3D printing assisted multi-scale metal three-dimensional surface structure preparation method and product

Abstract

This invention relates to the field of micro / nano-structure-enhanced heat transfer surfaces, providing a 3D printing-assisted method and product for fabricating multi-scale three-dimensional metal surface structures. The method includes: fabricating a micron-level high-precision three-dimensional structure mask using 3D printing technology; the three-dimensional structure mask includes a cutout portion and a body portion; the cutout portion matches a three-dimensional structure model; performing material conversion on a metal substrate with the three-dimensional structure mask fixed thereon to obtain a target metal, wherein the metal substrate may be machined beforehand; the target metal surface has a three-dimensional structure matching the three-dimensional structure model. The 3D printing-assisted method for fabricating multi-scale three-dimensional metal surface structures provided by this invention improves the precision of the metal structure by increasing the precision of the template, fabricating multi-scale, multi-material heat transfer structures with micron-level precision and complex structures on the metal surface, thereby improving the metal phase change heat transfer efficiency.

Description

Technical Field

[0001] This invention relates to the field of micro / nano structure-enhanced heat transfer surfaces, specifically to a method and product for fabricating micron- and millimeter-scale multi-scale metal three-dimensional surface structures assisted by 3D printing. Background Technology

[0002] With the rapid development of integration and miniaturization of electronic components, many thermal systems with high heat flux density, such as advanced lasers, light-emitting diodes, radars, microprocessors, and motors, require the consumption of huge amounts of heat. The requirements for the heat dissipation system of these thermal systems with high heat flux density are becoming increasingly stringent. Among them, the surface of the heat exchange structure is an important factor that determines the performance of the heat dissipation system.

[0003] Currently, surface treatment methods for heat exchange structures mainly include changing surface roughness, adding surface coatings, and fabricating surface geometries. Among these, fabricating surface geometries has advantages over changing surface roughness and adding surface coatings in improving the heat dissipation efficiency of heat exchange structures.

[0004] However, traditional methods for fabricating geometric structures are limited by the precise control of structural scale and shape. For example, machining structures are typically fabricated at the millimeter level, and it is still impossible to fabricate multi-scale three-dimensional ordered structures with hollow, porous, and gradient features. Although metal 3D printing technology used in recent years can complete the fabrication of three-dimensional structures on metal surfaces at the millimeter or sub-millimeter scale, it still cannot meet the requirements at the micrometer level. Summary of the Invention

[0005] This invention provides a method and product for preparing micron- and millimeter-scale multi-scale metal three-dimensional surface structures assisted by 3D printing, which solves the technical problem of poor processing accuracy of three-dimensional metal surface structures. It can also combine machining methods with 3D printing-assisted multi-scale metal three-dimensional surface structure preparation methods to prepare metal surface three-dimensional structures with diverse materials and sizes.

[0006] In a first aspect, embodiments of the present invention provide a method for preparing multi-scale metal three-dimensional surface structures assisted by 3D printing, comprising:

[0007] The precision of metal structures is improved by using 3D printing technology to prepare micron-level high-precision three-dimensional structural masks. The three-dimensional structural mask includes a hollow part and a body part; the hollow part matches the three-dimensional structural model.

[0008] Material conversion is performed on a metal substrate with the three-dimensional structure mask fixed thereon to obtain a target metal; the surface of the target metal has a three-dimensional structure that matches the three-dimensional structure model.

[0009] In one embodiment, the 3D printing technology includes photopolymerization 3D printing technology and laser direct writing 3D printing technology.

[0010] The conversion method for material conversion of a metal substrate with the fixed three-dimensional structure mask includes electroplating, electroless plating, and chemical vapor deposition.

[0011] Before performing material conversion on the metal substrate with the three-dimensional structure mask fixed thereon, the process further includes:

[0012] The metal substrate is machined.

[0013] The process of performing material conversion on a metal substrate with the three-dimensional structure mask fixed thereon to obtain the target metal includes:

[0014] The three-dimensional structure mask is fixed on the surface of a metal substrate to form a template-substrate assembly; wherein the hollowed-out portion of the three-dimensional structure mask is directly connected to the metal substrate;

[0015] The template matrix assembly is subjected to material conversion to obtain a metallic body;

[0016] Remove the three-dimensional structure mask from the metal body to obtain the target metal.

[0017] Material conversion methods for a metal substrate with a fixed three-dimensional structure mask include electroplating, electroless plating, and chemical vapor deposition.

[0018] The template-substrate assembly is subjected to material conversion using an electroplating method to obtain a metallic body, comprising:

[0019] The template matrix assembly is immersed in a material conversion solution and connected to a working electrode;

[0020] The auxiliary electrode and the reference electrode are immersed in the material conversion solution;

[0021] After the electrochemical workstation is turned on for a preset time, the metal body is obtained;

[0022] A voltmeter is installed on the measurement circuit formed by the working electrode and the reference electrode; an ammeter is installed on the polarization circuit formed by the working electrode and the auxiliary electrode.

[0023] The process of removing the three-dimensional structure mask from the metal body to obtain the target metal includes:

[0024] The metal body is immersed in a resin removal solution to remove the three-dimensional structure mask, thereby obtaining the target metal. The resin removal solution can dissolve the photosensitive resin material corresponding to the three-dimensional structure mask without reacting with the metal material corresponding to the target metal.

[0025] Before performing material conversion on the metal substrate with the fixed three-dimensional structure mask to obtain the target metal, the process includes:

[0026] Polish the surface of the metal substrate;

[0027] Clean the surface of the polished metal substrate with a cleaning agent.

[0028] Secondly, embodiments of the present invention provide a component, the component being a metal component; the three-dimensional structure on the surface of the metal component is obtained by the 3D printing-assisted multi-scale metal three-dimensional surface structure preparation method described in the first aspect.

[0029] In one embodiment, the metal component is a heat-dissipating metal component.

[0030] The surface structure of the heat dissipation metal component is a hexagonal mesh porous structure, which consists of three layers of tightly spliced ​​hexagonal mesh structures. The length of the horizontal column of each hexagonal structure ranges from 50 to 500 μm, the diameter of the horizontal column ranges from 30 to 300 μm, and the diameter of the connecting column ranges from 30 to 300 μm. The layer spacing between two adjacent hexagonal mesh structures ranges from 50 to 400 μm.

[0031] The surface of the heat dissipation metal component has a gradient micropillar structure with a diameter ranging from 20 to 150 μm. The gradient micropillar structure is centrally symmetrical in the lateral direction, and the spacing gradient of the gradient micropillar structure increases sequentially.

[0032] The surface of the heat dissipation metal component has a trapezoidal dual-channel microchannel structure, which includes a main channel and a secondary channel. The main channel has a trapezoidal cross-section, with the upper base length ranging from 40 to 200 μm and the lower base length ranging from 60 to 300 μm. The secondary channel is a gap structure between the main channel and the secondary channel, which has an inverted trapezoidal cross-section. The secondary channel consists of side through holes and a top hole, with the side length of the top hole ranging from 20 to 100 μm and the depth of the top hole ranging from 20 to 100 μm.

[0033] The surface of the heat dissipation metal component has a structure combining straight fins and straight column holes. The width of the straight fins ranges from 0.5 to 2 mm, the spacing ranges from 0.5 to 2 mm, and the height ranges from 0.5 to 2 mm. The straight fins are provided with a porous structure. The thickness of the porous structure ranges from 0.1 to 0.5 mm, the pore diameter ranges from 10 to 100 μm, and the pore spacing ranges from 25 to 200 μm.

[0034] The surface of the heat dissipation metal component has a combined structure of circular fins and S-shaped curved pillars. The circular fins have a width ranging from 0.1 to 1 mm, a spacing between the fins ranging from 0.3 to 2 mm, and a height ranging from 0.3 to 2 mm. The S-shaped curved pillars are composed of multiple quarter-circular rings with a diameter ranging from 30 to 200 μm, a diameter ranging from 30 to 100 μm, and a spacing between the S-shaped curved pillars ranging from 100 to 300 μm.

[0035] The surface of the heat dissipation metal component has a structure combining a square trapezoidal platform and a porous cubic column array. The upper side of the square trapezoidal platform has a length ranging from 0.2 to 2 mm, the lower side has a length ranging from 0.5 to 4 mm, and the height ranges from 0.2 to 1 mm. The porous cubic column array is composed of multiple short straight columns with diameters ranging from 20 to 8 to 100 μm. The horizontal spacing between the straight columns ranges from 50 to 200 μm, and the vertical spacing between the straight columns ranges from 50 to 200 μm.

[0036] Thirdly, embodiments of the present invention provide a system, which is a heat exchange system, and the heat exchange system includes the metal components described in the second aspect.

[0037] The 3D printing-assisted multi-scale metal three-dimensional surface structure preparation method provided in this invention improves the accuracy of the metal structure by preparing a micron-level high-precision three-dimensional structure mask using 3D printing technology. The three-dimensional structure mask includes a hollow part and a body part; the hollow part matches the three-dimensional structure model; the metal substrate with the three-dimensional structure mask fixed is subjected to material conversion to obtain the target metal, wherein the metal substrate can be machined first; the surface of the target metal has a three-dimensional structure that matches the three-dimensional structure model.

[0038] The 3D printing-assisted multi-scale metal three-dimensional surface structure preparation method provided in this invention improves the precision of the metal structure by improving the precision of the template, and prepares a multi-scale, multi-material heat exchange structure with micron-level precision and complex structure on the metal surface, thereby improving the metal phase change heat transfer efficiency. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0040] Figure 1 This is a schematic flowchart of the 3D printing-assisted multi-scale metal three-dimensional surface structure preparation method provided in the embodiments of the present invention;

[0041] Figure 2 This is a top view of the hexagonal mesh porous structure provided in the embodiment of the present invention;

[0042] Figure 3 This is a schematic diagram of a hexagonal unit structure of the hexagonal mesh porous structure provided in an embodiment of the present invention;

[0043] Figure 4 This is one of the side sectional views of the hexagonal mesh porous structure provided in the embodiments of the present invention;

[0044] Figure 5 This is a second side sectional view of the hexagonal mesh porous structure provided in the embodiment of the present invention;

[0045] Figure 6 This is a top view of the unit structure of the three-dimensional structure mask corresponding to the hexagonal mesh porous structure provided in the embodiment of the present invention;

[0046] Figure 7 This is one of the side cross-sectional views of the three-dimensional structure mask corresponding to the hexagonal mesh porous structure provided in the embodiments of the present invention;

[0047] Figure 8 This is the second side cross-sectional view of the three-dimensional structure mask corresponding to the hexagonal mesh porous structure provided in the embodiment of the present invention;

[0048] Figure 9 This is a schematic diagram of the structure of the spray cooling device provided in an embodiment of the present invention;

[0049] Figure 10 This is a schematic diagram of the pyramid fin structure provided in an embodiment of the present invention;

[0050] Figure 11 This is a side view of the pyramid fin structure provided in an embodiment of the present invention;

[0051] Figure 12 This is a line graph of the heat flux density of spray cooling provided in an embodiment of the present invention;

[0052] Figure 13 This is a line graph of the spray cooling heat transfer coefficient provided in the embodiments of the present invention;

[0053] Figure 14 This is a side view of the gradient micropillar structure provided in an embodiment of the present invention;

[0054] Figure 15 This is a top view of the gradient micropillar structure provided in an embodiment of the present invention;

[0055] Figure 16 This is a top view of the trapezoidal dual-channel microchannel structure provided in an embodiment of the present invention;

[0056] Figure 17 This is a side sectional view of the trapezoidal dual-channel microchannel structure provided in an embodiment of the present invention;

[0057] Figure 18 This is a side view of the trapezoidal dual-channel microchannel structure provided in an embodiment of the present invention;

[0058] Figure 19 This is a schematic diagram of the combined structure of straight fins and straight column hole layers provided in an embodiment of the present invention;

[0059] Figure 20 This is a side view of the straight fin and straight column hole layer combined structure provided in the embodiment of the present invention;

[0060] Figure 21 This is a top view of the straight fin and straight column hole layer combined structure provided in the embodiment of the present invention;

[0061] Figure 22 This is a schematic diagram of the combined structure of annular fins and S-shaped curved column array provided in an embodiment of the present invention;

[0062] Figure 23 This is a side sectional view of the combined structure of annular fins and S-shaped curved column array provided in an embodiment of the present invention;

[0063] Figure 24 This is a top view of the combined structure of annular fins and S-shaped curved column array provided in an embodiment of the present invention;

[0064] Figure 25 This is a schematic diagram of the combined structure of a square trapezoidal platform and a porous cubic column array provided in an embodiment of the present invention;

[0065] Figure 26 This is a top view of the combined structure of a square trapezoidal platform and a porous cubic column array provided in an embodiment of the present invention;

[0066] Figure 27 This is a side view of the combined structure of a square trapezoidal platform and a porous cubic column array provided in an embodiment of the present invention. Detailed Implementation

[0067] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of this invention. Obviously, the described embodiments are only some embodiments of this invention, not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0068] Figure 1 This is a schematic flowchart illustrating a 3D printing-assisted method for preparing multi-scale metal three-dimensional surface structures, as provided in an embodiment of the present invention. (Refer to...) Figure 1 This invention provides a method for preparing multi-scale metal three-dimensional surface structures assisted by 3D printing, which may include:

[0069] S101. A high-precision, micro-scale three-dimensional structural mask is prepared using 3D printing technology to improve the accuracy of the metal structure. The three-dimensional structural mask includes a hollowed-out portion and a body portion; the hollowed-out portion matches the three-dimensional structural model.

[0070] S102, perform material conversion on the metal substrate on which the three-dimensional structure mask is fixed to obtain the target metal, wherein the metal substrate may be machined first; the surface of the target metal has a three-dimensional structure that matches the three-dimensional structure model.

[0071] In step S101, the required three-dimensional structure can be designed using 3D modeling software, and the corresponding model of the designed 3D structure can be imported into the software for analysis and processing. For example, a three-layer hexagonal porous structure model can be designed and drawn using the 3D drawing software SolidWorks, and then the drawn three-layer hexagonal porous structure model can be analyzed and processed using 3D slicing software.

[0072] In step S101, the 3D printing technologies that can be used include, but are not limited to, photopolymer 3D printing technology and laser direct-write 3D printing technology. This embodiment of the invention uses photopolymer 3D printing technology and laser direct-write 3D printing technology as examples for illustration.

[0073] Therefore, the specific steps for preparing micron-level high-precision three-dimensional structure masks using the laser direct-write 3D printing technology include:

[0074] The laser scanning sequence is obtained by analyzing and processing the three-dimensional structural model;

[0075] The laser direct-write 3D printing technology exposes a pre-processed three-dimensional structural pattern on the photoresist of the material to be prepared according to the laser scanning sequence, thereby obtaining the three-dimensional structural mask.

[0076] Specifically, the laser scanning sequence is obtained by analyzing and processing the three-dimensional structural model. Further, photoresist is spin-coated onto the surface of the material to be prepared. Then, laser direct-write 3D printing technology is used to expose the pre-processed three-dimensional structural pattern onto the photoresist of the material to be prepared, according to the laser scanning sequence, to obtain a three-dimensional structural mask.

[0077] This invention improves the precision of metal structures by using laser direct writing 3D printing technology to prepare high-precision three-dimensional structural masks. It also prepares multi-scale, multi-material heat exchange structures with micron-level precision and complex structures on the metal surface, thereby improving the heat transfer efficiency of metal phase transformation.

[0078] Furthermore, the specific steps for fabricating micron-level high-precision three-dimensional structural masks using photopolymerization 3D printing technology include:

[0079] The three-dimensional structural model is sliced ​​into layers to obtain a set of two-dimensional structural images; the set of two-dimensional structural images includes multiple two-dimensional structural images arranged in a layered order.

[0080] Based on the set of two-dimensional structure images, the liquid photosensitive material in the corresponding area is controlled to solidify under light induction to obtain the three-dimensional structure mask.

[0081] The three-dimensional structure mask is formed by stacking multiple cured layers in a layered order; wherein each cured layer is obtained by controlling the liquid photosensitive material in the corresponding area to be cured under light induction according to the corresponding two-dimensional structure image.

[0082] The set of two-dimensional structure images includes multiple two-dimensional structure images arranged in a layered order. Since the cured layers need to be re-stacked according to the three-dimensional structure after printing them from the two-dimensional structure images, the two-dimensional structure images can be sorted by storing them sequentially in different storage units according to their layered order; or the two-dimensional structure images can be numbered according to their layered order, with the number serving as the sorting sequence. The three-dimensional structure mask is formed by stacking multiple cured layers in a layered order; each cured layer is obtained by controlling the curing of liquid photosensitive material in the corresponding area under photo-induced curing based on the corresponding two-dimensional structure image.

[0083] The three-dimensional structure mask includes a cutout portion and a body portion. The cutout portion matches the three-dimensional structure, so that when the three-dimensional structure mask is fixed on the metal surface, the area where the three-dimensional structure needs to be formed will not be blocked by the body portion of the three-dimensional structure mask. That is, the area where the three-dimensional structure needs to be formed is a non-insulating area, which can then undergo a chemical reaction during material conversion to form a three-dimensional structure on the metal surface.

[0084] Photopolymerization 3D printing technology can utilize various liquid photosensitive materials, such as polyurethane acrylate resin, epoxy acrylate resin, polyacrylic resin, and polyether acrylate resin. Since the three-dimensional structure mask in this embodiment is used as a mask during the metal material conversion process, a high-temperature resistant and / or high-hardness photosensitive resin can be selected. The photoresist used in laser direct writing technology is selected based on the specific circumstances.

[0085] Correspondingly, the photosensitive resin and photoresist can be removed subsequently using chemical solvents that do not react with the metal material corresponding to the target metal. Alternatively, methods such as high-temperature melting or gas reaction can be used for removal.

[0086] Furthermore, in step S102, the conversion method for material conversion of the metal substrate with the fixed three-dimensional structure mask can include, but is not limited to, electroplating, electroless plating, chemical vapor deposition and chemical reduction, so that the target metal surface has a three-dimensional structure, wherein the material of the target metal may be different from the substrate material.

[0087] Material conversion is performed on a metal substrate with a fixed three-dimensional structure mask (which can be machined to prepare millimeter-scale structures and can be of a different type than the target metal) to obtain the target metal; the surface of the target metal has a multi-scale three-dimensional structure at the micrometer and millimeter levels.

[0088] Furthermore, for ease of understanding and explanation, the electroplating methods in the embodiments of the present invention include, but are not limited to, two-electrode electroplating methods and three-electrode electroplating methods.

[0089] In one embodiment, step S102 is as follows: the two-dimensional structure images are called sequentially according to their arrangement order, and the three-dimensional structure mask is formed by surface projection micro-stereoscopic curing technology based on each called two-dimensional structure image.

[0090] The surface projection micro-stereolithography technology uses an ultraviolet lithography projection system to project the pattern to be printed onto the surface of liquid photosensitive resin. Since the photosensitive resin undergoes a polymerization reaction under ultraviolet light irradiation and completes the solidification transformation, the part of the liquid photosensitive resin projected by ultraviolet light on the liquid surface is solidified and rapidly micro-stereoformed. Then, the complex three-dimensional model is directly processed from the digital model to complete the production of the target three-dimensional structure.

[0091] In the above process, each time a two-dimensional structure image is called, the corresponding pattern of the called two-dimensional structure image is projected onto the liquid surface of the liquid photosensitive resin using the ultraviolet lithography projection system to obtain a cured layer. Then, the next two-dimensional structure image is called, and the corresponding pattern of the currently called two-dimensional structure image is projected again on the basis of the previously obtained cured layer to obtain another cured layer. This process continues, and each cured layer being printed is printed on the basis of the previously obtained cured layer.

[0092] In this embodiment of the invention, the working parameters of the 3D printing system corresponding to the surface projection micro-stereoscopic curing technology can be set as follows: the minimum line width of the plane is set to 2μm; the minimum line width of the three-dimensional structure is set to 10μm; the printing layer thickness is set to 5μm~20μm; the maximum printing height is set to 10mm; the single-format size in the printing area is set to 3.84mm×2.16mm, and the splicing format size is set to 38.4mm×21.6mm; wherein, when the curing layer size to be produced is larger than the single-format size, the 3D printing system will divide it into regions, and the ultraviolet light will scan and project one region at a time. When all regions are scanned, one curing layer is printed. The splicing error in this process is less than 10μm.

[0093] In one embodiment, the specific process of sequentially calling the multiple two-dimensional structure images according to their arrangement order, and forming a three-dimensional structure mask using surface projection micro-stereolithography technology based on each called two-dimensional structure image is as follows:

[0094] S1. Call the first two-dimensional structure image in the set of two-dimensional structure images as the current two-dimensional structure image, and project the pattern corresponding to the current two-dimensional structure image onto the surface of the liquid photosensitive material through ultraviolet light, and solidify it to obtain the initial mask.

[0095] S2. Move the initial mask down so that there is a liquid photosensitive material of a preset thickness above the initial mask;

[0096] S3. Replace the current two-dimensional structure image with the next two-dimensional structure image from the set of two-dimensional structure images;

[0097] S4. Project the pattern corresponding to the current two-dimensional structure image onto the surface of the liquid photosensitive material above the initial mask using ultraviolet light to update the initial mask. Then return to step S2 until the current two-dimensional structure image is the last sorted two-dimensional structure image in the set of two-dimensional structure images, and then execute step S5.

[0098] S5. Use the current initial mask as the 3D structure mask.

[0099] In step S1, if the two-dimensional structure images are stored sequentially in different units of the same storage block, the two-dimensional structure images are accessed and called starting from the first unit in the storage block; if the two-dimensional structure images are associated with numbers set according to the hierarchical order, the two-dimensional structure images are called starting from the smallest to the largest number.

[0100] In step S1, the pattern corresponding to the current two-dimensional structure image is projected onto the surface of the liquid photosensitive material using ultraviolet light, and the resulting initial mask is a layer of the three-dimensional structure mask. In terms of shape, the pattern corresponding to the current two-dimensional structure image is essentially in a mutually interlocking relationship with the current two-dimensional structure.

[0101] In step S2, the preset layer thickness is the layer thickness of the three-dimensional structural model. In this step, the initial mask is moved down so that uncured liquid photosensitive material is laid on top of the already cured initial mask for the preparation of another cured layer.

[0102] In step S3, the two-dimensional structure image of the next unit or the two-dimensional structure image of the next number can be used to prepare the next curing layer.

[0103] In step S4, the pattern corresponding to the current two-dimensional structure image needs to be projected onto the surface of the liquid photosensitive material above the initial mask using ultraviolet light, so that the solidified layer formed in step S4 is stacked on the original initial mask. The initial mask with a new solidified layer is then used as the updated initial mask, and the action of moving the initial mask down by a preset layer thickness in step S2 is performed.

[0104] In step S5, when the current two-dimensional structure image is the last two-dimensional structure image in the set of two-dimensional structure images, it means that the current preparation is the last layer in the three-dimensional structure mask. After the last layer is cured, the three-dimensional structure mask can be obtained without moving the three-dimensional structure mask down.

[0105] In one embodiment, in step S2 above, the initial mask can be directly moved down a predetermined layer thickness in a container filled with liquid photosensitive material;

[0106] Alternatively, the initial mask can be moved down by a first preset distance and then up by a second preset distance, wherein the difference between the first preset distance and the second preset distance is the preset layer thickness; the preset layer thickness is greater than zero.

[0107] Compared to directly lowering the initial mask by a predetermined layer thickness in a container filled with liquid photosensitive material, this method involves lowering the initial mask by a first predetermined distance and then raising it by a second predetermined distance. This allows the initial mask to first descend a larger distance, ensuring it is completely immersed in the liquid photosensitive material and that the liquid photosensitive material covers the entire surface of the initial mask. Then, it is raised a smaller distance to adjust the distance between the initial mask and the surface of the liquid photosensitive material, allowing the next curing layer to cure on top of the initial mask. This ensures the integrity of each cured layer and the tightness of the adhesion between cured layers.

[0108] This invention employs photopolymerization 3D printing technology to prepare high-precision three-dimensional structural masks. By slicing the three-dimensional structural model into layers, the three-dimensional structure is broken down into two-dimensional structures for processing. Improving the processing precision of each two-dimensional layer enhances the precision of the three-dimensional structure. Furthermore, this invention utilizes the characteristic of liquid photosensitive materials solidifying under light induction to prepare a solidified layer corresponding to each two-dimensional structure. Specifically, by controlling the modulation of light to irradiate the surface of the liquid photosensitive material, specific areas are selectively exposed to generate specific structures. This method can utilize an optical system with a maximum optical resolution of 2μm to form three-dimensional structural masks with micron-level precision. The three-dimensional structural mask is fixed to the surface of a metal substrate for material conversion. The body of the three-dimensional structural mask insulates the surface of the metal substrate, while the cutouts in the three-dimensional structural mask facilitate material conversion to form the desired three-dimensional structure. This 3D printing-assisted multi-scale metal three-dimensional surface structure preparation method enables the fabrication of complex heat exchange structures with micron-level precision on metal surfaces, thereby improving the efficiency of metal phase change heat transfer.

[0109] The material conversion process in the 3D printing-assisted multi-scale metal three-dimensional surface structure preparation method is described below: In one embodiment, step S102 includes:

[0110] The three-dimensional structure mask is fixed on the surface of a metal substrate to form a template-substrate assembly; wherein the hollowed-out portion of the three-dimensional structure mask is directly connected to the metal substrate;

[0111] The template matrix assembly is subjected to material conversion to obtain a metallic body;

[0112] Remove the three-dimensional structure mask from the metal body to obtain the target metal.

[0113] It should be noted that before performing material conversion on the metal substrate with the fixed three-dimensional structure mask, the metal substrate must first be machined.

[0114] Furthermore, the three-dimensional structure mask is clamped and fixed to the metal substrate using a fixture, or the three-dimensional structure mask and the metal substrate are bonded together using a liquid photosensitive material. During this process, the cutout portions of the three-dimensional structure mask need to be directly connected to the metal substrate.

[0115] In one embodiment, a metal substrate with a fixed three-dimensional structure mask is subjected to a material conversion method or other methods to obtain a target metal (e.g., copper, nickel, chromium, gold, zinc, silver, and their alloys). The material conversion method includes, but is not limited to, electroplating, electroless plating, chemical vapor deposition, and chemical reduction. The process involves: first, machining the metal substrate (which may differ from the target metal to satisfy material diversity) to prepare a millimeter-scale structure according to requirements; then, fixing the three-dimensional structure mask onto the surface of the metal substrate to form a template-substrate assembly, achieving size diversity; wherein, the hollowed-out portions in the three-dimensional structure mask are directly connected to the metal substrate; and filling and solidifying any pores that are desired to be retained during machining with a liquid organic material, which is then removed after the metal substrate multi-scale three-dimensional structure is completed.

[0116] Furthermore, the metal body can be immersed in a removal resin solution, and the removal resin solution can also be heated to remove the three-dimensional structure mask and obtain the target metal.

[0117] In one embodiment, the resin removal solution may be an alkaline solution, such as a sodium hydroxide solution; wherein the resin removal solution is capable of dissolving the photosensitive resin material corresponding to the three-dimensional structure mask and does not react with the metal material corresponding to the target metal.

[0118] Furthermore, a two-electrode electroplating method or a three-electrode electroplating method is used for material conversion. It should also be noted that electroplating is only one method among many in this invention; chemical plating and chemical reduction methods can also be used to replace electroplating.

[0119] The material conversion process of the dual-electrode electroplating method is as follows: the template substrate assembly is immersed in the electroplating solution and connected to the working electrode, the auxiliary electrode is immersed in the material conversion solution, the working electrode is connected to the negative terminal of the power supply, the auxiliary electrode is connected to the positive terminal of the power supply, and the power supply is turned on to cause a reduction reaction to occur near the working electrode to complete the electroplating of the template substrate assembly.

[0120] The material conversion process for electroless plating is as follows: The template-substrate assembly is sequentially immersed in an electroless plating pretreatment solution, which may include one or more of the following: chemical degreasing solution, chemical roughening solution, chemical sensitizing solution, chemical activation solution, and chemical descaling solution. Before immersion in the next electroless plating pretreatment solution, the template-substrate assembly needs to be washed with water to remove any residual electroless plating pretreatment solution from the previous step. Subsequently, the template-substrate assembly is immersed in the electroless plating solution and appropriately heated or stirred to complete the electroless plating of the template-substrate assembly.

[0121] The material conversion process of the chemical reduction method is as follows: a polymer containing polar groups and a target metal salt that can form a complex with it are dissolved together in a solvent to prepare a homogeneous pretreatment solution. The template matrix assembly is immersed in the pretreatment solution. After the pretreatment solution is evaporated to dryness, it is placed in a reduction solution to complete the material conversion of the chemical reduction method.

[0122] In one embodiment, a three-electrode electroplating method is used for material conversion, and the process is as follows: the template matrix assembly is immersed in the material conversion solution and connected to the working electrode; the auxiliary electrode and the reference electrode are immersed in the material conversion solution; after the electrochemical workstation is turned on for a preset time, the metal body is obtained.

[0123] The measurement circuit consisting of the working electrode and the reference electrode is equipped with a voltmeter. The reference electrode in the measurement circuit measures or applies a reference to the working electrode potential to test the electrochemical reaction process of the electrode, thereby controlling the electrochemical reaction process. The polarization circuit consisting of the working electrode and the auxiliary electrode is equipped with an ammeter, and the polarization circuit plays the role of conducting current.

[0124] In this embodiment of the invention, the material conversion solution can be a copper pyrophosphate solution, which is obtained by mixing copper pyrophosphate, potassium pyrophosphate, ammonium citrate and deionized water and then mechanically stirring until homogeneous.

[0125] In actual material conversion processes, if the 3D structure mask and the metal substrate are clamped and fixed by a fixture, after a certain period of material conversion, some of the cutouts in the 3D structure mask will be filled with metal. At this point, the 3D structure mask and the surface of the metal substrate can maintain a tight fit without the fixture, and the fixture can be removed to complete the remaining material conversion, thereby reducing the impact of the fixture on the material conversion.

[0126] Taking the three-electrode electroplating method as an example, this embodiment of the invention uses an electrochemical workstation to set reasonable electrochemical parameters for material conversion. The electrochemical workstation parameters can be set as follows:

[0127] The potential range is ±10V; the current range is ±250mA; the lower limit of current measurement is 10pA; the electrochemical workstation supports electrochemical testing techniques including but not limited to: Multi-Current Steps (ISTEP) and Bulk Electrolysis with Coulometry (BE).

[0128] Compared to the two-electrode electroplating method, the three-electrode electroplating method used in this embodiment of the invention avoids the following problems associated with the two-electrode system: once current flows through the two-electrode system, the auxiliary electrode will become polarized, leading to a change in potential and inaccurate potential measured by the working electrode. Additionally, there is a voltage drop in the solution when current flows, resulting in unstable electrochemical reactions and affecting the electroplating effect. The three-electrode electroplating method introduces a reference electrode, which forms a measurement circuit with the working electrode. This allows for the measurement and control of the working electrode's potential. Since no polarization current flows through the measurement circuit, only a very small measurement current, it does not interfere with the polarization state of the working electrode or the stability of the reference electrode. Therefore, it can simultaneously control the potential and current during the electrochemical reaction process, ensuring the stability of the electrochemical reaction and achieving better electroplating results.

[0129] In one embodiment, before fixing the three-dimensional structure mask onto the surface of the metal substrate to form the template-substrate assembly, the metal substrate needs to be pretreated to remove burrs, oil, and oxides from its surface. This pretreatment includes the following steps:

[0130] Polish the surface of the metal substrate;

[0131] Clean the surface of the polished metal substrate with a cleaning agent.

[0132] The polished metal substrate surface can be cleaned sequentially with the following reagents: acetone, anhydrous ethanol, dilute sulfuric acid, and deionized water.

[0133] Acetone is used to clean oil stains on the surface of the metal substrate, anhydrous ethanol is used to clean acetone residue on the surface of the metal substrate, dilute sulfuric acid is used to remove oxides such as copper oxide from the surface of the metal substrate, and deionized water is used to clean residual dilute sulfuric acid. During the above cleaning process, the polished metal substrate can be immersed in the cleaning reagent for 3 to 10 minutes.

[0134] It should be noted that the above description of the mass percentage of dilute sulfuric acid and the soaking time during the cleaning process are only examples in the embodiments of the present invention and are not intended to be the only limitation on the embodiments of the present invention.

[0135] In this embodiment of the invention, the surface of the metal substrate is pre-polished and cleaned to remove burrs, oil stains and oxides, so that the three-dimensional structure formed by the material conversion can adhere more tightly to the surface of the metal substrate.

[0136] In one embodiment, before removing the three-dimensional structure mask on the metal body, the portion undergoing material transition can be smoothed by grinding. Then, the target metal is obtained by removing the three-dimensional structure mask on the metal body.

[0137] On the other hand, the present invention also provides a component, which is a metal component, the surface of which has a three-dimensional structure. The three-dimensional structure of the surface of the metal component is obtained by a 3D printing-assisted multi-scale metal three-dimensional surface structure preparation method as described in any of the above embodiments, for example including: a metal component with a hexagonal mesh porous structure on the surface.

[0138] The 3D printing-assisted multi-scale metal three-dimensional surface structure preparation method described in any of the above embodiments can be used to prepare structures such as... Figure 2 The hexagonal mesh porous structure shown is Figure 2 This is a top view of the hexagonal mesh porous structure provided in an embodiment of the present invention. Figures 3 to 5 As shown, Figure 3 This is a schematic diagram of a hexagonal unit structure of the hexagonal mesh porous structure provided in an embodiment of the present invention; Figure 4 This is one of the side sectional views of the hexagonal mesh porous structure provided in the embodiments of the present invention; Figure 5 This is a second side sectional view of the hexagonal mesh porous structure provided in an embodiment of the present invention. The hexagonal mesh porous structure consists of three tightly joined hexagonal mesh structures. Each hexagon 501 is formed by connecting six horizontal pillars of equal length. Adjacent mesh structures are connected by connecting pillars 502 at the endpoints of the hexagons in the upper and lower layers. To ensure the tightness of the connection between the hexagonal mesh porous structure and the metal substrate surface, see [reference needed]. Figure 4 The third layer of the porous mesh structure 601, which is connected to the surface of the metal substrate, retains only 1 / 2 of the layer.

[0139] Corresponding to the aforementioned hexagonal mesh porous structure, its three-dimensional structure mask constitutes the inverse structure of the aforementioned hexagonal mesh porous structure, such as... Figures 6 to 8 As shown, Figure 6 This is a top view of the unit structure of the three-dimensional structure mask corresponding to the hexagonal mesh porous structure provided in the embodiment of the present invention; Figure 7 This is one of the side cross-sectional views of the three-dimensional structure mask corresponding to the hexagonal mesh porous structure provided in the embodiments of the present invention; Figure 8This is the second side sectional view of the three-dimensional structure mask corresponding to the hexagonal mesh porous structure provided in this embodiment of the invention. That is, the hollowed-out portion of the three-dimensional structure mask matches the hexagonal mesh porous structure. For example... Figure 6 As shown, to facilitate observation of the material conversion process and prevent excessive copper metal deposition due to over-conversion, only through holes 801 with the same diameter as the connecting pillar 601 were left on the two-dimensional structure corresponding to the first layer of porous mesh structure. Figure 7 As shown, in order to prevent excessive deposition of metal around the desired hexagonal mesh porous structure during the material conversion process, a thin layer 901 is designed around its inverse structure to limit the range of metal deposition.

[0140] In this embodiment, a hexagonal mesh porous structure with the following structural parameters was prepared during the experimental stage for heat transfer applications such as spray cooling and pool boiling. The following section uses spray cooling as an example to test the heat transfer performance of the hexagonal mesh porous structure as the experimental object:

[0141] The length of each hexagonal horizontal column ranges from 50 to 500 micrometers (μm), the diameter of the horizontal column ranges from 30 to 300 μm, and the diameter of the connecting support column ranges from 30 to 300 μm; the layer spacing between two adjacent hexagonal mesh structures ranges from 50 to 400 μm. In one embodiment, the horizontal column length L = 300 μm; the horizontal column diameter d = 170 μm; the connecting support column diameter D = 170 μm; and the layer spacing between two adjacent hexagonal mesh structures H = 200 μm.

[0142] like Figure 9 As shown, Figure 9 This is a schematic diagram of the spray cooling device provided in an embodiment of the present invention. The spray cooling device used in this experimental stage includes the following:

[0143] The system comprises a working fluid circulation loop, a cooling oil circulation loop, a heating platform, a heating module, and a data measurement module. The working fluid circulation loop includes a heater, a storage tank, a magnetic gear pump, a flow regulating valve, a spiral heat exchanger, a flow meter, a filter, and nozzles. This ensures the working fluid is transported to the nozzles at a set temperature, pressure, and flow rate and sprayed onto the metal surface on the heating platform. The cooling circulation loop uses refrigerant heat transfer oil as the working fluid and includes a vacuum pump, a condenser, a refrigeration and heating cycle machine, and a spiral heat exchanger. This provides a cold source for the spray cooling device and regulates the working fluid temperature. The data measurement module includes thermocouples, a gear flow meter, a pressure transmitter, and a data acquisition unit for recording experimental data. The heating module includes a DC power supply, a cylindrical heater, and insulation material. The DC power supply powers the cylindrical heater on the heating platform, and the insulation material provides additional heat to ensure sufficient heat is absorbed by the metal surface during the experiment.

[0144] Using the pyramidal fin structure as the first reference object and the polished planar structure as the second reference object, the pyramidal fin structure is as follows: Figure 10 and Figure 11 As shown, Figure 10 This is a schematic diagram of the pyramid fin structure provided in an embodiment of the present invention; Figure 11 This is a side view of the pyramid fin structure provided in an embodiment of the present invention. The side length of the base of the pyramid structure is L1 = 1 mm, and the height of the pyramid is H1 = 1 mm; the pyramid fin structure is manufactured by machining.

[0145] The surface size of both the experimental subject and the reference object was taken as 1×1cm. 2 The experiment was conducted under atmospheric pressure, using deionized water as the working fluid, and the spray flow rate was 2.3 cm³ / s. 3 / s, the nozzle distance from the metal surface was 2.1cm. Both the experimental and reference objects were sequentially subjected to ultrasonic water bath cleaning with acetone, anhydrous ethanol, dilute sulfuric acid, and deionized water to remove surface organic matter. Then, spray cooling experiments were conducted to obtain the results as follows: Figures 12 to 13 The experimental results are shown.

[0146] according to Figure 12 and Figure 13 It can be seen that, Figure 12 This is a line graph of the heat flux density of spray cooling provided in an embodiment of the present invention; Figure 13 This is a line graph showing the heat transfer coefficient of the spray cooling system provided in this embodiment of the invention. The heat flux density of the hexagonal mesh porous structure can reach 470.3 W / cm². 2 The heat transfer coefficient can reach 5.041×10⁻⁶. 4 W / m 2 The heat flux density is increased by 13.4% and 23.2% compared to the pyramid fin structure and the planar structure, respectively, and the heat transfer coefficient is increased by 24.2% and 44.6% compared to the pyramid fin structure and the planar structure, respectively.

[0147] Compared with the pyramid fin structure and planar structure with millimeter-level precision, the heat flux density and heat transfer coefficient in heat transfer performance are improved. The hexagonal mesh porous structure prepared by the 3D printing-assisted multi-scale metal three-dimensional surface structure preparation method provided in the above embodiment has a structural precision of micrometer level, and the complex and fine porous structure is conducive to improving the efficiency of metal phase change heat transfer.

[0148] In addition to the hexagonal mesh porous structure described above, the 3D printing-assisted multi-scale metal three-dimensional surface structure preparation method described in any of the above embodiments can also prepare the following three-dimensional structures, including but not limited to: gradient micropillar structures and trapezoidal dual-channel microchannel structures.

[0149] like Figures 14 to 15 As shown, Figure 14 This is a side view of the gradient micropillar structure provided in an embodiment of the present invention; Figure 15 This is a top view of the gradient micropillar structure provided in an embodiment of the present invention. The diameter of the gradient micropillar structure ranges from 20 to 150 μm. The gradient micropillar structure is centrally symmetrical in the transverse direction, and the spacing gradient of the gradient micropillar structure increases sequentially. In one embodiment, the diameter D of the gradient micropillar structure is 20 μm. The gradient micropillar structure is centrally symmetrical in the transverse direction, and the spacing gradient of the gradient micropillar structure increases sequentially by 0.01 mm: G1 = 0.1 mm, G2 = 0.11 mm, G3 = 0.12 mm, G4 = 0.13 mm, G5 = 0.14 mm, G6 = 0.15 mm, G7 = 0.16 mm; the spacing remains consistent in the longitudinal direction, S = 0.1 mm. The above gradient micropillar structure can be used for boiling experiment research.

[0150] like Figures 16 to 18 As shown, Figure 16 This is a top view of the trapezoidal dual-channel microchannel structure provided in an embodiment of the present invention; Figure 17 This is a side sectional view of the trapezoidal dual-channel microchannel structure provided in an embodiment of the present invention; Figure 18 This is a side view of the trapezoidal dual-channel microchannel structure provided in an embodiment of the present invention. The trapezoidal dual-channel microchannel structure includes a main channel and a secondary channel. The main channel has a trapezoidal cross-section, with the upper base length ranging from 40-200 μm and the lower base length ranging from 60-300 μm. In one embodiment, the upper base length L of the trapezoid is... 41 =40μm, the length of the lower base L of the trapezoid 42 =60μm, trapezoidal height H4 = 50μm, main channel total length is 2mm, main channel spacing G4 = 0.1mm. The secondary channel is a main channel gap structure with an inverted trapezoidal cross-section, such as... Figure 17 As shown, the secondary flow channel consists of side through-holes and a top hole. The side length and depth of the top hole range from 20 to 100 μm. In one embodiment, the side length S1 of the top hole is 20 μm, the depth of the top hole is 20 μm, the side length S2 of the side through-hole is 20 μm, and the distance h between the axis of the side through-hole and the upper surface is 10 μm. The above-described trapezoidal dual-channel microchannel structure can be applied to microchannel flow heat dissipation.

[0151] The 3D printing-assisted multi-scale metal three-dimensional surface structure preparation method described in any of the above embodiments can also be combined with ordinary machining to prepare the following three-dimensional structures, including but not limited to: a structure combining straight fins and straight column hole layers, a structure combining circular ring fins and S-shaped curved column arrays, and a structure combining square trapezoidal platforms and porous cubic column arrays.

[0152] like Figures 19 to 21 The diagram shown is a schematic of the structure combining straight fins and straight column hole layers provided in an embodiment of the present invention. Figure 20 This is a side view of the straight fin and straight column hole layer combined structure provided in the embodiment of the present invention; Figure 21 This is a top view of the straight fin and straight column perforated layer combined structure provided in an embodiment of the present invention. The straight fins are machined, and their width, spacing, and height range from 0.5 to 2 mm. In one embodiment, the fin width L = 1 mm, the spacing G = 1 mm, and the height H = 1 mm. The porous structure on the top of the fins is prepared by the 3D printing-assisted multi-scale metal three-dimensional surface structure preparation method provided in this invention. The thickness of the porous structure ranges from 0.1 to 0.5 mm, the pore diameter ranges from 10 to 100 μm, and the pore spacing ranges from 25 to 200 μm. In one embodiment, the porous structure thickness h = 0.2 mm, the pore diameter D = 10 μm, and the pore spacing S = 25 μm. The straight fin and straight column perforated layer combined structure is suitable for condensation heat transfer.

[0153] like Figures 22 to 24 As shown, Figure 22 This is a schematic diagram of the combined structure of annular fins and S-shaped curved column array provided in an embodiment of the present invention; Figure 23 This is a side sectional view of the combined structure of annular fins and S-shaped curved column array provided in an embodiment of the present invention; Figure 24 This is a top view of the combined structure of annular fins and S-shaped curved pillars provided in an embodiment of the present invention. The annular fin and S-shaped curved pillar array combined structure, wherein the lower annular structure is machined, the annular fin has a width ranging from 0.1-1 mm, an annular spacing ranging from 0.3-2 mm, and a height ranging from 0.3-2 mm. In one embodiment, the annular width L = 0.3 mm, the annular spacing G = 0.7 mm, and the height H = 0.5 mm. The annular fins and S-shaped curved pillar array on the top of the fins are prepared using the 3D printing-assisted multi-scale metal three-dimensional surface structure preparation method provided in this description. The annular height h = 0.5 mm. The S-shaped curved pillar array consists of three identical curved pillars in the vertical direction, and the horizontal S-shaped curved pillar array is evenly distributed around the center, with an angle of 20° between two S-shaped curved pillars. The S-shaped curved columns are composed of multiple quarter-circular rings with diameters ranging from 30 to 200 μm, and the diameter of the S-shaped curved columns ranges from 30 to 100 μm, with a spacing between the S-shaped curved columns ranging from 100 to 300 μm. In one embodiment, the S-shaped curved columns are composed of multiple quarter-circular rings with a diameter of D = 100 μm, the diameter of the S-shaped curved columns is d = 50 μm, and the spacing between the S-shaped curved columns is B = 150 μm. The above-described combination structure of the circular ring fins and the S-shaped curved column array is suitable for spray cooling experiments.

[0154] like Figures 25 to 27 As shown, Figure 25 This is a schematic diagram of the combined structure of a square trapezoidal platform and a porous cubic column array provided in an embodiment of the present invention; Figure 26This is a top view of the combined structure of a square trapezoidal platform and a porous cubic column array provided in an embodiment of the present invention; Figure 27 This is a side view of the combined structure of a square trapezoidal platform and a porous cubic column array provided in an embodiment of the present invention. In this structure, the lower square trapezoidal platform is machined. The upper side length of the trapezoidal platform ranges from 0.2 to 2 mm, the lower side length ranges from 0.5 to 4 mm, and the height ranges from 0.2 to 1 mm. In one embodiment, the upper side length L1 = 0.5 mm, the lower side length L2 = 1 mm, and the height H = 0.5 mm. The porous cubic column array on the square trapezoidal platform is prepared using the 3D printing-assisted multi-scale metal three-dimensional surface structure preparation method provided by the present invention. The porous cubic columns are prepared only on the upper surface of the trapezoidal platform. The porous cubic column array consists of multiple short straight columns with diameters ranging from 20 to 8 to 100 μm, with horizontal column spacing ranging from 50 to 200 μm and vertical column spacing ranging from 50 to 200 μm. In one embodiment, the porous cubic column array is composed of multiple short straight columns with a diameter D = 50 μm, a horizontal column spacing G = 100 μm, and a vertical column spacing h = 100 μm. This combination of a trapezoidal platform and a porous cubic column array structure is suitable for boiling experiments.

[0155] On the other hand, the present invention also provides a system, which is a heat exchange system, comprising the metal components described in the above embodiments, such as: heat dissipation metal components with a hexagonal mesh porous structure on the surface, heat dissipation metal components with a trapezoidal dual-channel microchannel structure on the surface, heat dissipation devices with a straight fin and straight column hole layer combined structure, heat dissipation devices with a circular ring fin and S-shaped curved column array combined structure, and heat dissipation metal components with a square trapezoidal platform and porous cubic column array combined structure.

[0156] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for the fabrication of multi-scale metallic three-dimensional surface structures with 3D printing assistance, characterized in that, include: The precision of metal structures is improved by using 3D printing technology to prepare micron-level high-precision three-dimensional structural masks. The three-dimensional structural mask includes a hollow part and a body part; the hollow part matches the three-dimensional structural model. The target metal is obtained by electroplating a metal substrate with the three-dimensional structure mask fixed on it. The three-dimensional structure mask is fixed on the surface of a metal substrate to form a template-substrate assembly; wherein the hollowed-out portion of the three-dimensional structure mask is directly connected to the metal substrate; The template matrix assembly is subjected to material conversion to obtain a metallic body; The three-dimensional structure mask on the metal body is removed to obtain the target metal; the surface of the target metal has a three-dimensional structure that matches the three-dimensional structure model. The three-dimensional structure of the mask includes a hexagonal mesh porous structure; wherein, the target metal is a hexagonal mesh porous copper structure, applied to a spray cooling scenario, and adjacent layers of porous copper in the hexagonal mesh porous copper structure form aligned perforations; The three-dimensional structure mask is prepared based on the following steps: The three-dimensional structural model is sliced ​​into layers to obtain a set of two-dimensional structural images; the set of two-dimensional structural images includes multiple two-dimensional structural images arranged in a layered order. The two-dimensional structure images are called sequentially according to the layering order of the multiple two-dimensional structure images, and the pattern corresponding to each called two-dimensional structure image is projected onto the surface of the liquid photosensitive material through ultraviolet light and solidified to form the three-dimensional structure mask. Each time a two-dimensional structure image is called and solidified to form the current mask, the current mask is moved down by a first preset distance and then up by a second preset distance so that there is a preset layer of liquid photosensitive material on the top of the current mask, before the next time the two-dimensional structure image is called and solidified.

2. The method according to claim 1, wherein Before performing material conversion on the metal substrate with the three-dimensional structure mask fixed thereon, the process further includes: The metal substrate is machined.

3. The method for preparing multi-scale metal three-dimensional surface structures assisted by 3D printing according to claim 1, characterized in that, The template-substrate assembly is subjected to material conversion using the electroplating method described above to obtain a metallic body, comprising: The template matrix assembly is immersed in a material conversion solution and connected to a working electrode; The auxiliary electrode and the reference electrode are immersed in the material conversion solution; After the electrochemical workstation is turned on for a preset time, the metal body is obtained.

4. The method for preparing multi-scale metal three-dimensional surface structures assisted by 3D printing according to claim 1, characterized in that, The process of removing the three-dimensional structure mask from the metal body to obtain the target metal includes: The metal body is immersed in a resin removal solution to remove the three-dimensional structure mask, thereby obtaining the target metal. The resin removal solution can dissolve the photosensitive resin material corresponding to the three-dimensional structure mask without reacting with the metal material corresponding to the target metal.

5. The method for preparing multi-scale metal three-dimensional surface structures assisted by 3D printing according to any one of claims 1 to 4, characterized in that, Before performing material conversion on the metal substrate with the three-dimensional structure mask fixed thereon to obtain the target metal, the process includes: Polish the surface of the metal substrate; Clean the surface of the polished metal substrate with a cleaning agent.

6. A component, characterized in that, The component is a metal component; the three-dimensional structure of the surface of the metal component is obtained by the 3D printing-assisted multi-scale metal three-dimensional surface structure preparation method as described in any one of claims 1 to 4.

7. The component according to claim 6, characterized in that, The metal component is a heat-dissipating metal component.

8. The component according to claim 7, characterized in that, The surface structure of the heat dissipation metal component is a hexagonal mesh porous structure, which consists of three layers of tightly spliced ​​hexagonal mesh structures. The length of the horizontal column of each hexagonal structure ranges from 50 to 500 μm, the diameter of the horizontal column ranges from 30 to 300 μm, and the diameter of the connecting column ranges from 30 to 300 μm. The layer spacing between two adjacent hexagonal mesh structures ranges from 50 to 400 μm.

9. A system, characterized in that, The system is a heat exchange system; the heat exchange system includes the metal components as described in claim 6.

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