Disc device

Abstract

This invention relates to a disk device capable of suppressing the effects caused by the proximity of conductors. One embodiment of the disk device includes a magnetic disk, a magnetic head, and a flexible printed circuit board (FPCB). The FPCB is electrically connected to the magnetic head. The FPCB has a first layer, a conductive second layer, and an insulating third layer. The first layer has an insulating first surface. The second layer is disposed on the first surface and has a first conductor and a second conductor separated from the first conductor. The third layer covers at least a portion of the first surface and at least a portion of the second layer. A first hole is provided on the FPCB, separating from the second layer and penetrating the third layer between the first and second conductors.

Description

[0001] This application enjoys priority based on Japanese Patent Application 2021-137351 (filed on August 25, 2021). This application incorporates the entire contents of that basic application by reference. Technical Field

[0002] Embodiments of the present invention relate to a disk device. Background Technology

[0003] Disk devices such as hard disk drives read and write information relative to a disk using a read / write head. A disk device may have a flexible printed circuit board (FPCB) that electrically connects the controller to the read / write head. The FPCB has multiple conductors such as wiring and pads.

[0004] For example, as the functionality of disk devices increases, there is a trend towards higher conductor density in flexible printed circuit boards (FPCBs). In this case, the distance between two adjacent conductors becomes shorter, which may affect the performance of the FPCB. Summary of the Invention

[0005] Embodiments of the present invention provide a disk device capable of suppressing the effects caused by the proximity of conductive materials.

[0006] One embodiment of the disk device includes a magnetic disk, a read / write head, and a flexible printed circuit board (FPCB). The read / write head is configured to read and write information relative to the magnetic disk. The FPCB is electrically connected to the read / write head. The FPCB has a first layer, a conductive second layer, and an insulating third layer. The first layer has an insulating first surface. The second layer is disposed on the first surface and has a first conductor and a second conductor separated from the first conductor. The third layer covers at least a portion of the first surface and at least a portion of the second layer. A first hole is provided in the FPCB, which is separated from the second layer and extends through the third layer between the first conductor and the second conductor. Attached Figure Description

[0007] Figure 1 This is an exemplary perspective view showing the HDD of the first embodiment.

[0008] Figure 2 This is a schematic plan view illustrating an example of the FPC of the first embodiment.

[0009] Figure 3 This is an illustrative plan view schematically showing a portion of the first connecting part in the first embodiment.

[0010] Figure 4 It is along Figure 3The F4-F4 line represents an exemplary cross-sectional view of a portion of the first connection portion in the first embodiment.

[0011] Figure 5 It is along Figure 3 The F5-F5 line represents an exemplary cross-sectional view of a portion of the first connection portion in the first embodiment.

[0012] Figure 6 It is along Figure 3 The F6-F6 line represents an exemplary cross-sectional view of a portion of the first connection portion in the first embodiment.

[0013] Figure 7 This is an exemplary cross-sectional view showing a portion of the first connecting part in the second embodiment.

[0014] Figure 8 This is an exemplary cross-sectional view showing a portion of the first connecting part in the third embodiment. Detailed Implementation

[0015] (First Embodiment)

[0016] The following is for reference Figures 1 to 6 The first embodiment will be described. Furthermore, in this specification, the constituent elements in the embodiments and their descriptions are sometimes described in various ways. The constituent elements and their descriptions are merely examples and are not limited to the representation in this specification. Constituent elements can also be identified by names different from those used in this specification. Moreover, constituent elements can also be described in representations different from those used in this specification.

[0017] Figure 1 This is an exemplary perspective view showing the hard disk drive (HDD) 10 according to the first embodiment. The HDD 10 is an example of a disk device, and may also be referred to as an electronic device, storage device, external storage device, or disk device. However, the disk device is not limited to the HDD 10.

[0018] The HDD10 has a housing 11, multiple disks 12, a spindle motor 13, multiple heads 14, an actuator assembly 15, a voice coil motor (VCM) 16, a ramp loading mechanism 17, a flexible printed circuit board (FPC) 18, and a printed circuit board (PCB) 19.

[0019] The housing 11 has a base 21, an inner cover 22, and an outer cover 23. The base 21 is a bottomed container made of a metal material such as aluminum alloy, and has a bottom wall 25 and side walls 26. The bottom wall 25 is formed as a generally rectangular (quadrilateral) plate. The side walls 26 protrude from the edges of the bottom wall 25. The bottom wall 25 and the side walls 26 are integrally formed.

[0020] The inner cover 22 and the outer cover 23 are made of a metal material such as aluminum alloy. The inner cover 22 is mounted to the end of the side wall 26 by screws, for example. The outer cover 23 covers the inner cover 22 and is hermetically fixed to the end of the side wall 26, for example, by welding.

[0021] The interior of housing 11 is sealed. Inside housing 11 are arranged disk 12, spindle motor 13, read / write head 14, actuator assembly 15, VCM 16, ramp loading mechanism 17, and FPC 18.

[0022] A vent 22a is provided on the inner cover 22. Furthermore, a vent 23a is provided on the outer cover 23. After the components are installed inside the base 21 and the inner cover 22 and outer cover 23 are mounted on the base 21, air inside the housing 11 is extracted through the vents 22a and 23a. Then, a gas different from air is filled inside the housing 11.

[0023] The gas filled inside the casing 11 may be a low-density gas with a lower density than air, or a less reactive gas. For example, helium may be filled inside the casing 11. Alternatively, other fluids may be filled inside the casing 11. Furthermore, the interior of the casing 11 may be maintained as a vacuum, a near-vacuum, or a negative pressure below atmospheric pressure.

[0024] The vent 23a of the outer casing 23 is blocked by the seal 28. The seal 28 airtightly seals the vent 23a, preventing fluid filling the interior of the housing 11 from leaking out of the vent 23a.

[0025] Disk 12 is, for example, a disk having magnetic recording layers disposed on its upper and lower surfaces. The diameter of disk 12 is, for example, 3.5 inches, but is not limited to this example. Multiple disks 12 are stacked at intervals.

[0026] The spindle motor 13 supports and rotates the stacked disks 12. The disks 12 are held in place, for example, by snap rings, on the boss of the spindle motor 13.

[0027] The read / write head 14 records and reproduces information relative to the recording layer of the disk 12. In other words, the read / write head 14 reads and writes information relative to the disk 12. The read / write head 14 is mounted on the actuator assembly 15.

[0028] Actuator assembly 15 is supported by support shaft 31 to be rotatable, which is configured in a disengaged position from disk 12. VCM 16 rotates actuator assembly 15 and configures it in the desired position. When read / write head 14 moves to the outermost periphery of disk 12, ramp loading mechanism 17 holds read / write head 14 in the disengaged unloaded position from disk 12.

[0029] The actuator assembly 15 includes an actuator block 35, multiple arms 36, and multiple head suspension assemblies 37. Hereinafter, the head suspension assembly 37 will be referred to as suspension 37. Suspension 37 may also be referred to as head universal joint assembly (HGA).

[0030] The actuator block 35 is rotatably supported on the support shaft 31, for example, via bearings. Multiple arms 36 protrude from the actuator block 35 in a direction substantially orthogonal to the support shaft 31. Alternatively, the actuator assembly 15 can be divided so that the arms 36 protrude from the multiple actuator blocks 35 respectively.

[0031] Multiple arms 36 are arranged at intervals along the direction in which the support shaft 31 extends. Each arm 36 is formed into a plate shape that can enter between adjacent disks 12. The multiple arms 36 extend substantially parallel to each other.

[0032] The actuator block 35 and the plurality of arms 36 are integrally formed, for example, from aluminum. However, the material of the actuator block 35 and the arms 36 is not limited to this example.

[0033] The voice coil of VCM16 is provided on a protrusion that extends from the actuator block 35 to the opposite side of the arm 36. VCM16 has a pair of yokes, a voice coil disposed between the yokes, and a magnet disposed on the yokes.

[0034] As described above, VCM16 causes actuator assembly 15 to rotate. In other words, VCM16 causes actuator block 35, arm 36, and suspension 37 to rotate (move) as a whole.

[0035] The suspension 37 is mounted on the front end portion of the corresponding arm 36 and protrudes from the arm 36. Thus, the plurality of suspensions 37 are arranged at intervals in the direction in which the support shaft 31 extends.

[0036] Each of the multiple suspensions 37 has a base plate 41, a loading beam 42, and a flexible member 43. Furthermore, a magnetic head 14 is mounted at the front end of the suspension 37.

[0037] The substrate 41 and the loading beam 42 are made of, for example, stainless steel. However, the materials of the substrate 41 and the loading beam 42 are not limited to this example. The substrate 41 is formed in a plate shape and is mounted on the front end of the arm 36. The loading beam 42 is formed in a plate shape that is thinner than the substrate 41. The loading beam 42 is mounted on the front end of the substrate 41 and protrudes from the substrate 41.

[0038] The flexible element 43 is formed in the form of an elongated strip. However, the shape of the flexible element 43 is not limited to this example. The flexible element 43 is a laminate having a metal plate (lining layer) such as stainless steel, an insulating layer formed on the metal plate, a conductive layer formed on the insulating layer and constituting multiple wirings (wiring patterns), and a protective layer (insulating layer) covering the conductive layer.

[0039] A universal joint (elastic support) is provided at one end of the flexible member 43, located on the loading beam 42 and capable of displacement. The universal joint is located at the front end of the suspension 37 and mounts the magnetic head 14. The other end of the flexible member 43 is connected to the FPC 18. Thus, the FPC 18 is electrically connected to the magnetic head 14 via the wiring of the flexible member 43.

[0040] PCB 19 is, for example, a rigid substrate such as a glass epoxy board, and is a multilayer substrate or a laminated substrate. PCB 19 is disposed outside the housing 11 and mounted on the bottom wall 25 of the base 21. PCB 19 is mounted to the bottom wall 25, for example, by a plurality of screws.

[0041] For example, interface (I / F) connector 51, controller 52, and relay connector 53 are mounted on PCB 19. In addition, other components may also be mounted on PCB 19.

[0042] I / F connector 51 is a connector that conforms to interface standards such as Serial ATA (SATA) and connects to the host computer's I / F connector. HDD10 receives power from the host computer through I / F connector 51 and sends and receives various data between the host computer and the host computer.

[0043] The controller 52 is, for example, a system-on-a-chip (SoC) with a read-write channel (RWC), a hard disk controller (HDC), and a processor. Alternatively, the RWC, HDC, and processor can be separate components.

[0044] The processor of controller 52 is, for example, a CPU (Central Processing Unit). The processor controls the HDD 10 as a whole according to firmware pre-stored in ROM. For example, the processor loads the firmware from ROM into RAM and executes control of head 14, RWC, HDC, and other parts according to the loaded firmware.

[0045] The relay connector 53 is electrically connected to various components disposed inside the housing 11, for example, via a connector provided on the bottom wall 25. Thus, the PCB 19 is electrically connected to the spindle motor 13, the magnetic head 14, the actuator assembly 15, the VCM 16, and the FPC 18 disposed inside the housing 11.

[0046] Figure 2 This is a schematic plan view illustrating the FPC18 of the first embodiment. (Example) Figure 2 As shown, the FPC18 is formed into a roughly L-shaped strip in its natural state after being disassembled from other components and without any external force applied. However, the shape of the FPC18 is not limited to this example. The FPC18 has a first connecting portion 61, a second connecting portion 62, and a middle portion 63.

[0047] The first connecting part 61 is provided, for example, at one end of the FPC18 in the direction of extension of the FPC18. The first connecting part 61 is mounted to the actuator block 35, for example, by a screw. The first connecting part 61 is electrically connected to the VCM16 and the flexible member 43.

[0048] The first connecting portion 61 is provided with a plurality of through holes 64. The through holes 64 pass through the first connecting portion 61. For example, a screw passes through the through holes 64 to mount the first connecting portion 61 to the actuator block 35. However, the through holes 64 are not limited to this example. For example, a pin mounted to the actuator block 35 through the through holes 64 may be fixed to the first connecting portion 61 by solder.

[0049] The second connecting part 62 is provided, for example, at the other end of the FPC18 in the direction of extension of the FPC18. The second connecting part 62 is mounted to the bottom wall 25, for example, by screws. The second connecting part 62 is electrically connected to the PCB19, for example, by a connector provided on the bottom wall 25.

[0050] The intermediate portion 63 is disposed between the first connecting portion 61 and the second connecting portion 62. The intermediate portion 63 extends in a strip shape and flexes between the first connecting portion 61 and the second connecting portion 62 according to the rotation of the actuator block 35.

[0051] As shown in the figures, for convenience, the X-axis, Y-axis, and Z-axis are defined in this specification. The X-axis, Y-axis, and Z-axis are orthogonal to each other. The X-axis is set along the width of the middle portion 63 in its natural state. The Y-axis is set along the length of the middle portion 63 in its natural state. The Z-axis is set along the thickness of the FPC18 in its natural state.

[0052] Furthermore, in this specification, the X, Y, and Z directions are defined. The X direction is the direction along the X-axis, including the +X direction indicated by the arrow on the X-axis, and the -X direction, which is the opposite direction of the arrow on the X-axis. The Y direction is the direction along the Y-axis, including the +Y direction indicated by the arrow on the Y-axis, and the -Y direction, which is the opposite direction of the arrow on the Y-axis. The Z direction is the direction along the Z-axis, including the +Z direction indicated by the arrow on the Z-axis, and the -Z direction, which is the opposite direction of the arrow on the Z-axis.

[0053] The first connecting portion 61 is connected to the end of the intermediate portion 63 in the +Y direction and extends from that end in the +Y direction. The second connecting portion 62 is connected to the end of the intermediate portion 63 in the -Y direction and extends from that end in the +X direction. However, the first connecting portion 61 and the second connecting portion 62 are not limited to this example.

[0054] The HDD10 also includes multiple preamplifiers 65, repeater connectors 66, sensors 67, and multiple reinforcing plates 68. The preamplifiers 65 are one example of components and can also be referred to as preamplifiers. The reinforcing plates 68 are one example of walls.

[0055] A preamplifier 65 is mounted on the first connection section 61. The preamplifier 65 is electrically connected to the flexible element 43, for example, via wiring and pads of the FPC 18. Furthermore, the preamplifier 65 is electrically connected to the read / write head 14 via the flexible element 43. The preamplifier 65 amplifies the write signal and sends it to the read / write head 14, and also amplifies the read signal received from the read / write head 14.

[0056] The preamplifier 65 is secured to the FPC 18 by a bottom filler 69. The bottom filler 69 is disposed between the preamplifier 65 and the FPC 18. In addition, a portion of the bottom filler 69 is attached to the edge of the preamplifier 65 and is located outside the space between the preamplifier 65 and the FPC 18.

[0057] The relay connector 66 and the sensor 67 are mounted on the second connection portion 62. The relay connector 66 is electrically connected to the relay connector 53 of the PCB 19, for example, via a connector provided on the bottom wall 25. Thus, the second connection portion 62 is connected to the PCB 19. Alternatively, the relay connector 66 can be directly connected to the relay connector 53 of the PCB 19. The sensor 67 detects, for example, the temperature and humidity inside the housing 11, as well as the acceleration and angular acceleration of the HDD 10.

[0058] The reinforcing plate 68 is made of, for example, a metal such as aluminum or a synthetic resin, and is formed into a plate shape. However, the reinforcing plate 68 is not limited to this example. Multiple reinforcing plates 68 are installed on the first connecting portion 61 and the second connecting portion 62. The reinforcing plates 68 increase the rigidity of the first connecting portion 61 and the second connecting portion 62.

[0059] Figure 3 This is an illustrative plan view schematically showing a portion of the first connection portion 61 in the first embodiment. Figure 4 It is along Figure 3 The F4-F4 line represents an exemplary cross-sectional view of a portion of the first connection portion 61 in the first embodiment. Figure 5 It is along Figure 3 The F5-F5 line represents an exemplary cross-sectional view of a portion of the first connection portion 61 in the first embodiment. Figure 6 It is along Figure 3 The F6-F6 line represents an exemplary cross-sectional view of a portion of the first connection portion 61 in the first embodiment.

[0060] like Figure 4As shown, FPC18 has a base layer 71, a conductive layer 72, a capping layer 73, a ground layer 74, and a capping layer 75. The base layer 71 is an example of the first layer. The conductive layer 72 is an example of the second layer. The capping layer 73 is an example of the third layer.

[0061] The substrate 71 is made of an insulating material such as polyimide and has insulating properties. Alternatively, in the case where the FPC18 is a multilayer FPC, the substrate 71 may also have multiple insulating layers and multiple conductive layers.

[0062] The base layer 71 has an upper surface 71a and a lower surface 71b. Furthermore, in this specification, "upper" and "lower" refer to... Figure 4 For ease of representation, the vertical direction is used as a reference, and there are no restrictions on direction, position, or other conditions. The upper surface 71a is an example of the first surface.

[0063] The upper surface 71a is the surface of the substrate layer 71 facing the +Z direction. The lower surface 71b is located on the opposite side of the upper surface 71a and is the surface of the substrate layer 71 facing the -Z direction. Since the substrate layer 71 is made of an insulating material, the upper surface 71a is insulating. In addition, for example, in the case where the FPC18 is a multilayer FPC, conductors can also be exposed from the upper surface 71a.

[0064] A ground layer 74 made of a conductor such as copper is provided on the lower surface 71b. A cover layer 75 made of an insulating material such as polyimide covers the ground layer 74. Alternatively, in the case where the FPC18 is a multilayer FPC, the ground layer 74 may also be provided inside the base layer 71.

[0065] The conductive layer 72 is made of a conductive material such as copper and has electrical conductivity. The conductive layer 72 is disposed on the upper surface 71a of the substrate layer 71. In addition, an adhesive layer may be disposed between the conductive layer 72 and the upper surface 71a.

[0066] The conductive layer 72 has Figure 3 The diagram shows multiple pads 81, 82, 83, 84; signal wiring 85; power wiring 86; two GMA (gimbal micro actuator) wirings 87, 88; and... Figure 6 The conductor 89 is shown. Furthermore, the conductive layer 72 has... Figure 3 The multiple grounding wires 91, 92, and 93 are shown.

[0067] Pads 81 and 82, and GMA wiring 87 are examples of the first conductor. Pads 83 and 84, power wiring 86, and GMA wiring 88 are examples of the second conductor. GMA wiring 87 is an example of the first wiring. GMA wiring 88 is an example of the second wiring. Pads 81, 82, 83, and 84 can also be referred to as connection pads, terminals, or electrodes.

[0068] Pads 81 and 82 are among several pads connected to the preamplifier 65. For example... Figure 4 As shown, terminal 65a of the preamplifier 65 is connected to pad 81. Furthermore, as... Figure 6 As shown, terminal 65b of the preamplifier 65 is connected to pad 82. Terminals 65a and 65b are, for example, solder balls. However, terminals 65a and 65b are not limited to this example.

[0069] Figure 4 The pad 83 shown is connected to the terminal of the voice coil of VCM16. Pad 83 is connected to VCM16 via solder 95. That is, solder 95 is attached to pad 83. Pad 83 is detached from pads 81 and 82.

[0070] like Figure 3 As shown, pad 84 is arranged in a generally circular shape along the edge of through hole 64. Pad 84 is covered and protected by solder 96. However, pad 84 is not limited to this example. Pad 84 is separate from pads 81 and 82.

[0071] Signal wiring 85 extends along the upper surface 71a, for example, between repeater connector 66 and preamplifier 65. Signal wiring 85 connects to pad 81 or other pads to which preamplifier 65 is connected, and transmits read and write signals. However, signal wiring 85 is not limited to this example. Signal wiring 85 is separated from pads 83 and 84.

[0072] Power supply trace 86 extends along the upper surface 71a, for example, between repeater connector 66 and pad 83. Power supply trace 86 connects to pad 83 and supplies power to VCM 16. However, power supply trace 86 is not limited to this example. Power supply trace 86 is separated from pads 81, 82, 84 and signal trace 85.

[0073] GMA wirings 87 and 88 extend, for example, along the upper surface 71a between the repeater connector 66 and the flexible element 43. GMA wirings 87 and 88 extend substantially parallel to each other. Therefore, GMA wiring 88 extends along GMA wiring 87. Additionally, the distance between the two GMA wirings 87 and 88 may not be constant. GMA wiring 87 is closer to the preamplifier 65 than GMA wiring 88.

[0074] GMA wirings 87 and 88 are electrically connected, for example, to the magnetic head 14 of a microwave-assisted magnetic recording (MAMR) or heat-assisted magnetic recording (HAMR) system, and transmit control signals for the generation of a laser or microwave source. However, GMA wirings 87 and 88 are not limited to this example.

[0075] Figure 6 The conductor 89 shown is located between the pad 82 and the GMA wiring 87. The conductor 89 is, for example, an inspection pattern used for inspecting the FPC18. However, the conductor 89 is not limited to this example; it could also be wiring.

[0076] Grounding wiring 91, 92, and 93 are connected to ground. For example, grounding wiring 91, 92, and 93 are electrically connected to ground plane 74 via a path.

[0077] like Figure 3 As shown, the grounding trace 91 extends through the area between pads 81 and 83, the area between pads 81 and 84, and the area between pad 81 and power trace 86. Therefore, the grounding trace 91 is located between pads 81 and 83, and between pads 81 and 84. Furthermore, the grounding trace 91 is located between the underfill 69 and pad 83, and between the underfill 69 and pad 84.

[0078] Grounding wiring 92 is located between GMA wiring 87 and GMA wiring 88. Grounding wiring 93 is located between pad 82 and GMA wiring 87. Grounding wirings 92 and 93 extend approximately parallel to GMA wirings 87 and 88. Alternatively, grounding wirings 92 and 93 may be shorter than GMA wirings 87 and 88.

[0079] like Figure 4 As shown, the capping layer 73 covers at least a portion of the upper surface 71a of the base layer 71 and at least a portion of the conductive layer 72. For example, the capping layer 73 covers signal wiring 85, power wiring 86, GMA wiring 87, 88, and ground wiring 91, 92, 93. The capping layer 73 has a lower surface 73a and an upper surface 73b. The lower surface 73a is an example of a second surface. The upper surface 73b is an example of a third surface.

[0080] The lower surface 73a is the surface of the cover layer 73 facing the -Z direction. The lower surface 73a faces the upper surface 71a of the base layer 71. The upper surface 73b is located on the opposite side of the lower surface 73a and is the surface of the cover layer 73 facing the +Z direction. The upper surface 73b forms the surface of the FPC18.

[0081] The cover layer 73 has a cover film 101 and an adhesive 102. The cover film 101 is made of an insulating material, for example, polyimide. The adhesive 102 is made of an insulating adhesive, for example. Therefore, the cover layer 73 is insulating. Depending on other properties, the resistance of both the base layer 71 and the cover layer 73 is higher than the resistance of the conductive layer 72.

[0082] Adhesive 102 is sandwiched between the cover film 101, the upper surface 71a of the base layer 71, and the conductive layer 72. Adhesive 102 bonds the cover film 101 to the upper surface 71a of the base layer 71 and the conductive layer 72.

[0083] The capping layer 73 has a generally certain thickness and covers the upper surface 71a of the base layer 71 and the conductive layer 72. Therefore, at the location where the conductive layer 72 is provided, the capping layer 73 protrudes (bulges) from the upper surface 73b. Figure 3 As shown, the cover layer 73 has multiple protrusions 111, 112, and 113.

[0084] like Figure 4 As shown, protrusion 111 is part of the cover layer 73 covering the grounding wiring 91. Protrusion 111 protrudes from the upper surface 73b along the grounding wiring 91 and extends along the grounding wiring 91. Therefore, protrusion 111 is located between pads 81 and 83, and between pads 81 and 84, in the direction along the upper surface 71a of the substrate layer 71. In addition, protrusion 111 is located between the underfill 69 and pads 83, and between the underfill 69 and pads 84.

[0085] The protrusion 111 has two sides 111a and 111b. Side 111a is an example of the first protruding surface and the protruding surface. Sides 111a and 111b protrude (stand up, bulge) from the upper surface 73b along the grounding wiring 91 and face a direction that intersects with the direction facing the upper surface 73b.

[0086] Side 111a is closer to pad 83 than side 111b and closer to pad 84 than side 111b. Side 111b is located on the opposite side of side 111a. Side 111b is closer to pad 81 than side 111a.

[0087] like Figure 5 As shown, the protrusion 112 is part of the cover layer 73 covering the grounding wiring 92. The protrusion 112 protrudes from the upper surface 73b along the grounding wiring 92 and extends along the grounding wiring 92. Therefore, the protrusion 112 is located between the GMA wiring 87 and the GMA wiring 88 in the direction along the upper surface 71a of the base layer 71.

[0088] The protrusion 112 has two sides 112a and 112b. Sides 112a and 112b protrude from the upper surface 73b along the grounding wiring 92 and face a direction intersecting the direction facing the upper surface 73b. Side 112a is closer to the GMA wiring 88 than side 112b. Side 112b is located on the opposite side of side 112a. Side 112b is closer to the GMA wiring 87 than side 112a.

[0089] like Figure 6 As shown, the protrusion 113 is part of the cover layer 73 covering the ground wiring 93. The protrusion 113 protrudes from the upper surface 73b along the ground wiring 93 and extends along the ground wiring 93. Therefore, the protrusion 113 is located between the pad 82 and the GMA wiring 87 in the direction along the upper surface 71a of the substrate layer 71.

[0090] The protrusion 113 has two sides 113a and 113b. Sides 113a and 113b protrude from the upper surface 73b along the grounding wiring 93 and face a direction intersecting the direction faced by the upper surface 73b. Side 113a is closer to the GMA wiring 87 than side 113b. Side 113b is located on the opposite side of side 113a. Side 113b is closer to the pad 82 than side 113a.

[0091] like Figure 3 As shown, the cover layer 73 has multiple exposed holes 121, 122, 123, 124 and multiple through holes 125, 126, 127. Exposed holes 123 and 124 are examples of the second type of hole. Through holes 125, 126, 127 are examples of the first type of hole.

[0092] Exposed holes 121, 122, 123, 124 and through holes 125, 126, 127 penetrate the cover layer 73 along the Z direction. Therefore, exposed holes 121, 122, 123, 124 and through holes 125, 126, 127 open on the upper surface 73b and the lower surface 73a.

[0093] like Figure 4 As shown, the exposed hole 121 exposes the pad 81. In other words, the cover layer 73 does not cover the pad 81 in the portion where the exposed hole 121 is provided. Figure 6 As shown, the exposed hole 122 exposes the pad 82. (As indicated...) Figure 4 As shown, exposed hole 123 exposes pad 83. Exposed hole 124 exposes pad 84.

[0094] Through holes 125, 126, and 127 are separated from the conductive layer 72 in the direction along the upper surface 71a. Therefore, through holes 125, 126, and 127 do not expose the conductive layer 72. In other words, through holes 125, 126, and 127 do not overlap with the conductive layer 72 in the Z direction.

[0095] like Figure 3 As shown, the through-hole 125 is located between pad 81 and pad 83, between pad 81 and pad 84, and between pad 81 and power trace 86. Furthermore, the through-hole 125 is located between underfill 69 and solder 95, and between underfill 69 and solder 96, in the direction along the upper surface 71a of the substrate layer 71.

[0096] The through-hole 125 is located between the ground wiring 91 and the pad 83, and between the ground wiring 91 and the power wiring 86. Furthermore, the through-hole 125 is located between the side surface 111a of the protrusion 111 and the exposed hole 123 in the direction along the upper surface 71a of the substrate layer 71. Additionally, the through-hole 125 is located near the end 111c of the side surface 111a in the direction extending from the side surface 111a of the protrusion 111.

[0097] Through-hole 126 is located between GMA wiring 87 and GMA wiring 88. Through-hole 126 is located between ground wiring 92 and GMA wiring 87. In addition, through-hole 126 is located between the side 112a of protrusion 112 and GMA wiring 87 in the direction along the upper surface 71a of substrate layer 71.

[0098] Through-hole 127 is located between pad 82 and GMA wiring 87. Furthermore, through-hole 127 is located between ground wiring 93 and pad 82. Additionally, through-hole 127 is located between the side 113a of protrusion 113 and pad 82 in the direction along the upper surface 71a of substrate layer 71.

[0099] like Figure 6 As shown, the through-hole 127 exposes the upper surface 71a of the substrate layer 71 and the conductor 89. In other words, the capping layer 73 does not cover the conductor 89 in the portion where the through-hole 127 is provided. However, a portion of the underfill 69 fills the through-hole 127 and covers the conductor 89. That is, a portion of the underfill 69 is located in the through-hole 127.

[0100] like Figure 4 as well as Figure 5 As shown, through holes 131 and 132 are provided on the base layer 71. Through holes 131 and 132 are examples of the third hole. Through holes 131 and 132 penetrate the base layer 71 along the Z direction. Therefore, through holes 131 and 132 open on the upper surface 71a and the lower surface 71b.

[0101] The through hole 131 has a shape that is substantially the same as that of the through hole 125 in the cover layer 73. The through hole 131 overlaps with and communicates with the through hole 125 in the Z direction. Alternatively, the shape of the through hole 131 may differ from that of the through hole 125.

[0102] The through hole 132 has a shape substantially the same as the through hole 126 of the cover layer 73. The through hole 132 overlaps with and communicates with the through hole 126 in the Z direction. Alternatively, the shape of the through hole 132 may differ from that of the through hole 126.

[0103] Through holes 135 and 136 are provided on the grounding layer 74 and the cover layer 75, respectively. Through holes 135 and 136 penetrate the grounding layer 74 and the cover layer 75 along the Z direction.

[0104] The through hole 135 has a shape that is substantially the same as that of the through hole 131 in the substrate layer 71. The through hole 135 overlaps with and communicates with the through hole 131 in the Z direction. Alternatively, the shape of the through hole 135 may differ from that of the through hole 131.

[0105] The through-hole 136 has a shape substantially the same as the through-hole 132 of the substrate layer 71. The through-hole 136 overlaps with and communicates with the through-hole 132 in the Z direction. Alternatively, the shape of the through-hole 136 may differ from that of the through-hole 132.

[0106] The reinforcing plate 68 is mounted on the FPC 18 such that it covers the lower surface 71b of the base layer 71. Therefore, the base layer 71 is located between the cover layer 73 and the reinforcing plate 68. Furthermore, the rigidity of the reinforcing plate 68 is higher than that of the base layer 71 and also higher than that of the cover layer 73. Through holes 141 and 142 are provided in the reinforcing plate 68. Through holes 141 and 142 are examples of the fourth type of hole. Through holes 141 and 142 penetrate the reinforcing plate 68 along the Z-direction.

[0107] The through hole 141 has a shape that is substantially the same as that of the through hole 131 in the substrate layer 71. The through hole 141 overlaps with the through holes 131 and 135 in the Z direction and is connected to the through hole 131 through the through hole 135. Alternatively, the shape of the through hole 141 may be different from that of the through hole 131.

[0108] The through hole 142 has a shape that is substantially the same as that of the through hole 132 in the substrate layer 71. The through hole 142 overlaps with the through holes 132 and 136 in the Z direction and is connected to the through hole 132 through the through hole 136. Alternatively, the shape of the through hole 142 may be different from that of the through hole 132.

[0109] The through holes 125, 126, 131, 132, 135, 136, 141, and 142 are hollow and not filled with solids or liquids. Therefore, the interiors of the through holes 125, 126, 131, 132, 135, 136, 141, and 142 are either filled with gas from inside the casing 11 or remain a vacuum. However, the through holes 125, 126, 131, 132, 135, 136, 141, and 142 are not limited to this example. Furthermore, the through holes 131, 132, 135, 136, 141, and 142 may not be provided. In this case, the through holes 125 and 126 expose the upper surface 71a of the base layer 71.

[0110] The following describes a portion of the method for mounting components to the FPC18. However, the method for mounting components to the FPC18 is not limited to the following method, and other methods may also be used. First, solder paste (solder 95, 96) may be supplied to pads 83, 84, for example, by printing or coating. Furthermore, solder paste may also be supplied to pads 81, 82.

[0111] Next, the preamplifier 65 is mounted on pads 81 and 82. Then, the terminals of the VCM16 are mounted on pad 83. Next, the FPC18 is heated in a reflow oven to melt the solder paste and solder balls. As a result, the terminals 65a and 65b of the preamplifier 65 are bonded to pads 81 and 82, the terminals of the VCM16 are bonded to pad 83, and solder 96 covers pad 84. At this time, as... Figure 4 As shown, flux F mixed in solder 95 and 96 or supplied separately sometimes flows out from solder 95 and 96.

[0112] Next, underfill 69 is supplied between the preamplifier 65 and FPC 18. Underfill 69 is also supplied into the through-hole 127 and covers the conductor 89. At this time, when flux F is mixed into the underfill 69, it is possible to generate substances that could contaminate the HDD 10. For example, a sponge-like substance that is prone to collapse may be generated. However, the HDD 10 of this embodiment can suppress the mixing of flux F and underfill 69.

[0113] like Figure 4 As shown, flux F flows out, for example, from solder 95 supplied to pad 83 and weeps and spreads along the upper surface 73b of the cover layer 73. Additionally, flux F also flows out from solder 96 supplied to pad 84. When flux F reaches the through-hole 125 opening in the upper surface 73b, it remains at the edge of the through-hole 125 due to surface tension. That is, the through-hole 125 can block flux F.

[0114] Flux F can also flow into the through-hole 125. In this case, flux F accumulates in the through-holes 125, 131, 135, and 141, or is discharged through the through-holes 125, 131, 135, and 141. Thus, the through-hole 125 can block flux F.

[0115] The flux F sometimes extends beyond or around the through hole 125 towards the bottom filler 69. However, the flux F is blocked by the side 111a of the protrusion 111.

[0116] Furthermore, the flux F bypassing the through-hole 125 sometimes flows along the side 111a of the protrusion 111. When the flux F reaches the end 111c of the side 111a, it expands from the end 111c. However, since the through-hole 125 is located near the end 111c, the flux F flows into the through-hole 125. As described above, the side 111a of the protrusion 111 between the solder 95, 96 and the underfill 69, as well as the through-hole 125, block the flux F.

[0117] Figure 6 The through-hole 127 is formed to block the solder F while allowing the underfill 69 to flow in. For example, the angle of the edge of the through-hole 127 is locally different. Thus, the portion of the edge of the through-hole 127 near the underfill 69 allows the underfill 69 to pass through. On the other hand, the portion of the edge of the through-hole 127 near the solder blocks the solder F. Furthermore, the through-hole 127 is not limited to this example.

[0118] Next, the underfill 69 is cured, for example, by heat. Thus, the underfill 69 secures the preamplifier 65 to the FPC 18. Next, the FPC 18 is cleaned, for example, by ultrasonic cleaning, to remove the solder F. Through the above, the installation of the component onto the FPC 18 is completed.

[0119] In the HDD 10 of the first embodiment described above, the FPC 18 has a base layer 71, a conductive layer 72, and an insulating capping layer 73. The base layer 71 has an insulating upper surface 71a. The conductive layer 72 is disposed on the upper surface 71a and has a first conductor (pads 81, 82, GMA wiring 87) and a second conductor (pads 83, 84, GMA wiring 88) separated from the first conductor. The capping layer 73 covers at least a portion of the upper surface 71a and at least a portion of the conductive layer 72. Through-holes 125, 126, and 127 are provided on the FPC 18. The through-holes 125, 126, and 127 are separated from the conductive layer 72 and penetrate the capping layer 73 between the first conductors 81, 82, and 87 and the second conductors 83, 84, and 88. For example, sometimes a preamplifier 65 mounted on pad 81 is fixed to the FPC 18 by an underfill 69, and solder 95 and 96 are applied to pads 83 and 84. When the distance between pads 81 and pads 83 and 84 is close, the flux F flowing from the solder 95 and 96 may reach the underfill 69, and may mix with the flux F in the underfill 69, generating substances that could contaminate the HDD 10. However, in the HDD 10 of this embodiment, a through-hole 125 is provided between pads 81 and pads 83 and 84. Thus, even if flux F flows out from the solder 95 and 96 attached to pads 83 and 84, the flux F is blocked by the through-hole 125 before reaching the underfill 69. Therefore, in the HDD10 of this embodiment, even when pad 81 is close to pads 83 and 84, the mixing of flux F and underfill 69 can be suppressed, thereby suppressing contamination of the HDD10. That is, the HDD10 can suppress the effects caused by the proximity of pads 81 and 83 and 84. Furthermore, in the HDD10 of this embodiment, by making the through holes 125, 126, and 127 hollow, insulation and heat insulation can be provided between the first conductors 81, 82, and 87 and the second conductors 83, 84, and 88 using the through holes 125, 126, and 127. Therefore, in the HDD10 of this embodiment, even when the first conductors 81, 82, and 87 are close to the second conductors 83, 84, and 88, short circuits or noise transmission between the first conductors 81, 82, and 87 and the second conductors 83, 84, and 88 can be suppressed. That is, HDD10 can suppress the effects caused by the proximity of the first conductors 81, 82, 87 and the second conductors 83, 84, 88.

[0120] For example, the potential difference between the two GMA wirings 87 and 88 is greater than the potential difference between the signal wiring 85 and the power wiring 86. Normally, insulation failure could occur in an insulator such as the cover layer 73 between two wirings with a large potential difference. However, in this embodiment, a through-hole 126 filled with gas or a vacuum is provided between the GMA wirings 87 and 88. The resistance of a gas or vacuum space is higher than that of an individual component like polyimide. Therefore, the through-hole 126 can suppress insulation failure between the two GMA wirings 87 and 88 with a large potential difference. Furthermore, the thermal conductivity of a gas or vacuum space is lower than that of an individual component like polyimide. Therefore, the through-hole 126 can suppress heat transfer between the two GMA wirings 87 and 88.

[0121] For example, when signal wiring 85 transmits signals at high speed, the signal is susceptible to noise from power wiring 86 due to parasitic impedance. However, in this embodiment, a through-hole 125 filled with gas or a vacuum is provided between signal wiring 85 and power wiring 86. Therefore, through-hole 125 can suppress noise transmission between signal wiring 85 and power wiring 86.

[0122] The preamplifier 65 is connected to pad 81. Underfill 69 is disposed between the preamplifier 65 and FPC 18. Solder 95 and 96 are attached to pads 83 and 84. A through-hole 125 is located between the underfill 69 and the solder 95 and 96. Therefore, even if flux F flows out from the solder 95 and 96, it is blocked by the through-hole 125 before reaching the underfill 69. Thus, the HDD 10 of this embodiment can suppress the mixing of flux F and underfill 69.

[0123] The cover layer 73 has a lower surface 73a and an upper surface 73b. The lower surface 73a faces the upper surface 71a. The upper surface 73b is located on the opposite side of the lower surface 73a. Exposed holes 123 and 124 are provided on the cover layer 73. The exposed holes 123 and 124 open on the upper surface 73b and expose the pads 83 and 84. The FPC 18 has a side surface 111a that protrudes from the upper surface 73b and is located between the pads 81 and 83 and 84 in the direction along the upper surface 71a. When flux F flows out from the solder 95 and 96 attached to the pads 83 and 84, the flux F may spread along the upper surface 73b. However, the flux F is blocked by the side surface 111a protruding from the upper surface 73b before reaching the underfill 69. Therefore, the HDD 10 of this embodiment can suppress the mixing of flux F with the underfill 69.

[0124] The through-hole 125 is located between the side surface 111a and the exposed holes 123 and 124 in the direction along the upper surface 71a. Therefore, when flux F flows out from the solder 95 and 96 attached to the pads 83 and 84, the through-hole 125 can block the flux F before it reaches the side surface 111a. Thus, in the HDD 10 of this embodiment, even if the height of the side surface 111a is relatively low, it is possible to prevent the flux F from crossing the side surface 111a and reaching the bottom filler 69.

[0125] The conductive layer 72 has grounding wirings 91, 92, and 93. The grounding wirings 91, 92, and 93 are located between the first conductors 81, 82, and 87 and the second conductors 83, 84, and 88, and are electrically connected to ground. A side surface 111a protrudes from the upper surface 73b along the grounding wiring 91. For example, by stacking a cover layer 73 on the grounding wiring 91, the side surface 111a can be disposed on the cover layer 73. Therefore, the HDD 10 of this embodiment does not require a special process for disposing of the side surface 111a, thus suppressing cost increases. Furthermore, the grounding wirings 91, 92, and 93 can suppress short circuits caused by insulation failure or noise transmission caused by parasitic impedance between the first conductors 81, 82, and 87 and the second conductors 83, 84, and 88.

[0126] The through-hole 125 is located near the end 111c of the side surface 111a in the direction in which the side surface 111a extends. Therefore, for example, when the side surface 111a blocks the flux F, the through-hole 125 can block the flux F from flowing out around the end 111c of the side surface 111a. Thus, the HDD 10 of this embodiment can suppress the mixing of flux F with the underfiller 69.

[0127] The stiffening plate 68 has higher rigidity than the base layer 71 and is mounted on the FPC 18. The base layer 71 has a through-hole 131 that penetrates the base layer 71 and communicates with the through-hole 125. The base layer 71 is located between the cover layer 73 and the stiffening plate 68. The stiffening plate 68 has a through-hole 141 that penetrates the stiffening plate 68 and communicates with the through-hole 131. That is, the through-holes 125, 131, and 141 form a continuous hole penetrating the base layer 71, the cover layer 73, and the stiffening plate 68. The volume of this continuous hole is larger than the volume of the through-hole 125, thus allowing more flux F to accumulate than the through-hole 125, thereby blocking more flux F. Therefore, the HDD 10 of this embodiment can suppress the mixing of flux F with the underfill 69. Furthermore, during cleaning, the cleaning fluid can pass through this continuous hole. Thus, the cleaning fluid can effectively remove the flux F accumulated in the continuous hole.

[0128] The conductive layer 72 has a conductor 89 exposed through the through-hole 127. A portion of the underfill 69 is located in the through-hole 127 and covers the conductor 89. Normally, solder is supplied and reflowed before the underfill 69 is supplied. Therefore, before the underfill 69 is supplied, the underfill 69 does not flow into the through-hole 127, thus blocking the flux F flowing out of the solder. Furthermore, after the underfill 69 is supplied, it covers the conductor 89. Therefore, the underfill 69 can suppress short circuits and corrosion of the conductor 89.

[0129] First conductors 81, 82, and 87 have GMA wiring 87 extending along the upper surface 71a. Second conductors 83, 84, and 88 have GMA wiring 88 extending along the GMA wiring 87. A cover layer 73 covers the GMA wiring 87 and 88. A through-hole 126 is located between the GMA wiring 87 and the GMA wiring 88. In this embodiment, the HDD 10 makes the through-hole 126 hollow, thereby enabling insulation and heat insulation between the GMA wiring 87 and the GMA wiring 88. Therefore, the HDD 10 of this embodiment can suppress short circuits or noise transmission between the GMA wiring 87 and the GMA wiring 88.

[0130] (Second Implementation)

[0131] The following is for reference Figure 7 The second embodiment will be described. Furthermore, in the following descriptions of various embodiments, components having the same function as those already described are sometimes given the same symbols, and further explanation is omitted. Moreover, the multiple components given the same symbols are not limited to having all common functions and properties; they may also have different functions and properties corresponding to each embodiment.

[0132] Figure 7 This is an exemplary cross-sectional view showing a portion of the first connecting portion 61 in the second embodiment. (Example) Figure 7 As shown, in the second embodiment, the FPC18 has an anti-corrosion agent 200 instead of the grounding wiring 91 and the protrusion 111.

[0133] The resist 200 has a protrusion 201. The protrusion 201 protrudes from the upper surface 73b of the coating layer 73. For example... Figure 7 As in the example, the resist 200 can be partially disposed on the exposed hole 121 and partially disposed on the upper surface 73b, or it can be disposed only on the upper surface 73b.

[0134] The protrusion 201 is located between pads 81 and 83 and between pads 84 in the direction along the upper surface 71a of the base layer 71. In addition, the protrusion 111 is located between the underfill 69 and pads 83 and between the underfill 69 and pads 84.

[0135] The protrusion 201 has two side surfaces 201a and 201b. Side surface 201a is an example of a first protruding surface and a protruding surface. Side surfaces 201a and 201b protrude (stand up, bulge) from the upper surface 73b and face in a direction that intersects with the direction in which the upper surface 73b faces.

[0136] Side 201a is closer to pad 83 and to pad 84 than side 201b. Side 201b is located on the opposite side of side 201a. Side 201b is closer to pad 81 than side 201a. When flux F flows out from solder 95, flux F is blocked by side 201a of protrusion 201.

[0137] The through hole 125 is located between the side surface 201a of the protrusion 201 and the exposed hole 123 in the direction along the upper surface 71a of the base layer 71. In addition, the through hole 125 is located near the end of the side surface 201a in the direction in which the side surface 201a of the protrusion 201 extends.

[0138] As explained above, the protrusions 111 and 201 can be provided in various ways. For example, as in the first embodiment, the protrusion 111 and the side surfaces 111a and 111b can be provided by raising a portion of the cover layer 73 due to the presence of a portion of the conductive layer 72 such as the grounding wiring 91. Alternatively, as in the second embodiment, the protrusion 201 and the side surfaces 201a and 201b can be provided by distributing other components such as the photoresist 200 on the upper surface 73b of the cover layer 73.

[0139] (Third Implementation)

[0140] The following is for reference Figure 8 The third embodiment will be described. Figure 8 This is an illustrative cross-sectional view showing a portion of the first connecting portion 61 in the third embodiment. For example... Figure 8 As shown, the FPC18 of the third embodiment has a bent portion 301 instead of the grounding wiring 91 and the protrusion 111. The bent portion 301 is the bent part in the FPC18.

[0141] In the third embodiment, the reinforcing plate 68 has a bent portion 302. The bent portion 302 is a portion of the reinforcing plate 68 that is bent, for example, by a stamping process. Furthermore, the reinforcing plate 68 has a lower surface 68a, an upper surface 68b, a stepped lower surface 68c, a stepped upper surface 68d, and a slope 68e. The upper surface 68b is an example of a fifth surface. The slope 68e is an example of a second protruding surface.

[0142] The lower surface 68a and the lower step surface 68c are surfaces of the reinforcing plate 68 facing the -Z direction. The lower surface 68a and the lower step surface 68c are configured to be substantially parallel. The lower step surface 68c separates from the lower surface 68a in the Z direction towards the +Z direction.

[0143] The upper surface 68b and the stepped upper surface 68d are surfaces of the reinforcing plate 68 facing the +Z direction. The upper surface 68b and the stepped upper surface 68d face the lower surface 71b of the base layer 71. The upper surface 68b is located on the opposite side of the lower surface 68a. The stepped upper surface 68d is located on the opposite side of the stepped lower surface 68c. The upper surface 68b and the stepped upper surface 68d are configured to be substantially parallel. The stepped upper surface 68d separates from the upper surface 68b in the +Z direction in the Z direction.

[0144] A bending portion 302 is provided between the lower surface 68a and the lower surface 68c of the step, and between the upper surface 68b and the upper surface 68d of the step. That is, the bending portion 302 bends the reinforcing plate 68 into a stepped shape in such a way that it is divided into the lower surface 68a and the lower surface 68c of the step, and into the upper surface 68b and the upper surface 68d of the step. However, the reinforcing plate 68 is not limited to this example.

[0145] An inclined surface 68e is provided in the curved portion 302 and is located between the upper surface 68b and the upper surface 68d of the step. The inclined surface 68e extends obliquely relative to the upper surface 68b and the upper surface 68d of the step between the upper surface 68b and the upper surface 68d of the step. In addition, the inclined surface 68e may extend orthogonally relative to the upper surface 68b and the upper surface 68d of the step.

[0146] The bevel 68e protrudes (rises, bulges) from the upper surface 68b along the bend 302 and faces a direction intersecting the direction in which the upper surface 68b faces. The bend 302 and the bevel 68e are located between pads 81 and 83 and between pads 84 in the direction along the upper surface 71a of the base layer 71.

[0147] The cover layer 73 also has a stepped upper surface 73d and a slope 73e. The slope 73e is an example of a first protruding surface. The stepped upper surface 73d is arranged substantially parallel to the upper surface 73b. The stepped upper surface 73d separates from the upper surface 73b in the Z direction towards the +Z direction. In the third embodiment, the exposed hole 121 opens on the stepped upper surface 73d. On the other hand, the exposed hole 123 opens on the upper surface 73b.

[0148] A bend 301 is provided between the upper surface 73b and the stepped upper surface 73d. That is, the bend 301 bends the FPC18 into a stepped shape by dividing it into the upper surface 73b and the stepped upper surface 73d. However, the FPC18 is not limited to this example.

[0149] An inclined surface 73e is provided in the curved portion 301 and is located between the upper surface 73b and the upper surface 73d of the step. The inclined surface 73e extends obliquely relative to the upper surface 73b and the upper surface 73d of the step between the upper surface 73b and the upper surface 73d of the step. In addition, the inclined surface 73e may extend orthogonally relative to the upper surface 73b and the upper surface 73d of the step.

[0150] The bend 301 of the FPC18 is formed by mounting the FPC18 onto a reinforcing plate 68 having a bend 302. Therefore, the bend 301 of the FPC18 is provided along the bend 302 of the reinforcing plate 68.

[0151] The inclined surface 73e protrudes (rises, bulges) from the upper surface 73b along the bends 301 and 302, and faces a direction intersecting the direction in which the upper surface 73b faces. In other words, the inclined surface 73e protrudes from the upper surface 73b along the inclined surface 68e of the reinforcing plate 68.

[0152] The bend 301 and the bevel 73e are located between pads 81 and 83, and between pads 81 and 84, in the direction along the upper surface 71a of the substrate layer 71. Furthermore, the bend 301 and the bevel 73e are located between the underfill 69 and pads 83, and between the underfill 69 and pads 84. When flux F flows out from solder 95F, flux F is blocked by the bevel 73e.

[0153] In the HDD 10 of the third embodiment described above, the rigidity of the reinforcing plate 68 is higher than that of the base layer 71, and it is mounted on the FPC 18. The reinforcing plate 68 has an upper surface 68b facing the FPC 18 and a slope 68e protruding from the upper surface 68b. The slope 73e protrudes from the upper surface 73b along the slope 68e. For example, by mounting the FPC 18 on the upper surface 68b where the slope 68e is provided, the slope 73e can be provided on the cover layer 73. Therefore, the HDD 10 of this embodiment does not require a special process for providing the slope 73e, and cost increases can be suppressed.

[0154] In the above embodiments, the preamplifier 65 is one example of a component, but the relay connector 66, sensor 67, or other components may also be examples of components. In addition, the protrusions 111, 112, 113 and the through holes 125, 126, 127 are provided in the first connecting portion 61, but they may also be provided in other portions such as the second connecting portion 62.

[0155] In the above description, suppression is defined, for example, as preventing the occurrence of a phenomenon, effect, or influence, or reducing the degree of a phenomenon, effect, or influence. Furthermore, in the above description, restriction is defined, for example, as preventing movement or rotation, or allowing movement or rotation within a specified range and preventing movement or rotation beyond that specified range.

[0156] Several embodiments of the present invention have been described, but these embodiments are provided by way of example and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, and are included in the scope of the invention described in the claims and its equivalents.

Claims

1. A disk device comprising: a magnetic disk; a magnetic head configured to read and write information relative to the magnetic disk; a flexible printed circuit board electrically connected to the magnetic head, and having: a first layer having an insulating first surface; a conductive second layer disposed on the first surface, having a first conductor and a second conductor separated from the first conductor; and an insulating third layer covering at least a portion of the first surface and at least a portion of the second layer, wherein a first hole is provided on the flexible printed circuit board, the first hole being separated from the second layer and penetrating the third layer between the first conductor and the second conductor; a member connected to the first conductor; an underfill disposed between the member and the flexible printed circuit board; and solder, for attaching... The first hole is located between the bottom filler and the solder, and the third layer has a second surface facing the first surface and a third surface on the opposite side of the second surface. A second hole is provided on the third layer, opening on the third surface and exposing the second conductor. The second layer has a grounding wire located between the first conductor and the second conductor, and between the first hole and the bottom filler, and connected to ground. The flexible printed wiring board has a first protruding surface that protrudes from the third surface and is located between the first conductor and the second conductor in the direction along the first surface, and protrudes from the third surface along the grounding wire.

2. The disk device according to claim 1, wherein, The first hole is located near the end of the first protruding surface in the direction in which the first protruding surface extends.

3. The disk device according to claim 1, wherein, The aforementioned disk device also includes a wall, which has a higher rigidity than the first layer and is mounted on the flexible printed wiring board. A third hole is provided in the first layer, which penetrates the first layer and communicates with the first hole. The first layer is located between the third layer and the wall. A fourth hole is provided in the wall, which penetrates the wall and communicates with the third hole.

4. The disk device according to claim 1, wherein, The aforementioned disk device also includes a wall, which has a higher rigidity than the first layer and is mounted on the flexible printed wiring board. The wall has a fifth surface facing the flexible printed wiring board and a second protruding surface protruding from the fifth surface.

5. The disk device according to claim 1, wherein, The first conductor has a first wiring extending along the first surface, the second conductor has a second wiring extending along the first wiring, and the third layer covers the first wiring and the second wiring.

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