Display substrate, manufacturing method thereof and display device

Abstract

The application provides a display substrate, a manufacturing method thereof and a display device. The display substrate comprises a substrate, a light processing layer arranged on the substrate, the substrate comprising a display area, a non-display area surrounding the display area, and at least one cutting path in the non-display area; wherein the light processing layer is arranged in the display area and the cutting path, and a projection of the light processing layer on the substrate at least partially overlaps with a projection of the cutting path on the substrate. By arranging the light processing layer in the display area and the cutting path, the difference between the cutting path and the film layer structure on both sides of the cutting path can be reduced without changing the manufacturing process, increasing the manufacturing cost and the manufacturing complexity, so as to reduce the possibility of forming bubbles in the difference area by laser cutting, thereby reducing the bubble occurrence rate of the cutting path, avoiding cutting adhesion, and improving the product yield.

Description

Technical Field

[0001] This application relates to the field of display device technology, and in particular to a display substrate, its manufacturing method, and a display device. Background Technology

[0002] Active-matrix organic light-emitting diode (AMOLED) displays have advantages such as wide color gamut, high resolution, and individual pixel control, leading to their increasing market share in end-user markets. As panel sizes increase, the current manufacturing process for flexible display panels typically involves fabricating multiple display panels on a single motherboard. After vapor deposition and encapsulation processes, the motherboard is then cut into several display panels. In traditional dicing designs, a significant gap is created between the dicing channels and the film layers on either side. During cutting, the laser easily forms bubbles in this gap area. Subsequent processes cannot completely remove these bubbles, causing strong interference with the laser cutting process. This results in the laser not being able to fully focus in this area, ultimately leading to adhesion during cutting and reduced yield. Summary of the Invention

[0003] In view of this, the purpose of this application is to provide a display substrate, a method for manufacturing the same, and a display device.

[0004] To achieve the above objectives, the first aspect of this application provides a display substrate, comprising: a substrate, a light processing layer disposed on the substrate, the substrate including a display area, a non-display area surrounding the display area, and at least one dicing channel located in the non-display area;

[0005] The display area and the cutting channel are both provided with the light processing layer. The orthographic projection of the light processing layer on the substrate and the orthographic projection of the cutting channel on the substrate at least partially coincide. The light processing layer includes a first light processing layer and a second light processing layer. The second light processing layer is disposed on the side of the first light processing layer away from the substrate. The cutting channel is provided with the first light processing layer and / or the second light processing layer. The first light processing layer and the second light processing layer have different refractive indices.

[0006] Furthermore, the orthographic projection of the cutting path on the substrate lies within the orthographic projection of the light processing layer on the substrate.

[0007] Furthermore, the thickness of the light processing layer within the cutting channel is less than the depth of the cutting channel, and both the thickness direction of the light processing layer and the depth direction of the cutting channel are along a direction perpendicular to the plane of the substrate.

[0008] Furthermore, the light processing layer includes a first light processing layer and a second light processing layer, the second light processing layer being disposed on the side of the first light processing layer away from the substrate, and the first light processing layer and / or the second light processing layer being disposed within the cutting channel.

[0009] Furthermore, the cutting channel is provided with a first light processing layer and a second light processing layer. The top surface of the first light processing layer located in the cutting channel is flush with the top surface of the first light processing layer located in the display area. The top surface is the side of the first light processing layer that faces away from the substrate.

[0010] Furthermore, the cutting channel is provided with a first light processing layer or a second light processing layer, and the thickness of the first light processing layer or the second light processing layer in the cutting channel is less than the depth of the cutting channel.

[0011] Furthermore, the cut edge of the substrate is flush with the edge of the light-processing layer.

[0012] Furthermore, the cut edge of the substrate is flush with the edge of the first light-processing layer.

[0013] Furthermore, the orthographic projection of the edge of the second light processing layer on the substrate lies within the orthographic projection of the edge of the first light processing layer on the substrate.

[0014] Furthermore, it also includes: a light-emitting layer, the light-emitting layer being located between the substrate and the light processing layer, the light-emitting layer including a pixel definition layer, the pixel definition layer including a plurality of pixel openings;

[0015] The display area is provided with the first light processing layer. The first light processing layer located in the display area includes a plurality of light processing structures. A light processing opening is formed between two adjacent light processing structures. The orthographic projection of the light processing opening on the substrate at least partially overlaps with the orthographic projection of the pixel opening on the substrate.

[0016] Furthermore, the display area is also provided with a second light processing layer, which covers the side of the light processing structure away from the substrate, and the refractive index of the light processing structure is less than the refractive index of the second light processing layer.

[0017] Furthermore, the difference between the refractive index of the second light processing layer and the refractive index of the light processing structure is greater than or equal to 0.3.

[0018] Furthermore, it also includes: an encapsulation structure layer and a touch layer, wherein the encapsulation structure layer is disposed on the side of the light-emitting layer away from the substrate, the touch layer is disposed on the side of the encapsulation structure layer away from the substrate, and the light processing layer is disposed on the touch layer.

[0019] Based on the same inventive concept, a second aspect of this application provides a display device including the display substrate described in any of the first aspects above.

[0020] Based on the same inventive concept, a third aspect of this application provides a method for manufacturing a display substrate, comprising:

[0021] A substrate is provided, the substrate including a display area and a non-display area surrounding the display area;

[0022] A light-processing layer is formed on the substrate;

[0023] At least one slit is formed on the side of the light processing layer away from the substrate. The light processing layer is disposed in both the display area and the slit. The orthographic projection of the light processing layer on the substrate and the orthographic projection of the slit on the substrate at least partially overlap.

[0024] As can be seen from the above, the display substrate, its manufacturing method, and display device provided in this application, by simultaneously disposing the light processing layer in the display area and the cutting channel, only need to extend the light processing layer originally disposed only in the display area to the cutting channel position, so that the light processing layer at least partially covers the cutting channel. This can reduce the discontinuity between the film layer structure on both sides of the cutting channel without basically changing the manufacturing process, increasing manufacturing costs, or increasing manufacturing complexity. This reduces the possibility of the laser forming bubbles in the discontinuity area during cutting, thereby reducing the bubble occurrence rate of the cutting channel, avoiding cutting adhesion, and improving product yield. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a macroscopic schematic diagram of the existing technology of fabricating two display panels on a single motherboard;

[0027] Figure 2 This is a schematic diagram of the structure of a display substrate and its cutting channels in the prior art;

[0028] Figure 3 This is a schematic diagram of a prior art structure in which an insulating layer is filled inside the cutting channel;

[0029] Figure 4 This is a first schematic diagram of the cutting channel and both sides of the display substrate according to an embodiment of this application;

[0030] Figure 5 This is a second schematic diagram of the cutting path and both sides of the display substrate according to an embodiment of this application;

[0031] Figure 6 This is a third schematic diagram of the cutting path and both sides of the display substrate according to an embodiment of this application;

[0032] Figure 7 This is a fourth schematic diagram of the cutting channel and its two sides of the display substrate according to an embodiment of this application;

[0033] Figure 8 This is a schematic diagram of the display area of ​​a display substrate according to an embodiment of this application;

[0034] Figure 9 This is another structural schematic diagram of the display area of ​​the display substrate according to an embodiment of this application;

[0035] Figure 10 This is a schematic diagram of a display substrate after cutting according to an embodiment of this application;

[0036] Figure 11 This is a schematic diagram of another structure of the display substrate after cutting according to an embodiment of this application;

[0037] Figure 12 This is a schematic flowchart illustrating the manufacturing method of a display substrate sieve according to an embodiment of this application.

[0038] In the figure, 01 is the flexible substrate layer; 02 is the substrate support layer; 03 is other film layers; 04 is the surface protective film; 05 is the back protective film; 06 is the filling insulating layer; 1 is the substrate; 2 is the light processing layer; 21 is the first light processing layer; 211 is the light processing structure; 22 is the second light processing layer; 3 is the dicing channel; 4 is the insulating layer; 5 is the light-emitting layer; 51 is the pixel definition layer; 52 is the anode; 53 is the organic light-emitting layer; 54 is the cathode; 6 is the driving circuit layer; 7 is the packaging structure layer; and 8 is the touch layer. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0040] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0041] Active-matrix organic light-emitting diode (AMOLED) displays offer advantages such as wide color gamut, high resolution, and individual pixel control, leading to their increasing market share. As panel sizes increase, the current manufacturing process for flexible display panels typically involves fabricating multiple display panels on a single motherboard. After vapor deposition and encapsulation processes, the motherboard is then cut into several display panels. (Reference) Figure 1 , Figure 1 This is a macroscopic diagram of creating two display panels on a single motherboard. The dashed boxes in the diagram indicate the locations of the cutting paths.

[0042] In the current manufacturing process of flexible display panels, it is often necessary to remove a rigid substrate, such as a glass substrate, and then use a new substrate as the base plate. To protect the substrate from damage, a flexible protective film needs to be applied before and after removing the rigid substrate. Figure 2 As shown, when a substrate is fabricated using a single-layer flexible substrate layer 01 and a single-layer substrate support layer 02 ( Figure 2 In addition to the aforementioned film layers, the flexible display panel also includes other film layers (denoted by 03), and the location of the laser-cut kerf (e.g., ...). Figure 2 As shown by the dashed line L, the substrate support layer 02 and other film layers 03 are completely etched away. At this point, only the flexible substrate layer 01 remains at the dicing location. Along the direction perpendicular to the plane of the flexible substrate layer 01, the film thickness within the dicing path will be significantly lower than the thickness on both sides of the dicing path, creating a large gap between the dicing path and the film layers on both sides. After attaching the surface protective film 04 and the back protective film 05, the flexible substrate layer 01 is laser-cut at the dicing location using a laser. During cutting, the laser passes through this gap area (e.g., ...). Figure 2When filling the gap area (as shown in the figure), bubbles are easily formed in this gap area. Subsequent processes cannot completely remove the bubbles in this area, so the bubbles strongly interfere with the laser cutting process, causing the laser in this area to be unable to be fully focused, ultimately leading to cutting adhesion and reduced yield.

[0043] In related technologies, refer to Figure 3 As shown, by adding an insulating layer 06 within the traditional cutting path, the gap between the cutting path and the film layers on both sides of the cutting path is reduced, thereby reducing the space in the gap area and decreasing the possibility of laser forming bubbles in this gap area during cutting, thus reducing the bubble occurrence rate of the cutting path. However, this method has a significant impact on the process, requiring substantial modifications to the manufacturing process, increasing manufacturing costs and complexity. This is detrimental to the production and mass production of this type of display panel, therefore, the practical operability of this method is not strong. Therefore, how to reduce the bubble occurrence rate of the cutting path and increase product yield without significantly changing the manufacturing process, increasing manufacturing costs, or increasing manufacturing complexity is a technical problem that urgently needs to be solved in the industry.

[0044] Based on the above issues, refer to Figure 4 This application provides a display substrate, including: a substrate 1, a light processing layer 2 disposed on the substrate 1, the substrate 1 including a display area, a non-display area surrounding the display area, and at least one cleaving channel 3 located in the non-display area;

[0045] The display area and the cutting channel 3 are both provided with the light processing layer 2. The orthographic projection of the light processing layer 2 on the substrate 1 and the orthographic projection of the cutting channel 3 on the substrate 1 at least partially overlap. The light processing layer 2 includes a first light processing layer 21 and a second light processing layer 22. The second light processing layer 22 is disposed on the side of the first light processing layer 21 away from the substrate 1. The cutting channel 3 is provided with the first light processing layer 21 and / or the second light processing layer 22. The first light processing layer 21 and the second light processing layer 22 have different refractive indices.

[0046] Specifically, the cutting path described in this application is a region within a range of 200 to 300 micrometers from the cutting edge of the substrate.

[0047] The light processing layer 2 is a stacked structure formed by a first light processing layer 21 and a second light processing layer 22. The light processing layer 2 located at the cut-out channel 3 can be a stacked structure of the first light processing layer 21 and the second light processing layer 22, or it can consist of only the first light processing layer 21 or the second light processing layer 22. In specific implementations, the choice of which layer or combination of the first light processing layer 21 and the second light processing layer 22 to fill the cut-out channel 3 depends on the actual process and requirements, and is not limited here. The light processing layer 2 located within the display area includes a first light processing layer 21 and a second light processing layer 22, and the first light processing layer 21 and the second light processing layer 22 have different refractive indices. Thus, the light processing layer 22 can be applied in an efficiency enhancement structure (EES) to improve the front light emission efficiency of the display device.

[0048] In related technologies, to reduce power consumption during panel use, low-power light-emitting devices are required. For example, efficiency enhancement structures can be used to improve the front light emission efficiency of the display device, thereby reducing display power consumption. The light processing layer 2 is an essential film structure in the efficiency enhancement structure of flexible display panels. The light processing layer 2 is generally only set in the display area of ​​the display substrate to improve the front light emission efficiency of the display device.

[0049] In this application, the light processing layer 2 is provided in both the display area and the cutting channel 3. Placing the light processing layer 2 in the display area improves the front light emission efficiency of the display device. Simultaneously, placing the light processing layer 2 in the cutting channel 3 allows it to fill the space within the cutting channel 3, reducing the discontinuity between the cutting channel 3 and the film structures on both sides of the cutting channel 3. This reduces the likelihood of air bubbles forming in the discontinuity area during cutting, thereby lowering the air bubble rate in the cutting channel 3, preventing cutting adhesion, and improving product yield. Furthermore, by simultaneously placing the light processing layer 2 in both the display area and the cutting channel 3, it is only necessary to extend the light processing layer 2, originally only located in the display area, to the cutting channel 3, ensuring that the light processing layer 2 at least partially covers the cutting channel 3. This reduces the discontinuity between the film structures on both sides of the cutting channel 3 without significantly altering the manufacturing process, increasing manufacturing costs, or adding complexity, thus reducing the air bubble rate in the cutting channel 3 and improving product yield.

[0050] The orthographic projection of the light processing layer 2 on the substrate 1 at least partially overlaps with the orthographic projection of the cutting channel 3 on the substrate 1.

[0051] Specifically, the orthographic projection of the light processing layer 2 on the substrate 1 at least partially overlaps with the orthographic projection of the cutting channel 3 on the substrate 1, that is, the orthographic projection of the light processing layer 2 on the substrate 1 at least partially covers the orthographic projection of the cutting channel 3 on the substrate 1.

[0052] For example, refer to Figure 4 The orthographic projection of the cutting channel 3 on the substrate 1 is located within the orthographic projection of the light processing layer 2 on the substrate 1. That is, the orthographic projection of the light processing layer 2 on the substrate 1 completely covers the orthographic projection of the cutting channel 3 on the substrate 1. In other words, the bottom of the groove of the cutting channel 3 is completely filled with the light processing layer 2, ensuring that the bottom of the cutting channel 3 is completely covered by the light processing layer 2. This reduces the discontinuity between the entire cutting channel 3 and the film structure on both sides of the cutting channel 3, thereby significantly reducing the bubble occurrence rate of the cutting channel 3.

[0053] For example, refer to Figure 5 The orthographic projection of the cutting channel 3 onto the substrate 1 partially coincides with the orthographic projection of the light processing layer 2 onto the substrate 1. That is, the light processing layer 2 does not completely cover the bottom of the cutting channel 3, but only a portion of the bottom of the cutting channel 3. Compared with the conventional cutting channel 3, this arrangement can still reduce the discontinuity between the cutting channel 3 and the film structure on both sides of the cutting channel 3, thereby reducing the bubble formation rate of the cutting channel 3.

[0054] The display substrate described in this application, by simultaneously disposing the light processing layer 2 at both the display area and the cutting channel 3, only needs to extend the light processing layer 2, which was originally only disposed in the display area, to the cutting channel 3, so that the light processing layer 2 at least partially covers the cutting channel 3. This reduces the discontinuity between the cutting channel 3 and the film layer structures on both sides of the cutting channel 3 without significantly changing the manufacturing process, increasing manufacturing costs, or adding complexity. This reduces the possibility of the laser forming bubbles in the discontinuity area during cutting, thereby reducing the bubble occurrence rate of the cutting channel 3, avoiding cutting adhesion, and improving product yield.

[0055] In some embodiments, an insulating layer 4 is further disposed between the substrate 1 and the light processing layer 2. The insulating layer 4 may include one or more of a barrier layer, a pixel definition layer, a planarization layer, an interlayer dielectric layer, and a gate insulating layer, and is not specifically limited thereto.

[0056] In some embodiments, the thickness of the light processing layer 2 within the cutting channel 3 is less than the depth of the cutting channel 3, and the thickness direction of the light processing layer 2 and the depth direction of the cutting channel 3 are both along a direction perpendicular to the plane of the substrate 1.

[0057] Specifically, the thickness of the light processing layer 2 within the cutting channel 3 is less than the depth of the cutting channel 3. This ensures that the light processing layer 2 can effectively fill the cutting channel 3, while also ensuring that there is a small gap between the cutting channel 3 and the film structures on both sides of the cutting channel 3, which facilitates subsequent cutting processes.

[0058] In some embodiments, the thickness of the light processing layer 2 within the cutting path 3 is 1 / 3 to 3 / 4 of the depth of the cutting path 3, so as to effectively reduce the bubble formation rate of the cutting path 3. If the thickness of the light processing layer 2 within the cutting path 3 is less than 1 / 3 of the depth of the cutting path 3, the coverage thickness of the light processing layer 2 on the cutting path 3 is insufficient, resulting in an inability to effectively reduce the bubble formation rate of the cutting path 3; if the thickness of the light processing layer 2 within the cutting path 3 is greater than 3 / 4 of the depth of the cutting path 3, the coverage thickness of the light processing layer 2 on the cutting path 3 is too thick, thus affecting subsequent cutting processes.

[0059] In some embodiments, reference Figure 6 The cutting channel 3 is provided with a first light processing layer 21 and a second light processing layer 22. The top surface of the first light processing layer 21 located in the cutting channel 3 is flush with the top surface of the first light processing layer 21 located in the display area. The top surface is the side of the first light processing layer 21 that is away from the substrate 1.

[0060] Specifically, when the first light processing layer 21 and the second light processing layer 22 are simultaneously provided at the cutting channel 3, the top surface of the first light processing layer 21 located in the cutting channel 3 is flush with the top surface of the first light processing layer 21 located in the display area. This allows the first light processing layer 21 at the cutting channel 3 and the first light processing layer 21 in the display area to be fabricated in the same layer during actual manufacturing, without requiring any special processing or etching of the first light processing layer 21 at the cutting channel 3. This simplifies the operation, does not affect existing manufacturing processes, and does not increase manufacturing costs. Simultaneously, the sum of the thicknesses of the second light processing layer 22 and the first light processing layer 21 is less than the depth of the cutting channel 3, ensuring that the overall thickness of the light processing layer 2 at the cutting channel 3 is less than the thickness of the film layer structures on both sides of the cutting channel. This maintains a small discontinuity between the cutting channel 3 and the film layer structures on both sides of the cutting channel 3, facilitating subsequent cutting processes.

[0061] In some embodiments, continue to refer to Figure 4 The first light processing layer 21 is provided in the cutting channel 3, and the thickness of the first light processing layer 21 in the cutting channel 3 is less than the depth of the cutting channel 3.

[0062] Specifically, when only the first light processing layer 21 is provided at the cutting channel 3, the first light processing layer 21 is provided inside the cutting channel 3, and the thickness of the first light processing layer 21 inside the cutting channel 3 is less than the depth of the cutting channel 3. This ensures that the first light processing layer 21 can effectively fill the cutting channel 3 to reduce the breakage of the cutting channel 3.

[0063] In some embodiments, reference Figure 7 The cutting channel 3 is provided with a second light processing layer 22, and the thickness of the second light processing layer 22 in the cutting channel 3 is less than the depth of the cutting channel 3.

[0064] Specifically, when only the second light processing layer 22 is provided at the cutting channel 3, the second light processing layer 22 is provided inside the cutting channel 3. The thickness of the second light processing layer 22 inside the cutting channel 3 is less than the depth of the cutting channel 3. This ensures that the second light processing layer 22 can effectively fill the cutting channel 3, and also ensures that the total thickness of the light processing layer 2 at the cutting channel 3 is less than the thickness of the film layers on both sides of the cutting channel 3. This allows for a small discontinuity between the cutting channel 3 and the film layer structures on both sides of the cutting channel 3, facilitating subsequent cutting processes.

[0065] In some embodiments, reference Figure 10 and Figure 11 The cutting edge of the substrate 1 is flush with the edge of the light processing layer 2. Specifically, the cutting edge of the substrate 1 is flush with the edge of the first light processing layer 21, thus making the edge of the cut display substrate relatively flat, facilitating subsequent processes. It is worth noting that, in this application, "the cutting edge of the substrate 1 is flush with the edge of the light processing layer 2" means that the distance between the orthographic projection of the edge of the light processing layer 2 onto the substrate 1 and the cutting edge of the substrate 1 is 0 to 30 micrometers.

[0066] Furthermore, the orthographic projection of the edge of the second light processing layer 22 on the substrate 1 lies within the orthographic projection of the edge of the first light processing layer 21 on the substrate.

[0067] Specifically, refer to Figure 11 The edge of the second light processing layer 22 can be flush with the edge of the first light processing layer 21, that is, the orthographic projection of the edge of the second light processing layer 22 on the substrate 1 coincides with the orthographic projection of the edge of the first light processing layer 21 on the substrate. At this time, the edges of the second light processing layer 22, the first light processing layer 21 and the cutting edge of the substrate 1 are all flush, making the edge of the cut display substrate very flat, which facilitates subsequent processes.

[0068] refer to Figure 10The edge of the second light processing layer 22 may not be flush with the edge of the first light processing layer 21. That is, the orthographic projection of the edge of the second light processing layer 22 on the substrate 1 is located in the orthographic projection of the edge of the first light processing layer 21 on the substrate 1. At this time, the edge of the first light processing layer 21 and the cutting edge of the substrate 1 are still flush, which makes the cutting edge of the cut display substrate relatively flat and makes the cutting process more convenient.

[0069] In some embodiments, reference Figure 8 The display substrate further includes: a light-emitting layer 5, which is located between the substrate 1 and the light processing layer 2, and the light-emitting layer 5 includes a pixel definition layer, which includes a plurality of pixel openings;

[0070] The display area is provided with the first light processing layer 21. The first light processing layer 21 located in the display area includes a plurality of light processing structures 211. A light processing opening is formed between two adjacent light processing structures 211. The orthographic projection of the light processing opening on the substrate 1 at least partially overlaps with the orthographic projection of the pixel opening on the substrate 1.

[0071] Specifically, the light-emitting layer 5 may include a pixel definition layer 51 and a light-emitting device. The pixel definition layer 51 may include multiple pixel openings, which form light-emitting areas. Adjacent light-emitting areas are separated by pixel dams. The light-emitting areas may include red, green, and blue light-emitting areas, or they may include red, green, blue, and white light-emitting areas, without any specific limitation. The light-emitting device may include an anode 52, an organic light-emitting layer 53, and a cathode 54.

[0072] The first light processing layer 21 located in the display area is provided with the light processing opening. The orthographic projection of the light processing opening on the substrate 1 at least partially coincides with the orthographic projection of the pixel opening on the substrate 1, ensuring that the light emitted from the light-emitting area can pass through the light processing opening and avoid affecting the light output efficiency.

[0073] In specific implementation, the shape of the light processing structure 211 can be set according to the actual pixel morphology or process requirements to obtain a suitable shape for the light processing opening. On a plane parallel to the display substrate, the shape of the light processing structure 211 can be any one or more of the following: triangle, rectangle, pentagon, hexagon, circle, and ellipse. In a plane perpendicular to the substrate 1, the cross-sectional shape of the light processing structure 211 can include trapezoid, inverted trapezoid, or T-shape, etc. The sidewalls of the light processing structure 211 can be broken lines, arcs, or wavy lines, etc., without any specific limitation.

[0074] In some embodiments, continue to refer to Figure 8The display area is further provided with a second light processing layer 22, which covers the side of the light processing structure 211 away from the substrate 1. The refractive index of the light processing structure 211 is less than the refractive index of the second light processing layer 22.

[0075] Specifically, the surface of the second light processing layer 22 away from the substrate 1 can be a planarized surface. The refractive index of the light processing structure 211 is less than that of the second light processing layer 22, causing light from the light-emitting area to deflect towards the center of the light-emitting area after passing through the light processing layer 2, thereby improving the light extraction efficiency of the display panel. For example, the center of the light-emitting area can be the geometric center of the light-emitting area. The first refractive index n1 of the light processing structure 211 is less than the second refractive index n2 of the second light processing layer 22, and the first incident angle θ1 is greater than the critical angle of total internal reflection β, where the critical angle of total internal reflection β = arcsin(n1 / n2). In practice, light is incident at the interface between the light processing structure 211 and the second light processing layer 22 at a first incident angle θ1. Since the first incident angle θ1 is greater than the critical angle of total internal reflection β, the incident light undergoes total internal reflection and re-enters the second light processing layer 22 at a first reflection angle θ2. Since the first incident angle θ1 is equal to the first reflection angle θ2, the incident light that was originally directed at a large angle is deflected, thereby causing the light that re-enters the second light processing layer 22 to be deflected toward the light emission center, thus improving the efficiency of front light emission.

[0076] Wherein, the difference between the refractive index of the second light processing layer 22 and the refractive index of the light processing structure 211 is greater than or equal to 0.3. For example, the difference between the refractive index of the second light processing layer 22 and the refractive index of the light processing structure 211 can be 0.3, 0.35, 0.4, etc. When the difference between the refractive index of the light processing structure 211 and the refractive index of the second light processing layer 22 is greater than or equal to 0.3, the light processing layer 2 can better improve the front light emission efficiency.

[0077] In this application, the first light processing layer 21 has a layered structure within the cutting channel 3 and multiple light processing structures 211 within the display area. The different structural settings of the first light processing layer 21 in different areas can ensure that the first light processing layer 21 covers the cutting channel 3 to reduce the breakage of the cutting channel 3, and also make the first light processing layer 21 within the display area have light processing openings so that the light from the light-emitting area is deflected towards the center of the light-emitting area after total internal reflection by the light processing structure 211, thereby improving the front light emission efficiency.

[0078] In some embodiments, reference Figure 9The display substrate further includes a driving circuit layer 6, which is disposed on the side of the substrate 1 near the light processing layer 2. The driving circuit layer 6 may include a plurality of transistors and storage capacitors constituting a pixel driving circuit.

[0079] In some embodiments, continue to refer to Figure 9 The display substrate further includes an encapsulation structure layer 7, which is disposed on the side of the light-emitting layer 5 away from the substrate 1. The encapsulation structure layer 7 may include a first sub-layer, a second sub-layer, and a third sub-layer stacked together. The first and third sub-layers may be made of inorganic materials, and the second sub-layer may be made of organic materials.

[0080] In some embodiments, continue to refer to Figure 9 The display substrate further includes a touch layer 8, which is disposed on the side of the encapsulation structure layer 7 away from the substrate 1. The light processing layer 2 is disposed on the touch layer 8. The touch layer 8 can be a flexible multilayer on cell (FMLOC) structure. The touch layer 8 can include a first touch insulating layer, a first metal mesh layer, a second touch insulating layer, a third touch insulating layer, and a fourth touch insulating layer. The first touch insulating layer can be located on the side of the first metal mesh layer closer to the substrate 1. The second touch insulating layer can be located on the side of the first metal mesh layer away from the substrate 1. The second metal mesh layer can be located on the side of the second touch insulating layer 4 away from the substrate 1. The third touch insulating layer 4 can be located on the side of the second metal mesh layer away from the substrate 1.

[0081] This application also provides a display device, including the display substrate described in any of the above embodiments. This display device has the technical effects described in any of the above embodiments, which will not be elaborated upon here.

[0082] It should be noted that the display device can be a product with image display function, such as: monitor, television, billboard, digital photo frame, laser printer with display function, telephone, mobile phone, personal digital assistant (PDA), digital camera, portable camcorder, viewfinder, navigator, vehicle, large wall, home appliance, information query equipment (such as business query equipment of e-government, bank, hospital, power and other departments, monitor, etc.).

[0083] In some embodiments, the display device may further include a driving circuit coupled to a display panel, the driving circuit being configured to provide a corresponding electrical signal to the display panel.

[0084] refer to Figure 12 This application also provides a method for manufacturing a display substrate, comprising:

[0085] S101. A substrate 1 is provided, the substrate 1 including a display area and a non-display area surrounding the display area;

[0086] S102, A light-processing layer 2 is formed on the substrate 1;

[0087] S103. At least one cutting channel 3 is formed on the side of the light processing layer 2 away from the substrate 1. The light processing layer 2 is disposed in both the display area and the cutting channel 3. The orthographic projection of the light processing layer 2 on the substrate 1 and the orthographic projection of the cutting channel 3 on the substrate 1 at least partially overlap.

[0088] Specifically, step S102, forming the light processing layer 2 on the substrate 1, includes: coating the substrate 1 with a first optical adhesive; forming a light processing structure 211 within the display area using a photolithography process; and removing the first optical adhesive between the light processing structures 211 to form a light processing opening. In an exemplary embodiment, the first optical adhesive can be doped to obtain a first optical adhesive with a low refractive index.

[0089] Subsequently, a first optical thin film is deposited and patterned to form a second light processing layer 22 covering the first optical adhesive and multiple light processing structures 211. This completes the fabrication of the light processing layer 2 pattern. Exemplarily, the first optical thin film can be made of silicon oxide (SiO2). x ), silicon nitride (SiN) x It can be any one or more of silicon oxynitride (SiON) and can be a single layer, multiple layers or composite layers, and the deposition method can be chemical vapor deposition (CVD) or atomic layer deposition (ALD).

[0090] In step S103, at least one dicing channel 3 is formed on the side of the light processing layer 2 away from the substrate 1. The light processing layer 2 is disposed at both the display area and the dicing channel 3. The orthographic projection of the light processing layer 2 onto the substrate 1 at least partially overlaps with the orthographic projection of the dicing channel 3 onto the substrate 1. Specifically, this includes etching the light processing layer 2 on the substrate 1 where the light processing layer 2 pattern is formed, to form at least one dicing channel 3 containing the light processing layer 2. For example, the light processing layer 2 includes a first light processing layer 21 and a second light processing layer 22. The second light processing layer 22 is disposed on the side of the first light processing layer 21 away from the substrate 1, and the dicing channel 3 is disposed with the first light processing layer 21 and / or the second light processing layer 22.

[0091] In some embodiments, the manufacturing method further includes: performing a vapor deposition process, an encapsulation process, and a process of adding other functional film layers on the substrate 1, and etching the relevant film layers at the cutting path 3 after these processes. After etching, a display function-related driving circuit layer 6, a light-emitting layer 5, an encapsulation structure layer 7, and a touch layer 8 are formed in the display area accordingly. The specific structure of the relevant film layers in the display substrate can be referred to the description in the foregoing section, and will not be repeated here. Furthermore, another protective film can be provided on the side of the encapsulation structure layer 7 facing away from the substrate 1. This other protective film further prevents external water and oxygen from corroding the relevant film layers, ensuring the performance of the display substrate.

[0092] In some embodiments, between steps S01 and S102, the following further step is included:

[0093] (1) Forming a pattern for the driving circuit layer 6. Exemplarily, forming a pattern for the driving circuit layer 6 may include:

[0094] A first insulating film and a semiconductor film are sequentially deposited on a substrate 1. The semiconductor film is patterned by a patterning process to form a first insulating layer covering the substrate 1 and a semiconductor layer pattern disposed on the first insulating layer. The semiconductor layer pattern of each sub-pixel may include at least multiple active layers.

[0095] Subsequently, a second insulating film and a first conductive film are deposited sequentially. The first conductive film is patterned using a patterning process to form a second insulating layer covering the semiconductor layer pattern, and a first conductive layer pattern disposed on the second insulating layer. The first conductive layer pattern of each sub-pixel may include at least multiple gate electrodes and a first electrode plate.

[0096] Subsequently, a third insulating film and a second conductive film are deposited sequentially. The second conductive film is patterned by a patterning process to form a third insulating layer covering the first conductive layer and a second conductive layer pattern disposed on the third insulating layer. The second conductive layer pattern of each sub-pixel may include at least a second electrode plate. The orthographic projection of the second electrode plate on the substrate 1 at least partially overlaps with the orthographic projection of the first electrode plate on the substrate 1.

[0097] Subsequently, a fourth insulating film is deposited and patterned using a patterning process to form a fourth insulating layer pattern that covers the second conductive layer pattern. Two active vias are formed on the fourth insulating layer of each sub-pixel, and the two active vias expose the two ends of the active layer respectively.

[0098] Subsequently, a third conductive film is deposited and patterned using a patterning process to form a third conductive layer pattern on the fourth insulating layer. The third conductive layer pattern includes at least a source electrode and a drain electrode located in each sub-pixel, and the source electrode and drain electrode are respectively connected to the active layer through active vias.

[0099] Subsequently, a flat film is coated on the substrate 1 on which the aforementioned pattern is formed, and the flat film is patterned by a patterning process to form a flat layer pattern covering the third conductive layer pattern. At least one connection via is formed on the flat layer of each sub-pixel, and the connection via exposes the surface of the drain electrode.

[0100] At this point, the pattern of driving circuit layer 6 is complete. In an exemplary embodiment, the driving circuit layer 6 of each sub-pixel may include multiple transistors and a storage capacitor constituting a pixel driving circuit. In an exemplary embodiment, the transistor may include an active layer, a gate electrode, a source electrode, and a drain electrode, and the storage capacitor may include a first electrode and a second electrode. In an exemplary embodiment, the transistor may be a driving transistor in a pixel driving circuit, and the driving transistor may be a thin-film transistor (TFT).

[0101] In an exemplary embodiment, the first insulating layer, the second insulating layer, the third insulating layer, and the fourth insulating layer may be made of silicon oxide (SiO2). x ), silicon nitride (SiN) x The first insulating layer can be any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or an alloy of the aforementioned metals. The first, second, and third conductive layers can be single-layer, multi-layer, or composite layers. The first insulating layer can be called a buffer layer, the second and third insulating layers can be called GI layers, and the fourth insulating layer can be called an interlayer insulating (ILD) layer.

[0102] (2) Forming a pattern for the light-emitting layer 5. In an exemplary embodiment, forming a pattern for the light-emitting layer 5 may include:

[0103] A fourth conductive film is deposited on the substrate 1 on which the aforementioned pattern is formed. The fourth conductive film is patterned by a patterning process to form an anode electrode layer pattern. The anode electrode layer pattern of each sub-pixel may include at least an anode. The anode is connected to the drain electrode of the transistor through a connecting via.

[0104] Subsequently, a pixel definition film is coated on the substrate 1 on which the aforementioned pattern is formed. The pixel definition film is patterned by a patterning process to form a pixel definition layer. Each sub-pixel's pixel definition layer is provided with a pixel opening. The pixel definition film inside the pixel opening is removed to expose the surface of the anode.

[0105] Subsequently, on the substrate 1 on which the aforementioned pattern is formed, an organic light-emitting layer is formed in each sub-pixel by vapor deposition or inkjet printing. The organic light-emitting layer is connected to the anode through the pixel opening.

[0106] Subsequently, on the substrate 1 where the aforementioned pattern was formed, a cathode pattern was formed by vapor deposition using an open mask. The cathode of the entire structure was connected to the organic light-emitting layer, thus enabling the organic light-emitting layer to be connected to both the anode and the cathode simultaneously.

[0107] At this point, the pattern of luminescent layer 5 is complete.

[0108] In an exemplary embodiment, the fourth conductive film may be made of a metal material, a transparent conductive material, or a multilayer composite structure of a metal material and a transparent conductive material. The metal material may include any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or alloys of the above metals. The transparent conductive material may include indium tin oxide (ITO) or indium zinc oxide (IZO). The multilayer composite structure may be ITO / Al / ITO, etc.

[0109] In an exemplary embodiment, the material of the pixel definition film may include polyimide or acrylic, etc. In an exemplary embodiment, a half-tone mask patterning process may be used to form a septum pillar pattern when forming the pixel definition layer pattern. The septum pillars may be disposed outside the pixel openings and are configured to support a fine metal mask in subsequent vapor deposition processes. This application is not limited thereto.

[0110] In an exemplary embodiment, the organic light-emitting layer may include any one or more of the following: hole injection layer (HIL), hole transport layer (HTL), electron blocking layer (EBL), hole blocking layer (HBL), electron transport layer (ETL), and electron injection layer (EIL).

[0111] In an exemplary embodiment, the cathode may be any one or more of magnesium (Mg), silver (Ag), aluminum (Al), copper (Cu) and lithium (Li), or an alloy made of any one or more of the above metals.

[0112] (3) Forming a pattern for the encapsulation structure layer 7. In an exemplary embodiment, forming a pattern for the encapsulation structure layer 7 may include:

[0113] On the substrate 1 on which the aforementioned pattern is formed, a first encapsulation film is first deposited using an open mask to form a first sub-layer pattern. Then, a second encapsulation material is printed using an inkjet printing process with an open mask to form a second sub-layer pattern. Finally, a third encapsulation film is deposited using an open mask to form a third sub-layer pattern. At this point, the encapsulation layer pattern is complete.

[0114] In an exemplary embodiment, the first encapsulation film and the third encapsulation film may be made of silicon oxide (SiO2). x ), silicon nitride (SiN) x The light-emitting layer 5 can be made of any one or more of silicon oxynitride (SiON) and can be a single layer, multiple layers, or a composite layer. It ensures that external water and oxygen cannot enter the light-emitting layer 5. The deposition method can be chemical vapor deposition (CVD) or atomic layer deposition (ALD). The second encapsulation film can be made of organic materials, such as resin, to coat the various film layers of the display substrate, thereby improving structural stability and flatness. At this point, the pattern of the encapsulation structure layer 7 is complete.

[0115] In summary, the display substrate, its manufacturing method, and display device provided in this application, by simultaneously disposing the light processing layer 2 in the display area and the cutting channel 3, only requires extending the light processing layer 2, which was originally only disposed in the display area, to the cutting channel 3, so that the light processing layer 2 at least partially covers the cutting channel 3. This reduces the discontinuity between the film layer structures on both sides of the cutting channel 3 without significantly changing the manufacturing process, increasing manufacturing costs, or increasing manufacturing complexity. This reduces the possibility of the laser forming bubbles in the discontinuity area during cutting, thereby reducing the bubble occurrence rate of the cutting channel 3, avoiding cutting adhesion, and improving product yield.

[0116] It should be noted that the above description describes some embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0117] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in the details for the sake of brevity.

[0118] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A display substrate, characterized in that, include: A substrate and a light processing layer disposed on the substrate, the substrate including a display area, a non-display area surrounding the display area, and at least one cleaving channel located in the non-display area; The display area and the cutting channel are both provided with the light processing layer. The orthographic projection of the light processing layer on the substrate and the orthographic projection of the cutting channel on the substrate at least partially coincide. The light processing layer includes a first light processing layer and a second light processing layer. The second light processing layer is disposed on the side of the first light processing layer away from the substrate. The first light processing layer and / or the second light processing layer are disposed in the cutting channel. The light processing layer located in the cutting channel is in direct contact with the substrate. The first light processing layer and the second light processing layer have different refractive indices.

2. The display substrate according to claim 1, characterized in that, The orthographic projection of the cutting path on the substrate lies within the orthographic projection of the light processing layer on the substrate.

3. The display substrate according to claim 1, characterized in that, The thickness of the light processing layer within the cleaving channel is less than the depth of the cleaving channel, and both the thickness direction of the light processing layer and the depth direction of the cleaving channel are along a direction perpendicular to the plane of the substrate.

4. The display substrate according to claim 1, characterized in that, The cutting channel is provided with a first light processing layer and a second light processing layer. The top surface of the first light processing layer located in the cutting channel is flush with the top surface of the first light processing layer located in the display area. The top surface is the side of the first light processing layer that faces away from the substrate.

5. The display substrate according to claim 1, characterized in that, The cutting channel is provided with a first light processing layer or a second light processing layer, and the thickness of the first light processing layer or the second light processing layer in the cutting channel is less than the depth of the cutting channel.

6. The display substrate according to claim 1, characterized in that, The cut edge of the substrate is flush with the edge of the light-processing layer.

7. The display substrate according to claim 6, characterized in that, The cut edge of the substrate is flush with the edge of the first light-processing layer.

8. The display substrate according to claim 7, characterized in that, The orthographic projection of the edge of the second light processing layer on the substrate lies within the orthographic projection of the edge of the first light processing layer on the substrate.

9. The display substrate according to claim 1, characterized in that, Also includes: A light-emitting layer is located between the substrate and the light processing layer, and the light-emitting layer includes a pixel definition layer, which includes a plurality of pixel openings; The display area is provided with the first light processing layer. The first light processing layer located in the display area includes a plurality of light processing structures. A light processing opening is formed between two adjacent light processing structures. The orthographic projection of the light processing opening on the substrate at least partially overlaps with the orthographic projection of the pixel opening on the substrate.

10. The display substrate according to claim 9, characterized in that, The display area is further provided with a second light processing layer, which covers the side of the light processing structure away from the substrate. The refractive index of the light processing structure is less than that of the second light processing layer.

11. The display substrate according to claim 10, characterized in that, The difference between the refractive index of the second light processing layer and the refractive index of the light processing structure is greater than or equal to 0.

3.

12. The display substrate according to claim 9, characterized in that, Also includes: The package includes an encapsulation structure layer and a touch layer. The encapsulation structure layer is disposed on the side of the light-emitting layer away from the substrate, and the touch layer is disposed on the side of the encapsulation structure layer away from the substrate. The light processing layer is disposed on the touch layer.

13. A display device, characterized in that, Includes the display substrate as described in any one of claims 1 to 12.

14. A method for manufacturing a display substrate according to any one of claims 1 to 12, characterized in that, include: A substrate is provided, the substrate including a display area and a non-display area surrounding the display area; A light-processing layer is formed on the substrate; At least one slit is formed on the side of the light processing layer away from the substrate. The light processing layer is disposed in both the display area and the slit. The orthographic projection of the light processing layer on the substrate and the orthographic projection of the slit on the substrate at least partially overlap.

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