A heating assembly, an atomizer, an electronic atomization device and a manufacturing method

Abstract

The application relates to the technical field of electronic atomization, and provides a heating assembly, an atomizer, an electronic atomization device and a manufacturing method. The heating assembly comprises a first base body and a second base body. The first base body is formed with an intermediate channel. The second base body is formed with an accommodating channel. The first base body is accommodated in the accommodating channel. A spacing space is formed between the outer peripheral surface of the first base body and the wall surface of the accommodating channel. The spacing space is empty or filled with a porous piece. One of the wall surface of the intermediate channel and the outer peripheral surface of the second base body is a heating surface. The other of the wall surface of the intermediate channel and the outer peripheral surface of the second base body is a liquid inlet surface. The empty spacing space can greatly increase the liquid storage capacity. The porous piece can improve the liquid locking capacity and play a slow-release role, so that the liquid matrix is more evenly released to the heating surface.

Description

Technical Field

[0001] This application relates to the field of electronic atomization technology, and in particular to a heating component, an atomizer, an electronic atomization device, and a manufacturing method. Background Technology

[0002] The electronic atomizing device includes a liquid storage container and a heating element. The liquid storage container stores the liquid matrix to be atomized, and the heating element atomizes the liquid matrix into an aerosol. In related technologies, if there is an excessive amount of liquid matrix in the storage container or if it cannot be guided to the heating surface of the heating element in a timely manner, it can easily lead to the problem of dry burning of the heating element. Summary of the Invention

[0003] In view of this, this application aims to provide a heating element, atomizer, electronic atomizing device, and manufacturing method that can improve the liquid storage effect.

[0004] To achieve the above objectives, this application provides a heating component, comprising:

[0005] The first matrix has a central channel;

[0006] The second substrate has a receiving channel, and the first substrate is housed in the receiving channel. There is a space between the outer peripheral surface of the first substrate and the wall of the receiving channel. The space is either empty or filled with a porous component. One of the wall of the intermediate channel and the outer peripheral surface of the second substrate is a heating surface, and the other of the wall of the intermediate channel and the outer peripheral surface of the second substrate is a liquid inlet surface.

[0007] In some embodiments, the first substrate has a plurality of flow holes, and the second substrate has a plurality of connecting holes, the flow holes connecting the intermediate channel and the spacer, and the connecting holes connecting the spacer and the outer peripheral surface of the second substrate.

[0008] In some embodiments, the area of ​​the flow passage of the flow orifice is not equal to the area of ​​the flow passage of the connecting hole.

[0009] In some embodiments, the diameter of the flow-through orifice is not equal to the diameter of the connecting orifice.

[0010] In some embodiments, the wall surface of the intermediate channel is the heating surface, and the outer peripheral surface of the second substrate is the liquid inlet surface, and the diameter of the flow-through hole is smaller than the diameter of the connecting hole; or,

[0011] The wall of the intermediate channel is the liquid inlet surface, and the outer peripheral surface of the second substrate is the heating surface. The diameter of the flow passage is larger than the diameter of the connecting hole.

[0012] In some embodiments, the porosity of the first matrix is ​​not equal to the porosity of the second matrix.

[0013] In some embodiments, the wall surface of the intermediate channel is the heating surface, and the outer peripheral surface of the second substrate is the liquid inlet surface; the porosity of the first substrate is less than the porosity of the second substrate; or,

[0014] The wall of the intermediate channel is the liquid inlet surface, and the outer peripheral surface of the second substrate is the heating surface. The porosity of the first substrate is greater than that of the second substrate.

[0015] In some embodiments, the orifice through the outer peripheral surface of the first substrate is a flow port, and the orifice through the wall of the receiving channel is a communication port. The projection of the communication port on the first substrate overlaps with the flow port in at most parts.

[0016] In some embodiments, the distance between the upper end of the outer peripheral surface of the first substrate and the upper end of the wall of the receiving channel is greater than the distance between the lower end of the outer peripheral surface of the first substrate and the lower end of the wall of the receiving channel.

[0017] In some embodiments, the distance between the outer peripheral surface of the first substrate and the wall of the receiving channel gradually increases from top to bottom.

[0018] In some embodiments, the first substrate has a cylindrical or frustum-shaped profile.

[0019] In some embodiments, the outline shape of the second substrate is cylindrical or frustum conical.

[0020] In some embodiments, the heating component includes a plurality of heating films, which are spaced apart on the heating surface.

[0021] In some embodiments, the porous element is a ceramic porous structure.

[0022] This application provides an atomizer, comprising:

[0023] A liquid storage container for storing the liquid matrix to be atomized;

[0024] In the aforementioned heating component, the liquid matrix in the storage container can flow to the inlet surface.

[0025] Another aspect of this application provides an electronic atomizing device, comprising:

[0026] The atomizer described above;

[0027] The power supply is electrically connected to the heating component.

[0028] In some embodiments, the electronic atomizing device includes an air inlet channel and an air outlet channel, both of which are connected to the outside, and the heating element is located between the air inlet channel and the air outlet channel;

[0029] The intermediate channel connects the air inlet channel and the air outlet channel; the outer peripheral surface of the second substrate is part of the wall surface of the airflow channel of the electronic atomizing device, and the airflow channel connects the air inlet channel and the air outlet channel.

[0030] This application also provides a manufacturing method for manufacturing a heating element, the heating element comprising a first substrate and a second substrate, the first substrate forming a central channel; the second substrate forming a receiving channel, the first substrate being accommodated in the receiving channel, a space between the outer peripheral surface of the first substrate and the wall surface of the receiving channel, the space being either empty or filled with a porous element, one of the wall surface of the central channel and the outer peripheral surface of the second substrate being a heating surface, and the other of the wall surface of the central channel and the outer peripheral surface of the second substrate being a liquid inlet surface, the manufacturing method comprising:

[0031] Manufacture a first reverse mold that is structurally nested with the first substrate, and a second reverse mold that is structurally nested with the second substrate;

[0032] The first reverse mold is fitted into the second reverse mold, and a partition mold is placed between the first reverse mold and the second reverse mold. The first reverse mold, the second reverse mold, and the partition mold are all placed in the outer mold to jointly define the mold cavity.

[0033] The slurry fills the mold cavity to form a green embryo;

[0034] The embryo is processed to form the first matrix and the second matrix.

[0035] In some embodiments, the manufacturing method includes:

[0036] A first master mold with the same structure as the first substrate and a second master mold with the same structure as the second substrate are manufactured. A first reverse mold is manufactured based on the first master mold and a second reverse mold is manufactured based on the second master mold.

[0037] In some embodiments, after processing the green embryo to form the first matrix and the second matrix, the manufacturing method includes:

[0038] A heating film is formed by coating or brushing the heating surface.

[0039] In some embodiments, the first anti-mold is made of a soft material and / or the first anti-mold is a disposable sacrificial mold.

[0040] In some embodiments, the second anti-mold is made of a soft material and / or the second anti-mold is a disposable sacrificial mold.

[0041] In some embodiments, the first substrate has a plurality of flow holes, the second substrate has a plurality of connecting holes, the flow holes connect the intermediate channel and the space between them, the connecting holes connect the space between them and the outer peripheral surface of the second substrate, the first reverse mold has a first column nested with the flow holes, and the second reverse mold has a second column nested with the connecting holes.

[0042] In some embodiments, manufacturing a first reverse mold nested in the structure of the first substrate and a second reverse mold nested in the structure of the second substrate includes:

[0043] A first flexible template and a second flexible template are manufactured respectively, wherein the first flexible template includes a first flat plate and a plurality of first columns located on the first flat plate, and the second flexible template includes a second flat plate and a plurality of second columns located on the second flat plate;

[0044] The first flat plate is wound into a hollow ring structure to form the first reverse mold, and the second flat plate is wound into a hollow ring structure to form the second reverse mold, wherein the first column faces outward and the second column faces inward.

[0045] In some embodiments, the first flexible template is formed by integral injection molding; and / or,

[0046] The second flexible template is formed by integral injection molding.

[0047] The heating component provided in this application embodiment guides the liquid matrix from the inlet surface to the heating surface through a spacer. This spacer serves to guide and temporarily store the liquid matrix. Whether the spacer is empty or filled with porous components, the liquid matrix can be introduced from the inlet surface to the heating surface. An empty space significantly increases the liquid storage capacity, while porous components enhance liquid retention and provide a slow-release effect, further balancing the flow rate of the liquid matrix and ensuring a more even release to the heating surface. The spacer can store a certain amount of liquid matrix; as the liquid matrix on the heating surface gradually evaporates, the liquid matrix in the spacer can replenish the heating surface in a timely manner, thus preventing dry burning of the heating surface to a certain extent. Attached Figure Description

[0048] Figure 1 This is a schematic diagram of the structure of the heating component in one embodiment of this application;

[0049] Figure 2 for Figure 1 A schematic diagram of the heating component from another perspective;

[0050] Figure 3 for Figure 1 A structural schematic diagram of the heating component from another perspective;

[0051] Figure 4 for Figure 3 A cross-sectional view along the AA direction;

[0052] Figure 5 for Figure 3 Cross-sectional view along the BB direction;

[0053] Figure 6 This is a schematic diagram of the electronic atomizing device in one embodiment of this application;

[0054] Figure 7 This is a flowchart of a manufacturing method according to an embodiment of this application;

[0055] Figure 8 This is a schematic diagram of the structure of the first female mold and the first reverse mold in one embodiment of this application;

[0056] Figure 9 This is a scanning electron microscope image of the first inverse mode in one embodiment of this application;

[0057] Figure 10 This is a scanning electron microscope image of the second type of first inverse mode in one embodiment of this application;

[0058] Figure 11 This is a scanning electron microscope image of the third type of first inverse mode in one embodiment of this application.

[0059] Explanation of reference numerals in the attached figures

[0060] First substrate 10; intermediate channel 10a; flow hole 10b; second substrate 20; receiving channel 20a; spacer space 20a'; connecting hole 20b; connecting port 20b'; heating film 30;

[0061] Electronic atomizing device 100; air inlet channel 100a; air outlet channel 100b;

[0062] First reverse mold 1; First flat plate 11; First column 12; First female mold 2; Detailed Implementation

[0063] It should be noted that, unless otherwise specified, the embodiments and technical features in the embodiments of this application can be combined with each other, and the detailed descriptions in the specific implementation should be understood as explanations of the purpose of this application and should not be regarded as undue limitations on this application.

[0064] The directional terms used in the embodiments of this application are for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this application. The application will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0065] Please see Figures 1 to 5 ,as well as Figure 11 One embodiment of this application provides a heating component, which includes a first substrate 10 and a second substrate 20.

[0066] The first substrate 10 has an intermediate channel 10a. Specifically, the intermediate channel 10a extends along the height direction of the first substrate 10.

[0067] The second substrate 20 has a receiving channel 20a. Specifically, the receiving channel 20a extends along the height direction of the second substrate 20. It should be noted that the height direction of the first substrate 10 is consistent with the height direction of the second substrate 20.

[0068] A first substrate 10 is housed in a receiving channel 20a, and a space 20a' is provided between the outer peripheral surface of the first substrate 10 and the wall surface of the receiving channel 20a. The space 20a' may be empty or filled with a porous component. Please refer to [link / reference]. Figure 5 "Empty" means that no solid structure is placed in the space 20a', that is, the space 20a' is filled with air. "Porous component" refers to a structure with multiple interconnected pores that communicate with the material surface. In other words, the space 20a' can be empty or filled with a porous component. Thus, whether the space 20a' is empty or the pores in the porous component are open, it is convenient for temporarily storing liquid matrix and for the liquid matrix to flow.

[0069] One of the walls of the intermediate channel 10a and the outer peripheral surface of the second substrate 20 is a heating surface, and the other is a liquid inlet surface. For example, if the wall of the intermediate channel 10a is the heating surface, then the outer peripheral surface of the second substrate 20 is the liquid inlet surface. Or, for another example, if the outer peripheral surface of the second substrate 20 is the heating surface, then the wall of the intermediate channel 10a is the liquid inlet surface. The liquid inlet surface is the surface that receives the liquid matrix, and the heating surface is the surface that heats the liquid matrix. The liquid matrix from the liquid inlet surface is guided through the first substrate 10, the spacer space 20a', and the second substrate 20 to the heating surface.

[0070] The heating component provided in this application embodiment guides the liquid matrix from the inlet surface to the heating surface through the spacer space 20a'. The spacer space 20a' serves to guide and temporarily store the liquid matrix. Whether the spacer space 20a' is empty or filled with porous elements allows the liquid matrix to be introduced from the inlet surface to the heating surface. An empty spacer space 20a' significantly increases the liquid storage capacity, while porous elements enhance the liquid retention capacity, providing a slow-release effect and further balancing the flow rate of the liquid matrix, resulting in a more even release of the liquid matrix to the heating surface. The spacer space 20a' can store a certain amount of liquid matrix. As the liquid matrix on the heating surface gradually evaporates, the liquid matrix in the spacer space 20a' can be replenished to the heating surface in a timely manner, thus preventing the heating surface from dry-burning to a certain extent.

[0071] Both the first substrate 10 and the second substrate 20 are permeable to liquid matrix. (See also...) Figure 5 The first substrate 10 has a plurality of flow holes 10b, and the second substrate 20 has a plurality of connecting holes 20b. The flow holes 10b connect the intermediate channel 10a and the spacer space 20a'. The connecting holes 20b connect the spacer space 20a' and the outer peripheral surface of the second substrate 20. Thus, the liquid matrix can flow between the intermediate channel 10a and the outer peripheral surface of the second substrate 20 through the flow holes 10b, the spacer space 20a', and the connecting holes 20b. For example, the flow holes 10b penetrate the first substrate 10 along its thickness direction. That is, the flow holes 10b connect the intermediate channel 10a and the outer peripheral surface of the first substrate 10. The connecting holes 20b penetrate the second substrate 20 along its thickness direction. That is, the connecting holes 20b connect the receiving channel 20a and the outer peripheral surface of the second substrate 20. The liquid matrix from the inlet surface is guided to the heating surface through the flow hole 10b, the spacer space 20a' and the connecting hole 20b.

[0072] In this embodiment, the liquid matrix from the inlet surface is guided to the heating surface through the flow hole 10b, the spacer space 20a', and the connecting hole 20b. The flow hole 10b, the spacer space 20a', and the connecting hole 20b all serve to guide and temporarily store the liquid matrix. Each of these structures can store a certain amount of liquid matrix. As the liquid matrix on the heating surface gradually evaporates, the liquid matrix in the flow hole 10b, the spacer space 20a', and the connecting hole 20b can be replenished to the heating surface in a timely manner.

[0073] It should be noted that in the embodiments of this application, "multiple" refers to a quantity including two or more.

[0074] The heating element provided in this application can be used in an atomizer. The atomizer includes a liquid storage container and the heating element as described in any embodiment of this application. The liquid storage container is used to store the liquid matrix to be atomized. The liquid matrix in the liquid storage container can flow to the inlet surface 10a.

[0075] Please see Figure 6 The heating element provided in this application embodiment can be used in an electronic atomizing device 100. The electronic atomizing device 100 includes an atomizer and a power supply unit as described in any embodiment of this application, with the power supply unit electrically connected to the heating element. The power supply unit is capable of supplying power to the heating element so that the heating element heats the liquid matrix.

[0076] The electronic atomizing device 100 can be an electronic cigarette. That is to say, the liquid base can be e-liquid.

[0077] For example, the outline of the electronic atomizing device 100 can be generally elongated. This makes it easy for the user to hold the electronic atomizing device 100 with their fingers.

[0078] Power supply components include, but are not limited to, devices that can provide electrical energy, such as batteries.

[0079] Heating components can heat a liquid matrix to vaporize it. For example, heating components can heat e-liquid and atomize it into an aerosol.

[0080] The electronic atomizing device 100 provided in this application embodiment has a porous component that can either leave the space 20a' empty or fill it, allowing the liquid matrix to be introduced from the liquid inlet surface to the heating surface. Leaving the space 20a' empty can significantly increase the liquid storage capacity, while the porous component can improve the liquid retention capacity, playing a role in slow release and further balancing the flow rate of the liquid matrix, allowing the liquid matrix to be released more evenly to the heating surface. The flow hole 10b, the space 20a', and the connecting hole 20b can all store a certain amount of liquid matrix. As the liquid matrix on the heating surface gradually evaporates, the liquid matrix in the flow hole 10b, the space 20a', and the connecting hole 20b can be replenished to the heating surface in a timely manner, which to a certain extent avoids the phenomenon of dry burning of the heating surface and can effectively improve the user experience.

[0081] In some embodiments, the multiple holes in the porous component can be arranged randomly. That is, the holes in the porous component are generated randomly.

[0082] The material of the porous component is not limited; it can be made of polymer material.

[0083] For example, in one embodiment, the porous component is a ceramic porous structure. That is, the porous component is a porous structure made of ceramic material.

[0084] For example, porous parts can be formed by high-temperature sintering of components such as aggregates, binders, and pore-forming agents. During the sintering process of porous parts, the pore-forming agent creates randomly arranged pores in the porous parts.

[0085] In one embodiment, the intermediate channel 10a extends through both end faces of the first substrate 10 in the height direction.

[0086] In one embodiment, the receiving channel 20a extends through both end faces of the second substrate 20 in the height direction.

[0087] In some embodiments, the plurality of flow holes 10b of the first substrate 10 are arranged in an ordered manner. That is, the plurality of flow holes 10b are arranged according to a set rule. In other words, the set rule for the plurality of flow holes 10b can be designed or controlled manually. The ordered arrangement includes, but is not limited to, an array arrangement. For example, in one embodiment, the plurality of flow holes 10b can be arranged in a one-dimensional array, that is, the plurality of flow holes 10b are arranged at intervals in one direction. In another embodiment, the plurality of flow holes 10b can be arranged in a two-dimensional array, that is, the plurality of flow holes 10b are arranged at intervals in two or more intersecting directions.

[0088] In some embodiments, the plurality of connecting holes 20b of the second substrate 20 are arranged in an ordered manner. That is, the plurality of connecting holes 20b are arranged according to a set rule. In other words, the set rule for the plurality of connecting holes 20b can be designed or controlled manually. The ordered arrangement includes, but is not limited to, an array arrangement. For example, in one embodiment, the plurality of connecting holes 20b can be arranged in a one-dimensional array, that is, the plurality of connecting holes 20b are arranged at intervals in one direction. In another embodiment, the plurality of connecting holes 20b can be arranged in a two-dimensional array, that is, the plurality of connecting holes 20b are arranged at intervals in two intersecting directions.

[0089] The first substrate 10 and the second substrate 20 can also be porous structures with multiple interconnected pores that communicate with each other and with the material surface. The pores in the first substrate 10 and the second substrate 20 can be arranged randomly. The pores in the first substrate 10 and the second substrate 20 have a capillary effect, allowing the liquid matrix from the inlet surface to flow through the pores in the first substrate 10, the spacer space 20a', and the pores in the second substrate 20 to the heating surface.

[0090] The materials of the first substrate 10 and the second substrate 20 are not limited. For example, both the first substrate 10 and the second substrate 20 can be made of dense ceramic material or porous ceramic material.

[0091] In one embodiment, the cross-sectional area of ​​the flow passage 10b is not equal to the cross-sectional area of ​​the connecting hole 20b. The flow passage is a cross-section orthogonal to all streamlines of the primary or total flow, i.e., the liquid matrix, that is, a surface perpendicular to the velocity cluster. The size of the cross-sectional area is positively correlated with the flow velocity of the liquid matrix. The fact that the cross-sectional area of ​​the flow passage 10b is not equal to that of the connecting hole 20b ensures that the flow velocity of the liquid matrix flowing through the flow passage 10b is not equal to that flowing through the connecting hole 20b. This not only improves the liquid supply capacity but also reduces backflow. Backflow refers to the aerosol formed after the liquid matrix atomizes and flows back into the heating element, for example, impacting the flow passage 10b and / or the connecting hole 20b, etc.

[0092] The cross-sectional shape of the flow orifice 10b is not limited. For example, the cross-sectional shape of the flow orifice 10b includes, but is not limited to, a circle, an ellipse, or a polygon. The polygon can be a quadrilateral, a pentagon, or an irregular shape.

[0093] The cross-sectional shape of the connecting hole 20b is not limited. For example, the cross-sectional shape of the connecting hole 20b includes, but is not limited to, a circle, an ellipse, or a polygon. The polygon can be a quadrilateral, a pentagon, or an irregular shape.

[0094] In one embodiment, the flow passage 10b can be a straight hole. That is, a single flow passage 10b extends in a straight line. In this way, the flow passage 10b is easy to form and has low manufacturing difficulty.

[0095] In one embodiment, the flow orifice 10b is a constant diameter orifice. That is, the diameter of a single flow orifice 10b is the same at any position.

[0096] In one embodiment, the connecting hole 20b can be a straight hole. That is, a single connecting hole 20b extends along a straight line. In this way, the connecting hole 20b is easy to form and has low manufacturing difficulty.

[0097] In one embodiment, the connecting hole 20b is a hole of equal diameter. That is, the diameter of a single connecting hole 20b is the same at any position.

[0098] In one embodiment, please refer to Figure 4 and Figure 5 The diameter of the flow orifice 10b is not equal to the diameter of the connecting orifice 20b. For example, both the cross-sectional shape of the flow orifice 10b and the cross-sectional shape of the connecting orifice 20b are circular. The orifice diameter is positively correlated with the flow cross-section. The unequal diameters of the flow orifice 10b and the connecting orifice 20b result in a different flow velocity of the liquid matrix through the flow orifice 10b compared to that through the connecting orifice 20b. This not only improves the liquid supply capacity but also reduces backflow.

[0099] In one embodiment, the wall of the intermediate channel 10a is the heating surface, and the outer peripheral surface of the second substrate 20 is the liquid inlet surface. The diameter of the flow-through hole 10b is smaller than the diameter of the connecting hole 20b. That is, the liquid matrix from the outer peripheral surface of the second substrate 20 flows sequentially through the connecting hole 20b, the spacer space 20a', and the flow-through hole 10b before being introduced to the wall of the intermediate channel 10a, where it atomizes into an aerosol. The relatively large diameter of the connecting hole 20b facilitates the rapid entry of the liquid matrix from the outer peripheral surface of the second substrate 20 into the connecting hole 20b. The relatively small diameter of the flow-through hole 10b increases the difficulty for the aerosol in the intermediate channel 10a to flow back into the flow-through hole 10b, increasing resistance and reducing backflow.

[0100] In one embodiment, please refer to Figure 1 and Figure 4 The wall of the intermediate channel 10a serves as the liquid inlet surface, and the outer peripheral surface of the second substrate 20 serves as the heating surface. The diameter of the flow-through hole 10b is larger than that of the connecting hole 20b. In other words, the liquid matrix from the wall of the intermediate channel 10a flows sequentially through the flow-through hole 10b, the spacer space 20a', and the connecting hole 20b before being introduced to the outer peripheral surface of the second substrate 20, where it atomizes into an aerosol. The relatively large diameter of the flow-through hole 10b facilitates the rapid entry of the liquid matrix from the wall of the intermediate channel 10a into the flow-through hole 10b. The relatively small diameter of the connecting hole 20b increases the difficulty for the aerosol from the outer peripheral surface of the second substrate 20 to flow back into the connecting hole 20b, increasing resistance and reducing backflow.

[0101] In one embodiment, please refer to Figure 1 The porosity of the first matrix 10 is not equal to that of the second matrix 20. Porosity is positively correlated with the flow rate of the liquid matrix. The unequal porosity of the first matrix 10 and the second matrix 20 results in unequal flow rates of the liquid matrix through the first matrix 10 and the second matrix 20. This not only improves the liquid supply effect and achieves balanced liquid supply, but also reduces backgassing.

[0102] In one embodiment, the wall of the intermediate channel 10a is a heating surface, and the outer peripheral surface of the second substrate 20 is a liquid inlet surface. The porosity of the first substrate 10 is less than that of the second substrate 20. That is, the liquid matrix from the outer peripheral surface of the second substrate 20 flows sequentially through the connecting hole 20b, the spacer space 20a', and the flow hole 10b before being introduced to the wall of the intermediate channel 10a, where it atomizes into an aerosol. The relatively large porosity of the second substrate 20 facilitates the rapid replenishment of the liquid matrix to the spacer space 20a'. The relatively small porosity of the first substrate 10 reduces the likelihood of the aerosol in the intermediate channel 10a flowing back into the spacer space 20a', increasing resistance and reducing backflow.

[0103] In one embodiment, please refer to Figure 1 and Figure 4 The wall of the intermediate channel 10a serves as the liquid inlet surface, and the outer peripheral surface of the second substrate 20 serves as the heating surface. The porosity of the first substrate 10 is greater than that of the second substrate 20. That is, the liquid matrix on the wall of the intermediate channel 10a flows sequentially through the flow hole 10b, the spacer space 20a', and the connecting hole 20b before being introduced to the outer peripheral surface of the second substrate 20, where it atomizes into an aerosol. The relatively large porosity of the first substrate 10 facilitates the rapid replenishment of the liquid matrix to the spacer space 20a'. The relatively small porosity of the second substrate 20 reduces the likelihood of the aerosol on its outer peripheral surface flowing back into the spacer space 20a', increasing resistance and reducing backflow.

[0104] In one embodiment, the orifice 10b penetrating the outer peripheral surface of the first substrate 10 is the flow port, and the orifice 20b penetrating the wall of the receiving channel 20a is the connection port 20b'. The projection of the connection port 20b' on the first substrate 10 at most partially overlaps with the flow port. For example, the projection of the connection port 20b' on the first substrate 10 may partially overlap with the flow port. Alternatively, the projection of the connection port 20b' on the first substrate 10 may not overlap with the flow port, meaning the projection of the connection port 20b' on the first substrate 10 is completely offset from the flow port. This design ensures that even if a trace amount of aerosol enters the flow port 10b or the connection port 20b, the trace amount of aerosol in the flow port 10b or the connection port 20b is difficult to flow directly between the connection port 20b' and the flow port because the projection of the connection port 20b' on the first substrate 10 at most partially overlaps with the flow port. This further increases the difficulty of aerosol flow and reduces backflow.

[0105] In one embodiment, the distance between the upper end of the outer peripheral surface of the first substrate 10 and the upper end of the wall of the receiving channel 20a is greater than the distance between the lower end of the outer peripheral surface of the first substrate 10 and the lower end of the wall of the receiving channel 20a. That is, the height direction of the first substrate 10 can be set along the vertical direction. If the distance between the upper end of the outer peripheral surface of the first substrate 10 and the upper end of the wall of the receiving channel 20a is larger, the upper part of the space 20a' will have a larger volume and can accommodate more liquid matrix. If the distance between the lower end of the outer peripheral surface of the first substrate 10 and the lower end of the wall of the receiving channel 20a is smaller, the lower part of the space 20a' will have a smaller volume and can accommodate relatively less liquid matrix. With this design, the capillary force of the upper part of the space 20a' is greater than that of the lower part of the space 20a', thus resisting the effect of gravity.

[0106] In one embodiment, the distance between the outer peripheral surface of the first substrate 10 and the wall of the receiving channel 20a gradually increases from top to bottom. The smaller the distance, the stronger the capillary effect. As the distance gradually increases from top to bottom, the capillary effect generated by the distance gradually decreases from top to bottom. With this design, the capillary force in the space 20a' gradually decreases from top to bottom, which better resists gravity and allows the liquid matrix to be distributed more evenly in the space 20a', resulting in a better atomization effect.

[0107] The outline shape of the first base 10 can be a body of revolution. In one embodiment, please refer to... Figure 1 The outline shape of the first substrate 10 is cylindrical or frustum-shaped. The outline shape of the first substrate 10 refers to the outer outline shape of the first substrate 10 in multidimensional space.

[0108] The outline shape of the second base 20 can be a body of revolution structure. In one embodiment, please refer to... Figure 1 The outline shape of the second substrate 20 is cylindrical or frustum-shaped. The outline shape of the second substrate 20 refers to the outer outline shape of the second substrate 20 in multidimensional space.

[0109] For example, in some embodiments, both the first base 10 and the second base 20 may be cylindrical. In other embodiments, both the first base 10 and the second base 20 may be frustoconical. In still other embodiments, one of the first base 10 and the second base 20 may be cylindrical, and the other of the first base 10 and the second base 20 may be frustoconical.

[0110] In some embodiments, the outer contour shape of the first substrate 10 may also be a frustum.

[0111] In some embodiments, the outer contour shape of the second substrate 20 may also be a frustum.

[0112] In some embodiments, a heating film 30 can be disposed on the heating surface of the heating component. This simplifies the structure and facilitates the electrical connection between the power supply component and the heating film 30. The heating film 30 is used to heat the liquid matrix on the heating surface after being energized. For example, the heating film 30 can heat and atomize the liquid matrix into an aerosol.

[0113] In some embodiments, the heating film 30 includes a positive electrode, a negative electrode, and a resistive portion, with the positive and negative electrodes spaced apart and the resistive portion electrically connected to the positive and negative electrodes. The positive and negative electrodes are respectively used to connect to the positive and negative terminals of a power supply component. Exemplarily, the positive and negative electrodes are spaced apart circumferentially, the resistive portion has a continuously curved structure, one end of the resistive portion is electrically connected to the positive electrode, and the other end of the resistive portion is electrically connected to the negative electrode.

[0114] It is understandable that the resistive part can also be a straight line or other shapes.

[0115] In one embodiment, please refer to Figure 1 and Figure 2 The heating element includes multiple heating films 30, which are spaced apart on the heating surface. The multiple heating films 30 are electrically isolated from each other. This allows different areas of the heating surface to be heated independently, improving the heating effect.

[0116] For example, in one embodiment, each heating film 30 can be powered independently. Independent power supply to each heating film 30 allows for independent control of each film, enabling individual adjustment of its heating temperature and power. For instance, during the atomization of a liquid matrix, energy-saving or rapid atomization effects can be achieved by controlling the number and power of the heating films 30 in operation.

[0117] The material of the heating film 30 is not limited. For example, the heating film 30 may include, but is not limited to, metals and / or alloys. For example, the heating film 30 may be made of aluminum, gold, silver, copper, nickel-chromium alloy, nickel-chromium-iron alloy, iron-chromium-aluminum alloy, nickel, platinum, or titanium, etc.

[0118] The resistance value of the heating film 30 can be set according to requirements. For example, in this application, the resistance value of the heating film 30 is between 0.2Ω (ohms) and 0.8Ω. In this way, the heating film 30 can heat up quickly and can be well matched with the power supply.

[0119] In one embodiment, please refer to Figure 6 The electronic atomizing device 100 includes an air inlet channel 100a and an air outlet channel 100b, both of which are connected to the outside environment. A heating element is located between the air inlet channel 100a and the air outlet channel 100b. An intermediate channel 10a connects the air inlet channel 100a and the air outlet channel 100b. The air inlet channel 100a is used to introduce outside air into the electronic atomizing device 100, and the air outlet channel 100b is used to guide the aerosol from the atomized liquid matrix to the user's mouth. The intermediate channel 10a, connecting the air inlet channel 100a and the air outlet channel 100b, facilitates the flow of air and aerosol, reduces the obstruction of airflow by the heating element, and makes it smoother for the user to inhale from the electronic atomizing device 100.

[0120] As an example, in one embodiment, please refer to Figure 6 The wall of the intermediate channel 10a is the heating surface, and the outer peripheral surface of the second substrate 20 is the liquid inlet surface. The intermediate channel 10a connects the air inlet channel 100a and the air outlet channel 100b, which is conducive to the smooth flow of the outside air introduced by the air inlet channel 100a carrying the aerosol in the intermediate channel 10a to the air outlet channel 100b, resulting in a good user experience.

[0121] For example, in some embodiments, the electronic atomizing device includes a housing with a receiving cavity, the housing forming an air inlet channel and an air outlet channel, and a heating element located in the receiving cavity.

[0122] In one embodiment, the outer peripheral surface of the second substrate is part of the wall surface of the airflow channel of the electronic atomizing device, and the airflow channel connects the inlet channel and the outlet channel. That is, the electronic atomizing device includes an airflow channel, and the outer peripheral surface of the second substrate can jointly define the airflow channel with the cavity wall surface of the receiving cavity. This allows for flexible design of the airflow channel, and the volume of the airflow channel can be relatively large.

[0123] For example, in one embodiment, the outer peripheral surface of the second substrate is the heating surface, and the wall of the intermediate channel 10a is the liquid inlet surface. The outer peripheral surface of the second substrate is part of the wall of the airflow channel, which connects the air inlet channel 100a and the air outlet channel 100b. The airflow channel has a large volume, allowing the aerosol generated on the outer peripheral surface of the second substrate to flow more abundantly and more smoothly to the air outlet channel 100b.

[0124] Please see Figure 7 This application also provides a manufacturing method for manufacturing a heating element. The heating element includes a first substrate 10 and a second substrate 20. The first substrate 10 has a central channel 10a; the second substrate 20 has a receiving channel 20a. The first substrate 10 is housed in the receiving channel 20a. A space 20a' is provided between the outer peripheral surface of the first substrate 10 and the wall surface of the receiving channel 20a. The space 20a' is either empty or filled with a porous component. One of the wall surface of the central channel 10a and the outer peripheral surface of the second substrate 20 is a heating surface, and the other of the wall surface of the central channel 10a and the outer peripheral surface of the second substrate 20 is a liquid inlet surface. The manufacturing method includes:

[0125] S100: Manufacturing a first reverse mold that is structurally nested with the first substrate and a second reverse mold that is structurally nested with the second substrate.

[0126] Please see Figures 8 to 11 The structure of the first reverse mold 1 is nested with the structure of the first base 10, meaning that all surfaces of the first reverse mold 1 can overlap with all surfaces of the first base 10. The structure of the second reverse mold is nested with the structure of the second base 20, meaning that all surfaces of the second reverse mold can overlap with all surfaces of the second base 20.

[0127] S200. The first reverse mold is fitted into the second reverse mold, and a partition mold is placed between the first reverse mold and the second reverse mold. The first reverse mold, the second reverse mold and the partition mold are all placed in the outer mold to jointly define the mold cavity.

[0128] The outline shape of the outer mold can be adapted to the outline shape of the second base 20, and the surface of the outer mold facing the second reverse mold together with the second reverse mold forms the mold cavity.

[0129] For example, if the outline shape of the second mold is a solid of revolution, then the outer mold is also a solid of revolution, and the number of faces of the second mold is equal to the number of faces of the outer mold. In addition, the shapes of the faces of the second mold and the faces of the outer mold correspond one-to-one and are the same, but the volumes of the second mold and the outer mold may be different.

[0130] For example, the partition mold can also be a disposable sacrificial mold. This facilitates the formation of a spacer between the first substrate and the second substrate.

[0131] In some embodiments, the partition mold can be a dense solid. Thus, removing the partition mold creates empty space between the partitions.

[0132] In some embodiments, the partition mold may also be a porous structure. Thus, a porous part is formed after the slurry is filled and the partition mold is removed.

[0133] The material of the partition mold is not limited; the partition mold can be made of polymer materials.

[0134] S300, the slurry is filled into the mold cavity to form a green embryo.

[0135] The slurry is a component of the first matrix 10 and the second matrix 20; for example, the slurry can be a ceramic material. The slurry has a certain temperature so that it is in a flowing liquid state. When the temperature of the slurry drops below its freezing point, it becomes solid. After the slurry solidifies, it forms a green body.

[0136] S400, Process the embryo to form the first matrix and the second matrix.

[0137] After secondary processing based on the condition of the embryo, a first substrate 10 and a second substrate 20 are formed.

[0138] The manufacturing method provided in this application can be used to manufacture the heating component in any embodiment of this application.

[0139] In related technologies, methods such as laser induction and etching are required to form flow holes in the first substrate and connecting holes in the second substrate. This production method not only has high equipment costs, but also high process requirements.

[0140] The manufacturing method of this application embodiment first manufactures a first reverse mold 1 that is structurally nested with the first substrate 10 and a second reverse mold that is structurally nested with the second substrate 20. Then, the first substrate 10 and the second substrate 20 are formed by grouting using the first reverse mold 1 and the second reverse mold. The mold is relatively simple, the production equipment cost is low, and the manufacturing process is relatively simple. It can adapt to mass production, greatly improve the product yield, reduce material loss, and has high production efficiency.

[0141] For example, in some embodiments, a first flexible template and a second flexible template can be manufactured separately, wherein the first flexible template includes a first flat plate and the second flexible template includes a second flat plate;

[0142] The first flat plate is wound into a hollow ring structure to form the first reverse mold, and the second flat plate is wound into a hollow ring structure to form the second reverse mold.

[0143] In some embodiments, please refer to Figures 8 to 11 The first substrate 10 has a plurality of flow holes 10b, and the second substrate 20 has a plurality of connecting holes 20b. The flow holes 10b connect the intermediate channel 10a and the space 20a', and the connecting holes 20b connect the space 20a' and the outer peripheral surface of the second substrate 20. The first mold 1 has a first column 12 nested with the flow holes 10b, and the second mold has a second column nested with the connecting holes 20b.

[0144] Please see Figures 8 to 11 The structure of the first mold 1 is nested with the structure of the first base 10, meaning that all surfaces of the first mold 1 can overlap with all surfaces of the first base 10, and the first post 12 of the first mold 1 can be embedded in the flow hole 10b of the first base 10. The structure of the second mold 2 is nested with the structure of the second base 20, meaning that all surfaces of the second mold can overlap with all surfaces of the second base 20, and the second post of the second mold can be embedded in the connecting hole 20b of the second base 20.

[0145] The length of the first post 12 can be determined based on the length of the flow hole 10b. In some embodiments, the length of the first post 12 is not less than the length of the flow hole 10b. This ensures that the final flow hole 10b is a through hole.

[0146] The length of the second post can be determined based on the length of the connecting hole 20b. In some embodiments, the length of the second post is not less than the length of the connecting hole 20b. This ensures that the final connected hole 20b is a through hole.

[0147] Taking ceramic as an example, S300, where the slurry fills the mold cavity to form a green body, may include:

[0148] S310. The slurry in the mold cavity is cured by photopolymerization to form the green embryo.

[0149] This allows the ceramic slurry in the mold cavity to solidify quickly, saving curing time. For example, the ceramic slurry can be cured using ultraviolet light.

[0150] In one embodiment, S400, processing the embryo to form the first matrix and the second matrix includes:

[0151] S410. The green embryo is sintered to form the first matrix and the second matrix.

[0152] After the green embryo is subjected to high-temperature debinding and sintering, a first substrate 10 and a second substrate 20 are formed.

[0153] It is understandable that if the flow holes 10b and / or connecting holes 20b of the green preform are blocked by residual slurry, the green preform can be treated with through-hole treatment.

[0154] In one embodiment, the manufacturing method includes:

[0155] S500: Manufacturing a first master mold with the same structure as the first substrate and a second master mold with the same structure as the second substrate; manufacturing a first reverse mold based on the first master mold and manufacturing a second reverse mold based on the second master mold.

[0156] Please see Figure 8 In this embodiment, a large number of first reverse molds 1 and second reverse molds can be generated in batches using one or a small number of first master molds 2 and second master molds.

[0157] The production methods for the first and second master molds are not limited. For example, the first and second master molds can be produced by drilling or other methods. The demand for the first and second master molds is small, and the processing and molding methods can be diverse, which can effectively control production costs.

[0158] It is understandable that the first reverse module 1 is nested with the first parent module 2. The second reverse module is nested with the second parent module.

[0159] In one embodiment, after processing the green embryo to form the first matrix and the second matrix, the manufacturing method includes:

[0160] A heating film is formed by coating or brushing the heating surface.

[0161] For example, in one embodiment, a heating film 30 can be deposited on the heating surface by physical vapor deposition or chemical vapor deposition. Thus, a heating film 30 is formed by coating the heating surface. This method allows the heating film 30 to be tightly bonded to the heating surface, reducing assembly steps. Furthermore, the thickness of the heating film 30 can be in the micrometer or nanometer range, which not only meets the requirement for overall miniaturization of the heating component but also saves material on the heating film 30.

[0162] In one exemplary embodiment, a film is brushed onto the heating surface to form a heating film 30. Alternatively, the heating film 30 can be prepared by applying a conductive paste and forming a thick film.

[0163] In one embodiment, the first mold 1 is made of a soft material. In this way, on the one hand, the cost of the first mold 1 is low; on the other hand, the first mold 1 is easy to detach from the first master mold 2 and easy to separate from the green mold, so that neither the first master mold 2 nor the green mold is easily damaged.

[0164] Soft materials include, but are not limited to, soft polymer materials. For example, soft silicone or soft resin, etc.

[0165] In one embodiment, the first anti-mold 1 is a disposable sacrificial mold. A disposable sacrificial mold refers to a mold that is discarded after the production of a single first substrate 10. Thus, when separating the first anti-mold 1 from the green embryo, the first anti-mold 1 can be destroyed, allowing for rapid separation of the first anti-mold 1 from the green embryo and facilitating operation.

[0166] In one embodiment, the second mold is made of a soft material. In this way, on the one hand, the cost of the second mold is lower; on the other hand, the second mold is easy to detach from the second master mold and easy to separate from the green mold, so that neither the second master mold nor the green mold is easily damaged.

[0167] Soft materials include, but are not limited to, soft polymer materials. For example, soft silicone or soft resin, etc.

[0168] In one embodiment, the second mold is a disposable sacrificial mold. A disposable sacrificial mold is a mold that is discarded after the production of a single first substrate 10. Thus, when separating the second mold from the green embryo, the second mold can be destroyed, allowing for rapid separation of the second mold from the green embryo and facilitating operation.

[0169] In one embodiment, manufacturing a first reverse mold with a structure nested in the first substrate and a second reverse mold with a structure nested in the second substrate includes:

[0170] S110. Manufacture a first flexible template and a second flexible template respectively, wherein the first flexible template includes a first flat plate and a plurality of first columns located on the first flat plate, and the second flexible template includes a second flat plate and a plurality of second columns located on the second flat plate.

[0171] The first flexible template is a structure capable of deformation under relatively small forces. It is a one-piece molded structure, which reduces assembly steps and simplifies the manufacturing process.

[0172] The second flexible template is a structure capable of deformation under relatively small forces. It is a one-piece molded structure, which reduces assembly steps and simplifies the manufacturing process.

[0173] For example, both the first female mold 2 and the second female mold can be made of rigid materials such as metal or steel, so that the first female mold 2 and the second female mold can be reused multiple times. The first plate 11 can be easily detached from the first female mold 2, and the second plate can be easily detached from the second female mold, reducing the manufacturing difficulty of the first reverse mold 1 and the second reverse mold.

[0174] S120. The first flat plate is wound into a hollow ring structure to form the first reverse mold, and the second flat plate is wound into a hollow ring structure to form the second reverse mold, wherein the first column faces outward and the second column faces inward.

[0175] Here, the first plate 11 is wound into a hollow ring structure using the deformation capability of the first flexible template to form the three-dimensional shape of the first reverse mold 1. The second plate is wound into a hollow ring structure using the deformation capability of the second flexible template to form the three-dimensional shape of the second reverse mold.

[0176] In one embodiment, the first flexible template is formed by integral injection molding. For example, a hot pressing process can be used to press the melt of high-temperature molten polymer material into the first master mold 2. After cooling, the first master mold 2 can be removed to obtain the first flexible template.

[0177] In one embodiment, the second flexible template is formed by integral injection molding. For example, a hot-pressing process can be used to press a melt of high-temperature molten polymer material into a second master mold. After cooling, the second master mold is removed to obtain the second flexible template.

[0178] For example, in one embodiment, both the first substrate 10 and the first mold 1 have cylindrical outlines. The first flexible template includes a rectangular first flat plate 11. The two sides of the first flat plate 11 are connected by winding to form a three-dimensional cylindrical first mold 1. The cylindrical first mold 1 has openings on both axial sides. It is understood that when both the second substrate 20 and the second mold have cylindrical outlines, the formation method of the second mold is the same as described above, and will not be repeated here.

[0179] For example, in one embodiment, the first mold 1 has a frustum-shaped profile. The first flexible template includes a first flat plate 11 in the shape of an isosceles trapezoid. The two sides of the first flat plate 11 are connected by winding to form a three-dimensional frustum-shaped first mold 1. The frustum-shaped first mold 1 has openings on both axial sides. It is understood that when the second base 20 and the second mold both have frustum-shaped profiles, the formation method of the second mold is the same as described above, and will not be repeated here.

[0180] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art after the technical scope disclosed in this application should be included after the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims.

Claims

1. A heating element, characterized in that, include: The first matrix has a central channel; The second substrate has a receiving channel, and the first substrate is housed in the receiving channel. There is a space between the outer peripheral surface of the first substrate and the wall of the receiving channel. The space is either empty or filled with a porous component. One of the wall of the intermediate channel and the outer peripheral surface of the second substrate is a heating surface, and the other of the wall of the intermediate channel and the outer peripheral surface of the second substrate is a liquid inlet surface. The intermediate channel penetrates both end faces of the first substrate in the height direction; the receiving channel penetrates both end faces of the second substrate in the height direction; the spacer is empty or filled with a porous element so that the liquid matrix can be introduced from the liquid inlet surface to the heating surface; the height direction of the first substrate is set in the vertical direction, and the height direction of the first substrate is consistent with the height direction of the second substrate.

2. The heating component according to claim 1, characterized in that, The first substrate has a plurality of flow holes, and the second substrate has a plurality of connecting holes. The flow holes connect the intermediate channel and the space between them, and the connecting holes connect the space between them and the outer peripheral surface of the second substrate.

3. The heating component according to claim 2, characterized in that, The cross-sectional area of ​​the flow passage is not equal to the cross-sectional area of ​​the connecting hole.

4. The heating component according to claim 2, characterized in that, The diameter of the flow passage is not equal to the diameter of the connecting hole.

5. The heating component according to claim 4, characterized in that, The wall of the intermediate channel is the heating surface, and the outer peripheral surface of the second substrate is the liquid inlet surface; the diameter of the flow-through hole is smaller than the diameter of the connecting hole; or, The wall of the intermediate channel is the liquid inlet surface, and the outer peripheral surface of the second substrate is the heating surface. The diameter of the flow passage is larger than the diameter of the connecting hole.

6. The heating component according to claim 1, characterized in that, The porosity of the first matrix is ​​not equal to that of the second matrix.

7. The heating component according to claim 6, characterized in that, The wall of the intermediate channel is the heating surface, and the outer peripheral surface of the second substrate is the liquid inlet surface; the porosity of the first substrate is less than that of the second substrate; or, The wall of the intermediate channel is the liquid inlet surface, and the outer peripheral surface of the second substrate is the heating surface. The porosity of the first substrate is greater than that of the second substrate.

8. The heating component according to claim 2, characterized in that, The orifice through the outer peripheral surface of the first substrate is the flow port, and the orifice through the wall of the receiving channel is the communication port. The projection of the communication port on the first substrate overlaps with the flow port in at most parts.

9. The heating component according to claim 1, characterized in that, The distance between the upper end of the outer peripheral surface of the first substrate and the upper end of the wall of the receiving channel is greater than the distance between the lower end of the outer peripheral surface of the first substrate and the lower end of the wall of the receiving channel.

10. The heating component according to claim 9, characterized in that, The distance between the outer peripheral surface of the first substrate and the wall of the receiving channel gradually increases from top to bottom.

11. The heating component according to claim 1, characterized in that, The first substrate has a cylindrical or frustum-shaped profile.

12. The heating component according to claim 1, characterized in that, The outline shape of the second substrate is cylindrical or frustum conical.

13. The heating component according to claim 1, characterized in that, The heating component includes multiple heating films, which are spaced apart on the heating surface.

14. The heating component according to claim 1, characterized in that, The porous component is a ceramic porous structure.

15. An atomizer, characterized in that, include: A liquid storage container for storing the liquid matrix to be atomized; The heating component according to any one of claims 1 to 14, wherein the liquid matrix in the liquid storage container can flow to the liquid inlet surface.

16. An electronic atomizing device, characterized in that, include: The atomizer as described in claim 15; The power supply is electrically connected to the heating component.

17. The electronic atomizing device according to claim 16, characterized in that, The electronic atomizing device includes an air inlet channel and an air outlet channel, both of which are connected to the outside world, and the heating element is located between the air inlet channel and the air outlet channel; The intermediate channel connects the air inlet channel and the air outlet channel; or, the outer peripheral surface of the second substrate is part of the wall surface of the airflow channel of the electronic atomizing device, and the airflow channel connects the air inlet channel and the air outlet channel.

18. A manufacturing method, characterized in that, For manufacturing a heating element, the heating element includes a first substrate and a second substrate. The first substrate forms a central channel; the second substrate forms a receiving channel, in which the first substrate is housed. A space exists between the outer peripheral surface of the first substrate and the wall of the receiving channel. The space is either empty or filled with a porous element. One of the wall of the central channel and the outer peripheral surface of the second substrate is a heating surface, and the other is a liquid inlet surface. The central channel penetrates both end faces of the first substrate in the height direction; the receiving channel penetrates both end faces of the second substrate in the height direction. The space is either empty or filled with a porous element to allow a liquid matrix to be introduced from the liquid inlet surface to the heating surface. The height direction of the first substrate is vertically oriented, and the height direction of the first substrate is consistent with that of the second substrate. The manufacturing method includes: Manufacture a first reverse mold that is structurally nested with the first substrate, and a second reverse mold that is structurally nested with the second substrate; The first reverse mold is fitted into the second reverse mold, and a partition mold is placed between the first reverse mold and the second reverse mold. The first reverse mold, the second reverse mold, and the partition mold are all placed in the outer mold to jointly define the mold cavity. The slurry fills the mold cavity to form a green embryo; The embryo is processed to form the first matrix and the second matrix.

19. The manufacturing method according to claim 18, characterized in that, The manufacturing method includes: A first master mold with the same structure as the first substrate and a second master mold with the same structure as the second substrate are manufactured. A first reverse mold is manufactured based on the first master mold and a second reverse mold is manufactured based on the second master mold.

20. The manufacturing method according to claim 18, characterized in that, After processing the green embryo to form the first matrix and the second matrix, the manufacturing method includes: A heating film is formed by coating or brushing the heating surface.

21. The manufacturing method according to claim 18, characterized in that, The first anti-mold is made of a soft material and / or the first anti-mold is a disposable sacrificial mold.

22. The manufacturing method according to claim 18, characterized in that, The second anti-mold is made of a soft material and / or the second anti-mold is a disposable sacrificial mold.

23. The manufacturing method according to claim 18, characterized in that, The first substrate has a plurality of flow holes, and the second substrate has a plurality of connecting holes. The flow holes connect the intermediate channel and the space between them, and the connecting holes connect the space between them and the outer peripheral surface of the second substrate. The first reverse mold has a first column nested with the flow holes, and the second reverse mold has a second column nested with the connecting holes.

24. The manufacturing method according to claim 23, characterized in that, Manufacturing a first reverse mold that is structurally nested with the first substrate and a second reverse mold that is structurally nested with the second substrate includes: A first flexible template and a second flexible template are manufactured respectively, wherein the first flexible template includes a first flat plate and a plurality of first columns located on the first flat plate, and the second flexible template includes a second flat plate and a plurality of second columns located on the second flat plate; The first flat plate is wound into a hollow ring structure to form the first reverse mold, and the second flat plate is wound into a hollow ring structure to form the second reverse mold, wherein the first column faces outward and the second column faces inward.

25. The manufacturing method according to claim 24, characterized in that, The first flexible template is formed by integral injection molding; and / or, The second flexible template is formed by integral injection molding.

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