Laser cutting system

Abstract

The application discloses a kind of laser cutting systems.The laser cutting system of the application includes: processing table, bearing assembly, transfer assembly and laser processing assembly.Processing table is used to carry material and can be moved along X axis and Y axis direction.Bearing assembly is used to carry material.Transfer device is used to transport material.Laser processing assembly further includes first, second and third adjusting assembly, first adjusting assembly is used to introduce laser beam into third adjusting assembly output, light can pass through second, third adjusting assembly output, second adjusting assembly is used to deliver back light to CCD camera, and second adjusting assembly can adjust the focal length of CCD camera.Laser can be transmitted to third adjusting assembly output, light generated by light source can pass through the second, third adjusting assembly output, back light can pass through second, third adjusting assembly and be transmitted to CCD camera, to realize real-time monitoring of laser processing process while laser processing, to ensure the quality of laser processing.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser processing, in particular to a laser cutting system. BACKGROUND

[0002] In the related art, a CCD camera is used to position the material to be processed before laser processing, so as to determine the starting position and processing path of laser processing, thereby improving the processing precision. However, the photographing range of the existing CCD camera and the processing range of the laser cannot be coincided, and the CCD camera cannot realize real-time detection of the laser processing position during the laser processing process. Alternatively, after a period of laser processing is completed, the laser head and the CCD camera are moved so that the CCD camera corresponds to the processing area, and then the laser head is moved back for continuous processing after photographing and identification. During the movement, repeated positioning errors occur, which is not suitable for high-precision laser processing requirements. SUMMARY

[0003] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a laser cutting system, which can realize real-time monitoring of the laser processing process by the CCD camera and ensure the quality of laser processing.

[0004] The laser cutting system according to the first aspect of the present application comprises:

[0005] A processing table, provided with a bearing surface for bearing the material, the processing table being capable of moving along the X-axis and Y-axis directions;

[0006] A bearing assembly comprising a bearing table for bearing the material to be processed and the processed material;

[0007] A transfer device comprising a suction accessory capable of moving along the X-axis and Z-axis directions, the suction accessory being capable of suctioning the material to be processed from the bearing table and transferring to the processing table, and suctioning the processed material from the bearing table and transferring to the processing table;

[0008] The laser processing assembly for processing material to be processed comprises a connecting piece, a laser head, a CCD camera and a light source, the laser head, the CCD camera and the light source are connected to the connecting piece, and the laser head, the CCD camera and the light source are arranged at intervals along the X-axis direction, the laser processing assembly further comprises a first adjusting assembly, a second adjusting assembly and a third adjusting assembly, the first adjusting assembly and the second adjusting assembly are distributed along the X-axis direction, the third adjusting assembly, the second adjusting assembly and the light source are distributed along the Z-axis direction, the first adjusting assembly is arranged at intervals with the laser head along the Z-axis direction, the third adjusting assembly corresponds to the material, the first adjusting assembly is used for guiding the laser beam into the third adjusting assembly output, the first adjusting assembly can adjust the focal length of the laser beam, the light source is used for emitting light, the light can pass through the second adjusting assembly and be output by the third adjusting assembly, the second adjusting assembly is used for conveying the light reflected by the material to the CCD camera, and the second adjusting assembly can adjust the focal length of the CCD camera.

[0009] The laser cutting system has at least the following beneficial effects: after the material to be processed is placed on the bearing table, the suction accessory can adsorb the material and move to the corresponding processing table along the X-axis direction, then the suction accessory moves downward along the Z-axis direction to place the material on the processing table, the X-Y plane of the processing table moves to the corresponding laser processing assembly, the CCD camera drives the processing platform to move after identifying the material, so that the laser head corresponds to the starting position of the material processing, then laser cutting is performed, and the material is discharged to the bearing table after the cutting is completed, during the laser cutting process, the laser generated by the laser head can be transmitted to the third adjusting assembly through the first adjusting assembly and output to the material by the third adjusting assembly, the third adjusting assembly, the second adjusting assembly and the light source are distributed along the Z-axis direction, the light generated by the light source can pass through the second adjusting assembly and be output by the third adjusting assembly, and the reflected light generated by the light irradiated on the material can pass through the third adjusting assembly and be reflected to the CCD camera by the second adjusting assembly, so that the real-time monitoring of the laser processing process is realized while the laser processing is performed, the laser processing path can be adjusted in time, and the laser processing quality is ensured.

[0010] According to some embodiments of the application, the first adjusting assembly, the second adjusting assembly and the third adjusting assembly all comprise adjusting pieces, and the adjusting pieces can move along the Z-axis direction.

[0011] According to some embodiments of the application, the adjusting piece of the first adjusting assembly comprises a first reflecting mirror, and the first reflecting mirror can reflect the laser.

[0012] According to some embodiments of the present application, the adjusting member of the third adjusting assembly comprises a second mirror, the second mirror is capable of reflecting the laser, and the light emitted by the light source is capable of penetrating the second mirror.

[0013] According to some embodiments of the present application, the adjusting member of the second adjusting assembly comprises a beam splitter, the light emitted by the light source is capable of penetrating the beam splitter, and the beam splitter is capable of delivering the light reflected by the material to the CCD camera.

[0014] According to some embodiments of the present application, the bearing table comprises two bearing members, the two bearing members are arranged along the Y-axis direction, the bearing members are provided with bearing portions, the two bearing portions are arranged oppositely, and the two bearing portions jointly bear the material. Along the X-axis direction, the bearing table is sequentially provided with a first bearing position and a second bearing position, the first bearing position is used for bearing the material to be processed, and the second bearing position is used for bearing the processed material.

[0015] According to some embodiments of the present application, at least one bearing member of the bearing table is capable of moving along the Y-axis direction, so as to change the distance between the two bearing portions.

[0016] According to some embodiments of the present application, the material moving device comprises a first suction accessory, a second suction accessory and a connecting member, the first suction accessory and the second suction accessory are connected to the connecting member, the first suction accessory and the second suction accessory are capable of moving along the Z-axis direction, the first suction accessory corresponds to the first bearing position, and the second suction accessory corresponds to the second bearing position.

[0017] According to some embodiments of the present application, a first sensor is further included, the first sensor is connected to the laser processing assembly, the first sensor is arranged above the processing platform, and the first sensor is used for detecting the thickness of the material.

[0018] According to some embodiments of the present application, the processing table is made of alumina, and a vacuum source is connected to the lower portion of the processing table, so as to generate a negative pressure on the bearing surface to adsorb the material.

[0019] Additional aspects and advantages of the present application will be given in part in the following description, will become apparent in part from the following description, or will be learned by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0020] The present application will be further described below in combination with the drawings and embodiments, in which:

[0021] Figure 1 FIG. 1 is a schematic view of a laser cutting system according to an embodiment of the present application;

[0022] Figure 2A schematic view of a carrying table according to an embodiment of the present application;

[0023] Figure 3 A schematic view of a transfer device according to an embodiment of the present application;

[0024] Figure 4 A schematic view of a carrying assembly according to an embodiment of the present application;

[0025] Figure 5 A schematic view of a laser processing assembly according to an embodiment of the present application;

[0026] Figure 6 A schematic view of a laser processing assembly without connecting member according to an embodiment of the present application;

[0027] Figure 7 A schematic view of an optical path of a laser processing assembly according to an embodiment of the present application.

[0028] Reference signs:

[0029] Base table 100, processing table 110, carrying surface 111, rack 120;

[0030] Carrying assembly 200, carrying table 210, carrying member 211, carrying part 212, main body part 213, first carrying position 214, second carrying position 215, guide rail 220;

[0031] Transfer device 300, suction accessory 310, suction head 311, first suction accessory 312, second suction accessory 313;

[0032] Laser processing assembly 400, connecting member 410, second accommodating cavity 411, light-transmitting hole 412, laser head 420, CCD camera 430, light source 440, first adjusting assembly 450, first reflecting mirror 451, second adjusting assembly 460, light splitter 461, third adjusting assembly 470, second reflecting mirror 471, first driving member 480, adjusting member 490, second driving member 491, third reflecting mirror 492, mounting plate 493;

[0033] Mounting member 500, mounting cavity 510, opening 520, first sensor 530, mounting rack 540, lens 550;

[0034] Material 600, jig 610, carrying film 620, sapphire substrate 630. DETAILED DESCRIPTION

[0035] Embodiments of the present application are described in detail below with reference to the attached drawings, which show by way of example, embodiments in which the same or similar elements have the same or similar reference numbers. The embodiments described below are examples only, and are not to be construed as limiting the present application.

[0036] In the description of the application, it should be understood that the orientation description, such as the orientation or position relationship indicated by the upper, lower, front, rear, left, right and the like, is based on the orientation or position relationship shown in the drawings, and is only for the purpose of facilitating the description of the application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the application.

[0037] In the description of the application, if the meaning of several is more than one, the meaning of multiple is more than two, greater than, less than, more than and the like are understood as not including the number, above, below, within and the like are understood as including the number. If the first, second is described, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance of the indicated technical features or implying a specific number of the indicated technical features or implying a specific order of the indicated technical features.

[0038] In the description of the application, unless otherwise explicitly limited, the words such as setting, installing, connecting and the like should be broadly understood, and the person skilled in the art can reasonably determine the specific meaning of the above words in the application in combination with the specific content of the technical scheme.

[0039] In the description of the application, the description of the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0040] Reference Figures 1 to 7The first aspect embodiment of the present application provides a laser cutting system, comprising a machining table 110, a carrying assembly 200, a moving device 300 and a laser machining assembly 400. The machining table 110 is provided with a carrying surface 111 for carrying materials 600, and the machining table 110 can move along the X-axis and Y-axis directions. The carrying assembly 200 comprises a carrying table 210 for carrying materials 600 to be machined and machined materials 600. The moving device 300 comprises a suction accessory 310, which can move along the X-axis and Z-axis directions, and the suction accessory 310 can suction the materials 600 to be machined from the carrying table 210 and transfer them to the machining table 110, and suction the machined materials 600 from the machining table 110 and transfer them to the carrying table 210. The laser machining assembly 400 is used for machining the materials 600 to be machined, and comprises a connecting piece 410, a laser head 420, a CCD camera 430 and a light source 440. The laser head 420, the CCD camera 430 and the light source 440 are all connected to the connecting piece 410, and are arranged at intervals along the X-axis direction. The laser machining assembly 400 further comprises a first adjusting assembly 450, a second adjusting assembly 460 and a third adjusting assembly 470. The first adjusting assembly 450 and the second adjusting assembly 460 are distributed along the X-axis direction, and the third adjusting assembly 470, the second adjusting assembly 460 and the light source 440 are distributed along the Z-axis direction. The first adjusting assembly 450 is arranged at intervals with the laser head 420 along the Z-axis direction. The third adjusting assembly 470 corresponds to the materials 600, and the first adjusting assembly 450 is used for guiding the laser beam into the third adjusting assembly 470. The first adjusting assembly 450 can adjust the focal length of the laser beam. The light source 440 is used for emitting light, and the light can pass through the second adjusting assembly 460 and be output by the third adjusting assembly 470. The second adjusting assembly 460 is used for transmitting the light reflected by the materials 600 to the CCD camera 430, and the second adjusting assembly 460 can adjust the focal length of the CCD camera 430.

[0041] After the material 600 to be processed is placed on the bearing table 210, the suction accessory 310 can suck the material 600 and move along the X-axis direction to the processing table 110, then the suction accessory 310 moves downward along the Z-axis direction to place the material 600 on the processing table 110, the processing table 110 moves in the X-Y plane to correspond to the laser processing assembly 400, after the CCD camera 430 identifies the material 600, the driving processing platform is driven to move, so that the laser head 420 corresponds to the starting position of the material 600, then laser cutting is performed, and after the cutting is completed, the material 600 is discharged to the bearing table 210. During the laser cutting process, the laser generated by the laser head 420 can be transmitted to the third adjusting assembly 470 through the first adjusting assembly 450 and output to the material 600 by the third adjusting assembly 470. The third adjusting assembly 470, the second adjusting assembly 460 and the light source 440 are distributed along the Z-axis direction. The light generated by the light source 440 can pass through the second adjusting assembly 460 and be output by the third adjusting assembly 470. The reflected light generated by the light irradiated on the material 600 can pass through the third adjusting assembly 470 and be reflected to the CCD camera 430 by the second adjusting assembly 460, so that the laser processing process is monitored in real time while the laser processing is performed, the laser processing path can be adjusted in time, and the laser processing quality is ensured.

[0042] With reference to Figure 1 Specifically, the laser cutting system further comprises a base 100 and a rack 120, the rack 120 and the processing table 110 are installed on the base 100, the transfer device 300 and the bearing assembly 200 are connected to the rack 120, and the base 100 is made of marble. The density of marble is high, the base 100 made of marble has good stability, and in addition, the processing of marble is simple, so that the flatness of marble used to bear the plane of the rack 120 and the base 100 can be ensured.

[0043] Before the material 600 is processed by laser, the focal length of the laser is determined and adjusted, then the focal length of the CCD camera 430 is adjusted to be the same as the focal length of the laser, so that the CCD camera 430 can obtain the position of the current laser beam processing, and provide basis for laser beam path correction.

[0044] With reference to Figure 5Specifically, the connecting piece 410 is provided with a second accommodating cavity 411, an adjusting assembly, a second adjusting assembly 460 and a third adjusting assembly 470 are accommodated in the second accommodating cavity 411, the top wall of the connecting piece 410 is provided with three mounting holes along the X-axis direction, the CCD camera 430, the light source 440 and the laser head 420 are connected to the connecting piece 410 and pass through the corresponding mounting holes, so that the light can enter the second accommodating cavity 411, the bottom wall of the connecting piece 410 is provided with a light transmission hole 412, the light transmission hole 412 corresponds to the third adjusting assembly 470, and the outer side of the bottom wall of the connecting piece 410 is further connected with a lens 550, the lens 550 is coaxially arranged with the light transmission hole 412, and the laser beam and the light can be transmitted to the material 600 through the lens 550 and the light transmission hole 412. The laser processing assembly further comprises a mounting plate 493, the above-mentioned components are connected to the mounting plate 493, and then connected to the inner wall of the connecting piece 100 and accommodated in the second accommodating cavity 101 through the mounting plate 493. The mounting plate 493 is used for connecting the plane of the above-mentioned components, and the flatness of the plane is easy to guarantee, so that the stable transmission of the laser beam and the light can be guaranteed. The above-mentioned components are accommodated in the second accommodating cavity 800, so that the laser beam and the light can be prevented from being affected by the external environment, such as external light, and the quality of the laser beam and the light can be guaranteed.

[0045] Referring to FIG. 5, in some embodiments, the first adjusting assembly 450, the second adjusting assembly 460 and the third adjusting assembly 470 all comprise a first driving piece 480 and an adjusting piece 490, the adjusting piece 490 is connected to the first driving piece 480, and the first driving piece 480 can adjust the adjusting piece 490 to move along the Z-axis direction. The first driving piece 480 can adjust the position of the corresponding adjusting piece 490 along the Z-axis direction, so as to adjust the focal length of the CCD camera 430 or the laser beam. For example, first, the positions of the first adjusting assembly 450 and the third adjusting assembly 470 are adjusted to adjust the focal length of the laser beam, and then the distance between the second adjusting assembly 460 and the third adjusting assembly 470 is adjusted to realize the adjustment of the focal length of the CCD camera 430. The above-mentioned adjustment accuracy can reach microns, so as to realize the requirement of laser processing accuracy.

[0046] Referring to Figure 5 and Figure 6 In some embodiments, the adjusting piece 490 of the first adjusting assembly 450 comprises a first reflector 451 and a mounting frame 540, the first reflector 451 is mounted on the mounting frame 540, the first driving piece 480 can drive the mounting frame 540 to rotate, and the first reflector 451 can reflect the laser. The first reflector 451 is selected as a specific waveband reflector, so as to achieve the purpose of reflecting only the laser, and the laser beam is transmitted to the third adjusting assembly 470. Specifically, the first reflector 451 is arranged to be capable of reflecting the laser beam with a waveband of 532 nm.

[0047] Referring to Figure 5 andFigure 6 In some embodiments, the third adjusting assembly 470 comprises a second mirror 471 and a mounting frame 540, the second mirror 471 is mounted on the mounting frame 540, the first driving member 480 is capable of driving the mounting frame 540 to rotate, and the second mirror 471 is capable of reflecting the laser light. Specifically, the second mirror 471 is also selected as a specific waveband mirror, and the reflection waveband of the second mirror 471 is the same as that of the first mirror 451, so that the laser beam transmitted by the first mirror 451 can be output to the material 600. Meanwhile, the visible light can penetrate the second mirror 471, so that the light beam emitted by the light source 440 can pass through the second mirror 471 to illuminate the material 600, and the reflected light formed by the material 600 can also pass through the third adjusting assembly 470 and be transmitted to the CCD camera 430 by the second adjusting assembly 460 to form an image.

[0048] With reference to Figure 5 and Figure 6 In some embodiments, the second adjusting assembly 460 comprises a beam splitter 461, the light emitted by the light source 440 can penetrate the beam splitter 461, and the beam splitter 461 is capable of transmitting at least part of the light reflected by the material 600 to the CCD camera 430. Specifically, after the reflected light generated by the light irradiating on the material 600 enters the beam splitter 461, the beam splitter 461 can reflect about 50% of the light to the CCD camera 430 to form an image.

[0049] With reference to Figure 6 In some embodiments, the laser processing assembly 400 further comprises a third mirror 492, the third mirror 492 is arranged along the X-axis direction away from the second adjusting assembly 460, the third mirror 492 corresponds to the second adjusting assembly 460, and the CCD camera 430 is directed towards the third mirror 492. The third mirror 492 guides the reflected light to the CCD camera 430 to form an image, and the propagation direction of the reflected light is changed by the third mirror 492, so that the CCD camera 430 can be connected to the top wall of the connecting member 410 and directed towards the third mirror 492, facilitating the installation of the CCD camera 430. In addition, the third mirror 492 can be adjusted synchronously with the beam splitter 461, and the focal length of the CCD camera 430 is adjusted to be the same as the focal length of the laser.

[0050] With reference to Figure 6In some embodiments, the first adjusting assembly 450, the second adjusting assembly 460 and the third adjusting assembly 470 each comprises a second driving member 491 connected to the first driving member 480, and an adjusting member 490 connected to the second driving member 491, the second driving member 491 being configured to drive the adjusting member 490 to rotate. The second driving member 491 is configured to adjust the included angle of the adjusting member 490 relative to the horizontal plane, so as to change the irradiation position of the laser beam and the light, and the second driving member 491 is configured to be coordinated with the corresponding first driving member 480 to adjust the focal length of the laser beam or the CCD camera 430, so as to meet the use requirement. It should be noted that the functions of the first driving member 480 and the second driving member 491 can be achieved by only one driving member, so as to realize the rotation and Z-axis direction movement of the adjusting member 490.

[0051] With reference to Figure 6 In some embodiments, the laser processing assembly 400 comprises at least three mounting members 500 and a plurality of blocking members, the mounting members 500 being connected to the connecting member 410, the mounting members 500 being provided with mounting cavities 510, and the two side walls of the mounting members 500 along the X-axis, Y-axis and Z-axis directions being provided with corresponding openings 520, the openings 520 being communicated with the mounting cavities 510, the first adjusting assembly 450, the second adjusting assembly 460 and the third adjusting assembly 470 each corresponding to one mounting member 500 and being accommodated in the mounting cavity 510 of the corresponding mounting member 500, and part of the openings 520 being configured to pass the laser beam or the light, and the rest of the openings 520 being blocked by the blocking members. The above-mentioned arrangement can realize the modular design, when it is required to adjust or increase the adjusting member 490, only one mounting member 500 is required to be added, and the newly added adjusting member 490 and driving member are placed and fixed in the mounting cavity 510, the opening 520 not passing the laser beam or the light is blocked, then the newly added mounting member 500 is connected to the connecting member 410, so as to realize convenient assembly. In addition, the opening 520 not passing the laser beam or the light is blocked, so as to reduce the interference of the external environment on the laser beam and the light.

[0052] In some embodiments, the carrying table 210 includes two carrying members 211 which are spaced apart along the Y-axis direction, and the carrying member 211 is provided with a carrying portion 212, and the two carrying portions 212 are oppositely arranged and jointly carry the material 600. Along the X-axis direction, the carrying table 210 is sequentially provided with a first carrying position 214 and a second carrying position 215, the first carrying position 214 is used for carrying the material 600 to be processed, and the second carrying position 215 is used for carrying the material 600 processed. Specifically, the carrying member 211 includes a main body portion 213 and a carrying portion 212, and the carrying portion 212 is protrudingly arranged on the main body portion 213. The distance between the surfaces of the two main body portions 213 facing each other is greater than the maximum diameter of the material 600, and the distance between the surfaces of the two carrying portions 212 facing each other is less than the minimum diameter of the material 600, so as to achieve the carrying of the material 600.

[0053] In addition, a second sensor is arranged corresponding to the positions of the first carrying position 214 and the second carrying position 215, and the second sensor is connected to any one of the carrying members 211. The sensor corresponding to the first carrying position 214 is used for detecting the material 600 to be processed, and the second sensor corresponding to the second carrying position 215 is used for detecting the material 600 processed. Through the detection of the sensor on the presence or absence of the material 600, the artificial feeding and discharging can be timely reminded, or the signal can be transmitted to the mechanical hand, and the material 600 to be processed is placed on the first carrying position 214 by the mechanical hand, and the material 600 processed is moved out of the second carrying position 215 by the mechanical hand. The second sensor can be a laser sensor.

[0054] Referring to Figure 1 and Figure 4 In some embodiments, at least one carrying member 211 of the carrying table 210 can move along the Y-axis direction to change the distance between the two carrying portions 212. The distance between the two carrying portions 212 is adjustable, so as to adapt to different sizes of the jig 610, and the jig 610 of different sizes is used for carrying the material 600 of different sizes, so as to realize the carrying of the material 600 of different sizes. Specifically, the laser cutting system further includes a plurality of guide rails 220 which are spaced apart along the X-axis direction, and the guide rail 220 extends along the Y-axis direction. The at least one carrying member 211 is slidingly connected to the guide rail 220, so as to realize the adjustment of the distance between the at least one carrying member 211 and the other carrying member 211 along the Y-axis direction.

[0055] Referring to Figure 3In some embodiments, the transfer device 300 comprises a first suction member 312, a second suction member 313, and a connecting member 410, the first suction member 312 and the second suction member 313 are connected to the connecting member 410, the first suction member 312 and the second suction member 313 are movable along the Z-axis direction, the first suction member 312 corresponds to the first supporting position 214, and the second suction member 313 corresponds to the second supporting position 215. For example, the material 600 can be a sapphire substrate 630, the sapphire substrate 630 is generally carried on the jig 610 together through a supporting film 620, the supporting film 620 is bonded to one side of the jig 610, the jig 610 is provided with a through hole 611, and the sapphire substrate 630 is carried on the supporting film 620 and protrudes out of the through hole 611. Specifically, the first suction member 312 and the second suction member 313 are each provided with a plurality of suction heads 311, the plurality of suction heads 311 are arranged at intervals along the circumferential direction, the suction heads 311 correspond to the jig 610, the suction member 310 is lowered to contact the suction heads 311 with the jig 610 when suction is required, at the same time, the suction heads 311 generate negative pressure to suck and transfer the jig 610 together with the sapphire substrate 630 to the processing platform 110. Among them, the plurality of suction heads 311 arranged on the suction member 310 are connected to each other through pipelines and are further connected to a vacuum source, so that the negative pressure generated on each suction head 311 is uniform and equal, which can keep the state of the material 600 stable during the process of suction and transportation.

[0056] With reference to Figure 1 And Figure 5 In some embodiments, the laser cutting system further comprises a first sensor 530 connected to the connecting member 410 or the rack 120, the first sensor 530 is arranged above the processing platform, the first sensor 530 is used for detecting the thickness of the material 600, the first sensor 530 can scan the profile of the material 600, so as to obtain the thickness of the material 600 itself and the distance between the material 600 and the lens 550, and the distance is used as the basis for adjusting the focal length to meet the processing requirements of the material 600 with different height sizes, that is, the height deviation of the workpiece 600 itself can be compensated, and the problem of cutting path deviation in the Z direction caused by the inconsistent height of different workpieces 600 can be solved. The first sensor 530 can be selected as a laser ranging sensor.

[0057] In some embodiments, the processing table 110 is made of aluminum oxide, and a vacuum source is connected to the processing table 110 below to generate a negative pressure on the bearing surface 111 to adsorb the material 600. Since the structure of aluminum oxide has many pores, when the vacuum source is arranged below the processing table 110, the negative pressure can act on the material 600 through the pores to adsorb the material 600 on the bearing surface 111, avoiding the material 600 from moving when the processing table 110 moves. For example, when the material 600 is a sapphire substrate 630, the negative pressure on the bearing surface 111 can adsorb the bearing film 620, so that the sapphire substrate 630 does not move relatively, ensuring the relative position of the sapphire substrate 630 during laser cutting. In addition, the processing table 110 can rotate, so as to facilitate the laser beam to cut the material 600 from different directions, for example, after cutting in the X-axis direction is completed, the processing table 110 is rotated by 90° to cut in the Y-axis direction, so as to cut the material 600 into small pieces. The above rotating function can be realized by a DD motor.

[0058] In summary, when the material 600 is a sapphire substrate 630, the specific steps of laser cutting processing of the sapphire substrate 630 are as follows:

[0059] Step 1: providing a sapphire substrate 630 to be cut;

[0060] Step 2: fixing the sapphire substrate 630 on the film of the jig 610, and placing the jig 610 on the docking platform;

[0061] Step 3: using the suction accessory 310 to adsorb and transfer the jig 610 to the bearing surface 111 arranged on the processing table 110;

[0062] Step 4: turning on the vacuum source to adsorb the jig 610 on the bearing surface 111;

[0063] Step 5: moving the processing table 110 below the lens 550;

[0064] Step 6: determining the height difference of the material 600 to be cut by the first sensor 530, to determine the displacement amount of the height adjustment of the laser head 420 during cutting, so as to adjust the focal length of the laser;

[0065] Step 7: performing laser cutting according to the set trajectory;

[0066] Step 8: completing the laser cutting, turning off the vacuum source, taking out the jig 610, and placing it back on the bearing table.

[0067] The embodiments of the present application are described in detail above with reference to the drawings, but the present application is not limited to the above-described embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the spirit of the present application. Furthermore, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

Claims

1. A laser cutting system, characterized in that, The application relates to a laser processing device, which comprises the following components: a processing table, which is provided with a bearing surface for bearing materials, and can move along the X-axis and Y-axis directions; a bearing assembly, which comprises a bearing table for bearing materials to be processed and processed materials; a transfer device, which comprises a suction accessory capable of moving along the X-axis and Z-axis directions, and can suck the materials to be processed by the bearing table and transfer the materials to the processing table, and can suck the processed materials from the processing table and transfer the materials to the bearing table; a laser processing assembly for processing the materials to be processed, which comprises a connecting piece, a laser head, a CCD camera and a light source, the laser head, the CCD camera and the light source are connected to the connecting piece, and are arranged at intervals along the X-axis direction, the laser processing assembly further comprises a first adjusting assembly, a second adjusting assembly and a third adjusting assembly, the first adjusting assembly and the second adjusting assembly are distributed along the X-axis direction, the third adjusting assembly, the second adjusting assembly and the light source are distributed along the Z-axis direction, the first adjusting assembly is arranged at intervals along the Z-axis direction with the laser head, the third adjusting assembly corresponds to the materials, the first adjusting assembly is used for guiding the laser beam into the third adjusting assembly, the first adjusting assembly can adjust the focal length of the laser beam, the light source is used for emitting light, the light can pass through the second adjusting assembly and be output by the third adjusting assembly, the second adjusting assembly is used for transmitting the light reflected by the materials to the CCD camera, and the second adjusting assembly can adjust the focal length of the CCD camera; the first adjusting assembly, the second adjusting assembly and the third adjusting assembly all comprise a first driving piece, a second driving piece and an adjusting piece, the adjusting piece can move along the Z-axis direction; the adjusting piece of the first adjusting assembly comprises a first reflector, the first reflector can reflect the laser; the adjusting piece of the second adjusting assembly comprises a light splitter, the light emitted by the light source can penetrate the light splitter, and the light splitter can transmit at least part of the light reflected by the materials to the CCD camera; the adjusting piece of the third adjusting assembly comprises a second reflector, the light emitted by the light source can penetrate the second reflector, and the second reflector can reflect the laser; the first driving piece can adjust the position of the corresponding adjusting piece along the Z-axis direction; the second driving piece is connected to the first driving piece and the corresponding adjusting piece, and is used for driving the corresponding adjusting piece to rotate.

2. The laser cutting system of claim 1, wherein, the bearing table comprises two bearing pieces arranged at intervals along the Y-axis direction, the bearing pieces are provided with bearing portions, the two bearing portions are arranged oppositely, and the two bearing portions jointly bear the materials; along the X-axis direction, the bearing table is sequentially provided with a first bearing position and a second bearing position, the first bearing position is used for bearing the materials to be processed, and the second bearing position is used for bearing the processed materials.

3. The laser cutting system of claim 2, wherein, At least one of the carriers of the carrier table is movable along the Y-axis direction to change the distance between the two carrier parts.

4. The laser cutting system of claim 2, wherein, The transfer device comprises a first suction accessory, a second suction accessory and a connecting member, the first suction accessory and the second suction accessory are connected to the connecting member, the first suction accessory and the second suction accessory are movable along the Z-axis direction, the first suction accessory corresponds to the first carrier position, and the second suction accessory corresponds to the second carrier position.

5. The laser cutting system of claim 1, wherein, A first sensor is further included, the first sensor is connected to the laser processing assembly, the first sensor is arranged above the processing table, and the first sensor is used to detect the thickness of the material.

6. The laser cutting system of claim 1, wherein, The processing table is made of aluminum oxide, and the lower part of the processing table is communicated with a vacuum source to generate negative pressure on the carrier surface to adsorb the material.

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