Driver chip, display device, and driver chip debugging method

Abstract

The present invention discloses a driver chip, a display device, and a debugging method for the driver chip. The driver chip causes a control module to output a control signal to an electromagnetic radiation suppression module based on the frequency of actual electromagnetic radiation and a mapping relationship between the electromagnetic radiation frequency stored in a storage module and the electromagnetic radiation suppression parameters, so that the electromagnetic radiation suppression module provides a device with the actual electromagnetic radiation suppression parameters to improve the actual electromagnetic radiation. The display device includes a driver chip. The debugging method for the driver chip sequentially places the driver chip in an electromagnetic radiation environment with different frequencies, sequentially sends multiple control signals to the electromagnetic radiation suppression module by controlling the control module, causing the electromagnetic radiation suppression module to sequentially provide multiple electromagnetic radiation suppression parameters, and determines a first electromagnetic radiation suppression parameter from the multiple electromagnetic radiation suppression parameters based on the suppression effect on the electromagnetic radiation, and stores the mapping relationship between the first electromagnetic radiation suppression parameter and the electromagnetic radiation frequency in the storage module.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a driver chip, a display device, and a debugging method for the driver chip. Background Art

[0002] Electromagnetic interference (EMI) is a common and challenging issue in product testing in the display industry. When a product's system circuit is affected by EMI, electromagnetic interference waves with a specific frequency and amplitude are generated on the power or signal lines. Severe EMI can cause erroneous signals and data, leading to erroneous display effects. When EMI exceeds standards, there are limited locations on the printed circuit board that can be adjusted to improve EMI. Summary of the Invention

[0003] Embodiments of the present invention provide a driver chip, a display device, and a driver chip debugging method, which can improve electromagnetic radiation interference and reduce costs.

[0004] An embodiment of the present invention provides a driver chip comprising a storage module, a control module, and an electromagnetic radiation suppression module. The storage module is configured to store a mapping relationship between electromagnetic radiation frequency and electromagnetic radiation suppression parameters; the control module is configured to output a control signal based on the frequency of actual electromagnetic radiation and the mapping relationship; wherein the control signal comprises a first control signal and a second control signal; when the frequency of the actual electromagnetic radiation is less than or equal to a first electromagnetic radiation threshold, the control module is configured to output the first control signal; when the frequency of the actual electromagnetic radiation is greater than a second electromagnetic radiation threshold, the control module is configured to output the second control signal. The electromagnetic radiation suppression module is configured to provide a device having corresponding electromagnetic radiation suppression parameters based on the control signal to suppress the actual electromagnetic radiation; wherein the electromagnetic suppression module comprises a low-frequency suppression unit and a high-frequency suppression unit; the low-frequency suppression unit is configured to suppress the actual electromagnetic radiation based on the first control signal, and the high-frequency suppression unit is configured to suppress the actual electromagnetic radiation based on the second control signal.

[0005] Optionally, in some embodiments of the present invention, the driver chip further includes a digital ground module, an analog ground module, and a non-digital-analog ground module. The low-frequency suppression unit is connected in series between the non-digital-analog ground module and the digital ground module; and / or, the low-frequency suppression unit is connected in series between the non-digital-analog ground module and the analog ground module; or, the low-frequency suppression unit is connected in series between the non-digital-analog ground module and the ground output port of the driver chip. The high-frequency suppression unit is connected in series between the non-digital-analog ground module and the digital ground module; and / or, the high-frequency suppression unit is connected in series between the non-digital-analog ground module and the analog ground module; or, the high-frequency suppression unit is connected in series between the non-digital-analog ground module and the ground output port of the driver chip.

[0006] Optionally, in some embodiments of the present invention, one of the low-frequency suppression unit and the high-frequency suppression unit is connected in series between the non-digital-analog ground module and the ground output port; the other of the low-frequency suppression unit and the high-frequency suppression unit is connected in series between the non-digital-analog ground module and the digital ground module; and / or the other of the low-frequency suppression unit and the high-frequency suppression unit is connected in series between the non-digital-analog ground module and the analog ground module.

[0007] Optionally, in some embodiments of the present invention, the low-frequency suppression unit includes multiple low-frequency suppression branches connected in parallel, each of the low-frequency suppression branches including a first switching transistor and a first suppression device connected in series, wherein the first suppression device includes a resistor. A control terminal of each first switching transistor is electrically connected to the control module, and the control module outputs the first control signal to the corresponding first switching transistor. The resistors in the multiple low-frequency suppression branches have different resistance values, and the electromagnetic radiation suppression parameter includes the resistance values of the resistors in the multiple low-frequency suppression branches.

[0008] Optionally, in some embodiments of the present invention, the high-frequency suppression unit includes a plurality of high-frequency suppression branches connected in parallel, each of the high-frequency suppression branches including a second switching tube and a second suppression device connected in series, the second suppression device including a capacitor. A control terminal of each second switching tube is electrically connected to the control module, and the control module outputs the second control signal to the corresponding second switching tube. The capacitance values of the capacitors in the plurality of high-frequency suppression branches are different, and the electromagnetic radiation suppression parameter includes the capacitance values of the capacitors in the plurality of high-frequency suppression branches.

[0009] Optionally, in some embodiments of the present invention, the low-frequency suppression unit further includes a third switching tube, which is connected in parallel with the multiple low-frequency suppression branches, and the control end of the third switching tube is electrically connected to the control module. The third switching tube is configured to be turned on when the first switching tubes in the multiple low-frequency suppression branches included in the low-frequency suppression unit are all in the off state according to the corresponding first control signal.

[0010] Optionally, in some embodiments of the present invention, the high-frequency suppression unit further includes a fourth switching tube, which is connected in parallel with the multiple high-frequency suppression branches, and the control end of the fourth switching tube is electrically connected to the control module. The fourth switching tube is configured to be turned on when the second switching tubes in the multiple high-frequency suppression branches included in the high-frequency suppression unit are all in the off state according to the corresponding second control signal.

[0011] The present invention further provides a display device, comprising a display panel and a driving module electrically connected to the display panel, wherein the driving module comprises any one of the above-mentioned driving chips.

[0012] The present invention also provides a debugging method for a driver chip, wherein the driver chip includes a storage module, a control module, and an electromagnetic radiation suppression module. The debugging method includes:

[0013] In each environment with electromagnetic radiation, controlling the control module to sequentially send multiple control signals to the electromagnetic radiation suppression module, so that the electromagnetic radiation suppression module sequentially provides multiple electromagnetic radiation suppression parameters; wherein the driver chip is configured to be sequentially placed in environments with electromagnetic radiation of different frequencies;

[0014] determining a first electromagnetic radiation suppression parameter from the plurality of electromagnetic radiation suppression parameters according to the suppression effects of the plurality of electromagnetic radiation suppression parameters on the electromagnetic radiation;

[0015] The mapping relationship between the first electromagnetic radiation suppression parameter and the frequency of the electromagnetic radiation is stored in the storage module.

[0016] Optionally, in some embodiments of the present invention, the control signal includes a first control signal and a second control signal; wherein, when the frequency of the electromagnetic radiation is less than or equal to a first electromagnetic radiation threshold, the control module is configured to output the first control signal; when the frequency of the electromagnetic radiation is greater than a second electromagnetic radiation threshold, the control module is configured to output the second control signal.

[0017] The electromagnetic suppression module includes a low-frequency suppression unit and a high-frequency suppression unit; wherein the low-frequency suppression unit includes a plurality of first suppression devices, and the low-frequency suppression unit is configured to enable the plurality of first suppression devices to provide a plurality of electromagnetic radiation suppression parameters according to the first control signal; the high-frequency suppression unit includes a plurality of second suppression devices of a type different from that of the first suppression devices, and the high-frequency suppression unit is configured to enable the plurality of second suppression devices to provide a plurality of electromagnetic radiation suppression parameters according to the second control signal.

[0018] Embodiments of the present invention provide a driver chip, a display device, and a debugging method for the driver chip. The driver chip includes a storage module, a control module, and an electromagnetic radiation suppression module. The control module outputs a first control signal to the electromagnetic radiation suppression module when the actual electromagnetic radiation frequency is less than or equal to a first electromagnetic radiation threshold, and outputs a second control signal to the electromagnetic radiation suppression module when the actual electromagnetic radiation frequency is greater than a second electromagnetic radiation threshold, based on a mapping relationship between the actual electromagnetic radiation frequency, the electromagnetic radiation frequency stored in the storage module, and electromagnetic radiation suppression parameters. This causes the low-frequency suppression unit of the electromagnetic radiation suppression module to suppress the actual electromagnetic radiation according to the first control signal, and the high-frequency suppression unit to suppress the actual electromagnetic radiation according to the second control signal. Because the electromagnetic radiation suppression module is integrated into the driver chip, there is no need to provide solder pads on a horizontal circuit board, which can reduce the cost of the display device and improve electromagnetic radiation interference issues among different display panels, resulting in high compatibility. The display device includes a display panel and a driver chip. The debugging method of the driver chip is to sequentially place the driver chip in an environment with electromagnetic radiation of different frequencies, and sequentially send multiple control signals to the electromagnetic radiation suppression module through the control module, so that the electromagnetic radiation suppression module sequentially provides multiple electromagnetic radiation suppression parameters, and determine the first electromagnetic radiation suppression parameter from the multiple electromagnetic radiation suppression parameters according to the suppression effect of the multiple electromagnetic radiation suppression parameters on the electromagnetic radiation, and store the mapping relationship between the first electromagnetic radiation suppression parameter and the frequency of the electromagnetic radiation in the storage module, so as to facilitate calling the mapping relationship to improve the electromagnetic radiation problem. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 It is a schematic diagram of the structure of a driver chip in the prior art;

[0021] Figures 2A to 2His a schematic structural diagram of a driver chip provided by an embodiment of the present invention;

[0022] Figure 3A-3B Schematic diagram of simulation results provided by an embodiment of the present invention;

[0023] Figure 4 is a schematic structural diagram of a display device provided by an embodiment of the present invention;

[0024] Figure 5 This is a flowchart of a driver chip debugging method provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention. In the present invention, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; while "inside" and "outside" refer to the outline of the device.

[0026] Specifically, Figures 2A to 2H Schematic diagram of the structure of a driver chip DIC provided by an embodiment of the present invention. The embodiment of the present invention provides a driver chip DIC, comprising a storage module, a control module CU and an electromagnetic radiation suppression module.

[0027] The storage module is configured to store a mapping relationship between electromagnetic radiation frequencies and electromagnetic radiation suppression parameters. Optionally, the storage module includes a non-volatile memory. Optionally, the storage module can be integrated into the control module CU.

[0028] The control module CU is configured to output a control signal according to the frequency of the actual electromagnetic radiation and the mapping relationship. Optionally, the control module CU includes a logic device. Optionally, the logic device includes a programmable logic gate array, etc.

[0029] The electromagnetic radiation suppression module is configured to provide a device with corresponding electromagnetic radiation suppression parameters according to the control signal to suppress the actual electromagnetic radiation.

[0030] Since the electromagnetic radiation suppression module is integrated into the driver chip DIC, there is no need to set pads on the horizontal circuit board XB, which can reduce the cost of the display device and can be used to improve the electromagnetic radiation interference problem in different display panels, with high compatibility.

[0031] Optionally, the control module CU may output different types of control signals according to the frequency of the actual electromagnetic radiation, so that different suppression units in the electromagnetic suppression module can improve electromagnetic radiation problems of different frequencies according to different control signals.

[0032] Optionally, the control signal includes a first control signal and a second control signal. When the frequency of the actual electromagnetic radiation is less than or equal to a first electromagnetic radiation threshold, the control module CU is configured to output the first control signal; and when the frequency of the actual electromagnetic radiation is greater than a second electromagnetic radiation threshold, the control module CU is configured to output the second control signal.

[0033] Optionally, the first electromagnetic radiation threshold and the second electromagnetic radiation threshold are equal to or different from each other.

[0034] Optionally, the first electromagnetic radiation threshold and / or the second electromagnetic radiation threshold is equal to 100 MHz.

[0035] The electromagnetic suppression module includes a low-frequency suppression unit 100 and a high-frequency suppression unit 200. The low-frequency suppression unit 100 is configured to suppress the actual electromagnetic radiation according to the first control signal, and the high-frequency suppression unit 200 is configured to suppress the actual electromagnetic radiation according to the second control signal.

[0036] Optionally, the control signal further includes a third control signal. When the frequency of the actual electromagnetic radiation is less than or equal to a third electromagnetic radiation threshold, the control module is configured to output the third control signal. The electromagnetic suppression module further includes an intermediate frequency suppression unit configured to suppress the actual electromagnetic radiation based on the third control signal. Optionally, the third electromagnetic radiation threshold is between the first electromagnetic radiation threshold and the second electromagnetic radiation threshold.

[0037] Optionally, see Figures 2A to 2H The driver chip DIC also includes a digital ground module DGND, an analog ground module AGND and a non-digital-analog ground module GND.

[0038] The low-frequency suppression unit 100 is connected in series between the non-digital-analog ground module GND and the digital ground module DGND; and / or, the low-frequency suppression unit 100 is connected in series between the non-digital-analog ground module GND and the analog ground module AGND; or, the low-frequency suppression unit 100 is connected in series between the non-digital-analog ground module GND and the ground output port of the driver chip DIC.

[0039] The high-frequency suppression unit 200 is connected in series between the non-digital-analog ground module GND and the digital ground module DGND; and / or, the high-frequency suppression unit 200 is connected in series between the non-digital-analog ground module GND and the analog ground module AGND; or, the high-frequency suppression unit 200 is connected in series between the non-digital-analog ground module GND and the ground output port of the driver chip DIC.

[0040] Optionally, the low-frequency suppression unit 100 can be arranged in parallel with the high-frequency suppression unit 200 between the non-digital-analog ground module GND and the digital ground module DGND; and / or, the low-frequency suppression unit 100 can be arranged in parallel with the high-frequency suppression unit 200 between the non-digital-analog ground module GND and the analog ground module AGND; or, the low-frequency suppression unit 100 can be arranged in parallel with the high-frequency suppression unit 200 between the non-digital-analog ground module GND and the ground output port of the driver chip DIC.

[0041] Optionally, to save layout space, one of the low-frequency suppression unit 100 and the high-frequency suppression unit 200 is connected in series between the non-digital-analog ground module GND and the ground output port of the driver chip DIC; the other of the low-frequency suppression unit 100 and the high-frequency suppression unit 200 is connected in series between the non-digital-analog ground module GND and the digital ground module DGND; and / or the other of the low-frequency suppression unit 100 and the high-frequency suppression unit 200 is connected in series between the non-digital-analog ground module GND and the analog ground module AGND.

[0042] Optionally, the ground output port is electrically connected to the horizontal circuit board XB.

[0043] Optionally, the low-frequency suppression unit 100 includes a plurality of first suppression devices, and the high-frequency suppression unit 200 includes a plurality of second suppression devices, wherein the first suppression devices and the second suppression devices are of different types.

[0044] Optionally, the low-frequency suppression unit 100 includes multiple low-frequency suppression branches connected in parallel, each of which includes a first switching transistor and a first suppression device connected in series, wherein the first suppression device includes a resistor. The control terminal of each first switching transistor is electrically connected to the control module CU, and the control module CU outputs the first control signal to the corresponding first switching transistor. The input and output terminals of each first switching transistor are connected in series between one of the digital ground module DGND, the analog ground module AGND, and the non-digital-analog ground module GND and the corresponding resistor. The resistors in the multiple low-frequency suppression branches have different resistance values, and the electromagnetic radiation suppression parameters include the resistance values of the resistors in the multiple low-frequency suppression branches.

[0045] Optionally, the resistance of the resistors of the plurality of low-frequency suppression branches may be greater than or equal to 10Ω and less than or equal to 1 kΩ.

[0046] like Figure 2C to Figure 2H The multiple parallel low-frequency suppression branches include a first low-frequency suppression branch, a second low-frequency suppression branch, a third low-frequency suppression branch, ..., and an nth low-frequency suppression branch. The first low-frequency suppression branch includes a first switch T11 and a first resistor R1, with the first resistor R1 having a resistance of r1. The second low-frequency suppression branch includes a first switch T12 and a second resistor R2, with the second resistor R2 having a resistance of r2. The third low-frequency suppression branch includes a first switch T13 and a third resistor R3, with the third resistor R3 having a resistance of r3. ... The nth low-frequency suppression branch includes a first switch T1n and an nth resistor Rn, with the nth resistor Rn having a resistance of rn. Therefore, r1 ≠ r2 ≠ r3 ≠ ... ≠ rn. The electromagnetic radiation suppression parameters include r1, r2, r3, ..., rn. n is a positive integer.

[0047] When the frequency of the actual electromagnetic radiation is less than or equal to the first electromagnetic radiation threshold, the control module CU searches the mapping relationship stored in the storage module for an electromagnetic radiation suppression parameter corresponding to the frequency of the actual electromagnetic radiation based on the frequency of the actual electromagnetic radiation, and outputs a corresponding first control signal based on the electromagnetic radiation suppression parameter to control the corresponding low-frequency suppression branch to improve the actual electromagnetic radiation. For example, when the frequency of the actual electromagnetic radiation is 70 MHz, and the electromagnetic radiation suppression parameter corresponding to the electromagnetic radiation at a frequency of 70 MHz in the mapping relationship stored in the storage module is r2, the control module CU outputs a first control signal to turn on the first switch T12 in the second low-frequency suppression branch, thereby improving the actual electromagnetic radiation at a frequency of 70 MHz using the resistance value r2 corresponding to the second resistor R2. The resistors included in the multiple low-frequency suppression branches dissipate energy from the electromagnetic radiation in the low-frequency band.

[0048] Optionally, the high-frequency suppression unit 200 includes multiple high-frequency suppression branches connected in parallel, each of which includes a second switching transistor and a second suppression device connected in series, wherein the second suppression device includes a capacitor. The control terminal of each second switching transistor is electrically connected to the control module CU, and the control module CU outputs the second control signal to the corresponding second switching transistor. The input and output terminals of each second switching transistor are connected in series between one of the digital ground module DGND, the analog ground module AGND, and the non-digital-analog ground module GND and the corresponding capacitor. The capacitance values of the capacitors in the multiple high-frequency suppression branches are different, and the electromagnetic radiation suppression parameters include the capacitance values of the capacitors in the multiple high-frequency suppression branches.

[0049] like Figure 2C to Figure 2H The multiple parallel high-frequency suppression branches include a first high-frequency suppression branch, a second high-frequency suppression branch, a third high-frequency suppression branch, ..., and an nth high-frequency suppression branch. The first high-frequency suppression branch includes a second switch T21 and a first capacitor C1, with the first capacitor C1 having a capacitance value of c1. The second high-frequency suppression branch includes a second switch T22 and a second capacitor C2, with the second capacitor C2 having a capacitance value of c2. The third high-frequency suppression branch includes a second switch T23 and a third capacitor C3, with the third capacitor C3 having a capacitance value of c3. ... The nth high-frequency suppression branch includes a second switch T2n and an nth capacitor Cn, with the nth capacitor Cn having a capacitance value of cn. Therefore, c1 ≠ c2 ≠ c3 ≠ ... ≠ cn. The electromagnetic radiation suppression parameters include c1, c2, c3, ..., cn. Where n is a positive integer.

[0050] When the frequency of the actual electromagnetic radiation is greater than the second electromagnetic radiation threshold, the control module CU searches the mapping relationship stored in the storage module for an electromagnetic radiation suppression parameter corresponding to the frequency of the actual electromagnetic radiation based on the frequency of the actual electromagnetic radiation, and outputs a corresponding second control signal based on the electromagnetic radiation suppression parameter to control the corresponding high-frequency suppression branch to improve the actual electromagnetic radiation. For example, when the frequency of the actual electromagnetic radiation is 160 MHz, and the electromagnetic radiation suppression parameter corresponding to the electromagnetic radiation at a frequency of 160 MHz in the mapping relationship stored in the storage module is c3, the control module CU outputs a second control signal to turn on the second switch T23 in the third high-frequency suppression branch, thereby utilizing the capacitance c3 corresponding to the third capacitor C3 to improve the actual electromagnetic radiation at a frequency of 160 MHz. Interference signals are filtered out by the capacitors included in the multiple low-frequency suppression branches.

[0051] Compared to Figure 1 The schematic diagram of the structure of the driver chip DIC in the prior art is shown (the electromagnetic radiation suppression module is not provided between the digital ground module DGND, the analog ground module AGND, and the non-digital-analog ground module GND). The present application provides the electromagnetic radiation suppression module between the digital ground module DGND, the analog ground module AGND, and the non-digital-analog ground module GND, and the control module CU controls the size of the selected resistor and the capacitor so that there is resistance matching between the digital ground module DGND, the analog ground module AGND, and the non-digital-analog ground module GND, providing a suppression loop current and weakening interference signals for the electromagnetic radiation discharge path, and filtering interference signals through the capacitor. Since the low-frequency suppression unit 100 and the high-frequency suppression unit 200 are integrated into the driver chip DIC, the component cost of the horizontal circuit board XB is also reduced. At the same time, since it will not affect the size of the driver chip DIC, it will not affect the manufacturing cost of the driver chip DIC.

[0052] Optionally, in order to achieve connectivity between the digital ground module DGND, the analog ground module AGND and the non-digital-analog ground module GND when the electromagnetic radiation suppression module is not working, the low-frequency suppression unit 100 also includes a third switch tube T3, the third switch tube T3 is connected in parallel with multiple low-frequency suppression branches, and the control end of the third switch tube T3 is electrically connected to the control module CU. The third switch tube T3 is configured to be turned on when the first switch tubes in the multiple low-frequency suppression branches included in the low-frequency suppression unit 100 are in the off state according to the corresponding first control signal.

[0053] Optionally, the input and output ends of the third switch tube T3 are connected in series between the non-digital-analog ground module GND and the digital ground module DGND; and / or, the input and output ends of the third switch tube T3 are connected in series between the non-digital-analog ground module GND and the analog ground module AGND; or, the input and output ends of the third switch tube T3 are connected in series between the non-digital-analog ground module GND and the ground output port.

[0054] Optionally, in order to achieve connectivity between the digital ground module DGND, the analog ground module AGND and the non-digital-analog ground module GND when the electromagnetic radiation suppression module is not working, the high-frequency suppression unit 200 also includes a fourth switch tube T4, the fourth switch tube T4 is connected in parallel with the multiple high-frequency suppression branches, and the control end of the fourth switch tube T4 is electrically connected to the control module CU. The fourth switch tube T4 is configured to be turned on when the second switch tubes in the multiple high-frequency suppression branches included in the high-frequency suppression unit 200 are in the off state according to the corresponding second control signal.

[0055] Optionally, the input and output ends of the fourth switch tube T4 are connected in series between the non-digital-analog ground module GND and the digital ground module DGND; and / or, the input and output ends of the fourth switch tube T4 are connected in series between the non-digital-analog ground module GND and the analog ground module AGND; or, the input and output ends of the fourth switch tube T4 are connected in series between the non-digital-analog ground module GND and the ground output port.

[0056] like Figure 3A-3B It is a schematic diagram of the simulation results provided by an embodiment of the present invention. The inventors of the present application conducted simulation experiments on actual electromagnetic radiation with frequencies of 70 MHz and 160 MHz and proved that the radiation value of the improved electromagnetic radiation is greater than 6 dB, which meets the design specifications.

[0057] Figure 4 The present invention further provides a display device comprising a display panel 300 and a driving module 400 electrically connected to the display panel 300 , wherein the driving module 400 comprises any one of the above-mentioned driving chips DIC.

[0058] Optionally, the display device includes a movable display device (such as a laptop computer, a mobile phone, etc.), a fixed terminal (such as a desktop computer, a television, etc.), a measuring device (such as a sports bracelet, a thermometer, etc.), etc.

[0059] like Figure 5 This is a flowchart of a driver chip DIC debugging method provided by an embodiment of the present invention.

[0060] The present invention also provides a debugging method for a driver chip, wherein the driver chip includes a storage module, a control module, and an electromagnetic radiation suppression module. The debugging method includes:

[0061] In each environment with electromagnetic radiation, the control module is controlled to send multiple control signals to the electromagnetic radiation suppression module in sequence, so that the electromagnetic radiation suppression module provides multiple electromagnetic radiation suppression parameters in sequence; wherein the driving chip is configured to be set in environments with electromagnetic radiation of different frequencies in sequence.

[0062] A first electromagnetic radiation suppression parameter is determined from the plurality of electromagnetic radiation suppression parameters according to the suppression effects of the plurality of electromagnetic radiation suppression parameters on the electromagnetic radiation.

[0063] The mapping relationship between the first electromagnetic radiation suppression parameter and the frequency of the electromagnetic radiation is stored in the storage module.

[0064] Optionally, the driver chip may be arranged in an environment of low-frequency electromagnetic radiation (eg, frequency lower than or equal to 100 MHz), or in an environment of high-frequency electromagnetic radiation (eg, frequency higher than 100 MHz).

[0065] Optionally, based on the suppression effects of the multiple electromagnetic radiation suppression parameters on the electromagnetic radiation, an electromagnetic radiation suppression parameter with the best suppression effect on the electromagnetic radiation may be selected from the multiple electromagnetic radiation suppression parameters as the first electromagnetic radiation suppression parameter.

[0066] Optionally, the control signal includes a first control signal and a second control signal.

[0067] When the frequency of the electromagnetic radiation is less than or equal to a first electromagnetic radiation threshold, the control module is configured to output the first control signal; when the frequency of the electromagnetic radiation is greater than a second electromagnetic radiation threshold, the control module is configured to output the second control signal.

[0068] Optionally, the first electromagnetic radiation threshold and the second electromagnetic radiation threshold are equal to or different from each other. Optionally, the first electromagnetic radiation threshold and / or the second electromagnetic radiation threshold are equal to 100 MHz.

[0069] Optionally, the electromagnetic suppression module includes a low-frequency suppression unit and a high-frequency suppression unit.

[0070] Optionally, the low-frequency suppression unit is connected in series between the non-digital-analog ground module and the digital ground module; and / or, the low-frequency suppression unit is connected in series between the non-digital-analog ground module and the analog ground module; or, the low-frequency suppression unit is connected in series between the non-digital-analog ground module and the ground output port of the driver chip.

[0071] The high-frequency suppression unit is connected in series between the non-digital-analog ground module and the digital ground module; and / or, the high-frequency suppression unit is connected in series between the non-digital-analog ground module and the analog ground module; or, the high-frequency suppression unit is connected in series between the non-digital-analog ground module and the ground output port of the driver chip.

[0072] Optionally, one of the low-frequency suppression unit and the high-frequency suppression unit is connected in series between the non-digital-analog ground module and the ground output port of the driver chip, the other of the low-frequency suppression unit and the high-frequency suppression unit is connected in series between the non-digital-analog ground module of the driver chip and the digital ground module, and / or the other of the low-frequency suppression unit and the high-frequency suppression unit is connected in series between the non-digital-analog ground module of the driver chip and the analog ground module.

[0073] Optionally, the low-frequency suppression unit includes a plurality of first suppression devices, and the low-frequency suppression unit is configured to enable the plurality of first suppression devices to provide a plurality of the electromagnetic radiation suppression parameters according to the first control signal.

[0074] Optionally, the first suppression device includes a resistor, and the resistance values of the multiple resistors are different.

[0075] Optionally, the low-frequency suppression unit includes a plurality of first switching tubes, an input end and an output end of each first switching tube are connected in series with a resistor, and a control end of each first switching tube is electrically connected to the control module.

[0076] When the driving chips are sequentially set in an environment of electromagnetic radiation with a frequency less than or equal to the first electromagnetic radiation threshold, the control module can control the multiple first switching tubes corresponding to the multiple first suppression devices to select the corresponding first suppression devices, thereby testing the electromagnetic radiation improvement conditions in turn, and then determining the first electromagnetic radiation suppression parameter from the multiple electromagnetic radiation suppression parameters according to different improvement conditions, and storing the mapping relationship between the first electromagnetic radiation suppression parameter and the frequency of the electromagnetic radiation in the storage module.

[0077] Optionally, the high frequency suppression unit includes a plurality of second suppression devices of a type different from that of the first suppression device, and the high frequency suppression unit is configured to enable the plurality of second suppression devices to provide a plurality of electromagnetic radiation suppression parameters according to the second control signal.

[0078] Optionally, the second suppression device includes a capacitor, and the capacitance values of the plurality of capacitors are different.

[0079] Optionally, the high-frequency suppression unit includes a plurality of second switching tubes, the input end and the output end of each second switching tube are connected in series with a capacitor, and the control end of each second switching tube is electrically connected to the control module.

[0080] When the driving chip is sequentially set in an environment of electromagnetic radiation with a frequency greater than the second electromagnetic radiation threshold, the control module can control the multiple second switching tubes corresponding to the multiple second suppression devices to select the corresponding second suppression devices, thereby testing the electromagnetic radiation improvement in turn, and then determining the first electromagnetic radiation suppression parameter from the multiple electromagnetic radiation suppression parameters according to different improvement conditions, and storing the mapping relationship between the first electromagnetic radiation suppression parameter and the frequency of the electromagnetic radiation in the storage module.

[0081] It can be understood that the debugging process of the low-frequency suppression unit and the high-frequency suppression unit can be performed simultaneously or separately.

[0082] Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A driver chip, characterized in that: include: a storage module configured to store a mapping relationship between electromagnetic radiation frequencies and electromagnetic radiation suppression parameters; a control module configured to output a control signal based on the frequency of the actual electromagnetic radiation and the mapping relationship; wherein the control signal includes a first control signal and a second control signal; when the frequency of the actual electromagnetic radiation is less than or equal to a first electromagnetic radiation threshold, the control module is configured to output the first control signal; when the frequency of the actual electromagnetic radiation is greater than a second electromagnetic radiation threshold, the control module is configured to output the second control signal; and An electromagnetic radiation suppression module is configured to provide a device with corresponding electromagnetic radiation suppression parameters according to the control signal to suppress the actual electromagnetic radiation; wherein the electromagnetic radiation suppression module includes a low-frequency suppression unit and a high-frequency suppression unit, the low-frequency suppression unit is configured to suppress the actual electromagnetic radiation according to the first control signal, and the high-frequency suppression unit is configured to suppress the actual electromagnetic radiation according to the second control signal.

2. The driver chip according to claim 1, wherein: The driver chip also includes a digital ground module, an analog ground module and a non-digital-analog ground module; The low-frequency suppression unit is connected in series between the non-digital-analog ground module and the digital ground module; and / or, the low-frequency suppression unit is connected in series between the non-digital-analog ground module and the analog ground module; or, the low-frequency suppression unit is connected in series between the non-digital-analog ground module and the ground output port of the driver chip; The high-frequency suppression unit is connected in series between the non-digital-analog ground module and the digital ground module; and / or, the high-frequency suppression unit is connected in series between the non-digital-analog ground module and the analog ground module; or, the high-frequency suppression unit is connected in series between the non-digital-analog ground module and the ground output port of the driver chip.

3. The driver chip according to claim 2, wherein: One of the low-frequency suppression unit and the high-frequency suppression unit is connected in series between the non-digital-analog ground module and the ground output port; The other of the low-frequency suppression unit and the high-frequency suppression unit is connected in series between the non-digital-analog ground module and the digital ground module; and / or, the other of the low-frequency suppression unit and the high-frequency suppression unit is connected in series between the non-digital-analog ground module and the analog ground module.

4. The driver chip according to claim 2, wherein: The low-frequency suppression unit includes: A plurality of parallel low-frequency suppression branches, each of the low-frequency suppression branches comprising a first switching tube and a first suppression device connected in series, wherein the first suppression device comprises a resistor; In which, the control end of each first switching tube is electrically connected to the control module, the control module outputs the first control signal to the corresponding first switching tube, the resistance values of the resistors of the multiple low-frequency suppression branches are different, and the electromagnetic radiation suppression parameters include the resistance values of the resistors of the multiple low-frequency suppression branches.

5. The driver chip according to claim 2, wherein: The high frequency suppression unit includes: A plurality of high-frequency suppression branches connected in parallel, each of the high-frequency suppression branches comprising a second switch tube and a second suppression device connected in series, wherein the second suppression device comprises a capacitor; In which, the control end of each second switching tube is electrically connected to the control module, the control module outputs the second control signal to the corresponding second switching tube, the capacitance values of the capacitors of the multiple high-frequency suppression branches are different, and the electromagnetic radiation suppression parameters include the capacitance values of the capacitors of the multiple high-frequency suppression branches.

6. The driver chip according to claim 4, characterized in that: The low frequency suppression unit further includes: a third switching tube connected in parallel with the plurality of low-frequency suppression branches, wherein a control end of the third switching tube is electrically connected to the control module, and the third switching tube is configured to be turned on when all the first switching tubes in the plurality of low-frequency suppression branches included in the low-frequency suppression unit are in an off state according to the corresponding first control signal.

7. The driver chip according to claim 5, characterized in that: The high frequency suppression unit further includes: a fourth switching tube connected in parallel with the plurality of high-frequency suppression branches, wherein a control end of the fourth switching tube is electrically connected to the control module, and the fourth switching tube is configured to be turned on when the second switching tubes in the plurality of high-frequency suppression branches included in the high-frequency suppression unit are all in an off state according to the corresponding second control signal.

8. A display device, characterized in that: It comprises a display panel and a driving module electrically connected to the display panel, wherein the driving module comprises the driving chip according to any one of claims 1 to 7.

9. A debugging method for a driver chip, characterized in that: The driver chip includes a storage module, a control module and an electromagnetic radiation suppression module, and the debugging method includes: In each environment with electromagnetic radiation, controlling the control module to sequentially send a plurality of control signals to the electromagnetic radiation suppression module so that the electromagnetic radiation suppression module sequentially provides a plurality of electromagnetic radiation suppression parameters, wherein the driver chip is configured to be sequentially placed in environments with electromagnetic radiation of different frequencies; determining a first electromagnetic radiation suppression parameter from the plurality of electromagnetic radiation suppression parameters according to the suppression effects of the plurality of electromagnetic radiation suppression parameters on the electromagnetic radiation; The mapping relationship between the first electromagnetic radiation suppression parameter and the frequency of the electromagnetic radiation is stored in the storage module.

10. The debugging method of the driver chip according to claim 9, characterized in that: The control signal includes a first control signal and a second control signal; wherein, when the frequency of the electromagnetic radiation is less than or equal to a first electromagnetic radiation threshold, the control module is configured to output the first control signal; and when the frequency of the electromagnetic radiation is greater than a second electromagnetic radiation threshold, the control module is configured to output the second control signal; The electromagnetic radiation suppression module includes a low-frequency suppression unit and a high-frequency suppression unit; wherein, the low-frequency suppression unit includes multiple first suppression devices, and the low-frequency suppression unit is configured to enable the multiple first suppression devices to provide multiple electromagnetic radiation suppression parameters according to the first control signal; the high-frequency suppression unit includes multiple second suppression devices of a type different from the first suppression devices, and the high-frequency suppression unit is configured to enable the multiple second suppression devices to provide multiple electromagnetic radiation suppression parameters according to the second control signal.

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