Bonding structure, display module and bonding method

Abstract

The application relates to a bonding structure, a display module and a bonding method. The bonding structure comprises a thin film transistor and a silver paste pattern layer, the silver paste pattern layer is arranged on the thin film transistor, and the silver paste pattern layer is used for bonding a connector. The silver paste pattern layer comprises at least two layers of silver paste layers which are stacked and arranged in a non-overlapping mode. The bonding structure is designed by arranging the multiple layers of silver paste layers in a non-overlapping mode, so that the problem of excessively high or wide accumulated horn-shaped protrusion height caused by the multiple layers of silver paste layers is avoided, the multiple layers of silver paste layers are realized, the overall thickness of the thin film transistor and the silver paste pattern layer is reduced, the problem of poor glue overflow caused by bonding of an anisotropic conductive film in a subsequent process is avoided, and the effect of yield improvement is achieved by adopting a silver paste multi-layer printing process.

Description

Technical Field

[0001] This application relates to the field of thin-film transistor bonding, and in particular to bonding structures, display modules, and bonding methods. Background Technology

[0002] When bonding flexible printed circuits (FPCs) and thin film transistors (TFTs), anisotropic conductive films (ACFs) are used. Anisotropic conductive films, which have the property of being conductive in the vertical direction but not in the horizontal direction, are used to fix the flexible printed circuit board and the thin film transistor and enable electrical conduction.

[0003] Currently, in the electronics manufacturing industry, screen printing processes on thin-film transistors use silver paste (AG) printing technology. For example, flexible circuit boards and silver paste circuits are bonded and connected through anisotropic conductive films. The characteristics of silver paste materials include viscosity, molecular forces, and hydrophilicity. Due to the characteristics of the material, multiple layers of printing are often required to achieve the desired thickness when printing the silver paste layer, i.e., the silver layer, on the product surface. Moreover, due to the influence of the surface tension of the substrate and the hydrophilicity of the material, after the silver layer is printed, horn-shaped bumps will form on the four edges of the substrate. Some horn-shaped bumps are too high or too wide, which can lead to corresponding defects in the image during functional testing and can also cause problems such as excess adhesive on the bonded anisotropic conductive film. Summary of the Invention

[0004] Therefore, it is necessary to provide a bonding structure, a display module, and a bonding method.

[0005] In one embodiment of this application, a bonding structure includes:

[0006] Thin-film transistors; and

[0007] A silver paste pattern layer is disposed on the thin-film transistor for bonding a connector; the silver paste pattern layer comprises at least two stacked silver paste layers, and each adjacent silver paste layer is not overlapping.

[0008] The aforementioned bonding structure, through the design of non-overlapping multilayer silver paste layers, avoids the problem of excessively high or wide cumulative horn protrusions caused by multiple silver paste layers, making the realization of multilayer silver paste layers possible. On the other hand, it helps to reduce the overall thickness of the thin-film transistor and the silver paste pattern layer, avoiding the problem of adhesive overflow defects caused by bonding anisotropic conductive films in subsequent processes. Furthermore, it helps to achieve improved yield when using multilayer silver paste printing processes.

[0009] In one embodiment, adjacent silver paste layers form a staggered structure; or...

[0010] The area of ​​the silver paste layer that is further away from the thin-film transistor is smaller than the area of ​​the silver paste layer that is further away from the thin-film transistor.

[0011] In one embodiment, the silver paste layers are similar in shape; and / or,

[0012] The two adjacent silver paste layers form a regular misaligned structure; or,

[0013] The misalignment structure of two adjacent silver paste layers or the area difference between two adjacent silver paste layers forms an open groove, which is used to accommodate the horn-shaped protrusion structure formed by the lower silver paste layer.

[0014] In one embodiment, the silver paste layer includes a first silver paste layer and a second silver paste layer, which are staggered, or the area of ​​the first silver paste layer is larger than the area of ​​the second silver paste layer.

[0015] In one embodiment, the silver paste pattern layer is printed onto the thin-film transistor to form silver paste patterned bumps.

[0016] In one embodiment, the silver paste patterned boss includes a first boss and a second boss separated by a spacer area.

[0017] In one embodiment, the bonding structure further includes the connector.

[0018] In one embodiment, the connector includes a connector base, a rigid circuit board, and a flexible circuit board.

[0019] In one embodiment, a display module includes a flexible circuit board and any of the bonding structural members described above;

[0020] The silver paste pattern layer of the bonding structure bonds the flexible circuit board.

[0021] In one embodiment, a bonding method includes the steps of:

[0022] The first silver paste layer is printed on the thin-film transistor with a silver paste pattern layer.

[0023] Print another layer of silver paste pattern layer on the first layer of silver paste, until all silver paste patterns are printed and adjacent silver paste layers are not overlapped.

[0024] A flexible circuit board is bonded on the silver paste pattern layer. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of a traditional bonding structure.

[0027] Figure 2 for Figure 1 A schematic diagram showing the location of the horn-shaped protrusions on the bonding structural component.

[0028] Figure 3 A schematic diagram illustrating new problems arising from improvements to traditional bonding structures.

[0029] Figure 4 Another schematic diagram illustrating new problems arising from improvements to traditional bonding structures.

[0030] Figure 5 This is a schematic diagram of an embodiment of the bonding structure described in this application.

[0031] Figure 6 This is a schematic diagram of another embodiment of the bonding structure described in this application.

[0032] Figure 7 This is a schematic diagram of another embodiment of the bonding structure described in this application.

[0033] Figure 8 This is a schematic diagram of another embodiment of the bonding structure described in this application.

[0034] Figure 9 This is a schematic diagram of the structure of the silver paste pattern layer of another embodiment of the bonding structure described in this application.

[0035] Figure 10 This is a schematic diagram of the structure of the silver paste pattern layer in another embodiment of the bonding structure described in this application.

[0036] Figure 11 This is a schematic diagram of another embodiment of the bonding structure described in this application.

[0037] Figure 12 This is a schematic flowchart of an embodiment of the bonding method described in this application.

[0038] Reference numerals: Thin film transistor 100, first protrusion 111, second protrusion 112, spacer region 113, silver paste pattern layer 200, horn protrusion structure 201, open groove 202, first silver paste layer 210, first horn protrusion 211, second silver paste layer 220, second horn protrusion 221, third silver paste layer 230, fourth silver paste layer 240, first length L1, second length L2, third length L3, fourth length L4, first thickness H1, second thickness H2, third thickness H3. Detailed Implementation

[0039] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0040] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0042] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0043] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0044] This application discloses a bonding structure, a display module, and a bonding method, which includes some or all of the structures of the following embodiments; that is, the bonding structure, display module, and bonding method include some or all of the following technical features. In one embodiment of this application, a bonding structure includes: a thin-film transistor and a silver paste pattern layer, wherein the silver paste pattern layer is disposed on the thin-film transistor and is used for bonding a connector; the silver paste pattern layer includes at least two stacked silver paste layers, and each adjacent silver paste layer is not overlapped. The above-mentioned bonding structure, by designing non-overlapping multi-layer silver paste layers, avoids the problem of excessively high or wide cumulative horn protrusions caused by multi-layer silver paste layers, making the implementation of multi-layer silver paste layers possible; on the other hand, it helps to reduce the overall thickness of the thin-film transistor and the silver paste pattern layer, avoiding the problem of adhesive overflow defects due to bonding anisotropic conductive films in subsequent process processes; and furthermore, it helps to achieve improved yield when using multi-layer silver paste printing processes.

[0045] Traditional bonding structural components such as Figure 1 As shown, the silver paste pattern layer 200 is disposed on the thin-film transistor 100. As previously described, due to the material properties of the silver paste pattern layer 200, a bull-horn protrusion structure is formed, combined with... Figure 2 It is evident that the horn-shaped protrusion structure 201 has a significant impact on the thickness of the product under microscopic conditions. Some sophisticated electronic devices, such as wearable devices or smartphones, have very strict requirements for product thickness. A change in thickness in the early stages of the process may seriously affect tens of thousands of subsequent process steps. Therefore, exceeding the limits of thickness variation is unacceptable.

[0046] However, during further innovation, it was discovered that when multiple layers of printed silver paste pattern 200 are required, if this application adopts... Figure 3 and Figure 4The structure shown depicts a silver paste pattern layer 200 with two or more layers of silver paste superimposed on it. In this case, the superposition of the first silver paste layer 210 and the second silver paste layer 220 results in an excessively high horn-shaped protrusion structure 201, causing changes in product thickness and leading to various defects. Furthermore, the superposition of the first silver paste layer 210 and the second silver paste layer 220 also results in an excessively wide horn-shaped protrusion structure 201, which also brings a series of derivative problems. In other words, this product defect arises from improvements made; without these improvements, the defect would not occur, thus increasing the difficulty of further improvements.

[0047] To enhance the stability and effectiveness of bonding, and to avoid product defects caused by excessive height or width of the horn-shaped protrusion structure 201, a bonding structure component is adopted in one embodiment, such as... Figure 5 As shown, it includes a thin-film transistor 100 and a silver paste pattern layer 200. The silver paste pattern layer 200 is disposed on the thin-film transistor 100 for bonding a connector. The silver paste pattern layer 200 includes at least two stacked silver paste layers, and adjacent silver paste layers are not overlapped. In one embodiment, the bonding structure further includes the connector. In one embodiment, the connector includes a connector base, a rigid circuit board, and a flexible circuit board. The bonding structure mainly achieves the bonding purpose, such as effectively bonding the thin-film transistor 100 to the connector base, rigid circuit board, or flexible circuit board through the silver paste pattern layer 200. A common application is that the thin-film transistor 100 is bonded to a flexible circuit board through the silver paste pattern layer 200. In other applications, provided that other frame structures remain in a fixed relative position, the thin-film transistor 100 can be bonded to a connector base or rigid circuit board through the silver paste pattern layer 200, which is also an alternative solution.

[0048] In this embodiment, the silver paste pattern layer 200 includes two stacked silver paste layers, namely a first silver paste layer 210 and a second silver paste layer 220, and the adjacent silver paste layers are not overlapped. In this embodiment, the silver paste layer includes a first silver paste layer 210 and a second silver paste layer 220, which are staggered, or the area of ​​the first silver paste layer 210 is larger than the area of ​​the second silver paste layer 220. In other embodiments, the silver paste pattern layer 200 includes three, four, or more stacked silver paste layers. These silver paste layers form slightly different patterns, and can all be essentially called pattern layers, that is, each layer of the silver paste pattern layer 200 is different from the adjacent layers, i.e., the pattern of each layer of the silver paste pattern layer 200 is different from the pattern of the adjacent layers. This design is advantageous in providing vacancies, such as open slots, to accommodate the horn-shaped protrusion structure 201, and in reducing the overall thickness of the thin-film transistor and the silver paste pattern layer, making it possible to realize multi-layer silver paste layers.

[0049] Based on the consideration of accommodating the horn-shaped protrusion structure 201, in one embodiment, adjacent silver paste layers form a staggered structure; in one embodiment, such as Figure 6 As shown, the silver paste pattern layer 200 includes four stacked silver paste layers: a first silver paste layer 210, a second silver paste layer 220, a third silver paste layer 230, and a fourth silver paste layer 240, which are stacked sequentially. Adjacent first silver paste layers 210 and 220 form a staggered structure, as do adjacent second silver paste layers 220 and 230, and adjacent third silver paste layers 230 and 240. This design facilitates the coordination between the silver paste layers, avoids the accumulation of the horn-shaped protrusions 201 in the same location, which could affect the overall thickness of the product, and helps improve yield in multi-layer silver paste printing processes.

[0050] In one embodiment, such as Figure 7 As shown, the silver paste pattern layer 200 also includes four sequentially stacked silver paste layers. This embodiment is similar to... Figure 6 The difference in the illustrated embodiment is that adjacent silver paste layers form a regular misaligned structure, while Figure 6 In the illustrated embodiment, adjacent silver paste layers form an irregular misaligned structure. In this embodiment, the regular misaligned structure facilitates the position control of the horn-shaped protrusion structure 201, avoiding adhesive overflow defects caused by bonding anisotropic conductive films in subsequent processes. Furthermore, the regular misaligned structure has a clear hierarchical structure, making it easy to coordinate with other aspects to achieve the overall design.

[0051] To simplify the production process, in one embodiment, such as Figure 8As shown, the shapes of each silver paste layer are similar. To avoid excessively high cumulative horn-like protrusions caused by multiple silver paste layers, in this embodiment, the area of ​​the silver paste layer with a larger distance from the thin-film transistor 100 is smaller than the area of ​​the silver paste layer with a smaller distance from the thin-film transistor 100. In other embodiments, a stacked structure of silver paste layers with a larger upper layer and a smaller lower layer can also be formed. In practical applications, because the silver paste layer has a certain fluidity before curing, the upper silver paste layer will have a certain shape change at the lower silver paste layer, covering the lower horn-like protrusion structure 201. However, trial production tests show that this does not affect the bonding stability and can still achieve the design goal of improving bonding strength, which is beneficial for subsequent process steps such as further bonding of anisotropic conductive films.

[0052] In one embodiment, such as Figure 9 As shown, the misalignment structure of two adjacent silver paste layers or the area difference between two adjacent silver paste layers forms an open groove 202. The open groove 202 is used to accommodate the horn-shaped protrusion structure 201 formed by the lower silver paste layer. The open groove 202 is a partially position-restricted area formed based on the misalignment structure or area difference, hence the name open groove. One side of it is limited by the upper silver paste layer, and the bottom is limited by the lower silver paste layer. Its main function is to accommodate the horn-shaped protrusion structure 201 formed by the lower silver paste layer. In this embodiment, the silver paste layer includes a first silver paste layer 210 and a second silver paste layer 220. The first silver paste layer 210 and the second silver paste layer 220 are staggered, and the area of ​​the first silver paste layer 210 is larger than the area of ​​the second silver paste layer 220. The staggered structure of the first silver paste layer 210 and the second silver paste layer 220 forms an open groove 202. The open groove 202 is used to accommodate the first horn protrusion 211 formed by the lower first silver paste layer 210, so that the first horn protrusion 211 does not affect the second silver paste layer 220 located above. The second horn protrusion 221 formed by the silver paste layer 220, that is, the first horn protrusion 211 and the second horn protrusion 221 will not accumulate. To a certain extent, this eliminates the problem of excessively high or wide accumulated horn protrusions caused by multiple silver paste layers. In particular, the problem of excessively high accumulated horn protrusions caused by multiple silver paste layers is particularly beneficial. Therefore, it is advantageous to achieve multiple silver paste layers to ensure the bonding strength, stability and reliability without affecting other processes of similar products. It is also beneficial to cooperate with subsequent processes to ensure the effectiveness and accuracy of bonding of anisotropic conductive films.

[0053] Based on the open slot 202 design concept of the above embodiments, further, when the design of the multilayer silver paste layer is to solve the bonding effectiveness problem, in practical applications, two or more types of silver paste with different ratios can be designed. That is, in one embodiment, the lower silver paste layer, that is, the silver paste layer closer to the thin film transistor 100, can also be called the lower silver paste layer, and the upper silver paste layer, that is, the silver paste layer further away from the thin film transistor 100, can also be called the upper silver paste layer. It has a thicker shape, and relative to the thin film transistor 100, the highest position of the horn protrusion structure 201 formed by the lower silver paste layer is lower than the highest position of the horn protrusion structure 201 formed by the upper silver paste layer. This design is beneficial in maintaining the thickness of the bonding structure and avoiding new derivative problems caused by micron-level thickness changes, thereby ensuring product yield. On the other hand, it is beneficial in reducing the number of silver paste layers, reducing processes and curing time, and improving the production efficiency of the bonding structure.

[0054] In one embodiment, such as Figure 10 As shown, the silver paste layer includes a first silver paste layer 210, a second silver paste layer 220 and a third silver paste layer 230. The misalignment structure of two adjacent silver paste layers or the area difference between two adjacent silver paste layers forms an open groove 202, which is used to accommodate the horn protrusion structure 201 formed by the lower silver paste layer.

[0055] In one embodiment, such as Figure 11 As shown, the silver paste pattern layer 200 is printed onto the thin-film transistor 100 to form silver paste patterned protrusions. In this embodiment, the silver paste patterned protrusions include a first protrusion 111 and a second protrusion 112 separated by a spacer region 113. (Comparison) Figure 1 and Figure 11 Compared to the single silver paste patterned boss formed by the silver paste pattern layer 200 in traditional bonding structural components, this application uses the silver paste pattern layer 200 to form a first boss 111 and a second boss 112 separated by a spacer area 113. With this design, the pattern of the AG boss changes from a single piece to two unconnected small pieces, and the width of the AG also changes. For example, in traditional bonding structural components... Figure 1 As shown, the width, i.e., the first length L1, of the silver paste pattern protrusions formed by the silver paste pattern layer 200 is 3.6 mm, as... Figure 11As shown, in this embodiment, the individual width of the silver paste patterned protrusion is 0.9 mm, that is, the width of the first protrusion 111 and the width of the second protrusion 112, which is also the second length L2 is 0.9 mm. The width of the spacing region 113, i.e., the third length L3, is 1.8 mm, ensuring that the overall width of the silver paste patterned protrusion in this embodiment remains 3.6 mm, i.e., the sum of the third length L3 and the two second lengths L2 remains 3.6 mm, to avoid affecting other processes and requiring unnecessary adjustments. The distance from the first protrusion 111 and the second protrusion 112 to the edge of the thin-film transistor 100, i.e., the fourth length L4, can remain constant or be adjusted. In this embodiment, the fourth length L4 is 0.9 mm or 1.0 mm. This design provides two separate silver paste patterned protrusions and also increases the number of bonding electrical connection points.

[0056] Furthermore, it should be noted that this improvement introduces new technical problems due to the presence of the spacing region 113. Since the pattern of the AG bump has been changed from a single piece to two unconnected small pieces, when bonding connectors such as FPCs, the height difference between the two small bumps is too large, approximately 2μm to 5μm, which may cause the ACF to overflow and not come out properly. When resin alloy material (RA) is applied, there is a risk of poor reliability test (not good, NG). Therefore, it is necessary to design the design to accommodate the non-overlapping characteristics of the adjacent silver paste layers to accommodate the horn-shaped protrusion structure 201 formed by the lower silver paste layer and avoid the horn-shaped protrusion height from accumulating too high over multiple layers. At the same time, the overall thickness of the thin film transistor and the silver paste pattern layer must be maintained and not exceed the limit to avoid new defects.

[0057] Taking the bonding structure as an example of its application in a traditional 20mm×30mm display module, a functional heart rate monitor (HRM) can be used to detect heart rate and physical health status, for example, to make a smartwatch.

[0058] Specifically, the AG bumps, i.e., the silver paste pattern bumps, applied during the bonding of the flexible circuit board, traditionally consist of only one layer of AG. In the embodiments of this application, this is changed to at least two layers, AG1 + AG2, i.e., a first silver paste layer 210 and a second silver paste layer 220. This results in an increased overall thickness, leading to new problems. The AG bump structure, previously negligible in traditional designs, now causes product defects. This is because the height of the AG bump after a single layer of AG printing is approximately 2μm to 3μm. Figure 1The first thickness H1 shown is approximately 2μm to 3μm. Based on this, and following printing experience, AG2 is printed on top of AG1, that is, the second silver paste layer 220 is printed on top of the first silver paste layer 210. If the design of this application is not adopted, and the size of the printed pattern is kept consistent, it will result in the AG bumps overlapping, such as... Figure 3 As shown, the overall height of the second thickness H2 is approximately 4μm to 5μm. As can be seen from the above description, the application environment of this application is microscopic, aiming to achieve, within the micrometer-level design, minimize significant modifications to the relevant processes of similar products, improve bonding strength and reliability, and control the adverse effects of technological improvements on other structures. This presents extremely significant challenges.

[0059] Understandably, for delicate devices like smartwatches, even a slight increase in thickness can alter the entire product's structure, potentially impacting the entire manufacturing process and requiring adjustments to production equipment. This leads to a significant increase in production costs and may cause unpredictable defects, thus reducing the likelihood of adopting new technologies. To overcome this problem, this application designs non-overlapping multilayer silver paste layers, specifically, the first silver paste layer 210 and the second silver paste layer 220 are non-overlapping, staggering the patterns of the AG1+AG2 layers. This ensures that the thickness meets the requirements during multilayer printing while maintaining the height of the horn-shaped protrusion structure 201 without affecting the process. Specifically, when printing multiple patterns of the same size on AG1, stacking the prints can cause excessive bumps. This application addresses this issue through structural design by slightly compensating for the screen pattern sizes of AG1 and AG2, or other layers. For example, the pattern of AG2 is larger than that of AG1, and the pattern of AG3 is larger than both AG1 and AG2, thus minimizing the staggering of the printing patterns. This design allows the bumps of each AG layer to be staggered. After multi-layer AG printing, it can not only meet the overall thickness requirements, but also control the overall AG bump within a certain height so as not to affect the subsequent anisotropic conductive film bonding process. Therefore, it can be applied to the field of electronic product manufacturing and can improve the yield of related silver paste multi-layer printing processes.

[0060] In one embodiment, a display module includes a flexible circuit board and a bonding structure as described in any embodiment; a silver paste pattern layer 200 of the bonding structure bonds the flexible circuit board. In another embodiment, a display module includes a flexible circuit board and a bonding structure, the bonding structure including a thin-film transistor 100 and a silver paste pattern layer 200, the silver paste pattern layer 200 being disposed on the thin-film transistor 100 for bonding the flexible circuit board; the silver paste pattern layer 200 includes at least two stacked silver paste layers, and adjacent silver paste layers are not overlapping, i.e., any two adjacent silver paste layers are not overlapping. Other embodiments follow the same principle and will not be described in detail. This design, through the non-overlapping arrangement of multiple silver paste layers, avoids the problem of excessively high or wide accumulated horn protrusions caused by multiple silver paste layers, making the realization of multiple silver paste layers possible. On the other hand, it helps to reduce the overall thickness of the thin-film transistor and the silver paste pattern layer, avoiding the problem of adhesive overflow defects caused by bonding anisotropic conductive films in subsequent processes. Furthermore, it helps to improve the yield when using silver paste multilayer printing processes.

[0061] In other embodiments, a display module includes a connector and a bonding structure, wherein a silver paste pattern layer 200 of the bonding structure bonds the connector. The connector includes, but is not limited to, a connector base, a rigid circuit board, and a flexible circuit board. Further, in one embodiment, the display module is applied to a wearable device. In one embodiment, this application can also be a wearable device having either the display module or the bonding structure.

[0062] In one embodiment, a bonding method such as Figure 12As shown, it includes the following steps: S100, printing a first layer of silver paste pattern layer 200 on the thin-film transistor 100; S200, printing another layer of silver paste pattern layer 200 on the first layer of silver paste, until all silver paste layers of the silver paste pattern layer 200 are printed and adjacent silver paste layers are not overlapped; S300, bonding a flexible circuit board on the silver paste pattern layer 200. It can be understood that in step S200, first, another layer of silver paste pattern layer 200 is printed on the first layer of silver paste, and then another layer of silver paste pattern layer 200 is printed on the next layer of silver paste, until all silver paste layers of the silver paste pattern layer 200 are printed. For example, for a silver paste layer including a first silver paste layer 210 and a second silver paste layer 220, it is only necessary to print the second silver paste layer 220 on the first silver paste layer 210; while for a silver paste layer including a first silver paste layer 210, a second silver paste layer 220, and a third silver paste layer 230, in step S100, the first silver paste layer 210 is printed on the thin-film transistor 100, and then in step S200, the second silver paste layer 220 is first printed on the first silver paste layer 210, and then the third silver paste layer 230 is printed on the second silver paste layer 220, with each adjacent silver paste layer being non-overlapping; then step S300 is performed, that is, the flexible circuit board is bonded on the silver paste pattern layer 200. Other embodiments follow the same principle and will not be described in detail. In one embodiment, the bonding method is used to prepare or implement the bonding structure of any embodiment, that is, the bonding method has relevant steps for preparing or implementing the bonding structure of any embodiment. Such a design is beneficial for preparing the bonding structures of the above embodiments.

[0063] It should be noted that other embodiments of this application also include bonded structural components, display modules, and bonding methods formed by combining the technical features of the above embodiments.

[0064] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0065] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A bonding structural component, characterized in that, include: Thin-film transistor (100); and A silver paste pattern layer (200) is disposed on the thin film transistor (100) for bonding a connector; the silver paste pattern layer (200) includes at least two stacked silver paste layers, and each adjacent silver paste layer is not overlapped; The silver paste pattern layer (200) is printed on the thin film transistor (100) to form a silver paste pattern protrusion. The silver paste pattern protrusion includes a first protrusion (111) and a second protrusion (112) separated by a spacer region (113).

2. The bonding structure according to claim 1, characterized in that, The two adjacent silver paste layers form a misaligned structure.

3. The bonding structure according to claim 1, characterized in that, The area of ​​the silver paste layer that is further away from the thin-film transistor (100) is smaller than the area of ​​the silver paste layer that is further away from the thin-film transistor (100).

4. The bonding structure according to claim 3, characterized in that, The shapes of the silver paste layers are similar.

5. The bonding structure according to claim 2, characterized in that, The two adjacent silver paste layers form a regular misaligned structure.

6. The bonding structure according to claim 2, characterized in that, The misaligned structure of two adjacent silver paste layers forms an open groove (202), which is used to accommodate the horn-shaped protrusion (201) formed by the lower silver paste layer.

7. The bonding structure according to claim 2, characterized in that, The area difference between two adjacent silver paste layers forms an open groove (202), which is used to accommodate the horn-shaped protrusion structure (201) formed by the lower silver paste layer.

8. The bonding structure according to claim 2, characterized in that, The silver paste layer includes a first silver paste layer (210) and a second silver paste layer (220), which are staggered.

9. The bonding structure according to claim 3, characterized in that, The silver paste layer includes a first silver paste layer (210) and a second silver paste layer (220), wherein the area of ​​the first silver paste layer (210) is larger than the area of ​​the second silver paste layer (220).

10. The bonding structure according to any one of claims 1 to 9, characterized in that, It also includes the connector.

11. The bonding structure according to claim 10, characterized in that, The connector includes a connector base, a rigid circuit board, and a flexible circuit board.

12. A display module, characterized in that, Includes flexible circuit boards and bonding structures as described in any one of claims 1 to 11; The silver paste pattern layer (200) of the bonding structure bonds the flexible circuit board.

13. A bonding method, characterized in that, For preparing or realizing the bonding structural member as described in any one of claims 1 to 11, the bonding method includes the steps of: A first silver paste layer of a silver paste pattern layer (200) is printed on the thin-film transistor (100); Print another layer of silver paste pattern layer (200) on the first layer of silver paste until all the silver paste patterns (200) are printed and the adjacent silver paste layers are not overlapped. A flexible circuit board is bonded on the silver paste pattern layer (200).

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