Inductor component and mounting configuration of inductor component

Abstract

The present application relates to an inductor component and an inductor component mounting structure. The inductor component includes a base and a coil provided on the base and wound in a spiral shape along an axis. The base includes a substrate having first and second main surfaces facing each other. The coil includes at least one first coil wire provided on the first main surface, at least one second coil wire provided on the second main surface, at least one first through wire provided to pass through the substrate from the first main surface to the second main surface, and at least one second through wire provided to pass through the substrate from the first main surface to the second main surface and arranged on the opposite side of the first through wire with respect to the axis. The first coil wire, the first through wire, the second coil wire, and the second through wire are connected in this order to form at least a portion of the spiral shape. The at least one second coil wire includes a two-end connecting coil wire having a first end connected to the first through wire and a second end connected to the second through wire.

Description

Technical Field

[0001] This invention relates to inductor components and mounting structures for inductor components. Background Technology

[0002] Conventionally, as an inductor component, there exists a technology described in Japanese Patent Application Publication No. 11-251146 (Patent Document 1). The inductor component has a substrate and a coil disposed on the substrate and wound into a spiral shape along an axis.

[0003] Patent Document 1: Japanese Patent Application Publication No. 11-251146

[0004] However, in the existing inductor components described above, the coil is entirely embedded in the substrate. Therefore, to protect the coil from external environmental influences and ensure its reliability, the size of the substrate needs to be increased. As a result, it is difficult to miniaturize the component. Summary of the Invention

[0005] Therefore, the purpose of this disclosure is to provide an inductor component and an inductor component mounting structure that can both reduce the size of the component and ensure the reliability of the coil.

[0006] To address the aforementioned issues, an inductor component according to one embodiment of this disclosure includes: a substrate; and a coil disposed on the substrate and wound into a spiral shape along an axis. The substrate includes a substrate having a first main surface and a second main surface facing each other. The coil includes: at least one first coil wiring disposed on the first main surface; at least one second coil wiring disposed on the second main surface; at least one first through wiring configured to extend through the substrate from the first main surface to the second main surface; and at least one second through wiring configured to extend through the substrate from the first main surface to the second main surface. Furthermore, the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are sequentially connected to the first coil wiring, which is disposed opposite to the first through wiring relative to the aforementioned axis, thereby forming at least a portion of the aforementioned spiral shape. The at least one second coil wiring includes a first end connected to the first through wiring and a second end connected to the second through wiring. The portion of the outer surface of the coil wiring connected to the two ends located opposite to the second main surface is exposed to the outside. The exposed surface of the outer surface contains a corrosion-resistant conductive material.

[0007] According to the above method, the portion of the outer surface of the coil wiring connected at both ends, located on the side opposite to the second main surface, is exposed to the outside. Therefore, compared to covering this portion with an insulating layer, the size of the inductor component in the direction orthogonal to the second main surface can be reduced, thereby enabling miniaturization of the inductor component. Furthermore, since the exposed surface of the outer surface contains a corrosion-resistant conductive material, the corrosion resistance of the second coil wiring is improved even when it has an exposed surface, protecting it from degradation caused by the external environment. As a result, the reliability of the coil can be ensured.

[0008] Preferably, in one embodiment of the inductor component, an external electrode is further provided, which is disposed on the substrate and electrically connected to the coil, wherein the corrosion-resistant conductive material is the same as the conductive material constituting the outer surface of the external electrode.

[0009] According to the above embodiment, since the corrosion-resistant conductive material is the same as the conductive material constituting the outer surface of the external electrode, at least a portion of the second coil wiring can be formed simultaneously during the manufacture of the external electrode, making the manufacture of the second coil wiring easy. Furthermore, because the corrosion-resistant conductive material is the same as the conductive material constituting the outer surface of the external electrode, stability relative to the external environment can be ensured.

[0010] Preferably, in one embodiment of the inductor component, the external electrode is disposed on the first main surface of the substrate.

[0011] According to the above embodiment, the external electrode is disposed on the first main surface of the substrate, thus the external electrode can be easily manufactured.

[0012] Preferably, in one embodiment of the inductor component, the aforementioned corrosion-resistant conductive material is Au, Ti, Ti alloy, Al, or Al alloy.

[0013] According to the above-described embodiments, the corrosion resistance of the coil wiring connected at both ends can be improved.

[0014] Preferably, in one embodiment of the inductor component, the first coil wiring includes one or more conductive layers, the two-end connected coil wiring includes two or more conductive layers, and the number of conductive layers in the two-end connected coil wiring is greater than the number of conductive layers in the first coil wiring.

[0015] According to the above embodiment, the number of conductive layers in the first coil wiring is reduced, thus making it easy to manufacture the first coil wiring.

[0016] Preferably, in one embodiment of the inductor component, an insulating layer is disposed on the first main surface, and no insulating layer is disposed on the second coil wiring.

[0017] According to the above embodiment, no insulating layer is provided on the second coil wiring, thus enabling miniaturization of the inductor component.

[0018] Preferably, in one embodiment of the inductor component, the conductive material that is the main component of the first coil wiring and the conductive material that is the main component of the second coil wiring are the same as the conductive material of at least one of the first through wiring and the second through wiring.

[0019] Here, the principal component of the coil wiring refers to the conductive material that occupies the largest area in the cross section orthogonal to the extension direction of the coil wiring.

[0020] According to the above embodiments, the overall linear expansion coefficient of the coil can be made uniform, thus suppressing coil damage caused by expansion differences between wirings.

[0021] Preferably, in one embodiment of the inductor component, an external electrode is further provided, which is disposed on the first main surface and electrically connected to the coil, wherein the wiring of the first coil is covered by an insulating layer.

[0022] According to the above embodiment, when the external electrode is provided on the first main surface, the insulation between the first coil wiring and the external electrode can also be ensured.

[0023] Preferably, in one embodiment of the inductor component, the second coil wiring includes: a main body portion made of the same conductive material as the first coil wiring; and a covering layer covering the main body portion and containing the corrosion-resistant conductive material, wherein the line width of the main body portion is smaller than the line width of the first coil wiring.

[0024] Here, the linewidth of the first coil wiring refers to the length of the first coil wiring in a cross-section orthogonal to the extension direction of the first coil wiring, in the direction parallel to the first main surface. The linewidth of the main body refers to the length of the main body in a cross-section orthogonal to the extension direction of the second coil wiring, in the direction parallel to the second main surface.

[0025] According to the above implementation method, the risk of short circuit in the second coil wiring can be reduced.

[0026] Preferably, in one embodiment of the inductor component, the second coil wiring includes: a main body made of the same conductive material as the first coil wiring; and a covering layer covering the main body and containing the corrosion-resistant conductive material, wherein the thickness of the main body is smaller than the thickness of the first coil wiring.

[0027] Here, the thickness of the first coil wiring refers to the length of the first coil wiring in a cross-section orthogonal to the extension direction of the first coil wiring, in a direction orthogonal to the first main surface. The thickness of the main body refers to the length of the main body in a cross-section orthogonal to the extension direction of the second coil wiring, in a direction orthogonal to the second main surface.

[0028] According to the above embodiments, the size of the inductor component in the direction orthogonal to the second main surface can be further reduced, thereby enabling further miniaturization of the inductor component.

[0029] Preferably, in one embodiment of the inductor component, at least a portion of the covering layer covers the outer surfaces of both sides of the main body in the width direction. When the line width of the second coil wiring is set to W1, the line width of the main body is set to W21, the width of the covering layer covering one side of the outer surface of the main body in the width direction is set to W221, and the width of the covering layer covering the other side of the outer surface of the main body in the width direction is set to W222, W1 > W21 > W221 + W222 is satisfied.

[0030] Here, "width direction" refers to the direction parallel to the second main surface in a cross-section orthogonal to the extension direction of the second coil wiring. "Width of the covering layer on one side of the outer surface of the main body in the width direction" refers to the length of the covering layer on one side of the outer surface of the main body in the width direction, in a cross-section orthogonal to the extension direction of the second coil wiring, in a direction parallel to the second main surface. Similarly, "width of the covering layer on the other side of the outer surface of the main body in the width direction" refers to the length of the covering layer on the other side of the outer surface of the main body in the width direction, in a cross-section orthogonal to the extension direction of the second coil wiring, in a direction parallel to the second main surface.

[0031] According to the above embodiment, since "W1 > W21" is satisfied, the risk of short circuit in the second coil wiring can be reduced. Furthermore, since "W21 > W221 + W222" is satisfied, the proportion occupied by the main body in the second coil wiring increases. When a low-resistivity material is used as the conductive material for the first coil wiring, the resistivity of the main body, which is made of the same conductive material as the first coil wiring, is also reduced. Therefore, the resistance of the second coil wiring can be reduced.

[0032] Preferably, in one embodiment of the inductor component, when the thickness of the second coil wiring is set to T1, the thickness of the main body is set to T21, and the thickness of the covering layer in the direction orthogonal to the second main surface is set to T22, T1 > T21 > 2 × T22 is satisfied.

[0033] Here, "thickness of the covering layer in the direction orthogonal to the second principal plane" refers to the thickness of the portion of the covering layer that overlaps with the main body when viewed from the direction orthogonal to the second principal plane.

[0034] According to the above embodiment, since "T1 > T21" is satisfied, the size of the inductor component in the direction orthogonal to the second main plane can be further reduced, thereby enabling further miniaturization of the inductor component. Furthermore, since "T21 > 2 × T22" is satisfied, short circuits between the second coil wirings can be suppressed.

[0035] Preferably, in one embodiment of the inductor component, there are multiple second coil wirings, and an insulating layer is provided between adjacent second coil wirings.

[0036] According to the above implementation method, insulation between adjacent second coil wirings can be ensured.

[0037] Preferably, in one embodiment of the inductor component, there are multiple first coil wirings, second coil wirings, first through wirings, and second through wirings, with the spacing between adjacent first through wirings being 10μm or more and 150μm or less, and the spacing between adjacent second through wirings being 10μm or more and 150μm or less.

[0038] According to the above embodiment, the spacing of the first through-wire is 10 μm or more, and the spacing of the second through-wire is 10 μm or more, thus suppressing short circuits between adjacent first coil wires, adjacent second coil wires, adjacent first through-wires, and adjacent second through-wires. Furthermore, the spacing of the first through-wire is 150 μm or less, and the spacing of the second through-wire is 150 μm or less, thus shortening the coil length and improving the inductance efficiency.

[0039] An inductor component according to one aspect of this disclosure includes: a substrate; a coil disposed on the substrate and wound into a spiral shape along an axis; and an external electrode disposed on the substrate and electrically connected to the coil. The substrate includes a substrate having a first main surface and a second main surface facing each other. The coil includes: at least one first coil wiring disposed on the first main surface; at least one second coil wiring disposed on the second main surface; at least one first through wiring configured to penetrate the substrate from the first main surface to the second main surface; and at least one second through wiring configured to penetrate the substrate from the first main surface to the second main surface. The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are sequentially connected to form at least a portion of the spiral shape relative to the aforementioned axis. The at least one second coil wiring includes a first end connected to the first through wiring and a second end connected to the second through wiring. The portion of the outer surface of the coil wiring connected to the two ends located on the opposite side of the second main surface is exposed to the outside. The conductive material of the exposed surface that forms the outside is the same as the conductive material of the outer surface that forms at least a portion of the outer surface of the external electrode.

[0040] The portion of the outer surface of the coil wiring connected at both ends, located on the side opposite to the second main surface, is exposed to the outside. Therefore, compared to covering this portion with an insulating layer, the size of the inductor component in the direction orthogonal to the second main surface can be reduced, thereby enabling miniaturization of the inductor component. Furthermore, the conductive material of the exposed surface constituting the outer surface is the same as the conductive material of the outer surface constituting the external electrode. Therefore, even when the second coil wiring has an exposed surface, the second coil wiring can be made as resistant to the external environment as the external electrode, protecting the second coil wiring from degradation caused by the external environment. As a result, the reliability of the inductor component can be ensured.

[0041] Preferably, in one embodiment of the mounting structure of the inductor component, it includes: a mounting substrate; and the inductor component, which is mounted on the mounting surface of the mounting substrate, wherein the axis of the coil is orthogonal to the mounting surface.

[0042] According to the above embodiment, the axis of the coil is orthogonal to the mounting surface, so the magnetic flux of the inductor component will not affect other inductor components adjacent to it, thus increasing the freedom of the mounting layout.

[0043] Preferably, in one embodiment of the mounting structure of the inductor component, it includes: a mounting substrate; and the inductor component, which is mounted on the mounting surface of the mounting substrate, wherein the axis of the coil is parallel to the mounting surface.

[0044] According to the above embodiment, the axis of the coil is parallel to the mounting surface, so the magnetic flux of the inductor component is not affected by the wiring portion of the mounting substrate, and the reduction in inductance efficiency can be suppressed.

[0045] Preferably, in one embodiment of the mounting structure of the inductor component, the substrate has a length, a width, and a height, and the inductor component is disposed on the mounting surface such that the direction of the shortest dimension among the length, width, and height of the substrate is orthogonal to the mounting surface.

[0046] According to the above embodiments, the direction of the shortest dimension among the length, width, and height of the substrate is called the thickness direction, which can make the thickness of the inductor component thinner.

[0047] Preferably, in one embodiment of the mounting structure of the inductor component, the substrate has a length, a width, and a height, and the inductor component is disposed on the mounting surface such that the direction of the longest dimension among the length, width, and height of the substrate is orthogonal to the mounting surface.

[0048] According to the above embodiments, the direction of the shorter dimension among the length, width and height of the substrate determines the mounting surface of the inductor component, which can reduce the mounting area of ​​the inductor component.

[0049] According to the inductor component and the mounting structure of the inductor component as one aspect of this disclosure, both the component size can be miniaturized and the reliability of the coil can be ensured. Attached Figure Description

[0050] Figure 1 This is a schematic perspective view of the inductor component from the bottom side.

[0051] Figure 2 This is a schematic bottom view of the inductor component viewed from the bottom side.

[0052] Figure 3 yes Figure 2 AA sectional view.

[0053] Figure 4 yes Figure 3 An enlarged view of region A.

[0054] Figure 5A This is a schematic cross-sectional view illustrating the manufacturing method of an inductor component.

[0055] Figure 5BThis is a schematic cross-sectional view illustrating the manufacturing method of an inductor component.

[0056] Figure 5C This is a schematic cross-sectional view illustrating the manufacturing method of an inductor component.

[0057] Figure 5D This is a schematic cross-sectional view illustrating the manufacturing method of an inductor component.

[0058] Figure 5E This is a schematic cross-sectional view illustrating the manufacturing method of an inductor component.

[0059] Figure 5F This is a schematic cross-sectional view illustrating the manufacturing method of an inductor component.

[0060] Figure 5G This is a schematic cross-sectional view illustrating the manufacturing method of an inductor component.

[0061] Figure 6 This is a schematic bottom view showing a modified example of an inductor component, viewed from the bottom side.

[0062] Figure 7 This is a schematic diagram showing the mounting structure of an inductor component.

[0063] Figure 8 This is a schematic diagram showing a modified example of the mounting structure of an inductor component.

[0064] Figure 9 This is a schematic perspective view of the fourth embodiment of the inductor component, viewed from the bottom side.

[0065] Figure 10 yes Figure 9 BB cross-sectional view.

[0066] Figure 11 This is a schematic perspective view of the fifth embodiment of the inductor component, viewed from the bottom side.

[0067] Figure 12 This is a schematic bottom view of the inductor component viewed from the bottom side.

[0068] Figure 13 yes Figure 12 CC section view.

[0069] Explanation of reference numerals in the attached figures

[0070] 1…Inductor component; 5…Mounting substrate; 10…Substrate; 11b…Bottom surface wiring (first coil wiring); 11t…Top surface wiring (second coil wiring); 13…First through wiring; 13b…End face; 14…Second through wiring; 14b…End face; 21…Substrate; 21b…Bottom surface (first main surface); 21t…Top surface (second main surface); 22…Insulating layer; 50…Mounting surface; 51…Wiring section; 100…Outer surface; 100b…Bottom surface; 100t…Top surface; 100s1…First side surface; 100s2…Second side surface; 100e1…First end face; 100e2…Second end face; 110…Coil; 111t…Main body; 112t …Covering layer; 121…First external electrode; 121b…First bottom surface portion; 121e…First end surface portion; 121e1…First part; 121e2…Second part; 121e3…Third part; 122…Second external electrode; 122b…Second bottom surface portion; 122e…Second end surface portion; 122e1…First part; 122e2…Second part; 122e3…Third part; AX…Axis; DW…Connecting coil wiring at both ends; e1…First end; e2…Second end; L13, L14…Distance between through wirings; P13, P14…Spacing of through wirings; V…Through hole; θ…Angle formed by bottom wiring and top wiring. Detailed Implementation

[0071] Hereinafter, an inductor component and its mounting structure, which are embodiments of the present disclosure, will be described in detail with reference to the illustrated embodiments. Furthermore, the accompanying drawings contain some schematic components and may not reflect actual dimensions or proportions.

[0072] <First Implementation>

[0073] The inductor component 1 according to the first embodiment will be described below. Figure 1 This is a schematic perspective view of the inductor component 1 as seen from the bottom side. Figure 2 This is a schematic bottom view of the inductor component 1 as seen from the bottom side. Figure 3 yes Figure 2 AA section view. Furthermore, in Figure 2 For convenience, the insulating layer of the substrate is omitted and depicted, and a portion of the external electrode (bottom surface) is depicted with a double-dotted line.

[0074] 1. Overview Structure

[0075] The general structure of inductor component 1 will be described. Inductor component 1 is, for example, a surface-mount type inductor component used in high-frequency signal transmission circuits. Figures 1-3As shown, the inductor component 1 includes: a base 10; a coil 110 disposed on the base 10 and wound into a spiral shape along the axis AX; and a first external electrode 121 and a second external electrode 122 disposed on the base 10 and electrically connected to the coil 110. The axis AX of the coil 110 is a straight line passing through the center of the inner diameter portion of the coil 110.

[0076] The substrate 10 has a length, a width, and a height. The substrate 10 has a first end face 100e1 and a second end face 100e2 located at both ends in the length direction, a first side face 100s1 and a second side face 100s2 located at both ends in the width direction, and a bottom surface 100b and a top surface 100t located at both ends in the height direction. That is, the outer surface 100 of the substrate 10 includes the first end face 100e1 and the second end face 100e2, the first side face 100s1 and the second side face 100s2, and the bottom surface 100b and the top surface 100t.

[0077] Furthermore, as shown in the attached figures, for ease of explanation, the length direction (long side direction) of the base 10, i.e., the direction from the first end face 100e1 to the second end face 100e2, is designated as the X direction. The width direction of the base 10, i.e., the direction from the first side face 100s1 to the second side face 100s2, is designated as the Y direction. The height direction of the base 10, i.e., the direction from the bottom face 100b to the top face 100t, is designated as the Z direction. The X, Y, and Z directions are orthogonal to each other, and when arranged in the order X, Y, Z, they form a right-handed system.

[0078] In this specification, the term "outer surface 100 of the substrate," comprising the first end face 100e1, the second end face 100e2, the first side face 100s1, the second side face 100s2, the bottom surface 100b, and the top surface 100t, does not refer only to the surface facing the outer periphery of the substrate 10, but rather to the surface that forms the boundary between the outer and inner sides of the substrate 10. Furthermore, "above the outer surface 100 of the substrate 10" is not an absolute direction such as vertically upward as defined by the direction of gravity, but rather refers to the direction relative to the outer surface 100, pointing towards the outer side of the boundary between the outer and inner sides. Therefore, "above the outer surface 100" refers to a relative direction determined by the orientation of the outer surface 100. Additionally, "above" relative to a certain element includes not only the position above that element (separated from it, i.e., the position above that element separated from other objects, or the position above an open gap), but also the position directly above (on) that is in contact with that element.

[0079] The substrate 10 includes a substrate 21 and an insulating layer 22 disposed on the substrate 21. The substrate 21 has a bottom surface 21b and a top surface 21t that are opposite to each other in the Z direction. The insulating layer 22 is disposed on the bottom surface 21b of the substrate 21. The bottom surface 21b corresponds to an example of the "first main surface" described in the technical solution, and the top surface 21t corresponds to an example of the "second main surface" described in the technical solution.

[0080] The axis AX of coil 110 is arranged parallel to the direction of the shorter dimension among the length, width, and height of base 10. Here, in base 10, the dimensions decrease in the order of length (dimension in the X direction), height (dimension in the Z direction), and width (dimension in the Y direction). Since the length, width, and height are all different, the shorter dimension refers to any one of the two dimensions (height and width) other than the longest dimension (length). In this embodiment, the shorter dimension is the width, and the axis AX of coil 110 is arranged parallel to the width direction of base 10.

[0081] The coil 110 includes: a plurality of bottom surface wirings 11b disposed on the bottom surface 21b and covered by an insulating layer 22; a plurality of top surface wirings 11t disposed on the top surface 21t; a plurality of first through wirings 13 configured to extend from the bottom surface 21b to the top surface 21t through the substrate 21 and arranged along the axis AX; and a plurality of second through wirings 14 configured to extend from the bottom surface 21b to the top surface 21t through the substrate 21 and disposed on the opposite side of the first through wirings 13 relative to the axis AX and arranged along the axis AX.

[0082] The bottom surface wiring 11b corresponds to an example of the "first coil wiring" described in the technical solution, and the top surface wiring 11t corresponds to an example of the "second coil wiring" described in the technical solution. The bottom surface wiring 11b, the first through wiring 13, the top surface wiring 11t, and the second through wiring 14 are connected in sequence to form at least a portion of a spiral shape.

[0083] The top surface wiring 11t includes a two-end connected coil wiring DW. The two-end connected coil wiring DW is a wiring in the top surface wiring 11t where the first end e1 is connected to the first through wiring 13, and the second end e2 is connected to the second through wiring 14. Therefore, the top surface wiring 11t, for example, where the first end e1 is directly connected to the first external electrode 121 and also functions as a lead-out wiring to the first external electrode 121, is not included in the two-end connected coil wiring DW. In this embodiment, all top surface wiring 11t are two-end connected coil wiring DWs.

[0084] For the two-end connected coil wiring DW, at least a portion of the outer surface of the two-end connected coil wiring DW located on the side opposite to the top surface 21t is exposed to the outside, and the exposed surface contains a corrosion-resistant conductive material. This exposed surface may be composed of a portion of the corrosion-resistant conductive material, or it may be composed entirely of the corrosion-resistant conductive material. From the viewpoint of further improving the corrosion resistance of the two-end connected coil wiring DW, it is preferable that the entire exposed surface is composed of a corrosion-resistant conductive material. Furthermore, this exposed surface preferably contains a conductive material with higher corrosion resistance than the conductive material constituting the bottom surface wiring 11b. Therefore, the corrosion resistance of the two-end connected coil wiring DW (top surface wiring 11t) is improved compared to the bottom surface wiring 11b, thereby improving the reliability of the coil 110.

[0085] According to the above structure, the portion of the outer surface of the coil wiring DW connected at both ends, located on the side opposite to the top surface 21t, is exposed to the outside. Therefore, compared to covering this portion with an insulating layer, the size of the inductor component 1 in the direction orthogonal to the top surface 21t (Z direction) can be reduced, thereby enabling miniaturization of the inductor component 1. Furthermore, the exposed surface of the outer surface contains a corrosion-resistant conductive material. Therefore, even when the coil wiring DW connected at both ends has an exposed surface, the corrosion resistance of the coil wiring DW can be improved, protecting it from degradation caused by the external environment. As a result, the reliability of the coil 110 can be ensured.

[0086] The first external electrode 121 is disposed on the bottom surface 100b and the first end surface 100e1 of the substrate 10. Specifically, a portion of the first external electrode 121 is disposed above the bottom surface wiring 11b and is disposed on the insulating layer 22 in a manner separate from the bottom surface wiring 11b, while the other portion of the first external electrode 121 is embedded in the first end surface 100e1 in a manner that exposes it from the first end surface 100e1.

[0087] The second external electrode 122 is disposed on the bottom surface 100b and the second end surface 100e2 of the substrate 10. Specifically, a portion of the second external electrode 122 is disposed above the bottom surface wiring 11b and is disposed on the insulating layer 22 in a manner separate from the bottom surface wiring 11b, while the other portion of the second external electrode 122 is embedded in the second end surface 100e2 in a manner that exposes it from the second end surface 100e2.

[0088] 2. Structure of each part

[0089] (Inductor component 1)

[0090] The volume of inductor component 1 is preferably 0.08 mm. 3Furthermore, the length of the long side of the inductor component 1 is 0.65 mm or less. The length of the long side of the inductor component 1 refers to the maximum value among its length, width, and height; in this embodiment, it refers to the length in the X direction. Based on the above structure, the inductor component 1 has a small volume and a short long side, thus reducing its weight. Therefore, even with small external electrodes 121 and 122, the required mounting strength can be achieved.

[0091] Specifically, the dimensions (length (X direction) × width (Y direction) × height (Z direction)) of inductor component 1 are 0.6mm × 0.3mm × 0.3mm, 0.4mm × 0.2mm × 0.2mm, 0.25mm × 0.125mm × 0.120mm, etc. Alternatively, the width and height can be different, for example, 0.4mm × 0.2mm × 0.3mm, etc.

[0092] (Matrix 10)

[0093] The substrate 10 includes: a substrate 21 having a bottom surface 21b and a top surface 21t located at both ends in the Z direction; and an insulating layer 22 covering the bottom surface 21b of the substrate 21. Thus, the insulating layer 22 covers the bottom surface wiring 11b, thereby protecting the bottom surface wiring 11b from the effects of solder and environmental stress during installation. Furthermore, by improving the insulation of the insulating layer 22 compared to the substrate 21, eddy currents can be suppressed, and the Q value can be improved.

[0094] The substrate 21 is preferably made of glass, which has high insulation properties, thus suppressing eddy currents and improving the Q value. Preferably, the substrate 21 contains Si, which provides high thermal stability, thereby suppressing changes in the dimensions of the substrate 10 caused by heat and reducing deviations in electrical characteristics.

[0095] The substrate 21 is preferably a single-layer glass plate. This ensures the strength of the substrate 10. In addition, with a single-layer glass plate, the dielectric loss is low, thus improving the Q value at high frequencies. Furthermore, since there is no sintering process like that of a sintered body, deformation of the substrate 10 during sintering can be suppressed, thereby suppressing pattern deviations and providing an inductor component with small inductance tolerances.

[0096] From a manufacturing method perspective, photosensitive glass, such as Foturan II (a registered trademark of Schott AG), is preferred as a material for single-layer glass sheets. In particular, single-layer glass sheets preferably contain cerium oxide (cerium dioxide: CeO2), in which case cerium oxide acts as a sensitizer, making photolithography easier.

[0097] However, since single-layer glass sheets can be processed through machining such as drilling and sandblasting, dry / wet etching using photoresists and metal masks, and laser processing, they can also be non-photosensitive glass sheets. Furthermore, single-layer glass sheets can be formed by sintering glass paste or by known methods such as the float glass process.

[0098] A single-layer glass plate is a single-layer plate-like member that is integrated within the glass body and does not incorporate wiring (part of coil 110). In particular, the single-layer glass plate has an outer surface that serves as the boundary between the outer and inner sides of the glass body. The through-hole V formed in the single-layer glass plate is also the boundary between the outer and inner sides of the glass body and is therefore included in the outer surface 100 of the substrate 10.

[0099] Single-layer glass is essentially amorphous, but it can also have crystalline portions. For example, in the case of Foturan II described above, the dielectric constant of the amorphous glass is 6.4, while by crystallizing it, the dielectric constant can be reduced to 5.8. This reduces stray capacitance between conductors (wires) near the crystalline portions.

[0100] The insulating layer 22 is a component that protects the wiring from external forces by covering the wiring (bottom wiring 11b), preventing damage to the wiring and improving the insulation of the wiring. The insulating layer 22 is preferably an inorganic film such as silicon, hafnium oxide, nitride, or oxynitride, which has excellent insulation and thin-film properties. However, the insulating layer 22 can also be a resin film such as epoxy or polyimide, which is easier to form. In particular, the insulating layer 22 is preferably made of a material with a low dielectric constant, thereby reducing the stray capacitance formed between the coil 110 and the external electrodes 121 and 122 when the insulating layer 22 is present between the coil 110 and the external electrodes 121 and 122.

[0101] The insulating layer 22 can be formed, for example, by laminating a resin film such as ABF GX-92 (manufactured by Ajinomoto Fine Chemicals Co., Ltd.), or by applying a paste-like resin and then heat-curing it.

[0102] Preferably, the thickness of the insulating layer 22 is less than one-third of the thickness of the substrate 21, and the dielectric constant of the insulating layer 22 is less than that of the substrate 21. Thickness refers to the maximum value of the dimension in the direction orthogonal to the bottom surface 21b. Therefore, by reducing the thickness of the insulating layer 22, the inductor component 1 can be miniaturized. Furthermore, even with the reduced thickness of the insulating layer 22, the distance between the first external electrode 121, the second external electrode 122, and the bottom surface wiring 11b is shortened. Since the dielectric constant of the insulating layer 22 is smaller than that of the substrate 21, the parasitic capacitance between the first external electrode 121, the second external electrode 122, and the bottom surface wiring 11b can be reduced, thereby improving the Q value.

[0103] Furthermore, the substrate 10 may also include a sintered body, meaning the substrate 21 may also be a sintered body, which ensures the strength of the substrate 10. In addition, by using ferrite or the like in the sintered body, the efficiency of inductance can be improved.

[0104] The substrate 10 may also include an insulating film covering a portion of the insulating layer 22 on the bottom surface 21b side. That is, the insulating film is located at least between the first external electrode 121 and the second external electrode 122 disposed on the insulating layer 22, which can more reliably prevent short circuits between the first external electrode 121 and the second external electrode 122. The material of the insulating film is, for example, the same material as the insulating layer 22.

[0105] (Coil 110)

[0106] The coil 110 includes: a bottom surface wiring 11b disposed above the bottom surface 21b of the substrate 21 and covered by an insulating layer 22; a top surface wiring 11t disposed above the top surface 21t of the substrate 21; and a pair of through wirings 13 and 14 extending through the substrate 21 to the bottom surface 21b and the top surface 21t, and disposed on opposite sides of each other relative to the axis AX. The bottom surface wiring 11b, the first through wiring 13, the top surface wiring 11t, and the second through wiring 14 are sequentially connected to form at least a portion of the coil 110 wound along the axis AX.

[0107] According to the above structure, the coil 110 is a so-called spiral-shaped coil 110. Therefore, in the cross section orthogonal to the axis AX, the area where the bottom surface wiring 11b, the top surface wiring 11t, and the through wirings 13 and 14 are parallel along the winding direction of the coil 110 can be reduced, and the stray capacitance in the coil 110 can be reduced.

[0108] Here, a spiral shape refers to a shape where the total number of turns of the coil is greater than one, but the number of turns of the coil in a cross-section orthogonal to the axis is less than one. Regarding the number of turns of the coil in a cross-section orthogonal to the axis, "more than one turn" means that in a cross-section orthogonal to the axis, the coil wiring has portions that are radially adjacent and parallel in the winding direction when viewed from the axial direction; "less than one turn" means that in a cross-section orthogonal to the axis, the coil wiring does not have portions that are radially adjacent and parallel in the winding direction when viewed from the axial direction. Furthermore, the parallel portions of the wiring include not only extensions extending along the winding direction of the wiring, but also pad portions connected to the ends of the extensions and having a width greater than the width of the extensions.

[0109] The axis AX of coil 110 is arranged parallel to the direction of the width, which is the shortest dimension among the length, width, and height of the base 10. This allows for a further increase in the inner diameter of coil 110, thereby further improving the efficiency of inductance.

[0110] Preferred options Figure 2 As shown, on the bottom surface 21b, the line (dotted line) connecting the centroids of the end faces 13b of the plurality of first through-wires 13 is parallel to the axis AX of the coil 110, and the line (dotted line) connecting the centroids of the end faces 14b of the plurality of second through-wires 14 is parallel to the axis AX of the coil 110. This allows the inner diameter of the coil to increase constantly along the axial direction, further improving the efficiency of inductance. More preferably, on the top surface 21t, the line connecting the centroids of the end faces 13t of the plurality of first through-wires 13 is parallel to the axis AX of the coil 110, and the line connecting the centroids of the end faces 14t of the plurality of second through-wires 14 is parallel to the axis AX of the coil 110.

[0111] The bottom surface wiring 11b extends in only one direction. Specifically, the bottom surface wiring 11b is slightly inclined in the Y direction and extends in the X direction. Multiple bottom surface wirings 11b are arranged parallel to each other along the Y direction. Here, in the photolithography process, if deformable illumination such as ring illumination or dipole illumination is used, the pattern resolution in a specific direction can be improved, and finer patterns can be formed. Based on the above structure, since the bottom surface wiring 11b extends in only one direction, fine bottom surface wirings 11b can be formed by using deformable illumination, for example, in the photolithography process, enabling miniaturization of the inductor component 1. Specifically, when the bottom surface wiring 11b extends in only one direction, the lines of the bottom surface wiring 11b are orthogonal to that direction. Therefore, by improving the pattern resolution in this orthogonal direction, the formation accuracy between the lines of the bottom surface wiring 11b can be improved compared to normal.

[0112] The top surface wiring 11t extends in only one direction. Specifically, the top surface wiring 11t has a shape that extends along the X direction. Multiple top surface wirings 11t are arranged along the Y direction and configured parallel to each other. According to the above structure, the top surface wiring 11t extends in only one direction, so by using, for example, deformable illumination in the photolithography process, fine top surface wirings 11t can be formed, enabling miniaturization of the inductor component 1.

[0113] As described above, in this embodiment, all top surface wiring 11t consists of two-end connected coil wiring DW, with the first end e1 connected to the first through wiring 13 and the second end e2 connected to the second through wiring 14. The portion of the outer surface of the two-end connected coil wiring DW located on the side opposite to the top surface 21t is exposed to the outside, and the exposed surface of the outer surface contains a corrosion-resistant conductive material.

[0114] like Figure 3As shown, each end-connected coil wiring DW includes a main body 111t and a covering layer 112t that covers the main body 111t. The main body 111t is disposed on the top surface 21t and extends along the X direction. The shape of the main body 111t is not particularly limited. In this embodiment, the main body 111t is rectangular in a cross-section orthogonal to the X direction. The conductive material of the main body 111t is preferably the same as that of the bottom surface wiring 11b. Therefore, the main body 111t can be manufactured when manufacturing the bottom surface wiring 11b, which simplifies the manufacturing process. The conductive material of the main body 111t is, for example, copper.

[0115] The cladding layer 112t covers the entire outer surface of the main body 111t, excluding the outer surface of the top surface 21t. The cladding layer 112t contains a corrosion-resistant conductive material. "Corrosion-resistant" means that the metal is not easily degraded, i.e., it is not easily rusted. This "corrosion resistance" includes not only the situation where oxidation is not easily caused due to a low ionization tendency, but also the situation where a passive coating is formed by the combination of the metal surface and oxygen to inhibit further corrosion. Corrosion-resistant conductive materials include, for example, Au, Pt, Ag, or their alloys, which have low ionization tendencies, or Ti, Al, Cr, Ta, or their alloys, Ni alloys, etc., which form a passive coating. This improves the corrosion resistance of the coil wiring DW connected at both ends. In this embodiment, the conductive material constituting the cladding layer 112t is the same as the conductive material constituting the first external electrode 121 and the second external electrode 122. Therefore, even when the two-end connecting coil wiring DW has an exposed surface, the two-end connecting coil wiring DW can be made to have the same resistance to the external environment as the first external electrode 121 and the second external electrode 122, protecting the two-end connecting coil wiring DW from degradation caused by the external environment. As a result, the reliability of the inductor component 1 can be ensured. In addition, when manufacturing the first external electrode 121 and the second external electrode 122, at least a portion of the two-end connecting coil wiring DW (top surface wiring 11t) can be formed simultaneously, making it easy to manufacture the two-end connecting coil wiring DW. With the above structure, the entire outer surface of the two-end connecting coil wiring DW, except for the outer surface on the top surface 21t side, becomes an exposed surface, which contains a corrosion-resistant conductive material.

[0116] Alternatively, the entire cladding layer 112t may be made of a corrosion-resistant conductive material. This effectively improves the corrosion resistance of the coil wiring DW connected at both ends. Furthermore, the cladding layer 112t may also be composed of multiple layers. In this case, it is preferable that each layer contains a corrosion-resistant conductive material. However, to ensure the corrosion resistance of the coil wiring DW connected at both ends, at least the outermost layer must contain a corrosion-resistant conductive material. Examples of multiple layers include Ni / Au.

[0117] A first through-wire 13 is disposed within the through-hole V of the substrate 10, positioned relative to the axis AX on the first end face 100e1 side. A second through-wire 14 is disposed within the through-hole V of the substrate 10, positioned relative to the axis AX on the second end face 100e2 side. The first through-wire 13 and the second through-wire 14 extend in directions orthogonal to the bottom surface 21b and the top surface 21t (bottom surface 100b and top surface 100t), respectively. This shortens the lengths of the first through-wire 13 and the second through-wire 14, thereby suppressing the DC resistance (Rdc). Multiple first through-wires 13 and multiple second through-wires 14 are arranged parallel to each other along the Y direction.

[0118] The main body 111t of the bottom surface wiring 11b and the top surface wiring 11t is made of a good conductor material such as copper, silver, gold, or their alloys. The main body 111t of the bottom surface wiring 11b and the top surface wiring 11t can be a metal film formed by plating, vapor deposition, sputtering, etc., or it can be a sintered metal body formed by applying conductive paste and then sintering. Alternatively, the main body 111t of the bottom surface wiring 11b and the top surface wiring 11t can also be a multilayer structure with multiple metal layers stacked. The thickness of the main body 111t of the bottom surface wiring 11b and the top surface wiring 11t is preferably 5 μm or more and 50 μm or less.

[0119] The first through-wire 13 and the second through-wire 14 can be formed in the through-hole V pre-formed in the substrate 10 using the materials and manufacturing methods exemplified by the bottom surface wiring 11b and the top surface wiring 11t. Preferably, at least one of the first through-wire 13 and the second through-wire 14 is composed of multiple conductive layers. Thus, the type of conductive layer can be selected, and through-wires corresponding to the application can be formed. For example, through-wires 13 and 14 can be formed by combining conductive layers such as TiN or Ti, Ni, which have high barrier properties and closeness but low conductivity, with conductive layers such as Cu, Ag, which have high conductivity. In addition, through-wires 13 and 14 with low cost and low Rdc can be formed by filling the voids after isotropic conformal plating using a printing method with conductive paste containing Cu or Ag filler. Furthermore, in order to alleviate stress, voids can also exist in a portion of the through-wires 13 and 14.

[0120] Preferably, the main body 111t of the bottom wiring 11b, the top wiring 11t, the first through wiring 13, and the second through wiring 14 are primarily composed of copper. Therefore, by using inexpensive and highly conductive copper as the wiring material, the mass production capability of the inductor component 1 can be improved, and the Q value can be increased.

[0121] Preferred options Figure 2As shown, when viewed from a direction orthogonal to the bottom surface 21b, the first end of the bottom surface wiring 11b overlaps with the first end e1 of the top surface wiring 11t, and the angle θ between the bottom surface wiring 11b and the top surface wiring 11t is more than 5 degrees and less than 45 degrees. Angle θ refers to the angle between the center line (dotted line) of the width of the bottom surface wiring 11b and the center line (dotted line) of the width of the top surface wiring 11t when viewed from a direction orthogonal to the bottom surface 21b.

[0122] According to the above structure, when the angle θ is 45 degrees or less, the coil 110 is tightly wound, thus increasing the inductance. Furthermore, when the angle θ is 5 degrees or more, it ensures proper spacing between adjacent bottom surface wirings 11b, adjacent top surface wirings 11t, adjacent first through wirings 13, or adjacent second through wirings 14, reducing the occurrence of short circuits. Moreover, it is acceptable for the angle θ to be 5 degrees or more and 45 degrees or less in at least one group of bottom surface wirings 11b and top surface wirings 11t; preferably, the angle θ to be 5 degrees or more and 45 degrees or less in all groups of bottom surface wirings 11b and top surface wirings 11t.

[0123] Preferred options Figure 2 As shown, the number of first through-wires 13 is the same as the number of second through-wires 14. When viewed from a direction orthogonal to the bottom surface 21b, the first through-wires 13 and the second through-wires 14 are linearly symmetrical with respect to the axis AX of the coil 110. In this embodiment, the number of first through-wires 13 and the number of second through-wires 14 are four each.

[0124] According to the above structure, when the number of the first through wiring 13 and the second through wiring 14 is the same, compared with the case where they are asymmetrical with respect to the axis AX of the coil 110, the size of the coil 110 in the axis AX direction can be reduced, and the inductor component 1 can be miniaturized.

[0125] Preferred options Figure 3As shown, the length L of the first through-wire 13 in its extension direction is at least 5 times the equivalent circular diameter R of the end face 13b of the first through-wire 13 in the bottom surface 21b. Similarly, the length L of the second through-wire 14 in its extension direction is at least 5 times the equivalent circular diameter R of the end face 14b of the second through-wire 14 in the bottom surface 21b. This increases the aspect ratio of the first through-wire 13 and the second through-wire 14, thereby increasing the inner diameter of the coil 110 and further improving the inductance efficiency. Furthermore, it is even more preferable that the length L of the first through-wire 13 in its extension direction is at least 5 times the equivalent circular diameter R of the end face 13t of the first through-wire 13 in the top surface 21t. Similarly, it is even more preferable that the length L of the second through-wire 14 in its extension direction is at least 5 times the equivalent circular diameter R of the end face 14t of the second through-wire 14 in the top surface 21t.

[0126] Figure 4 yes Figure 3 A magnified view of region A. (See image below.) Figure 4 As shown, when the line width of the top surface wiring 11t is set to W1, the line width of the main body 111t is set to W21, the width of the covering layer 112t covering one side of the outer surface of the main body 111t in the width direction is set to W221, and the width of the covering layer 112t covering the other side of the outer surface of the main body 111t in the width direction is set to W222, it is preferable to satisfy W1 > W21 > W221 + W222. Here, "width direction" refers to the direction parallel to the top surface 21t in a cross section orthogonal to the extension direction (X direction) of the top surface wiring 11t. "Width of the covering layer 112t covering one side of the outer surface of the main body 111t in the width direction" refers to the length of the covering layer 112t covering one side of the outer surface of the main body 111t in the width direction in a cross section orthogonal to the extension direction of the top surface wiring 11t in the direction parallel to the top surface 21t. Similarly, "the width of the covering layer 112t on the outer surface of the other side of the width direction of the main body 111t" refers to the length of the covering layer 112t on the outer surface of the other side of the width direction of the main body 111t in a cross section orthogonal to the extension direction of the top surface wiring 11t, in a direction parallel to the top surface 21t.

[0127] Based on the above structure, since "W1 > W21" is satisfied, the risk of short circuits in the top surface wiring 11t can be reduced. Furthermore, since "W21 > W221 + W222" is satisfied, the proportion occupied by the main body 111t in the top surface wiring 11t is increased. Therefore, when using a material with low resistivity as the conductive material of the main body 111t, the resistance of the top surface wiring 11t can be reduced.

[0128] Furthermore, when the thickness of the top surface wiring 11t is set to T1, the thickness of the main body 111t is set to T21, and the thickness of the covering layer 112t in the direction orthogonal to the top surface 21t (Z direction) is set to T22, it is preferable to satisfy T1 > T21 > 2 × T22. Here, "the thickness of the covering layer 112t in the direction orthogonal to the top surface 21t" refers to the thickness of the portion of the covering layer 112t that overlaps with the main body 111t in that direction when viewed from the direction orthogonal to the top surface 21t (in other words, the thickness of the covering layer 112t that exists directly above the main body 111t in that direction).

[0129] Based on the above structure, since "T1 > T21" is satisfied, the size of the inductor component 1 in the direction orthogonal to the top surface 21t can be further reduced, thereby enabling further miniaturization of the inductor component 1. Furthermore, in the photolithography process, to improve resolution, the spacing between adjacent main body portions 111t in the Y direction is preferably [missing information]. Figure 4 The thickness T21 of the main body 111t is the same as that of the main body 111t. When the spacing between adjacent main body 111t is the same as the thickness T21, according to the above structure, since "T21 > 2 × T22" (that is, the spacing between adjacent main body 111t in the Y direction is more than twice the thickness T22 of the covering layer 112t), short circuits between the top surface wiring 11t can be suppressed.

[0130] (First external electrode 121 and second external electrode 122)

[0131] The first external electrode 121 is disposed on the first end face 100e1 side with respect to the center of the substrate 10 in the X direction, exposed from the outer surface 100 of the substrate 10. The second external electrode 122 is disposed on the second end face 100e2 side with respect to the center of the substrate 10 in the X direction, exposed from the outer surface 100 of the substrate 10.

[0132] The first external electrode 121 is connected to the first end of the coil 110, and the second external electrode 122 is connected to the second end of the coil 110. The first external electrode 121 and the second external electrode 122 can each be made of a single layer of conductive material or multiple layers of conductive material. In the case of a single layer of conductive material, the first external electrode 121 and the second external electrode 122 are preferably made of the same conductive material as the covering layer 112t of the top surface wiring 11t, but they can also be made of different conductive materials. In the case of multiple layers of conductive material, for example, a base layer of the same material as the coil 110 and a plating layer covering the base layer are used. The plating layer is preferably made of the same conductive material as the covering layer 112t.

[0133] The first external electrode 121 is continuously disposed on the first end face 100e1 and the bottom face 100b. According to the above structure, the first external electrode 121 is a so-called L-shaped electrode, therefore, when the inductor component 1 is mounted on the mounting substrate, solder joints can be formed on the first external electrode 121. This improves the mounting strength of the inductor component 1 and further stabilizes its mounting posture.

[0134] The first external electrode 121 has a first end face portion 121e disposed on a first end face 100e1 and a first bottom face portion 121b disposed on a bottom face 100b. The first end face portion 121e is connected to the first bottom face portion 121b. The first end face portion 121e is embedded in the first end face 100e1 in a manner that exposes it. The first bottom face portion 121b is disposed on the bottom face 100b in a manner that protrudes it. The first end face portion 121e is connected to the first through wiring 13 of the coil 110.

[0135] The first end face portion 121e has a first portion 121e1, a second portion 121e2, and a third portion 121e3 connected sequentially along the Z direction. The first portion 121e1 is connected to the first bottom surface portion 121b at the bottom surface 100b. The second portion 121e2 is connected to the first through wiring 13 within the substrate 10. The third portion 121e3 is exposed from the substrate 21.

[0136] The second external electrode 122 is continuously disposed on the second end face 100e2 and the bottom face 100b. According to the above structure, the second external electrode 122 is a so-called L-shaped electrode, therefore, when the inductor component 1 is mounted on the mounting substrate, solder joints can be formed on the second external electrode 122. This improves the mounting strength of the inductor component 1 and further stabilizes its mounting posture.

[0137] The second external electrode 122 has a second end face portion 122e disposed on the second end face 100e2 and a second bottom face portion 122b disposed on the bottom face 100b. The second end face portion 122e is connected to the second bottom face portion 122b. The second end face portion 122e is connected to the second through wiring 14 of the coil 110. The second end face portion 122e is embedded in the second end face 100e2 in a manner that exposes it. The second bottom face portion 122b is disposed on the bottom face 100b in a manner that protrudes from it.

[0138] The second end face portion 122e has a first portion 122e1, a second portion 122e2, and a third portion 122e3 connected sequentially along the Z direction. The first portion 122e1 is connected to the second bottom surface portion 122b at the bottom surface 100b. The second portion 122e2 is connected to the second through wiring 14 within the substrate 10. The third portion 122e3 is exposed from the substrate 21.

[0139] According to the inductor component 1 described above, the entire outer surface of the outer surface of the coil wiring DW (top surface wiring 11t) connected to both ends, excluding the outer surface on the side of the top surface 21t, becomes the exposed surface. Therefore, the portion of the outer surface of the coil wiring DW connected to both ends, located on the side opposite to the top surface 21t, is exposed to the outside. Compared to covering this portion with an insulating layer, the size of the inductor component 1 in the direction orthogonal to the top surface 21t can be reduced, thereby enabling miniaturization of the inductor component 1. Furthermore, the exposed surface contains a corrosion-resistant conductive material, thus improving the corrosion resistance of the coil wiring DW (top surface wiring 11t) even when it has an exposed surface, protecting it from degradation caused by the external environment. As a result, the reliability of the coil 110 can be ensured.

[0140] Preferably, the conductive material with corrosion resistance is the same as the conductive material constituting the outer surface of the first external electrode 121 and the second external electrode 122.

[0141] According to the above structure, even when the coil wiring DW connected at both ends has exposed surfaces, the coil wiring DW connected at both ends can be made to have the same resistance to the external environment as the first external electrode 121 and the second external electrode 122, thus protecting the coil wiring DW connected at both ends from degradation caused by the external environment. As a result, the reliability of the inductor component 1 can be ensured. In addition, at least a portion of the top surface wiring 11t can be formed simultaneously when manufacturing the first external electrode 121 and the second external electrode 122, making it easy to manufacture the top surface wiring 11t. Furthermore, since the corrosion-resistant conductive material is the same as the conductive material constituting the outer surface of the first external electrode 121 and the second external electrode 122, stability relative to the external environment can be ensured.

[0142] Preferably, the bottom surface wiring 11b includes one or more conductive layers, and the coil wiring DW connected at both ends includes two or more conductive layers. The number of conductive layers in the coil wiring DW connected at both ends is more than the number of conductive layers in the bottom surface wiring 11b.

[0143] Based on the above structure, the number of conductive layers in the bottom surface wiring 11b can be reduced, thus making it easy to manufacture the bottom surface wiring 11b.

[0144] Preferably, the two ends connecting coil wiring DW and the first external electrode 121 and the second external electrode 122 each have multiple conductive layers containing a conductive layer with copper as the main component.

[0145] According to the above structure, the coil wiring DW connected at both ends and the first external electrode 121 and the second external electrode 122 respectively contain copper with low resistivity, thus suppressing Rdc (DC resistance).

[0146] Preferably, the conductive material with corrosion resistance is the same as the conductive material constituting the outer surface of the first external electrode 121 and the second external electrode 122, and the conductive material constituting the outer surface of the bottom wiring 11b is different from the conductive material with corrosion resistance and the conductive material constituting the outer surface of the first external electrode 121 and the second external electrode 122.

[0147] According to the above structure, the corrosion-resistant conductive material is the same as the conductive material constituting the outer surfaces of the first external electrode 121 and the second external electrode 122. Therefore, when manufacturing the first external electrode 121 and the second external electrode 122, at least a portion of the top surface wiring 11t can be formed simultaneously, making the top surface wiring 11t easy to manufacture. Furthermore, stability relative to the first external electrode 121 and the second external electrode 122 can be ensured. In addition, the conductive material constituting the outer surface of the bottom surface wiring 11b is different from both the corrosion-resistant conductive material and the conductive material constituting the outer surfaces of the first external electrode 121 and the second external electrode 122. Therefore, when forming the bottom surface wiring 11b, it is not necessary to cover it with the same conductive material as the corrosion-resistant conductive material. Thus, material costs can be reduced.

[0148] Preferably, the conductive material used as the main component of the bottom wiring 11b and the conductive material used as the main component of the top wiring 11t are the same as the conductive material of at least one of the first through wiring 13 and the second through wiring 14.

[0149] Here, the principal component of the bottom surface wiring 11b refers to the conductive material that occupies the largest area in the cross-section orthogonal to the extension direction of the bottom surface wiring 11b. The principal component of the top surface wiring 11t is defined similarly.

[0150] According to the above structure, the linear expansion coefficient of the coil 110 as a whole can be made uniform, thus suppressing the damage to the coil 110 caused by the expansion difference between the wiring wires.

[0151] The preferred top surface wiring 11t includes a main body 111t made of the same conductive material as the bottom surface wiring 11b and a covering layer 112t, wherein the line width of the main body 111t is smaller than the line width of the bottom surface wiring 11b.

[0152] Here, the linewidth of the bottom surface wiring 11b refers to the length of the bottom surface wiring 11b in a direction parallel to the bottom surface 21b within a cross-section orthogonal to the extension direction of the bottom surface wiring 11b. The linewidth of the main body 111t refers to the length of the main body 111t in a direction parallel to the top surface 21t within a cross-section orthogonal to the extension direction (X direction) of the top surface wiring 11t. Specifically, a cross-section orthogonal to the extension direction of the bottom surface wiring 11b refers to a surface orthogonal to the extension direction of the bottom surface wiring 11b and passing through the center of the extension direction of the bottom surface wiring 11b. Similarly, a cross-section orthogonal to the extension direction of the top surface wiring 11t refers to a surface orthogonal to the extension direction of the top surface wiring 11t and passing through the center of the extension direction of the top surface wiring 11t.

[0153] Based on the above structure, the risk of short circuit in the top surface wiring can be reduced by 11t.

[0154] The preferred top surface wiring 11t includes a main body 111t made of the same conductive material as the bottom surface wiring 11b, and a covering layer 112t, wherein the thickness of the main body 111t is smaller than the thickness of the bottom surface wiring 11b.

[0155] Here, the thickness of the bottom surface wiring 11b refers to the length of the bottom surface wiring 11b in a cross section orthogonal to the extension direction of the bottom surface wiring 11b, in a direction orthogonal to the bottom surface 21b. The thickness of the main body 111t refers to the length of the main body 111t in a cross section orthogonal to the extension direction of the top surface wiring 11t, in a direction orthogonal to the top surface 21t.

[0156] Based on the above structure, the size of the inductor component 1 in the direction orthogonal to the top surface 21t can be further reduced, and the inductor component 1 can be further miniaturized.

[0157] The preferred spacing between adjacent first through-wires 13 (in) Figure 2 The spacing between adjacent second through-wires 14 (denoted as P13 in the attached figure) is 10μm to 150μm. Figure 2 The part numbered in the figure (P14) is 10μm or more and 150μm or less.

[0158] Here, the spacing between adjacent first through-wires 13 refers to the distance between the center lines of adjacent first through-wires 13. The spacing between adjacent second through-wires 14 is defined in the same way.

[0159] According to the above structure, the spacing between adjacent first through-wires 13 is 10 μm or more, and the spacing between adjacent second through-wires 14 is 10 μm or more. Therefore, short circuits between adjacent bottom surface wires 11b, adjacent top surface wires 11t, adjacent first through-wires 13, and adjacent second through-wires 14 can be suppressed. In addition, the spacing between adjacent first through-wires 13 is 150 μm or less, and the spacing between adjacent second through-wires 14 is 150 μm or less. Therefore, the coil length can be shortened, and the inductance efficiency can be improved.

[0160] Preferably, when viewed from a direction orthogonal to the bottom surface 21b, the minimum distance between the end faces 13b of adjacent first through wiring 13 is (in Figure 2 The minimum distance between the end faces 14b of adjacent second through-wires 14 (denoted as L13 in the attached figure) is 5 μm or more. Figure 2 The value is 5μm or larger (as indicated by the attached figure L14).

[0161] Based on the above structure, short circuits between adjacent first through-wires 13 and adjacent second through-wires 14 can be further suppressed.

[0162] Preferably, when at least one of the conductive materials of the first external electrode 121, the second external electrode 122, and the top surface wiring (second coil wiring) 11t is a magnetic conductive material, at least one of the thickness and width of the conductive layer made of the conductive material is 1 μm or less.

[0163] Here, magnetic conductive materials include, for example, Fe, Co, and Ni. For instance, using a conductive material containing Ni or a Ni alloy as the external electrode can improve the electromigration resistance of the external electrode. Furthermore, the "thickness" and "width" of the conductive layer only need to be related to... Figure 4 The T and W values ​​shown can be defined similarly. Based on the above structure, even when a magnetic conductive material is used for the external electrode, the small size of the conductive layer reduces high-frequency losses and improves electromigration resistance.

[0164] (Manufacturing method of inductor component 1)

[0165] Next, use Figures 5A to 5G The manufacturing method of inductor component 1 will be described. Figures 5A to 5G Is with Figure 2 The diagram corresponding to section AA.

[0166] like Figure 5AAs shown, a glass substrate 1021 is prepared to become substrate 21. The glass substrate 1021 is a single-layer glass plate. Multiple through holes V are provided at predetermined positions on the glass substrate 1021. At this time, the glass substrate 1021 is opened by laser processing, or it can be opened by dry or wet etching, or by mechanical processing such as drilling.

[0167] like Figure 5B As shown, a seed layer (not shown) is formed on the entire surface of the glass substrate 1021. A copper layer is formed on the seed layer by electroplating. The seed layer and copper layer on the entire surface of the glass substrate 1021, except inside the through-hole V, are removed by wet etching or dry etching. As a result, a through conductor layer 1013, which becomes the first through wiring 13, is formed inside the through-hole V of the glass substrate 1021. At the same time, although not shown, a through conductor layer, which becomes the second through wiring 14, is also formed inside the through-hole V. In addition, a third part conductor layer is formed as the third part 121e3 of the first end face portion 121e, and a third part conductor layer is formed as the third part 122e3 of the second end face portion 122e.

[0168] like Figure 5C As shown, a seed layer (not shown) is formed on the entire surface of the glass substrate 1021, and a patterned photoresist is formed on the seed layer. Next, a copper layer is formed on the seed layer at the opening of the photoresist by electroplating. Then, the photoresist and the seed layer are removed by wet etching or dry etching. As a result, a bottom conductor layer 1011b, patterned into an arbitrary shape, is formed, which becomes the bottom surface wiring 11b, and a main body conductor layer 1011t, which becomes the main body portion 111t of the top surface wiring 11t. At this time, although not shown, a second part conductor layer, which becomes the second part 121e2 of the first end face portion 121e, and a second part conductor layer, which becomes the second part 122e2 of the second end face portion 122e, are formed.

[0169] In addition, Figure 5B Alternatively, the bottom conductor layer 1011b and the main conductor layer 1011t can be formed without removing the copper layer. In this case, the upper surface of the bottom conductor layer 1011b and the main conductor layer 1011t corresponding to the through hole V becomes concave.

[0170] like Figure 5D As shown, an insulating resin layer 1022, which serves as an insulating layer 22, is applied to a glass substrate 1021 and cured to cover the bottom conductor layer 1011b.

[0171] like Figure 5EAs shown, a seed layer (not shown) is provided on the insulating resin layer 1022, and a patterned photoresist 1023 is formed on the seed layer. Next, a catalyst layer (not shown) is formed on the seed layer at the opening of the photoresist 1023 and on the exposed surface of the main conductor layer 1011t. Then, a plating layer is formed on the seed layer at the opening of the photoresist 1023 and on the exposed surface of the main conductor layer 1011t by electroless plating. The plating layer is, for example, Ni / Au. The plating layer can also be a single layer. Then, as... Figure 5F As shown, the photoresist and seed layer are removed by wet etching or dry etching. This forms a first bottom conductor layer 1021b, patterned into an arbitrary shape, becoming the first bottom portion 121b, and a covering conductor layer 1012t, becoming the covering layer 112t. At this time, although not shown, a second bottom conductor layer, becoming the second bottom portion 122b, is formed by electroless plating. Furthermore, while the first bottom conductor layer 1021b and the covering conductor layer 1012t are formed simultaneously as described above, this method is not limited to this; for example, the following method could also be used: First, a photoresist or the like is formed on the main conductor layer 1011t. Next, a Ni / Sn plating layer is formed as the first bottom conductor layer 1021b, becoming the first bottom portion 121b. Then, the photoresist or the like on the main conductor layer 1011t is removed, and a photoresist or the like is formed on the first bottom conductor layer 1021b. Next, a Ni / Au plating layer is formed on the surface of the main conductor layer 1011t as a cover conductor layer 1012t. Finally, the photoresist and the like on the first bottom conductor layer 1021b are removed. Thus, a cover conductor layer 1012t with a structure different from the first bottom conductor layer 1021b can be formed.

[0172] like Figure 5G As shown, the inductor component 1 is manufactured by segmenting along the cutting line C. Furthermore, a plating layer is formed by barrel plating to cover each of the second and third conductor layers described above. The plating layer may, for example, consist of two Ni / Au layers. Alternatively, the plating layer may consist of multiple layers such as Cu / Ni / Au or Cu / Ni / Pd / Au.

[0173] Furthermore, in the above manufacturing method, the copper layer is removed by wet etching or dry etching, but CMP processing or machining can also be used to remove the copper layer. In addition, when forming a through conductor layer that serves as a through wiring in the through hole V, it can be formed entirely by plating, but it is also possible to partially plating and then filling the gaps with conductive resin.

[0174] Furthermore, while a glass substrate is used as the base in the above manufacturing method, a sintered material can also be used. In this case, the inductor wiring of one or fewer turns is formed by printing using conductive paste. Here, materials with good conductivity, such as Ag and Cu, are selected as the conductive paste.

[0175] Next, insulating pastes such as glass and ferrite are printed, and this process is repeated. By forming an opening in the insulating paste that leads to the connection portion of the inductor wiring, and filling the opening with conductive paste, the connection portions of the inductor wiring between layers can be electrically connected.

[0176] Then, the insulating paste is heat-treated at high temperature to sinter it, and then it is segmented to form external terminals, thus manufacturing inductor components. If the insulating paste uses a highly insulating material such as glass, inductor components with high Q can be obtained even at high frequencies. If the insulating paste uses ferrite, inductor components with high inductance can be obtained.

[0177] 3. Variations

[0178] Figure 6 This is a schematic bottom view showing a modified example of an inductor component, viewed from the bottom surface 100b (bottom surface 21b).

[0179] like Figure 6 As shown, the difference between the number of first through-wires 13 and the number of second through-wires 14 is 1. Viewed from a direction orthogonal to the bottom surface 21b, the first through-wires 13 and the second through-wires 14 are arranged alternately relative to the axis AX of the coil 110. In this embodiment, the number of first through-wires 13 is 4, and the number of second through-wires 14 is 3.

[0180] In other words, regarding the position in the AX direction, the second through wire 14 is located between adjacent first through wires 13, and the first through wire 13 is located between adjacent second through wires 14. That is, the first through wires 13 and the second through wires 14 are arranged in an alternating pattern along the AX direction.

[0181] According to the above structure, when the difference in the number of the first through wiring 13 and the second through wiring 14 is 1, compared with the case where they are linearly symmetrical with respect to the axis AX of the coil 110, the size of the coil 110 in the axis AX direction can be reduced, and the inductor component 1 can be miniaturized.

[0182] <Second Implementation>

[0183] Figure 7 This is a schematic diagram showing the mounting structure of an inductor component. For example... Figure 7As shown, the inductor component mounting structure includes a mounting substrate 5 and a mounting surface 50 on the mounting substrate 5, as described in the first embodiment of the inductor component 1. The mounting substrate 5 has a wiring portion 51 on the mounting surface 50. The wiring portion 51 includes, for example, wiring of conductors such as printed circuit wiring, and also includes pad patterns that are electrically and physically connected to mounting components such as the inductor component. The axis AX of the coil 110 is parallel to the mounting surface 50. Furthermore, although in Figure 7 Although not clearly described, it is also possible to perform insulation treatment using solder resist or the like on the surface of the portion of the mounting substrate 5 without wiring portion 51.

[0184] According to the above structure, the axis AX of the coil 110 is parallel to the mounting surface 50, so the magnetic flux of the inductor component 1 is not affected by the wiring portion 51 of the mounting substrate 5, and the reduction in inductance efficiency can be suppressed.

[0185] Figure 8 This is a schematic diagram showing a variation of the mounting structure of an inductor component. For example... Figure 8 As shown, the inductor component mounting structure includes a mounting substrate 5 and a mounting surface 50 mounted on the mounting substrate 5, which is the inductor component 1 of the first embodiment described above. The axis AX of the coil 110 is orthogonal to the mounting surface 50.

[0186] According to the above structure, the axis AX of the coil 110 is orthogonal to the mounting surface 50. Therefore, the magnetic flux of the inductor component 1 will not affect other inductor components 1 adjacent to it, and the degree of freedom of the installation layout is improved.

[0187] Preferably, the axis AX of the coil 110 does not overlap with the wiring portion 51. This prevents the magnetic flux of the inductor component 1 from being obstructed by the wiring portion 51, and suppresses the reduction in inductance efficiency.

[0188] In addition, Figure 7 and Figure 8 In this configuration, the inductor component can also be positioned on the mounting surface such that the direction of the shortest dimension among the length, width, and height of the substrate is orthogonal to the mounting surface. Thus, the direction of the shortest dimension among the length, width, and height of the substrate becomes the thickness direction when positioned on the mounting surface, allowing the inductor component to be thinner.

[0189] In addition, Figure 7 and Figure 8 In this configuration, the inductor component can also be positioned on the mounting surface such that the direction of the longest dimension among the length, width, and height of the substrate is orthogonal to the mounting surface. Thus, the direction of the shortest dimension among the length, width, and height of the substrate determines the mounting surface of the inductor component, thereby reducing the mounting area of ​​the inductor component.

[0190] <Third Implementation Method>

[0191] The third embodiment differs from the first embodiment in the structure of the covering layer for the top surface wiring. This different structure will be described below. Other structures are the same as in the first embodiment, and detailed descriptions are omitted. In this embodiment, the accompanying drawings are omitted; for convenience, reference will be made to the first embodiment below. Figures 1-3 Please provide an explanation.

[0192] In this embodiment, the conductive material of the exposed surface of the outer surface of the coil wiring DW that is connected to both ends is the same as the conductive material of the outer surface of at least a portion of the first external electrode 121 and the second external electrode 122. Specifically, the conductive material of the cladding layer 112t that constitutes the coil wiring DW (top surface wiring 11t) is the same as the conductive material of the outer surface of at least the first bottom surface portion 121b and the second bottom surface portion 122b that constitute the first external electrode 121 and the second external electrode 122. For example, if the conductive material constituting each of the first bottom surface portion 121b and the second bottom surface portion 122b is composed of two layers of Cu / Ni, the conductive material of the cladding layer 112t that constitutes the coil wiring DW is Ni.

[0193] For the conductive material used on the outer surface of the external electrodes, a conductive material with high resistance to the external environment is typically selected. According to this embodiment, the conductive material of the exposed surface constituting the two-end connected coil wiring DW is the same as the conductive material of the outer surface constituting at least a portion of the first external electrode 121 and the second external electrode 122. Therefore, the resistance to the external environment can be improved in the two-end connected coil wiring DW, ensuring the reliability of the coil. Furthermore, since at least a portion of the outer surface of the two-end connected coil wiring DW located on the side opposite to the second main surface 21t is exposed to the outside, compared to covering this portion with an insulating layer, the size of the inductor component in the direction orthogonal to the second main surface 21t (Z direction) can be reduced, thereby enabling miniaturization of the inductor component. Additionally, when manufacturing the first external electrode 121 and the second external electrode 122, a portion of the two-end connected coil wiring DW can be manufactured simultaneously, thus simplifying the manufacturing process.

[0194] <Fourth Implementation>

[0195] Figure 9 This is a schematic perspective view of the fourth embodiment of the inductor component, viewed from the bottom side. Figure 10 yes Figure 9 A BB cross-sectional view. The fourth embodiment differs from the first embodiment in the structure of the coil, substrate, and external electrodes. This difference in structure will be described below. Other structures are the same as in the first embodiment, and are labeled with the same reference numerals as in the first embodiment, with their descriptions omitted.

[0196] The substrate 10 includes a substrate 21 and an insulating layer 23 disposed on the substrate 21. The substrate 21 has a bottom surface 21b and a top surface 21t that are opposite each other in the Z direction. The insulating layer 23 is disposed on a portion of the bottom surface 21b of the substrate 21. Specifically, the insulating layer 23 is disposed on the bottom surface 21b to cover the entire bottom surface wiring 11b. In other words, viewed from the Z direction, the insulating layer 23 is disposed on a defined area of ​​the bottom surface 21b such that it overlaps with the wiring (bottom surface wiring 11b) disposed on the substrate 21. The shape of the insulating layer 23 is not particularly limited; in this embodiment, it is rectangular when viewed from the Z direction. The material and forming method of the insulating layer 23 can be the same as those of the insulating layer 22 in the first embodiment.

[0197] The coil 110A includes: a plurality of bottom surface wirings 11b disposed on a bottom surface 21b and covered by an insulating layer 22; a plurality of top surface wirings 11t disposed on a top surface 21t; a plurality of first through wirings 13 configured to extend from the bottom surface 21b to the top surface 21t through the substrate 21 and arranged along the axis AX; and a plurality of second through wirings 14 configured to extend from the bottom surface 21b to the top surface 21t through the substrate 21 and disposed opposite to the first through wirings 13 relative to the axis AX, and arranged along the axis AX. The bottom surface wirings 11b, the first through wirings 13, the top surface wirings 11t, and the second through wirings 14 are connected sequentially, thereby forming at least a portion of a spiral shape.

[0198] The bottom surface wiring 11b extends in only one direction. Specifically, the bottom surface wiring 11b is slightly inclined in the Y direction and extends in the X direction. Multiple bottom surface wirings 11b are arranged along the Y direction and configured parallel to each other.

[0199] The top surface wiring 11t extends in only one direction. Specifically, the top surface wiring 11t has a shape that extends along the X direction. Multiple top surface wirings 11t are arranged along the Y direction and configured parallel to each other.

[0200] The top surface wiring 11t includes a two-end connecting coil wiring DW, where a first end e1 is connected to a first through wiring 13 and a second end e2 is connected to a second through wiring 14. In this embodiment, all top surface wiring 11t consists of two-end connecting coil wiring DW.

[0201] The portion of the outer surface of the coil wiring DW connected at both ends, located on the side opposite to the top surface 21t, is exposed to the outside at least. This exposed portion of the outer surface contains a corrosion-resistant conductive material. In this embodiment, as... Figure 10As shown, the two-end connected coil wiring DW includes a main body 111t and a covering layer 112t that covers the main body 111t and contains a corrosion-resistant conductive material. The main body 111t is disposed on the top surface 21t and extends in the X direction. The shape of the main body 111t is not particularly limited. The conductive material of the main body 111t is preferably the same as the conductive material of the bottom surface wiring 11b. Therefore, the main body 111t can be manufactured when manufacturing the bottom surface wiring 11b, which simplifies the manufacturing process. The covering layer 112t covers the entire outer surface of the main body 111t except for the outer surface on the side of the top surface 21t. With the above structure, the outer surface of the two-end connected coil wiring DW except for the outer surface on the side of the top surface 21t becomes the exposed surface, which contains a corrosion-resistant conductive material. Alternatively, the covering layer 112t can be entirely composed of a corrosion-resistant conductive material. Therefore, the corrosion resistance of the two-end connected coil wiring DW can be effectively improved.

[0202] The first through-wire 13 is disposed within the through-hole V of the substrate 10, positioned relative to the axis AX on the side of the first end face 100e1. The second through-wire 14 is disposed within the through-hole V of the substrate 10, positioned relative to the axis AX on the side of the second end face 100e2. The first through-wire 13 and the second through-wire 14 extend in directions orthogonal to the bottom surface 21b and the top surface 21t (bottom surface 100b and top surface 100t), respectively. A plurality of first through-wires 13 and a plurality of second through-wires 14 are arranged along the Y direction and configured parallel to each other.

[0203] The first external electrode 121 is disposed on the bottom surface 21b in a manner separate from the bottom surface wiring 11b in the opposite X direction when viewed from the Z direction. Since the first external electrode 121 is disposed on the bottom surface 21b, at least a portion of the first external electrode 121 can be formed simultaneously when manufacturing the bottom surface wiring 11b. Therefore, the first external electrode 121 can be easily manufactured. The shape of the first external electrode 121 is not particularly limited, but in this embodiment, it is rectangular when viewed from the Z direction. Figure 10 As shown, the first external electrode 121 includes a main body 1211 and a covering layer 1212. The main body 1211 is disposed on the bottom surface 21b. The outer surface of the main body 1211 in the positive X direction contacts the side surface of the insulating layer 23 in the negative X direction. The conductive material of the main body 1211 is preferably the same as the conductive material of the bottom surface wiring 11b. Therefore, the main body 1211 can be formed simultaneously when manufacturing the bottom surface wiring 11b. The covering layer 1212 covers the outer surface of the main body 1211 except for the contact surface that contacts the bottom surface 21b and the insulating layer 23. The conductive material of the covering layer 1212 is preferably the same as the conductive material of the covering layer 112t of the top surface wiring 11t. Therefore, the covering layer 1212 can be formed simultaneously when manufacturing the covering layer 112t.

[0204] The second external electrode 122 is disposed on the bottom surface 21b in a manner that it is separated from the bottom surface wiring 11b in the positive X direction when viewed from the Z direction. Since the second external electrode 122 is disposed on the bottom surface 21b, at least a portion of the second external electrode 122 can be formed simultaneously when manufacturing the bottom surface wiring 11b. Therefore, the second external electrode 122 can be easily manufactured. The shape of the second external electrode 122 is not particularly limited; in this embodiment, it is rectangular when viewed from the Z direction. Figure 10 As shown, the second external electrode 122 includes a main body 1221 and a covering layer 1222. The main body 1221 is disposed on the bottom surface 21b. The outer surface of the main body 1221 on the opposite X-direction side contacts the side surface of the insulating layer 23 on the positive X-direction side. The conductive material of the main body 1221 is preferably the same as the conductive material of the bottom surface wiring 11b. Therefore, the main body 1221 can be formed simultaneously when manufacturing the bottom surface wiring 11b. The covering layer 1222 covers the outer surface of the main body 1221 except for the contact surface that contacts the bottom surface 21b and the insulating layer 23. The conductive material of the covering layer 1222 is preferably the same as the conductive material of the covering layer 112t of the top surface wiring 11t. Therefore, the covering layer 1222 can be formed simultaneously when manufacturing the covering layer 112t.

[0205] According to this embodiment, the outer surface of the outer surface of the coil wiring DW connected at both ends, excluding the outer surface on the side of the top surface 21t, becomes the exposed surface. Therefore, the portion of the outer surface of the coil wiring DW located on the side opposite to the top surface 21t is exposed to the outside. Compared to covering this portion with an insulating layer, the size of the inductor component 1A in the direction orthogonal to the top surface 21t can be reduced, thereby enabling miniaturization of the inductor component 1A. Furthermore, the exposed surface contains a corrosion-resistant conductive material, thus improving the corrosion resistance of the coil wiring DW even when it has an exposed surface, protecting it from degradation caused by the external environment.

[0206] Furthermore, according to this embodiment, the first external electrode 121 and the second external electrode 122 are disposed on the bottom surface 21b, and the bottom surface wiring 11b is covered by the insulating layer 23. Therefore, even when the first external electrode 121 and the second external electrode 122 are disposed on the bottom surface 21b, insulation between the bottom surface wiring 11b and the first external electrode 121 and the second external electrode 122 can be ensured. In addition, since the first external electrode 121 and the second external electrode 122 are disposed on the bottom surface 21b, the first external electrode 121 and the second external electrode 122 can be easily manufactured. Furthermore, since the insulating layer 23 is disposed on the bottom surface 21b, and no insulating layer is disposed on the top surface 21t including the top surface wiring 11t, the inductor component 1A can be miniaturized.

[0207] <Fifth Implementation>

[0208] Figure 11 This is a schematic perspective view of the fifth embodiment of the inductor component, viewed from the bottom side. Figure 12 This is a schematic bottom view of the inductor component viewed from the bottom side. Figure 13 yes Figure 12 CC section view. Furthermore, in Figure 12 For convenience, the insulating layer of the substrate is omitted from the drawing, and a portion of the external electrode (bottom surface) is depicted with a double-dotted line. The fifth embodiment differs from the first embodiment in the structure of the coil and the substrate. This different structure will be described below. Other structures are the same as those in the first embodiment, and the same reference numerals are used as in the first embodiment, with their descriptions omitted.

[0209] The coil 110B includes: a bottom surface wiring 11b disposed above the bottom surface 21b of the substrate 21 and covered by an insulating layer 22; a top surface wiring 11t disposed above the top surface 21t of the substrate 21, partially covered by the insulating layer 22; and a pair of through wirings 13 and 14 extending through the substrate 21 to both the bottom surface 21b and the top surface 21t, and disposed on opposite sides of each other relative to the axis AX. The two sides of the top surface wiring 11t in the X direction are covered by the insulating layer 22, and the upper surface of the top surface wiring 11t in the Z direction is exposed from the insulating layer 22.

[0210] The bottom surface wiring 11b extends in only one direction. Specifically, the bottom surface wiring 11b is slightly inclined in the X direction and extends in the Y direction. Multiple bottom surface wirings 11b are arranged parallel to each other along the X direction.

[0211] The top surface wiring 11t extends in only one direction. Specifically, the top surface wiring 11t has a shape that extends along the Y direction. Multiple top surface wirings 11t are arranged parallel to each other along the X direction. Each top surface wiring 11t includes a first end e1 connected to a first through wiring 13, and a second end e2 connected to a second through wiring 14. In this embodiment, all top surface wirings 11t are two-end connected coil wirings DW.

[0212] The portion of the outer surface of the coil wiring DW connected at both ends, located on the side opposite to the top surface 21t, is exposed to the outside at least, and the exposed surface of the outer surface contains a corrosion-resistant conductive material. Specifically, as... Figure 13As shown, each of the two-end connected coil wirings DW includes a main body 111t and a cladding layer 112t covering a portion of the outer surface of the main body 111t and containing a corrosion-resistant conductive material. The main body 111t is disposed on the top surface 21t and extends along the Y direction. The shape of the main body 111t is not particularly limited. In this embodiment, the main body 111t is rectangular in a cross section orthogonal to the Y direction. The conductive material of the main body 111t is preferably the same as that of the bottom wiring 11b. Thus, the main body 111t can be manufactured when manufacturing the bottom wiring 11b, simplifying the manufacturing process. The cladding layer 112t covers the outer surface of the main body 111t that faces the outer surface of the top surface 21t (in other words, the upper surface of the main body 111t in the Z direction). The conductive material of the cladding layer 112t is preferably the same as that of the first external electrode 121 and the second external electrode 122.

[0213] An insulating layer 22 is provided on the top surface 21t of the substrate 10. Specifically, the insulating layer 22 is provided on the top surface 21t to cover the two sides of the coil wiring DW connected at both ends in the X direction. In the Z direction, the thickness of the insulating layer 22 is the same as the thickness of the coil wiring DW connected at both ends.

[0214] With the above structure, the outer surface of the coil wiring DW connected at both ends, which faces the outer surface of the top surface 21t, becomes the exposed surface, and this exposed surface contains a corrosion-resistant conductive material. Alternatively, the entire covering layer 112t can be made of a corrosion-resistant conductive material. This effectively improves the corrosion resistance of the coil wiring DW connected at both ends.

[0215] According to this embodiment, the outer surface of the coil wiring DW connected at both ends, which faces the outer surface of the top surface 21t, becomes the exposed surface. Therefore, the portion of the outer surface of the coil wiring DW located on the side opposite to the top surface 21t is exposed to the outside. Compared to covering this portion with an insulating layer, the size of the inductor component 1B in the direction orthogonal to the top surface 21t can be reduced, thereby enabling miniaturization of the inductor component 1B. Furthermore, the exposed surface contains a corrosion-resistant conductive material, thus improving the corrosion resistance of the coil wiring DW even when it has an exposed surface, protecting it from degradation caused by the external environment.

[0216] Furthermore, according to this embodiment, an insulating layer 22 is provided between adjacent two-end connecting coil wiring DWs (top surface wiring 11t), thus ensuring insulation between adjacent two-end connecting coil wiring DWs. Additionally, the presence of an insulating layer 22 between adjacent two-end connecting coil wiring DWs, and the absence of an insulating layer 22 on the two-end connecting coil wiring DWs themselves, ensures insulation between adjacent two-end connecting coil wiring DWs and enables miniaturization of the inductor component.

[0217] Furthermore, this disclosure is not limited to the above-described embodiments, and design changes can be made without departing from the spirit of this disclosure. For example, the feature points of each of the first to fifth embodiments can be combined in various ways.

[0218] In the first to fifth embodiments, there may be multiple bottom surface wirings, but at least one is sufficient. Similarly, at least one of the top surface wirings, the first through wiring, and the second through wiring is also sufficient.

Claims

1. An inductor component, wherein, have: matrix; and A coil, disposed on the substrate, is wound into a spiral shape along an axis. The substrate includes a base plate having a first main surface and a second main surface that are opposite each other. The coil includes: At least one first coil wiring is disposed on the first main surface; At least one second coil wiring is disposed on the second main surface; At least one first through-wire is configured to extend through the substrate from the first main surface to the second main surface; and At least one second through-wire is configured to extend through the substrate from the first main surface to the second main surface, and is disposed on the opposite side of the first through-wire relative to the axis. The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected sequentially to form at least a portion of the spiral shape. The at least one second coil wiring includes coil wiring with a first end connected to the first through wiring and a second end connected to the second through wiring at both ends. The portion of the outer surface of the coil wiring connected at both ends, located on the side opposite to the second main surface, is exposed to the outside at least. The exposed surface of the outer surface contains a corrosion-resistant conductive material. The first coil wiring is covered by an insulating layer. At the first main surface, the line width of the first coil wiring is greater than the width of the first through wiring and the second through wiring in the width direction of the first coil wiring. The two-end connecting coil wiring includes a main body made of the same conductive material as the first coil wiring and a covering layer that covers the main body and includes the corrosion-resistant conductive material. At the second main surface, the line width of the main body is smaller than the width of the first through-wire and the second through-wire in the width direction of the connecting coil wires at both ends. The covering layer covers the outer surface covering portion of the main body located on the side opposite to the second main surface and the side covering portion of the main body located between the outer surface covering portion and the second main surface.

2. The inductor component according to claim 1, wherein, The inductor component also includes an external electrode, which is disposed on the substrate and electrically connected to the coil. The corrosion-resistant conductive material is the same as the conductive material constituting the outer surface of the external electrode.

3. The inductor component according to claim 2, wherein, The external electrode is disposed on the first main surface of the substrate.

4. The inductor component according to any one of claims 1 to 3, wherein, The corrosion-resistant conductive material is Au, Ti, Ti alloy, Al, or Al alloy.

5. The inductor component according to any one of claims 1 to 3, wherein, The first coil wiring includes one or more conductive layers. The wiring connecting the two ends of the coil includes two or more conductive layers. The number of conductive layers in the coil wiring connected at both ends is greater than the number of conductive layers in the first coil wiring.

6. The inductor component according to any one of claims 1 to 3, wherein, An insulating layer is disposed on the first main surface. No insulation layer was provided on the wiring of the second coil.

7. The inductor component according to any one of claims 1 to 3, wherein, The conductive material that is the main component of the first coil wiring and the conductive material that is the main component of the second coil wiring are the same as the conductive material of at least one of the first through wiring and the second through wiring.

8. The inductor component according to any one of claims 1 to 3, wherein, The line width of the main body is smaller than the line width of the first coil wiring.

9. The inductor component according to any one of claims 1 to 3, wherein, The thickness of the main body is smaller than the thickness of the first coil wiring.

10. The inductor component according to claim 8, wherein, When the line width of the second coil wiring is set to W1, the line width of the main body is set to W21, the width of the covering layer covering one side of the outer surface of the main body in the width direction is set to W221, and the width of the covering layer covering the other side of the outer surface of the main body in the width direction is set to W222, W1 > W21 > W221 + W222 is satisfied.

11. The inductor component according to claim 8, wherein, When the thickness of the second coil wiring is set to T1, the thickness of the main body is set to T21, and the thickness of the covering layer in the direction orthogonal to the second main surface is set to T22, T1 > T21 > 2 × T22 is satisfied.

12. The inductor component according to any one of claims 1 to 3, wherein, There are multiple second coil wirings. An insulating layer is provided between adjacent second coil wirings.

13. The inductor component according to any one of claims 1 to 3, wherein, There are multiple instances of the first coil wiring, the second coil wiring, the first through wiring, and the second through wiring. The spacing between adjacent first through-wires is between 10 μm and 150 μm. The spacing between adjacent second through-wires is between 10 μm and 150 μm.

14. A mounting structure for an inductor component, wherein, have: Mounting substrate; and The inductor component according to any one of claims 1 to 13 is mounted on the mounting surface of the mounting substrate. The axis of the coil is orthogonal to the mounting surface.

15. A mounting structure for an inductor component, wherein, have: Mounting substrate; and The inductor component according to any one of claims 1 to 13 is mounted on the mounting surface of the mounting substrate. The axis of the coil is parallel to the mounting surface.

16. The mounting configuration of the inductor component according to claim 14 or 15, wherein, The substrate has a length, width, and height. The inductor component is arranged orthogonally to the mounting surface with respect to the mounting surface in the direction of the shortest dimension among the length, width, and height of the substrate.

17. The mounting configuration of the inductor component according to claim 14 or 15, wherein, The substrate has a length, width, and height. The inductor component is arranged orthogonally to the mounting surface with respect to the mounting surface in the direction of the longest dimension among the length, width, and height of the substrate.

Images