Electrolytic polishing device, system and method

Abstract

The present invention discloses an electrolytic polishing device, which relates to the field of electrolytic polishing technology. The device includes an electrolytic cell for containing electrolyte, a polishing channel for a workpiece to be polished to pass through, and an anode plate assembly and a cathode plate assembly arranged in the electrolytic cell along the extension direction of the polishing channel. The anode plate assembly and the cathode plate assembly are separated by a partition assembly. The anode plate assembly includes two anode plates arranged opposite each other, the two anode plates being located on either side of the polishing channel, respectively; the cathode plate assembly includes two cathode plates arranged opposite each other, the two cathode plates being located on either side of the polishing channel, respectively; and the partition assembly includes two partitions arranged opposite each other, the two partitions being located on either side of the polishing channel, respectively. The anode plate assembly and the cathode plate assembly are both capable of being connected to a power source. The present invention also discloses an electrolytic polishing system and method, which can improve the polishing effect and uniformity of the workpiece to be polished.

Description

Technical Field

[0001] The present invention relates to the technical field of electrolytic polishing, and in particular to an electrolytic polishing device, system and method. Background Art

[0002] Electropolishing utilizes the electrochemical dissolution of the anode within an electrolytic cell to selectively dissolve microscopic protrusions on the anode, creating a smooth surface. This technique achieves a more uniform electric field distribution by controlling the relative positions of the electrode, baffle, and workpiece, resulting in both surface uniformity and brightness on the polished workpiece.

[0003] Conventional electrolytic polishing technology requires electrical polishing. When processing continuous products, it is difficult to control the distribution of current density on the workpiece, making it difficult to control the uniformity of the workpiece surface. Summary of the Invention

[0004] The object of the present invention is to provide an electrolytic polishing device, system and method to solve the problems existing in the above-mentioned prior art and to improve the polishing effect and uniformity of the workpiece to be polished.

[0005] To achieve the above object, the present invention provides the following solutions:

[0006] The present invention provides an electrolytic polishing device, comprising an electrolytic cell, wherein the electrolytic cell is used to contain electrolyte, and a polishing channel for a workpiece to be polished is provided in the electrolytic cell. An anode plate assembly and a cathode plate assembly are also provided in the electrolytic cell along the extension direction of the polishing channel, and the anode plate assembly and the cathode plate assembly are separated by a partition assembly; the anode plate assembly comprises two anode plates arranged opposite to each other, and the two anode plates are respectively located on both sides of the polishing channel; the cathode plate assembly comprises two cathode plates arranged opposite to each other, and the two cathode plates are respectively located on both sides of the polishing channel; the partition assembly comprises two partitions arranged opposite to each other, and the two partitions are respectively located on both sides of the polishing channel; wherein both the anode plate assembly and the cathode plate assembly can be connected to a power supply.

[0007] Preferably, a plurality of the anode plate assemblies and a plurality of the cathode plate assemblies are provided, and the plurality of the anode plate assemblies and the plurality of the cathode plate assemblies are alternately arranged.

[0008] Preferably, one anode plate assembly is provided, and two cathode plate assemblies are provided, and the two cathode plate assemblies are respectively located on both sides of the anode plate assembly.

[0009] Preferably, the separator assembly is provided between the two cathode plate assemblies and the side wall of the electrolytic cell.

[0010] Preferably, the electrolytic polishing device further comprises an electrolyte tank, which is connected to the electrolytic cell and is used to provide electrolyte to the electrolytic cell.

[0011] Preferably, the electrolyte tank is located below the electrolytic tank and can surround the bottom of the electrolytic tank; the electrolytic tank is provided with an opening on the side wall along the extension direction of the polishing channel, and the electrolyte in the electrolytic tank can fall into the electrolyte tank through the opening; the electrolyte tank is also connected to the electrolytic tank through a pipeline and an acid-resistant pump, and can provide electrolyte to the electrolytic tank.

[0012] Preferably, an electrolyte cavity is provided at the bottom of the electrolytic cell, the electrolyte cell is connected to the electrolyte cavity through the pipe, and a spray hole is provided at the top of the electrolyte cavity for spraying electrolyte into the electrolytic cell.

[0013] The present invention also provides an electrolytic polishing system, comprising a cleaning device and the above-mentioned electrolytic polishing device, wherein the cleaning device can clean the workpiece to be polished after polishing is completed.

[0014] The present invention also provides an electrolytic polishing method, which uses the above-mentioned electrolytic polishing device and includes the following steps:

[0015] S1, placing the workpiece to be polished into the polishing channel, and moving along the polishing channel for polishing;

[0016] S2. After the workpiece to be polished is polished, it is taken out.

[0017] Preferably, the step S2 further includes the following steps:

[0018] S21, cleaning the workpiece to be polished after polishing is completed;

[0019] S22, after cleaning is completed, the workpiece to be polished is dried;

[0020] S23: After drying is completed, the surface roughness of the workpiece to be polished is detected.

[0021] Compared with the prior art, the present invention has achieved the following beneficial technical effects:

[0022] The anode plate assembly in the present invention includes two anode plates arranged opposite to each other, and the two anode plates are respectively located on both sides of the polishing channel. Similarly, the cathode plate assembly includes two cathode plates arranged opposite to each other, and the two cathode plates are respectively located on both sides of the polishing channel. In the present invention, the workpiece to be polished moves in the polishing channel for polishing and does not contact the anode plate or the cathode plate. Precision electrolytic polishing is performed on different curved surfaces of the metal workpiece to be polished in a non-contact manner. When an electric field is applied to the electrolyte in the electrolytic cell, when the metal workpiece passes through the electrode, a bipolar induced current is generated in the sample, and then electrolytic polishing is performed on the rougher and uneven surfaces of the metal workpiece to make it smooth and bright, thereby improving the polishing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 This is a front view of the electrolytic polishing device in an embodiment of the present invention;

[0025] Figure 2 A top view of an electrolytic polishing device according to an embodiment of the present invention;

[0026] Figure 3 This is a side view of the electrolytic polishing device installed on the bracket in an embodiment of the present invention;

[0027] Figure 4 Schematic side view of a single pair of electrodes arranged in opposite directions in an embodiment of the present invention;

[0028] Figure 5 Schematic top view of the polarization working area in an embodiment of the present invention;

[0029] Figure 6 Schematic top view of the relative positions of the positive and negative electrodes, the baffle and the workpiece in an embodiment of the present invention;

[0030] Figure 7 This is a curve diagram showing the effect of electricity per unit area on polishing degree;

[0031] Among them, 1 is the cathode plate, 2 is the anode plate, 3 is the partition, 4 is the jet hole, 5 is the electrode plate assembly, 6 is the acid-resistant pump, 7 is the electrolyte tank, 8 is the polishing channel, 9 is the anode electrode, 10 is the cathode electrode, 11 is the workpiece, 12 is the path a for the current to be conducted through the workpiece, 13 is the path b for the current to bypass the partition through the electrolyte, 14 is the workpiece, 15 is the anode electrode, 16 is the cathode electrode, and 17 is the partition. DETAILED DESCRIPTION

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0033] The object of the present invention is to provide an electrolytic polishing device, system and method to solve the problems existing in the above-mentioned prior art and to improve the polishing effect and uniformity of the workpiece to be polished.

[0034] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0035] Example 1

[0036] like Figure 1-Figure 3 As shown, this embodiment provides an electrolytic polishing device, including an electrolytic cell, which is used to contain electrolyte. A polishing channel 8 for a workpiece to be polished is provided in the electrolytic cell. An anode plate assembly and a cathode plate assembly are also provided in the electrolytic cell along the extension direction of the polishing channel 8. The anode plate assembly and the cathode plate assembly are separated by a partition assembly; wherein, the anode plate assembly includes two anode plates 2 arranged opposite to each other, and the two anode plates 2 are respectively located on both sides of the polishing channel 8; the cathode plate assembly includes two cathode plates 1 arranged opposite to each other, and the two cathode plates 1 are respectively located on both sides of the polishing channel 8; the partition assembly includes two partitions 3 arranged opposite to each other, and the two partitions 3 are respectively located on both sides of the polishing channel 8; wherein both the anode plate assembly and the cathode plate assembly can be connected to a power supply.

[0037] In this embodiment, the workpiece to be polished moves within the polishing channel 8 for polishing without contact with the anode plate 2 or cathode plate 1. Precision electrolytic polishing is performed on the various curved surfaces of the metal workpiece in a non-contact manner. When an electric field is applied to the electrolyte in the electrolytic cell, a bipolar inductive current is generated in the sample as the metal workpiece passes through the electrodes. This electrolytic polishing targets the rougher and more uneven areas of the metal workpiece, smoothing and brightening them and improving the polishing effect. As the workpiece moves through the polishing channel 8, the polarization between the cathode plate 1 and the anode plate 2 creates a bipolar phenomenon with both high and low potential areas on the workpiece. Electrolytic oxidation occurs in the high potential area (near the anode plate 2), dissolving the rough surface and achieving a superior polishing effect.

[0038] In this embodiment, multiple anode plate assemblies and cathode plate assemblies are provided, and multiple anode plate assemblies and multiple cathode plate assemblies are arranged alternately; wherein, the number of anode plate assemblies and cathode plate assemblies can be selected according to specific work needs, specifically, adjusted according to production speed requirements. The higher the production speed required, the more pairs of electrode pairs are required.

[0039] As a preferred implementation, in this embodiment, only one anode plate assembly is provided and is located in the middle of the electrolytic cell, and two cathode plate assemblies are provided, and the two cathode plate assemblies are respectively located on both sides of the anode plate assembly.

[0040] In this embodiment, non-contact polishing is adopted, and multiple pairs of electrodes are provided. The current density between each pair of electrodes is uniform, and the workpiece to be polished is induced to generate a bipolar phenomenon. Since electrolytic oxidation occurs in the area close to the anode plates 2, the effect of uniformly polishing the rough areas can be achieved. At the same time, this embodiment realizes the bipolar potential gradient effect of simultaneous oxidation and reduction treatment on the workpiece to be polished. Compared with the traditional anodic electrolytic polishing process, the generation of oxides on the surface of the finished product will be greatly reduced, which will be more conducive to the progress of the next process.

[0041] In this embodiment, a partition assembly is further provided between the two cathode plate assemblies and the side wall of the electrolytic cell; wherein, the number of the partition assemblies can be adjusted according to work needs; as a preferred embodiment, a group of partition assemblies is provided between the cathode plate assembly and the side wall of the electrolytic cell, and two groups of partition assemblies are provided between adjacent cathode plate assemblies and anode plate assemblies.

[0042] In this embodiment, the electrolytic polishing device also includes an electrolytic tank 7, which is connected to the electrolytic tank and is used to provide electrolyte to the electrolytic tank; specifically, the electrolyte tank 7 is located below the electrolytic tank and can surround the bottom of the electrolytic tank; the electrolytic tank is provided with an opening on the side wall along the extension direction of the polishing channel 8, and the electrolyte in the electrolytic tank can fall into the electrolyte tank 7 through the opening; the electrolyte tank 7 is also connected to the electrolytic tank through a pipeline and an acid-resistant pump 6, and can provide electrolyte to the electrolytic tank.

[0043] In this embodiment, an electrolyte cavity is provided at the bottom of the electrolytic cell, the electrolyte tank 7 is connected to the electrolyte cavity through a pipeline, and a spray hole 4 is provided at the top of the electrolyte cavity for spraying electrolyte into the electrolytic cell to achieve uniform mass transfer of electrolysis products in the electrolyte.

[0044] This embodiment also provides an electrolytic polishing system, including a cleaning device and the above-mentioned electrolytic polishing device. The cleaning device can clean the workpiece to be polished after polishing is completed; wherein, the cleaning device is preferably a cleaning tank, and a cleaning liquid is provided in the cleaning tank for cleaning the workpiece to be polished.

[0045] This embodiment also provides an electrolytic polishing method, which uses the above-mentioned electrolytic polishing device and includes the following steps:

[0046] S1. After connecting the positive and negative poles of the power supply, place the workpiece to be polished into the polishing channel 8 with sufficient electrolyte and move along the polishing channel 8 for polishing; when polishing, use 900-1000kCm -2 The amount of electricity used to control the time it takes for the workpiece to be polished to pass through;

[0047] S2. After the workpiece is polished, the circuit is disconnected and the workpiece is taken out.

[0048] In this embodiment, the following steps are further included after step S2:

[0049] S21, immersing the workpiece to be polished after polishing into a cleaning tank filled with sufficient cleaning liquid for cleaning;

[0050] S22, after cleaning for a certain period of time, taking the workpiece to be polished out of the cleaning tank and drying it;

[0051] S23. After drying, the surface roughness of the workpiece to be polished is detected. After polishing, the surface roughness Sa (um) of the metal workpiece can be reduced to 0.07-0.09.

[0052] like Figure 4-Figure 6 As shown, in this embodiment, through detailed decomposition, according to the relative efficiency between the electrodes in each electrolytic cell, it is divided into single-pair electrode opposite arrangement, multiple-pair electrode parallel arrangement and single-pair electrode parallel arrangement. The processing results are tested in these three groups, and the polishing effect is tested in two groups with the workpiece statically placed in the anode and cathode polarized area. Figure 6 The relative positions of the cathode and anode electrodes, the baffle, and the workpiece are explained. The roughness Sa value is measured using an optical surface profiler (Sensorfar) to demonstrate surface differences and demonstrate polarization ability and polishing effect.

[0053] Specifically, if Figure 4 As shown, the workpiece is placed between two electrodes in a beaker to simulate the configuration of independent electric fields between each pair of electrodes in the electrolytic polishing device, so that the surface facing the cathode electrode generates an induced anode, causing electrolytic oxidation to occur, thereby achieving the purpose of surface polishing, and achieving different degrees of polishing effect depending on the amount of electricity provided.

[0054] like Figure 5 As shown, when the workpiece is placed in the electrolytic polishing device and is in a stationary state and supplied with 900-1000kCm -2 The area facing the cathode electrode can be obtained as follows Figure 4 The same results were obtained in the beaker, proving that the polishing effect was achieved through polarization capability.

[0055] Electricity (kCm -2 ) is an important factor affecting the degree of polishing. At the same time, polishing efficiency also needs to be considered. Figure 6 As shown, the relative positions of the electrode, workpiece and baffle will affect the polishing efficiency; the electrolytic polishing device will also control the distance between the cathode and the anode and the relative position between the baffles. The current is conducted from the cathode 16 and will be conducted to the anode 15 through the path a12 and the path b13 at the same time.

[0056] When path a is smaller than path b, since path a is shorter and has a smaller resistance value, more current is transmitted to the workpiece via path a, thereby achieving higher polishing efficiency.

[0057] When path a is larger than path b, since path a is longer and has a larger resistance value, more current flows through path b, which reduces the polishing efficiency.

[0058] like Figure 7 As shown, the reaction charge (kCm -2 ) to 150, the surface roughness Sa value will increase first; and when it reaches 750kCm -2 When the temperature drops, it starts to decrease and is greater than 900kCm -2 When the surface is polished, the roughness begins to be reduced and the polishing effect is achieved.

[0059] It should be noted that it is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, from all perspectives, the embodiments should be regarded as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the foregoing description. It is intended that all changes that fall within the meaning and range of equivalents of the claims be included in the present invention, and any reference signs in the claims should not be construed as limiting the claims to which they relate.

[0060] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only intended to help understand the method and core concept of the present invention. At the same time, those skilled in the art will find that the specific implementation methods and application scopes may vary based on the concept of the present invention. In summary, the contents of this specification should not be construed as limiting the present invention.

Claims

1. An electrolytic polishing device, characterized in that: The invention comprises an electrolytic cell, wherein the electrolytic cell is used to contain electrolyte, a polishing channel for a workpiece to be polished is provided in the electrolytic cell, an anode plate assembly and a cathode plate assembly are also provided in the electrolytic cell along the extension direction of the polishing channel, the anode plate assembly and the cathode plate assembly are separated by a partition assembly, a plurality of the anode plate assemblies and the cathode plate assemblies are provided, and the plurality of the anode plate assemblies and the plurality of the cathode plate assemblies are alternately arranged; the anode plate assembly comprises two anode plates arranged opposite to each other, and the two anode plates are respectively located on both sides of the polishing channel; the cathode plate assembly comprises two anode plates arranged opposite to each other, and the two anode plates are respectively located on both sides of the polishing channel; the cathode plate assembly comprises two anode plates arranged opposite to each other, and the cathode plate assembly comprises two cathode ... The polishing channel comprises two cathode plates disposed on the polishing channel, the two cathode plates being located on either side of the polishing channel; the partition plate assembly comprises two partition plates disposed opposite to each other, the two partition plates being located on either side of the polishing channel; wherein the anode plate and the cathode plate are both perpendicular to the polishing channel, and the anode plate assembly and the cathode plate assembly are both capable of being connected to a power source; when the workpiece to be polished moves through the polishing channel, the polarization between the cathode plate and the anode plate causes a bipolar phenomenon of high potential and low potential areas to be simultaneously generated on the workpiece to be polished, and the workpiece to be polished undergoes electrolytic oxidation in the high potential area; The electrolytic polishing device also includes an electrolyte tank, which is connected to the electrolytic tank and is used to provide electrolyte to the electrolytic tank; the electrolyte tank is located below the electrolytic tank and can surround the bottom of the electrolytic tank; the electrolytic tank is provided with an opening on the side wall along the extension direction of the polishing channel, and the electrolyte in the electrolytic tank can fall into the electrolyte tank through the opening; the electrolyte tank is also connected to the electrolytic tank through a pipeline and an acid-resistant pump, and can provide electrolyte to the electrolytic tank; an electrolyte cavity is provided at the bottom of the electrolytic tank, the electrolyte tank is connected to the electrolyte cavity through the pipeline, and a spray hole is provided on the top of the electrolyte cavity for spraying electrolyte into the electrolytic tank.

2. The electrolytic polishing device according to claim 1, characterized in that: One anode plate assembly is provided, and two cathode plate assemblies are provided. The two cathode plate assemblies are respectively located on both sides of the anode plate assembly.

3. The electrolytic polishing device according to claim 2, characterized in that: The separator assembly is arranged between the two cathode plate assemblies and the side wall of the electrolytic cell.

4. An electrolytic polishing system, characterized in that: It comprises a cleaning device and the electrolytic polishing device as described in any one of claims 1 to 3, and the cleaning device can clean the workpiece to be polished after polishing is completed.

5. An electrolytic polishing method, characterized in that: The electrolytic polishing device according to any one of claims 1 to 3 comprises the following steps: S1, placing the workpiece to be polished into the polishing channel, and moving along the polishing channel for polishing; S2. After the workpiece to be polished is polished, it is taken out.

6. The electrolytic polishing method according to claim 5, characterized in that: The step S2 further includes the following steps: S21, cleaning the workpiece to be polished after polishing is completed; S22, after cleaning is completed, the workpiece to be polished is dried; S23: After drying is completed, the surface roughness of the workpiece to be polished is detected.

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