A wafer sorting machine feeding mechanism supporting multiple sizes of silicon wafers and a method of use

Abstract

A wafer sorting machine feeding mechanism supporting multiple sizes of silicon wafers and a use method thereof, including a wafer loading frame, the wafer loading frame is provided with a track and a wafer push door guide slot plate on the side, the track is matched with a sliding block, the sliding block is connected with a rotating shaft fixed block, and the rotating shaft fixed block is rotatably provided with a rotating shaft; the wafer loading frame is detachably connected with a push door structure plate through the rotating shaft, the push door structure plate is detachably connected with a push piece structure plate, the push piece structure plate is connected with a wafer push plate, and the edge of the wafer push plate is provided with a soft material wafer push block; the wafer loading frame includes an upper top plate and a lower bottom plate, the upper top plate and the lower bottom plate are provided with side baffle adjustable waist holes, the side baffle adjustable waist holes are connected with side baffles through adjusting screws, the side baffles are connected with front baffles through adjusting screws, and the front baffles are provided with front baffle adjustable waist holes. The present application can realize convenient operation personnel detection of silicon wafers and realize random switching of multiple size wafer feeding.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of photovoltaic silicon wafer manufacturing, and particularly relates to a silicon wafer sorting machine feeding mechanism supporting multiple sizes of silicon wafers and a use method. BACKGROUND

[0002] BACKGROUND: In the silicon wafer cutting process, the silicon wafer sorting process is an important link for guaranteeing the quality of silicon wafers. In the development process of silicon wafers from 157 mm to 210 mm in size, the compatibility of the equipment is particularly important. The existing sorting machines have poor compatibility, and the silicon wafer manufacturers need to invest more costs to purchase different equipment, which is a great burden for the silicon wafer manufacturers. In the process of silicon wafer detection, the following defects exist:

[0003] 1. After the wafer box is loaded onto the feeding mechanism of the sorting machine, only a small part of the wafer box outside is provided for the wafer extraction device to extract wafers. This leads to a small contact area between the wafer extraction device belt and the silicon wafer, i.e. small friction, and the silicon wafer may not be effectively extracted, which may cause frequent wafer sticking.

[0004] 2. The fixed size of the wafer box for feeding leads to the fact that the feeding mechanism can only load one size of silicon wafer, and the silicon wafer sorting machine can only detect one size of silicon wafer, and cannot detect multiple sizes of silicon wafers. For enterprises with various products, compatibility cannot be achieved, and for enterprises undergoing product transformation, new equipment needs to be purchased, increasing the cost burden of the enterprise.

[0005] 3. The wafer box cannot be accurately positioned, and in the wafer extraction process, wafer sticking and wafer breakage may occur, causing direct product loss.

[0006] 4. The loading capacity of a single wafer box is fixed, and the production efficiency cannot be improved. SUMMARY

[0007] In view of the technical problems existing in the background art, the silicon wafer sorting machine feeding mechanism supporting multiple sizes of silicon wafers and the use method provided by the present application can facilitate the detection of silicon wafers by the operator and realize the random switching of multiple sizes of silicon wafers. The operator can easily master the switching process, improve the compatibility of the equipment, improve the production efficiency, improve the quality of silicon wafer output, and reduce the probability of silicon wafer breakage.

[0008] In order to solve the above technical problems, the present application adopts the following technical solutions to realize:

[0009] A silicon wafer sorting machine feeding mechanism supporting multi-size silicon wafers includes a cassette loading frame. The cassette loading frame has multiple layers of partitions for placing cassettes. The side of the cassette loading frame is provided with a track and a cassette push-door guide groove. The track cooperates with a slider, and the slider is connected to a rotating shaft fixing block. A rotating shaft is rotatably mounted on the rotating shaft fixing block. The cassette push-door guide groove is provided with a U-shaped guide groove, and the upper and lower ends of the rotating shaft cooperate with the U-shaped guide groove via guide idlers.

[0010] The material box loading frame is detachably connected to the sliding door structure plate via a rotating shaft. The sliding door structure plate is detachably connected to the wafer pusher structure plate. The wafer pusher structure plate is connected to the silicon wafer pusher plate. The edge of the silicon wafer pusher plate is provided with soft silicon wafer pusher blocks. The material box loading frame includes an upper top plate and a lower bottom plate. The upper top plate and the lower bottom plate are provided with adjustable side baffle holes. The adjustable side baffle holes are connected to the side baffles via adjusting screws. The side baffles are connected to the front baffles via adjusting screws. The front baffles are provided with adjustable front baffle holes.

[0011] In a preferred embodiment, the loading frame of the material box is equipped with a buffer resistance cylinder, and the telescopic end of the buffer resistance cylinder cooperates with the push door structure plate.

[0012] In a preferred embodiment, a door detection sensor is provided on the guide groove plate of the material box push door.

[0013] In a preferred embodiment, the push door structure plate, the rotating shaft, and the push plate structure plate are provided with through holes, and the push door structure plate, the rotating shaft, and the push plate structure plate are connected by adjusting screws and adjusting nuts.

[0014] In a preferred embodiment, the pusher plate is connected to the pusher rod of the material box.

[0015] In a preferred embodiment, the push-door structure plate is provided with a magnet, and the slider is provided with a magnet stop.

[0016] In a preferred embodiment, the hopper loading frame is equipped with multiple hopper detection sensors.

[0017] In a preferred embodiment, the bottom of the material box loading frame is provided with a positioning level adjustment screw.

[0018] In a preferred embodiment, the method of using the silicon wafer sorting machine feeding mechanism that supports multi-size silicon wafers includes the following steps:

[0019] Step 1: Loosen the adjusting screws of the adjustable waist hole of the side baffle and the adjustable waist hole of the front baffle. Adjust the position of the front baffle and the side baffle according to the width of the silicon wafer, and then tighten the adjusting screws.

[0020] Step 2: Adjust the adjusting screw and adjusting nut according to the length of the silicon wafer, or replace it with a suitable sliding door structure plate;

[0021] Step 3: Hold the material box push lever to open the material box door and load the material box into the material box loading frame;

[0022] Step 4: Use the material box detection sensor to detect the material box's position signal;

[0023] Step four: Close the material box door. The silicon wafer pusher plate pushes the silicon wafer a certain distance through the soft material silicon wafer pusher block, so that part of the silicon wafer is pushed out of the front baffle. The buffer resistance cylinder is used to reduce the impact of the push-pull door on the entire silicon wafer sorting machine feeding mechanism and improve the stability of the whole device.

[0024] Step 5: Use the door detection sensor to detect the signal indicating that the material box door is closed;

[0025] Step six: The feeding mechanism is driven to move up and down by a lifting device. The lifting device is used to drive the feeding mechanism to move from top to bottom, and the silicon wafers are pulled out one by one by the belt conveyor. After the silicon wafers are completely pulled out, the feeding mechanism rises to the original position. The belt conveyor is located on one side of the front baffle. When the material box door of the feeding mechanism is closed, the silicon wafer is pushed out. At this time, the end of the belt conveyor is just below the silicon wafer push-out part. The belt conveyor pulls out the silicon wafer by friction.

[0026] Step 7: Open the material box push door. The magnet and magnetic stop are used to ensure that the material box push door will not spring back when it is open.

[0027] This patent can achieve the following beneficial effects:

[0028] The silicon wafer sorting machine of this invention employs a three-layer feeding structure design, capable of simultaneously loading three silicon wafer cassettes. The feeding structure includes a push-door device that can be opened and closed, and also secures and positions the cassettes, ensuring they are in their corresponding coordinate positions and guaranteeing accurate positioning of each silicon wafer. Each cassette's door push plate has a wafer pusher device that can push out a portion of the wafer, increasing the contact area between the wafer and the conveyor belt of the feeding device, increasing the extraction friction, ensuring effective wafer extraction, and reducing the probability of wafer jamming. The wafer pusher device is equipped with a soft-material pusher block to prevent wafer breakage caused by contact between hard objects and the wafer during extraction.

[0029] The silicon wafer feeding mechanism has adjustable waist holes on both the front baffle and the top plate. These adjustable waist holes can be adjusted according to the different sizes of silicon wafers being produced, facilitating the loading of different sized material boxes and meeting the feeding requirements for inspecting silicon wafers of different sizes.

[0030] The loading mechanism has a door detection switch and a wafer cassette detection switch to detect whether the door push device is open or closed and whether there is a wafer cassette. Below the loading mechanism are four leveling screws to adjust the level, ensuring the silicon wafers are level with the belt of the loading and pulling device, preventing jamming or tilting during wafer extraction.

[0031] This invention enables operators to easily inspect silicon wafers and switch freely between various wafer sizes. Operators can easily master the switching process, improving equipment compatibility, production efficiency, wafer quality, and reducing wafer breakage. Attached Figure Description

[0032] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0033] Figure 1 This is a three-dimensional structural diagram of the present invention (material box door open).

[0034] Figure 2 This is a three-dimensional structural diagram of the invention (material box with the door closed);

[0035] Figure 3 This is a diagram showing the fit between the material box push door and the rotating shaft of the present invention;

[0036] Figure 4 This is a schematic diagram of the adjustment principle of the sliding door structure plate of the present invention. Figure 1 ;

[0037] Figure 5 This is a schematic diagram of the adjustment principle of the sliding door structure plate of the present invention. Figure 2 .

[0038] In the diagram: 1. Material box loading frame; 2. Material box push door rod; 3. U-shaped guide groove; 4. Door detection sensor; 5. Material box detection sensor; 6. Positioning level adjustment screw; 7. Guide idler wheel; 8. Silicon wafer push plate; 9. Soft material silicon wafer push block; 10. Adjusting screw; 11. Push door structure plate; 12. Buffer resistance cylinder; 13. Rotating shaft; 14. Track; 15. Rotating shaft fixing block; 16. Magnet; 17. Magnet stop block; 18. Adjustable waist hole of side baffle; 19. Adjustable waist hole of front baffle; 20. Front baffle; 21. Push plate structure plate; 22. Slider; 23. Material box push door guide groove plate; 24. Side baffle; 25. Adjusting nut. Detailed Implementation

[0039] Example 1:

[0040] Preferred solutions include Figures 1 to 5As shown, a silicon wafer sorting machine feeding mechanism and its usage method supporting multi-size silicon wafers include a wafer loading frame 1. The wafer loading frame 1 has multiple layers of partitions for placing wafers. A track 14 and a wafer push-door guide groove plate 23 are provided on the side of the wafer loading frame 1. The track 14 cooperates with a slider 22, which is connected to a rotating shaft fixing block 15. A rotating shaft 13 is rotatably mounted on the rotating shaft fixing block 15. The wafer push-door guide groove plate 23 has a U-shaped guide groove 3. The upper and lower ends of the rotating shaft 13 cooperate with the U-shaped guide groove 3 through guide idler wheels 7. The U-shaped guide groove 3 guides the running trajectory of the wafer push-door opening and closing, and the guide idler wheels 7 prevent jamming during wafer push-door opening and closing. The slider and guide track are used to realize the forward and backward movement of the door.

[0041] The material box loading frame 1 is detachably connected to the push-door structure plate 11 via a rotating shaft 13. The push-door structure plate 11 is detachably connected to the wafer pusher structure plate 21. The wafer pusher structure plate 21 is connected to the silicon wafer pusher plate 8. The edge of the silicon wafer pusher plate 8 is provided with a soft silicon wafer pusher block 9, which increases the front-to-back distance between the silicon wafer pusher plate and the soft silicon wafer pusher block, ensuring that the silicon wafer can be pushed out normally even when it becomes larger, and preventing the silicon wafer from being pushed and broken. The material box loading frame 1 includes an upper top plate and a lower bottom plate. The upper top plate and the lower bottom plate are provided with adjustable side baffle holes 18. The adjustable side baffle holes 18 are connected to the side baffle 24 via adjusting screws. The side baffle 24 is connected to the front baffle 20 via adjusting screws. The front baffle 20 is provided with an adjustable front baffle hole 19. The wafer pusher structure plate 21, the push-door structure plate 11, the silicon wafer pusher plate 8, and the soft silicon wafer pusher block 9 constitute the material box push-door.

[0042] The wafer loading frame 1 can hold three wafer boxes at a time. When switching between different sizes of silicon wafers, the operator can adjust the fixing position of the adjusting screws of the adjustable waist hole 18 on the side baffle and the adjustable waist hole 19 on the front baffle to move the side baffle and front baffle to the appropriate position. This positions the wafer boxes of different sizes, thus achieving the loading of silicon wafers of different sizes. Single-sided adjustment is more convenient and faster, and the positioning is more accurate, which can reduce the workload of the operator and will not affect the sliding door device on the other side.

[0043] A buffer resistance cylinder 12 is installed on the material box loading frame 1. The telescopic end of the buffer resistance cylinder 12 cooperates with the push door structure plate 11. This is used to reduce the impact of manual pushing and pulling of the door on the entire silicon wafer sorting machine loading mechanism and improve the stability of the frame.

[0044] A door detection sensor 4 is installed on the guide groove plate 23 of the material box push door. It is used to detect whether the material box push door is closed.

[0045] The sliding door structure plate 11, the rotating shaft 13, and the push plate structure plate 21 are provided with through holes. The sliding door structure plate 11, the rotating shaft 13, and the push plate structure plate 21 are connected by adjusting screw 10 and adjusting nut 25.

[0046] The push plate structure plate 21 is connected to the material box push rod 2. The material box push rod 2 is equivalent to a door handle.

[0047] A magnet 16 is provided on the sliding door structure plate 11, and a magnet stop 17 is provided on the slider 22.

[0048] The material box loading frame 1 is equipped with multiple material box detection sensors 5. These sensors are used to check whether the material boxes are installed in place. Each layer is equipped with a material box detection sensor 5. When the corresponding material box detection sensor 5 does not detect a signal, it means that no material box is loaded in that layer. When picking up the wafer, the fixture can directly skip this layer. The material box detection sensors 5 and the door detection sensor 4 are proximity switches.

[0049] The bottom of the material box loading frame 1 is equipped with a positioning level adjustment screw 6. The level of the entire feeding mechanism can be adjusted to keep the silicon wafer and the feeding and pulling device belt level, ensuring that the silicon wafer does not jam or tilt when it is pulled out.

[0050] A method for using a silicon wafer sorting machine feeding mechanism that supports multi-size silicon wafers includes the following steps:

[0051] Step 1: Loosen the adjusting screws of the adjustable waist hole 18 of the side baffle and the adjustable waist hole 19 of the front baffle, adjust the position of the front baffle 20 and the side baffle 24 according to the width of the silicon wafer, and then tighten the adjusting screws.

[0052] Step two: Adjust the adjusting screw 10 and adjusting nut 25 according to the length of the silicon wafer, or replace it with a suitable sliding door structure plate 11; the adjustment method is as follows:

[0053] Method 1: No need to replace the sliding door structure plate. Manually remove the adjusting screw 10, replace it with a long screw, and add a nut to the end of the screw to hold the sliding door structure plate 11 in place, so that the long screw rod bears the force.

[0054] Method 2: No need to replace the adjusting screw 10. Manually remove the adjusting screw 10, replace it with a longer sliding door structure plate 11, and then put the adjusting screw 10 back on.

[0055] Step 3: Hold the material box push lever 2 to open the material box door and load the material box into the material box loading frame 1;

[0056] Step 4: Use the material box detection sensor 5 to detect the material box positioning signal;

[0057] Step four: Close the material box door. The silicon wafer pusher plate 8 pushes the silicon wafer a certain distance through the soft material silicon wafer pusher block 9, so that part of the silicon wafer is pushed out of the front baffle 20. The buffer resistance cylinder 12 is used to reduce the impact of the push-pull door on the entire silicon wafer sorting machine feeding mechanism and improve the stability of the entire device.

[0058] Step 5: Use door detection sensor 4 to detect the signal indicating that the material box door is closed;

[0059] Step six: The feeding mechanism is driven to move up and down by a lifting device. The lifting device drives the feeding mechanism to move from top to bottom, and the silicon wafers are extracted sequentially by a belt conveyor. After the silicon wafers are completely extracted, the feeding mechanism rises to the original position. The belt conveyor is located on one side of the front baffle. When the material box door of the feeding mechanism is closed, the silicon wafers are pushed out. At this time, the end of the belt conveyor is just below the silicon wafer push-out part. The belt conveyor pulls out the silicon wafers by friction. The lifting device is a cylinder.

[0060] Step 7: Open the material box push door. Magnet 16 and magnet block 17 are used to ensure that the material box push door will not spring back when it is open.

[0061] The above embodiments are merely preferred technical solutions of the present invention and should not be considered as limitations on the present invention. The scope of protection of the present invention should be limited to the technical solutions described in the claims, including equivalent substitutions of the technical features described in the claims. That is, equivalent substitutions and improvements within this scope are also within the scope of protection of the present invention.

Claims

1. A silicon wafer sorting machine feeding mechanism that supports multi-size silicon wafers, characterized in that: The system includes a material box loading frame (1), which has multiple partitions for placing material boxes. The side of the material box loading frame (1) is provided with a track (14) and a material box push door guide groove plate (23). The track (14) cooperates with a slider (22), and the slider (22) is connected to a rotating shaft fixing block (15). The rotating shaft fixing block (15) is rotatably provided with a rotating shaft (13). The material box push door guide groove plate (23) is provided with a U-shaped guide groove (3). The upper and lower ends of the rotating shaft (13) cooperate with the U-shaped guide groove (3) through guide idler wheels (7). The material box loading frame (1) is detachably connected to the push door structure plate (11) via a rotating shaft (13). The push door structure plate (11) is detachably connected to the push plate structure plate (21). The push plate structure plate (21) is connected to the silicon wafer push plate (8). The edge of the silicon wafer push plate (8) is provided with a soft material silicon wafer push block (9). The material box loading frame (1) includes an upper top plate and a lower bottom plate. The upper top plate and the lower bottom plate are provided with adjustable side baffle holes (18). The adjustable side baffle holes (18) are connected to the side baffle (24) via adjusting screws. The side baffle (24) is connected to the front baffle (20) via adjusting screws. The front baffle (20) is provided with adjustable front baffle holes (19).

2. The silicon wafer sorting machine feeding mechanism supporting multi-size silicon wafers according to claim 1, characterized in that: The loading frame (1) of the material box is equipped with a buffer resistance cylinder (12), and the telescopic end of the buffer resistance cylinder (12) is matched with the push door structure plate (11).

3. The silicon wafer sorting machine feeding mechanism supporting multi-size silicon wafers according to claim 1, characterized in that: A door detection sensor (4) is provided on the guide groove plate (23) of the material box push door.

4. The silicon wafer sorting machine feeding mechanism supporting multi-size silicon wafers according to claim 1, characterized in that: Through holes are provided on the push door structure plate (11), the rotating shaft (13) and the push plate structure plate (21). The push door structure plate (11), the rotating shaft (13) and the push plate structure plate (21) are connected by adjusting screw (10) and adjusting nut (25).

5. The silicon wafer sorting machine feeding mechanism supporting multi-size silicon wafers according to claim 1, characterized in that: The push plate structure plate (21) is connected to the material box push rod (2).

6. The silicon wafer sorting machine feeding mechanism supporting multi-size silicon wafers according to claim 1, characterized in that: A magnet (16) is provided on the push door structure plate (11), and a magnet stop (17) is provided on the slider (22).

7. The silicon wafer sorting machine feeding mechanism supporting multi-size silicon wafers according to claim 1, characterized in that: Multiple box detection sensors (5) are provided on the box loading frame (1).

8. The silicon wafer sorting machine feeding mechanism supporting multi-size silicon wafers according to claim 1, characterized in that: The bottom of the material box loading frame (1) is equipped with a positioning level adjustment screw (6).

9. A method of using a silicon wafer sorting machine feeding mechanism supporting multi-size silicon wafers according to any one of claims 1-8, characterized in that... Includes the following steps: Step 1: Loosen the adjusting screws of the adjustable waist hole (18) of the side baffle and the adjustable waist hole (19) of the front baffle, adjust the position of the front baffle (20) and the side baffle (24) according to the width of the silicon wafer, and then tighten the adjusting screws. Step 2: Adjust the adjusting screw (10) and adjusting nut (25) according to the length of the silicon wafer, or replace the door structure plate (11) with a suitable one. Step 3: Hold the material box push bar (2) to open the material box door and load the material box into the material box loading frame (1); Step 4: Use the material box detection sensor (5) to detect the material box positioning signal; Step 4: Close the material box door. The silicon wafer pusher plate (8) pushes the silicon wafer a certain distance through the soft material silicon wafer pusher block (9), so that part of the silicon wafer is pushed out of the front baffle (20). The buffer resistance cylinder (12) is used to reduce the impact of the push-pull door on the entire silicon wafer sorting machine feeding mechanism and improve the stability of the entire device. Step 5: Use the door detection sensor (4) to detect the push-to-close signal of the material box door; Step six: The feeding mechanism is driven to move up and down by a lifting device. The lifting device is used to drive the feeding mechanism to move from top to bottom, and the silicon wafers are pulled out one by one by the belt conveyor. After the silicon wafers are completely pulled out, the feeding mechanism rises to the original position. The belt conveyor is located on one side of the front baffle. When the material box door of the feeding mechanism is closed, the silicon wafer is pushed out. At this time, the end of the belt conveyor is just below the silicon wafer push-out part. The belt conveyor pulls out the silicon wafer by friction. Step 7: Open the material box push door. The magnet (16) and the magnet stop (17) are used to ensure that the material box push door will not bounce back when it is open.

Images