Display module, display device and its forming method

Abstract

The present invention relates to a display module, a display device and a forming method thereof. The display module includes: a display panel, including an array substrate, the array substrate having a top surface, a bottom surface and a side surface connecting the top surface and the bottom surface, the top surface and the bottom surface being spaced apart in the thickness direction of the array substrate, the array substrate including a pixel circuit, a plurality of first connection lines provided on the top surface and a plurality of second connection lines provided on the bottom surface, the first connection lines being electrically connected to the pixel circuit; a connection portion, provided on the side surface, the connection portion including a plurality of conductors distributed at intervals, each first connection line being electrically connected to a second connection line through one of the conductors; and an integrated circuit chip, provided on the bottom surface and electrically connected to the second connection line. The present invention can meet the narrow border requirement, is easy to form, and has high reliability.

Description

Technical Field

[0001] The present invention relates to the field of display technologies, and particularly to a display module, a display device and a forming method thereof. Background Art

[0002] In recent years, in order to implement large-sized display devices, the concept and application of splicing multiple display modules have gradually emerged. However, when multiple display modules are spliced into a large-sized display device, the border width of the display panels included in the display modules often causes discontinuity of the display image at the junction between adjacent display panels. Therefore, display panels with narrow borders or no borders are increasingly widely applied to various devices.

[0003] In the existing display panels with narrow borders or no borders, the driving circuit is bent to the back of the display panel and then an integrated circuit chip is bonded. This setting method has the problem that the connection lines on the side of the display panel are easily broken due to the stress of the panel during the manufacturing process, resulting in signal failure, making the reliability of the display module formed after bonding the integrated circuit chip low. Summary of the Invention

[0004] Embodiments of the present invention provide a display module, a display device and a forming method thereof. The display module can meet the narrow border requirement, is easy to form, and has high reliability.

[0005] On the one hand, according to an embodiment of the present invention, a display module is provided, including: a display panel including an array substrate having a top surface, a bottom surface, and a side surface connecting the top surface and the bottom surface. The top surface and the bottom surface are spaced apart in the thickness direction of the array substrate. The array substrate includes a pixel circuit, a plurality of first connection lines disposed on the top surface, and a plurality of second connection lines disposed on the bottom surface. The first connection lines are electrically connected to the pixel circuit; a connection part disposed on the side surface, the connection part including a plurality of conductors distributed at intervals, and each first connection line is electrically connected to a second connection line through one of the conductors; an integrated circuit chip disposed on the bottom surface and electrically connected to the second connection line.

[0006] According to an aspect of an embodiment of the present invention, the conductor is a strip-shaped structure.

[0007] According to an aspect of an embodiment of the present invention, in the thickness direction of the array substrate, each conductor is a structure with an equal cross-section.

[0008] According to an aspect of an embodiment of the present invention, in the thickness direction of the array substrate, the length dimensions of each conductor are the same.

[0009] According to an aspect of an embodiment of the present invention, the conductor includes one or a combination of two or more of silver, copper, aluminum, carbon nanotubes, and graphite powder.

[0010] According to one aspect of an embodiment of the present invention, the number of the first connection lines and the second connection lines is the same and they are arranged in one-to-one correspondence.

[0011] According to one aspect of an embodiment of the present invention, multiple first connection lines are spaced apart, and multiple second connection lines are spaced apart.

[0012] According to one aspect of an embodiment of the present invention, the connection portion further includes an insulator, and the insulator is coated on each conductor.

[0013] According to one aspect of an embodiment of the present invention, the insulator is at least partially located between the conductor and the side surface.

[0014] According to one aspect of an embodiment of the present invention, the first connection line extends to the connection portion and is connected to the conductor, and the second connection line extends to the connection portion and is connected to the conductor.

[0015] According to one aspect of an embodiment of the present invention, the first connection line extends to one end surface of the connection portion facing away from the bonding area, and the second connection line extends to one end surface of the connection portion facing away from the bonding area.

[0016] According to one aspect of an embodiment of the present invention, the cross-section of the connection portion in the thickness direction of the array substrate is integrally rectangular.

[0017] According to one aspect of an embodiment of the present invention, the insulator is a viscous colloid.

[0018] According to one aspect of an embodiment of the present invention, the integrated circuit chip includes a flip chip thin film, and the flip chip thin film is electrically connected to the second connection line.

[0019] On the other hand, according to an embodiment of the present invention, a display device is provided, which includes a plurality of the above-mentioned display modules. The plurality of display modules are distributed in rows and columns. In the row direction, the connection portion of each display module is docked with an adjacent display module.

[0020] According to another aspect of an embodiment of the present invention, the display device further includes a fixing frame, and the fixing frame has a receiving cavity, and a plurality of display modules are all located in the receiving cavity.

[0021] In still another aspect, according to an embodiment of the present invention, a forming method of a display device is provided, including:

[0022] Providing a plurality of panel monomers, the panel monomers include an array substrate, the array substrate has a top surface, a bottom surface, and a side surface connecting the top surface and the bottom surface, the top surface and the bottom surface are spaced apart in the thickness direction of the panel monomer, and the array substrate includes a pixel circuit;

[0023] Providing a connection portion on the side surface of each panel monomer, the connection portion includes a plurality of spaced conductors;

[0024] Arrange multiple panel units in rows and columns. In the row direction, the connecting parts on each panel unit are butted against adjacent panel units.

[0025] Form multiple first connecting lines on the top surface of each panel unit, and each first connecting line is electrically connected to one of the conductors located on the same panel unit.

[0026] Form multiple second connecting lines on the bottom surface of each panel unit, and each second connecting line is electrically connected to one of the conductors located on the same panel unit.

[0027] Bind integrated circuit chips on the second connecting lines of each panel unit.

[0028] According to another aspect of the embodiment of the present invention, in the step of setting the connecting parts on the side surfaces of each panel unit, the connecting parts provided on the side surfaces further include insulators, and the insulators are coated on each conductor and connected to the side surfaces.

[0029] In another aspect, a forming method of a display device is proposed according to the embodiment of the present invention, including:

[0030] Provide multiple panel units. The panel unit includes an array substrate, the array substrate has a top surface, a bottom surface, and side surfaces connecting the top surface and the bottom surface, the top surface and the bottom surface are spaced apart in the thickness direction of the panel unit, and the array substrate includes a pixel circuit.

[0031] Arrange multiple panel units in rows and columns. In the row direction, every two adjacent panel units are spaced apart to form a gap.

[0032] Form a conductor layer in the gap between each panel unit.

[0033] Pattern the conductor layer along the thickness direction to form connecting parts on the side surfaces of each panel unit. The connecting parts include multiple conductors distributed at intervals.

[0034] Form multiple first connecting lines on the top surface of each panel unit, and each first connecting line is electrically connected to one of the conductors located on the same panel unit.

[0035] Form multiple second connecting lines on the bottom surface of each panel unit, and each second connecting line is electrically connected to one of the conductors located on the same panel unit.

[0036] Bind integrated circuit chips on the second connecting lines of each panel unit.

[0037] According to the display module, display device and forming method thereof provided by an embodiment of the present invention, it includes a display panel, a connection part and an integrated circuit chip. Since the connection part is arranged on the side surface of the array substrate, and the connection part includes a conductor, the conductor can be connected to the pixel circuit on the array substrate through a first connection line and connected to the integrated circuit chip on the back surface of the array substrate through a second connection line. Through the above arrangement, the electrical connection and control requirements between the integrated circuit chip and the pixel circuit can be satisfied. On the basis of meeting the narrow border of the display module, the problem of disconnection of the connection line caused by factors such as bending of the connection line or stress action on the display panel can be avoided, ensuring smooth signal transmission and improving the reliability of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The features, advantages and technical effects of exemplary embodiments of the present invention will be described below with reference to the drawings.

[0039] Figure 1 is a configuration block diagram of a display module according to an embodiment of the present invention;

[0040] Figure 2 is a top view of a display module according to an embodiment of the present invention;

[0041] Figure 3 is Figure 2 a cross-sectional view along the B-B direction;

[0042] Figure 4 is a top view of a display module with the first connection line hidden according to an embodiment of the present invention;

[0043] Figure 5 is a top view of a display module according to another embodiment of the present invention;

[0044] Figure 6 is Figure 5 a cross-sectional view along the C-C direction in;

[0045] Figure 7 is a schematic structural diagram of a connection part according to an embodiment of the present invention;

[0046] Figure 8 is Figure 7 a cross-sectional view along the D-D direction in;

[0047] Figure 9 is a schematic structural diagram of a connection part according to another embodiment of the present invention;

[0048] Figure 10 is a schematic structural diagram of a display device according to an embodiment of the present invention;

[0049] Figure 11 is a schematic structural diagram of a display device according to another embodiment of the present invention;

[0050] Figure 12 It is a schematic flow chart of a forming method of a display device according to an embodiment of the present invention;

[0051] Figures 13 to 18 It is a schematic structural diagram corresponding to each step of the forming method of the display device according to an embodiment of the present invention;

[0052] Figure 19 It is a schematic flow chart of a forming method of a display device according to another embodiment of the present invention;

[0053] Figures 20 to 27 It is a schematic structural diagram corresponding to each step of the forming method of the display device according to another embodiment of the present invention.

[0054] Wherein:

[0055] 100 - display module;

[0056] 10 - display panel; 11 - array substrate; 11a - top surface; 11b - bottom surface; 11c - side surface; 111 - first connection line; 112 - second connection line; 113 - pixel circuit; 12 - light-emitting layer;

[0057] 20 - connection part; 21 - insulator; 22 - conductor; 22a - conductor layer; 23 - gap; 24 - sealing plate;

[0058] 30 - integrated circuit chip;

[0059] 200 - fixing frame;

[0060] 300 - panel unit;

[0061] 400 - support structure;

[0062] X - thickness direction; Y - first direction; AA - display area; NA - bonding area.

[0063] In the drawings, the same components are denoted by the same reference numerals. The drawings are not drawn to actual scale. Detailed Embodiments

[0064] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the objectives, technical solutions and advantages of the present invention more clear and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present invention and are used to exemplarily illustrate the principles of the present invention, and are not configured to limit the present invention. Additionally, the components in the drawings are not necessarily drawn to scale. For example, the dimensions of some components or regions in the drawings may be enlarged for other components or regions to assist in understanding the embodiments of the present invention.

[0065] The orientation terms used in the following description are all the directions shown in the figures, and do not limit the specific structure of the embodiments of the present invention. In the description of the present invention, it should be noted that unless otherwise specified, the terms "mounted", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0066] In addition, the terms "comprising", "including", "having" or any other variants thereof are intended to cover non-exclusive inclusion, so that a structure or component including a series of elements not only includes those elements, but also includes other elements that are not explicitly listed or are inherent to the structure or component. Without further limitation, the elements defined by the statement "including..." do not exclude the existence of additional identical elements in the article or device including the elements. For those skilled in the art, the present invention can be implemented without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by showing examples of the present invention.

[0067] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In addition, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0068] For a better understanding of the present invention, the following Figures 1 to 27 will describe in detail a display module, a display device, and a forming method thereof according to an embodiment of the present invention.

[0069] When the display module is in operation, its display panel needs to be connected to a gate driver, a data driver, a power supply line, etc. The display panel is controlled to display by the gate driver and the data driver. The gate driver, the data driver, the power supply line, etc. can be provided as integrated circuits, and integrated circuit chips are formed and bonded to the display panel and connected to the pixel circuit of the display panel to control the image display of the display panel.

[0070] In order to enable the display panel to form a narrow border, usually a part of its wiring layer is bent so that the integrated circuit chip is bonded to the side opposite to the light emitting direction of the display area to meet the narrow border requirement. The above setting method has the problem that the connection lines on the side of the display panel are easily broken, resulting in signal failure, and the reliability of the display module formed after connecting the integrated circuit chips is low.

[0071] Therefore, based on the technical problems existing in the above display module, the embodiments of the present invention provide a new display module that can meet the narrow border requirement and has high reliability.

[0072] As shown Figures 1 to 4 in the figure, the display module 100 provided by the embodiment of the present invention includes a display panel 10, a connection part 20, and an integrated circuit chip 30. The display panel 10 includes an array substrate 11. The array substrate 11 has a top surface 11a, a bottom surface 11b, and a side surface 11c connecting the top surface 11a and the bottom surface 11b. The top surface 11a and the bottom surface 11b are spaced apart in the thickness direction X of the array substrate 11. The array substrate 11 includes pixel circuits 113, a plurality of first connection lines 111 disposed on the top surface 11a, and a plurality of second connection lines 112 disposed on the bottom surface 11b. The first connection lines 111 are electrically connected to the pixel circuits 113. The connection part 20 is disposed on the side surface 11c. The connection part 20 includes a plurality of conductors 22 distributed at intervals. Each first connection line 111 is electrically connected to a second connection line 112 through one of the conductors 22. The integrated circuit chip 30 is disposed on the bottom surface 11b and is electrically connected to the second connection line 112.

[0073] According to the display module 100 provided by the embodiment of the present invention, since the connection part 20 is disposed on the side surface 11c of the array substrate 11, and the connection part 20 includes a plurality of conductors 22 distributed at intervals, the conductors 22 can be connected to the pixel circuits 113 on the array substrate 11 through the first connection lines 111, and are connected to the integrated circuit chip 30 on the back surface of the array substrate 11 through the second connection lines 112. Through the above arrangement, the electrical connection and control requirements between the integrated circuit chip 30 and the pixel circuits 113 can be satisfied, and on the basis of meeting the narrow border of the display module 100, the problem of the connection line break caused by factors such as the bending of the connection line or the stress effect of the display panel can be avoided, ensuring smooth signal transmission and improving the reliability of the display module.

[0074] Optionally, the display panel 10 has a display area AA and a bonding area NA disposed on one side of the display area AA. The pixel circuits are disposed in the display area AA, and the first connection lines 111, the second connection lines 112, and the connection part 20 are all located in the bonding area NA.

[0075] As an optional implementation manner, for the display module 100 provided by the embodiment of the present invention, the display panel 10 further includes a light-emitting layer 12 stacked on the top surface 11a of the array substrate 11. The light-emitting layer 12 is located in the display area AA. The light-emitting layer 12 includes light-emitting units distributed in an array. The pixel circuits 113 are connected to the light-emitting units and are used to control the light-emitting units.

[0076] In some optional embodiments, each of the conductors 22 is a strip-shaped structure. With the above structural form of the conductors 22, it is beneficial to meet the connection requirements between the conductors 22 and the corresponding first connection lines 111 and second connection lines 112 on the basis of meeting the signal transmission requirements.

[0077] In some alternative embodiments, in the thickness direction X of the array substrate 11, each conductor 22 may be a strip-shaped structure.

[0078] In some alternative embodiments, the conductor 22 is a structure with a uniform cross-section in the thickness direction X of the array substrate 11. Through the above arrangement, the distance between two adjacent conductors 22 can be reduced, ensuring that the distance between them is the same everywhere, and avoiding the occurrence of contact short-circuit between two adjacent conductors 22 due to dimensional mutation of a certain conductor 22 in the thickness direction X.

[0079] Such as Figures 2 to 4 As shown, as an alternative embodiment, the cross-section of the conductor 22 in the thickness direction X may be a rectangle.

[0080] As an alternative embodiment, in the thickness direction X of the array substrate 11, the length dimensions of each conductor 22 are the same. Through the above arrangement, it is beneficial to ensure the consistency of each first connection line 111 on the top surface 11a of the array substrate 11 and the consistency of each second connection line 112 on the bottom surface 11b, and avoid the problem of poor contact between a certain conductor 22 and the corresponding first connection line 111 or second connection line 112 due to the size of a certain conductor 22 being too large or too small in the direction perpendicular to the side surface 11c.

[0081] As an alternative embodiment, in the thickness direction X of the array substrate 11, the sides of each conductor 22 facing the top surface 11 are flush with each other, and the sides of each conductor 22 facing the bottom surface 11b are flush with each other.

[0082] In some alternative embodiments, the conductor 22 includes one or a combination of two or more of silver, copper, aluminum, carbon nanotubes, and graphite powder.

[0083] The conductor 22 may include only silver, or only copper, or only aluminum, or only carbon nanotubes, or only graphite powder. Of course, it may also include a combination of at least two of the above materials. By using the above materials for the conductor 22, the connection requirements with the first connection line 111 and the second connection line 112 can be reliably met, and at the same time, the impedance during signal transmission can be reduced.

[0084] Such as Figures 5 to 7 As shown, as an alternative embodiment, in the display module 100 provided by the embodiment of the present invention, the connection portion 20 further includes an insulator 21, and the insulator 21 is coated around each conductor 22 and connected to the side surface 11c. By providing the insulator 21, each conductor 22 can be protected to avoid the risk of short-circuit between conductors 22.

[0085] Optionally, each conductor 22 can be directly connected to the side surface 11c. Of course, in some embodiments, the outer periphery of the conductor 22 can also be completely coated within the insulator 21, and the conductor 22 is indirectly connected to the side surface 11c through the insulator 21.

[0086] As Figures 5 to 7 shown, in some alternative embodiments, the insulator 21 is at least partially located between the conductor 22 and the side surface 11c of the array substrate 11. Through the above arrangement, the conductor 22 and the side surface 11c of the array substrate 11 are separated by the insulator 21 to protect the conductor 22 and ensure the safety performance of the conductor 22.

[0087] As an alternative implementation, the first connection line 111 extends to the connection portion 20 and is electrically connected. Through the above arrangement, the positive projection of the first connection line 111 in the thickness direction X can cover the positive projection of the connected conductor 22 in the thickness direction X, so that one end of the conductor 22 in the thickness direction X is conducive to contacting and electrically connecting with the first connection line 111, ensuring the reliability of the electrical connection between the first connection line 111 and the corresponding conductor 22.

[0088] Optionally, the first connection line 111 extends to the end face of the connection portion 20 away from the bonding area NA, improving the reliability of the electrical connection between the first connection line 111 and the corresponding conductor 22.

[0089] As an alternative implementation, the second connection line 112 extends to the connection portion 20 and is electrically connected to the conductor 22. Through the above arrangement, the positive projection of the second connection line 112 in the thickness direction X can cover the positive projection of the connected conductor 22 in the thickness direction X, so that the other end of the conductor 22 in the thickness direction X is conducive to contacting and electrically connecting with the second connection line 112, ensuring the reliability of the electrical connection between the second connection line 112 and the corresponding conductor 22.

[0090] Optionally, the second connection line 112 extends to the end face of the connection portion 20 away from the bonding area NA, improving the reliability of the electrical connection between the second connection line 112 and the corresponding conductor 22.

[0091] As an alternative implementation, in the display module 100 provided by the embodiment of the present invention, the insulator 21 of the connection portion 20 can be a viscous colloid. With the above arrangement of the insulator 21, the requirements for coating and fixing each conductor 22 can be met to fix the relative positions of the conductors 22. Moreover, the insulator 21 can also be connected to the side surface 11c of the array substrate 11 by means of adhesion.

[0092] In some optional embodiments, for the display module 100 provided by the embodiments of the present invention, the number of the first connection lines 111 and the second connection lines 112 included therein is the same and they are arranged in one-to-one correspondence. Through the above arrangement, it is convenient for the corresponding conductor 22 to connect the relatively arranged first connection line 111 and the second connection line 112, so that the travel of the conductor 22 for connecting the relatively arranged first connection line 111 and the second connection line 112 is the shortest, and further reduces the risk of the conductor 22 breaking and opening.

[0093] Optionally, the number of the first connection lines 111 and the second connection lines 112 is the same and they are arranged in one-to-one correspondence in the thickness direction X of the array substrate 11.

[0094] In some optional embodiments, multiple first connection lines 111 are distributed at intervals to avoid short circuit caused by overlapping between two adjacent first connection lines 111. Optionally, multiple second connection lines 112 are distributed at intervals to avoid short circuit caused by overlapping between two adjacent second connection lines.

[0095] As an optional implementation manner, for the display module 100 provided by the above embodiments of the present invention, the cross-section of the conductor 22 in the thickness direction X is taken as a rectangle for illustration, which is an optional implementation manner.

[0096] As Figure 7 and Figure 8 shown, in some embodiments, the cross-section of the conductor 22 in the thickness direction X can also be circular.

[0097] As Figure 9 shown, in some embodiments, the cross-section of the conductor 22 in the thickness direction X can also be elliptical.

[0098] As Figures 5 to 9 shown, in some optional embodiments, for the display module 100 provided by the embodiments of the present invention, the cross-section of the whole connecting portion 20 in the thickness direction X is rectangular. Through the above arrangement, the maximum distance D between the surface of the connecting portion 20 facing away from the side surface 11c and the side surface 11c can be reduced, so that when multiple display modules 100 are spliced to form a display device, the distance between two adjacent display modules 100 is reduced, and the continuity at the junction of two adjacent display modules 100 is ensured.

[0099] As Figures 4 to 9As shown, as an alternative embodiment, for the display module 100 provided by the embodiments of the present invention, the maximum distance D between the surface of the connection portion 20 facing away from the side surface 11c and the side surface 11c is any value between 10 micrometers and 40 micrometers, including the two end values of 10 micrometers and 40 micrometers, and can be optionally any value between 10 micrometers and 20 micrometers. For example, it can be 15 micrometers, 18 micrometers, etc. It can not only meet the connection requirements between the integrated circuit chip 30 and the pixel circuit 113 on the array substrate 11, but also effectively ensure the continuity at the junction of two adjacent display modules 100.

[0100] In some alternative embodiments, the integrated circuit chip 30 includes a flip-chip thin film, and the flip-chip thin film is electrically connected to the second connection line 112. It can ensure the control requirements for the pixel circuit 113.

[0101] As Figure 10 As shown, on the other hand, the embodiments of the present invention further provide a display device, including a plurality of display modules 100 provided in any of the above embodiments. The plurality of display modules 100 are distributed in rows and columns. In the row direction, the connection portion 20 of each display module 100 is butted against an adjacent display module 100.

[0102] The display device provided by the embodiments of the present invention includes the display modules 100 of the above embodiments. Since the connection portions 20 of the respective display modules 100 included therein are provided on the side surface 11c of the array substrate 11 in the bonding area NA, and the connection portion 20 includes conductors 22 distributed at intervals, the conductors 22 can be connected to the pixel circuit 113 on the array substrate 11 through the first connection line 111 and connected to the integrated circuit chip 30 on the back surface of the array substrate 11 through the second connection line 112. That is, it can meet the electrical connection and control requirements between the integrated circuit chip 30 and the pixel circuit 113, so that the connection portion 20 can be directly connected to the side surface 11c of the array substrate 11 as a finished product, effectively avoiding the breakage of the conductors 22 due to the stress of the display panel 10, ensuring smooth signal transmission, and improving the overall reliability of the display device. Moreover, adopting the connection form of the connection portion 20 can meet the narrow bezel requirements of the display module 100, making the continuity at the junction of the display device formed by splicing the respective display modules 100 good, and optimizing the picture display effect of the display device.

[0103] Optionally, the connection portion 20 of each display module 100 is butted against the display area AA of an adjacent display module 100.

[0104] As Figure 11As shown, as an alternative implementation, the display device provided by the embodiment of the present invention further includes a fixing frame 200. The fixing frame 200 has a receiving cavity, and a plurality of display modules 100 are all located in the receiving cavity. By providing the fixing frame 200, it is beneficial to fix the relative positions of the display modules 100, so that no additional fixing parts are required between two adjacent display modules 100, facilitating the splicing and disassembly of the display modules 100. Moreover, when one or more display modules 100 are damaged, it is beneficial for the repair and replacement of the display modules 100.

[0105] As Figures 12 to 17 , on the other hand, the embodiment of the present invention further provides a forming method of a display device, including:

[0106] S110, as Figure 13 shown, provide a plurality of panel units 300. For the sake of simplifying the drawings, only two panel units 300 are taken as an example in Figure 11 . The panel unit 300 includes an array substrate 11. The array substrate 11 has a top surface 11a, a bottom surface 11b, and a side surface 11c connecting the top surface 11a and the bottom surface 11b. The top surface 11a and the bottom surface 11b are spaced apart in the thickness direction X of the panel unit 300. The array substrate 11 includes a pixel circuit (not shown in the figure).

[0107] S120, as Figure 14 shown, provide a connecting part 20 on the side surface 11c of each panel unit 300. The connecting part 20 includes a plurality of conductors 22 distributed at intervals.

[0108] S130, as Figure 15 shown, arrange a plurality of panel units 300 in rows and columns. In the row direction, the connecting part 20 on each panel unit 300 is docked with the adjacent panel unit 300.

[0109] S140, as Figure 16 shown, form a plurality of first connecting lines 111 on the top surface 11a of each panel unit 300, and each first connecting line 111 is electrically connected to one of the conductors 22 located on the same panel unit 300.

[0110] S150, as Figure 17 shown, form a plurality of second connecting lines 112 on the bottom surface 11b of each panel unit 300, and each second connecting line 112 is electrically connected to one of the conductors 22 located on the same panel unit 300.

[0111] S160, as Figure 18 shown, bind an integrated circuit chip 30 on the second connecting line 112 on the side of the bottom surface 11b of each panel unit 300.

[0112] In step S110, the provided panel unit 300 has a display area AA and a bonding area NA provided on one side of the display area AA, and the pixel circuit is provided in the display area AA. The display panel 300 may further include a light-emitting layer 12 laminated on the top surface 11a of the array substrate 11. The light-emitting layer 12 is located in the display area AA. The light-emitting layer 12 includes light-emitting units distributed in an array. The pixel circuit 113 is connected to the light-emitting units and is used to control the light-emitting units. The provided panel units 300 can be respectively placed on a support structure 400. The support structure 400 may have a negative pressure adsorption ability to fix the panel unit 300 by negative pressure adsorption.

[0113] In step S120, the structural form of the provided connection portion 20 can be the connection portion 20 corresponding to each embodiment in the above display module 100, and will not be further described here. The connection portion 20 is connected to a portion of the side surface 11c located in the bonding area NA of the display panel 10. The connection portion 20 and the side surface 11c can be connected to each other by an adhesive method, and the connection portion 20 can be directly adhered to the side surface 11c.

[0114] In step S130, the number of the panel units 300 distributed in the row direction and the column direction is not specifically limited, and can be specifically set according to the required size of the display device to be formed. The connection portion 20 on each panel unit 300 is docked with a portion of the side surface 11c of the adjacent panel unit 300 located in the display area AA. They can be in direct contact and fit with each other, or they can be adhesively connected.

[0115] In step S140, a plurality of first connection lines 111 can be formed on the top surface 11a of each panel unit 300 synchronously. Of course, a plurality of first connection lines 111 can also be formed on the top surfaces 11a of some of the panel units 300. Or a plurality of first connection lines 111 can be separately formed on the top surface 11a of each panel unit 300.

[0116] Optionally, a first metal layer can be formed on the top surface 11a of a predetermined number of panel units 300, and the first metal layer can be patterned to form a plurality of first connection lines 111 on the top surface 11a of each of the predetermined number of panel units 300. The arrangement form of the formed first connection lines 111 on the top surface 11a, the position and connection relationship with the connection portion 20 are the same as those introduced in the above display module 100 in each embodiment, and will not be repeated here.

[0117] In step S150, multiple second connection lines 112 can be formed on the bottom surface 11b of each panel unit 300. Of course, multiple second connection lines 112 can also be formed on the bottom surfaces 11b of a partial number of panel units 300, or multiple second connection lines 112 can be separately formed on the bottom surface 11b of each panel unit 300.

[0118] Optionally, a second metal layer can be formed on the ground surface of a predetermined number of panel units 300, and the second metal layer can be patterned to form multiple second connection lines 112 on the bottom surface 11b of each of the predetermined number of panel units 300. The arrangement form of the formed second connection lines 112 on the bottom surface 11b, the position and connection relationship with the connection part 20 are the same as those introduced in the above embodiments in the display module 100, and will not be repeated here.

[0119] In step S160, the integrated circuit chip 30 can include a chip-on-film, which is beneficial to bonding the chip-on-film with the second connection lines 112 to form a display device.

[0120] The panel unit 300, the first connection lines 111, the second connection lines 112, the connection part 20, and the integrated circuit chip 30 together form the display module 100 provided in the above embodiments.

[0121] As an optional implementation manner, in step S120, the connection part provided in the bonding area further includes an insulator 21, and the insulator 21 is coated around each conductor 22 and is connected to the side surface 11c. The connection part 20 including the insulator 21 and the conductor 22 can be pre-fabricated. In step S120, the connection part 20 can be directly connected to the side surface 11c by means of adhesive connection or the like.

[0122] The forming method of the display device provided by the embodiments of the present invention can be used to form the display devices provided in the above embodiments. By providing a connection part 20 on the side surface 11c of the panel unit 300, forming a first connection line 111 corresponding to the top surface 11a of the panel unit 300, and forming a second connection line 112 corresponding to the bottom surface 11b, the conductor 22 can be connected to the pixel circuit 113 on the array substrate 11 through the first connection line 111 and connected to the integrated circuit chip 30 on the back of the array substrate 11 through the second connection line 112, that is, the electrical connection and control requirements between the integrated circuit chip 30 and the pixel circuit 113 can be satisfied, so that the connection part 20 can be a finished product directly connected to the side surface 11c of the array substrate 11, effectively avoiding the fracture of the conductor 22 due to the stress of the display panel, ensuring smooth signal transmission, and improving the overall reliability of the display device. Moreover, by adopting the form of providing the connection part 20 for connection, the narrow border requirement of the display module 100 can be satisfied, the continuity at the junction of the display devices formed by splicing the display modules 100 can be ensured, and the picture display effect of the display device can be optimized.

[0123] As Figures 19 to 27 , on the other hand, an embodiment of the present invention further provides a forming method for a display device, including:

[0124] S210, as Figure 20 shown, provide a plurality of panel units 300. The panel unit 300 includes an array substrate 11. The array substrate 11 has a top surface 11a, a bottom surface 11b, and a side surface 11c connecting the top surface 11a and the bottom surface 11b. The top surface 11a and the bottom surface 11b are spaced apart in the thickness direction X of the panel unit 300. The array substrate 11 includes a pixel circuit.

[0125] S220, as Figure 21 shown, arrange the plurality of panel units 300 in rows and columns. In the row direction, every two adjacent panel units 300 are spaced apart to form a gap 23.

[0126] S230, as Figure 22 and Figure 23 shown, Figure 23 is Figure 22 a top view. A conductor layer 22a is formed in the gap 23 between each panel unit 300.

[0127] S240, as Figure 24 shown, pattern the conductor layer 22a in the thickness direction X to form a connection part 20 on the side surface 11c of each panel unit 300. The connection part 20 includes a plurality of spaced-apart conductors 22.

[0128] S250, as Figure 25 shown, form a plurality of first connection lines 111 on the top surface 11a of each panel unit 300. Each first connection line 111 is electrically connected to one of the conductors 22 located on the same panel unit 300.

[0129] S260, as Figure 26 shown, form a plurality of second connection lines 112 on the bottom surface 11b of each panel unit 300. Each second connection line 112 is electrically connected to one of the conductors 22 located on the same panel unit 300.

[0130] S270, as Figure 27 shown, bind an integrated circuit chip 30 to the second connection line 112 of each panel unit 300.

[0131] In step S210, the provided panel unit 300 has a display area AA and a bonding area NA provided on one side of the display area AA, and the pixel circuit is located in the display area AA. The panel unit 300 may further include a light-emitting layer 12 laminated on the top surface 11a of the array substrate 11. The light-emitting layer 12 is located in the display area AA. The light-emitting layer 12 includes light-emitting units distributed in an array. The pixel circuit 113 is connected to the light-emitting units and is used to control the light-emitting units. The provided panel units 300 can be respectively placed on a support structure 400. The support structure 400 may have a negative pressure adsorption ability to fix the panel unit 300 by negative pressure adsorption.

[0132] In step S220, in the row direction, the bonding area NA of one of every two adjacent panel units 300 is adjacent to the display area AA of the other to form a gap 23. The size of the formed gap 23 can be any value between 10 μm and 40 μm, including the two end values of 10 μm and 40 μm, and can be optionally any value between 10 μm and 20 μm. For example, it can be 15 μm, 18 μm, etc.

[0133] In step S230, a conductor layer 22a can be formed in each gap 23 by sputtering, deposition, etc. One end of the conductor layer 22a in the thickness direction X can be flush with the bottom surface 11b and the other end can be flush with the top surface 11a.

[0134] As Figure 22 shown, optionally, when performing step S200, a sealing plate 24 can be provided to support the formed conductor layer 22a.

[0135] In step S240, an etching process can be used to etch the conductor layer 22a on one side in the thickness direction X to form a plurality of conductors 22 in each gap 22a. Each conductor 22 extends along the thickness direction X. One end of each conductor 22 in the thickness direction X is flush with the bottom surface 11b and the other end is flush with the top surface 11a.

[0136] In step S250, a plurality of first connection lines 111 can be formed on the top surface 11a of each panel unit 300 synchronously. Of course, a plurality of first connection lines 111 can also be formed on the top surfaces 11a of some of the panel units 300. Or a plurality of first connection lines 111 can be formed separately on the top surface 11a of each panel unit 300.

[0137] Optionally, a first metal layer may be formed on the top surface 11a of a predetermined number of panel units 300, and the first metal layer may be patterned to form a plurality of first connection lines 111 on the top surface 11a of each of the predetermined number of panel units 300. The arrangement form of the formed first connection lines 111 on the top surface 11a, the position and connection relationship with the connection portion 20 are the same as those introduced in the above embodiments in the display module 100, and will not be repeated here.

[0138] In step S260, a plurality of second connection lines 112 may be formed on the bottom surface 11b of each panel unit 300 synchronously. Of course, a plurality of second connection lines 112 may also be formed on the bottom surface 11b of a partial number of panel units 300, or a plurality of second connection lines 112 may be formed on the bottom surface 11b of each panel unit 300 separately.

[0139] Optionally, a second metal layer may be formed on the bottom surface of a predetermined number of panel units 300, and the second metal layer may be patterned to form a plurality of second connection lines 112 on the bottom surface 11b of each of the predetermined number of panel units 300. The arrangement form of the formed second connection lines 112 on the bottom surface 11b, the position and connection relationship with the connection portion 20 are the same as those introduced in the above embodiments in the display module 100, and will not be repeated here.

[0140] In step S270, the integrated circuit chip 30 may include a flip chip thin film, which is conducive to binding the flip chip thin film to the second connection lines 112 to form a display device.

[0141] As an optional implementation manner, before step S270, an insulator forming step may also be included, where an insulator is formed at the patterned conductor layer, the insulator is arranged to cover the conductor, and both ends of the conductor in the thickness direction are exposed from the insulator.

[0142] The forming method of the display device provided by the embodiments of the present invention can be used to form the display devices provided in the above embodiments. By first forming a conductor layer 22a on the part of the side surface 11c of the panel unit 300 located in the bonding area NA, then patterning the conductor layer 22a to form a plurality of conductors 22, and then forming the first connection lines 111 and the second connection lines 112 and binding the integrated circuit chip 30, it can meet the electrical connection and control requirements between the integrated circuit chip 30 and the pixel circuit 113, and avoid the conductors 22 from being broken due to the stress of the display panel, ensure smooth signal transmission, improve the overall reliability of the display device, and can increase the thickness of the conductors 22 and reduce the resistance. Moreover, with this setting method, the conductors 22 are patterned vertically without bending, there will be no open circuit, and at the same time, the operation is simple and conducive to forming.

[0143] Although the present invention has been described with reference to preferred embodiments, various modifications can be made thereto and components thereof can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any manner. The present invention is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display module, characterized in that, Comprising: A display panel, including an array substrate, the array substrate having a top surface, a bottom surface, and a side surface connecting the top surface and the bottom surface, the top surface and the bottom surface being spaced apart in the thickness direction of the array substrate, the array substrate including pixel circuits, a plurality of first connection lines disposed on the top surface, and a plurality of second connection lines disposed on the bottom surface, the first connection lines being electrically connected to the pixel circuits; A connection portion, disposed on the side surface, the connection portion including a plurality of conductors spaced apart from each other, each of the first connection lines being electrically connected to one of the second connection lines through one of the conductors, the connection portion further including an insulator, the insulator covering the conductors, the insulator being located between the conductors and the side surface, and the insulator being located on a side of the conductors away from the side surface, the insulator being a viscous colloid, the connection portion being connected to the side surface by an adhesive connection method, the first connection lines extending to the connection portion and being electrically connected to the conductors, and / or, the second connection lines extending to the connection portion and being connected to the conductors, a positive projection of the first connection lines and / or the second connection lines in the thickness direction covering a positive projection of the conductors in the thickness direction; An integrated circuit chip, disposed on the bottom surface and electrically connected to the second connection lines.

2. The display module according to claim 1, wherein The conductors are strip-shaped structures.

3. The display module according to claim 2, wherein In the thickness direction of the array substrate, each of the conductors is a structure with a constant cross-section.

4. The display module according to claim 2, wherein In the thickness direction of the array substrate, the length dimensions of each of the conductors are the same.

5. The display module according to claim 2, wherein The conductors include one or a combination of two or more of silver, copper, aluminum, carbon nanotubes, and graphite powder.

6. The display module according to claim 1, wherein The number of the first connection lines is the same as that of the second connection lines and they are arranged in one-to-one correspondence; and / or, the plurality of first connection lines are spaced apart from each other, and the plurality of second connection lines are spaced apart from each other.

7. The display module according to claim 1, wherein A cross-section of the connection portion in the thickness direction of the array substrate is integrally rectangular; and / or, the integrated circuit chip includes a flip-chip thin film, the flip-chip thin film being electrically connected to the second connection lines.

8. A display device, characterized in that, Including a plurality of display modules as described in any one of claims 1 to 7, the plurality of display modules being arranged in rows and columns, in the row direction, the connection portion of each display module being docked with an adjacent display module.

9. A forming method of a display device, characterized in that, Comprising: Providing a plurality of panel units, each panel unit including an array substrate, the array substrate having a top surface, a bottom surface, and a side surface connecting the top surface and the bottom surface, the top surface and the bottom surface being spaced apart in the thickness direction of the panel unit, the array substrate including pixel circuits; A connection portion is disposed on the side surface of each of the panel units, the connection portion including a plurality of conductors spaced apart from each other, the connection portion disposed on the side surface further including an insulator, the insulator covering each of the conductors, the insulator being located between the conductors and the side surface, and the insulator being located on a side of the conductors away from the side surface, the insulator being a viscous colloid, and the connection portion being adhered to the side surface; Arrange multiple panel monomers in rows and columns. In the row direction, the connecting parts on each panel monomer are butted against adjacent panel monomers. Form multiple first connecting lines on the top surface of each panel monomer, and each first connecting line is electrically connected to one of the conductors located on the same panel monomer. Form multiple second connecting lines on the bottom surface of each panel monomer, and each second connecting line is electrically connected to one of the conductors located on the same panel monomer. The orthographic projection of the first connecting line and / or the second connecting line in the thickness direction covers the orthographic projection of the conductor in the thickness direction. Bind integrated circuit chips on the second connecting lines of each panel monomer.

10. A forming method of a display device, characterized in that, Comprising: Provide multiple panel monomers. The panel monomer includes an array substrate having a top surface, a bottom surface, and a side surface connecting the top surface and the bottom surface. The top surface and the bottom surface are spaced apart in the thickness direction of the panel monomer, and the array substrate includes a pixel circuit. Arrange multiple panel monomers in rows and columns. In the row direction, every two adjacent panel monomers are spaced apart to form a gap. Form a conductor layer in the gap between each panel monomer. Pattern the conductor layer along the thickness direction to form a connecting part on the side surface of each panel monomer. The connecting part includes multiple conductors distributed at intervals. The connecting part provided on the side surface further includes an insulator. The insulator coats each conductor and is located between the conductor and the side surface, and the insulator is located on the side of the conductor away from the side surface. The insulator is a viscous colloid that bonds the connecting part to the side surface. Form multiple first connecting lines on the top surface of each panel monomer, and each first connecting line is electrically connected to one of the conductors located on the same panel monomer. Form multiple second connecting lines on the bottom surface of each panel monomer, and each second connecting line is electrically connected to one of the conductors located on the same panel monomer. The orthographic projection of the first connecting line and / or the second connecting line in the thickness direction covers the orthographic projection of the conductor in the thickness direction. Bind integrated circuit chips on the second connecting lines of each panel monomer.

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