Display device

Abstract

A display device is provided. The display device includes a substrate including a first area and a second area different from the first area; a display unit disposed on the first area and including a light-emitting element; a pad portion disposed on the second area, the pad portion including a first pad array arranged in a first row and a second pad array arranged in a second row, the first row and the second row extending along a first direction; and a driving circuit disposed on the second area and electrically connected to the pad portion, wherein the first pad array includes a plurality of first signal pads and a plurality of first dummy pads disposed outwardly relative to the plurality of first signal pads, wherein the second pad array includes a plurality of second signal pads and a plurality of second dummy pads disposed outwardly relative to the plurality of second signal pads, and wherein the number of the plurality of first dummy pads in the first row is greater than the number of the plurality of second dummy pads in the second row.

Description

[0001] This application is a divisional application of the Chinese patent application with application number 201910309617.4 and invention name “Display Device” filed on April 17, 2019.

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This application claims the priority benefit of Korean Patent Application No. 10-2018-0046258 filed on April 20, 2018, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0004] The inventive concept relates to a display device. Background Art

[0005] A display device is a device for visually displaying data. Such a display device includes a substrate divided into a display area and a non-display area. A display unit is provided on the substrate in the display area, and a pad or the like is provided on the substrate in the non-display area. The pad is provided with a driving circuit to transmit a driving signal to the display unit.

[0006] At the same time, the driving circuit may be mounted on the substrate through a pressing and heating process. When the substrate is made of a flexible material, the substrate is bent by pressing, and thus the display unit may be separated from the substrate. Summary of the invention

[0007] An aspect of the inventive concept is to provide a display device having improved durability and reliability.

[0008] However, aspects of the inventive concept are not limited to the aspects set forth herein. The above and other aspects of the inventive concept will become more apparent to those of ordinary skill in the art to which the inventive concept pertains by referring to the detailed description of the inventive concept given below.

[0009] According to an exemplary embodiment of the present invention, a display device is provided. The display device may include: a flexible base layer, a display unit, and a driving circuit, the flexible base layer including a first area and a second area located around the first area; the display unit is disposed on a surface of the first area and includes a light-emitting element; the driving circuit is disposed on the second area and includes a plurality of first bumps arranged in a first row and a plurality of second bumps arranged in a second row, wherein the driving circuit includes an additional bump disposed in the first row and disposed outwardly relative to the plurality of first bumps, each of the first reference bumps and the second reference bumps disposed at the center of the plurality of first bumps and the plurality of second bumps is disposed along a reference line defined in a column direction perpendicular to the row direction, and the remaining first bumps and the second bumps other than the first reference bumps and the second reference bumps are arranged to have a preset slope relative to the reference line.

[0010] In an exemplary embodiment, the plurality of first bumps may include a plurality of eleventh bumps arranged on the left side of the first reference bump and a plurality of twelfth bumps arranged on the right side of the first reference bump, and the plurality of eleventh bumps are arranged to form an acute angle in a clockwise direction relative to the reference line, and the plurality of twelfth bumps are arranged to form an acute angle in a counterclockwise direction relative to the reference line.

[0011] In an exemplary embodiment, the shortest distance from the end of the flexible base layer to the first bump may be greater than the shortest distance from the end of the flexible base layer to the second bump.

[0012] In an exemplary embodiment, the additional bump may be disposed between the end of the flexible base layer and the first bump.

[0013] In an exemplary embodiment, the shortest distance from the end of the flexible base layer to the additional bump may be equal to the shortest distance from the end of the flexible base layer to the second bump.

[0014] In an exemplary embodiment, a difference between the shortest distance from the end of the flexible base layer to the additional bump and the shortest distance from the end thereof to the second bump may be about 30 μm or less.

[0015] In exemplary embodiments, the thickness of the first bump may be equal to the thickness of the additional bump.

[0016] In exemplary embodiments, the thickness of the additional bump may be greater than the thickness of the first bump.

[0017] In an exemplary embodiment, the plurality of first bumps and the plurality of second bumps may be output bumps that output driving signals for driving the display unit.

[0018] In example embodiments, the additional bump may be an output bump configured to output a driving signal for driving the display unit.

[0019] In exemplary embodiments, the additional bumps may be dummy bumps.

[0020] In an exemplary embodiment, the driving circuit may include a plurality of third bumps and a fourth bump arranged in a third row, and the fourth bump is disposed between an end portion of the flexible base layer and the plurality of third bumps.

[0021] In example embodiments, the third bump may be an input bump configured to receive a signal from the outside.

[0022] According to an exemplary embodiment of the present invention, a display device may be provided. The display device may include: a flexible base layer, a display unit, and a driving circuit, the flexible base layer including a first area and a second area located around the first area; the display unit is disposed on a surface of the first area and includes a light-emitting element; the driving circuit is disposed on the second area and includes a plurality of first bumps arranged in a first row and a plurality of second bumps arranged in a second row, wherein the number of the plurality of first bumps is greater than the number of the plurality of second bumps, each first reference bump and a second reference bump disposed at the center of the plurality of first bumps and the plurality of second bumps are disposed along a reference line defined in a column direction perpendicular to the row direction, and the remaining first bumps and second bumps other than the first reference bumps and the second reference bumps are arranged to have a preset slope relative to the reference line.

[0023] In an exemplary embodiment, the plurality of first bumps are disposed adjacent to the display unit with respect to the plurality of second bumps.

[0024] In an exemplary embodiment, the plurality of first bumps may include a plurality of eleventh bumps arranged at the left side of the first reference bump and a plurality of twelfth bumps arranged at the right side of the first reference bump, and the plurality of eleventh bumps are arranged to form an acute angle in a clockwise direction relative to the reference line, and the plurality of twelfth bumps are arranged to form an acute angle in a counterclockwise direction relative to the reference line.

[0025] In an exemplary embodiment, the shortest distance from the end of the flexible base layer to the first bump may be equal to the shortest distance from the end of the flexible base layer to the second bump.

[0026] In an exemplary embodiment, a difference between a shortest distance from an end of the flexible base layer to the first bump and a shortest distance from an end of the flexible base layer to the second bump is about 30 μm or less.

[0027] In an exemplary embodiment, the plurality of second bumps may be disposed adjacent to the display unit with respect to the plurality of first bumps.

[0028] In an exemplary embodiment, the plurality of first bumps may include a plurality of eleventh bumps arranged at the left side of the first reference bump and a plurality of twelfth bumps arranged at the right side of the first reference bump, and the plurality of eleventh bumps are arranged to form an obtuse angle in a clockwise direction relative to the reference line, and the plurality of twelfth bumps are arranged to form an obtuse angle in a counterclockwise direction relative to the reference line. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The above and other aspects and features of the inventive concept will become more apparent by describing in detail exemplary embodiments thereof with reference to the accompanying drawings, in which:

[0030] Figure 1 is a plan view of a display device according to an embodiment;

[0031] Figure 2 is along Figure 1 A cross-sectional view taken along line II-II';

[0032] Figure 3 yes Figure 2 An enlarged cross-sectional view of region A in FIG.

[0033] Figure 4 is a plan view showing a layout of a bump unit of a driving circuit according to an embodiment;

[0034] Figure 5 yes Figure 4 An enlarged cross-sectional view of the middle region B;

[0035] Figure 6 is along Figure 1 A cross-sectional view taken along line V-V' in FIG. 1 , which schematically shows a process for mounting a driving circuit;

[0036] Figure 7 is a cross-sectional view for explaining a process of mounting a driving circuit when an additional bump is omitted;

[0037] Figure 8 is a cross-sectional view of a display device according to another embodiment;

[0038] Fig. 9 is a cross-sectional view of a display device according to yet another embodiment;

[0039] Fig.10 is a cross-sectional view of a display device according to yet another embodiment;

[0040] Fig.11 is a plan view showing a layout of a bump unit of a driving circuit according to another embodiment;

[0041] Fig.12is a plan view showing a layout of a bump unit of a driving circuit according to still another embodiment; and

[0042] Fig.13 is a plan view showing a layout of a bump unit of a driving circuit according to still another embodiment. DETAILED DESCRIPTION

[0043] Advantages and features of the inventive concept and methods for achieving the advantages and features will be apparent by referring to the embodiments to be described in detail with reference to the accompanying drawings. However, the inventive concept is not limited to the embodiments disclosed hereinafter but can be implemented in various forms.

[0044] When an element is described as being related to another element, such as being “on” or “located” “on” another element, it includes both the case where the element is directly on another element or layer and the case where the element is on another element via another layer or yet another element. Conversely, when an element is described as being related to another element, such as being “directly on” or “directly on” another element, it indicates that the element is on another element or layer without an intervening element or layer therebetween.

[0045] Although the terms "first, second, etc." are used to describe different components, these components are not limited by these terms. These terms are only used to distinguish a component from other components. Therefore, in the following description, the first component may be the second component.

[0046] The terms used herein are for the purpose of describing specific embodiments only and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" as used herein are also intended to include plural forms, including "at least one". "At least one" should not be interpreted as limiting "a" or "an". "Or" means "and / or". As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items. It should also be understood that when the terms "comprise" and / or "comprising", or "include" and / or "including" are used in this specification, the presence of the stated features, regions, integers, steps, operations, elements and / or parts is indicated, but the presence or addition of one or more other features, regions, integers, steps, operations, elements, parts and / or their clusters is not excluded.

[0047] The embodiments described herein will be described with reference to the plan views and cross-sectional views as ideal schematic diagrams of the inventive concept. Therefore, the illustrated shapes may be modified by manufacturing techniques and / or allowable errors. Therefore, it should be understood that the embodiments are not limited to the specific forms shown, but may include formal changes produced according to the manufacturing process. Therefore, the regions depicted in the figures have schematic properties, and the shapes of the regions depicted in the figures are intended to illustrate the specific forms of the regions of the elements, and are not intended to limit the scope of the invention.

[0048] Throughout the specification, the same reference numerals are used for the same or like parts.

[0049] Hereinafter, embodiments of the inventive concept will be described with reference to the accompanying drawings.

[0050] A display device, which is a device for displaying moving images or still images, can be used as a display screen for various products such as televisions, laptops, monitors, billboards, the Internet of Things, and portable electronic devices such as mobile phones, smart phones, tablet personal computers (PCs), smart watches, watch phones, mobile communication terminals, electronic notebook computers, e-books, portable multimedia players (PMPs), navigators, and ultra mobile PCs (UMPCs). Examples of display devices may include organic light emitting displays (OLEDs), liquid crystal displays (LCDs), plasma displays (PDPs), field emission displays (FEDs), and electrophoretic displays (EPDs).

[0051] Hereinafter, an organic light emitting display device will be described as an example of a display device, but the inventive concept is not limited thereto.

[0052] Figure 1 is a plan view of a display device according to an embodiment, Figure 2 is along Figure 1 A cross-sectional view taken along line II-II' in FIG. Figure 3 yes Figure 2 An enlarged cross-sectional view of area A in FIG.

[0053] Reference Figures 1 to 3 The display device 1 according to the present embodiment includes a display area DA and a non-display area NDA around the display area DA. The display area DA is an area where an image is displayed, and the non-display area NDA is an area where no image is displayed.

[0054] The display device 1 may include a flexible base layer 110, a display unit 130, and a driving circuit 200. The display device 1 may further include a circuit board unit 300 and a packaging unit 150.

[0055] The flexible base layer 110 may be an insulating substrate. In an embodiment, the flexible base layer 110 may include a flexible polymer material. Here, the polymer material may be polyimide (PI), polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl ether, polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP), or a combination thereof.

[0056] The flexible base layer 110 may include a first area 110A and a second area 110B. A display area DA in which the display unit 130 is disposed may be defined in the first area 110A, and one area of ​​the non-display area NDA may be defined in the first area 110A. Another area of ​​the non-display area NDA may be defined in the second area 110B, and the driving circuit 200 may be disposed in the second area 110B.

[0057] The display unit 130 may be disposed on the first region 110A of the flexible base layer 110 , and the encapsulation unit 150 may be disposed on the display unit 130 .

[0058] The display unit 130 includes a thin film transistor TFT as a switching element and a light emitting element OLED connected to the thin film transistor TFT, and may also include a buffer layer BU, a gate insulating film GI, an interlayer insulating film ILD, a planarization film PLA, a pixel defining film PDL, a gate line (not shown) and a data line (not shown).

[0059] The buffer layer BU may be disposed on the first region 110A of the flexible base layer 110. The buffer layer BU can prevent diffusion of impurity ions, can prevent penetration of moisture or external air, and can perform a surface planarization function. The buffer layer BU may include silicon nitride, silicon oxide, or silicon oxynitride. In some embodiments, the buffer layer BU may be omitted depending on process conditions, etc.

[0060] The semiconductor layer SM may be disposed on the buffer layer BU. The semiconductor layer SM may include single crystal silicon, low temperature polycrystalline silicon, amorphous silicon, etc. However, the inventive concept is not limited thereto, and in another embodiment, the semiconductor layer SM may include ITZO (including oxides of indium, tin, and titanium) or IGZO (including oxides of indium, gallium, and tin).

[0061] The gate insulating film GI may be disposed on the semiconductor layer SM. The gate insulating film GI may be made of an inorganic material, and may include, for example, silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, or the like.

[0062] The gate electrode GE may be disposed on the gate insulating film GI. The gate electrode GE may be connected to a gate line (not shown) extending in the first direction DR1 to receive a gate signal such as a gate voltage.

[0063] The interlayer insulating film ILD may be disposed on the gate electrode GE. The interlayer insulating film ILD may be made of an organic material or an inorganic material, and may be a single-layer film or a multi-layer film composed of a plurality of different materials.

[0064] The source electrode SE and the drain electrode DE may be disposed on the interlayer insulating film ILD. Each of the source electrode SE and the drain electrode DE may be connected to the semiconductor layer SM through the interlayer insulating film ILD and the gate insulating film GI. The source electrode SE may be connected to a data line extending in the second direction DR2 to receive a data signal such as a data voltage.

[0065] The semiconductor layer SM, the gate electrode GE, the source electrode SE, and the drain electrode DE may constitute a thin film transistor TFT as a switching element.

[0066] The planarization film PLA may be disposed on the source electrode SE and the drain electrode DE. In some embodiments, the planarization film PLA may be made of an organic material, but the inventive concept is not limited thereto.

[0067] The first electrode E1 may be disposed on the planarization film PLA. The first electrode E1 may be connected to the drain electrode DE through the planarization film PLA. In some embodiments, the first electrode E1 may be an anode electrode.

[0068] The pixel defining film PDL partially exposing the first electrode E1 may be disposed on the planarization film PLA. In some embodiments, the pixel defining film PDL may be made of an organic material.

[0069] The organic light emitting layer OL may be disposed on the first electrode E1 exposed through the pixel defining layer PDL. In some embodiments, the organic light emitting layer OL may be made of a low molecular weight organic material or a high molecular weight organic material such as PEDOT (poly (3,4-ethylenedioxythiophene)). The organic light emitting layer OL may be a multilayer film including one or more of a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL).

[0070] The second electrode E2 may be disposed on the organic light emitting layer OL and the pixel defining layer PDL. In some embodiments, the second electrode E2 may be a cathode electrode connected to a common power source (ELVSS).

[0071] The first electrode E1 , the organic light emitting layer OL and the second electrode E2 may constitute a light emitting element OLED.

[0072] The encapsulation unit 150 may be disposed on the light emitting element OLED. The encapsulation unit 150 may encapsulate the light emitting element OLED and may prevent moisture, etc. from being introduced into the light emitting element OLED from the outside. In some embodiments, the encapsulation unit 150 may completely cover the display unit 130 .

[0073] The encapsulation unit 150 may be formed by thin film encapsulation and may include at least one organic film and at least one inorganic film. Illustratively, the encapsulation unit 150 may include a first inorganic film 151 disposed on the second electrode E2, an organic film 153 disposed on the first inorganic film 151, and a second inorganic film 155 disposed on the organic film 153.

[0074] The first inorganic film 151 can prevent moisture, oxygen, etc. from penetrating into the light emitting element OLED. The first inorganic film 151 can be made of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, or silicon oxynitride (SiON).

[0075] The organic film 153 can improve flatness. The organic film 153 may be formed of a liquid organic material, for example, acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, or perylene resin.

[0076] The second inorganic film 155 may have a function substantially the same as or similar to that of the first inorganic film 151, and may be made of a material substantially the same as or similar to that of the first inorganic film 151. The second inorganic film 155 may completely cover the organic film 153. In some embodiments, the second inorganic film 155 and the first inorganic film 151 may contact each other in the non-display area NDA to form an inorganic-inorganic junction.

[0077] The driving circuit 200 may be disposed on the second region 110B of the flexible base layer 110. The driving circuit 200 may include a driving chip 210, an output bump unit 220 connected to the driving chip 210, and an input bump unit 230 spaced apart from the output bump unit 220 and connected to the driving chip 210.

[0078] In some embodiments, the driving chip 210 may be a data driver IC that provides a data signal, etc., for driving the display unit 130 .

[0079] The output bump unit 220 may output a driving signal for driving the display unit 130, and the input bump unit 230 may receive a control signal and power provided from the circuit board unit 300. A plurality of output bump units 220 may be disposed along the first direction DR1 and the second direction DR2 corresponding to the first pad 170, and may be spaced apart from the input bump unit 230 along the second direction DR2. A plurality of input bump units 230 may also be disposed along the first direction DR1 corresponding to the second pad 180.

[0080] The first and second pads 170 and 180 may be disposed on the second region 110B of the flexible base layer 110. In some embodiments, a plurality of first pads 170 may be disposed along the first direction DR1 and the second direction DR2, and may be spaced apart from the second pads 180 along the second direction DR2. A plurality of second pads 180 may be disposed along the first direction DR1. The first and second pads 170 and 180 may be electrically connected to the driving circuit 200.

[0081] The first wiring unit 121 for electrically connecting the first pad 170 and the display unit 130 may be disposed on the flexible base layer 110. The first wiring unit 121 may be disposed not only on the second area 110B of the flexible base layer 110 but also on the first area 110A of the flexible base layer 110.

[0082] The circuit board unit 300 is connected to an external system and a power supply unit (not shown). The circuit board unit 300 supplies control signals, power, etc. to the display unit 130 and the driving circuit 200. The circuit board unit 300 is disposed on the second area 110B of the flexible base layer 110 and is farther from the display area DA than the driving circuit 200.

[0083] In some embodiments, the circuit board unit 300 may include a circuit board 310 and a circuit bump 320 connected to the circuit board 310 .

[0084] The circuit board 310 may be a printed circuit board, and may be rigid or flexible. In some embodiments, a portion of the circuit board 310 may be rigid, and another portion thereof may be flexible.

[0085] The circuit pad 190 may also be disposed on the second region 110B of the flexible base layer 110, and the circuit pad 190 may be electrically connected to the circuit board unit 300. In some embodiments, the first pad 170 and the second pad 180 may be disposed adjacent to the display area DA relative to the circuit pad 190. The second wiring unit 122 for electrically connecting the second pad 180 with the circuit pad 190 may be disposed on the second region 110B of the flexible base layer 110. In some embodiments, a plurality of circuit pads 190 may be disposed along the first direction DR1 corresponding to the circuit bump 320.

[0086] The first pad 170 is a portion receiving a driving signal output from the driving circuit 200. The driving signal output from the driving circuit 200 may be provided to the display unit 130 via the first pad 170 and the first wiring unit 121.

[0087] The second pad 180 may be a portion for transmitting a control signal and power supplied from the circuit board unit 300 to the driving circuit 200 , and the circuit pad 190 may be a portion for receiving a control signal and power supplied from the circuit board unit 300 .

[0088] A control signal and power provided from the circuit board unit 300 may be provided to the driving circuit 200 via the circuit pad 190 , the second wiring unit 122 , and the second pad 180 .

[0089] The first pad 170 is electrically connected to the output bump unit 220 , and the second pad 180 is electrically connected to the input bump unit 230 .

[0090] An anisotropic conductive film ACF including an adhesive resin and conductive particles may be interposed between the first pad 170 and the output bump unit 220. The anisotropic conductive film ACF may also be interposed between the second pad 180 and the input bump unit 230.

[0091] In some embodiments, the driving circuit 200 can be mounted on the flexible base layer 110 by a pressing and heating process. Figure 4 A detailed layout of the output bump unit 220 of the driving circuit 200 is described.

[0092] Figure 4 is a plan view showing a layout of a bump unit of a driving circuit according to an embodiment. Figure 5 yes Figure 4 An enlarged cross-sectional view of region B in the figure.

[0093] Reference Figure 4 and Figure 5 , the output bump unit 220 may include a plurality of first output bumps 221, a plurality of second output bumps 222, and a plurality of third output bumps 223 arranged in a row direction (first direction DR1). That is, the first output bump 221, the second output bump 222, and the third output bump 223 may be arranged in a first row, a second row, and a third row, respectively. Although a layout in which the output bump unit 220 is arranged in three rows is shown in the figure, the inventive concept is not limited thereto, and a layout in which the output bump unit 220 is arranged in two rows or four rows or more rows may be provided.

[0094] Each of the plurality of first output bumps 221, the plurality of second output bumps 222, and the plurality of third output bumps 223 may include n bumps. That is, the number of bumps constituting the plurality of first output bumps 221, the plurality of second output bumps 222, and the plurality of third output bumps 223 may be the same. However, the inventive concept is not limited thereto, and depending on the structure of the display device, the number of bumps arranged in each row may be different.

[0095] The first reference bump 221VB disposed at the center of the plurality of first output bumps 221 and the second reference bump 222VB disposed at the center of the plurality of second output bumps 222 are disposed on a reference line VL defined in the second direction DR2. The third reference bump 223VB disposed at the center of the plurality of third output bumps 223 may also be disposed on the reference line VL.

[0096] The plurality of first output bumps 221 may include a plurality of eleventh output bumps 2211 disposed on the relatively left side of the first reference bump 221VB and a plurality of twelfth output bumps 2212 disposed on the relatively right side of the first reference bump 221VB.

[0097] Similar to the plurality of first output bumps 221, the plurality of second output bumps 222 may include a plurality of twenty-first output bumps 2221 disposed on the relatively left side of the second reference bump 222VB and a plurality of twenty-second output bumps 2222 disposed on the relatively right side of the second reference bump 222VB. The plurality of third output bumps 223 may also include a plurality of thirty-first output bumps 2231 disposed on the relatively left side of the third reference bump 223VB and a plurality of thirty-second output bumps 2232 disposed on the relatively right side of the third reference bump 223VB.

[0098] The plurality of eleventh output bumps 2211, the plurality of twenty-first output bumps 2221, and the plurality of thirty-first output bumps 2231 arranged on the left side of the reference line VL are arranged to have a preset slope relative to the reference line VL. The preset slope may be a slope having a constant value, that is, a predetermined slope. In particular, the plurality of eleventh output bumps 2211, the plurality of twenty-first output bumps 2221, and the plurality of thirty-first output bumps 2231 may be arranged to form an acute angle α in a clockwise direction relative to the reference line VL.

[0099] The plurality of twelfth output bumps 2212, the plurality of twenty-second output bumps 2222, and the plurality of thirty-second output bumps 2232 arranged on the right side of the reference line VL are respectively arranged to have a preset slope, i.e., a predetermined slope, relative to the reference line VL. In particular, the plurality of twelfth output bumps 2212, the plurality of twenty-second output bumps 2222, and the plurality of thirty-second output bumps 2232 may be respectively arranged to form an acute angle β in a counterclockwise direction relative to the reference line VL.

[0100] When the number of the first output bumps 221 is the same as the number of the second output bumps 222, the slope of the n-th bump of the plurality of first output bumps 221 may be equal to the slope of the n-th bump of the plurality of second output bumps 222. In addition, when the number of the first output bumps 221 is the same as the number of the third output bumps 223, the slope of the n-th bump of the plurality of first output bumps 221 may be equal to the slope of the n-th bump of the plurality of third output bumps 223.

[0101] The spacing between the plurality of first output bumps 221 may be smaller than the spacing between the plurality of second output bumps 222. The spacing between the plurality of second output bumps 222 may be smaller than the spacing between the plurality of third output bumps 223. That is, the intervals between the bumps may increase from the plurality of first output bumps 221 to the plurality of third output bumps 223.

[0102] When the bumps disposed farthest from the reference line VL are the outermost bumps, the distance from the reference line VL to the first outermost bump 2210B may be shorter than the distance from the reference line VL to the second outermost bump 2220B. In addition, the distance from the reference line VL to the second outermost bump 2220B may be shorter than the distance from the reference line VL to the third outermost bump 2230B. In other words, the bumps may move away from the reference line VL from the first outermost bump 2210B toward the third outermost bump 2230B.

[0103] When one short side of the driver chip 210 of the driver circuit 200 is used as a reference, the first outermost bump 2210B may be relatively arranged inwardly relative to the second outermost bump 2220B and the third outermost bump 2230B. That is, the distance d1 from the short side of the driver chip 210 to the first outermost bump 2210B may be longer than the distance d2 from its short side to the second outermost bump 2220B, and may also be longer than the distance d3 from its short side to the third outermost bump 2230B.

[0104] The driving circuit 200 may include a first additional bump 240 disposed in the same row as the plurality of first output bumps 221 and a second additional bump 250 disposed in the same row as the plurality of second output bumps 222 .

[0105] The first additional bump 240 may be disposed in the first row and may be disposed adjacent to the first outermost bump 2210B. The first additional bump 240 may be disposed between one short side of the driving chip 210 and the first output bump 221 .

[0106] The first additional bump 240 and the second additional bump 250 may be driving bumps for outputting driving signals for driving the display unit 130 , respectively.

[0107] The second additional bump 250 may be disposed in the second row and may be disposed adjacent to the second outermost bump 2220B. The second additional bump 250 may be disposed between one short side of the driving chip 210 and the second output bump 222 .

[0108] When the plurality of first output bumps 221, the plurality of second output bumps 222, and the plurality of third output bumps 223 each include n bumps, the total number of the arranged bumps increases from the third row toward the first row. That is, the total number of bumps arranged in the first row is equal to the sum of the number (n) of the plurality of first output bumps 221 and the number of the first additional bumps 240, and the total number of bumps arranged in the second row is equal to the sum of the number (n) of the plurality of second output bumps 222 and the number of the second additional bumps 250. In some embodiments, four first additional bumps 240 may be provided, and two second additional bumps 250 may be provided. In this case, the total number of bumps arranged in the first row is n+4, the total number of bumps arranged in the second row is n+2, and the total number of bumps arranged in the third row is n.

[0109] The first additional bump 240 and the second additional bump 250 may be arranged on the same row as the third outermost bump 2230B, or may be arranged inward from the third outermost bump 2230B.

[0110] The bumps disposed at the outer sides of the first additional bump 240, the second additional bump 250, and the third outermost bump 2230B may be arranged in parallel with the reference line VL. That is, the bumps disposed at the outermost sides of the first additional bump 240 and the second additional bump 250 may be substantially aligned with the third outermost bump 2230B along the second direction DR2. In other words, each of the distance from one short side of the driving chip 210 to the first additional bump 240 and the distance from one short side thereof to the second additional bump 250 may be substantially equal to the distance d3 from one short side thereof to the third outermost bump 2230B.

[0111] The first additional bump 240 and the second additional bump 250 can compensate for the step difference caused by the distance d1 from one short side of the driving chip 210 to the first outermost bump 2210B and the distance d2 from the short side of the driving chip 210 to the second outermost bump 2220B, respectively. Figure 6 and Figure 7 Describe its details.

[0112] Figure 6 is along Figure 1 A cross-sectional view taken along line V-V' in FIG. 1 schematically illustrates the process of mounting the driving circuit. Figure 7 is a cross-sectional view for explaining a process of mounting a driving circuit when an additional bump is omitted.

[0113] Reference Figure 6 and Figure 7 , each of the bumps of the driving circuit 200 may be electrically connected to each of the pads of the flexible base layer 110 in a one-to-one correspondence.

[0114] A plurality of pads corresponding to respective bumps of the driving circuit 200 may be disposed on the second region 110B of the flexible base layer 110 .

[0115] In some embodiments, the plurality of bumps may be electrically connected to the plurality of pads in a one-to-one correspondence. In particular, the second output pad 172 corresponding to the second output bump 222 and the second additional pad 175 corresponding to the second additional bump 250 may be disposed on the second region 110B of the flexible base layer 110. Although not shown in the figure, the plurality of first output pads corresponding to the plurality of first output pads 221, the plurality of first additional pads corresponding to the plurality of first additional bumps 240, and the plurality of third output pads corresponding to the plurality of third output bumps 223 may be disposed on the second region 110B of the flexible base layer 110.

[0116] The driving circuit 200 may be mounted on the flexible base layer 110 by a pressing and heating process. In particular, the driving circuit 200 may be mounted on the flexible base layer 110 by applying pressure and heat to the driving chip 210. Since the flexible base layer 110 has high flexibility as described above, the flexible base layer 110 can be easily bent by externally applied pressure.

[0117] In the case where the first output bump 221 and the second output bump 222 are relatively inwardly disposed relative to the third output bump 223, the position where the pressure is applied to the flexible base layer 110 is greatly spaced apart from the end of the second region 110B, so that a large portion of the second region 110B is bent, as shown in FIG. Figure 7 As shown. The bent second region 110B is restored to its original flat shape by the restoring force. In this case, other layers (eg, the display unit 130 and the encapsulation unit 150) disposed on the flexible base layer 110 may be separated from the flexible base layer 110.

[0118] On the contrary, Figure 6 As shown, when the second additional bump 250 is disposed adjacent to one end of the driving chip 210 , pressure is dispersed to an area adjacent to the end of the second area 110B, so that the flexible base layer 110 can be prevented from being bent.

[0119] Although the second row in which the second output bumps 222 are disposed is described with reference to Figure 6 and Figure 7However, even in the first row in which the first output bump 221 is disposed, similar to the second row, the flexible base layer 110 can be prevented from being bent by the provision of the first additional bump 240 .

[0120] In this way, other layers can be prevented from being separated from the flexible base layer 110 , so that the durability and reliability of the display device 1 can be improved.

[0121] Hereinafter, display devices according to other embodiments will be described. In the following embodiments, descriptions of configurations identical to those of the previously described embodiments will be omitted or simplified, and differences will be mainly described.

[0122] Figure 8 is a cross-sectional view of a display device according to another embodiment.

[0123] Reference Figure 8 , the second additional bump 250_2 of the driving circuit 200_2 installed in the display device 2 may be a dummy bump. The second additional bump 250 of the driving circuit 200 of the display device 1 is a driving bump that outputs a driving signal, while the second additional bump 250_2 may be a dummy bump that does not output a separate signal.

[0124] Although not shown in the figure, the first additional bump of the driving circuit 200_2 may also be a dummy bump. That is, both the first additional bump and the second additional bump 250_2 may be dummy bumps. However, the inventive concept is not limited thereto. The first additional bump may be a driving bump, and the second additional bump 250_2 may be a dummy bump.

[0125] Fig. 9 is a cross-sectional view of a display device according to another embodiment.

[0126] Reference Fig. 9 , the second additional bump 250_3 of the driving circuit 200_3 mounted in the display device 3 may be a dummy bump, and the pad corresponding to the second additional bump 250_3 may be omitted.

[0127] Since the thickness of the pad provided on the second region 110B_3 is thinner than the thickness of the second additional bump 250_3, even if the pad is omitted, the flexible base layer 110_3 can be sufficiently prevented from being bent only by the second additional bump 250_3. In particular, when the drive circuit 200_3 is mounted, the second region 110B_3 of the flexible base layer 110_3 is bent by the step difference between the lower surface of the drive chip 210_3 and the upper surface of the second region 110B_3. In this case, the thickness of the second additional bump 250_3 is thick enough to compensate for the step difference between the drive chip 210_3 and the second region 110B_3, so that even if the pad is omitted, the second region 110B_3 can be prevented from being bent when the drive circuit 200_3 is mounted.

[0128] Fig.10 is a cross-sectional view of a display device according to another embodiment.

[0129] Reference Fig.10 , the thickness h1 of the second output bump 222_4 of the driving circuit 200_4 mounted in the display device 4 may be different from the thickness h2 of the second additional bump 250_4 thereof.

[0130] The thickness h2 of the second additional bump 250_4 may be thicker than the thickness h1 of the second output bump 222_4 .

[0131] As the thickness h2 of the second additional bump 250_4 increases, the distance between the lower surface of the second additional bump 250_4 and the upper surface of the second region 110B_4 decreases. In this case, even if pressure is applied during the process of mounting the driving circuit 200_4, the pressure can be dispersed to the end of the second region 110B_4 through the second additional bump 250_4 to compensate for the bending of the second region 110B_4.

[0132] Fig.11 is a plan view showing a layout of a bump unit of a driving circuit according to another embodiment.

[0133] Reference Fig.11 , in the driving circuit 200_5 , the second additional bumps 250_5 in the second row may be arranged inwardly relative to the outermost bumps of the first additional bumps 240_5 .

[0134] Fig.11 The driving circuit 200_5 and Figure 4 The driving circuit 200 is different in that Figure 4 In the driving circuit 200 of FIG. 1 , the distance from one end of the driving chip 210 to the outermost first additional bump 240, the distance from one end thereof to the second additional bump 250, and the distance from one end thereof to the third outermost bump 2230B are the same as each other, while Fig.11In the driving chip 200_5 , the distance from one end of the driving chip 210_5 to the outermost bump of the first additional bump 240_5 , the distance from one end thereof to the second additional bump 250_5 , and the distance from one end thereof to the third outermost bump 2230B_5 are different from each other.

[0135] The leftmost side of the second additional bump 250_5 may be spaced apart from the leftmost side of the third outermost bump 2230B_5 by a distance p in the first direction DR1 of about 30 μm or less.

[0136] Although the outermost bump of the first additional bump 240_5 is shown to be substantially aligned with the third outermost bump 2230B_5 along the second direction DR2 in the drawing, the inventive concept is not limited thereto, and the first additional bump 240_5 may also be spaced apart from the third outermost bump 2230B_5 in the first direction DR1. Even in this case, similar to the distance p between the second additional bump 250_5 and the third outermost bump 2230B_5, the distance p by which the first additional bump 240_5 is spaced apart from the third outermost bump 2230B_5 in the first direction DR1 may be 30 μm or less.

[0137] In other words, differences in the shortest distances from one end of the driving chip 210_5 to the first additional bump 240_5, the shortest distance from one end thereof to the second additional bump 250_5, and the shortest distance from one end thereof to the third end output bump 223_5 may be about 30 μm or less, respectively.

[0138] For example, the shortest distance from one end of the driving chip 210_5 to the first additional bump 240_5 may be approximately 30 μm shorter than the shortest distance from one end thereof to the second additional bump 250_5 .

[0139] The outermost bumps in the first, second and third rows, i.e., Fig.11 In this case, the outermost bumps of the first additional bump 240_5, the second additional bump 250_5, and the third outermost bump 2230B_5 may be substantially aligned along the second direction DR2, and the distance between the respective bumps may be about 30 μm or less.

[0140] When each distance among the outermost bumps in the first direction DR1 is about 30 μm or greater, since the distances from one end of the driving chip 210_5 to the bumps are different from each other, the pressure applied to the flexible base layer 110 when mounting the driving circuit 200_5 is different relative to each part, so that the flexible base layer 110 can be bent and lifted.

[0141] The layout slopes α′ and β′ of the plurality of first output bumps 221_5, the plurality of second output bumps 222_5, and the plurality of third output bumps 223_5 in the driving circuit 200_5 may be greater than Figure 4 Layout slopes α and β of the plurality of first output bumps 221 , the plurality of second output bumps 222 , and the plurality of third output bumps 223 in the driving circuit 200 .

[0142] When the layout slopes α' and β' of the respective bumps 221_5, 222_5, and 223_5 increase, the length of the portion in which the output bumps are arranged increases from the first row toward the third row. Therefore, the difference between the shortest distance from one end of the driver chip 210_5 to the first output bump 221_5 and the shortest distance from one end thereof to the second output bump 222_5 may increase. The number of the first additional bumps 240_5 disposed between one end of the driver chip 210_5 and the first output bump 221_5 may be greater than Figure 4 For example, the number of the first additional bumps 240_5 may be three. However, the inventive concept is not limited thereto, and the number of the first additional bumps 240_5 may be set to two, and the first additional bumps 240_5 may be arranged such that the distance therebetween increases.

[0143] Fig.12 is a plan view showing a layout of a bump unit of a driving circuit according to still another embodiment.

[0144] Reference Fig.12 , the driving circuit 200_6 and Figure 4 The driving circuit 200_6 is different from the driving circuit 200_6 in that the layout angles of the plurality of first output bumps 221_6, the plurality of second output bumps 222_6 and the plurality of second output bumps 223_6 in the driving circuit 200_6 are respectively obtuse angles with respect to the reference line VL.

[0145] In particular, the plurality of first output bumps 221_6 arranged at the left side of the first reference bump 221VB_6 are arranged at an obtuse angle in the clockwise direction relative to the reference line VL, and the plurality of first output bumps 221_6 arranged at the right side of the first reference bump 221VB_6 are arranged at an obtuse angle in the counterclockwise direction relative to the reference line VL.

[0146] The plurality of second output bumps 222_6 and the plurality of third output bumps 223_6 may also be arranged in the same manner as the first output bump 221_6 .

[0147] The length of the portion in which the plurality of output bumps 221_6, 222_6, and 223_6 are arranged may decrease from the first row toward the third row. That is, the shortest distance from one end of the driving chip 210_6 to each of the output bumps 221_6, 222_6, and 223_6 may increase from the first row toward the third row.

[0148] The third additional bump 260_6 and the fourth additional bump 270_6 may be disposed in the second row and the third row, respectively.

[0149] The third additional bump 260_6 may be disposed between one end of the driving chip 210_6 and the second output bump 222_6, and the fourth additional bump 270_6 may be disposed between one end of the driving chip 210_6 and the third output bump 223_6.

[0150] A total number of the plurality of bumps arranged in each row may increase from the first row toward the third row.

[0151] Distances from one end of the driving chip 210_6 to the bumps disposed at the outermost sides of each row may be substantially the same as each other.

[0152] Fig.13 is a plan view showing a layout of a bump unit of a driving circuit according to still another embodiment.

[0153] Reference Fig.13 , the driving circuit 200_7 may include a fifth additional bump 280_7 disposed adjacent to the input bump unit 230_7.

[0154] The fifth additional bump 280_7 may be disposed adjacent to both ends of the driving chip 210_7 , and in particular, between both ends of the driving chip 210_7 and the input bump unit 230_7 .

[0155] The fifth additional bump 280_7 may reduce the distance from the end of the flexible base layer 110 to the bump and disperse the pressure applied to the second region 110B during mounting of the driving circuit 200_7 , thereby preventing the second region 110B from being bent.

[0156] As described above, according to the embodiments of the inventive concept, a display device having improved durability and reliability can be provided.

[0157] The effects of the inventive concept are not limited to the foregoing, and other various effects are expected herein.

[0158] Although the preferred embodiments of the inventive concept have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the inventive concept as disclosed in the accompanying claims.

Claims

1. A display device, include: a substrate comprising a first region and a second region different from the first region; a display unit, the display unit being disposed on the first area and comprising a light emitting element; A pad portion, the pad portion is disposed on the second area, the pad portion includes a first pad array arranged in a first row and a second pad array arranged in a second row, the first row and the second row extending along a first direction; as well as a driving circuit disposed on the second region and electrically connected to the pad portion, The first pad array includes a plurality of first output pads and a plurality of first additional pads arranged outwardly relative to the plurality of first output pads. The second pad array includes a plurality of second output pads and a plurality of second additional pads arranged outwardly relative to the plurality of second output pads. wherein the number of the plurality of first additional pads in the first row is greater than the number of the plurality of second additional pads in the second row, and The outermost first additional pads among the plurality of first additional pads are substantially aligned with the outermost second additional pads among the plurality of second additional pads along a second direction perpendicular to the first direction.

2. The display device according to claim 1, in, The number of the plurality of first output pads in the first row is the same as the number of the plurality of second output pads in the second row.

3. The display device according to claim 2, in, The plurality of first output pads and the plurality of second output pads are configured to receive a driving signal for driving the display unit.

4. A display device, include: a substrate comprising a first region and a second region different from the first region; a display unit, the display unit being disposed on the first area and comprising a light emitting element; A pad portion, the pad portion is disposed on the second area, the pad portion includes a first pad array arranged in a first row and a second pad array arranged in a second row, the first row and the second row extending along a first direction; as well as a driving circuit disposed on the second region and electrically connected to the pad portion, The first pad array includes a plurality of first output pads and a plurality of first additional pads arranged outwardly relative to the plurality of first output pads. The second pad array includes a plurality of second output pads and a plurality of second additional pads arranged outwardly relative to the plurality of second output pads. wherein the sum of the number of the plurality of first output pads and the number of the plurality of first additional pads in the first row is greater than the sum of the number of the plurality of second output pads and the number of the plurality of second additional pads in the second row, and The outermost first additional pads among the plurality of first additional pads are substantially aligned with the outermost second additional pads among the plurality of second additional pads along a second direction perpendicular to the first direction.

5. The display device according to claim 4, in, The number of the plurality of first output pads in the first row is the same as the number of the plurality of second output pads in the second row.

6. A display device, include: a flexible base layer comprising a first region and a second region different from the first region; a display unit, the display unit being disposed on a surface of the first area and comprising a light emitting element; as well as a driving circuit disposed on the second area and including a plurality of first bumps arranged in a first row and a plurality of second bumps arranged in a second row, wherein the number of the plurality of first bumps is greater than the number of the plurality of second bumps, The plurality of first bumps include a plurality of first output bumps and a plurality of first additional bumps disposed outwardly relative to the plurality of first output bumps, The plurality of second bumps include a plurality of second output bumps and a plurality of second additional bumps disposed outwardly relative to the plurality of second output bumps, The first reference bumps and the second reference bumps respectively disposed at the centers of the plurality of first bumps and the plurality of second bumps are disposed along a reference line defined in a column direction perpendicularly intersecting the row direction, The remaining first bumps of the plurality of first bumps except the first reference bump and the remaining second bumps of the plurality of second bumps except the second reference bump are inclined relative to the reference line, and A first bump disposed at an outermost side of the plurality of first bumps is substantially aligned with a second bump disposed at an outermost side of the plurality of second bumps in a direction parallel to the reference line.

7. The display device according to claim 6, in, The plurality of first bumps are disposed adjacent to the display unit relative to the plurality of second bumps.

8. The display device according to claim 7, in, The shortest distance from an end of the flexible base layer to the first bump is equal to the shortest distance from the end of the flexible base layer to the second bump.

9. The display device according to claim 6, in, A difference between a shortest distance from an end of the flexible base layer to the first bump and a shortest distance from the end of the flexible base layer to the second bump is 30 micrometers or less.

10. The display device according to claim 6, in, The plurality of second bumps are disposed adjacent to the display unit with respect to the plurality of first bumps.

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