LED display module mask filler, packaging method and packaging structure

Abstract

The present application relates to a kind of LED display module mask filler, packaging method and packaging structure.LED display module mask filler includes first filling particle, second filling particle and hot melt particle, the size of first filling particle is less than the size of gap space, the size of second filling particle is less than the size of first filling particle, the size of hot melt particle is less than the size of second filling particle;LED display module packaging method can be used LED display module mask filler to LED display module is packaged, including the following steps: S1: to the gap space of LED display module fills filler;S2: to LED display module is heated, so that hot melt particle in filler melts;S3: to filler is cooled, so that hot melt material solidifies.The mask generated by the method is distributed in the gap space between the two adjacent lamp beads, can prevent the light of the two adjacent lamp beads, while the rough surface of mask can reduce reflection, effectively improve the contrast and display effect of LED display module.

Description

Technical Field

[0001] This invention relates to the field of LED display technology, and in particular to LED display module mask filler, encapsulation method and encapsulation structure. Background Technology

[0002] LED display module LED chips are surface-mounted on the PCB using SMD packaging technology. To protect the LED chips and improve the contrast and consistency of the module, a mask is usually used to fill the surface of the LED chips. Existing masks are used to fill the gaps between LED chips, protecting the solder pads of the LED chips from impacts, while also blocking the ink on the PCB to improve the contrast of the module.

[0003] However, existing face masks have a series of shortcomings, including susceptibility to heat deformation. After deformation, the face mask will bulge and collapse, resulting in uneven gaps between the LED bead panels, affecting display quality. Deformation of the face mask can also cause LEDs to pull, leading to poor contact of the LED beads or even LEDs falling off. Summary of the Invention

[0004] Therefore, it is necessary to provide an LED display module mask filler, packaging method, and packaging structure to address the problem of poor packaging quality of LED display modules.

[0005] An LED display module mask filler is disclosed. The LED display module includes a circuit board and multiple LED beads, which are arranged sequentially at intervals on the circuit board. A gap space is provided between two adjacent LED beads. The filler is used to fill the gap space. The filler includes a first filler particle, a second filler particle, and a hot-melt particle. The size of the first filler particle is smaller than the size of the gap space, the size of the second filler particle is smaller than the size of the first filler particle, and the size of the hot-melt particle is smaller than the size of the second filler particle.

[0006] The aforementioned LED display module mask filler includes first filler particles, second filler particles, and hot-melt particles. When used as a mask encapsulation material, the filler needs to be heated. After the hot-melt particles melt, they bond the first and second filler particles together. The first filler particles form the main filling structure and are spaced apart after curing. The second filler particles fill the gaps between the first filler particles, making the mask structure dense and uniform, forming a stable, integrated mask structure after curing. Therefore, the first filler particles form the main frame of the mask and create a rough surface on the mask surface to prevent reflection. The second filler particles fill the gaps between the first filler particles, making the mask structure more stable. The hot-melt particles bond the first and second filler particles together, ensuring stable mask formation. Furthermore, the granular filler material itself has high elasticity. Even if a certain amount of deformation occurs during the heating process, the pressure exerted on the LED beads is very small. After the particles are filled, they are densely and evenly distributed. However, from a local perspective, their structure is not integrated. There are also some small air gaps distributed inside the formed mask. Even if thermal deformation occurs, it will not lead to an overall bulge or collapse.

[0007] In one embodiment, the filler further includes blackened particles, the size of which is smaller than that of the second filler particles. The blackened particles are used to adjust the blackness of the mask; due to their small size, they can adhere evenly to both the first and second filler particles, ensuring uniform color.

[0008] In one embodiment, the filler is made from the following raw materials in parts by weight: the first filler particle 10, the second filler particle 10, and the hot melt particles 1-10.

[0009] An LED display module encapsulation method, which encapsulates an LED display module using the aforementioned LED display module mask filler, includes the following steps:

[0010] S1: Fill the gaps between the LED display modules with filler;

[0011] S2: The LED display module is heated so that the hot-melt particles in the filler melt.

[0012] S3: Cool the filler to solidify the hot melt material.

[0013] The aforementioned LED display module encapsulation method utilizes LED display module mask filler to encapsulate the LED display module. During the encapsulation process, filler is first added to the gaps between the LED display modules. Then, the LED display module is heated, causing the hot-melt particles in the filler to melt. Finally, the filler is cooled, solidifying the hot-melt material. Therefore, the gaps between the LED display modules are filled with molten filler, and the filler in adjacent gaps adheres to each other, forming a stable mesh-like mask. This mask is distributed between adjacent LED beads, preventing light leakage between adjacent beads. Simultaneously, the rough surface of the mask reduces reflection, effectively improving the contrast and display effect of the LED display module. Furthermore, the granular filler material itself has high elasticity; even if a certain amount of deformation occurs during heating, the pressure exerted on the LED beads is very small. After filling, the particles are densely and uniformly distributed, but from a local perspective, their structure is not entirely integrated. Small air gaps are distributed within the formed mask, preventing overall bulging or collapse even if thermal deformation occurs.

[0014] In one embodiment, step S1 includes the following steps:

[0015] S11: The filler is evenly spread on the display surface of the LED display module;

[0016] S12: Press down on the filler on the display surface to allow the filler to enter the gap space.

[0017] In one embodiment, after step S12, the following step is further included:

[0018] S13: Clean the filler protruding from the display surface.

[0019] In one embodiment, after step S3, the following step is further included:

[0020] S4: Cover the display surface with a protective layer.

[0021] In one embodiment, between step S3 and step S4, the following step is further included:

[0022] S31: Clean the filler protruding from the display surface.

[0023] In one embodiment, between step S3 and step S4, the following step is further included:

[0024] S32: Detect the effectiveness of each LED bead on the LED display module.

[0025] An LED display module packaging structure, manufactured using the aforementioned LED display module packaging method, includes a circuit board, multiple LED beads, and filler. The multiple LED beads are sequentially and spaced apart on the circuit board, with a gap space between adjacent LED beads. The filler is located within the gap space, and the fillers in adjacent gap spaces are bonded to each other to form the mask of the LED display module.

[0026] In the aforementioned LED display module packaging structure, the gaps between the LED beads are filled with molten filler, and the filler in adjacent gaps adheres to each other, forming a stable mesh-like mask. This mask, distributed between adjacent LED beads, prevents light leakage between them. Simultaneously, the rough surface of the mask reduces reflection, effectively improving the contrast and display effect of the LED display module. Furthermore, the granular filler material itself has high elasticity; even if it deforms during heating, the pressure exerted on the LED beads is very small. The particles are densely and uniformly distributed after filling, but locally, the structure is not a unified whole. Small air gaps are distributed within the formed mask, preventing overall bulging or collapse even if thermal deformation occurs. Attached Figure Description

[0027] Figure 1 This is a flowchart of an LED display module packaging method in one embodiment;

[0028] Figure 2 This is a flowchart of an LED display module packaging method in another embodiment;

[0029] Figure 3 This is a schematic diagram of the structure of an LED display module packaging device in one embodiment;

[0030] Figure 4 This is a schematic diagram of the structure of the pressure member in one embodiment;

[0031] Figure 5 This is a top view of the pressure member and the conveyor belt in one embodiment;

[0032] Figure 6 This is a top view of the LED display module before encapsulation in one embodiment;

[0033] Figure 7 This is a cross-sectional view of the LED display module before encapsulation in one embodiment;

[0034] Figure 8 This is a cross-sectional view of the packaged LED display module in one embodiment.

[0035] Reference numerals: 100, LED display module packaging equipment; 10, filling module; 11, material mixing bin; 12, pressing component; 121, elastic pressing part; 122, brush part; 13, washing component; 131, roller; 14, feeding belt; 20, heating module; 30, storage bin; 40, feeder; 50, conveyor belt; 60, fixed bracket; 70, spraying module; 80, secondary cleaning module; 90, LED display module; 91, circuit board; 92, LED bead; 921, chip; 922, encapsulation layer; 93, gap space; 94, filler; 95, protective layer. Detailed Implementation

[0036] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0037] The technical features in the following embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the following embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0038] The following describes in detail, with reference to the accompanying drawings, the LED display module mask filler, encapsulation method, and encapsulation structure in some embodiments.

[0039] like Figure 6 and Figure 7 As shown, the LED display module 90 includes a circuit board 91 and multiple LED beads 92. The multiple LED beads 92 are arranged sequentially and spaced apart on the circuit board 91, and a gap space 93 is provided between two adjacent LED beads 92.

[0040] In one embodiment, an LED display module mask filler is provided. The filler 94 is used to fill the gap space 93. The filler 94 includes a first filler particle, a second filler particle, and hot-melt particles. The size of the first filler particle is smaller than the size of the gap space 93, the size of the second filler particle is smaller than the size of the first filler particle, and the size of the hot-melt particles is smaller than the size of the second filler particle.

[0041] The aforementioned LED display module mask filler 94 includes first filler particles, second filler particles, and hot-melt particles. When used as a mask encapsulation material, the filler 94 needs to be heated. After the hot-melt particles melt, they bond the first and second filler particles together. The first filler particles form the main filling structure and are spaced apart after curing. The second filler particles fill the gaps between the first filler particles, making the mask structure dense and uniform, forming a stable, integrated mask structure after curing. Therefore, the first filler particles form the main frame of the mask and create a rough surface on the mask surface to prevent reflection. The second filler particles fill the gaps between the first filler particles, making the mask structure more stable. The hot-melt particles bond the first and second filler particles together, ensuring stable mask formation. Furthermore, the granular filler material itself has high elasticity. Even if a certain amount of deformation occurs during the heating process, the pressure exerted on the LED bead 92 is very small. After the particles are filled, they are densely and evenly distributed. However, from a local perspective, its structure is not integrated. There are also some small air gaps distributed inside the formed mask. Even if thermal deformation occurs, it will not lead to an overall bulge or collapse.

[0042] The first filler particles include rubber particles, the second filler particles include ceramic particles, and the hot melt particles include hot melt adhesive particles.

[0043] In this specific embodiment, the first filler particle is a black particle, and the second filler particle is a dyed second filler particle whose color is consistent with the color of the first filler particle. Therefore, the resulting mask is black, which is used to prevent light from passing through the mask and improve the contrast and consistency of the LED module 90.

[0044] Specifically, in one embodiment, the filler 94 further includes black-dyed particles, the size of which is smaller than that of the second filler particles. The black-dyed particles are used to adjust the blackness of the mask. Because the black-dyed particles are small in size, they can adhere evenly to the first and second filler particles, ensuring uniform color.

[0045] Among them, the blackening particles include carbon black particles.

[0046] Specifically, in one embodiment, the filler 94 is made from the following raw materials in parts by weight: first filler particles 10, second filler particles 10, and hot-melt particles 1-10. Since the filler 94 is granular, its particle size is relatively small compared to the interstitial space, but it still maintains a relatively large size, meaning it is not affected by airflow or static electricity, and thus does not adhere to the surface of the LED beads. If the content of the first filler particles is too small, the filler 94 will be liquid after melting, producing a smooth reflective surface after solidification. If the content of the second filler particles is too small, on the one hand, the hot-melt particles will lack an adhesion surface, failing to form stable structural strength; on the other hand, the porosity of the mask will be too large, easily causing dust accumulation and reducing the contrast of the LED display module 90. If the content of the hot-melt particles is too small, it will be impossible to bond all the first and second filler particles together to form a stable structure.

[0047] like Figure 1 As shown, in one embodiment, an LED display module encapsulation method is provided, which can encapsulate the LED display module 90 using LED display module mask filler, including the following steps:

[0048] S1: Fill the gap space 93 of the LED display module 90 with filler 94;

[0049] S2: Heat the LED display module 90 to melt the hot-melt particles in the filler 94;

[0050] S3: Cool the filler 94 to solidify the hot melt material.

[0051] The above-described LED display module encapsulation method uses LED display module mask filler to encapsulate the LED display module 90. During the encapsulation process, filler 94 is first filled into the gap space 93 of the LED display module 90. Then, the LED display module 90 is heated to melt the hot-melt particles in the filler 94. Finally, the filler 94 is cooled to solidify the hot-melt material. Therefore, the gap space 93 between the LED display modules 90 is filled with molten filler 94, and the filler 94 in adjacent gap spaces 93 adhere to each other to form a stable mesh mask. This mask is distributed in the gap space 93 between two adjacent LED beads 92, which can prevent light leakage between two adjacent LED beads 92. At the same time, the rough surface of the mask can reduce reflection, effectively improving the contrast and display effect of the LED display module 90. Furthermore, the granular filler material itself has high elasticity. Even if a certain amount of deformation occurs during the heating process, the pressure exerted on the LED bead 92 is very small. After the particles are filled, they are densely and evenly distributed. However, from a local perspective, its structure is not integrated. There are also some small air gaps distributed inside the formed mask. Even if thermal deformation occurs, it will not lead to an overall bulge or collapse.

[0052] The melting point of the hot-melt particles is 65℃-115℃, and the heating temperature of the LED display module 90 is also 65℃-115℃. After heating, the LED display module 90 is cooled to room temperature. The heating temperature cannot be too high, otherwise it will damage the structure of the first filling particles, thus affecting the structural stability of the mask, and will also damage the encapsulation layer 922 of the lamp beads 92.

[0053] Specifically, in one embodiment, step S3 includes the following steps: cooling the filler 94 using a natural cooling method, allowing the hot-melt material to gradually cool and solidify. The natural cooling method allows for a slower cooling rate, reducing stress formation inside the particulate mask and further improving its structural stability.

[0054] like Figure 3 As shown, in one embodiment, an LED display module packaging device 100 is used to package an LED display module 90. The LED display module packaging device 100 includes a filling module 10, a heating module 20, a storage bin 30, a feeder 40, a conveyor belt 50, a fixed bracket 60, a secondary cleaning module 80, and a spraying module 70. The conveyor belt 50 is mounted on the fixed bracket 60 and has a working surface for receiving the LED display module 90. The filling module 10, heating module 20, secondary cleaning module 80, and spraying module 70 are sequentially fixed on the fixed bracket 60 along the conveying direction of the conveyor belt 50. The storage bin 30 is used to store filler 94. The inlet of the feeder 40 is connected to the storage bin 30, and the outlet of the feeder 40 is connected to the filling module 10. The feeder 40 is used to transport the filler 94 in the storage bin 30 to the filling module 10.

[0055] In this specific embodiment, the storage bin 30 is located on the side of the conveyor belt 50 away from the working surface. The feeder 40 is a screw lifting feeder 40, which includes a drive unit, a rotating rod and a housing. The bottom of the housing is provided with a filler 94 inlet and the top of the housing is provided with a filler 94 outlet. The housing is sleeved on the rotating rod, and multiple helical blades are provided on the rotating rod along its axial direction. The drive unit is connected to the rotating rod and is used to drive the rotating rod to rotate around its axis, thereby causing the helical blades to rotate and lift the filler 94.

[0056] Specifically, in one embodiment, the filling module 10 includes a batching bin 11, a pressing component 12, and a washing component 13 arranged sequentially along the conveying direction of the conveyor belt 50.

[0057] In this specific embodiment, the filling module 10 also includes a driving component, which is connected to the mixing bin 11. The mixing bin 11 is provided with a discharge port. The driving component can control the mixing bin 11 to vibrate or rotate, so that the filler 94 in the mixing bin 11 is evenly spread on the display surface.

[0058] Optionally, the drive unit can provide negative pressure near the discharge port, which causes the filler 94 in the mixing bin 11 to be drawn out from the discharge port and fall onto the display surface.

[0059] A feeding belt 14 is provided between the outlet of the feeder 40 and the inlet of the filling module 10. The feeding belt 14 is used to transport the filler 94 from the feeder 40 to the filling module 10.

[0060] Furthermore, such as Figure 3 and Figure 4 As shown, in one embodiment, the pressing member 12 can move towards or away from the display surface, repeatedly pressing against the display surface and filling the filler 94 on the display surface into the gap space 93. The pressing member 12 is provided with an elastic pressing part 121 and a brush part 122. The elastic pressing part 121 is located on the end face of the pressing member 12 facing the display surface, and the brush part 122 is located on the end face of the elastic pressing part 121 facing the display surface. When the pressing member 12 presses against the display surface, the elastic pressing part 121 presses the pile of filler 94 as a whole, and the brush part 122 inserts into the pile of filler 94, pushing against the filler 94 particles. As the pressing member 12 gradually approaches the LED display module 90, the filler 94 particles are squeezed into the gap space 93 by the brush part 122. At the same time, when the pressing member 12 completes the pressing and moves away from the LED display module 90, the brush part 122 has a fine and pointed structure and will not carry out the filled particles.

[0061] Furthermore, in one embodiment, the washing component 13 includes a roller 131 and a shaft, wherein the roller 131 is sleeved on the shaft and can rotate about the shaft's axial direction. The roller 131 is provided with a short-bristled soft brush or a cloth surface, and the surface of the roller 131 is tangentially disposed to the display surface of the LED display module 90. After the LED display module 90 is pressed by the pressing component 12, the filler 94 remaining on the surface of the LED beads 92, and the filler 94 protruding from the display surface in the spatial gap, are all brushed by the roller 131 of the washing component 13 and fall off the display surface of the LED display module 90.

[0062] Among them, such as Figure 5 and Figure 6 As shown, multiple LED beads 92 on the circuit board 91 are spaced apart along a first direction, and multiple gap spaces 93 are also spaced apart along the first direction. The axis of the roller is a second direction, which is parallel to the display surface. The first direction and the second direction are set at an angle, and the angle between the first direction and the second direction is greater than 0° and less than 90°. When the angle between the first direction and the second direction is 45°, it can effectively prevent the roller 131 from carrying out the filler 94 in the gap space 93, and the cleaning effect of the washing part 13 is optimal.

[0063] Specifically, such as Figure 3As shown, in one embodiment, the batching bin 11, the pressing component 12, and the washing component 13 are all arranged opposite to the working surface, and the heating module 20 is located on the side of the conveyor belt 50 away from the working surface. The heating module 20 is located at the bottom of the conveyor belt 50 and is used to heat the bottom of the LED display module 90. During the heating process, heat can be transferred through the material of the circuit board 91 itself, improving the heating uniformity and allowing the filler 94 to melt synchronously. This avoids the heating module 20 directly baking the surface of the LED beads 92 and damaging the coating on the surface of the LED beads 92.

[0064] Meanwhile, the storage bin 30 is located below the batching bin 11, the pressing component 12 and the washing component 13. The opening of the storage bin 30 faces the working surface. Therefore, the excess filler 94 on the LED display module 90 falls into the storage bin 30 through the cleaning of the washing component 13, thereby realizing the recycling of the filler 94.

[0065] Specifically, such as Figure 2 As shown, in one embodiment, before step S1, the following steps are further included:

[0066] S0: Thoroughly mix the packing material 94.

[0067] Further, step S0 includes the following step: using a feeder 40 to thoroughly mix the filler 94.

[0068] Specifically, such as Figure 2 As shown, in one embodiment, step S1 includes the following steps:

[0069] S11: Spread filler 94 evenly on the display surface of LED display module 90;

[0070] S12: Press down on the filler 94 on the display surface so that the filler 94 enters the gap space 93.

[0071] Specifically, such as Figure 2 As shown, in one embodiment, after step S12, the following step is further included:

[0072] S13: Clean the filler 94 that protrudes from the display surface.

[0073] Furthermore, in one embodiment, step S1 includes the following steps:

[0074] S11: Spread the filler 94 in the mixing bin 11 evenly on the display surface;

[0075] S12: The pressure piece 12 is used to repeatedly press the display surface, so that the filler 94 enters the gap space 93.

[0076] S13: Use washing part 13 to brush the filler 94 protruding from the display surface.

[0077] The washing component 13 is used to prevent filler 94 from remaining on the surface of the LED bead 92, and to prevent it from sticking to the surface of the LED bead 92 after heating, so as to avoid affecting the display effect of the LED display module 90.

[0078] Specifically, such as Figure 2 As shown, in one embodiment, after step S3, the following step is further included:

[0079] S4: Cover the display surface with a protective layer 95. The protective layer 95 covers the surface of the mask and the LED beads 92, which helps to improve the contrast of the LED display module 90 and protect the mask.

[0080] Specifically, such as Figure 2 As shown, in one embodiment, step S4 includes the following steps:

[0081] An epoxy resin layer is sprayed onto the display surface.

[0082] Furthermore, in one embodiment, step 4 includes the following step: applying a protective layer 95 to the display surface using a spraying module 70.

[0083] The spraying module 70 includes a spray gun with its outlet positioned opposite the display surface. The spraying module 70 can be used to spray liquid epoxy resin, forming an epoxy resin layer on the display surface. This epoxy resin layer is translucent and serves to protect the mask and LED beads 92 surfaces, extending their service life.

[0084] Specifically, such as Figure 2 As shown, in one embodiment, the following step is further included between step S3 and step S4:

[0085] S31: Clean the filler 94 that protrudes from the display surface.

[0086] Furthermore, in one embodiment, step S31 includes the following steps: using a secondary cleaning module 80 to clean the filler 94 protruding from the display surface, wherein the secondary cleaning module 80 has the same structure as the washing component 13.

[0087] After thermosetting, the residual filler 94 on the surface of the LED beads 92 will re-solidify, and the filler 94 in the gaps between the LED beads 92 will also solidify. Since the number of filler particles remaining on the surface of the LED beads 92 is small, their own structural strength and adhesion to the lamp surface are very small, and the bead-like particle clusters formed after remelting and solidification are easier to clean, the secondary cleaning module 80 performs roller brush cleaning on the display surface to ensure the smoothness of the subsequent sprayed protective layer 95.

[0088] Specifically, such as Figure 2 As shown, in one embodiment, the following step is further included between step S3 and step S4:

[0089] S32: Test the effectiveness of each LED bead 92 on the LED display module 90.

[0090] Since covering the display surface with a protective layer 95 will significantly increase the difficulty of repairing and replacing the LED beads 92 on the LED display module 90, the LED display module 90 needs to be tested before coating to prevent dead LEDs and other issues.

[0091] like Figure 8 As shown, in one embodiment, an LED display module packaging structure is provided, which is manufactured by an LED display module packaging method. It includes a circuit board 91, multiple LED beads 92 and filler 94. The multiple LED beads 92 are arranged sequentially and spaced apart on the circuit board 91. A gap space 93 is provided between two adjacent LED beads 92. The filler 94 is located in the gap space 93, and the fillers 94 in adjacent gap spaces 93 are bonded to each other to form a mask of the LED display module 90.

[0092] In the aforementioned LED display module packaging structure, the gaps 93 between the LED beads 92 are filled with molten filler 94, and the filler 94 in adjacent gaps 93 adhere to each other, forming a stable and integrated mesh-like mask. This mask is distributed in the gaps 93 between adjacent LED beads 92, preventing light leakage between adjacent LED beads 92. At the same time, the rough surface of the mask reduces reflection, effectively improving the contrast and display effect of the LED display module 90. Furthermore, the granular filler material itself has high elasticity. Even if a certain amount of deformation occurs during heating, the pressure exerted on the LED beads 92 is very small. After filling, the particles are densely and uniformly distributed, but from a local perspective, its structure is not integrated. There are still some small air gaps distributed inside the formed mask. Even if thermal deformation occurs, it will not lead to an overall bulge or collapse.

[0093] In this specific embodiment, the LED bead 92 includes a chip 921 and an encapsulation layer 922 that wraps around the chip 921. The bottom surface of the filler 94 is bonded to the circuit board 91, the side surface of the filler 94 is bonded to the encapsulation layer 922, and the protective layer 95 is connected to the top of the encapsulation layer 922 and the top of the filler 94.

[0094] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0095] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0096] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0097] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0098] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0099] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0100] The above embodiments merely illustrate several implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A method for encapsulating an LED display module, comprising encapsulating the LED display module with LED display module mask filler, the LED display module including a circuit board and multiple LED chips, the multiple LED chips being arranged sequentially at intervals on the circuit board, with a gap space between adjacent two LED chips, the filler being used to fill the gap space, the filler comprising a first filler particle, a second filler particle, and hot-melt particles, wherein the size of the first filler particle is smaller than the size of the gap space, the size of the second filler particle is smaller than the size of the first filler particle, and the size of the hot-melt particles is smaller than the size of the second filler particle, characterized in that... The method includes the following steps: S1: Fill the gap space of the LED display module with the filler; S2: The LED display module is heated so that the hot-melt particles in the filler melt. S3: Cool the filler to solidify the hot melt material.

2. The LED display module packaging method according to claim 1, characterized in that, Step S1 includes the following steps: S11: The filler is evenly spread on the display surface of the LED display module; S12: Press down on the filler on the display surface to allow the filler to enter the gap space.

3. The LED display module packaging method according to claim 2, characterized in that, Following step S12, the following steps are also included: S13: Clean the filler protruding from the display surface.

4. The LED display module packaging method according to claim 1, characterized in that, Following step S3, the following steps are also included: S4: Cover the display surface of the LED display module with a protective layer.

5. The LED display module packaging method according to claim 4, characterized in that, Between step S3 and step S4, the following steps are also included: S31: Clean the filler protruding from the display surface.

6. The LED display module packaging method according to claim 4, characterized in that, Between step S3 and step S4, the following steps are also included: S32: Detect the effectiveness of each LED bead on the LED display module.

7. The LED display module packaging method according to any one of claims 1-6, characterized in that, The filler also includes blackening particles, the size of which is smaller than the size of the second filler particles.

8. The LED display module packaging method according to any one of claims 1-6, characterized in that, The filler is made from the following raw materials in parts by weight: the first filler particle 10, the second filler particle 10, and the hot melt particles 1-10.

9. An LED display module packaging structure, characterized in that, The LED display module is manufactured using the packaging method of any one of claims 1-8, comprising a circuit board, multiple LED beads and filler, wherein the multiple LED beads are arranged sequentially at intervals on the circuit board, and a gap space is provided between two adjacent LED beads, the filler is located in the gap space, and the fillers in adjacent gap spaces are adhered to each other to form the mask of the LED display module.

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