Board card assembly and board card cabinet

Abstract

The application relates to the field of electronic equipment heat dissipation technology, and discloses a board card assembly and a board card cabinet, the board card assembly comprising a first cover body, a second cover body and a PCBA mainboard; the first cover body and the second cover body enclose a first containing cavity; the PCBA mainboard is arranged in the first containing cavity; wherein, along the thickness direction of the first cover body, the first cover body has oppositely arranged first and second side surfaces, the first side surface is provided with a heat dissipation fin group, the first cover body is provided with a heat dissipation boss protruding from the second side surface, the heat dissipation boss is located in the first containing cavity, and a heat conduction layer is arranged between the end of the heat dissipation boss away from the second side surface and the PCBA mainboard. According to the board card assembly and the board card cabinet, the heat dissipation effect of the board card is improved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic devices, and in particular to a board assembly and board chassis. Background Technology

[0002] EMC boards have multiple functional modules. As the integration of terminals increases, power consumption requirements increase, and heat is relatively concentrated. To ensure that EMC boards do not overheat and cause performance degradation or system instability under long-term high-load operation, traditional solutions, such as using sheet metal parts as the whole machine shell and putting them in a closed simple chassis, have very poor heat dissipation.

[0003] Therefore, improving the heat dissipation of circuit boards is a technical problem that urgently needs to be solved. Utility Model Content

[0004] This application provides a board assembly and board chassis, which improve the heat dissipation effect of the board.

[0005] To achieve the above objectives, the main technical solutions adopted in this application include:

[0006] In a first aspect, embodiments of this application provide a board assembly, including a first cover, a second cover, and a PCBA motherboard: the second cover and the first cover enclose a first receiving cavity; the PCBA motherboard is disposed in the first receiving cavity; wherein, along the thickness direction of the first cover, the first cover has a first side and a second side disposed opposite to each other, a heat sink assembly is disposed on the first side, the first cover has a heat dissipation boss protruding from the second side, the heat dissipation boss is located in the first receiving cavity, and a thermally conductive layer is disposed between the end of the heat dissipation boss away from the second side and the PCBA motherboard.

[0007] The board assembly proposed in this application has a heat sink that increases the contact area with air, improving the efficiency of air flow on the surface of the heat sink and removing heat. Simultaneously, the heat sink can radiate heat to the outside, quickly transferring the heat absorbed by the first cover to the outside, thus improving heat dissipation efficiency. The thermally conductive layer can quickly transfer heat from the PCBA motherboard to the heat dissipation protrusions, achieving rapid cooling of the PCBA motherboard, reducing the occurrence of overheating, and further improving the heat dissipation effect of the PCBA motherboard. It also helps improve the local heat dissipation efficiency of the PCBA motherboard, reducing the probability of heat diffusion and heat spread, thus contributing to improved heat dissipation performance.

[0008] Optionally, there are multiple heat dissipation bosses and thermal conductive layers. The multiple heat dissipation bosses are spaced apart, and the end of each heat dissipation boss away from the second side is connected to the PCBA motherboard through the corresponding thermal conductive layer.

[0009] In the above solution, multiple heat dissipation bumps can dissipate heat at different locations on the PCBA motherboard. On the one hand, this can improve the heat dissipation efficiency at multiple locations on the PCBA motherboard, and on the other hand, it can improve the overall heat dissipation efficiency of the PCBA motherboard, thus helping to improve the heat dissipation effect of the PCBA motherboard. At the same time, heat can be quickly transferred to the heat dissipation bumps at multiple locations on the PCBA motherboard through the thermal conductive layer, which helps to achieve rapid cooling of the PCBA motherboard. This facilitates meeting the different thermal conductivity requirements at different locations on the PCBA motherboard, helps to improve the heat dissipation effect of severely heat-generating parts, and thus improves the overall heat dissipation effect.

[0010] Optionally, at least two heat dissipation protrusions have different projected areas along the thickness direction of the first cover.

[0011] In the above solution, the different sizes of some heat dissipation bumps can meet the heat dissipation needs of different locations on the PCBA motherboard. On the one hand, it can reduce the probability of assembly failure caused by collision between large heat dissipation bumps and dense components on the PCBA motherboard, thus blocking the heat dissipation path. On the other hand, it can reduce the occurrence of insufficient heat conduction of small heat dissipation bumps to high heat-generating areas on the PCBA motherboard, ensuring that each heat dissipation bump can effectively contact the corresponding heat-generating area on the PCBA motherboard, reducing the probability of heat dissipation path interruption due to space limitations.

[0012] Optionally, along the thickness direction of the first cover, the projection of each heat dissipation protrusion at least partially overlaps with the projection of the heat sink assembly.

[0013] In the above scheme, the heat absorbed by the heat dissipation protrusion from the PCBA motherboard needs to be conducted to the heat sink assembly through the first cover before it can be dissipated to the outside. The design that the projection of each heat dissipation protrusion and the projection of the heat sink assembly at least partially overlaps reduces the probability of heat diffusion within the first cover and ensures that heat is quickly conducted to the heat sink assembly. At the same time, the overlap between the projection of the heat dissipation protrusion and the heat sink assembly allows the heat dissipation protrusion to dissipate heat quickly, reducing the occurrence of heat accumulation on the heat dissipation protrusion and ensuring the heat dissipation efficiency of the heat dissipation protrusion, thereby ensuring the heat dissipation efficiency of the PCBA motherboard.

[0014] Optionally, the heat sink assembly includes multiple heat sink fins, with adjacent heat sink fins spaced apart to form a heat dissipation channel, the extension direction of which is parallel to the length direction of the first cover.

[0015] In the above scheme, the airflow can gradually absorb the heat of the heat dissipation fins as it passes through the heat dissipation duct, avoiding the airflow from flowing out before it has fully absorbed heat due to the heat dissipation duct being too short. This maximizes the heat carrying capacity of each airflow and improves the heat dissipation effect. This design helps to increase the effective heat dissipation length of the heat dissipation duct and increase the contact time between the heat dissipation duct and the heat dissipation fins, thereby improving the heat dissipation effect.

[0016] Secondly, embodiments of this application provide a board chassis, including a chassis and a board assembly according to any embodiment: the chassis has a second receiving cavity inside; the board assembly is disposed in the second receiving cavity; wherein, along a first direction, the chassis includes a first side wall and a second side wall disposed opposite to each other, the first side wall is provided with a cooling fan, the second side wall is provided with ventilation holes, and the first direction is perpendicular to the thickness direction of the first cover.

[0017] The circuit board chassis proposed in this application embodiment has a cooling fan that can actively extract hot air from the second receiving cavity. After the airflow enters through the ventilation hole, it can flow over the surface of the circuit board components and carry away the heat of the circuit board components. Under the active cooling effect of the cooling fan, the hot air in the second receiving cavity can be quickly discharged, which helps to reduce the heat accumulation inside the chassis, helps to lower the overall temperature of the chassis, and improves the heat dissipation effect of the circuit board components.

[0018] Optionally, the heat sink assembly has multiple heat dissipation channels, and the extension direction of the heat dissipation channels is parallel to the first direction.

[0019] In the above solution, cold air can flow along the entire length of the heat dissipation channel across the surface of each heat dissipation fin. This maximizes the contact area between the airflow and the heat dissipation fins and extends the contact time between the cold air and the high-temperature fins, allowing the airflow to fully absorb the heat from the heat dissipation fins. This prevents the cold air from being expelled without absorbing heat, significantly improving the heat dissipation efficiency per unit airflow, thereby maximizing the active cooling efficiency of the fan and rapidly cooling the circuit board components.

[0020] Optionally, there are multiple board components, including adjacent first board components and second board components. Along the thickness direction of the first cover, the first board components and second board components are spaced apart to form a first air duct. Along the first direction, the cooling fan and the ventilation hole are respectively arranged opposite to the first air duct.

[0021] In the above scheme, when the airflow passes between the first board assembly and the second board assembly, the airflow can simultaneously dissipate heat from the first board assembly and the second board assembly. This configuration allows the gas to flow over the surfaces of the two board assemblies without changing its flow trajectory, enabling simultaneous heat dissipation of multiple board assemblies within the board chassis. This improves heat dissipation efficiency, reduces the likelihood of the board chassis temperature becoming too high, and helps improve the overall heat dissipation effect of the board chassis.

[0022] Optionally, along the thickness direction of the first cover, the heat sink assembly of the first board assembly and the heat sink assembly of the second board assembly are both located within the first air duct.

[0023] In the above scheme, part of the airflow in the first air duct enters the heat sink of the first board assembly, and another part of the airflow in the first air duct can enter the heat sink of the second board assembly, so that more gas in the first air duct comes into contact with the first board assembly and the second board assembly. The gas in the first air duct can simultaneously carry away the heat from the heat sinks of the first board assembly and the heat sinks of the second board assembly, thereby helping to improve the airflow heat exchange efficiency.

[0024] Optionally, there are multiple cooling fans, ventilation holes, first board components, and second board components. A first air duct is formed between each first board component and its corresponding second board component. Along the first direction, the first air duct is respectively positioned opposite to the corresponding cooling fan and the corresponding ventilation hole.

[0025] In the above scheme, multiple first air ducts can simultaneously dissipate heat from multiple first board components and multiple second board components. At the same time, each first air duct is equipped with a corresponding cooling fan, which improves the active heat dissipation effect of each heat dissipation air duct. This can ensure that different areas inside the board chassis can be efficiently cooled, reduce the probability of heat transfer between different areas inside the board chassis, and help improve the overall heat dissipation effect of the board chassis. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the board assembly in some embodiments of this application;

[0028] Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure along the AA direction;

[0029] Figure 3 This is a schematic diagram of the structure of the first cover in some embodiments of this application;

[0030] Figure 4 This is a schematic diagram of the board chassis structure in some embodiments of this application;

[0031] Figure 5 This is a schematic diagram of the board chassis in some other embodiments of this application;

[0032] Figure 6 This is a schematic diagram of the board chassis in some other embodiments of this application.

[0033] [Explanation of Labels in the Attached Image]

[0034] 1000, Circuit Board Chassis;

[0035] 100, Board assembly; 100a, First receiving cavity;

[0036] 110. First cover; 111. First side; 112. Second side; 113. Heat sink assembly; 113a. Heat sink fins; 113b. Heat dissipation duct; 113c. Heat dissipation channel; 114. Heat dissipation boss; 115. Thermal conductive layer;

[0037] 101. First board assembly; 102. Second board assembly; 103. First air duct;

[0038] 120. Second cover;

[0039] 130. PCBA (Printed Circuit Board Assembly) Mainboard;

[0040] 200, housing; 200a, second accommodating cavity;

[0041] 210. First sidewall; 211. Cooling fan; 220. Second sidewall; 221. Ventilation hole;

[0042] X, the first direction. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0044] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used in the description of this application is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms "comprising" and "having," and any variations thereof, in the description, claims, and accompanying drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the description, claims, or accompanying drawings of this application are used to distinguish different objects, not to describe a specific order or hierarchy.

[0045] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0046] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "attachment" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0047] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, in this application, the character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0048] In this application, "multiple" refers to two or more (including two), and similarly, "multiple groups" refers to two or more (including two), and "multiple pieces" refers to two or more (including two).

[0049] EMC boards have multiple functional modules. As terminal integration increases and power consumption demands rise, heat is concentrated, necessitating heat dissipation to quickly transfer heat from the heat source to the casing without affecting reliability and stability. To ensure that EMC boards do not overheat and cause performance degradation or system instability under prolonged high-load operation, traditional solutions, such as using sheet metal components as the casing within a closed, simple chassis without fans, suffer from poor heat dissipation because heat cannot be effectively expelled to the external environment.

[0050] Therefore, improving the heat dissipation of circuit boards is a technical problem that urgently needs to be solved.

[0051] In view of this, in order to improve the heat dissipation effect of the circuit board, this application proposes a circuit board assembly and a circuit board chassis. The circuit board assembly 100 includes a first cover 110. Along the thickness direction of the first cover 110, the first cover 110 has a first side 111 and a second side 112 disposed opposite to each other. A heat sink assembly 113 is disposed on the first side 111. The first cover 110 is provided with a heat dissipation boss 114 protruding from the second side 112. The heat dissipation boss 114 is located in the first receiving cavity 100a. A thermally conductive layer 115 is disposed between the end of the heat dissipation boss 114 away from the second side 112 and the PCBA motherboard 130. It can be understood that the heat sink assembly 113 disposed on the first side 111 can significantly increase the contact area between the first cover 110 and the air, and can quickly transfer the heat absorbed by the first cover 110 to the outside through convection and radiation, thereby improving the heat dissipation of the first cover 110. In terms of thermal efficiency, the thermally conductive layer 115 can efficiently transfer heat. The heat generated by the PCBA motherboard 130 can be quickly transferred by the thermally conductive layer 115 to the heat dissipation protrusion 114, and then from the heat dissipation protrusion 114 to the first cover 110. Finally, it is dissipated to the outside through the heat sink assembly 113. This configuration can enhance the local heat dissipation effect and improve the heat dissipation efficiency of the PCBA motherboard 130. The heat generated by the PCBA motherboard 130 can be quickly transferred to the outer casing, reducing the probability of heat accumulation on the PCBA motherboard 130 and helping to quickly reduce the temperature of the PCBA motherboard 130. On the other hand, it improves the overall heat dissipation efficiency. The heat of the first cover 110 can be quickly transferred to the outside, reducing the probability of heat accumulation on the first cover 110 and ensuring that the first cover 110 can continuously obtain heat from the PCBA motherboard 130, thereby improving the heat dissipation effect of the PCBA board.

[0052] The board assembly and board chassis proposed in the embodiments of this application are described below with reference to the accompanying drawings.

[0053] Please refer to Figure 1 and Figure 2 According to the first aspect of this application, the board assembly 100 includes a first cover 110, a second cover 120, and a PCBA motherboard 130.

[0054] The second cover 120 and the first cover 110 form a first receiving cavity 100a. It can be understood that the first cover 110 and the second cover 120 can protect the PCBA motherboard 130 and isolate the PCBA motherboard 130 from the outside world to prevent dust, moisture, oil or external impact from damaging the PCBA motherboard 130.

[0055] As an example, the first cover 110 and the second cover 120 can be detachably connected by bolts.

[0056] PCBA motherboard 130 is disposed in the first receiving cavity 100a; specifically, PCBA motherboard 130 can be fixed to the first cover 110 or the second cover 120 by bolts or snap-fit, and this application does not limit this.

[0057] Along the thickness direction of the first cover 110, the first cover 110 has a first side 111 and a second side 112 arranged opposite to each other. The first side 111 is provided with a heat sink assembly 113. It can be understood that the heat sink assembly 113 can increase the contact area with air, improve the efficiency of air carrying away heat when flowing on the surface of the heat sink assembly 113, and at the same time, the heat sink assembly 113 can transfer heat to the outside through radiation, thereby quickly transferring the heat absorbed by the first cover 110 to the outside and improving the heat dissipation efficiency.

[0058] The first cover 110 is provided with a heat dissipation protrusion 114 protruding from the second side 112. The heat dissipation protrusion 114 is located in the first receiving cavity 100a. It can be understood that the heat dissipation protrusion 114 extends from the second side 112 into the first receiving cavity 100a, which can shorten its distance with the PCBA motherboard 130 and help improve the heat transfer efficiency between the PCBA motherboard 130 and the heat dissipation protrusion 114. This configuration helps to improve the local heat dissipation efficiency of the PCBA motherboard 130, reduce the probability of heat diffusion in the PCBA motherboard 130, reduce the occurrence of heat spread, and help improve the heat dissipation effect of the PCBA motherboard 130.

[0059] A thermally conductive layer 115 is provided between the end of the heat dissipation protrusion 114 away from the second side 112 and the PCBA motherboard 130. It is understood that the thermally conductive layer 115 can accelerate heat transfer. On one hand, the thermally conductive layer 115 can quickly transfer the heat from the PCBA motherboard 130 to the heat dissipation protrusion 114, achieving rapid cooling of the PCBA motherboard 130, reducing the occurrence of overheating, and further improving the heat dissipation effect of the PCBA motherboard 130. On the other hand, the flexible thermally conductive layer 115 can buffer the rigid contact between the heat dissipation protrusion 114 and the PCBA motherboard 130, avoiding component damage caused by thermal expansion and contraction or vibration, and facilitating compatibility with heat-generating components of different heights.

[0060] As an example, the thermally conductive layer 115 may be constructed as one or more of thermally conductive grease, thermally conductive silicone pad, thermally conductive gel or graphite thermal sheet, and this application does not limit this.

[0061] When the gap between the heat dissipation boss 114 and the PCBA motherboard 130 is small, thermal grease can be used as the thermal conductive layer 115. The thermal conductive layer 115 can fit tightly against the surface of the heat dissipation boss 114 and the PCBA motherboard 130, avoiding the increase in thermal resistance caused by residual air.

[0062] When there is a certain assembly gap between the heat dissipation boss 114 and the PCBA motherboard 130, or when the surface of the PCBA motherboard 130 has slight undulations, a thermally conductive silicone pad can be used as a heat dissipation layer. The thermally conductive silicone pad can adaptively fit the surface of the heat dissipation boss 114 and the PCBA motherboard 130, while avoiding damage to the electronic components on the PCBA motherboard 130.

[0063] In other embodiments, please refer to Figure 2 and Figure 3 There are multiple heat dissipation protrusions 114 and heat conduction layers 115. It can be understood that multiple heat dissipation protrusions 114 and corresponding heat conduction layers 115 can work together to transfer heat and simultaneously cool down the PCBA motherboard 130, further improving the heat dissipation effect of the PCBA motherboard 130.

[0064] Multiple heat dissipation protrusions 114 are spaced apart, meaning that the multiple heat dissipation protrusions 114 can dissipate heat at different locations on the PCBA motherboard 130. This arrangement can improve the heat dissipation efficiency at multiple locations on the PCBA motherboard 130, reduce the probability of heat diffusion on the PCBA motherboard 130, reduce the occurrence of heat spread, and further reduce the occurrence of excessive heat in local areas of the PCBA motherboard 130. On the other hand, it can improve the overall heat dissipation efficiency of the PCBA motherboard 130, which helps to improve the heat dissipation effect of the PCBA motherboard 130.

[0065] Each heat dissipation protrusion 114 is connected to the PCBA motherboard 130 at the end furthest from the second side 112 via a corresponding thermally conductive layer 115. In other words, heat can be quickly transferred from multiple locations on the PCBA motherboard 130 to the heat dissipation protrusion 114 via the thermally conductive layer 115, facilitating rapid cooling of the PCBA motherboard 130. This design not only meets the different heat dissipation needs of different locations on the PCBA motherboard 130 and improves the heat dissipation effect of severely heat-generating areas, thus improving the overall heat dissipation effect, but also allows heat to be directly transferred to each heat dissipation protrusion 114 via the thermally conductive layer 115. The spaced arrangement of the heat dissipation protrusions 114 reduces the probability of heat accumulation inside them, improving the heat transfer efficiency of the heat dissipation protrusions 114 and thus enhancing the heat dissipation efficiency of the PCBA motherboard 130.

[0066] Furthermore, it is understandable that the PCBA motherboard 130 does not generate heat uniformly as a whole, but rather in multiple localized locations such as chips and power devices. Multiple heat dissipation protrusions 114 can correspond to these heat dissipation points. Each heat dissipation protrusion 114 directly absorbs the heat of the corresponding area through its respective thermal conductive layer 115, reducing the probability of heat diffusion on the PCBA motherboard 130 and reducing the loss caused by the thermal resistance of the PCBA substrate during the diffusion process, thus significantly improving the local heat dissipation efficiency.

[0067] In other embodiments, please refer to Figure 2 and Figure 3 Along the thickness direction of the first cover 110, at least two heat dissipation protrusions 114 have different projected areas. It is understood that there are multiple heat dissipation protrusions 114, and some of the heat dissipation protrusions 114 have different sizes. This arrangement is to facilitate meeting the heat dissipation needs of different locations on the PCBA motherboard 130.

[0068] The heat dissipation power varies significantly in different areas of the PCBA motherboard. The larger the contact area between the heat dissipation boss 114 and the PCBA motherboard, the more heat can be transferred per unit time, which helps to reduce the chance of heat accumulation in areas with high heat generation, while also reducing the space occupied by the heat dissipation boss 114 in areas with low heat generation.

[0069] Furthermore, PCBA components are densely distributed and space is limited: high-heat-generating components such as power management chips may have ample space around them, accommodating large-area bosses; while medium- and low-heat-generating components such as resistor and capacitor arrays have limited space around them, only accommodating small-area bosses. On the one hand, this can reduce the probability of assembly failure caused by collisions between large-area heat dissipation bosses 114 and dense components on the PCBA motherboard 130, thus blocking the heat dissipation path; on the other hand, it can reduce the occurrence of insufficient heat conduction in high-heat-generating areas on the PCBA motherboard 130 caused by small-area heat dissipation bosses 114.

[0070] This configuration allows for enhanced heat dissipation at high-heat-generating components using large-area heat dissipation protrusions 114, while avoiding interference in confined areas using small-area heat dissipation protrusions 114. This ensures that each heat dissipation protrusion 114 can effectively contact the corresponding heat-generating area on the PCBA motherboard 130, reducing the likelihood of interrupted heat dissipation pathways.

[0071] In other embodiments, please refer to Figure 1 and Figure 2 Along the thickness direction of the first cover 110, the projection of each heat dissipation protrusion 114 at least partially overlaps with the projection of the heat sink assembly 113. It is understood that the heat absorbed by the heat dissipation protrusion 114 from the PCBA motherboard needs to be conducted through the first cover 110 to the heat sink assembly 113 before it can be dissipated to the outside. The design that the projection of each heat dissipation protrusion 114 at least partially overlaps with the projection of the heat sink assembly 113 reduces the probability of heat diffusion within the first cover 110, ensuring rapid heat conduction to the heat sink assembly 113 and helping to improve heat dissipation efficiency.

[0072] Meanwhile, different areas of the first cover 110 have different heat dissipation capabilities. For example, the area where the heat sink assembly 113 is located has higher heat dissipation efficiency, while the area without the heat sink assembly 113 has lower heat dissipation efficiency. The heat dissipation protrusion 114 obtains heat from the PCBA body more efficiently, resulting in the heat dissipation protrusion 114 heating up faster. Therefore, the heat dissipation protrusion 114 is designed to overlap with the heat sink assembly 113 in projection, which allows the heat dissipation protrusion 114 to dissipate heat quickly, reducing the accumulation of heat on the heat dissipation protrusion 114 and ensuring the heat dissipation efficiency of the heat dissipation protrusion 114, thereby ensuring the heat dissipation efficiency of the PCBA motherboard 130.

[0073] In a specific embodiment, the heat dissipation protrusion 114 is located in the area of ​​the PCBA motherboard 130 where heat generation is high. The heat generated by the PCBA motherboard 130 can be directly dissipated to the outside through the heat dissipation protrusion 114 and the heat sink assembly 113, reducing the probability of heat remaining in the first cover 110 and helping to reduce the temperature rise caused by heat accumulation.

[0074] In other embodiments, please refer to Figure 1 and Figure 2 The heat sink assembly 113 includes multiple heat sink fins 113a. Two adjacent heat sink fins 113a are spaced apart to form a heat dissipation channel 113b. It can be understood that as the airflow passes through the heat dissipation channel 113b, it can gradually absorb the heat from the heat sink fins 113a, avoiding the airflow from flowing out before it has fully absorbed heat due to the heat dissipation channel 113b being too short. This maximizes the heat carrying capacity of each airflow and improves the heat dissipation effect.

[0075] The extension direction of the heat dissipation duct 113b is parallel to the length direction of the first cover 110. It can be understood that the length direction of the first cover 110 is the same as the main extension direction of the PCBA board. This setting helps to increase the effective heat dissipation length of the heat dissipation duct 113b and increase the contact time between the heat dissipation duct 113b and the heat dissipation fins 113a, thereby improving the heat dissipation effect.

[0076] Meanwhile, the PCBA motherboard 130 in the length direction of the first cover 110 usually integrates more core heat-generating components, such as CPU, memory, interface chips and other electronic components arranged along the length direction. The heat dissipation channel 113b of the heat sink assembly 113 extends parallel to the length direction of the first cover 110 and can correspond to multiple core heat-generating components on the PCBA motherboard 130 in the first receiving cavity 100a. After the heat from the PCBA motherboard 130 is transferred to the first cover 110, it can come into contact with the heat dissipation channel 113b more quickly, and then quickly diffuse through the heat dissipation channel 113b parallel to the length direction of the first cover 110, avoiding the local accumulation of heat in the first cover 110.

[0077] In addition, this layout does not require additional space to be reserved for air ducts in the width direction, which helps to arrange more and longer heat dissipation fins 113a on the first cover 110 with limited size. It can increase the heat dissipation area without increasing the width of the first cover 110, thus taking into account both heat dissipation performance and the need for device miniaturization.

[0078] Secondly, please refer to Figure 4 and Figure 5 This application provides a board chassis 1000, including a chassis 200 and a board assembly 100 according to any embodiment.

[0079] The enclosure 200 has a second receiving cavity 200a inside; the board assembly 100 is disposed in the second receiving cavity 200a; it can be understood that the enclosure 200 can protect the board assembly 100.

[0080] Along the first direction X, the housing 200 includes a first sidewall 210 and a second sidewall 220 disposed opposite to each other. The first sidewall 210 is provided with a cooling fan 211, and the second sidewall 220 is provided with a ventilation hole 221. The first direction X is perpendicular to the thickness direction of the first cover 110. It is understood that along the first direction X, the cooling fan 211 and the ventilation hole 221 are at least partially disposed opposite to each other, and the air outlet direction of the cooling fan 211 is towards the outside of the second receiving cavity 200a. This arrangement creates a straight passage for airflow from the first sidewall 210 to the second sidewall 220, allowing hot air in the second receiving cavity 200a to be quickly discharged, which helps to improve the heat dissipation effect.

[0081] Meanwhile, the cooling fan 211 can actively extract the hot air from the second accommodating cavity 200a. After the airflow enters through the ventilation hole 221, it can flow over the surface of the board assembly 100 to carry away the heat of the board assembly 100, and then be extracted by the cooling fan 211. This configuration helps to reduce the heat accumulation inside the chassis, helps to lower the overall temperature of the chassis, and improves the heat dissipation effect of the board assembly 100.

[0082] In other words, the cooling fan 211 can actively dissipate heat from the chassis, while the ventilation holes 221 can passively draw in cool air, enabling air circulation inside the chassis 1000. This, combined with the passive cooling of the board components 100, further improves the heat dissipation efficiency.

[0083] In other embodiments, please refer to Figure 4 and Figure 5The heat sink assembly 113 has multiple heat dissipation channels 113c, and the extension direction of the heat dissipation channels 113c is parallel to the first direction X. It can be understood that the extension direction of the heat dissipation channels 113c is parallel to the main airflow direction from the fan to the ventilation hole 221, so the airflow can quickly enter the heat dissipation channels 113c without turning, and the airflow entering the heat dissipation channels 113c will not be reduced due to excessive resistance.

[0084] This configuration allows cold air to flow along the entire length of the heat dissipation channel 113c across the surface of each heat dissipation fin 113a. This maximizes the contact area between the airflow and the heat dissipation fin 113a, while also extending the contact time between the cold air and the high-temperature fins. This allows the airflow to fully absorb the heat from the heat dissipation fins 113a, preventing the cold air from being expelled before absorbing heat. This significantly improves the heat dissipation efficiency per unit airflow, thereby maximizing the active cooling efficiency of the fan and rapidly cooling the board component 100.

[0085] In other embodiments, please refer to Figure 5 and Figure 6 There are multiple board components 100, including adjacent first board components 101 and second board components 102. Along the thickness direction of the first cover 110, the first board components 101 and second board components 102 are spaced apart to form a first air duct 103. It can be understood that when the airflow passes between the first board components 101 and the second board components 102, the airflow can simultaneously dissipate heat from the first board components 101 and the second board components 102. With this configuration, the simultaneous heat dissipation of multiple board components 100 in the board chassis 1000 can be achieved, which helps to improve heat dissipation efficiency, reduce the probability of the board chassis 1000 overheating, and help improve the overall heat dissipation effect of the board chassis 1000.

[0086] Along the first direction X, the cooling fan 211 and the ventilation hole 221 are respectively positioned opposite to the first air duct 103. It can be understood that after the gas enters through the ventilation hole 221, it can flow along the first air duct 103, simultaneously dissipating heat from the first circuit board assembly 101 and the second circuit board assembly 102 on both sides of the first air duct 103. After flowing in a straight line, it is exhausted by the cooling fan 211. This arrangement allows the gas to flow over the surfaces of both circuit board assemblies 100 without changing its flow trajectory, improving heat dissipation efficiency. Furthermore, it ensures that the first circuit board assembly 101 and the second circuit board assembly 102 cool down simultaneously, reducing the possibility of localized heat accumulation and contributing to improved heat dissipation.

[0087] In other embodiments, please refer to Figure 5 and Figure 6Along the thickness direction of the first cover 110, the heat sink assembly 113 of the first board assembly 101 and the heat sink assembly 113 of the second board assembly 102 are both located within the first air duct 103. That is, the air within the first air duct 103 can simultaneously carry away the heat from the heat sink assembly 113 of the first board assembly 101 and the heat sink assembly 113 of the second board assembly 102, allowing the heat from both boards to dissipate quickly and further improving the heat dissipation efficiency of both boards.

[0088] Meanwhile, part of the airflow in the first air duct 103 enters the heat sink group 113 of the first board assembly 101, and another part of the airflow in the first air duct 103 can enter the heat sink group 113 of the second board assembly 102, so that more gas in the first air duct 103 comes into contact with the first board assembly 101 and the second board assembly 102, thereby helping to improve the airflow heat exchange efficiency.

[0089] In other embodiments, please refer to Figure 5 and Figure 6 There are multiple cooling fans 211, ventilation holes 221, first board assembly 101, and second board assembly 102. A first air duct 103 is formed between each first board assembly 101 and the corresponding second board assembly 102. Along the first direction X, the first air duct 103 is respectively arranged opposite to the corresponding cooling fan 211 and the corresponding ventilation hole 221.

[0090] In the above scheme, multiple first air ducts 103 can simultaneously dissipate heat from multiple first board components 101 and multiple second board components 102. At the same time, each first air duct 103 is equipped with a corresponding cooling fan 211, which improves the active heat dissipation effect of each heat dissipation air duct 113b. This ensures that different areas inside the board chassis 1000 can be efficiently cooled, reduces the probability of heat transfer between different areas inside the board chassis 1000, and helps to improve the overall heat dissipation effect of the board chassis 1000.

[0091] In a specific embodiment, the cooling fan 211 can be a silent fan, and it delivers air from the second receiving cavity 200a to the outside. This configuration allows the heat of the entire circuit board to be conducted to the outside of the chassis, meeting the needs of multiple circuit board components 100 being installed together. In use, after the circuit board component 100 is assembled into the circuit board chassis 1000, the airflow direction of the heat dissipation fins 113a is consistent with the airflow direction. After the four high-volume silent fans are turned on, they will draw air from inside the chassis. The airflow enters the second receiving cavity 200a through the bottom ventilation hole 221 and flows through the heat dissipation fins 113a of the circuit board component 100, and finally is discharged from the cooling fan 211, thereby achieving active heat dissipation of the circuit board component 100 and maximizing the removal of heat to the external environment of the circuit board chassis 1000.

[0092] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0093] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.

[0094] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

[0095] Although embodiments of this application have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of this application, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A board assembly, characterized in that, include: First cover (110); The second cover (120) and the first cover (110) together form a first receiving cavity (100a); The PCBA motherboard (130) is disposed in the first receiving cavity (100a); Along the thickness direction of the first cover (110), the first cover (110) has a first side (111) and a second side (112) disposed opposite to each other. The first side (111) is provided with a heat sink assembly (113). The first cover (110) is provided with a heat dissipation boss (114) protruding from the second side (112). The heat dissipation boss (114) is located in the first receiving cavity (100a). A heat-conducting layer (115) is disposed between the end of the heat dissipation boss (114) away from the second side (112) and the PCBA motherboard (130).

2. The board assembly (100) according to claim 1, characterized in that, There are multiple heat dissipation protrusions (114) and multiple heat conduction layers (115). The multiple heat dissipation protrusions (114) are spaced apart. The end of each heat dissipation protrusion (114) away from the second side (112) is connected to the PCBA motherboard (130) through the corresponding heat conduction layer (115).

3. The board assembly (100) according to claim 2, characterized in that, Along the thickness direction of the first cover (110), at least two of the heat dissipation protrusions (114) have different projected areas.

4. The board assembly (100) according to claim 2, characterized in that, Along the thickness direction of the first cover (110), the projection of each heat dissipation protrusion (114) at least partially overlaps with the projection of the heat sink assembly (113).

5. The board assembly (100) according to claim 1, characterized in that, The heat sink assembly (113) includes a plurality of heat sink fins (113a), and two adjacent heat sink fins (113a) are spaced apart to form a heat dissipation duct (113b), and the extension direction of the heat dissipation duct (113b) is parallel to the length direction of the first cover (110).

6. A circuit board chassis, characterized in that, include: The housing (200) has a second receiving cavity (200a) inside; The board assembly (100) according to any one of claims 1 to 5, wherein the board assembly (100) is disposed in the second receiving cavity (200a); Along the first direction (X), the housing (200) includes a first sidewall (210) and a second sidewall (220) disposed opposite to each other. The first sidewall (210) is provided with a cooling fan (211), and the second sidewall (220) is provided with a ventilation hole (221). The first direction (X) is perpendicular to the thickness direction of the first cover (110).

7. The board chassis (1000) according to claim 6, characterized in that, The heat sink assembly (113) has multiple heat dissipation channels (113c), and the extending direction of the heat dissipation channels (113c) is parallel to the first direction (X).

8. The board chassis (1000) according to claim 6, characterized in that, There are multiple board components (100), and the multiple board components (100) include adjacent first board components (101) and second board components (102). Along the thickness direction of the first cover (110), the first board components (101) and the second board components (102) are spaced apart to form a first air duct (103). Along the first direction (X), the cooling fan (211) and the ventilation hole (221) are respectively arranged opposite to the first air duct (103).

9. The board chassis (1000) according to claim 8, characterized in that, Along the thickness direction of the first cover (110), the heat sink group (113) of the first board assembly (101) and the heat sink group (113) of the second board assembly (102) are both located within the first air duct (103).

10. The board chassis (1000) according to claim 8, characterized in that, There are multiple cooling fans (211), ventilation holes (221), first board assembly (101), and second board assembly (102). A first air duct (103) is formed between each first board assembly (101) and the corresponding second board assembly (102). Along the first direction (X), the first air duct (103) is respectively arranged opposite to the corresponding cooling fan (211) and the corresponding ventilation hole (221).

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