Display substrate and display device

Abstract

The application provides a display substrate and a display device. The display substrate comprises: a substrate, comprising an opening area, a display area surrounding the opening area, and a peripheral area surrounding the display area; a touch layer located on one side of the substrate, comprising a shielding structure, the shielding structure at least surrounds part of the opening area, and connects to the peripheral area through the display area, and extends to a touch driving chip along the peripheral area; and an encapsulation layer between the substrate and the touch layer.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display substrate and a display device. Background Technology

[0002] In recent years, mobile display technology has developed rapidly, with next-generation display technologies, represented by flexible displays, being increasingly widely used. At the same time, the market demand for display panels with high screen-to-body ratios is becoming increasingly urgent, and existing designs such as "notch screens" and "waterdrop screens" are gradually failing to meet user needs. Against this backdrop, punch-hole technology has emerged as a new design approach. Summary of the Invention

[0003] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0004] According to one aspect of an embodiment of this application, a display substrate is provided, comprising:

[0005] A substrate includes an opening area, a display area surrounding the opening area, and a peripheral area surrounding the display area;

[0006] A touch layer, located on one side of the substrate, includes a shielding structure that at least surrounds a portion of the opening area, passes through the display area and connects to the peripheral area, and extends along the peripheral area to connect to the touch driver chip;

[0007] An encapsulation layer is located between the substrate and the touch layer.

[0008] Optionally, the touch layer includes a first metal layer located on the side of the encapsulation layer away from the substrate, a second metal layer located on the side of the first metal layer away from the substrate, and an insulating layer located between the first metal layer and the second metal layer, wherein the shielding structure is disposed in the first metal layer and / or the second metal layer.

[0009] Optionally, the shielding structure includes a grounding wire and a signal protection wire.

[0010] Optionally, the shielding structure includes a first portion located in the opening area, a second portion located in the display area, a third portion located in the peripheral area, a first connecting structure connecting the first portion and the second portion, and a second connecting structure connecting the second portion and the third portion.

[0011] Optionally, in the first part, both the grounding wire and the signal protection wire are single-layer structures.

[0012] Optionally, in the first part, the grounding wire and the signal protection wire are arranged in different layers.

[0013] Optionally, in the first part, the grounding wire and the signal protection wire are arranged on the same layer.

[0014] Optionally, in the first part, both the grounding wire and the signal protection wire have a double-layer structure.

[0015] Optionally, in the first part, the grounding wire is located on the side of the signal protection wire closer to the center of the opening area;

[0016] Optionally, the touch layer further includes a plurality of touch electrodes, and the second part and the touch electrodes are both disposed in the second metal layer.

[0017] Optionally, both the second part and the touch electrode are metal mesh structures; the second part includes a plurality of second sub-parts, each second sub-part including at least one row of the metal mesh structures in the extension direction of the second part, and each second sub-part is insulated from the touch electrode through a break in the metal mesh structure.

[0018] Optionally, the bisector of the length direction of one of the plurality of touch electrodes passes through the second portion along the extension direction of the second portion.

[0019] Optionally, the touch layer further includes touch traces located in the peripheral area, the touch traces being led out from the touch electrodes and extending along the peripheral area to the touch driver chip, the third portion being at least partially located on the side of the touch traces away from the display area, and at least partially parallel to the touch traces.

[0020] Optionally, the third portion is disposed in the first metal layer and the second metal layer, and the third portion of the different layers is connected through a via in the insulating layer.

[0021] Optionally, in the third part, the grounding wire is located on the side of the signal protection line away from the display area.

[0022] Optionally, the first connection structure is connected to the first part at one end of the opening area, and the first connection structure is connected to the second part at the other end of the display area, and the first connection structure is disposed in the first metal layer.

[0023] Optionally, the second connection structure is connected to the second part at one end of the display area, and the second connection structure is connected to the third part at the other end of the peripheral area, and the second connection structure is disposed in the second metal layer.

[0024] Optionally, the orthographic projection of the touch trace on the substrate and the orthographic projection of the second connection structure on the substrate have an overlapping area, and the touch trace is disposed in the first metal layer in the overlapping area; the remaining part is disposed in the first metal layer and the second metal layer, and the touch traces in different layers are connected through vias in the insulating layer.

[0025] Optionally, the width of the grounding wire and the signal protection wire is 5 to 20 micrometers, and the spacing is 20 to 50 micrometers.

[0026] Optionally, the touch layer further includes a crack detection structure, which at least surrounds a portion of the opening area and passes through the display area to connect to the peripheral area, and extends along the peripheral area to connect to the display driver chip. In the opening area, the crack detection structure is located on the side of the first portion closer to the center of the opening area. In the display area, the crack detection structure is located inside the second portion. In the peripheral area, the crack detection structure is located on the side of the third portion away from the display area.

[0027] Optionally, the encapsulation layer includes at least a first inorganic encapsulation layer, a second inorganic encapsulation layer located on the side of the first inorganic encapsulation layer away from the substrate, and an organic encapsulation layer located between the first inorganic encapsulation layer and the second inorganic encapsulation layer, and the opening region includes at least one barrier dam surrounding the opening region.

[0028] Optionally, the at least one barrier dam includes a first barrier dam located on the side of the first portion near the center of the opening area.

[0029] Optionally, the at least one barrier includes a first barrier and a second barrier, the second barrier being located on the side of the first barrier closer to the center of the opening area, the signal protection line in the first portion being located on the side of the first barrier farther from the center of the opening area, the grounding line in the first portion being at least partially located between the first barrier and the second barrier, and the crack detection structure being at least partially located on the side of the second barrier closer to the center of the opening area.

[0030] According to another aspect of the embodiments of this application, a display device is provided, comprising: the display substrate described in any of the above embodiments. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 A schematic diagram of the structure of a display substrate according to an embodiment of this application is shown.

[0033] Figure 2 schematically shown Figure 1 The cross-sectional view of the touch layer in the display substrate shown along section AA;

[0034] Figure 3 schematically shown Figure 1 The diagram shows an enlarged view of region B in the display substrate.

[0035] Figure 4 schematically shown Figure 3 An enlarged schematic diagram of region C in the display substrate shown;

[0036] Figure 5 schematically shown Figure 4 The image shows a cross-sectional view of the touch layer along section DD in the display substrate.

[0037] Figure 6 schematically shown Figure 4 Another cross-sectional view of the touch layer along section DD in the display substrate shown;

[0038] Figure 7 schematically shown Figure 4 Another cross-sectional view of the touch layer along section DD in the display substrate shown;

[0039] Figure 8 schematically shown Figure 4 The diagram shows an enlarged view of region E in the display substrate.

[0040] Figure 9 schematically shown Figure 8 The diagram shows a cross-sectional view of the display substrate along section FF;

[0041] Figure 10 A schematic diagram of another display substrate according to an embodiment of this application is shown.

[0042] Figure 11 schematically shown Figure 4 The cross-sectional view of the touch layer along section GG in the display substrate shown;

[0043] Figure 12 schematically shown Figure 4 The cross-sectional view of the touch layer along section HH in the display substrate shown;

[0044] Figure 13 schematically shown Figure 3 Another enlarged schematic diagram of region C in the display substrate shown;

[0045] Figure 14 schematically shown Figure 1 An enlarged schematic diagram of the opening area in the display substrate shown;

[0046] Figure 15 schematically shown Figure 14 The cross-sectional view of the display substrate shown is along section II;

[0047] Figure 16 schematically shown Figure 1 Another enlarged schematic diagram of the opening area in the display substrate shown;

[0048] Figure 17 schematically shown Figure 16 The image shows a cross-sectional view of the display substrate along section JJ.

[0049] Explanation of reference numerals in the attached figures:

[0050] 100—Display substrate; 11—Substrate; 111—Aperture area;

[0051] 112—Display area; 113—Peripheral area; 12—Driver circuit layer;

[0052] 13—Display function layer; 131—Light-emitting unit; 132—Pixel limiting layer;

[0053] 14—Encapsulation layer; 141—First inorganic encapsulation layer; 142—Organic encapsulation layer;

[0054] 143—Second inorganic encapsulation layer; 144—First barrier dam; 145—Second barrier dam;

[0055] 15—Touch layer; 1501—Buffer layer; 1502—First metal layer;

[0056] 1503—Insulating layer; 1504—Second metal layer; 1505—Protective layer;

[0057] 1506—via; 1511—touch electrode; 1511a—first touch electrode;

[0058] 1511b—Second touch electrode; 1511c—Bridging electrode; 1511d—Virtual electrode;

[0059] 1512—Touchscreen trace; 1513—Metal mesh structure; 1514—Break point;

[0060] 1515—Compensation structure; 1516—Light-shielding structure; 152—Shielding structure;

[0061] 152a—Part 1; 152b—Part 2; 152b1—Second Subpart;

[0062] 152c—Third part; 152d—First connection structure; 152e—Second connection structure;

[0063] 1521—Grounding wire; 1522—Signal protection wire; 153—Crack detection structure. Detailed Implementation

[0064] The embodiments of this application will now be described in detail with reference to the accompanying drawings. The implementation can be carried out in many different forms. Those skilled in the art will readily understand that the methods and content can be transformed into one or more forms without departing from the spirit and scope of this application. Therefore, this application should not be construed as being limited only to the content described in the following embodiments. Unless otherwise specified, the embodiments and features described in these embodiments can be arbitrarily combined with each other.

[0065] In the accompanying drawings, the size of one or more constituent elements, the thickness of layers, or areas are sometimes exaggerated for clarity. Therefore, one aspect of this application is not necessarily limited to these dimensions, and the shapes and sizes of the components in the drawings do not reflect true proportions. Furthermore, the drawings schematically illustrate ideal examples, and one aspect of this application is not limited to the shapes or values ​​shown in the drawings.

[0066] The ordinal numbers "first," "second," and "third" used in this application are used to avoid confusion among the constituent elements, not to limit the quantity. "Multiple" in this application includes two or more.

[0067] In this application, for convenience, terms such as "middle," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are used to indicate orientation or positional relationships in conjunction with the accompanying drawings. This is solely for the purpose of facilitating the description and simplification of the specification, and does not imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this application. The positional relationships of the constituent elements may be appropriately changed depending on the direction in which the constituent elements are described. Therefore, the terminology used is not limited to those described in the specification and may be appropriately replaced as needed.

[0068] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection, an indirect connection through an intermediate component, or a connection within two components. Those skilled in the art will understand the meaning of the above terms in this application according to the circumstances.

[0069] In this application, a transistor refers to a device that includes at least three terminals: a gate electrode, a drain electrode, and a source electrode. A transistor has a channel region between the drain electrode (drain electrode terminal, drain region, or drain electrode) and the source electrode (source electrode terminal, source region, or source electrode), and current can flow through the drain electrode, the channel region, and the source electrode. In this application, the channel region refers to the region through which current primarily flows. In cases where transistors with opposite polarities are used or where the current direction changes during circuit operation, the functions of the "source electrode" and the "drain electrode" are sometimes interchanged. Therefore, in this application, the "source electrode" and the "drain electrode" can be interchanged.

[0070] In this application, "electrical connection" includes the situation where constituent elements are connected together by a component having a certain electrical function. There are no particular limitations on the "component having a certain electrical function," as long as it enables the transmission and reception of electrical signals between the connected constituent elements. Examples of "component having a certain electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other components with one or more functions.

[0071] In this application, "parallel" refers to a state in which the angle formed by two straight lines is greater than -10° and less than 10°, and therefore can include a state in which the angle is greater than -5° and less than 5°. In addition, "perpendicular" refers to a state in which the angle formed by two straight lines is greater than 80° and less than 100°, and therefore can include a state in which the angle is greater than 85° and less than 95°.

[0072] In this application, "set in a layer" refers to all structures in that layer being formed using the same film deposition process and the same patterning process. Depending on the specific pattern, the same patterning process may include multiple exposure, development, or etching processes, and the specific patterns in the layer structure formed by the same patterning process may be continuous or discontinuous, and these specific patterns may also be at different heights or have different thicknesses.

[0073] In this application, the terms "film" and "layer" can be interchanged. For example, "conductive layer" can sometimes be replaced with "conductive film". Similarly, "insulating film" can sometimes be replaced with "insulating layer".

[0074] In this application, "about" and "approximately" refer to situations where there are no strict limits and the process and measurement errors are allowed.

[0075] With the rapid development of Organic Light Emitting Diode (OLED) display panels, mobile terminals have entered the era of full-screen and foldable screens. To provide users with a better experience, full-screen, narrow-bezel, high-resolution, and foldable screens will inevitably become important development directions for OLED display panels in the future. To make display panels lighter and thinner to adapt to foldable and rollable products, Flexible Multi-Layer On Cell (FMLOC) technology has emerged.

[0076] To enhance user experience, punch-hole technology is often used on top of the FMLOC structure to house optical components such as the front-facing camera in the opening area, achieving a higher screen-to-body ratio. However, the inventors noticed that punch-hole technology cuts off the FMLOC touch structure in the opening area, effectively severing the touch structure at the edge of the opening. This means that the touch structure in this part, along with the touch structure around the perimeter of the display panel, is directly exposed to external environmental signals. The touch signal becomes susceptible to interference from external noise, affecting the touch performance at the edges of the opening area and the display panel, resulting in a poor user experience.

[0077] In view of the above, the embodiments of this application propose the following technical solutions.

[0078] Figure 1 A schematic diagram of the structure of a display substrate according to an embodiment of this application is shown; Figure 2 It shows Figure 1 The image shows a cross-sectional view of the touch layer in the display substrate along section AA.

[0079] like Figure 1As shown, this application embodiment proposes a display substrate 100, including: a substrate 11, including an opening region 111, a display region 112 surrounding the opening region 111, and a peripheral region 113 surrounding the display region 112; a touch layer (not shown), located on one side of the substrate 11, including a shielding structure 152, the shielding structure 152 at least surrounding a portion of the opening region 11, and passing through the display region 112 to connect to the peripheral region 113, and extending along the peripheral region 113 to connect to a touch driver chip IC; and an encapsulation layer (not shown), located between the substrate 11 and the touch layer.

[0080] The substrate 11 includes an aperture region 111, a display region 112 surrounding the aperture region 111, and a peripheral region 113 surrounding the display region 112. The aperture region 111 may not contain any film layers, but may house optical devices such as a front-facing camera. The other film layers in the display region 112 can house display and touch structures, providing display and touch functionality to the display substrate 100. The peripheral region 113 is used for wiring, such as housing gate drive lines.

[0081] Optionally, the substrate 11 can be a flexible substrate, such as acrylic, cyclic olefin polymer (COP), polyimide (PI), etc., or it can be a rigid substrate, which is not limited here.

[0082] Optionally, the opening area 111 can be roughly circular, racetrack-shaped, rectangular, or other shapes, and is not limited here.

[0083] Optionally, the number of opening areas 111 can be one, two, three or more, and is not limited here.

[0084] Optionally, the display area 112 can be roughly rectangular or other regular shapes, or roughly heart-shaped or other irregular shapes; no limitation is made here.

[0085] Optionally, the shape of the peripheral area 113 is consistent with the shape of the outer edge of the display area 112. That is, it can be roughly a regular shape such as a rectangle, or it can be roughly a irregular shape such as a heart. There is no limitation here.

[0086] The touch layer, located on one side of the substrate 11, includes a shielding structure 152. It is understood that the touch layer, including the touch structure, provides touch functionality to the display substrate 100, offering users better interactive functions and a superior user experience. The shielding structure 152 can shield against interference from external signals, ensuring the stability of the touch signal of the touch structure, thereby improving the touch performance of the touch structure.

[0087] The shielding structure 152 at least surrounds a portion of the opening area 111, passes through the display area 112, connects to the peripheral area 113, and extends along the peripheral area 113 to connect to the touch driver chip IC. The shielding structure 152 can form an electrical connection path that sequentially passes through the opening area 111, the display area 112, and the peripheral area 113, connecting to the touch driver chip IC. This constitutes a signal barrier surrounding most of the display area 112, shielding it from interference from external signals outside the opening area 111 and the peripheral area 113 (i.e., the display area 112), ensuring the stability of the touch signal and thus improving the touch performance. Simultaneously, it protects the touch structure in the contact areas between the display area 112 and the opening area 111, and between the display area 112 and the peripheral area 113, from external signal interference, thus maintaining consistent touch performance with the touch structures in other areas of the display area 112.

[0088] An encapsulation layer is located between the substrate 11 and the touch layer. The encapsulation layer protects the display structure within the display area from external water and oxygen corrosion, thereby extending the lifespan of the display substrate 100. The touch layer is directly disposed on top of the encapsulation layer, allowing for a thinner display substrate 100 and better bending performance.

[0089] like Figure 2 As shown, the touch layer includes a first metal layer 1502 located on one side of the substrate 11, a second metal layer 1504 located on the side of the first metal layer 1502 away from the substrate 11, and an insulating layer 1503 located between the first metal layer 1502 and the second metal layer 1504. The touch structure is disposed within the first metal layer 1502 and the second metal layer 1504 to provide touch functionality to the display substrate 100. The insulating layer 1503 provides insulation between the first metal layer 1502 and the second metal layer 1504.

[0090] Optionally, the materials of the first metal layer 1502 and the second metal layer 1504 may include metals such as aluminum (Al), molybdenum (Mo), copper (Cu), and silver (Ag) or alloys of these metals, and are not limited herein.

[0091] Optionally, the material of the insulating layer 1503 can be a transparent inorganic insulating material or an organic insulating material to obtain good bending resistance, and no limitation is made here.

[0092] Optionally, the touch layer further includes a buffer layer 1501 located between the substrate 11 and the first metal layer 1502, and a protective layer 1505 located on the side of the second metal layer 1504 away from the substrate 11. The buffer layer 1501 is used to improve the adhesion between the touch layer and the encapsulation layer. The protective layer 1505 serves to protect the touch structure and planarize the touch layer. No limitations are specified herein.

[0093] The shielding structure 152 is disposed in the first metal layer 1502 and / or the second metal layer 1504. The shielding structure 1502, disposed in the first metal layer 1502 and / or the second metal layer 1504, and disposed in the same layer as the touch structure, allows the shielding structure 152 to better shield the touch structure from interference from external signals, ensuring the stability of the touch signal of the touch structure, thereby improving the touch performance of the touch structure.

[0094] Optionally, the shielding structure 152 may be disposed only in the first metal layer 1502, or the shielding structure 152 may be disposed only in the second metal layer 1504, or the shielding structure 152 may be disposed in both the first metal layer 1502 and the second metal layer 1504, without limitation.

[0095] Figure 3 It shows Figure 1 The diagram shows an enlarged view of region B in the display substrate. Figure 4 It shows Figure 3 An enlarged schematic diagram of region C in the display substrate shown.

[0096] like Figure 1 and Figure 3 As shown, the shielding structure 152 includes a grounding wire 1521 and a signal protection wire 1522. The grounding wire 1521 is grounded through the touch driver chip IC, which can conduct external noise to the ground, thus providing better shielding against external signals. The signal protection wire 1522 is connected to the touch signal through the touch driver chip IC. While providing some shielding against external signals, it effectively prevents signal crosstalk between the touch structure and the grounding wire 1521, and also prevents signal crosstalk within the touch structure itself, i.e., between touch electrodes, between touch traces, and between touch electrodes and touch traces.

[0097] like Figure 4As shown, the shielding structure 152 includes a first portion 152a located in the opening area 111, a second portion 152b located in the display area 112, a third portion 152c located in the peripheral area 113, a first connecting structure 152d connecting the first portion 152a and the second portion 152b, and a second connecting structure 152e connecting the second portion 152b and the third portion 152c. The first portion 152a is disposed within the opening area 111, including a portion surrounding a portion of the opening area 111 and a portion leading to the display area 112. It can shield interference from external signals within the opening area 111, ensuring the stability of the touch signal of the touch structure in the contact area between the display area 112 and the opening area 111. The second portion 152b is disposed within the display area 112, including a portion leading to the opening area 111 and a portion leading to the peripheral area 113. The third part 152c includes a portion surrounding the partial display area 112, a portion leading to the display area 112, and a portion connected to the touch driver chip IC. It can shield against interference from external signals outside the peripheral area 113, ensuring the stability of the touch signal in the touch structure of the contact area between the display area 112 and the peripheral area 113. The two ends of the first connecting structure 152d are respectively connected to the portion of the first part 152a leading to the display area 112 and the portion of the second part 152b leading to the opening area 111, thus connecting the first part 152a and the second part 152b. The two ends of the second connecting structure 152e are respectively connected to the portion of the second part 152b leading to the peripheral area 113 and the portion of the third part 152c leading to the display area 112, thus connecting the second part 152b and the third part 152c.

[0098] Optionally, the portion of the first part 152a surrounding the partial opening area 111 can be set close to the edge of the opening area 111, which can reduce the overall width of the edge of the opening area 111, thereby reducing the area of ​​the opening area 111 and achieving a higher screen-to-body ratio. The shape of the portion of the first part 152a surrounding the partial opening area 111 is consistent with the shape of the opening area 111, that is, it can be roughly circular, racetrack-shaped, rectangular, etc., and is not limited here.

[0099] Optionally, the second part 152b can be generally linear, extending from the portion of the first part 152a leading to the display area 112 to the portion of the third part 152c leading to the display area 112. This can reduce the overall length of the shielding structure 152 passing through the display area 112, thereby reducing the impact of the shielding structure 152 on the integrity of the touch structure. The second part 152b can be generally linear, curved, wavy, or other shapes, and is not limited here.

[0100] Optionally, the portion of the third part 152c surrounding the partial display area 112 can be positioned close to the outer edge of the display area 112, which can reduce the overall width of the surrounding area 113, thereby reducing the bezel width and achieving a narrow bezel. The shape of the portion of the third part 152c surrounding the partial display area 112 is consistent with the shape of the outer edge of the display area 112, that is, it can be roughly rectangular or other regular shapes, or roughly heart-shaped or other irregular shapes, without limitation.

[0101] Optionally, the portion of the third part 152c surrounding the partial display area 112 may have an opening to release static electricity from longer traces in the shielding structure 152. The specific location of the opening can be set according to the actual trace length and is not limited here. Alternatively, the portion of the third part 152c surrounding the partial display area 112 may not have an opening, retaining a complete connected structure, and is not limited here.

[0102] Optionally, the first connecting structure 152d can be generally linear, extending from the portion of the first part 152a leading to the display area 112 to the portion of the second part 152b leading to the opening area 111. This can reduce the overall length of the shielding structure 152, thereby reducing the impact of the shielding structure 152 on the integrity of the touch structure. The first connecting structure 152d can be generally linear, curved, wavy, or other shapes, and is not limited here.

[0103] Optionally, the second connecting structure 152e can be generally linear, extending from the portion of the second part 152b leading to the opening area 111 to the portion of the third part 152c leading to the display area 112. This can reduce the overall length of the shielding structure 152, thereby reducing the impact of the shielding structure 152 on the integrity of the touch structure. The second connecting structure 152e can be generally linear, curved, wavy, or other shapes, and is not limited here.

[0104] Dividing the shielding structure 152 into a first part 152a, a second part 152b, a third part 152c, a first connecting structure 152d, and a second connecting structure 152e allows the shielding structure 152 to pass sequentially through the opening area 111, the display area 112, and the peripheral area 113 and connect to the touch driver chip IC, resulting in a more complete structure. This better shields against external signal interference, ensuring the stability of the touch signal and improving the touch performance of the touch structure. Furthermore, since the shielding structure 152 is located within the first metal layer 1502 and / or the second metal layer 1504, the appropriate arrangement of the second part 152b, the first connecting part 152d, and the second connecting part 152e reduces the impact of the shielding structure 152 on the integrity of the touch structure, thus ensuring its touch performance.

[0105] Figures 5 to 7 It shows Figure 4 The image shows three cross-sectional views of the touch layer along section DD in the display substrate.

[0106] like Figure 5 As shown, in the first part 152a, the grounding wire 1521 can be a single-layer structure, only disposed in the first metal layer 1502. The grounding wire 1521 can shield the first metal layer 1502 from interference from external signals, ensuring the stability of the touch signal of the touch structure in the first metal layer 1502.

[0107] like Figure 6 As shown, in the first part 152a, the grounding wire 1521 can be a single-layer structure, only disposed in the second metal layer 1504. The grounding wire 1521 can shield the second metal layer 1504 from interference from external signals, ensuring the stability of the touch signal of the touch structure in the second metal layer 1504.

[0108] like Figure 7 As shown, in the first part 152a, the grounding wire 1521 can be a double-layer structure, disposed in both the first metal layer 1502 and the second metal layer 1504. The grounding wires 1521 disposed in different layers can be connected through vias 1506 in the insulating layer 1503 within the portion of the first part 152a surrounding the partial opening area 111. The grounding wire 1521 can simultaneously shield the first metal layer 1502 from external signal interference and the second metal layer 1504 from interference, ensuring the stability of the touch signals in the touch structures of the first metal layer 1502 and the second metal layer 1504.

[0109] Understandable, Figure 4 In the middle DD, the grounding wire 1521 is located. The signal protection wire 1522 can be set in the same way as the three setting methods of the grounding wire 1521. That is, in the first part 152a, the signal protection wire 1522 can be set in a single layer, either only in the first metal layer 1502 or only in the second metal layer 1504. The signal protection wire 1522 can also be set in a double layer, simultaneously in the first metal layer 1502 and the second metal layer 1504.

[0110] Optionally, in the first part 152a, both the grounding wire 1521 and the signal protection wire 1522 are single-layer structures. That is, in the first part 152a, the grounding wire 1521 is only disposed in the first metal layer 1502 or only disposed in the second metal layer 1504, and the signal protection wire 1522 is also only disposed in the first metal layer 1502 or only disposed in the second metal layer 1504, without any limitation.

[0111] Optionally, in the first part 152a, the grounding wire 1521 and the signal protection wire 1522 are arranged in different layers. That is, in the first part 152a, the grounding wire 1521 is only arranged in the first metal layer 1502, and the signal protection wire 1522 is only arranged in the second metal layer 1504, or the grounding wire 1521 is only arranged in the second metal layer 1504, and the signal protection wire 1522 is only arranged in the first metal layer 1502; this is not limited here. With the grounding wire 1521 and the signal protection wire 1522 arranged in different layers, the shielding structure 152 can simultaneously shield the first metal layer 1502 from interference from external signals and the second metal layer 1504 from interference from external signals, ensuring the stability of the touch signal of the touch structure in the first metal layer 1502 and the second metal layer 1504.

[0112] Optionally, in the first part 152a, the grounding wire 1521 and the signal protection wire 1522 are arranged in the same layer. That is, in the first part 152a, the grounding wire 1521 and the signal protection wire 1522 are simultaneously arranged in the first metal layer 1502 or simultaneously arranged in the second metal layer 1504, which is not limited here. With the grounding wire 1521 and the signal protection wire 1522 arranged in the same layer, the shielding structure 152 can better shield the interference of external signals to the first metal layer 1502 or to the second metal layer 1504, and better ensure the stability of the touch signal of the touch structure in the first metal layer 1502 or the second metal layer 1504.

[0113] Optionally, in the first part 152a, both the grounding wire 1521 and the signal protection wire 1522 have a double-layer structure. That is, in the first part 152a, the grounding wire 1521 is disposed in both the first metal layer 1502 and the second metal layer 1504, and the signal protection wire 1522 is disposed in both the first metal layer 1502 and the second metal layer 1504. With both the grounding wire 1521 and the signal protection wire 1522 having a double-layer structure, the shielding structure 152 can simultaneously and better shield external signals from interfering with both the first metal layer 1502 and the second metal layer 1504, thus better ensuring the stability of the touch signal of the touch structure in both the first metal layer 1502 and the second metal layer 1504.

[0114] Optionally, in the first part 152a, one of the grounding wire 1521 and the signal protection wire 1522 may be a single-layer structure and the other may be a double-layer structure; this is not limited here.

[0115] Optionally, in the first part 152a, both the grounding wire 1521 and the signal protection wire 1522 can be partially single-layered or partially double-layered, with structural conversion achieved through the via 1506 in the insulating layer 1503. No limitation is made here.

[0116] like Figure 1 , Figure 3as well as Figure 4 As shown, in the first part 152a, the grounding wire 1521 is located on the side of the signal protection wire 1522 closer to the center of the opening area 111. The first part 152a is set within the opening area 111, and the grounding wire 1521 is located on the side of the signal protection wire 1522 closer to the center of the opening area 111. This arrangement allows the grounding wire 1521 to come into contact with external signals earlier than the signal protection wire 1522, thus enabling the grounding wire 1521, with its better shielding function, to provide better signal protection for the opening area 111. Furthermore, it allows the signal protection wire 1522 to be closer to the touch structure in the contact area between the display area 112 and the opening area 111 than the grounding wire 1521, effectively preventing signal crosstalk between the touch structure and the grounding wire 1521, and allowing the signal protection wire 1522 to better prevent signal crosstalk within the touch structure.

[0117] Figure 8 It shows Figure 4 The diagram shows an enlarged view of region E in the display substrate. Figure 9 It shows Figure 8 The diagram shows a cross-sectional view of the display substrate along section FF; Figure 10 A schematic diagram of another display substrate according to an embodiment of this application is shown.

[0118] like Figures 1 to 3 As shown, the touch layer also includes a plurality of touch electrodes 1511. The plurality of touch electrodes 1511 include a plurality of electrodes along a first direction (…). Figure 1 The first touch electrode 1511a is arranged in the horizontal direction and the plurality of electrodes are arranged along the second direction. Figure 1 The second touch electrode 1511b is arranged vertically in the middle. Both the first touch electrode 1511a and the second touch electrode 1511b are disposed in the second metal layer 1502 and are insulated from each other. At the junction of the first touch electrode 1511a and the second touch electrode 1511b, the first touch electrode 1511a is directly electrically connected to the second metal layer 1504, while the second touch electrode 1511b is disconnected in the second metal layer 1502 and electrically connected to the bridging electrode 1511c located in the first metal layer 1502 through a via 1506 in the insulating layer 1503, thus achieving conductivity. Alternatively, the second touch electrode 1511b can be directly electrically connected to the second metal layer 1504, while the first touch electrode 1511a is disconnected in the second metal layer 1502 and electrically connected to the bridging electrode 1511c located in the first metal layer 1502 through a via 1506 in the insulating layer 1503, thus achieving conductivity; this is not limited to either method. Alternatively, the touch electrode 1511 can be disposed on the first metal layer 1502, and the bridging electrode 1511c can be disposed on the second metal layer 1504; this is not limited here.

[0119] Optionally, the first touch electrode 1511a can be a touch driving electrode (Tx), and the second touch electrode 1511b can be a touch sensing electrode (Rx). Alternatively, the first touch electrode 1511a can be a touch sensing electrode, and the second touch electrode 1511b can be a touch driving electrode; this is not limited here. The touch driving chip IC senses the capacitance value Cm between the touch driving electrode and the touch sensing electrode before and after finger loading, as well as the change in capacitance ΔCm, and determines the finger position based on ΔCm, thereby making a touch response.

[0120] Optionally, each touch electrode 1511 may be composed of multiple diamond-shaped electrode blocks electrically connected together. The electrode blocks may also be in other shapes, which are not limited here.

[0121] like Figure 3 As shown, a compensation structure 1515 and a light-shielding structure 1516 located on the side of the compensation structure 1515 near the center of the opening area 111 can be provided at the edge of the opening area 111. Since the on-screen punching technology removes the touch structure in the opening area 111, the touch electrodes 1511 around the opening area 111 become incomplete, affecting touch performance. Providing a compensation structure 1515 at the edge of the opening area 111, electrically connected to the touch electrodes 1511 around the opening area 111, can achieve capacitance compensation for the touch structure at the edge of the opening area 111, thereby ensuring the touch performance of the touch structure around the opening area 111. Since optical components are located within the opening area 111, external light sources can affect these components, and the light from the optical components can also affect the display effect of the display area 112 around the opening area 111. Providing a light-shielding structure 1516 at the edge of the opening area 111, which is insulated from the touch structure, can effectively block the light from external light sources and optical components, avoiding optical problems in the display substrate 100.

[0122] Optionally, the shapes of the compensation structure 1515 and the light-shielding structure 1516 are consistent with the shape of the opening area 111, that is, they can be roughly circular, racetrack-shaped, rectangular, etc., and are not limited here.

[0123] Optionally, the compensation structure 1515 and the light-shielding structure 1516 can be provided with openings to release static electricity in structures with larger areas. The specific opening positions can be set according to the actual structural area and are not limited here. Alternatively, the compensation structure 1515 and the light-shielding structure 1516 can be without openings to retain a complete connected structure, and this is not limited here.

[0124] Optionally, the compensation structure 1515 may include an inner ring structure and an outer ring structure, thereby better realizing the connection compensation with the touch electrodes 1511 around the opening area 111. The specific setting method can be set according to the actual touch electrode 1511 structure, and is not limited here.

[0125] Optionally, the compensation structure 1515 can be disposed in the second metal layer 1504. The fact that the compensation structure 1515 and the touch electrode 1511 are disposed in the same layer simplifies the manufacturing process, allowing the compensation structure 1515 to be directly electrically connected to the touch electrode 111 without needing to pass through the via 1506 in the insulating layer 1503. This improves the capacitance compensation effect of the compensation structure 1515, thereby ensuring the touch performance of the touch structure around the opening area 111. The compensation structure 1515 can also be disposed in the first metal layer 1502; this is not limited to this setting.

[0126] Optionally, the portion of the first part 152a leading to the display area 112 can be cut off and pass through a portion of the compensation structure 1515. Since the compensation structure 1515 is electrically connected to the touch structure, this portion of the compensation structure 1515 still needs to be at least partially connected to ensure the capacitance compensation effect of this portion of the compensation structure 1515. Alternatively, the portion of the first part 152a leading to the display area 112 can also pass through the compensation structure 1515 without being cut off, passing through the via 1506 in the insulating layer 1503; this is not limited here.

[0127] Optionally, the light-shielding structure 1516 can be disposed in the first metal layer 1502. Since the wiring in the opening area 111 will use the first metal layer 1502, placing the light-shielding structure 1516 in the first metal layer 1502 can avoid the uneven load problem caused by both the compensation structure 1515 and the light-shielding structure 1516 being disposed in the second metal layer 1504, ensuring the uniformity of the load on the first metal layer 1502 and the second metal layer 1504 in the opening area 111. The light-shielding structure 1516 can also be disposed in the second metal layer 1504, which is not limited here.

[0128] Optionally, the portion of the first part 152a leading to the display area 112 can be cut off and pass through a portion of the light-shielding structure 1516. Since the light-shielding structure 1516 is insulated from the touch structure, the portion of the first part 152a leading to the display area 112 can completely pass through this portion of the light-shielding structure 1516, simplifying the manufacturing process. This eliminates the need for the portion of the first part 152a leading to the display area 112 to pass through the light-shielding structure 1516 via the via 1506 in the insulating layer 1503. Alternatively, the portion of the first part 152a leading to the display area 112 can also pass through the light-shielding structure 1516 without being cut off, but through the via 1506 in the insulating layer 1503; this is not limited here.

[0129] like Figure 4 and Figure 8As shown, the second part 152b and the touch electrode 1511 are both disposed in the second metal layer 1504. Since the shielding structure 152 passes through the display area 112, the opening area 111 will be connected to the surrounding area 113, causing the touch structure in the contact area between the display area 112 and the second part 152b to directly contact external signals, thus becoming susceptible to interference. By having the second part 152b and multiple touch electrodes 1511 disposed in the same layer, the shielding structure 152 can better shield against interference from external signals caused by the signal connection between the opening area 111 and the surrounding area 113, ensuring the stability of the touch signal in the contact area between the display area 112 and the second part 152b.

[0130] Understandable, Figure 8 In the diagram, FF represents the location of display area 112. Display area 112 includes a substrate 11, a driving circuit layer 12 located on one side of the substrate 11, a display function layer 13 located on the side of the driving circuit layer 12 away from the substrate 11, an encapsulation layer 14 located on the side of the display function layer 13 away from the substrate 11, and a touch layer 15 located on the side of the encapsulation layer 14 away from the display function layer 13. The display function layer 13 includes an array of light-emitting units 131 and a pixel defining layer 132. Each light-emitting unit 131 may include at least one sub-pixel. The pixel defining layer 132 has an opening, and the sub-pixel is disposed within the opening of the pixel defining layer 132. The driving circuit layer 12 includes a pixel driving circuit for driving the light-emitting units 131 in the display function layer 13 to emit light, providing display functionality to the display substrate 100.

[0131] Optionally, the pixel driving circuit includes thin-film transistors (TFTs) and storage capacitors. The pixel driving circuit can be a 2T1C pixel driving circuit, a 3T1C pixel driving circuit, a 4T1C pixel driving circuit, a 6T1C pixel driving circuit, a 7T1C pixel driving circuit, a 7T2C pixel driving circuit, an 8T1C pixel driving circuit, etc., and is not limited here. Here, nTmC indicates that a pixel driving circuit includes n TFTs (represented by the letter "T") and m storage capacitors (represented by the letter "C"). The TFTs can be P-type transistors or N-type transistors, and are not limited here. Using the same type of TFTs in the pixel driving circuit can simplify the process flow, reduce process difficulty, and improve product yield.

[0132] Optionally, the driving circuit layer 12 may include a semiconductor layer, a first gate metal layer, a second gate metal layer, and a source / drain metal layer sequentially disposed on the substrate 11. Insulating layers are disposed between the semiconductor layer and the substrate 11, between the semiconductor layer and the first gate metal layer, between the first and second gate metal layers, between the second gate metal layer and the source / drain metal layers, and on the side of the source / drain metal layer away from the substrate 11. The semiconductor layer includes at least the active layer of a thin-film transistor, the first gate metal layer includes at least the gate electrode of the thin-film transistor and the first capacitor electrode of the storage capacitor, the second gate metal layer includes at least the second capacitor electrode of the storage capacitor, and the source / drain metal layer includes at least the source electrode and the drain electrode of the thin-film transistor. No further limitations are imposed.

[0133] Optionally, the driving circuit layer 12 may include scan signal lines, data signal lines, and light emission signal lines connected to the pixel driving circuit. The pixel driving circuit is configured to receive the data voltage transmitted by the data signal lines under the control of the scan signal lines and the light emission signal lines, and output a corresponding current to the light emission unit 131, thereby controlling the intensity of light emission from the light emission unit 131. No limitations are imposed here.

[0134] Optionally, the light-emitting unit 131 may include red sub-pixels, green sub-pixels, and blue sub-pixels arranged in sequence. The red sub-pixels emit red light, the green sub-pixels emit green light, and the blue sub-pixels emit blue light. The light-emitting unit 131 may also include red, green, and blue sub-pixels and white sub-pixels, or only white sub-pixels. The white sub-pixels emit white light. No limitation is made here.

[0135] Optionally, the sub-pixels in the light-emitting unit 131 can be roughly rectangular, rhomboid, pentagonal, hexagonal, etc., and arranged in a certain pattern, without limitation.

[0136] Optionally, the sub-pixels in the light-emitting unit 131 can be OLEDs, including a first electrode, a second electrode located on the side of the first electrode away from the substrate 11, and an organic light-emitting layer located between the first electrode and the second electrode. The first electrode can be an anode, electrically connected to the pixel circuit, and the second electrode can be a cathode. The orthogonal projection of the organic light-emitting layer on the substrate 11 lies within the orthogonal projection of the first electrode on the substrate 11. The organic light-emitting layer can include a hole injection layer, a hole transport layer, an electron blocking layer, a light-emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer arranged sequentially. The hole injection layer and electron injection layer of all sub-pixels can be common layers connected together, the hole transport layer and electron transport layer of all sub-pixels can be common layers connected together, and the hole blocking layer of all sub-pixels can be common layers connected together. The light-emitting layer and electron blocking layer of adjacent sub-pixels can have a small overlap or can be isolated. The hole blocking layer can be a common layer connected together, which is not limited here. The sub-pixels in the light-emitting unit 131 can also be quantum dot light-emitting diodes (QLEDs), and this is not a limitation.

[0137] Optionally, the display functional layer 13 may also include other membrane layers such as spacers, which are not limited here.

[0138] like Figure 4 , Figure 8 and Figure 9 As shown, both the second part 152b and the touch electrode 1511 are metal mesh structures 1513. The orthographic projection of the metal mesh structure 1513 on the substrate 11 is within the orthographic projection of the pixel limiting layer 132 on the substrate 11. The orthographic projection of the metal mesh structure 1513 on the substrate 11 does not overlap with the orthographic projection of the sub-pixels in the light-emitting unit 131 on the substrate 11. Each metal mesh in the metal mesh structure 1513 can correspond to at least one sub-pixel in the light-emitting unit 131. This ensures that the metal mesh structure 1513 does not block the light-emitting area, guarantees the light emission efficiency of the light-emitting unit 131, and avoids the metal mesh structure 1513 affecting the normal display of the display substrate 100.

[0139] Optionally, each metal grid in the metal grid structure 1513 may be roughly rectangular, rhomboid, pentagonal, hexagonal, or similar in shape, and may be arranged in a certain pattern, without limitation.

[0140] Optionally, each metal grid in the metal grid structure 1513 may correspond to one sub-pixel, two sub-pixels, or other number of sub-pixels in the light-emitting unit 131, without limitation.

[0141] like Figure 4 and Figure 8As shown, the second part 152b includes multiple second sub-parts 152b1. Each second sub-part 152b1 includes at least one row of metal mesh structures 1513 extending in the direction of the second part 152b, and each second sub-part 152b1 is insulated from the touch electrode 1511 through a break 1514 in the metal mesh structure 1513. Each second sub-part 152b1 corresponds to a grounding wire 1521 or a signal protection wire 1522. The inclusion of a row of metal mesh structures 1513 in the direction of the second part ensures the shielding effect of the shielding structure 152 and reduces the overall area of ​​the shielding structure 152 passing through the display area 112, thereby reducing the impact of the shielding structure 152 on the integrity of the touch structure. The metal mesh structure 1513 has a break 1514, which serves to insulate the shielding structure 152 from the touch electrode 1511 and to insulate different touch electrodes 1511 from each other. By insulating the second sub-part 152b1 with the touch electrode 1511 through the break 1514 in the metal mesh structure 1513, the shielding structure 152 can ensure that the touch function of the touch electrode 1511 is not affected. At the same time, the second sub-part 152b1 can shield the interference of external signals caused by the connection between the opening area 111 and the peripheral area 113, ensuring the stability of the touch signal of the touch structure and thus improving the touch performance of the touch structure.

[0142] Optionally, the touch electrode 1511 further includes a virtual electrode 1511d. The virtual electrode 1511d is located between adjacent second sub-parts 152b1 and inside each electrode block of the touch electrode 1511. It is insulated from the first touch electrode 1511a, the second touch electrode 1511b, and the shielding structure 152 through the break 1514 and does not have touch functionality. The two adjacent second sub-parts 152b1 are insulated by the virtual electrode 1511d between them, thereby ensuring that no signal crosstalk occurs between the ground wire 1521 and the signal protection line 1522 in the display area. No further limitations are imposed here.

[0143] Optionally, in the extension direction perpendicular to the second part 152b, the signal protection line 1522 is located at the edge of the second part 152b, and the grounding line 1521 is located inside the second part. The signal protection line 1522 being located at the edge of the second part 152b allows it to be closer to the touch structure within the display area, effectively preventing signal crosstalk between the touch structure and the grounding line 1521, and enabling the signal protection line 1522 to better prevent signal crosstalk within the touch structure. No limitation is made here.

[0144] like Figure 1 , Figure 3 and Figure 10As shown, the bisector of the length direction of one of the multiple touch electrodes 1511 passes through the second portion 152b along its extension direction. The bisector of the length direction of one of the multiple touch electrodes 1511 refers to the bisector of the second direction of a first touch electrode 1511a or the bisector of the first direction of a second touch electrode 1511b. The touch performance of the touch electrodes 1511 is provided by the mutual capacitance value Cm formed between the electrode blocks of the first touch electrode 1511a and the second touch electrode 1511b. The edge portion of each touch electrode 1511's electrode block is the main provider of the mutual capacitance value Cm, while the middle portion of the electrode block is farther from the edge and has less impact on the mutual capacitance value Cm. Furthermore, a virtual electrode 1511d that does not affect the mutual capacitance value Cm is usually placed in the middle of the electrode block. The bisecting line passes through the second part 152b along the extension direction of the second part 152b, which can make the second part 152b as close as possible to the middle position of the touch electrode 1511 in the length direction. This can reduce the area of ​​the second part 152b passing through the edge of the electrode block of the touch electrode 1511, reduce the impact on the mutual capacitance value Cm of the touch electrode 1511, and thus ensure the touch performance of the touch structure.

[0145] Optionally, the extension direction of the second part 152b is the direction with the shortest vertical distance from the opening area 111 to the peripheral area 113. This can further reduce the area of ​​the second part 152b passing through the edge of the electrode block of the touch electrode 1511, reduce the impact on the mutual capacitance value Cm of the touch electrode 1511, and thus ensure the touch performance of the touch structure. No limitation is made here.

[0146] Figure 11 It shows Figure 4 The image shows a cross-sectional view of the touch layer along section GG in the display substrate.

[0147] like Figure 1 , Figure 4 and Figure 10As shown, the touch layer 15 may include touch traces 1512, which are led out from touch electrodes 1511 and extend along the peripheral area 113 to connect to the touch driver chip IC. A third portion 152c is at least partially located on the side of the touch trace 1512 away from the display area 112 and is at least partially parallel to the touch trace 1512. The touch trace 1512 has signal transmission functionality, capable of transmitting touch signals received by the touch electrodes 1511 to the touch driver chip IC, and also transmitting drive signals provided by the touch driver chip IC to the touch electrodes 1511. Because the touch trace 1512 is located in the peripheral area 113, it is in direct contact with external environmental signals, and the touch signal is susceptible to interference from external noise, affecting the stability of the touch signal. Meanwhile, due to the close proximity of the touch traces 1512 and the touch electrodes 1511 at the outer edge of the display area 112, signal crosstalk can occur between the touch traces 1512 and between the touch traces 1512 and the touch electrodes 1511 at the outer edge of the display area 112. Therefore, the third part 152c is at least partially disposed on the side of the touch traces 1512 away from the display area 112. This can, on the one hand, shield the touch traces 1512 from external signal interference, ensuring the stability of the touch signal of the touch traces 1512, and on the other hand, prevent signal crosstalk between the touch traces 1512 and between the touch traces 1512 and the touch electrodes 1511.

[0148] like Figure 11 As shown, the third part 152c is disposed in the first metal layer 1502 and the second metal layer 1504. The third part 152c of different layers is connected through a via 1506 in the insulating layer 1503. The double-layer structure of the third part 152c disposed in the first metal layer 1502 and the second metal layer 1504, and connected in parallel through the via 1506 in the insulating layer 1503, can reduce the overall resistance of the shielding structure 152, and can also better shield external signal interference, ensuring the stability of the touch signal of the touch structure, thereby improving the touch performance of the touch structure.

[0149] like Figure 1 , Figure 3 as well as Figure 4As shown, in the third part 152c, the grounding wire 1521 is located on the side of the signal protection wire 1522 away from the display area 112. The third part 152c is set in the peripheral area 113, and the grounding wire 1521 is located on the side of the signal protection wire 1522 away from the display area 112. On the one hand, this allows the grounding wire 1521 to come into contact with external signals earlier than the signal protection wire 1522, so that the grounding wire 1521 with better shielding function can play a better signal protection role for the display area 112. On the other hand, it allows the signal protection wire 1522 to be closer to the touch structure in the contact area between the display area 112 and the peripheral area 113 than the grounding wire 1521. This can effectively prevent signal crosstalk between the touch structure and the grounding wire 1521, and allow the signal protection wire 1522 to better play its role in preventing signal crosstalk within the touch structure.

[0150] Optionally, the touch trace 1512 can be led out from one side of the touch electrode 1511 or from both sides of the touch electrode 1511 simultaneously; this is not limited here. When the touch trace 1512 is led out from both sides of the touch electrode 1511 simultaneously, in the third part 152c, the signal protection line 1522 can be set between the touch trace 1512 of the first touch electrode 1511a and the touch trace 1512 of the second touch electrode 1511b, thereby better preventing signal crosstalk between the touch traces 1512.

[0151] like Figures 4 to 7As shown, the first connecting structure 152d is connected to the first portion 152a at one end of the opening region 111, and to the second portion 152b at the other end of the display region 112. The first connecting structure 152d is disposed in the first metal layer 1502. The first connecting structure 152d connects the portion of the first portion 152a leading to the display region 112 and the portion of the second portion 152b leading to the opening region 111, thereby achieving communication between the first portion 152a and the second portion 152b. Since the first connecting structure 152d connects the first portion 152a located in the opening region 111 and the second portion 152b located in the display region 112, the first connecting structure 152d will pass through the edge of the opening region 111. The orthographic projection of the first connecting structure 152d on the substrate 11 will inevitably overlap with the orthographic projection of the compensation structure 1515 located in the opening region 111 on the substrate 11. Therefore, by placing the first connecting structure 152d in the first metal layer 1502, structural overlap between the first connecting structure 152d and the compensation structure 1515 placed in the second metal layer 1504 can be avoided. Since the second part 152b is placed in the second metal layer 1504, the first connecting structure 152d needs to be connected to the second part 152b through a via 1506 in the insulating layer 1503. It is understood that the portion of the first part 152a that is only placed in the first metal layer 1502 also needs to be connected to the second part 152b through a via 1506 in the insulating layer 1503.

[0152] Figure 12 It shows Figure 4 The image shows a cross-sectional view of the touch layer along section HH in the display substrate.

[0153] like Figure 4 and Figure 11 As shown, the second connection structure 152e is connected to the second part 152b at one end of the display area 112, and to the third part 152c at the other end of the peripheral area 113. The second connection structure 152e is disposed in the second metal layer 1504. The second connection structure 152e connects the portion of the second part 152b leading to the peripheral area 113 with the portion of the third part 152c leading to the display area 112, thereby achieving communication between the second part 152b and the third part 152c. The fact that the second connection structure 152e and the second part 152b are disposed in the same layer simplifies the manufacturing process, allowing the second connection structure 152e to be directly electrically connected to the second part 152b without needing to pass through the via 1506 in the insulating layer 1503.

[0154] like Figure 11 and Figure 12As shown, the orthographic projection of the touch trace 1512 on the substrate 11 overlaps with the orthographic projection of the second connection structure 152e on the substrate 11. The touch trace 1512 is disposed in the first metal layer 1502 in the overlapping area, and the remaining part is disposed in the first metal layer 1502 and the second metal layer 1504. The touch traces 1504 in different layers are connected through vias 1506 in the insulating layer 1503. Since the second connection structure 152e connects the second part 152b located in the display area 112 and the third part 152c located in the peripheral area 113, the second connection structure 152e will pass through the outer edge of the display area 112. The orthographic projection of the second connection structure 152e on the substrate 11 will inevitably overlap with the orthographic projection of the touch trace 1512 located in the peripheral area 113 on the substrate 11. Therefore, by placing the touch trace 1512 in the overlapping area of ​​the first metal layer 1502, structural intersection between the touch trace 1512 and the second connection structure 152e disposed in the second metal layer 1504 can be avoided. By placing the remaining portion of the touch trace 1512 in a double-layer structure of the first metal layer 1502 and the second metal layer 1504, and connecting it in parallel through the via 1506 in the insulating layer 1503, the overall resistance of the touch trace 1512 can be reduced.

[0155] Optionally, the width of the grounding wire 1521 and the signal protection wire 1522 is 5–20 micrometers, and the spacing is 20–50 micrometers. The 5–20 micrometer width of the grounding wire 1521 and the signal protection wire 1522 allows for a smaller area occupied by the shielding structure 152 while ensuring its shielding effect. This reduces the overall width of the edge of the opening area 111, thereby reducing the area of ​​the opening area 111 and achieving a higher screen-to-body ratio. It also reduces the overall width of the shielding structure 152 passing through the display area 112, thus reducing the impact of the shielding structure 152 on the integrity of the touch structure. Finally, it reduces the overall width of the peripheral area 113, thereby reducing the bezel width and achieving a narrow bezel. Similarly, the grounding wire 1521 and the signal protection wire 1522 have a spacing of 20 to 50 micrometers, which can reduce the area occupied by the shielding structure 152 while ensuring the shielding effect of the shielding structure 152. This can reduce the overall width of the edge of the opening area 111, thereby reducing the area of ​​the opening area 111 and achieving a higher screen ratio. It can also reduce the overall width of the shielding structure 152 passing through the display area 112, thereby reducing the impact of the shielding structure 152 on the integrity of the touch structure. Finally, it can reduce the overall width of the peripheral area 113, thereby reducing the bezel width and achieving a narrow bezel.

[0156] Figure 13 It shows Figure 3 Another enlarged schematic diagram of region C in the display substrate shown; Figure 14 It shows Figure 1An enlarged schematic diagram of the opening area in the display substrate shown; Figure 15 It shows Figure 14 The cross-sectional view of the display substrate shown is along section II; Figure 16 It shows Figure 1 Another enlarged schematic diagram of the opening area in the display substrate shown; Figure 17 It shows Figure 16 The image shows a cross-sectional view of the display substrate along section JJ.

[0157] like Figure 13 , Figure 16 and Figure 17 As shown, the touch layer 15 also includes a crack detection structure 153. The crack detection structure 153 at least surrounds a portion of the opening area 111, passes through the display area 112, and connects to the peripheral area 113. It extends along the peripheral area 113 and connects to the display driver chip (not shown in the figure). In the opening area 111, the crack detection structure 153 is located on the side of the first portion 152a near the center of the opening area 111. In the display area 112, the crack detection structure 153 is located inside the second portion 152b. In the peripheral area 113, the crack detection structure 153 is located on the side of the third portion 152c away from the display area 112. Since there is a risk of screen edge damage and cracking during the manufacturing process of the display substrate 100, cracks may appear in the display area 112, affecting the display function. Therefore, the crack detection structure 153 can detect cracks in the display substrate 100, thereby monitoring product yield and preventing defective products from entering the market. The crack detection structure 153 can form an electrical connection path that sequentially passes through the opening area 111, the display area 112, and the peripheral area 113 and connects to the display driver chip, constituting a crack detection circuit surrounding most of the display area 112. This allows for the detection of cracks in the opening area 111 and the peripheral area 113, thereby monitoring product yield and preventing defective products from entering the market. Since the crack detection structure 153 connects to the display driver chip and carries different signals, and because it is also located in the opening area 111, display area 112, and peripheral area 113, it may cause signal interference to the touch structure. Therefore, by placing the crack detection structure 153 in the opening area 111 on the side of the first part 152a near the center of the opening area 111; inside the display area 112 in the second part; and on the side of the peripheral area 113 away from the display area 112 in the third part 152c, the shielding structure 152 can shield the signal interference from the crack detection structure 153, ensuring the stability of the touch signal of the touch structure and thus improving the touch performance of the touch structure.

[0158] Optionally, the crack detection structure 153 can be configured in the same way as the shielding structure 152, allowing both the crack detection structure 153 and the shielding structure 152 to be fabricated simultaneously, thus simplifying the manufacturing process. No specific limitations are imposed here. For detailed configuration methods, please refer to the configuration details of each part of the shielding structure 152 described above; further elaboration is not required here.

[0159] Optionally, the crack detection structure 153 may include a portion surrounding a portion of the opening area 111 and a portion leading to the display area 112 within the opening area 111. The portion surrounding the opening area 111 may have two loops of wiring. Having two loops of wiring around the portion of the opening area 111 allows for better detection of cracks within the opening area 111, thereby improving product yield and preventing defective products from entering the market. Alternatively, the portion of the crack detection structure surrounding the opening area 111 may have one loop of wiring or more than two loops of wiring; this is not limited here.

[0160] like Figure 9 , Figure 15 and Figure 17 As shown, the encapsulation layer 14 includes at least a first inorganic encapsulation layer 141, a second inorganic encapsulation layer 143 located on the side of the first inorganic encapsulation layer 141 away from the substrate 11, and an organic encapsulation layer 142 located between the first inorganic encapsulation layer 141 and the second inorganic encapsulation layer 143. The opening region 111 includes at least one barrier dam surrounding the opening region 111. The encapsulation layer 14 is used to encapsulate the light-emitting unit 131 in the display substrate 100, isolating the light-emitting unit 131 from the outside air and preventing the light-emitting unit 131 from being corroded by components such as moisture and oxygen in the air. The first inorganic encapsulation layer 141 and the second inorganic encapsulation layer 143 are used to block water and oxygen, and the organic encapsulation layer 142 is used to relieve the stress between the first inorganic encapsulation layer 141 and the second inorganic encapsulation layer 143, giving the encapsulation layer better bending resistance. Since the organic encapsulation layer 142 is fluid before molding, setting at least one barrier around the opening area 111 can block the organic encapsulation layer 142, ensuring that the organic encapsulation layer 142 is not placed in the opening area 111 that is in contact with the outside air. This can prevent the organic encapsulation layer 142 from absorbing moisture in the opening area 111 and affecting the encapsulation effect of the encapsulation layer 14.

[0161] Optionally, the orthographic projection of the organic encapsulation layer 142 on the substrate 11 lies within the orthographic projection of the first inorganic encapsulation layer 141 on the substrate 11, and also within the orthographic projection of the second inorganic encapsulation layer 143 on the substrate 11. The first inorganic encapsulation layer 141 and the second inorganic encapsulation layer 143 are in edge contact, encapsulating the organic encapsulation layer 142. This prevents water and oxygen from eroding the organic encapsulation layer 142, thereby avoiding the organic encapsulation layer 142 absorbing moisture at its edges, which would affect the encapsulation effect of the encapsulation layer 14. At the same time, it avoids the film layer separation phenomenon that easily occurs when bending, effectively ensuring the reliability of the display substrate 100.

[0162] Optionally, the materials of the first inorganic encapsulation layer 141 and the second inorganic encapsulation layer 143 may include any one or any combination of silicon oxynitride (SiOxNy), silicon nitride (SiNx), silicon oxide (SiOx), and aluminum oxide (AlOx), without limitation herein. The first inorganic encapsulation layer 141 and the second inorganic encapsulation layer 143 may be prepared using plasma-enhanced chemical vapor deposition (PECVD), chemical vapor deposition (CVD), atomic layer deposition (ALD), or hexamethyldisiloxane (HDMSO) coating processes, without limitation herein.

[0163] Optionally, the material of the organic encapsulation layer 142 may include at least one of thermosetting and photocurable organic materials, without limitation. The organic encapsulation layer 142 may be prepared by a blade coating process or an inkjet printing (IJP) process, without limitation.

[0164] Optionally, the peripheral area 113 includes at least one barrier surrounding the peripheral area 113, which is not limited here. Since the organic encapsulation layer 142 is fluid before molding, setting at least one barrier surrounding the peripheral area 113 can block the organic encapsulation layer 142, ensuring that the organic encapsulation layer 142 is not placed in the peripheral area 113 that is in contact with the outside air. This can prevent the organic encapsulation layer 142 from absorbing moisture in the peripheral area 113 and affecting the encapsulation effect of the encapsulation layer 14.

[0165] Optionally, the barrier dam may be composed of an organic film layer in the display substrate 100, which is not limited here.

[0166] like Figure 14 and Figure 15As shown, at least one barrier includes a first barrier dam 144, which is located on the side of the first portion 152a near the center of the opening area 111. Since the organic encapsulation layer 142 is fluid before molding, setting the first barrier dam 144 around the opening area 111 can block the organic encapsulation layer 142, ensuring that the organic encapsulation layer 142 is not present in the opening area 111 that is in contact with the outside air. This prevents the organic encapsulation layer 142 from absorbing moisture in the opening area 111, thus affecting the encapsulation effect of the encapsulation layer 14. By placing the first barrier dam 144 on the side of the first part 152a near the center of the opening area 111, the orthographic projection of the first part 152a on the substrate 11 and the orthographic projection of the first barrier dam 144 on the substrate 11 do not overlap. This allows the portion of the first part 152 leading to the display area 112 to connect directly to the first connection structure 152d without crossing the first barrier dam 144, thereby preventing the grounding wire 1521 and the signal protection wire 1522 in the first part 152a from breaking due to step differences.

[0167] like Figure 16 and Figure 17As shown, at least one barrier includes a first barrier 144 and a second barrier 145. The second barrier 145 is located on the side of the first barrier 144 closer to the center of the opening area 111. The signal protection line 1522 in the first part 152a is located on the side of the first barrier 144 farther away from the center of the opening area 111. The grounding line 1521 in the first part 152a is at least partially located between the first barrier 144 and the second barrier 145. The crack detection structure 153 is at least partially located on the side of the second barrier 145 closer to the center of the opening area 111. Since the organic encapsulation layer 142 is fluid before molding, a first barrier dam 144 surrounding the opening area 111 can block the organic encapsulation layer 142, and a second barrier dam 145 can prevent the organic encapsulation layer 142 from crossing the first barrier dam 144. This further ensures that the organic encapsulation layer 142 is not placed in the opening area 111 that is in contact with the outside air, thereby preventing the organic encapsulation layer 142 from absorbing moisture in the opening area 111 and affecting the encapsulation effect of the encapsulation layer 14. By placing the signal protection line 1522 in the first part 152a on the side of the first barrier dam 144 that is far away from the center of the opening area 111, the signal protection line 1522 can be closer to the touch structure in the contact area between the display area 112 and the opening area 111, thereby allowing the signal protection line 1522 to better prevent signal crosstalk inside the touch structure. By placing at least a portion of the grounding wire 1521 in the first part 152a between the first barrier 144 and the second barrier 145, the space between the first barrier 144 and the second barrier 145 can be better utilized, reducing the overall space occupied by the shielding structure 152 and the barrier 145 at the edge of the opening area 111. By placing at least a portion of the crack detection structure 153 on the side of the second barrier 145 near the center of the opening area 111, the crack detection structure 153 can detect cracks in all structures, including the first part 152a, the first barrier 144, the second barrier 145, and the display area 112, thereby monitoring product yield and preventing defective products from entering the market.

[0168] Optionally, the height of the second barrier dam 145 is higher than the height of the first barrier dam 144, which is not limited here. Since the organic encapsulation layer 142 is fluid before molding, the first barrier dam 144 surrounding the opening area 111 can block the organic encapsulation layer 142, and the second barrier dam 145, which is higher than the first barrier dam 144, can block the organic encapsulation layer 142 from crossing the first barrier dam 144. This further ensures that the organic encapsulation layer 142 is not placed in the opening area 111 that is in contact with the outside air, thereby preventing the organic encapsulation layer 142 from absorbing moisture in the opening area 111 and affecting the encapsulation effect of the encapsulation layer 14.

[0169] This application also provides a display device, including the display substrate 100 of the foregoing embodiments. The display device can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator, and is not limited thereto.

[0170] The accompanying drawings in this application only illustrate the structures relevant to this application; other structures can be referenced to common designs. Unless otherwise specified, the embodiments and features described herein can be combined to obtain new embodiments.

[0171] Those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application, and all such modifications and substitutions should be covered within the scope of the claims of this application.

Claims

1. A display substrate, comprising: A substrate includes an opening area, a display area surrounding the opening area, and a peripheral area surrounding the display area; A touch layer, located on one side of the substrate, includes a shielding structure that at least surrounds a portion of the opening area, passes through the display area and connects to the peripheral area, and extends along the peripheral area to connect to the touch driver chip; An encapsulation layer is located between the substrate and the touch layer; The shielding structure includes a grounding wire and a signal protection wire. The shielding structure includes a first part located in the opening area, a second part located in the display area, a third part located in the peripheral area, a first connection structure connecting the first part and the second part, and a second connection structure connecting the second part and the third part. In the first part, the grounding wire is located on the side of the signal protection wire closer to the center of the opening area.

2. The display substrate according to claim 1, characterized in that, The touch layer includes a first metal layer located on the side of the encapsulation layer away from the substrate, a second metal layer located on the side of the first metal layer away from the substrate, and an insulating layer located between the first metal layer and the second metal layer, wherein the shielding structure is disposed in the first metal layer and / or the second metal layer.

3. The display substrate according to claim 2, characterized in that, In the first part, both the grounding wire and the signal protection wire are single-layer structures.

4. The display substrate according to claim 3, characterized in that, In the first part, the grounding wire and the signal protection wire are arranged in separate layers.

5. The display substrate according to claim 3, characterized in that, In the first part, the grounding wire and the signal protection wire are arranged on the same layer.

6. The display substrate according to claim 2, characterized in that, In the first part, both the grounding wire and the signal protection wire have a double-layer structure.

7. The display substrate according to claim 2, characterized in that, The touch layer also includes multiple touch electrodes, and the second part and the touch electrodes are both disposed in the second metal layer.

8. The display substrate according to claim 7, characterized in that, Both the second part and the touch electrode are metal mesh structures; the second part includes a plurality of second sub-parts, each second sub-part including at least one row of the metal mesh structures in the extension direction of the second part, and each second sub-part is insulated from the touch electrode through a break in the metal mesh structure.

9. The display substrate according to claim 7, characterized in that, The bisector of the length direction of one of the plurality of touch electrodes passes through the second portion along the extension direction of the second portion.

10. The display substrate according to claim 7, characterized in that, The touch layer also includes touch traces located in the peripheral area. The touch traces are led out from the touch electrodes and extend along the peripheral area to the touch driver chip. The third portion is at least partially located on the side of the touch traces away from the display area and is at least partially parallel to the touch traces.

11. The display substrate according to claim 10, characterized in that, The third part is disposed in the first metal layer and the second metal layer, and the third part of the different layers is connected through a via in the insulating layer.

12. The display substrate according to claim 11, characterized in that, In the third part, the grounding wire is located on the side of the signal protection line away from the display area.

13. The display substrate according to claim 2, characterized in that, The first connection structure is connected to the first part at one end of the opening area, and the first connection structure is connected to the second part at the other end of the display area. The first connection structure is disposed in the first metal layer.

14. The display substrate according to claim 10, characterized in that, The second connection structure is connected to the second part at one end of the display area, and the second connection structure is connected to the third part at the other end of the peripheral area. The second connection structure is disposed in the second metal layer.

15. The display substrate according to claim 14, characterized in that, The orthographic projection of the touch trace on the substrate and the orthographic projection of the second connection structure on the substrate have an overlapping area, and the touch trace is disposed in the first metal layer in the overlapping area; The remaining portion is disposed in the first metal layer and the second metal layer, and the touch traces of the different layers are connected through vias in the insulating layer.

16. The display substrate according to claim 2, characterized in that, The width of the grounding wire and the signal protection wire is 5-20 micrometers, and the spacing is 20-50 micrometers.

17. The display substrate according to claim 2, characterized in that, The touch layer further includes a crack detection structure, which at least surrounds a portion of the opening area and passes through the display area to connect to the peripheral area, and extends along the peripheral area to connect to the display driver chip. In the opening area, the crack detection structure is located on the side of the first portion closer to the center of the opening area. In the display area, the crack detection structure is located inside the second portion. In the peripheral area, the crack detection structure is located on the side of the third portion away from the display area.

18. The display substrate according to claim 17, characterized in that, The encapsulation layer includes at least a first inorganic encapsulation layer, a second inorganic encapsulation layer located on the side of the first inorganic encapsulation layer away from the substrate, and an organic encapsulation layer located between the first inorganic encapsulation layer and the second inorganic encapsulation layer, and the opening region includes at least one barrier dam surrounding the opening region.

19. The display substrate according to claim 18, characterized in that, The at least one barrier includes a first barrier located on the side of the first portion near the center of the opening area.

20. The display substrate according to claim 18, characterized in that, The at least one barrier includes a first barrier and a second barrier, the second barrier being located on the side of the first barrier closer to the center of the opening area, the signal protection line in the first portion being located on the side of the first barrier farther from the center of the opening area, the grounding line in the first portion being at least partially located between the first barrier and the second barrier, and the crack detection structure being at least partially located on the side of the second barrier closer to the center of the opening area.

21. A display device, characterized in that, Includes the display substrate as described in any one of claims 1 to 20.

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