An evaporator and loop heat pipe

Abstract

The embodiment of the application discloses an evaporator loop heat pipe, and the evaporator comprises a capillary structure arranged between an evaporation cavity and a compensation cavity; a first guide flow channel structure is arranged in the compensation cavity, the first guide flow channel structure has a first end and a second end, the first end is communicated with a gas pipeline of the loop heat pipe, and the second end is communicated with a liquid pipeline of the loop heat pipe, so that gaseous working medium formed by evaporation of liquid working medium in the compensation cavity which absorbs heat from the evaporation cavity and enters the compensation cavity through the capillary structure flows into the gas pipeline through the first end under the action of the first guide flow channel structure.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the field of heat dissipation, and in particular to an evaporator and loop heat pipe. BACKGROUND

[0002] In order to meet the problem of high heat flux density heat dissipation, the loop heat pipe is constantly developed in the field of electronic equipment heat dissipation due to the characteristics of long-distance heat transfer and anti-gravity performance, and becomes a very potential heat dissipation method. At present, the loop heat pipe technology is generally composed of an evaporator, a gas pipeline, a heat dissipation device and a liquid pipeline connected in sequence. The capillary force formed by the capillary structure arranged in the evaporator drives the circulating working medium, and the loop system using phase change heat transfer of the working medium exchanges heat in the internal vacuum environment.

[0003] However, in the process of implementing the present application, the inventors found that at least the following problems exist in the prior art: under high heat flux density, the temperature of the existing evaporator rises sharply, the superheat degree of the steam increases, the heat taken away in the evaporation cavity is limited, part of the heat is quickly transferred to the compensation cavity through the capillary structure, the liquid in the compensation cavity is heated, and part of the gas in the evaporation cavity enters the compensation cavity through the capillary pores, forming a reverse heat flow, which reduces the overall pressure drop in the evaporator, resulting in a decrease in the heat transfer efficiency of the entire loop heat pipe. SUMMARY

[0004] To solve the above technical problems, embodiments of the present application provide an evaporator and a loop heat pipe, which can divert part of the heat transferred from the evaporation cavity to the compensation cavity through the capillary structure by the guide flow channel structure in the compensation cavity, so that the gas formed by the liquid working medium in the compensation cavity after being heated enters the gas pipeline of the loop heat pipe, thereby improving the heat transfer efficiency.

[0005] An evaporator, comprising: an evaporation cavity and a compensation cavity;

[0006] A capillary structure is arranged between the evaporation cavity and the compensation cavity;

[0007] A first guide flow channel structure is arranged in the compensation cavity, the first guide flow channel structure has a first end and a second end, the first end is in communication with a gas pipeline of a loop heat pipe, and the second end is in communication with a liquid pipeline of the loop heat pipe, so that gaseous working medium formed by evaporation of liquid working medium in the compensation cavity which absorbs heat from the evaporation cavity through the capillary structure into the compensation cavity flows into the gas pipeline through the first end under the action of the first guide flow channel structure.

[0008] Optionally, the evaporator further comprises: an upper cover plate and a lower cover plate;

[0009] The upper cover plate and the lower cover plate are connected to form a cavity, the cavity includes the evaporation cavity and the compensation cavity, and the evaporation cavity and the compensation cavity are respectively arranged at one side of the cavity.

[0010] Optionally, the capillary structure includes a first capillary structure and a second capillary structure.

[0011] The compensation cavity is in communication with one side of the first capillary structure, the second capillary structure is close to the other side of the first capillary structure, and the capillary force of the first capillary structure is smaller than the capillary force of the second capillary structure, so that the liquid working medium in the compensation cavity flows through the first capillary structure and the second capillary structure.

[0012] Optionally, the first capillary structure is a sheet structure.

[0013] Optionally, the second capillary structure is a strip structure.

[0014] Optionally, the first guide flow channel structure includes at least one Tesla valve structure.

[0015] Optionally, when the first guide flow channel structure includes a plurality of Tesla valve structures, the plurality of Tesla valve structures are connected in series or in parallel.

[0016] A loop heat pipe includes the above-mentioned evaporator, the evaporator includes an evaporation cavity, a capillary structure and a compensation cavity, and the loop heat pipe further includes a gas pipeline, a liquid pipeline and a heat dissipation device.

[0017] The evaporation cavity, the gas pipeline, the heat dissipation device, the liquid pipeline, the compensation cavity and the capillary structure are sequentially communicated to form a first circulation loop.

[0018] The compensation cavity, the gas pipeline, the heat dissipation device and the liquid pipeline are sequentially communicated to form a second circulation loop.

[0019] Optionally, a second guide flow channel structure is arranged in the liquid pipeline, for increasing the flow resistance of the working medium in the liquid pipeline to the heat dissipation device.

[0020] Optionally, the loop heat pipe further includes a gas removal pipeline.

[0021] The gas removal pipeline is used for removing gas in the loop heat pipe.

[0022] The embodiments of the present application have at least the following beneficial effects:

[0023] With the increase of heat flow density, part of heat absorbed by the evaporation cavity is transferred to the compensation cavity through the capillary structure. By setting the guide flow channel structure in the compensation cavity, the liquid working medium in the compensation cavity absorbs heat and vaporizes, and then the gaseous working medium flows from the outlet of the guide flow channel structure to the gas pipeline of the loop heat pipe and then to the heat dissipation device of the loop heat pipe through the one-way flow characteristic of the guide flow channel structure, and the gaseous working medium is liquefied into liquid working medium through the heat dissipation device, thereby taking away part of the heat in the evaporation cavity, thereby greatly improving the heat dissipation performance, and at the same time, part of the gas entering the compensation cavity through the capillary pores flows from the outlet of the guide flow channel structure to the gas pipeline of the loop heat pipe through the one-way flow characteristic of the guide flow channel, thereby avoiding the formation of reverse heat flow in the compensation cavity and affecting the heat dissipation performance. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 An embodiment of the evaporator of the present application is shown in the figure;

[0025] Figure 2 An embodiment of the loop heat pipe of the present application is shown in the figure;

[0026] Figure 3 An embodiment of the loop heat pipe of the present application is shown in the figure; Figure 2 An embodiment of the loop heat pipe of the present application is shown in the figure;

[0027] Figure 4 An embodiment of the loop heat pipe of the present application is shown in the figure; Figure 2 An embodiment of the loop heat pipe of the present application is shown in the figure;

[0028] Figure 5 An embodiment of the loop heat pipe of the present application is shown in the figure; Figure 2 An embodiment of the loop heat pipe of the present application is shown in the figure;

[0029] Figure 6 An embodiment of the loop heat pipe of the present application is shown in the figure. Figure 2 An embodiment of the loop heat pipe of the present application is shown in the figure. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the scheme of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0031] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", "third" are only for the purpose of description and cannot be understood as indicating or implying relative importance.

[0032] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0033] The existing evaporator rises sharply in temperature during heat absorption, however, the heat taken away in the evaporation cavity is limited, part of the heat is quickly transmitted to the compensation cavity through the capillary structure, the liquid in the compensation cavity is heated, at the same time, part of the gas in the evaporation cavity enters the compensation cavity through the capillary pore, so that the overall pressure drop in the evaporator is reduced, resulting in the decrease of the heat transfer efficiency of the whole loop heat pipe. In order to solve the above problems, the embodiments of the present application provide an evaporator and a loop heat pipe, which are provided with a guide flow channel structure to take away part of the heat in the evaporation cavity, so as to greatly improve the heat dissipation performance and bring better experience to the user.

[0034] The evaporator of the present application will be described below. Please refer to Figure 1 The evaporator 11 provided by the present application includes an evaporation cavity and a compensation cavity 10.

[0035] The capillary structure is arranged between the evaporation cavity and the compensation cavity 10, and the capillary structure can draw the liquid working medium from the compensation cavity to the evaporation cavity;

[0036] The first guide flow channel structure is arranged in the compensation cavity 10, and the first guide flow channel structure has a first end and a second end, the first end is communicated with the gas pipeline 5 of the loop heat pipe, and the second end is communicated with the liquid pipeline 7 of the loop heat pipe, so that the gaseous working medium formed by the evaporation of the liquid working medium which absorbs the heat from the evaporation cavity and enters the compensation cavity 10 through the capillary structure in the compensation cavity 10 flows into the gas pipeline 5 through the first end under the action of the first guide flow channel structure.

[0037] The evaporator 11 is provided with a compensation cavity 10 and an evaporation cavity. The evaporation cavity is used to absorb heat from a heat source and vaporize the liquid working medium flowing into the evaporation cavity from the compensation cavity 10 into gas working medium by using the heat. The inlet of the compensation cavity 10 is communicated with the liquid pipeline 7, and the outlet of the compensation cavity 10 is communicated with the gas pipeline 5. Generally, the evaporator 11 is arranged near the heat source so as to absorb heat and cool the heat source. The heat is absorbed by the working medium in the evaporator 11, the liquid working medium absorbs heat by phase change and is vaporized into gas working medium, and finally flows into the gas pipeline 5. The material of the gas pipeline 5 and the liquid pipeline 7 can be copper, aluminum, stainless steel and other metal materials, or can be a flexible PTFE plastic pipe material, which is not limited here;

[0038] The compensation cavity 10 is a first guide flow channel structure, which is used to increase the flow resistance of the working medium in the compensation cavity 10 flowing to the liquid pipeline 7 through the inlet. The guide flow channel structure can be a Tesla valve structure, that is, a flow channel with a Tesla valve structure, or other deformed flow channels that can achieve the same effect, which is not limited here.

[0039] The working principle of the embodiment will be described below. The heat source generates heat, and the evaporator 11 near the heat source absorbs the heat emitted by the heat source. Since there is liquid working medium flowing into the compensation cavity 10 in the evaporation cavity, the liquid working medium absorbs heat and is vaporized into gas working medium, and flows into the gas pipeline 5. At the same time, part of the heat leakage in the evaporation cavity passes through the capillary structure to the compensation cavity 10, and the liquid working medium in the compensation cavity absorbs heat and is vaporized into gas working medium. The compensation cavity 10 is a first guide flow channel structure, which can increase the flow resistance of the working medium in the compensation cavity 10 flowing to the liquid pipeline 7 through the inlet of the compensation cavity 10, while not increasing the flow resistance of the working medium in the compensation cavity 10 flowing to the gas pipeline 5 through the outlet of the compensation cavity 10. Therefore, the gas working medium in the compensation cavity flows to the gas pipeline 5 under the action of the first guide flow channel structure. The working medium in the gas pipeline 5 is condensed and flows to the liquid pipeline 7. The liquid working medium flows into the compensation cavity 10 of the evaporator 11 through the liquid pipeline 7, and the next cycle is performed.

[0040] With the increase of heat flux, part of the heat absorbed by the evaporation cavity is transferred to the compensation cavity 10 through the capillary structure. By arranging the first guide flow channel structure in the compensation cavity 10, the liquid working medium in the compensation cavity 10 absorbs heat and vaporizes, and then the gas working medium flows from the outlet of the first guide flow channel structure to the gas pipeline 5 of the loop heat pipe through the one-way flow characteristic of the first guide flow channel structure, and then flows to the heat dissipation device 6 of the loop heat pipe through the gas pipeline 5. The gaseous working medium is liquefied into liquid working medium through the heat dissipation device 6, thereby taking away part of the heat in the evaporation cavity, thereby greatly improving the heat dissipation performance. At the same time, the first guide flow channel structure can also guide the gas entering the compensation cavity from the evaporation cavity through the capillary pore to flow from the outlet of the first guide flow channel structure to the gas pipeline 5, avoiding the gas flowing from the inlet of the first guide flow channel structure to the liquid pipeline, affecting the circulation of the loop heat pipe, and further causing the heat dissipation performance of the loop heat pipe to decrease.

[0041] Please refer to Figures 2 to 6 An embodiment of the loop heat pipe provided by the present application comprises a gas pipeline 5, a heat dissipation device 6, a liquid pipeline 7, and an evaporator 11. The evaporator 11 is provided with a compensation cavity 10, a capillary structure, and an evaporation cavity 9. The evaporator comprises a lower cover plate 1 and an upper cover plate 4. The upper cover plate 4 and the lower cover plate 1 are connected to form a sealed cavity.

[0042] The evaporator 11 is formed into a sealed cavity by brazing or diffusion welding between the upper cover plate 4 and the lower cover plate 1. The lower cover plate 1 can be in contact with a heat source to absorb heat from the heat source. The material of the upper cover plate 4 and the lower cover plate 1 can be one or more of copper, stainless steel, aluminum, etc., and the specific material is not limited herein. The compensation cavity 10 is arranged on one side of the sealed cavity of the evaporator 11 close to the upper cover plate 4, and the evaporation cavity 9 is arranged on one side of the sealed cavity close to the lower cover plate 1. The capillary structure is arranged between the compensation cavity 10 and the evaporation cavity 9. The inlet of the compensation cavity 10 is in communication with the liquid pipeline 7, and the outlet of the compensation cavity 10 is in communication with the gas pipeline 5. The first guide flow channel structure is arranged in the compensation cavity 10, which is used to increase the flow resistance of the working medium in the compensation cavity 10 flowing through the inlet to the liquid pipeline, so that the gaseous working medium formed by the liquid working medium in the compensation cavity 10 absorbing heat from the evaporation cavity 9 entering the compensation cavity 10 through the capillary structure flows into the gas pipeline 5 through the first end under the action of the first guide flow channel structure.

[0043] In some embodiments, the first guide flow channel structure comprises at least one Tesla valve structure. When the first guide flow channel structure comprises a plurality of Tesla valve structures, the plurality of Tesla valve structures can be connected in series, i.e., the first and last Tesla valve structures are connected in series to form a path, as shown in Figure 3 , or the plurality of Tesla valve structures can be connected in parallel, i.e., there are multiple parallel paths between the inlet and the outlet of the evaporator 11, as shown in Figure 4 . This embodiment is described by taking the series connection as an example.

[0044] In some embodiments, a second guide channel structure is also provided in the liquid pipeline 7 to increase the flow resistance of the working fluid in the liquid pipeline 7 to the heat dissipation device 6.

[0045] In some embodiments, the capillary structure includes a first capillary structure 3 and a second capillary structure 2, which are disposed within the evaporator 11. One side of the first capillary structure 3 is connected to the compensation chamber 10, and the other side of the first capillary structure is connected to the second capillary structure. The second capillary structure is disposed within the evaporation chamber, and the capillary force of the first capillary structure 3 is less than the capillary force of the second capillary structure 2, so that the working fluid of the compensation chamber 10 flows through the first capillary structure 3 and then through the second capillary structure 2.

[0046] In this embodiment, the first capillary structure 3 can be a sheet-like structure. One side of the first capillary structure 3 is in close contact with the compensation cavity 10 and communicates with the compensation cavity 10. The other side of the first capillary structure 3 is connected to the second capillary structure 2.

[0047] In this embodiment, the second capillary structure 2 can be a strip-shaped structure, and multiple strips can be provided; no specific limitation is made here. The materials of the first capillary structure 3 and the second capillary structure 2 can be one or more of the following: copper powder, sintered aluminum powder, copper woven mesh, stainless steel mesh, etc.; no specific limitation is made here.

[0048] In some embodiments, the loop heat pipe further includes a degassing pipe 8, which is connected to the compensation chamber and is used to remove air from the compensation chamber and serve as a channel for injecting working fluid.

[0049] Gas pipeline 5, heat dissipation device 6, liquid pipeline 7, and evaporator 11 are connected in sequence to form a circulation loop. The working fluid circulates in the circulation loop, and the circulation direction of the working fluid is... Figure 3 The loop is counter-clockwise, starting from gas pipe 5, passing through heat dissipation device 6, liquid pipe 7, and evaporator 11, and finally returning to gas pipe 5 to form one cycle. Furthermore, the loop heat pipe is a vacuum loop; the working fluid can be pure water, ethanol, or other types of coolant, which is not limited here. Specifically, evaporator 9, gas pipe 5, heat dissipation device 6, liquid pipe 7, compensation chamber 10, and capillary structure are sequentially connected to form the first loop; compensation chamber 10, gas pipe 5, heat dissipation device 6, and liquid pipe 7 are sequentially connected to form the second loop.

[0050] The evaporator 11 can be arranged above or horizontally to the heat dissipating device 6, and in this embodiment, it is arranged above. The evaporator is provided with a compensation cavity 10 and an evaporation cavity 9. The evaporation cavity 9 is used to absorb heat from the heat source, and use the heat to vaporize the liquid working medium flowing from the compensation cavity 10 into the evaporation cavity 9 into gas working medium. The inlet of the compensation cavity 10 is communicated with the liquid pipeline 7, and the outlet of the compensation cavity 10 is communicated with the gas pipeline 5. Generally, the evaporator 11 is arranged near the heat source so as to absorb heat therefrom and cool the heat source. The heat is absorbed by the working medium in the evaporator 11, the liquid working medium absorbs heat by phase change, vaporizes into gas working medium, and finally flows into the gas pipeline 5;

[0051] The heat dissipating device 6 is used to liquefy the gas working medium flowing from the gas pipeline 5 into the heat dissipating device 6 into liquid working medium, and discharge the liquid working medium into the liquid pipeline 7. The material of the gas pipeline 5 and the liquid pipeline 7 can be copper, aluminum, stainless steel, or plastic pipe material such as PTFE, and the specific material is not limited here;

[0052] The compensation cavity 10 is a first guide flow channel structure, which is used to increase the flow resistance of the working medium in the compensation cavity 10 flowing to the liquid pipeline 7 through the inlet, or in other words, the guide flow channel structure of the compensation cavity 10 can increase the resistance of the working medium in the compensation cavity 10 flowing clockwise, so that the working medium in the compensation cavity 10 is more likely to flow counterclockwise to the gas pipeline 5. The first guide flow channel structure can be a Tesla valve structure, that is, a flow channel with a Tesla valve structure, or other deformed flow channels that can achieve the same effect, and the specific structure is not limited here.

[0053] The working principle of the loop heat pipe of this embodiment will be described below. The gas working medium enters the heat dissipating device 6 through the gas pipeline 5, and the heat dissipating device 6 absorbs heat from the gas working medium, so that the gas working medium is liquefied into liquid working medium by phase change. The liquid working medium flows out of the heat dissipating device 6 and flows into the liquid pipeline 7, and then enters the evaporator 11 after flowing through the guide flow channel in the liquid pipeline 7. Please refer to Figure 3When the evaporator 11 is arranged above, the liquid working medium in the liquid pipeline 7 has a tendency to flow backward under the action of gravity, that is, the working medium has a tendency to flow clockwise, and the second guiding flow channel structure arranged in the liquid pipeline 7 can increase the flow resistance of the working medium in the liquid pipeline 7 to flow to the heat dissipation device 6 without increasing the flow resistance of the working medium in the liquid pipeline 7 to flow to the evaporator 11, that is, the flow resistance of the liquid working medium in the liquid pipeline 7 to flow downward is relatively large, and the flow resistance of the liquid working medium in the liquid pipeline 7 to flow upward is unchanged, and finally the liquid working medium in the liquid pipeline 7 flows upward under the driving of the capillary force. The working medium in the liquid pipeline 7 flows into the compensation cavity 10 through the inlet of the compensation cavity 10, and the compensation cavity 10 is the first guiding flow channel structure, which can increase the flow resistance of the working medium in the compensation cavity 10 to flow to the liquid pipeline 7 through the inlet of the compensation cavity 10 without increasing the flow resistance of the working medium in the compensation cavity 10 to flow to the gas pipeline 5 through the outlet of the compensation cavity 10, that is, the resistance of the working medium to flow counterclockwise is unchanged, and the resistance of the working medium to flow clockwise is greatly increased. Combined with the driving of the capillary force, finally the working medium flows into the compensation cavity 10 through the inlet and flows out of the compensation cavity 10 through the outlet. The liquid circulates counterclockwise in the circulation loop. Specifically, the liquid working medium flows into the compensation cavity 10 in the evaporator 11, part of the working medium still stays in the compensation cavity 10, and the other part of the working medium flows through the first capillary structure 3 and the second capillary structure 2 to the evaporation cavity 9 in contact with the lower cover plate 1 under the action of the capillary force formed by the first capillary structure 3 and the second capillary structure 2. The lower cover plate 1 arranged beside the heat source absorbs the heat emitted by the heat source, part of the heat is absorbed by the liquid working medium in the evaporation cavity 9 and is vaporized into gas working medium, and then flows into the gas pipeline 5 through the hole arranged between the evaporation cavity and the gas pipeline 5, and the other part of the heat is transmitted to the compensation cavity 10 through the capillary structure and is absorbed by the liquid working medium in the compensation cavity 10, vaporized into gas working medium, and flows into the gas pipeline 5 under the action of the Tesla valve structure. The two parts of gas working medium converge and flows into the heat dissipation device 6 through the gas pipeline 5 to perform the next cycle.

[0054] In the embodiment, the second guiding flow channel structure arranged in the liquid pipeline 7, combined with the first guiding flow channel structure design of the compensation cavity 10 close to the upper cover plate 4, can increase the flow resistance of the working medium in the compensation cavity 10 to flow to the liquid pipeline 7 through the inlet of the compensation cavity 10, so that the gas working medium in the compensation cavity can flow to the gas pipeline 5, the liquid working medium in the heat dissipation device 6 flows back to the compensation cavity 10, the flow rate of the forward flow in the circulation loop is greater than that of the backward flow, and the anti-gravity effect is good. In addition, the arrangement in the evaporator 11 can realize two heat absorption methods, that is, the working medium in the compensation cavity 10 absorbs heat and the working medium in the evaporation cavity 9 absorbs heat, which reduces the heat leakage of the loop heat pipe and divides the heat of the high-density heat flow, so that the performance of the loop heat pipe is greatly improved, and users have a very good experience.

[0055] The loop heat pipe provided by the application is described in detail above, and the principle and implementation mode of the application are described by applying specific examples. The above description of the examples is only used to help understand the method of the application and its core idea; meanwhile, for those skilled in the art, according to the idea of the application, the specific implementation mode and application range will be changed, and the above description should not be understood as a limitation on the application.

Claims

1. An evaporator, characterized by The evaporator comprises: an evaporation cavity and a compensation cavity; a capillary structure is arranged between the evaporation cavity and the compensation cavity, and the capillary structure is capable of drawing liquid working medium from the compensation cavity to the evaporation cavity; a first guiding flow channel structure is arranged in the compensation cavity, the first guiding flow channel structure has a first end and a second end, the first end is in communication with a gas pipeline of a loop heat pipe, and the second end is in communication with a liquid pipeline of the loop heat pipe, so that gaseous working medium in the compensation cavity, which is formed by evaporation of liquid working medium that absorbs heat from the evaporation cavity and enters the compensation cavity through the capillary structure, flows into the gas pipeline through the first end under the action of the first guiding flow channel structure; the first guiding flow channel structure comprises at least one Tesla valve structure; the evaporator further comprises a gas removal pipe, which is in communication with the compensation cavity and serves as a channel for removing air in the compensation cavity and injecting liquid working medium.

2. The evaporator of claim 1, wherein, The evaporator further comprises an upper cover plate and a lower cover plate; the upper cover plate and the lower cover plate are connected to form a cavity, the cavity comprises the evaporation cavity and the compensation cavity, and the evaporation cavity and the compensation cavity are respectively arranged on one side of the cavity.

3. The evaporator of claim 1, wherein, The capillary structure comprises a first capillary structure and a second capillary structure; one side of the compensation cavity is in communication with the first capillary structure, the second capillary structure is tightly attached to the other side of the first capillary structure and is arranged in the evaporation cavity, the capillary force of the first capillary structure is smaller than the capillary force of the second capillary structure, and the liquid working medium in the compensation cavity flows through the second capillary structure through the first capillary structure.

4. The evaporator of claim 3, wherein, The first capillary structure is a sheet structure.

5. The evaporator of claim 3, wherein, The second capillary structure is a strip structure.

6. The evaporator of claim 1, wherein, When the first guiding flow channel structure comprises a plurality of Tesla valve structures, the plurality of Tesla valve structures are connected in series or in parallel.

7. A loop heat pipe, characterized by The evaporator according to any one of claims 1-6, a gas pipeline, a liquid pipeline and a heat dissipation device are comprised; the evaporation cavity, the gas pipeline, the heat dissipation device, the liquid pipeline, the compensation cavity and the capillary structure are sequentially connected to form a first circulation loop; the compensation cavity, the gas pipeline, the heat dissipation device and the liquid pipeline are sequentially connected to form a second circulation loop.

8. The loop heat pipe according to claim 7, characterized in that, A second guiding flow channel structure is arranged in the liquid pipeline, which is used to increase the flow resistance of working medium in the liquid pipeline to the heat dissipation device.

Images