An optical module

Abstract

The application discloses an optical module, comprising: a coherent light chip, comprising: a receiving optical fiber coupling port, a local oscillator optical fiber coupling port, a polarization rotation beam splitter; a first local oscillator optical splitter, the input end of which is connected with the local oscillator optical fiber coupling port, the first output end of which is connected with a first polarization coherent modulator, and the second output end of which is connected with a second local oscillator optical splitter; the output end of the second local oscillator optical splitter is connected with a second polarization coherent modulator and a third local oscillator optical splitter; and the output end of the third local oscillator optical splitter is connected with a first polarization balance receiver and a second polarization balance receiver. According to the difference between the output optical powers of the first polarization coherent modulator and the second polarization coherent modulator, different structural designs can be made on the light splitting ratio of the first local oscillator optical splitter, so that the two polarization optical powers of the first angle and the second angle in the light beam emitted from the transmitting optical fiber coupling port are balanced.

Description

Technical Field

[0001] This application relates to the field of optical communication technology, and in particular to an optical module. Background Technology

[0002] Optical communication technology is used in new business and application models such as cloud computing, mobile Internet, and video. In optical communication, optical modules are the tools for realizing the conversion between photoelectric signals and optical signals. They are one of the key components in optical communication equipment. With the rapid development of 5G networks, optical modules, which are at the core of optical communication, have achieved significant development.

[0003] Traditional optical communication systems primarily employ intensity modulation / direct demodulation (IMDD), where the intensity of the optical carrier is directly modulated at the transmitting end, and envelope detection is performed on the optical carrier at the receiving end. This method is simple in structure, low in cost, and widely used in modern communication systems. However, its drawbacks include a single modulation format and limited single-channel bandwidth, failing to meet the ever-increasing bandwidth demands. Coherent optical communication, with its advantages of high receiver sensitivity, high spectral efficiency, and applicability to multiple modulation formats, effectively compensates for the shortcomings of intensity modulation / direct demodulation. Through coherent demodulation, the amplitude, frequency, and phase information of the optical carrier can be modulated, promoting the development of optical digital transmission systems. Summary of the Invention

[0004] In the optical module provided in this application, the optical power of two emitted signal lights with different polarization directions in the coherent optical module is made the same.

[0005] The optical module provided in this application embodiment includes: a coherent optical chip coupled to the optical fiber connector, comprising:

[0006] A coherent optical chip, coupled to the fiber optic connector, includes:

[0007] The receiving fiber optic coupling port receives the received signal light.

[0008] The local oscillator fiber coupling port receives the local oscillator light;

[0009] A polarization rotating beam splitter is located on one side of the receiving fiber coupling port and is used to split the received signal light into a first received signal light and a second received signal light according to different deflection angles.

[0010] The first local oscillator splitter has its input end connected to the local oscillator fiber coupling port, its first output end connected to the first polarization coherent modulator, and its second output end connected to the input end of the second local oscillator.

[0011] The first output terminal of the second local oscillator beam splitter is connected to the second polarization coherent modulator, and the second output terminal is connected to the input terminal of the third local oscillator beam splitter.

[0012] The first output terminal of the third local oscillator beam splitter is connected to the first polarization balanced receiver, and the second output terminal is connected to the second polarization balanced receiver.

[0013] The difference in optical power output between the first polarization coherent modulator and the second polarization coherent modulator does not exceed 15%.

[0014] The first polarization balanced receiver is connected to the first output port of the polarization rotating beam splitter and the first output port of the third local oscillator beam splitter;

[0015] The second polarization balance receiver is connected to the second output port of the polarization rotating beam splitter and the second output port of the third local oscillator beam splitter.

[0016] The beneficial effects of this application are:

[0017] This application discloses an optical module, including: a coherent optical chip, comprising: a receiving fiber coupling port, a local oscillator fiber coupling port, and a polarization rotating beam splitter; a first local oscillator beam splitter, whose input end is connected to the local oscillator fiber coupling port, its first output end is connected to a first polarization coherent modulator, and its second output end is connected to the input end of a second local oscillator beam splitter. The first output end of the second local oscillator beam splitter is connected to the second polarization coherent modulator, and its second output end is connected to the input end of a third local oscillator beam splitter. The first output end of the third local oscillator beam splitter is connected to a first polarization balanced receiver, and its second output end is connected to a second polarization balanced receiver. The first polarization balanced receiver is connected to the first output port of the polarization rotating beam splitter and the first output port of the third local oscillator beam splitter. The second polarization balanced receiver is connected to the second output port of the polarization rotating beam splitter and the second output port of the third local oscillator beam splitter. This application can design different structures for the splitting ratio of the first local oscillator beam splitter based on the difference in output optical power between the first polarization coherent modulator and the second polarization coherent modulator, so that the power of the first angle and the second angle polarized light beam emitted from the transmitting fiber coupling port is balanced, thereby improving the effective optical emission power. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0019] Figure 1 This is a diagram showing the connection relationships of an optical communication system.

[0020] Figure 2 This is a structural diagram of an optical network terminal;

[0021] Figure 3 This is a structural diagram of an optical module according to some embodiments;

[0022] Figure 4 This is an exploded structural diagram of an optical module according to some embodiments;

[0023] Figure 5 This is a structural diagram of an optical module with the housing and unlocking component removed according to some embodiments;

[0024] Figure 6 The diagram shows the structure of an optical fiber adapter, a light source, a coherent component, and a circuit board according to some embodiments.

[0025] Figure 7 An exploded structural diagram of an optical module with the housing and unlocking components removed, according to some embodiments;

[0026] Figure 8 This is a structural diagram of the first angle of the fiber optic winding frame according to some embodiments;

[0027] Figure 9 This is a structural diagram of the second angle of the fiber optic winding frame according to some embodiments;

[0028] Figure 10 This is a structural diagram of a light source according to some embodiments;

[0029] Figure 11 An exploded view of a light source according to some embodiments;

[0030] Figure 12 This is a structural diagram of a first support plate according to some embodiments;

[0031] Figure 13 A structural diagram of the second support plate at a first angle according to some embodiments;

[0032] Figure 14 This is a structural diagram of the second angle of the second support plate according to some embodiments;

[0033] Figure 15 This is a structural diagram of a second circuit board according to some embodiments;

[0034] Figure 16 This is a structural diagram of a light source according to some embodiments;

[0035] Figure 17 An exploded view of a light source according to some embodiments;

[0036] Figure 18A structural diagram of a light source according to some embodiments, excluding the top cover, optical components, and internal fiber optic adapter;

[0037] Figure 19 An exploded view of a light source according to some embodiments, excluding the top cover, optical components, and internal fiber optic adapter.

[0038] Figure 20 This is a structural diagram of a second fixing frame according to some embodiments;

[0039] Figure 21 This is a structural diagram of a first fixing frame according to some embodiments;

[0040] Figure 22 This is a first cross-sectional view of a light source according to some embodiments;

[0041] Figure 23 This is a second cross-sectional view of a light source according to some embodiments;

[0042] Figure 24 This is a structural diagram of a first light source according to some embodiments;

[0043] Figure 25 This is a structural diagram of a second light source according to some embodiments;

[0044] Figure 26 This is a structural diagram of a third type of light source according to some embodiments;

[0045] Figure 27 This is a structural diagram of a fourth light source according to some embodiments;

[0046] Figure 28 This is a structural diagram of a fifth light source according to some embodiments;

[0047] Figure 29 This is a structural diagram of a first type of silicon photonics chip according to some embodiments;

[0048] Figure 30 A filtering curve diagram of a wavelength sensor according to some embodiments;

[0049] Figure 31 This is a structural diagram of a sixth light source according to some embodiments;

[0050] Figure 32 This is a structural diagram of a second type of silicon photonics chip according to some embodiments;

[0051] Figure 33 This is a structural diagram of a third type of silicon photonics chip according to some embodiments;

[0052] Figure 34 This application illustrates a coherent component in an embodiment of the present application;

[0053] Figure 35 This is an exploded view of a coherent component as shown in an embodiment of this application;

[0054] Figure 36 This is a schematic diagram of a carrier plate structure as exemplified in this application;

[0055] Figure 37 A schematic diagram of the structure of a cover shell as an example of this application. Figure 1 ;

[0056] Figure 38 A schematic diagram of the structure of a cover shell as an example of this application. Figure 2 ;

[0057] Figure 39 This is a schematic cross-sectional view of the connection between the fiber optic connector and the coherent component, as exemplified in this application.

[0058] Figure 40 A schematic diagram of the structure of an optical fiber fastener as an example of this application. Figure 1 ;

[0059] Figure 41 Schematic diagram of fiber optic fastener Figure 2 ;

[0060] Figure 42 This is a schematic diagram of the structure of a coherent optical chip as exemplified in this application;

[0061] Figure 43 This application provides a schematic diagram of the structure of a coherent optical chip. Figure 2 ;

[0062] Figure 44 This is an example of a coherent optical chip surface ball-planting layout proposed in this application.

[0063] Figure 45 A schematic diagram of a coherent optical chip structure provided in this application Figure 3 ;

[0064] Figure 46 A schematic diagram of a coherent optical chip structure provided in this application Figure 4 ;

[0065] Figure 47 A schematic diagram of a coherent optical chip structure provided in this application Figure 5 ;

[0066] Figure 48 This is a schematic diagram of the structure of an unbalanced beam splitter provided in an embodiment of this application;

[0067] Figure 49 A schematic diagram of a coherent optical chip structure as exemplified in this application. Figure 6 ;

[0068] Figure 50 A schematic diagram of a coherent optical chip structure as exemplified in this application. Figure 7 . Detailed Implementation

[0069] In optical communication systems, optical signals carry the information to be transmitted and are transmitted through information transmission equipment such as optical fibers or waveguides to information processing equipment such as computers to complete the information transmission. Because light has passive transmission characteristics when transmitted through optical fibers or waveguides, low-cost, low-loss information transmission can be achieved. However, the signals transmitted by information transmission equipment such as optical fibers or waveguides are optical signals, while the signals that information processing equipment such as computers can recognize and process are electrical signals. Therefore, in order to establish an information connection between information transmission equipment such as optical fibers or waveguides and information processing equipment such as computers, it is necessary to achieve mutual conversion between electrical and optical signals.

[0070] In the field of optical communication technology, optical modules realize the mutual conversion function between optical signals and electrical signals. An optical module includes an optical port and an electrical port. The optical port enables optical communication with information transmission devices such as optical fibers or optical waveguides, while the electrical port enables electrical connection with optical network terminals (e.g., optical modems). The electrical connection is mainly used for power supply, I2C signal transmission, data transmission, and grounding. The optical network terminal transmits electrical signals to information processing devices such as computers via network cables or Wi-Fi.

[0071] Figure 1 This is a diagram showing the connection relationships within an optical communication system. (Example:) Figure 1 As shown, the optical communication system includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0072] One end of optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 via optical module 200. Optical fiber itself can support long-distance signal transmission, such as signal transmission over several kilometers (6 to 8 kilometers). Theoretically, unlimited distance transmission can be achieved by using repeaters. Therefore, in typical optical communication systems, the distance between the remote server 1000 and the optical network terminal 100 can typically reach several kilometers, tens of kilometers, or hundreds of kilometers.

[0073] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing device 2000 can be any one or more of the following devices: router, switch, computer, mobile phone, tablet computer, television, etc.

[0074] The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by optical fiber 101 and network cable 103; while the connection between optical fiber 101 and network cable 103 is completed by optical module 200 and optical network terminal 100.

[0075] The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101. The electrical port is configured to connect to the optical network terminal 100, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the optical network terminal 100. The optical module 200 performs mutual conversion between optical and electrical signals, thereby establishing an information connection between the optical fiber 101 and the optical network terminal 100. For example, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and then input to the optical fiber 101. Since the optical module 200 is a tool for mutual conversion between optical and electrical signals and does not have the function of data processing, the information does not change during the above photoelectric conversion process.

[0076] The optical network terminal 100 includes a generally cuboid housing, and an optical module interface 102 and a network cable interface 104 disposed on the housing. The optical module interface 102 is configured to connect to an optical module 200, thereby establishing a bidirectional electrical signal connection between the optical network terminal 100 and the optical module 200; the network cable interface 104 is configured to connect to a network cable 103, thereby establishing a bidirectional electrical signal connection between the optical network terminal 100 and the network cable 103. The optical module 200 and the network cable 103 are connected through the optical network terminal 100. For example, the optical network terminal 100 transmits electrical signals from the optical module 200 to the network cable 103, and vice versa, thus the optical network terminal 100 acts as a host computer for the optical module 200, monitoring its operation. Besides the optical network terminal 100, the host computer for the optical module 200 may also include an optical line terminal (OLT), etc.

[0077] The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing equipment 2000 through optical fiber 101, optical module 200, optical network terminal 100 and network cable 103.

[0078] Figure 2 This is a structural diagram of an optical network terminal. To clearly show the connection relationship between the optical module 200 and the optical network terminal 100... Figure 2Only the structure of the optical network terminal 100 related to the optical module 200 is shown. For example... Figure 2 As shown, the optical network terminal 100 also includes a circuit board 105 disposed within a housing, a cage 106 disposed on the surface of the circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has protrusions such as fins to increase the heat dissipation area.

[0079] The optical module 200 is inserted into the cage 106 of the optical network terminal 100, where it is secured. Heat generated by the optical module 200 is conducted to the cage 106 and then dissipated through the heat sink 107. After insertion into the cage 106, the optical module 200's electrical port connects to an electrical connector inside the cage 106, establishing a bidirectional electrical signal connection between the optical module 200 and the optical network terminal 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0080] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded structural diagram of an optical module according to some embodiments. Figure 5 This is a structural diagram of an optical module with the housing and unlocking components removed, according to some embodiments. Figure 6 This is a structural diagram of a fiber optic adapter, light source, coherent assembly, and circuit board according to some embodiments. Figure 3-6 As shown, the optical module 200 includes a shell, a circuit board 300, a light source 401, a coherent component 500, a DSP chip 600, and an optical fiber winding frame 700 disposed within the shell.

[0081] The housing includes an upper housing 201 and a lower housing 202, with the upper housing 201 covering the lower housing 202 to form the aforementioned housing with two openings; the outer contour of the housing is generally square.

[0082] In some embodiments of this disclosure, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0083] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0084] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (right end). Figure 3 (Left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200. Opening 204 is an electrical port, through which the gold fingers of circuit board 300 extend and are inserted into a host computer (e.g., optical network terminal 100); opening 205 is an optical port, configured to connect to external optical fiber 101 so that external optical fiber 101 can connect to the light source 401 inside optical module 200.

[0085] The assembly method using an upper housing 201 and a lower housing 202 facilitates the installation of components such as the circuit board 300 and the light source 401 into the housing, with the upper housing 201 and lower housing 202 providing encapsulation and protection for these components. Furthermore, the assembly of components such as the circuit board 300 and the light source 401 facilitates the deployment of positioning components, heat dissipation components, and electromagnetic shielding components, which is beneficial for automated production.

[0086] In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0087] In some embodiments, the optical module 200 further includes an unlocking component located outside its housing, the unlocking component being configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0088] For example, the unlocking component is located on the outer wall of the two lower side plates 2022 of the lower housing 202, and has a locking component that matches the host computer cage (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the host computer cage, the locking component of the unlocking component fixes the optical module 200 in the host computer cage; when the unlocking component is pulled, the locking component of the unlocking component moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the locking relationship between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the host computer cage.

[0089] Circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips include, for example, microcontroller units (MCUs), laser driver chips, limiting amplifiers, clock and data recovery (CDR) chips, power management chips, and digital signal processing (DSP) chips.

[0090] Circuit board 300 is generally a rigid circuit board. Due to its relatively rigid material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can stably support the aforementioned electronic components and chips; when the light source is located on the circuit board, the rigid circuit board can also provide stable support; the rigid circuit board can also be inserted into the electrical connector in the host computer cage.

[0091] The circuit board 300 also includes gold fingers formed on its end surfaces, each gold finger consisting of a plurality of independent pins. The circuit board 300 is inserted into a cage 106 and electrically connected to an electrical connector within the cage 106 by the gold fingers. The gold fingers may be located only on one side of the surface of the circuit board 300 (e.g., ...). Figure 4 The gold fingers (shown on the upper surface) can also be placed on the upper and lower surfaces of the circuit board 300 to accommodate applications with a large number of pins. The gold fingers are configured to establish an electrical connection with the host computer to enable power supply, grounding, I2C signal transmission, and data signal transmission.

[0092] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards. For example, a flexible circuit board can be used to connect the rigid circuit board to the light source.

[0093] The circuit board 300 includes a first circuit board 301, a second circuit board 302 and a third circuit board 303. The first circuit board 301 and the second circuit board 302 are both rigid circuit boards, and the third circuit board 303 is a flexible circuit board. The second circuit board 302 is stacked on the first circuit board 301 at the end near the light source 401. The second circuit board 302 is located between the first circuit board 301 and the upper housing 201. The first circuit board 301 and the second circuit board 302 are connected through the third circuit board 303.

[0094] The light source 401, connected to the second circuit board 302, is used to emit a beam of a preset specific wavelength. Specifically, the light source 401 includes a semiconductor gain chip and a silicon photonics chip. The semiconductor gain chip emits a beam of light within a certain wavelength range, and the silicon photonics chip filters out a specific wavelength beam from the beam of light within the same wavelength range. The silicon photonics chip and the semiconductor gain chip form a resonant cavity, and the specific wavelength beam is reflected back and forth between the silicon photonics chip and the semiconductor gain chip, so that the specific wavelength beam is stably output by the semiconductor gain chip.

[0095] The optical module also includes a transmitting fiber optic adapter 800 and a receiving fiber optic adapter 801. The transmitting fiber optic adapter 800 is used to transmit high-speed optical signals, and the receiving fiber optic adapter 801 is used to receive high-speed optical signals.

[0096] A coherent component 500, placed on a circuit board, is used to realize high-speed photoelectric signal conversion. Specifically, the coherent component 500 includes an optical transmitting interface, an optical receiving interface, and a local oscillator interface. The optical transmitting interface extends from a first optical fiber, the optical receiving interface extends from a second optical fiber, and the local oscillator interface extends from a third optical fiber. The optical transmitting interface is connected to a transmitting fiber optic adapter 800, the optical receiving interface is connected to a receiving fiber optic adapter 801, and the local oscillator interface is connected to a light source 401. The coherent component is connected to the transmitting fiber optic adapter, the receiving fiber optic adapter, and the light source 401 through the optical transmitting interface, the optical receiving interface, and the local oscillator interface, respectively. The coherent component 500 is also connected to a DSP chip 600.

[0097] A narrow-linewidth, high-power laser emitted by light source 401 is input into coherent component 500 via a local oscillator interface. Inside coherent component 500, the laser is split into two beams. One beam, used as the emission beam, enters the coherent modulator within the coherent component and, driven by a high-speed electrical signal from DSP chip 600, performs electro-optical signal conversion. The converted high-speed optical signal is output from the module's optical emission interface. The other beam, used as the local oscillator beam, is coherently demodulated with the high-speed optical signal input into coherent component 500 from the module's optical receiving port. The demodulated electrical signal then enters DSP chip 600 for signal processing, thus completing the photoelectric signal conversion. The narrow-linewidth, high-power laser is a specific wavelength beam.

[0098] The light source 401 also includes an internal fiber optic adapter. A first fiber extends from the internal fiber optic adapter, and a local oscillator fiber extends from the local oscillator interface. The first fiber and the local oscillator fiber are fused together to connect the internal fiber optic adapter to the local oscillator interface. A second fiber extends from the transmitting fiber adapter 800, and a transmitting fiber extends from the optical transmitting interface. The second fiber and the transmitting fiber are fused together to connect the transmitting fiber adapter 800 to the optical transmitting interface. A third fiber extends from the receiving fiber adapter 801, and a receiving fiber extends from the optical receiving interface. The third fiber and the receiving fiber are fused together to connect the receiving fiber adapter 801 to the optical receiving interface.

[0099] Because there is a certain failure rate when splicing two optical fibers, a certain length of fiber needs to be reserved to ensure successful splicing in the end, so that splicing can continue if the two fibers fail. Furthermore, since the splicing point between the first fiber and the local oscillator fiber is located near the internal fiber adapter, the splicing point between the second fiber and the transmitting fiber is located near the transmitting fiber adapter 800, and the splicing point between the third fiber and the receiving fiber is located near the receiving fiber adapter 801, the lengths of the first fiber, the local oscillator fiber, the transmitting fiber, and the receiving fiber are relatively long.

[0100] The fiber optic winding frame 700 is used to fix the optical fiber. Specifically, because the circuit board 300 has high-frequency signal lines and many components, the optical fiber cannot be directly laid on the surface of the circuit board 300. Furthermore, because the first optical fiber, the local oscillator fiber, the transmitting fiber, and the receiving fiber are relatively long, in order to prevent the upper housing from damaging these fibers, a fiber optic winding frame 700 is provided between the coherent assembly 500 and the upper housing 201 to fix the optical fiber.

[0101] The first optical fiber, the local oscillator optical fiber, the transmitting optical fiber, and the receiving optical fiber are all neatly fixed on the optical fiber winding frame 700. This not only avoids damage to the first optical fiber, the local oscillator optical fiber, the transmitting optical fiber, and the receiving optical fiber caused by the upper shell, but also avoids signal crosstalk problems caused by the optical fiber being directly laid on the surface of the circuit board 300.

[0102] Figure 8 This is a structural diagram of the first angle of the fiber optic winding frame according to some embodiments. Figure 9 This is a structural diagram of the second angle of the fiber optic winding frame according to some embodiments. For example... Figure 4-9 As can be seen, in some embodiments, the fiber optic winding frame 700 includes two first support legs 701 and two second support legs 702. The first support legs 701 are engaged with the card interface of the first circuit board 301, and the second support legs 702 are connected to the upper surface of the first circuit board 301. The two first support legs 701 are symmetrically arranged on both sides of the fiber optic winding frame 700, and the two second support legs 702 are symmetrically arranged on both sides of the fiber optic winding frame 700. The second support legs 702 are closer to the light source 401 than the first support legs 701.

[0103] like Figure 4-9As can be seen, in some embodiments, the outer surface of the fiber optic winding frame 700 is provided with a first protrusion 703, a second protrusion 704, a third protrusion 705, a fourth protrusion 706, and a fifth protrusion 707. The first protrusion 703 and the second protrusion 704 are located at the end of the fiber optic winding frame 700 away from the light source 401, and the third protrusion 705, the fourth protrusion 706, and the fifth protrusion 707 are located at the end of the fiber optic winding frame 700 closer to the light source 401. A first storage groove is provided between the first protrusion 703, the second protrusion 704, the third protrusion 705, the fourth protrusion 706, and the fifth protrusion 707 and the side of the fiber optic winding frame 700, respectively. A second storage groove 708 is provided between the first protrusion 703 and the second protrusion 704. Among all the protrusions, except for the space between the first protrusion 703 and the second protrusion 704, any two protrusions have a storage groove between them, which is the first storage groove. The second storage groove 708 is more recessed than the first storage groove.

[0104] The local oscillator fiber, the transmitting fiber, and the receiving fiber all extend from the coherent component 500 and enter the fiber winding frame 700 through the first placement groove between the fourth protrusion 706 and the side of the fiber winding frame 700.

[0105] The local oscillator fiber passes sequentially through the first storage slot between the first protrusion 703 and the side of the fiber winding frame 700 → the first storage slot between the second protrusion 704 and the side of the fiber winding frame 700 → the first storage slot between the third protrusion 705 and the side of the fiber winding frame 700 → the first storage slot between the third protrusion 705 and the fifth protrusion 707 → the first storage slot between the third protrusion 705 and the fourth protrusion 706 → the second storage slot 708 between the second protrusion 704 and the first protrusion 703.

[0106] The local oscillator fiber can also be placed in the first storage slot between the third protrusion 705 and the fourth protrusion 706, and then sequentially through the first storage slot between the second protrusion 704 and the third protrusion 705 → the first storage slot between the third protrusion 705 and the fifth protrusion 707 → the first storage slot between the third protrusion 705 and the fourth protrusion 706 → the first storage slot between the third protrusion 705 and the side of the fiber winding frame 700 → the second storage slot 708 between the second protrusion 704 and the first protrusion 703.

[0107] The first optical fiber passes sequentially through the first storage slot between the fourth protrusion 706 and the side of the fiber optic winding 700 → the first storage slot between the third protrusion 705 and the side of the fiber optic winding 700 → the first storage slot between the first protrusion 703 and the side of the fiber optic winding 700 → the first storage slot between the second protrusion 704 and the side of the fiber optic winding 700 → the first storage slot between the third protrusion 705 and the side of the fiber optic winding 700 → the first storage slot between the third protrusion 705 and the fifth protrusion 707 → the third protrusion 706 → the first storage slot between the third protrusion 705 and the fifth protrusion 707 → the first storage slot between the third protrusion 706 and the fifth protrusion 707. The first storage slot between 05 and the fourth protrusion 706 → the first storage slot between the second protrusion 704 and the third protrusion 705 → the first storage slot between the third protrusion 705 and the fifth protrusion 707 → the first storage slot between the third protrusion 705 and the fourth protrusion 706 → the first storage slot between the third protrusion 705 and the side of the fiber optic winding frame 700 → the first storage slot between the first protrusion 703 and the side of the fiber optic winding frame 700 → the second storage slot 708 between the second protrusion 704 and the first protrusion 703.

[0108] The transmitting optical fiber is fixed sequentially through the first storage slot between the first protrusion 703 and the side of the optical fiber winding frame 700, the first storage slot between the second protrusion 704 and the side of the optical fiber winding frame 700, and the first storage slot between the third protrusion 705 and the side of the optical fiber winding frame 700. Then, it extends out of the optical fiber winding frame 700 through the first storage slot between the fifth protrusion 707 and the side of the optical fiber winding frame 700, and is fused with the second optical fiber near the transmitting optical fiber adapter 800.

[0109] The receiving optical fiber is fixed sequentially through the first storage slot between the first protrusion 703 and the side of the optical fiber winding frame 700, the first storage slot between the second protrusion 704 and the side of the optical fiber winding frame 700, the first storage slot between the third protrusion 705 and the side of the optical fiber winding frame 700, and the first storage slot between the fifth protrusion 707 and the third protrusion 705. Then, it extends out of the optical fiber winding frame 700 through the first storage slot between the fourth protrusion 706 and the fifth protrusion 707 and is fused to the third optical fiber near the receiving optical fiber adapter 801.

[0110] As described above, the splice point connecting the first optical fiber and the local oscillator optical fiber is located within the second storage slot 708. To protect this splice point, in some embodiments, a protective sleeve is provided within the second storage slot 708. This protective sleeve protects the splice point of the first optical fiber and the local oscillator optical fiber, preventing breakage of the splice point.

[0111] Since the splice point of the first optical fiber and the local oscillator optical fiber is located in the second storage groove 708, in order to increase the number of times the first optical fiber and the local oscillator optical fiber can be spliced ​​to ensure successful splicing, the third protrusion 705 is cylindrical in shape, and the circumference of the third protrusion 705 is less than (the sum of the lengths of the first storage groove between the first protrusion 703 and the side of the optical fiber winding frame 700, the first storage groove between the second protrusion 704 and the side of the optical fiber winding frame 700, and the first storage groove between the third protrusion 705 and the side of the optical fiber winding frame 700).

[0112] If the first fiber and the local oscillator fiber fail to be fused together after the optical fiber is not wound along the third protrusion 705 and need to be fused again, the length of the first fiber or the local oscillator fiber that needs to be cut is the length of the first fiber or the local oscillator fiber that wraps around the entire fiber winding frame 700 once. If the first fiber and the local oscillator fiber fail to be fused together after the optical fiber is wound along the third protrusion 705 and need to be fused again, the length of the first fiber or the local oscillator fiber that needs to be cut is the length of the first fiber or the local oscillator fiber that wraps around the third protrusion 705 once.

[0113] For example, if the third protrusion 705 is not provided and the first optical fiber and the local oscillator optical fiber fail to be fused and need to be fused again, the length of the first optical fiber that needs to be cut may be 100 mm; if the third protrusion 705 is provided and the first optical fiber and the local oscillator optical fiber fail to be fused and need to be fused again, the length of the first optical fiber that needs to be cut may be 50 mm.

[0114] In order to fix the first optical fiber, the local oscillator optical fiber, the transmitting optical fiber and the receiving optical fiber inside the optical fiber winding frame 700, a snap-fit ​​strip is provided on a plurality of protrusions of the optical fiber winding frame 700 and on the side of the optical fiber winding frame 700. One end of the snap-fit ​​strip is connected to the surface of the protrusion of the optical fiber winding frame 700, and the other end of the snap-fit ​​strip is connected to the surface of the side of the optical fiber winding frame 700.

[0115] The presence of the snap-fit ​​strip ensures that the first optical fiber, the local oscillator optical fiber, the transmitting optical fiber, and the receiving optical fiber are fixed within the optical fiber winding frame 700, preventing damage to the optical fibers caused by the first optical fiber, the local oscillator optical fiber, the transmitting optical fiber, and the receiving optical fiber detaching from the optical fiber winding frame 700.

[0116] like Figure 4-9As can be seen, in some embodiments, the inner surface of the fiber optic winding frame 700 is provided with a third placement groove 709 and a fourth placement groove 710. Both the third placement groove 709 and the fourth placement groove 710 are formed by inward indentation of the inner surface of the fiber optic winding frame 700. The third placement groove 709 is more concave than the fourth placement groove 710. The third placement groove 709 is located at the end of the fiber optic winding frame 700 closer to the light source 401, and the fourth placement groove 710 is located at the end of the fiber optic winding frame 700 away from the light source 401. The third placement groove 709 is used to place the coherent component 500, and the fourth placement groove 710 is used to place the DSP chip 600. The shape of the third placement groove 709 is the same as the shape of the coherent component 500.

[0117] like Figure 4-9 It is understood that, in some embodiments, the inner surface of the fiber optic winding frame 700 is also provided with a fifth storage slot 711. The fifth storage slot 711 is closer to the light source 401 than the third storage slot 709, and the fifth storage slot 711 is used to place the interface of the coherent component 500. The third storage slot 709 is more recessed than the fifth storage slot 711.

[0118] Figure 10 This is a structural diagram of a light source according to some embodiments. Figure 11 This is an exploded view of a light source according to some embodiments. Figure 12 This is a structural diagram of a first support plate according to some embodiments. Figure 13 This is a structural diagram of the second support plate at a first angle according to some embodiments. Figure 14 This is a structural diagram of the second angle of the second support plate according to some embodiments. Figure 15 This is a structural diagram of a second circuit board according to some embodiments. For example... Figure 4-15 As can be seen, in some embodiments, the light source assembly 400 includes a light source 401, a first support plate 402, a second support plate 403, and a second circuit board 302. Specifically,

[0119] The light source 401 has multiple metal pins on its side, and the second circuit board 302 has multiple pin pads on its side. The metal pins and pin pads are arranged in a corresponding manner, and the light source 401 and the second circuit board 302 are electrically connected through the metal pins and pin pads.

[0120] The second circuit board 302 has two first through holes 3022, and the second support plate 403 has two second through holes 4032. The first through holes 3022 and the second through holes 4032 are correspondingly arranged and connected by screws to realize the connection between the second circuit board 302 and the second support plate 403.

[0121] The second support plate 403 is also provided with a third through hole 4033, and the first support plate 402 is provided with a fourth through hole 4024. The third through hole 4033 and the fourth through hole 4024 are provided correspondingly, and the third through hole 4033 and the fourth through hole 4024 are connected by screws to realize the connection between the first support plate 402 and the second support plate 403.

[0122] The second support plate 403 is also provided with a fifth through hole 4031, which corresponds to the through hole on the cover plate 2011 of the upper housing 201. The fifth through hole 4031 and the through hole on the cover plate 2011 of the upper housing 201 are connected by screws to realize the connection between the second support plate 403 and the upper housing 201.

[0123] The first support plate 402 is also provided with a support plate body 4022, a first support protrusion 4021 and a second support protrusion 4023. The first support protrusion 4021 and the second support protrusion 4023 are both formed by the support plate body 4022 protruding upward. The first support protrusion 4021 protrudes more than the second support protrusion 4023. The first support protrusion 4021 is provided with a fourth through hole 4024. The second support protrusion 4023 is connected to the lower surface of the light source 401.

[0124] The second support protrusion 4023 is a heat-dissipating adhesive. The presence of the heat-dissipating adhesive not only connects the light source 401 to the first support plate 402, but also dissipates the heat from the light source 401.

[0125] The second support plate 403 is also provided with a sixth storage slot 4034 and a seventh storage slot 4035. The sixth storage slot 4034 and the seventh storage slot 4035 are both formed by inward indentation of the inner surface of the second support plate 403. The sixth storage slot 4034 and the seventh storage slot 4035 are not connected. The sixth storage slot 4034 is connected to the second circuit board 302, and the seventh storage slot 4035 is connected to the upper surface of the light source 401.

[0126] The second circuit board 302 has a first notch 3021 on the side facing the light source 401, and multiple pin pads are provided on the side where the first notch 3021 is located. The first support plate 402 and the light source 401 can be placed in the first notch 3021, and the length of the first notch 3021 is greater than the length of the light source 401.

[0127] like Figure 4-15 It is understood that in some embodiments, the light source assembly 400 further includes a heat dissipation pad 404. The heat dissipation pad 404 is located between the cover plate 2011 of the upper housing 201 and the second support plate 403, and is used to dissipate the heat of the light source assembly 400 outside the light module through the upper housing 201.

[0128] Current light sources use a combination of semiconductor gain chips and discrete filters to achieve wavelength tunability. However, because multiple discrete components need to be coupled and packaged in the light source, and these discrete components occupy a large space, the current light sources are large in size and do not meet production requirements.

[0129] To address this issue, a light source is proposed in some embodiments. This light source includes a semiconductor gain chip and a silicon photonics chip. The semiconductor gain chip emits a light beam within a specific wavelength range. The silicon photonics chip integrates a wavelength-tunable optical component and a wavelength-locked optical component. The wavelength-tunable optical component filters a specific wavelength beam from the light beam emitted by the semiconductor gain chip within the specified wavelength range, achieving wavelength tunability. The wavelength-locked optical component determines whether the specific wavelength beam deviates from a preset wavelength beam, achieving wavelength locking. If the specific wavelength beam deviates from the preset wavelength beam, the refractive index of the wavelength-tunable optical component is adjusted to ensure that the filtered specific wavelength beam does not deviate from the preset wavelength beam. The semiconductor gain chip and the silicon photonics chip form a resonant cavity, and the specific wavelength beam reflects back and forth between the semiconductor gain chip and the silicon photonics chip, achieving a stable output of the specific wavelength beam from the semiconductor gain chip. The integration of the wavelength-tunable optical component and the wavelength-locked optical component within the silicon photonics chip not only enables wavelength tunability and wavelength locking functions but also saves space, resulting in a smaller light source size to meet production requirements.

[0130] Figure 16 This is a structural diagram of a light source according to some embodiments. Figure 17 This is an exploded view of a light source according to some embodiments. Figure 18 This is a structural diagram of a light source according to some embodiments, excluding the top cover, optical components, and internal fiber optic adapter. Figure 19 An exploded view of a light source according to some embodiments, excluding the top cover, optical components, and internal fiber optic adapter. Figure 20 This is a structural diagram of a second fixing frame according to some embodiments. Figure 21 This is a structural diagram of a first fixing frame according to some embodiments. Figure 22 This is a first cross-sectional view of a light source according to some embodiments. Figure 23 This is a second cross-sectional view of a light source according to some embodiments. For example... Figure 4-23As can be seen, in some embodiments, the light source 401 includes a first fixing frame 4011, a second fixing frame 4012, an upper cover 4013, a base 4014, and an internal fiber optic adapter 4016. The first fixing frame 4011 is provided with a second notch 40111 and an insertion hole 40112, which are located at opposite ends of the first fixing frame 4011. The second fixing frame 4012 is snapped into the second notch 40111 of the first fixing frame 4011, and the internal fiber optic adapter 4016 is placed in the insertion hole 40112. The side of the second fixing frame 4012 near the second circuit board 302 is provided with multiple metal pins 4015. The multiple metal pins 4015 are soldered to multiple pin pads on the second circuit board 302. The first fixing frame 4011, the second fixing frame 4012, the upper cover 4013, and the base 4014 form a cavity, in which an optical component 405 is disposed.

[0131] like Figure 4-23 As can be seen, in some embodiments, two semiconductor coolers 40141 are disposed on the base plate 4014, a ceramic substrate 40142 is disposed on the two semiconductor coolers 40141, and an optical component 405 is disposed on the ceramic substrate 40142. The optical component 405 is placed on the ceramic substrate 40142 to facilitate temperature control of the optical component 405.

[0132] like Figure 4-23 As can be seen, in some embodiments, the optical component 405 includes a semiconductor gain chip 4051, a silicon photonics chip 4052, a first lens 4053, an isolator 4054, a second lens 4055, a semiconductor amplification chip 4056, a third lens 4057, a beam splitter 4058, a first power monitor 4059, and a fourth lens 4060. Specifically,

[0133] A semiconductor gain chip 4051, located between the fourth lens 4060 and the first lens 4053, is used to emit a light beam within a specific wavelength range. A silicon photonics chip 4052, located to one side of the fourth lens 4060, is used to receive the light beam within a specific wavelength range and filter out a specific wavelength beam from it; it also serves to direct the specific wavelength beam into the semiconductor gain chip 4051. The silicon photonics chip 4052 and the semiconductor gain chip 4051 form a resonant cavity, and the specific wavelength beam is reflected back and forth between the silicon photonics chip 4052 and the semiconductor gain chip 4051, achieving a stable output of the specific wavelength beam from the semiconductor gain chip.

[0134] The silicon photonics chip 4052 is used to filter a specific wavelength beam from a beam within a wavelength range. Specifically, the silicon photonics chip 4052 integrates a wavelength-tunable optical component and a wavelength-locked optical component. The wavelength-tunable optical component filters the specific wavelength beam from the beam emitted by the semiconductor gain chip within a wavelength range to achieve wavelength tunability. The wavelength-locked optical component determines whether the specific wavelength beam deviates from a preset wavelength beam to achieve wavelength locking. If the specific wavelength beam deviates from the preset wavelength beam, the refractive index of the wavelength-tunable optical component is adjusted to ensure that the specific wavelength beam filtered by the wavelength-tunable optical component does not deviate from the preset wavelength beam. The semiconductor gain chip and the silicon photonics chip form a resonant cavity, and the specific wavelength beam is reflected back and forth between the semiconductor gain chip and the silicon photonics chip, achieving a stable output of the specific wavelength beam from the semiconductor gain chip. The silicon photonics chip integrates both wavelength-tunable and wavelength-locked optical components, which not only enables the light source to achieve wavelength tunability and wavelength locking functions but also saves space, resulting in a smaller light source size to meet production requirements.

[0135] The first lens 4053, located between the semiconductor gain chip 4051 and the isolator 4054, is used to collimate a beam of a specific wavelength. Specifically, the first lens 4053 is a collimating lens, which collimates the beam of a specific wavelength.

[0136] Isolator 4054, located between first lens 4053 and second lens 4055, is used to prevent the light beam incident on second lens 4055 from being reflected back into semiconductor gain chip 4051, so as to reduce the impact of light path reflection and thereby reduce the noise level of light source assembly 400.

[0137] The second lens 4055, located between the isolator 4054 and the semiconductor amplifier chip 4056, is used to converge and couple a specific wavelength light beam passing through the isolator 4054 into the semiconductor amplifier chip 4056. Specifically, the second lens 4055 is a converging lens, which converges and couples the specific wavelength light beam passing through the isolator 4054 into the semiconductor amplifier chip 4056.

[0138] The semiconductor amplifier chip 4056 is located between the collimating lens 4057 and the third lens 4057, and is used to amplify the power of a specific wavelength beam to increase the optical power of the specific wavelength beam.

[0139] Because the semiconductor amplifier chip 4056 amplifies the power, the optical power of a specific wavelength beam emitted by a light source equipped with the semiconductor amplifier chip 4056 is much higher than the optical power of a beam emitted by a light source without the semiconductor amplifier chip 4056.

[0140] The third lens 4057, located between the semiconductor amplifier chip 4056 and the beam splitter 4058, is used to collimate a beam of a specific wavelength. Specifically, the third lens 4057 is a collimating lens, which collimates the specific wavelength beam amplified by the semiconductor amplifier chip 4056.

[0141] Beam splitter 4058, located between third lens 4057 and internal fiber optic adapter 4016, is used to split a specific wavelength beam into two paths, one coupled to first power monitor 4059 and the other coupled to internal fiber optic adapter 4016.

[0142] A beam splitter is an optical device that splits a beam of light into two or more beams, typically made of a metal or dielectric film. The most common shape is a cube, made of two triangular glass prisms bonded together on a substrate using polyester, epoxy, or polyurethane adhesives. The thickness of the resin layer is adjusted so that half of the light (of a certain wavelength) incident through a "port" (i.e., a face of the cube) is reflected, while the other half continues to propagate due to total internal reflection. Polarizing beam splitters, such as Wollaston prisms, use birefringent materials to split light into beams of different polarizations. Another design uses a semi-silvered mirror, a sheet of glass or plastic with a thin, transparent metallic coating, now typically deposited from aluminum vapor. The thickness of the deposit is controlled so that a portion (usually half) of the light incident at a 45-degree angle and not absorbed by the coating is transmitted, while the remainder is reflected.

[0143] The first power monitor 4059, located between the beam splitter 4058 and the second mounting bracket 4012, is used for real-time monitoring of the optical power of a specific wavelength beam. Specifically, when the optical power of the specific wavelength beam is less than a preset optical power range, the amplification factor of the semiconductor amplifier chip 4056 is increased to bring the optical power of the specific wavelength beam within the preset optical power range. When the optical power of the specific wavelength beam is greater than the preset optical power range, the amplification factor of the semiconductor amplifier chip 4056 is decreased to bring the optical power of the specific wavelength beam within the preset optical power range.

[0144] In some embodiments, the optical power of a specific wavelength beam is monitored in real time by the first power monitor 4059 and the amplification factor of the semiconductor amplifier chip 4056 is adjusted so that the optical power of the specific wavelength beam emitted by the light source is within a preset optical power range.

[0145] The fourth lens 4060 is located between the semiconductor gain chip 4051 and the silicon photonics chip 4052, and is used to collimate the light beam of a wavelength range output by the semiconductor gain chip 4051.

[0146] like Figure 4-23As can be seen, in some embodiments, a sixth lens 40161 and an optical window 40162 are provided inside the internal fiber optic adapter 4016. The optical window 40162 is closer to the beam splitter 4058 than the sixth lens 40161. A specific wavelength beam is split into two paths by the beam splitter 4058, one of which enters the internal fiber optic adapter 4016 through the optical window 40162 and is focused and coupled into the fiber optic ferrule of the internal fiber optic adapter 4016 by the sixth lens 40161.

[0147] Based on the above description of the optical component 405 and the internal fiber optic adapter 4016, the optical component 405 can be divided into the following types.

[0148] Figure 24 This is an optical path diagram of a first optical component according to some embodiments. For example... Figure 24 It is understood that in some embodiments, the optical component 405 includes a semiconductor gain chip 4051, a silicon photonics chip 4052, and a first lens 4053. The semiconductor gain chip 4051 is located between the silicon photonics chip 4052 and the first lens 4053, and the first lens 4053 is located between the semiconductor gain chip 4051 and the internal fiber optic adapter.

[0149] All components in the light source except for the silicon photonic chip 4052 are placed on one side of the silicon photonic chip 4052, which effectively saves space in the light source, making the light source smaller and thus making it easier to meet production requirements.

[0150] Semiconductor gain chip 4051 is used to emit a light beam within a wavelength range. Silicon photonic chip 4052 is used to receive the light beam within a wavelength range and filter a specific wavelength beam from the light beam; it is also used to direct the specific wavelength beam into semiconductor gain chip 4051. Semiconductor gain chip 4051 and silicon photonic chip 4052 form a resonant cavity, and the specific wavelength beam is reflected back and forth between semiconductor gain chip 4051 and silicon photonic chip 4052, achieving a stable output of the specific wavelength beam from semiconductor gain chip. First lens 4053 is used to couple the specific wavelength beam emitted by semiconductor gain chip 4051 to an internal fiber optic adapter.

[0151] The semiconductor gain chip 4051 and the silicon photonics chip 4052 form a resonant cavity. A specific wavelength beam is reflected back and forth between the semiconductor gain chip 4051 and the silicon photonics chip 4052, enabling the specific wavelength beam to be stably output by the semiconductor gain chip. Specifically, since the semiconductor gain chip is made of III-V group gain material, it contains two optical waveguide end faces. One end face adopts a tilted waveguide structure and is coated with an antireflection film to achieve extremely low optical field reflectivity, which is used to couple with the input coupler of the silicon photonics chip, facilitating the back and forth reflection of the specific wavelength beam between the semiconductor gain chip and the silicon photonics chip. The other end face adopts a straight waveguide structure and is coated with a reflective film with a certain reflectivity to realize the optical field reflection and transmission functions, so that when the specific wavelength beam oscillates to a certain extent, the semiconductor gain chip 4051 emits the specific wavelength beam.

[0152] Figure 25 This is an optical path diagram of a second optical component according to some embodiments. For example... Figure 25 It is understood that in some embodiments, the optical component 405 further includes an isolator 4054 and a second lens 4055, the isolator 4054 being located between the first lens 4053 and the second lens 4055, and the second lens 4055 being located between the isolator 4054 and the internal fiber optic adapter 4016.

[0153] Figure 26 This is an optical path diagram of a third optical component according to some embodiments. For example... Figure 26 It is understood that in some embodiments, the optical component 405 further includes a semiconductor amplification chip 4056 and a third lens 4057. The semiconductor amplification chip 4056 is located between the second lens 4055 and the third lens 4057, and the third lens 4057 is located between the semiconductor amplification chip 4056 and the internal optical fiber adapter 4016.

[0154] Figure 27 This is an optical path diagram of a fourth optical component according to some embodiments. For example... Figure 27 It is understood that in some embodiments, the optical component 405 further includes a beam splitter 4058 and a first power monitor 4059. The beam splitter 4058 is located between the third lens 4057 and the internal fiber optic adapter 4016, and the first power monitor 4059 is located on one side of the beam splitter 4058.

[0155] Figure 28 This is an optical path diagram of a fifth optical component according to some embodiments. For example... Figure 27 It is understood that in some embodiments, the optical component 405 further includes a fourth lens 4060, which is located between the semiconductor gain chip 4051 and the silicon photonics chip 4052, and the semiconductor gain chip 4051 is located between the fourth lens 4060 and the first lens 4053.

[0156] Figure 29 This is a structural diagram of a first type of silicon photonic chip according to some embodiments. Figure 30 This is a filtering curve diagram of a wavelength sensor according to some embodiments. For example... Figures 29-30 As can be seen, in some embodiments, the first type of silicon photonics chip includes an input coupler 40521, a directional coupler 40522, a phase modulator 40523, a first power divider 40524, a first filter 40526, a second filter 40527, a fourth power monitor 40529, a wavelength sensor 405216, a vertical coupler 405217, a fifth power monitor 405218, and a sixth power monitor 405219. The input coupler 40521, directional coupler 40522, phase modulator 40523, first power divider 40524, first filter 40526, second filter 40527, fourth power monitor 40529, wavelength sensor 405216, vertical coupler 405217, fifth power monitor 405218, and sixth power monitor 405219 are all fabricated from silicon photonics chips using CMOS technology. Specifically,

[0157] The input coupler 40521 is located on one end face of the silicon photonic chip 4052. It is used to receive a light beam of a wavelength range emitted by the semiconductor gain chip 4051 and to output a specific wavelength light beam selected by the silicon photonic chip 4052 to the outside of the silicon photonic chip 4052.

[0158] A specific wavelength beam is reflected back and forth between the silicon photonics chip 4052 and the semiconductor gain chip 4051, so that the semiconductor gain chip 4051 and the silicon photonics chip 4052 form a resonant cavity, and the specific wavelength beam is stably output by the semiconductor gain chip.

[0159] In some embodiments, the input coupler 40521 adopts an angled waveguide design, that is, the optical waveguide of the input coupler 40521 is set at a certain angle to the end face of the silicon photonic chip 4052. In this way, when the light beam emitted by the semiconductor gain chip enters the input coupler 40521 from the upper right, part of the light beam may be reflected at the end face of the silicon photonic chip 4052. The reflected light beam will exit from the upper right instead of returning to the semiconductor gain chip, thereby reducing the impact of light reflection from the end face of the silicon photonic chip on the semiconductor gain chip.

[0160] Since one end face of the semiconductor gain chip adopts a tilted waveguide structure, the input coupler 40521 and the tilted waveguide structure of the semiconductor gain chip are arranged parallel to each other in the optical path direction. This allows the semiconductor gain chip to match the silicon photonics chip, reducing the reflection of the optical field of the input coupler 40521 and thus improving the beam quality. Specifically, the input coupler 40521 and the tilted waveguide structure of the semiconductor gain chip can be arranged parallel to each other in the optical path direction so that the exit angle of the specific wavelength beam output by the input coupler 40521 is 20°.

[0161] Directional coupler 40522, located between phase modulator 40523 and input coupler 40521, is used for beam splitting. Specifically, the first end of directional coupler 40522 is connected to input coupler 40521 via an optical waveguide, the second end of directional coupler 40522 is connected to phase modulator 40523 via an optical waveguide, the third end of directional coupler 40522 is connected to fourth power monitor 40529 via an optical waveguide, and the fourth end of directional coupler 40522 is connected to the first end of wavelength sensor 405216 via an optical waveguide. The directional coupler 40522 splits the input specific wavelength beam into three beams. The first beam is transmitted to the input coupler 40521 via the first optical waveguide, and then output to the outside of the silicon photonic chip 4052 via the input coupler 40521. The second beam is transmitted to the fourth power monitor 40529 via the optical waveguide, so that the fourth power monitor 40529 can monitor the optical power of the specific wavelength beam. The third beam is transmitted to the wavelength sensor 405216 via the optical waveguide for wavelength locking.

[0162] Phase modulator 40523, located between directional coupler 40522 and first power divider 40524, is used to adjust the wavelength of the beam supported by the resonant cavity to match the specific wavelength beam filtered by first filter 40526 and second filter 40527 with the beam in the resonant cavity. Specifically, the first end of phase modulator 40523 is connected to the second end of directional coupler 40522 via an optical waveguide, and the second end of phase modulator 40523 is connected to first power divider 40524 via an optical waveguide. A heater is provided on phase modulator 40523. By changing the heater, the cavity length of phase modulator 40523 is changed, thereby changing the cavity length of the resonant cavity, so that the beam of a certain wavelength supported by the resonant cavity coincides with the specific wavelength beam filtered by the two filters.

[0163] The first power divider 40524, located between the first filter 40526 and the phase modulator 40523, is used for beam splitting and beam combining. Specifically,

[0164] The first terminal of the first power divider 40524 is connected to the second terminal of the phase modulator 40523 via an optical waveguide. The second terminal of the first power divider 40524 is connected to the first filter 40526 via an optical waveguide. The third terminal of the first power divider 40524 is connected to the second filter 40527 via an optical waveguide.

[0165] A power divider generally refers to a power splitter. A power splitter is a device that splits the energy of one input signal into two or more outputs with equal or unequal energy. Conversely, it can also combine the energy of multiple signals into one output, in which case it can also be called a combiner.

[0166] The first power divider 40524 can split a single beam input from the phase modulator 40523 into two beams. One beam passes through a first filter 40526 and then a second filter 40527, while the other beam passes through a second filter 40527 and then a first filter 40526. The first power divider 40524 can also combine a specific wavelength beam filtered by the first filter 40526 and then the second filter 40527, and a specific wavelength beam filtered by the second filter 40527 and then the first filter 40526, into a single specific wavelength beam.

[0167] The splitting ratio of the first power divider 40524 is 50%:50%. Specifically, the first power divider 40524 splits a single beam into two beams at a 50%:50% ratio. These two beams are then filtered by the first filter 40526 and the second filter 40527 before returning to the first power divider 40524. According to the principle of optical path reversibility, theoretically, the losses other than those through the first filter 40526, the second filter 40527, and the optical waveguide are zero. The first power divider 40524 also splits a single beam into two beams at a 20%:80% ratio. These two beams are then filtered by the first filter 40526 and the second filter 40527 before returning to the first power divider 40524. According to the principle of optical path reversibility, theoretically, the losses other than those through the first filter 40526, the second filter 40527, and the optical waveguide are greater than zero. Therefore, in order to minimize beam loss, in some embodiments, the splitting ratio of the first power divider 40524 is 50%:50%.

[0168] The first filter 40526, in conjunction with the second filter 40527, filters a specific wavelength beam from a beam emitted by the semiconductor gain chip 4051 within a certain wavelength range. Specifically, the first filter is coupled to the power divider via a first direct optical waveguide, the second filter is coupled to the first filter via a second direct optical waveguide, and the second filter is coupled to the first power divider via a third direct optical waveguide. Both the first filter 40526 and the second filter 40527 are micro-ring structures, but they have different perimeters, resulting in different wavelengths of the beams filtered by the first filter 40526 and the second filter 40527. Based on the vernier effect, the beam filtered by the silicon photonics chip 4052 is only a specific wavelength beam when the wavelengths of the beams filtered by the first filter 40526 and the second filter 40527 coincide.

[0169] The second end of the first power divider 40524 is connected to the first straight optical waveguide. The first straight optical waveguide is coupled to the first filter 40526. The first filter 40526 and the second filter 40527 are coupled to the second straight optical waveguide, respectively. The second filter 40527 is coupled to the third straight optical waveguide. The second end of the first power divider 40524 is connected to the third straight optical waveguide.

[0170] The process of filtering a specific wavelength beam using the first filter 40526 and the second filter 40527 is as follows:

[0171] A beam of light within a certain wavelength range is incident through the input end of a first direct optical waveguide (near the first power divider 40524). When the beam reaches the first coupling region between the first direct optical waveguide and the first filter 40526, part of the beam couples into the first filter 40526, while the remaining part is output from the output end of the first direct optical waveguide (away from the first power divider 40524). The beam propagating in the first filter 40526 passes through the second coupling region formed by the second direct optical waveguide and the first filter 40526, where part of the beam couples into the second direct optical waveguide, while the remaining part continues to propagate within the first filter 40526. When the beam propagating in the first filter 40526 satisfies the resonance condition mλ = nl, resonance occurs, resulting in coherent enhancement. The optical power of the beam obtained from the first filter 40526 by the second direct optical waveguide also increases. Beams that do not satisfy the resonance condition are output from the output end of the first direct optical waveguide. Where λ is the wavelength of the light beam, l is the perimeter of the first filter, n is the effective refractive index of the first filter, and m is a positive integer. That is, only light beams that satisfy the resonance condition of the first filter 40526 can be filtered out by the first filter 40526 and coupled to the second straight waveguide.

[0172] When the light beam propagates to the third coupling region between the second straight waveguide and the second filter 40527, part of the beam couples into the second filter 40527, and the remaining part is output from the second output terminal of the second straight waveguide. When the beam propagating in the second filter 40527 passes through the fourth coupling region formed by the third straight waveguide and the second filter 40527, part of the beam couples into the third straight waveguide, and the remaining part continues to propagate within the second filter 40527. When the beam propagating in the second filter 40527 satisfies the resonance condition mλ = nl of the second filter 40527, resonance occurs, resulting in coherent enhancement. The optical power of the beam obtained from the second filter 40527 by the third straight waveguide also increases. Light that does not satisfy the resonance condition is output from the second output terminal of the second straight waveguide. Here, λ is the wavelength of the beam, l is the perimeter of the second filter, n is the effective refractive index of the second filter, and m is a positive integer. That is, only beams that satisfy the resonance condition of the second filter 40527 can be filtered out by the second filter 40527 and coupled to the third straight waveguide. At this time, the beam received by the third straight optical waveguide is a beam of a specific wavelength.

[0173] The above describes the process of selecting a specific wavelength beam by passing it through the first filter 40526 and then the second filter 40527. Similarly, the process of selecting a specific wavelength beam by passing it through the second filter 40527 and then the first filter 40526 is as follows:

[0174] A beam of light within a certain wavelength range is incident at the input end of the third straight waveguide (near the first power divider 40524). When the beam reaches the fourth coupling region between the third straight waveguide and the second filter 40527, part of the beam couples into the second filter 40527, while the remaining part is output from the output end of the third straight waveguide (away from the first power divider 40524). When the beam propagating in the second filter 40527 passes through the third coupling region formed by the second straight waveguide and the second filter 40527, part of the beam couples into the second straight waveguide, while the remaining part continues to propagate within the second filter 40527. When the beam propagating in the second filter 40527 satisfies the resonance condition mλ = nl of the second filter 40527, resonance occurs, resulting in coherent enhancement. The optical power of the beam obtained from the second filter 40527 by the second straight waveguide also increases. Light that does not satisfy the resonance condition is output from the output end of the third straight waveguide.

[0175] When the light beam propagates to the second coupling region between the second straight waveguide and the first filter 40526, part of the beam couples into the first filter 40526, and the remaining part is output from the first output terminal of the second straight waveguide. When the beam propagating in the first filter 40526 passes through the first coupling region formed by the first straight waveguide and the first filter 40526, part of the beam couples into the first straight waveguide, and the remaining part continues to propagate within the first filter 40526. When the beam propagating in the first filter 40526 satisfies the resonance condition mλ = nl of the first filter 40526, resonance occurs, resulting in coherent enhancement. The optical power of the beam received by the first straight waveguide from the first filter 40526 also increases. Light that does not satisfy the resonance condition is output from the first output terminal of the second straight waveguide. At this time, the beam received by the first straight waveguide is a beam of a specific wavelength.

[0176] Both the first filter 40526 and the second filter 40527 are micro-ring structures, but they have different perimeters. According to the resonance condition, the wavelengths of the beams filtered by the first filter 40526 and the second filter 40527 are different. Based on the vernier effect, the beam filtered by the silicon photonics chip 4052 is only a beam of a specific wavelength when the beam filtered by the first filter 40526 coincides with the beam filtered by the second filter 40527.

[0177] The first filter 40526, the second filter 40527, and the phase modulator 40523 constitute a wavelength-tunable optical component. The wavelength-tunable optical component is used to filter out a specific wavelength beam from a beam emitted by the semiconductor gain chip 4051 within a certain wavelength range.

[0178] The first filter 40526 and the second filter 40527 can filter a specific wavelength beam from a beam within a certain wavelength range emitted by the semiconductor gain chip 4051. This wavelength value is determined by the inherent characteristics of the first filter 40526 and the second filter 40527. However, the resonant cavity composed of the semiconductor gain chip and the silicon photonics chip will selectively support multiple different wavelength beams according to its own cavity structure. The multiple wavelength beams supported by the resonant cavity may not coincide with the beams filtered by the two filters. If the multiple wavelength beams supported by the resonant cavity do not coincide with the specific wavelength beams filtered by the two filters, the refractive index of the phase modulator can be changed to change the cavity length of the phase modulator, thereby changing the cavity length of the resonant cavity, so that the beam of a certain wavelength supported by the resonant cavity coincides with the specific wavelength beam, so that the resonant cavity emits a specific wavelength beam.

[0179] The fourth power monitor 40529 is used to monitor the optical power of a specific wavelength beam, thereby monitoring the optical power of the specific wavelength beam coupled to the semiconductor gain chip 4051. Specifically, the fourth power monitor 40529 is connected to the third end of the directional coupler 40522 via an optical waveguide. The fourth power monitor 40529 monitors the optical power of the second beam split off by the directional coupler 40522, and further monitors the optical power of the first beam split off by the directional coupler 40522 and input to the semiconductor gain chip 4051.

[0180] When the semiconductor gain chip 4051 couples the optical power of a specific wavelength beam, the photocurrent value flowing through the fourth power monitor 40529 is monitored in real time. A fixed current is applied to the semiconductor gain chip 4051, and the relative positions of the semiconductor gain chip 4051 and the silicon photonics chip 4052 are adjusted so that the photocurrent value flowing through the fourth power monitor 40529 varies with different coupling positions. The position with the largest photocurrent is the position with the largest coupled optical power.

[0181] The wavelength sensor 405216 has its first end connected to the vertical coupler 405217 via an optical waveguide, and its second end connected to the fifth power monitor 405218 and the sixth power monitor 405219 via optical waveguides, respectively. It is used to measure whether a specific wavelength beam changes, that is, whether the specific wavelength beam deviates from the preset wavelength beam.

[0182] The wavelength sensor 405216 is temperature insensitive. When the temperature of the silicon photonics chip changes, the filtering curve of the wavelength sensor 405216 remains essentially unchanged. Therefore, the wavelength sensor 405216 can be used as a device to measure whether a specific wavelength of light beam changes.

[0183] The fifth power monitor 405218 and the sixth power monitor 405219 are used to monitor the optical power of the output beam of the wavelength sensor 405216, respectively.

[0184] Wavelength sensor 405216, fifth power monitor 405218, and sixth power monitor 405219 constitute a wavelength-locked optical component to achieve wavelength locking. Specifically, the optical power monitored by the fifth power monitor 405218 is denoted as P. x The optical power monitored by the sixth power monitor 405219 is denoted as P. y According to P x / P y To characterize the direction of wavelength change of a beam of light at a specific wavelength. According to P... x / P y Knowing the wavelength offset direction of a specific wavelength beam, the wavelength-tunable component within the silicon photonics chip 4052 is adjusted to make P... x / P yRestore to the default value. When P x / P y When the settings are restored to the preset value, the selected wavelength beam will be the preset wavelength beam.

[0185] According to P x / P y This is used to characterize the direction of wavelength change of a beam at a specific wavelength. Specifically, according to the filter curve of wavelength sensor 405216, the optical power (optical intensity, equal to the optical power per unit area, or simply intensity) of the output beam at the output end of wavelength sensor 405216 follows a cosine function relationship with wavelength. That is, the optical power monitored by the fifth power monitor 405218 and the sixth power monitor 405219 both follow a cosine function, and the two are complementary. Since the optical power monitored by the fifth power monitor 405218 and the sixth power monitor 405219 both follow a cosine function and are complementary, and wavelength sensor 405216 has temperature-insensitive characteristics, then according to P... x / P y It is used to characterize the direction of wavelength change of a beam of a specific wavelength.

[0186] For example, the wavelength of the preset wavelength beam is set to 1549.7 nm. When the wavelength of the beam input to the wavelength sensor 405216 is 1549.7 nm, P x / P y Equals 1; when the wavelength of the light beam input to the wavelength sensor 405216 is 1549.8nm, P x / P y A value much greater than 1 indicates that 1549.8nm deviates from the preset wavelength.

[0187] In some embodiments, it may also be based on P x / (P x +P y To characterize the direction of wavelength change of a beam of light at a specific wavelength; or, according to P y / (P x +P y () is used to characterize the direction of wavelength change of a beam of a specific wavelength.

[0188] According to P x / P y Knowing the wavelength offset direction of a specific wavelength beam, the wavelength-tunable component within the silicon photonics chip 4052 is adjusted to make P... x / P y Restore to the preset value. Specifically, both the first filter 40526 and the second filter 40527 are equipped with heaters. When P x / P yWhen the value deviates from the preset value, the heaters of the first filter 40526 or the second filter 40527, or the heaters of the first filter 40526 and the second filter 40527, are adjusted to change the refractive index of the filter, thereby changing the wavelength of the light beam passing through the filter, so that the light beam filtered by the wavelength adjustable light component is a specific wavelength light beam.

[0189] Vertical coupler 405217 is used to couple a light beam from the outside of silicon photonics chip 4052 into the silicon photonics chip 4052 to test the filtering characteristics of wavelength sensor 405216. Specifically, material and process errors in the actual manufacturing process of silicon photonics chips can easily cause phase deviations in wavelength sensor 405216, thereby altering its filtering characteristics. When the filtering characteristics of wavelength sensor 405216 change, a specific wavelength beam is considered not to be the preset wavelength beam. To avoid this problem, the filtering characteristics of wavelength sensor 405216 need to be tested before the optical module is used. The preset wavelength beam from the outside of silicon photonics chip 4052 is coupled into silicon photonics chip 4052 via vertical coupler 405217, and then incident on wavelength sensor 405216 via the light waveguide between vertical coupler 405217 and wavelength sensor 405216. When P x / P y When the value deviates from the preset value, the phase difference of the wavelength sensor 405216 is changed by adjusting the heater on one of the modulation arms of the wavelength sensor 405216 to restore the filtering characteristics of the wavelength sensor 405216.

[0190] like Figure 29 As shown, the wavelength sensor 405216 includes a first beam splitter 4052161, a first modulation arm 4052163, a second modulation arm 4052164, and a second beam splitter 4052162. Specifically,

[0191] The first beam splitter 4052161 has its first end connected to the fourth end of the directional coupler 40522 and the vertical coupler 405217 via optical waveguides, and its second end connected to the first ends of the first modulation arm 4052163 and the second modulation arm 4052164, respectively. It is used to split the beam transmitted by the directional coupler 40522 or the vertical coupler 405217 into two beams, and transmit the two beams to the first modulation arm 4052163 and the second modulation arm 4052164, respectively. Specifically,

[0192] The first end of the first beam splitter 4052161 includes a first input port and a second input port. The second end of the first beam splitter 4052161 includes a first output port and a second output port. The first input port is connected to the fourth end of the directional coupler 40522 via an optical waveguide. The second input port is connected to the vertical coupler 405217 via an optical waveguide. The first output port is connected to the first end of the first modulation arm 4052163. The second output port is connected to the first end of the second modulation arm 4052164.

[0193] The second beam splitter 4052162 has its first end connected to the second ends of both the first modulation arm 4052163 and the second modulation arm 4052164, and its second end connected to the fifth power monitor 405218 and the sixth power monitor 405219 via optical waveguides. It is used to couple the beams from the first modulation arm 4052163 and the second modulation arm 4052164 into a single beam, and also to split the single beam into two beams. One beam enters the fifth power monitor 405218 via the optical waveguide for monitoring; the other beam enters the sixth power monitor 405219 via the optical waveguide for monitoring. Specifically,

[0194] The first end of the second beam splitter 4052162 includes a third input port and a fourth input port, and the second end of the second beam splitter 4052162 includes a third output port and a fourth output port. The third input port is connected to the second end of the first modulation arm 4052163, the fourth input port is connected to the second end of the second modulation arm 4052164, the third output port is connected to the fifth power monitor 405218 through an optical waveguide, and the fourth output port is connected to the sixth power monitor 405219 through an optical waveguide.

[0195] Both the first beam splitter 4052161 and the second beam splitter 4052162 utilize the principle of interference to achieve beam splitting and beam combining.

[0196] The splitting ratios of the first beam splitter 4052161 and the second beam splitter 4052162 are equal. Specifically, when the splitting ratios of the first beam splitter 4052161 and the second beam splitter 4052162 differ significantly, beam loss is easily caused. To reduce beam loss, in some embodiments, the splitting ratios of the first beam splitter 4052161 and the second beam splitter 4052162 are designed to be approximately equal. However, to further reduce beam loss, the splitting ratios of the first beam splitter 4052161 and the second beam splitter 4052162 can be designed to be equal, with the splitting ratio of the first beam splitter 4052161 being 50%:50% and the splitting ratio of the second beam splitter 4052162 also being 50%:50%.

[0197] At any given moment, only one beam transmitted by the directional coupler 40522 and the vertical coupler 405217 is coupled to the first beam splitter 4052161. For example, at time T1, the beam transmitted by the directional coupler 40522 is coupled to the first beam splitter 4052161; at time T2, the beam transmitted by the vertical coupler 405217 is coupled to the first beam splitter 4052161.

[0198] The first modulation arm 4052163 has its first end connected to the second end of the first beam splitter 4052161, and its second end connected to the first end of the second beam splitter 4052162.

[0199] The second modulation arm 4052164 has its first end connected to the second end of the first beam splitter 4052161, and its second end connected to the first end of the second beam splitter 4052162.

[0200] Among them, the first modulation arm 4052163 is a silicon waveguide, and the second modulation arm 4052164 is a silicon waveguide + silicon nitride waveguide + silicon waveguide.

[0201] The 405216 wavelength sensor is temperature insensitive. Specifically,

[0202] The waveform of the output intensity of the output beam at the output end of the wavelength sensor based on the Mach-Zehnder interferometry principle is related to the refractive index and the length of the upper and lower modulation arms. The difference between the product of the refractive index and the length of the modulation arm determines the wavelength position of the input beam. Therefore, as long as the waveguide design ensures that the difference between the product of the refractive index and the length of the modulation arm remains constant at different temperatures, the waveform of the output intensity of the output beam at the output end remains constant as the wavelength of the input beam at the input end changes at different temperatures, thereby achieving the temperature-insensitive characteristic of the input beam wavelength.

[0203] Since the first modulation arm 4052164 is a silicon waveguide and the second modulation arm 4052164 is a silicon waveguide + silicon nitride waveguide + silicon waveguide, it is only necessary to adjust the lengths of the first modulation arm 4052164 and the second modulation arm 4052164 so that the difference between the product of the length of the first modulation arm 4052164 and the refractive index and the product of the length of the second modulation arm 4052164 and the refractive index remains unchanged, thus achieving the wavelength insensitivity characteristic.

[0204] Since the first end of the second modulation arm 4052164 is a silicon waveguide, the second end of the second modulation arm 4052164 is a silicon waveguide, and the space between the first end and the second end of the second modulation arm 4052164 is a silicon nitride waveguide, in order to enable a specific wavelength beam to be transmitted smoothly between waveguides made of two different materials, two waveguide transducers are provided on the second modulation arm 4052164, and the two waveguide transducers are located between the silicon waveguide and the silicon nitride waveguide, respectively.

[0205] Since two waveguide converters are provided on the second modulation arm 4052164, in order to eliminate the influence of the two waveguide converters on the second modulation arm 4052164, two corresponding waveguide converters are provided on the first modulation arm 4052163.

[0206] like Figure 29 As can be seen, in some embodiments, the first silicon photonic chip further includes multiple absorbers, which are used to absorb the optical power of unwanted light beams and avoid the generation of reflected and stray light. Specifically, the first silicon photonic chip includes a first absorber 405211, a second absorber 405212, a third absorber 405213, and a fourth absorber 405214.

[0207] The first power divider 40524 is connected to the input terminal of the first straight optical waveguide, the first absorber 405211 is connected to the output terminal of the first straight optical waveguide, the second absorber 405212 is connected to the first output terminal of the second straight optical waveguide, the third absorber 405213 is connected to the second output terminal of the second straight optical waveguide, the first power divider 40524 is connected to the input terminal of the third straight optical waveguide, and the fourth absorber 40214 is connected to the output terminal of the third straight optical waveguide.

[0208] The first absorber 405211 is used to absorb other light beams in the first straight optical waveguide that are not passed through the first filter 40526 and the second filter 40527. The second absorber 405212 and the third absorber 405213 are both used to absorb other light beams in the second straight optical waveguide that are not passed through the first filter 40526 and the second filter 40527. The fourth absorber 405214 is used to absorb other light beams in the third straight optical waveguide that are not passed through the first filter 40526 and the second filter 40527.

[0209] In some embodiments, the light source includes a semiconductor gain chip and a silicon photonics chip. The silicon photonics chip receives a light beam of a wavelength range emitted by the semiconductor gain chip, filters a specific wavelength beam from the beam, and also emits the specific wavelength beam back to the semiconductor gain chip. The semiconductor gain chip and the silicon photonics chip form a resonant cavity, and the specific wavelength beam is reflected back and forth between the semiconductor gain chip and the silicon photonics chip, causing the resonant cavity to emit the specific wavelength beam. The silicon photonics chip includes an input coupler, a directional coupler, a wavelength-tunable optical component, a wavelength sensor, a fifth power monitor, and a sixth power monitor. The directional coupler is connected to the input coupler, the wavelength-tunable optical component, and the wavelength sensor via optical waveguides, and the wavelength sensor is also connected to the fifth and sixth power monitors via optical waveguides. The input coupler, directional coupler, wavelength-tunable optical component, wavelength sensor, fifth power monitor, and sixth power monitor are integrated on the silicon photonics chip, saving space and making the light source smaller to meet production requirements. The input coupler receives a light beam of a wavelength range emitted by the semiconductor gain chip and emits a specific wavelength beam back to the semiconductor gain chip. The directional coupler splits the specific wavelength beam. A wavelength-tunable optical component is used to filter a specific wavelength beam from a beam within a wavelength range to achieve wavelength tunability. A wavelength-locked optical component comprises a wavelength sensor, a fifth power monitor, and a sixth power monitor. The wavelength-locked optical component uses the ratio of the optical power of the fifth power monitor to the optical power of the sixth power monitor to characterize whether the specific wavelength beam deviates from a preset wavelength beam, thus achieving wavelength locking. When the specific wavelength beam deviates from the preset wavelength beam, the wavelength-tunable optical component is adjusted to prevent it from deviating from the preset wavelength beam. In this application, the input coupler, directional coupler, wavelength-tunable optical component, and wavelength-locked optical component are integrated on a silicon photonics chip, saving space and resulting in a smaller light source size to meet production requirements. The wavelength-tunable optical component and the wavelength-locked optical component work together to ensure that the specific wavelength beam output by the light source does not deviate from the preset wavelength beam.

[0210] To address the issue of large size in current light sources, some embodiments propose an alternative light source. This light source includes a semiconductor gain chip, a silicon photonics chip, a wavelength calibration device, and a second power monitor. The semiconductor gain chip emits a beam of light within a specific wavelength range. The silicon photonics chip integrates a wavelength-tunable optical component, which filters a specific wavelength beam from the beam emitted by the semiconductor gain chip to achieve wavelength tunability. The semiconductor gain chip and the silicon photonics chip form a resonant cavity, and the specific wavelength beam reflects back and forth between the semiconductor gain chip and the silicon photonics chip, ensuring a stable output of the specific wavelength beam from the semiconductor gain chip. A power monitor, a wavelength calibration device, and a second power monitor within the silicon photonics chip constitute a wavelength-locking optical component. The wavelength-locking optical component determines whether the specific wavelength beam deviates from a preset wavelength beam to achieve wavelength locking. If the specific wavelength beam deviates from the preset wavelength beam, the refractive index of the wavelength-tunable optical component is adjusted to ensure that the specific wavelength beam filtered by the wavelength-tunable optical component does not deviate from the preset wavelength beam. A semiconductor gain chip and a silicon photonics chip form a resonant cavity. A beam of a specific wavelength is reflected back and forth between the semiconductor gain chip and the silicon photonics chip, enabling a stable output of the specific wavelength beam from the semiconductor gain chip. The silicon photonics chip integrates a wavelength-tunable optical component. A power monitor, a wavelength calibration device, and a second power monitor within the silicon photonics chip constitute a wavelength-locked optical component. This not only enables the light source to achieve wavelength tunability and wavelength locking functions, but also saves space, making the light source smaller to meet production requirements.

[0211] like Figure 17 , 22 As can be seen from Figure 23, in some embodiments, the optical component 405, in addition to including a semiconductor gain chip 4051, a silicon photonics chip 4052, a first lens 4053, an isolator 4054, a second lens 4055, a semiconductor amplification chip 4056, a third lens 4057, a beam splitter 4058, a first power monitor 4059, and a fourth lens 4060, may also include a fifth lens, a wavelength calibration device, and a second power monitor. Specifically,

[0212] The semiconductor gain chip 4051, the first lens 4053, the isolator 4054, the second lens 4055, the semiconductor amplifier chip 4056, the third lens 4057, the beam splitter 4058, the first power monitor 4059, and the fourth lens 4060 have been described before and will not be repeated here.

[0213] However, the silicon photonics chip 4052 only contains a wavelength-tunable optical component and lacks a wavelength-locked optical component. Therefore, the silicon photonics chip 4052 can only achieve wavelength tunability, not wavelength locking.

[0214] To achieve wavelength locking, in some embodiments, optical component 405 also needs to include a fifth lens, a wavelength calibration element, and a second power monitor.

[0215] The fifth lens, located on the same side of the silicon photonics chip 4052 as the fourth lens 4060, is situated between the silicon photonics chip 4052 and the wavelength calibration element. It is used to couple a beam of a specific wavelength emitted by the silicon photonics chip to the wavelength calibration element. Specifically, the fifth lens is a focusing lens that focuses and couples the specific wavelength beam to the wavelength calibration element.

[0216] The wavelength calibration element is located between the fifth lens and the second power monitor.

[0217] The second power monitor is used to monitor the optical power of a specific wavelength beam flowing through the wavelength calibration device.

[0218] The silicon photonics chip 4052 contains a power monitor, a wavelength calibration unit, and a second power monitor, which together form a wavelength-locked optical component. This component determines whether a specific wavelength beam deviates from a preset wavelength beam, thus achieving wavelength locking.

[0219] Figure 31 This is an optical path diagram of a sixth optical component according to some embodiments. For example... Figure 31 It is understood that, in some embodiments, the optical component 405 includes a semiconductor gain chip 4051, a silicon photonics chip 4052, a first lens 4053, a fifth lens 4061, a wavelength calibration component 4062, and a second power monitor 4063.

[0220] Semiconductor gain chip 4051 is located between silicon photonic chip 4052 and first lens 4053. First lens 4053 is located between semiconductor gain chip 4051 and internal fiber optic adapter. Fifth lens 4061 is located between silicon photonic chip 4052 and wavelength calibration component 4062. Wavelength calibration component 4062 is located between fifth lens 4061 and second power monitor 4063.

[0221] All components in the light source, except for the silicon photonic chip 4052, are placed on the same side of the silicon photonic chip 4052, which effectively saves space in the light source, making the light source smaller and thus making it easier to meet production requirements.

[0222] Semiconductor gain chip 4051 is used to emit a light beam within a wavelength range. Silicon photonics chip 4052 is used to receive the light beam within a wavelength range and filter a specific wavelength beam within that range; it is also used to direct the specific wavelength beam into semiconductor gain chip 4051 and fifth lens 4061. First lens 4053 is used to couple the specific wavelength beam emitted by semiconductor gain chip 4051 to an internal fiber optic adapter. Fifth lens 4061 is used to couple the specific wavelength beam output by silicon photonics chip 4052 to wavelength calibration element 4062. Second power monitor 4063 is used to monitor the optical power of the specific wavelength beam flowing through wavelength calibration element 4062. The direction of wavelength change of the specific wavelength beam is characterized by the ratio (P1 / P0) of the optical power monitored by one of the power monitors in silicon photonics chip 4052 (denoted as P0) to the optical power monitored by the second power monitor 4063 (denoted as P1).

[0223] A beam of light with a wavelength range emitted by a semiconductor gain chip 4051 is incident on a silicon photonic chip 4052. The silicon photonic chip 4052 selects a specific wavelength beam from the beam of light with a wavelength range. The specific wavelength beam is incident on a fifth lens 4061. The fifth lens 4061 couples the specific wavelength beam output by the silicon photonic chip 4052 to a wavelength calibration element 4062. A second power monitor 4063 monitors the optical power of the specific wavelength beam flowing through the wavelength calibration element 4062.

[0224] A power monitor in the silicon photonics chip 4052, along with a wavelength calibration device 4061 and a second power monitor 4063, constitute a wavelength-locked optical component. The wavelength-locked optical component characterizes whether a specific wavelength beam deviates from a preset wavelength beam based on the ratio of the optical power of the second power monitor 4063 to the optical power of the power monitor in the silicon photonics chip 4052, thereby achieving wavelength locking.

[0225] When the wavelength of the selected specific wavelength beam deviates from the wavelength of the preset wavelength beam, the optical power of the second power monitor 4063 changes, causing P1 / P0 to deviate from the preset value. When the wavelength of the selected specific wavelength beam deviates from the wavelength of the preset beam, the optical power input to the second power monitor 4063 from the wavelength calibration component changes, causing P1 / P0 to deviate from the preset value. The increase or decrease of P1 / P0 reflects the direction of the wavelength shift of the specific wavelength beam, i.e., whether the wavelength of the specific wavelength beam shifts towards longer or shorter wavelengths. Once the direction of the shift is known, P1 / P0 can be restored to the preset value by adjusting the components within the silicon photonics chip 4052. When P1 / P0 returns to the preset value, the wavelength of the selected specific wavelength beam is the wavelength of the preset wavelength beam. The preset wavelength beam is the local oscillator beam that satisfies the requirements of the coherent components.

[0226] A specific wavelength beam not only enters the fifth lens 4061 but also the semiconductor gain chip 4051. After entering the semiconductor gain chip 4051, the beam is reflected back and forth between the silicon photonics chip 4052 and the semiconductor gain chip 4051. The semiconductor gain chip 4051 and the silicon photonics chip 4052 form a resonant cavity, allowing the specific wavelength beam to be stably output from the semiconductor gain chip. The first lens 4053 couples the specific wavelength beam emitted by the semiconductor gain chip 4051 to the internal fiber optic adapter.

[0227] Combination Figure 24 , 25 As can be seen from 31, the optical component 405 also includes an isolator 4054 and a second lens 4055.

[0228] Combination Figure 24 , 26 As can be seen from 31, the optical component 405 also includes a semiconductor amplification chip 4056 and a third lens 4057.

[0229] Combination Figure 24 , 27 As can be seen from 31, the optical component 405 also includes a beam splitter 4058 and a first power monitor 4059.

[0230] Combination Figure 24 , 28 As can be seen from 31, the optical component 405 also includes a fourth lens 4060.

[0231] Figure 32 This is a structural diagram of a second type of silicon photonic chip according to some embodiments. For example... Figures 31-32 As can be seen, in some embodiments, the silicon photonics chip 4052 includes an input coupler 40521, a directional coupler 40522, a phase modulator 40523, a first power divider 40524, a second power divider 40525, a first filter 40526, a second filter 40527, a third power monitor 40528, a fourth power monitor 40529, and an output coupler 405210. The input coupler 40521, directional coupler 40522, phase modulator 40523, first power divider 40524, second power divider 40525, first filter 40526, second filter 40527, third power monitor 40528, fourth power monitor 40529, and output coupler 405210 are all fabricated from the silicon photonics chip using CMOS technology. Specifically,

[0232] The input coupler 40521 and the output coupler 405210 are located on the same side of the silicon photonics chip.

[0233] The input coupler 40521, phase modulator 40523, first power divider 40524, first filter 40526, second filter 40527 and fourth power monitor 40529 have all been introduced and will not be repeated here.

[0234] The first end of the directional coupler 40522 is connected to the input coupler 40521 via an optical waveguide; the second end of the directional coupler 40522 is connected to the phase modulator 40523 via an optical waveguide; the third end of the directional coupler 40522 is connected to the fourth power monitor 40529 via an optical waveguide; and the fourth end of the directional coupler 40522 is connected to the second power divider 40525 via an optical waveguide. The directional coupler 40522 splits the input specific wavelength beam into three beams. The first beam is transmitted through the first optical waveguide to the input coupler 40521, and then output through the input coupler 40521 to the outside of the silicon photonics chip 4052; the second beam is transmitted through the optical waveguide to the fourth power monitor 40529 for monitoring the optical power of the specific wavelength beam; and the third beam is transmitted through the optical waveguide to the second power divider 40525 for wavelength locking.

[0235] The second power divider 40525, located between the directional coupler 40522 and the third power monitor 40528, and also between the directional coupler 40522 and the output coupler 405210, is used for beam splitting. Specifically, the first end of the second power divider 40525 is connected to the fourth end of the directional coupler 40522 via an optical waveguide, the second end of the second power divider 40525 is connected to the third power monitor 40528 via an optical waveguide, and the third end of the second power divider 40525 is connected to the output coupler 405210 via an optical waveguide. The second power divider 40525 splits the third beam split from the directional coupler 40522 into two beams. One beam is transmitted via an optical waveguide to the third power monitor 40528 for monitoring the optical power of a specific wavelength beam; the other beam is transmitted via an optical waveguide to the output coupler 405210.

[0236] The splitting ratio of the second power divider 40525 can be any ratio. When the splitting ratio of the second power divider 40525 changes, the preset value of P1 / P0 also changes. Simply adjust the preset value of P1 / P0 whenever the splitting ratio of the second power divider 40525 changes.

[0237] The third power monitor 40528 is used to monitor the optical power of a specific wavelength beam in real time. Specifically, the third power monitor 40528 is connected to the second end of the second power divider 40525 via an optical waveguide. The third power monitor 40528 monitors the optical power of one beam split off from the second power divider 40525.

[0238] Among them, the power monitor used to monitor a specific wavelength beam in the silicon photonics chip 4052 is the third power monitor 40528.

[0239] Output coupler 405210, located on one end face of silicon photonic chip 4052, is used to couple a specific wavelength beam to the fifth lens 4061. Specifically, output coupler 405210 is connected to the second power divider 40525 via an optical waveguide. Output coupler 405210 couples another beam split from the second power divider 40525 to the fifth lens 4061.

[0240] In some embodiments, the output coupler 405210 adopts an inclined waveguide design, that is, the waveguide of the output coupler 405210 is set at a certain angle to the end face of the silicon photonic chip 40521, so that the signal light output by the output coupler 405210 is horizontally emitted from the end face of the silicon photonic chip, which facilitates coupling with the second lens 4055 outside the silicon photonic chip 4052.

[0241] The third power monitor 40528, along with the wavelength calibration component 4062 located outside the silicon photonics chip 4052 and the second power monitor 4063, achieve wavelength locking. Specifically, the optical power monitored by the third power monitor 40528 is denoted as P0, and the optical power monitored by the second power monitor 4063 is denoted as P1. The wavelength calibration component 4062 characterizes the wavelength change direction of a specific wavelength beam based on P1 / P0. The wavelength calibration component determines the wavelength offset direction of the specific wavelength beam based on P1 / P0 and adjusts the components within the silicon photonics chip 4052 to restore P1 / P0 to a preset value. When P1 / P0 returns to the preset value, the selected specific wavelength beam is the preset wavelength beam.

[0242] like Figure 32 As can be seen, in some embodiments, the second type of silicon photonic chip further includes multiple absorbers. These absorbers are used to absorb the optical power of unwanted light beams, preventing reflections and stray light generation. Specifically, the first silicon photonic chip includes a first absorber 405211, a second absorber 405212, a third absorber 405213, and a fourth absorber 405214. The first absorber 405211, the second absorber 405212, the third absorber 405213, and the fourth absorber 405214 have all been described previously and will not be repeated here.

[0243] Figure 33 This is a structural diagram of a third type of silicon photonic chip according to some embodiments. For example... Figure 33As can be seen, in some embodiments, the third type of silicon photonics chip includes an input coupler 40521, a directional coupler 40522, a phase modulator 40523, a first power divider 40524, a second power divider 40525, a first filter 40526, a second filter 40527, a third power monitor 40528, and an output coupler 405210. The input coupler 40521, directional coupler 40522, phase modulator 40523, first power divider 40524, second power divider 40525, first filter 40526, second filter 40527, third power monitor 40528, and output coupler 405210 are all fabricated from silicon photonics chips using CMOS technology. Specifically,

[0244] The input coupler 40521, phase modulator 40523, first power divider 40524, first filter 40526, second filter 40527 and output coupler 405210 have been introduced and will not be repeated here.

[0245] The first end of the directional coupler 40522 is connected to the input coupler 40521 via an optical waveguide. The second end of the directional coupler 40522 is connected to the phase modulator 40523 via an optical waveguide. The third end of the directional coupler 40522 is connected to the second power divider 40525 via an optical waveguide. The directional coupler 40522 splits the input specific wavelength beam into multiple beams. The first beam is transmitted to the input coupler 40521 via the first optical waveguide, and then output to the outside of the silicon photonics chip 4052 via the input coupler 40521. The second beam is transmitted to the second power divider 40525 via an optical waveguide for wavelength locking.

[0246] The second power divider 40525, located between the directional coupler 40522 and the third power monitor 40528, and also between the directional coupler 40522 and the output coupler 405210, is used for beam splitting. Specifically, the first end of the second power divider 40525 is connected to the third end of the directional coupler 40522 via an optical waveguide, the second end of the second power divider 40525 is connected to the third power monitor 40528 via an optical waveguide, and the third end of the second power divider 40525 is connected to the output coupler 405210 via an optical waveguide. The second power divider 40525 splits the second beam split from the directional coupler 40522 into two beams. One beam is transmitted via an optical waveguide to the third power monitor 40528 for monitoring the optical power of a specific wavelength beam; the other beam is transmitted via an optical waveguide to the output coupler 405210.

[0247] The third power monitor 40528 is used to monitor the optical power of a beam at a specific wavelength. Specifically, the third power monitor 40528 is connected to the second end of the second power divider 40525 via an optical waveguide. The third power monitor 40528 monitors the optical power of the second beam split by the directional coupler 40522, and further monitors the optical power of the first beam split by the directional coupler 40522 and input to the semiconductor gain chip 4051.

[0248] Among them, the power monitor used to monitor a specific wavelength beam in the silicon photonics chip 4052 is the third power monitor 40528.

[0249] The third power monitor 40528, along with the wavelength calibration component 4062 outside the silicon photonics chip 4052 and the second power monitor 4063, achieve wavelength locking. Specifically, the optical power monitored by the third power monitor 40528 is denoted as P0, and the optical power monitored by the second power monitor 4063 is denoted as P1. The wavelength change direction of a specific wavelength beam is characterized by P1 / P0. Based on P1 / P0, the wavelength shift direction of the specific wavelength beam is determined, and the components within the silicon photonics chip 4052 are adjusted to restore P1 / P0 to a preset value. When P1 / P0 returns to the preset value, the selected specific wavelength beam is the preset wavelength beam.

[0250] like Figure 33 As can be seen, in some embodiments, the third type of silicon photonic chip also includes multiple absorbers, which are used to absorb the optical power of unwanted light beams and avoid the generation of reflected and stray light. Specifically, the third type of silicon photonic chip includes a first absorber 405211, a second absorber 405212, a third absorber 405213, a fourth absorber 405214, and a fifth absorber 405215.

[0251] The first absorber 405211, the second absorber 405212, the third absorber 405213, the fourth absorber 405214, and the fifth absorber 405215 have been introduced and will not be repeated here.

[0252] The fifth absorber 405215 is connected to the fourth end of the directional coupler 40522 via the fourth straight optical waveguide. The fifth absorber 405215 is used to absorb the light beam transmitted from the fourth straight optical waveguide. The light beam transmitted from the fourth straight optical waveguide is the third beam split off by the directional coupler 40522.

[0253] In some embodiments, the second and third silicon photonic chips further include a plurality of thermal insulation grooves 405216. The thermal insulation grooves 405216 are formed by etching the surface of the silicon photonic chip 4052. The thermal insulation grooves 405216 are placed between the various devices within the silicon photonic chip 4052, reducing thermal crosstalk between the devices and improving the performance of the silicon photonic chip 4052.

[0254] For the second type of silicon photonic chip, the heat insulation slot 405216 is placed between the directional coupler 40522 and the phase modulator 40523, between the first power divider 40524 and the first filter 40526, between the first filter 40526 and the second filter 40527, between the second filter 40527 and the third power monitor 40528, between the phase modulator 40523 and the second power divider 40525, and between the directional coupler 40522 and the second power divider 40525.

[0255] A heat insulation slot 405216 is placed between the directional coupler 40522 and the phase modulator 40523. Here, the heat insulation slot 405216 reduces thermal crosstalk between the directional coupler 40522 and the phase modulator 40523. A heat insulation slot 405216 is also placed between the first power divider 40524 and the first filter 40526, reducing thermal crosstalk between them. Finally, a heat insulation slot 405216 is placed between the first filter 40526 and the second filter 40527, reducing thermal crosstalk between them. Thermal insulation slot 405216 is placed between the second filter 40527 and the third power monitor 40528. Here, thermal insulation slot 405216 reduces thermal crosstalk between the second filter 40527 and the third power monitor 40528. Thermal insulation slot 405216 is also placed between the phase modulator 40523 and the second power divider 40525. Here, thermal insulation slot 405216 reduces thermal crosstalk between the phase modulator 40523 and the second power divider 40525. Thermal insulation slot 405216 is also placed between the directional coupler 40522 and the second power divider 40525. Here, thermal insulation slot 405216 reduces thermal crosstalk between the directional coupler 40522 and the second power divider 40525.

[0256] The first, second, and third silicon photonic chips are all silicon photonic chips that integrate wavelength-tunable optical components using CMOS (Complementary Metal Oxide Semiconductor) technology. The first silicon photonic chip also integrates a wavelength-locked optical component. The second and third silicon photonic chips have a power monitor integrated inside, which, together with the wavelength calibration device and the second power monitor outside the silicon photonic chip, forms a wavelength-locked optical component.

[0257] In some embodiments, the light source includes a semiconductor gain chip, a silicon photonics chip, a wavelength calibration device, and a second power monitor. The silicon photonics chip receives a light beam of a wavelength range emitted by the semiconductor gain chip, filters a specific wavelength beam from the beam, and also emits the specific wavelength beam to the semiconductor gain chip and the wavelength calibration device. The semiconductor gain chip and the silicon photonics chip form a resonant cavity, and the specific wavelength beam is reflected back and forth between the semiconductor gain chip and the silicon photonics chip, causing the resonant cavity to emit the specific wavelength beam. The second power monitor monitors the optical power of the specific wavelength beam flowing through the wavelength calibration device. The silicon photonics chip includes an input coupler, a directional coupler, a wavelength-tunable optical component, a second power divider, a third power monitor, and an output coupler. The directional coupler is connected to the input coupler, the wavelength-tunable optical component, and the second power divider via optical waveguides, respectively. The third power monitor and the output coupler are connected to the second power divider via optical waveguides, respectively. The input coupler and the output coupler are located on the same side of the silicon photonics chip. The input coupler, directional coupler, wavelength-tunable optical component, second power divider, third power monitor, and output coupler are integrated onto a silicon photonic chip, saving space and resulting in a smaller light source size to meet production requirements. The input coupler receives a beam of light within a wavelength range emitted by the semiconductor gain chip and emits a specific wavelength beam to the semiconductor gain chip. The directional coupler splits the specific wavelength beam. The wavelength-tunable optical component filters the specific wavelength beam from a beam within a wavelength range to achieve wavelength tunability. The second power divider splits the beam flowing through it after being split by the directional coupler. The third power monitor monitors the optical power of one of the beams. The output coupler emits the other beam to a wavelength calibration device. The third power monitor, along with the wavelength calibration device and the second power monitor, forms a wavelength-locked optical component. The wavelength-locked optical component uses the ratio of the optical power of the second power monitor to the optical power of the third power monitor to characterize whether the specific wavelength beam deviates from the preset wavelength beam, thus achieving wavelength locking. When the specific wavelength beam deviates from the preset wavelength beam, the wavelength-tunable optical component is adjusted to bring the specific wavelength beam back to the preset wavelength beam. In this application, the input coupler, directional coupler, wavelength-tunable light component, second power divider, third power monitor, and output coupler are integrated on a silicon photonic chip, saving space and making the light source smaller to meet production requirements; the wavelength-tunable light component and the wavelength-locked light component work together to ensure that the specific wavelength beam output by the light source does not deviate from the preset wavelength beam.

[0258] Driven by large-scale and cloud data center providers, the transmission rate of optical modules is rapidly increasing, such as 200G / 400G high-speed optical modules.

[0259] The optical module provided in this application embodiment is a coherent optical module, and more specifically a silicon photonics coherent optical module; the coherent optical module is an optical module in which the transmitting end adopts coherent modulation and the receiving end adopts coherent technology for detection.

[0260] At the transmitting end, in addition to amplitude modulation of light, frequency or phase modulation can also be performed using external modulation methods, such as QAM. Furthermore, external modulation can be employed at the transmitting end using an IQ modulator based on a Mach-Zehnder modulator (MZM) to achieve higher-order modulation, modulating the signal onto an optical carrier to generate light carrying the signal for transmission. Specifically, the silicon photonics chip contains a Mach-Zehnder modulator to achieve power and phase modulation. The Mach-Zehnder modulator uses the principle of same-wavelength light interference. A Mach-Zehnder modulator has two interference arms, with one beam of light input to each arm. A total of two beams of light of the same wavelength are required to power the Mach-Zehnder modulator. After modulation by the Mach-Zehnder modulator, the light on the interference arms merges into a single beam. A single-wavelength light beam can be supplied to the silicon photonics chip, and the beam splitter inside the chip can split it into two beams of the same wavelength, which are then input into the two interference arms of a Mach-Zehnder modulator. Alternatively, two beams of the same wavelength can be supplied to the chip and directly input into the two interference arms of the modulator. Since the Mach-Zehnder modulator ultimately fuses the light from each interference arm, the scheme of supplying two beams of light to the silicon photonics chip, using a single chip with the same optical power, can provide higher optical power than the scheme of supplying one beam.

[0261] At the receiving end, the local oscillator light is mixed with the received external optical signal in an optical mixer to obtain a difference frequency signal whose frequency, phase, and amplitude vary in the same way as the external optical signal. The magnitude of the output photocurrent after coherent mixing is proportional to the product of the power of the external optical signal and the power of the local oscillator light. Since the power of the local oscillator light is greater than the power of the external optical signal, the output photocurrent after coherent mixing increases significantly, thereby improving the detection sensitivity. Therefore, it can be concluded that in incoherent optical modules, many amplifiers are used during transmission to continuously relay and amplify the signal, while in coherent optical modules, the weak arriving signal is directly mixed and amplified at the receiving end.

[0262] Furthermore, since optical signals will be distorted during transmission through optical fiber links, the above embodiments of this application employ digital signal processing (DSP) technology to combat and compensate for distortion, thereby reducing the impact of distortion on the system bit error rate. DSP technology can perform various signal compensation processing, such as chromatic dispersion compensation and polarization mode dispersion compensation.

[0263] Figure 34 This application illustrates a coherent component in an embodiment. Figure 35This is an exploded view of a coherent component as shown in an embodiment of this application, such as... Figure 34 and Figure 35 As shown, the coherent assembly 500 typically includes a cover 501 and a carrier plate 502, with the cover 501 fastened to the carrier plate 502 to form a coherent housing with an opening; the outer contour of the housing is generally rectangular.

[0264] A first U-shaped groove 5021 is provided on the side of the carrier plate 502, located at the opening. A mounting groove 5013 is provided on one side of the cover 501, its position corresponding to the position of the first U-shaped groove. The cover 501 is provided with a first limiting part and a second limiting part for limiting the installation of the carrier plate 502 and the cover. The first limiting part and the second limiting part are respectively provided on both sides of the mounting groove. To achieve the installation limiting of the carrier plate 502 and the cover 501, the lower surfaces of the first limiting part and the second limiting part are set lower than the upper surface of the carrier plate 502. During installation, the first limiting part and the second limiting part are pressed against the side wall of the carrier plate 502 to achieve the length-direction limiting. The first U-shaped groove 5021 is also called the carrier plate groove.

[0265] The opening of the coherent housing faces the wavelength-tunable optical component. An optical fiber connector is located at the opening, and an optical fiber array, including a local oscillator fiber, a receiving fiber, and a transmitting fiber, is positioned at the connector. One end of the optical fiber connector extends into the opening. One end of the local oscillator fiber connects to the wavelength-tunable optical component to receive the local oscillator light. The receiving fiber connects to a receiver adapter to receive externally transmitted signal light sent to the optical module. The transmitting fiber connects to a transmitter adapter to transmit the modulated signal light.

[0266] The fiber optic fastener 503 is fixedly connected to the fiber optic connector and to the cover, and is used to fix the fiber optic connector to the cover.

[0267] Figure 36 This is a schematic diagram of a carrier board structure exemplified by this application. As shown in the figure, a coherent optical chip 510 is mounted on top of the carrier board 502 for modulation and demodulation of optical signals. An optical port is provided on the side of the coherent optical chip 510, and the end face of the optical port is coupled to the end face of an optical fiber connector. A first electrical chip 520 is disposed on the surface of the carrier board 502, on the side of the coherent optical chip, and electrically connected to the coherent optical chip. A second electrical chip 530 is disposed on the surface of the carrier board 502, on the side of the coherent optical chip, and electrically connected to the coherent optical chip. A third electrical chip 540 is disposed on the surface of the carrier board 502, on the side of the coherent optical chip, and electrically connected to the coherent optical chip.

[0268] In this application example, the first electrical chip 520 is a coherent transmit driver chip, located opposite the optical port of the coherent optical chip, and is used to drive the coherent modulator in the coherent optical chip. The second electrical chip 530 and the third electrical chip 540 are receive amplifier chips, located adjacent to the coherent transmit driver chip and close to the coherent optical chip, and are used to amplify the received electrical signals.

[0269] The carrier board 502 also carries multiple power supply circuits for powering the balanced receiver, power monitor, and transmit attenuator inside the coherent optical chip. The specific electrical components are configured according to the functional pin settings of the coherent optical chip. The carrier board 502 is a high-speed carrier board 502, which is electrically connected to the circuit board through conductive areas on its side or bottom surface.

[0270] Because the optoelectronic chips on the surface of the carrier 502 have a certain height and weight, and are relatively concentrated in a specific location, the center of gravity of the carrier 502 is not near its geometric center of gravity, but rather close to the location of the coherent optical chip. To increase the structural stability of the coherent component 500 and make its geometric center coincide with its center of gravity as much as possible, the center of gravity of the cover 501 is set to be symmetrical about the center of gravity of the carrier 502.

[0271] Figure 37 A schematic diagram of the structure of a cover shell as an example of this application. Figure 1 , Figure 38 A schematic diagram of the structure of a cover shell as an example of this application. Figure 2 . Figure 37 and Figure 38 The diagram shows the structure of the cover 501 at different angles. The cover 501 is rectangular, with a mounting groove 5013 on one side, corresponding to the position of the first U-shaped groove. The cover 501 has a first limiting part 5011 and a second limiting part 5012 for limiting the installation of the carrier plate 502 and the housing. The first limiting part 5011 and the second limiting part 5012 are respectively located on both sides of the mounting groove 5013. To achieve the installation limitation between the carrier plate 502 and the cover 501, the lower surfaces of the first limiting part 5011 and the second limiting part 5012 are lower than the upper surface of the carrier plate 502. During installation, the first limiting part 5011 and the second limiting part 5012 are pressed against the side wall of the carrier plate 502 to achieve length-direction limitation. The cover 501 is provided with a coherent mounting protrusion protruding from the upper surface of the cover 501, which is set along the shape of the mounting groove and is used for connection and positioning of the cover 501 and the extension.

[0272] To achieve a flat surface for the coherent component 500 and facilitate its installation within the optical module, a support plate 50111 is provided around the mounting groove. Its upper surface connects to the lower surface of the extension portion, serving to limit the vertical positioning of the fiber optic fixing component on the cover 501. In this example, the upper surface of the extension portion is flush with the upper surface of the coherent mounting protrusion 5016.

[0273] The sidewall of the coherent mounting protrusion abuts against the sidewall of the extension, thereby limiting the extension in the horizontal direction and further realizing the coupling and limiting of the fiber array and the coherent optical chip.

[0274] To facilitate the positioning of the extension portion of the fiber optic fixing component and the coherent mounting protrusion, the carrier plate 50111 is provided with a mounting limiting portion, including: a first mounting limiting portion 5014 and a second mounting limiting portion 5015. The first mounting limiting portion 5014 and the second mounting limiting portion 5015 protrude from the upper surface of the carrier plate. For the integrity of the surface of the coherent component, the upper surfaces of the first mounting limiting portion 5014 and the second mounting limiting portion 5015 are flush with the upper surface of the coherent mounting protrusion 5016.

[0275] In this application example, the first mounting limiting part 5014 and the second mounting limiting part 5015 can be arranged symmetrically or asymmetrically. For ease of installation and use, the first mounting limiting part 5014 and the second mounting limiting part 5015 are arranged symmetrically. The first mounting limiting part 5014 and the second mounting limiting part 5015 can be semi-circular, triangular, or other geometric shapes.

[0276] Support arms are provided on the lower surface of the cover 501, located around the lower surface of the cover 501, for connecting with the carrier plate.

[0277] The lower surface of the cover 501 has cover protrusions of different heights to accommodate the structure of the optoelectronic devices on the carrier plate 502. The cover 501 has a connecting portion that connects to the upper surface of the carrier plate 502 and protrudes from the lower surface of the cover 501. The lower surface of the cover 501 has a first protruding platform 5018 and a second protruding platform 5017 of different heights. The first protruding platform 5018 protrudes from the lower surface of the cover 501 and corresponds to the positions of the first, second, and third electrical chips. The lower surface of the first protruding platform 5018 is higher than the lower surface of the second protruding platform, and the lower surface of the second protruding platform 5017 is higher than the connecting portion. The first raised platform 5018 includes a first sub-platform 50181 and a second sub-platform 50182. The first sub-platform 50181 is disposed above the first electrical chip 520, and its projection on the carrier plate 502 covers the first electrical chip 520. The second sub-platform 50182 is disposed above the second electrical chip 530 and the third electrical chip 540, and its projection on the carrier plate 502 covers the second electrical chip 530 and the third electrical chip 540. The bottom surface of the cover 501 covers the coherent optical chip.

[0278] The second raised platform 5017 covers other electrical components on the carrier 502. The second raised platform 5017 is located at the edge of the first raised platform 5018, between the first raised platform 5018 and the connecting part. The second raised platform 5017 is also provided with a raised connecting part 5019, located at the corner furthest from the coherent optical chip, and connected to the carrier 502 by conductive silver paste, which can realize the heat on the carrier 502 is dissipated through the raised connecting part and the cover 501.

[0279] In this application example, the first raised platform 5018 and the second raised platform 5017 are positioned diagonally opposite each other on the coherent optical chip. Because the thickness of the first raised platform 5018 and the second raised platform 5017 is greater than the thickness of the bottom surface of the cover 501, the center of gravity of the cover 501 is located close to the second raised platform 5017. After the cover 501 and the carrier plate 502 are closed, the center of gravity of the coherent component 500 is brought as close as possible to the geometric center, ensuring the stability of the coherent component 500.

[0280] Figure 39 This is a schematic diagram illustrating the connection between the fiber optic connector and the coherent component, as shown in the example of this application. Figure 39 As shown, the coherent connection board 550 spans between the coherent optical chip 510 and the fiber optic connector 504, and is used to fix the coherent optical chip and the fiber optic connector. The fiber optic adapter is connected to the corresponding fiber inside the fiber optic connector.

[0281] To prevent light from being reflected at the junction of the fiber optic connector and the coherent optical chip, thus affecting optical power, the central axis of the fiber array is at an angle of 6° to 8° with the central axis of the optical port of the coherent optical chip, thereby reducing light reflection at the junction of the fiber optic connector and the coherent optical chip.

[0282] In this application example, the fiber optic connector 504 is rectangular, with a coherent connection plate 550 disposed on its top, bridging the coherent optical chip and the fiber optic connector. An adhesive is disposed on the lower surface of the coherent connection plate 550 to connect and fix the coherent connection plate 550 to the fiber optic connector and to the coherent optical chip.

[0283] To reduce the deterioration of coupling accuracy between the fiber optic connector and the coherent optical chip due to external force pulling on the optical fiber during transportation or use, this application also includes a pigtail sleeve 5041, which is fitted onto the outside of the fiber optic array. An optical fiber fixing component is disposed outside the optical fiber connector and is fixedly connected to the pigtail sleeve. The upper surface of the pigtail sleeve 5041 is provided with double-sided adhesive material or glue, which connects to the optical fiber fixing component. In this example, the pigtail sleeve is a square tube with a through hole. The optical fiber array passes through one end of the square tube, the optical fiber connector abuts against the end of the square tube, and the connection between the optical fiber array and the pigtail sleeve is filled with glue.

[0284] Figure 40 A schematic diagram of the structure of an optical fiber fastener as an example of this application. Figure 1 . Figure 41 Schematic diagram of fiber optic fastener Figure 2 .like Figure 39 and Figure 40 The fiber optic fastener is shown from different angles. The fastener has the same thickness and is die-cast from a single sheet metal. It includes a base plate 5031 and first fiber side plates 5032 and second fiber side plates 5033 disposed on both sides of the base plate. The base plate 5031 includes a first base plate 50311 and a second base plate 50312 with different heights. The upper surface of the second base plate 50312 is higher than the upper surface of the first base plate. A pigtail 5041 is disposed within the space formed by the first base plate, the first fiber side plate, and the second fiber side plate. A coherent connector 550 is disposed on the upper surface of the coherent optical chip and the fiber connector, such that the upper surface of the coherent connector 550 is higher than the upper surface of the fiber connector. The upper surface of the coherent connector 550 is connected to the second base plate 50312. The different heights of the first and second base plates 50312 are used to accommodate the height of the coherent connector 550.

[0285] The upper surface of the pigtail sleeve is connected to the lower surface of the first fixed base plate, and its side surface is connected to the first optical fiber side plate and the second optical fiber side plate.

[0286] An extension portion 50313 is provided on one side of the second fixed base plate 50312, the width of which is greater than the width of the fixed base plate. A first extension limiting groove 503131 and a second extension limiting groove 503132 are provided on the side of the extension portion 50313 to limit the corresponding structure on the upper surface of the cover shell 501, facilitating the connection and fixation between the optical fiber fixing component and the cover shell 501. To further facilitate the connection and fixation between the optical fiber fixing component and the cover shell 501, multiple adhesive dispensing grooves 5034 are also provided on the side of the extension portion 50313. After the extension portion 50313 and the cover shell 501 are positioned, liquid adhesive is applied to the adhesive dispensing grooves to achieve the connection between the extension portion 50313 and the cover shell 501.

[0287] In the example of this application, the dispensing groove has the same shape as the first extension limiting groove and the second extension limiting groove.

[0288] The first extended limiting groove 503131 is matched and connected with the first mounting limiting part 5014, and the second extended limiting groove 503132 is matched and connected with the second mounting limiting part 5015.

[0289] In the installation process of this application example, firstly, the coherent optical chip is installed and connected to the carrier plate 502, the pigtail sleeve 5041 is connected to the fiber array, and the optical port of the coherent optical chip protrudes from the first U-shaped groove of the carrier plate 502. Then, the coherent connecting plate 550 is straddled above the fiber connector and the coherent optical chip to achieve coupling connection between the fiber connector and the coherent optical chip. Then, the cover 501 is connected to the edge of the carrier plate 502. During installation, the first limiting part and the second limiting part abut against the side of the carrier plate 502, the connecting part of the cover 501 is connected to the carrier plate 502, and the protruding connecting part is connected to the edge of the carrier plate 502. The first fixing base plate of the fiber fixing component is connected to the pigtail sleeve 5041, the second fixing base plate 50312 is connected to the coherent connecting plate 550, and the extension part 50313 is connected to the carrier plate 502 on the upper surface of the cover 501. Through the above connections, the fiber optic connector is fixedly connected to the fiber optic fastener via the pigtail sleeve 5041 and the coherent connection plate 550. When the fiber is subjected to external force, the force is dispersed and transferred through the connection, reducing the stress on the fiber optic connector, improving the connection stability between the fiber optic connector and the coherent optical chip, and avoiding impact on optical coupling accuracy.

[0290] In this application example, the fiber optic array and the coherent optical chip are connected via a glass bridge using flexible adhesive, which enhances maintainability and facilitates manufacturing. The upper shell consists of two parts: the fiber optic fixing component is die-cast, and the cover 501 is made of sheet metal. The overall thickness of the product is only 2.42mm, meeting the SFP-DD optical module packaging requirements. A pigtail sleeve 5041 is designed on the outside of the fiber optic array. During use, it is fixed to the fiber optic fixing component with adhesive, and the fiber optic fixing component is then fixed to the cover 501 with adhesive to protect the optical end faces of the fiber optic array and the coherent optical chip from external forces. Multiple grooves are designed on both sides of the bonding area between the metal cover 501 and the fiber optic fixing component for adhesive fixation, improving connection stability.

[0291] To improve the communication efficiency of optical signals, in the coherent component 500 of this application, the coherent modulator is a dual-polarization coherent modulator. The emitted signal light is a coupled beam of signal light with different polarization directions, and the received signal light contains two sets of signal light with different polarization directions, thereby realizing single-channel multi-signal transmission.

[0292] Figure 42 This is a schematic diagram of a coherent optical chip as an example of the present application. As shown in the figure, the layout scheme of the high-speed coherent optical chip proposed in this application adopts silicon photonics integration technology, integrating dual-polarization coherent transmission and reception functions on a single chip. The fiber coupling port includes three fiber coupling ports, from top to bottom: receiving fiber coupling port 5111, local oscillator fiber coupling port 5112, and transmitting fiber coupling port 5113. Among them, the local oscillator fiber coupling port 5112 is connected to an external local oscillator light source through polarization-maintaining fiber. After the light from the external local oscillator light enters the chip, it is split into two beams. One beam is used as the transmission light and enters the dual-polarization coherent modulator. After electro-optic signal loading and polarization processing by the polarization rotation beam combiner 5141, it is output from the transmitting fiber coupling port 5113. The other beam is used as the local oscillator light and is split again, entering the first polarization balance detector and the second polarization balance detector respectively. It is optically mixed with the light from the receiving fiber coupling port 5111 after being processed by the polarization rotation beam splitter, thereby realizing signal demodulation processing.

[0293] To facilitate active coupling between the fiber optic coupling port and the fiber optic array, a transmit coupling power monitor and a receive coupling power monitor are integrated after the polarization rotating beam combiner 5141 and the polarization rotating beam splitter, respectively, for active coupling of the fiber optic array. At the receiving end, a small portion of the two beams after passing through the polarization rotating beam splitter is split into the same receive coupling power monitor for real-time active coupling monitoring. At the transmitting end, a small portion of the two beams after passing through the polarization rotating beam combiner 5141 is split into the same transmit coupling power monitor for real-time active coupling monitoring. Simultaneously, to reduce the impact of different polarization states on the coupling power monitor and improve the accuracy of active coupling monitoring, a polarization beam splitter can be integrated before the coupling power monitor to improve the polarization purity of the monitored light, thereby enhancing the accuracy of active coupling monitoring.

[0294] The coherent optical chip has fiber optic coupling ports at its optical port, which are coupled to fiber optic connectors. These fiber optic coupling ports include: a receiving fiber optic coupling port 5111, a local oscillator fiber optic coupling port 5112, and a transmitting fiber optic coupling port 5113. A polarization-balanced receiver, connected to the receiving fiber optic coupling port 5111 and the local oscillator fiber optic coupling port 5112, is used to convert the received signal light into a received electrical signal. A dual-polarization coherent modulator, connected to the transmitting fiber optic coupling port 5111 and the local oscillator fiber optic coupling port 5112, is used to convert the transmitted electrical signal emitted by the DSP chip into an optical signal, which is then loaded into the local oscillator light to form the transmitted signal light.

[0295] The receiving fiber optic coupling port 5111 connects to the receiving fiber optic adapter and is used to receive the signal light from the other end, referred to as the received signal light for simplicity. The received signal light is a coupled beam of a first received signal light and a second received signal light with different polarization directions. The polarization rotating beam splitter 5121 is connected to the fiber optic coupling port via an optical waveguide and is used to split the received signal light into a first received signal light and a second received signal light according to their polarization directions. The local oscillator fiber optic coupling port 5112 receives the local oscillator light emitted by the wavelength-tunable optical component and splits it into a first sub-local oscillator light and a second sub-local oscillator light via an optical waveguide. The first sub-local oscillator light is further divided into a first receiving local oscillator light and a second receiving local oscillator light.

[0296] The first received local oscillator light and the first received signal light are coupled into the first polarization balance receiver 5123. The first polarization balance receiver 5123 performs frequency mixing and balance detection on the first received local oscillator light and the first received signal light, converting the first received signal light into a first received electrical signal. After being amplified by the first received amplifier chip, the signal enters the DSP chip, where it is converted from the first received electrical signal into a first received digital signal.

[0297] The second receiving local oscillator light and the second receiving signal light are coupled into the second polarization balance receiver 5124. The second polarization balance receiver 5124 performs frequency mixing and balance detection on the second receiving local oscillator light and the second receiving signal light, converting the second receiving signal light into a second receiving electrical signal. After being amplified by the second receiving amplifier chip, the signal enters the DSP chip, where it is converted from the second receiving electrical signal into a second receiving digital signal.

[0298] To facilitate monitoring of the coupling accuracy between the receiving optical fiber and the receiving optical fiber coupling port 5111, test beams, including a first test beam, a second test beam, and a third test beam, are connected outside the optical fiber coupling port during coupling installation. During this process, all test beams enter the coherent optical chip from outside the chip. The coherent optical chip also includes a receiving coupling power monitor 5122, which receives a portion of the light from the two output optical paths of the polarization rotation beam splitter 5121 and monitors the coupling power. The MCU is electrically connected to the receiving coupling power monitor 5122, receives its electrical signal, calculates the optical power of the optical fiber coupling port based on the signal, and compares the optical power of the optical fiber coupling port with the optical power of the first test beam to adjust the coupling accuracy between the receiving optical fiber coupler and the receiving optical fiber. Specifically, the MCU sets a first test beam power threshold range. If the optical power of the optical fiber coupling port is not within this threshold range, the coupling accuracy between the receiving optical fiber and the receiving optical fiber coupling port 5111 needs to be adjusted.

[0299] To simplify the waveguide path within the coherent optical chip, the local oscillator fiber coupling port 5112 is located between the receiving fiber coupling port 5111 and the transmitting fiber coupling port 511.

[0300] In this application, the node positions shown in the figure are used to split a portion of the light. For example, at node 5125, the optical waveguide between node 5125 and the first output port of the polarization rotating beamsplitter 5121 is called the first waveguide; the optical waveguide between the receiving coupled power monitor 5122 and node 5125 is called the second waveguide; and the optical waveguide between the first polarization balanced receiver 5123 and node 5125 is called the third waveguide. To split the light within the first output port of the polarization rotating beamsplitter 5121, a directional coupler is provided at the node, and the receiving coupled power monitor 5122 is located between node 5125 and the first polarization balanced receiver 5123. Similarly, the receiving coupled power monitor 5122 is located between node 5126 and the second polarization balanced receiver 5124.

[0301] The dual-polarization coherent modulator 516 is connected to the transmitting fiber coupling port 511 and the local oscillator fiber coupling port 5112 via an optical waveguide. It is used to convert the transmitted electrical signal emitted by the DSP chip into an optical signal and load it into the local oscillator light to form the transmitted signal light.

[0302] To facilitate active coupling between the fiber optic coupling port and the fiber optic array, a transmit coupling power monitor is installed between the two input terminals of the polarization rotating combiner 5141.

[0303] To facilitate monitoring of the coupling accuracy between the transmitting fiber and the transmitting fiber coupling port 511, test beams, including a first test beam, a second test beam, and a third test beam, are connected externally to the fiber coupling port during coupling installation. During this process, all test beams enter the coherent optical chip from outside the chip. The first test beam enters through the receiving fiber coupling port 5111, the second test beam enters through the local oscillator fiber coupling port 5112, and the third test beam is connected through the transmitting fiber coupling port 511. The coherent optical chip also includes a transmitting coupling power monitor 5143. Partial light from the two inputs of the transmitting polarization rotation combiner 5141 is used for coupling power monitoring. The MCU is electrically connected to the transmitting coupling power monitor 5143, receives its electrical signals, calculates the optical power of the transmitting fiber coupling port 511 based on these signals, and compares the optical power of the fiber coupling port with the optical power of the third test beam to adjust the coupling accuracy between the transmitting fiber receiving coupler and the transmitting fiber. Specifically, a second test optical power threshold range is set within the MCU. If the optical power of the transmitting fiber coupling port 511 is not within the second test optical power threshold range, the coupling accuracy between the transmitting fiber and the transmitting fiber coupling port 511 needs to be adjusted.

[0304] Figure 43 This application provides a schematic diagram of the structure of a coherent optical chip. Figure 2 To reduce the impact of different polarization states on the coupled power monitor and improve the accuracy of active coupling monitoring, a first polarization beamsplitter 5128 is installed between the receiving coupled power monitor 5122 and the first output port of the polarization rotating beamsplitter 5121 to prevent light not belonging to the first polarization state from entering the receiving coupled power monitor 5122. Similarly, a second polarization beamsplitter 5127 is installed between the receiving coupled power monitor 5122 and the second output port of the polarization rotating beamsplitter 5121 to prevent light not belonging to the second polarization state from entering the receiving coupled power monitor 5122.

[0305] To facilitate monitoring of the coupling accuracy between the receiving fiber and the receiving fiber coupling port 5111, test beams, including a first test beam, a second test beam, and a third test beam, are connected outside the fiber coupling port during coupling installation. During this process, all test beams enter the coherent optical chip from outside the chip. The first test beam enters the coherent optical chip through the receiving fiber coupling port 5111, receiving portions of the light from the two output paths on the right side of the polarization rotating beam splitter 5121, forming a first sub-test beam and a second sub-test beam with different polarization directions. For example, the first sub-test beam may be X-polarized, and the second sub-test beam may be Y-polarized. The receiving polarization rotating beam splitter 5121 guides the X-polarized light through the first path (above), then partially enters the first polarization balance detector and partially enters the first polarization beam splitter 5128. The first polarization beam splitter 5128 allows X-polarized light in the beam transmitted to it to pass through, while filtering out light in other directions. The receiving polarization rotating beam splitter 5121 guides the Y-polarized light through a second path (below), then part of it enters the second polarization balance detector, and part enters the second polarization beam splitter. The second polarization beam splitter allows the Y-polarized light in the beam guided to it to pass through, while filtering out light from other directions. The receiving coupling power monitor 5122 monitors the coupling power. The MCU is electrically connected to the receiving coupling power monitor 5122, receives its electrical signal, calculates the optical power at the fiber optic coupling port based on the signal, and compares it with the optical power of the first test light to adjust the coupling accuracy between the receiving fiber coupler and the receiving fiber. Specifically, the MCU sets a first test light power threshold range. If the optical power at the fiber coupler port is not within this threshold range, the coupling accuracy between the receiving fiber and the receiving fiber coupling port 5111 needs to be adjusted.

[0306] Similarly, to reduce the impact of different polarization states on the coupling power monitor and improve the accuracy of active coupling monitoring, a first transmitting polarization beamsplitter 5161 is provided between the first input end of the transmitting coupling power monitor 5143 and the polarization rotating beam combiner 5141 to prevent light that does not belong to the first polarization state from entering the receiving coupling power monitor 5122. A second receiving polarization beamsplitter 5162 is provided between the second input end of the transmitting coupling power monitor 5143 and the polarization rotating beam combiner 5141 to prevent light that does not belong to the second polarization state from entering the receiving coupling power monitor 5122.

[0307] Continue to combine Figure 42 , Figure 43As shown in the example of this application, during operation, the local oscillator fiber coupling port 5112 receives the local oscillator light emitted by the wavelength-tunable optical component. The local oscillator light is then divided into a first sub-local oscillator light and a second sub-local oscillator light via an optical waveguide. The first sub-local oscillator light is further divided into a first receiving local oscillator light and a second receiving local oscillator light. The second receiving local oscillator light is further divided into a first transmitting light and a second transmitting light, which respectively enter the two input terminals of the dual-polarization coherent modulator 516.

[0308] For example, a dual-polarization coherent modulator 516 has a first optical input terminal to receive a first emitted light and a second optical input terminal to receive a second emitted light, modulates the first and second emitted light signals respectively, and outputs a first emitted signal light and a second emitted signal light. A polarization rotation beam combiner 5141 is connected to the first and second output terminals of the dual-polarization coherent modulator 516, rotates the first and second emitted signal lights into beams with mutually perpendicular polarization directions, and couples them out as emitted signal light.

[0309] The first and second emitted beams have the same polarization direction but different amplitudes and phases to carry different signals. A polarization rotation combiner 5141 deflects one of the first or second emitted beams, forming a near 90° angle with the other beam, and then combines them into a single emitted signal beam. The polarization rotation combiner 5141 includes a first input terminal, a second input terminal, and an output terminal. The first input terminal is connected to the first output terminal of a dual-polarization coherent modulator 516, the second input terminal is connected to the second output terminal of the dual-polarization coherent modulator 516, and the output terminal is connected to a transmitting fiber coupling port 511. The emitted signal beam enters the transmitting fiber through the transmitting fiber coupling port 511.

[0310] The coherent optical chip also includes a first transmit light attenuator 5144, positioned between the polarization rotation combiner 5141 and the first polarization coherent modulator 5142, to control the attenuation of the first transmitted signal light. To control the first transmit light attenuator 5144, a first light attenuator power monitor 5145 is installed at its second output terminal. The first output terminal of the first transmit light attenuator 5144 is connected to the first input terminal of the transmit polarization rotation combiner 5141. The MCU is electrically connected to the first light attenuator power monitor 5145 and controls the output voltage of the first transmit light attenuator 5144 based on the data collected by the first light attenuator power monitor 5145.

[0311] To achieve more precise monitoring of the transmitted optical power, a first transmitted power monitor 5147 is installed between the second output port of the first transmitted optical attenuator 5144 and the polarization rotation beam combiner 5141 to monitor the optical power of the attenuated first transmitted signal light. The MCU is electrically connected to the first transmitted power monitor 5147, and the host computer can read the optical power of the first transmitted signal light stored in the MCU.

[0312] Similarly, the coherent optical chip also includes a second transmit attenuator 5154, positioned between the polarization rotation combiner 5141 and the second polarization coherent modulator 5152, to control the attenuation of the second transmit signal light. To control the second transmit attenuator 5154, a second attenuator power monitor 5155 is installed at its second output terminal. The first output terminal of the second transmit attenuator 5154 is connected to the second input terminal of the transmit polarization rotation combiner 5141. The MCU is electrically connected to the second attenuator power monitor 5155 and controls the output voltage of the second transmit attenuator 5154 based on the data collected by the second attenuator power monitor 5155.

[0313] To achieve more precise monitoring of the transmitted light power, a second transmitted light power monitor 5157 is installed between the second transmitted light attenuator 5154 and the polarization rotation beam combiner 5141 to monitor the optical power of the attenuated second transmitted signal light. The MCU is electrically connected to the second transmitted light power monitor, and the host computer can read the optical power of the second transmitted signal light stored in the MCU.

[0314] A first modulator power monitor 5146 is disposed between the first transmit light attenuator 5144 and the first polarization coherent modulator 5142 to monitor the phase of the first transmit signal light. The first modulator power monitor 5146 is connected to the MCU. The MCU receives the monitoring data from the first modulator power monitor 5146 and performs phase modulation on the first transmit signal light.

[0315] Figure 44 This application provides an example of a coherent optical chip surface ball-planting layout, such as... Figure 44 As shown, the conductive area 5171 of the dual polarization coherent modulator and the conductive area 5172 of the fiber coupling port are respectively distributed on the upper and lower sides of the surface of the coherent optical chip. The conductive area 5173 of the first polarization balanced receiver and the conductive area 5174 of the second polarization balanced receiver are distributed on the left side of the coherent optical chip. Other DC signal balls are distributed around the coherent optical chip to facilitate signal interconnection with external electrical chips. The middle part of the coherent optical chip is uniformly filled with balls to improve the reliability and stability of the 2.5D flip-chip package. These filling balls have no actual function and can be grounded or disconnected.

[0316] To facilitate the coupling and encapsulation of the fiber array and fiber coupling port, the spacing between the surrounding spheres and the fiber coupling port must be greater than 0.5 mm. The fiber coupling port includes five coupling ports from left to right: a receive coupling port, a local oscillator coupling port, and a transmit coupling port. The two ports on the right are loopback test ports for coupling testing. To improve coupling efficiency with the FA and the reworkability of the coupling, this fiber coupler uses silicon nitride material and a direct dicing and disassembly method to ensure the perpendicularity of the fiber coupling port end face.

[0317] In some examples of this application, such as Figure 45 and Figure 46 As shown, the first local oscillator beam splitter 5131 has its input end connected to the local oscillator fiber coupling port, its first output end connected to the first polarization coherent modulator 5412, and its second output end connected to the input end of the second local oscillator beam splitter 5132; the first output end of the second local oscillator beam splitter 5132 is connected to the second polarization coherent modulator 5152, and its second output end is connected to the input end of the third local oscillator beam splitter 5133; the first output end of the third local oscillator beam splitter 5133 is connected to the first polarization balanced receiver, and its second output end is connected to the second polarization balanced receiver. Alternatively, the first local oscillator beam splitter can be configured such that its input end is connected to the local oscillator fiber coupling port, its first output end is connected to the input end of the second local oscillator beam splitter, and its second output end is connected to the input end of the third local oscillator beam splitter; the first output end of the third local oscillator beam splitter is connected to the first polarization coherent modulator, and its second output end is connected to the first polarization coherent modulator; the first output end of the second local oscillator beam splitter is connected to the first polarization balanced receiver, and its second output end is connected to the second polarization balanced receiver.

[0318] In the above coherent optical chip, in order to improve the effective transmitted light power and ensure that the transmitted light output from the two polarization coherent modulators in different directions is basically consistent, this application employs power dividers at the first local oscillator beam splitter 5131, the second local oscillator beam splitter 5132, and the third local oscillator beam splitter 51333 to split the light into two equal beams. Figure 44 As shown in the diagram, after the light from the external local oscillator enters the chip, it is split into two beams with 50% and 50% power respectively at the first local oscillator beam splitter 5131. One of the beams is used as the emission light and is split into two equal beams at the fourth local oscillator beam splitter 5134. These beams then enter the first polarization coherent modulator and the second polarization coherent modulator, respectively. After electro-optic signal loading and polarization processing by the polarization rotation beam combiner 5141, the beams are output from the emission fiber coupling port 5113. The other beam, as the local oscillator light, is split again by the third local oscillator beam splitter 5133 and enters the first polarization balance detector 5123 and the second polarization balance detector 5124, respectively. It is then optically mixed with the light that has been processed by the polarization rotation beam splitter 5121 and comes from the receiving fiber coupling port 5111.

[0319] The light is split into two beams with 50% and 50% power respectively at the first local oscillator beam splitter 5131. One of the beams is used as the emitted light and is split into two beams at the fourth local oscillator beam splitter 5134. The beams then enter the first polarization coherent modulator 5142 and the second polarization coherent modulator 5152 respectively. Therefore, the light entering the first polarization coherent modulator and the second polarization coherent modulator has the same power.

[0320] To avoid a significant difference in optical power output between the first and second polarization coherent modulators due to varying light losses during modulation, a first transmit optical attenuator 5144 is provided, positioned between the polarization rotating beam combiner 5141 and the first polarization coherent modulator 5142, to control the attenuation of the first transmitted signal light. To control the first transmit optical attenuator 5144, a first optical attenuator power monitor 5145 is installed at its second output terminal. The first output terminal of the first transmit optical attenuator 5144 is connected to the first input terminal of the transmit polarization rotating beam combiner 5141. The MCU is electrically connected to the first optical attenuator power monitor 5145 and controls the output voltage of the first transmit optical attenuator 5144 based on the data collected by the first optical attenuator power monitor 5145.

[0321] A first transmit power monitor 5147 is installed between the second output port of the first transmit attenuator 5144 and the polarization rotation combiner 5141 to monitor the optical power of the attenuated first transmit signal light. The MCU is electrically connected to the first transmit power monitor 5147, and the host computer can read the optical power of the first transmit signal light stored in the MCU.

[0322] The coherent optical chip also includes a second transmit attenuator 5154, positioned between the polarization rotation combiner 5141 and the second polarization coherent modulator 5152, to control the attenuation of the second transmitted signal light. To control the second transmit attenuator 5154, a second attenuator power monitor 5155 is installed at its second output terminal. The first output terminal of the second transmit attenuator 5154 is connected to the second input terminal of the transmit polarization rotation combiner 5141. The MCU is electrically connected to the second attenuator power monitor 5155 and controls the output voltage of the second transmit attenuator 5154 based on the data collected by the second attenuator power monitor 5155.

[0323] A second transmit power monitor 5157 is installed between the second transmit light attenuator 5154 and the polarization rotation beam combiner 5141 to monitor the optical power of the attenuated second transmit signal light. The MCU is electrically connected to the second transmit power monitor, and the host computer can read the optical power of the second transmit signal light stored in the MCU.

[0324] In this application, in order to improve the effective transmitted light power, the difference ratio of the transmitted light power output by two polarization coherent modulators in different directions should not be greater than 15%, that is, the difference between the first polarization coherent modulator and the second polarization coherent modulator should not be greater than 15% of the ratio of the first polarization coherent modulator or the second polarization coherent modulator.

[0325] The MCU can monitor the optical power of the first transmitted signal light and the optical power of the second transmitted signal light to control the attenuation value of the first or second optical attenuator, so that the difference ratio between the first polarization coherent modulator and the second polarization coherent modulator is within a preset difference ratio range.

[0326] This application also provides another embodiment, wherein the first local oscillator beam splitter 5131 and the fourth local oscillator beam splitter 5134 are adjustable beam splitters, and the magnitude of the emitted optical power can be controlled by controlling the beam splitting ratio at the output ends of the first and third local oscillator beam splitters. To improve the effective emitted optical power and ensure that the emitted optical power output by the two polarization coherent modulators in different directions remains essentially consistent, the difference between the output optical power of the first polarization coherent modulator and the output optical power of the second polarization coherent modulator is controlled to be no greater than 15%.

[0327] In the above coherent optical chips, the insertion loss of the fiber coupling port and the polarization rotation combiner 5141 will be different for light with different polarization states. In particular, the optical insertion loss of the fiber coupling port will also be affected by the chip manufacturing process. In practical applications, it is required that the power of the two different polarization light emitted from the transmitter be balanced. Therefore, this application provides another schematic diagram of a coherent optical chip structure. The adjustable optical attenuator integrated on the coherent optical chip is used to attenuate the power of the higher polarization state light, thereby reducing the effective optical emission power and affecting the chip yield. Figure 47 A schematic diagram of a coherent optical chip structure provided in this application Figure 5 ,like Figure 47 As shown, the fiber optic coupler includes three fiber optic coupling ports, from top to bottom: a receiving fiber optic coupling port 5111, a local oscillator fiber optic coupling port 5112, and a transmitting fiber optic coupling port 511. The local oscillator fiber optic coupling port 5112 is connected to an external local oscillator light source via a polarization-maintaining fiber. The first local oscillator splitter 5131 is an unbalanced splitter; its input is connected to the local oscillator fiber optic coupling port 5112, its first output is connected to a first polarization coherent modulator, and its second output is connected to the input of a second local oscillator splitter. The first output of the second local oscillator splitter 5132 is connected to a second polarization coherent modulator, and its second output is connected to the input of a third local oscillator splitter. The first output of the third local oscillator splitter 5133 is connected to a first polarization balanced receiver 5123, and its second output is connected to a second polarization balanced receiver 5124.

[0328] After the light from the external local oscillator enters the coherent optical chip, it is split into two beams by an unbalanced beam splitter. One beam is emitted and enters the first polarization coherent modulator 5142. After electro-optic signal loading and polarization processing by the polarization rotation combiner 5141, it is output from the transmitting fiber coupling port 5113. The other beam is emitted and then split into two beams by the second local oscillator beam splitter 5132. One beam is emitted and enters the second polarization coherent modulator 5152. After electro-optic signal loading and polarization processing by the polarization rotation combiner 5141, it is output from the transmitting fiber coupling port 5111 and the transmitting fiber coupling port 5113. The other output port of the second local oscillator beam splitter 5132 is connected to the input of the third local oscillator beam splitter 5133. The beam is split into two beams by the third local oscillator beam splitter and enters the first polarization balance detector 5123 and the second polarization balance detector 5124 respectively. They are optically mixed with the light that has been processed by the polarization rotation beam splitter 5121 and comes from the receiving fiber coupling port 5111, thereby realizing signal demodulation.

[0329] After the light from the external local oscillator enters the coherent chip, the specific beam splitting process is as follows: First, a certain proportion of the light is split by an unbalanced beam splitter and enters the first polarization coherent modulator (e.g., 40%). This splitting ratio can be designed differently depending on the power difference between the first and second polarized emitted light. The remaining 60% of the light enters the second local oscillator beam splitter 5132. After being evenly split into two parts by the second local oscillator beam splitter 5132, one beam enters the second polarization coherent modulator 5152, and the other beam enters the third local oscillator beam splitter 5133.

[0330] In practical chip design, the splitting ratio of the unbalanced beam splitter can be designed differently based on the difference in output optical power between the first and second polarization coherent modulators. This ensures that the power of the first and second polarized beams emitted from the transmitting fiber coupling port 5113 is balanced, thereby improving the effective optical transmission power. This unbalanced beam splitter typically employs an asymmetric waveguide structure.

[0331] The output end of the polarization rotating beam combiner 5141 is connected to the transmitting fiber coupling port 511, the first input end is connected to the first polarization coherent modulator 5142, and the second input end is connected to the second polarization coherent modulator 5152.

[0332] In the examples of this application, the unbalanced beam splitter can be designed using an asymmetric waveguide structure, or it can utilize devices based on Mach-Zehnder interferometry structures, such as... Figure 46As shown, a heater is integrated above the Mach-Zehnder interferometer structure. Adjusting the heater changes the splitting ratio of the unbalanced beam splitter. In practical applications, the splitting ratio of the unbalanced beam splitter can be adjusted in real time based on the output optical power of the second polarization coherent modulator, ensuring that the power of the two polarized beams emitted from the emission coupling port is balanced, thereby increasing the effective optical emission power and improving chip yield.

[0333] Figure 48 This is a schematic diagram of an unbalanced beam splitter provided in an embodiment of this application. Figure 48 As shown, the unbalanced beam splitter includes: a first sub-splitter, a modulation arm, an interferometer arm, and a second sub-splitter. The input of the first sub-splitter is connected to the local oscillator fiber coupling port, splitting the local oscillator light into two beams. The first output of the first sub-splitter is connected to the modulation arm, and the second output is connected to the interferometer arm. The first input of the third sub-splitter is connected to the output of the modulation arm, the second input is connected to the output of the interferometer arm, the first output is connected to the input of the second local oscillator beam splitter 5132, and the second output is connected to the first polarization coherent modulator 5142. The MCU is electrically connected to the first and second modulation arms and controls the temperature of the modulation arms through its output voltage to control the refractive index of the modulation arms, thereby achieving beam splitting at the two outputs of the unbalanced beam splitter.

[0334] Figure 49 A schematic diagram of a coherent optical chip structure provided in this application Figure 6 In this application example, the coherent optical chip further includes a first transmit light attenuator 5144, disposed between the polarization rotation beam combiner 5141 and the first polarization coherent modulator, for attenuation control of the first transmit signal light. To control the first transmit light attenuator 5144, a first light attenuator power monitor 5145 is provided at its first output terminal, and the first output terminal of the first transmit light attenuator 5144 is connected to the first input terminal of the transmit polarization rotation beam combiner 5141. The MCU is electrically connected to the first light attenuator power monitor 5145 and controls the output voltage of the first transmit light attenuator 5144 based on the data collected by the first light attenuator power monitor 5145.

[0335] Figure 50 A schematic diagram of a coherent optical chip structure as exemplified in this application. Figure 7 ,like Figure 50As shown, in order to monitor the effective light emission power and calculate the splitting ratio of the unbalanced beam splitter, a first emission power monitor 5147 is set between the first emission light attenuator 5144 and the polarization rotation beam combiner 5141 in the coherent optical chip to monitor the optical power of the attenuated first emission signal light. The MCU is electrically connected to the first emission power monitor 5147, and the host computer can read the optical power of the first emission signal light stored in the MCU.

[0336] Similarly, to achieve more precise monitoring of the transmitted light power, a second transmitted light power monitor is set between the second transmitted light attenuator and the polarization rotation beam combiner 5141 to monitor the optical power of the attenuated second transmitted signal light. The MCU is electrically connected to the second transmitted light power monitor, and the host computer can read the optical power of the second transmitted signal light stored in the MCU.

[0337] The splitting ratio of the unbalanced beam splitter is adjusted based on the data collected by the second transmit power monitor 5157 and the first transmit power monitor 5147.

[0338] Unequalized beam splitters can also utilize devices based on Mach-Zehnder interferometer structures. A heater is integrated above the Mach-Zehnder interferometer structure, and the splitting ratio of the unequalized beam splitter can be changed by adjusting the heater. In practical applications, the splitting ratio of the unequalized beam splitter can be adjusted in real time based on the output optical power of the second polarization coherent modulator, ensuring that the power of the two polarized beams emitted from the transmitting fiber coupling port 511 and transmitting fiber coupling port 5113 is balanced, thereby improving the effective optical emission power and increasing chip yield.

[0339] In the coherent optical module of this application example, the input terminal of the unbalanced beam splitter is connected to the local oscillator fiber coupling port 5112, the first output terminal is connected to the first polarization coherent modulator, and the second output terminal is connected to the input terminal of the second local oscillator beam splitter. The first output terminal of the second local oscillator beam splitter is connected to the second polarization coherent modulator, and the second output terminal is connected to the input terminal of the third local oscillator beam splitter. The first output terminal of the third local oscillator beam splitter is connected to the first polarization balanced receiver 5123, and the second output terminal is connected to the second polarization balanced receiver 5124.

[0340] Furthermore, to achieve power balance between the two different polarizations, the second local oscillator beam splitter, a 5132-bit adjustable beam splitter, can adjust its beam splitting based on the difference in output power between the first and second polarization coherent modulators. When the output power of the first polarization coherent modulator is greater than that of the second polarization coherent modulator, the output ratio at the second output end of the adjustable beam splitter is increased, thereby increasing the power of the second emitted light entering the second polarization coherent modulator and reducing the difference in output power between the first and second polarization coherent modulators.

[0341] When the output optical power of the first polarization coherent modulator is less than the output optical power of the second polarization coherent modulator, the output ratio of the second output terminal of the adjustable beam splitter decreases. This reduces the optical power of the second emitted light entering the second polarization coherent modulator, thus decreasing the difference between the output optical power of the first and second polarization coherent modulators.

[0342] It should be noted that, in this specification, the terms "comprising," "including," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a circuit structure, article, or device. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the circuit structure, article, or device that includes said element.

[0343] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the content of the claims.

[0344] The embodiments described above do not constitute a limitation on the scope of protection of this application.

[0345] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. An optical module, characterized in that, include: A coherent optical chip, coupled to an optical fiber connector, includes: The receiving fiber optic coupling port receives the received signal light. The local oscillator fiber coupling port receives local oscillator light; A polarization rotating beam splitter is located on one side of the receiving fiber coupling port and is used to split the received signal light into a first received signal light and a second received signal light according to different deflection angles. The first local oscillator beam splitter has its input end connected to the local oscillator fiber coupling port, its first output end connected to the first polarization coherent modulator, and its second output end connected to the input end of the second local oscillator beam splitter. The first output terminal of the second local oscillator beam splitter is connected to the second polarization coherent modulator, and the second output terminal is connected to the input terminal of the third local oscillator beam splitter. The first output terminal of the third local oscillator beam splitter is connected to the first polarization balanced receiver, and the second output terminal is connected to the second polarization balanced receiver. The first local oscillator beam splitter is an unbalanced beam splitter, and the first polarization balanced receiver is connected to the first output port of the polarization rotating beam splitter and the first output port of the third local oscillator beam splitter. The second polarization balance receiver is connected to the second output port of the polarization rotating beam splitter and the second output port of the third local oscillator beam splitter. A polarization rotating beam combiner is disposed at the output port of the first polarization coherent modulator. A first emitted light attenuator is disposed between the polarization rotating beam combiner and the first polarization coherent modulator; The second emitted light attenuator is disposed between the polarization rotating beam combiner and the second polarization coherent modulator; A first transmit power monitor is installed at the output port of the first transmit optical attenuator to monitor the transmit optical power of the first polarization coherent modulator. The second transmit power monitor is located at the output port of the second transmit optical attenuator and is used to monitor the transmit optical power of the second polarization coherent modulator. The MCU is connected to the first local oscillator beam splitter, the first transmit power monitor, and the second transmit power monitor to control the beam splitting ratio of the first local oscillator beam splitter so that the difference in optical power output between the first polarization coherent modulator and the second polarization coherent modulator does not exceed 15%. The MCU is connected to the first and second optical attenuators to control their attenuation voltages.

2. The optical module according to claim 1, characterized in that, The first local oscillator beam splitter is a Mach-Zehnder interferometer.

3. The optical module according to claim 2, characterized in that, The coherent optical chip also includes: The first polarization coherent modulator receives the local oscillator light output from the first output terminal of the unbalanced beam splitter and modulates it to form the first transmitted signal light. The second polarization coherent modulator receives the local oscillator light output from the first output terminal of the second local oscillator beam splitter and modulates it to form the second transmitted signal light. The polarization rotating beam combiner has a first input port connected to the output of a first polarization coherent modulator, a second input port connected to the output of a second polarization coherent modulator, and a beam combining port connected to the coupling port of the transmitting fiber. It is used to deflect the polarization direction of the first transmitted signal light and combine it with the second transmitted signal light to form a transmitted signal light.

4. The optical module according to claim 3, characterized in that, The local oscillator fiber coupling port is located between the transmitting fiber coupling port and the receiving fiber coupling port.

5. The optical module according to claim 1, characterized in that, Also includes: A carrier board on which the coherent optical chip is disposed; A transmitter driver chip is mounted on the carrier board and located on the opposite side of the local oscillator fiber; The first receiving amplification chip is located on the carrier board and is electrically connected to the first polarization balanced receiver. The second receiving amplification chip is located on the carrier board and is electrically connected to the first polarization-balanced receiver.

6. The optical module according to claim 5, characterized in that, Also includes: A circuit board, wherein the carrier board is disposed on the circuit board; The circuit board is also equipped with a DSP chip, which is electrically connected to the coherent optical chip.

Images