Gravity assisted heat sink device

By designing a gravity-assisted heat dissipation device, which combines an evaporator, horizontal pipes, vertical pipes, and a condenser, the problems of eliminating multiple local hot spots and low transmission limits in traditional gravity heat pipes in underground data centers are solved, achieving a high-efficiency and low-energy-consumption heat dissipation effect.

CN115752043BActive Publication Date: 2026-07-10INST OF ENGINEERING THERMOPHYSICS - CHINESE ACAD OF SCI +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
INST OF ENGINEERING THERMOPHYSICS - CHINESE ACAD OF SCI
Filing Date
2022-10-27
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

Traditional gravity heat pipes cannot effectively eliminate multiple local hot spots in underground data centers, have a low transmission limit, and the evaporator end design is not conducive to tight contact, resulting in high contact thermal resistance. Existing cooling methods have high energy consumption and cannot accurately match the cooling capacity.

Method used

Design a gravity-assisted heat dissipation device, including an evaporator, a horizontal pipe, a vertical pipe, and a condenser. The evaporator is in contact with the component to be cooled, the horizontal pipe is connected to the vertical pipe, and the condenser is used to liquefy and vaporize the working fluid. Porous media and finned condenser tubes are provided to enhance heat transfer. A superhydrophobic coating and pipes arranged at a specific angle are used to facilitate the return flow of the working fluid.

Benefits of technology

It achieves high heat flux density heat dissipation and long-distance heat transfer, reduces energy consumption, avoids the inconvenience of traditional gravity heat pipe installation, improves the transmission limit and thermal design freedom, eliminates local hot spots, and is energy-saving, environmentally friendly and noiseless.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present disclosure provides a gravity-assisted heat dissipation device, comprising an evaporator, a horizontal pipe, a vertical pipe and a condenser; the evaporator is arranged above and in contact with a component to be cooled, so as to vaporize working medium in the evaporator by using heat of the component to be cooled; an outlet of the evaporator is connected with a first connecting end of the horizontal pipe; a second connecting end of the horizontal pipe is connected with a first connecting end of the vertical pipe; the horizontal pipe is used for transmitting working medium; the distance between the first connecting end of the horizontal pipe and a horizontal plane is less than the distance between the second connecting end of the horizontal pipe and the horizontal plane; a second connecting end of the vertical pipe is connected with a bottom of the condenser; the vertical pipe is used for transmitting working medium; the distance between the second connecting end of the vertical pipe and the horizontal plane is greater than the distance between the first connecting end of the vertical pipe and the horizontal plane; and the condenser is used for liquefying working medium in a vaporized state.
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Description

Technical Field

[0001] This disclosure relates to the field of phase change cooling and energy-saving technology, and in particular to a gravity-assisted heat dissipation device. Background Technology

[0002] Faced with the continuous deterioration of the global environment, natural disasters and extreme weather have gradually become the two highest-level threats to data center facilities. Underground data centers, leveraging their natural geographical advantages to cope with the threats to data center security posed by extreme environmental changes and sudden major disasters, have become a new direction for data center development. As chips continue to evolve towards high performance, high integration, and miniaturization, the heat flux density of key components such as CPUs and GPUs inside servers is constantly increasing, and the energy consumption of cooling systems now accounts for 40% of the total energy consumption of data centers.

[0003] Among existing data center cooling methods, precision air conditioning is the most widely used cooling technology. It primarily utilizes refrigerant to exchange heat with the indoor air in the air conditioning unit, and then transfers the heat to the outdoor chiller unit through refrigerant circulation pipes. However, it has high energy consumption and high resistance in hot airflow and refrigerant piping, leading to problems such as localized hot spots and inaccurate matching of cooling capacity. Gravity heat pipes utilize the latent heat of vaporization of the working medium to rapidly transfer heat from the heat source to the condenser, enabling the transfer of high heat flux density heat over long distances. Gravity heat pipes achieve two-phase circulation of vapor and liquid in the pipes through vapor-liquid pressure difference and gravity, requiring no external force and consuming significantly less energy than mechanical refrigeration systems. However, the one-dimensional heat transfer method of traditional gravity heat pipes is not suitable for eliminating multiple localized hot spots in underground data centers, and has a low transfer limit and many thermal design limitations. Furthermore, the design of the evaporator end of traditional gravity heat pipes is not conducive to a tight fit with the heat pipe, resulting in high contact thermal resistance. Summary of the Invention

[0004] In view of the above problems, this disclosure provides a gravity-assisted heat dissipation device.

[0005] According to one aspect of this disclosure, a gravity-assisted heat dissipation device is provided, comprising:

[0006] Evaporator, horizontal pipes, vertical pipes, and condenser;

[0007] The evaporator is positioned above and in contact with the component to be cooled, so as to use the heat from the component to vaporize the working fluid in the evaporator. The steam outlet of the evaporator is connected to the first connection end of the horizontal pipe.

[0008] The second connecting end of the horizontal pipe is connected to the first connecting end of the vertical pipe. The horizontal pipe is used to transport the working fluid. The distance between the first connecting end of the horizontal pipe and the horizontal plane is less than the distance between the second connecting end of the horizontal pipe and the horizontal plane.

[0009] The second connection end of the vertical pipe is connected to the bottom of the condenser. The vertical pipe is used to transport the working fluid. The distance between the second connection end of the vertical pipe and the horizontal plane is greater than the distance between the first connection end of the vertical pipe and the horizontal plane.

[0010] A condenser is used to liquefy a working fluid that is in a vaporized state.

[0011] Optionally, the evaporator includes a cover plate and a bottom shell, the cover plate and the bottom shell being tightly connected;

[0012] One end of the cover plate is provided with an evaporator steam outlet;

[0013] The bottom surface of the bottom shell is provided with support columns and porous media. The porous media is used to enhance phase change heat transfer. The top of all sides of the bottom shell is provided with interconnected overflow channels.

[0014] Optionally, the condenser includes a lower head and finned condenser tubes;

[0015] The lower head includes a steam buffer chamber and a lower mounting hole;

[0016] A connection port is provided at the center of the bottom of the steam buffer chamber. The connection port is connected to the second connection end of the vertical pipe. The bottom of the steam buffer chamber is designed with a tapering structure so that the liquid working fluid can flow back to the evaporator through the connection port, the vertical pipe and the horizontal pipe.

[0017] The lower mounting hole is located on the upper surface of the steam buffer chamber and is used to install finned condenser tubes.

[0018] Optionally, the condenser also includes an upper head;

[0019] The upper end cap includes a gas collection chamber, an upper mounting hole, and an exhaust port;

[0020] The upper mounting hole is located on the lower surface of the gas collection chamber and is used to install finned condenser tubes;

[0021] The exhaust port is located at the center of the upper surface of the gas collection chamber;

[0022] The gas collection chamber is used to collect the generated non-condensable gases.

[0023] Optionally, the end of the support column furthest from the bottom shell contacts the cover plate.

[0024] Optionally, the angle between the horizontal pipe and the horizontal plane is 5-10°.

[0025] Optionally, the inner walls of both the horizontal and vertical pipes are provided with a superhydrophobic coating.

[0026] Optionally, the finned condenser tube is a round tube with an inner diameter of 10-50 mm; the inner wall of the finned condenser tube is provided with a superhydrophobic coating.

[0027] Optionally, the volume of the working fluid charged into the evaporator is 0.5-3 times the total volume of the evaporator's inner cavity.

[0028] Optionally, the thickness of the bottom shell is 20-100mm.

[0029] The gravity-assisted heat pipe cooling device disclosed herein includes an evaporator, a horizontal pipe, a vertical pipe, and a condenser. The evaporator is positioned above and in contact with the component to be cooled, utilizing the heat from the component to vaporize the working fluid in the evaporator. The evaporator outlet is connected to the first connection end of the horizontal pipe. The second connection end of the horizontal pipe is connected to the first connection end of the vertical pipe. The horizontal pipe is used to transport the working fluid, and the distance between the first connection end of the horizontal pipe and the horizontal plane is less than the distance between the second connection end of the horizontal pipe and the horizontal plane. The second connection end of the vertical pipe is connected to the bottom of the condenser. The vertical pipe is used to transport the working fluid, and the distance between the second connection end of the vertical pipe and the horizontal plane is greater than the distance between the first connection end of the vertical pipe and the horizontal plane. The condenser is used to liquefy the vaporized working fluid. The gravity-assisted heat pipe cooling device disclosed herein utilizes the latent heat of vaporization of the working medium to rapidly transfer the heat generated by the component to be cooled to the condenser, achieving high heat flux density cooling and long-distance heat transfer requirements. It requires no external force, consumes far less energy than traditional mechanical refrigeration systems, and is noiseless, energy-saving, and environmentally friendly. In addition, the gravity-assisted heat dissipation device provided in this disclosure is equipped with horizontal and vertical pipes, which avoids the inconvenience of unidirectional installation of traditional gravity heat pipes. The horizontal pipe is set with a certain angle, which can facilitate the return of the working fluid and avoid liquid accumulation. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments in this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 The schematic diagram illustrates a gravity-assisted heat dissipation device according to an embodiment of the present disclosure;

[0032] Figure 2 This schematic diagram illustrates the structure of an evaporator in a gravity-assisted heat dissipation device according to an embodiment of the present disclosure.

[0033] Figure 3A This schematic diagram illustrates the structure of the cover plate of an evaporator in a gravity-assisted heat dissipation device according to an embodiment of the present disclosure.

[0034] Figure 3BThis schematic diagram illustrates the structure of the bottom shell of an evaporator in a gravity-assisted heat dissipation device according to an embodiment of the present disclosure.

[0035] Figure 4A The schematic diagram shows a scanning electron microscope image of a sintered wire mesh porous medium provided in an embodiment of the present disclosure;

[0036] Figure 4B The schematic diagram shows a scanning electron microscope image of a sintered powder porous medium provided in an embodiment of the present disclosure;

[0037] Figure 5 This schematic diagram illustrates the structure of a condenser in a gravity-assisted heat dissipation device according to an embodiment of the present disclosure.

[0038] Figure 6 This schematic diagram illustrates the structure of the lower end cap of a condenser in a gravity-assisted heat dissipation device according to an embodiment of the present disclosure.

[0039] Figure 7 This schematically illustrates the structure of the finned condenser tube of a gravity-assisted heat dissipation device according to an embodiment of the present disclosure; and

[0040] Figure 8 The diagram illustrates the structure of the upper end cap of a gravity-assisted heat dissipation device according to an embodiment of the present disclosure.

[0041] Explanation of reference numerals in the attached figures:

[0042] 1 Evaporator; 2 Horizontal tube; 3 Vertical tube; 4 Condenser; 11 Cover plate; 12 Bottom shell; 121 Overflow groove; 122 Support column; 123 Porous medium; 41 Lower end cap; 42 Finned condenser tube; 43 Upper end cap; 411 Connection port; 412 Steam buffer chamber; 413 Lower mounting hole; 431 Upper mounting hole; 432 Gas collection chamber; 433 Exhaust port. Detailed Implementation

[0043] The embodiments of the present disclosure will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the disclosure. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the embodiments of the present disclosure for ease of explanation. However, it will be apparent that one or more embodiments may be practiced without these specific details. Furthermore, descriptions of well-known structures and techniques are omitted in the following description to avoid unnecessarily obscuring the concepts of the present disclosure.

[0044] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. The terms “comprising,” “including,” etc., as used herein indicate the presence of features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0045] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0046] It should be noted that similar or identical parts are referred to by the same reference numerals in the accompanying drawings or description. Implementations not shown or described in the drawings are forms known to those skilled in the art. Furthermore, while this document provides examples of parameters containing specific values, it should be understood that the parameters need not be exactly equal to the corresponding values, but can approximate the corresponding values ​​within acceptable error tolerances or design constraints. Additionally, directional terms mentioned in the following embodiments, such as "up," "down," "front," "back," "left," "right," "inner," and "outer," are merely for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the scope of this disclosure.

[0047] Figure 1 The schematic diagram illustrates a gravity-assisted heat dissipation device according to an embodiment of the present disclosure.

[0048] like Figure 1 As shown in one embodiment of this disclosure, the gravity-assisted heat dissipation device includes: an evaporator 1, a horizontal pipe 2, a vertical pipe 3, and a condenser 4; the evaporator 1 is disposed above and in contact with the component to be cooled, so as to use the heat of the component to be cooled to vaporize the working fluid in the evaporator 1; the steam outlet of the evaporator 1 is connected to the first connecting end of the horizontal pipe 2; the second connecting end of the horizontal pipe 2 is connected to the first connecting end of the vertical pipe 3; the horizontal pipe 2 is used to transport the working fluid; the distance between the first connecting end of the horizontal pipe 2 and the horizontal plane is less than the distance between the second connecting end of the horizontal pipe 2 and the horizontal plane; the second connecting end of the vertical pipe 3 is connected to the bottom of the condenser 4; the vertical pipe 3 is used to transport the working fluid; the distance between the second connecting end of the vertical pipe 3 and the horizontal plane is greater than the distance between the first connecting end of the vertical pipe 3 and the horizontal plane; the condenser 4 is used to liquefy the working fluid in the vaporized state.

[0049] In this embodiment, an evaporator 1, part of the gravity-assisted heat dissipation device provided in this disclosure, is disposed above the component to be cooled, and the evaporator 1 is in contact with the component. The evaporator 1 is filled with a working fluid, the volume of which is 0.5-3 times the total volume of the evaporator 1's inner cavity. In this embodiment, the working fluid is one or more mixtures of deionized water, acetone, methanol, ethanol, FC-72, ammonia, and Freon. When the gravity-assisted heat dissipation device provided in this disclosure is used to cool the component, the heat from the component cools it is used to vaporize the working fluid in the evaporator 1, thereby reducing the temperature of the component. A horizontal pipe 2 is connected to the steam outlet of the evaporator 1, and a vertical pipe 3 is connected to the second end of the horizontal pipe 2. Both the horizontal pipe 2 and the vertical pipe 3 are used to transport the working fluid. In this embodiment, the wall thickness of the horizontal pipe 2 and the vertical pipe 3 is 0.2-1 mm, the inner diameter is 20-200 mm, and the material is one of stainless steel, copper, aluminum, or other metals and alloys with good weldability and high mechanical strength. The second connection end of the vertical pipe 3 is connected to a condenser 4, which is used to liquefy the working fluid in a vaporized state.

[0050] To facilitate the smooth flow of the vaporized working fluid in evaporator 1 into condenser 4 via horizontal pipe 2 and vertical pipe 3, and to facilitate the smooth return of the working fluid, after being cooled by condenser 4 and changing from a vaporized state to a liquid state, to evaporator 1, in this embodiment, the distance between the first connecting end of horizontal pipe 2 and the horizontal plane is less than the distance between the second connecting end of horizontal pipe 2 and the horizontal plane. Simultaneously, the distance between the second connecting end of vertical pipe 3 and the horizontal plane is greater than the distance between the first connecting end of vertical pipe 3 and the horizontal plane. In this embodiment, the angle between horizontal pipe 2 and the horizontal plane is set to 5-10°. The specific tilt angle of horizontal pipe 2 can be set according to actual needs, and this disclosure does not limit this. In one embodiment of this disclosure, a superhydrophobic coating can also be provided on the inner walls of both horizontal pipe 2 and vertical pipe 3 to better facilitate the return of the working fluid, after being cooled by condenser 4 and changing to a liquid state, to evaporator 1. Horizontal pipe 2 and evaporator 1 can also be tightly connected via 80-85° elbow joints, and horizontal pipe 2 and vertical pipe 3 can be tightly connected via 95-100° elbow joints. When using the gravity-assisted heat dissipation device provided in this disclosure, the evaporator 1, the horizontal pipe 2, and the vertical pipe 3 can be installed underground, while the condenser 4 can be installed on the ground, and cooling can be achieved through natural air convection.

[0051] The gravity-assisted heat pipe cooling device disclosed herein utilizes the latent heat of vaporization of the working medium to rapidly transfer the heat generated by the component to be cooled to the condenser. This enables high heat flux density cooling and long-distance heat transfer, requiring no external force. Its energy consumption is significantly lower than traditional mechanical refrigeration systems, and it operates without noise, making it energy-efficient and environmentally friendly. Furthermore, the gravity-assisted cooling device provided herein is equipped with both horizontal and vertical pipes, avoiding the inconvenience of unidirectional installation in traditional gravity heat pipes. The horizontal pipe is angled to facilitate recirculation of the working fluid and prevent liquid accumulation.

[0052] Figure 2 The diagram illustrates the structure of an evaporator in a gravity-assisted heat dissipation device according to an embodiment of the present disclosure. Figure 3A The schematic diagram illustrates the structure of the cover plate of an evaporator in a gravity-assisted heat dissipation device according to an embodiment of the present disclosure. Figure 3B The schematic diagram illustrates the structure of the bottom shell of an evaporator in a gravity-assisted heat dissipation device according to an embodiment of the present disclosure. Figure 4A The illustration shows a schematic diagram of a sintered wire mesh porous medium SEM provided in an embodiment of the present disclosure. Figure 4B The illustration shows a schematic diagram of a sintered powder porous media SEM provided in an embodiment of the present disclosure.

[0053] refer to Figure 2 , Figure 3A , Figure 3B , Figure 4A and Figure 4B In one embodiment of this disclosure, the evaporator 1 includes: a cover plate 11 and a bottom shell 12, which are tightly connected; one end of the cover plate 11 is provided with an evaporator 1 steam outlet; a support column 122 and a porous medium 123 are provided on the inner bottom surface of the bottom shell 12, the porous medium 123 is used to enhance phase change heat transfer, and overflow grooves 121 that communicate with each other are provided on the top of all sides of the bottom shell 12.

[0054] In this embodiment, the evaporator 1 consists of a bottom shell 12 and a cover plate 11, as follows: Figure 3BAs shown, a support column 122 and a porous medium 123 are provided on the inner bottom surface of the bottom shell 12. An overflow groove 121 is also provided on the top of the side wall of the bottom shell 12, and all the overflow grooves 121 on the side walls are interconnected. In this embodiment, the bottom shell 12 and the cover plate 11 can be connected by seamless welding. The welding method can be one or more of induction welding, molecular diffusion welding, brazing, etc. When brazing is used, the overflow groove 121 serves to overflow the brazing filler metal, preventing liquid brazing filler metal from flowing into the bottom shell and contaminating the interior. When the bottom shell 12 and the cover plate 11 are connected, the end of the support column 122 away from the bottom shell 12 contacts the cover plate 11. In this embodiment, the thickness of the bottom shell 12 can be 20-100mm. When using the gravity-assisted heat dissipation device provided in this disclosure to dissipate heat from the component to be cooled, in order to improve the heat dissipation effect, the porous medium needs to be placed as close as possible to the heat source of the component to be cooled. In this embodiment, the porous medium 123 can be prepared by sintering metal powders, wire meshes, foamed metals, and other materials of different materials and mesh sizes. The cover plate 11 has a thickness of 0.5-3mm and is made of stainless steel, copper, aluminum, or other metals and alloys with good thermal conductivity and weldability.

[0055] The gravity-assisted heat pipe cooling device disclosed herein employs a two-dimensional planar structure for its evaporator, transforming the one-dimensional unidirectional heat dissipation of traditional heat pipes into two-dimensional planar heat dissipation. This avoids the problem of high vapor escape resistance in traditional gravity heat pipes, significantly improving the ultimate power transfer capability of traditional heat pipes. Furthermore, the planar structure of the evaporator in this gravity-assisted heat pipe cooling device facilitates better contact with the heat source of the component to be cooled, allowing for high flexibility in thermal design and rapid elimination of local hot spots, ensuring long-term stable operation of high-power equipment. In addition, the evaporator's bottom shell is sintered with a porous medium, increasing the number of vaporization nuclei, accelerating the generation and detachment of bubbles during working fluid boiling, reducing the superheat required for the working fluid to enter nucleation boiling, and improving the burn-out limit of traditional gravity heat pipes.

[0056] Figure 5 The schematic diagram illustrates the structure of a condenser in a gravity-assisted heat dissipation device according to an embodiment of the present disclosure. Figure 6 The diagram illustrates the structure of the lower end cap of a condenser in a gravity-assisted heat dissipation device according to an embodiment of the present disclosure. Figure 7 The schematic diagram illustrates the structure of the finned condenser tube of a gravity-assisted heat dissipation device according to an embodiment of the present disclosure.

[0057] like Figure 5 , Figure 6 and Figure 7As shown, in one embodiment of this disclosure, the condenser 4 includes a lower end cap 41 and a finned condenser tube 42; the lower end cap 41 includes a steam buffer chamber 412 and a lower mounting hole 413; a connection port 411 is provided at the center of the bottom of the steam buffer chamber 412, and the connection port 411 is connected to the second connection end of the vertical pipe 3; the bottom of the steam buffer chamber 412 is configured as a tapered structure so that the liquid working fluid flows back to the evaporator 1 through the connection port 411, the vertical pipe 3 and the horizontal pipe 2; the lower mounting hole 413 is provided on the upper surface of the steam buffer chamber 412 and is used to install the finned condenser tube 42.

[0058] In this embodiment, the condenser 4 includes finned condenser tubes 42, which are circular tubes with an inner diameter of 10-50 mm, made of metals with good thermal conductivity such as copper, aluminum, and stainless steel. A superhydrophobic coating can be formed on the inner wall of the finned condenser tubes 42 to prevent the cooling medium from forming a liquid film in the steam channel, reduce thermal resistance, and allow for rapid condensate return. The condenser 4 also includes a lower end cap 41, made of a metal or alloy with good thermal conductivity and weldability such as stainless steel, copper, or aluminum. The lower end cap 41 includes a steam buffer chamber 412, which buffers the steam entering the condenser 4, facilitating the steam's entry into the finned condenser tubes 42 and its transformation into a liquid state. To facilitate the return of the liquid working fluid to the evaporator 1, the bottom of the steam buffer chamber 412 is designed as a tapered structure, as shown in the reference. Figure 6 Designing the bottom of the steam buffer chamber 412 as a tapered structure can accelerate the reflux of the working fluid. In this embodiment, a connection port 411 is provided at the bottom of the tapered structure of the steam buffer chamber 412, which connects to the second connection end of the vertical pipe 3. The inner diameter of the connection port 411 is 20-200mm. A lower mounting hole 413 is provided on the upper surface of the steam buffer chamber 412. In this embodiment, the lower mounting hole 413 is a circular hole with an inner diameter of 10-50mm.

[0059] The condenser finned tubes in the gravity-assisted heat pipe heat dissipation device disclosed herein have a superhydrophobic coating on their inner walls. This coating prevents the cooling medium from forming a liquid film in the steam channel, reduces thermal resistance, and enables the condensate to flow back quickly, thereby improving the vapor-liquid circulation efficiency of the working fluid.

[0060] Figure 8 The diagram illustrates the structure of the upper end cap of a gravity-assisted heat dissipation device according to an embodiment of the present disclosure.

[0061] like Figure 8As shown, in one embodiment of this disclosure, the condenser 4 further includes an upper end cap 43; the upper end cap 43 includes a gas collection chamber 432, an upper mounting hole 431, and an exhaust port 433; the upper mounting hole 431 is disposed on the lower surface of the gas collection chamber 432 and is used to install the finned condenser tube 42; the exhaust port 433 is disposed at the center of the upper surface of the gas collection chamber 432; the gas collection chamber 432 is used to collect the generated non-condensable gas.

[0062] In this embodiment, the upper end cap 43 of the condenser 4 includes a gas collection chamber 432, which is mainly used to collect non-condensable gases generated during the operation of the device. An exhaust port 433 is provided at the top of the upper end cap 43. The exhaust port 433 has an inner diameter of 20-100 mm and can be connected to a control valve for evacuating the device, injecting working fluid into the device, and discharging non-condensable gases. The upper end cap 43 also has an upper mounting hole 431 for installing the finned condenser tube 42. In this embodiment, the upper mounting hole 431 is a circular hole with an inner diameter of 10-50 mm.

[0063] The upper end cap of the condenser of the gravity-assisted heat pipe heat dissipation device disclosed herein includes a gas collection chamber for collecting non-condensable gases. Non-condensable gases generated during vacuuming and after multiple boilings of the working fluid can be automatically collected into the gas collection chamber through the vapor pressure difference. The exhaust port can be opened to discharge the non-condensable gases through the vacuuming device, which can effectively solve the problem of performance degradation caused by the accumulation of non-condensable gases after long-term operation of traditional gravity heat pipes.

[0064] Those skilled in the art will understand that the features described in the various embodiments and / or claims of this disclosure can be combined and / or combined in various ways, even if such combinations or combinations are not explicitly described in this disclosure. In particular, the features described in the various embodiments and / or claims of this disclosure can be combined and / or combined in various ways without departing from the spirit and teachings of this disclosure. All such combinations and / or combinations fall within the scope of this disclosure.

[0065] The embodiments of this disclosure have been described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of this disclosure. Although this disclosure has been shown and described with reference to specific exemplary embodiments, those skilled in the art will understand that various changes in form and detail may be made to this disclosure without departing from the spirit and scope of this disclosure as defined by the appended claims and their equivalents. Therefore, the scope of this disclosure should not be limited to the above embodiments, but should be determined not only by the appended claims but also by their equivalents.

Claims

1. A gravity-assisted heat dissipation device, characterized in that, include: Evaporator (1), horizontal tube (2), vertical tube (3) and condenser (4); The evaporator (1) is positioned above and in contact with the heat-dissipating component to vaporize the working fluid in the evaporator (1) using the heat from the heat-dissipating component. The steam outlet of the evaporator (1) is connected to the first connection end of the horizontal pipe (2). The evaporator (1) includes a bottom shell (12), and a porous medium (123) is provided on the inner bottom surface of the bottom shell (12). The porous medium (123) is used to enhance phase change heat transfer. The top of all sides of the bottom shell (12) is provided with interconnected overflow grooves (121). The porous medium (123) is also used to increase vaporization nuclei, accelerate the generation and detachment of bubbles when the working fluid boils, reduce the superheat required for the working fluid to enter nucleus boiling, and improve the burn-out limit of the gravity heat pipe. The second connecting end of the horizontal pipe (2) is connected to the first connecting end of the vertical pipe (3). The horizontal pipe (2) is used to transport the working fluid. The distance between the first connecting end of the horizontal pipe (2) and the horizontal plane is less than the distance between the second connecting end of the horizontal pipe (2) and the horizontal plane. The second connecting end of the vertical pipe (3) is connected to the bottom of the condenser (4). The vertical pipe (3) is used to transport the working fluid. The distance between the second connecting end of the vertical pipe (3) and the horizontal plane is greater than the distance between the first connecting end of the vertical pipe (3) and the horizontal plane. The condenser (4) is used to liquefy the working fluid in a vaporized state; the condenser (4) includes a lower end cap (41), the lower end cap (41) includes a steam buffer chamber (412); wherein, the bottom center of the steam buffer chamber (412) is provided with a connection port (411) connected to the second connection end of the vertical pipe (3), and the bottom of the steam buffer chamber (412) is provided with a tapered structure so that the liquid working fluid flows back to the evaporator (1) through the connection port (411), the vertical pipe (3) and the horizontal pipe (2); The condenser (4) further includes a finned condenser tube (42); the lower end cap (41) further includes a lower mounting hole (413); the lower mounting hole (413) is disposed on the upper surface of the steam buffer chamber (412), and the lower mounting hole (413) is used to install the finned condenser tube (42). The condenser (4) further includes an upper end cap (43); the upper end cap (43) includes a gas collection chamber (432), an upper mounting hole (431), and an exhaust port (433); the upper mounting hole (431) is located on the lower surface of the gas collection chamber (432) and is used to install the finned condenser tube (42); the exhaust port (433) is located at the center of the upper surface of the gas collection chamber (432); the gas collection chamber (432) is used to collect the generated non-condensable gases.

2. The gravity-assisted heat dissipation device according to claim 1, characterized in that, The evaporator (1) also includes a cover plate (11), which is tightly connected to the bottom shell (12); One end of the cover plate (11) is provided with the steam outlet of the evaporator (1); A support column (122) is also provided on the inner bottom surface of the bottom shell (12).

3. The gravity-assisted heat dissipation device according to claim 2, characterized in that, The end of the support column (122) away from the bottom shell (12) is in contact with the cover plate (11).

4. The gravity-assisted heat dissipation device according to claim 1, characterized in that, The angle between the horizontal pipe (2) and the horizontal plane is 5-10°.

5. The gravity-assisted heat dissipation device according to claim 1, characterized in that, The inner walls of both the horizontal tube (2) and the vertical tube (3) are provided with a superhydrophobic coating.

6. The gravity-assisted heat dissipation device according to claim 3, characterized in that, The finned condenser tube (42) is a round tube with an inner diameter of 10-50 mm; the inner wall of the finned condenser tube (42) is provided with a superhydrophobic coating.

7. The gravity-assisted heat dissipation device according to claim 1, characterized in that, The volume of the working fluid charged into the evaporator (1) is 0.5-3 times the total volume of the inner cavity of the evaporator (1).

8. The gravity-assisted heat dissipation device according to claim 2, characterized in that, The thickness of the bottom shell (12) is 20-100 mm.