Wafer assisted positioning device

Abstract

The application provides a wafer auxiliary positioning device, comprising a body, an identification part and a positioning part; the body comprises a first surface and a second surface, the first surface and the second surface are opposite; the identification part is arranged on the first surface and used for identifying the relative position of the wafer and the body; the positioning part is arranged on the second surface and used for abutting against the side surface of a heating disc, so that the body is fixed on the heating disc. By comparing the relative position between the wafer and the identification part, the relative position relationship between the wafer and the heating disc is obtained, so that the position of the wafer is adjusted, and the positioning of the wafer is realized. In addition, since the wafer processing process needs to be carried out under negative pressure, the positioning part abutting against the side surface of the heating disc can avoid the position deviation of the wafer auxiliary positioning device under the vacuum condition and in the vacuumizing process, and is favorable for improving the positioning accuracy of the wafer.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment, and more particularly to a wafer-assisted positioning device. Background Technology

[0002] In semiconductor manufacturing, wafers often need to be moved so that they can be processed in different process cavities.

[0003] Currently, during the transfer of wafers between different process cavities, the precise placement of the wafer on the heating plate is difficult to control, resulting in poor uniformity of film thickness at different locations on the wafer surface during thin film deposition. Sometimes, multiple engineers are required to perform multiple corrections to the wafer position, wasting a significant amount of time.

[0004] Therefore, it is necessary to develop a new type of wafer-assisted positioning device to improve some of the problems existing in the prior art. Summary of the Invention

[0005] The purpose of this invention is to provide a wafer auxiliary positioning device that can improve the accuracy of wafer placement.

[0006] To achieve the above objectives, the present invention provides a wafer-assisted positioning device comprising: a body, an identification part, and a positioning part; the body includes a first surface and a second surface, the first surface and the second surface being opposite to each other; the identification part is disposed on the first surface for identifying the relative position of the wafer and the body; the positioning part is disposed on the second surface and is used to abut against the side of a heating plate, thereby fixing the body on the heating plate.

[0007] The beneficial effects of the wafer auxiliary positioning device provided by the present invention are as follows: when the wafer auxiliary positioning device is fixedly installed on the heating plate and the wafer is placed on the first surface of the body, the relative positional relationship between the wafer and the heating plate can be known by comparing the relative position between the wafer and the marking part, so as to adjust the position of the wafer and realize the positioning of the wafer; in addition, since the wafer processing technology needs to be carried out under negative pressure conditions, the positioning part abutting against the side of the heating plate can prevent the wafer auxiliary positioning device from shifting its position under vacuum conditions and during the vacuuming process, which is beneficial to improving the accuracy of wafer positioning.

[0008] Optionally, the body is a disc-shaped structure, and the positioning part includes a protrusion disposed on the edge of the body and extending along the axial direction of the body. Its advantages are that the disc-shaped body is adapted to the shape of the heating plate, facilitating the fixing of the body to the heating plate, while the protrusion abuts against the side of the heating plate to achieve fixation in the radial direction of the heating plate.

[0009] Optionally, the protrusion has a circular cross-sectional shape in a plane perpendicular to the axis of the body.

[0010] Optionally, the marking portion includes a circular mark used to identify the relative position of the wafer and the body. Its advantage is that by comparing the circular mark with the outline of the wafer, the position of the wafer on the heating plate can be determined.

[0011] Optionally, the marking section includes a plurality of circular markings of different diameters, which are concentrically arranged. This has the advantage of facilitating the positioning of wafers of different sizes.

[0012] Optionally, the circular marker is concentrically positioned with the main body. This improves ease of use.

[0013] Optionally, the marking section includes a straight line marker used to identify the relative position of the wafer and the body. Its advantage is that it helps improve the positioning accuracy of the wafer.

[0014] Optionally, the marking section includes at least three straight markings arranged radially along the body.

[0015] Optionally, the four straight line markers are arranged radially along the body, and the included angle between two adjacent straight line markers is 90°.

[0016] Optionally, the body is provided with a plurality of through holes extending along the axial direction of the body. The advantage is that the heating plate has ejector pins for lifting the wafer, and the through holes facilitate the ejector pins passing through and lifting the wafer on the body.

[0017] Optionally, the main body is provided with a groove for cooperating with a robotic arm when the main body is clamped. The advantage is that: installing the wafer auxiliary positioning device onto the heating plate under vacuum conditions requires a robotic arm; the groove facilitates clamping by the robotic arm, thus enabling automated installation and unloading of the wafer auxiliary positioning device.

[0018] Optionally, the straight line is marked as a scale line, and the scale line has a division value greater than or equal to 0.2 and less than or equal to 1 mm.

[0019] Optionally, the material of the body is aluminum oxide or ceramic. Its advantages include: reducing particle generation by the wafer auxiliary positioning device and improving process stability.

[0020] Optionally, the diameter of the body is greater than or equal to 200 and less than or equal to 400 mm. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the wafer auxiliary positioning device in the first embodiment of the present invention;

[0022] Figure 2 This is a schematic diagram of the wafer-assisted positioning device in the second embodiment of the present invention;

[0023] Figure 3 for Figure 2 The schematic diagram of the wafer-assisted positioning device shown is viewed from direction A in the figure.

[0024] Figure 4 for Figure 1 The diagram shows the structure of the first surface.

[0025] Figure 5 for Figure 1 The diagram shows the operation of the wafer auxiliary positioning device.

[0026] Figure label:

[0027] 1. Body; 101. First surface; 102. Second surface; 2. Marking part; 201. Circular mark; 202. Straight mark; 3. Positioning part; 4. Through hole; 5. Groove; 6. Wafer; 7. Heating plate. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, but does not exclude other elements or objects.

[0029] To address the problems existing in the prior art, embodiments of the present invention provide a wafer-assisted positioning device.

[0030] Figure 1 This is a schematic diagram of the wafer auxiliary positioning device in the first embodiment of the present invention; Figure 5 for Figure 1 The diagram shows the operation of the wafer auxiliary positioning device.

[0031] In some embodiments of the present invention, reference is made to Figure 1 and Figure 5The wafer auxiliary positioning device includes: a body 1, an identification part 2, and a positioning part 3; the body 1 includes a first surface 101 and a second surface (not shown in the figure), the first surface 101 and the second surface are opposite to each other; the identification part 2 is disposed on the first surface 101 and is used to identify the relative position of the wafer 6 and the body 1; the positioning part 3 is disposed on the second surface and is used to abut against the side of the heating plate 7, so that the body 1 is fixed on the heating plate 7.

[0032] In some embodiments of the present invention, reference is made to Figure 1 The main body 1 has a disc-shaped structure, and the two opposite circular surfaces on the main body 1 are the first surface 101 and the second surface (not shown in the figure).

[0033] In some embodiments of the present invention, the marking part 2 can be marked with a certain shape, such as a raised dot or a recess.

[0034] In other embodiments of the present invention, the marking part 2 can be marked with certain markers, such as color changes, characters or scale lines.

[0035] In some specific embodiments of the present invention, reference is made to Figure 1 The straight line 202 is a scale line, and the scale line has a division value greater than or equal to 0.2 and less than or equal to 1 mm.

[0036] Specifically, the graduation value can be 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9 or 1 mm.

[0037] In some embodiments of the present invention, reference is made to Figure 1 and Figure 5 The positioning part 3 includes a protrusion disposed on the edge of the body 1 and extending along the axial direction of the body 1, the protrusion abutting against the side of the heating plate 7.

[0038] Specifically, refer to Figure 5 The number of protrusions is at least three, so as to fix the body 1 in the radial direction of the heating plate 7.

[0039] Figure 2 This is a schematic diagram of the wafer-assisted positioning device in the second embodiment of the present invention; Figure 3 for Figure 2 The diagram shows the structure of the wafer-assisted positioning device as viewed from direction A.

[0040] In some specific embodiments of the present invention, reference is made to Figure 2 and Figure 3 The cross-sectional shape of the protrusion in a plane perpendicular to the axis of the body 1 is annular.

[0041] In some embodiments of the present invention, reference is made to Figure 4 and Figure 5 The marking part 2 includes a circular marking 201, which is used to identify the relative position of the wafer 6 and the body 1.

[0042] Specifically, refer to Figure 5 The diameter of the circular marker 201 used for positioning wafer 6 is larger than the diameter of wafer 6. The wafer 6 is placed inside the circular marker 201 to achieve the positioning of wafer 6.

[0043] Figure 4 for Figure 1 The diagram shows the structure of the first surface.

[0044] In some embodiments of the present invention, reference is made to Figure 4 The marking part 2 includes a plurality of circular markings 201 with different diameters, and the circular markings 201 are arranged concentrically.

[0045] Specifically, refer to Figure 4 There are four circular markers 201, which are concentrically arranged on the first surface 101. The circular marker 201 with the largest diameter coincides with the outline of the first surface 101, and the included angle between two adjacent straight markers 202 is 90°.

[0046] In some specific embodiments of the present invention, the diameters of the four circular markers 201 are respectively matched with the diameters of 8-inch, 10-inch, 12-inch and 14-inch wafers, for auxiliary positioning of wafers of different sizes.

[0047] For example, the diameter of the circular marker 201 can be 310 mm, slightly larger than the diameter of a 12-inch wafer. By comparing the circular marker 201 with the outline of the wafer, the 12-inch wafer can be positioned in an auxiliary manner.

[0048] In some embodiments of the present invention, reference is made to Figure 4 The body 1 is provided with a plurality of through holes 4 extending along the axial direction of the body 1. When the wafer needs to be lifted by the ejector pins on the heating plate 7, the ejector pins can pass through the through holes 4 to lift the wafer.

[0049] In some embodiments of the present invention, reference is made to Figure 2 The main body 1 has a groove 5 on its side, which is used to cooperate with the robot arm when the main body 1 is clamped.

[0050] In some embodiments of the present invention, reference is made to Figure 5During use, the wafer auxiliary positioning device is used by a robotic arm in the thin film deposition equipment to hold the groove (not shown in the figure) and install the wafer auxiliary positioning device onto the heating plate 7. Then, the wafer 6 transport device is used to transport the wafer 6 onto the first surface 101 of the wafer auxiliary positioning device. The position of the wafer 6 is adjusted by comparing the relative positional relationship between the wafer 6 and the marking part 2, so that the wafer 6 is placed in the expected position most suitable for processing. At this time, the wafer 6 transport device records the placement position of the wafer 6. This completes the teaching of the wafer 6 transport device, so that when other wafers 6 are transported in the future, they can be placed in the expected position.

[0051] In some specific embodiments of the present invention, reference is made to Figure 1 and Figure 5 The wafer auxiliary positioning device is installed on the heating plate 7 during use. When the wafer 6 is transferred to the first surface 101 by the robot arm, the position of the wafer 6 is adjusted according to the relative positional relationship between the edge of the wafer 6 and the straight line mark 202, so that the edge of the wafer 6 and the corresponding circular mark 201 are concentric and the radial distance is equal everywhere. At this time, the position of the wafer 6 is the expected position.

[0052] Specifically, refer to Figure 5 When the wafer 6 is in the expected position, the wafer 6 is concentric with the circular mark 201, and at this time the wafer 6 is also concentric with the heating plate 7.

[0053] In some embodiments of the present invention, the material of the body is aluminum oxide or ceramic.

[0054] In some embodiments of the present invention, the diameter of the body is greater than or equal to 200 mm and less than or equal to 400 mm to meet the positioning requirements of wafers of different sizes.

[0055] Specifically, the diameter of the body can be 200, 250, 300, 350 or 400 mm.

[0056] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the invention as set forth in the claims. Furthermore, the invention described herein may have other embodiments and can be implemented or carried out in various ways.

Claims

1. A wafer-assisted positioning device, characterized in that, include: The body includes a first surface and a second surface, which are opposite to each other. The first surface is used to support the wafer. A marking portion is disposed on the first surface to identify the relative position of the wafer and the body. The marking portion includes several circular markings of different diameters and at least three straight markings arranged radially along the body. The circular markings are concentrically arranged and all concentric with the body. The diameter of each circular marking matches the diameter of a wafer of a different size. The straight markings are scale lines used to identify the radial distance between the edge of the wafer and the corresponding circular marking. A positioning portion is disposed on the second surface and is used to abut against the side of a heating plate, thereby fixing the body radially to the heating plate.

2. The wafer auxiliary positioning device according to claim 1, characterized in that, The body has a disc-shaped structure, and the positioning part includes a protrusion disposed on the edge of the body and extending along the axial direction of the body.

3. The wafer auxiliary positioning device according to claim 2, characterized in that, The protrusion has a circular cross-sectional shape in a plane perpendicular to the axis of the body.

4. The wafer auxiliary positioning device according to claim 1, characterized in that, The four straight line markers are arranged radially along the body, and the included angle between two adjacent straight line markers is 90°.

5. The wafer auxiliary positioning device according to claim 1, characterized in that, The graduation value of the scale line is greater than or equal to 0.2 and less than or equal to 1 mm.

6. The wafer auxiliary positioning device according to claim 2, characterized in that, The body has several through holes that extend along its axial direction.

7. The wafer auxiliary positioning device according to claim 2, characterized in that, The main body is provided with a groove, which is used to cooperate with the robotic arm when the main body is clamped.

8. The wafer auxiliary positioning device according to claim 1, characterized in that, The material of the body is aluminum oxide or ceramic.

Images