Fingerprint identification module, manufacturing method thereof and electronic device

Abstract

This application relates to a fingerprint recognition module, its manufacturing method, and an electronic device. The manufacturing method of the fingerprint recognition module includes the following steps: preparing a fingerprint recognition sensor, the fingerprint recognition sensor including a metal layer; preparing a resin layer on one side of the metal layer; irradiating a light beam onto the resin layer on the side of the resin layer opposite to the metal layer; wherein the resin layer includes a covering area covering the metal layer; the metal layer is configured to reflect the light beam incident on the covering area, so that the reflected light beam is incident again on the covering area from the surface of the metal layer. This manufacturing method of the fingerprint recognition module can improve the problem of inaccurate coating in the wet process of fingerprint recognition modules.

Description

Technical Field

[0001] This application relates to the field of fingerprint recognition technology, and in particular to a fingerprint recognition module, its manufacturing method, and an electronic device. Background Technology

[0002] Currently, in the wet coating process of fingerprint recognition modules, the easy flow of coating ink results in poor alignment accuracy of different layers of coating ink during the layered stacking coating process. Summary of the Invention

[0003] Therefore, it is necessary to provide a fingerprint recognition module, its manufacturing method, and an electronic device to address the problem of poor ink alignment accuracy in the wet coating process of fingerprint recognition modules.

[0004] According to one aspect of this application, a method for manufacturing a fingerprint recognition module is provided, the method comprising the following steps:

[0005] A fingerprint recognition sensor is fabricated, the fingerprint recognition sensor comprising a metal layer;

[0006] A resin layer is prepared on one side of the metal layer;

[0007] A light beam is irradiated onto the resin layer on the side of the resin layer opposite to the metal layer.

[0008] The resin layer includes a covering area that covers the metal layer;

[0009] The metal layer is configured to reflect a light beam incident on the coverage area, such that the reflected light beam is incident again on the coverage area from the surface of the metal layer.

[0010] In some embodiments, the light beam passes through the resin layer once, and at least 10% of the energy of the light beam is absorbed by the resin layer.

[0011] In some embodiments, the light beam passes through the resin layer once, and 30% to 70% of the energy of the light beam is absorbed by the resin layer.

[0012] In some embodiments, the thickness of the resin layer is 20 μm ± 3 μm.

[0013] In some embodiments, the wavelength range of the light beam is 306 nm to 380 nm.

[0014] In some embodiments, the resin layer comprises the following raw materials in parts by weight: 60% to 90% resin; 5% to 30% monomer; 2% to 10% initiator; and 2% to 5% additives.

[0015] In some embodiments, the metal layer includes a first metal electrode layer and a second metal electrode layer; the fingerprint recognition sensor further includes a piezoelectric thin film layer disposed between the first metal electrode layer and the second metal electrode layer; and preparing a resin layer on one side of the metal layer includes printing a resin layer on the side of the second metal electrode layer opposite to the piezoelectric thin film layer.

[0016] In some embodiments, the resin layer further includes a peripheral region that does not cover the metal layer and is adjacent to the covered area; the method further includes removing material of the resin layer in the peripheral region from the surface of the fingerprint sensor.

[0017] According to another aspect of this application, a fingerprint recognition module is also provided, comprising: a fingerprint recognition sensor including a metal layer; and a resin layer, the resin layer being prepared on one side surface of the fingerprint recognition sensor using the aforementioned method for manufacturing a fingerprint recognition module, such that the orthographic projection of the resin layer on the surface of the fingerprint recognition sensor overlaps with the orthographic projection of the metal layer on the surface of the fingerprint recognition sensor.

[0018] According to another aspect of this application, an electronic device is also provided, including a fingerprint recognition module as described above.

[0019] The fingerprint recognition module manufacturing method provided in this application utilizes a light beam to irradiate a resin layer prepared on the surface of a metal layer. The metal layer reflects the light beam, allowing the reflected beam to re-enter the area of ​​the resin layer overlapping with the metal layer. Thus, when the resin layer simultaneously has areas overlapping and areas not overlapping with the metal layer, the curing degree of the overlapping and non-overlapping areas differs. Based on this, by adjusting the light beam irradiation according to manufacturing requirements, precise transfer of the resin layer pattern can be achieved, thereby improving the problem of inaccurate coating in the wet process of fingerprint recognition modules. Attached Figure Description

[0020] Figure 1 A schematic diagram of the structure of an ultrasonic fingerprint recognition module in the related technology is shown;

[0021] Figure 2 A flowchart illustrating a method for manufacturing a fingerprint recognition module according to an embodiment of this application is shown;

[0022] Figure 3 This illustration shows a process diagram of a method for manufacturing a fingerprint recognition module according to an embodiment of this application;

[0023] Figure 4 It shows Figure 3 Top view of the fingerprint recognition module;

[0024] Figure 5The transmittance curves of halogen-free glass for UV light of different wavelengths are shown.

[0025] Figure 6 The reflectivity curves of Al at different wavelength bands are shown.

[0026] Explanation of icon numbers:

[0027] 10: Ultrasonic fingerprint recognition module; 221: First metal electrode layer

[0028] 11: Driving electrode; 222: Piezoelectric thin film layer

[0029] 12: Piezoelectric thin film layer; 223: Second metal electrode layer

[0030] 13: Receiving electrode; 23: Resin layer

[0031] 14: Protective layer AA: Coverage area

[0032] 21: Glass substrate BB: Peripheral area

[0033] 22: Metal layer Detailed Implementation

[0034] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0035] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0037] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0038] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0039] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0040] Fingerprint recognition modules are widely used in access control devices and electronic devices such as mobile phones, laptops, and tablets to unlock doors or devices. Currently, fingerprint recognition modules mainly acquire fingerprint images through optical scanning devices (such as miniature prism matrices), temperature-sensitive fingerprint sensors, semiconductor fingerprint sensors, and ultrasonic fingerprint scanning.

[0041] Among them, ultrasonic fingerprint recognition technology can perform more in-depth analysis and sampling of fingerprints, even penetrating below the skin surface to identify the unique three-dimensional features of the fingerprint. Moreover, because ultrasound has a certain degree of penetrability, it can still work when the fingers are slightly dirty or moist, and can penetrate glass, aluminum, stainless steel, sapphire, and other materials for identification. Therefore, ultrasonic fingerprint recognition technology is receiving increasing attention.

[0042] Ultrasonic fingerprint recognition technology utilizes the property that ultrasound can penetrate materials and generate echoes of varying magnitudes depending on the material to achieve fingerprint recognition. Specifically, when ultrasound reaches the surface of different materials, the reflected ultrasound energy and the path it travels differ. Based on this, the difference in acoustic impedance between skin and air can be used to distinguish the location of fingerprint ridges and valleys, thereby achieving fingerprint recognition.

[0043] Figure 1 A schematic diagram of the structure of an ultrasonic fingerprint recognition module in related technologies is shown.

[0044] See Figure 1 An ultrasonic fingerprint recognition module 10 typically includes a driving electrode 11, a receiving electrode 13, and a piezoelectric thin film layer 12 disposed between the driving electrode 11 and the receiving electrode 13. The driving electrode 11 and the receiving electrode 13 form a capacitor. When the capacitor is connected to alternating current, the piezoelectric thin film layer 12 vibrates under the electric field of the capacitor and generates ultrasonic waves. When the ultrasonic waves are transmitted to the fingerprint, they are reflected at the fingerprint. Due to the different reflection energies of the ridges and valleys of the fingerprint, the ultrasonic waves reflected to the piezoelectric thin film layer 12 are different. Based on this, the piezoelectric thin film layer 12 converts the reflected signals into AC voltage, thereby realizing fingerprint recognition.

[0045] Furthermore, the ultrasonic fingerprint recognition module 10 can also be provided with a protective layer 14 to protect the piezoelectric thin film layer 12, the receiving electrode 13 and the driving electrode 11.

[0046] In current ultrasonic fingerprint recognition module manufacturing processes, after coating a piezoelectric polymer film, a low-cost screen printing process is typically used to create the Ag electrode layer and protective layer. The Ag electrode layer and protective layer require layer-by-layer coating. During this process, wet inks (such as silver ink and protective ink) tend to flow downwards due to gravity, causing the ink at the edges to flow before curing. This results in uneven ink distribution at the edges, making precision control difficult. This uneven ink distribution at the edges leads to step differences, which in turn causes uneven thickness when coating subsequent layers, resulting in some areas lacking coating material while others are raised, leading to poor image uniformity at the edges. Therefore, to ensure finished product quality, the ink alignment tolerance must be considered during printing, and the amount of ink at the edges must be designed, which prolongs the process verification time and increases the technical threshold.

[0047] Based on the above problems, the inventors of this application analyzed and found that the main reasons for inaccurate coating in the wet manufacturing process of fingerprint recognition modules include: after coating, it is difficult to avoid ink flowing from the edge of the ink coating to the surrounding area, resulting in the uniformity of the outline shape and thickness of the final cured coating not meeting the pre-designed standards. Based on this, the inventors of this application propose an inventive concept: in the wet manufacturing process of fingerprint recognition modules, the outline boundary line of the cured lower coating layer is used as the dividing line between the cured and uncured areas of the upper coating layer. This ensures that the curing speed of the area where the upper coating layer overlaps with the lower coating layer is greater than the curing speed of the area where the upper coating layer does not overlap with the lower coating layer. In this way, the liquid flow at the edge of the upper coating layer will not affect the outline shape and thickness uniformity of the cured area.

[0048] To achieve zoned curing of the upper coating, the inventors of this application further analyzed and discovered that metallic materials have the characteristic of reflecting electromagnetic waves of certain wavelengths, while polymer materials undergo physical and chemical reactions under the action of electromagnetic waves of certain wavelengths (such as ultraviolet light). Therefore, if a metal layer is first formed, and a polymer coating is coated on the metal layer, and electromagnetic waves that can be reflected by the metal layer and can also deform the polymer coating are applied to the polymer coating, the areas of the polymer coating that overlap with the metal layer will be subjected to secondary electromagnetic waves due to the reflection of electromagnetic waves by the metal layer, while the areas of the polymer coating that do not overlap with the metal layer will not be subjected to secondary electromagnetic waves. This achieves zoned curing of the polymer coating, and the boundary line between the cured and uncured areas is accurately aligned with the outline of the metal layer.

[0049] Specifically, this application provides a method for manufacturing a fingerprint recognition module. After forming a metal layer, a resin layer is prepared on the metal layer. A light beam with a wavelength within a preset wavelength range is used to irradiate the resin layer. The light beam irradiating the area of ​​the resin layer overlapping with the metal layer is reflected at the surface of the metal layer, and the reflected beam further photocures the resin layer. However, the light beam irradiating the area of ​​the resin layer not overlapping with the metal layer is not reflected by the metal layer, so that this area of ​​the resin layer does not undergo secondary photocuring. In this way, the resin layer is divided into cured and uncured areas. The cured area automatically aligns with the electrode layer, achieving precise transfer of the resin layer pattern, thereby improving the problem of inaccurate coating in the wet processing of fingerprint recognition modules.

[0050] Figure 2 A flowchart illustrating a method for manufacturing a fingerprint recognition module according to an embodiment of this application is shown. Figure 3 A schematic diagram illustrating the manufacturing process of a fingerprint recognition module according to an embodiment of this application is shown. Figure 4 It shows Figure 3 A top view of the fingerprint recognition module.

[0051] See Figures 2 to 4 An embodiment of this application provides a method for manufacturing a fingerprint recognition module, comprising the following steps:

[0052] Step S1: Prepare a fingerprint recognition sensor, which includes a metal layer 22;

[0053] Step S2: Prepare a resin layer 23 on one side of the metal layer 22;

[0054] Step S3: Irradiate the resin layer 23 with a light beam on the side of the resin layer 23 that is away from the metal layer 22;

[0055] The resin layer 23 includes a covering area AA covering the metal layer 22; the metal layer 22 is configured to reflect the light beam incident on the covering area AA so that the reflected light beam is incident on the covering area AA again from the surface of the metal layer 22.

[0056] In some exemplary embodiments, the metal layer 22 is made of silver, aluminum, copper, nickel, or gold, and the metal layer 22 may be disposed on the glass substrate 21. The shape of the covered area AA includes a circle, an ellipse, a triangle, a rectangle, a pentagon, or a combination of at least two of these shapes.

[0057] The fingerprint recognition module manufacturing method provided in this application embodiment utilizes a light beam to irradiate a resin layer 23 prepared on the surface of a metal layer 22. The metal layer 22 reflects the light beam, allowing the reflected beam to re-enter the area of ​​the resin layer 23 overlapping with the metal layer 22. Thus, when the resin layer 23 simultaneously has areas overlapping with and not overlapping with the metal layer 22, the curing degree of the overlapping and non-overlapping areas differs. Based on this, by adjusting the light beam irradiation according to manufacturing requirements, precise transfer of the pattern on the resin layer 23 can be achieved, thereby improving the problem of inaccurate coating in the wet process of fingerprint recognition modules.

[0058] In some embodiments, when the light beam passes through the resin layer 23 once, at least 10% of the energy of the light beam is absorbed by the resin layer 23. For example, when the light beam passes through the resin layer 23 once, 15%, 20%, 25%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, and 90% of the energy of the light beam is absorbed by the resin layer 23.

[0059] In an exemplary embodiment, the resin layer 23 includes a covering area AA covering the metal layer 22 and a peripheral area BB not covering the metal layer 22 and adjacent to the covering area AA. When a light beam passes through the resin layer 23 once, 10% of the beam's energy is absorbed by the resin layer 23. After the light beam is irradiated onto the resin layer 23 from the side of the resin layer 23 away from the metal layer 22, in the covering area AA, the light beam first enters the resin layer 23 from the side of the resin layer 23 away from the metal layer 22 and irradiates the surface of the metal layer 22 (i.e., the light beam passes through the resin layer 23 for the first time), and then is reflected by the surface of the metal layer 22 and re-enters the resin layer 23 from the surface of the metal layer 22 (i.e., the light beam passes through the resin layer 23 for the second time). The energy of the light beam entering the resin layer 23 after the first passage of the light beam is I... T 10% of the energy absorbed by resin layer 23 is absorbed by resin layer 23 for the first time. A1 =I T *10%, the remaining 90% is not absorbed by the resin layer 23. If the light beam is UV light with a wavelength of 365nm, then the light beam is almost totally reflected at the surface of the metal layer 22, that is, the remaining 90% is completely reflected at the surface of the metal layer 22. The energy I reflected by the metal layer 22 is... R =I T *90%; the energy I reflected by the surface of the metal layer 22 after the beam passes through the resin layer 23 for the second time. R 10% of the energy is absorbed again by the resin layer 23, and the energy absorbed by the resin layer 23 for the second time is I. A2 =I R *10%, which is I A2 =I T *90% * 10% = I T*9%. Therefore, after the beam passes through the resin layer 23 twice, the sum of the energy absorbed by the resin layer 23 is I. A1 +I A2 =I T *19%. In the outer region BB, the light beam is not reflected by the metal layer 22 after entering the resin layer 23. Therefore, the energy absorbed by the resin layer 23 in this region is I. A1 =I T *10%. Thus, the energy difference I between the covered area AA and the outer area BB. A2 =I T *9%.

[0060] In another exemplary embodiment, the light beam passes through the resin layer 23 once, and 50% of the energy of the light beam is absorbed by the resin layer 23, that is, the energy I absorbed by the resin layer 23 in the first pass. A1 =I T *50%, Energy I reflected by metal layer 22 R =I T *50%, Energy absorbed by resin layer 23 in the second phase (I) A2 =I R *50% = I T *50% * 50% = I T *25%. Therefore, after the light beam passes through the resin layer 23 twice, the sum of the energy absorbed by the resin layer 23 is I. A1 +I A2 =I T *75%, the energy difference between the covered area AA and the outer area BB, I A2 =I T *25%.

[0061] In another exemplary embodiment, the light beam passes through the resin layer 23 once, and 70% of the energy of the light beam is absorbed by the resin layer 23, that is, the energy I absorbed by the resin layer 23 in the first pass. A1 =I T *70%, Energy I reflected by metal layer 22 R =I T *30%, Energy absorbed by resin layer 23 in the second phase (I) A2 =I R *70% = I T *30% * 70% = I T *21%. Therefore, after the light beam passes through the resin layer 23 twice, the sum of the energy absorbed by the resin layer 23 is I. A1 +I A2 =I T *91%, the energy difference between the covered area AA and the outer area BB, I A2 =I T*21%. Based on the energy difference between the covered area AA and the peripheral area BB, the curing degree of these two areas can be made different. By adjusting the beam energy, an accurate boundary line between the cured and uncured areas can be formed. When the critical energy for the curing reaction of the resin layer 23 is 100mJ, the energy absorbed by the covered area AA needs to exceed 100mJ, i.e., I... T *91% > 100mJ, while the energy absorbed by the peripheral region BB cannot exceed 100mJ, i.e., I T *70% < 100mj, therefore, I T Condition to be met: 109.89mj < I T <142.86mJ. Based on this, by controlling the energy injected into the resin layer 23 to be between 109.89mJ and 142.86mJ, the covered area AA can be cured while the outer area BB remains uncured.

[0062] In some embodiments, the light beam passes through the resin layer 23 once, and 30% to 70% of the beam's energy is absorbed by the resin layer 23. Thus, the difference in energy absorption between the overlapping area and the outer area BB of the resin layer 23 is significant, making it easier to meet the condition that the covered area AA is cured while the outer area BB remains uncured.

[0063] Optionally, the thickness of the resin layer 23 is 20μm±3μm, so that the resin layer 23 can play a good protective role on the surface of the fingerprint recognition sensor.

[0064] Figure 5 The transmittance curves of halogen-free glass for UV light of different wavelengths are shown. Figure 6 The reflectivity curves of Al at different wavelength bands are shown.

[0065] See Figure 5 and Figure 6 When selecting the wavelength of the light beam, the transmittance curves of TFT halogen-free glass for UV light of different wavelengths and the reflectance curves of Al (aluminum) at different wavelength bands were referenced. It was found that when the wavelength is 355nm, the TFT has a high transmittance of about 90%, and Al has a reflectance of about 75%. Based on this, some embodiments of this application select the wavelength range of the light beam as 306nm to 380nm, such as 310nm, 315nm, 325nm, 335nm, 345nm, 355nm, and 365nm, so that the resin layer 23 has a high transmittance for the light beam, while the metal layer 22 has a high reflectance for the light beam.

[0066] In some embodiments, the resin layer 23 comprises the following raw materials in parts by weight: 60%–90% resin; 5%–30% monomer; 2%–10% initiator; and 2%–5% additives. Thus, the resin layer 23 exhibits fast curing speed, high gloss, strong adhesion, high surface hardness, and excellent wear resistance, sun resistance, and scratch resistance. By adjusting the raw material ratio, the properties of the resin layer 23, such as light transmittance, can be adjusted accordingly to meet manufacturing requirements. For example, the printing screen used for printing the resin layer 23 is 250-420 mesh, the UV curing energy used during curing is ≥150 mJ / cm², and the curing speed is ≥12 m / min.

[0067] See Figure 2 and Figure 3 In some embodiments, the metal layer 22 includes a first metal electrode layer 221 and a second metal electrode layer 223; the fingerprint recognition sensor also includes a piezoelectric thin film layer 222 disposed between the first metal electrode layer 221 and the second metal electrode layer 223; preparing a resin layer 23 on one side of the metal layer 22 includes printing the resin layer 23 on the side of the second metal electrode layer 223 opposite to the piezoelectric thin film layer 222. The first metal electrode layer 221 and the second metal electrode layer 223 form a capacitor. When the capacitor is connected to AC power, the piezoelectric thin film layer 222 vibrates under the action of the electric field of the capacitor and generates ultrasonic waves; when the ultrasonic waves are transmitted to the fingerprint, they are reflected at the fingerprint. Since the reflection energy of the ridges and valleys of the fingerprint is different, the signal of the ultrasonic waves reflected to the piezoelectric thin film layer 222 is different. Based on this, the piezoelectric thin film layer 222 converts the reflected signal into AC voltage, thereby realizing fingerprint recognition. After printing the resin layer 23 on the side of the second metal electrode layer 223 away from the piezoelectric thin film layer 222, the covered area AA of the resin layer 23 is cured by irradiation with a light beam, thus completing the pattern transfer of the resin layer 23.

[0068] In some embodiments, the resin layer 23 further includes a peripheral region BB that is not covered by the metal layer 22 and is adjacent to the coverage area AA. The method of manufacturing the fingerprint recognition module further includes removing the material of the resin layer 23 in the peripheral region BB from the surface of the fingerprint recognition sensor. Thus, after the coverage area AA is cured, the resin material in the peripheral region BB is removed, and the shape of the resin layer 23 remaining on the surface of the fingerprint recognition sensor overlaps with the metal layer 22.

[0069] For example, the fingerprint recognition module includes a circuit board and an ultrasonic sensor electrically connected to the circuit board. The ultrasonic sensor includes an array substrate, a receiving electrode disposed on the array substrate, a piezoelectric thin film layer 222 disposed on the side of the receiving electrode facing away from the array substrate, and a driving electrode disposed on the side of the piezoelectric thin film layer 222 facing away from the receiving electrode. The receiving electrode and the driving electrode are electrically connected to the piezoelectric thin film layer 222 respectively, so as to share the piezoelectric thin film layer 222. By applying alternating current to the electrodes, the piezoelectric thin film layer 222 vibrates, thereby emitting ultrasonic waves.

[0070] The array substrate may be provided with a primer, a piezoelectric thin film layer 222 is provided on the side of the primer away from the array substrate, and an ITO film layer is provided on the side of the piezoelectric thin film facing the primer. A silver electrode layer is provided on the side of the piezoelectric thin film layer 222 away from the primer. The silver electrode layer and the ITO film layer form a capacitor.

[0071] Based on the same inventive objective, this application also provides a fingerprint recognition module. The fingerprint recognition module includes a fingerprint sensor and a resin layer. The fingerprint sensor includes a metal layer. The resin layer is fabricated on one side surface of the fingerprint sensor using the manufacturing method of the fingerprint recognition module described in the above embodiments, such that the orthographic projection of the resin layer on the surface of the fingerprint sensor overlaps with the orthographic projection of the metal layer on the surface of the fingerprint sensor.

[0072] For the same inventive purpose, this application also provides an electronic device. This electronic device includes the fingerprint recognition module described in the above embodiments.

[0073] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0074] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for manufacturing a fingerprint recognition module, characterized in that, The method includes the following steps: A fingerprint recognition sensor is fabricated, the fingerprint recognition sensor comprising a metal layer; A resin layer is prepared on one side of the metal layer; A light beam is irradiated onto the resin layer on the side of the resin layer opposite to the metal layer. The resin layer includes a covering area that covers the metal layer; The metal layer is configured to reflect the light beam incident on the coverage area, so that the reflected light beam is incident on the coverage area again from the surface of the metal layer; The resin layer also includes a peripheral area that does not cover the metal layer and is adjacent to the covered area; The method further includes: Remove the resin layer material in the peripheral area from the surface of the fingerprint sensor; When the light beam passes through the resin layer for the first time, at least 10% of the energy of the light beam is absorbed by the resin layer. After being reflected by the metal layer, when it passes through the resin layer for the second time, a portion of the energy is absorbed again. This results in the total energy absorbed by the covered area being higher than the total energy absorbed by the peripheral area, ensuring that the covered area is cured while the peripheral area remains uncured.

2. The method for manufacturing a fingerprint recognition module according to claim 1, characterized in that, The light beam passes through the resin layer once, and 30% to 70% of the energy of the light beam is absorbed by the resin layer.

3. The method for manufacturing a fingerprint recognition module according to claim 1, characterized in that, The thickness of the resin layer is 20μm±3μm.

4. The method for manufacturing a fingerprint recognition module according to claim 1, characterized in that, The wavelength range of the light beam is 306nm~380nm.

5. The method for manufacturing a fingerprint recognition module according to any one of claims 1-4, characterized in that, The resin layer comprises the following raw materials in parts by weight: Resin content: 60%~90%; Monomer 5%~30%; Initiator 2%~10%; Additives: 2%~5%.

6. The method for manufacturing a fingerprint recognition module according to any one of claims 1-4, characterized in that, The metal layer includes a first metal electrode layer and a second metal electrode layer; The fingerprint recognition sensor further includes a piezoelectric thin film layer disposed between the first metal electrode layer and the second metal electrode layer; Preparing a resin layer on one side of the metal layer includes printing a resin layer on the side of the second metal electrode layer opposite to the piezoelectric thin film layer.

7. A fingerprint recognition module, characterized in that, include: A fingerprint recognition sensor, the fingerprint recognition sensor including a metal layer; and A resin layer is prepared on one side surface of the fingerprint sensor using the fingerprint recognition module manufacturing method as described in any one of claims 1-6, such that the orthographic projection of the resin layer on the surface of the fingerprint sensor overlaps with the orthographic projection of the metal layer on the surface of the fingerprint sensor.

8. An electronic device, characterized in that, Includes the fingerprint recognition module as described in claim 7.

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