A sensor design structure

Abstract

This application discloses a sensor design structure that is particularly suitable for the design of a three-axis MEMS gyroscope structure and belongs to the field of MEMS sensors. The structure is designed with a rotating frame for motion transmission and a shared mass block for X / Y axis detection. The structure saves the area of the drive structure and effectively reduces the overall size of the chip. The anchor points on the anchor frame can be adjusted accordingly based on the different stress performance of the chip at different locations on the wafer to offset or partially offset the effects of MEMS manufacturing process or packaging stress, thereby improving chip performance. Due to the use of the above-mentioned overall structural layout, the three-axis MEMS gyroscope in the present invention has a compact structure, a small overall area, and a low production cost.

Description

Technical Field

[0001] The present application relates to the field of MEMS sensors, and in particular to a sensor design structure. Background Art

[0002] Gyroscopes, sensors used to measure angular rate, are core components of inertial technology and are widely used in aviation, navigation, aerospace, defense, and consumer electronics. Micro-electro-mechanical system (MEMS) gyroscopes, developed in the 1990s, have seen rapid growth due to their unique advantages, including small size, low power consumption, light weight, mass production, low price, strong overload resistance, and integration, offering broad application prospects.

[0003] MEMS gyroscopes are active devices. When powered, the system undergoes simple harmonic oscillation at a resonant point. When an angular velocity input is applied perpendicular to the direction of motion of the mass block, a Coriolis force is generated in the direction perpendicular to the mass block's motion. A corresponding representation of the angular velocity can be obtained through a detection structure and peripheral processing circuitry. Currently, the most widely used drive methods are electrostatic and piezoelectric, while detection methods are capacitive and piezoelectric.

[0004] As consumer market demand increases, MEMS gyroscopes face higher requirements for size and performance. Gyroscopes have evolved from single-axis to three-axis gyroscopes. Early three-axis gyroscopes consisted of three independent single-axis gyroscopes, requiring separate drive structures, resulting in a large overall structure. Current consumer applications generally use monolithic three-axis gyroscopes, characterized by shared drive and the rational layout of the X / Y / Z gyro masses. Despite this, three-axis gyroscopes still face problems such as large size, low integration, and large orthogonality errors. Summary of the Invention

[0005] This application provides a sensor design structure that can optimize the size and performance of a three-axis gyroscope.

[0006] The present application provides a sensor design structure suitable for the structural design of a three-axis MEMS gyroscope, which includes: a substrate, an anchoring frame 10 located on the substrate, an XY-axis detection mass group 20, a Z-axis detection mass group 30, a first detection device group 40, a second detection device group 50, a rotating frame 60, a driving frame 70, a driving spring 80, a Z-axis detection spring 90, and a drive transfer beam 100 within the anchoring frame 10;

[0007] With the anchor frame 10 as the layout plane, the Z-axis detection mass group 30, the second detection device group 50, the drive frame 70, the drive spring 80, and the Z-axis detection spring 90 are symmetrically arranged on both sides of the anchor frame 10. The rotating frame 60 is located between the drive frame 70 and accommodates the XY-axis detection mass group 20 and the first detection device group 40.

[0008] The Z-axis detection mass group 30 is disposed within the drive frame 70 and is interconnected with the drive frame 70 via the Z-axis detection spring 90 ;

[0009] The short sides of the driving frame 70 are connected to the anchoring frame 10 via the driving springs 80 ; the long side of the driving frame 70 is connected to the rotating frame 60 where the XY-axis detection mass group 20 is located via the driving transmission beam 100 ;

[0010] The XY-axis detection mass group 20 is used to rotate around the center of the structure in the plane formed by the X-direction and the Y-direction after being driven; the Z-axis detection mass group 30 is used to move along the Y-direction after being driven by the driving device;

[0011] The first detection device group 40 is used to detect the angular velocity around the X direction and the Y direction; the second detection device group 50 is used to detect the angular velocity around the Z direction;

[0012] The rotating frame 60 is used to place the XY axis detection mass group 20 inside the frame, and the driving device is arranged outside the rotating frame 60;

[0013] The driving spring 80 is used to drive the driving frame 70 to move in the Y direction; the driving frame 70 is used to drive the XY axis detection mass group 20 to move through the rotating frame 60;

[0014] The X direction is perpendicular to the Y direction, and the Z direction is perpendicular to the X direction and the Y direction.

[0015] Optionally, the XY axis detection mass group 20 is composed of an XY axis detection mass block 21, and the first detection device group 40 includes an X axis detection plate 41 and a Y axis detection plate 42;

[0016] The X-axis detection plate 41 is symmetrically arranged on the left and right sides of the XY-axis detection mass block 21 in the Y direction, and the Y-axis detection plate 42 is symmetrically arranged on the upper and lower sides of the XY-axis detection mass block 21 in the X direction; the X-axis detection plate 41 and the Y-axis detection plate 42 are located in different planes from the XY-axis detection mass block 21, and there is a small gap in the middle to form a detection capacitor group.

[0017] The XY axis detection mass block 21 is connected to the rotating frame 60 via a connecting beam 22 . The XY axis detection mass block 21 rotates in the X or Y plane with the connecting beam 22 as the axis.

[0018] Optionally, the connecting beam 22 includes a first connecting beam arranged along the Y direction, and a second transfer beam arranged along the X direction on both sides of the rotating frame 60 and connected to the driving frame 70 .

[0019] Optionally, in the X-axis detection mode, the left and right sides of the XY-axis detection mass block 21 move in opposite directions along the rotation center in the Z direction, and the X-axis detection plate 41 is used to detect the angular velocity around the X direction;

[0020] In the Y-axis detection mode, the upper and lower sides of the XY-axis detection mass block 21 move in opposite directions along the rotation center in the Z direction, and the Y-axis detection plate 42 is used to detect the angular velocity around the Y direction;

[0021] Under the action of the driving device and the transmission structure, the symmetrically arranged Z-axis detection mass group 30 moves in the opposite direction along the Y direction.

[0022] Optionally, at symmetrical locations on both sides of the anchor frame 10, the Z-axis detection mass group 30 is composed of at least two Z-axis detection mass blocks 31, and the second detection device group 50 is composed of at least two Z-axis detection plates 51, each Z-axis detection plate 51 being arranged at a corresponding Z-axis detection mass block 31;

[0023] Each Z-axis detection mass 31 is interconnected with the drive frame 70 via at least one set of the Z-axis detection springs 90 , which enable synchronous movement with the connected structure in the Y direction and can generate relative movement in the X direction;

[0024] The Z-axis detection plate 51 is provided with a fixed comb tooth group fixed on the base through the anchor point 11, and the Z-axis detection plate 51 is provided with a movable comb tooth group fixed on the corresponding Z-axis detection mass block 31;

[0025] In the Z-axis detection mode, the distance between the fixed comb tooth group and the movable comb tooth group changes, and the Z-axis detection electrode plate 51 is used to detect the angular velocity around the Z direction.

[0026] Optionally, the driving device includes at least one driving unit and at least one driving detection unit;

[0027] The at least one driving unit is provided with a fixed comb tooth group fixed on the base through corresponding anchor points, and the at least one driving detection unit is provided with a fixed comb tooth group fixed on the base through corresponding anchor points;

[0028] A driving unit and a driving detection unit constitute a driving structure, and the driving device includes at least two driving structures. The at least two driving structures can be symmetrically arranged along the symmetry axis of the Z-axis detection mass block 31, and the movement directions of the driving structures on both sides of the symmetry axis are opposite, or the at least two driving structures are diagonally arranged.

[0029] Optionally, at least two driving frames 70 are provided in the anchoring frame 10, and are provided with a driving capacitor group and a driving detection capacitor group for driving respectively;

[0030] Optionally, the anchoring frame 10 is a supporting device for the sensor design structure. The anchoring frame 10 is fixed to the substrate via anchor points 11 and does not move relative to the substrate.

[0031] Optionally, the anchor point 11 on the substrate is a supporting device for the sensor design structure.

[0032] Optionally, the driving and detecting methods are at least one of electrostatic, piezoelectric, piezoresistive, magnetic, and thermal.

[0033] The sensor design structure provided in this application is suitable for the structural design of a three-axis MEMS gyroscope and has at least the following advantages:

[0034] 1. Designed with a rotating frame for motion transmission;

[0035] 2. The X / Y axis detection shares a mass block, which saves the area of the drive structure and effectively reduces the overall size of the chip;

[0036] 3. The anchor points on the anchoring frame can be adjusted accordingly based on the different stress performance of the chip at different locations on the wafer to offset or partially offset the impact of MEMS manufacturing process or packaging stress and improve chip performance;

[0037] 4. Due to the use of the aforementioned overall structural layout, the three-axis MEMS gyroscope of the present invention has a compact structure, a small overall area, and a low production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0039] Figure 1 A schematic diagram of a sensor design structure provided by an embodiment of the present invention is shown;

[0040] Figure 2 A schematic diagram of another sensor design structure provided by an embodiment of the present invention is shown;

[0041] Figure 3 A schematic diagram of an X-axis detection mode provided by an embodiment of the present invention is shown;

[0042] Figure 4 A schematic diagram of a Y-axis detection mode provided by an embodiment of the present invention is shown;

[0043] Figure 5 A schematic diagram of a Z-axis detection mode provided by an embodiment of the present invention is illustrated. DETAILED DESCRIPTION

[0044] The following is a clear and complete description of the technical solutions in this application in conjunction with the accompanying drawings. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.

[0045] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0046] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal connections between two components; they can refer to wireless connections or wired connections. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0047] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0048] Example 1

[0049] Please refer to Figure 1, which shows a schematic diagram of a sensor design structure provided by an exemplary embodiment of the present application, which is applicable to the structural design of a three-axis MEMS gyroscope. Among them, the X direction is perpendicular to the Y direction, and the Z direction is perpendicular to the X direction and the Y direction.

[0050] First, the composition of the sensor design structure is introduced.

[0051] The sensor design structure includes a substrate, an anchoring frame 10 located on the substrate, an XY-axis detection mass group 20, a Z-axis detection mass group 30, a first detection device group 40, a second detection device group 50, a rotating frame 60, a driving frame 70, a driving spring 80, a Z-axis detection spring 90 and a driving transfer beam 100 within the anchoring frame 10.

[0052] Secondly, the internal connection relationship of the sensor design structure is introduced.

[0053] like Figure 1 As shown, with the anchoring frame 10 as the layout surface, the Z-axis detection mass group 30, the second detection device group 50, the driving frame 70, the driving spring 80 and the Z-axis detection spring 90 are symmetrically arranged on both sides of the anchoring frame 10, and the rotating frame 60 is located between the driving frames 70 and accommodates the XY-axis detection mass group 20 and the first detection device group 40.

[0054] The Z-axis detection mass group 30 is disposed within the driving frame 70 and is interconnected with the driving frame 70 via the Z-axis detection spring 90 .

[0055] The short sides of the driving frame 70 are connected to the anchor frame 10 via driving springs 80. The long sides of the driving frame 70 are connected to the rotating frame 60 where the XY axis detection mass group 20 is located via driving transmission beams 100.

[0056] Furthermore, the functions of each component of the sensor design structure are introduced.

[0057] like Figure 1 As shown, the XY-axis detection mass group 20 is used to rotate around the center of the structure in the plane formed by the X and Y directions after being driven. The Z-axis detection mass group 30 is used to move along the Y direction after being driven by the driving device.

[0058] The first detection device group 40 is used to detect angular velocity around the X direction and around the Y direction. The second detection device group 50 is used to detect angular velocity around the Z direction.

[0059] The rotating frame 60 is used to place the XY axis detection mass group 20 inside the frame, and the driving device is arranged outside the rotating frame 60.

[0060] The driving spring 80 is used to drive the driving frame 70 to move in the Y direction. The driving frame 70 is used to drive the XY axis detection mass group 20 to move through the rotating frame 60.

[0061] In an embodiment of the present application, a sensor design is provided. This structure features a rotating frame for motion transmission and a shared mass for X / Y axis detection. This reduces the area of the drive structure and effectively reduces the overall chip size. Due to the aforementioned integrated structural layout, the three-axis MEMS gyroscope of the present invention is compact, has a small overall footprint, and offers low production costs.

[0062] Example 2

[0063] Further, such as Figure 2 , which shows a schematic diagram of a sensor design structure provided by another exemplary embodiment of the present application, wherein the X direction is perpendicular to the Y direction, and the Z direction is perpendicular to the X direction and the Y direction.

[0064] Optionally, the XY-axis detection mass group 20 is composed of an XY-axis detection mass block 21 , and the first detection device group 40 includes an X-axis detection plate 41 and a Y-axis detection plate 42 .

[0065] The X-axis detection plates 41 are symmetrically arranged on the left and right sides of the XY-axis detection mass block 21 in the Y direction, and the Y-axis detection plates 42 are symmetrically arranged on the upper and lower sides of the XY-axis detection mass block 21 in the X direction.

[0066] Typically, the X-axis detection plate 41 and the Y-axis detection plate 42 are located in different planes from the XY-axis detection mass block 21 , and a small gap exists between them to form a detection capacitor group.

[0067] The XY-axis detection mass block 21 is connected to the rotating frame 60 via the connecting beam 22 . The XY-axis detection mass block 21 rotates in the X or Y plane with the connecting beam 22 as the axis.

[0068] Optionally, the connecting beam 22 includes a first connecting beam arranged along the Y direction, and a second transfer beam arranged along the X direction on both sides of the rotating frame 60 and connected to the driving frame 70 .

[0069] like Figures 3 to 5 As shown, the detection mode diagram corresponding to the X-axis, Y-axis and Z-axis is further illustrated.

[0070] Optional, such as Figure 3 As shown, in the X-axis detection mode, the left and right sides of the XY-axis detection mass block 21 move in opposite directions along the rotation center in the Z direction, and the X-axis detection plate 41 is used to detect the angular velocity around the X direction.

[0071] like Figure 4 As shown, in the Y-axis detection mode, the upper and lower sides of the XY-axis detection mass block 21 move in opposite directions along the rotation center in the Z direction, and the Y-axis detection plate 42 is used to detect the angular velocity around the Y direction.

[0072] Under the action of the driving device and the transmission structure, the symmetrically arranged Z-axis detection mass group 30 moves in the opposite direction along the Y direction.

[0073] Optionally, at the symmetrical locations on both sides of the anchoring frame 10, the Z-axis detection mass group 30 is composed of at least two Z-axis detection mass blocks 31, and the second detection device group 50 is composed of at least two Z-axis detection plates 51, and each Z-axis detection plate 51 is arranged at the corresponding Z-axis detection mass block 31.

[0074] Each Z-axis detection mass 31 is interconnected with the drive frame 70 via at least one set of Z-axis detection springs 90 , which synchronize movement with the connected structure in the Y direction and generate relative movement in the X direction.

[0075] The Z-axis detection plate 51 is provided with a fixed comb tooth group fixed on the substrate through the anchor point 11 , and the Z-axis detection plate 51 is provided with a movable comb tooth group fixed on the corresponding Z-axis detection mass block 31 .

[0076] like Figure 5 As shown, in the Z-axis detection mode, the distance between the fixed comb tooth group and the movable comb tooth group changes, and the Z-axis detection electrode plate 51 is used to detect the angular velocity around the Z direction.

[0077] Optionally, the driving device includes at least one driving unit and at least one driving detection unit. Figure 1 and 2 Indicated in the.

[0078] Among them, at least one driving unit is provided with a fixed comb tooth group fixed on the base through corresponding anchor points, and at least one driving detection unit is provided with a fixed comb tooth group fixed on the base through corresponding anchor points.

[0079] A driving unit and a driving detection unit constitute a driving structure. The driving device includes at least two driving structures. The at least two driving structures can be symmetrically arranged along the symmetry axis of the Z-axis detection mass block 31, and the movement directions of the driving structures on both sides of the symmetry axis are opposite, or at least two driving structures are diagonally arranged.

[0080] In one possible embodiment, when a driving structure is included in a driving frame 70 or a Z-axis detection mass block 31, the driving unit and the driving detection unit are arranged on the same side of the driving frame 70 or the same side of the Z-axis detection mass block 31; or, the driving unit and the driving detection unit are arranged on two symmetrical sides of the driving frame 70 or on two symmetrical sides of the Z-axis detection mass block 31; when two driving structures are included in a driving frame 70 or a Z-axis detection mass block 31, the two driving structures are arranged on two symmetrical sides of the driving frame 70 or on two symmetrical sides of the Z-axis detection mass block 31; or, the two driving units in the two driving structures are arranged on one side of the driving frame 70 or a Z-axis detection mass block 31, and the two driving detection units are arranged on the other symmetrical side of the driving frame 70 or the Z-axis detection mass block 31.

[0081] Optionally, at least two driving frames 70 are provided in the anchoring frame 10 , and are provided with a driving capacitor group and a driving detection capacitor group for driving respectively.

[0082] The X-direction detection capacitor group includes an X-axis detection plate 41 and an XY-axis detection mass group 20 disposed on the substrate. The Y-direction detection capacitor group includes a Y-axis detection plate 42 and an XY-axis detection mass group 20 disposed on the substrate.

[0083] Optionally, the anchoring frame 10 is a supporting device for the sensor design structure. The anchoring frame 10 is fixed to the substrate via anchor points 11 and does not move relative to the substrate.

[0084] Optionally, the anchor points 11 on the substrate serve as support devices for the sensor design structure.

[0085] Optionally, the driving and detecting methods are at least one of electrostatic, piezoelectric, piezoresistive, magnetic, and thermal.

[0086] The embodiments of this application further disclose the XY-axis detection quality group, the Z-axis detection quality group, and the drive-related structure content. The detection modes of each axis, as well as the fixing method of the sensor design structure, and the drive and detection methods are introduced. The detection mode and drive implementation of the sensor design structure are mainly explained. Among them, the anchor points on the anchor frame can be adjusted accordingly based on the different stress performance of the chip at different locations on the wafer to offset or partially offset the effects of MEMS manufacturing process or packaging stress, thereby improving chip performance.

[0087] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will appreciate that other variations or modifications can be made based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of this application.

Claims

1. A sensor design structure, characterized in that: A structural design suitable for a three-axis MEMS gyroscope, the structure comprising: a substrate, an anchoring frame (10) located on the substrate, an XY-axis detection mass group (20), a Z-axis detection mass group (30), a first detection device group (40), a second detection device group (50), a rotating frame (60), a driving frame (70), a driving spring (80), a Z-axis detection spring (90), and a driving transmission beam (100) within the anchoring frame (10); Taking the anchoring frame (10) as the layout surface, the Z-axis detection mass group (30), the second detection device group (50), the driving frame (70), the driving spring (80) and the Z-axis detection spring (90) are symmetrically arranged on both sides of the anchoring frame (10); the rotating frame (60) is located between the driving frames (70) and accommodates the XY-axis detection mass group (20) and the first detection device group (40); The Z-axis detection mass group (30) is disposed in the drive frame (70) and is interconnected with the drive frame (70) via the Z-axis detection spring (90); The two sides of the short side of the driving frame (70) are connected to the anchoring frame (10) via the driving springs (80); the one side of the long side of the driving frame (70) is connected to the rotating frame (60) where the XY-axis detection mass group (20) is located via the driving transmission beam (100); The XY-axis detection mass group (20) is used to rotate around the center of the structure in a plane formed by the X-direction and the Y-direction after being driven; the Z-axis detection mass group (30) is used to move along the Y-direction after being driven by the driving device; The XY-axis detection mass group (20) is composed of an XY-axis detection mass block (21), and the first detection device group (40) includes an X-axis detection plate (41) and a Y-axis detection plate (42); The X-axis detection plate (41) is symmetrically arranged on the left and right sides of the XY-axis detection mass block (21) in the Y direction, and the Y-axis detection plate (42) is symmetrically arranged on the upper and lower sides of the XY-axis detection mass block (21) in the X direction; the X-axis detection plate (41) and the Y-axis detection plate (42) are located in different planes from the XY-axis detection mass block (21), and a small gap exists between them to form a detection capacitor group; The XY-axis detection mass block (21) is connected to the rotating frame (60) via a connecting beam (22), and the XY-axis detection mass block (21) rotates in the X or Y plane with the connecting beam (22) as the axis; The first detection device group (40) is used to detect angular velocity around the X direction and around the Y direction; the second detection device group (50) is used to detect angular velocity around the Z direction; The rotating frame (60) is used to place the XY-axis detection mass group (20) inside the frame, and the driving device is arranged outside the rotating frame (60); The driving spring (80) is used to drive the driving frame (70) to move in the Y direction; the driving frame (70) is used to drive the XY-axis detection mass group (20) to move through the rotating frame (60); The X direction is perpendicular to the Y direction, and the Z direction is perpendicular to the X direction and the Y direction.

2. The sensor design structure according to claim 1, characterized in that: The connecting beam (22) comprises a first connecting beam arranged along the Y direction, and a second transfer beam arranged along the X direction on both sides of the rotating frame (60) and connected to the driving frame (70).

3. The sensor design structure according to claim 2, characterized in that: In the X-axis detection mode, the left and right sides of the XY-axis detection mass block (21) move in opposite directions along the rotation center in the Z direction, and the X-axis detection plate (41) is used to detect the angular velocity around the X direction; In the Y-axis detection mode, the upper and lower sides of the XY-axis detection mass block (21) move in opposite directions along the rotation center in the Z direction, and the Y-axis detection plate (42) is used to detect the angular velocity around the Y direction; Under the action of the driving device and the transmission structure, the symmetrically arranged Z-axis detection mass group (30) moves in the opposite direction along the Y direction.

4. The sensor design structure according to claim 1, characterized in that: At symmetrical locations on both sides of the anchoring frame (10), the Z-axis detection mass group (30) is composed of at least two Z-axis detection mass blocks (31), and the second detection device group (50) is composed of at least two Z-axis detection plates (51), each Z-axis detection plate (51) being arranged at a corresponding Z-axis detection mass block (31); Each Z-axis detection mass block (31) is interconnected with the drive frame (70) via at least one set of the Z-axis detection springs (90), wherein the Z-axis detection springs (90) cause synchronous movement with the connected structure in the Y direction and can generate relative movement in the X direction; The Z-axis detection plate (51) is provided with a fixed comb tooth group fixed on the base via an anchor point (11), and the Z-axis detection plate (51) is provided with a movable comb tooth group fixed on the corresponding Z-axis detection mass block (31); In the Z-axis detection mode, a distance change occurs between the fixed comb tooth group and the movable comb tooth group, and the Z-axis detection plate (51) is used to detect an angular velocity around the Z direction.

5. The sensor design structure according to claim 4, characterized in that: The driving device includes at least one driving unit and at least one driving detection unit; The at least one driving unit is provided with a fixed comb tooth group fixed on the base through corresponding anchor points, and the at least one driving detection unit is provided with a fixed comb tooth group fixed on the base through corresponding anchor points; A driving unit and a driving detection unit constitute a driving structure; When the driving device includes two driving structures, the two driving structures can be symmetrically arranged along the symmetry axis of the Z-axis detection mass block (31), and the movement directions of the driving structures on both sides of the symmetry axis are opposite, or the two driving structures are diagonally arranged.

6. The sensor design structure according to any one of claims 2 to 5, characterized in that: At least two driving frames (70) are arranged in the anchoring frame (10), and a driving capacitor group and a driving detection capacitor group are correspondingly arranged.

7. The sensor design structure according to any one of claims 2 to 5, characterized in that: The anchoring frame (10) is a supporting device for the sensor design structure. The anchoring frame (10) is fixed on the substrate via anchor points (11) and does not move relative to the substrate.

8. The sensor design structure according to any one of claims 2 to 5, characterized in that: The anchor points (11) on the substrate serve as support devices for the sensor design structure.

9. The sensor design structure according to any one of claims 2 to 5, characterized in that: The driving and detecting methods are at least one of electrostatic, piezoelectric, piezoresistive, magnetic, and thermal.

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