Laser processing apparatus

Abstract

The application provides a laser processing equipment, which comprises a main body and a frame mechanism. The main body comprises a track device and a laser device. The track device comprises a track frame assembly and a mounting assembly. The track frame assembly comprises a track frame and an optical axis provided on the track frame. The mounting assembly comprises a pulley, which is provided with a sliding groove. The sliding groove is in sliding connection with the optical axis. The laser device comprises a shell, a guide optical axis and a processing mechanism. The pulley is rotatably arranged on the shell. The guide optical axis is arranged on the shell. The processing mechanism comprises a laser shell in sliding connection with the guide optical axis and a laser device arranged on the laser shell. The axis of the optical axis is not collinear with the axis of the guide optical axis. The frame mechanism comprises a rack, a bearing assembly and a camera. The rack has a processing space for accommodating the main body. The bearing assembly comprises a mounting rack arranged on the rack and located in the processing space. The mounting rack has a mounting surface facing the processing space. The camera is arranged on the mounting surface of the mounting rack. The laser processing equipment has high processing precision.

Description

Technical Field

[0001] This invention relates to the field of engraving and cutting technology, and in particular to a laser processing device. Background Technology

[0002] Laser processing equipment uses laser light as the processing medium to achieve its processing objectives. Because the equipment does not directly contact the workpiece, it is unaffected by mechanical motion, and the workpiece surface is less prone to deformation. In laser processing equipment, the laser moves along a track assembly to form the processing path. Depending on the workpiece, the laser needs to move relative to the track assembly closer to or further away from the workpiece surface to adjust its distance and ensure processing accuracy. However, existing lasers have low motion accuracy along the track assembly and also low motion accuracy relative to the track assembly, thus affecting the processing precision of the laser processing equipment. Summary of the Invention

[0003] To address the aforementioned problems, this invention provides a laser processing device that can improve processing accuracy.

[0004] This invention provides a laser processing device, comprising: a main body and a frame mechanism;

[0005] The main components include a track system and a laser device;

[0006] The track device includes a track frame assembly and an installation assembly. The track frame assembly includes a track frame and an optical shaft mounted on the track frame. The installation assembly includes a pulley with a groove that is slidably connected to the optical shaft.

[0007] The laser device includes a housing, a guide optical axis, and a processing mechanism. A pulley is rotatably mounted on the housing, the guide optical axis is located on the housing, and the processing mechanism includes a laser housing slidably connected to the guide optical axis and a laser located on the laser housing. The axis of the optical axis is not collinear with the axis of the guide optical axis.

[0008] The frame structure includes a frame, a load-bearing component, and a camera. The frame has a processing space for accommodating the main body. The load-bearing component includes a mounting bracket mounted on the frame and located within the processing space. The mounting bracket has a mounting surface facing the processing space. The camera is mounted on the mounting surface of the mounting bracket.

[0009] The laser processing equipment provided by this invention improves the smoothness and accuracy of the laser device's movement on the track frame by connecting the laser device's housing to a pulley, and then slidingly connecting the pulley to an optical axis. This optical axis guides the laser device's movement, allowing it to move smoothly and precisely along the workpiece surface to the desired position. Furthermore, the guide optical axis guides the movement of the laser housing relative to the track frame, enhancing the smoothness and accuracy of the laser's movement. This ensures the laser moves smoothly and stably towards the workpiece surface to the appropriate distance, improving the processing accuracy of the laser processing equipment. Additionally, by mounting the camera within the frame, repeated adjustments to the laser processing equipment before processing are avoided, further improving processing accuracy and efficiency. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is an exploded three-dimensional structural diagram of a laser processing device provided in one embodiment of the present invention.

[0012] Figure 2 This is a schematic diagram of the main body's three-dimensional structure.

[0013] Figure 3 yes Figure 2 A schematic diagram of the three-dimensional structure.

[0014] Figure 4 yes Figure 3 A three-dimensional structural diagram of the first track device.

[0015] Figure 5 yes Figure 4 A three-dimensional exploded view of the first track device.

[0016] Figure 6 yes Figure 5 A magnified view of the middle V section.

[0017] Figure 7 This is a partial three-dimensional assembly diagram of the first track device.

[0018] Figure 8 This is a schematic diagram of the three-dimensional structure after the second orbital device and the laser device are assembled.

[0019] Figure 9 yes Figure 8 A schematic diagram of the three-dimensional structure.

[0020] Figure 10 yes Figure 9 A magnified view of section IX.

[0021] Figure 11 This is a three-dimensional exploded view of the assembly components of the second orbital device and the laser device.

[0022] Figure 12 This is a three-dimensional structural diagram of the laser device.

[0023] Figure 13 yes Figure 12 A partial sectional view along line XII-XII.

[0024] Figure 14 yes Figure 12 A schematic diagram of the three-dimensional structure.

[0025] Figure 15 yes Figure 14 A three-dimensional structural diagram of the drive component.

[0026] Figure 16 yes Figure 14 A three-dimensional structural diagram of the machining mechanism.

[0027] Figure 17 yes Figure 16 An exploded view of the three-dimensional structure.

[0028] Figure 18 yes Figure 17 A three-dimensional structural diagram of the middle shell.

[0029] Figure 19 It is a three-dimensional structural diagram of the assembled housing, processing device, guide optical axis, drive assembly and second control board.

[0030] Figure 20 yes Figure 12 A top view of the machining mechanism.

[0031] Figure 21 yes Figure 1 A schematic diagram of the three-dimensional structure of the laser processing equipment after assembly.

[0032] Figure 22 yes Figure 21 A three-dimensional structural exploded view of the central frame mechanism.

[0033] Figure 23 yes Figure 21 A partial exploded view of the three-dimensional structure of a laser processing equipment (cover plate omitted) along the O-O direction.

[0034] Figure 24 This is a structural diagram of part of the frame mechanism (the structure on the load-bearing components).

[0035] Figure 25 yes Figure 24 A schematic diagram of a localized explosion structure.

[0036] Figure 26 This is a three-dimensional structural diagram of the laser processing equipment after assembly, viewed from another perspective.

[0037] Figure 27 This is a schematic diagram showing the positional relationship between the camera of the laser processing equipment and the processing surface.

[0038] Figure 28 yes Figure 21 A cross-sectional view along the A-A direction in a laser processing equipment (main body omitted).

[0039] Figure 29 This is a circuit block diagram of a laser processing equipment. Detailed Implementation

[0040] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] Please refer to the following: Figure 1 and Figure 2 This invention provides a laser processing device 1000 for processing workpieces (not shown). In this invention, the laser processing device 1000 processes the workpiece by performing operations such as cutting, engraving, or indentation, so that the processed workpiece meets the user's requirements.

[0042] The laser processing equipment 1000 includes a main body 100 and a frame mechanism 70. The main body 100 is used to process workpieces. The frame mechanism 70 is used to house the main body 100 and the workpieces. The main body 100 precisely processes patterns that meet user requirements on the workpieces through a camera 74 in the frame mechanism 70.

[0043] Please refer to the following: Figure 2 , Figure 3 and Figure 14The main body 100 includes a support device 10, a track device 20, and a laser device 40. The support device 10 supports the track device 20 and the laser device 40. The track device 20 includes a first track device 201 and a second track device 203. The first track device 201 is fixed to the support device 10. The second track device 203 is movably disposed on the first track device 201. The second track device 203 is capable of moving along a first direction (e.g., ...) on the first track device 201. Figure 2 The laser device 40 is movably mounted on the second track device 203. The laser device 40 can move linearly along the second direction (as shown in the Y direction) on the second track device 203. Figure 2 and Figure 3 The laser device 40 includes a housing 41 movably mounted on the second track device 203, a guide optical axis 42 mounted on the housing 41, and a processing mechanism 50. The housing 41 can move linearly along the second direction on the second track device 203, and the processing mechanism 50 can move along a third direction (e.g., the X direction shown in the diagram) relative to the housing 41. Figure 2 and Figure 3 (as shown in the Z1 direction) or the fourth direction (such as...) Figure 2 and Figure 3 The Z2 direction (shown in the diagram) moves in a straight line, the third direction is opposite to the fourth direction, and the first, second, and third directions are all different, as are the first, second, and fourth directions. In this embodiment, there are two first track devices 201, and a second track device 203 is mounted on the two first track devices 201. The processing mechanism 50 is used for processing; the processing mechanism 50 can move towards the workpiece along the third direction and press against the workpiece; the processing mechanism 50 can also move away from the workpiece along the fourth direction. It is understood that the support device 10 can be omitted.

[0044] The main body 100 can be disassembled into several modules. In particular, the first track device 201, the second track device 203 and the laser device 40 can be assembled into a complete module, minimizing the user's assembly difficulty and time, and ensuring the best motion performance after assembly.

[0045] The support device 10 includes a support frame 11 and four foot pads 12. The four foot pads 12 are respectively fixed to the four corners of the bottom of the support frame 11 to raise the height of the main body 100. It is understood that the present invention does not limit the number of foot pads 12, and there may be one or more. It is understood that in some embodiments, the foot pads 12 may be omitted.

[0046] Please refer to the following: Figure 4 and Figure 5The first track device 201 includes a track frame assembly 21, a mounting assembly 23, a driver 24, and a transmission assembly 25. The mounting assembly 23 is movably mounted on the track frame assembly 21 and is used to support the second track device 203 and the laser device 40. The transmission assembly 25 is connected to the mounting assembly 23. The driver 24 is used to drive the transmission assembly 25 to move the mounting assembly 23 linearly along a first direction on the track frame assembly 21.

[0047] The track frame assembly 21 includes a track frame 211 and an optical axis 213 disposed on the track frame 211. The track frame 211 includes a first connecting portion 2111, a second connecting portion 2113, and a third connecting portion 2115. The third connecting portion 2115 is fixedly connected between the first connecting portion 2111 and the second connecting portion 2113. The first connecting portion 2111, the second connecting portion 2113, and the third connecting portion 2115 together form a groove 2110. The groove 2110 is generally U-shaped. The first connecting portion 2111 and the second connecting portion 2113 are arranged opposite each other along a third direction.

[0048] Please refer to the following: Figure 4 , Figure 5 and Figure 7 The first connecting portion 2111 has a recessed first receiving groove 2118 communicating with the groove 2110 for receiving the optical axis 213. The second connecting portion 2113 has a recessed second receiving groove 2119 communicating with the groove 2110 for receiving the optical axis 213.

[0049] In this embodiment, the track frame 211 is integrally formed from a special material by extrusion molding to achieve high strength. It is understood that the present invention does not limit the forming method of the track frame 211; for example, it can be assembled from independent first connecting parts 2111, second connecting parts 2113, and third connecting parts 2115.

[0050] It is understandable that the third connecting part 2115 can be omitted from the track frame 211, and the first connecting part 2111 and the second connecting part 2113 are fixedly connected, forming a V-shaped groove.

[0051] The optical axis 213 includes a first optical axis 2131 and a second optical axis 2133. The first optical axis 2131 is fixedly received in the first receiving groove 2118 of the first connecting portion 2111, and is used to guide the movement of the mounting assembly 23 relative to the track frame 211. The second optical axis 2133 is fixedly received in the second receiving groove 2119 of the second connecting portion 2113, and is used to guide the movement of the mounting assembly 23 relative to the track frame 2111. The first optical axis 2131 and the second optical axis 2133 are embedded in the side wall of the groove 2110, which is beneficial to the miniaturization of the first track device 201. In this embodiment, the first receiving groove 2118 and the second receiving groove 2119 extend along a first direction, the axis of the first optical axis 2131 extends along the first direction, and the axis of the second optical axis 2133 extends along the first direction. The first optical axis 2131 and the second optical axis 2133 are along a third direction (e.g., Figure 2 The Z1 direction in the middle is set at intervals. In other words, the first optical axis 2131 and the second optical axis 2133 are arranged in a direction different from the axial direction of the first optical axis 2131, that is, the arrangement direction of the first optical axis 2131 and the second optical axis 2133 is different from the axial direction of the first optical axis 2131.

[0052] In this embodiment, the first optical axis 2131 is pressed into the first receiving groove 2118 of the first connecting portion 2111. The cross-section of the first receiving groove 2118 is an arc space, and the opening of the first receiving groove 2118 is smaller than the maximum diameter within the cross-sectional space. During installation, the first optical axis 2131 is pressed into the first receiving groove 2118 through the opening, and the first optical axis 2131 and the inner wall of the first receiving groove 2118 of the first connecting portion 2111 have an interference fit, which helps to improve the connection strength between the first optical axis 2131 and the track frame 211, resulting in quick assembly and structural stability. The second optical axis 2133 is pressed into the second receiving groove 2119 of the second connecting portion 2113. The second optical axis 2133 and the inner wall of the second receiving groove 2119 of the second connecting portion 2113 have an interference fit, which helps to improve the connection strength between the second optical axis 2133 and the track frame 211. Similar to the first receiving slot 2118, the second receiving slot 2119 has a circular arc space in its cross-section. The opening of the second receiving slot 2119 is smaller than the maximum diameter within the cross-sectional space. During installation, the second optical axis 2133 is pressed into the second receiving slot 2119 through the opening. The stable distance between the first optical axis 2131 and the second optical axis 2133 on the track frame 211 ensures the clearance of the first track device 201 in the third direction. It is understood that the first receiving slot 2118 on the first connecting part 2111 can be omitted, and the first optical axis 2131 can be directly fixed to the first connecting part 2111 by welding, gluing, or other methods. It is understood that the second receiving slot 2119 on the second connecting part 2113 can be omitted, and the second optical axis 2133 can be directly fixed to the second connecting part 2113 by welding, gluing, or other methods. It is understood that there can be only one optical axis 213.

[0053] Please refer to the following: Figure 1 , Figure 2 and Figures 4 to 7 The mounting assembly 23 includes a mounting base 231 and a pulley 233. The mounting base 231 is movably connected to the track frame 211 of the first track device 201 via the pulley 233.

[0054] Mounting base 231 includes mounting plate 2311 and connector 2312 fixed to mounting plate 2311. Figure 2 and Figure 5 As shown, the mounting plate 2311 is used to support the connector 2312, pulley 233, second track device 203 and laser device 40. The connector 2312 is provided with a connecting groove 2315 for connecting with the transmission assembly 25.

[0055] The pulley 233 includes a first pulley 2331 and a second pulley 2333. The first pulley 2331 is rotatably mounted on the mounting plate 2311 and slidably connected to the first optical axis 2131. The first pulley 2331 is received in the groove 2110 and located between the first optical axis 2131 and the second optical axis 2133. The mounting plate 2311 covers the groove 2110, and the first pulley 2331 is located between the mounting plate 2311 and the third connecting part 2115 of the track frame 211. When the transmission assembly 25 drives the mounting base 231 to move, the first pulley 2331 rolls along the first optical axis 2131. Since the first pulley 2331 can roll along the first optical axis 2131, that is, the first pulley 2331 and the first optical axis 2131 are connected by rolling, it is beneficial to reduce the friction between the first pulley 2331 and the first optical axis 2131, reduce noise, and reduce the wear between the first pulley 2331 and the track frame 211, so that the laser processing equipment 1000 has the characteristics of high precision, high strength, long life and low noise.

[0056] In this embodiment, the outer wall of the first pulley 2331 is provided with an annular groove 2335, and the first optical shaft 2131 passes through the groove 2335, and the first optical shaft 2131 is slidably connected to the groove 2335 of the first pulley 2331. The groove 2335 can limit the first optical shaft 2131, thereby reducing the possibility of the first pulley 2331 disengaging from the first optical shaft 2131. It can be understood that the groove 2335 of the first pulley 2331 can be omitted, and a guide groove can be provided on the first optical shaft 2131, and the first pulley 2331 is slidably connected to the guide groove of the first optical shaft 2131. It can be understood that the first pulley 2331 can be directly fixed to the mounting plate 2311, that is, when the first pulley 2331 is connected to the mounting plate 2311, the first pulley 2331 cannot rotate.

[0057] The second pulley 2333 is rotatably mounted on the mounting plate 2311 and slidably connected to the second optical axis 2133. The second pulley 2333 is housed in the groove 2110 and located between the first optical axis 2131 and the second optical axis 2133. When the transmission assembly 25 drives the connecting piece 2312 to move the mounting base 231, the second pulley 2333 rolls along the second optical axis 2133, that is, the second pulley 2333 is in a rolling connection with the second optical axis 2133. This helps to reduce the friction between the second pulley 2333 and the second optical axis 2133, reduce noise, and reduce the wear between the second pulley 2333 and the track frame 211, giving the laser processing equipment 1000 the characteristics of high precision, high strength, long life and low noise.

[0058] In this embodiment, the outer wall of the second pulley 2333 is provided with an annular groove 2335, and the second optical shaft 2133 passes through the groove 2335 of the second pulley 2333, and the second optical shaft 2133 is slidably connected to the groove 2335 of the second pulley 2333. The groove 2335 of the second pulley 2333 can limit the second optical shaft 2133, thereby reducing the possibility of the second pulley 2333 disengaging from the second optical shaft 2133. It can be understood that the groove 2335 of the second pulley 2333 can be omitted, and a guide groove can be provided on the second optical shaft 2133, and the second pulley 2333 is slidably connected to the guide groove of the second optical shaft 2133. It can also be understood that the second pulley 2333 can be directly fixed to the mounting plate 2311, that is, when the second pulley 2333 is connected to the mounting plate 2311, the second pulley 2333 cannot rotate.

[0059] The cooperation between the first optical axis 2131 and the first pulley 2331, and between the second optical axis 2133 and the pulley 2333, guides the movement of the mounting base 231 along the first direction. This improves the smoothness and accuracy of the linear movement of the mounting base 231 along the first direction, thereby enhancing the performance of the second track device 203 (e.g., Figure 2 (As shown) the smoothness of linear motion along the first direction on the first track device 201.

[0060] In addition, the mounting plate 2311 covers the groove 2110, the first pulley 2331 is located between the mounting plate 2311 and the track frame 211, and the second pulley 2333 is located between the mounting plate 2311 and the track frame 211, so that the first pulley 2331 and the second pulley 2333 are both hidden in the groove 2110, which helps to reduce the interference of other components on the movement of the first pulley 2331 and the second pulley 2333, and also helps to promote the miniaturization of the first track device 201.

[0061] Please refer to the following: Figure 4 , Figure 5 and Figure 7 The driver 24 is fixed to the third connecting part 2115 of the track frame 211, and the drive shaft of the driver 24 is connected to the transmission assembly 25 to drive the transmission assembly 25 to move. In this embodiment, as... Figure 3 As shown, the two first track devices 201 share the same driver 24, which is fixed to the track frame 211 of one of the first track devices 201 and drives the mounting assembly 23 of both first track devices 201 to move. It can be understood that each first track device 201 may be equipped with one driver 24.

[0062] Please see Figures 4 to 7The transmission assembly 25 includes a driving wheel 251, a driven wheel 253, and a timing belt 255. The driving wheel 251 is connected to the drive shaft of the driver 24. The driven wheel 253 is rotatably mounted on the track frame 211, and the timing belt 255 is sleeved on the driving wheel 251 and the driven wheel 253. The timing belt 255 is fixedly inserted into the connecting groove 2315 of the connector 2312. In this embodiment, the driver 24 is a rotary motor. The driver 24 drives the driving wheel 251 to rotate, and the driving wheel 251 drives the timing belt 255. When the driver 24 drives the driving wheel 251 to rotate, the driving wheel 251 drives the timing belt 255 to move, which in turn drives the connector 2312 to move, thereby causing the mounting assembly 23 to move linearly along the first optical axis 2131 and the second optical axis 2133.

[0063] The transmission assembly 25 also includes a mounting bracket 257 (such as...). Figure 5 (As shown). The fixing frame 257 is fixed to the track frame 211, and the fixing frame 257 supports the driven wheel 253. It can be understood that the connecting piece 2312 can be omitted, and the mounting plate 2311 is directly connected to the timing belt 255. It can be understood that the transmission assembly 25 can be omitted, and the driver 24 is directly connected to the mounting base 231. The driver 24 can be a linear motor, and the driver 24 drives the mounting base 231 to move linearly in the first direction.

[0064] When the laser processing equipment 1000 processes the workpiece through the main body 100, the drive wheel 251 is driven to rotate by the driver 24. The drive wheel 251 drives the second track device 203 to move linearly along the first track device 201 in a first direction. The laser device 40 can move linearly along the second direction on the second track device 203. In this way, the processing position of the laser device 40 is changed by the movement of the second track device 203 on the first track device 201 and the movement of the laser device 40 on the second track device 203.

[0065] It is understood that the second track device 203 can have a similar structure to the first track device 201. That is, it is understood that the structure of the first track device 201 of the present invention can be applied to the linear motion track guiding mechanism of the main body 100, for example, it can be applied to... Figure 1 A linear motion trajectory in any direction, such as the X-axis, Y-axis, Z1, and Z2.

[0066] Please refer to the following: Figures 8 to 10 The second track device 203 includes a track frame assembly 31, a mounting assembly 33, a driver 34, and a transmission assembly 35. The mounting assembly 33 is movably mounted on the track frame assembly 31 and is used to connect the laser device 40. The transmission assembly 35 is connected to the mounting assembly 33. The driver 34 is used to drive the transmission assembly 33 to cause the mounting assembly 33 to move linearly along a second direction on the track frame assembly 31.

[0067] The track frame assembly 31 includes a track frame 311 and an optical shaft 313 mounted on the track frame 311. The track frame 311 includes a first connecting portion 3111 and a second connecting portion 3113 fixedly connected to the first connecting portion 3111. A recessed groove 3116 is provided on the side of the first connecting portion 3111 facing away from the second connecting portion 3113 for accommodating a transmission assembly 35. A guide groove 3115 is provided on the second connecting portion 3113 for accommodating a mounting assembly 33. The opening direction of the guide groove 3115 is different from the opening direction of the recess 3116. The opening of the guide groove 3115 faces the laser device 40, while the opening of the recess 3116 faces the bottom of the main body 100 (e.g., ...). Figure 3 (As shown). The inner wall of the guide groove 3115 is recessed with a first receiving groove 3117 that communicates with the guide groove 3115 for receiving the optical axis 313. The end face of the first connecting part 3111 opposite to the guide groove 3115 is recessed with a second receiving groove 3119 for receiving the optical axis 313.

[0068] The optical axis 313 includes a first optical axis 3131 and a second optical axis 3133. The first optical axis 3131 is fixedly received in a first receiving groove 3117 of the track frame 311, and is used to guide the movement of the mounting assembly 33 relative to the track frame 311. The second optical axis 3133 is fixedly received in a second receiving groove 3119 of the track frame 311, and is used to guide the movement of the mounting assembly 33 relative to the track frame 311. In this embodiment, the first optical axis 3131 extends along a second direction, and the second optical axis 3133 extends along a second direction. The first optical axis 3131 and the second optical axis 3133 are along a third direction (e.g., Figure 2 and Figure 3 The Z1 direction shown in the figure is spaced apart. In other words, the first optical axis 3131 and the second optical axis 3133 are arranged in a direction different from the axial direction of the first optical axis 3131, that is, the arrangement direction of the first optical axis 3131 and the second optical axis 3133 is different from the axial direction of the first optical axis 3131.

[0069] In this embodiment, the first optical axis 3131 is pressed into the first receiving groove 3117, and the second optical axis 3133 is pressed into the second receiving groove 3119. Both the first receiving groove 3117 and the second receiving groove 3119 have circular arc spaces within their cross-sections. The opening of the first receiving groove 3117 is smaller than the maximum diameter within the cross-sectional space. During installation, the first optical axis 3131 is pressed into the first receiving groove 3117 through its opening, and the first optical axis 3131 and the inner wall of the first receiving groove 3117 are interference-fitted. This improves the connection strength between the first optical axis 3131 and the track frame 311, resulting in rapid assembly and structural stability. The opening of the second receiving groove 3119 is smaller than the maximum diameter within the cross-sectional space. During installation, the second optical axis 3133 is pressed into the second receiving groove 3119 through its opening, and the second optical axis 3133 is interference-fitted with the inner wall of the second receiving groove 3119. This improves the connection strength between the second optical axis 3133 and the track frame 311, resulting in quick assembly and structural stability. The stable distance between the first optical axis 3131 and the second optical axis 3133 on the track frame 311 ensures the clearance of the second track device 203 in the third direction. It is understood that the first receiving groove 3117 can be omitted, and the first optical axis 3131 can be directly fixed to the inner wall of the guide groove 3115 of the track frame 311. It is also understood that the second receiving groove 3119 can be omitted, and the second optical axis 3133 can be directly fixed to the end face of the first connecting part 3111 of the track frame 311 facing away from the second connecting part 3113.

[0070] Please refer to the following: Figures 9 to 11 The mounting assembly 33 includes a mounting base 331 and a pulley 333. The mounting base 331 is movably connected to the track frame assembly 31 via the pulley 333. The mounting base 331 includes a mounting plate 3311 and a connector 3312 fixed to the mounting plate 3311. The connector 3312 has a connecting groove 3315 for connecting to the transmission assembly 35. The mounting plate 3311 is connected to the housing 41 of the laser device 40, and the connector 3312 is connected to the pulley 333 via the mounting plate 3311, thereby connecting the housing 41 to the transmission assembly 35. The pulley 333 is connected to the housing 41 of the laser device 40. The driver 34 drives the transmission assembly 35 to move the mounting base 331 along a second direction, and the pulley 333 and the laser device 40 move linearly along the second direction on the track frame assembly 31 with the mounting base 331. It is understood that the mounting base 331 can be omitted, and the laser device 40 can move along the second direction on the track frame assembly 31 via the pulley 333 connected to the housing 41.

[0071] The pulley 333 includes a first pulley 3331 and a second pulley 3333. The first pulley 3331 is rotatably mounted on the housing 41 of the laser device 40 and slidably connected to the first optical axis 3131. The first pulley 3331 is housed in the guide groove 3115. When the transmission assembly 35 drives the mounting base 331 to move, the first pulley 3331 rolls along the first optical axis 3131. Since the first pulley 3331 can roll along the first optical axis 3131, that is, the first pulley 3331 is slidably connected to the first optical axis 3131, it is beneficial to reduce the friction between the first pulley 3331 and the first optical axis 3131, reduce noise, and reduce the wear between the first pulley 3331 and the track frame 311, so that the laser processing equipment 1000 has the characteristics of high precision, high strength, long life and low noise.

[0072] In this embodiment, an annular groove 3335 is provided on the outer wall of the first pulley 3331, and the first optical axis 3131 passes through the groove 3335, with the first optical axis 3131 slidably connected to the groove 3335 of the first pulley 3331. The groove 3335 can limit the first optical axis 3131, thereby reducing the possibility of the first pulley 3331 disengaging from the first optical axis 3131. It can be understood that the groove 3335 can be omitted, and a sliding groove can be provided on the first optical axis 3131, with the first pulley 3331 slidably connected to the sliding groove of the first optical axis 3131. It can also be understood that the first pulley 3331 can be directly fixed to the housing 41 of the laser device 40, that is, when the first pulley 3331 is connected to the housing 41, the first pulley 3331 cannot rotate.

[0073] The second pulley 3333 is rotatably mounted between the housing 41 and the mounting plate 3311, and is slidably connected to the second optical axis 3133. The first pulley 3331 and the second pulley 3333 are arranged along a third direction on the mounting base 331. The first optical axis 3131 is located between the first pulley 3331 and the second pulley 3333, and the second optical axis 3133 is located between the first pulley 3331 and the second pulley 3333. The first connecting part 3111 is located between the first pulley 3331 and the second pulley 3333. When the transmission assembly 35 drives the mounting base 331 to move, the second pulley 3333 can roll along the second optical axis 3133. Since the second pulley 3333 can roll along the second optical axis 3133, that is, the second pulley 3333 and the second optical axis 3133 are connected by rolling, it is beneficial to reduce the friction between the second pulley 3333 and the second optical axis 3133, reduce noise, and reduce the wear between the second pulley 3333 and the track frame 311, so that the laser processing equipment 1000 has the characteristics of high precision, high strength, long life and low noise.

[0074] In this embodiment, the outer wall of the second pulley 3333 is provided with an annular groove 3337, and the second optical shaft 3133 passes through the groove 3337, with the second optical shaft 3133 slidably connected to the groove 3337 of the second pulley 3333. The groove 3337 can limit the second optical shaft 3133, thereby reducing the possibility of the second pulley 3333 disengaging from the second optical shaft 3133. It can be understood that the groove 3337 can be omitted, and a sliding groove can be provided on the second optical shaft 3133, with the second pulley 3333 slidably connected to the sliding groove of the second optical shaft 3133. It can also be understood that the second pulley 3333 can be directly fixed to the mounting plate 3311, that is, when the second pulley 3333 is connected to the mounting plate 3311, the second pulley 3333 cannot rotate.

[0075] The cooperation between the first optical axis 3131 and the first pulley 3331, and the cooperation between the second optical axis 3133 and the second pulley 3333, guides the movement of the mounting base 331 along the second direction. This improves the smoothness and accuracy of the linear movement of the mounting base 331 along the second direction, and further improves the smoothness and accuracy of the linear movement of the laser device 40 along the second direction on the second track device 203.

[0076] Furthermore, when the housing 41 of the laser device 40 is connected to the pulley 333, the housing 41 is covered with a guide groove 3115. Under the cover of the housing 41, the first pulley 3331 housed in the guide groove 3115 is hidden inside the guide groove 3115, and the second pulley 3333, which is fixed to the end face of the first connecting part 3111 opposite to the second connecting part 3113, is hidden under the second connecting part 3113. This helps to reduce interference from other components on the movement of the first pulley 3331 and the second pulley 3333, and also facilitates the miniaturization of the second track device 203.

[0077] Please refer to the following: Figures 8 to 10 The driver 34 is fixed to the track frame 311 and positioned near one end of the guide groove 3115. The drive shaft of the driver 34 is connected to the transmission assembly 35 and is used to drive the transmission assembly 35 to move.

[0078] The transmission assembly 35 is housed within the groove 3116. The transmission assembly 35 includes a driving wheel 351, a driven wheel 353, and a timing belt 355. The driving wheel 351 is connected to the drive shaft of the driver 34. The driven wheel 353 is rotatably mounted on the track frame 311, and the timing belt 355 is sleeved on the driving wheel 351 and the driven wheel 353. The timing belt 355 is fixedly inserted into the groove 3116. In this embodiment, the driver 34 is a rotary motor. The driver 34 drives the driving wheel 351 to rotate, and the driving wheel 351 drives the timing belt 355. When the driver 34 drives the driving wheel 351 to rotate, the driving wheel 351 drives the timing belt 355 to move, thereby causing the mounting assembly 33 to move linearly along the first optical axis 3131 and the second optical axis 3133. It can be understood that the connecting piece 3312 can be omitted, and the mounting plate 3311 can be directly connected to the timing belt 355. It is understood that the transmission component 35 can be omitted, and the driver 34 is directly connected to the mounting plate 3311. The driver 34 can be a linear motor. The driver 34 drives the mounting plate 3311 to move linearly in the second direction, thereby driving the laser device 40 connected to the mounting plate 3311 to move linearly in the second direction.

[0079] Please refer to the following: Figure 2 and Figure 3 When the main body 100 of the laser processing equipment 1000 processes the workpiece, the driver 24 of the first track device 201 drives the second track device 203 to move linearly along the first track device 201 in a first direction. The driver 34 of the second track device 203 drives the drive wheel 351 to rotate, causing the laser device 40 to move linearly along the second track device 203 in a second direction. In this way, the processing position of the laser device 40 is changed by the movement of the second track device 203 on the first track device 201 and the movement of the laser device 40 on the second track device 203.

[0080] Understandably, the structure of the second track device 203 of this application can be adapted to the linear motion track of the main body 100, for example, it can be adapted to... Figure 2 A linear motion trajectory in any direction, such as the X-axis, Y-axis, Z1, Z2, etc.

[0081] Please refer to the following: Figures 8 to 11 The second track device 203 provided in this application, since the first pulley 3331 is slidably connected to the first optical axis 3131 and the second pulley 3333 is slidably connected to the second optical axis 3133, guides the movement of the mounting component 33 relative to the track frame 311, improves the smoothness and accuracy of the movement of the mounting component 33 connected to the housing 41 of the laser device 40 on the track frame 311, thereby improving the smoothness and accuracy of the movement of the laser device 40 on the track frame 311, and thus improving the processing accuracy of the laser processing equipment 1000.

[0082] Please refer to the following: Figure 5 , Figure 8 and Figure 11 In this embodiment, the laser device 40 moves along a second direction on the second track device 203, and the pulley 333 of the second track device 203 is directly and rotatably mounted on the housing 41 of the laser device 40. In another embodiment, the laser device 40 can also move along a first direction on the first track device 201, and the housing 41 of the laser device 40 is fixed to the mounting plate 2311 of the first track device 201. Since the pulley 233 of the first track device 201 is rotatably connected to the mounting plate 2311, the pulley 233 can be indirectly and rotatably connected to the housing 41 of the laser device 40 through the mounting plate 2311.

[0083] Please refer to the following: Figure 12 , Figure 13 , Figure 16 , Figure 17 and Figure 19 The laser device 40 includes a housing 41, a guide optical axis 42, and a processing mechanism 50. The guide optical axis 42 is fixed to the housing 41 and extends along a third direction. The processing mechanism 50 includes a laser housing 51 and a laser 52 disposed on the laser housing 51. The laser housing 51 is slidably connected to the guide optical axis 42, and the laser 52 moves with the laser housing 51 relative to the housing 41 along a third or fourth direction. The laser 52 is used to emit laser light to process the workpiece.

[0084] The laser device 40 guides the movement of the laser housing 51 relative to the housing 41 via the guide optical axis 42, thereby guiding the movement of the laser 52 connected to the laser housing 51 relative to the housing 41. This improves the smoothness and accuracy of the movement of the laser 52 relative to the housing 41, ensuring the movement accuracy of the laser 52 when it moves toward the workpiece to a suitable distance for processing, and improving the processing accuracy of the laser device 40.

[0085] In this embodiment, the laser 52 can move along a third direction (e.g., along the laser housing 51 relative to the housing 41) with respect to the housing 41. Figure 12 The laser 52 moves closer to the workpiece and presses against it. When the laser 52 moves relative to the housing along a third direction and there is a suitable distance between it and the workpiece surface in the third direction, the laser 52 can emit laser light to process the workpiece. The laser 52 moves with the laser housing 51 relative to the housing 41 along a fourth direction (e.g., ...). Figure 12 Z2) moves away from the workpiece.

[0086] In this embodiment, there are two guide optical axes 42. The axes of both guide optical axes 42 are parallel to a third direction, and the two guide optical axes 42 do not coincide. When the laser shell 51 moves relative to the shell 41, the laser shell 51 moves synchronously on the two guide optical axes 42. It can be understood that in other embodiments, the number of guide optical axes 42 may also be 1, 3, or 4, or other positive integers of at least 1.

[0087] Please refer to the following: Figures 12 to 14 , Figure 16 and Figure 19 The housing 41 is provided with a connecting portion 411 corresponding to the guide optical axis 42. The connecting portion 411 has a connecting hole 4111, and the end of the guide optical axis 42 is inserted into the connecting hole 4111. In this way, the guide optical axis 42 is fixedly connected to the housing 41 through the connecting hole 4111 of the connecting portion 411. When the laser housing 51 slides along the guide optical axis 42 in a third or fourth direction, it is equivalent to the laser housing 51 moving relative to the housing 41 in the corresponding third or fourth direction. In addition, the connecting portion 411 serves as a limiting function. That is, when the laser housing 51 slides a certain distance along the guide optical axis 42 in the fourth direction, the laser housing 51 will press against / or contact the connecting portion 411. At this time, the laser housing 51 cannot continue to slide along the guide optical axis 42 in the fourth direction.

[0088] In this embodiment, there are two connecting parts 411, and the two connecting parts 411 correspond one-to-one with the two guide optical shafts 42. Each connecting part 411 is provided with a connecting hole 4111, and the ends of the two guide optical shafts 42 are respectively inserted into the connecting holes 4111 of the corresponding connecting parts 411.

[0089] In other embodiments, the number of connecting parts 411 may also be one. The connecting part 411 is provided with connecting holes 4111 corresponding to the two guide optical shafts 42. The scheme in which the ends of the two guide optical shafts 42 are respectively inserted into the corresponding connecting holes 4111 is also within the protection scope of the present invention.

[0090] In this embodiment, the connecting hole 4111 penetrates both opposite end faces of the connecting portion 411 in a third direction. In other embodiments, the connecting hole 4111 may also penetrate only the end face of the connecting portion 411 facing the laser housing 51.

[0091] In this embodiment, the connecting part 411 is disposed inside the housing 41, and the laser housing 51 can pass through the housing 41 along the guide optical axis 42 inserted into the connecting part 411. In this way, the laser housing 51 can be housed in the housing 41, reducing the overall size of the laser device 40 and improving space utilization. Of course, the connecting part 411 can also be disposed outside the housing 41, that is, the laser housing 51 cannot be housed in the housing 41.

[0092] In this embodiment, when the laser housing 51 moves along the guide optical axis 42 within the housing 41 in a third or fourth direction, a gap exists between the laser housing 51 and the inner wall of the housing 41. This minimizes the frictional resistance between the laser housing 51 and the housing 41 when the laser housing 51 moves along the guide optical axis 42 within the housing 41, resulting in smooth movement and high control precision of the laser housing 51 driving the laser 52.

[0093] Please refer to the following: Figures 12 to 14 , Figure 16 and Figure 19 The laser housing 51 includes a guide portion 511 corresponding to the guide optical axis 42. The guide portion 511 has guide holes 5111 extending through its opposite end faces in a third direction. The guide optical axis 42 is movably inserted into the corresponding guide holes 5111. Thus, the laser housing 51 can move along the guide optical axis 42 through the guide holes 5111. In this embodiment, there are two guide portions 511, each corresponding to one of the two guide optical axes 42. Each guide portion 511 has a guide hole 5111, and the two guide optical axes 42 are movably inserted into the guide holes 5111 of their respective guide portions. In other embodiments, there may be only one guide portion 511, with two guide holes 5111 corresponding to the two guide optical axes 42, and the two guide optical axes 42 movably inserted into the corresponding guide holes 5111. This configuration is also within the scope of this invention.

[0094] In one embodiment, a sleeve 44 is fixedly mounted in the guide hole 5111 of the laser housing 51, and the guide optical shaft 42 is movably inserted through the sleeve 44 in the corresponding guide hole 5111. The presence of the sleeve 44 improves the smoothness and accuracy of the sliding of the guide optical shaft 42 in the guide hole 5111, further improving the smoothness and accuracy of the movement of the laser 52 relative to the housing 41. Moreover, compared to the scheme where the guide optical shaft 42 is directly inserted through the corresponding guide hole 5111, i.e., no other components are provided between the guide optical shaft 42 and the guide hole 5111, the use of a high-precision sleeve 44 directly mounted and fixed in the guide hole 5111 effectively reduces the machining accuracy requirements of the guide hole 5111, i.e., while reducing machining difficulty and cost, it can also achieve better smoothness and accuracy. In this embodiment, the sleeve 44 is a copper sleeve. It is understood that the sleeve 44 can also be made of other metals or other materials.

[0095] Please refer to the following: Figure 12 , Figures 14 to 16 ,as well as Figure 19The laser device 40 also includes a drive assembly 45, which includes a drive member 451 disposed on the housing 41. The drive member 451 is used to drive the laser housing 51 to move along the guide optical axis 42. In this way, under the action of the drive member 451, the laser housing 51 can move relative to the housing 41 in a third or fourth direction.

[0096] Specifically, the outer peripheral wall of the guide portion 511 is provided with a rack 5112 extending in a third direction. The drive assembly 45 also includes a gear 452 connected to the drive member 451 and meshing with the rack 5112. The drive member 451 drives the gear 452 to rotate, so that the rack 5112 moves relative to the guide optical axis 42 in a third or fourth direction. In this way, the drive member 451 can drive the laser housing 51 to move on the guide optical axis 42 through the meshing of the gear 452 and the rack 5112, and thus the laser 52 can move with the laser housing 51 relative to the housing 41.

[0097] In this embodiment, the driving component 451 is a motor, and the gear 452 is fixedly connected to the rotating shaft of the motor, that is, the gear 452 is fixedly sleeved on the rotating shaft. The gear 452 and the rotating shaft are coaxial. When the rotating shaft of the motor rotates, the gear 452 can rotate with the rotating shaft, so that the rack 5112 can move relative to the guide optical axis 42 in a third or fourth direction. When the rotating shaft of the motor does not rotate, the friction between the gear 452 and the rack 5112 fixedly connected to the rotating shaft can play a locking role, preventing the laser shell 51 from moving on the guide optical axis 42, thereby restricting the movement of the laser shell 51 relative to the shell 41. At this time, the position of the laser shell 51 on the guide optical axis 42 is locked.

[0098] In this embodiment, the outer peripheral wall of one of the two guide portions 511 is provided with a rack 5112 extending in a third direction, and there is one gear 452, which meshes with the rack 5112. In other embodiments, the outer peripheral walls of both guide portions 511 are provided with racks 5112 extending in a third direction, and there are two gears 452. The scheme in which the racks 5112 of the two guide portions 511 mesh with the gears 452 is also within the protection scope of this invention.

[0099] In this embodiment, a connecting plate 453 is rotatably mounted on the rotating shaft of the motor (i.e., the drive component 451). The connecting plate 453 is connected to the drive component 451 and is used to connect the drive assembly 45 to the housing 41. Specifically, the connecting plate 453 has two first through holes 4531; the housing 41 has a first fixing part 412 extending in a third direction, and the first fixing part 412 has a connecting groove 4121 extending in a third direction. The portions of the first fixing part 412 located on both sides of the connecting groove 4121 each have a second through hole 4122, and the two second through holes 4122 correspond one-to-one with the two first through holes 4531. By passing screws or other components through the first through holes 4531 and the corresponding second through holes 4122, the connecting plate 453 can be fixedly connected to the first fixing part 412, thereby fixing the drive component 451 to the housing 41.

[0100] Please refer to the following: Figures 14 to 17 The laser device 40 also includes a drive control assembly 46, which includes a first control board 461 electrically connected to the drive member 451. The first control board 461 transmits a first control signal to the drive member 451 to control the drive member 451 to drive the laser shell 51 to move relative to the housing 41 in a third direction or a fourth direction. Thus, the first control signal from the external control center can be transmitted to the drive member 451 through the first control board 461, thereby controlling the rotation of the drive member 451, and further controlling the rotation of the gear 452 connected to the drive member 451 to control the movement of the laser shell 51 relative to the housing 41 in a third direction or a fourth direction. By controlling the rotation of the drive member 451 through the first control signal, the external control center can control the distance the laser shell 51 moves on the guide optical axis 42, thereby controlling the distance the laser shell 51 moves relative to the housing 41 in a third direction or a fourth direction, ensuring that the laser 52 can move accurately to a preset position with the laser shell 51 relative to the housing 41, thus improving the processing accuracy of the laser device 40.

[0101] The drive control assembly 46 also includes a reset sensor 462 mounted on the first control board 461. The reset sensor 462 is electrically connected to the first control board 461, which is connected to the housing 41. The laser housing 51 is equipped with a reset element 53. The laser housing 51 moves along the fourth direction until the reset element 53 cooperates with the reset sensor 462 to output a reset signal. When the reset element 53 cooperates with the reset sensor 462 to output a reset signal, the laser housing 51 stops moving along the fourth direction. The external control center receives the reset signal through the first control board 461 and records the current position information of the laser housing 51, determining the origin position of the laser device 40 in the third and fourth directions. At this time, the external control center can output the corresponding first control signal according to the user's needs through a precise algorithm to control the distance the laser housing 51 moves relative to the housing 41 in the third or fourth direction, ensuring that the laser 52 can move accurately to the preset position with the laser housing 51 relative to the housing 41, thus improving the processing accuracy of the laser device 40. In this embodiment, the first control board 461 is fixed to the housing 41 by screws or other components, and the first control board 461 is positioned on the surface of the connecting part 411 opposite to the laser housing 51. In other embodiments, the first control board 461 can also be fixed to the housing 41 by adhesive bonding, welding or other methods.

[0102] In this embodiment, the reset sensor 462 is a groove-type optocoupler sensor. When the reset member 53 moves along the fourth direction with the laser housing 51 and is inserted into the groove of the reset sensor 462, the reset member 53 and the reset sensor 462 can cooperate to output a reset signal. In one embodiment, when the laser housing 51 moves along the fourth direction and contacts or presses against the connecting part 411, the reset member 53 moves along the fourth direction with the laser housing 51 and is inserted into the groove of the reset sensor 462.

[0103] Optionally, the drive control assembly 46 further includes a return sensor mounted on the first control plate 461. A third through hole 413 is provided on the surface of the housing 41 facing the first track device 201, through which the return sensor is exposed outside the housing 41. The first track device 201 also includes a return component 27 (such as...) mounted on the mounting plate 2311. Figure 3As shown, the laser device 40 moves along the second direction on the second track device 203, allowing the positioning component 27 to pass through the third through hole 413 and cooperate with the positioning sensor to output a positioning signal. When the positioning component 27 cooperates with the positioning sensor to output a positioning signal, the laser device 40 no longer moves along the second direction. The external control center receives the positioning signal through the first control board 461 and records the current position information of the laser device 40, determining the origin position of the laser device 40 in the second direction. At this time, the external control center can output the corresponding positioning control signal according to the user's needs through a precise algorithm to control the distance the laser device 40 moves along the second direction on the second track device 203. It can be understood that the positioning sensor can be a groove-type optocoupler sensor. When the positioning component 27 moves relative to the laser device 40 along the second direction and inserts into the groove of the positioning sensor, the positioning component 27 and the positioning sensor can cooperate to output a positioning signal.

[0104] Please refer to the following: Figure 14 and Figure 19 The laser device 40 also includes a second control board 47 electrically connected to the laser 52. The second control board 47 is connected to the housing 41 and is used to transmit a second control signal to the laser 52 to control the power of the laser emitted by the laser 52. Thus, an external control center can transmit the second control signal to the laser 52 through the second control board 47, allowing the external control center to adjust the second control signal according to user needs to adjust the power of the laser emitted by the laser 52 for workpiece processing. In this embodiment, the housing 41 has a second fixing part 414 extending in a third direction. A first fixing part 412 is disposed opposite to the second fixing part 414. The surface of the first fixing part 412 facing the second fixing part 414 has a first sliding groove 4123, and the surface of the second fixing part 414 facing the first fixing part 412 has a second sliding groove 4141 corresponding to the first sliding groove 4123. The second control board 47 is inserted into the first sliding groove 4123 and the second sliding groove 4141 in a third direction, thereby connecting the second control board 47 to the housing 41.

[0105] Please refer to the following: Figure 12 , Figure 14 , Figure 16 , Figure 17 and Figure 20 The laser housing 51 is provided with a laser receiving cavity 513 extending through its opposite two end faces along a third direction. The laser 52 is housed in the laser receiving cavity 513. The laser 52 is provided with an emission outlet 521 along a third direction, and the laser light from the laser 52 is emitted from the emission outlet 521. In this way, when the laser light from the laser 52 is emitted from the emission outlet 521, the laser light can be used to perform cutting, engraving, and other processing operations on the workpiece along a third direction.

[0106] The processing mechanism 50 also includes a heat sink, which comprises several heat-conducting fins 522 disposed on the outer peripheral surface of the laser 52, each heat-conducting fin 522 extending in a third direction. The laser device 40 also includes a fan 48 connected to the housing 41, the fan 48 corresponding to the heat sink, that is, the fan 48 blows air in a third direction. The heat dissipation area of ​​the laser 52 is increased by the heat-conducting fins 522. When the fan 48 corresponding to the heat sink blows air to the heat-conducting fins 522, the heat release of the laser 52 is greatly accelerated, ensuring that the temperature of the laser 52 is at a normal level when processing the workpiece, and avoiding the laser emitted by the laser 52 from being affected by high temperature, which would cause the laser power to decrease rapidly and affect the laser device 40's processing of the workpiece using the laser 52 as the processing medium.

[0107] In this embodiment, such as Figure 20 As shown, the laser 52 has several heat-conducting fins 522 on two adjacent sides. For ease of description, the two adjacent sides of the laser 52 with heat-conducting fins 522 are referred to as the first surface and the second surface, respectively. The laser 52 has a groove 523 on the first surface and a protrusion 524 on the side opposite to the first surface. The laser housing 51 has a slot 5131 corresponding to the protrusion 524 on the inner wall of the laser housing cavity 513. The user can press the bottom wall of the groove 523 by passing a screw through the peripheral wall of the laser housing 51, that is, the screw can pass through the peripheral wall of the laser housing 51 and press against the first surface. The screw provides pressure to the laser 52, so that the protrusion 524 of the laser 52 is stably and reliably embedded in the slot 5131. At this time, the laser 52 is housed in the laser housing cavity 513, that is, the laser 52 is fixedly connected to the laser housing 51. Furthermore, the user can easily disconnect the laser 52 from the laser housing 51 by rotating the screw, thus preventing it from pressing against the first surface. This simple operation facilitates assembly and disassembly. In this embodiment, the fan 48 is housed within the cavity of the housing 41. Specifically, the fan 48 is located on the surface of the first control plate 461 facing away from the laser housing 51. The first control plate 461 has ventilation holes 4611, and the axis of the fan 48 is collinear with the axis of the ventilation holes 4611. This allows the air generated by the fan 48 to be delivered to the laser 52 through the ventilation holes 4611 for heat dissipation.

[0108] In one embodiment, the heat sink further includes a plurality of heat sink 514 disposed on the outer peripheral surface of the laser housing 51, each heat sink 514 extending in a third direction. The presence of the heat sink 514 increases the heat dissipation area of ​​the laser housing 51, further accelerating the release of heat from the laser 52. In this embodiment, as... Figure 20As shown, the laser housing 51 has several heat sinks 514 on one side. For ease of description, the surface of the laser housing 51 with the heat sinks 514 is referred to as the third surface. The third surface is opposite to the second surface, so when the laser 52 is housed in the laser housing cavity 513, the heat dissipation area of ​​the laser 52 can be maximized by the heat-conducting fins 522 provided on the opposing first and second surfaces and the heat sinks 514 provided on the third surface of the laser housing 51 opposite to the second surface, thereby accelerating the release of heat from the laser 52.

[0109] In one embodiment, please refer to the following: Figure 12 , Figure 16 and Figure 17 The processing mechanism 50 also includes an air guide shroud 54, which is disposed on the surface of the laser housing 51 facing a third direction. The air guide shroud 54 directs the airflow from the fan 48 from the processing mechanism 50 along a third direction to the laser 52 and the laser housing 51, further accelerating the release of heat from the laser 52 and ensuring that the laser 52 operates at a normal temperature. Moreover, by directing the airflow from the fan 48 from the laser housing 51 and the laser 52 along a third direction, the air guide shroud 54 also prevents dust generated during processing by the laser device 40 from accumulating outside the lens of the laser 52, thus affecting the processing effect of the laser 52 and providing a dustproof function for the laser 52.

[0110] Please refer to the following: Figure 2 , Figure 14 , Figure 16 and Figure 17 The processing mechanism 50 also includes a tool mechanism 55, which is connected to the laser housing 51 and moves relative to the housing 41 along with the laser housing 51. In this way, the laser device 40 integrates the laser 52 and the tool mechanism 55 through the laser housing 51. It can process workpieces using either the laser 52 as the processing medium or the tool mechanism 55 as the processing medium. This simplifies operation, significantly reduces processing time and costs, and improves the applicability of the laser device 40, thereby enhancing the applicability of the laser processing equipment 1000.

[0111] Specifically, the laser housing 51 also includes a receiving portion 515, which has a second receiving cavity 5151 extending along a third direction, and the tool mechanism 55 is housed in the second receiving cavity 5151. In this way, when the laser housing 51 moves along the third direction on the guide optical axis 42, the tool mechanism 55 can process the workpiece as the laser housing 51 moves relative to the housing 41 along the third direction, for example, by cutting, indenting, or engraving the workpiece; when the laser housing 51 moves along the fourth direction on the guide optical axis 42, the tool mechanism 55 can move away from the workpiece as the laser housing 51 moves relative to the housing 41 along the fourth direction.

[0112] In one embodiment, a first magnetic chuck 57 is fixed in the second receiving cavity 5151, and a second magnetic chuck 58 is provided on the surface of the tool mechanism 55 facing the first magnetic chuck 57. The tool mechanism 55 is magnetically attracted to the first magnetic chuck 57 by the second magnetic chuck 58 and received in the second receiving cavity 5151. This magnetic attraction reduces the machining requirements of the second receiving cavity 5151 and facilitates the assembly and disassembly of the tool mechanism 55, making it easy to replace the tool mechanism 55 as needed. It is understood that the tool mechanism 55 can also be directly fixed in the second receiving cavity 5151 by welding, gluing, or other methods.

[0113] Please refer to the following: Figure 1 , Figure 3 and Figures 21 to 25 The frame mechanism 70 includes a frame 71, a cover plate 72, a support component 73, and a camera 74. The frame 71 has a processing space 701 for accommodating the main body 100 and the workpiece. The support component 73 includes a mounting bracket 731 mounted on the frame 71 and located within the processing space 701, the mounting bracket 731 having a mounting surface 7311 facing the processing space 701. The camera 74 is disposed on the mounting surface 7311 of the mounting bracket 731 and is used to capture images of the workpiece so that the laser processing equipment 1000 can determine the material information (e.g., thickness and hardness) of the workpiece based on the images; it is also used to acquire a pattern to be processed so that the processing mechanism 50 of the main body 100 can process the workpiece according to the pattern to be processed; and it is also used to confirm the position of the workpiece (e.g., the distance between the workpiece and the processing mechanism 50) for more precise processing. The cover plate 72 covers the frame 71, so that the main body 100 and the workpiece housed in the processing space 701 are in a closed space, avoiding unnecessary interference to the processing mechanism 50 of the main body 100 when processing the workpiece, thereby affecting the processing accuracy of the laser processing equipment 1000.

[0114] The design of mounting the camera 74 on the mounting bracket 731, which in turn is mounted on the frame 71, not only simplifies the wiring of the camera 74 but also effectively prevents changes in the position of the camera 74 caused by deformation of the cover plate 72 or repeated opening and closing. This avoids repeated adjustments to the laser processing equipment 1000 before processing, improving the processing accuracy and efficiency of the laser processing equipment 1000. Furthermore, mounting the camera 74 on the mounting bracket 731 ensures that the entire workpiece is captured while reducing the overall height of the laser processing equipment 1000, making it easier for the user to place the workpiece (when placing the workpiece, the user's hands would need to extend into the processing space 701 or the frame 71; the laser processing equipment 1000's height is too high, making it inconvenient for the user to operate).

[0115] Please refer to the following: Figures 21 to 23The frame 71 has a first opening 703, which communicates with the processing space 701. The frame 71 includes a bottom, a side, and a shielding part. The shielding part and the bottom are disposed at opposite ends of the side plate, and the bottom, the side, and the shielding part enclose the processing space 701.

[0116] In this embodiment, the side portion includes a first side plate 711, a second side plate 712, a third side plate 713, and a fourth side plate 714 connected end-to-end. The bottom portion includes a bottom plate 715, which is connected to the first side plate 711, the second side plate 712, the third side plate 713, and the fourth side plate 714. The bottom plate 715, the first side plate 711, the second side plate 712, the third side plate 713, and the fourth side plate 714 enclose a processing space 701 and form a first opening 703. Optionally, the shielding portion is adjacent to or located at the first opening 703; in other words, the shielding portion is located at the end of the side portion away from the bottom, or in other words, the shielding portion is located at the end of the first side plate 711 away from the bottom. The shielding portion includes a shielding plate 716, which is located at the end of the first side plate 711 away from the bottom plate 715. It is understandable that the frame 71 can have various specific shapes, such as a cylindrical shape with open ends or one open end and closed end, and the cross-section can be circular, triangular, quadrilateral, polygonal, irregular, etc. It is also understandable that the bottom of the frame 71 can be hollowed out, so that the laser processing equipment 1000 can be placed on an external support surface such as a desktop or metal plate during use.

[0117] Please see Figure 22 and Figure 28 The frame 71 has a processing surface 717 located at the end of the frame away from the first opening 703 and within the processing space 701. The processing surface 717 is a surface used to place the workpiece. Optionally, the processing surface 717 can be a solid component or a virtual plane. In this embodiment, the processing surface 717 is a support platform located at the bottom of the processing space 701, used to support the workpiece; in other words, the support platform is located at the end of the frame 71 away from the first opening 703. Optionally, the support platform is disposed on a base plate 715. It is understood that the base plate 715 can serve as a support platform; in other words, the base plate 715 and the support platform are integral or the same component. It is understood that the processing surface 717 can be a virtual plane. When the laser processing equipment 1000 is placed on an external support surface such as a tabletop or a metal plate surface, the processing surface 717 is the external support surface such as the tabletop or metal plate surface defined by the frame 71.

[0118] Please include Figures 21 to 25The support component 73 is located on the side of the shielding portion facing the bottom. In this embodiment, the support component 73 is disposed on the side of the shielding plate 716 opposite to the first opening 703; in other words, the support component 73 is disposed on the side of the shielding plate 716 facing the processing space 701. This allows the shielding plate 716 to conceal the support component 73, making the interior of the laser processing equipment 1000 invisible to the naked eye, resulting in a more aesthetically pleasing overall appearance.

[0119] In this embodiment, the mounting bracket 731 is disposed close to the first side plate 711 and away from the base plate 715; in other words, the mounting bracket 731 is located at the end of the first side plate 711 away from the base plate 715, which makes the structure of the entire laser processing equipment 1000 more compact and smaller. It is understood that the mounting bracket 731 can be mounted on the first side plate 711. It is also understood that the opposite ends of the mounting bracket 731 are respectively mounted on the second side plate 712 and the fourth side plate 714.

[0120] Mounting bracket 731 is provided with receiving groove 7312 and mounting groove 7313, which are located on mounting surface 7311. Receiving groove 7312 is located in the middle of mounting bracket 731 and is used to mount camera 74. Mounting groove 7313 is located at one end of mounting bracket 731 and is spaced apart from receiving groove 7312. In this embodiment, the equivalent circle diameter of receiving groove 7312 gradually decreases from mounting surface 7311 to the bottom of receiving groove 7312. The "equivalent circle diameter" refers to the diameter of a circle with the same area as a non-circular geometric shape.

[0121] Please see also Figures 22 to 25 The mounting surface 7311 of the mounting bracket 731 is provided with a mounting through hole 7314. The mounting through hole 7314 is located on the outer periphery of the mounting groove 7313 and is positioned close to the first side plate 711. The mounting through hole 7314 communicates with the mounting groove 7313 and is used to allow a screwdriver to pass through for installing or removing components within the mounting groove 7313. When it is necessary to remove components within the mounting groove 7313 for inspection and maintenance, the screwdriver is inserted into the mounting through hole 7314 to remove the components within the mounting groove 7313. Optionally, there may be one or more mounting through holes 7314. When there are multiple mounting through holes 7314, the multiple mounting through holes 7314 are arranged in a direction parallel to the first side plate 711 (e.g., ...). Figure 22 The vias 7314 are arranged at intervals in the X direction. In this embodiment, there are two mounting vias 7314.

[0122] In this embodiment, the mounting bracket 731 and the frame 71 are two different components, and the mounting bracket 731 is assembled with the frame 71. It can be understood that the mounting bracket 731 and the frame 71 are an integral structure or the mounting bracket 731 is part of the frame 71. In other words, the camera 74 is mounted on the frame 71.

[0123] Please see Figures 23 to 25 The support assembly 73 also includes a protective cover 733, which is detachably connected to the mounting bracket 731 and is used to close the mounting slot 7313. The protective cover 733 can be detachably mounted on the mounting bracket 731 by means of screws, bolts, clips, or other means.

[0124] Optionally, the camera 74 is positioned in the middle of the mounting bracket 731. When the camera 74 is mounted in the middle of the mounting bracket 731, a better overall image of the workpiece can be captured. The "middle position" of component A refers to the exact center of component A, or a portion close to the exact center. Optionally, the camera 74 is positioned at the bottom of the receiving groove 7312. This prevents the workpiece from accidentally damaging the camera 74 during processing, provides better dust protection, and extends the service life of the camera 74. Furthermore, the equivalent circle diameter of the receiving groove 7312 gradually decreases from the mounting surface 7311 towards the bottom of the receiving groove 7312, which better prevents the sidewalls of the receiving groove 7312 from affecting the camera's shooting effect.

[0125] Please refer to the following: Figure 21 , Figure 22 and Figure 27 The processing surface 717 includes a first end 7171 and a second end 7173. The plane formed by the camera 74 and the first end 7171 is the first plane 702, and the plane formed by the camera 74 and the second end 7173 is the second plane 704. The angle α between the axis of symmetry of the camera 74 and the first plane 702 is equal to the angle β between the axis of symmetry of the camera 74 and the second plane 704. This allows the image of the workpiece acquired by the camera 74 to have better quality, so that the laser processing equipment 1000 can process the workpiece more accurately. The axis of symmetry of the camera 74 also refers to the axis of symmetry of the optical system of the camera 74.

[0126] Optionally, the angle between the axis of symmetry of the camera 74 and the processing surface 717 is 30° to 60°; specifically, it can be, but is not limited to, 30°, 35°, 40°, 45°, 50°, 55°, 60°, etc. This allows the camera 74 to capture the entire image of the workpiece while also reducing the height and width of the laser processing equipment 1000, resulting in a smaller overall size. Furthermore, the angle between the axis of symmetry of the camera 74 and the plane containing the processing surface 717 is 40° to 50°. This further balances the height and width of the laser processing equipment 1000, resulting in an even smaller overall size.

[0127] Please refer to the following: Figure 1 , Figure 21 and Figure 22The cover plate 72 is rotatably connected to the frame 71. The cover plate 72 can rotate relative to the frame 71 to close the first opening 703, making the processing space 701 a closed space. This prevents unnecessary interference to the main body 100 housed in the processing space 701 when processing the workpiece housed in the processing space 701, thus avoiding affecting the processing accuracy of the laser processing equipment 1000. Optionally, the cover plate 72 is hinged to the frame 71; or, the cover plate 72 and the frame 71 are movably connected via pivots. Furthermore, the cover plate 72 is rotatably connected to the first side plate 711. Optionally, the cover plate 72 is made of plastic or resin, and the cover plate 72 is injection molded from plastic or resin. The plastic or resin can be, but is not limited to, one or more of polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), polyvinyl chloride (PVC), polypropylene (PP), or polyethylene (PE).

[0128] Please refer to the following: Figure 1 and Figures 22 to 25 The frame mechanism 70 also includes a circuit board assembly 75, which is electrically connected to the camera 74. The circuit board assembly 75 is detachably mounted in the mounting slot 7313 of the mounting bracket 731. When the circuit board assembly 75 needs to be removed for maintenance, the protective cover 733 is removed first, and then the circuit board assembly 75 is removed to facilitate testing and maintenance.

[0129] Optionally, the circuit board assembly 75 includes a circuit board 751 and a fixing member 753. The circuit board 751 is detachably mounted in the mounting slot 7313 of the mounting bracket 731 via the fixing member 753. Optionally, the fixing member 753 includes a first fixing member 7531 and a second fixing member 7533. The first fixing member 7531 and the second fixing member 7533 are located at opposite ends of the circuit board 751, respectively. The first fixing member 7531 is positioned closer to the first side plate 711 than the second fixing member 7533. The first fixing member 7531 is provided with a mounting through hole 7314 so that a screwdriver can pass through the mounting through hole 7314 to install or remove the first fixing member 7531. Both the first fixing member 7531 and the second fixing member 7533 can be screws or bolts. Optionally, the number of first fixing members 7531 can be one or more. When there are multiple first fixing members 7531, the multiple first fixing members 7531 are arranged in a direction parallel to the first side plate 711 (e.g., ...). Figure 26 The second fasteners 7533 are arranged at intervals in the X direction. There can be one or more second fasteners 7533. When there are multiple second fasteners 7533, they are arranged at intervals along a direction parallel to the first side plate 711. Optionally, the circuit board assembly 75 is disposed at one end of the mounting bracket 731.

[0130] Please refer to the following: Figure 1 , Figure 3and Figure 29 The circuit board assembly 75 also includes a processor 755 and a memory 757. The processor 755 is electrically connected to the memory 757 and the camera 74, respectively. Both the processor 755 and the memory 757 are mounted on the circuit board 751. The processor 755 is used to run various programs and control the laser device 40 of the laser processing equipment 1000 to process the workpiece based on the image of the workpiece, the workpiece image, and the workpiece position information acquired by the camera 74. The memory 757 is used to store the program code required for the processor 755 to run, the workpiece image, etc. In this embodiment, the laser device 40 is electrically connected to the processor 755, so that under the control of the processor 755, the laser device 40 moves within the processing space 701 according to the workpiece image via the track device 20 to form a corresponding processing trajectory on the workpiece. Under the control of the processor 755, the processing mechanism 50 of the laser device 40 adjusts the distance between the processing mechanism 50 and the workpiece to process the workpiece.

[0131] Optionally, processor 755 includes one or more general-purpose processors, wherein the general-purpose processor can be any type of device capable of processing electronic instructions, including a central processing unit (CPU), microprocessor, microcontroller, main processor, controller, and ASIC, etc. Processor 755 is used to execute various types of digital storage instructions, such as software or firmware programs stored in memory 757, which enables the computing device to provide a wide range of services.

[0132] Optionally, memory 757 may include volatile memory, such as random access memory (RAM); memory 757 may also include non-volatile memory (NVM), such as read-only memory (ROM), flash memory (FM), hard disk drive (HDD), or solid-state drive (SSD). Memory 757 may also include combinations of the above types of memory.

[0133] Please refer to the following: Figure 1 , Figures 24 to 26 and Figure 28The frame mechanism 70 also includes an exhaust mechanism 76, which includes an exhaust fan 761. The exhaust fan 761 is mounted on the mounting bracket 731 and is used to exhaust the fumes generated when the laser processing equipment 1000 processes workpieces. Further, the exhaust fan 761 is located at the end of the mounting bracket 731 away from the circuit board assembly 75. Optionally, the exhaust fan 761 is located at one end of the mounting bracket 731, corresponding to the exhaust hole 7111 of the first side plate 711. This allows the entire laser processing equipment 1000 to have a more compact and miniaturized structure, achieving a desktop-level miniaturized design.

[0134] Optionally, the exhaust fan 761 has an air inlet 7611 and an air outlet 7613. The air outlet 7613 and the mounting bracket 731 form an exhaust chamber 7601. The air inlet 7611 is connected to the processing space 701. The exhaust fan 761 is used to discharge the smoke in the processing space 701 through the air inlet 7611 and the air outlet 7613. The plane where the air inlet 7611 is located forms a preset angle with the support table (i.e., the processing surface 717), and the preset angle α (e.g., ...) is... Figure 28 The range (shown) is 20° to 70°. This reduces the height occupied by the exhaust fan 761 within the entire laser processing equipment 1000, thereby reducing the overall height of the laser processing equipment 1000, making it more compact and easier for users to operate, for example, making it easier for users to place workpieces in the processing space 701. It also provides good smoke extraction. Optionally, the frame 71 has an exhaust port 7111 at the first side plate 711, and the exhaust chamber 7601 communicates with the exhaust port 7111 to exhaust smoke from the exhaust chamber 7601. When the laser processing equipment 1000 is operating, the exhaust fan 761 is turned on. Smoke generated in the processing space 701 enters the exhaust fan 761 through the air inlet 7611, is discharged through the air outlet 7613 to the exhaust chamber 7601, and then through the exhaust port 7111 to the outside of the laser processing equipment 1000.

[0135] Optionally, the preset included angle α can be, but is not limited to, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55°, 60°, 65°, 70°, etc. When the preset included angle is less than 20°, the smoke extraction effect is poor; when the preset included angle is greater than 70°, the space for lowering the laser processing equipment 1000 is limited. Furthermore, the range of the preset included angle is 30° to 60°. When the preset included angle is within this range, the smoke extraction effect can be guaranteed while allowing the laser processing equipment 1000 to have a lower height.

[0136] Optionally, the exhaust fan 761 and the mounting bracket 731 are detachable. This facilitates the removal of the exhaust fan 761 for cleaning. Optionally, the exhaust fan 761 is detachably mounted on the mounting bracket 731 by means of screws, bolts, or clips.

[0137] In one embodiment, the exhaust mechanism 76 further includes a smoke exhaust pipe 763, which is disposed on the surface of the first side plate 711 away from the exhaust fan 761 and is disposed corresponding to the exhaust hole 7111. The smoke exhaust pipe 763 is used to exhaust the smoke discharged by the exhaust fan 761 or to introduce it into an external smoke treatment device, such as smoke treatment liquid or smoke filter.

[0138] Optionally, the exhaust pipe 763 is detachably mounted on the surface of the first side plate 711 opposite to the exhaust fan 761. This allows the exhaust pipe 763 to be removed for easy transport when not in use, and it can also be removed for cleaning when necessary. Optionally, the exhaust pipe 763 is detachably mounted on the first side plate 711 using screws, bolts, or clips.

[0139] The above description discloses only preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. Therefore, equivalent variations made in accordance with the claims of the present invention are still within the scope of the present invention.

Claims

1. A laser processing device, characterized in that, include: Main body and frame structure; The main body includes a track device and a laser device; The track device includes a track frame assembly and a mounting assembly. The track frame assembly includes a track frame and an optical shaft disposed on the track frame. The mounting assembly includes a pulley with a groove, and the groove is slidably connected to the optical shaft. The laser device includes a housing, a guide optical axis, and a processing mechanism. The pulley is rotatably mounted on the housing, the guide optical axis is disposed on the housing, and the processing mechanism includes a laser housing slidably connected to the guide optical axis and a laser disposed on the laser housing. The axis of the optical axis is not collinear with the axis of the guide optical axis. The frame structure includes a frame, a support component, and a camera. The frame has a processing space for accommodating the main body. The support component includes a mounting bracket installed on the frame and located within the processing space. The mounting bracket has a mounting surface facing the processing space. The camera is disposed on the mounting surface of the mounting bracket. The laser device further includes a driving assembly, which includes a driving member disposed in the housing. The laser housing includes a guide portion corresponding to the guide optical axis. The guide portion is provided with guide holes that penetrate opposite end faces along the axial direction of the guide optical axis. The guide optical axis is movably disposed in the corresponding guide holes. The outer peripheral wall of the guide portion is provided with a rack extending axially along the guide optical axis. The drive assembly further includes a gear connected to the drive member and meshing with the rack. The drive member drives the gear to rotate so that the rack moves relative to the guide optical axis along the axial direction of the guide optical axis.

2. The laser processing equipment according to claim 1, characterized in that, The optical axis includes a first optical axis and a second optical axis. The pulley includes a first pulley slidably connected to the first optical axis and a second pulley slidably connected to the second optical axis. The first pulley is located between the first optical axis and the second optical axis, and the second pulley is located between the first optical axis and the second optical axis.

3. The laser processing equipment according to claim 2, characterized in that, The track frame has a groove, the first optical axis is at least partially located in the groove, the second optical axis is at least partially located in the groove, the first pulley is received in the groove, the second pulley is received in the groove, and the first optical axis and the second optical axis are arranged opposite to each other.

4. The laser processing equipment according to claim 3, characterized in that, The track frame includes a first connecting part and a second connecting part that are fixedly connected, and the first connecting part and the second connecting part form the groove; the first connecting part is recessed with a first receiving groove that communicates with the groove, and the first optical axis is fixedly received in the first receiving groove; the second connecting part is recessed with a second receiving groove that communicates with the groove, and the second optical axis is fixedly received in the second receiving groove.

5. The laser processing equipment according to claim 1, characterized in that, The optical axis includes a first optical axis and a second optical axis. The pulley includes a first pulley slidably connected to the first optical axis and a second pulley slidably connected to the second optical axis. The first optical axis is located between the first pulley and the second pulley, and the second optical axis is located between the first pulley and the second pulley.

6. The laser processing equipment according to claim 5, characterized in that, The track frame includes a first connecting part and a second connecting part fixedly connected to the first connecting part. The side of the first connecting part facing away from the second connecting part is recessed with a groove. The second connecting part is provided with a guide groove, the opening of which faces a different direction than the opening of the groove. The first optical axis is fixed to the inner wall of the guide groove, and the second optical axis is fixed to the end face of the first connecting part facing away from the second connecting part. The first connecting part is located between the first pulley and the second pulley, and the first pulley is received in the guide groove.

7. The laser processing equipment according to claim 1, characterized in that, The mounting assembly further includes a mounting base, which includes a mounting plate and a connector fixed to the mounting plate. The pulley is mounted on the mounting plate. The track device further includes a transmission assembly, which includes a driving wheel, a driven wheel, and a timing belt. The driving wheel is connected to a driver, the driven wheel is rotatably mounted on the track frame, the timing belt is sleeved on the driving wheel and the driven wheel, and the connector is connected to the timing belt. The rotation of the driving wheel can drive the timing belt to move, thereby driving the mounting assembly to move linearly along the optical axis. And / or, the housing is provided with a connecting part corresponding to the guide optical axis, the connecting part is provided with a connecting hole, and the end of the guide optical axis is inserted into the connecting hole.

8. The laser processing equipment according to claim 1, characterized in that, The laser device further includes a drive control component, which includes a first control board electrically connected to the drive component. The first control board is used to transmit a first control signal to the drive component to control the drive component to drive the laser housing to move relative to the housing along the axial direction of the guide optical axis.

9. The laser processing equipment according to claim 8, characterized in that, The drive control assembly also includes a reset sensor disposed on the first control board. The reset sensor is electrically connected to the first control board, and the first control board is connected to the housing. The laser housing is provided with a reset component, and the reset component cooperates with the reset sensor to output a reset signal.

10. The laser processing equipment according to claim 1, characterized in that, The processing mechanism further includes a heat sink, which includes a plurality of heat-conducting fins disposed on the outer peripheral surface of the laser, each heat-conducting fin extending axially along the guide optical axis; the laser device further includes a fan connected to the housing, the fan corresponding to the heat sink.

11. The laser processing equipment according to any one of claims 1 to 10, characterized in that, The processing mechanism further includes a cutting tool mechanism, which is connected to the laser housing and moves relative to the housing along with the laser housing.

12. The laser processing equipment according to claim 1, characterized in that, The mounting bracket is provided with a receiving groove, which is located on the mounting surface. The equivalent circle diameter of the receiving groove gradually decreases from the mounting surface to the bottom of the receiving groove, and the camera is disposed at the bottom of the receiving groove. And / or, the frame has a first opening and a processing surface, the first opening communicating with the processing space, the processing surface located at the end of the frame away from the first opening and within the processing space; the processing surface includes a first end and a second end disposed opposite to each other, the plane formed by the camera and the first end is a first plane, the plane formed by the camera and the second end is a second plane, the angle between the optical axis of the camera and the first plane and the angle between the axis of symmetry of the camera and the second plane are equal; And / or, the frame has a first opening and a processing surface, the first opening is in communication with the processing space, the processing surface is located at the end of the frame away from the first opening and within the processing space, and the angle between the axis of symmetry of the camera and the processing surface is 30° to 60°; And / or, the frame mechanism further includes a circuit board assembly and an exhaust mechanism. The circuit board assembly is electrically connected to the camera and is detachably disposed in the mounting slot of the mounting bracket. The circuit board assembly includes a processor and a memory. The processor is electrically connected to the memory and the camera respectively, and is used to control the laser processing equipment to perform processing. The memory is used for storage. The exhaust mechanism includes an exhaust fan, which is disposed at one end away from the circuit board assembly and is used to exhaust smoke in the processing space.

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