Modified polyether resin with UV / moisture dual curing properties and preparation method thereof

Abstract

The present application discloses a modified polyether resin with UV / moisture dual curing properties, which contains the following structures: (A) structure: the main chain skeleton is a polyoxyalkylene polymer; (B) structure: the molecular end has a UV-curable double bond; and (C) structure: the molecular end has a moisture-curable silaneoxy group. The present application also discloses a preparation method of the modified polyether resin.

Description

Technical Field

[0001] The invention relates to a modified polyether resin with UV / moisture dual curing properties and a preparation method thereof. Background Art

[0002] Silane-modified polyether sealant (MS sealant) is a new generation of sealant developed after polysulfide sealants, silicone sealants, and polyurethane sealants. It combines the performance advantages of silicone and polyurethane sealants, offering excellent weather resistance, adhesion, paintability, and environmental friendliness. MS sealant cures by crosslinking through hydrolysis of terminal silane alkoxy groups. Its curing speed is slow, typically taking more than a day, and it is primarily used in the construction industry. However, some applications, such as electronics, place even higher demands on curing speed, requiring a fast-drying effect. This is achieved through the application of high-performance silane-modified polyether resins.

[0003] UV adhesives can cure quickly in seconds. Existing UV / moisture-curing dual-curing adhesives mostly use polyurethane-modified acrylate resins. The published patent CN 109776755 A uses a direct reaction of diisocyanate and hydroxyalkyl acrylate to prepare the adhesive, which is prone to side reactions. The reaction also requires the addition of solvents such as toluene, which must be removed by rotary evaporation after the reaction, making the preparation process complex. Furthermore, polyurethane-modified acrylate resins can achieve moisture-curing properties, but moisture-curing of NCO produces carbon dioxide gas, which can cause bubbles in the cured colloid.

[0004] By introducing UV-curable functional groups into the silane-modified polyether resin, the present invention significantly improves the resin's curing speed and bonding strength to the substrate. In practical applications, thicker resin sections or those in shadowed areas are difficult to UV-cure, significantly impacting bonding effectiveness. Moisture-curable siloxy groups can effectively address this issue. Summary of the Invention

[0005] The present invention aims to provide a modified polyether resin with UV / moisture dual-curing properties and a preparation method thereof. The resin molecules contain double bonds that can be UV-cured and siloxane groups that can be moisture-cured. At the same time, the structure can also contain highly polar urethane bonds and urea bonds. The main structure of the resin is a low-surface-energy polyether segment with good wetting ability, and can provide the resin with excellent toughness, tensile deformation resistance and other properties. The molecular structure contains a small amount of urethane bonds and urea bonds, which can enhance the adhesion with the adhesive material through hydrogen bonding. The resin is cured by UV, and the system can quickly dry on the surface. At the same time, moisture curing can completely cure the shadowed part, enhancing the bonding effect. The present invention introduces ultraviolet light curing groups and silane alkoxy groups, which can achieve dual curing in the presence of ultraviolet light and moisture (or water), thereby achieving the resin's rapid curing, strong adhesion, good coating properties, good toughness, and weather resistance.

[0006] Based on the above objectives, the present invention provides a modified polyether resin having UV / moisture dual curing properties, which comprises the following structure:

[0007] (A) Structure: The main chain skeleton is a polyoxyalkylene polymer;

[0008] (B) Structure: having a UV-curable double bond at the molecular end; and

[0009] (C) Structure: Moisture-curable siloxy groups are present at the molecular ends.

[0010] Another aspect of the present invention provides a method for preparing a modified polyether resin having UV / moisture dual curing properties, the method comprising the following steps:

[0011] (i) reacting an acrylate compound containing multiple double bond functional groups with an aminosilicone compound to obtain a product C1;

[0012] (ii) reacting a polyether polyol with an isocyanate compound to obtain a polyurethane prepolymer C2 having an isocyanate group as a terminal group;

[0013] (iii) The product C1 reacts with a polyurethane prepolymer C2 having an isocyanate group as a terminal group to obtain a modified polyether resin having UV / moisture dual curing properties. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 The structure of the modified polyether resin with UV / moisture dual curing properties prepared in Example 1 is shown. DETAILED DESCRIPTION

[0015] "Range" disclosed herein is in the form of a lower limit and an upper limit. It can be one or more lower limits, and one or more upper limits, respectively. A given range is defined by selecting a lower limit and an upper limit. The selected lower limit and upper limit define the boundaries of a particular range. All ranges that can be defined in this way are inclusive and combinable, i.e., any lower limit can be combined with any upper limit to form a range. For example, a range of 60-120 and 80-110 is listed for a particular parameter, and it is understood that a range of 60-110 and 80-120 is also expected. In addition, if the minimum range values ​​listed are 1 and 2, and if the maximum range values ​​listed are 3, 4, and 5, then the following ranges can all be expected: 1-3, 1-4, 1-5, 2-3, 2-4, and 2-5.

[0016] In this disclosure, unless otherwise specified, the numerical range "ab" is an abbreviation for any combination of real numbers between a and b, where a and b are real numbers. For example, the numerical range "0-5" indicates that all real numbers between "0-5" are listed herein, and "0-5" is merely an abbreviation for these numerical combinations.

[0017] Unless otherwise specified, the term "two" used in this specification means "at least two".

[0018] In the present invention, unless otherwise specified, all embodiments and preferred embodiments mentioned herein can be combined with each other to form a new technical solution.

[0019] In the present invention, unless otherwise specified, all technical features and preferred features mentioned herein can be combined with each other to form a new technical solution.

[0020] In one aspect, the present invention provides a modified polyether resin having UV / moisture dual curing properties, comprising the following structure:

[0021] (A) Structure: The main chain skeleton is a polyoxyalkylene polymer;

[0022] (B) Structure: having a UV-curable double bond at the molecular end; and

[0023] (C) Structure: Moisture-curable siloxy groups are present at the molecular ends.

[0024] In some embodiments of the present invention, the modified polyether resin having UV / moisture dual curing properties contains a highly polar urethane bond and a urea bond in its structure.

[0025] In some embodiments of the present invention, the modified polyether resin having UV / moisture dual curing properties is prepared by the following steps:

[0026] (i) reacting an acrylate compound containing multiple double bond functional groups with an aminosilicone compound to obtain a product C1;

[0027] (ii) reacting a polyether polyol with an isocyanate compound to obtain a polyurethane prepolymer C2 having an isocyanate group as a terminal group;

[0028] (iii) The product C1 reacts with a polyurethane prepolymer C2 having an isocyanate group as a terminal group to obtain a modified polyether resin having UV / moisture dual curing properties.

[0029] In some embodiments of the present invention, the acrylate compound refers to an acrylate compound containing two or more, preferably two or three, more preferably two double bond functional groups in the molecule, and examples thereof include 1,3-butanediol diacrylate, 1,4-butanediol dimethacrylate, dipropylene glycol diacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, dipropylene glycol dimethacrylate, tripropylene glycol dimethacrylate, 1,6-hexanediol dimethacrylate, and the like. Acrylates, tetraethylene glycol diacrylate, triethylene glycol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, ethoxylated bisphenol A (meth) acrylate, polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, neopentyl glycol diethoxy diacrylate, neopentyl glycol dipropoxy diacrylate, cyclohexanedimethanol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, tris(2-hydroxyethyl)isocyanate triacrylate, pentaerythritol tetraacrylate, etc.

[0030] In some embodiments of the present invention, the aminosiloxane compound refers to a compound having an amino structure at one end of the molecule and two or more alkoxysilane structures at the other end, and examples thereof include 3-aminopropyltrimethoxysilane, 3-aminopropylmethyldimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropylmethyldiethoxysilane, N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane, N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane, N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, γ-diethylenetriaminopropyltrimethoxysilane, and the like.

[0031] In some embodiments according to the present invention, the polyether polyol refers to a polyol having a polyoxyalkylene backbone, and examples thereof include polypropylene oxide diol and other polyether polyols. As polypropylene oxide diol, examples include BD2-8000A and BD2-12000A of Huai'an Bader Polyurethane Technology Co., Ltd., ZSN-280 and ZSN-2120 of Jiangsu Zhongshan Chemical Co., Ltd., and D280 and D2120 of Jiahua Chemical Co., Ltd. As other polyether polyols, examples include polypropylene oxide triol, examples include MN-3050D and MN-3050DF of Shandong Bluestar Dongda Co., Ltd., and G4030 and G5030 of Jiahua Chemical Co., Ltd. Polypropylene oxide diol is preferred.

[0032] The number average molecular weight of the polypropylene oxide diol is not particularly limited, but is preferably 1,000-50,000 g / mol, more preferably 3,000-30,000 g / mol, and further preferably 4,000-20,000 g / mol.

[0033] In some embodiments of the present invention, the isocyanate compound refers to an isocyanate compound having two or more isocyanate groups in the molecule, and examples thereof include diisocyanates and other isocyanate compounds. Examples of diisocyanate compounds include aromatic, aliphatic, and alicyclic diisocyanate compounds. Examples of other isocyanate compounds include triphenylmethane triisocyanate, 4,4',4"-triphenylmethane triisocyanate, and L-lysine triisocyanate. Diisocyanate compounds are preferred.

[0034] For example, the aromatic diisocyanate compound can be selected from 2,4- or 2,6-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, m- or p-phenylene diisocyanate, o- or m- or p-xylylene diisocyanate, m- or p-1,4-methylxylylene diisocyanate, 1,5-naphthalene diisocyanate, 2,4-ethylphenyl diisocyanate, 3,5'-dimethyl 4,4'-diphenyl diisocyanate, and the like.

[0035] For example, the aliphatic diisocyanate compound may be selected from tetramethylene diisocyanate, hexamethylene diisocyanate, 2,2,4-trimethylhexane diisocyanate, methyl formate pentamethylene diisocyanate, and the like.

[0036] For example, the alicyclic diisocyanate compound may be selected from isophorone diisocyanate, methylcyclohexylene diisocyanate, dicyclohexylmethylene diisocyanate, isopropylidenebis(cyclohexyl isocyanate), cyclohexyl-1,3-dimethylene diisocyanate, and the like.

[0037] Preferably, the diisocyanate compound is selected from one or more of 2,4- or 2,6-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, hexamethylene diisocyanate, and isophorone diisocyanate.

[0038] In some embodiments of the present invention, the molar ratio of the acrylate compound containing multiple double bond functional groups to the aminosilicone compound in step (i) is 1:1-1:1.2, preferably 1:1.03-1:1.17, and more preferably 1:1.05-1:1.15.

[0039] In some embodiments of the present invention, the molar ratio of the polyether polyol to the isocyanate compound in step (ii) is 1:2-1:2.2, preferably 1:2.03-1:2.17, and more preferably 1:2.05-1:2.15.

[0040] In some embodiments of the present invention, the molar ratio of product C2 to product C1 in step (iii) is 1:2-1:2.2, preferably 1:2.03-1:2.17, and more preferably 1:2.05-1:2.15.

[0041] In some embodiments of the present invention, the reaction in step (i) comprises mixing an acrylate compound containing multiple double bond functional groups with an aminosilicone compound, followed by reacting under certain conditions to obtain a product C1. The reaction can be carried out under a nitrogen atmosphere. The reaction can be carried out at a temperature of 10-100°C, preferably 20-80°C, and more preferably 35-65°C. The reaction can be carried out with stirring. The reaction duration can be 5-80 hours, preferably 10-50 hours, and more preferably 12-36 hours.

[0042] In some embodiments of the present invention, the reaction in step (ii) comprises mixing a polyether polyol with an isocyanate compound, followed by reacting under certain conditions to obtain a polyurethane prepolymer C2 having isocyanate groups as terminal groups. The reaction can be carried out under a nitrogen atmosphere. The reaction can be carried out at a temperature of 20-150°C, preferably 40-120°C, and more preferably 50-90°C. The reaction can be carried out with stirring. The reaction duration can be 1-10 hours, preferably 2-8 hours, and more preferably 3-6 hours.

[0043] In some embodiments of the present invention, the reaction in step (iii) comprises adding the obtained product C1 to an isocyanate-terminated polyurethane prepolymer C2, followed by reaction under certain conditions to obtain a modified polyether resin having UV / moisture dual-cure properties. The reaction can be carried out under a nitrogen atmosphere. The reaction can be carried out at a temperature of 20-150°C, preferably 40-120°C, and more preferably 50-90°C. The reaction can be carried out with stirring. The reaction duration can be 0.5-10 hours, preferably 1-8 hours, and more preferably 1-4 hours.

[0044] Another aspect of the present invention provides a method for preparing a modified polyether resin having UV / moisture dual curing properties, the method comprising the following steps:

[0045] (i) reacting an acrylate compound containing multiple double bond functional groups with an aminosilicone compound to obtain a product C1;

[0046] (ii) reacting a polyether polyol with an isocyanate compound to obtain a polyurethane prepolymer C2 having an isocyanate group as a terminal group;

[0047] (iii) The product C1 reacts with a polyurethane prepolymer C2 having an isocyanate group as a terminal group to obtain a modified polyether resin having UV / moisture dual curing properties.

[0048] The detailed description of each step in the above method can be found in the definition of the modified polyether resin with UV / moisture dual curing properties herein.

[0049] The modified polyether resin with UV / moisture dual curing properties prepared by the present invention can be used to prepare sealants, and the sealants are suitable for multiple fields such as construction and electronics.

[0050] Compared with the prior art, the advantages of the present invention are:

[0051] (i) There are carbon-carbon double bonds in the molecular chain, which can be UV-cured under the action of photoinitiators;

[0052] (ii) There are silane groups in the molecular chain, which can be cured by moisture;

[0053] (iii) The molecular chain contains highly polar urethane bonds and urea bonds, which have excellent adhesion.

[0054] Example

[0055] The present invention will be further described below in conjunction with the examples, but the present invention is not limited to these examples. The following examples are only used to illustrate the present invention and should not be regarded as limiting the scope of protection of the present invention. In addition, those who do not indicate specific technical operation steps or conditions in the specific examples are all carried out according to the general techniques or conditions described in the literature in this area. Those who do not indicate the manufacturer of the reagents or instruments used are all conventional products that can be obtained by purchase.

[0056] Example 1

[0057] A method for preparing a modified polyether resin with UV / moisture dual-curing properties, wherein the resin has a carbon-carbon double bond, a trimethoxysilyl group, a carbamate bond, and a urea bond in the molecule, specifically comprising the following steps:

[0058] (i) 198.2 g of 1,3-butanediol diacrylate and 179.3 g of 3-aminopropyltrimethoxysilane were added to a reaction vessel, and the mixture was stirred at 40° C. under a nitrogen atmosphere for 24 hours to obtain a product S-1;

[0059] (ii) In another reaction vessel, 400 g of polyether polyol (brand: BD2-8000A, Huaian Bader Polyurethane Technology Co., Ltd., number average molecular weight 8000 g / mol) and 22.2 g of isophorone diisocyanate were added, and the mixture was stirred and reacted at 90° C. under a nitrogen atmosphere for 8 hours to obtain a polyurethane prepolymer S-2 having isocyanate groups as terminal groups;

[0060] (iii) Then, 37.8 g of the product S-1 obtained above was added to the above S-2, and the mixture was stirred and reacted at 90° C. in a nitrogen atmosphere for 2 hours to obtain a silane-modified polyether resin R-1 having a urethane bond, a urea bond, and a siloxane-containing characteristic group in the molecule. The structure of the polyether resin R-1 is as follows: Figure 1 shown.

[0061] Example 2

[0062] A method for preparing a modified polyether resin with UV / moisture dual-curing properties, wherein the resin has a carbon-carbon double bond, a trimethoxysilyl group, a dimethoxysilyl group, a carbamate bond, and a urea bond in the molecule, specifically comprising the following steps:

[0063] (i) 198.2 g of 1,3-butanediol diacrylate, 89.7 g of 3-aminopropyltrimethoxysilane, and 81.7 g of 3-aminopropylmethyldimethoxysilane were added to a reaction vessel, and the mixture was stirred at 40° C. under a nitrogen atmosphere for 24 hours to obtain a product S-3;

[0064] (ii) In another reaction vessel, 400 g of polyether polyol (brand: BD2-8000A, Huaian Bader Polyurethane Technology Co., Ltd., number average molecular weight 8000 g / mol) and 22.2 g of isophorone diisocyanate were added, and the mixture was stirred and reacted at 90° C. under a nitrogen atmosphere for 8 hours to obtain a polyurethane prepolymer S-4 having isocyanate groups as terminal groups;

[0065] (iii) Then, 37.0 g of the product S-3 obtained above was added to the above S-4, and the mixture was stirred and reacted at 90° C. in a nitrogen atmosphere for 2 hours to obtain a silane-modified polyether resin R-2 having a carbamate bond, a urea bond and a siloxane-containing characteristic group in the molecule.

[0066] Example 3

[0067] A method for preparing a modified polyether resin with UV / moisture dual-curing properties, wherein the resin has a carbon-carbon double bond, a trimethoxysilyl group, a carbamate bond, and a urea bond in the molecule, specifically comprising the following steps:

[0068] (i) 198.2 g of 1,3-butanediol diacrylate and 179.3 g of 3-aminopropyltrimethoxysilane were added to a reaction vessel, and the mixture was stirred at 40° C. under a nitrogen atmosphere for 24 hours to obtain a product S-5;

[0069] (ii) In another reaction vessel, 600 g of polyether polyol (brand: BD2-12000A, Huaian Bader Polyurethane Technology Co., Ltd., number average molecular weight 12000 g / mol) and 22.2 g of isophorone diisocyanate were added, and the mixture was stirred at 90° C. under a nitrogen atmosphere for 8 hours to obtain a polyurethane prepolymer S-6 having isocyanate groups as terminal groups;

[0070] (iii) Then, 37.8 g of the product S-5 obtained above was added to the above S-6, and the mixture was stirred and reacted at 90°C in a nitrogen atmosphere for 2 hours to obtain a silane-modified polyether resin R-3 having a carbamate bond, a urea bond and a siloxane-containing characteristic group in the molecule.

[0071] Example 4

[0072] A method for preparing a modified polyether resin with UV / moisture dual-curing properties, wherein the resin has a carbon-carbon double bond, a triethoxysilyl group, a carbamate bond, and a urea bond in the molecule, specifically comprising the following steps:

[0073] (i) 198.2 g of 1,3-butanediol diacrylate and 221.4 g of 3-aminopropyltriethoxysilane were added to a reaction vessel, and the mixture was stirred at 40° C. under a nitrogen atmosphere for 24 hours to obtain a product S-7;

[0074] (ii) In another reaction vessel, 400 g of polyether polyol (brand: BD2-8000A, Huaian Bader Polyurethane Technology Co., Ltd., number average molecular weight 8000 g / mol) and 22.2 g of isophorone diisocyanate were added, and the mixture was stirred at 90° C. under a nitrogen atmosphere for 8 hours to obtain a polyurethane prepolymer S-8 having isocyanate groups as terminal groups;

[0075] (iii) Then, 42.0 g of the product S-7 obtained above was added to the above S-8, and the mixture was stirred and reacted at 90°C in a nitrogen atmosphere for 2 hours to obtain a silane-modified polyether resin R-4 having a carbamate bond, a urea bond and a siloxane-containing characteristic group in the molecule.

[0076] To compare the curing performance of the UV / moisture dual-cure resins R-1, R-2, R-3, and R-4 obtained in Examples 1-4, the resin, 1-hydroxy-cyclohexylbenzophenone, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, and dibutyltin dilaurate were rapidly mixed using a stirrer for 20 seconds according to the formulation ratio (by mass) shown in Table 1. The mixtures were then placed in a UV area and a shaded area, respectively. The surface of the mixture was touched until it was free of stains, and the surface-free time was recorded. The samples were first UV-cured in a mold for 10 hours and then moisture-cured for 5 days. The tensile strength and elongation at break were measured according to GB / T 528-2009.

[0077] Comparative Example 1-2

[0078] For Comparative Examples 1 and 2, pentaerythritol triacrylate (Resin A) and different photoinitiators (Comparative Example 1: 1-hydroxy-cyclohexyl benzophenone; Comparative Example 2: 1-hydroxy-cyclohexyl benzophenone and 2,4,6-trimethylbenzoyl-diphenylphosphine oxide) were rapidly mixed for 20 seconds according to the formulation ratios (by mass) shown in Table 1. The mixtures were then placed in a UV area and a shaded area, respectively. The surface of the mixture was touched until it was free of stains, and the surface-free time was recorded. The samples were then UV-cured in a mold for 10 hours and then moisture-cured for 5 days. Tensile strength and elongation at break were measured according to GB / T 528-2009.

[0079] The test results of Examples 1-4 and Comparative Examples 1-2 are shown in Table 1 below.

[0080] Table 1

[0081]

[0082] As can be seen from the results in Table 1, the modified polyether resin with UV / moisture dual curing properties prepared by the present invention has the advantages of good surface drying effect, good toughness, and can be cured by moisture in places where ultraviolet light is difficult to irradiate. In contrast, resin A, which contains double bonds and can only be cured by ultraviolet light, cannot be cured without ultraviolet light irradiation in the shaded area. By introducing a carbon-carbon double bond into the silane-modified polyether resin, it can participate in UV curing, greatly improving the curing speed of the resin. The other end is a silane alkoxy group, which does not participate in the reaction during the UV curing stage and can participate in moisture curing in the later stage, increasing the connection between molecules and further improving the bonding effect of the resin.

Claims

1. A modified polyether resin having UV / moisture dual curing properties, characterized in that: The modified polyether resin contains the following structure: (A) Structure: The main chain skeleton is a polyoxyalkylene polymer; (B) Structure: having a UV-curable double bond at the molecular end; and (C) Structure: Moisture-curable siloxy groups at the molecular ends, The modified polyether resin contains a highly polar urethane bond and a urea bond in its structure. Wherein, the modified polyether resin is prepared by the following steps: (i) reacting an acrylate compound containing multiple double bond functional groups with an aminosilicone compound to obtain a product C1; (ii) reacting a polyether polyol with an isocyanate compound to obtain a polyurethane prepolymer C2 having isocyanate groups as terminal groups, wherein the main chain skeleton of the polyether polyol comprises a polyoxyalkylene; (iii) The product C1 reacts with a polyurethane prepolymer C2 having an isocyanate group as a terminal group to obtain a modified polyether resin having UV / moisture dual curing properties.

2. The modified polyether resin having UV / moisture dual curing properties according to claim 1, wherein The acrylate compound contains two or three double bond functional groups in the molecule.

3. The modified polyether resin having UV / moisture dual curing properties according to claim 1, wherein The acrylate compound is selected from the group consisting of: 1,3-butanediol diacrylate, 1,4-butanediol dimethacrylate, dipropylene glycol diacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, dipropylene glycol dimethacrylate, tripropylene glycol dimethacrylate, 1,6-hexanediol dimethacrylate, tetraethylene glycol diacrylate, triethylene glycol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, ethoxylated bisphenol A (meth) acrylate, polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, neopentyl glycol diethoxy diacrylate, neopentyl glycol dipropoxy diacrylate, cyclohexanedimethanol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, tris(2-hydroxyethyl)isocyanate triacrylate, pentaerythritol tetraacrylate, or any combination thereof.

4. The modified polyether resin having UV / moisture dual curing properties according to claim 1, wherein The aminosilicone compound has an amino structure at one end and two or more alkoxysilane structures at the other end within the molecule.

5. The modified polyether resin having UV / moisture dual curing properties according to claim 1, wherein The aminosilicone compound is selected from: 3-aminopropyltrimethoxysilane, 3-aminopropylmethyldimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropylmethyldiethoxysilane, N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane, N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane, γ-diethylenetriaminopropyltrimethoxysilane or any combination thereof.

6. The modified polyether resin having UV / moisture dual curing properties according to claim 1, wherein The polyether polyol is polypropylene oxide diol.

7. The modified polyether resin having UV / moisture dual curing properties as claimed in claim 6, wherein The number average molecular weight of the polypropylene oxide diol is 1000-50000 g / mol.

8. The modified polyether resin having UV / moisture dual curing properties according to claim 1, wherein The isocyanate compound has two or more isocyanate groups in the molecule.

9. The modified polyether resin having UV / moisture dual curing properties according to claim 1, wherein The isocyanate compound is an aromatic, aliphatic or alicyclic diisocyanate compound.

10. The modified polyether resin having UV / moisture dual curing properties according to claim 9, wherein The diisocyanate compound is selected from: 2, 4 or 2, 6-toluene diisocyanate, 4, 4'-diphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate or any combination thereof.

11. The modified polyether resin having UV / moisture dual curing properties according to claim 1, wherein The molar ratio of the acrylate compound containing multiple double bond functional groups to the aminosilicone compound in step (i) is 1:1 to 1:1.2; and / or the molar ratio of the polyether polyol to the isocyanate compound in step (ii) is 1:2 to 1:2.2; and / or the molar ratio of the polyurethane prepolymer C2 with isocyanate groups as terminal groups to the product C1 in step (iii) is 1:2 to 1:2.

2.

12. The modified polyether resin having UV / moisture dual curing properties according to claim 1, wherein The reaction in step (i) is carried out at a temperature in the range of 10-100°C for 5-80 hours; and / or the reaction in step (ii) is carried out at a temperature in the range of 20-150°C for 1-10 hours; and / or the reaction in step (iii) is carried out at a temperature in the range of 20-150°C for 0.5-10 hours.

13. A method for preparing a modified polyether resin having UV / moisture dual curing properties according to any one of claims 1 to 12, characterized in that: The method comprises the following steps: (i) reacting an acrylate compound containing multiple double bond functional groups with an aminosilicone compound to obtain a product C1; (ii) reacting a polyether polyol with an isocyanate compound to obtain a polyurethane prepolymer C2 having isocyanate groups as terminal groups, wherein the main chain skeleton of the polyether polyol comprises a polyoxyalkylene; (iii) The product C1 reacts with a polyurethane prepolymer C2 having an isocyanate group as a terminal group to obtain a modified polyether resin having UV / moisture dual curing properties.

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