Electronic devices and their external panels

Abstract

An electronic device includes: a device body having a first outer surface facing a first direction and a first side surface facing a second direction orthogonal to the first direction; and a first outer panel that is at least partially curved, wherein the first outer panel covers and is attached to the first outer surface, and the first outer panel has a first protrusion at an end of the first outer panel that extends beyond the first side surface.

Description

[0001] This application is a divisional application of the invention patent application filed on March 18, 2021, with application number 202110293587.X and title "Electronic Device and External Panel Thereof".

[0002] Cross-reference to related applications

[0003] This application claims the benefit of Japanese priority patent application JP2020-059187, filed on March 27, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0004] This disclosure relates to external components of electronic devices. Background Technology

[0005] PCT patent publication WO2014 / 185311 discloses an electronic device used as a game console. The electronic device has an upper cover and a lower cover as external components, the upper cover covering the upper side of internal components such as circuit boards, power supply units and heat sinks, and the lower cover covering the lower side of the internal components. Summary of the Invention

[0006] Electronic devices preferably maintain their aesthetic appearance over a long period of time. For example, when the electronic device is placed vertically, the side surfaces of the device body are preferably properly protected.

[0007] An electronic device according to an embodiment of this disclosure includes: a device body having a first outer surface facing a first direction and a first side surface facing a second direction orthogonal to the first direction; and a first outer panel that is at least partially curved. The first outer panel covers and is attached to the first outer surface. The first outer panel has a first protrusion at an end that extends beyond the first side surface. According to this electronic device, when the electronic device is positioned such that the first side surface is below, the device body can be protected by the outer panel.

[0008] According to another embodiment of this disclosure, the outer panel is attached to a housing and disposed relative to the housing along a first direction. The housing has a first outer surface facing the first direction and a first side surface facing a second direction orthogonal to the first direction. The outer panel is at least partially curved and includes a plurality of attachment target portions, which are individually attached to a plurality of attachment portions formed in the first outer surface of the housing. At an end of the outer panel, a first protrusion extends beyond the position of the first side surface. According to this outer panel, when the electronic device is positioned such that the first side surface is below, the device body can be protected by the outer panel. Attached Figure Description

[0009] Figure 1AThis is a perspective view illustrating an example of an electronic device according to an embodiment of the present disclosure;

[0010] Figure 1B It is a perspective view showing an electronic device;

[0011] Figure 1C This is a front view showing the electronic device;

[0012] Figure 1D It is a plan view showing the electronic equipment;

[0013] Figure 1E This is a right-side view of the electronic device;

[0014] Figure 1F This is a left-side view of the electronic device;

[0015] Figure 1G This is a rear view showing the electronic device;

[0016] Figure 1H It is a bottom view showing the electronic device;

[0017] Figure 2A It is an exploded perspective view showing the main body of the device, including the electronic device, and the upper and lower external panels in a disassembled state;

[0018] Figure 2B It is an exploded perspective view showing the main body of the device, including the electronic device, and the upper and lower external panels in a disassembled state;

[0019] Figure 3 This is an exploded perspective view showing the internal components of an electronic device;

[0020] Figure 4 It is an exploded perspective view of the housing and front cover included in the main body of the device;

[0021] Figure 5 This is a perspective view showing the interior of the upper shell component;

[0022] Figure 6A It is a plan view of the main body of the equipment;

[0023] Figure 6B It is a plan view showing the positional relationship between the airflow channels and the components formed on the upper side of the circuit board;

[0024] Figure 7A This is a sectional view of the main body of the equipment. Figure 6B Obtained from the cutting plane represented by line VIIa-VIIa;

[0025] Figure 7B This is a sectional view of the main body of the equipment. Figure 6BObtained from the cutting plane represented by line VIIb-VIIb;

[0026] Figure 7C This is a sectional view of the main body of the equipment. Figure 6B Obtained from the cutting plane represented by line VI1c-VI1c;

[0027] Figure 8A This is a bottom view of the main body of the equipment;

[0028] Figure 8B It is a bottom view showing the positional relationship between the airflow channel and the components formed on the underside of the circuit board;

[0029] Figure 9 This is a sectional view of the main body of the equipment, which is constructed by... Figure 7A The line IX-IX in the diagram represents the cutting plane obtained;

[0030] Figure 10A It is a plan view of the fan shroud;

[0031] Figure 10B This is a cross-sectional view of the fan shroud and cooling fan, the cross-sectional view being composed of... Figure 10A The line Xb-Xb in the diagram represents;

[0032] Figure 11A This is a perspective view of the power supply unit;

[0033] Figure 11B It is a cross-sectional view of the air intake wall and side walls;

[0034] Figure 12 This is a sectional view of the main body of the equipment, which is constructed by... Figure 6B The line XII-XII in the diagram represents the cutting plane obtained;

[0035] Figure 13A This is a plan view of a heat dissipation device mounted on the upper side of the circuit board. Figure 3 As shown in the image;

[0036] Figure 13B yes Figure 13A The heat dissipation device shown is a bottom view, in which the substrate supporting the fins is omitted;

[0037] Figure 14A This is a cross-sectional view of the heat dissipation device and the circuit board. Figure 13A The line XIVa-XIVa in the diagram represents the cutting plane obtained;

[0038] Figure 14B This is a cross-sectional view of the heat dissipation device, which is constructed by... Figure 13A The line XIVb-XIVb in the diagram represents the cutting plane obtained;

[0039] Figure 14C This is a cross-sectional view of the heat dissipation device and the circuit board. Figure 13B The line XIVc-XIVc in the diagram represents the cutting plane obtained;

[0040] Figure 15 This is a view showing the lower surface of the circuit board;

[0041] Figure 16A This is a cross-sectional view of the circuit board and its shielding, which is composed of... Figure 15 The lines XVIa-XVIa in the diagram indicate and show the side surface of the heat dissipation device;

[0042] Figure 16B This is a schematic diagram (plan view) of the heat dissipation device as viewed from the side of the circuit board;

[0043] Figure 17A This is a schematic diagram (plan view) of the modified heat dissipation device as viewed from the circuit board side;

[0044] Figure 17B It is by Figure 17A The sectional view obtained in the cutting plane indicated by line XVIIb-XVIIb in the diagram;

[0045] Figure 17C It is based on the side view of the modified heat dissipation device;

[0046] Figure 18A It is by Figure 8A The sectional view obtained from the cutting plane indicated by lines XVIIIa-XVIIIa in the diagram;

[0047] Figure 18B It is by Figure 18A The sectional view obtained by the cutting plane is represented by line XVIII b-XVIII in the diagram;

[0048] Figure 18C It is by Figure 18A The line XVIIIc-XVIIIc in the diagram represents the cross-sectional view obtained in the cutting plane;

[0049] Figure 19 This is a floor plan showing the memory housing, in which the plate shielding is depicted;

[0050] Figure 20A This is a sectional view of the outer panel and housing, which is constructed by... Figure 1D The line XXa-XXa in the diagram represents the cutting plane obtained from it;

[0051] Figure 20B This is a sectional view of the outer panel and housing, which is constructed by... Figure 1DThe line XXb-XXb in the figure represents the cutting plane obtained;

[0052] Figure 21A This is a cross-sectional view of the external panel and housing of an electronic device excluding the optical disc drive, wherein the cutting plane of the cross-section is perpendicular to the plane formed by... Figure 1D The lines XXa-XXa in the diagram represent the same cutting plane;

[0053] Figure 21B yes Figure 21A The cross-sectional view shown is of the outer panel and housing, wherein the cutting plane of the cross-section is perpendicular to... Figure 1D The cutting planes shown by the midline XXb-XXb are the same;

[0054] Figure 21C yes Figure 21A The front view of the electronic device shown;

[0055] Figure 22 This is a sectional view of the upper outer panel and the upper shell component, which is a sectional view constructed from the material of the upper outer panel and the upper shell component. Figure 1D The line XX-XX in the diagram represents the cutting plane obtained from it;

[0056] Figure 23 This is a schematic diagram to help explain the attachment structure between the upper outer panel and the upper shell component;

[0057] Figure 24 This is a perspective view that helps explain the modifications to the attachment structure of the upper outer panel and the upper shell component;

[0058] Figure 25 This is a cross-sectional view of an electronic device, which is constructed by... Figure 1C The line XXV-XXV in the diagram represents the cutting plane obtained from it;

[0059] Figure 26A It is a floor plan, showing Figure 13A Modifications to the heat dissipation device shown;

[0060] Figure 26B yes Figure 26A The diagram shows a side view of the heat dissipation device, and is a view of the heat dissipation device viewed in the direction indicated by arrow XXVIb in the diagram;

[0061] Figure 26C yes Figure 26A The plan view of the heat dissipation device shown is provided, but the heat sink is omitted; and

[0062] Figure 27 It includes Figure 26A A plan view of the main body of the heat dissipation device shown. Detailed Implementation

[0063] Embodiments of this disclosure will now be described with reference to the accompanying drawings. Figures 1A to 1H Electronic device 1 is shown as an example of an embodiment. In the following description, Figures 1A to 1H X1 and X2 are shown as rightward and leftward directions, respectively; Y1 and Y2 are shown as forward and backward directions, respectively; and Z1 and Z2 are shown as upward and downward directions, respectively. However, these directions are defined to describe the shape, relative positional relationships, and movement of the components (parts, components, and sections) of electronic device 1, and do not limit the posture of electronic device 1 during use. For example, although... Figure 1A The image shows an electronic device 1 in a horizontal position, but in use, the electronic device 1 can be in a vertical position. ("Vertical position" means that the right or left surface of the electronic device 1 is facing down.)

[0064] Electronic device 1 is, for example, an entertainment device used as a gaming device or audiovisual device. Electronic device 1 outputs to a display device such as a television display data generated by executing a game program, video and audio data obtained via a network, and video and audio data obtained from a recording medium such as an optical disc. This electronic device may, for example, be a personal computer.

[0065] [Standard Configuration]

[0066] like Figure 2A As shown, the electronic device 1 includes a device body 10, an upper external panel 20A covering the upper side of the device body 10, and a lower external panel 20B covering the lower side of the device body 10. Figure 3 As shown, the device body 10 includes a circuit board 50, internal components such as a heat dissipation device 70, and a housing 30 that houses the internal components. The housing 30 includes an upper housing member 30A covering the upper side of the circuit board 50 and a lower housing member 30B covering the lower side of the circuit board 50. These housings are joined together vertically. The upper housing member 30A forms the upper surface of the device body 10. The lower housing member 30B forms the lower surface of the device body 10. The upper outer panel 20A can be detached from the upper housing member 30A. The lower outer panel 20B can be detached from the lower housing member 30B. The outer panels 20A and 20B, as well as the housing members 30A and 30B, comprise resins such as acrylonitrile-butadiene-styrene (ABS) resin or polycarbonate.

[0067] like Figure 1A As shown, the device body 10 may have a power button 2a and a CD eject button 2b on its front surface. The device body 10 may also have connectors 3a and 3b on its front surface. Furthermore, the device body 10 may have connectors 4a to 4e on its rear surface (see...). Figure 1G ).

[0068] like Figure 3 As shown, in addition to the circuit board 50 and the power supply unit 60, the main body 10 of the device also includes a cooling fan 5, a heat dissipation device 70, and an optical disc drive 6 as internal components. As described below, the heat dissipation device 70 includes heat sinks 71 and 72 (see...). Figure 6B ) and heat pipes 73A to 73F (see Figure 13B The upper surface of circuit board 50 is covered by an upper shield 51, which blocks electromagnetic waves from electronic components mounted on the upper surface. The lower surface of circuit board 50 is covered by a lower shield 52, which blocks electromagnetic waves from electronic components mounted on the lower surface. Shields 51 and 52 are attached to the upper and lower surfaces of circuit board 50, respectively. Shields 51 and 52 are metal plates. The material of the metal plates can be, for example, iron, stainless steel, aluminum, etc.

[0069] [Component Layout Overview]

[0070] The power supply unit 60 and the heat dissipation device 70 are, for example, disposed on the upper side of the circuit board 50 (more specifically, on the upper side of the upper shield 51). The integrated circuit 50a, used as a central processing unit (CPU), graphics processing unit (GPU), etc. (see...) Figure 3 The integrated circuit 50a is mounted on the upper surface of the circuit board 50. It is a heat-generating device and is connected to the heat sink 70. The power supply unit 60 is also a heat-generating device. Airflow generated by the cooling fan 5 is supplied to the heat sink 70 and the power supply unit 60. The layout of internal devices such as the heat sink 70, the power supply unit 60, and the cooling fan 5 is not limited to the example of the electronic device 1.

[0071] The optical disc drive 6 is, for example, located on the underside of the circuit board 50 (more specifically, on the underside of the lower shield 52). A heat sink 80 (see...) Figure 7A The circuit board 50 can be positioned on its underside. Electronic components (e.g., power transistors that generate drive power for integrated circuit 50a) are mounted on the underside of the circuit board 50. A heat sink 80 can be connected to these electronic components.

[0072] [Cooling Fan]

[0073] like Figure 7AAs shown, the cooling fan 5 is configured such that its rotation center line Cf is along the thickness direction of the circuit board 50 (the vertical direction in the electronic device 1). Furthermore, the cooling fan 5 is located on the outer side of the outer edge of the circuit board 50. For example, the cooling fan 5 is located on the right side of the right edge of the circuit board 50. In this description, the vertical direction of the electronic device 1 is along the normal to the circuit board 50. Furthermore, the directions mentioned in this specification do not limit the orientation of the electronic device 1 during use. Therefore, when the electronic device 1 is positioned vertically, for example, the rotation center line Cf of the cooling fan 5 is a line along the horizontal direction.

[0074] The cooling fan 5 may have a portion located above the horizontal plane Hp1 including the circuit board 50 and a portion located below the horizontal plane Hp1 including the circuit board 50. More specifically, the plurality of fins 5a rotating about the rotation center line Cf may each have a portion 5b located above the horizontal plane Hp1 and a portion 5c located below the horizontal plane Hp1. This arrangement of the cooling fan 5 can generate an airflow F1 along the upper surface of the circuit board 50 and an airflow F2 along the lower surface of the circuit board 50. Therefore, heat-generating devices arranged or mounted on the upper side of the circuit board 50 and heat-generating devices arranged or mounted on the lower side of the circuit board 50 can be cooled without increasing the number of components.

[0075] like Figure 2A As shown, the upper housing component 30A has an upper inlet 31a located above the cooling fan 5. (As indicated...) Figure 2B As shown, the lower housing member 30B has a lower inlet 31b located below the cooling fan 5. By forming inlets 31a and 31b in the upper and lower surfaces of the housing 30 respectively, air can be effectively drawn into the interior of the housing 30.

[0076] The heat generated by the heating devices arranged on the upper surface of the circuit board 50 can be greater than the heat generated by the heating devices arranged on the lower surface of the circuit board 50. For example, the total heat generated by the integrated circuit 50a and the power supply unit 60 arranged on the upper surface of the circuit board 50 can be greater than the total heat generated by the electronic components 50c (e.g., power transistors and integrated circuits, such as memory) arranged on the lower surface of the circuit board 50. When the heating devices are arranged in this way, the center Ch of the cooling fan 5 in the vertical direction can be located above the horizontal plane Hp1 including the circuit board 50, as shown below. Figure 7A As shown. This allows a large amount of air to be supplied to the device that generates a large amount of heat.

[0077] like Figure 7AAs shown, the distance D5 between the upper inlet 31a and the lower inlet 31b corresponds to the width of the cooling fan 5 in the vertical direction. Therefore, air is drawn in from inlets 31a and 31b and flows smoothly in the radial direction of the cooling fan 5. In the example of the electronic device 1, the lower part of the cooling fan 5 (specifically, the substrate 5d, see...) Figure 3 It is attached to the edge of the lower inlet 31b. On the other hand, the upper end of the cooling fan 5 (specifically, the upper end of the rotor 5e) is located at approximately the same height as the edge of the inlet 31a.

[0078] The vertical distance between the upper shell member 30A and the lower shell member 30B at the locations of inlets 31a and 31b, i.e., the distance D5 between inlets 31a and 31b (see...) Figure 7A The distance between the upper housing member 30A and the lower housing member 30B at other locations can be smaller than the distance between them at other locations. In the example of the electronic device 1, the upper housing member 30A has a recessed plate portion 32a in its upper surface (see...). Figure 2A The recessed plate portion 32a is recessed into the circuit board 50 side relative to another portion 32c in the upper surface. (In this description, the other portion 32c will be referred to as the "main board portion".) An upper inlet 31a is formed in the recessed plate portion 32a. A heat dissipation device 70, a power supply unit 60, etc., are arranged between the main board portion 32c and the circuit board 50.

[0079] Similar to the upper shell member 30A, the lower shell member 30B has a recessed plate portion 32b in its lower surface. Figure 2B As shown, the recessed plate portion 32b is recessed relative to another portion 32d in the lower surface. (In this description, the other portion 32d will be referred to as the "main plate portion".) The lower inlet 31b is formed in the recessed plate portion 32b. The fins 81 of the heat dissipation device 80 (see...) Figure 8A and Figure 8B It is positioned between the main board section 32d and the circuit board 50.

[0080] Then, the distance between the upper and lower recessed plate portions 32a and 32b corresponds to the height of the cooling fan 5. This structure ensures sufficient distance between the upper and lower motherboard portions 32c and 32d, and sufficient space for the heat dissipation devices 70 and 80 arranged between the upper and lower motherboard portions 32c and 32d, while also ensuring that the distance between the inlets 31a and 31b corresponds to the height of the cooling fan 5.

[0081] like Figure 3 As shown, the cooling fan 5 includes a rotor 5e with multiple fins 5a and a base plate 5d supporting the rotor 5e. The rotor 5e is rotatable relative to the base plate 5d. Figure 8BAs shown, the substrate 5d may, for example, have an annular peripheral portion 5f, a central portion 5g located inside the peripheral portion 5f, and a bridge 5i connecting the peripheral portion 5f and the central portion 5g to each other. This substrate 5d can be attached to the lower housing member 30B. Specifically, the annular peripheral portion 5f can be attached to the edge of the lower inlet 31b.

[0082] Because the substrate 5d is located below the cooling fan 5, the air resistance at the top of the cooling fan 5 is less than the air resistance at the bottom. As described above, the heat generated by the heating device arranged on the upper surface of the circuit board 50 is greater than the heat generated by the heating device arranged on the lower surface of the circuit board 50. That is, the cooling fan 5 is configured such that the upper part of the cooling fan 5 with low air resistance corresponds to a flow channel in which a device that generates a large amount of heat is arranged.

[0083] Circuit board 50 may have a curved edge 50b (see) Figure 15 The right edge of the circuit board 50 is located at the curved edge 50b. A cooling fan 5 is positioned inside the curved edge 50b. This arrangement of the circuit board 50 and the cooling fan 5 allows airflow to be generated on both the upper and lower surfaces of the circuit board 50, while simultaneously suppressing any increase in the size of the electronic device 1.

[0084] [Positioning relationship between cooling fan and heatsink]

[0085] The power supply unit 60 and the heat dissipation device 70 can be arranged side by side in the left-right direction. For example, as Figure 6B As shown, the first heat sink 71 is located on the right side of the power supply unit 60. The cooling fan 5 can be configured such that the centerline Cf of the cooling fan 5 is located to the right of the right end of the first heat sink 71. In the example of the electronic device 1, the entire cooling fan 5 is located to the right of the right end of the first heat sink 71. According to this arrangement, even if the front-rear dimension of the first heat sink 71 increases, the first heat sink 71 and the cooling fan 5 will not interfere with each other. Therefore, the increase in the front-rear dimension of the entire electronic device 1 can be suppressed while ensuring sufficient size of the first heat sink 71 in the front-rear direction. In the description here, the front-rear direction of the heat sink 71 is the direction in which air passes through the heat sink 71. The left-right direction is the direction orthogonal to the direction in which air passes through the heat sink 71. Furthermore, the directions mentioned in this specification do not limit the orientation of the electronic device 1 during use. Therefore, for example, the power supply unit 60 and the heat sink 70 can be arranged adjacent to each other in the front-rear direction, and the cooling fan 5 and the heat sink 71 can also be arranged adjacent to each other in the front-rear direction. In this case, the size of the heat sink 71 in the left-right direction can be increased.

[0086] like Figure 6BAs shown, the cooling fan 5 is located behind the front end 61n of the power supply unit housing 61, which will be described later. Furthermore, the centerline Cf of the cooling fan 5 is located behind the front end of the first heatsink 71.

[0087] like Figure 6B As shown, the second radiator 72 (heat dissipation device) can be located to the right of the first radiator 71. Then, at least a portion of the cooling fan 5 can be located in front of the second radiator 72. With this arrangement of the cooling fan 5 and the second radiator 72, the air flowing backward from the cooling fan 5 can also be used effectively.

[0088] like Figure 6B As shown, the width of the second heat sink 72 in the front-to-back direction can be smaller than the width of the first heat sink 71 in the front-to-back direction. Then, the cooling fan 5 can be positioned in front of the second heat sink 72. With this arrangement of the heat sinks 71 and 72 and the cooling fan 5, the air flowing backward from the cooling fan 5 can be effectively utilized, while suppressing the increase in the front-to-back dimension of the electronic device 1.

[0089] As will be explained in detail later, the heat dissipation device 70 has multiple heat pipes 73A to 73F (see below). Figure 13B The two heat sinks 71 and 72 are thermally connected to each other via multiple heat pipes 73. Furthermore, the two heat sinks 71 and 72 are fixed to a common substrate 75 (see...). Figure 13A ).

[0090] Incidentally, unlike the example of electronic device 1, the first heat sink 71 and the second heat sink 72 may not be connected to each other via a heat transfer component such as a heat pipe. For example, the second heat sink 72 may be used to cool heat-generating components (e.g., electronic components) that are different from the integrated circuit 50a to which the first heat sink 71 is connected. Additionally, components located to the right of the first heat sink 71 and behind the cooling fan 5 may not be heat sink 72. For example, the heat-generating component to be cooled (e.g., electronic component) may be located behind the cooling fan 5.

[0091] [Airflow channel between the housing and the outer panel]

[0092] The upper surface of housing 30 is covered by upper outer panel 20A. A gap Ua (see [reference needed]) allows airflow to the upper inlet 31a. Figure 20A A gap Ua can be formed between the upper surface of the housing 30 and the upper outer panel 20A. (The gap Ua will be referred to as the upper flow channel below.) As described above, the upper surface of the upper housing member 30A has a recessed plate portion 32a that is recessed relative to the main plate portion 32c (see...). Figure 2AA recessed plate portion 32a is formed, for example, on the right front portion of the upper housing member 30A, and an upper inlet 31a is formed in the recessed plate portion 32a. For example, an upper flow channel Ua is fixed between the recessed plate portion 32a and the upper outer panel 20A.

[0093] The upper flow channel Ua may, for example, open towards the front and / or right side of the electronic device 1. That is, an inlet may be provided between the front edge of the upper surface of the upper housing member 30A (specifically, the front edge of the recessed plate portion 32a) and the front edge of the upper outer panel 20A, or an inlet may be provided between the right edge of the upper surface of the upper housing member 30A (specifically, the right edge of the recessed plate portion 32a) and the right edge of the upper outer panel 20A. In the example of the electronic device 1, as... Figure 1C and Figure 1E As shown, an inlet Ea is provided that extends from the upper surface of the upper housing member 30A and the front edge of the upper outer panel 20A to the right edge of the upper outer panel 20A. The inlet Ea may, for example, extend from the center of the front edge of the upper outer panel 20A in a left-right direction to the rear portion of the right edge of the upper outer panel 20A. The upper housing member 30A may have a louver 33A in the inlet Ea.

[0094] The lower surface of the housing 30 is covered by the lower outer panel 20B. The lower surface of the housing 30 and the lower outer panel 20B of the electronic device 1 may have the same structure as the housing 30 and the upper outer panel 20A described above.

[0095] In other words, airflow is allowed to the gap Ub at the lower inlet 31b (see...) Figure 20A A lower flow channel 31b can be formed between the lower surface of the housing 30 and the lower outer panel 20B. (The gap Ub will be referred to as the lower flow channel Ub below.) As described above, the lower surface of the lower housing member 30B has a recessed plate portion 32b (see FIG. 2b) that is recessed relative to the main plate portion 32d. The recessed plate portion 32b is formed, for example, at the right front portion of the lower housing member 30B, and the lower inlet 31b is formed in the recessed plate portion 32b. For example, the lower flow channel Ub is fixed between the recessed plate portion 32b and the lower outer panel 20B.

[0096] The lower flow channel Ub can also be open, for example, toward the front and / or right side of the electronic device 1. That is, the inlet can be located between the front edge of the lower surface of the lower housing member 30B (specifically, the front edge of the recessed plate portion 32b) and the front edge of the lower outer panel 20B, or the inlet can be located between the right edge of the lower surface of the lower housing member 30B (specifically, the right edge of the recessed plate portion 32b) and the right edge of the lower outer panel 20B. In the example of the electronic device 1, as... Figure 1C and Figure 1EAs shown, an inlet Eb is provided that extends from the lower surface of the lower housing member 30B and the front edge of the lower outer panel 20B to the right edge of the lower outer panel 20B. The inlet Eb may, for example, extend from the center of the front edge of the lower outer panel 20B in a left-right direction to the rear portion of the right edge of the lower outer panel 20B. The lower housing member 30B may have a louver 33B in the inlet Eb.

[0097] The portion of the upper surface of the upper housing member 30A, excluding the recessed plate portion 32a, namely the main board portion 32c, is close to the upper outer panel 20A. The main board portion 32c and the upper outer panel 20A may contact each other, or a gap may be formed between the main board portion 32c and the upper outer panel 20A, the gap having a width in the vertical direction smaller than that of the upper flow channel Ua.

[0098] The airflow generated by driving the cooling fan 5 exits from the exhaust port M formed on the rear surface of the housing 30 (see...). Figure 1G and Figure 6A Exhaust to the rear. Venetian blinds 33C and 33D can be formed in the exhaust port M. For example... Figure 2A As shown, the main board portion 32c may have a portion 32e located behind the recessed plate portion 32a. With this structure, the main board portion 32c can prevent air discharged rearward from the exhaust port M from flowing back to the inlet 31a.

[0099] The portion of the lower surface of the lower housing member 30B, excluding the recessed plate portion 32b, i.e., the main board portion 32d, is close to the lower outer panel 20B. The main board portion 32d and the lower outer panel 20B can contact each other, or a gap can be formed between them, this gap having a width in the vertical direction smaller than that of the lower flow channel Ub. Figure 2B As shown, the main board portion 32d may have a portion 32f located behind the recessed plate portion 32b. With this structure, the main board portion 32d can prevent air discharged rearward from the exhaust port M from flowing back towards the inlet 31b.

[0100] The outer surface of the electronic device 1 is curved, increasing the vertical width of the electronic device 1 in the front right portion where inlets 31a and 31b are formed. In other words, the outer panels 20A and 20B are curved, increasing the distance between them in the front right portion of the electronic device 1. This external shape of the electronic device 1 facilitates ensuring sufficient vertical width of the aforementioned flow channels Ua and Ub. The curvature of the outer panels 20A and 20B will be explained in detail later.

[0101] Incidentally, the locations of the inlets 31a and 31b formed in the housing 30, and the locations of the inlets Ea and Eb formed between the housing 30 and the outer panels 20A and 20B, are not limited to the example shown in the electronic device 1. For example, inlets 31a and 31b may be formed on the left side portion of the housing 30. Furthermore, inlets 31a and 31b may be formed only on the upper or lower surface of the housing 30. The locations of inlets Ea and Eb can be appropriately varied depending on the locations of inlets 31a and 31b.

[0102] like Figure 6A As shown, the electronic device 1 may have a fan shroud 38A, which is attached to the edge of the inlet 31a and covers the upper side of the cooling fan 5. Similarly, the electronic device 1 may have a fan shroud 38B, which is attached to the edge of the inlet 31b and covers the lower side of the cooling fan 5.

[0103] like Figure 10A As shown, the fan shroud 38A includes multiple rings 38a, a central portion 38b located at the center of the multiple rings 38a, and multiple spokes 38c extending from the outer rings 38a to the central portion 38b. In the example of the electronic device 1, the cooling fan 5 rotates clockwise in the plan view. The spokes 38c are tilted so as to be in the same direction of rotation as the cooling fan 5. Specifically, the spokes 38c are tilted relative to the radial direction so as to advance clockwise toward the center Cf. According to this structure, the spokes 38c can avoid becoming a source of air resistance.

[0104] like Figure 10B As shown, the positions of the multiple rings 38a and the central portion 38b rise towards the center Cf. Furthermore, the spokes 38c extend obliquely to rise towards the center Cf. This increases the area of ​​the opening formed between the rings 38a and the spokes 38c.

[0105] As described above, the spokes 38c extend obliquely, thus rising towards the center Cf. On the other hand, each ring 38a may have a plane along the rotation center line Cf perpendicular to the cooling fan 5. Figure 10B The cross-section of the plane Hp5 in the middle. This can increase the area of ​​the opening formed between the ring 38a and the spokes 38c. The upper outer panel 20A is disposed on the upper side of the fan shroud 38A. As mentioned above, the upper outer panel 20A is curved. The fan shroud 38A can be curved in accordance with the curvature of the upper outer panel 20A.

[0106] The fan shroud 38B covering the lower side of the cooling fan 5 can have the same structure as the upper fan shroud 38A. That is, the fan shroud 38B can be obtained by inverting the upper and lower surfaces of the fan shroud 38A.

[0107] [Power Supply Unit]

[0108] like Figure 7B As shown, the power supply unit 60 includes a power supply circuit 62 and a power supply unit housing 61 that houses the power supply circuit 62. The power supply unit housing 61 has a wall portion 61a located in front of the first heat sink 71. A plurality of air inlets 61b may be formed in the wall portion 61a. (The wall portion 61a will be referred to as the "air inlet wall" below.) Figure 6B As shown, radiators 71 and 72 have multiple fins 71a and 72a arranged side-by-side in the left-right direction. Therefore, air passes through radiators 71 and 72 in the front-back direction. An intake wall 61a is inclined relative to both the front-back and left-back directions. The outer surface of the intake wall 61a faces the first radiator 71. Here, "the outer surface of the intake wall 61a faces the first radiator 71" means that a straight line extending from and perpendicular to the outer surface intersects the first radiator 71. A cooling fan 5 is configured to deliver air to the intake wall 61a. In the example of electronic device 1, the cooling fan 5 separates to the right from the outer surface of the intake wall 61a. The airflow from the cooling fan 5 to the intake wall 61a is formed by flow channel walls 34A and 34B, which will be described later.

[0109] According to the shape and arrangement of the power supply unit housing 61, such as Figure 6B As shown, a portion of the air reaching the intake wall 61a passes through the intake port 61b and enters the interior of the power unit housing 61. Additionally, another portion of the air reaching the intake wall 61a moves to the first heat sink 71 while being guided by the intake wall 61a. In other words, the intake wall 61a ensures that the airflow supplied to the first heat sink 71 is simultaneously cooled by cold air (air not heated by another heat-generating or cooling device). When the power unit 60 can be cooled by cold air, the gap between the circuit portions 62a and 62b (e.g., transformer and capacitor) included in the power circuit 62 can be reduced, allowing for miniaturization of the power unit 60.

[0110] The power supply unit housing 61 includes a rear portion 61c located to the left of the first heat sink 71 and a front portion 61d extending forward beyond the front end of the first heat sink 71. In the example of the electronic device 1, the air intake wall 61a is the right side wall of the front portion 61d and extends forward and to the right from the right side wall 61f of the rear portion 61c. On the other hand, the left side wall 61e of the power supply unit housing 61 extends forward from the rear portion 61c to the front portion 61d in a straight line. Therefore, the width of the front portion 61d gradually increases forward in the left-right direction.

[0111] like Figure 11BAs shown, the air intake 61b can be formed at an angle relative to the air intake wall 61a. That is, the centerline Ch1 of the air intake 61b can be inclined relative to the air intake wall 61a. For example, the centerline Ch1 of the air intake 61b can be along the left-right direction. This makes it easier for the air exhausted from the cooling fan 5 to pass through the air intake wall 61a. Incidentally, the structure of the air intake 61b is not limited to the example of the electronic device 1. The centerline Ch1 of the air intake 61b can be inclined relative to the left-right and front-back directions in accordance with the airflow direction. For example, the centerline Ch1 can extend forward and to the right from the air intake wall 61a.

[0112] like Figure 11A and Figure 11B As shown, the air inlet 61m can also be formed in the right side wall 61f of the rear portion 61c of the housing. In this case, the direction in which the air inlet 61m penetrates the right side wall 61f, i.e., the direction of the centerline Ch2 of the air inlet 61m, can be the same as the direction of the air inlet 61b in the air inlet wall 61a. This can facilitate the formation of both air inlets 61b and 61m.

[0113] like Figure 7B As shown, a portion of the power supply circuit 62 can be disposed in the space within the front portion 61d of the housing and fixed by the inclination of the air intake wall 61a, that is, the space Sf formed inside the air intake wall 61a (see Figure 6B The circuit portion 62b included in the power supply circuit 62 is housed in this space and is located in front of the first heat sink 71. This layout allows for efficient use of the volume of the power supply unit housing 61.

[0114] The circuit portion 62b, arranged in the space formed on the inner side of the air intake wall 61a, can have a smaller size than the other portions 62a. This can facilitate airflow within the power unit housing 61.

[0115] Multiple vents 61g and 61h can be formed in the rear portion 61c of the housing. More specifically, as... Figure 7C As shown, multiple vents 61g can be formed in the rear wall 61i of the rear portion 61c of the housing, and multiple vents 61h can be formed in the rear portion 61k of the upper wall 61j of the power unit housing 61. In the example of the electronic device 1, the rear portion 61k of the upper wall 61j is recessed relative to the front portion of the upper wall 61j. Due to this recess, the airflow channel Se is fixed between the upper housing member 30A and the rear portion 61k.

[0116] The positions of the vents 61g and 61h are not limited to the example shown in the electronic device 1. For example, the vent 61h formed in the upper wall 61j may not exist. Multiple vents may be formed in the last part of the left side wall 61e.

[0117] [Flow channel wall that defines the airflow channel]

[0118] The heat dissipation device 70 includes a first radiator 71 and a second radiator 72 arranged side-by-side in a left-right direction. A cooling fan 5 is located in front of the second radiator 72. Figure 4 and Figure 6B As shown, the upper housing member 30A may have a flow channel wall 34A that defines a flow channel for airflow from the cooling fan 5 and directs the airflow to the first heat sink 71. The flow channel wall 34A has a portion that curves along the outer periphery of the cooling fan 5. In the example of the electronic device 1, the entire flow channel wall 34A is curved.

[0119] like Figure 6B As shown, as the distance from the starting point 34A of the flow channel wall 34a increases in the extending direction of the flow channel wall 34A, the distance from the cooling fan 5 to the flow channel wall 34A (the distance in the radial direction of the cooling fan 5) also increases. The flow channel wall 34A extends from the periphery of the cooling fan 5 towards the air intake wall 61a of the power unit housing 61. The air intake wall 61a is located on the extension of the end 34b of the flow channel wall 34A. This flow channel wall 34A allows air from the cooling fan 5 to be smoothly delivered to the air intake wall 61a.

[0120] The intake wall 61a can be curved similarly to the flow channel wall 34A. For example, the flow channel wall 34A is formed along a curve defined by a predetermined function. The intake wall 61a can be arranged along the same curve. For example, the flow channel wall 34A is formed along a spiral curve with the rotation center line Cf of the cooling fan 5 as the origin. In this case, the intake wall 61a can also be curved along the same spiral curve. Therefore, a smooth airflow is formed from the cooling fan 5 to the intake wall 61a and the first radiator 71. Incidentally, the curves on which the curvature of the flow channel wall 34A and the intake wall 61a is based can be, for example, an involute, a logarithmic spiral, a Nelson spiral, etc., rather than a spiral curve.

[0121] The flow channel wall 34A surrounds the periphery of the cooling fan 5 located outside the outer edge of the circuit board 50. The flow channel wall 34A extends downward from the portion forming the upper surface of the device body 10 in the upper housing member 30A (this portion is the recessed plate portion 32a in the example of the electronic device 1). The lower edge of the flow channel wall 34A can reach the lower housing member 30B.

[0122] In the example of electronic device 1, such as Figure 4 and Figure 8BAs shown, an upwardly projecting flow channel wall 34B is formed on the lower housing member 30B. Similar to flow channel wall 34A, flow channel wall 34B defines a flow channel for the airflow delivered from the cooling fan 5. Flow channel wall 34B has a portion that curves along the periphery of the cooling fan 5. In the example of electronic device 1, similar to flow channel wall 34A, the entire flow channel wall 34B is curved.

[0123] like Figure 7B As shown, the lower edge of the flow channel wall 34A of the upper housing member 30A is connected in the vertical direction to the flow channel wall 34B of the lower housing member 30B. Flow channel walls 34A and 34B are connected to each other to form a wall extending along the periphery of the cooling fan 5. In the example of the electronic device 1, flow channel walls 34A and 34B serve as walls on the front side of the cooling fan 5.

[0124] The structure of the flow channel walls 34A and 34B is not limited to the example of the electronic device 1. For example, only the upper housing member 30A or the lower housing member 30B may have a flow channel wall formed thereon. Then, the flow channel wall formed on one housing member may extend upward or downward until it reaches the other housing member.

[0125] like Figure 4 As shown, the electronic device 1 has a front external panel 35 that covers the flow channel walls 34A and 34B, which are part of the external components. The front external panel 35 is located on the front and right sides of the curved flow channel walls 34A and 34B and covers the entire flow channel walls 34A and 34B. Due to the presence of the front external panel 35, the shape of the flow channel walls 34A and 34B can be freely adjusted. A circuit board equipped with switches operated by a power button 2a and a disc eject button 2b can be attached to the front external panel 35, or a circuit board equipped with connectors 3a and 3b can be attached to the front external panel 35.

[0126] [Airflow channel on the underside of the circuit board]

[0127] As described above, the power supply unit 60 and the heat dissipation device 70 are arranged on the upper surface of the circuit board 50, and the power supply unit 60 and the heat dissipation device 70 are side by side with each other in the left-right direction. Air delivered from the cooling fan 5 passes through the heat dissipation device 70 and the power supply unit housing 61. Therefore, airflow is formed throughout the entire space between the circuit board 50 and the upper housing member 30A. On the other hand, a member that reduces the width of the airflow channel between the circuit board 50 and the lower housing member 30B can be provided on the lower side of the circuit board 50. Then, the width of the airflow channel between the lower surface of the circuit board 50 and the lower housing member 30B can be narrower than the width of the airflow channel between the upper surface of the circuit board 50 and the upper housing member 30A. This helps to ensure the velocity of the airflow formed on the lower side of the circuit board 50.

[0128] In the example of electronic device 1, the optical disc drive 6 is disposed on the underside of the circuit board 50. The optical disc drive 6 reduces the width of the airflow channel between the circuit board 50 and the lower housing member 30B.

[0129] like Figure 8B As shown in the plan view of the electronic device 1, the optical disc drive 6 is separated from the cooling fan 5 to the left. The optical disc drive 6 has a disc drive housing 6a. The spindle motor (not shown), pickup module (not shown), etc., for rotating the optical disc are arranged inside the disc drive housing 6a.

[0130] like Figure 8B As shown, from cooling fan 5 to exhaust port M (see...) Figure 8A An airflow channel Sb is formed between the cooling fan 5 and the disk drive housing 6a. The disk drive housing 6a confines the airflow channel Sb to the right side region of the circuit board 50. The disk drive housing 6a has a right side wall 6b facing the cooling fan 5, which extends in the front-rear direction at a position separated from the cooling fan 5 to the left. The airflow channel Sb is formed between the right side wall 6b and the cooling fan 5. A plurality of fins 81 included in the heat dissipation device 80 are arranged at the midpoint of the airflow channel Sb.

[0131] The wall defining the airflow passage Sb can be formed on the lower housing member 30B. For example, as... Figure 4 and Figure 8B As shown, the lower housing member 30B may have a flow channel wall 34c extending from the periphery of the cooling fan 5 toward the heat dissipation device 80. In the example of the electronic device 1, the flow channel wall 34c extends toward the heat dissipation device 80 from the starting point of the aforementioned flow channel wall 34B, which bends on the periphery of the cooling fan 5.

[0132] Incidentally, electronic device 1 may not have an optical disc drive 6. In this case, the wall can restrict the airflow channel Sb. The wall portion formed on the lower housing member 30B can be used as a member that reduces the width of the airflow channel between the circuit board 50 and the lower housing member 30B compared to the airflow channel between the circuit board 50 and the upper housing member 30A.

[0133] like Figure 4 As shown, an opening 30c, corresponding in size and shape to the disk drive housing 6a, is formed in the lower housing member 30B. The lower surface of the disk drive housing 6a can be exposed downwards through the opening 30c. According to this structure, the width of the electronic device 1 in the vertical direction is reduced, thus reducing the thickness of the lower housing member 30B.

[0134] [Dust Collection Room]

[0135] like Figure 6BAs shown, the dust collection chamber Ds can be disposed on the flow channel wall 34A. The dust collection chamber Ds captures dust contained in the airflow formed above the circuit board 50 and collects the captured dust. According to this structure, the amount of dust entering devices arranged downstream of the dust collection chamber Ds, such as the first heat sink 71, the power supply unit 60, etc., can be reduced.

[0136] Dust collection chamber Ds is defined by dust collection chamber wall 34C (see Figure 5 The dust collection chamber wall 34C is box-shaped with openings in two directions, as will be described later. The dust collection chamber wall 34C is integrally formed, for example, with the upper housing member 30A. This allows the dust collection chamber Ds to be secured without increasing the number of parts. Furthermore, because the upper housing member 30A is the component that covers the entire internal device, the positional freedom of the dust collection chamber Ds can be ensured when the dust collection chamber wall 34C is integrally formed with the upper housing member 30A.

[0137] In the plan view of electronic device 1, the cooling fan 5 rotates clockwise around the rotation center line Cf. In the example of electronic device 1, the flow channel wall 34A extends clockwise from its starting point 34a along the periphery of the cooling fan 5. The entire flow channel wall 34A is curved. The dust collection chamber Ds can be positioned to this curved flow channel wall 34A. More specifically, the dust collection chamber Ds can be located at the end of the flow channel wall 34A. The location of the dust collection chamber Ds is not limited to the example of electronic device 1. The dust collection chamber Ds can be positioned at the midpoint of the flow channel wall 34A.

[0138] Two devices, each a heat-generating or heat-dissipating device, can be positioned downstream of the airflow channel formed by the flow channel wall 34A. A dust collection chamber Ds can be located upstream of both devices. In the example of electronic device 1, the power supply unit 60 and the first heat sink 71 are located downstream of the airflow channel defined by the flow channel wall 34A. The dust collection chamber Ds is located upstream of the power supply unit 60 and the first heat sink 71. In this way, dust can be prevented from being sent to both devices through a single dust collection chamber Ds. In the example of electronic device 1, the dust collection chamber Ds is located between the air inlet wall 61a of the power supply unit housing 61 and the flow channel wall 34A.

[0139] like Figure 12As shown, the dust collection chamber Ds has a first opening A1 that opens along the circuit board 50 toward the airflow passage Sa defined by the flow channel wall 34A and the air inlet wall 61a. Dust contained in the air flowing through the airflow passage Sa is captured into the dust collection chamber Ds through the first opening A1. The dust collection chamber Ds also has a second opening A2 that opens toward the outside of the airflow passage Sa in a direction intersecting with the circuit board 50. According to this structure of the dust collection chamber Ds, dust can be collected in the dust collection chamber Ds, and the collected dust can be discharged through the second opening A2 with relatively simple operation.

[0140] The second opening A2 opens in a direction, for example, orthogonal to the circuit board 50. The second opening A2 opens to the outside of the housing 30, and more specifically, to the upper side of the upper housing member 30A. The upper outer panel 20A covers the second opening A2 and prevents it from being exposed to the outside. A user can expose the second opening A2 by removing the upper outer panel 20A from the upper housing member 30A and extract the dust collected in the dust collection chamber Ds. For example, the dust collected in the dust collection chamber Ds can be sucked in by a vacuum cleaner. Furthermore, because the upper outer panel 20A serves as a member covering the second opening A2, an increase in the number of components can be suppressed.

[0141] The dust collection chamber wall 34C of the defined dust collection chamber Ds has a sidewall 34e extending downward from the edge of the second opening A2 (see... Figure 12 ).like Figure 6B As shown, a portion 34f of the sidewall 34e is located between the flow passage wall 34A and the intake wall 61a, and faces the airflow passage Sa. (The portion 34f will be referred to as the "inner wall" below.) The inner wall 34f may be curved in accordance with the flow passage wall 34A. For example, the inner wall 34f may be formed along a function curve (e.g., a cycloid curve) that defines the curvature of the flow passage wall 34A. Furthermore, in another example, as... Figure 6B As shown by the dashed line, the inner wall 34f can extend into the interior of the curved function curve (e.g., a cycloid) that defines the flow channel wall 34A. This can enlarge the first opening A1 and increase the amount of air entering the dust collection chamber Ds.

[0142] like Figure 12 As shown, the dust collection chamber wall 34C may have a bottom 34g located at the lower edge of the side wall 34e. Dust captured in the dust collection chamber Ds is collected on the bottom 34g. The bottom 34g may have a embankment 34h along the edge of the first opening A1. Accordingly, dust collected on the bottom 34g can be prevented from returning to the airflow passage Sa. The bottom 34g can be attached to the circuit board 50 by means of the boss 34h and screws 59.

[0143] Incidentally, when the upper outer panel 20A is attached to the upper housing member 30A, a gap can be formed between the edge of the second opening A2 and the upper outer panel 20A. This facilitates the formation of an airflow that enters the dust collection chamber Ds from the first opening A1 and is discharged from the dust collection chamber Ds to the outside through the second opening A2.

[0144] Incidentally, the structure of the dust collection chamber Ds is not limited to the example of the electronic device 1. For example, instead of using the upper outer panel 20A as a cover to cover the second opening A2, a dedicated cover (cap) can be provided to cover the second opening A2. In another example, the dust collection chamber Ds can be formed in the power unit housing 61 instead of in the upper housing member 30A.

[0145] like Figure 27 As shown, in addition to the second opening A2 of the dust collection chamber Ds, a third opening A3 can be formed in the upper shell member 30A. Figure 27 In the example shown, the upper housing member 30A covers the heat dissipation device 170 (see Figures 26 and 26C), which will be described later as a modification of the heat dissipation device 70. The fins 171A of the front heat sink 171a are inclined relative to the front-rear and left-right directions. Therefore, a generally triangular space is created between the fins 171c at the end of the heat sink 171A and the right wall portion 61f of the power unit housing 61. The third opening A3 is located directly above this space. According to this structure, dust collected in the space between the heat sink 171A and the right wall portion 61f on the front side of the power unit housing 61 can be extracted through the third opening A3. For example, the dust collected in this space can be sucked in by a vacuum cleaner.

[0146] [Top heat dissipation device]

[0147] like Figure 13B As shown, in addition to heat sinks 71 and 72, the heat dissipation device 70 also has multiple heat pipes 73A to 73F. In the example of electronic device 1, the heat dissipation device 70 has six heat pipes 73A to 73F. However, the number of heat pipes can be two or three, or more than six. In the following description, where the multiple heat pipes 73A to 73F are not distinguished from each other, reference numeral 73 is used for the multiple heat pipes 73A to 73F. Furthermore, as... Figure 13A As shown, the heat dissipation device 70 may have a substrate 75. Heat sinks 71 and 72 are fixed to the upper side of the substrate 75. The fins 71a and 72a of the heat sinks 71 and 72 are fixed to the substrate 75, for example, by welding.

[0148] like Figure 14AAs shown, each heat pipe 73 has a heat-receiving portion 73a thermally connected to an integrated circuit 50a mounted on a circuit board 50. Here, "thermally connected to the heat-receiving portion 73a of the integrated circuit 50a" means that the heat-receiving portion 73a and the integrated circuit 50a are in direct contact with each other or connected to each other via a metal component with high thermal conductivity (e.g., copper or aluminum), such that heat from the integrated circuit 50a is transferred to the heat-receiving portion 73a. In the example of the electronic device 1, the heat-receiving portion 73a is the portion located directly above the integrated circuit 50a. The heat dissipation device 70 may have a heat transfer member 74 disposed between the heat pipe 73 and the integrated circuit 50a. The heat-receiving portion 73a may be connected to the integrated circuit 50a via the heat transfer member 74.

[0149] like Figure 14A As shown, multiple heat pipes 73 have heat receiving portions 73a arranged side-by-side in the left-right direction and can contact adjacent heat receiving portions 73a. The heat receiving portion 73a has a substantially rectangular cross-section and has an upper surface, a lower surface, a left side surface, and a right side surface. The side surfaces of the heat receiving portions 73a contact the side surfaces of adjacent heat receiving portions 73a. Two adjacent heat receiving portions 73a can be in direct contact with each other, or they can be in contact with each other via a layer of thermally conductive grease or the like.

[0150] like Figure 14A As shown, each heat receiving portion 73a has a width W1 in the vertical direction and a width W2 in the horizontal direction. The vertical width W1 is greater than the horizontal width W2. This structure facilitates increasing the number of heat pipes 73. Consequently, it facilitates increasing the size of heat sinks 71 and 72, through which the heat from the integrated circuit 50a is transferred to the heat sinks 71 and 72. In the example of electronic device 1, the horizontal width W2 is less than 3 / 4 of the vertical width W1. The horizontal width W2 can be less than 2 / 3 of the vertical width W1. The horizontal width W2 can be greater than 1 / 2 of the vertical width W1.

[0151] like Figure 14A As shown, the total width Wa (width in the left-right direction) of the heat-receiving portions 73a of the multiple heat pipes 73 can correspond to the left-right width of the integrated circuit 50a. More specifically, the width difference between the total width Wa and the integrated circuit 50a can be less than the thickness of one heat pipe 73 (the width W2 of the heat-receiving portion 73a in the left-right direction). In the example of the electronic device 1, this difference is less than half the thickness of one heat pipe 73. Because the total width Wa thus corresponds to the width of the integrated circuit 50a, all heat pipes 73 can operate effectively.

[0152] like Figure 14AAs shown, the heat transfer member 74 has two sides 74b separated from each other in the left-right direction and a groove 74a formed between the two sides 74b. The width of the groove 74a in the left-right direction corresponds to the total width Wa of the heat receiving portions 73a of the plurality of heat pipes 73. The heat receiving portions 73a of all heat pipes 73 are arranged within the groove 74a. The side surfaces of the heat receiving portions 73a located at the respective right and left ends can contact the inner surface (side 74b) of the groove 74a of the heat transfer member 74. The depth of the groove 74a corresponds to the width W1 of the heat receiving portions 73a in the vertical direction. Therefore, the height of the upper surface of the heat receiving portion 73a and the height of the upper surface of the side 74b are substantially the same. The lower edge of the fins 71a included in the radiator 71 is fixed to the upper surface of the side 74b. The fins 71a are fixed to the upper surface of the side 74b, for example, by welding. According to the side portion 74b, heat can also be transferred to the fins 71a located on the right and left sides of the heat receiving portion 73a.

[0153] The width of the heat pipe 73 in both the vertical and horizontal directions can be varied along its extension direction. The heat pipe 73 may then include a portion whose width in the vertical direction is smaller than its width in the horizontal direction compared to the heat receiving portion 73a. This facilitates the bending of the heat pipe 73 and improves thermal conductivity from the heat pipe 73 to the heat sinks 71 and 72. In the example of electronic device 1, the width of all heat pipes 73 in the vertical direction varies along the extension direction of the heat pipe 73. Unlike the example of electronic device 1, only a portion of the heat pipe 73 may have its width in the vertical direction varied along its extension direction.

[0154] like Figure 13B As shown, each heat pipe 73 has portions 73b and 73c that contact the heat sinks 71 and 72 at locations separated from the heat receiving portion 73a in the extending direction of the heat pipe 73. In the following text, the portion 73b contacting the first heat sink 71 will be referred to as the first heat dissipation portion, and the portion 73c contacting the second heat sink 72 will be referred to as the second heat dissipation portion. For example, as... Figure 14B As shown, heat pipes 73C and 73D have a second heat dissipation portion 73c, which extends to the right on the lower side of the second radiator 72 and connects to the lower edge of each fin 72a. Heat pipes 73E and 73F also have a second heat dissipation portion 73c, which extends to the right on the upper side of the second radiator 72 and connects to the upper edge of each fin 72a. Additionally, as... Figure 13B As shown, heat pipes 73A to 73F have a first heat dissipation portion 73b that contacts the lower edge of the first heat sink 71.

[0155] The width of the second heat dissipation portion 73c in a direction orthogonal to both its extension direction and vertical direction may be greater than the width of the second heat dissipation portion 73c in the vertical direction. In the example of electronic device 1, such as... Figure 14B As shown, the second heat dissipation portion 73c has a width W3 in the vertical direction and a width W4 in the front-to-back direction. The width W4 in the front-to-back direction is greater than the width W3 in the vertical direction. This allows heat to be effectively transferred from the second heat dissipation portion 73c to the second heat sink 72.

[0156] Similarly, the width of the first heat dissipation portion 73b in a direction orthogonal to both its extension direction and vertical direction can be greater than its width in the vertical direction. This can improve the thermal conductivity from the first heat dissipation portion 73b to the first heat sink 71.

[0157] In each heat pipe 73, the width W1 of the heat receiving portion 73a in the vertical direction is greater than the widths of the heat dissipation portions 73b and 73c in the vertical direction (W1>W3). On the other hand, the widths of the heat dissipation portions 73b and 73c in the directions perpendicular to their extension and vertical directions (e.g., the width W4 of the second heat dissipation portion 73c) are greater than the widths of the heat receiving portion 73a in the directions orthogonal to its extension and vertical directions (i.e., width W2) (W4>W2). According to this structure, variations in the outer perimeter length of the cross-section of each heat pipe 73 can be avoided.

[0158] Incidentally, heat dissipation portions 73b and 73c may not be arranged on the upper or lower sides of radiators 71 and 72. For example, the second heat dissipation portion 73c may extend in the left-right direction on the front or rear side of the second radiator 72. In this case, the vertical width of the second heat dissipation portion 73c may be greater than its horizontal width. Furthermore, in another example, holes penetrating the respective fins 72a of the second radiator 72 in the left-right direction may be formed in the fins 72a. The second heat dissipation portion 73c may then be inserted into these holes. In this case, the upper and / or lower surfaces of the second heat dissipation portion 73c may contact the edge of the through-hole in the radiator 72. The horizontal width of the second heat dissipation portion 73c may then be greater than its vertical width.

[0159] The radius of curvature of the corner 73d of the heat receiving portion 73a (see...) Figure 14A The radius of curvature of the corners or sides of the heat dissipation portions 73b and 73c can be smaller than that of the heat dissipation portions 73b and 73c (e.g., Figure 14B (Side portion 73e shown). Therefore, the cross-section of the heat receiving portion 73a is nearly rectangular, allowing multiple heat pipes 73 to be effectively arranged on the upper side of the integrated circuit 50a.

[0160] like Figure 14C As shown, each heat pipe 73 has an intermediate portion 73h located between the integrated circuit 50a mounted on the circuit board 50 and the first heat sink 71. The intermediate portion 73h is the portion located between the heat receiving portion 73a and the first heat dissipation portion 73b. As shown in the plan view of the heat dissipation device 70, the intermediate portions 73h of the plurality of heat pipes 73 extend in a direction orthogonal to the extending direction of each heat receiving portion 73a (left-right direction in the example of the electronic device 1) (see...). Figure 13B ).

[0161] like Figure 14C As shown, the upper surface 73i of the intermediate portion 73h is connected to the lower edge of the fins 71a of the first heat sink 71. The upper surface 73i is parallel to the lower edge of the circuit board 50 and the fins 71a. On the other hand, the lower surface 73j of the intermediate portion 73h can be inclined, so that the width W7 of the intermediate portion 73h in the vertical direction gradually decreases as the distance from the heat receiving portion 73a increases. This can increase the degree of freedom in the layout of the electronic components 50c below the intermediate portion 73h. Incidentally, the lower surface 73j of the intermediate portion 73h does not have to be inclined. Multiple steps can be formed in the lower surface 73j, so that the width W7 of the intermediate portion 73h in the vertical direction gradually decreases.

[0162] The substrate 75 has a bottom 75c located below the middle portion 73h. Multiple steps can be formed in the bottom 75c to bias the lower surface 73j of the middle portion 73h toward the heat sink 71 side.

[0163] As described above, the second heat dissipation portion 73c of heat pipes 73E and 73F is arranged along the upper side of the second heat sink 72. Therefore, as Figure 13A As shown, the two heat pipes 73E and 73F may have a curved portion 73g that bends upward from the lower side of the first heat sink 71 to the upper side of the second heat sink 72.

[0164] like Figure 9 As shown, the curved portion 73g has a width W5 in the vertical direction. Furthermore, the curved portion 73g has a width W5 in a direction orthogonal to its extension direction and the vertical direction (in...). Figure 9 The example shown has a width W6 in the front-to-back direction. Then, the width W6 can be greater than the width W5 in the vertical direction. Based on this structure of heat pipes 73E and 73F, heat pipes 73E and 73F can easily bend upwards.

[0165] Incidentally, the bending direction of the bent portion 73g is not limited to the vertical direction. For example, if the second heat dissipation portion 73c is located on the front or rear side of the second heat sink 72, the bent portion 73g can be bent to the front or rear side. In this case, the width of the bent portion 73g in the vertical direction can be greater than the width of the bent portion 73g in the front-rear direction.

[0166] Figures 26A to 26C This is a diagram showing a heat dissipation device 170, which is a variant of the heat dissipation device 70. Figure 27 This is a plan view of the main body 10 of the device, which includes a heat dissipation device 170. Figure 27 In the middle, the heat dissipation device 170 is covered by the upper housing component 30A.

[0167] In the heat dissipation device 170, such as Figure 13A The first heat sink 71 shown is divided into two heat sinks 171A and 171B (two finned blocks) along the direction of airflow (front and back in the example of electronic device 1), as shown. Figure 26A As shown. Heat sinks 171A and 171B are fixed to a common substrate 75. Furthermore, heat sinks 171A and 171B are connected to each other via a common heat pipe 73, which has a heat-receiving portion 73a thermally connected to an integrated circuit 50a mounted on the circuit board 50. The front heat sink 171A is located to the left of the centerline Cf of the cooling fan 5, and a line running in the left-right direction passes through the centerline Cf and the heat sink 171A (see...). Figure 27 The heat transfer member 74 and the heat receiving portion 73a of the heat pipe 73 are fixed to the front heat sink 171A (front finned block). The front heat sink 171A is connected to the integrated circuit 50a via the heat transfer member 74 and the heat receiving portion 73a. The rear heat sink 171B (rear finned block) is located at the rear of the heat sink 171A. The heat dissipation portions 73c of the multiple heat pipes 73 are fixed to the rear heat sink 171B. The rear second heat sink 72 and the heat sink 171B are arranged side by side in the left-right direction.

[0168] In the following description, the front radiator 171A will be referred to as the first front radiator, the radiator 171B will be referred to as the first rear radiator, and the radiator 72 will be referred to as the second radiator, as... Figure 13A As shown in the example.

[0169] like Figure 26AAs shown, the front edge of the first rear radiator 171B separates rearward from the rear edge of the first front radiator 171A, and a gap Gn is fixed between the front edge of the first rear radiator 171B and the rear edge of the first front radiator 171A. According to this structure, air that has passed through the rear edge of the first front radiator 171A mixes in the gap Gn (i.e., airflow is disturbed in the gap Gn), and then air enters the first rear radiator 171B. Therefore, the air to be cooled is easily distributed throughout the first rear radiator 171B. As a result, the first rear radiator 171B can be effectively utilized, thereby improving cooling performance.

[0170] like Figure 26A As shown, in the heat dissipation device 170, radiators 171A and 171B each have multiple fins 171a and 171b, which are arranged side by side in the left-right direction. The fins 171A included in the first front radiator 171a are inclined relative to both the front-rear and left-right directions. Air is supplied to the wall 61a (the air intake wall of the power unit housing 61, see...) of the first front radiator 171A. Figure 6B A fin 171a is formed in front of the first front heat sink 171A. Each fin 171a may be inclined in the same direction as the wall 61a. This allows air to pass smoothly through the heat sink 171A. In the example of the electronic device 1, the wall 61a extends backward and to the left from its front edge. Similar to the wall 61a, each fin 171a extends backward and to the left from its front edge. The fins 171a and the wall 61a may not be parallel to each other.

[0171] On the other hand, each fin 171B of the first rear radiator 171b is arranged in the front-rear direction. Therefore, the fins 171A of the first front radiator 171a are inclined relative to the fins 171B of the first rear radiator 171b.

[0172] The clearance Gn is preferably the size required for air mixing. The clearance Gn can, for example, be greater than 1 / 5 of the width of the first front heatsink 171A in the front-rear direction. The clearance Gn can also be greater than 1 / 4 of the width of the first front heatsink 171A in the front-rear direction.

[0173] exist Figure 26A In the example shown, the middle portions 73h of multiple heat pipes 73 are exposed in the gap Gn. (As...) Figure 26B As shown, the upper surface of the heat receiving portion 73a of the heat pipe 73 and the upper surface of the heat transfer member 74 are in contact with the lower edge of the fins 171a of the first front radiator. The heat dissipation portions 73c of the plurality of heat pipes 73 are in contact with the lower edge of the fins 171b of the first rear radiator 171B. Therefore, in Figures 26A to 26CIn the example shown, heat sinks 171A and 171B are both in partial contact with heat pipe 73, wherein the widths W1 and W3 of heat pipe 73 in the vertical direction are ( Figure 14A and Figure 14B It is uniform.

[0174] [Lower side heat dissipation device]

[0175] like Figure 15 As shown, the heat dissipation device 80 disposed on the lower surface of the circuit board 50 includes a substrate 82, multiple fins 81, and a heat pipe 83. Figure 16A As shown, heat pipe 83 is disposed between lower plate shield 52 and circuit board 50. Opening 52a is formed in lower plate shield 52. Fins 81 are disposed inside opening 52a and exposed to the outside of lower plate shield 52 (underside of lower plate shield 52 in the example of electronic device 1). Fins 81 are disposed in the aforementioned airflow channel Sb formed between circuit board 50 and lower housing member 30B (see... Figure 8B ).

[0176] The substrate 82 is, for example, a metal plate made of copper, aluminum, stainless steel, etc. The substrate 82 is formed by extruding the metal plate. That is, a portion of the substrate 82 is formed from a single metal plate. Multiple fins 81 are supported by the substrate 82. The fins 81 are, for example, fixed to the lower surface of the substrate 82 by welding.

[0177] like Figure 15 As shown, the heat pipe 83 has a heat-receiving portion 83n at a location separated from the fins 81. For example, the heat pipe 83 is L-shaped. The heat-receiving portion 83n is disposed between the aforementioned optical disc drive 6 and circuit board 50. The fins 81 are arranged in an area that does not overlap with the optical disc drive 6 (in the example of electronic device 1, the area to the right of the optical disc drive 6). During the manufacturing process of the circuit board 50 (the process of mounting electronic components on the circuit board 50), a clamp can press against the surface of the circuit board 50 to suppress warping in the circuit board 50. The heat pipe 83 may have a shape consistent with the area where the clamp is pressed against.

[0178] The heat-receiving portion 83n contacts an electronic component 50c mounted on the lower surface of the circuit board 50. The electronic component 50c is, for example, a power transistor, which receives power from the power supply unit 60 to generate drive power for an integrated circuit 50a (specifically, a CPU) mounted on the upper surface of the circuit board 50. The components and devices cooled by the heat sink 80 are not limited to transistors; the heat sink 80 can be used to cool memory.

[0179] like Figure 16AAs shown, the heat pipe 83 has a connecting portion 83a on the opposite side of the heat receiving portion 83n. The connecting portion 83a is located between the fin 81 and the circuit board 50 and extends in the left-right direction. A retaining recess 82f extending in the left-right direction is formed in the lower surface of the substrate 82. The lower surface of the substrate 82 is recessed upward in the retaining recess 82f. A first through hole 82g penetrating the substrate 82 in the left-right direction is formed at the left end of the retaining recess 82f. A second through hole 82h penetrating the substrate 82 in the left-right direction is formed at the right end of the retaining recess 82f. The connecting portion 83a is inserted into the retaining recess 82f from the first through hole 82g on the left side, for example, and is held within the retaining recess 82f. The connecting portion 83a is fixed to the retaining recess 82f, for example, by soldering. Both the retaining recess 82f and the connecting portion 83a are linearly extending portions.

[0180] like Figure 16A As shown, gaps G1 and G2 are generated between the edge of the opening 52a of the lower plate shield 52 and the fin 81. Specifically, gap G1 is generated between the edge (left edge) of the opening 52a and the fin 81 located at the left end, and gap G2 is generated between the edge (right edge) of the opening 52a and the fin 81 located at the right end.

[0181] like Figure 16A As shown, the substrate 82 may have a left portion 82c located to the left of the retaining recess 82f. The left portion 82c may cover the lower surface of the heat pipe 83 (the surface on the side of the plate shield 52) and close the gap G1. This prevents electromagnetic waves from being transmitted from the gap G1 to the outside of the lower plate shield 52. The left portion 82c may have a dimension larger than the gap G1 in the front-back direction and close the entire gap G1.

[0182] Similarly, such as Figure 16A As shown, the substrate 82 may have a right portion 82d located to the right of the retaining recess 82f. The right portion 82d may cover the lower surface of the heat pipe 83 (the surface on the side of the plate shield 52) and close the gap G2. This prevents electromagnetic waves from being transmitted from the gap G2 to the outside of the lower plate shield 52. The right portion 82d may have a dimension larger than the gap G2 in the front-back direction and close the entire gap G2.

[0183] like Figure 16A As shown, the width T1 of the left portion 82c of the board is greater than the distance (gap G1) between the edge (left edge) of the opening 52a of the board shield 52 and the fins 81 located at the left end of the plurality of fins 81. Therefore, as shown in the plan view of the circuit board 50, the left portion 82c of the board is stacked on the fins 81 located at the left end, and also on the edge of the opening 52a of the board shield 52. As a result, electromagnetic waves can be effectively prevented from leaking from the gap G1. In the example of the electronic device 1, the plurality of fins 81 are stacked on the left portion 82c of the board.

[0184] like Figure 16A As shown, the width T2 of the right portion 82d of the board is greater than the distance (gap G2) between the rightmost fin 81 and the edge (right edge) of the opening 52a of the board shield 52. Therefore, as shown in the plan view of the circuit board 50, the right portion 82d of the board is stacked on the rightmost fin 81 and also on the edge of the opening 52a of the board shield 52. As a result, electromagnetic waves can be effectively prevented from leaking from the gap G2. In the example of the electronic device 1, the multiple fins 81 are also stacked on the right portion 82d of the board.

[0185] like Figure 16B As shown, the substrate 82 has a front portion 82a and a rear portion 82b, which are located on opposite sides of each other in the front-rear direction, with a retaining recess 82f inserted between them. The front portion 82a, the rear portion 82b, the left portion 82c, and the right portion 82d are connected to each other and surround the retaining recess 82f. The four portions 82a to 82d are located in the same plane along the circuit board 50. The edge of the fin 81 is fixed to the lower surface of the front portion 82a and the lower surface of the rear portion 82b, for example, by soldering. Heat transferred from the heat pipe 83 to the retaining recess 82f is transferred to the fin 81 via the front portion 82a and the rear portion 82b.

[0186] The front portion 82a extends forward from the retaining recess 82f and overlaps the edge of the opening 52a of the plate shield 52. The rear portion 82b extends rearward from the retaining recess 82f and overlaps the edge of the opening 52a of the plate shield 52. Therefore, the substrate 82 can be overlapped over the entire periphery of the edge of the opening 52a of the plate shield 52. This effectively prevents electromagnetic wave leakage.

[0187] Each of portions 82a to 82d may be secured to the edge of the opening 52a of the board shield 52 by means of a fastening device such as screws or rivets. The fastening structure of the substrate 82 and the lower board shield 52 is not limited to the example of the electronic device 1. For example, only the front portion 82a and the rear portion 82b may be provided with fastening devices for securing the substrate 82 to the lower board shield 52.

[0188] like Figure 16BAs shown, the width W11 of the first through-hole 82g in the left-right direction can be greater than the width (left-right width) of one fin 81. Similarly, the width W12 of the second through-hole 82h in the left-right direction can be greater than the width (left-right width) of one fin 81. The first through-hole 82g is closed by a plurality of fins 81. The second through-hole 82h is also closed by a plurality of fins 81. Each fin 81 has a fixed portion 81b at its upper edge that bends to the adjacent fin 81. The fixed portion 81b contacts the adjacent fin 81, and there is no gap between two adjacent fins 81. This also prevents electromagnetic waves from leaking from the area between two adjacent fins 81.

[0189] like Figure 16B As shown, the substrate 82 may have a stop 82k, one end of which faces the heat pipe 83 in the left-right direction (the right end in the example of the electronic device 1). During the manufacture of the heat dissipation device 80, when the connecting portion 83a of the heat pipe 83 is inserted into the retaining recess 82f from the left, the stop 82k can reduce the relative positional displacement between the connecting portion 83a and the retaining recess 82f.

[0190] Incidentally, in the example of electronic device 1, the substrate 82 has a left portion 82c and a right portion 82d that are respectively stacked on the edge of the opening 52a of the plate shield 52 to the right and left of the retaining recess 82f. Unlike this example, only the left portion 82c or the right portion 82d can be stacked on the edge of the opening 52a of the plate shield 52.

[0191] In another example, the substrate 82 may not have the retaining recess 82f. In this case, the heat dissipation device 80 may have a back plate that clamps the connection portion 83a of the heat pipe 83 to the substrate 82. Figures 17A to 17C This is a schematic diagram illustrating an example of such a heat dissipation device.

[0192] In the examples shown in these figures, the heat dissipation device 180 has a base plate 182 and a back plate 184. For example... Figure 17BAs shown, a substrate 182 is disposed between the connection portion 83a of the heat pipe 83 and the fin 81. The upper edge of the fin 81 is fixed to the substrate 182. Unlike the substrate 82 described above, no retaining recess is formed in the substrate 182. A back plate 184 covers the upper surface of the connection portion 83a and is attached to the substrate 182. A retaining recess 184a extending in the left-right direction is formed in the back plate 184. The connection portion 83a of the heat pipe 83 is fitted into this retaining recess. The back plate 184 has a front portion 184b and a rear portion 184c, which are located on opposite sides of each other, with the retaining recess 184a located between them. Portions 184b and 184c are attached to the substrate 182. Incidentally, in the heat dissipation device 180, unlike the heat dissipation device 80, for example, the connection portion 83a of the heat pipe 83 can be curved rather than linear. In this case, the recess 184a can be bent in accordance with the connecting portion 83a.

[0193] like Figure 17C As shown, the substrate 182 has a left portion 182c located to the left of the fin 81 and a right portion 182d located to the right of the fin 81. The left portion 182c closes the gap G1. The right portion 182d closes the gap G2. This prevents electromagnetic waves from leaking from gaps G1 and G2.

[0194] like Figure 17C As shown, the left portion 182c of the plate extends to the left beyond the edge (left edge) of the opening 52a of the plate shield 52 and overlaps with the plate shield 52. The right portion 182d of the plate extends to the right beyond the edge (right edge) of the opening 52a of the plate shield 52 and overlaps with the plate shield 52. This can more effectively prevent electromagnetic waves from leaking from gaps G1 and G2.

[0195] like Figure 17B As shown, the substrate 182 has a front portion 182a and a rear portion 182b, which are located on opposite sides of each other in the front-rear direction, with a connecting portion 83a inserted between them. The front portion 182a and the rear portion 182b also extend forward and backward respectively beyond the edge of the opening 52a of the shielding member 52, and overlap with the shielding member 52. Therefore, the substrate 182 can be stacked over the entire periphery of the edge of the opening 52a of the shielding member 52. This effectively prevents electromagnetic wave leakage.

[0196] The backplate 184 may have substantially the same dimensions as the substrate 182 in at least one of the left-right and front-back directions. In the example of the electronic device 1, as shown... Figure 17AAs shown, the front-rear dimension K2 of the back plate 184 is the same as the dimension of the substrate 182. Furthermore, the left-right dimension K1 of the back plate 184 is the same as the dimension of the substrate 182. Due to this structure of the back plate 184 and the substrate 182, heat transferred from the heat pipe 83 to the back plate 184 is easily transferred to the entire substrate 182, and therefore easily transferred to the entire fin 81. Incidentally, the back plate 184 may have substantially the same dimensions as the substrate 182 only in the left-right direction or the front-rear direction. Here, the fact that the back plate 184 and the substrate 182 have the same dimensions in the front-rear direction means that its foremost portion can be attached to the plate shield 52 via a common fixing device (screw or rivet), and its rearmost portion can also be attached to the plate shield 52 via a common fixing device. For example, a connection hole for inserting the common fixing device is formed in each of the foremost and rearmost portions of the plates 184 and 182. Similarly, the fact that the backplate 184 and the substrate 182 have the same dimensions in the left-right direction means that their rightmost portion can be attached to the plate shield 52 by a common fixing device, and their leftmost portion can be attached to the plate shield 52 by a common fixing device.

[0197] Furthermore, unlike the aforementioned substrate 82, this structure does not form holes (the aforementioned through holes 82g and 82h) penetrating the substrate 182. Therefore, electromagnetic wave leakage can be prevented more effectively.

[0198] [Memory housing]

[0199] like Figure 15 As shown, a grounding pattern 50f, including a conductor and serving as an electrical ground, is formed on the lower surface of the circuit board 50. Figure 15 In the diagram, grounding pattern 50f is shaded. Grounding pattern 50f surrounds the entire periphery of area B1 on which electronic components 50c and 50e, etc., are mounted (this area will be referred to as the shielding area below). Lower plate shield 52 covers shielding area B1. Lower plate shield 52 has grounding contact portion 52b (see... Figure 7C The grounding contact portion 52b is fixed to the grounding pattern 50f by a fixing device such as a screw.

[0200] like Figure 15 As shown, semiconductor memory 55 (see Figure 18A A removable memory connector 50g is mounted on the area outside the shielding region B1 on the lower surface of the circuit board 50. In the example of the electronic device 1, the semiconductor memory 55 is disposed to the right of the memory connector 50g. The lower plate shield 52 may have a connector cover 52c covering the memory connector 50g (see...). Figure 18A ). The memory housing R1 that houses the semiconductor memory 55 (see Figure 18A It is located on the underside of the circuit board 50.

[0201] like Figure 18C As shown, the lower plate shield 52 has shielding walls 52e and 52f formed along the memory housing R1. This structure reduces the impact of static electricity on the semiconductor memory 55 while suppressing an increase in the number of components. Shielding walls 52e and 52f are walls higher than the semiconductor memory 55 and also have a width corresponding to the length (left-right direction) of the semiconductor memory 55.

[0202] In the example of electronic device 1, the memory housing R1 is defined on the front surface 10a of electronic device 1 (see [reference]). Figure 8A (Nearby). Figure 15 As shown, the memory housing R1 is located in front of the center of the circuit board 50 in the front-rear direction, and is formed, for example, along the front edge 50h of the circuit board 50. A shielding wall 52e is formed on the front side of the memory housing R1. According to this structure, when a user touches the front surface 10a of the electronic device 1, the shielding wall 52e can suppress static current to the semiconductor memory 55.

[0203] like Figure 18C As shown, a shielding wall 52f can be formed on the rear side of the memory housing R1. This allows for more effective suppression of the effects of static electricity on the semiconductor memory 55.

[0204] like Figure 15 As shown, the grounding pattern 50f may have grounding portions 50i and 50j formed along the memory housing R1. Grounding portions 50i and 50j, for example, have a length corresponding to the length of the memory housing R1 (length in the left-right direction). Grounding portion 50i is formed on the front side of the memory housing R1. Grounding portion 50j is formed on the rear side of the memory housing R1. In the following text, grounding portion 50i will be referred to as the front grounding portion, and grounding portion 50j will be referred to as the rear grounding portion.

[0205] like Figure 18C As shown, the lower plate shield 52 has a contact portion 52g that contacts the front grounding portion 50i and a contact portion 52h that contacts the rear grounding portion 50j. The front shielding wall 52e extends downward from the contact portion 52g. The rear shielding wall 52f extends downward from the contact portion 52h. According to this structure, the distance from the shielding walls 52e and 52f to the grounding pattern 50f of the circuit board 50 is reduced. Therefore, the effects of static electricity can be reduced more effectively.

[0206] Incidentally, the structure of the grounding pattern 50f and the structure of the lower plate shield 52 are not limited to the example shown in the electronic device 1. For example, the grounding pattern 50f may have only one of the two grounding portions 50i and 50j (e.g., the front grounding portion 50i). In this case, the lower plate shield 52 may have only one of the two contact portions 52g and 52h (e.g., the contact portion 52g on the front side).

[0207] like Figure 18A As shown, the memory housing R1 can be covered by a memory cover 56. The memory cover 56 comprises, for example, a conductive material (e.g., a metal such as copper, aluminum, or iron). The memory cover 56 is electrically connected to shielding walls 52e and 52f. Accordingly, the effects of static electricity on the semiconductor memory 55 can be more effectively suppressed.

[0208] In the example of electronic device 1, the memory cover 56 is connected by a conductive pad 56a disposed between the edge of the memory cover 56 and the edge of the shielding wall 52e on the front side. Figure 18C The memory cover 56 is electrically connected to the shielding wall 52e. Furthermore, the memory cover 56 is electrically connected to the shielding wall 52f via a conductive pad 56b disposed between the edge of the memory cover 56 and the edge of the shielding wall 52f on the rear side.

[0209] like Figure 18C As shown, an opening 30d is formed in the lower housing member 30B to expose the memory housing R1. Supporting walls 37a, 37b, and 37c may be formed on the lower housing member 30B surrounding the memory housing R1. The supporting walls 37a, 37b, and 37c are walls extending from the edge of the opening 30d toward the circuit board 50. The supporting walls 37a, 37b, and 37c can ensure the strength of the lower housing member 30B around the perimeter of the opening 30d.

[0210] like Figure 18C As shown, shielding walls 52e and 52f can be located inside support walls 37a, 37b, and 37c. For example, the shielding wall 52e on the front side is disposed on the inner side of the support wall 37a on the front side and along the support wall 37a. For example, the shielding wall 52f on the rear side is disposed on the inner side of the support wall 37b on the rear side and along the support wall 37b. In the example of electronic device 1, the board shield 52 does not have a shielding wall located inside the support wall 37c formed on the right side of the memory housing R1. Unlike the example of electronic device 1, the board shield 52 can have a shielding wall located inside the support wall 37c.

[0211] The outer peripheral edge of the memory cover 56 is, for example, located at the lower edge of the support walls 37a, 37b, and 37c. Figure 18AAs shown, a protruding portion 56c is formed at the end of the memory cover 56 (the left end in the example shown in the electronic device 1). An opening in which the protruding portion 56c is fitted horizontally is formed in the lower housing member 30B. The opposite end of the memory cover 56 (the right end in the example shown in the electronic device 1) is provided on and fixed to the support wall 37c. For example, a hole is formed in the support wall 37c, and the end of the memory cover 56 is fixed to the hole by a fixing device such as a screw 58a.

[0212] The semiconductor memory 55 can be fixed to the circuit board 50 or the upper shield 51 at a location separate from the memory connector 50g. For example, as Figure 18A As shown, the right end 55a of the semiconductor memory 55 can be fixed to a threaded hole 51b formed in the upper plate shield 51 by a screw 58b. In this case, a spacer 57 can be provided between the upper plate shield 51 and the right end 55a of the semiconductor memory 55. The hole 50k for providing the spacer 57 can be formed at a position corresponding to the threaded hole 51b in the circuit board 50.

[0213] Electronic device 1 allows for the selective use of multiple semiconductor memories with different storage capacities. These semiconductor memories have different lengths in the left-right direction depending on their storage capacity. Therefore, as... Figure 18A As shown, multiple threaded holes 51b can be formed in the upper shield 51, allowing multiple semiconductor memories of different lengths to be fixed to the upper shield 51. Additionally, in the circuit board 50, holes for providing spacers 57 can be formed at positions corresponding to the threaded holes 51b.

[0214] With the memory cover 56 closed, a vent H1 (see) allows air to flow between the inside and outside of the memory housing R1. Figure 18A and Figure 18B It can be formed in the memory housing R1. This can improve the heat dissipation characteristics of the semiconductor memory 55.

[0215] As described above, the memory housing R1 is disposed near the front surface 10a of the electronic device 1. A vent H1 can be formed in the rear wall portion of the memory housing R1. In the example of the electronic device 1, the vent H1 can be disposed in the rear shielding wall 52f or the rear support wall 37b. Furthermore, the vent H1 can open towards the rear of the electronic device 1. With this structure of the vent H1, the vent H1 is located away from the front surface 10a of the electronic device 1, thus effectively preventing the vent H1 from becoming an electrostatic discharge path.

[0216] In the example of electronic device 1, multiple gaps 52i (see Figure 19 It is formed in the rear shielding wall 52f. (For example...) Figure 18B As shown, the lower edge of the support wall 37b of the lower housing member 30B has a recess 37e at a position corresponding to the gap 52i. A vent H1, opening toward the rear side of the electronic device 1, is formed between the recess 37e and the edge of the memory cover 56. An attachment hole 52j (see [reference needed]) is provided for securing the ground contact portion 52h of the lower plate shield 52 to the circuit board 50. Figure 18B It can be formed in the gap 52i.

[0217] The aforementioned lower flow channel Ub (see above) Figure 20A A vent H1 is formed between the lower surface of the lower housing member 30B and the lower outer panel 20B. The vent H1 opens in the lower flow channel Ub. Furthermore, the vent H1 opens from the memory housing chamber R1 toward the inlet 31b of the lower housing member 30B (see...). Figure 8A Therefore, when the cooling fan 5 is driven, an airflow is formed from the interior of the memory housing R1 through the ventilation hole H1 to the inlet 31b.

[0218] In addition to the ventilation hole H1, holes leading to the outside of the memory housing R1 can be formed in the wall portions defining the memory housing R1, such as shielding walls 52e and 52f, support walls 37a, 37b and 37c, circuit board 50, etc. When the cooling fan 5 is driven, air flows into the interior of the memory housing R1 through the holes. The holes leading to the outside of the memory housing R1, i.e., air inlets, are, for example, holes 50k formed in the circuit board 50 to fix the semiconductor memory 55.

[0219] [External Panel]

[0220] As described above, the electronic device 1 has an upper external panel 20A attached to the upper surface of the device body 10 and a lower external panel 20B attached to the lower surface of the device body 10. The device body 10 has an upper housing member 30A and a lower housing member 30B that are joined to each other in the vertical direction. The upper external panel 20A is attached to the upper surface of the upper housing member 30A. The lower external panel 20B is attached to the lower surface of the lower housing member 30B.

[0221] like Figure 1C As shown, the upper outer panel 20A may have a right-side protrusion 20a on its right side, extending to the right beyond the right-side surface 10b of the device body 10 (the right-side outer surface of the front outer panel 35). Furthermore, the upper outer panel 20A may have a left-side protrusion 20b on its left side. Figure 1G The left protruding portion 20b protrudes to the left beyond the left side surface 10c (left side surface of housing 30) of the main body 10. Figure 1B As shown, the protruding portions 20a and 20b can extend from the rear edge to the front edge of the upper outer panel 20A.

[0222] The protruding portions 20a and 20b can protect the device body 10. For example, when the electronic device 1 is placed vertically with the right side surface 10b of the electronic device 1 below, the right protruding portion 20a abuts against the floor surface and supports the device body 10, thereby preventing the side surface of the device body 10 from being damaged or soiled.

[0223] Similar to the upper outer panel 20A, such as Figure 1C As shown, the lower outer panel 20B may have a right protrusion 20c on its right side that protrudes to the right beyond the right side surface 10b of the device body 10, and a left protrusion 20d on its left side that protrudes to the left beyond the left side surface 10c of the device body 10 (see...). Figure 1G The protruding portions 20c and 20d can extend from the rear edge to the front edge of the lower outer panel 20B. This structure of the outer panels 20A and 20B allows for more effective protection of the device body 10.

[0224] like Figure 1E As shown, the upper outer panel 20A may have a forward protrusion 20e on its front side that extends forward beyond the front surface 10a (front surface of the front outer panel 35) of the device body 10. Similarly, the lower outer panel 20B may have a forward protrusion 20f on its front side that extends forward beyond the front surface 10a of the device body 10. This structure of the outer panels 20A and 20B protects the front surface 10a of the device body 10 and components arranged in the front surface 10a (e.g., buttons 2a and 2b, connectors 3a and 3b, etc.). The forward protrusion 20e extends from the right edge to the left edge of the upper outer panel 20A. The forward protrusion 20f extends from the right edge to the left edge of the lower outer panel 20B. Furthermore, the outer panels 20A and 20B may have a rearward protrusion that extends rearward beyond the rear surface (rear surface of the housing 30) of the device body 10.

[0225] Incidentally, the outer panels 20A and 20B may have protrusions only on a portion of their right, left, and front sides. For example, the outer panels 20A and 20B may not have protrusions 20e and 20f on their front sides. Furthermore, only one of the two outer panels 20A and 20B may have a protrusion.

[0226] like Figure 1A As shown, the upper outer panel 20A has a shape obtained by gently bending a plate along its thickness direction, and does not have a wall portion that descends towards the lower outer panel 20B at its outer peripheral edge. That is, the upper outer panel 20A is not box-shaped. Therefore, the upper outer panel 20A has a right end surface 20g facing the right side and having a width T3 (width in the vertical direction) corresponding to the thickness of the upper outer panel 20A (see...). Figure 1E Similarly, the upper outer panel 20A has a left end surface facing left and having a width corresponding to the thickness of the upper outer panel 20A, a front end surface facing forward and having a width corresponding to the thickness of the upper outer panel 20A, and a rear end surface facing rearward and having a width corresponding to the thickness of the upper outer panel 20A.

[0227] Similar to the upper outer panel 20A, the lower outer panel 20B does not have a wall extending toward the upper outer panel 20A at its outer peripheral edge. Therefore, the lower outer panel 20B has a right end surface 20h facing the right and having a width T4 (width in the vertical direction) corresponding to the thickness of the lower outer panel 20B (see...). Figure 1G The outer panel 20B has a left end surface facing left and having a width corresponding to the thickness of the lower outer panel 20B, a front end surface facing forward and having a width corresponding to the thickness of the lower outer panel 20B, and a rear end surface facing rearward and having a width corresponding to the thickness of the lower outer panel 20B.

[0228] [Bending of the outer panel]

[0229] The upper outer panel 20A may have a curved portion in a cut plane that intersects the vertical direction and the horizontal direction. Compared to the case where the upper outer panel 20A is flat, this increases the strength of the outer component when the electronic device 1 is placed vertically. Figure 20A and Figure 20B As shown, the upper outer panel 20A may have portions that are curved in different ways in two cutting planes, which are along the vertical direction and intersect each other. Here, the two cutting planes are, for example, formed by... Figure 1D The cutting planes are represented by lines XXa-XXa and XXb-XXb. The cutting planes are not limited to... Figure 1D The example shown could be a plane along the vertical and horizontal directions. Similarly, in this case, the strength of the upper outer panel 20A (its strength against forces acting in the horizontal direction) can be increased.

[0230] exist Figure 1D In this configuration, the first position P1, the second position P2, the third position P3 located on the opposite side of the center Pc of the upper outer panel 20A, and the fourth position P4 located on the opposite side of the center Pc of the upper outer panel 20A, are positioned at the four corners of the upper outer panel 20A. Figure 1D In the middle, the first position P1 is located in the front right corner, the second position P2 is located in the back left corner, the third position P3 is located in the front left corner, and the fourth position P4 is located in the back right corner.

[0231] When four positions are defined in the example of electronic device 1, the first position P1 and the second position P2 are connected to each other, and line L1 along the upper surface of the upper outer panel 20A is a downwardly convex curve, as shown. Figure 20A As shown. In other words, when observing the cut plane along the first diagonal of the electronic device 1, the upper outer panel 20A curves along an arc around the point where it separates upwards from the upper outer panel 20A. Here, "first diagonal" is... Figure 1D The XXa-XXa line is shown in the diagram.

[0232] On the other hand, the line L2 connecting the third position P3 and the fourth position P4 to each other and along the upper surface of the upper outer panel 20A is an upwardly convex curve, such as... Figure 20B As shown. In other words, when observing the cut plane along the second diagonal of the electronic device 1, the upper outer panel 20A can bend along an arc around the point where it separates downwards from the upper outer panel 20A. Here, "second diagonal" is... Figure 1D The line shown is XXb-XXb.

[0233] Based on this curvature of the upper outer panel 20A, such as Figure 20A As shown, the thickness (width in the vertical direction) of electronic device 1 at its front right corner (first position P1) and the thickness (width in the vertical direction) of electronic device 1 at its rear left corner (second position P2) increase. Therefore, when electronic device 1 is placed vertically, its posture can be stable.

[0234] For example, when electronic device 1 is placed vertically with its right side facing down, the thicker right front corner (first position P1) is on the bottom and supports electronic device 1. Similarly, when electronic device 1 is placed with its front side facing down, the thicker right front corner (first position P1) is also on the bottom. On the other hand, when electronic device 1 is placed vertically with its left side facing down, the thicker left rear corner (second position P2) is on the bottom and supports electronic device 1. Therefore, based on the aforementioned curvature of the upper outer panel 20A, the posture of electronic device 1 can be stabilized when it is placed vertically.

[0235] Figure 20A The first distance D1 at the first position P1 (right front corner) and the second distance D2 at the second position P2 (left rear corner) are shown as distances from the horizontal plane Hp1 including the circuit board 50 to the upper surface of the upper outer panel 20A. Furthermore, Figure 20BThe third distance D3 at the third position P3 (left front corner) and the fourth distance D4 at the fourth position P4 (right rear corner) are shown as distances from the horizontal plane Hp1 including the circuit board 50 to the upper surface of the upper outer panel 20A. As described above, the line L1 connecting the first position P1 and the second position P2 (the first position P1 and the second position P2 are defined on the diagonal of the upper outer panel 20A) is a downward convex curve, and the line L2 connecting the third position P3 and the fourth position P4 (the third position P3 and the fourth position P4 are on the other diagonal of the upper outer panel 20A) is an upward convex curve. Therefore, each of the first distance D1 and the second distance D2 is greater than each of the third distance D3 and the fourth distance D4. Therefore, by arranging the cooling system devices and components near the first position P1 and the second position P2, smooth air intake and exhaust can be achieved.

[0236] For example, such as Figure 1D As shown in the plan view of the electronic device 1, the line connecting the center Pc of the upper outer panel 20A and the first position P1 (line XXa-XXa represents the cutting plane) passes through the inlet Ea formed between the upper outer panel 20A and the upper housing member 30A (see...). Figure 1C Furthermore, a line connecting the center Pc of the upper outer panel 20A and the first position P1 passes through the upper flow channel Ua (see Figure 2a) formed between the upper outer panel 20A and the recessed plate portion 32a (see Figure 2a). Figure 20A This helps ensure that the inlet Ea has sufficient width in the vertical direction and the upper flow channel Ua has sufficient width in the vertical direction.

[0237] Furthermore, as seen in the plan view of the electronic device 1, the line connecting the center Pc and the second position P2 of the upper outer panel 20A (line XXa-XXa represents the cutting plane) passes through the airflow channel from the cooling fan 5 to the exhaust port M provided in the rear surface of the electronic device 1. In the example of the electronic device 1, the air flowing from the cooling fan 5 passes through the interior of the power unit housing 61 and is discharged from the exhaust port M. From the plan view of the electronic device 1, the line connecting the center Pc and the second position P2 of the upper outer panel 20A (line XXa-XXa represents the cutting plane) passes through the airflow channel formed in the rear part (rear part 61c) of the power unit housing 61. Therefore, it is easy to ensure that the rear part of the power unit housing 61 has sufficient dimensions in the vertical direction, and exhaust efficiency can be improved.

[0238] Additionally, as seen in the plan view of electronic device 1, a line connecting the center Pc and the second position P2 of the upper outer panel 20A passes through the rear wall 61i of the power unit housing 61, where the vent 61g is formed (see...). Figure 7C) and the rear part 61k of the upper wall 61j in which the vent hole 61h is formed (see Figure 7C This helps ensure sufficient dimensions in the vertical direction of the rear wall 61i of the power unit housing 61, and the airflow passage Se (see) formed between the rear portion 61k of the upper wall 61j and the upper housing member 30A. Figure 7C Ensure sufficient width in the vertical direction.

[0239] The lower outer panel 20B can also be bent as a whole. For example, as Figure 20A As shown, when along the first diagonal of electronic device 1 ( Figure 1D When observing the cutting plane along line XXa-XXa, the lower outer panel 20B is curved. For example... Figure 20B As shown, when along the second diagonal of electronic device 1 ( Figure 1D When observing the cutting plane (line XXb-XXb), the lower outer panel 20B can be viewed differently from... Figure 20A The cutting plane is bent in the manner shown. As described above, the optical disc drive 6 is disposed on the lower side of the circuit board 50. The optical disc drive 6 is located on the left side of the electronic device 1. Therefore, the left side of the lower outer panel 20B protrudes downward to cover the lower side of the optical disc drive 6. The right side Br of the lower outer panel 20B may have a shape symmetrical to the right side of the upper outer panel 20A.

[0240] Incidentally, the electronic device 1 may not have an optical disc drive 6 on the underside of the circuit board 50. In this case, the entire shape (bend) of the lower outer panel 20B may be symmetrical to the shape (bend) of the upper outer panel 20A. Figure 21A and Figure 21B This is a cross-sectional view showing the lower outer panel according to this modification. In the example shown in these figures, the lower outer panel 120B and the upper outer panel 20A have shapes that are symmetrical with respect to the horizontal plane Hp2. Figure 21A The cross-sections of outer panels 20A and 120B are shown, which are in relation to... Figure 1D It is obtained from the same cutting plane as the cutting plane shown by the midline XXa-XXa. Figure 21B The cross-sections of outer panels 20A and 120B are shown, which are in relation to... Figure 1D It is obtained from the same cutting plane as the cutting plane shown by the midline XXb-XXb. Figure 21C It has Figure 21A and Figure 21B Front view of electronic device 101 with external panels 20A and 120B shown.

[0241] exist Figure 21A and Figure 21BIn the example shown, the fifth position P5, the sixth position P6 and the seventh position P7 located on the opposite side of the center Pc of the lower outer panel 120B, and the eighth position P8 located on the opposite side of the center Pc of the lower outer panel 120B, are located at the four corners of the lower outer panel 120B. For example, the fifth position P5 is located at the front right corner of the lower outer panel 120B, the sixth position P6 is located at the rear left corner of the lower outer panel 120B, the seventh position P7 is located at the front left corner of the lower outer panel 120B, and the eighth position P8 is located at the rear right corner of the lower outer panel 120B. Therefore, from the plan view of the electronic device 1, the fifth position P5, the sixth position P6, the seventh position P7, and the eighth position P8 correspond to the first position P1, the second position P2, the third position P3, and the fourth position P4, respectively.

[0242] When the four positions are thus confined within the lower outer panel 120B, the line L3 connecting the fifth position P5 and the sixth position P6 to each other and along the lower surface of the lower outer panel 120B can be an upwardly convex curve, such as... Figure 21A As shown. On the other hand, the line L4 connecting the seventh position P7 and the eighth position P8 to each other and along the lower surface of the lower outer panel 120B can be a downwardly convex curve, as shown. Figure 21B As shown.

[0243] Incidentally, the curvature of the upper outer panel 20A is not limited to the example of the electronic device 1. For example, the four positions P1 to P4 that define the curvature of the upper outer panel 20A may not be the four corners of the upper outer panel 20A. For example, the first position P1 may be defined at the center of the front edge of the upper outer panel 20A, the second position P2 may be defined on the side opposite to the first position P1 of the center Pc of the upper outer panel 20A, the third position P3 may be defined at the center of the right edge of the upper outer panel 20A, and the fourth position P4 may be defined on the side opposite to the third position P3 of the center Pc of the upper outer panel 20A. When the four positions P1 to P4 are defined in this way, the line connecting the first position P1 and the second position P2 to each other and along the upper surface of the upper outer panel 20A may be, for example, a downwardly convex curve. On the other hand, the line connecting the third position P3 and the fourth position P4 to each other and along the upper surface of the upper outer panel 20A may be an upwardly convex curve.

[0244] In this case, the curvature of the lower outer panel 20B can correspond to the curvature of the upper outer panel 20A. For example, the entire shape (curvature) of the lower outer panel 20B can be symmetrical to the shape (curvature) of the upper outer panel 20A. Furthermore, in another example, although only the upper outer panel 20A is curved as described above, the lower outer panel 20B can be flat. In yet another example, a portion of the upper outer panel 20A or a portion of the lower outer panel 20B can include a flat surface.

[0245] [External panel attachment structure]

[0246] like Figure 2A and Figure 22 As shown, multiple attachment holes 30e and 30f are formed in the upper surface of the device body 10 (the upper surface of the upper housing member 30A). Multiple attachment target protrusions 21 and 22 (see...) Figure 2B A mounting hole 21 and 22 are formed on the lower surface of the upper outer panel 20A. Attachment target protrusions 21 and 22 are respectively fitted into attachment holes 30e and 30f. Attachment holes 30e and 30f are, for example, holes that penetrate the upper housing member 30A.

[0247] exist Figure 22 In the diagram, the assembly directions of the attachment target protrusions 21 and 22, respectively, into the attachment holes 30e and 30f, are indicated by arrow Da. Assembly direction Da corresponds, for example, to the direction in which the attachment target protrusions 21 and 22 protrude from the lower surface of the upper outer panel 20A. Additionally, assembly direction Da corresponds, for example, to the direction in which the attachment holes 30e and 30f penetrate the upper housing member 30A. Each assembly direction Da of the plurality of attachment target protrusions 21 and 22 being assembled into the attachment holes 30e and 30f is parallel to each other. Assembly direction Da can be relative to a plane perpendicular to the vertical direction (…). Figure 22 The assembly direction Da is inclined relative to the horizontal plane Hp3 of the circuit board 50. For example, the assembly direction Da can be inclined relative to the horizontal plane Hp3 and along a plane parallel to the up-down and left-right directions.

[0248] As described above, the upper outer panel 20A is bent in different ways in two intersecting cutting planes along the vertical direction. That is, the upper outer panel 20A is bent along the first diagonal ( Figure 1D The line XXa-XXa in the middle bulges downward in the cutting plane and curves along the second diagonal ( Figure 1D The line XXb-XXb in the diagram bulges upwards in the cutting plane. For example... Figure 22As shown, the upper surface of the device body 10 is also curved, consistent with the upper outer panel 20A. When the assembly direction Da is inclined relative to the horizontal plane Hp3, the curved upper outer panel 20A can be attached to the similarly curved upper surface of the device body 10, and the upper outer panel 20A and the upper surface of the device body 10 can be in close contact with each other.

[0249] Figure 23 This is a schematic diagram to help explain this. In the example shown in the figure, the horizontal portion 30i and the inclined portion 30j are formed in the upper housing member 30A. The horizontal portion 20i and the inclined portion 20j are also formed in the upper outer panel 20A. The attachment target protrusions 21 and 22 protrude in a direction Da that is inclined relative to the horizontal plane. The attachment holes 30e and 30f penetrate the upper housing member 30A in a direction Da that is inclined relative to the horizontal plane Hp3. The assembly direction Da is more inclined than the inclined portions 30j and 20j. That is, the angle θ1 formed between the horizontal plane Hp3 and the assembly direction Da is greater than the angle θ2 formed between the horizontal plane Hp3 and the inclined portions 20j and 30j. Therefore, the attachment target protrusions 21 and 20 can be inserted into the attachment holes 30e and 30f without interference between the inclined portions 20j and 30j or between the horizontal portions 20i and 30i. Furthermore, after the insertion of the attachment target protrusions 21 and 20, the inclined portions 20j and 30j can be in close contact with each other, and the horizontal portions 20i and 30i can be in close contact with each other.

[0250] To reduce the vertical dimensions of the electronic device 1, one effective method involves attaching the upper outer panel 20A and the upper housing member 30A to each other, for example, by sliding the upper outer panel 20A relative to the upper housing member 30A in a rightward or leftward direction. However, this method results in a gap between the inclined portions 20j and 30j, and interference between another inclined portion of the upper outer panel 20A and the upper housing member 30A. On the other hand, in the example of the electronic device 1, the assembly direction Da is more inclined than the inclined portions 20j and 30j, thus the upper outer panel 20A can be attached to the upper housing member 30A without causing such gaps or interference. Therefore, it is desirable that the assembly direction Da of the attachment target protrusions 21 and 22 and the attachment holes 30e and 30f is more inclined relative to the horizontal plane Hp3 than the portion of the upper outer panel 20A with the largest inclination.

[0251] Incidentally, the plurality of attachment holes 30e and 30f are preferably distributed over the entire upper surface of the upper housing member 30A. This allows the entire upper outer panel 20A to be in close contact with the upper surface of the upper housing member 30A. In the example of the electronic device 1, a recessed plate portion 32a is formed in the upper surface of the upper housing member 30A. The attachment holes 30e and 30f are preferably distributed in areas other than the recessed plate portion 32a.

[0252] like Figure 22 As shown, the attachment target protrusion 21 has an engaging protrusion 21a at its base. A recess 30h is formed in the bottom surface of the attachment hole 30e. The engaging protrusion 21a is fitted into the recess 30h and restricts the sliding of the attachment target protrusion 21 from the attachment hole 30e. On the other hand, the attachment target protrusion 22 has no protrusion at its base. The engaging protrusion 21a has a surface 21b facing the direction in which the attachment target protrusion 21 is pulled out from the attachment hole 30e. At the surface 21b, the engaging protrusion 21a engages with the recess 30h. (The surface 21b will be referred to as the locking surface below.) The upper outer panel 20A uses the locking surface 21b of the attachment target protrusions 22 and 211 to hold the upper surface of the upper housing member 30A. A plurality of attachment target protrusions 22 are arranged along the left edge of the upper outer panel 20A. Unlike the protruding portion 21 of the attached target, no protrusion may be formed at the base of the protruding portion 22 of the attached target.

[0253] The structure for attaching the lower outer panel 20B to the lower housing member 30B can be the same as the structure for attaching the upper outer panel 20A to the upper housing member 30A. That is, as Figure 2A As shown, the lower outer panel 20B may have an attachment target protrusion 25 and an attachment target protrusion 24. The attachment target protrusion 25 has a protrusion formed at its base, while the attachment target protrusion 24 does not have such a protrusion formed thereon. Attachment holes into which the attachment target protrusions 24 and 25 will be fitted may be formed in the lower surface of the lower housing member 30B.

[0254] Incidentally, the structure used to fix the upper outer panel 20A to the upper housing member 30A is not limited to the example of the electronic device 1. For example, such as Figure 24As shown, the engaging protrusion 26 can be formed in the lower surface of the upper outer panel 20A, instead of the engaging protrusion 21a formed on the base of the attachment target protrusion 21. The engaging protrusion 26 can be formed, for example, such that its centerline is along the vertical direction. On the other hand, the hole or recess into which the engaging protrusion 26 will be fitted can be formed in the upper housing member 30A. According to this structure, the size of the protrusion can be easily increased compared to the engaging protrusion 21a of the attachment target protrusion 21. As a result, the strength of the engaging protrusion can be increased.

[0255] [Disc Insertion Slot]

[0256] like Figure 1B and Figure 25 As shown, a disc insertion slot 23a can be formed in the lower outer panel 20B, into which the optical disc will be inserted toward the optical disc drive 6. The lower outer panel 20B has a front bevel 23 on its front side. The front bevel 23 is a surface that extends downward and backward from the front edge 20k of the lower outer panel 20B. The disc insertion slot 23a is formed in the front bevel 23. This prevents the disc insertion slot 23a from being conspicuous.

[0257] like Figure 25 As shown, a guide bending surface 23c connected to the edge of the disc insertion slot 23a is formed on the upper part of the disc insertion slot 23a. The guide bending surface 23c can be used as a guide for the optical disc D. For example, when the optical disc D is inserted, if the front edge of the optical disc collides with the front edge 20k of the lower outer panel 20B, the guide bending surface 23c guides the optical disc D into the interior of the disc insertion slot 23a.

[0258] In the example of electronic device 1, the disk insertion slot 23a is located on the left side of electronic device 1. The front inclined surface 23, where the disk insertion slot 23a is formed, is formed at an angle such that the right side of the front inclined surface 23 (the part near the center in the left-right direction of electronic device 1) is located in front of the left side of the front inclined surface 23. Therefore, as... Figure 1H As shown, in the bottom view of the electronic device 1, the front edge 23e of the disc insertion slot 23a slopes forward from the left end of the front edge 23e to the center of the electronic device 1 (center in the left-right direction). Therefore, when the optical disc D is inserted, the guidance of the optical disc D begins earlier near the center of the electronic device 1.

[0259] like Figure 25 As shown, a bevel 23d is formed at the lower edge of the disc insertion slot 23a. The bevel 23d extends rearward and upward from its leading edge. In the event that the leading edge of the optical disc collides with the bevel 23d, the bevel 23d guides the optical disc D to the insertion opening 6c formed in the front surface of the disc drive housing 6a.

[0260] The insertion opening 6c formed in the front surface of the disk drive housing 6a is located above the lower part of the inclined surface 23d. Therefore, the distance from the insertion opening 6c to the disk insertion slot 23a formed in the lower housing member 30B is reduced. As a result, it is convenient to insert the optical disc D.

[0261] As described above, in the electronic device 1, the housing 30 includes an upper housing member 30A covering the upper surface of the circuit board 50 and a lower housing member 30B covering the lower surface of the circuit board 50. A cooling fan 5 is disposed outside the outer edge of the circuit board 50. The cooling fan 5 has a rotation center line Cf along the vertical direction as the thickness direction of the circuit board 50. The cooling fan 5 forms an airflow between the upper surface of the circuit board 50 and the upper housing member 30A, and between the lower surface of the circuit board 50 and the lower housing member 30B. The upper housing member 30A has an upper inlet 31a defined above the cooling fan 5. The lower housing member 30B has a lower inlet 31b defined below the cooling fan 5. According to the electronic device 1, one cooling fan 5 can deliver air to both surfaces of the circuit board 50. Therefore, components disposed on both surfaces of the circuit board 50 can be cooled without increasing the number of components. Furthermore, since the upper inlet 31a and the lower inlet 31b are formed in the housing 30, air can be effectively drawn in, thereby improving cooling performance.

[0262] Furthermore, the electronic device 1 includes: a first heat sink 71 that allows air to pass through in the front-rear direction; a power supply unit 60 including a power supply circuit 62 and a power supply unit housing 61 housing the power supply circuit 62 and having an air intake wall 61a, with a plurality of air intake holes 61b formed in the air intake wall 61a; and a cooling fan 5. The air intake wall 61a is located in front of the first heat sink 71. Furthermore, the air intake wall 61a has an outer surface that is inclined relative to the front-rear and left-right directions and faces the first heat sink 71. The cooling fan 5 is configured to deliver air to the air intake wall. This air intake wall 61a ensures that airflow is supplied to the first heat sink 71 and simultaneously cools the power supply unit 60 with cold air (air not heated by another heat-generating or heat-dissipating device). When the power supply unit 60 can be cooled by cold air, the gap between the circuit components 62a and 62b (e.g., transformers and capacitors) included in the power supply circuit 62 can be reduced, allowing the power supply unit 60 to be miniaturized.

[0263] Furthermore, the electronic device 1 includes: a circuit board 50; a cooling fan 5 that forms an airflow for cooling components mounted on the circuit board 50; a flow channel wall 34A that defines a flow channel for the airflow delivered from the cooling fan 5; and a dust collection chamber Ds that captures dust in the airflow and collects the captured dust, the dust collection chamber Ds being disposed on the flow channel wall 34A. According to this structure, the amount of dust entering devices arranged downstream of the dust collection chamber Ds, such as the first heat sink 71, the power supply unit 60, etc., can be reduced. Additionally, the dust collection chamber Ds has a first opening A1 that opens towards the airflow channel Sa in the direction along the circuit board 50, and a second opening A2 that opens towards the outside of the dust collection chamber Ds in a direction intersecting with the circuit board 50. In the example of the electronic device 1, the direction in which the second opening A2 opens is orthogonal to the direction of the circuit board 50. According to this structure of the dust collection chamber Ds, dust can be collected in the dust collection chamber Ds, and the collected dust can be discharged through the second opening A2 with relatively simple operation.

[0264] Additionally, the heat dissipation device 70 includes: a plurality of heat pipes 73A to 73F located above the integrated circuit 50a, each heat pipe having a heat receiving portion 73a thermally connected to the integrated circuit 50a; and heat sinks 71 and 72 connected to the plurality of heat pipes 73A to 73F. The heat receiving portions 73a of the heat pipes 73A to 73F are arranged side by side in the left-right direction and are in contact with the heat receiving portions 73a of adjacent heat pipes 73. The heat receiving portions 73a have a first width W1 in the vertical direction and a second width W2 in the left-right direction that is smaller than the first width W1. With this structure, it becomes easy to increase the number of heat pipes 73. As a result, it becomes easy to increase the size of the heat sinks 71 and 72 to which the heat from the integrated circuit 50a is transferred through the heat pipes 73. Therefore, the cooling performance of the integrated circuit 50a can be improved.

[0265] Furthermore, the electronic device 1 includes: a circuit board 50; a plate shield 52 covering the circuit board 50 and having an opening 52a formed therein; and a heat dissipation device 80. The heat dissipation device 80 includes: a plurality of fins 81 disposed inside the opening 52a; a heat pipe 83 having a connecting portion 83a located between the plurality of fins 81 and the circuit board 50 and extending along the circuit board 50 in a left-right direction; and a substrate 82 or 182 supporting the plurality of fins 81. The substrate 82 or 182 has a left portion 82c or 182c. The left portion 82c or 182c covers the lower surface of the heat pipe 83, i.e., the lower surface facing the plate shield 52, and closes the gap G1 between the left ends of the plurality of fins 81 and the left edge of the opening 52a of the plate shield 52. According to this structure, electromagnetic wave leakage from the gap G1 between the left ends of the plurality of fins 81 and the left edge of the opening 52a of the plate shield 52 can be effectively suppressed.

[0266] As described above, in the electronic device 1, the lower surface of the circuit board 50 has a shielding region B1, electronic components 50c and 50e are arranged on the shielding region B1, and a board shield 52 covers the shielding region. A memory housing chamber R1 capable of accommodating a semiconductor memory 55 is defined outside the shielding region. The board shield 52 has shielding walls 52e and 52f along the memory housing chamber R1. Because the shielding walls 52e and 52f are formed on the board shield 52 in the electronic device 1, the semiconductor memory 55 can be protected from static electricity while suppressing an increase in the number of components.

[0267] As described above, the electronic device 1 includes an upper outer panel 20A having an upper surface. The upper surface of the upper outer panel 20A has a first position P1, a second position P2 defined on the side opposite to the first position P1 at the center Pc of the upper surface, a third position P3, and a fourth position P4 defined on the side opposite to the third position P3 at the center Pc, on its peripheral portion. The line L1 connecting the first position P1 and the second position P2 to each other and forming along the upper surface is a downwardly convex curve. The line L2 connecting the third position P3 and the fourth position P4 to each other and forming along the upper surface is an upwardly convex curve. According to the electronic device 1, the appearance is improved, and the strength of the outer panel 20A is easily ensured. Incidentally, this can be applied to electronic devices without an outer panel 20A. In this case, the upper surface of the housing accommodating internal devices such as a circuit board 50 can be bent as described above.

[0268] Furthermore, the electronic device 1 includes a device body 10 having an upper surface and a right side surface 10b, and a curved upper outer panel 20A. The upper outer panel 20A covers and is attached to the upper surface of the device body 10. The upper outer panel 20A has a right protrusion 20A at its end that extends beyond the right side surface 10b. According to the electronic device 1, when the electronic device 1 is placed vertically such that the right side surface 10b is below, the device body 10 can be protected by the upper outer panel 20A. Furthermore, because the upper outer panel 20A is curved, its strength can be ensured compared to, for example, a flat upper outer panel 20A. Additionally, the upper outer panel 20A has a cut plane that intersects the vertical direction and the horizontal direction (specifically, in...). Figure 1D The outer panel 20A has a curved portion within the cutting plane (represented by line XXa-XXa). This ensures sufficient strength for the outer panel 20A. The cutting plane, intersecting the vertical direction and the horizontal direction, can be, for example, a plane along both the vertical and horizontal directions. Similarly, in this case, sufficient strength for the outer panel 20A to resist external forces acting in the horizontal direction can be ensured.

[0269] Furthermore, the upper outer panel 20A is a panel attached to the housing 30, which has an upper surface and a right side surface 10b, and is positioned above the housing 30. The upper outer panel 20 is curved and has a plurality of attachment target protrusions 21 and 22 for attachment to a plurality of attachment holes 30e and 30f formed in the upper surface of the housing 30, respectively, and has a right protrusion 20a at its end extending beyond the right side surface 10b. According to the upper outer panel 20A, when the electronic device 1 is positioned such that the right side surface 10b is below, the device body 10 can be protected by the upper outer panel 20A.

[0270] The outer panel 20A (or 20B) includes a surface for attachment to the housing 30 of the gaming device 10, comprising: a curved profile including an inner surface and an outer surface; and a plurality of protrusions 21 and 22 (or 24 and 25) extending from the inner surface of the outer panel. Each of the plurality of protrusions 21 and 22 (or 24 and 25) is inclined relative to a plane perpendicular to the vertical direction of the outer panel. Each of the protrusions 21 and 22 (or 24 and 25) is configured to fit into corresponding attachment holes 30e and 30f penetrating the surface of the housing 30 of the gaming device when the outer panel is attached to the housing of the gaming device.

[0271] The vertical direction extends from the base of housing 30 to the top of housing 30, such that when the outer panel is attached to the gaming device, the outer panel 20A (or 20B) covers the surface of housing 30.

[0272] The surface of the housing 30 to which the outer panel 20A is attached is one of two side surfaces (upper surface), wherein each of the two side surfaces is approximately parallel to each other, and wherein the second outer panel 20B is configured to be attached to one of the two side surfaces (lower surface).

[0273] When the multiple protrusions 21 and 22 (or 24 and 25) are fitted into the corresponding holes 30e and 30f, a gap Ua (or Ub) is provided between the surface of the housing 30 of the gaming device and the inner surface 20A (or 20B).

[0274] The interval Ua (or Ub) provides a path for the airflow generated by the cooling fan 5 of the gaming device to flow out between the inner surface of the outer panel 20A (or 20B) and the surface of the housing 30, wherein when the outer panel is attached to the housing, the cooling fan 5 is guided from the surface of the housing and toward the inner surface of the outer panel 20A (or 20B).

[0275] like Figure 24 and 2B As shown, some protrusions 21 protrude more from the inner surface of the outer panel 20A than other protrusions 21. Furthermore, as... Figure 2AAs shown, some protrusions 24 (or 25) protrude from the inner surface of the outer panel 20B more than other protrusions 24 (or 25). That is, one or more of the plurality of protrusions 21 and 22 (or 24 and 25) include a first dimension and a second dimension (see...). Figure 24 , 2A (and 2B), wherein the first dimension protrudes less from the inner surface of the outer panel 20A (or 20B) than the second dimension.

[0276] When the plurality of protrusions 21 and 22 (or 24 and 25) of the first and second dimensions are fitted into the corresponding holes 30e and 30f, a spacing Ua (or Ub) is provided between the surface of the housing of the gaming device and the inner surface of the outer panel 20A (or 20B).

[0277] The spacing Ua (or Ub) provides a path for the airflow output from the cooling fan of the gaming device to flow between the inner surface of the outer panel and the surface of the housing.

[0278] The multiple protrusions 21 and 22 (or 24 and 25) of the second dimension include extensions. Figure 24 The larger protrusion 21 shown includes an extension extending from the inner surface of the outer panel 20A and having an arcuate shape. A gap is provided between the extension and the inner surface of the outer panel. This gap allows airflow to follow a path (Ua or Ub) when the cooling fan 5 of the gaming device is running and the outer panel 20A (or 20B) is attached to the surface of the housing.

[0279] One or more of the plurality of protrusions 21 (or 25) include an engaging protrusion 21a. The engaging protrusion 21a is located near the base of the protrusion 21 (or 25).

[0280] The housing 30 includes a second outer panel 20B having a plurality of protrusions 24 or 25 configured to be attached to the second side of the housing.

[0281] The curved profile of the outer panel 20A (or 20B) is along the first and second cutting planes (along... Figure 1D The lines XXa-XXa and XXb-XXb in the diagram are different, and the first and second cutting planes are along the vertical direction and intersect each other.

[0282] The curved profile of the outer panel 20A has a first protrusion downward along the first cutting plane, which extends along the first diagonal ( Figure 1D XXa-XXa in the middle), and the second protrusion upward along the second cutting plane, which is along the second diagonal ( Figure 1D (XXb-XXb in the middle).

[0283] An outer panel 20A (or 20B) for attachment to the surface of the housing 30 of the gaming device has a curved profile including an inner surface and an outer surface; a plurality of protrusions 21 and 22 (or 24 and 25) extending from the inner surface of the outer panel, each of the protrusions being inclined relative to a plane perpendicular to the vertical direction (Z1-Z2 direction) of the outer panel. The plurality of protrusions 21 and 22 (or 24 and 25) have a first dimension and a second dimension, wherein the second dimension protrudes further outward from the inner surface of the outer panel 20A (or 20B) than the first dimension. The plurality of protrusions 21 and 22 (or 24 and 25) of the second dimension include extensions. Figure 24 The larger protruding portion 21 shown includes an extension extending from the inner surface of the outer panel 20A and having an arcuate shape. A gap is provided between the extension and the inner surface of the outer panel 20A (or 20B).

[0284] Each of the protrusions 21 and 22 (or 24 and 25) is configured to fit into corresponding attachment holes 30e and 30f penetrating the surface of the housing 30 of the game device when the outer panel 20A (or 20B) is attached to the housing 30 of the game device.

[0285] The gap between the extension and the inner surface of the outer panel 20A (or 20B) provides an area for airflow. When the fan of the gaming device is activated, airflow occurs between the inner surface of the outer panel and the surface of the housing.

[0286] Spacer Ua (or Ub) is defined between the outer panel 20A (or 20B) and the surface of the housing. Spacer Ua (or Ub) is provided by a plurality of protrusions 21 and 22 (or 24 and 25). Figure 2A , 2B In the examples shown in 21 and 22 (or 24 and 25), the larger protrusions 21 and 22 (or 24 and 25) can be located in the region of interval Ua (or Ub) to provide interval Ua (or Ub).

[0287] The curved profile of the outer panel 20A (or 20B) is different along the first and second cutting planes, which are in the vertical direction and intersect each other, such that the curved profile has a first diagonal along the first cutting plane. Figure 1D The first protrusion (XXa-XXa) downwards, and along the second cutting plane, it has a second diagonal ( Figure 1D The second upward protrusion of XXb-XXb in the middle.

[0288] Those skilled in the art should understand that various modifications, combinations, sub-combinations and alterations can be made depending on design requirements and other factors, as long as they are within the scope of the appended claims or their equivalents.

Claims

1. An external panel for attaching to the surface of a housing of a gaming device, comprising: The outer panel has a curved profile that includes an inner surface and an outer surface; Multiple protrusions extending from the inner surface of the outer panel, each of which is inclined relative to a plane perpendicular to the vertical direction of the outer panel. Each protruding portion is configured to fit into a corresponding attachment hole penetrating the surface of the game device's housing when the outer panel is attached to the housing. When the plurality of protruding portions are fitted into the corresponding holes, a gap is provided between the surface of the gaming device's housing and the inner surface. The interval provides a path for the airflow generated by the cooling fan of the gaming device to flow out from the inner surface of the outer panel and the surface of the housing. One or more of the plurality of protruding portions include a first dimension and a second dimension, wherein the first dimension protrudes less from the inner surface of the outer panel than the second dimension. The second dimension includes multiple protruding portions, with a gap between the extensions and the inner surface of the outer panel.

2. The external panel according to claim 1, wherein, The vertical direction extends from the base of the housing to the top of the housing, such that when the outer panel is attached to the gaming device, the outer panel covers the surface of the housing.

3. The external panel according to claim 1, wherein, The surface of the housing is one of two side surfaces, wherein each of the two side surfaces is approximately parallel to each other, and wherein the second external panel is configured to be attached to one of the two side surfaces.

4. The external panel according to claim 1, wherein, When the outer panel is attached to the housing, the cooling fan is directed from the surface of the housing toward the inner surface of the outer panel.

5. The external panel according to claim 1, wherein, One or more of the plurality of protruding portions include a first dimension and a second dimension, wherein the first dimension protrudes less from the inner surface of the outer panel than the second dimension.

6. The external panel according to claim 5, wherein, When the multiple protrusions of the first and second dimensions are fitted into the corresponding holes, a gap is provided between the surface of the housing of the gaming device and the inner surface of the outer panel.

7. The external panel according to claim 6, wherein, The plurality of protruding portions of the second dimension include extensions, wherein, A gap is provided below the inner surface of the extension and the outer panel.

8. The external panel according to claim 7, wherein, When the gaming device's cooling fan is running and the external panel is attached to the surface of the housing, the gap allows airflow to travel along the path.

9. The external panel according to claim 1, wherein, One or more of the plurality of protrusions include a joining protrusion, wherein the joining protrusion is located near the base of the protrusion.

10. The external panel according to claim 1, wherein, The housing includes a second side opposite to one side and a second outer panel, the second outer panel having a plurality of protrusions configured to attach to the second side.

11. The external panel according to claim 1, wherein, The curved profile is different along the first and second cutting planes, which are in the vertical direction and intersect each other.

12. The external panel according to claim 11, wherein, The curved profile has a first protrusion downward along a first cutting plane and a second protrusion upward along a second cutting plane, the first cutting plane being along a first diagonal and the second cutting plane being along a second diagonal.

13. An external panel for attachment to the surface of a housing of a gaming device, comprising: The outer panel has a curved profile that includes an inner surface and an outer surface; Multiple protrusions extending from the inner surface of the outer panel, each of the multiple protrusions being inclined relative to a plane perpendicular to the vertical direction of the outer panel, wherein the multiple protrusions have a first dimension and a second dimension, wherein the second dimension protrudes further outward from the inner surface of the outer panel than the first dimension; The second dimension includes multiple protruding portions, each including an extension, with a gap between the extension and the inner surface of the outer panel. The gap provides an area for airflow, which occurs between the inner surface of the outer panel and the surface of the housing when the gaming device's fan is activated.

14. The external panel according to claim 13, wherein, Each of the protruding parts is configured to fit into a corresponding attachment hole in the surface of the game device housing when the outer panel is attached to the housing of the game device.

15. The external panel according to claim 13, wherein, When attached, the gap is defined between the surfaces of the outer panel and the housing, wherein the gap is provided by a plurality of protrusions.

16. The external panel according to claim 13, wherein, The curved profile is different along the first and second cutting planes, which are in the vertical direction and intersect each other, such that the curved profile has a first protrusion downward along the first cutting plane and a second protrusion upward along the second cutting plane, the first cutting plane being along the first diagonal and the second cutting plane being along the second diagonal.

17. An external panel for being disposed from and attached to a surface of a housing of a gaming device in an upward or downward direction, the external panel comprising: The outer panel has a curved profile that includes an inner surface and an outer surface; Multiple protrusions extending from the inner surface of the outer panel are used for attachment to the housing. The inner surface includes the area covering the entrance formed on the upper or lower surface of the housing. During attachment, the spacing is defined between the surfaces of the outer panel and the housing, wherein, The interval is provided by a plurality of protruding portions. One or more of the plurality of protruding portions include a first dimension and a second dimension, wherein the first dimension protrudes less from the inner surface of the outer panel than the second dimension. The second dimension includes multiple protruding portions, with a gap between the extensions and the inner surface of the outer panel.

18. The external panel according to claim 17, wherein, Each of the plurality of protruding portions is inclined relative to a plane along the vertical and horizontal directions of the gaming device.

19. The external panel according to claim 17, wherein, Multiple protrusions include protrusions arranged along the edges of the outer panel.

Images