A silicon ring polishing device

Abstract

This invention discloses a silicon ring polishing device, belonging to the technical field of polishing equipment, including a base column, an inner ring polishing mechanism, and an outer ring polishing mechanism. Through the arrangement of the inner and outer polishing mechanisms, the inner and outer walls of the silicon ring can be polished simultaneously. The rotation direction of the outer disk controlled by the first motor is opposite to the rotation direction of the polishing ring, avoiding the silicon ring from rotating together during polishing in the same direction, thereby improving the polishing effect. Simultaneously, during polishing, the outer polishing mechanism can hold the silicon ring in place, preventing it from falling off.

Description

Technical Field

[0001] This invention belongs to the field of polishing equipment technology, and specifically relates to a silicon ring polishing device. Background Technology

[0002] The silicon ring is an important component in the fabrication of the lower electrode. Before its formal use, the silicon ring needs to be polished. Existing polishing equipment usually fixes the silicon ring in place and then polishes the inner and outer ring walls in sequence. This type of polishing equipment cannot polish the inner and outer ring walls of the silicon ring at the same time, resulting in low efficiency and affecting the production efficiency of the lower electrode. Summary of the Invention

[0003] In view of this, the purpose of the present invention is to provide a silicon ring polishing device to solve the technical problem in the prior art that the inner and outer ring walls of the silicon ring cannot be polished at the same time.

[0004] To achieve the above objectives, the present invention provides the following technical solution:

[0005] This invention provides a silicon ring polishing device, including a base column, an inner ring polishing mechanism, and an outer ring polishing mechanism disposed on one side of the inner ring polishing mechanism; the inner ring polishing mechanism includes a polishing ring rotatably sleeved on the outside of the base column by a limiting mechanism; a plurality of polishing parts for polishing the inner wall of the silicon ring are evenly distributed on the circumference of the polishing ring; the outer ring polishing mechanism includes an outer disk disposed on one side of the base column by a first motor; a plurality of outer polishing parts capable of limiting and polishing the outer wall of the silicon ring are arranged in a circular array on one side wall of the outer disk near the base column.

[0006] Furthermore, it also includes an inner support mechanism capable of supporting the inner wall of the silicon ring; the inner support mechanism includes a rotating column coaxially rotatably connected to the other side of the base column; a plurality of support grooves are uniformly opened along the axial direction on the periphery of the rotating column; a support member is provided in each support groove; each support member includes a support rod rotatably disposed in the support groove; a plurality of first cylinders are rotatably connected to the side wall of the polishing ring; the telescopic shaft of each first cylinder is rotatably connected to the corresponding support member; a drive mechanism capable of driving the support member to press against the inner wall of the silicon ring is provided on the periphery of the base column.

[0007] Furthermore, the driving mechanism includes several axially uniformly formed grooves on the periphery of the base column; a slider is slidably connected to each groove via a tension spring; each slider is provided with a locking mechanism; the locking mechanism includes a through groove formed on the slider along the radial direction of the base column; the through groove communicates with the groove; a locking strip is rotatably connected between the two side walls of the through groove; a locking slot is formed on the side wall of the groove perpendicular to the forming direction of the through groove; one end of the locking strip can be locked into the locking slot; a first spring is connected between the side wall of the locking strip away from the locking slot and the through groove; a driving groove is formed on the side wall of the locking strip away from the first spring; two pop-out slots are formed on the inner wall of the polishing ring; a driving block is rotatably connected to each pop-out slot; the driving block is connected to the pop-out slot via a second spring; when the polishing ring rotates towards the driving groove, the driving block can be locked into the driving groove.

[0008] Furthermore, the limiting mechanism includes two annular grooves coaxially formed on the inner wall of the polishing ring; the two annular grooves are located on both sides of the drive groove; locking teeth are provided in the annular grooves; four moving grooves are formed axially on the periphery of the base column; rollers are rolledly connected in the moving grooves; limiting blocks with gaps between them and the inner wall of the polishing ring are connected to the rollers; two limiting motors are provided on the limiting blocks; gears that mesh with the locking teeth in the corresponding annular grooves are coaxially connected to the output shafts of the two limiting motors.

[0009] Furthermore, the outer disk has a number of adjusting components evenly arranged on the side wall near the base column, which can adjust the distance of the corresponding outer polished parts; the adjusting components include positioning blocks arranged parallel to the outer polished parts; positioning slots are opened in the positioning blocks; a second cylinder parallel to the positioning blocks is arranged in the positioning slots; a second motor is vertically connected to the second cylinder; the outer polished parts are connected to the output shaft of the second motor.

[0010] Furthermore, each outer polishing component includes a central block; one end of the central block is connected to a U-shaped block for polishing the outer wall of the silicon ring; the opening of the U-shaped block faces away from the central block; the other end of the central block is provided with an arc-shaped block for supporting the outer wall of the silicon ring; the central block is perpendicularly connected to the output shaft of the second motor.

[0011] Furthermore, a fixed box for providing a water source is coaxially provided on one side of the rotating column; the rotating column and the fixed box are rotatably connected; several water pipes are arranged in a circular array on the side wall of the fixed box near the rotating column; one end of the water pipe is connected to the inside of the fixed box; the other end of the water pipe is aligned with the side wall of the silicon ring; there is a gap between the water outlet end of the water pipe and the silicon ring.

[0012] The beneficial effects of this invention are as follows:

[0013] 1. By setting up an inner polishing mechanism and an outer polishing mechanism, the inner and outer walls of the silicon ring can be polished simultaneously. This allows the rotation direction of the outer disk controlled by the first motor to be opposite to the rotation direction of the polishing ring, preventing the silicon ring from rotating together when polishing in the same direction, thereby improving the polishing effect. At the same time, during polishing, the outer polishing mechanism can hold the silicon ring in place to prevent it from falling off.

[0014] 2. When only the outer wall of the silicon ring needs to be polished, the drive mechanism moves the inner polishing mechanism away from the silicon ring while the support block at the end of the support rod presses against the inner wall of the silicon ring, controlling the rotation of the outer polishing part to polish the outer wall of the silicon ring. Since the outer polishing part can hold the silicon ring in place, the silicon ring will not detach when the inner polishing mechanism moves away from the silicon ring, so polishing can continue without stopping the polishing process. It can switch back and forth between two modes: polishing the inner and outer parts simultaneously and polishing only the outer wall.

[0015] Other advantages, objectives, and features of the invention will be set forth in the following description and will be apparent to those skilled in the art in some respects, or may be learned by practice of the invention. The objectives and other advantages of the invention can be realized and obtained through the following description. Attached Figure Description

[0016] To make the objectives, technical solutions, and beneficial effects of this invention clearer, the following figures are provided for illustration:

[0017] Figure 1 This is a three-dimensional view of the polishing equipment of the present invention;

[0018] Figure 2 This is a three-dimensional diagram of a portion of the polishing equipment of the present invention;

[0019] Figure 3 This is a three-dimensional view of the polishing equipment of the present invention from another perspective;

[0020] Figure 4 This is a longitudinal sectional view of the polishing ring of the present invention.

[0021] The following components are marked in the attached diagram: 1. Base column; 2. Polishing ring; 3. Polishing rod; 4. Outer disc; 5. First motor; 6. Rotating column; 7. Support groove; 8. Support rod; 9. First cylinder; 10. Slider; 11. Through groove; 12. Snap-fit ​​strip; 13. Snap-fit ​​groove; 14. First spring; 15. Drive groove; 16. Pop-out groove; 17. Drive block; 18. Second spring; 19. Annular groove; 20. Moving groove; 21. Limiting block; 22. Gear; 23. Positioning block; 24. Second motor; 25. Center block; 26. U-shaped block; 27. Arc-shaped block; 28. Fixing box; 29. ​​Water pipe. Detailed Implementation

[0022] like Figures 1-4 As shown, the present invention provides a silicon ring polishing apparatus, including a base pillar 1, an inner ring polishing mechanism, and an outer ring polishing mechanism disposed on one side of the inner ring polishing mechanism; as shown Figure 2As shown, the inner ring polishing mechanism includes a polishing ring 2 coaxially rotatably mounted on a base column 1 via a limiting mechanism; four polishing components for polishing the inner wall of the silicon ring are evenly distributed around the circumference of the polishing ring 2, each polishing component including a polishing rod 3 radially connected to the circumference of the polishing ring 2, the end of which is connected to a polishing head that can fit against the inner wall of the silicon ring; as shown Figure 3 As shown, the outer ring polishing mechanism includes an outer disk 4 located on the right side of the base column 1; a first motor 5 is coaxially connected to the right end of the base column 1; the left side wall of the outer disk 4 is coaxially connected to the output shaft of the first motor 5; four outer polishing parts are arranged in a circular array on the left side wall of the outer disk 4, which can limit and polish the outer wall of the silicon ring; the outer polishing parts are located away from the first motor 5.

[0023] The principles and effects of the above technical solution:

[0024] In use, the entire polishing equipment is placed vertically, with the base column 1 placed on the actual worktable. The silicon ring is placed between the inner and outer polishing mechanisms. The polishing ring 2 is rotated by the limiting mechanism, and the polishing head on the polishing ring 2 polishes the inner wall of the silicon ring. The first motor 5 is started, which drives the outer disk 4 to rotate, so that the outer polishing mechanism polishes the outer wall of the silicon ring. Through the setting of the inner and outer polishing mechanisms, the inner and outer walls of the silicon ring can be polished simultaneously. The rotation direction of the outer disk 4 controlled by the first motor 5 is opposite to the rotation direction of the polishing ring 2, avoiding the silicon ring from rotating together when polishing in the same direction, thereby improving the polishing effect. At the same time, during polishing, the outer polishing mechanism can hold the silicon ring in place to prevent it from falling off.

[0025] In this embodiment, as Figure 2 , 3 As shown, it also includes an inner support mechanism that can support the inner wall of the silicon ring; the inner support mechanism includes a rotating column 6 coaxially rotatably connected to the left side of the base column 1. When the limiting mechanism drives the polishing ring 2 to rotate, the rotating column 6 rotates together; four support grooves 7 are evenly opened along the axial direction on the periphery of the rotating column 6; each support groove 7 is provided with a support member; each support member includes a fixed rod fixedly connected between the front and rear side walls of the support groove 7; a vertically arranged support rod 8 is rotatably connected to the fixed rod; a support block is connected to the end of the support rod 8 away from the fixed rod; four first cylinders 9 are rotatably connected to the left side wall of the polishing ring 2; each first cylinder 9 is located on the same horizontal plane as the corresponding support groove 7; the telescopic shaft of each first cylinder 9 is rotatably connected to the periphery of the corresponding support rod 8; the periphery of the base column 1 is provided with a driving mechanism that can drive the support rod 8 to press against the inner wall of the silicon ring, and the driving mechanism can make the inner polishing mechanism move to the right.

[0026] The principles and effects of the above technical solution:

[0027] The inner polishing mechanism is driven to move to the right by the drive mechanism. The polishing ring 2 drives the support rod 8 in the support groove 7 to rotate clockwise. At the same time, the first cylinder 9 is controlled to extend and retract, so that the support block at the end of the support rod 8 presses against the inner wall of the silicon ring, so that the inner polishing mechanism is separated from polishing the inner wall of the silicon ring, and only the outer polishing part polishes the outer wall of the silicon ring.

[0028] When only the outer wall of the silicon ring needs to be polished, the drive mechanism moves the inner polishing mechanism away from the silicon ring while the support block at the end of the support rod 8 presses against the inner wall of the silicon ring, controlling the rotation of the outer polishing part to polish the outer wall of the silicon ring. Since the outer polishing part can hold the silicon ring in place, the silicon ring will not detach when the inner polishing mechanism moves away from the silicon ring, so polishing can continue without stopping the polishing process. It can switch back and forth between two modes: polishing the inner and outer parts simultaneously and polishing only the outer wall.

[0029] In this embodiment, as Figure 2 As shown, the driving mechanism includes two axially evenly spaced grooves on the circumference of the base column; each groove is slidably connected to a slider 10; the right side wall of the slider 10 is connected to the right side wall of the groove by a tension spring; both the slider 10 and the groove have T-shaped cross-sections, which prevents the slider 10 from detaching from the groove; as shown... Figure 4 As shown, each slider 10 is provided with a locking mechanism; the locking mechanism on the right side includes a through groove 11 opened on the slider 10 along the radial direction of the base column 1; the through groove 11 communicates with the slide groove; a fixed shaft is rotatably connected between the two side walls of the through groove 11 in the front-rear direction; a vertically arranged locking strip 12 is rotatably connected to the fixed shaft; a protrusion is provided at the left end of the locking strip 12; a locking groove 13 is opened on the upper side wall of the slide groove; when the locking strip 12 rotates, the protrusion can be locked into the locking groove 13; a first spring 14 is connected between the lower side wall of the locking strip 12 and the through groove 11; a drive groove 15 is opened on the side of the lower side wall of the locking strip 12 away from the first spring 14; the locking mechanism on the left side... The structure of the locking mechanism is mirror-symmetrical about the axis of the base column 1 with respect to the locking mechanism on the right side; the inner wall of the polishing ring 2 has two pop-out grooves 16; the front and rear side walls of the pop-out groove 16 on the right side are fixedly connected to a connecting shaft; a driving block 17 is rotatably connected to the connecting shaft; the right side wall of the driving block 17 is connected to the pop-out groove 16 by a second spring 18; the structure of the pop-out groove 16, the driving block 17 and the second spring 18 on the left side are mirror-symmetrical about the axis of the base column 1 with respect to the structure on the right side; when the polishing ring 2 rotates counterclockwise, the driving block 17 can be locked into the driving groove 15, and when the polishing ring 2 rotates, the driving block 17 can pass through the limiting mechanism.

[0030] The principles and effects of the above technical solution:

[0031] During normal polishing, the polishing ring 2 rotates clockwise via the limiting mechanism (e.g., ...). Figure 4As shown, when the drive block 17 contacts the snap-fit ​​strip 12, the snap-fit ​​strip 12 pushes the drive block 17 back into the ejection slot 16. When it is necessary to press the inner support mechanism against the inner wall of the silicon ring, the limiting mechanism drives the polishing ring 2 to rotate counterclockwise. When the free end of the drive block 17 is engaged in the drive groove 15 on the lower side wall of the snap-fit ​​strip 12, it causes the protrusion on the snap-fit ​​strip 12 to disengage from the slot 13, stopping the limiting mechanism from driving the polishing ring 2 to continue rotating. The tension spring will drive the slider 10 to slide away from the support. At the same time, because the drive block 17 is engaged in the drive groove 15, the polishing ring 2 will move together with the slider 10. The slides in the same direction, while simultaneously controlling the retraction shaft of the first cylinder 9 to retract, thereby causing the support block to press against the inner wall of the silicon ring; when it is necessary to return the inner polishing mechanism to polish the inner wall of the silicon ring, the sliding block 10 is driven by the drive mechanism to slide, so that the protrusion on the locking strip 12 is locked into the locking groove 13 under the action of the first spring 14, and then the polishing ring 2 is controlled to rotate clockwise by the limiting mechanism, thereby causing the inner polishing mechanism to return to polishing the inner wall of the silicon ring. The drive mechanism can switch back and forth between the two modes of polishing the inner wall of the silicon ring and supporting only the inner wall of the silicon ring.

[0032] In this embodiment, as Figure 2 , 4 As shown, the limiting mechanism includes two annular grooves 19 coaxially formed on the inner wall of the polishing ring 2; the two annular grooves 19 are located on both sides of the drive groove 15; the annular grooves 19 are provided with locking teeth; four moving grooves 20 are formed axially on the periphery of the base column 1; rollers are rolledly connected in the moving grooves 20; two support blocks are rotatably connected on the rotating shaft of the rollers; the same limiting block 21 is fixedly connected to the two support blocks; there is a gap between the limiting block 21 and the inner wall of the polishing ring 2; a transition groove is formed on the limiting block 21; when the polishing ring 2 rotates, the drive block 17 can pass through the transition groove to avoid the limiting block 21 interfering with the rotation of the polishing ring 2; two limiting motors are provided on the limiting block 21; gears 22 that mesh with the locking teeth in the corresponding annular grooves 19 are coaxially connected to the output shafts of the two limiting motors.

[0033] The principles and effects of the above technical solution:

[0034] The forward and reverse rotation of the control limit motor can drive the polishing ring 2 to switch between clockwise and counterclockwise rotation modes. At the same time, the transition groove on the limit block 21 allows the drive block 17 to pass smoothly, preventing the drive block 17 from getting stuck in the limit block 21 and being unable to rotate when the polishing ring 2 rotates. The moving groove 20 can restrict the roller to move back and forth in the axial direction of the base column 1, preventing the polishing ring 2 from driving the roller to rotate together.

[0035] In this embodiment, as Figure 3As shown, the left side wall of the outer disk 4 is uniformly provided with four adjustment components that can adjust the distance between the four corresponding outer polishing parts; the adjustment components include positioning blocks 23 arranged parallel to the outer polishing parts; the left side wall of the positioning block 23 has a positioning groove along the length direction; a second cylinder parallel to the positioning block 23 is provided in the positioning groove; a second motor 24 is vertically connected to the telescopic shaft of the second cylinder; each outer polishing part includes a center block 25; a U-shaped block 26 for polishing the outer wall of the silicon ring is connected to one end of the center block 25 away from the polishing ring 2; the opening of the U-shaped block faces away from the center block 25; an arc-shaped block 27 for supporting the outer wall of the silicon ring is provided at the opposite end of the center block 25 and the U-shaped block 26; the center block 25 is vertically connected to the output shaft of the second motor 24.

[0036] The principles and effects of the above technical solution:

[0037] When only the outer wall of the silicon ring needs to be supported, the second cylinder drives the second motor 24 to move, thereby moving the outer polishing part away from the silicon ring. The second motor 24 is controlled to rotate, causing the center block 25 to rotate, thereby bringing the arc block 27 closer to the outer wall of the silicon ring. Then the first cylinder 9 is controlled to retract, causing the arc block 27 to press against the outer wall of the silicon ring. During normal polishing, the second motor 24 is controlled to drive the center block 25 to rotate, thereby bringing the U-shaped block 26 closer to the outer wall of the silicon ring.

[0038] When polishing the left and right sidewalls of the silicon ring, the second cylinder is controlled to extend and retract back and forth, so that the inner edge of the U-shaped block 26 is polished without the U-shaped block 26 contacting the outer wall of the silicon ring, thus effectively controlling the polishing precision.

[0039] In this embodiment, as Figure 3 As shown, a fixed box 28 for providing a water source is coaxially provided on the left side of the rotating column 6; the rotating column 6 is rotatably connected to the fixed box 28; four water pipes 29 are arranged in a circular array on the right side wall of the fixed box 28; the left end of each water pipe 29 is connected to the inside of the fixed box 28; the right end of the water pipe 29 is aligned with the side wall of the silicon ring; there is a gap between the water outlet end of the water pipe 29 and the silicon ring, and the water in the fixed box 28 is sent out from the fixed box 28 by a water pump installed in the fixed box 28.

[0040] The principles and effects of the above technical solution:

[0041] During polishing, water in the fixed box 28 is flushed through the water pipe 29 to assist in polishing.

[0042] Finally, it should be noted that the above preferred embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made to it in form and detail without departing from the scope defined by the claims of the present invention.

Claims

1. A silicon ring polishing device, characterized in that: The device includes a base post, an inner ring polishing mechanism, and an outer ring polishing mechanism located on one side of the inner ring polishing mechanism. The inner ring polishing mechanism includes a polishing ring that is rotatably sleeved on the outside of the base post via a limiting mechanism. Several polishing components for polishing the inner wall of the silicon ring are evenly distributed around the periphery of the polishing ring. The outer ring polishing mechanism includes an outer disk that is coaxially rotatable on one side of the base post via a first motor. Several outer polishing components that can limit and polish the outer wall of the silicon ring are arranged in a circular array on the side wall of the outer disk near the base post. It also includes an inner support mechanism that can support the inner wall of the silicon ring; the inner support mechanism includes a rotating column coaxially rotatably connected to the other side of the base column; a plurality of support grooves are evenly opened along the axial direction on the periphery of the rotating column; a support member is provided in each support groove; each support member includes a support rod rotatably set in the support groove; a plurality of first cylinders are rotatably connected to the side wall of the polishing ring; the telescopic shaft of each first cylinder is rotatably connected to the corresponding support member; a drive mechanism is provided on the periphery of the base column that can drive the support member to press against the inner wall of the silicon ring; The driving mechanism includes several axially evenly spaced grooves around the base column; each groove contains a slider slidably connected by a tension spring; each slider is equipped with a locking mechanism; the locking mechanism includes a through groove on the slider along the radial direction of the base column; the through groove communicates with the groove; a locking strip is rotatably connected between the two side walls of the through groove; a locking slot is formed on the side wall of the groove perpendicular to the direction of the through groove; one end of the locking strip can be locked into the locking slot; a first spring connects the side wall of the locking strip away from the locking slot to the through groove; a driving groove is formed on the side wall of the locking strip away from the first spring; two ejection slots are formed on the inner wall of the polishing ring; a driving block is rotatably connected in each ejection slot; the driving block is connected to the ejection slot by a second spring; when the polishing ring rotates towards the driving slot, the driving block can be locked into the driving slot; During normal polishing, the polishing ring rotates clockwise via a limiting mechanism. When the drive block contacts the retaining strip, the retaining strip pushes the drive block back into the ejection groove. When the inner support mechanism needs to be pressed against the inner wall of the silicon ring, the polishing ring rotates counterclockwise via the limiting mechanism. When the free end of the drive block engages in the drive groove on the lower side wall of the retaining strip, the protrusion on the retaining strip disengages from the groove, stopping the limiting mechanism from continuing to rotate the polishing ring. The tension spring causes the slider to slide away from the support component. Simultaneously, because the drive block engages in the drive groove, the polishing ring slides in the same direction as the slider. At the same time, the telescopic shaft of the first cylinder retracts, causing the support block to press against the inner wall of the silicon ring. When the inner polishing mechanism needs to return to polishing the inner wall of the silicon ring, the drive mechanism drives the slider to slide, causing the protrusion on the retaining strip to engage in the groove under the action of the first spring. Then, the limiting mechanism controls the polishing ring to rotate clockwise, causing the inner polishing mechanism to return to polishing the inner wall of the silicon ring.

2. The silicon ring polishing equipment according to claim 1, characterized in that: The limiting mechanism includes two annular grooves coaxially formed on the inner wall of the polishing ring; the two annular grooves are located on both sides of the drive groove; locking teeth are provided in the annular grooves; four moving grooves are formed axially on the periphery of the base column; rollers are rolledly connected in the moving grooves; limiting blocks with gaps between them and the inner wall of the polishing ring are connected to the rollers; two limiting motors are provided on the limiting blocks; gears that mesh with the locking teeth in the corresponding annular grooves are coaxially connected to the output shafts of the two limiting motors.

3. The silicon ring polishing equipment according to claim 2, characterized in that: The outer plate has several adjusting components evenly arranged on the side wall near the base column, which can adjust the distance of the corresponding outer polished parts; the adjusting components include positioning blocks arranged parallel to the outer polished parts; positioning slots are opened in the positioning blocks; a second cylinder parallel to the positioning blocks is arranged in the positioning slots; a second motor is vertically connected to the second cylinder; the outer polished parts are connected to the output shaft of the second motor.

4. The silicon ring polishing equipment according to claim 3, characterized in that: Each outer polishing part includes a center block; one end of the center block is connected to a U-shaped block for polishing the outer wall of the silicon ring; the opening of the U-shaped block faces away from the center block; the other end of the center block is provided with an arc-shaped block for supporting the outer wall of the silicon ring; the center block is perpendicularly connected to the output shaft of the second motor.

5. The silicon ring polishing equipment according to claim 4, characterized in that: A fixed box providing a water source is coaxially mounted on one side of the rotating column; the rotating column and the fixed box are rotatably connected; several water pipes are arranged in a circular array on the side wall of the fixed box near the rotating column; one end of the water pipe is connected to the inside of the fixed box; the other end of the water pipe is aligned with the side wall of the silicon ring; there is a gap between the water outlet end of the water pipe and the silicon ring.

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