Printing system components and methods

Abstract

Various embodiments of a printing system for printing a substrate are disclosed herein, wherein the printing system can be housed in a gas enclosure, wherein the environment within the enclosure can be maintained as a controlled printing environment. The controlled environment of the present teachings can include control over the type of gas environment within the gas enclosure, control over the size and level of particulate matter within the enclosure, control over the temperature within the enclosure, and control over the lighting. Various embodiments of the printing system of the present teachings can include a Y-axis motion system and a Z-axis moving platen configured to substantially reduce excess heat load within the gas enclosure, for example, by eliminating or substantially minimizing the use of conventional electric motors.

Description

Technical Field

[0001] This teaching relates to various embodiments of printing systems that can be maintained within a gas-enclosed system that defines an inert, substantially low-particle environment.

[0002] Cross-references to the application

[0003] This application claims the benefit of: (1) U.S. Provisional Patent Application No. 62 / 013,433, filed June 17, 2014; (2) U.S. Provisional Patent Application No. 62 / 021,390, filed July 7, 2014; (3) U.S. Provisional Patent Application No. 62 / 037,494, filed August 14, 2014; (4) U.S. Provisional Patent Application No. 62 / 013,440, filed June 17, 2014; (5) U.S. Provisional Patent Application No. 62 / 021,563, filed July 7, 2014; (6) U.S. Provisional Patent Application No. 62 / 044,165, filed August 29, 2014; and (7) U.S. Provisional Patent Application No. 62 / 092,721, filed December 16, 2014; all of which are incorporated herein by reference.

[0004] Overview

[0005] Attention to the potential of Organic Light Emitting Diode (OLED) display technology has been driven by demonstrations of its attributes, including highly saturated colors, high contrast, ultra-thinness, fast response, and energy efficiency. Furthermore, a variety of substrate materials, including flexible polymer materials, can be used to manufacture OLED displays. While demonstrations of displays for small-screen applications (primarily mobile phones) have highlighted the technology's potential, challenges remain in achieving high-volume, high-yield manufacturing across a range of substrate formats.

[0006] In terms of scale, the Gen 5.5 substrate measures approximately 130cm x 150cm and can produce approximately eight 26” flat panel displays. In contrast, larger scale substrates can include those using Gen 7.5 and Gen 8.5 mother glass substrates. The Gen 7.5 mother glass measures approximately 195cm x 225cm and can be cut into eight 42” or six 47” flat panel displays per substrate. The mother glass for Gen 8.5 measures approximately 220cm x 250cm and can be cut into six 55” or eight 46” flat panel displays per substrate. One indication of the challenges in scaling OLED display manufacturing to larger scales is that manufacturing OLED displays at high throughput and high capacity on substrates larger than the Gen 5.5 substrate has proven extremely challenging.

[0007] In principle, OLED devices can be fabricated by printing various organic thin films and other materials onto substrates using OLED printing systems. These organic materials can be susceptible to oxidation and damage from other chemical processes. Containing OLED printing systems in a manner scalable to various substrate sizes and operating in an inert, substantially low-particle printing environment presents a variety of engineering challenges. Manufacturing tools for high-throughput, large-format substrate printing (e.g., printing of Gen 7.5 and Gen 8.5 substrates) require very large facilities. Therefore, maintaining such large facilities in an inert environment, requiring gas purging to remove reactive atmospheric species (such as water vapor and oxygen, as well as organic solvent vapors), and maintaining a substantially low-particle printing environment have proven extremely challenging.

[0008] Similarly, challenges remain in achieving high-volume, high-yield manufacturing of OLED displays across a range of substrate formats. Therefore, there is a need for various embodiments of the gas envelopment system of this teaching, which can house the OLED printing system in an inert, substantially low-particle environment and can be easily calibrated to provide manufacturing of OLED panels on a variety of substrate sizes and materials. Furthermore, the various gas envelopment systems of this teaching can provide rapid external access to the OLED printing system during processing and internal access for maintenance with minimal downtime. Attached Figure Description

[0009] A better understanding of the features and advantages of this disclosure will be obtained by referring to the accompanying drawings, which are intended to illustrate and not limit the teachings. In the drawings, which are not necessarily drawn to scale, the same reference numerals may describe similar parts in different views. The same reference numerals with different letter suffixes may indicate different instances of similar parts.

[0010] Figure 1A This is a front perspective view of a gas-enclosed assembly according to various embodiments of this teaching. Figure 1B Describing as Figure 1A Exploded views of various embodiments of the gas-enclosed assembly depicted in the figure. Figure 1C Depicting in Figure 1B An unfolded isometric perspective view of the printing system depicted in the image. Figure 1D This is an unfolded perspective view of the auxiliary enclosure of a gas enclosure system according to various embodiments of this teaching.

[0011] Figure 2A This is a front perspective view of a gas-enclosed assembly according to various embodiments of this teaching. Figure 2B This is a partially exploded perspective view of the auxiliary enclosure of a gas enclosure system according to various embodiments of this teaching. Figure 2CThis is a partially exploded top perspective view of the auxiliary enclosure of a gas enclosure system according to various embodiments of this teaching.

[0012] Figure 3 This is an unfolded isometric view of the printing system according to this teaching, which shows the Y-axis motion system.

[0013] Figure 4A This is a top view of a Y-axis motion system according to various embodiments of the systems and methods of this teaching. Figure 4B yes Figure 4A Top view of the expanded portion.

[0014] Figure 5A This is an isometric view of a Y-axis motion system according to various embodiments of the systems and methods of this teaching. Figure 5B yes Figure 5A The long cross-sectional view.

[0015] Figure 6 This is a side view of the side frame of the bracket assembly with the clamp motion control components mounted thereon.

[0016] Figure 7A This is an isometric view of the voice coil assembly according to various embodiments of the systems and methods of this teaching. Figure 7B This is a side view of the voice coil assembly.

[0017] Figure 8 This is a top view of a Y-axis motion system according to various embodiments of the systems and methods of this teaching, which indicates two cross-sectional views.

[0018] Figure 9 Is it like this? Figure 8 A cross-sectional view of the indicated voice coil assembly.

[0019] Figure 10 Is it like this? Figure 8 A cross-sectional view of the indicated central pivot assembly.

[0020] Figure 11 This is a schematic diagram of a closed-loop control circuit that provides pneumatic balance to a Z-axis motor according to various embodiments of the systems and methods of this teaching.

[0021] Figure 12A It is an isometric perspective view of a Z-axis moving plate with pneumatic lifting elements, and Figure 12B This is a front perspective view of a Z-axis moving plate with a pneumatic lifting element according to various embodiments of this teaching.

[0022] Figure 13 This is a schematic diagram of a closed printing system that can utilize various embodiments of an ink delivery system according to this teaching.

[0023] Figure 14This is a schematic diagram of a batch ink delivery system according to various embodiments of this teaching.

[0024] Figure 15 This is a schematic diagram of a batch ink delivery system according to various embodiments of this teaching.

[0025] Figure 16 This is a schematic diagram of a local ink delivery system for a closed printing system according to various embodiments of this teaching.

[0026] Figure 17 This is a schematic diagram of a partial ink delivery system in fluid communication with the printhead ink delivery system for a closed printing system, according to various embodiments of this teaching.

[0027] Figure 18A Bottom perspective view of the printhead assembly mounted on the X-axis bridge. Figure 18B yes Figure 18A The unfolded diagram.

[0028] Figure 19A It is a top-down perspective view of the printhead assembly, and Figure 19B This is a front-view perspective view of a printhead apparatus according to various embodiments of this teaching. Figure 19C This is a top-down perspective view of the mounting plate used for the printhead assembly, and Figure 19D This is a front-view perspective view of a printhead assembly mounted in a mounting assembly according to various embodiments of this teaching.

[0029] Figure 20 These are schematic diagrams of various embodiments of the gas-enclosed components and related system parts of this teaching.

[0030] Figure 21A and Figure 21B These are schematic diagrams of various embodiments of a closed printing system and components for integrating and controlling gas sources (such as those used to establish a controlled gas environment within a gas enclosure), wherein the various embodiments may include a pressurized gas supply used in conjunction with a floating stage.

[0031] Figures 22A to 22C These are schematic diagrams of various embodiments of a closed printing system and components for integrating and controlling gas sources (such as those used to establish a controlled gas environment within a gas enclosure), wherein the various embodiments may include a blower circuit to provide, for example, pressurized gas used with a floating stage, as well as a vacuum source. Detailed Implementation

[0032] This teaching discloses various embodiments of a printing system for printing substrates, wherein the printing system may be housed within a gas enclosure, wherein the environment within the enclosure can be maintained as a controlled printing environment. The controlled environment of this teaching may include: control of the type of gas environment within the gas enclosure, control of the size and level of particulate matter within the enclosure, control of the temperature within the enclosure, and control of illumination. Various embodiments of the printing system of this teaching may include a Y-axis motion system and a Z-axis moving plate assembly configured, for example, to substantially reduce excessive thermal load within the gas enclosure by eliminating or substantially minimizing the use of conventional electric motors. Additionally, various embodiments of the Y-axis motion system of this teaching may include a gripper motion control component of the Y-axis motion system configured to provide dynamic directional rotation of the substrate about the theta-Z (θ-Z) axis during Y-axis travel to maintain high precision in substrate orientation parallel to the travel axis.

[0033] Various embodiments of the gas envelopment assembly can be hermetically constructed and integrated with various components of various embodiments of the gas envelopment system that provide gas circulation and filtration systems, particle control systems, gas purification systems, and thermal conditioning systems to form a substantially low-particulate inert gas environment capable of maintaining such an environment for processes requiring it. Various embodiments of the gas envelopment can have a printing system enclosure and an auxiliary enclosure constructed as part of the gas envelopment assembly, which can be hermetically separable from the gas envelopment printing system enclosure. Various embodiments of the printing system of this teaching can have a printhead management system enclosed within an auxiliary enclosure. Embodiments of the printhead management system of this teaching can include various means and devices for printhead maintenance and calibration; each of these means and devices is mounted on a motion system platform for finely positioning the various means and devices relative to the printhead.

[0034] exist Figure 1C The printing system shown in the unfolded diagram (such as, Figure 1BA printing system (2000) can consist of several devices and apparatuses that allow for the reliable placement of ink droplets at specific locations on a substrate. Printing requires relative movement between a printhead assembly and a substrate. This can be accomplished using a motion system (typically a benchtop or a split-axis XYZ system). The printhead assembly can move on a fixed substrate (benchtop type), or both the printhead and substrate can move in a split-axis configuration. In another embodiment, the printhead assembly can be substantially fixed; for example, the substrate can move relative to the printhead in the X and Y axes, with Z-axis movement provided by a substrate support device or a Z-axis motion system associated with the printhead assembly. As the printhead moves relative to the substrate, ink droplets are ejected at the correct time to deposit at the desired location on the substrate. A substrate loading and unloading system can be used to insert and remove the substrate from the printer. Depending on the printer configuration, this can be accomplished using a mechanical conveyor, a substrate floating stage with conveying components, or a substrate transfer robot with an end effector. In various embodiments of the systems and methods of this teaching, the Y-axis motion system can be based on an air bearing gripper system.

[0035] To gain a clearer understanding of the substrate sizes available for manufacturing various OLED concepts, since the early 1990s, several generations of mother glass substrate sizes have evolved from those used in flat panel displays manufactured using OLED printing. The first-generation mother glass substrate (designated Gen 1) was approximately 30cm x 40cm, and therefore, 15” panels could be produced. Around the mid-1990s, existing technology for producing flat panel displays had advanced to the Gen 3.5 mother glass substrate size, which was approximately 60cm x 72cm. In comparison, the Gen 5.5 substrate had a size of approximately 130cm x 150cm.

[0036] With each generation of development, different mother glass sizes, Gen 7.5 and Gen 8.5, have been produced for different OLED printing manufacturing processes. Gen 7.5 mother glass measures approximately 195cm x 225cm and can be cut into eight 42” or six 47” flat panels per substrate. The mother glass for Gen 8.5 is approximately 220cm x 250cm and can be cut into six 55” or eight 46” flat panels per substrate. While expectations for the quality of OLED flat panel displays (such as more realistic colors, higher contrast, thinness, flexibility, transparency, and energy efficiency) have been met, OLED manufacturing has been practically limited to Gen 3.5 and smaller. Currently, OLED printing is considered the best manufacturing technology to break this limitation and enable OLED panel manufacturing not only for Gen 3.5 and smaller mother glass sizes but also for the largest mother glass sizes, such as Gen 5.5, Gen 7.5, and Gen 8.5. One of the characteristics of OLED panel display technology is the ability to use a variety of substrate materials, such as, but not limited to, various glass substrate materials and various polymer substrate materials. In this regard, the terminology coined by the use of glass-based substrates can be applied to any substrate material suitable for OLED printing.

[0037] In principle, manufacturing tools that allow printing of various substrate sizes, including large-format substrates, may require very large facilities to house such OLED manufacturing tools. Therefore, maintaining this large facility in an inert environment presents engineering challenges, such as the continuous purification of large volumes of inert gases. Various embodiments of the gas envelopment system may have a circulation and filtration system within the gas envelopment assembly, combined with a gas purification system outside the gas envelopment, which, together with the gas purification system, can provide a continuous circulation of substantially low-particulate inert gas with substantially low levels of reactive species throughout the gas envelopment system. According to this teaching, an inert gas can be any gas that does not undergo a chemical reaction under a set of defined conditions. Some common, non-limiting examples of inert gases may include nitrogen, any rare gases, and any combinations thereof. Furthermore, providing a substantially airtight large facility to prevent contamination from various reactive atmospheric gases, such as water vapor and oxygen, and organic solvent vapors generated from various printing processes, presents engineering challenges. According to this teaching, the OLED printing facility maintains the levels of various reactive species (including various reactive atmospheric gases, such as water vapor and oxygen, and organic solvent vapor) at 100 ppm or lower, for example, 10 ppm or lower, 1.0 ppm or lower, or 0.1 ppm or lower.

[0038] The need to print OLED panels in facilities where the levels of each of the reactive species should be maintained at target low levels can be illustrated in the information outlined in Review Table 1. The data outlined in Table 1 are generated from individual samples fabricated using a large-pixel spin-coating apparatus, including tests of organic thin-film compositions for each of the red, green, and blue species. These samples are substantially easier to fabricate and test for the purpose of rapid evaluation of various formulations and processes. While sample testing should not be confused with lifetime testing of printed panels, it can indicate the impact of various formulations and processes on lifetime. The results shown in the following table represent variations in process steps during sample fabrication, where only the spin-coating environment differs from that of samples fabricated in a nitrogen environment with less than 1 ppm of reactive species, compared to samples similarly fabricated in an air environment instead of a nitrogen environment.

[0039] By examining the data in Table 1 for samples manufactured under different processing conditions, particularly in red and blue conditions, it is evident that printing in an environment that effectively reduces the exposure of the organic thin film composition to reactive species can have a substantial impact on the stability of various ELs, and thus on lifetime. Lifetime specifications are particularly important for OLED panel technology because they are directly related to the lifespan of the display product; the product specification for all panel technologies, which has always been a challenge for OLED panel technology. To provide panels that meet the required lifetime specifications, various embodiments of the gas envelopment system of this teaching can be used to maintain the level of each of the reactive species (such as water vapor, oxygen, and organic solvent vapor) at 100 ppm or lower, for example, 10 ppm or lower, 1.0 ppm or lower, or 0.1 ppm or lower.

[0040]

[0041] Table 1: The impact of inert gas treatment on the lifespan of OLED panels.

[0042] In addition to providing an inert environment, maintaining a substantially low-particle environment for OLED printing is crucial, as even very small particles can cause visible defects on OLED panels. Particle control in a gas envelopment system can present significant challenges not encountered in processes that can be performed under atmospheric conditions, such as open air or high-flow laminar flow filter hoods. For example, manufacturing facilities may require various service bundles of basic length that can be operatively connected from various systems and components to provide operation, such as, but not limited to, the optical, electrical, mechanical, and fluid connections required by the printing system. Such service bundles, located close to the substrate for printing positioning and used for the operation of the printing system, can be a continuous source of particulate matter. Additionally, components of the printing system (such as fans using friction bearings or linear motion systems) can be particulate-generating components. Various embodiments of the gas circulation and filtration systems of this teaching can be used in conjunction with particulate control components to contain and expel particulate matter. Furthermore, a low-particle environment can be maintained for various embodiments of the gas envelopment system by using various inherently low-particle-generating pneumatic operating components (such as, but not limited to, substrate floating stages, air bearings, and pneumatically operated robots).

[0043] Regarding maintaining a substantially low-particulate environment, various embodiments of the gas circulation and filtration system can be designed to provide a low-particulate inert gas environment conforming to standards specified in categories 1 to 5 of the International Organization for Standardization standard (ISO) 14644-1:1999 "Cleanrooms and associated controlled environments - Part 1: Classification of air cleanliness". However, controlling airborne particulate matter alone is insufficient to provide a low-particulate environment near the substrate during, for example, but not limited to, the printing process, because particles generated near the substrate during such a process can accumulate on the substrate surface before being swept away by the gas circulation and filtration system.

[0044] Therefore, various embodiments of the gas envelopment system of this teaching, in conjunction with a gas circulation and filtration system, can have a particle control system that can include components capable of providing a low-particle region close to the substrate during processing in the printing step. The particle control system for various embodiments of the gas envelopment system of this teaching can include a gas circulation and filtration system, a low-particle-generating X-axis linear bearing system for moving the printhead assembly relative to the substrate, a service bundle housing exhaust system, and a printhead assembly exhaust system. For example, the gas envelopment system can have a gas circulation and filtration system within the gas envelopment assembly.

[0045] Various embodiments of the systems and methods of this teaching can maintain a substantially low-particle environment that provides an average on-substrate distribution of particles within a specific particle size range of interest that does not exceed the on-substrate deposition rate specification. The on-substrate deposition rate specification can be set between approximately 0.1 μm and larger and approximately 10 μm and larger for each of the particle size ranges of interest. In various embodiments of the systems and methods of this teaching, the on-substrate particle deposition rate specification can be expressed as: a limit on the number of particles deposited per minute per square meter of substrate for each of the target particle size ranges.

[0046] Various embodiments of particle deposition rate specifications on a substrate can be readily converted from a limit to the number of particles deposited per minute per square meter of substrate to a limit to the number of particles deposited per minute per substrate for each of the target particle size range. This conversion can be readily made using known relationships between the substrate (e.g., for a specific generation size substrate) and the corresponding area of ​​that generation of substrate. For example, Table 2 below outlines the aspect ratios and areas of some known generation sizes of substrates. It should be understood that slight variations in aspect ratios can be observed from different manufacturers, and thus slight variations in size. However, regardless of such variations, a conversion factor for the specific generation size substrate and its area in square meters can be obtained for any substrate of any generation size.

[0047] Generation ID X(mm) Y(mm) <![CDATA[Area (m 2 )]]> Gen 3.0 550 650 0.36 Gen 3.5 610 720 0.44 Gen 3.5 620 750 0.47 Gen 4 680 880 0.60 Gen 4 730 920 0.67 Gen 5 1100 1250 1.38 Gen 5 1100 1300 1.43 Gen 5.5 1300 1500 1.95 Gen 6 1500 1850 2.78 Gen 7.5 1950 2250 4.39 Gen 8 2160 2400 5.18 Gen 8 2160 2460 5.31 Gen 8.5 2200 2500 5.50 Gen 9 2400 2800 6.72 Gen 10 2850 3050 8.69

[0048] Table 2: Correlation between area and substrate size.

[0049] Furthermore, the substrate particle deposition rate specification, expressed as the limit of the number of particles deposited per square meter of substrate per minute, can be readily converted into any expression of various unit time. It will be readily understood that a substrate particle deposition rate specification normalized to minutes can be readily converted into any other time expression using known relationships of time (e.g., but not limited to, such as seconds, hours, days, etc.). Additionally, time units specific to the processing can be used. For example, a printing cycle can be associated with a time unit. For various embodiments of the gas envelopment system according to this teaching, the printing cycle can be a time period in which the substrate is moved into the gas envelopment system for printing and then removed from the gas envelopment system after printing is complete. For various embodiments of the gas envelopment system according to this teaching, the printing cycle can be the time period from the alignment of the substrate relative to the printhead assembly to the delivery of the last drop of ejected ink onto the substrate. In the field of processing technology, the overall average cycle time or TACT can be a representation of a time unit for a specific process cycle. For various embodiments of the systems and methods according to this teaching, the TACT for a printing cycle can be approximately 30 seconds. For various embodiments of the systems and methods according to this teaching, the TACT for a printing cycle can be approximately 60 seconds. In various embodiments of the systems and methods of this teaching, the TACT for a printing cycle can be approximately 90 seconds. In various embodiments of the systems and methods of this teaching, the TACT for a printing cycle can be approximately 120 seconds. In various embodiments of the systems and methods of this teaching, the TACT for a printing cycle can be approximately 300 seconds.

[0050] Numerous variables can influence the deposition of particulate matter and particles within the system relative to airborne particles: Developing general models that can be adequately calculated for any particular manufacturing system, such as approximations of particle scattering rates on surfaces (e.g., substrates). Variables, such as particle size, particle size distribution, substrate surface area, and substrate exposure time within the system, can vary depending on the manufacturing system. For example, particle size and particle size distribution can be substantially influenced by the source and location of particle-generating components in various manufacturing systems. Calculations based on various embodiments of the gas-enclosed system of this teaching show that, without the various particle control systems of this teaching, the deposition of particulate matter per square meter of substrate per print cycle can range from more than approximately 1 million particles to more than approximately 10 million particles for particles with a particle size range of 0.1 μm and larger. Such calculations show that, without the various particle control systems of this teaching, the deposition of particulate matter per square meter of substrate per print cycle can range from more than approximately 1000 particles to approximately more than approximately 10000 particles for particles with a particle size range of approximately 2 μm and larger.

[0051] Various embodiments of the low-particle gas envelopment system of this teaching can maintain a low-particle environment that provides an average on-substrate particle distribution conforming to a deposition rate specification of approximately 100 particles per minute per square meter of substrate for particles larger than or equal to 10 μm. Various embodiments of the low-particle gas envelopment system of this teaching can maintain a low-particle environment that provides an average on-substrate particle distribution conforming to a deposition rate specification of approximately 100 particles per minute per square meter of substrate for particles larger than or equal to 5 μm. Various embodiments of the gas envelopment system of this teaching can maintain a low-particle environment that provides an average on-substrate particle distribution conforming to a deposition rate specification of approximately 100 particles per minute per square meter of substrate for particles larger than or equal to 2 μm. Various embodiments of the gas envelopment system of this teaching can maintain a low-particle environment that provides an average on-substrate particle distribution conforming to a deposition rate specification of approximately 100 particles per minute per square meter of substrate for particles larger than or equal to 1 μm. Various embodiments of the low-particle gas envelopment system of this teaching can maintain a low-particle environment that provides an average on-substrate particle distribution conforming to a deposition rate specification of approximately 1000 particles per minute per square meter of substrate for particles larger than or equal to 0.5 μm. Various embodiments of the gas envelopment system of this teaching can maintain a low-particle environment that provides an average on-substrate particle distribution conforming to a deposition rate specification of approximately 1000 particles per minute per square meter of substrate for particles larger than or equal to 0.3 μm. Various embodiments of the low-particle gas envelopment system of this teaching can maintain a low-particle environment that provides an average on-substrate particle distribution conforming to a deposition rate specification of approximately 1000 particles per minute per square meter of substrate for particles larger than or equal to 0.1 μm.

[0052] It should be considered that various ink formulations can be printed in the inert, substantially low-particle environment of various embodiments of the gas-enclosed system of this teaching. During the manufacture of an OLED display, OLED pixels can be formed to include an OLED thin-film stack that can emit light at a specific peak wavelength when a voltage is applied. The OLED thin-film stack structure between the anode and cathode can include a hole injection layer (HIL), a hole transport layer (HTL), an emitter layer (EL), an electron transport layer (ETL), and an electron injection layer (EIL). In some embodiments of the OLED thin-film stack structure, the electron transport layer (ETL) can be combined with the electron injection layer (EIL) to form an ETL / EIL layer. According to this teaching, various ink formulations for EL of various color pixel EL films for OLED thin-film stacks can be printed using, for example, inkjet printing. Additionally, for example, but not limited to, the HIL, HTL, EML, and ETL / EIL layers can have ink formulations that can be printed using inkjet printing.

[0053] Further consideration is that the organic packaging layer can be printed onto the substrate. Inkjet printing can be used to print the organic packaging layer because it offers several advantages. First, a series of vacuum processing operations can be eliminated because this inkjet-based manufacturing can be performed under atmospheric pressure. Additionally, during the inkjet printing process, the organic packaging layer can be localized to cover portions of the OLED substrate above and near the active region, effectively packaging the active region, including its side edges. The targeted patterning achieved using inkjet printing results in: eliminating material waste and eliminating the additional processing typically required to achieve patterning of the organic layer. The packaging ink can include polymers (including, but not limited to, acrylates, methacrylates, urethane, or other materials, and copolymers and mixtures thereof) that can be cured using heat treatment (e.g., baking), UV exposure, and combinations thereof. As used herein, polymers and copolymers can include any form of polymeric component that can be formulated into an ink and cured onto a substrate to form the organic packaging layer. Such polymeric components can include polymers and copolymers, and their precursors, such as, but not limited to, monomers, oligomers, and resins.

[0054] Various embodiments of the gas envelopment assembly can have various frame members configured to provide a contour for the gas envelopment assembly. Various embodiments of the gas envelopment assembly of this teaching can optimize the workspace to minimize the volume of inert gas while allowing the OLED printing system to be accommodated from the outside during processing. In this respect, various gas envelopment assemblies of this teaching can have contoured topology and volume. As will be discussed in more detail below, various embodiments of the gas envelopment can be contoured around a printing system base (on which substrate support devices can be mounted). Further, the gas envelopment can be contoured around a bridge structure of the printing system for X-axis movement of the carriage assembly. As a non-limiting example, various embodiments of the contoured gas envelopment according to this teaching can have various embodiments of a printing system capable of accommodating printing substrates ranging in size from Gen 3.5 to Gen 10 in approximately 6m². 3 To approximately 95m 3 The gas enclosed volume between. By another non-limiting example, various embodiments of the contoured gas enclosed volume according to this teaching can have various embodiments of printing systems capable of accommodating, for example, Gen 5.5 to Gen 8.5 substrate sizes, in approximately 15m. 3 up to about 30m 3 The volume of gas enclosed between the dimensions. Compared to non-contour enclosed spaces with non-contour dimensions for width, length, and height, this embodiment of contoured gas enclosed spaces can save between approximately 30% and approximately 70% of the volume.

[0055] Figure 1A A perspective view of a gas enclosure assembly 1000 according to various embodiments of the gas enclosure assembly of the present teachings is depicted. The gas enclosure assembly 1000 may include a front panel assembly 1200, a middle panel assembly 1300, and a rear panel assembly 1400. The front panel assembly 1200 may include a front top panel assembly 1260, a front wall panel assembly 1240 which may have an opening 1242 for receiving a substrate, and a front base panel assembly 1220. The rear panel assembly 1400 may include a rear top panel assembly 1460, a rear wall panel assembly 1440, and a rear base panel assembly 1420. The middle panel assembly 1300 may include a first middle enclosure panel assembly 1340, a middle wall and top panel assembly 1360, a second middle enclosure panel assembly 1380, and a middle base panel assembly 1320.

[0056] In addition, such as Figure 1AThe depicted intermediate panel assembly 1300 may include a first printhead management system substantially low-particle environment and a second printhead management system auxiliary panel assembly (not shown). Various embodiments of the auxiliary enclosure, constructed as part of the gas enclosure assembly, can be hermetically separated from the working volume of the gas enclosure system. In various embodiments of the systems and methods of this teaching, the auxiliary enclosure may be less than or equal to approximately 1% of the enclosure volume of the gas enclosure system. In various embodiments of the systems and methods of this teaching, the auxiliary enclosure may be less than or equal to approximately 2% of the enclosure volume of the gas enclosure system. In various embodiments of the systems and methods of this teaching, the auxiliary enclosure may be less than or equal to approximately 5% of the enclosure volume of the gas enclosure system. In various embodiments of the systems and methods of this teaching, the auxiliary enclosure may be less than or equal to approximately 10% of the enclosure volume of the gas enclosure system. In various embodiments of the systems and methods of this teaching, the auxiliary enclosure may be less than or equal to approximately 20% of the enclosure volume of the gas enclosure system. Separating the auxiliary enclosure from the working volume of the gas enclosure can prevent contamination of the entire volume of the gas enclosure if it is instructed to open to an ambient environment containing reactive gases to perform, for example, a maintenance process. Furthermore, compared to the gas-enclosed portion of the printing system, given a relatively small volume of auxiliary enclosure, the recovery time of the auxiliary enclosure can be significantly less than that of the entire printing system enclosure.

[0057] like Figure 1B The depicted gas-enclosed assembly 1000 may include a front base panel assembly 1220, a middle base panel assembly 1320, and a rear base panel assembly 1420, which, when fully constructed, form a continuous base or chassis on which the printing system 2000 can be mounted. (As described above...) Figure 1A Similar to the gas enclosure assembly 100 described herein, various frame members and panels of the front panel assembly 1200, middle panel assembly 1300, and rear panel assembly 1400 of the gas enclosure assembly 1000 can be joined around the printing system 2000 to form a printing system enclosure. The front panel assembly 1200 can be contoured around the mounted printing system 2000 to form a first tunnel enclosure section of the gas enclosure. Similarly, the rear panel assembly 1400 can be shaped around the printing system 2000 to form a second tunnel enclosure section of the gas enclosure. Additionally, the middle panel assembly 1300 can be contoured around a bridge section of the printing system 2000 to form a bridge enclosure section of the gas enclosure. Simultaneously, the first tunnel enclosure section, the second tunnel section, and the bridge enclosure section can form a printing enclosure section. As will be discussed in more detail herein, according to this teaching, auxiliary enclosures can be hermetically separated from the printing system enclosure, for example, during the printing process, to perform various measurement and maintenance tasks with little or no interruption to the printing process.

[0058] Furthermore, the fully constructed gas-enclosed assembly (such as gas-enclosed assembly 1000), when integrated with various environmental control systems, can form various embodiments of a gas-enclosed system, including various embodiments of an OLED printing system (such as printing system 2000). According to various embodiments of the gas-enclosed system of this teaching, environmental control of the internal volume defined by the gas-enclosed assembly can include: control of illumination (e.g., by the number and arrangement of lamps of a specific wavelength), control of particulate matter using various embodiments of a particle control system, control of reactive gas species using various embodiments of a gas purification system, and temperature control of the gas-enclosed assembly using various embodiments of a thermal conditioning system.

[0059] exist Figure 1C The printing system shown in the unfolded diagram (such as, Figure 1B The printing system (2000) may consist of a number of devices and apparatuses that allow for the reliable arrangement of ink droplets at specific locations on a substrate. These devices and apparatuses may include, but are not limited to, a printhead assembly, an ink delivery system, a motion system for providing relative movement between the printhead assembly and the substrate, a substrate support device, a substrate loading and unloading system, and a printhead management system.

[0060] A printhead assembly may include at least one inkjet head having at least one orifice capable of ejecting ink droplets at a controlled rate, speed, and size. The inkjet head is fed by an ink supply system that supplies ink to the inkjet head. For example... Figure 1C As shown in the unfolded diagram, the printing system 2000 may have a substrate (such as substrate 2050) that can be supported by a substrate support device (such as a suction cup, for example, but not limited to, a vacuum suction cup, a substrate floating suction cup with a pressure port, and a substrate floating suction cup with both vacuum and pressure ports). In various embodiments of the systems and methods of this teaching, the substrate support device may be a substrate floating stage. As will be discussed in more detail herein, Figure 1C The substrate floating stage 2200 can be used to support the substrate 2050, and in conjunction with the Y-axis motion system, it can be part of a substrate transport system that provides frictionless transport of the substrate 2050. As will be discussed in more detail herein, the Y-axis motion system of this teaching may include a first Y-axis support beam 2351 and a second Y-axis support beam, which may include a clamping system (not shown) for holding the substrate. The Y-axis motion may be provided by a linear air bearing or a linear mechanical system. Figure 1B and Figure 1C The substrate floating stage 2200 of the printing system 2000 shown can limit the substrate 2050 to pass through during the printing process. Figure 1AThe gas surrounds the movement of component 1000.

[0061] Figure 1C An example of a substrate floating stage 2200 for a printing system 2000 is generally shown, which may include a floating transport member for the substrate, the floating transport member potentially having a porous medium for providing floating. Figure 1C In the example, a conveyor or other transport mechanism can be used to position the substrate 2050 within the input region 2201 of the substrate floating stage 2200, such as on a transport mechanism. The conveyor can position the substrate 2050 at a specific location within the printing system, such as using mechanical contact (e.g., using an array of pins, a tray, or a support frame construction) or using air cushions to controllably float the substrate 2050 (e.g., an "air bearing" stage construction). The printing region 2202 of the substrate floating stage 2200 can be used to controllably deposit one or more layers onto the substrate 2050 during manufacturing. The printing region 2202 can also be coupled to the output region 2203 of the substrate floating stage 2200. The conveyor can extend along the input region 2201, printing region 2202, and output region 2203 of the substrate floating stage 2200 and can reposition the substrate 2050 as needed for various deposition tasks, or can reposition the substrate 2050 during a single deposition operation. The controlled environment near the input area 2201, the print area 2202, and the output area 2203 can be universally shared.

[0062] Figure 1C The printing system 2000 may include one or more printhead assemblies 2505, each printhead assembly having one or more printheads; for example, nozzle printing, thermal jet, or inkjet type. The one or more printhead assemblies 2505 may be coupled to or otherwise span an overhead carriage, such as a first X-axis carriage assembly 2301. In various embodiments of the printing system 2000 of this teaching, one or more printheads of the one or more printhead assemblies 2505 may be configured to deposit one or more patterned organic layers on the substrate 2050 in a "face-up" configuration. Such layers may include, for example, one or more of an electron injection or transport layer, a hole injection or transport layer, a blocking layer, or an emitting layer. This material may provide one or more electrically functional layers.

[0063] according to Figure 1CThe floating scheme illustrated, in the example where substrate 2050 is supported solely by an air cushion, can apply a combination of positive pressure and vacuum through the arrangement of ports or the use of a distributed porous medium. Such a zone with pressure and vacuum control can effectively provide a fluid spring between the conveyor and the substrate. The combination of positive pressure and vacuum control can provide a fluid spring with bidirectional stiffness. The gap between the substrate (e.g., substrate 2050) and the surface can be referred to as the "flight height" and can be controlled or otherwise established by controlling the positive pressure and vacuum port states. In this way, the substrate's Z-axis height can be carefully controlled, for example, within the printing area 2202. In some embodiments, mechanical holding techniques (such as pins or frames) can be used to limit lateral translation of the substrate when it is supported by the air cushion. This holding technique can include the use of a spring-loaded structure to reduce instantaneous forces transmitted to the sides of the substrate while holding it; this can be advantageous because high-force impacts between the laterally translated substrate and the holding device can cause the substrate to shatter or even catastrophically break.

[0064] In other cases, generally speaking, as Figure 1C As shown, when precise control of flight altitude is not required, pressure-only floating zones may be provided, for example, along a conveyor or elsewhere in input or output areas 2100 or 2300. "Transition" zones may be provided, for example, where the pressure-to-vacuum nozzle ratio gradually increases or decreases. In an exemplary example, substantially uniform heights may exist between the pressure-vacuum zone, the transition zone, and the pressure-only zone, such that, within tolerances, these three zones may be substantially in a single plane. Elsewhere, the flight altitude of the substrate above the pressure-only zone may be greater than that of the substrate above the pressure-vacuum zone, for example, to allow sufficient height so that the substrate will not collide with the floating stage in the pressure-only zone. In an exemplary example, the OLED panel substrate may have a flight altitude between approximately 150 micrometers (μ) and approximately 300 μ above the pressure-only zone, and then a flight altitude between approximately 30 μ and approximately 50 μ above the pressure-vacuum zone. In an exemplary example, one or more parts of the substrate floating stage 2200 or other manufacturing equipment may include components made of… Air Bearings (Aston, Pennsylvania, USA) provides "air bearing" components.

[0065] Porous media can be used to create distributed pressurized air cushions for floating transport or supporting the substrate 2050 during one or more of the processes of printing, buffering, drying, or heat treatment. For example, a porous media “plate” (such as being attached to or included as part of a conveyor) can provide “distributed” pressure to support the substrate 2050 in a manner similar to the use of individual gas ports. The use of distributed pressurized air cushions can further improve uniformity and reduce or minimize the formation of non-uniformities or other visible defects in certain situations, such as where the use of relatively large gas ports for generating the air cushions results in non-uniformity.

[0066] Porous media can be obtained, for example, from Nano TEM Co., Ltd. (Niigata, Japan), having physical dimensions specified to occupy the entirety of substrate 2050 or a specified area of ​​the substrate (such as a display area or an area outside the display area). Such porous media may include pore sizes specified to provide a desired pressurized airflow over the specified area while reducing or eliminating the formation of inhomogeneities or other visible defects.

[0067] Printing requires relative movement between the printhead assembly and the substrate. This can be accomplished using a motion system (typically a stage or a split-axis XYZ system). The printhead assembly can move on a fixed substrate (stage type), or both the printhead and substrate can move in a split-axis configuration. In another embodiment, the printhead assembly can be substantially fixed; for example, the substrate can move relative to the printhead in the X and Y axes, with Z-axis movement provided by a substrate support device or a Z-axis motion system associated with the printhead assembly. As the printhead moves relative to the substrate, ink droplets are ejected at the correct time to deposit at the desired location on the substrate. A substrate loading and unloading system can be used to insert and remove the substrate from the printer. Depending on the printer configuration, this can be accomplished using a mechanical conveyor, a substrate floating stage with conveying components, or a substrate transfer robot with an end effector. A printhead management system can consist of several subsystems that allow for measurement tasks (such as checking nozzle emission and measuring droplet volume, velocity, and trajectory from each nozzle in the printhead) and maintenance tasks (such as wiping or drying ink nozzle surfaces with excess ink, agitating and cleaning the printhead by ejecting ink from the ink supply through the printhead into a waste pool, and replacing the printhead). Considering the various components that may be included in an OLED printing system, various embodiments of the OLED printing system can have various influence areas and shape factors.

[0068] Compared to Figure 1CThe printing system base 2100 may include a first vertical plate 2120 and a second vertical plate 2122, on which a bridge 2130 is mounted. In various embodiments of the printing system 2000, the bridge 2130 may support a first X-axis bracket assembly 2301 and a second X-axis bracket assembly 2302 respectively spanning the bridge 2130, which may control the movement of a first printhead assembly 2501 and a second printhead assembly 2502. In various embodiments of the printing system 2000, the first X-axis bracket assembly 2301 and the second X-axis bracket assembly 2302 may utilize a linear air bearing motion system that is inherently low-particle-generating. In various embodiments of the printing system according to this teaching, the X-axis bracket may have a Z-axis moving plate mounted thereon. Figure 1C In the diagram, the first X-axis bracket assembly 2301 is depicted as having a first Z-axis moving plate 2310, while the second X-axis bracket assembly 2302 is depicted as having a second Z-axis moving plate 2312. Although Figure 1C Two carriage assemblies and two printhead assemblies are depicted. For various embodiments of the printing system 2000, a single carriage assembly and a single printhead assembly may be present. For example, one of the first printhead assembly 2501 and the second printhead assembly 2502 may be mounted on the X, Z axis carriage assembly, while a camera system for inspecting features of the substrate 2050 may be mounted on the second X, Z axis carriage assembly. Various embodiments of the printing system 2000 may have a single printhead assembly; for example, one of the first printhead assembly 2501 and the second printhead assembly 2502 may be mounted on the X, Z axis carriage assembly, while a UV lamp for curing the packaging layer printed on the substrate 2050 may be mounted on the second X, Z axis carriage assembly. For various embodiments of the printing system 2000, a single printhead assembly (e.g., either the first printhead assembly 2501 or the second printhead assembly 2502) may be mounted on the X, Z axis carriage assembly, while a heat source for curing the packaging layer printed on the substrate 2050 may be mounted on the second carriage assembly.

[0069] exist Figure 1C In the process, each printhead component (such as, Figure 1CThe first printhead assembly 2501 and the second printhead assembly 2502 may have a plurality of printheads mounted in at least one printhead assembly, as depicted in a partial view for the first printhead assembly 2501, which depicts a plurality of printhead assemblies 2505. A printhead assembly may include, for example, but not limited to, fluid and electronic connections to at least one printhead; and a respective printhead having a plurality of nozzles or orifices capable of ejecting ink at a controlled rate, speed, and size. For various embodiments of the printing system 2000, the printhead assembly may include between about one and about 60 printhead assemblies, wherein each printhead assembly may have between about one and about 30 printheads. A printhead (e.g., an industrial inkjet head) may have between about 16 and about 2048 nozzles capable of ejecting droplet volumes between about 0.1 pl and about 200 pl.

[0070] According to various embodiments of the gas envelopment system of this teaching, given the absolute number of printhead assemblies and printheads, a first printhead management system 2701 and a second printhead management system 2702 can be housed in an auxiliary enclosure that can be separated from the print system enclosure during the printing process to perform various measurement and maintenance tasks with little or no interruption to the printing process. For example, in Figure 1C As can be seen, the first printhead assembly 2501 is positioned relative to the first printhead management system 2701 in preparation for performing various measurement and maintenance processes that can be performed by the first printhead management system devices 2707, 2709, and 2711. Devices 2707, 2709, and 2711 can be any subsystem or module among various subsystems or modules used to perform various printhead management functions. For example, devices 2707, 2709, and 2711 can be any module among droplet measurement modules, printhead replacement modules, cleaning tank modules, and ink-absorbing paper modules. Figure 1C As depicted, the first printhead management system 2701 may have devices 2707, 2709, and 2711, which may be mounted on a linear track motion system 2705 for positioning relative to the first printhead assembly 2501. Similarly, various devices housed within the second printhead management system 2702 may be mounted on a linear track motion system 2706 for positioning relative to the first printhead assembly 2502.

[0071] Referring again to various embodiments of gas-enclosed assemblies with auxiliary enclosures, Figure 1B The auxiliary enclosure can be isolated from the first working volume (e.g., the printing system enclosure) and hermetically isolated from the first working volume. For example... Figure 1CAs depicted, four isolators may exist on the printing system 2000; a first isolator arrangement 2110 (a second isolator on the opposite side is not shown) and a second isolator arrangement 2112 (a second isolator on the opposite side is not shown), which support the substrate floating stage 2200 of the printing system 2000. For Figure 1B The gas envelopment assembly, the first isolator setting 2110 and the second isolator setting 2112 can be installed in each of the corresponding isolator wall panels (e.g., the first isolator wall panel 1325 and the second isolator wall panel 1327 of the intermediate base panel assembly 1320). For Figure 1B The gas envelopment assembly 1000, and the intermediate base assembly 1320 may include a first printhead management system auxiliary panel assembly 1330 and a second printhead management system auxiliary panel assembly 1370. The gas envelopment assembly 1000... Figure 1B A first printhead management system auxiliary panel assembly 1330, which may include a first rear wall panel assembly 1338, is depicted. Similarly, a second printhead management system auxiliary panel assembly 1370, which may include a second rear wall panel assembly 1378, is also depicted. The first rear wall panel assembly 1338 of the first printhead management system auxiliary panel assembly 1330 may be constructed in a similar manner as shown for the second rear wall panel assembly 1378. The second rear wall panel assembly 1378 of the second printhead management system auxiliary panel assembly 1370 may be constructed from a second rear wall frame assembly 1378 having a second seal support panel 1375 that is sealably mounted to the second rear wall frame assembly 1378. The second seal support panel 1375 may have a second channel 1365 adjacent to a second end (not shown) of the base 2100. A second seal 1367 may be mounted on the second seal support panel 1375 around the second channel 1365. A first seal may be positioned and mounted around the first channel of the first printhead management system auxiliary panel assembly 1330. Each channel in auxiliary panel assembly 1330 and auxiliary panel assembly 1370 can accommodate a printhead management system platform, such as, via the channel... Figure 1C The first and second printhead management system platforms 2703 and 2704. According to this teaching, in order to hermetically isolate auxiliary panel assembly 1330 and auxiliary panel assembly 1370, channels (such as...) Figure 1B The second channel (1365) must be sealable. Various seals (such as pneumatic seals, bellows seals, and lip seals) can be used to seal the channel (such as...) around the printhead management system platform fixed to the print system base. Figure 1B The second channel (1365).

[0072] The first printhead management system auxiliary panel assembly 1330 and the second printhead management system auxiliary panel assembly 1370 may respectively include a first printhead assembly opening 1342 of the first base plate panel assembly 1341 and a second printhead assembly opening 1382 of the second base plate panel assembly 1381. Figure 1B The first base plate panel assembly 1341 is depicted as part of the first intermediate surrounding panel assembly 1340 of the intermediate panel assembly 1300. The first base plate panel assembly 1341 is the same panel assembly as the first intermediate surrounding panel assembly 1340 and the first printhead management system auxiliary panel assembly 1330. Figure 1B The second base panel assembly 1381 is depicted as part of the second intermediate surrounding panel assembly 1380 of the intermediate panel assembly 1300. The second base panel assembly 1381 is the same panel assembly as the second intermediate surrounding panel assembly 1380 and the second printhead management system auxiliary panel assembly 1370.

[0073] As discussed previously herein, a first printhead assembly 2501 may be housed within a first printhead assembly enclosure 2503, while a second printhead assembly 2502 may be housed within a second printhead assembly enclosure 2504. According to the systems and methods of this teaching, the first printhead assembly enclosure 2503 and the second printhead assembly enclosure 2504 may have openings at their bottoms that may have edges (not shown), thereby allowing the various printhead assemblies to be positioned for printing during the printing process. Furthermore, the housing-forming portions of the first printhead assembly enclosure 2503 and the second printhead assembly enclosure 2504 may be constructed as previously described for the various panel assemblies, thereby enabling the frame assembly members and the panels to provide an hermetically sealed enclosure.

[0074] A compressible gasket, which may also be used for hermetically sealing various frame components, may be secured around each of the first printhead assembly opening 1342 and the second printhead assembly opening 1382, or alternatively around the edges of the first printhead assembly surround 2503 and the second printhead assembly surround 2504.

[0075] According to this teaching, compressible gasket materials can be selected from, for example, but not limited to, any class of closed-cell polymer materials (also referred to in this field as expandable rubber materials or expandable polymer materials). Briefly, closed-cell polymers are prepared in a manner that encloses gas in discrete pores; wherein each discrete pore is sealed by the polymer material. Desired properties of compressible closed-cell polymer gasket materials for hermetic sealing of frame and panel components include, but are not limited to, resistance to chemical attack over a wide range of chemical species, excellent moisture barrier properties, elasticity over a wide temperature range, and resistance to permanent compression set. Generally, closed-cell polymer materials exhibit higher dimensional stability, lower moisture absorption coefficients, and higher strength compared to open-cell polymer materials. Various types of polymer materials (from which closed-cell polymer materials can be made) can include, for example, but not limited to, silicone resins, neoprene rubber, ethylene-propylene-diene terpolymers (EPT); polymers and composites made using ethylene-propylene-diene monomers (EPDM), vinyl nitrile, styrene-butadiene rubber (SBR), and various copolymers and mixtures thereof.

[0076] Besides closed-cell compressible gasket materials, another example of a category of compressible gasket materials having the desired properties for constructing gas-enclosed assemblies according to the present teachings includes hollow extrusion compressible gasket materials. Hollow extrusion gasket materials, as a category of materials, have desired properties, including but not limited to, resistance to chemical attack over a wide range of chemical species, good moisture barrier properties, elasticity over a wide temperature range, and resistance to permanent compression deformation. Such hollow extrusion compressible gasket materials can be made using various shape factors, such as, for example, but not limited to, U-shaped holes, D-shaped holes, square holes, rectangular holes, and any of the various conventional shape factor hollow extrusion gasket materials. Various hollow extrusion gasket materials can be manufactured from polymeric materials used in the manufacture of closed-cell compressible gaskets. For example, but not limited to, various embodiments of hollow extrusion gaskets can be manufactured from silicone resins, neoprene rubber, ethylene-propylene-diene terpolymers (EPT); polymers and composites made using ethylene-propylene-diene monomers (EPDM), vinyl nitrile, styrene-butadiene rubber (SBR), and various copolymers and mixtures thereof. The compression of this hollow-hole gasket material should not exceed 50% deviation in order to maintain the desired properties. Various types of pneumatic seals can be considered for use: sealing the printhead assembly using a first printhead assembly mating gasket 1345 and a second printhead assembly mating gasket 1385. These pneumatic seals provide rapid sealing and opening during processing and are made from low-contamination materials such as low-particulate-generation materials and low-degassing polymers, such as silicone, neoprene, and butyl rubber.

[0077] like Figure 1B As depicted, the first printhead assembly mating washer 1345 and the second printhead assembly mating washer 1385 can be secured around the first printhead assembly opening 1342 and the second printhead assembly opening 1382, respectively. During various printhead measurement and maintenance processes, the first printhead assembly 2501 and the second printhead assembly 2502 can be positioned above the first printhead assembly opening 1342 of the first base plate panel assembly 1341 and the second printhead assembly opening 1382 of the second base plate panel assembly 1381, respectively, by the first X, Z axis bracket assembly 2301 and the second X, Z axis bracket assembly 2302. In this respect, for various printhead measurement and maintenance processes, without covering or sealing the first printhead assembly opening 1342 and the second printhead assembly opening 1382, the first printhead assembly 2501 and the second printhead assembly 2502 can be positioned above the first printhead assembly opening 1342 of the first base plate panel assembly 1341 and the second printhead assembly opening 1382 of the second base plate panel assembly 1381, respectively. The first X, Z axis bracket assembly 2301 and the second X, Z axis bracket assembly 2302 can respectively mate the first printhead assembly surround 2503 and the second printhead assembly surround 2504 with the first printhead management system auxiliary panel assembly 1330 and the second printhead management system auxiliary panel assembly 1370. During various printhead measurement and maintenance processes, this mating can effectively close the first printhead assembly opening 1342 and the second printhead assembly opening 1382 without requiring a seal. For various printhead measurement and maintenance processes, the mating may include the formation of a gasket seal between each of the printhead assembly surround and the printhead management system panel assembly. Combined with a sealable closure channel (such as...) Figure 1B The second channel 1365 and the supplementary first channel) when the first printhead assembly surround 2503 and the second printhead assembly surround 2504 are mated with the first printhead management system auxiliary panel assembly 1330 and the second printhead management system auxiliary panel assembly 1370 to sealably close the first printhead assembly opening 1342 and the second printhead assembly opening 1382, the resulting combined structure is hermetically sealed.

[0078] Additionally, according to this teaching, auxiliary enclosures can be sealingly closed by using structural closures (such as, Figure 1BThe first printhead assembly opening 1342 and the second printhead assembly opening 1382 are used to separate from, for example, another internal enclosing volume (such as a printing system enclosure) and the exterior of the gas enclosing assembly. According to this teaching, structural closures can include various sealable covers for openings or passages; such openings or passages include non-limiting examples of enclosing panel openings or passages. According to the systems and methods of this teaching, a door can be any structural closure that can be used to reversibly cover or reversibly seal any opening or passage using pneumatic, hydraulic, electrical, or manual actuation. Thus, a door can be used to reversibly cover or reversibly seal any opening or passage. Figure 1B The first printhead assembly opening 1342 and the second printhead assembly opening 1382.

[0079] exist Figure 1C In the unfolded view of the printing system 2000, various embodiments of the printing system may include a substrate floating stage 2200 supported by a substrate floating stage base 2220. The substrate floating stage base 2220 may be mounted on the printing system base 2100. The substrate floating stage 2000 of the OLED printing system may support a substrate 2050 and define the travel of the substrate 2050 through the gas envelopment assembly 1000 during the printing of the OLED substrate. The Y-axis motion system of this teaching may include a first Y-axis support beam 2351 and a second Y-axis support beam, which may include a clamping system (not shown) for holding the substrate, which will be discussed in more detail herein. Y-axis motion may be provided by a linear air bearing or a linear mechanical system. In this respect, in conjunction with the motion system; such as Figure 1C The depicted Y-axis motion system, the substrate floating stage 2200, can provide frictionless transport of the substrate 2050 through the printing system.

[0080] Figure 1D A first printhead management system 2701, comprising various embodiments of a gas envelopment assembly and system according to the present teachings, is depicted, housed within a first printhead management system auxiliary panel assembly 1330. For example... Figure 1D The auxiliary panel assembly 1330 is depicted as a cross-sectional view to provide a clearer view of the details of the first printhead management system 2701. Printhead management systems according to this teaching (such as...) Figure 1D In various embodiments of the first printhead management system 2701, devices 2707, 2709, and 2711 can be various subsystems or modules for performing various functions. For example, devices 2707, 2709, and 2711 can be a droplet measurement module, a printhead cleaning tank module, and an ink-absorbing paper module. Figure 1DAs depicted, the printhead replacement module 2713 can provide a location for docking at least one printhead assembly 2505. In various embodiments of the first printhead management system 2701, the first printhead management system auxiliary panel assembly 1330 can be maintained as a gas-supporting assembly 1000 (see...). Figure 1A The same environmental specifications apply. The first printhead management system auxiliary panel assembly 1330 may have a conveyor 2530 positioned to perform tasks associated with various printhead management processes. For example, such a subsystem may have various consumable and replaceable parts, such as replacement absorbent paper, ink, and waste reservoirs. The conveyor can be used to package various consumable parts in preparation for insertion (e.g., in a fully automated mode). As a non-limiting example, absorbent paper may be packaged in a tube format, which can be easily inserted into the absorbent module for use. As another non-limiting example, ink may be packaged in a replaceable reservoir and in a tube format for use in the printing system. Various embodiments of the waste reservoir may be packaged in a tube format, which can be easily inserted into the cleaning tank module for use. In addition, parts of various components of the printing system subjected to continuous use may need to be replaced periodically. During the printing process, advantageous management of the printhead assembly (e.g., but not limited to, printhead assembly or printhead interchangeability) may be desirable. The printhead replacement module may have a portion (such as a printhead assembly or printhead) that can be easily inserted into the printhead assembly for use. A droplet measurement module for checking nozzle emission and for measuring droplet volume, velocity, and trajectory based on optical detection from each nozzle may have a source and detector that may need to be replaced periodically after use. A conveyor may be used to package various consumable and highly utilized portions in preparation for insertion (e.g., in a fully automated mode). The conveyor 2530 may have an end effector 2536 mounted to the arm 2534. Various embodiments of the end effector configuration may be used, such as blade-type end effectors, clamp-type end effectors, and gripper-type end effectors. Various embodiments of the end effector may include mechanical gripping and clamping, as well as pneumatic or vacuum-assisted components to actuate portions of the end effector or otherwise hold the printhead assembly or the printhead from the printhead assembly.

[0081] Regarding the printhead assembly or printhead replacement, Figure 1D The printhead management system 2701's printhead replacement module 2713 may include a docking station for a printhead assembly having at least one printhead, and a storage container for the printhead. In each printhead assembly (see...) Figure 1BWhen the printhead assembly may include approximately 1 to approximately 60 printhead units, and when each printhead assembly may have approximately 1 to approximately 30 printheads, various embodiments of the printing system of this teaching may have approximately 1 to approximately 1800 printheads. In various embodiments of the printhead replacement module 2713, although the printhead assemblies are docked, the individual printheads mounted to the printhead assemblies may remain in operating conditions when not in use in the printing system. For example, when placed in the docking station, the individual printheads on each printhead assembly may be connected to the ink supply and electrically connected. Power may be supplied to the individual printheads on each printhead assembly, so that periodic emission pulses may be applied to the individual nozzles of each printhead during docking to ensure that the nozzles remain engaged and do not clog. Figure 1D The conveyor 2530 can be positioned close to the printhead assembly 2500. For example... Figure 1D As depicted, the printhead assembly 2500 can be docked above the first printhead management system auxiliary panel assembly 1330. During the printhead replacement process, the conveyor 2530 can remove the target portion from the printhead assembly 2500; the printhead or a printhead assembly having at least one printhead. The conveyor 2530 can retrieve the replacement portion (such as a printhead assembly or printhead) from the printhead replacement module 2713 and complete the replacement process. The removed portion can be placed into the printhead replacement module 2713 for retrieval.

[0082] exist Figure 2A In the gas encapsulation system 500, there may be: a first tunnel encapsulation section, which may have an inlet gate 1242 for receiving a substrate; a bridge encapsulation section 1300; and a second tunnel encapsulation section, which together form a printing system encapsulation. Additionally, the gas encapsulation system 500 may have an auxiliary encapsulation 1330. The auxiliary encapsulation 1330 can be hermetically separable from the printing system encapsulation of the gas encapsulation system 500. For example, during the printing process, the auxiliary encapsulation 1330 can be hermetically separable from the printing system encapsulation of the gas encapsulation system 500 to perform various measurement and maintenance tasks with little or no interruption to the printing process. As will be discussed later herein... Figure 8 The discussion in more detail concerns purification systems (such as...). Figure 8 The purified inert gas from the purification system 3130 can be circulated into the printing system enclosure and auxiliary enclosure 1300 of the gas enclosure system 500.

[0083] In various embodiments of the printing system according to this teaching, the printhead assembly may include between approximately one and approximately 60 printhead devices. Recall, a printhead device may include, for example, but not limited to, fluid and electronic connections to at least one printhead; and individual printheads having multiple nozzles or orifices capable of ejecting ink at controlled rates, speeds, and sizes, wherein each printhead device may have between approximately one and 30 printheads. A printhead (e.g., an industrial inkjet head) may have between approximately 16 and approximately 2048 nozzles capable of ejecting droplet volumes between approximately 0.1 pl and approximately 200 pl. Given the absolute number of printhead devices and printheads, an auxiliary enclosure may house various embodiments of the printhead management system. According to this teaching, the auxiliary enclosure may be separated from the printing system enclosure during the printing process to perform various measurement and maintenance tasks, such as, but not limited to, various devices and apparatuses using the printhead management system. Similarly, various measurement and maintenance tasks may be performed with little or no interruption to the printing process.

[0084] Figure 2B A perspective view depicting an auxiliary enclosure 1330 of a gas enclosure system according to various embodiments of the present teaching is provided. The auxiliary enclosure 1330 can be, for example, but not limited to, various gas enclosure systems of the present teaching (such as, Figure 1A Gas Enclosure System 1000 and Figure 2A An embodiment of an auxiliary enclosure that utilizes a gas enclosure system 500 together. For example... Figure 2B As shown, the auxiliary enclosure 1330 may have a printhead management system platform 2703, which may have a linear track system 2705 for positioning various devices and equipment for various measurement and maintenance processes relative to various printhead devices of the printhead assembly. For example, in Figure 2B The partially exploded view shows a printhead assembly 2500 positioned above the printhead assembly opening 1350. The printhead assembly 2500 may have multiple printhead assemblies, such as... Figure 2C The figures 2505A, 2505B, and 2505C are shown. The first motion system platform 2800A and the second motion system platform 2800B can be used to position various devices and equipment mounted on the motion system platform for various measurement and maintenance processes relative to each of the plurality of printhead devices of the printhead assembly 2500.

[0085] Figure 2C The partially exploded view depicts a top perspective view of the printhead management system 2700 related to the printhead assembly 2500. (See attached image.) Figure 2CThe depicted first motion system platform 2800A and second motion system platform 2800B are movable along the Y-axis on a linear track system 2705. In this manner, the linear track system 2705 can position various devices and equipment mounted on the motion system platform relative to the respective printhead assemblies 2505A, 2505B, and 2505C of the printhead assembly 2500. The first motion system platform 2800A can support a first X-axis motion system platform 2810A, which may have a first X-axis linear track system 2820A. The first X-axis linear track system 2820A can move various devices mounted on the first X-axis motion system platform 2810A in a direction orthogonal to the direction of the first motion system platform 2800A on the linear track system 2705. Similarly, the second motion system platform 2800B can support a second X-axis motion system platform 2810B, which may have a second X-axis linear track system 2820B. The second X-axis linear track system 2820B can move various devices mounted on the second X-axis motion system platform 2810B in a direction orthogonal to the direction of the second motion system platform 2800B on the linear track system 2705. In this respect, the X and Y movements of the first motion system platform 2800A and the first X-axis motion system platform 2810A, as well as the X and Y movements of the second motion system platform 2800B and the second X-axis motion system platform 2810B, can provide precise X and Y positioning of various devices and equipment relative to each of the printhead devices 2505A, 2505B, and 2505C.

[0086] like Figure 2C The various devices depicted mounted on the first X-axis motion system platform 2810A of the first motion system platform 2800A may include: cleaning pools 2707A, 2707B, and 2707C for each of the printhead devices 2505A, 2505B, and 2505C, and a desiccant station 2709. Figure 2CThe first droplet measurement module 2711A, mounted on a first X-axis motion system platform 2810A of a first motion system platform 2800A, and the second droplet measurement module 2711B, mounted on a second X-axis motion system platform 2810B of a second motion system platform 2800B, are depicted for providing calibration information. The first droplet measurement system 2711A may be based on, for example, but not limited to, printed droplets falling from the nozzles of the respective printheads of the respective printhead assemblies onto a thin film under specified conditions, and imaged from the film. Information (such as droplet volume, velocity, and trajectory) can be obtained through image analysis of the data thus acquired. Alternatively, the second droplet measurement system 2711B may be based on, for example, but not limited to, an optical measurement system. For example, laser scattering techniques (such as phase Doppler analysis (PDA) and phase Doppler interferometry (PDI)) can be used to determine the droplet volume, velocity, and trajectory of each droplet from the nozzles of the respective printheads of the respective printhead assemblies.

[0087] Figure 3 Depicting the situation according to this teaching Figure 3 The Y-axis motion system is depicted as being mounted on a Y-axis beam 2350, which may be, for example, a granite beam. As depicted in the coordinate system, a substrate (such as 2050) mounted on a floating stage 2200 can travel in the + / - Y-axis direction. The floating stage 2200 provides frictionless, low-particle-generation substrate support for the substrate 2050 with precise Z-axis flight height, while the Y-axis motion system 2600 provides support for the substrate 2050 relative to a printhead assembly (such as...). Figure 1C Frictionless, low-particle Y-axis transport of the printhead assembly 2501.

[0088] Various embodiments of the low-particle-generation Y-axis motion system of this teaching, combined with the floating stage, can be compared to, for example, a suction cup mounted on a large turntable. In the case of a suction cup mounted on a large turntable, a large motor would be required for operation of the turntable, resulting in significant heat dissipation and particle generation due to the movement of solid components against solid components. In the various embodiments of the gripper system of this teaching, the only inertia in the system is the mass of the substrate and gripper assembly, thus making any linear motor required for Y-axis motion substantially smaller than that required for a suction cup mounted on a turntable.

[0089] Furthermore, the inventors have discovered that although the Y-axis beam 2350 is manufactured to provide a highly flat and parallel surface, the Y-axis beam can deviate during travel. This deviation may be unacceptable for the intended use, given the accuracy of the substrate's orientation relative to the theta-Z (θ-Z) axis during Y-axis travel. For example, but not limited to, printing ink into pixels of an OLED device substrate is a process requiring precise orientation of the substrate along the travel axis. For this travel, a beam manufactured with high tolerances for flatness and parallelism can still produce unacceptable deviations in substrate orientation during travel. Therefore, various embodiments of the Y-axis motion system 2600 of this teaching, utilizing an air bearing motion system for transporting the Y-axis carrier assembly 2620, can provide reliable, accurate, low-particle-generation Y-axis transport of the substrate, thereby providing operation at high speeds with rapid acceleration and deceleration, and eliminating the need for dissipation of excessive heat contamination in the gas-enclosed system. Furthermore, the gripper motion control component 2650 of the Y-axis motion system 2600 can provide dynamic rotation of the substrate around the theta-Z (θ-Z) axis during Y-axis travel to maintain high accuracy in substrate orientation parallel to the travel axis. Therefore, the gripper motion control component 2650 of the Y-axis motion system 2600 can maintain the substrate orientation in, for example, a horizontal plane determined by the substrate's flight height, with high accuracy parallel to the Y-axis travel direction.

[0090] like Figure 3 As shown, various embodiments of the linear Y-axis motion system 2600 may include a substrate holder assembly 2610, a Y-axis bracket assembly 2620, and a holder motion control assembly 2650. Figure 3 In this assembly, the clamping assembly 2610 may include a substrate clamping surface, such as, but not limited to, a vacuum suction cup rod 2612, which may be supported on the substrate clamping frame 2614. The substrate clamping frame 2614 may be mounted to the Y-axis bracket assembly 2620 of the Y-axis motion system assembly 2600. Figure 3In the Y-axis bracket assembly 2620, the first air bearing positioner 2628A and the second air bearing positioner 2628B are indicated to be mounted to the first saddle arm 2622A and the second saddle arm 2622B, respectively, which are part of a plurality of air bearings supporting the Y-axis bracket assembly 2620. The Y-axis bracket assembly 2620 can be translated in the + / - Y-axis direction using a brushless linear motor. As will be discussed in more detail below, the gripper motion control assembly 2650 can utilize a dual voice coil motor assembly (such as voice coil motor assemblies 2630A and 2630B) and a pivot assembly 2660. Various embodiments of the gripper motion control assembly may include at least one voice coil motor and an air-sleeve central pivot combining a position sensor and a motion controller. Various embodiments of the Y-axis motion system of this teaching based on a voice coil motor are highly reliable and can provide directional accuracy of less than 1 micrometer. Furthermore, this gripper assembly, where the substrate is directly coupled to the Y-axis motion system, allows for frictionless high-speed operation with rapid acceleration and deceleration using a linear brushless motor for transport in the Y-axis carriage assembly 2620, and enables dynamic rotation of the substrate around the theta-Z (θ-Z) axis during Y-axis travel using the gripper motion control assembly 2650 to maintain high accuracy in substrate orientation parallel to the travel axis. Thus, various embodiments of the Y-axis motion system utilizing the air bearing gripper system can be implemented through printing systems (such as... Figure 1C The printing system 2000 provides precise, low-particle-forming transport of a substrate 2050 supported on a floating stage 2200. This frictionless Y-axis motion system for moving the substrate can utilize one or two Y-axis tracks. The service bundle carrier 2430 can be used for managing various service bundles, which may include, for example, but not limited to, optical fibers, cables, wires, conduits, etc. Various embodiments of the service bundles according to this teaching can be connected to the printing system to provide various optical, electrical, mechanical, and fluid connections required for the operation of the printing system.

[0091] Figure 4A This is a top view of the Y-axis motion system 2600, showing the gripper assembly 2610, the Y-axis bracket assembly top plate 2624, and the gripper motion control assembly 2650. The gripper assembly 2610 may include a vacuum suction cup rod 2612 mounted on the gripper frame 2614. The Y-axis bracket assembly top plate 2624... Figure 4AThe description indicates that it has a first end 2623 and a second end 2625. A sub-assembly of the gripper motion control assembly 2650 can be adjacent to the gripper assembly 2610 and the Y-axis bracket assembly 2620. For example, the first voice coil assembly 2630A and the second voice coil assembly 2630B have first and second voice coil housings 2632A and 2623B, respectively, which can be fixed to the Y-axis bracket assembly 2620 on one side of the voice coil assembly housing and to the gripper assembly 2610 on the opposite side of the voice coil housing. Additionally, the central pivot 2660 may include an air bearing housing 2662, which can be fixed to the boss 2616 of the gripper assembly 2610. Figure 4B yes Figure 4A A partial top view of the air bearing Y-axis motion system 2600, depicting an unfolded top view of the second end 2625 of the Y-axis motion system 2600. Figure 4B The unfolded top view of the clamp assembly 2610 and the unfolded top view of the voice coil assembly 2630B are particularly evident. Various embodiments of the vacuum suction cup rod 2612 mounted on the clamp frame 2614 may include multiple vacuum slots 2613, wherein... Figure 4B The text indicates three of the plurality of vacuum slots 2613. The vacuum slots 2613 are spaced apart along the length of the vacuum suction rod 2612, thereby allowing the vacuum suction rod 2612 to easily engage and release the substrate, thus eliminating the need for bilateral mechanical clamping of the substrate (such as bilateral mechanical clamping of a two- or three-finger clamping device). In addition... Figure 3 In addition to the first air bearing positioner 2628A and the second air bearing positioner 2628B used to support the Y-axis bracket assembly 2620, a second upper positioner 2628D can be mounted to the underside of the top plate 2624 of the Y-axis bracket assembly (see [link]). Figure 3 and Figure 4B The first upper locator (not shown) can be symmetrically mounted below the opposite first end 2623 of the top plate 2624 of the Y-axis bracket assembly near the first support arm 2622A (see [link]). Figure 4A ).

[0092] As will be discussed in more detail in this article, in addition to the air bearing positioner used to support the Y-axis bracket assembly 2620, Figure 4B The voice coil air bearing 2641 of the second voice coil assembly 2630B, as depicted together with the first voice coil assembly 2630A (see... Figure 4A An associated voice coil air bearing (not shown) can be used for the vertical stability of the clamp assembly 2610. Figure 4B In the top-view presentation, a single air bearing is visible. This is because the voice coil air bearing in the voice coil assembly is preloaded, such as... Figure 4AThe voice coil assemblies 2630A and 2630B ensure the necessary system stiffness. For example... Figure 4B As depicted in the top view, various embodiments of the Y-axis motion system of this teaching may include a single air bearing. Various embodiments of systems and methods utilizing a single air bearing in a voice coil assembly may use, for example, but not limited to, gravity, vacuum, or magnetic preloading to preload the air bearing. Various embodiments of the Y-axis motion system may utilize a second, opposing air bearing to provide bearing preloading. Various embodiments of the voice coil motor assembly of this teaching ( Figure 4B Such a voice coil assembly 2630B may include a voice coil housing 2633B that can be adjacent to a Y-axis bracket 2620. As will be discussed in more detail herein, a voice coil holder frame mounting block 2648B of the voice coil assembly 2630B may be used to secure the voice coil assembly to a holder frame 2614. The voice coil assembly 2630B may also include a voice coil shaft 2634B, which may have a pivot screw 2635B, a retaining screw 2636B, and a fixing screw 2637B. Additionally, the voice coil assembly 2630B may have a linear encoder 2638B. Finally, the central pivot 2660 is an air sleeve configured to provide a rotational axis for reliable and accurate theta-Z (θ-Z) rotation in an embodiment of the holder motion control system 2650 according to the present teachings. Although the components of the voice coil assembly 2630B have been described, the voice coil assembly 2630A can be described similarly.

[0093] Figure 5A This is an isometric view of the bracket assembly, gripper motion control assembly, and gripper assembly of a Y-axis motion system according to various embodiments of the systems and methods of this teaching. Figure 5A Described Figure 5A A Y-axis bracket assembly 2620 is depicted having first support arms 2622A and 2622B respectively; the support arms each have a first positioner 2628A and a second positioner 2628B mounted thereon; thereby, the positioners are close to the Y-axis beam 2350 (see Figure 3 The first and second support arms 2622A and 2622B, and the Y-axis bracket assembly side frame 2626 can be engaged with the Y-axis bracket assembly top plate 2624. The Y-axis bracket assembly side frame 2626 may have proximity to the Y-axis beam 2350 (see...). Figure 3 The first side 2627 and the second side 2629 adjacent to the gripper frame 2614. The gripper motion control assembly 2650 may include first and second voice coil assemblies 2630A and 2630B, respectively, and a central pivot assembly 2660. As discussed earlier herein, the gripper motion control assembly 2650 is adjacent to both the Y-axis bracket assembly 2620 and the gripper assembly 2610; thereby effectively abutting the Y-axis bracket assembly and the gripper assembly (see also...). Figure 4B Because the substrate (such as, Figure 3 The substrate 2050 is held by a vacuum suction cup rod 2612 mounted to the clamp frame 2614, so that when the Y-axis bracket assembly 2620 is on the Y-axis beam 2350 (see... Figure 3 During upward travel, the gripper motion control assembly 2650 dynamically adjusts the substrate's angle (θ-Z) to counteract the effects of defects in the Y-axis beam. Therefore, during Y-axis travel, the gripper motion control assembly 2650 can maintain the substrate's orientation around the θ-Z axis with high precision, thus maintaining high accuracy in orientation parallel to the travel axis. Various embodiments of the gripper motion control assembly 2650 can maintain the substrate's orientation parallel to the Y-axis travel within + / -4300 microradians. Therefore, the gripper motion control assembly 2650 of the Y-axis motion system 2600 can maintain the substrate's orientation with high precision parallel to the Y-axis travel direction, for example, in a horizontal plane determined by the substrate's flight height.

[0094] Figure 5B Depicting through Figure 5A A long cross-sectional perspective view of the Y-axis bracket assembly 2620, which generally shows the clamp assembly 2610 mounted to the Y-axis bracket assembly 2620. Figure 5B The image shows the first and second voice coil motor assemblies 2630A and 2630B, the vacuum suction cup rod 2612 on the clamp frame 2614, and the central pivot 2660. Figure 3 and Figure 5A The image shows the first air bearing positioner 2628A and the second air bearing positioner 2628B of the Y-axis bracket assembly 2620. Figure 4B The image describes the first and second air bearing positioners located below the top plate 2624 of the Y-axis bracket assembly. (See image for details.) Figure 5B As shown, the Y-axis bracket assembly side frame 2626 may have multiple air bearing positioners mounted thereon, such as air bearing positioners 2628E to 2640H. In addition to the air bearing positioners located on the support arm and the top plate of the bracket assembly near the Y-axis beam 2350, the multiple air bearing positioners mounted on the Y-axis bracket assembly side frame 2626 can provide bearing support between the side frame 2626 and the respective sides of the Y-axis beam 2350. Various embodiments of the Y-axis motion system of this teaching (e.g., as...) Figures 3 to 5B (as shown in the general diagram) can provide low particle generation and low heat generation delivery through the substrate of the printing system.

[0095] Figure 6The second side 2627 of the Y-axis bracket assembly side frame 2626, which is adjacent to the side of the gripper frame 2614, is depicted, and a Y-axis motion system sub-assembly including the gripper motion control assembly 2650 without the gripper frame 2614 is generally shown. First and second voice coil assemblies 2630A and 2630B can be mounted at opposite top ends of the second side 2627 of the Y-axis bracket assembly side frame 2626, while a central pivot 2660 can be mounted in the top central portion of the second side 2627 of the Y-axis bracket assembly side frame 2626. The first and second voice coil assemblies 2630A and 2630B can each include a first voice coil assembly shaft 2634A and a second voice coil assembly shaft 2634B, as well as a first voice coil assembly housing 2632A and a second voice coil assembly housing 2632B. Each of the first voice coil assembly shaft 2634A and the second voice coil assembly shaft 2634B may have a fixing screw, namely a first voice coil assembly fixing screw 2635A and a second voice coil assembly fixing screw 2637B, each fixing screw having a shank extending into the voice coil assembly fixing screw holes 2621A and 2621B respectively. Additionally, as... Figure 6 The depicted voice coil assembly shafts, first voice coil assembly shaft 2634A and second voice coil assembly shaft 2634B, may have pivot screws and retaining screws; pivot screw 2635A and retaining screw 2636A for the first voice coil assembly shaft 2634A and pivot screw 2635B and retaining screw 2636B for the first voice coil assembly shaft 2634B. For the initial adjustment of the horizontal position of the gripper assembly and the substrate relative to the floating stage, for the first and second voice coil assemblies 2630A and 2630B, the pivot screws and retaining screws can be loosened until the horizontal position of the gripper and the substrate is correctly adjusted, and then the pivot screws and retaining screws are tightened. The voice coil assemblies 2630A and 2630B can be adjusted equally to adjust the position of the gripper assembly in + / -Z relative to the floating stage (see [link to relevant documentation]). Figure 3 The voice coil assemblies 2630A and 2630B can be adjusted unequally relative to the floating stage (see...). Figure 3 The position of the clamping assembly in theta-X (θ-X) is adjusted. As discussed earlier herein, various embodiments of the voice coil assembly of this teaching utilize a pair of air bearings: an upper or top air bearing (such as air bearing 2640A of the first voice coil assembly 2630A and air bearing 2641A of the second voice coil assembly 2630B) and a corresponding bottom air bearing (such as air bearing 2640B of the first voice coil assembly 2630A and air bearing 2641B of the second voice coil assembly 2630B). Each bottom air bearing is used to preload the respective upper or top air bearing.

[0096] Figure 7AAn isometric view of a voice coil assembly according to this teaching is generally shown. The voice coil assembly may include a voice coil housing 2632 having a first side 2631 of a first voice coil housing and a second side 2633 opposite to the voice coil housing, and a voice coil shaft 2634. (As previously stated herein...) Figure 6 The voice coil shaft 2634, as discussed, may include a pivot screw 2635 and a retaining screw 2636, as well as a fixing screw 2637, all of which can be used for initial vertical adjustment of the gripper assembly relative to the floating stage. Figure 7B In the diagram, pivot screw 2635 and retaining screw 2636 have been removed, making the pivot through-hole 2645 accommodating pivot screw 2635 and the through slot 2646 accommodating retaining screw 2636 visible. Voice coil assembly 2630 may have a pair of air bearings, such as an upper air bearing 2642A and an opposite or lower air bearing 2642B, the lower air bearing being used to preload the upper air bearing. Voice coil assembly 2630 may include a voice coil holder frame mounting block 2648, which can be used to secure the voice coil assembly to a holder frame (see [link to documentation]). Figure 4B Alternatively, the voice coil assembly of this teaching may include a linear encoder 2638 oriented in the X direction. Various embodiments of the Y-axis motion system of this teaching utilize a linear encoder head that allows the voice coil to be oriented within 1-2 micrometers relative to the bracket assembly in the X direction, thereby providing dynamic adjustment in the theta-Z (θ-Z) during transport of the substrate on the Y-axis beam using various embodiments of the Y-axis motion system of this teaching. Additionally, for Figure 6 Various embodiments of the gripper control assembly 2650, a master-slave control system can be used to control Figure 6 The first voice coil assembly 2630A and the second voice coil assembly 2630B are configured such that if one voice coil responds to a correction theta-Z (θ-Z) orientation, the other voice coil is controlled in an equal or offset manner. Various embodiments of the gripper motion control assembly 2650 can maintain the orientation of the substrate traveling parallel to the Y-axis within + / -4300 microradians. Therefore, the gripper motion control assembly 2650 of the Y-axis motion system 2600 can maintain the substrate orientation in a horizontal plane, for example, determined by the substrate's flight height, with high precision in the direction of travel parallel to the Y-axis.

[0097] Figure 8 This is a top view of the Y-axis motion system 2600, with indicators. Figure 8 and Figure 9 The position of the cross-sectional view Figure 4A Similarly, gripper assembly 2610, Y-axis bracket assembly top plate 2624, and gripper motion control assembly 2650 are shown.

[0098] Figure 9A cross-sectional view through the voice coil assembly is generally shown; in Figure 8 Specifically, as specified in the text, such as through the cross-sectional view of the voice coil assembly 2630B, and through the information provided herein regarding... Figure 9 Any description of the cross-sectional diagram applies equally to the voice coil assembly 2630A. Figure 9 The image depicts a voice coil holder frame mounting block 2648B positioned between a first air bearing 2641A and a second air bearing 2641B in a voice coil assembly 2630B. Air bearing spherical pivots 2643A and 2643B are associated with each of the first air bearings 2641A and 2641B, respectively. The air bearing spherical pivots 2643A associated with the first air bearing 2641A and 2643B associated with the first air bearing 2641B allow the respective air bearings to float in theta-X (θ-X) and theta-Y (θ-Y), thereby maintaining the first air bearings 2641A and 2641B in a parallel arrangement relative to the mounting block 2648B. In addition to being positioned between the first air bearings 2641A and 2641B, the voice coil holder frame mounting block 2648B is also secured to a voice coil retainer 2647. The voice coil retainer 2647 and the voice coil magnet base are housed inside the second side 2633 of the voice coil housing. Figure 9 The voice coil retainer 2647 is depicted as associated with the voice coil magnet base 2649. During operation, the kinetic force of the voice coil magnet base 2649 is translated to the voice coil magnet retainer 2647, which is then translated to the voice coil holder frame mounting block 2648B, and subsequently to the holder frame 2614. As discussed earlier herein, various embodiments of the holder motion control assembly 2650 may use master-slave control of two voice coil assemblies, such that the two voice coils are used synchronously to maintain the orientation of the holder assembly relative to the direction of travel. Figure 9 The image also depicts a vacuum manifold 2618 of the clamp assembly 2610, which is in flow communication with the vacuum recess 2617. (As shown...) Figure 9 Described Figure 4B The multiple vacuum slots depicted can be flow-connected to the vacuum manifold 2618 via the vacuum groove 2617.

[0099] Figure 10 Generally shown by, as Figure 8A cross-sectional view of the designated central pivot assembly 2660. The pivot assembly 2660 may include an air sleeve housing 2662 that can accommodate a first air sleeve 2664A and a second air sleeve 2664B. The first air sleeve 2664A and the second air sleeve 2664B may be constructed about a central axis 2666; the use of two air sleeves provides the necessary system rigidity. The first air sleeve 2664A and the second air sleeve 2664B may be made of a porous material (such as porous graphite) to ensure that uniform flow of gas (such as an inert gas) can be evenly distributed about the central axis 2666. The central axis 2666 may be held by an upper clamp 2665 and a lower clamp 2667 that can be fixed to a bracket assembly top plate 2624. A central pivot adapter plate 2669 may be configured to secure the air sleeve housing 2662 to a clamp frame 2614. In this regard, in response, any theta-Z (θ-Z) rotation of the air sleeve assembly 2660 generated by the movement of the bracket assembly is translated to the clamp assembly 2610. Figure 10 The image also depicts the bracket assembly air bearing 2638D (see...). Figure 4B ) and bracket assembly air bearing 2638H (see Figure 5B ).

[0100] As discussed earlier in this document, maintaining a controlled environment within the printing enclosure is paramount for the various methods associated with the manufacture of various OLED devices. As will be discussed in more detail below, environmental control of the internal volume defined by the gas enclosure assembly, according to various embodiments of the gas enclosure system of this teaching, may include: control of illumination (e.g., by the number and arrangement of lamps of specific wavelengths), control of particulate matter using various embodiments of a particle control system, control of reactive gas species using various embodiments of a gas purification system, and temperature control of the gas enclosure assembly using various embodiments of a thermal conditioning system. One aspect of thermal conditioning involves minimizing the thermal load within the enclosed printing system, for example, as given by the design of the Y-axis motion system described earlier in this document.

[0101] In addition to the Y-axis motion system, and regarding Figure 11 The schematic diagram shown illustrates that minimizing thermal load can also include minimizing the thermal load of the motor used to control the movement of the Z-axis moving plate by utilizing pneumatic balancing. Figure 11 In this circuit, control loop 100 can be used to ensure that the current-driven Z-axis motor 2305 is optimized during operation (especially under load), because increasing the current entering the Z-axis motor 2305 will increase the motor temperature. One drawback of this motor heating is a potential loss of printing accuracy due to thermal expansion of the motor and its components. Furthermore, as mentioned earlier, heat dissipation control is an aspect of environmental control in closed-loop printing systems. Therefore, Figure 11 The control loop 100 is shown as including a pneumatic balancing system 2309, which can compensate for the load on the Z-axis motor 2305 by providing an automated balancing force to resist the load, thereby minimizing motor current and thus minimizing motor heating.

[0102] exist Figure 11 In the middle, Z cmd Input 105 is for printhead components (such as, Figure 1C The command Z-axis position of the first printhead assembly 2501 and the second printhead assembly 2502. (Refer to...) Figure 1C In retrospect, the first printhead assembly 2501 and the second printhead assembly 2502 can be mounted on the first Z-axis moving plate 2310 and the second Z-axis moving plate 2312, respectively. The first Z-axis moving plate 2310 and the second Z-axis moving plate 2312 are respectively mounted to the first X-axis bracket assembly 2301 and the second X-axis bracket assembly 2302. In this respect, each printhead assembly can be positioned relative to a substrate (such as...). Figure 1C The substrate 2050 is positioned in the X and Z directions. During exemplary process steps (e.g., but not limited to, the printing process), the Z... cmd Input 105 can be controlled by motor controller C. M 110 receives, and can be used with command Z-axis position i cmd The associated current 115 is sent to the motor drive D 120, thereby enabling the Z-axis linear motor 2305 to move the Z-axis moving plate (e.g., Figure 1C The first Z-axis moving plate 2310 and the second Z-axis moving plate 2312. An encoder 2303 can be used to measure the exact position of the Z-axis moving plate in the Z-axis direction, where information about the exact Z-axis position can then be fed back to the motor controller C. M In step 110, this continues until the command position is reached. Additionally, i can be used... cmd Output 115 is sent to low-pass filter LP 130, which can be used to filter current spikes and additionally gate the controller response. The low-pass filter output 135 can be sent to the pneumatic controller C. P 140. Pneumatic controller C P 140 Then we can calculate the optimization i cmd The equilibrium pressure P of 115 CB During exemplary process steps, such as, but not limited to, mating the printhead assembly with a mating washer as previously described herein, Figure 11 As indicated, there exists a force F that resists sealing. S Required motor force F M While the additional motor force allows the seal to be maintained, it requires increased motor current, resulting in increased motor heating.

[0103] like Figure 11 Described as, in order to minimize the sealing caused by the printhead assembly abutting against the mating gasket, in order to maintain the motor force F M The motor heating generated by increasing the current can utilize the pneumatic balancing force F. CB Vertical sealing force F S The sealing force F can be detected by continuously monitoring the current of the motor 2305. The sealing force F can be reported to the pneumatic controller Cp 140. S Based on the magnitude and direction, the pneumatic controller Cp 140 can calculate the required pneumatic reaction force and can command the balancing force pressure P. CB 145 is sent to pressure regulator 150. Pressure regulator 150 can then supply the command pressure to pneumatic balancing system 2309 to apply pneumatic reaction force F. CB According to this teaching, control circuit 100 operates in a manner that ensures all forces acting on the Z-axis assembly, including the sealing force F, are controlled. S Inherent tool environment force F E pneumatic reaction force F CB Motor force F M and gravity F G The sum is 0.

[0104] Figure 12A A printing system 2000 is depicted, showing a first X-axis carriage assembly 2301 and a second X-axis carriage assembly 2302 on which the printhead assembly is not mounted. Figure 12B The image depicts a front view of the X-axis bracket assembly 2301 mounted to bridge 2130, wherein the pneumatic balancing system 2309 may include a first cylinder 2307A and a second cylinder 2307B. While an example of the use of the control loop 100 is given for the process of mating the printhead assembly with the gasket, the control loop 100 can be used for several purposes. For example, during printing operations, the pneumatic balancing system (such as pneumatic balancing system 2309) can operate in response to various embodiments of the pneumatic balancing control loop to support the Z-axis moving plate and any associated loads in order to minimize ingress during printing. Figure 11 The current of the 2305 motor. Additionally, the pneumatic balance control circuit (such as...) Figure 11 Various embodiments of the control loop 100 can be used for parameter monitoring of the printing system. For example, the sliding of the Z-axis moving plate can change over time, with increased friction due to wear and aging. Various embodiments of the pneumatic balancing control loop and associated systems can be used to counteract the increased load on the Z-axis moving plate motor caused by the increased friction. As another non-limiting example, the pneumatic controller C... PMonitored pressure changes can be used as a quality metric to initiate ad hoc maintenance of the Z-axis motion system before obvious failures occur. It should be noted that while some examples are given for specific bracket assemblies, various embodiments of the pneumatic balance control loop and associated systems are generally applicable to any bracket assembly and any load described in this teaching.

[0105] like Figure 13 As depicted, the gas envelopment 1000A can accommodate the printing system 200A. The gas envelopment assembly 500A has the features described in various embodiments of the gas envelopment system 500 of FIG. 18, while the printing system 2000A may have features for... Figure 17 All features described in the printing system 2000A. The printing system 2000A may have a printing system base 2100, which may consist of at least two sets of separators (such as, including...). Figure 13 The separator assembly 2110 of separators 2110A and 2110B is supported. The Y-axis motion system 2350 can be mounted on the printing system base 2100. The substrate 2050 can be floatingly supported by the substrate floating stage 2200. The printing system base 2100 can support a first vertical plate 2120 and a second vertical plate 2122, and a bridge 2130 can be mounted on these two vertical plates. The printing system bridge 2130 can support: a first X-axis bracket assembly 2301 on which a printhead assembly 2500 can be mounted; and a second X-axis bracket assembly 2302 on which a camera assembly 2550 can be mounted. Additionally, the gas enclosure 1000A can have an auxiliary panel assembly 1330 that can enclose the printhead management system 2701, and a waste containment system for the batch ink delivery system. The auxiliary panel assembly 1330 can flow in communication with the remaining working volume of the gas enclosure 1000A through the printhead assembly opening 1342. Various embodiments of the bulk ink delivery system may be outside the gas enclosure 1000A and flow in communication with various embodiments of the local ink delivery system, which may be close to the printhead assembly 2500 on the first X-axis carriage assembly 2301.

[0106] Figure 14 This is a schematic diagram of various embodiments of a batch ink delivery system 3300 that can be in flow communication with a local ink delivery system 3500. The batch ink delivery system (BIDS) 3300 may have a batch ink supply system 3310, which may include a first BIDS ink supply line L in flow communication with a first ink source. B1 And the second BIDS ink supply line L, which is in flow communication with the second ink source. B2 First BIDS Ink Supply Line L B1 Second BIDS ink supply line L B2Each can have a first BIDS ink supply safety valve V. B1 Second BIDS ink supply safety valve V B2 For example, when the ink supply container needs to be replaced or refilled, the first BIDS ink supply safety valve V... B1 Second BIDS ink supply safety valve V B2 It can be used to isolate the first ink supply source and the second ink supply source from the upstream pipeline. First BIDS ink supply valve V B3 The first ink supply container 1 is opened when ink 1 is used. Similarly, the second BIDS ink supply valve V... B4 Open the second ink supply container (ink 2) when using it.

[0107] although Figure 14 Two ink supply sources are indicated, but multiple ink supply containers can be included in the batch ink supply system 3310 and can act as continuous ink supply sources. For example, as Figure 14 As shown, when the ink level in the first ink supply container 1 is at the low level indicator, the first BIDS ink supply safety valve V can be closed. B1 The first BIDS ink supply valve V can be closed. B3 This allows the ink in the first ink supply container 1 to be isolated and refilled or replaced. After the ink 1 is isolated, the second BIDS ink supply safety valve V can be opened. B2 And the second BIDS ink supply valve V can be opened. B4 Thus, the second ink supply container, ink 2, can act as a gas envelopment system (such as, Figure 13 The ink supply source is a 500A gas envelopment system. The first BIDS ink supply line L... B1 Second BIDS ink supply line L B2 Two valves can be used (e.g.) Figure 14 (As shown) to connect at the T-junction, or a three-way valve can be used. First BIDS ink supply line L B1 Alternatively, one of the second BIDS ink supply lines can be connected to the third BIDS line L. B3 Flow connectivity depends on which ink supply source is in use. Third BIDS line L B3 Can be used with the first BIDS pump P B1 Flow communication, the first BIDS pump P B1 It can be a pneumatic piston injector or a metering pump compatible with the chemical process of the ink used. During processes requiring ink flow from the batch ink supply system 3310, the fifth BIDS valve V... B5 In the open position, thus allowing the third BIDS line LB3 and the fourth BIDS pipeline L B4 The flow between them. Fourth BIDS line L B4 Passing through filter 3312 and connecting to the fifth BIDS pipeline L B5 Flow connectivity, the fifth BIDS pipeline L B5 It is in flow communication with a degasser used to remove dissolved gases from the batch ink supplied from the supply source of the batch ink supply system 3310. Finally, after degassing, the ink can flow through the sixth BIDS line L, which is in flow communication with the local ink delivery system 3500. B6 Sixth BIDS pipeline L B6 It can be controlled at the outlet by a suckback valve located in the local ink delivery system 3500.

[0108] In addition to the bulk ink supply system 3310, the bulk ink delivery system 3300 may have a BIDS maintenance system 3330, which may include a solvent line and a seventh BIDS solvent line L. B7 And inert gas pipelines, the eighth BIDS gas pipeline L B8 ,exist Figure 14 The diagram depicts the use of a nitrogen source. The seventh BIDS solvent pipeline L... B7 It can have the ability to work with a second BIDS pump P B2 Flow communication, the second BIDS pump P B2 This can be a pneumatic piston injector or metering pump compatible with the chemical process of the solvent used. Seventh BIDS Solvent Line L B7 And the eighth BIDS gas pipeline L B8 Each can have a first BIDS maintenance system safety valve V. B6 Second BIDS maintenance system safety valve V B7 The first BIDS maintenance system safety valve V B6 Second BIDS maintenance system safety valve V B7 It is normally closed during processing, but may be selectively opened during, for example, but not limited to, maintenance procedures. For example, during maintenance, the BIDS valve associated with the bulk ink supply system 3310, BIDS valve V... B1 To V B5 It will remain in the closed position. If a maintenance process utilizing solvents is implemented, then the BIDS valve V can be opened. B6 V B8 、 and V B10 This results in the solvent pipeline, the seventh BIDS solvent pipeline L B7 It can be used with the sixth BIDS pipeline L B6Flow connectivity, as previously described, this sixth BIDS pipeline L B6 It is in flow communication with the local ink delivery system 3500. Additionally, if inert gas is used during maintenance, the BIDS valve V can be opened. B7 V B9 、 and V B10 This results in the inert gas line, the eighth BIDS solvent line, L B8 It can be used with the sixth BIDS pipeline L B6 Flow connectivity, as previously described, this sixth BIDS pipeline L B6 It is in flow communication with the local ink delivery system 3500. It should be mentioned that, similar to the description for the batch ink supply system 3310, the seventh BIDS solvent line L... B7 And the eighth BIDS gas pipeline L B8 Two valves can be used to engage at the T-junction (e.g.) Figure 14 (As shown), to connect with the ninth BIDS pipeline L B9 Flow connectivity. Similarly, the third BIDS line L B3 and the ninth BIDS pipeline L B9 Two valves can be used to engage at the T-junction (e.g.) Figure 14 (As shown), to connect with the fourth BIDS pipeline L B4 Flow connection. In any case, the 3-way valve can be used in a manner equivalent to a T-connection using two valves.

[0109] like Figure 14 The depicted partial ink delivery system 3500, according to various systems and methods of this teaching, may include a partial ink supply system 3600, a printhead ink delivery system 3700, and a partial ink waste assembly 3800. For various embodiments of this teaching, the partial ink supply system 3600 may be via a sixth BIDS line L B6 It is in flow communication with the bulk ink delivery system 3300, while the local ink waste assembly 3800 can be connected via the tenth BIDS line L. B10 It is in flow communication with the waste component 3340 of the bulk ink delivery system. Tenth BIDS line L B10 It can have a third BIDS pump P B3 The third BIDS pump P B3 It can be a pneumatic piston injector or metering pump that is compatible with the chemical processes that remove waste from the printhead ink delivery system 3700.

[0110] exist Figure 15The diagram shows schematic representations of various embodiments of a batch ink delivery system 3301. The batch ink delivery system 3301 can be in flow communication with a partial ink delivery system 3501. For various embodiments of the batch ink delivery system 3301, pump P... B1 It can be a metering pump capable of efficiently pumping liquid and gaseous fluids. In this regard, the maintenance system 3331 and the batch ink supply system 3311 of the batch ink delivery system 3301 can utilize the metering pump P. B1 Perform flow control. For example... Figure 15 The metering pump P is described. B1 Provides a controllable manifold system with three input lines and the possibility of using three output lines; Figure 15 Two of the lines are indicated, and all lines are controlled using metering pumps as indicated. The number of controllable input and output lines can vary depending on the various embodiments of the metering pump. Various embodiments of the metering pumps utilized in the embodiments of the batch ink delivery system of this teaching may include, for example, but not limited to, properties such as: the ability to control liquid and gaseous fluids; corrosion-resistant polymer surfaces in contact with the fluid flow to prevent corrosion and contamination; zero dead volume connections to prevent cross-contamination; minimum retention volume for rapid actuation using a minimum volume of various inks; and valves with back-suction capability. Therefore, various embodiments of the batch ink delivery system 3301 can utilize... Figure 14 Various embodiments of the 3300 batch ink delivery system have fewer valves and pumps.

[0111] Figure 15 The batch ink delivery system (BIDS) 3301 may have a batch ink delivery system 3311, which may have a first BIDS ink supply line L in flow communication with a first ink source. B1 and the second BIDS ink supply line L which is in flow communication with the second ink source B2 First BIDS Ink Supply Line L B1 Second BIDS ink supply line L B2 It can be respectively controlled by the first BIDS valve V B1 Second BIDS valve V B2 Control, such as Figure 15 As indicated, the first BIDS valve V B1 Second BIDS valve V B2 It can be a multi-port metering pump P B1 It is part of the components. In addition to providing flow control to the batch ink supply system 3311, given the metering pump P... B1 Metering pump P has the ability to controllably handle a variety of fluids with minimal retention volume. B1It can also be used for controlled maintenance of system 3331. For example, in Figure 15 In the middle, the third BIDS solvent supply line L B3 It can be connected to the solvent source in a flow path, and the fourth BIDS gas supply line L B4 It can be connected to an inert gas source flow, for example, such as Figure 15 Indicated nitrogen source. Third BIDS solvent supply line L B3 and the fourth BIDS gas supply line L B4 It can be supplied separately by the third BIDS solvent supply valve V B3 and the fourth BIDS gas supply valve V B4 Control. For example... Figure 15 The third BIDS solvent supply pipeline L is described. B3 and the fourth BIDS gas supply line L B4 It can be used with the fifth BIDS pipeline L B5 Flow connectivity, the fifth BIDS pipeline L B5 Valve V can be supplied by the fifth BIDS maintenance system. B5 Control. For example... Figure 15 As instructed, the fifth BIDS maintenance system supply valve V B5 It can be a multi-port metering pump P B1 Part of the components. The third BIDS solvent supply line L B3 and the fourth BIDS gas supply line L B4 Two valves can be used to engage at the T-junction (e.g.) Figure 15 (As shown), or a 3-way valve can be used. Third BIDS solvent supply valve V B3 and the fourth BIDS inert gas supply valve V B4 It is normally closed during processing, but can be selectively opened during maintenance procedures, as will be described in more detail later in this document.

[0112] Firstly, regarding Figure 15 Various embodiments of the system and method, for example, can be implemented by passing ink lines through metering pump P before the printing process has begun. B1 The manifold system is activated. For example, once ink supply becomes available from the first ink supply container 1, the first BIDS ink supply line L... B1 This can be achieved by opening the first BIDS ink supply valve V. B1 and BIDS waste line valve V BW All other valves remain closed, activated by ink from ink 1. For this valve positioning, the first BIDS ink supply line L can be activated. B1 The triggering, in which, in the first BIDS ink supply line L B1There is a waste pipeline L between the waste component 3341 of the bulk ink delivery system and the BIDS waste line. BW The flow connection. After activation, such as during the initiation of a printing process, the metering pump P can be turned on. B1 First BIDS ink supply valve V B1 and the sixth BIDS valve V B6 Meanwhile, all other valves are closed. With the valves in this positioned state, the first ink supply container (ink 1) is in flow communication with the batch ink delivery system 3301, which is in flow communication with the local ink delivery system 3501. The second BIDS line L... B2 It can be followed according to the L-type ink supply line for triggering the first BIDS. B1 The given example utilizes ink from ink 2 in a similar manner.

[0113] although Figure 15 Two ink supply sources are indicated, but multiple ink supply containers can be included in the batch ink supply system 3311 and can serve as continuous ink supply sources. For example, as Figure 15 As shown, when the ink level in ink 1 of the first ink supply container is at the low level indicator, the metering pump P can be turned off. B1 First BIDS ink supply valve V B1 This allows the ink 1 in the first ink supply container to be isolated and refilled or replaced. After the ink 1 is isolated, the metering pump P can be turned on. B1 The second BIDS ink supply valve V B2 Thus, the second ink supply container, ink 2, can act as a gas envelopment system (such as, Figure 13 The ink supply source for the 500A gas envelopment system. The first BIDS pipeline ink supply L B1 Or the second BIDS ink supply line L B2 One of them can be connected to the sixth BIDS pipeline L B6 Flow continuity depends on which ink supply source is in use. During processes requiring ink flow from the batch ink supply system 3311, metering pump P can be turned on. B1 First BIDS ink supply valve V B1 and the sixth BIDS valve V B6 All other valves are closed, thus allowing the first BIDS ink supply line L to be open. B1 With the sixth BIDS pipeline L B6 Flow between them. Sixth BIDS pipeline L B6 Passing through filter 3312 and connecting to the seventh BIDS pipeline L B7 Flow connection, the seventh BIDS pipeline L B7It is in flow communication with a degasser used to remove, for example, but not limited to, dissolved gases from a batch of ink supplied from a source in the batch ink supply system 3311. Finally, after degassing, the ink can flow through the eighth BIDS line L, which is in flow communication with the local ink delivery system 3501. B8 .and Figure 14 The sixth BIDS line L of the 3310 bulk ink supply system B6 Different, when metering pumps (such as, Figure 15 metering pump P B1 When this control can be provided, the eighth BIDS pipeline L B8 The back-suction valve located in the local ink delivery system 3500 is not required (e.g. Figure 14 (As shown).

[0114] As discussed earlier in this article, in addition to the batch ink supply system 3311, Figure 15 The batch ink delivery system 3301 may include a BIDS maintenance system 3331. The BIDS maintenance system 3331 may include a third BIDS solvent supply line L. B3 and the fourth BIDS gas supply line L B4 The third BIDS solvent supply line L B3 and the fourth BIDS gas supply line L B4 It can be supplied separately by the third BIDS solvent supply valve V B3 and the fourth BIDS inert gas supply valve V B4 Control. For example... Figure 15 The third BIDS solvent supply pipeline L is described. B3 and the fourth BIDS gas supply line L B4 It can be used with the fifth BIDS pipeline L B5 Flow connectivity. Fifth BIDS pipeline L B5 It can be made by metering pump P B1 The fifth BIDS maintenance system supply valve V B5 Control. Additionally, regarding... Figure 15 Batch ink delivery system 3301, BIDS waste line L BW It can be in flow communication with the waste component 3341 of the bulk ink delivery system. BIDS waste line L BW It can be made by metering pump P B1 BIDS waste line valve V BW Control. Third BIDS solvent supply valve V B3 Fourth BIDS gas supply valve V B4 Fifth BIDS maintenance system supply valve V B5 and BIDS waste line valve V BWIt is normally closed during processing, but can be selectively opened during maintenance.

[0115] For example, during maintenance, the metering pump P associated with the batch ink supply system 3311 B1 BIDS valve, BIDS valve V B1 V B2 、 and V B5 It will remain in the closed position. If a maintenance process using solvent cleaning is implemented, then the BIDS valve V can be opened. B3 V B5 、 and V BW This allows the fifth BIDS line L, which is in flow communication with the waste component 3341 of the bulk ink delivery system, to be used. B5 Solvent aspiration is performed. After aspiration, during maintenance procedures such as solvent cleaning of pipelines within the local ink delivery system 3501, the BIDS waste pipeline valve V can be closed. BW And it can open the BIDS valve V B3 V B5 、 and V B6 This allows the solvent to flow through the sixth BIDS line L. B6 The fifth BIDS pipeline L with flow communication B5 As described previously, the sixth BIDS pipeline L B6 It is in flow communication with the local ink delivery system 3500, providing solvent flow through the local ink delivery system 3501, and ultimately through the ninth BIDS line L. B9 The ink flows to the waste component 3341 of the batch ink delivery system. Additionally, if a maintenance process utilizing inert gas is implemented, the BIDS valve V can be opened. B4 V B5 、 and V B6 This allows the inert gas to flow through the sixth BIDS pipeline L. B6 The fifth BIDS pipeline L with flow communication B5 As described previously, the sixth BIDS pipeline L B6 It is in flow communication with the local ink delivery system 3500.

[0116] like Figure 15 The depicted local ink delivery system 3501, according to various systems and methods of this teaching, may include a local ink supply system 3601, a printhead ink delivery system 3701, and a local ink waste assembly 3801. For various embodiments of this teaching, the local ink supply system 3601 may be via an eighth BIDS line L B8It is in flow communication with the bulk ink delivery system 3301, while the local ink waste assembly 3801 can be connected via the ninth BIDS line L. B9 It is in flow communication with the waste component 3341 of the bulk ink delivery system. Ninth BIDS line L B9 It can have a second BIDS pump P B2 The second BIDS pump P B2 It can be a pneumatic piston injector or metering pump that is compatible with the chemical processes that remove waste from the printhead ink delivery system 3701.

[0117] Figure 16 A schematic cross-sectional view is depicted of a gas envelopment system 500A, which may include a gas envelopment system 1000A and a local ink delivery system 3500. As previously described herein, the local ink delivery system 3500, according to various embodiments of the present teachings, may include a local ink supply system 3600, a printhead ink delivery system 3700, and a local ink waste assembly 3800. Figure 16 The sixth BIDS pipeline L is depicted. E6 The back-suction valve V located in the local ink delivery system 3500 can be used. P1 Control, thereby enabling ink to be directly delivered to a bulk ink supply reservoir, which is part of a local ink supply system 3600. In this respect, various embodiments of the bulk ink delivery system of this teaching can deliver ink directly to the ink reservoir local ink supply system 3600, which can be in flow communication with the bulk ink reservoir and the distribution reservoir, which in turn is connected to, for example, multiple printhead devices (such as...). Figure 1C The printhead assembly 2505 is in flow communication with the printhead ink delivery system 3700. Various embodiments of the printhead ink delivery system 3700, as will be described in more detail herein, can utilize a two-stage ink delivery assembly. Furthermore, the local ink waste assembly within the gas enclosure can be in flow communication with the batch ink delivery system waste assembly, which is part of the batch ink delivery system. Therefore, various embodiments of the batch ink delivery system, which can be substantially outside the gas enclosure system, can avoid running ink lines to the printhead assembly (e.g., in…) via cable carriers. Figure 1C The printhead assembly 2500 on the first X-axis bracket assembly 2301 communicates with the local ink delivery system inside the gas envelopment system. Similarly, the batch replenishment system, which is essentially outside the gas envelopment, can be more easily used for services such as replenishing ink and solvent supplies, and changing pipelines carrying various inks and solvents.

[0118] Figure 17This is a schematic diagram of a partial ink delivery system including a printhead ink delivery system according to this teaching. For various embodiments of the partial ink delivery system of this teaching, a pneumatic control component IA can provide control between the main dispensing reservoir IC and various pneumatic control sources (such as gas and vacuum sources). According to various embodiments of the partial ink delivery system of this teaching, a partial ink delivery line IB may be able to provide fluid distribution and control between the main dispensing reservoir IC and the partial batch ink reservoir ID. The main dispensing reservoir IC can be in flow communication with multiple printheads IE via an input manifold line IF. Figure 17 In the schematic diagram, three printheads are indicated for each of the three printhead assembly components. The printhead assembly inlet manifold line IF can be in flow communication with the printhead assembly inlet manifold IG. The printhead assembly inlet manifold IG can be in flow communication with each of a plurality of printhead assemblies, wherein each printhead assembly can have at least three printheads. Figure 17 The printheads are numbered sequentially from printhead 1 to printhead 9. This can be achieved by using the printhead assembly manifold valve IG. V1 IG V2 and IG V3 This controls the flow between the printhead assembly inlet manifold IG and the individual printhead units. Finally, multiple printhead assemblies can be in flow communication with the printhead assembly output waste line, which is part of the printhead output manifold IH. The printhead assembly output waste line can be in flow communication with a local ink waste assembly, which in turn is in flow communication with the batch ink delivery system waste assembly (see, for example, ...). Figure 14 and Figure 15 ) Flow connectivity. This can be achieved by using the printhead assembly manifold line valve IH. V1 IH V2 and IH V3 This controls the flow communication between the printhead assembly output manifold IH and each printhead unit.

[0119] Figure 18A It is installed in the printhead assembly positioning system (such as the first X-axis carriage assembly 2301 (see also)). Figure 1C A bottom unfolded perspective view of the printhead assembly 2500 on the substrate. The first X-axis bracket assembly 2301 can be positioned relative to the substrate (such as, ...) in the X-axis direction. Figure 1C The substrate 2050 is positioned on the printing system bridge 2130. For example... Figure 18AAs shown, a service bundle housing 2410 is mounted to a printing system bridge 2130. The service bundle housing 2410 may contain various service bundles operatively connected from various devices and systems to a gas-enclosed system including the printing system. Various embodiments of the service bundles may include bundled optical fibers, cables, wires, and conduits for providing optical, electrical, mechanical, and fluid functions to various components and systems disposed within the gas-enclosed system. During various processing steps, such as printing and maintenance steps, the various service bundles move accordingly as the X-axis carriage assembly 2301 moves across the printing system bridge 2130 to move the printhead assembly 2500. Consequently, the liquid ink lines within such service bundles are subjected to continuous flexing and abrasion. According to the systems and methods of this teaching, a bulk ink delivery system outside the gas-enclosed system can be in fluid communication with a local ink delivery supply system inside the gas-enclosed system, eliminating the need to operate ink lines via service bundles located in the service bundle housing 2410. Similarly, a bulk replenishment system substantially outside the gas enclosure can be more readily used for servicing, such as replenishing ink and solvent supplies, and servicing or replacing various lines and valves.

[0120] like Figure 18A As depicted, the printhead assembly 2500 may have a printhead assembly enclosure 2503 that can enclose a plurality of printhead devices 2505A, 2505B, and 2505C mounted therein. (For...) Figure 1C Printing system 2000 or Figure 13 and Figure 16 Various embodiments of the 2000A printing system may include a printhead assembly comprising between approximately one and approximately 60 printhead assemblies, wherein each printhead assembly may have between approximately one and approximately 30 printheads. For example... Figure 18A As depicted, according to the system and method of this teaching, the printhead assembly 2500 may have three printhead devices, wherein each printhead device may have three printheads (see also...). Figure 17 As will be discussed in more detail herein, given the number of printhead units and printheads requiring constant maintenance, the printhead assembly 2500 can be positioned above the maintenance system for the preparation, arrangement, or replacement of the printhead units or printheads.

[0121] like Figure 18B As shown in the bottom perspective view, the printhead assembly 2500 may have printhead devices 2505A, 2505B, and 2505C mounted using a motion mount, for example, Figure 13 The description of the motion mounting of the printhead assembly 2500 is similar. In this respect, as will be discussed in more detail later herein, it is possible to utilize the methods for mounting printhead devices (such as...) Figure 18BEmbodiments of printhead assemblies 2505A, 2505B, and 2505C are vertically mounted to printhead assembly components (such as...). Figure 18B Various embodiments of the motion mounting components in the printhead assembly 2500, such as boat-shaped ball and V-shaped block assemblies. Figure 18B In China, targeting Figure 18B The various printhead assemblies 2505A, 2505B, and 2505C depict a boat-shaped sphere 1118A.

[0122] Additionally, camera assembly 2551 is shown mounted within printhead assembly enclosure 2503. In various embodiments of the systems and methods of this teaching, multiple cameras can be mounted on various devices, equipment, and components to provide illumination in gas enclosure systems (such as...). Figure 13 Real-time visualization of operations within a 500A gas envelopment system. For example, it can utilize... Figure 13 Camera component 2550 and Figure 18B The camera assembly 2551, for example, but not limited to, navigation and inspection. Various embodiments of the printing system camera assembly can have different specifications regarding field of view and resolution. For example, one camera can be a line scan camera for in-situ particle inspection, while a second camera can be used for general navigation of a substrate in a gas-enclosed system, or for positioning the printhead assembly relative to the substrate. Such a camera useful for general navigation can be an area scan camera with a field of view ranging from approximately 5.4 mm x 4 mm at approximately 0.9X magnification to approximately 10.6 mm x 8 mm at approximately 0.45X magnification. In another practical example, one camera can be a line scan camera for in-situ particle inspection, while a second camera can be used for precise navigation of a substrate in a gas-enclosed system, for example, for substrate alignment, or for precise positioning of the printhead assembly relative to the substrate. Such a camera useful for precise navigation can be an area scan camera with a field of view of approximately 0.7 mm x 0.5 mm at approximately 7.2X magnification.

[0123] Figure 19A and Figure 19BVarious perspective views of a printhead assembly 2505 according to various embodiments of the printhead assembly of the present teachings are depicted. As previously described herein, the motion mounting of the printhead unit to the printing system can provide repeatable, strain-free positioning for various embodiments of the printhead unit and printhead assembly of the present teachings. For example, the motion mounting assembly described for the motion mounting of printhead assembly 2500 can utilize point contact motion assemblies, such as ball and V-block motion mounting assemblies. Various embodiments of the motion mounting assembly for vertically mounting multiple printhead units into a printhead assembly can utilize line contact motion assemblies, such as, but not limited to, boat-shaped ball and V-block motion mounting assemblies. Various embodiments of the line contact motion mounting assembly can carry substantially larger loads than equivalent motion mounting assemblies providing point contact, for example, at least 100 times the load. Various embodiments of the motion mounting assembly provide significant stability for repeatable, strain-free positioning of the printhead units vertically mounted into the printhead assembly, and stability during X-axis movement of the printhead assembly by naturally resisting movement in the X-axis direction.

[0124] exist Figure 19A Top-down perspective and Figure 19B In the bottom perspective view, the first boat-shaped ball mounting and fixing device 1116A of the first boat-shaped ball 1118A and the second boat-shaped ball mounting and fixing device 1116B of the second boat-shaped ball 1118B can be seen. The third boat-shaped ball mounting and fixing device 1116C is... Figure 19A and Figure 19B It is evident that the third boat-shaped ball can be mounted on the back of the printhead assembly 2505. The positions of a set of boat-shaped balls 1118A, 1118B, and 1118C, once engaged in the mating surfaces of the V-block mount, can be used to connect the printhead assembly 2505 to the printhead assembly assembly (such as...). Figure 18A and Figure 18B Repeatable and strain-free vertical bottom insertion in the printhead assembly 2500. Figure 19B As shown, each printhead assembly can have three end-user selectable printhead assemblies 200A, 200B, and 200C. Printhead assembly 2505 can have a first quick-connect connector 1110A providing ease of connection to fluid lines entering printhead assembly 2505, and a second quick-connect connector 1110B providing ease of connection to fluid lines originating from printhead assembly 2505. As... Figure 17 The schematic illustration of the fluid systems for various embodiments of the local ink delivery system in the printhead assembly shows that the flow communication of the local ink delivery system for each printhead assembly in the printhead assembly can be achieved by using the printhead assembly manifold valve IG. V1 IG V2 and IG V3 To control. Similarly, Figure 17 As shown, the flow communication from each printhead assembly in the printhead assembly to the printhead output manifold can be achieved using the printhead assembly manifold valve IH. V1 IH V2 and IH V3 To control the printhead assembly manifold valve IH V1 IH V2 and IH V3 It can be Figure 17 It is part of the printhead output manifold IH. Various embodiments of the printhead output manifold can be combined with local ink waste components (such as, for example, Figure 16 The local ink waste component 3800) is in flow communication. Figure 19A and Figure 19B The input manifold valve IG for the printhead assembly is shown in the diagram for the printhead assembly 2505. V and output printhead assembly manifold valve IH V .

[0125] Figure 19C A printhead assembly motion mounting plate 1340 is depicted having a first V-block 1348A, a second V-block 1348B, and a third V-block 1348C, wherein the first V-block 1348A, the second V-block 1348B, and the third V-block 1348C are respectively... Figure 19A and Figure 19B The mating surfaces of the first boat-shaped ball 1118A, the second boat-shaped ball 1118B, and the third boat-shaped ball 1118C. The first V-block 1348A, the second V-block 1348B, and the third V-block 1348C can be respectively fixed to the printhead assembly moving mounting plate 1340 using the first V-block mounting and fixing device 1342A, the second V-block mounting and fixing device 1342B, and the third V-block mounting and fixing device 1342C. For example... Figures 19A to 19C As depicted, the first V-shaped block 1348A is the mating surface of the first boat-shaped ball 1118A, the second V-shaped block 1348B is the mating surface of the second boat-shaped ball 1118B, and the third V-shaped block 1348C is the mating surface of the third boat-shaped ball 1118C. Figure 19D A printhead assembly unit 1300 is depicted, wherein the printhead assembly 2505 is mounted on a printhead assembly motion mounting plate 1340 using a boat-shaped ball and a V-shaped block motion mount. For example, in Figure 19D In, such as Figure 19BThe first boat-shaped ball 1118A shown is mounted to the first boat-shaped ball mounting device 1116A and engages in the first V-block 1348A, which is mounted on the first V-block mounting device 1342A. As described earlier herein, the first V-block mounting device 1342A is one of three V-shaped mounting devices mounted to the printhead assembly motion mounting plate 1340. In this respect, for Figure 19D The connection of the first boat-shaped ball 1118A to the first V-block 1348A in the printhead assembly unit 1300 is an example of the connection of the second boat-shaped ball 1118B and the third boat-shaped ball 1118C to the second V-block 1348B and the third V-block 1348C, respectively. Besides the printhead assembly motion mounting plate 1340, other components for the printhead assembly unit (such as...) Figure 19D Various embodiments of the mounting assembly for the printhead assembly unit 1300 may include a front mounting plate 1341 for the printhead assembly, a first printhead-side mounting plate 1343A, and a second printhead-side mounting plate 1343B. For example... Figure 19A and Figure 19B The quick-connect connectors shown can be mounted to the printhead assembly side mounting plate, such as... Figure 19D The first quick-connect connector 1110A is depicted for mounting to the first printhead assembly side mounting plate 1343A.

[0126] According to the various systems and methods described in this teaching, printhead devices (such as, Figure 18A and Figure 18B The printhead assemblies 2505A, 2505B, and 2505C can be inserted manually or automatically from the bottom of the printhead assembly 2500. For example, as Figure 1D As described, printhead installation or replacement can be performed using a robot. (See previous references in this article.) Figure 13 The gas enclosure discussed (e.g., gas enclosure 1000A) may have an auxiliary panel assembly 1330 that can enclose the printhead management system 2701. Figure 1D In this process, the installation and replacement of the printhead assembly or printhead can be performed using the robot 2530 in the auxiliary panel assembly 1330. Figure 1D The printhead management system 2701's printhead replacement module 2713 may include a docking station for a printhead assembly having at least one printhead, and a storage container for multiple printhead assemblies and multiple printheads. Each printhead assembly of this teaching may include between approximately one and approximately 60 printhead assemblies, and each printhead assembly may have between approximately one and approximately 30 printheads (e.g., but not limited to, see [reference]). Figure 1D and Figure 18AThe printhead assembly 2500). Therefore, various embodiments of the printing system of this teaching can have between approximately one and approximately 1800 printheads, in addition to having between approximately one and approximately 60 printhead assemblies. As discussed earlier herein, printhead assemblies (such as, Figure 19A and Figure 19B The printhead assembly 2505 can be accessed via printhead components (such as, Figure 18B The printhead assembly (2500) is installed or replaced by inserting the strain-free bottom of the printhead unit. Figure 1D The image shows a bottom view of the printhead assembly.

[0127] Figure 20 This is a schematic diagram illustrating a gas envelopment system 500B. Various embodiments of the gas envelopment system 500B according to this teaching may include a gas envelopment assembly 1000B for housing a printing system, a gas purification circuit 3130 in flow communication with the gas envelopment assembly 1000B, and at least one thermal conditioning system 3140. Additionally, various embodiments of the gas envelopment system 500B may have a pressurized inert gas recirculation system 3000 that supplies inert gas for operating various devices, such as a substrate floating stage for an OLED printing system. As will be discussed in more detail below, various embodiments of the pressurized inert gas recirculation system 3000 may utilize a compressor, a blower, or a combination of both as the source for the pressurized inert gas recirculation system 3000. Furthermore, the gas envelopment system 500B may have a circulation and filtration system (not shown) within the gas envelopment system 500B.

[0128] like Figure 20 Depicted for various embodiments of the gas envelopment assembly according to this teaching, the filtration system is designed to separate the inert gas circulating through the gas purification circuit 3130 from the inert gas continuously circulated and filtered internally for various embodiments of the gas envelopment assembly. The gas purification circuit 3130 includes an outlet line 3131 from the gas envelopment assembly 500B to the solvent removal component 3132 and then to the gas purification system 3134. The inert gas, purified to remove solvent and other reactive gaseous species (such as oxygen and water vapor), is then returned to the gas envelopment assembly 1000B through the inlet line 3133. The gas purification circuit 3130 may also include suitable piping and connections, and sensors, such as oxygen, water vapor, and solvent vapor sensors. Gas circulation units (such as fans, blowers, or motors, etc.) may be provided separately or integrated, for example, in the gas purification system 3134, to allow gas circulation through the gas purification circuit 3130. According to various embodiments of the gas envelopment assembly, although the solvent removal system 3132 and the gas purification system 3134 are in... Figure 20The schematic diagram shows them as separate units, but the solvent removal system 3132 and the gas purification system 3134 can be housed together as a single purification unit.

[0129] Figure 20 The gas purification circuit 3130 may have a solvent removal system 3132 located upstream of the gas envelopment purification system 3134, such that the inert gas circulating from the gas envelopment assembly 100B passes through the solvent removal system 3132 via the outlet line 3131. According to various embodiments, the solvent removal system 3132 may be based on the solvent removal system 3132, whereby the inert gas circulating from the gas envelopment assembly 100B passes through the outlet line 3131. Figure 20 The solvent removal system 3132 is a solvent trapping system that uses an inert gas to absorb solvent vapors. One or more beds of adsorbent (e.g., but not limited to, activated carbon, molecular sieves, etc.) can effectively remove various organic solvent vapors. For various embodiments of the gas envelopment system, cold trapping techniques can be employed to remove solvent vapors in the solvent removal system 3132. As discussed earlier herein, for various embodiments of the gas envelopment system according to the teachings, sensors (such as oxygen, water vapor, and solvent vapor sensors) can be used to monitor the vapors as they continuously circulate through the gas envelopment system (such as... Figure 20 Effective removal of inert gases (using a gas envelopment system 500B). Various embodiments of the solvent removal system can indicate when an adsorbent (such as activated carbon, molecular sieves, etc.) reaches its capacity, allowing one or more beds of adsorbent to be regenerated or replaced. Molecular sieve regeneration can involve heating the molecular sieve, contacting the molecular sieve with a forming gas, or a combination thereof. Molecular sieves configured to trap various species (including oxygen, water vapor, and solvents) can be regenerated by heating and exposing them to a forming gas comprising hydrogen (e.g., a forming gas comprising approximately 96% nitrogen and 4% hydrogen, wherein the percentages are by volume or by weight). Activated carbon can be physically regenerated using a similar process of heating in an inert environment.

[0130] Any suitable gas purification system can be used Figure 20Gas purification system 3134 of gas purification loop 3130. Gas purification systems available from MBRAUN Inc., of Statham, New Hampshire or Innovative Technology of Amesbury, Massachusetts can be useful for integration into various embodiments of the gas enclosure assembly according to the teachings herein. Gas purification system 3134 can be used to purify one or more inert gases in gas enclosure system 500B, for example, to purify the entire gas environment within the gas enclosure assembly. As discussed earlier herein, gas purification system 3134 may have gas circulation units, such as fans, blowers, or motors, to circulate gas through gas purification loop 3130. In this respect, the gas purification system can be selected according to the volume of the enclosure, which can define the volumetric flow rate for moving the inert gas through the gas purification system. For volumes up to approximately 4 m³, 3 Various embodiments of the gas envelopment system of the gas envelopment component; capable of being moved approximately 84m 3 A gas purification system with a capacity of approximately 10 m³ / h. 3 Various embodiments of the gas envelopment system of the gas envelopment component; capable of being moved approximately 155m 3 A gas purification system with a capacity of approximately 52 to 114 m³ / h. 3 Various embodiments of the gas surrounding components may be used, and more than one gas purification system may be employed.

[0131] Any suitable gas filtration or purification device may be included in the gas purification system 3134 of this teaching. In some embodiments, the gas purification system may include two parallel purification devices, such that one device can be removed from the pipeline for maintenance, while the other device can be used to continue system operation without interruption. In some embodiments, for example, the gas purification system may include one or more molecular sieves. In some embodiments, the gas purification system may include at least a first molecular sieve and a second molecular sieve, such that when one of the molecular sieves becomes saturated with impurities, or is otherwise deemed insufficient for effective operation, the system may switch to another molecular sieve while regenerating that saturated or ineffective molecular sieve. A control unit may be provided to determine the operating efficiency of each molecular sieve, to switch between the operation of different molecular sieves, to regenerate one or more molecular sieves, or combinations thereof. As discussed earlier herein, molecular sieves may be regenerated or reused.

[0132] Figure 20The thermal control system 3140 may include at least one cooler 3142, which may have a fluid outlet line 3141 for circulating coolant into the gas enclosure assembly and a fluid inlet line 3143 for returning coolant to the cooler. At least one fluid cooler 3142 may be provided to cool the gas environment within the gas enclosure system 500B. For various embodiments of the gas enclosure system of this teaching, the fluid cooler 3142 delivers cooling fluid to a heat exchanger within the enclosure, wherein an inert gas is passed over a filtration system within the enclosure. At least one fluid cooler may also be provided to the gas enclosure system 500B to cool heat released by equipment enclosed within the gas enclosure system 500B. For example, but not limited to, at least one fluid cooler may also be provided to the gas enclosure system 500B to cool heat generated by an OLED printing system. The thermal control system 3140 may include a heat exchanger or Peltier device and may have various cooling capacities. For example, for various embodiments of the gas enclosure system, the cooler may provide a cooling capacity between approximately 2 kW and approximately 20 kW. Various embodiments of the gas-enclosed system may have multiple fluid coolers capable of cooling one or more fluids. In some embodiments, the fluid coolers may utilize several fluids as coolants, such as, but not limited to, water, antifreeze, refrigerant, and combinations thereof as heat exchange fluids. Suitable leak-free, lockable connections may be used to connect associated piping and system components.

[0133] As discussed earlier herein, this teaching discloses various embodiments of a gas encapsulation system that may include a printing system enclosure defining a first volume and an auxiliary enclosure defining a second volume. Various embodiments of the gas encapsulation system may have an auxiliary enclosure that can be hermetically constructed as part of the gas encapsulation assembly. According to the systems and methods of this teaching, the auxiliary enclosure may be hermetically isolated from the printing system enclosure and may be open to the environment outside the gas encapsulation assembly without exposing the printing system enclosure to the external environment. This physical isolation of the auxiliary enclosure for performing, for example, but not limited to, various printhead management processes, can be performed to eliminate or minimize the printing system enclosure's exposure to contaminants such as air and water vapor and various organic solvents, as well as particulate contamination. Various printhead management processes, which may include measurement and maintenance processes related to the printhead assembly, can be performed with little or no interruption to the printing process, thereby minimizing or eliminating gas encapsulation system downtime.

[0134] For a gas envelopment system having a printing system enclosure defining a first volume and an auxiliary enclosure defining a second volume, these two volumes can be readily integrated with gas circulation, filtration, and purification components to form a gas envelopment system that can maintain an inert, substantially low-particulate environment for processes requiring such an environment with little or no interruption to the printing process. According to various systems and methods of this teaching, the printing system enclosure can incorporate a purification system that can remove sufficiently low levels of contamination before it can affect the printing process. Various embodiments of the auxiliary enclosure can be substantially smaller in volume than the overall volume of the gas envelopment assembly and can be readily integrated with gas circulation, filtration, and purification components to form an auxiliary enclosure system that can rapidly recover an inert, low-particulate environment after exposure to the external environment, thereby providing an auxiliary enclosure system with little or no interruption to the printing process.

[0135] Furthermore, various embodiments of the auxiliary enclosure can be integrated with a set of dedicated environmental control system components (such as lighting, gas circulation and filtration, gas purification, and temperature control components). In this regard, various embodiments of a gas enclosure system including an auxiliary enclosure that can be hermetically isolated as a gas enclosure assembly can have a controlled environment configured to be the same as the first volume defined by the gas enclosure assembly of the printing system. Further, various embodiments of a gas enclosure system including an auxiliary enclosure that can be hermetically isolated as a gas enclosure assembly can have a controlled environment configured to be different from the controlled environment of the first volume defined by the gas enclosure assembly of the printing system.

[0136] While the examples above mention cooling capacity and cooling applications, these examples can also be applied to applications including buffering of substrates in controlled environments, or applications where circulating gas can be maintained at a temperature similar to the rest of the system to avoid unwanted heat transfer from the substrate being manufactured or to avoid disruption of temperature uniformity across or between substrates.

[0137] Figure 21A and 21B An example of a gas envelopment system for integrating and controlling a source of nonreactive gas and clean dry air (CDA), such as that which can be used to establish a controlled environment as mentioned in other examples described elsewhere in this document, and such as that which can include a supply of pressurized gas for use with a floating platform. Figure 22A and 22BAn example of a gas envelopment system for integrating and controlling a source of nonreactive gas and clean dry air (CDA), such as that which can be used to establish a controlled environment as mentioned in other examples described elsewhere herein, and such as that which can include a blower circuit to provide, for example, pressurized gas and at least a partial vacuum for use with a floating stage. Figure 22C This section presents another example of a system for integrating and controlling one or more gas or air sources to establish a floating control zone as part of a floating delivery system.

[0138] The various examples described herein include environmentally controlled enclosed modules. The enclosing assembly and corresponding support devices may be referred to as a "gas enclosing system," and such an enclosing assembly may be constructed in a contoured manner that reduces or minimizes the internal volume of the gas enclosing assembly while simultaneously providing working volume for accommodating various affected areas of printing system components, such as the deposition (e.g., printing), holding, loading, or processing modules described herein. For example, for various examples of gas enclosing assemblies of this teaching covering, for example, substrate sizes from Gen 3.5 to Gen 10, the contoured gas enclosing assembly according to this teaching may have approximately 6m². 3 To approximately 95m 3 The gas surrounding volume between. Various examples of the outlined gas surrounding components according to this teaching may have, for example, but not limited to, approximately 15 m. 3 up to about 30m 3 The gas envelopment volume between these dimensions can be useful for printing, for example, but not limited to, Gen 5.5 to Gen 8.5 substrate sizes or other substrate sizes. Various examples of auxiliary envelopment can be constructed as segments of gas envelopment components and easily integrated with gas circulation and filtration and purification components to form a gas envelopment system that can maintain a controlled, substantially low-particulate environment for processes requiring such an environment.

[0139] like Figure 21A and 22AAs shown, various examples of gas containment systems can include pressurized nonreactive gas recirculation systems. Various examples of pressurized gas recirculation loops can utilize compressors, blowers, and combinations thereof. Based on this teaching, several engineering challenges are presented to provide various examples of pressurized gas recirculation systems within gas containment systems. First, in typical operation of a gas containment system without a pressurized nonreactive gas recirculation system, the gas containment system can be maintained at a slightly positive internal pressure (e.g., above atmospheric pressure) relative to the external pressure to prevent the entry of external gas or air into the containment system in the event of any leakage. For example, under typical operation, for various examples of gas containment systems according to this teaching, the interior of the gas containment system can be maintained relative to the surrounding environment outside the containment system at, for example, a pressure of at least 2 mbargs, for example, at least 4 mbargs, at least 6 mbargs, at least 8 mbargs, or at a higher pressure.

[0140] Maintaining a pressurized gas recirculation system within a gas enclosed system can be challenging because it presents a dynamic and continuous balancing action involving the constant introduction of pressurized gas into the system while maintaining a slight positive internal pressure. Furthermore, the variable demands of various devices and equipment can create irregular pressure distributions for the various gas enclosed components and systems used in this teaching. Maintaining a dynamic pressure balance of the gas enclosed system at a slight positive pressure relative to the external environment under such conditions can provide the integrity of a continuous manufacturing process. For various examples of gas enclosed systems, a pressurized gas recirculation system according to this teaching may include various examples of a pressurized gas circuit that can utilize at least one of a compressor, accumulator, blower, or combinations thereof. Various examples of pressurized gas recirculation systems including various examples of pressurized gas circuits may have a specially designed pressure control bypass circuit that can provide the internal pressure of the non-reactive gas in the gas enclosed system of this teaching at a stable, defined value. In various examples of gas enclosed systems, the pressurized gas recirculation system may be configured to recirculate the pressurized gas via the pressure control bypass circuit when the gas pressure in the accumulator of the pressurized gas circuit exceeds a preset threshold pressure. The threshold pressure can be, for example, in the range of approximately 25 psig to approximately 200 psig, or more specifically, in the range of approximately 75 psig to approximately 125 psig, or more specifically, in the range of approximately 90 psig to approximately 95 psig. In this regard, the gas enclosed system of this teaching, having various examples of pressurized gas recirculation systems with specially designed pressure control bypass loops, can maintain equilibrium within a sealed gas enclosed system with pressurized gas recirculation. According to this teaching, various devices and apparatuses can be disposed within the gas enclosed system and flow in communication with various examples of pressurized gas recirculation systems. The use of various pneumatic operating devices and apparatuses for various examples of gas enclosed systems and systems of this teaching can provide low particulate generation performance and low maintenance. Exemplary devices and apparatuses that can be disposed within the gas enclosed system and flow in communication with various pressurized gas loops can include, for example, but not limited to, one or more pneumatic robots, substrate floating stages, air bearings, air sleeves, compressed gas tools, pneumatic actuators, and combinations thereof. The substrate floating stage and air bearings can be used in various aspects of printing systems that operate the gas-enclosed system according to this teaching. For example, a substrate floating stage utilizing air bearing technology can be used to transport the substrate to a position within the printhead chamber and to support the substrate during the printing process.

[0141] For example, such as Figure 21A , 21BAs shown in 22A and 22B, various examples of gas enclosure systems 500C and 500D may have an external gas loop 3200 for integrating and controlling the non-reactive gas source 3201 and the clean dry air (CDA) source 3203 used in various aspects of the operation of gas enclosure systems 500C and 500D. As previously described, gas enclosure systems 500C and 500D may also include various examples of internal particulate filtration and gas recirculation systems, as well as various examples of external gas purification systems. Such examples of gas enclosure systems may include gas purification systems for purifying various reactive species from gases. Some common, non-limiting examples of non-reactive gases may include nitrogen, any rare gases, and any combination thereof. Various examples of gas purification systems according to this teaching can maintain the levels of various reactive species (including various reactive atmospheric gases, such as water vapor, oxygen, ozone, and organic solvent vapors) at 1000 ppm or lower, for example, 100 ppm or lower, 10 ppm or lower, or 1.0 ppm or lower, or at 0.1 ppm or lower. In addition to the external loop 3200 for integrating and controlling gas source 3201 and CDA source 3203, gas enclosure systems 500C and 500D may have a compressor loop 3250 that supplies gas to operate various devices and equipment that may be disposed within gas enclosure systems 500C and 500D. A vacuum system 3270 may also be provided, for example, connected to gas enclosure assembly 1005 via line 3272 when valve 3274 is in the open position.

[0142] Figure 21AThe compressor circuit 3250 may include a compressor 3262 configured for flow communication, a first accumulator 3264, and a second accumulator 3268. The compressor 3262 may be configured to compress gas drawn from the gas enclosure assembly 1005 to a desired pressure. The inlet side of the compressor circuit 3250 may be in flow communication with the gas enclosure assembly 1005 via the gas enclosure assembly outlet 3252, through a line 3254 having a valve 3256 and a check valve 3258. The compressor circuit 3250 may be in flow communication with the gas enclosure assembly 1005 on the outlet side via an external gas circuit 3200. The accumulator 3264 may be disposed between the compressor 3262 and the connection between the compressor circuit 3250 and the external gas circuit 3200, and may be configured to generate a pressure of 5 psig or higher. The second accumulator 3268 may be located within the compressor circuit 3250 to provide damping fluctuations due to the compressor piston cycle of approximately 60 Hz. For various examples of compressor circuit 3250, the first accumulator 3264 may have a capacity between approximately 80 gallons and approximately 160 gallons, while the second accumulator may have a capacity between approximately 30 gallons and approximately 60 gallons. According to various examples of gas envelopment system 500C, compressor 3262 may be a zero-ingress compressor. Various types of zero-ingress compressors can operate without allowing atmospheric gases to leak into various examples of the gas envelopment system of this teaching. Various examples of zero-ingress compressors may, for example, be continuously operated during manufacturing by utilizing various devices and equipment that require compressed gases.

[0143] Accumulator 3264 can be configured to receive and accumulate compressed gas from compressor 3262. Accumulator 3264 can supply compressed gas into gas enclosure assembly 1005 as needed. For example, accumulator 3264 can provide gas to maintain the pressure of various components of gas enclosure assembly 1005 (such as, but not limited to, pneumatic robots, substrate floating stages, air bearings, air sleeves, compressed gas tools, pneumatic actuators, and combinations thereof). Figure 21A As shown in the gas envelopment system 500C, the gas envelopment assembly 1005 may have a printing system 2005 enclosed therein. For example... Figure 21ASchematably depicted, the printing system 2005 may be supported by a printing system base 2150, which may be a granite stage. The printing system base 2150 may support a substrate support device, such as a suction cup, for example, but not limited to, a vacuum suction cup, a substrate floating suction cup with a pressure port, and a substrate floating suction cup with both vacuum and pressure ports. In various examples of this teaching, the substrate support device may be a substrate floating stage, such as a substrate floating stage 2250. The substrate floating stage 2250 may be used for frictionless support of the substrate. In addition to a low-particle-generation floating stage, for frictionless Y-axis transport of the substrate, the printing system 2005 may have a Y-axis motion system utilizing an air sleeve.

[0144] Additionally, the printing system 2005 may have at least one X, Z-axis carriage assembly with motion control provided by a low-particle-generation X-axis air bearing assembly. Various components of the low-particle-generation motion system (such as the X-axis air bearing assembly) can be used instead, for example, various particle-generation linear mechanical bearing systems. Various pneumatic operating devices and apparatuses can provide low-particle-generation performance and low maintenance, according to various examples of the gas enclosure and systems of this teaching. The compressor circuit 3250 can be configured with various devices and apparatuses to continuously supply pressurized gas to the gas enclosure system 500C. In addition to the supply of pressurized gas, the substrate floating stage 2250 of the printing system 2005 utilizing air bearing technology also utilizes a vacuum system 3270, which is connected to the gas enclosure assembly 1005 via a line 3272 when the valve 3274 is in the open position.

[0145] The pressurized gas recirculation system according to this teaching can have the following characteristics: Figure 21AA pressure control bypass circuit 3260 is shown for compressor circuit 3250. This pressure control bypass circuit 3260 is used to compensate for variable demand of pressurized gas during operation, thereby providing dynamic balance for various examples of gas containment systems according to this teaching. For various examples of gas containment systems according to this teaching, the bypass circuit can maintain a constant pressure in accumulator 3264 without disturbing or changing the pressure in containment 1005. Bypass circuit 3260 may have a first bypass inlet valve 3261 on the inlet side of the bypass circuit, which is closed unless bypass circuit 3260 is used. Bypass circuit 3260 may also have a back pressure regulator 3266, which can be used when second valve 3263 is closed. Bypass circuit 3260 may have a second accumulator 3268 disposed on the outlet side of bypass circuit 3260. For the example of compressor circuit 3250 utilizing zero-entry compressor, bypass circuit 3260 can compensate for small pressure shifts that may occur over time during the use of the gas enclosed system. Bypass circuit 3260 is in flow communication with compressor circuit 3250 on the inlet side of bypass circuit 3260 when bypass inlet valve 3261 is in the open position. When bypass inlet valve 3261 is open, if gas from bypass circuit 3250 is not needed within the gas enclosed assembly 1005, the gas diverted through bypass circuit 3260 can be recirculated to the compressor. Compressor circuit 3250 is configured to divert gas through bypass circuit 3260 when the pressure of the gas in accumulator 3264 exceeds a preset threshold pressure. The preset threshold pressure of the accumulator 3264 can be between approximately 25 psig and approximately 200 psig at a flow rate of at least approximately 1 cubic foot per minute (cfm), or between approximately 50 psig and approximately 150 psig at a flow rate of at least approximately 1 cubic foot per minute (cfm), or between approximately 75 psig and approximately 125 psig at a flow rate of at least approximately 1 cubic foot per minute (cfm), or between approximately 90 psig and approximately 95 psig at a flow rate of at least approximately 1 cubic foot per minute (cfm).

[0146] Various examples of compressor circuit 3250 may utilize compressors other than zero-entry compressors, such as variable-speed compressors or compressors with controllable on / off states. As discussed earlier herein, a zero-entry compressor ensures that atmospheric reactive species are not introduced into the gas enclosure system. Similarly, any compressor configuration that prevents the introduction of atmospheric reactive species into the gas enclosure system may be used in compressor circuit 3250. According to various examples, compressor 3262 of gas enclosure system 500C may be housed in, for example, but not limited to, a hermetically sealed housing. The interior of the housing may be configured to flow in communication with a gas source (e.g., the same gas forming the gas environment for gas enclosure assembly 1005). For various examples of compressor circuit 3250, compressor 3262 may be controlled at a constant speed to maintain a constant pressure. In other examples of compressor circuit 3250 that do not utilize a zero-entry compressor, compressor 3262 may be shut off when a maximum threshold pressure is reached and turned on when a minimum threshold pressure is reached.

[0147] For the 500D gas enclosure system Figure 22A In the diagram, the operation of the substrate floating stage 2250 of the printing system 2005 is illustrated by a blower circuit 3280 utilizing a vacuum blower 3290, both of which are housed within a gas envelopment assembly 1005. As discussed earlier herein with respect to the compressor circuit 3250, the blower circuit 3280 can be configured to continuously supply pressurized gas to the substrate floating stage 2250 of the printing system 2005.

[0148] Various examples of gas enclosed systems that can utilize pressurized gas recirculation systems can have various loops utilizing various pressurized gas sources, such as compressors, blowers, and combinations thereof, at least one of these. In the case of a gas enclosed system 500D... Figure 22A In this configuration, the compressor circuit 3250 can be in flow communication with the external gas circuit 3200, which can be used for gas supply to both the high-consumption manifold 3225 and the low-consumption manifold 3215. For example... Figure 22A Various examples of gas envelopment systems according to the present teachings are shown for gas envelopment system 500D. High-consumption manifold 3225 can be used to supply gas to various devices and apparatuses, such as, but not limited to, a floating platform, a pneumatic robot, an air bearing, an air sleeve, and compressed gas tools, and combinations thereof. For various embodiments of the gas envelopment system according to the present teachings, low-consumption manifold 3215 can be used to supply gas to various devices and apparatuses, such as, but not limited to, isolators and pneumatic actuators, and combinations thereof.

[0149] against Figure 22A and 22BVarious examples of the gas envelopment system 500D include a blower circuit 3280 that can be used to supply pressurized gas to the substrate floating stage 2250. In addition to the pressurized gas supply, the substrate floating stage 2250 of the printing system 2005 utilizing air bearing technology also utilizes a vacuum blower 3290, which is connected to the gas envelopment assembly 1005 via a line 3292 when the valve 3294 is in the open position. The housing 3282 of the blower circuit 3280 can maintain a first blower 3284 for supplying pressurized gas to the substrate floating stage 2250 and a second blower 3290 that acts as a vacuum source for the substrate floating stage 2250, which is housed in the gas environment of the gas envelopment assembly 1005. Properties that make the blower suitable as a source of pressurized gas or vacuum for various examples of substrate floating stages include, for example, but not limited to, high reliability; low maintenance; variable speed control; and a wide range of flow volumes; and the ability to provide approximately 100m³ of flow. 3 / h to approximately 2,500m 3 The volumetric flow rate is between / h. Various examples of the blower circuit 3280 may further include a first isolation valve 3283 at the inlet of the blower circuit 3280, and a check valve 3285 and a second isolation valve 3287 at the outlet of the blower circuit 3280. Various examples of the blower circuit 3280 may include an adjustable valve 3286, which may be, for example, but not limited to, a gate valve, a butterfly valve, a needle valve, or a ball valve; and a heat exchanger 3288 for maintaining the gas from the blower circuit 3280 to the substrate floating stage 2250 at a defined temperature.

[0150] Figure 22A Describes the use of integration and control in Figure 21A Gas Enclosure System 500C and Figure 22A The external gas circuit 3200 of the gas source 3201 and clean dry air (CDA) source 3203 in various aspects of the operation of the gas enclosure system 500D, also in Figure 21A As shown in the image. Figure 21A and Figure 22AThe external gas circuit 3200 may include at least four mechanical valves. These valves include a first mechanical valve 3202, a second mechanical valve 3204, a third mechanical valve 3206, and a fourth mechanical valve 3208. These various valves are located in various flow lines that allow control of non-reactive gases and air sources (such as clean dry air (CDA)). According to this teaching, a non-reactive gas can be any gas that does not undergo a chemical reaction under a set of defined conditions. Some common, non-limiting examples of non-reactive gases may include nitrogen, any rare gases, and any combination thereof. The enclosure gas line 3210 extends from the enclosure gas source 3201. The enclosure gas line 3210 continues linearly as a low-consumption manifold line 3212, which is in flow communication with a low-consumption manifold 3215. A first cross-connection section 3214 extends from a first flow junction 3216 located at the junction of the outer casing gas line 3210, the low-consumption manifold line 3212, and the first cross-connection section 3214. The first cross-connection section 3214 extends to a second flow junction 3218. A compressor gas line 3220 extends from the accumulator 3264 of the compressor circuit 3250 and terminates at the second flow junction 3218. A CDA line 3222 extends from the CDA source 3203 and continues as a high-consumption manifold line 3224, which is in flow communication with the high-consumption manifold 3225. A third flow junction 3226 is located at the junction of a second cross-connection section 3228, a clean dry air line 3222, and the high-consumption manifold line 3224. The second cross-connection section 3228 extends from the second flow junction 3218 to the third flow junction 3226. As high-consumption components, CDA can be supplied during maintenance via the high-consumption manifold 3225. Isolating the compressor using valves 3204, 3208, and 3230 prevents reactive species (such as ozone, oxygen, and water vapor) from contaminating the gas within the compressor and accumulator.

[0151] and Figure 21A and 22A compared to, Figure 21B and 22BThe following configuration is generally shown: the pressure of the gas inside the gas enclosure assembly 1005 can be maintained within a desired or specified range, for example, using a valve connected to a pressure monitor P, wherein the valve allows gas to be discharged to another enclosure, system, or area around the gas enclosure assembly 1005 by using information obtained from the pressure monitor. As described in other examples herein, this gas can be recovered and reprocessed. As mentioned above, this regulation can help maintain a slight positive internal pressure in the gas enclosure system because it also allows pressurized gas to be introduced into the gas enclosure system simultaneously. Variable requirements of various devices and equipment can create irregular pressure distributions for various gas enclosure assemblies and systems used in this teaching. Therefore, in addition to or alternative to the methods described herein, it is possible to use… Figure 21B and 22B The method shown in the figure is to help maintain a dynamic pressure balance between the gas enclosed system and the surrounding environment, which is kept at a slight positive pressure.

[0152] Figure 22C Another example of a system 500E is shown, generally illustrating the integration and control of one or more gas or air sources to establish a floating control area incorporated as part of a floating delivery system. Figure 1C , Figure 22A and Figure 22B Similar to the example, Figure 22C The floating stage 2250 is shown in general. Figure 22C The exemplary example also shows input region 2201 and output region 2203. For illustrative purposes only, regions 2201, 2202, and 2203 are referred to as input, print, and output. These regions can be used for other process steps, such as substrate transport or substrate support, such as during one or more of the substrate holding, drying, and heat treatment processes in one or more other modules. Figure 22C In the illustration, the first blower 3284A is configured to supply pressurized gas to one or more input or output areas 2201 or 2203 of the floating platform device. This pressurized gas can be temperature-controlled, for example, using a first cooler 142A connected to a first heat exchanger 1502A. A first filter 1503A can be used to filter this pressurized gas. A temperature monitor 8701A can be connected to the first cooler 142 (or another temperature controller).

[0153] Similarly, a second blower 3284B can be coupled to the printing area 2202 of the floating stage. A separate cooler 142B can be coupled to a loop including a second heat exchanger 1502B and a second filter 1503B. A second temperature monitor 8701B can be used to provide independent adjustment of the temperature of the pressurized gas supplied by the second blower 3284B. In illustrative examples, as previously stated herein... Figure 1C As described, input and output regions 2201 and 2203 are supplied with positive pressure, but printing region 2202 may include a combination of positive pressure and vacuum control to provide precise control over the substrate position. For example, this combination of positive pressure and vacuum control can be used to specifically control the substrate by using a floating air cushion provided by a gas envelopment system 500D within the area defined by printing region 2202. The vacuum may be established by a third blower 3290, such as providing at least a portion of the supplemental gas for the first and second blowers 3284A or 3284B within blower housing 3282.

[0154] It should be understood that this disclosure can be implemented using various alternatives to the embodiments described herein. For example, a wide range of different fields (such as chemistry, biotechnology, high technology, pharmaceutical technology) can benefit from this teaching. Printing is used to illustrate the practicality of various embodiments of the gas envelopment system according to this teaching. Various embodiments of the gas envelopment system that can house the printing system can provide features such as, but not limited to, providing a hermetically sealed enclosure through cycles of construction and deconstruction, minimization of the enclosure volume, and access from the outside to the inside during processing and maintenance. Such features of various embodiments of the gas envelopment system can have an impact on functionality such as, but not limited to, structural integrity providing ease of maintaining low levels of reactive species during processing, and rapid enclosure volume transitions minimizing downtime during maintenance cycles. Similarly, various features and specifications that provide practicality for substrate printing can also provide benefits to a wide range of technical fields.

[0155] While embodiments of the present disclosure have been shown and described herein, it will be apparent to those skilled in the art that such embodiments are provided by way of example only. Several variations, modifications, and substitutions will now occur to those skilled in the art without departing from the disclosure. The appended claims are intended to define the scope of the disclosure, and the methods and structures within the scope of these claims, as well as their equivalents, are covered by that scope.

Claims

1. A method for controlling the movement of a printhead assembly: Receive input for the Z-axis position of the printhead assembly, which is mounted on the Z-axis moving plate assembly of the XZ motion system of the inkjet printer; In response to receiving the input, an input current is provided to a drive motor operably connected to the Z-axis moving plate assembly to move the Z-axis moving plate assembly in the Z direction; Monitor the input current of the drive motor; and The operation of the pneumatic balancing system, which is operatively connected to the Z-axis moving plate assembly, is controlled based on the monitoring of the input current.

2. The method of claim 1, wherein controlling the operation of the pneumatic balancing system includes controlling the pressure of the pneumatic balancing system.

3. The method according to claim 1, wherein, The Z-axis position corresponds to the position of the printhead assembly during maintenance operations.

4. The method according to claim 1, wherein, An input current is provided to the drive motor so that the Z-axis moving plate assembly moves in the first Z direction.

5. The method according to claim 4, wherein, The input current is monitored to occur in the direction opposite to the first Z direction during the application of force on the Z-axis moving plate assembly.

6. The method according to claim 5, wherein, The force is a sealing force generated by mating the printhead assembly during maintenance operations.

7. The method according to claim 1, further comprising: A pneumatic reaction force sufficient to counteract the motor load is calculated, the calculation of which is based on monitoring of the input current.

8. The method of claim 7, further comprising controlling the pneumatic balancing system to apply a pneumatic balancing force to the Z-axis moving plate assembly.

9. The method according to claim 1, further comprising: Before supplying input current to the drive motor: Receive additional input for the X-axis position of the printhead assembly; and In response to receiving the additional input, the X-axis motion system is actuated to move the printhead assembly to the X-axis position.

10. The method according to claim 9, wherein, An input current is supplied to the drive motor so that the Z-axis moving plate assembly moves the printhead assembly to the Z-axis position while maintaining it at the X-axis position.

11. The method according to claim 1, wherein, A method for controlling the operation of the printhead assembly is performed when the printhead assembly is in a closed, thermally controlled substrate printing environment.

12. The method according to claim 11, wherein, The enclosed, thermally controlled substrate printing environment is an inert gas environment.

13. A method for controlling the operation of a printhead assembly, comprising: A Z-axis moving plate assembly of a movable XZ-axis motion system is used to move a printhead assembly to a Z-axis position in a first Z direction, the printhead assembly being coupled to the Z-axis moving plate assembly; With the printhead assembly in the Z-axis position, the actuating motor applies a first force to the Z-axis moving plate assembly in a first Z-direction, while a second force acts on the Z-axis moving plate assembly in a second Z-direction opposite to the first Z-direction; and An actuated pneumatic balancing system is used to keep the first force on the Z-axis moving plate, while the second force continues to act on the Z-axis moving plate.

14. The method according to claim 13, wherein, The Z-axis position is the docking position of the printhead assembly during maintenance operations on the printhead assembly.

15. The method according to claim 14, wherein, The second force is a sealing force generated during maintenance of the printhead assembly by mating the printhead assembly against the sealing structure.

16. The method according to claim 13, wherein, Actuating the pneumatic balancing system includes increasing the air pressure of the pneumatic balancing system.

17. The method according to claim 13, wherein, Actuating the motor includes supplying current to the motor.

18. The method of claim 17, further comprising reducing the current supplied to the motor after actuating the pneumatic balancing system.

19. The method of claim 13, further comprising supporting a substrate in a gas envelopment, the printhead assembly being used in the gas envelopment for printing the substrate, wherein the surface of the substrate to be printed is located in the XY plane, and the Z direction is defined as perpendicular to the XY plane.

20. The method of claim 19, wherein, It also includes maintaining a thermal control environment within the gas enclosure.

21. The method according to claim 20, wherein, The thermal control environment is an inert gas environment.

22. The method according to claim 21, wherein, Supporting the substrate in the gas enclosure includes supporting the substrate by floating in the gas enclosure.

23. The method of claim 13, further comprising moving the Z-axis moving plate assembly to position the printhead assembly at the X-axis position.

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