Display module and display device

Abstract

The application provides a display module and a display device. The display module comprises a display panel, a flexible circuit board, a panel bump and a glue. The display panel has a first surface and a second surface arranged oppositely; the display panel comprises a display part, a bending part and a binding part connected in sequence. The flexible circuit board is arranged on one side of the first surface of the binding part and extends along the direction of the binding part away from the bending part to form a glue-coated part exposed to the first end surface, and the first end surface is the end surface of one end of the binding part away from the bending part. The panel bump is distributed on the first surface of the binding part and at least partially exposed to the first end surface, and is used for connecting the display panel and the flexible circuit board. The glue is arranged between the first end surface and a supporting surface, and at least part of the glue covers the panel bump; and the supporting surface is the surface of the glue-coated part close to one side of the binding part. The risk of the panel bump of the display panel suffering from salt mist or water vapor erosion can be reduced, and the display module can be prevented from having no display or abnormal display defects.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display module and a display device. Background Technology

[0002] In recent years, foldable and bendable display devices have become increasingly popular, and flexible display panels have attracted more and more attention due to their flexibility and ability to be bent into curved surfaces. Curved display devices with a certain angle made of flexible display panels (such as curved screens and waterfall screens) are favored by consumers because of their beautiful curves, comfortable feel, and high screen-to-body ratio.

[0003] However, flexible display panels are susceptible to salt spray or moisture intrusion during use and testing, which can lead to display module malfunctions such as no display or abnormal display. Summary of the Invention

[0004] This application addresses the shortcomings of existing technologies by proposing a display module and display device to solve the technical problem that display modules in the prior art are easily subject to salt spray or water vapor intrusion during use and testing.

[0005] This application provides a display module. The display module includes: a display panel, a flexible circuit board, panel protrusions, and an adhesive. The display panel has a first surface and a second surface disposed opposite to each other; the display panel includes a display portion, a bending portion, and a bonding portion connected in sequence; the bending portion is bendable so that the bonding portion bends to the side where the second surface of the display portion is located; the flexible circuit board is disposed on the side where the first surface of the bonding portion is located, the flexible circuit board extends along the bonding portion away from the bending portion and forms an adhesive portion exposed on a first end face, the first end face being the end face of the bonding portion away from the bending portion; the panel protrusions are distributed on the first surface of the bonding portion and at least partially exposed on the first end face, for connecting the display panel and the flexible circuit board; the adhesive is disposed between the first end face and a supporting surface, at least partially covering the panel protrusions; the supporting surface is the surface of the adhesive portion near the bonding portion.

[0006] As can be seen from the above embodiments, compared with the COP (Chip On Pi) packaging process in related technologies where the display panel extends relative to the flexible circuit board in a direction away from the bending portion along the bonding portion, this embodiment forms an adhesive coating portion in the bonding area of ​​the display module by extending the flexible circuit board relative to the bonding portion of the display panel in a direction away from the bending portion. The adhesive coating portion and the end of the bonding portion of the display panel away from the bending portion enclose a region of supporting adhesive, so that the adhesive at least partially covers the panel protrusions exposed on the cut surface of the display panel, thereby reducing the risk of the panel protrusions of the display panel being corroded by salt spray or moisture, and avoiding the display module from having no display or abnormal display failure.

[0007] In one embodiment, the display module further includes a flexible circuit board protrusion;

[0008] The flexible circuit board protrusions are distributed on the surface of the flexible circuit board near the bonding portion and are connected to the panel protrusions; at least part of the colloid covers the flexible circuit board protrusions.

[0009] In one embodiment, the display module further includes a support layer;

[0010] The support layer is disposed on the side of the display panel away from the flexible circuit board. The point of the colloid furthest from the flexible circuit board along the first direction does not exceed the surface of the support layer on the side away from the bonding portion. The first direction is perpendicular to the surface of the display panel.

[0011] In one embodiment, the side of the colloid away from the flexible circuit board is flush with the side of the support layer away from the display panel.

[0012] This application also provides another display module. The display module includes: a display panel, a flexible circuit board, a first thin film, first thin film protrusions, and an adhesive. The display panel has a first surface and a second surface disposed opposite to each other; the display panel includes a display portion, a bending portion, and a bonding portion connected in sequence; the bending portion is bendable so that the bonding portion bends to the side where the second surface of the display portion is located; the flexible circuit board is disposed on the side where the first surface of the bonding portion is located; the first thin film is disposed between the flexible circuit board and the display panel, the flexible circuit board extending along the first thin film away from the bending portion and forming an adhesive portion exposed on a second end face, the second end face being the end face of the first thin film away from the bending portion; the first thin film protrusions are distributed on the side of the first thin film away from the display panel and are at least partially exposed on the second end face, for connecting the flexible circuit board and the first thin film; the adhesive is disposed between the second end face and a supporting surface, at least partially covering the first thin film protrusions; the supporting surface is the surface of the adhesive portion near the bonding portion.

[0013] As can be seen from the above embodiments, compared with the COF (Chip On Film) packaging process in related technologies where the end faces of the flip-chip film and the flexible circuit board are flush along the bonding portion away from the bending portion, this embodiment extends the flexible circuit board relative to the first film along the bonding portion of the display panel away from the bending portion to form an adhesive coating portion in the bonding area of ​​the display module. The adhesive coating portion and the first film along the bonding portion of the display panel away from the bending portion form a region of supporting adhesive, so that the adhesive at least partially covers the first film protrusion exposed on the cut surface, thereby reducing the risk of the display panel being corroded by salt spray or moisture and avoiding the display module from having no display or abnormal display failure.

[0014] In one embodiment, the display module further includes a flexible circuit board protrusion;

[0015] The flexible circuit board protrusions are distributed on the surface of the flexible circuit board near the bonding portion and are connected to the first film protrusions; at least part of the colloid covers the first film protrusions.

[0016] In one embodiment, the point of the colloid furthest from the flexible circuit board along a first direction does not exceed the surface of the first film on the side away from the bonding portion, and the first direction is perpendicular to the surface of the display panel.

[0017] In one embodiment, the side of the colloid away from the flexible circuit board is flush with the side of the first film away from the display panel.

[0018] In one embodiment, the colloid comprises a photosensitive adhesive or a pressure-sensitive adhesive.

[0019] This application also provides a display device, including the display panel as described above.

[0020] Additional aspects and advantages of this application will be set forth in part in the description which follows, and will become apparent from the description or may be learned by practice of this application. Attached Figure Description

[0021] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0022] Figure 1 This is a schematic diagram of the structure of a display module according to existing technology;

[0023] Figure 2 This is a schematic diagram of the structure of a display module according to an embodiment of this application;

[0024] Figure 3This is a schematic diagram of another display module structure according to an embodiment of this application;

[0025] Figure 4 This is a schematic diagram of another display module structure based on existing technology;

[0026] Figure 5 This is a schematic diagram of the structure of another display module according to an embodiment of this application;

[0027] Figure 6 This is a schematic diagram of another display module structure according to an embodiment of this application;

[0028] Figure 7 This application Figure 2 A top view of the display panel in the central display module;

[0029] Figures 8-11 This is a flowchart illustrating the manufacturing process of a display module provided in this application.

[0030] In the picture:

[0031] 1-Display panel; 101-First surface; 102-Second surface; 11-Display part; 12-Bending part; 13-Binding part; 131-First end face; 2-Flexible circuit board; 21-Glue application part; 211-Supporting surface; 3-Adhesive; 4-Panel protrusion; 5-Flexible circuit board protrusion; 6-Supporting layer; 7-First thin film; 71-Second end face; 8-First thin film protrusion; 9-Driver chip; 10-Polarizer; 14-Adhesive layer; 15-Cover plate; 16-Stress neutral layer; 17-Protective film. Detailed Implementation

[0032] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0033] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0034] The research and development approach of this application includes:

[0035] Currently, there are three packaging processes in the display technology industry: COG (Chip On Glass) packaging process, COF (Chip On Film) packaging process, and COP (Chip On Pi) packaging process.

[0036] In COP (Chip On Pi) process design, such as Figure 1 As shown, the driver chip (Integrated Circuit Chip, IC) is first bonded to the display panel (PNL), and then the FOP bonding process (FPC On COPBonding) is performed to bond the flexible printed circuit (FPC) corresponding to the driver chip to the display panel. In related technologies, panel bumps are distributed on the side of the display panel near the flexible printed circuit board within the bonding area of ​​the display module. Typically, in the manufacturing process, a single display panel is cut from a large panel into sections. Therefore, the panel bumps on the display panel are partially exposed at the cut surface, making them susceptible to salt spray or moisture corrosion. However, in related technologies, the display panel extends beyond the flexible printed circuit board along the bonding area away from the bend. Therefore, the end of the bonding area away from the bend lacks support for the adhesive, making it impossible to use an adhesive coating process to encapsulate and protect the cut surface. This results in a high risk of display defects caused by salt spray or moisture corrosion of the bonding area.

[0037] "COF" (Chip On Flex or Chip On Film), also known as flip-chip film, is... Figure 4 The first thin film shown is first bonded to the display panel during the manufacturing process, then the driver chip is bonded to the first thin film, and finally the flexible circuit board is bonded to the first thin film. In related technologies, within the bonding area of ​​the display module, the first thin film and the flexible circuit board are flush at the end of the bonding portion of the display panel away from the bending portion. Therefore, the side of the flexible circuit board near the bonding portion is completely covered by the first thin film, leaving no extra space for adhesive application. This results in a higher risk of display defects caused by salt spray or moisture corrosion of the bonding area.

[0038] The display module and display device provided in this application are intended to solve the above-mentioned technical problems of the prior art.

[0039] The display module and display device in the embodiments of this application will now be described in detail with reference to the accompanying drawings. Unless otherwise specified, the features in the following embodiments may complement or combine with each other.

[0040] This application provides a display module. For example... Figure 2As shown, the display module includes: a display panel 1, a flexible circuit board 2, panel protrusions 4, and a colloid 3. The display panel 1 has a first surface 101 and a second surface 102 disposed opposite to each other. The display panel 1 includes a display portion 11, a bending portion 12, and a bonding portion 13 connected in sequence. The bending portion 12 is bendable so that the bonding portion 13 bends to the side where the second surface 102 of the display portion 11 is located. The flexible circuit board 2 is disposed on the side where the first surface 101 of the bonding portion 13 is located. The flexible circuit board 2 extends along the direction of the bonding portion 13 away from the bending portion 12 and forms an adhesive portion 21 exposed on the first end face 131. The first end face 131 is the end face of the bonding portion 13 away from the bending portion 12. Panel protrusions 4 are distributed on the first surface 101 of the bonding portion 13 and are at least partially exposed on the first end face 131 for connecting the display panel 1 and the flexible circuit board 2. Adhesive 3 is disposed between the first end face 131 and the support surface 211, and at least part of the adhesive 3 covers the panel protrusions 4. The support surface 211 is the surface of the adhesive portion 21 on the side near the bonding portion 13.

[0041] As can be seen from the above embodiments, relative to Figure 1 In the related COP (Chip On Pi) packaging process, the display panel 1 extends relative to the flexible circuit board 2 in the direction away from the bending portion 12 along the bonding portion 13. In this embodiment, the flexible circuit board 2 extends relative to the bonding portion 13 of the display panel 1 in the direction away from the bending portion 12 to form an adhesive coating portion 21 in the bonding area of ​​the display module. The adhesive coating portion 21 and the end of the bonding portion 13 of the display panel 1 away from the bending portion 12 enclose a region forming a supporting adhesive 3. The adhesive 3 at least partially covers the panel protrusion 4 of the display panel 1 exposed at the cut surface, thereby reducing the risk of the panel protrusion 4 of the display panel 1 being corroded by salt spray or moisture, and avoiding the display module from having no display or abnormal display failure.

[0042] In some embodiments, the display module further includes a polarizer 10 (POL), which is disposed on the side of the display panel 1 near the first surface 101 to suppress the reflection interference of ambient light.

[0043] In some embodiments, the display module further includes a cover plate 15, which is disposed on the side of the polarizer 10 away from the display panel 1. It should be noted that the cover plate 15 in this application is made of a foldable flexible material, which can be CPI (colorless polyimide), PET (polyethylene terephthalate), or UTG (ultra-thin glass).

[0044] In some embodiments, the cover plate 15 and the polarizer 10 are bonded and fixed together by an adhesive layer 14. Specifically, the adhesive layer 14 can be made of OCA (Optically Clear Adhesive).

[0045] In some embodiments, the display module further includes a stress neutral layer 16 disposed on the outside of the bending portion 12. The stress neutral layer 16 may be made of MCL adhesive and is used to protect the bending portion 12 of the display panel 1.

[0046] In some embodiments, the display module further includes: flexible circuit board protrusions 5. The flexible circuit board protrusions 5 are distributed on the surface of the flexible circuit board 2 near the bonding portion 13 and are connected to the panel protrusions 4; at least a portion of the adhesive 3 covers the flexible circuit board protrusions 5.

[0047] In this embodiment, at least part of the colloid 3 covers the protrusion of the flexible display panel 1, which can protect the structure of the flexible circuit board 2 by the colloid 3 and prevent the flexible circuit board 2 from being corroded by salt spray or moisture, thereby avoiding the display module from having no display or abnormal display defects.

[0048] In some embodiments, the flexible circuit board protrusions 5 fill the recesses of the flexible circuit board 2.

[0049] In some embodiments, the orthographic projections of the flexible circuit board protrusion 5 and the panel protrusion 4 onto the surface of the display panel 1 at least partially overlap, thereby achieving bonding between the flexible circuit board 2 and the display panel 1.

[0050] In some embodiments, the orthographic projections of the flexible circuit board protrusion 5 and the panel protrusion 4 on the display panel 1 are completely aligned, thereby achieving a tighter fit between the flexible circuit board 2 and the display panel 1.

[0051] In some embodiments, the flexible panel protrusion 4 is connected to the panel protrusion 4 by adhesive bonding.

[0052] In some embodiments, the display module further includes a support layer 6. The support layer 6 is disposed on the side of the display panel 1 away from the flexible circuit board 2, and the point of the colloid 3 farthest from the flexible circuit board 2 along a first direction does not exceed the surface of the support layer 6 away from the bonding portion 13, and the first direction is perpendicular to the surface of the display panel 1.

[0053] In this embodiment, a protective film 17 is provided on the side of the support layer 6 away from the display panel 1 in the relevant technical process. This film is removed after the display module is manufactured. If the area covered by the colloid 3 in the first direction perpendicular to the display panel 1 exceeds the side of the support layer 6 away from the display panel 1, it will cause the colloid 3 to tear when the protective film 17 is removed, thereby destroying the protective effect of the colloid 3 on the display panel 1 and causing the display module to have no display / abnormal display defects.

[0054] In some embodiments, such as Figure 2 As shown, the flexible circuit board 2 extends relative to the display panel 1 along the bonding portion 13 away from the bending portion 12 and forms an adhesive coating portion 21 exposed on the first end face 131. The exposed dimension of the adhesive coating portion 21 along the extension direction is 1.5 mm, and the dimension of the adhesive 3 on the adhesive coating portion 21 along the extension direction is 0.5 to 0.8 mm. The thickness of the display panel 1 is 38 μm, the thickness of the support layer 6 is 65 μm, and the center thickness of the adhesive 3 is 90 μm.

[0055] In some embodiments, such as Figure 3 As shown, the side of the colloid 3 away from the flexible circuit board 2 is flush with the side of the support layer 6 away from the display panel 1.

[0056] In one example, the thickness of the display panel 1 is 38 μm, the thickness of the support layer 6 is 60 μm, and the center thickness of the colloid 3 is 98 μm.

[0057] In one example, the thickness of the display panel 1 is 40 μm, the thickness of the support layer 6 is 60 μm, and the center thickness of the colloid 3 is 100 μm.

[0058] Based on the same inventive concept, embodiments of this application also provide another display module. For example... Figure 5 As shown, the display module includes: a display panel 1, a flexible circuit board 2, a first thin film 7, a first thin film protrusion 8, and an colloid 3. The display panel 1 has a first surface 101 and a second surface 102 disposed opposite to each other. The display panel 1 includes a display portion 11, a bending portion 12, and a bonding portion 13 connected in sequence. The bending portion 12 is bendable so that the bonding portion 13 bends to the side where the second surface 102 of the display portion 11 is located. A flexible circuit board 2 is disposed on the side where the first surface 101 of the bonding portion 13 is located. A first film 7 is disposed between the flexible circuit board 2 and the display panel 1. The flexible circuit board 2 extends along the direction of the first film 7 away from the bending portion 12 and forms an adhesive portion 21 exposed on the second end face 71. The second end face 71 is the end face of the first film 7 away from the bending portion 12. First film protrusions 8 are distributed on the side of the first film 7 away from the display panel 1 and are at least partially exposed on the second end face 71 for connecting the flexible circuit board 2 and the first film 7. An adhesive 3 is disposed between the second end face 71 and a support surface 211, and at least part of the adhesive 3 covers the first film protrusions 8. The support surface 211 is the surface of the adhesive portion 21 near the bonding portion 13.

[0059] As can be seen from the above embodiments, relative to Figure 4In the related technology of COF (Chip On Film) packaging process, the end faces of the flip-chip film and the flexible circuit board 2 are flush along the direction away from the bending portion 12 of the bonding portion 13. In this embodiment, the flexible circuit board 2 extends relative to the first film 7 in the bonding area of ​​the display module to form an adhesive coating portion 21 along the direction away from the bending portion 12 of the bonding portion 13 of the display panel 1. The adhesive coating portion 21 and the first film 7 are enclosed between the end of the bonding portion 13 of the display panel 1 away from the bending portion 12 to form a region of supporting adhesive 3. The adhesive 3 at least partially covers the first film 7 exposed on the cut surface of the first film protrusion 8, thereby reducing the risk of the display panel 1 being corroded by salt spray or moisture and avoiding the display module from having no display or abnormal display failure.

[0060] In some embodiments, the display module further includes a flexible circuit board protrusion 5;

[0061] The flexible circuit board protrusions 5 are distributed on the surface of the flexible circuit board 2 near the bonding portion 13 and are connected to the first film protrusions 8; at least part of the adhesive 3 covers the first film protrusions 8.

[0062] In some embodiments, such as Figure 5 As shown, the point of the colloid 3 furthest from the flexible circuit board 2 along the first direction does not exceed the surface of the first film 7 on the side away from the bonding part 13, and the first direction is perpendicular to the surface of the display panel 1.

[0063] In some embodiments, such as Figure 6 As shown, the side of the colloid 3 away from the flexible circuit board 2 is flush with the side of the first film 7 away from the display panel 1.

[0064] The principle behind the beneficial effects achieved by the above embodiments is the same as that of the foregoing embodiments, and will not be repeated here.

[0065] In some embodiments, colloid 3 includes photosensitive adhesive or pressure-sensitive adhesive.

[0066] In one example, colloid 3 can be a UV-curable adhesive (UV adhesive), such as... Figure 7 As shown, liquid adhesive is sprayed along the step formed by the display panel 1 and the flexible circuit board 2 through a pressure adhesive valve and cured by UV light source irradiation.

[0067] In some embodiments, the display module further includes a protective film disposed on the side of the support layer 6 away from the second surface 102 to provide support. The protective film may be made of PET (polyethylene terephthalate) film or PI (polyimide) film.

[0068] Based on the same inventive concept, such as Figures 8-11As shown in the figure, this application embodiment also provides a manufacturing process for a display module, including:

[0069] S101: The driver chip 9 is bonded to the first surface 101 of the bonding part 13 of the display panel 1;

[0070] S102: The flexible circuit board 2 is bonded to the first surface 101 of the bonding portion 13 of the display panel 1 (the driver chip 9 is located between the flexible circuit board 2 and the display panel 1), and the flexible circuit board 2 is extended along the bonding portion 13 away from the bending portion 12 to form an adhesive portion 21 exposed on the first end face 131. The first end face 131 is the end face of the bonding portion 13 away from the bending portion 12.

[0071] S103: Performs automated resistance testing (ART) and automated optical inspection (AOI) on the display module;

[0072] S104: Apply adhesive 3 to the adhesive coating section 21 to cover the panel protrusion 4;

[0073] S105: Perform automatic middle inspection (AMI) on the display module;

[0074] S106: Peel off the protective film 17 on the side of the support layer 6 away from the display panel 1, and bend the panel (pad bending) so that the binding part 13 is bent to the side where the second surface 102 of the display part 11 is located.

[0075] In this embodiment, applying adhesive to the cut surfaces of the display module before the pad bending encapsulation process can cover the cut surfaces with adhesive, thereby preventing salt spray or moisture intrusion that could lead to panel corrosion.

[0076] Based on the same inventive concept, this application also provides another manufacturing process for a display module, including:

[0077] S201: The first thin film 7 is bonded to the first surface 101 of the bonding portion 13 of the display panel 1;

[0078] S202: Fix the driver chip 9 to the side of the first thin film 7 away from the display panel 1;

[0079] S203: The flexible circuit board 2 is bonded to the first surface 101 of the bonding portion 13 of the display panel 1 (the driver chip 9 is located between the flexible circuit board 2 and the first film 7), and at the same time, the flexible circuit board 2 is extended along the direction away from the bending portion 12 of the first film 7 and forms an adhesive portion 21 exposed on the second end face 71, the second end face 71 being the end face of the first film 7 away from the bending portion 12.

[0080] S204: Perform Automated Resistance Testing (ART) and Automated Optical Inspection (AOI) on the display module;

[0081] S205: Apply adhesive to the adhesive application area to cover panel protrusions;

[0082] S206: Perform automatic middle inspection (AMI) on the display module;

[0083] S207: Pad bending, which bends the binding part to the side where the second surface of the display part is located.

[0084] Based on the same inventive concept, this application provides a display device. The display device includes the aforementioned display module. Therefore, the display device possesses all the features and advantages of the aforementioned display module, which will not be repeated here.

[0085] It should be noted that the display device can be any device that displays images, whether moving (e.g., video) or fixed (e.g., still images), and whether it contains text or images. More specifically, the intended embodiments can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controllers and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0086] The above embodiments of this application can complement each other without causing conflict.

[0087] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0088] The terms “center,” “upper,” “lower,” “front,” “back,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0089] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0090] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the claims.

[0091] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A display module, characterized in that, include: The display panel has a first surface and a second surface that are disposed opposite to each other; the display panel includes a display part, a bending part and a binding part connected in sequence; The bending portion is capable of bending so that the bonding portion bends to the side where the second surface of the display portion is located; A flexible circuit board is disposed on one side of the first surface of the bonding portion. The flexible circuit board extends along the bonding portion away from the bending portion and forms an adhesive portion exposed on the first end face. The first end face is the end face of the bonding portion away from the bending portion. The flexible circuit board is also provided with a groove for accommodating a driver chip. A panel protrusion is distributed on the first surface of the bonding portion and is at least partially exposed on the first end face, for connecting the display panel and the flexible circuit board. The side of the panel protrusion away from the second surface is flush with the portion of the first surface not covered by the panel protrusion. An adhesive is disposed between the first end face and the supporting surface, and at least part of the adhesive covers the panel protrusion; the supporting surface is the surface of the adhesive portion near the bonding portion. At least one sidewall of the panel protrusion is covered by the colloid and the display panel; The display module further includes: a flexible circuit board protrusion; The flexible circuit board protrusions are distributed on the surface of the flexible circuit board near the bonding portion and are connected to the panel protrusions; at least part of the adhesive covers the flexible circuit board protrusions, and the side surface of the flexible circuit board protrusions near the bonding portion is flush with the part of the side surface of the flexible circuit board near the bonding portion that is not covered by the flexible circuit board protrusions, and the two opposing surfaces of the display panel and the flexible circuit board are bonded together; at least one sidewall of the flexible circuit board protrusions is covered by the flexible circuit board.

2. The display module according to claim 1, characterized in that, The display module further includes: a support layer; The support layer is disposed on the side of the display panel away from the flexible circuit board. The point of the colloid furthest from the flexible circuit board along the first direction does not exceed the surface of the support layer on the side away from the bonding portion. The first direction is perpendicular to the surface of the display panel.

3. The display module according to claim 2, characterized in that, The side of the colloid away from the flexible circuit board is flush with the side of the support layer away from the display panel.

4. A display module, characterized in that, include: The display panel has a first surface and a second surface that are disposed opposite to each other; the display panel includes a display part, a bending part and a binding part connected in sequence; The bending portion is capable of bending so that the bonding portion bends to the side where the second surface of the display portion is located; A flexible circuit board is disposed on one side of the first surface of the bonding portion; the flexible circuit board is also provided with a groove for accommodating the driver chip; A first thin film is disposed between the flexible circuit board and the display panel. The flexible circuit board extends along the first thin film away from the bending portion and forms an adhesive portion exposed on a second end face. The second end face is the end face of the first thin film away from the bending portion. The first film protrusion is distributed on the side of the first film away from the display panel and is at least partially exposed on the second end face. It is used to connect the flexible circuit board and the first film. The surface of the first film protrusion away from the second surface is flush with the part of the surface of the first film close to the flexible circuit board that is not covered by the first film protrusion. An adhesive is disposed between the second end face and the supporting surface, and at least part of the adhesive covers the first film protrusion; the supporting surface is the surface of the adhesive portion near the bonding portion. At least one sidewall of the first film protrusion is covered by the colloid and the first film; The display module further includes: a flexible circuit board protrusion; The flexible circuit board protrusions are distributed on the surface of the flexible circuit board near the bonding portion and are connected to the first film protrusions; at least part of the adhesive covers the first film protrusions, and the side surface of the flexible circuit board protrusions near the bonding portion is flush with the part of the side surface of the flexible circuit board near the bonding portion that is not covered by the flexible circuit board protrusions, and the two opposing surfaces of the first film and the flexible circuit board are bonded together; at least one sidewall of the flexible circuit board protrusions is covered by the flexible circuit board.

5. The display module according to claim 4, characterized in that, The point of the colloid furthest from the flexible circuit board along the first direction does not exceed the surface of the first film on the side away from the bonding portion, and the first direction is perpendicular to the surface of the display panel.

6. The display module according to claim 5, characterized in that, The side of the colloid away from the flexible circuit board is flush with the side of the first film away from the display panel.

7. The display module according to any one of claims 1 to 6, characterized in that, The colloid includes photosensitive adhesive or pressure-sensitive adhesive.

8. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 7.

Images