Microphone and head-mounted display device

Abstract

A microphone and a head-mounted display device are disclosed. The microphone includes a base, at least one sound receiving element, and a flexible circuit board. The base has a plurality of support portions, a plurality of shock absorbing portions, and a load bearing portion. The plurality of support portions are spaced apart from each other. Each of the plurality of shock absorbing portions is disposed on an inner side of a corresponding support portion. The load bearing portion connects the plurality of shock absorbing portions and is suspended between the plurality of support portions. The at least one sound receiving element is disposed on the base. The flexible circuit board is disposed on the base and has a first transmission segment. The first transmission segment is electrically coupled to the at least one sound receiving element, and the first transmission segment has a plurality of bending portions. Thus, the microphone has a shock absorbing function and can absorb and block vibrations to avoid interference during sound reception.

Description

TECHNICAL FIELD

[0001] The present application relates to a microphone, and particularly to a microphone with shock absorption function, and to a head-mounted display device with the microphone with shock absorption function. BACKGROUND

[0002] A microphone is a transducer that converts sound waves into electronic signals, and is mainly used to receive sound sources such as environmental sound and human voice. The microphone is often applied to consumer electronic products such as smart phones, notebook computers, and head-mounted display devices. The existing microphone is usually fixed on the shell of the electronic product by pasting or locking. In this case, the microphone and the shell are in contact with each other, so that the vibration of the shell is directly transmitted to the microphone, and the noise derived from the vibration will cause poor voice signal quality. SUMMARY

[0003] The present application provides a microphone with shock absorption function, which can absorb and block vibration to avoid interference during sound reception.

[0004] The present application provides a head-mounted display device with a microphone with shock absorption function, which can absorb and block vibration to avoid interference during sound reception.

[0005] A microphone of the present application includes a base, at least one sound receiving element, and a flexible circuit board. The base has a plurality of support portions, a plurality of shock absorption portions, and a load bearing portion. The plurality of support portions are arranged at intervals. Each of the plurality of shock absorption portions is arranged on the inner side of the corresponding support portion. The load bearing portion connects the plurality of shock absorption portions and is suspended between the plurality of support portions. The at least one sound receiving element is arranged on the base. The flexible circuit board is arranged on the base and has a first transmission segment. The first transmission segment is electrically coupled to the at least one sound receiving element, and the first transmission segment has a plurality of bending portions.

[0006] A microphone of the present application includes a base, at least one sound receiving element, and a flexible circuit board. The base has a plurality of support portions, a plurality of shock absorption portions, and a load bearing portion. The plurality of support portions are arranged at intervals. Each of the plurality of shock absorption portions is arranged on the inner side of the corresponding support portion. The load bearing portion connects the plurality of shock absorption portions and is suspended between the plurality of support portions. The at least one sound receiving element is arranged on the base. The flexible circuit board is arranged on the base and has a first transmission segment. The first transmission segment is electrically coupled to the at least one sound receiving element. The first transmission segment includes a first bending portion, a second bending portion, a third bending portion, a fourth bending portion, a first linear portion, a second linear portion, a third linear portion, and a fourth linear portion. The first linear portion is connected between the connection segment of the flexible circuit board and the first bending portion. The second linear portion is connected between the first bending portion and the second bending portion. The third linear portion is connected between the second bending portion and the third bending portion, and the fourth linear portion is connected between the third bending portion and the fourth bending portion.

[0007] A head-mounted display device of the present application includes a main housing, a lens assembly, a harness assembly, and a microphone. The lens assembly is disposed on the main housing. The harness assembly connects the main housing to form a wearing space. The microphone is disposed on the main housing and adjacent to the lens assembly. The microphone includes a base, at least one sound receiving element, and a flexible circuit board. The base has a plurality of support portions, a plurality of shock absorbing portions, and a load bearing portion. The plurality of support portions are spaced apart from each other. Each of the plurality of shock absorbing portions is disposed on an inner side of a corresponding support portion. The load bearing portion connects the plurality of shock absorbing portions and is suspended between the plurality of support portions. The at least one sound receiving element is disposed on the base. The flexible circuit board is disposed on the base and has a first transmission segment. The first transmission segment is electrically coupled to the at least one sound receiving element, and the first transmission segment has a plurality of curved portions. The first linear portion and the third linear portion are parallel to each other, the second linear portion and the fourth linear portion are parallel to each other, and the first linear portion and the third linear portion are perpendicular to the second linear portion and the fourth linear portion.

[0008] Based on the above, in the present application, the sound receiving element is mounted on the base such that the sound receiving element is in a suspended state in the base. When the microphone is mounted on the main housing of the head-mounted display device, the sound receiving element does not directly touch the main housing of the head-mounted display device. In addition, the base has a plurality of shock absorbing portions, which are respectively located on both sides of the sound receiving element. During use of the microphone, vibrations from the head-mounted display device or the environment are absorbed by the plurality of shock absorbing portions of the base, so that the sound receiving element is not affected by the vibrations, to reduce noise derived from the vibrations.

[0009] Further, in the present application, the flexible circuit board with a plurality of curved portions is used, which can avoid the transmission of vibrations from the flexible circuit board to the sound receiving element, to avoid the interference of the sound receiving algorithm of the microphone by the vibrations. BRIEF DESCRIPTION OF DRAWINGS

[0010] The accompanying drawings are included to provide a further understanding of the present application, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present application and, together with the description, serve to explain the principles of the present application.

[0011] FIG. 1A is a perspective view of a microphone of an embodiment of the present application;

[0012] FIG. 1B is a top view of the microphone of FIG. 1A ;

[0013] FIG. 1C is a front view of the microphone of FIG. 1A ;

[0014] FIG. 1D is a front view of the microphone of FIG. 1Aa front view planar schematic diagram of a microphone of another embodiment of the present application;

[0015] FIG. 2A a perspective schematic diagram of a microphone of another embodiment of the present application;

[0016] FIG. 2B a FIG. 2A a top view schematic diagram of a microphone of another embodiment of the present application;

[0017] FIG. 2C a FIG. 2A a front view schematic diagram of a microphone of another embodiment of the present application;

[0018] FIG. 3A a perspective schematic diagram of a head-mounted display device of an embodiment of the present application;

[0019] FIG. 3B a FIG. 3A an exploded schematic diagram of a head-mounted display device of another embodiment of the present application;

[0020] FIG. 3C a FIG. 3A a partial enlarged schematic diagram of a microphone and a main housing of a head-mounted display device of another embodiment of the present application.

[0021] BRIEF DESCRIPTION OF THE DRAWINGS

[0022] 100, 100B: microphone;

[0023] 110, 110b: base;

[0024] 111, 111b: support portion;

[0025] 112, 112a, 112b: shock absorbing portion;

[0026] 113, 113a, 113b: load bearing portion;

[0027] 114: fixing portion;

[0028] 120, 120b: sound receiving element;

[0029] 130, 130b: flexible circuit board;

[0030] 131: connection segment;

[0031] 132, 132b: first transmission segment;

[0032] 133: second transmission segment;

[0033] 134: expansion segment;

[0034] 140: signal processing element;

[0035] 200: head-mounted display device;

[0036] 210: main housing

[0037] 211: fastening post

[0038] 212: fastener

[0039] 220: lens assembly

[0040] 221: lens

[0041] 230: band assembly

[0042] AS: accommodation space

[0043] C1: first curved portion

[0044] C2: second curved portion

[0045] C3: third curved portion

[0046] C4: fourth curved portion

[0047] CL: conductive line

[0048] BS: bottom surface

[0049] B1: first bottom surface

[0050] B2: second bottom surface

[0051] B3: third bottom surface

[0052] H1: first height difference

[0053] H2: second height difference

[0054] H3: third height difference

[0055] IS: inner side surface

[0056] LH: linear length

[0057] OP: perforation

[0058] OS: outer side surface

[0059] L1: first linear portion

[0060] L2: second linear portion

[0061] L3: third linear portion

[0062] L4: fourth linear portion

[0063] RL: rigid layer

[0064] TH: through hole

[0065] T1: first top surface;

[0066] T2: second top surface. DETAILED DESCRIPTION

[0067] Reference will now be made in detail to the exemplary embodiments of the present application, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.

[0068] Reference FIGS. 1A-1C In one embodiment of the present application, a microphone 100 includes a base 110, at least one sound receiving element 120, and a flexible circuit board 130. The microphone is a transducer that converts sound waves into electronic signals, and is suitable for use in consumer electronic products such as smart phones, notebook computers, head-mounted display devices, and the like. Types of head-mounted display devices include helmet-mounted display devices, eyecup display devices, and eyeglass display devices.

[0069] The base 110 is made of a shock-absorbing material, such as silicone, rubber, or other materials having shock-absorbing properties, but is not limited thereto. In detail, the base 110 has a plurality of support portions 111, a plurality of damping portions 112, and a load bearing portion 113. The support portions 111 are spaced apart from each other. Each of the damping portions 112 is disposed on an inner side surface IS of a corresponding support portion 111. Each of the damping portions 112 extends from the inner side surface IS of the corresponding support portion 111 and is perpendicular to the inner side surface IS. The load bearing portion 113 connects the damping portions 112 and is suspended between the support portions 111.

[0070] Reference FIGS. 1A-1C In detail, the load bearing portion 113 overlaps two damping portions 112, and a first bottom surface B1 of the load bearing portion 113 and a second bottom surface B2 of the corresponding damping portion 112 have a first height difference H1, and a first top surface T1 of the load bearing portion 113 and a second top surface T2 of the corresponding damping portion 112 have a second height difference H2. In addition, the second bottom surface B2 of each of the damping portions 112 and a third bottom surface B3 of the corresponding support portion 111 have a third height difference H3, such that the damping portions 112 support the load bearing portion 113 to be suspended between the support portions 111.

[0071] In the present embodiment, the number of the at least one sound receiving element 120 is one, and the sound receiving element 120 is disposed on the base 110. In other embodiments, the number of the at least one sound receiving element is a plurality, but is not limited thereto.

[0072] In addition, the bearing portion 113 is in a suspended structure to avoid directly touching the shell of the electronic product, so as to greatly reduce the vibration received by the sound receiving element 120 from the shell to reduce the noise derived from the vibration. In addition, the base 110 has a shock absorption feature. When the vibration is transmitted to the base 110, the vibration can be absorbed by the two shock absorbing portions 112, and the sound receiving element 120 can also be prevented from being disturbed, thereby improving the sound quality of the sound receiving element 120.

[0073] The flexible circuit board 130 is disposed on the base 110 and has a connection segment 131, a first transmission segment 132 and a second transmission segment 133. The connection segment 131 is disposed on the first top surface T1 of the bearing portion 113 and is electrically coupled to the first transmission segment 132. The first transmission segment 132 is electrically coupled to the sound receiving element 120 and is used to transmit the electronic signal converted by the sound receiving element 120 to the second transmission segment 133. The second transmission segment 133 is adapted to connect the sound source port of the electronic product, and transmit the electronic signal to the corresponding electronic element of the electronic product through the sound source port to perform functions such as voice control, recording or voice recognition.

[0074] Reference FIG. 1B and FIG. 1C The connection segment 131 of the flexible circuit board 130 is disposed on the first top surface T1 of the bearing portion 113. The sound receiving element 120 is disposed on the connection segment 131 and is supported by the bearing portion 113. In addition, the bearing portion 113 has a rigid layer RL located on the first top surface T1 of the bearing portion 113. The connection segment 131 of the flexible circuit board 130 is disposed on the rigid layer RL. The rigid layer RL can serve as an adhesive area of the bearing portion 113 and improve the overall rigidity of the bearing portion 113, so that the sound receiving element 120 can be stably positioned on the bearing portion 113.

[0075] Reference FIG. 1A and FIG. 1B The first transmission segment 132 of the flexible circuit board 130 has a plurality of curved portions, a first linear portion L1, a second linear portion L2, a third linear portion L3 and a fourth linear portion L4. The curved portions include a first curved portion C1, a second curved portion C2, a third curved portion C3 and a fourth curved portion C4.

[0076] The first linear portion L1 is connected between the connecting segment 131 of the flexible circuit board 130 and the first curved portion C1, the second linear portion L2 is connected between the first curved portion C1 and the second curved portion C2, the third linear portion L3 is connected between the second curved portion C2 and the third curved portion C3, and the fourth linear portion L4 is connected between the third curved portion C3 and the fourth curved portion C4. The first linear portion L1 is perpendicular to the base 110, the second linear portion L2 extends from one end of the first linear portion L1 away from the base 110 and is parallel to the base 110, and the third linear portion L3 extends from one end of the second linear portion L2 away from the first linear portion L1 and is parallel to the first linear portion L1. The fourth linear portion L4 extends from one end of the third linear portion L3 away from the second linear portion L2 and is parallel to the second linear portion L2.

[0077] Therefore, the first linear portion L1 and the third linear portion L3 are parallel to each other, the second linear portion L2 and the fourth linear portion L4 are parallel to each other, the first linear portion L1 and the third linear portion L3 are perpendicular to the second linear portion L2 and the fourth linear portion L4, and the length of the second linear portion L2 is greater than the length of the fourth linear portion L4. Since the first transmission segment 132 of the flexible circuit board 130 has a plurality of curved portions (C1-C4) and is configured with the first linear portion L1, the second linear portion L2, the third linear portion L3 and the fourth linear portion L4 which are sequentially perpendicular to each other, the flexible circuit board 130 has a soft characteristic. When vibration is transmitted along the second transmission segment 133 to the first transmission segment 132, the curved portions (C1-C4) can avoid the vibration to be transmitted linearly to the base 110 and the sound receiving element 120, so as to reduce the noise derived from the vibration.

[0078] Reference FIGS. 1A-1C The flexible circuit board 130 further has an extension segment 134. The extension segment 134 is connected between the first transmission segment 132 and the second transmission segment 133. The width of the extension segment 134 is greater than the width of the first transmission segment 132 and the second transmission segment 133. The microphone 100 further includes a signal processing element 140. The signal processing element 140 is disposed on the extension segment 134 of the flexible circuit board 130 and is electrically coupled to the sound receiving element 120 through the first transmission segment 132. The signal processing element 140 is used to process the electronic signal generated by the sound receiving element 120. The signal processing element 140 is, for example, an amplifier, a filter, a voltage stabilizer or the like, but is not limited thereto.

[0079] Reference FIGS. 1A-1CThe linear length LH of the signal processing element 140 relative to the sound receiving element 120 is less than the total length of the first transmission segment 132. In this embodiment, the total length of the first transmission segment 132 extending from the connecting segment 131 to the extension segment 134 is equal to or less than 5 cm, so as to reduce the volume of the microphone 100. If the total length of the first transmission segment 132 is equal to or less than 5 cm, it is helpful for the signal processing element 140 to stably process the signal from the sound receiving element 120. For example, if the total length of the first transmission segment 132 is equal to or less than 5 cm, it is helpful for the capacitance of the signal processing element 140 to stabilize the voltage of the sound receiving element 120. In addition, if the total length of the first transmission segment 132 is equal to or less than 5 cm, it is helpful for the debug of the sound receiving element 120 when the sound receiving element 120 has a problem.

[0080] Referring to FIGS. 1A-1C The base 110 also has a plurality of fixing portions 114. Each of the plurality of fixing portions 114 is disposed on the outer wall surface OS of the corresponding support portion 111 and relative to the corresponding shock absorbing portion 112. Each of the plurality of fixing portions 114 has a through hole OP and is adapted to combine with a fastener (e.g., a screw) to fasten the base 110 to the housing of the electronic device. In other embodiments, the fixing portion has a snap structure to snap to the housing of the electronic device to secure the base to the housing of the electronic device.

[0081] Referring to FIG. 1D In another embodiment, the carrier portion 113a and the two shock absorbing portions 112a can also be integrally formed and present a flat plate structure, that is, the carrier portion 113a and the two shock absorbing portions 112a are isohypse without height difference.

[0082] Referring to FIGS. 2A-2C The microphone 100B of another embodiment of the present application is different from the microphone 100 of FIG. 1A The difference between the two is that the first transmission segment 132b of the flexible circuit board 130b is disposed on the corresponding support portion 111b. The sound receiving element 120b is disposed on the first top surface T1 of the carrier portion 113b. A plurality of conductive wires CL are disposed on the carrier portion 113b, the corresponding shock absorbing portion 112b, and the corresponding support portion 111b and electrically couple the sound receiving element 120b and the first transmission segment 132b of the flexible circuit board 130b. In this embodiment, the sound receiving element 120b is directly fixed on the first top surface T1 of the carrier portion 113b and the conductive wires CL are connected by welding. Since the sound receiving element 120b is mounted on the base 110b that can absorb shock, noise derived from shock is reduced.

[0083] Referring to FIG. 2B and FIG. 2CThe carrier portion 113b has a rigid layer RL. The rigid layer RL is located on the first top surface T1 of the carrier portion 113b, and the sound receiving element 120b is disposed on the rigid layer RL. The rigid layer RL can serve as an adhesive area of the carrier portion 113b and improve the overall rigidity of the carrier portion 113b, so that the sound receiving element 120b can be stably positioned on the carrier portion 113b.

[0084] With reference to FIG. 3A , FIG. 3B and FIG. 1A , an embodiment of a head-mounted display device 200 of the present disclosure includes a main housing 210, a lens assembly 220, a harness assembly 230, and a microphone 100.

[0085] The main housing 210 has an accommodation space AS and two through holes TH. The two through holes TH are formed through a bottom surface BS of the main housing 210. The lens assembly 220 is disposed on the bottom surface BS of the main housing 210 and is arranged through the two through holes TH, so that two lenses 221 of the lens assembly 220 protrude outside the main housing 210. The harness assembly 230 is connected to the main housing 210 to form a wearing space. The microphone 100 is disposed in the accommodation space AS of the main housing 210 and is adjacent to the lens assembly 220.

[0086] With reference to FIG. 1A , each of the plurality of fixing portions 114 of the base 110 is disposed on an outer wall surface OS of the corresponding support portion 111 and is opposite to the corresponding shock-absorbing portion 112. Each of the plurality of fixing portions 114 has a through hole OP. The main housing 210 further has a plurality of fastening posts 211 (e.g., threaded posts) and a plurality of fasteners 212 (e.g., screws). Each of the plurality of fastening posts 211 is located in the through hole OP of the corresponding fixing portion 114. Each of the plurality of fasteners 212 is arranged through the corresponding through hole OP and is screwed into the corresponding fastening post 211, so as to fasten the base 110 to the bottom surface BS of the main housing 210. With reference to FIG. 3C , the carrier portion 113 of the base 110 is spaced apart from the bottom surface BS of the main housing 210, i.e., the carrier portion 113 is suspended above the bottom surface BS of the main housing 210.

[0087] In summary, in the present disclosure, the sound receiving element is mounted on the base, so that the sound receiving element is in a suspended state in the base. When the microphone is mounted on the main housing of the head-mounted display device, the sound receiving element does not directly touch the bottom surface of the head-mounted display device. In addition, the base has a plurality of shock-absorbing portions located on both sides of the sound receiving element. During use of the microphone, vibrations from the head-mounted display device or the environment are absorbed by the plurality of shock-absorbing portions of the base, so that the sound receiving element is not affected by the vibrations, thereby reducing noise derived from the vibrations.

[0088] Further, in the present application, the flexible circuit board with multiple bending portions is adopted, so that the vibration can be avoided from being directly transmitted from the flexible circuit board to the sound receiving element, and the sound receiving algorithm of the microphone can be avoided from being disturbed by the vibration.

Claims

1. A microphone, characterized by Comprising: a base having a plurality of support portions, a plurality of shock absorbing portions, and a load bearing portion, wherein the plurality of support portions are spaced apart from each other, each of the plurality of shock absorbing portions is disposed on an inner side of a corresponding one of the support portions, and the load bearing portion connects the plurality of shock absorbing portions and is suspended between the plurality of support portions; at least one sound receiving element disposed on the base; and a flexible circuit board disposed on the base and having a first transmission segment, wherein the first transmission segment is electrically coupled to the at least one sound receiving element, and the first transmission segment has a plurality of bending portions.

2. The microphone of claim 1, wherein the plurality of bending portions comprises a first bending portion, a second bending portion, a third bending portion, and a fourth bending portion, the first transmission segment has a first linear portion, a second linear portion, a third linear portion, and a fourth linear portion, the first linear portion is connected between the base and the first bending portion, the second linear portion is connected between the first bending portion and the second bending portion, the third linear portion is connected between the second bending portion and the third bending portion, the fourth linear portion is connected between the third bending portion and the fourth bending portion, the first linear portion and the third linear portion are parallel to each other, the second linear portion and the fourth linear portion are parallel to each other, and the first linear portion and the third linear portion are perpendicular to the second linear portion and the fourth linear portion.

3. The microphone of claim 2, wherein a length of the second linear portion is greater than a length of the fourth linear portion.

4. The microphone of claim 1, wherein the load bearing portion overlaps the plurality of shock absorbing portions, a first bottom surface of the load bearing portion and a second bottom surface of a corresponding one of the shock absorbing portions have a first height difference, and a first top surface of the load bearing portion and a second top surface of a corresponding one of the shock absorbing portions have a second height difference.

5. The microphone of claim 1, wherein a second bottom surface of each of the plurality of shock absorbing portions and a third bottom surface of a corresponding one of the support portions have a third height difference, and the plurality of shock absorbing portions support the load bearing portion to be suspended between the plurality of support portions.

6. The microphone of claim 1, wherein the flexible circuit board has a connection segment disposed on the first top surface of the load bearing portion and electrically coupled to the first transmission segment, and the at least one sound receiving element is disposed on the connection segment and supported by the load bearing portion.

7. The microphone of claim 1, wherein the first transmission segment is disposed on a corresponding one of the support portions, the at least one sound receiving element is disposed on the first top surface of the load bearing portion, a plurality of conductive wires are disposed on the load bearing portion, a corresponding one of the shock absorbing portions, and a corresponding one of the support portions, and the plurality of conductive wires electrically couple the at least one sound receiving element and the first transmission segment.

8. The microphone of claim 6, wherein the connection segment of the flexible circuit board is disposed on the rigid layer. ​ ​ 9. The microphone of claim 7, wherein the carrier portion has a rigid layer, the rigid layer is located on the first top surface of the carrier portion, and the at least one sound receiving element is disposed on the rigid layer.

10. The microphone of claim 2, wherein the flexible circuit board further has a second transmission segment and an extension segment, the extension segment is connected between the first transmission segment and the second transmission segment, and a width of the extension segment is greater than widths of the first transmission segment and the second transmission segment.

11. The microphone of claim 10, further comprising: a signal processing element disposed on the extension segment of the flexible circuit board and electrically coupled to the at least one sound receiving element through the first transmission segment.

12. The microphone of claim 11, wherein a straight line length of the signal processing element relative to the at least one sound receiving element is less than a total length of the first transmission segment.

13. The microphone of claim 1, wherein the base further has a plurality of securing portions, each of the plurality of securing portions is disposed on an outer wall surface of a corresponding one of the support portions, and each of the plurality of securing portions has a through hole.

14. The microphone of claim 1, wherein a material of the base comprises rubber or silicone.

15. A microphone, comprising: including: a base having a plurality of support portions, a plurality of shock absorbing portions, and a carrier portion, wherein the plurality of support portions are spaced apart from each other, each of the plurality of shock absorbing portions is disposed on an inner side surface of a corresponding one of the support portions, and the carrier portion connects the plurality of shock absorbing portions and is suspended between the plurality of support portions; at least one sound receiving element disposed on the base; and a flexible circuit board disposed on the base and having a first transmission segment, wherein the first transmission segment is electrically coupled to the at least one sound receiving element, wherein the first transmission segment includes a first curved portion, a second curved portion, a third curved portion, a fourth curved portion, a first linear portion, a second linear portion, a third linear portion, and a fourth linear portion, the first linear portion is connected between the base and the first curved portion, the second linear portion is connected between the first curved portion and the second curved portion, the third linear portion is connected between the second curved portion and the third curved portion, the fourth linear portion is connected between the third curved portion and the fourth curved portion, the first linear portion and the third linear portion are parallel to each other, the second linear portion and the fourth linear portion are parallel to each other, and the first linear portion and the third linear portion are perpendicular to the second linear portion and the fourth linear portion, wherein the carrier portion and the plurality of shock absorbing portions are integrally formed and have a flat plate structure, the carrier portion has a rigid layer, and the rigid layer is located on a first top surface of the carrier portion.

16. The microphone of claim 15, wherein a length of the second linear portion is greater than a length of the fourth linear portion.

17. The microphone of claim 15, wherein a total length of the first transmission segment is equal to or less than 5 centimeters. including:

18. A head-mounted display device, comprising: a main housing; a lens assembly disposed on the main housing; a band assembly connected to the main housing to form a wearing space; and ​ ​ a microphone disposed on the main housing and adjacent to the lens assembly, wherein the microphone comprises: a base having a plurality of support portions, a plurality of shock absorbing portions, and a load bearing portion, wherein the plurality of support portions are spaced apart from each other, each of the plurality of shock absorbing portions is disposed on an inner side of a corresponding one of the support portions, and the load bearing portion connects the plurality of shock absorbing portions and is suspended between the plurality of support portions; at least one sound receiving element disposed on the base; and a flexible circuit board disposed on the base and having a first transmission segment, wherein the first transmission segment electrically couples the at least one sound receiving element, and the first transmission segment has a plurality of bending portions, wherein the load bearing portion and the plurality of shock absorbing portions are integrally formed and have a flat plate structure, the load bearing portion has a rigid layer, and the rigid layer is located on a first top surface of the load bearing portion.

19. The head-mounted display device of claim 18, wherein the base further has a plurality of securing portions, each of the plurality of securing portions is disposed on an outer wall surface of a corresponding one of the support portions, each of the plurality of securing portions has a through hole, the main housing has a plurality of fastening posts and a plurality of fasteners, each of the plurality of fastening posts is located in the through hole of a corresponding one of the securing portions, each of the plurality of fasteners is threaded into the through hole of a corresponding one of the support portions and screwed into a corresponding one of the fastening posts, and the load bearing portion is spaced apart from the main housing.

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