Metallization method for hole in multilayer board

Abstract

The present application provides a method for metallizing a hole in a multilayer board. The above-mentioned method for metallizing a hole in a multilayer board includes: drilling a multilayer board to form a via hole, wherein the thickness-to-diameter ratio of the via hole is greater than 12:1; cleaning the multilayer board; roughening the via hole; tilting a plurality of multilayer boards in an inclined fixing device; metallizing a plurality of multilayer boards, wherein each multilayer board is tilted and fixed in the inclined fixing device; wherein the inclined fixing device includes a hook, a fixing frame, and two toothed limiting plates, wherein each toothed limiting plate is formed with a plurality of spaced limiting tooth grooves on one side adjacent to another toothed limiting plate, wherein the plurality of limiting tooth grooves of each toothed limiting plate are arranged one-to-one with the plurality of limiting tooth grooves of another toothed limiting plate, and each limiting tooth groove of each toothed limiting plate is staggered with the corresponding limiting tooth groove in the vertical direction, so that the corresponding multilayer board is tilted and clamped in the two toothed limiting plates.

Description

Technical Field

[0001] The invention relates to the field of circuit board production, in particular to a multilayer board hole metallization method. Background Art

[0002] In the production process of circuit boards, in order to achieve internal and external interconnection of the circuit boards, it is necessary to drill a number of via holes on the circuit boards, and metallize these via holes to achieve the conduction function. In traditional technology, the circuit boards with drilled via holes are pre-treated, that is, the circuit boards are cleaned and the via holes are roughened, and then the circuit boards are placed in a liquid medicine tank, and the metal ions in the liquid medicine tank form a metal coating in the via holes through chemical reactions.

[0003] However, for vias with an aspect ratio greater than 12:1, that is, a ratio of the length to the diameter of the via greater than 12:1, bubbles are generated in the via due to chemical reactions, and the bubbles cannot be completely discharged due to the influence of the horizontal resistance of the chemical solution, that is, some bubbles are still attached to the hole wall, so that there is a risk that the bubbles hinder the contact between the chemical solution and part of the hole wall, resulting in the risk of uneven plating and missed plating. Summary of the invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a method for metallizing in holes of a multilayer board which can suppress uneven plating and missed plating.

[0005] The objective of the present invention is achieved through the following technical solutions:

[0006] A multi-layer board hole metallization method, comprising:

[0007] Performing a drilling operation on the multilayer board to form a via hole, wherein the thickness-to-diameter ratio of the via hole is greater than 12:1;

[0008] Performing a cleaning operation on the multilayer board;

[0009] Performing a roughening process on the via hole;

[0010] The plurality of multilayer boards are tiltedly arranged on a tilting fixing device;

[0011] Performing metallization treatment on a plurality of the multilayer boards, wherein each of the multilayer boards is tiltedly fixed in a tilting fixing device;

[0012] Wherein, the tilt fixing device comprises:

[0013] A hook, the hook being used to connect to an external hanging rod;

[0014] A fixing frame, the hook being fixedly connected to the fixing frame;

[0015] The toothed limit plates include two toothed limit plates, two of which are fixed at intervals in the fixed frame, and the two toothed limit plates are arranged opposite to and in parallel up and down, and each toothed limit plate is formed with a plurality of spaced limit tooth grooves on a side adjacent to the other toothed limit plate, and the plurality of limit tooth grooves of each toothed limit plate correspond to the plurality of limit tooth grooves of the other toothed limit plate one by one, and each limit tooth groove of each toothed limit plate is staggered with the corresponding limit tooth groove in the vertical direction, and each limit tooth groove of each toothed limit plate and the corresponding limit tooth groove are used together to limit the corresponding multi-layer board, so that the corresponding multi-layer board is tilted and clamped in the two toothed limit plates.

[0016] In one embodiment, the plurality of limiting tooth grooves on each of the toothed limiting plates are arranged at intervals along the horizontal direction.

[0017] In one embodiment, each of the limiting tooth grooves is a rectangular through groove.

[0018] In one of the embodiments, each of the limiting tooth grooves is adapted to the corresponding multilayer board.

[0019] In one embodiment, each of the toothed limiting plates is provided with a forming surface on a side adjacent to another of the toothed limiting plates, the forming surface is parallel to a horizontal plane, and each of the limiting tooth grooves is formed on the forming surface.

[0020] In one of the embodiments, the fixing frame forms a communicating material transfer channel and a receiving cavity, and the two toothed limit plates are located in the receiving cavity and fixedly connected to the fixing frame.

[0021] In one embodiment, in the step of roughening the via hole, the via hole is roughened by using corundum and / or aluminum oxide powder.

[0022] In one embodiment, in the step of roughening the via hole, the diamond sand and / or the aluminum oxide powder impacts the hole wall of the via hole to roughen the hole wall of the via hole.

[0023] In one embodiment, the step of tilting the plurality of multilayer boards to the tilted fixing device comprises:

[0024] Placing the plurality of multilayer boards on the two toothed limiting plates in sequence;

[0025] The inclined fixing device is immersed in a medicine pool device, so that the plurality of multilayer boards are metallized in the medicine pool device.

[0026] In one embodiment, the drug pool device comprises:

[0027] A tank body, wherein the tank body is formed with a liquid medicine tank, the liquid medicine tank is used to contain liquid medicine, and the inclined fixing device is immersed in the liquid medicine tank;

[0028] A hanging rod, the hanging rod is located in the medicine liquid tank and connected to the tank body;

[0029] A vibration motor, wherein the vibration motor is mounted on the pool body, and an output end of the vibration motor is fixedly connected to the hanging rod; and

[0030] A vertical driving member, wherein the power output end of the vertical driving member is connected to the pool body, so that the vertical driving member is used to drive the pool body to reciprocate up and down.

[0031] A horizontal driving member, wherein a power output end of the horizontal driving member is connected to the hanging rod, so that the horizontal driving member is used to drive the hanging rod to reciprocate left and right.

[0032] Compared with the prior art, the present invention has at least the following advantages:

[0033] Since the two toothed limit plates are arranged on the fixed frame in parallel and opposite to each other up and down, the two toothed limit plates are provided with a plurality of spaced limit tooth grooves, the plurality of limit tooth grooves of each toothed limit plate are arranged one by one with the plurality of limit tooth grooves of the other toothed limit plate, and the limit tooth grooves on each toothed limit plate are staggered with the limit tooth grooves on the other toothed limit plate in the vertical direction, the limit tooth grooves of each toothed limit plate and the corresponding limit tooth grooves of the other toothed limit plate act together on the multilayer board, so that the multilayer board is tilted and fixed on the tilted fixing device; when the tilted multilayer board is placed in the liquid medicine tank for metallization treatment, a chemical reaction occurs at the conductive hole on the multilayer board to form At the same time, bubbles are generated. At this time, there is a certain angle between the via hole and the horizontal direction, that is, there is a certain slope in the discharge path of the bubbles. Since the inclined fixing device reciprocates horizontally and vertically in the liquid medicine tank, the liquid medicine flows in the liquid medicine tank so that the liquid medicine has an impact force on the bubbles in the via hole in the horizontal direction. During the horizontal reciprocating motion, the hole wall exerts a horizontal force on the bubbles, and during the vertical reciprocating motion, the hole wall also exerts a vertical force on the bubbles. Under the joint action of all the forces, the bubbles are discharged from the via hole along the slope, so that the liquid medicine can contact the entire wall of the via hole, thereby suppressing the risk of uneven plating and leaking plating. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0035] Figure 1 A schematic diagram of a process of metallization in a multilayer board hole according to an embodiment;

[0036] Figure 2 is a schematic structural diagram of a tilt fixing device according to an embodiment;

[0037] Figure 3 for Figure 2 An enlarged schematic diagram of the tilt fixing device shown at position A;

[0038] Figure 4 It is a structural schematic diagram of a tilt fixing device according to another embodiment;

[0039] Figure 5 for Figure 4 An enlarged schematic diagram of the tilt fixing device shown at position B;

[0040] Figure 6 for Figure 4 A partial cross-sectional view of the tilt fixture shown;

[0041] Figure 7 for Figure 6 An enlarged schematic diagram of the tilt fixing device at position C is shown. DETAILED DESCRIPTION

[0042] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

[0043] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0045] The present application provides a method for metallization in holes of a multilayer board, comprising: drilling a multilayer board to form a via hole, wherein the thickness-to-diameter ratio of the via hole is greater than 12:1; cleaning the multilayer board; roughening the via hole; tilting a plurality of multilayer boards in an inclined fixing device; and metallizing the plurality of multilayer boards, wherein each multilayer board is tilted and fixed in the inclined fixing device. Furthermore, the tilting and fixing device includes a hook, a fixing frame and a toothed limit plate, the hook is used to connect the external support frame; the hook is fixedly connected to the fixing frame; there are two toothed limit plates, the two toothed limit plates are fixed in the fixing frame at intervals, and the two toothed limit plates are arranged opposite to and parallel to each other up and down, and each toothed limit plate is adjacent to the side of the other toothed limit plate to form a plurality of spaced limit tooth grooves, the plurality of limit tooth grooves of each toothed limit plate are arranged one by one with the plurality of limit tooth grooves of the other toothed limit plate, and the plurality of limit tooth grooves of each toothed limit plate are staggered in the vertical direction with the corresponding limit tooth grooves, and the plurality of limit tooth grooves of each toothed limit plate and the corresponding limit tooth grooves are used together to limit the corresponding multi-layer board, so that the corresponding multi-layer board is tilted and clamped in the two toothed limit plates.

[0046] In the above-mentioned in-hole metallization method of the multilayer board, the multilayer board after the hole is drilled is cleaned to remove the debris on the board surface of the multilayer board and in the via hole. Due to the roughening treatment of the via hole, the hole wall of the via hole is rougher, so that the metal plating can better adhere to the hole wall of the via hole; due to the action of the inclined fixing device, the multilayer board is tilted and fixed on the inclined fixing device. When the multilayer board enters the liquid medicine tank, the via hole on the multilayer board has a certain angle with the horizontal direction; and because the inclined fixing device reciprocates horizontally and vertically in the liquid medicine tank, the liquid medicine flows in the liquid medicine tank so that the liquid medicine has an impact force on the bubbles in the via hole in the horizontal direction. During the horizontal reciprocating motion, the hole wall exerts a force on the bubbles in the horizontal direction, and during the vertical reciprocating motion, the hole wall also exerts a force on the bubbles in the vertical direction. Under the joint action of the forces used, the bubbles are discharged from the via hole along the slope, so that the liquid medicine can contact the entire hole wall of the via hole, that is, the risk of uneven plating and leakage plating is suppressed.

[0047] In order to better understand the technical solutions and beneficial effects of the present application, the present application is further described in detail below in conjunction with specific embodiments:

[0048] like Figure 1 As shown, a multi-layer board hole metallization method according to an embodiment includes:

[0049] S100: drilling the multilayer board to form a via hole, wherein the thickness-to-diameter ratio of the via hole is greater than 12:1.

[0050] In this embodiment, a drilling operation is performed on the multilayer board by a drill so that the drill penetrates the multilayer board, thereby forming a via hole in the multilayer board, and the ratio of the depth to the diameter of the via hole is greater than 12:1, that is, the thickness-diameter ratio of the via hole is greater than 12:1.

[0051] S300: performing a cleaning operation on the multilayer board.

[0052] In this embodiment, drilling will generate debris, which will adhere to the via holes and the surface of the multilayer board. Therefore, the multilayer board needs to be cleaned to remove the debris in the via holes and the debris on the surface of the multilayer board so as to perform metallization on the via holes.

[0053] S500: performing a roughening process on the via hole.

[0054] In this embodiment, physical methods are generally used to roughen the via hole walls, that is, a material with higher hardness is used to impact the via hole walls, thereby making the via hole walls rougher so that the metal coating generated by the reaction in the drug solution tank can better adhere to the hole walls.

[0055] S700: The plurality of multilayer boards are tiltedly arranged on a tilting fixing device.

[0056] In this embodiment, since the two toothed limit plates are arranged on the fixed frame opposite to each other and in parallel up and down, the two toothed limit plates are provided with a plurality of spaced limit tooth grooves, and the plurality of limit tooth grooves of each toothed limit plate are arranged one by one corresponding to the plurality of limit tooth grooves of the other toothed limit plate, and the plurality of limit tooth grooves on each toothed limit plate are staggered in the vertical direction with the plurality of limit tooth grooves on the other toothed limit plate, and the plurality of limit tooth grooves of each toothed limit plate and the corresponding plurality of limit tooth grooves of the other toothed limit plate act together on the multi-layer boards, so that the plurality of multi-layer boards are tilted and fixed on the tilt fixing device.

[0057] S900: performing metallization treatment on the plurality of multilayer boards, wherein each of the multilayer boards is tilted and fixed in a tilting fixing device.

[0058] In this embodiment, an inclined fixing device on which a plurality of multilayer boards are inclinedly fixed is hung on a liquid medicine tank for metallization treatment. At this time, a chemical reaction occurs at the via holes on the multilayer boards to form a metal layer, and bubbles are also generated. At this time, there is a certain angle between the via holes and the horizontal direction, that is, there is a certain slope in the discharge path of the bubbles. Since the inclined fixing device reciprocates horizontally and vertically in the liquid medicine tank, the liquid medicine flows in the liquid medicine tank so that the liquid medicine exerts an impact force on the bubbles in the via holes in the horizontal direction. During the horizontal reciprocating motion, the hole wall exerts a force on the bubbles in the horizontal direction, and during the vertical reciprocating motion, the hole wall also exerts a force on the bubbles in the vertical direction. Under the joint action of all forces, the bubbles are discharged from the via holes along the slope.

[0059] The above-mentioned in-hole metallization method of the multilayer board is to clean the multilayer board after the holes are drilled to remove the debris on the board surface of the multilayer board and in the via hole. Since the via hole is roughened, the hole wall of the via hole is rougher, so that the metal plating can better adhere to the hole wall of the via hole; due to the action of the inclined fixing device, the multilayer board is tilted and fixed on the inclined fixing device. When the multilayer board enters the liquid medicine tank, the via hole on the multilayer board has a certain angle with the horizontal direction; and because the inclined fixing device reciprocates horizontally and vertically in the liquid medicine tank, the liquid medicine flows in the liquid medicine tank so that the liquid medicine has an impact force on the bubbles in the via hole in the horizontal direction. During the horizontal reciprocating motion, the hole wall exerts a force on the bubbles in the horizontal direction, and during the vertical reciprocating motion, the hole wall also exerts a force on the bubbles in the vertical direction. Under the joint action of the forces used, the bubbles are discharged from the via hole along the slope, so that the liquid medicine can contact the entire hole wall of the via hole, thereby suppressing the risk of uneven plating and leakage plating.

[0060] In one embodiment, the method for metallizing a hole in a multilayer board is characterized in that, in the step of roughening the via hole, the via hole is roughened by corundum and / or aluminum oxide powder. In this embodiment, corundum and aluminum oxide powder have high hardness, and the hole wall is impacted by fine steel sand and aluminum oxide powder, so that the hole wall of the via hole of the multilayer board is relatively rough.

[0061] In one embodiment, in the step of roughening the via hole, the corundum and / or the aluminum oxide powder impact the hole wall of the via hole to roughen the hole wall of the via hole. In this embodiment, the hole wall of the via hole is made rougher by the physical method of corundum and aluminum oxide powder impacting the hole wall.

[0062] In one of the embodiments, the step of tilting the plurality of multilayer boards to the tilted tilted fixing device includes: firstly, clamping the plurality of multilayer boards on the two toothed limit plates in sequence; and secondly, immersing the tilted fixing device in a medicine pool device so that the plurality of multilayer boards are metallized in the medicine pool device.

[0063] In this embodiment, when the inclined multilayer board is placed in the medicine liquid tank for metallization treatment, a chemical reaction occurs at the via holes on the multilayer board to form a metal layer, and bubbles are also generated. At this time, there is a certain angle between the via holes and the horizontal direction, that is, there is a certain slope in the discharge path of the bubbles. Since the inclined fixing device reciprocates horizontally and vertically in the medicine liquid tank, the medicine liquid flows in the medicine liquid tank so that the medicine liquid has an impact force on the bubbles in the via holes in the horizontal direction. During the vertical reciprocating motion, the hole wall also generates a vertical force on the bubbles. Under the joint action of all forces, the bubbles are discharged from the via holes along the slope, so that the medicine liquid can contact the entire hole wall of the via hole.

[0064] like Figure 2 and Figure 3 As shown, an inclined fixing device 10 of an embodiment includes a hook 100, a fixing frame 200 and a toothed limiting plate 300. The hook 100 is used to connect an external hanging rod and is fixedly connected to the fixing frame 200. There are two toothed limit plates 300, which are fixed at intervals in the fixed frame 200, and the two toothed limit plates 300 are arranged opposite to each other and in parallel up and down, and a plurality of spaced limit tooth grooves 301 are formed on one side of each toothed limit plate 300 adjacent to the other toothed limit plate 300, and the plurality of limit tooth grooves 301 of each toothed limit plate 300 are arranged in a one-to-one correspondence with the plurality of limit tooth grooves 301 of the other toothed limit plate 300, and the plurality of limit tooth grooves 301 of each toothed limit plate 300 are staggered in the vertical direction with the corresponding limit tooth grooves 301, and the plurality of limit tooth grooves 301 of each toothed limit plate 300 and the corresponding limit tooth grooves 301 are used together to limit the corresponding multilayer board 20, so that the corresponding multilayer board 20 is tilted and clamped in the two toothed limit plates 300.

[0065] like Figure 2 As shown, in this embodiment, the hook 100 is fixedly connected to the fixing frame 200, two toothed limit plates 300 are connected to the fixing frame 200, and the hook 100 is connected to an external hanging rod, that is, the hanging rod on the medicine pool device, so that the tilting fixing device 10 is immersed in the medicine liquid tank.

[0066] Furthermore, two toothed limit plates 300 are arranged in parallel up and down on the fixed frame 200, and a plurality of limit tooth grooves 301 are opened on the side of each toothed limit plate 300 opposite to the other toothed limit plate 300, and the plurality of limit tooth grooves 301 on each toothed limit plate 300 are staggered in the vertical direction with the plurality of limit tooth grooves 301 on the other toothed limit plate 301, so that when the multilayer board 20 is installed on the two opposite limit tooth grooves 301, the multilayer board 20 has a certain angle in the horizontal direction and the vertical direction, that is, the multilayer board 20 is tilted and fixed on the tilt fixing device 10. The above-mentioned inclined fixing device 10, since the two toothed limit plates 300 are arranged on the fixing frame 200 opposite to each other and parallel to each other, the two toothed limit plates 300 are each provided with a plurality of spaced limit tooth grooves 301, and the plurality of limit tooth grooves 301 on each toothed limit plate 300 are staggered in the vertical direction with the plurality of limit tooth grooves 301 on the other toothed limit plate 300, so that the multilayer board 20 is tilted and fixed on the inclined fixing device 10; when the tilted multilayer board 20 is placed in the liquid medicine tank for metallization treatment, a chemical reaction occurs at the conductive hole on the multilayer board 20 to form a metal layer, and bubbles are also generated at the same time. At this time, there is a certain angle between the conductive hole and the horizontal direction, that is, there is a certain slope in the discharge path of the bubbles. At this time, the bubbles on the hole wall are subjected to the force of the liquid medicine in the horizontal direction, and the force will have a component along the slope, so that the bubbles are discharged from the conductive hole along the slope under the action of this component force, so that the liquid medicine can contact the entire hole wall of the conductive hole, that is, the risk of uneven plating and leakage plating is suppressed.

[0067] like Figure 2 and Figure 3 As shown, in one embodiment, a plurality of limiting tooth grooves 301 on each toothed limiting plate 300 are arranged at intervals in the horizontal direction. It can be understood that the two toothed limiting plates 300 are arranged in parallel in the horizontal direction in the fixing frame 200, so that the limiting tooth grooves 301 on the two toothed limiting plates 300 are arranged at intervals in the horizontal direction, and the two corresponding limiting tooth grooves 301 on the upper and lower toothed limiting plates 300 form a group of limiting tooth grooves 301, and a group of limiting tooth grooves 301 is used to tilt and fix a multilayer board 20, and the upper and lower toothed limiting plates 300 have a plurality of limiting tooth grooves 301 arranged at intervals, that is, they can form a plurality of groups of limiting tooth grooves 301, so that a plurality of multilayer boards 20 can be tilted and fixed.

[0068] like Figure 3 As shown, in one embodiment, each limiting tooth groove 301 is a rectangular through groove.

[0069] like Figure 3As shown. In one embodiment, each limiting tooth groove 301 is adapted to the corresponding multilayer board 20. It can be understood that the edge shape of the multilayer board 20 can be other shapes besides rectangular and the thickness is also different, such as arc shape or other irregular shapes. Different limiting tooth grooves 301 are adapted for multilayer boards 20 of different shapes and thicknesses, so that the tilt fixing device 10 is more adaptable to be used on multilayer boards 20 of different shapes and thicknesses.

[0070] like Figure 2 and Figure 3 As shown, in one embodiment, each toothed limiting plate 300 is provided with a forming surface 310 on one side adjacent to another toothed limiting plate 300 , the forming surface 310 is parallel to the horizontal plane, and each limiting tooth groove 301 is formed on the forming surface 310 . It can be understood that a forming surface 310 is formed on the opposite side of the two toothed limit plates 300, and a plurality of limiting tooth grooves 301 are opened on the forming surface 310. The plurality of limiting tooth grooves 301 on each toothed limit plate 300 are parallel to the horizontal plane, and the plurality of limiting tooth grooves 301 on each toothed limit plate 300 are staggered in the vertical direction with the plurality of limiting tooth grooves 301 on another toothed limit plate 300. The multilayer board 20 is fixed by the joint action of the limiting tooth grooves 301 on the toothed limit plate 300 and the limiting tooth grooves 301 of another toothed limit plate 300, so that the multilayer board 20 is tilted and clamped on the two toothed limit plates 300, that is, the multilayer board 20 has a certain angle with the horizontal direction.

[0071] like Figure 2 As shown, in one embodiment, the fixing frame 200 forms a connected material passage 210 and a receiving chamber 220, and two toothed limit plates 300 are located in the receiving chamber 220 and fixedly connected to the fixing frame 200. It can be understood that the fixing frame 200 is provided with a material passage 210, and the material passage 210 is used for the flow of the liquid medicine in the liquid medicine tank.

[0072] The present application also provides a medicine pool device, including a pool body, a hanging rod, a vibration motor and a vertical driving member. The pool body is formed with a medicine liquid tank, the medicine liquid tank is used to contain the medicine liquid, and the inclined fixing device is immersed in the medicine liquid tank; the hanging rod is located in the medicine liquid tank and connected to the pool body; the vibration motor is installed on the pool body, and the output end of the vibration motor is connected to the pool body; the power output end of the vertical driving member is connected to the hanging rod, so that the vertical driving member is used to drive the hanging rod to reciprocate up and down.

[0073] It can be understood that after the multilayer board is tilted and fixed on the tilted fixing device, the device is installed on the hanging rod through a hook so that the tilted fixing device is immersed in a liquid medicine tank. The liquid medicine tank contains metal ions so that the conductive holes of the multilayer board form a metal coating in the liquid medicine tank.

[0074] Furthermore, when the tilting fixing device is immersed in the medicine liquid tank, the vibration motor and the vertical driving member are started. Since the vibration motor is installed on the tank body, and the output end of the vibration motor is connected to the tank body, after the vibration motor is started, the output end of the vibration motor acts on the tank body, and the vibration of the vibration motor increases the flow speed of the medicine liquid in the medicine liquid tank. When the flow speed of the medicine liquid increases in the horizontal direction, the force of the medicine liquid hitting the tank wall of the tank body also increases, thereby increasing the reaction force of the tank body on the medicine liquid, that is, the impact force of the medicine liquid on the multilayer board in the middle of the tank body also increases, that is, the impact force of the medicine liquid on the bubbles in the conductive hole in the horizontal direction increases, so that the bubbles are better discharged along the slope under the impact force of the medicine liquid in the horizontal direction.

[0075] Furthermore, the horizontal driving member drives the hanging rod to reciprocate left and right. Since the hook of the inclined fixing device is connected to the hanging rod, the hanging rod drives the inclined fixing device to reciprocate left and right. When the inclined fixing device moves to the left, the bubbles in the conductive hole are subjected to a leftward force from the hole wall in the horizontal direction, and the force has a component in the direction of the slope. At the same time, the bubbles are subjected to the impact force of the liquid medicine in the horizontal direction. Under the joint action of all the forces, the bubbles are discharged along the slope; when the inclined fixing device moves to the right, the bubbles in the conductive hole are subjected to a rightward force from the hole wall in the horizontal direction, and the force has a component in the direction of the slope. At the same time, the bubbles are subjected to the impact force of the liquid medicine in the horizontal direction. Under the joint action of all the forces, the bubbles are discharged along the slope.

[0076] Furthermore, the vertical driving member drives the hanging rod to reciprocate up and down. Since the hook of the inclined fixing device is connected to the hanging rod, the hanging rod drives the inclined fixing device to reciprocate up and down. When the inclined fixing device moves upward, the bubbles in the conductive hole are subjected to an upward force from the hole wall in the vertical direction, and the force has a component in the direction of the slope. At the same time, the bubbles are subjected to the impact force of the liquid medicine in the horizontal direction. Under the joint action of all the forces, the bubbles are discharged along the slope; when the inclined fixing device moves downward, the bubbles in the conductive hole are subjected to a downward force from the hole wall in the vertical direction, and the force has a component in the direction of the slope. At the same time, the bubbles are subjected to the impact force of the liquid medicine in the horizontal direction. Under the joint action of all the forces, the bubbles are better discharged along the slope.

[0077] Furthermore, by driving the vibration motor to increase the flow speed of the liquid medicine in the liquid medicine tank and the joint action of the vertical drive member and the horizontal drive member, the bubbles in the via hole can be better discharged along the slope, so that the liquid medicine can completely contact the hole wall of the via hole, thereby suppressing the risk of uneven plating and missed plating.

[0078] It is understandable that Figure 2As shown, when the extension direction of each limiting tooth groove 301 is consistent with the direction of gravity, after each multilayer board 20 is placed in the corresponding limiting tooth groove 301, each multilayer board 20 cannot fit with the groove wall of the corresponding limiting tooth groove 301. Specifically, each multilayer board 20 is in line contact with the groove wall of the corresponding limiting tooth groove 301, so that the multilayer board 20 is locally subjected to greater force, resulting in the multilayer board 20 being more easily damaged during metallization treatment.

[0079] In order to increase the contact area between each multilayer board 20 and the toothed limiting plate 300, as shown in FIG. Figure 4 and Figure 5 As shown, in one of the embodiments, the extension direction of each limiting tooth groove 301 is the same as the inclination angle of the corresponding multilayer board 20, so that the groove wall of each limiting tooth groove 301 fits with the corresponding multilayer board 20, so that each multilayer board 20 is in surface contact with the toothed limiting plate 300, so that the force-bearing area of ​​the multilayer board 20 is larger, thereby suppressing the problem of damage to the multilayer board 20 during metallization treatment.

[0080] It is understandable that in order to improve the efficiency of metallization treatment, the tilting fixing device 10 needs to place more multilayer boards 20, so each toothed limiting plate 300 needs to have more limiting tooth grooves 301, resulting in denser limiting tooth grooves 301 on each toothed limiting plate 300, making the space in the tilting fixing device 10 more compact, and thus making the installation convenience of the multilayer boards 20 less convenient. Figure 5 As shown, in one embodiment, each limiting tooth groove 301 is formed with a guiding inclined surface 302 at the opening to increase the opening tooth groove of each limiting tooth groove 301, thereby reducing the difficulty of aligning each multilayer board 20 with the corresponding limiting tooth groove 301, thereby improving the convenience of each multilayer board 20 being clamped in the corresponding limiting tooth groove 301. In addition, the guiding inclined surface 302 is an inclined surface, and the guiding inclined surface 302 can guide the corresponding multilayer board 20 into the corresponding limiting tooth groove 301, that is, the guiding inclined surface 302 plays a guiding role for the multilayer board 20, thereby improving the efficiency of the multilayer board 20 being clamped in the corresponding limiting tooth groove 301.

[0081] It can be understood that when the metallization treatment is performed, the tilting fixing device 10 will shake under the drive of the vibration motor, the vertical driving member and the horizontal driving member. Figure 5 As shown, in one embodiment, each multilayer board 20 and each toothed limit plate 300 are interference fit to avoid relative movement between each multilayer board 20 and each toothed limit plate 300 when shaking, thereby avoiding wear of each multilayer board 20 by each toothed limit plate 300 when shaking, that is, avoiding wear of each multilayer board 20 by each toothed limit plate 300 during metallization treatment.

[0082] However, since each multilayer board 20 and each toothed limiting plate 300 are in interference fit, each multilayer board 20 will rub against the corresponding toothed limiting plate 300 when being clamped in the corresponding toothed limiting groove, thereby causing the toothed limiting plate 300 to wear against the corresponding multilayer board 20 when each multilayer board 20 is clamped in the corresponding limiting tooth groove 301. Similarly, since each multilayer board 20 and each toothed limiting plate 300 are in interference fit, each multilayer board 20 will rub against the corresponding toothed limiting plate 300 when being removed from the corresponding toothed limiting groove, thereby causing the toothed limiting plate 300 to wear against the corresponding multilayer board 20 when each multilayer board 20 is removed from the corresponding toothed limiting groove.

[0083] In order to solve the problem that the toothed stopper plate 300 wears the multilayer plate 20, as Figure 5 As shown, in one embodiment, each toothed limiting plate 300 includes a fixed plate 300a and a plurality of soft limiting members 300b, two fixed plates 300a are fixed in the fixed frame 200 at intervals, and the two fixed plates 300a are arranged in parallel with each other up and down, and a plurality of installation grooves 303 arranged at intervals are formed on one side of each fixed plate 300a adjacent to another fixed plate 300a, and the plurality of installation grooves 303 of each fixed plate 300a are arranged one-to-one with the plurality of installation grooves 303 of another fixed plate 300a, and each installation groove 303 of each fixed plate 300a is staggered with the corresponding installation groove 303 in the vertical direction. The plurality of soft limiting members 300b of each toothed limiting plate 300 are embedded in the plurality of installation grooves 303 of the corresponding fixed plate 300a one-to-one. Each soft limiting member 300b is formed with a limiting tooth groove 301.

[0084] like Figure 5As shown, in this embodiment, the limiting tooth grooves 301 of the multiple soft limiting parts 300b of each tooth-shaped limiting plate 300 are arranged one by one with the limiting tooth grooves 301 of the multiple soft limiting parts 300b of another tooth-shaped limiting plate 300, and the corresponding limiting tooth grooves 301 of the limiting tooth grooves 301 of each soft limiting part 300b of each tooth-shaped limiting plate 300 are staggered in the vertical direction. When each multilayer board 20 is clamped in the corresponding two limiting tooth grooves 301, each multilayer board 20 contacts the corresponding two soft limiting parts 300b. Since each soft limiting part 300b is a soft structure, the multilayer board 20 and the tooth-shaped limiting plate 300 are in soft contact, which suppresses the wear of the tooth-shaped limiting plate 300 on the multilayer board 20. Moreover, since each soft stopper 300b is a soft structure, when the multilayer board 20 shakes, the soft stopper 300b can suppress the relative displacement between the multilayer board 20 and the toothed stopper through elastic deformation, thereby making the soft stopper 300b suppress the problem of the multilayer board 20 being separated from the toothed stopper 300, improving the position stability of the multilayer board 20 connected to the toothed stopper 300, so as to ensure the stability of the metallization treatment, and at the same time avoid the problem of the multilayer board 20 being damaged by impact. Further, the material of the soft stopper 300b is silica gel, so that the soft stopper 300b has not only soft characteristics, but also anti-corrosion characteristics, thereby avoiding the corrosion of the soft stopper 300b by the liquid medicine. Of course, the soft stopper 300b can also be made of rubber material or other existing materials with soft and anti-corrosion characteristics.

[0085] It is understandable that when the metallization treatment is performed, the tilt fixing device 10 will shake under the drive of the vibration motor, the vertical drive member and the horizontal drive member. As the tilt fixing device 10 is used more and more times, it will be easier to cause the soft stoppers 300b to loosen, and then it will be easier to cause the soft stoppers 300b to separate from the corresponding fixing plate 300a. Figure 6 and Figure 7 As shown, in one of the embodiments, a plurality of snap-in protrusions 304 are convexly provided on the surface of each soft limit member 300b, and a plurality of snap-in grooves 305 are formed in each limit tooth groove 301 of each fixed plate 300a. The plurality of snap-in protrusions 304 of each soft limit member 300b are snap-fitted into the corresponding plurality of snap-in grooves 305, so that each soft limit member 300b is more firmly embedded in the corresponding limit tooth groove 301, thereby preventing the problem of each soft limit member 300b being separated from the corresponding fixed plate 300a.

[0086] like Figure 7As shown, further, each soft stopper 300b has a plurality of clamping protrusions 304 protruding on opposite sides, and each fixing plate 300a has a plurality of clamping grooves 305 formed on opposite side walls of each stopper tooth groove 301, so that each soft stopper 300b is embedded in the corresponding stopper tooth groove 301 with higher stability. Further, each clamping protrusion 304 is in an arc shape, and each clamping groove 305 is in an arc shape, so that each clamping protrusion 304 is easier to clamp in the corresponding clamping groove 305.

[0087] Furthermore, since each limiting tooth groove 301 is adapted to the multilayer board 20, that is, each limiting tooth groove 301 is adapted to a multilayer board 20 of a certain thickness, when it is necessary to perform metallization treatment on multilayer boards 20 of various thicknesses during the production process, the limiting tooth groove 301 of the corresponding thickness is also required to fix the multilayer board 20. In order to solve the problem of needing to adapt to multilayer boards 20 of various thicknesses, in one embodiment, the toothed limiting plate 300 and the fixing frame are detachable structures, that is, the toothed limiting plate 300 and the fixing frame are detachably connected. When metallization treatment is performed on multilayer boards 20 of various thicknesses, the toothed limiting plate 300 with the limiting tooth groove 301 of the corresponding thickness is selected and installed on the fixing frame, so that multilayer boards 20 of various thicknesses can be tilted and fixed on the tilting fixing device, so that the tilting fixing device is more adaptable to multilayer boards 20 of different thicknesses.

[0088] Compared with the prior art, the present invention has at least the following advantages:

[0089] Since the two toothed limit plates are arranged on the fixed frame opposite to each other and in parallel up and down, the two toothed limit plates are provided with a plurality of spaced limit tooth grooves 301, and the plurality of limit tooth grooves 301 of each toothed limit plate are arranged one by one with the plurality of limit tooth grooves 301 of the other toothed limit plate, and the plurality of limit tooth grooves 301 on each toothed limit plate are staggered in the vertical direction with the plurality of limit tooth grooves 301 on the other toothed limit plate, and the plurality of limit tooth grooves 301 of each toothed limit plate and the plurality of limit tooth grooves 301 on the other toothed limit plate act together on the multilayer board 2020 with the corresponding plurality of limit tooth grooves 301 of the other toothed limit plate, so that the multilayer board 2020 is tilted and fixed on the tilted fixing device; when the tilted multilayer board 2020 is placed in the liquid medicine tank for metallization treatment, the multilayer board A chemical reaction occurs at the via hole on 2020 to form a metal layer, and bubbles are also generated. At this time, there is a certain angle between the via hole and the horizontal direction, that is, there is a certain slope in the discharge path of the bubbles; since the inclined fixing device reciprocates horizontally and vertically in the liquid medicine tank, the liquid medicine flows in the liquid medicine tank so that the liquid medicine has an impact force on the bubbles in the via hole in the horizontal direction. During the horizontal reciprocating motion, the hole wall exerts a force on the bubbles in the horizontal direction, and during the vertical reciprocating motion, the hole wall also exerts a force on the bubbles in the vertical direction. Under the joint action of all forces, the bubbles are discharged from the via hole along the slope, so that the liquid medicine can contact the entire wall of the via hole, thereby suppressing the risk of uneven plating and leaky plating.

[0090] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for metallization in a multilayer board hole, characterized in that: include: Performing a drilling operation on the multilayer board to form a via hole, wherein the thickness-to-diameter ratio of the via hole is greater than 12:1; Performing a cleaning operation on the multilayer board; Performing a roughening process on the via hole; The plurality of multilayer boards are tiltedly arranged on a tilting fixing device; Performing metallization treatment on a plurality of the multilayer boards, wherein each of the multilayer boards is tiltedly fixed in a tilting fixing device; Wherein, the tilt fixing device comprises: A hook, the hook being used to connect to an external support frame; A fixing frame, the hook being fixedly connected to the fixing frame; The toothed limiting plates are two in number, the two toothed limiting plates are fixed in the fixing frame at intervals, and the two toothed limiting plates are arranged opposite to and in parallel with each other up and down, and each toothed limiting plate is formed with a plurality of spaced limiting tooth grooves on a side adjacent to the other toothed limiting plate, the plurality of limiting tooth grooves of each toothed limiting plate are arranged in one-to-one correspondence with the plurality of limiting tooth grooves of the other toothed limiting plate, and each limiting tooth groove of each toothed limiting plate is staggered with the corresponding limiting tooth groove in the vertical direction, and each limiting tooth groove of each toothed limiting plate and the corresponding limiting tooth groove are used together to limit the corresponding multi-layer board so that the corresponding multi-layer board is tilted and clamped in the two toothed limiting plates, and the extension direction of each limiting tooth groove is the same as the inclination angle of the corresponding multi-layer board; Each toothed limit plate includes a fixed plate and a plurality of soft limit members, the two fixed plates are fixed in the fixed frame at intervals, and the two fixed plates are arranged opposite to and parallel to each other in the upper and lower parts, and a plurality of spaced installation grooves are formed on a side of each fixed plate adjacent to the other fixed plate, the plurality of installation grooves of each fixed plate are arranged one-to-one with the plurality of installation grooves of the other fixed plate, and the installation grooves of each fixed plate are staggered with the corresponding installation grooves in the vertical direction, and a plurality of clamping grooves are formed on the groove wall of each of the installation grooves, and a plurality of clamping convex parts are respectively convexly provided on both sides of each of the soft limit members, and the plurality of soft limit members of each toothed limit plate are embedded in the plurality of installation grooves of the corresponding fixed plate one-to-one, and each clamping convex part is clamped in the corresponding clamping groove, and each soft limit member is formed with a limiting tooth groove.

2. The method for metallization in a multilayer board hole according to claim 1, characterized in that: The plurality of limiting tooth grooves on each of the toothed limiting plates are arranged at intervals along the horizontal direction.

3. The method for metallization in a multilayer board hole according to claim 1, characterized in that: Each of the limiting tooth grooves is a rectangular through groove.

4. The method for metallization in a multilayer board hole according to claim 1, characterized in that: Each of the limiting tooth grooves is adapted to the corresponding multilayer board.

5. The method for metallization in a multilayer board hole according to claim 1, characterized in that: A forming surface is provided on one side of each toothed limiting plate adjacent to another toothed limiting plate, the forming surface is parallel to the horizontal plane, and each limiting tooth groove is formed on the forming surface.

6. The method for metallization in a multilayer board hole according to claim 1, characterized in that: The fixing frame forms a communicating material passing channel and a containing cavity, and the two toothed limiting plates are located in the containing cavity and fixedly connected to the fixing frame.

7. The method for metallization in a multilayer board hole according to claim 1, characterized in that: In the step of roughening the via hole, the via hole is roughened by using corundum and / or aluminum oxide powder.

8. The method for metallization in a multilayer board hole according to claim 7, characterized in that: In the step of roughening the via hole, the diamond sand and / or the aluminum oxide powder impacts the hole wall of the via hole to roughen the hole wall of the via hole.

9. The method for metallization in a multilayer board hole according to claim 1, characterized in that: The step of tilting the plurality of multilayer boards to the tilted fixing device comprises: The plurality of multilayer boards are clamped on the two toothed limiting plates in sequence; The inclined fixing device is immersed in a medicine pool device, so that the plurality of multilayer boards are metallized in the medicine pool device.

10. The method for metallization in a multilayer board hole according to claim 9, characterized in that: The medicine pool device comprises: A tank body, wherein the tank body is formed with a liquid medicine tank, the liquid medicine tank is used to contain liquid medicine, and the inclined fixing device is immersed in the liquid medicine tank; A hanging rod, the hanging rod is located in the medicine liquid tank and connected to the tank body; a vibration motor, the vibration motor being mounted on the cell body, and an output end of the vibration motor being connected to the cell body; and A vertical driving member, wherein a power output end of the vertical driving member is connected to the hanging rod, so that the vertical driving member is used to drive the hanging rod to reciprocate up and down; A horizontal driving member, wherein a power output end of the horizontal driving member is connected to the hanging rod, so that the horizontal driving member is used to drive the hanging rod to reciprocate left and right.

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