A method for correcting chamfering specifications

Abstract

This invention relates to a method for correcting chamfering specifications, comprising: Step 1, obtaining a reference surface length by accurately measuring the diameter and vertical diameter of the finished wafer using calipers, and inputting the reference surface length information into the system; Step 2, obtaining the chamfer profile shape through the grinding wheel code information, and inputting the chamfer profile shape information into the system; Step 3, inputting the reference surface length value of the sample wafer into the system and comparing it with the wafer reference surface length specification automatically retrieved by the system. If it exceeds the specification, an error message will be issued and processing will be stopped; Step 4, inputting the grinding wheel code information into the system, retrieving the chamfer profile shape of the grinding wheel in the system, and comparing it with the profile shape specification of the sample wafer. Similarly, if the information read does not match, an error message will be issued and processing will be stopped.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and more specifically to a method for correcting chamfering specifications. Background Technology

[0002] In semiconductor manufacturing processes, wafer chamfering primarily removes edge stress from silicon wafers to prevent chipping and breakage during fabrication. In actual processing, different chamfer specifications (mainly chamfer shape and reference surface length) are required to meet the needs of subsequent manufacturing processes. Often, errors in parameter settings by the operator within the CNC system lead to inconsistent chamfering, resulting in low wafer chamfering yield and wasted manufacturing costs. Summary of the Invention

[0003] To address the problems existing in the prior art, the present invention provides a method for correcting chamfering specifications, which solves at least one of the above-mentioned technical problems.

[0004] The technical solution of this invention is: a method for correcting specifications in chamfering processes, characterized by comprising:

[0005] Step 1: Obtain the reference surface length by accurately measuring the diameter and vertical diameter of the finished wafer using vernier calipers, and then enter the reference surface length information into the system.

[0006] Step two: Obtain the chamfer profile shape through the information of the grinding wheel code, and enter the chamfer profile shape information into the system;

[0007] Step 3: Input the reference surface length value of the sample wafer into the system and compare it with the wafer reference surface length specification automatically retrieved by the system. If it exceeds the specification, an error message will be issued and processing will be stopped.

[0008] Step four: Input the grinding wheel code information into the system, retrieve the chamfer profile of the grinding wheel in the system, and compare it with the profile specifications of the sample wafer. Similarly, if the information read by each party does not match, an error message will be displayed and processing will be stopped.

[0009] This method primarily provides functions for checking and correcting chamfer profile morphology and reference surface straight line length. The reference surface length cannot be accurately measured on the wafer using existing measuring instruments (due to the shape characteristics, the measurement accuracy is insufficient and cannot meet process requirements). However, the actual diameter and vertical diameter of the finished wafer (which can be accurately measured using vernier calipers) are entered into the system to automatically calculate the current actual reference surface length value. This value is then compared with the reference surface length specification automatically retrieved by the program. If it exceeds the specification, an error message will be displayed, and processing will be stopped. Since the chamfer profile morphology is determined by the type of grinding wheel (whetstone) used during chamfering, the grinding wheel type information can be retrieved from the database by inputting the grinding wheel code. This information is then compared with the wafer profile morphology specification (automatically retrieved by the program from the wafer batch number information). Similarly, if the retrieved information does not match, an error message will be displayed, and processing will be stopped.

[0010] Further optimization allows steps three and four to be entered into the system simultaneously, thereby speeding up the inspection process.

[0011] Further preferably, the system has four processing interfaces, namely a first processing interface, a second processing interface, a third processing interface and a fourth processing interface. The first processing interface has an input box for inputting the sample wafer number, the second processing interface has an input box for inputting the sample wafer diameter and the sample wafer vertical diameter, the third processing interface has a display screen for displaying the ideal wafer cost profile, and the fourth processing interface has an input box for inputting the grinding wheel code.

[0012] This invention optimizes the system, enabling simpler and faster wafer inspection and saving costs.

[0013] Further preferably, both the second processing interface and the fourth processing interface are provided with a display surface for providing error messages, which will display "Correct" or "Error". This allows for a clearer understanding of the wafer's status.

[0014] Furthermore, the system includes a data storage module. This allows the data from each inspection to be saved, facilitating future review. Attached Figure Description

[0015] Figure 1 It is a type of display interface of the system;

[0016] Figure 2 It is another display interface of the system;

[0017] Figure 3 It is another display interface of the system. Detailed Implementation

[0018] The present invention will now be further described with reference to the accompanying drawings. Specific Implementation Example 1

[0020] See Figure 1 A schematic diagram of the interface for inputting the sample wafer number, sample wafer diameter, sample wafer vertical diameter, and grinding wheel code on the system. Figure 2 This involves checking, calculating, and confirming the results. A screenshot of the interface is shown when everything is correct. Figure 3 This is a screenshot of the interface when the relevant data does not match.

[0021] A method for correcting chamfering specifications includes:

[0022] Step 1: Accurately measure the diameter and vertical diameter of the finished wafer using calipers to obtain the reference surface length, and input the reference surface length information into the system. Step 2: Obtain the chamfer profile shape using the grinding wheel code information, and input the chamfer profile shape information into the system. Step 3: Input the reference surface length value of the sample wafer into the system and compare it with the wafer reference surface length specification automatically retrieved by the system. If it exceeds the specification, an error message will be issued, and processing will stop. Step 4: Input the grinding wheel code information into the system, retrieve the chamfer profile shape of that grinding wheel from the system, and compare it with the profile shape specification of the sample wafer. Similarly, if the information read does not match, an error message will be issued, and processing will stop.

[0023] This method primarily provides functions for checking and correcting chamfer profile morphology and reference surface straight line length. The reference surface length cannot be accurately measured on the wafer using existing measuring instruments (due to the shape characteristics, the measurement accuracy is insufficient and cannot meet process requirements). However, the actual diameter and vertical diameter of the finished wafer (which can be accurately measured using vernier calipers) are entered into the system to automatically calculate the current actual reference surface length value. This value is then compared with the reference surface length specification automatically retrieved by the program. If it exceeds the specification, an error message will be displayed, and processing will be stopped. Since the chamfer profile morphology is determined by the type of grinding wheel (whetstone) used during chamfering, the grinding wheel type information can be retrieved from the database by inputting the grinding wheel code. This information is then compared with the wafer profile morphology specification (automatically retrieved by the program from the wafer batch number information). Similarly, if the retrieved information does not match, an error message will be displayed, and processing will be stopped.

[0024] Further optimization allows steps three and four to be entered into the system simultaneously, thereby speeding up the inspection process.

[0025] Further preferably, the system has four processing interfaces, namely a first processing interface, a second processing interface, a third processing interface and a fourth processing interface. The first processing interface has an input box for inputting the sample wafer number, the second processing interface has an input box for inputting the sample wafer diameter and the sample wafer vertical diameter, the third processing interface has a display screen for displaying the ideal wafer cost profile, and the fourth processing interface has an input box for inputting the grinding wheel code.

[0026] This invention optimizes the system, enabling simpler and faster wafer inspection and saving costs.

[0027] Further preferably, both the second processing interface and the fourth processing interface are provided with a display surface for providing error messages, which will display "Correct" or "Error". This allows for a clearer understanding of the wafer's status.

[0028] Furthermore, the system includes a data storage module. This allows the data from each inspection to be saved, facilitating future review.

[0029] The above are merely preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A method for correcting specifications in chamfering processes, characterized in that, include: Step 1: Obtain the reference surface length by accurately measuring the diameter and vertical diameter of the finished wafer using vernier calipers, and then enter the reference surface length information into the system. Step two: Obtain the chamfer profile shape through the information of the grinding wheel code, and enter the chamfer profile shape information into the system; Step 3: Input the reference surface length value of the sample wafer into the system and compare it with the wafer reference surface length specification automatically retrieved by the system. If it exceeds the specification, an error message will be issued and processing will be stopped. Step four: Input the grinding wheel code information into the system, retrieve the chamfer profile of the grinding wheel in the system, and compare it with the profile specifications of the sample wafer. Similarly, if the information read by each party does not match, an error message will be displayed and processing will be stopped.

2. The method for correcting chamfering specifications according to claim 1, characterized in that: Steps three and four can be entered into the system simultaneously.

3. The method for correcting chamfering specifications according to claim 1, characterized in that: The system has four processing interfaces: a first processing interface, a second processing interface, a third processing interface, and a fourth processing interface. The first processing interface has an input box for inputting the sample wafer number, the second processing interface has an input box for inputting the sample wafer diameter and the sample wafer vertical diameter, the third processing interface has a display screen for displaying the ideal wafer cost profile, and the fourth processing interface has an input box for inputting the grinding wheel code.

4. The method for correcting chamfering specifications according to claim 3, characterized in that: Both the second processing interface and the fourth processing interface are provided with a display surface for making error prompts, which will display "correct" or "error".

5. The method for correcting chamfering specifications according to claim 1, characterized in that: The system is equipped with a storage module.

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