Wireless communication antenna of integrated circuit and design method thereof

Abstract

The application provides a wireless communication antenna of an integrated circuit and a design method thereof. The wireless communication antenna of the integrated circuit comprises: a middle layer; an insulating layer arranged on two opposite sides of the middle layer; a wiring layer arranged on a side of the insulating layer away from the middle layer; two groups of antenna through holes arranged in parallel and penetrating through the insulating layer and the middle layer to connect the wiring layer; the antenna through holes are filled with copper columns with side wall recesses for signal receiving or transmitting as antennas; the copper columns comprise four connecting positions connected with inner walls of the antenna through holes, and the antenna through holes are electrically connected with external circuits through the wiring layer. The double-layer insulating layer structure is adopted to reduce the signal crosstalk problem.

Description

Technical Field

[0001] This invention relates to the field of semiconductor applications, and more particularly to a wireless communication antenna for an integrated circuit and its design method. Background Technology

[0002] In recent years, with the rapid development of microelectronics and semiconductor technologies, and the emergence of the nanoscale era, the size, operating frequency, and pin count of hardware circuit chips have continuously increased in complexity, integration, and density, leading to a rapid evolution of packaging technology from 2.5D to 3D. In the future, with nanotechnology at its core, information processing speed and efficiency will be even faster and higher. Therefore, attention is turning to advanced packaging, particularly through-silicon vias (TSVs) for system integration innovation. TSV interconnects are suitable for various 2.5D and 3D packaging applications and architectures, offering advantages such as reduced package size, transmission latency, noise, and chip power consumption. Considering both product cost and R&D difficulty, TSV integration technology represents the future trend.

[0003] Currently, traditional through-silicon vias (TSVs) are cylindrical, but due to chip and wafer area limitations, an excessively large TSV ratio leads to reduced integration density. Furthermore, traditional TSVs operate at a fixed frequency, and meeting the communication requirements of different frequency bands without increasing the TSV area ratio remains a major challenge. Summary of the Invention

[0004] In view of the problems existing in the prior art, the present invention proposes a wireless communication antenna for integrated circuits and its design method, which mainly solves the problem of low chip integration caused by the excessive proportion of through holes in the existing technology.

[0005] To achieve the above and other objectives, the technical solution adopted by the present invention is as follows.

[0006] This application provides a wireless communication antenna for an integrated circuit, comprising:

[0007] Intermediate layer;

[0008] An insulating layer is disposed on two opposite sides of the intermediate layer;

[0009] A wiring layer is disposed on the side of the insulating layer opposite to the interlayer;

[0010] Two sets of antenna vias are arranged in parallel and penetrate the insulating layer and the interposer layer to connect the wiring layer; the antenna vias are filled with copper pillars with recessed sidewalls for use as antennas to receive or transmit signals; the copper pillars include four connection points, which are connected to the inner wall of the antenna vias, and the antenna vias are electrically connected to the external circuit through the wiring layer.

[0011] In one embodiment of this application, the contact surface between each connection point and the inner wall of the antenna through hole is an arc surface.

[0012] In one embodiment of this application, the wireless communication antenna of the integrated circuit further includes:

[0013] A power supply structure is disposed on the wiring layer on one side of the intermediate layer and is electrically connected to one end of the antenna via through the power supply structure;

[0014] A base disk is disposed on the wiring layer on the other side of the intermediate layer, and the base disk is sleeved on the other end of the antenna through hole; signal transmission or reception is achieved by connecting the feed structure and the base disk.

[0015] In one embodiment of this application, the feeding structure extends from the antenna through-hole to the side of the wiring layer to form an electrode, and the feeding structures corresponding to the two sets of antenna through-holes are on the same horizontal line.

[0016] In one embodiment of this application, multiple blind holes are respectively provided on both sides of the feeding structure of each group of antenna through holes. The blind holes on both sides of the same feeding structure are arranged in a Y-shape along the extension direction of the feeding structure, and the antenna through holes are located at the head of the Y-shape, so that the blind holes at corresponding positions of the two groups of antenna through holes have an axisymmetric structure.

[0017] In one embodiment of this application, the blind via is filled with copper and grounded through the wiring layer to enhance the transmission signal between the two sets of antenna vias.

[0018] This application also provides a method for designing a wireless communication antenna for an integrated circuit, including:

[0019] Provide an intermediary layer;

[0020] An insulating layer is formed on both sides of the intermediate layer;

[0021] Two sets of antenna through holes are provided, which are arranged in parallel and penetrate the insulating layer and the intermediate layer. A copper pillar is provided in the antenna through hole as an antenna for signal transmission or reception. Multiple recessed structures are made on the side wall of the copper pillar to form four connection positions of the copper pillar, which are connected to the inner wall of the antenna through hole through the connection positions.

[0022] A wiring layer is fabricated on the insulating layer, and the antenna vias are connected through the wiring layer so that one set of antenna vias serves as a signal transmitting end and the other set of antenna vias serves as a signal receiving end.

[0023] In one embodiment of this application, the distance between the side of the wiring layer opposite to the intermediary layer and the antenna via is between 1 and 50 micrometers.

[0024] In one embodiment of this application, the surface of the connection position used to connect with the inner wall of the antenna through hole is an arc surface.

[0025] In one embodiment of this application, after providing two sets of antenna through holes, the method further includes:

[0026] A set of blind holes arranged in a Y-shape is made for each group of antenna through holes so that the Y-shaped blind holes of the two groups of antenna through holes are axially symmetrical, wherein the antenna through holes are located at the head of the Y-shape;

[0027] The blind via is filled with copper and grounded through the wiring layer.

[0028] As described above, this application provides a wireless communication antenna for an integrated circuit and a design method thereof, which has the following beneficial effects.

[0029] This application uses two sets of antenna vias positioned opposite each other in the intermediate layer as antennas for signal transmission and reception. Combined with the copper pillar structure within the antenna vias, the stability of wireless communication can be effectively guaranteed. The use of a double-layer insulating layer structure reduces signal crosstalk. By adjusting the curvature of the concave surface of the copper pillars, communication requirements for different frequency bands can be met. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the wireless communication antenna of an integrated circuit in one embodiment of this application.

[0031] Figure 2 This is a schematic diagram of the wiring layer structure on one side in one embodiment of this application.

[0032] Figure 3 This is a schematic diagram of the wiring layer on the other side in one embodiment of this application.

[0033] Figure 4 This is a schematic diagram of a copper column with a recessed structure in one embodiment of this application.

[0034] Figure 5 This is a schematic diagram of a wiring layer structure with blind vias arranged in a Y-shape in one embodiment of this application.

[0035] Figure 6 This is a flowchart illustrating a design method for a wireless communication antenna of an integrated circuit in one embodiment of this application.

[0036] Figure 7 This is a schematic diagram of the stacked structure of the wireless communication antenna of the integrated circuit in one embodiment of this application. Detailed Implementation

[0037] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0038] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0039] Please see Figure 1 This application provides a wireless communication antenna for an integrated circuit, comprising: an interposer 3, an insulating layer 2, a wiring layer 1, and two sets of antenna vias 4. The interposer 3 may use silicon as a substrate. An insulating layer 2 is disposed on each of opposite sides of the interposer 3, and the insulating layer 2 may be made of an insulating material such as silicon dioxide. Two sets of antenna vias 4 are formed in the interposer 3, and each set of antenna vias 4 is filled with copper to form copper pillars. Each set of antenna vias 4 can serve as a signal transmitting end or a signal receiving end of the wireless communication antenna of the integrated circuit. For example, when one set of antenna vias 4 serves as a signal transmitting end, the other set of antenna vias 4 serves as a signal receiving end. Further, a wiring layer 1 is disposed on the side of the insulating layer 2 away from the interposer. The wiring layers 1 disposed on both sides of the interposer 3 are electrically connected to the antenna vias 4 to enable signal transmission and reception within the silicon substrate, and the signal is transmitted in the area between the two sets of antenna vias 4.

[0040] Please see Figure 2 , Figure 2 This is a schematic diagram of a side wiring layer structure in one embodiment of this application. The side wiring layer 1 of the wireless communication antenna of the integrated circuit may be provided with a feeding structure 6, which is electrically connected to one end of the antenna via 4. The feeding structure 6 is connected to an external circuit to receive antenna signals or to feed back the received antenna signals to an external circuit.

[0041] Please see Figure 3 , Figure 3This is a schematic diagram of the wiring layer on the other side in one embodiment of this application. This wiring layer 1 may be provided with a base disk 8, which can be made by electroplating an annular copper foil layer as the base disk. The base disk 8 is sleeved on one end of the antenna through-hole. The base disk 8 can be used for grounding, cooperating with the feed structure on the other side to form a signal path. The base disk 8 can be used to match the impedance of the copper pillars in the antenna through-hole; that is, the size of the base disk 8 can be determined according to the impedance of the copper pillars in the antenna through-hole, and can be adjusted according to actual application requirements, without limitation here.

[0042] Please see Figure 4 , Figure 4 This is a schematic diagram of a copper pillar with a recessed structure in one embodiment of this application. The antenna through-hole is filled with a copper pillar 5 with recessed sidewalls. The copper pillar 5 includes four connection points, each contacting the sidewall of the antenna through-hole. The plane of the connection point for contacting the inner wall of the antenna through-hole is an arc surface. In one embodiment, the antenna through-hole is cylindrical, but other shapes can be used depending on the actual application requirements. Here, a cylindrical shape is used as an example. The copper pillars 5 filling the antenna through-hole can be configured as a grid shape, with the outer edges of the grid-shaped copper pillars all being 1 / 4 cylindrical structures. The radius of the cylindrical structure is equal to the edge length of the grid-shaped copper pillar, both being W1. The width of the recessed part of the grid-shaped copper pillar is L2. The edge length where the grid-shaped copper pillar connects to the cylindrical structure is L3, and the lateral length of the grid-shaped copper pillar is L1. The cylindrical structure and the side with length L3 form connection points, and the four connection points are evenly distributed, forming a stacked structure. At a radius of... Within a large cylindrical area, the grid pattern exhibits certain advantages. Under the same height conditions, the circumference of the cylinder's base is 2πR, while the circumference of the grid pattern is 2πW1+8L3+8W1+4L2 (with θ as the calculation standard). Therefore, the grid pattern has a larger side area for the vias. A larger side area is beneficial for heat dissipation through the vias, and it also occupies less wafer area.

[0043] When a conductor carries alternating current or an alternating electromagnetic field, the current distribution inside the conductor is uneven. The current concentrates in the conductor's "skin," meaning it's concentrated in a thin outer layer. The closer to the conductor's surface, the greater the current density, while the current inside the conductor is actually smaller. This increases the conductor's resistance and consequently, its power loss. Therefore, different degrees of curvature in a grid-shaped via (the greater the curvature, the smaller the angle θ) will result in different operating frequencies. Thus, the operating frequency of the TSV can be adjusted within a cylindrical space of equal size, enabling TSV wireless communication between different frequencies.

[0044] Please see Figure 5 , Figure 5This is a schematic diagram of a wiring layer structure with Y-shaped blind vias in one embodiment of this application. The feed structures 6 of the two sets of antenna vias are on the same horizontal line and extend to both sides. Multiple blind vias 7 are provided on both sides of each set of feed structures 6, and the blind vias on both sides of each set of feed structures 6 are arranged in a Y-shape, so that the corresponding antenna vias 4 are located in the head region of the Y-shape. The arrangement of the blind vias in the two sets of antenna vias 4 is axially symmetrical. Each blind via 7 is filled with copper and grounded, serving to shield against external signal interference. The narrower the head of the Y-shape, the better the signal transmission performance. This can be adjusted according to actual application requirements and is not limited here.

[0045] Please see Figure 6 This application also provides a design method for a wireless communication antenna of an integrated circuit, the method comprising the following steps:

[0046] Step S100: Provide an interposer layer; the interposer layer may use silicon as a substrate.

[0047] Step S101: An insulating layer is formed on both sides of the intermediate layer; the insulating layer is deposited on both sides of the intermediate layer by physical vapor deposition.

[0048] Step S102: Two sets of antenna vias are set in parallel and penetrate the insulating layer and the interposer layer. Copper pillars are placed in the antenna vias as antennas for signal transmission or reception. A thin film is deposited on the silicon substrate surface of the interposer layer, and photoresist is coated on the thin film. The photoresist is exposed and developed to expose the ground TSV region. The mask of the TSV region is subjected to anisotropic etching treatment using wet etching or plasma dry etching. After etching the TSV vias (i.e., antenna vias), the thin film and photoresist are removed to complete the fabrication of the antenna vias. Copper is electroplated into the antenna vias, planarized, and excess copper is removed to complete the copper pillar filling.

[0049] Step S103: A wiring layer is fabricated on the insulating layer, and the antenna vias are connected through the wiring layer so that one set of antenna vias serves as a signal transmitting end and the other set serves as a signal receiving end. A wiring layer is fabricated on the side of the insulating layer opposite to the interposer. A temporary glass substrate is bonded to the front side of the interposer. The wafer is thinned to expose the copper pillars of the antenna vias on the back side of the interposer. The temporary glass substrate is removed, and plasma cleaning is performed. Similarly, a glass substrate is bonded to the back side of the interposer. The wafer is thinned to expose the copper pillars of the antenna vias on the front side of the interposer. The glass substrate is removed, and plasma cleaning is performed to complete the fabrication of the antenna vias.

[0050] In one embodiment, a copper pillar is disposed within the antenna through-hole as an antenna for signal transmission or reception, comprising: forming a plurality of recessed structures on the sidewall of the copper pillar to form four connection positions of the copper pillar, and connecting the copper pillar to the inner wall of the antenna through-hole through the connection positions, wherein the surface of the connection position for connecting to the inner wall of the antenna through-hole is an arc surface.

[0051] Specifically, a milling machine is used to locate the four end holes of the grid-shaped through-hole, forming a copper pillar with a recessed structure. The bottom wiring layer of the intermediate layer is mechanically ground to expose the base disk connecting the grid-shaped copper pillar, while the feed structure is mechanically ground to expose the wiring layer on the other side. Plasma cleaning is then used to complete the antenna structure fabrication.

[0052] Please see Figure 7 , Figure 7 This is a schematic diagram of the stacked structure of a wireless communication antenna of an integrated circuit in one embodiment of this application. In one embodiment, the front side of the silicon substrate of the interposer 3 is finely ground to 1-50 μm. Antenna vias are fabricated on the front side of the silicon substrate of the interposer 3 using photolithography and dry etching techniques, and an insulating layer 2 made of inorganic material SiO2 is deposited. Copper pillars are electroplated into the antenna vias, and bumps are fabricated using a bumping process. Top and bottom wiring layers 1 are fabricated. Antenna vias (grid-shaped) are fabricated on the front side of the silicon substrate of the interposer 3 using a milling machine. The feed structure and base disk are fabricated using photolithography and dry etching techniques. After setting two sets of antenna vias, the method further includes: fabricating a set of Y-shaped blind vias 7 for each set of antenna vias, so that the Y-shaped blind vias 7 of the two sets of antenna vias are axially symmetrical, wherein the antenna vias are located at the head of the Y-shape; copper is filled in the blind vias 7 and grounded through the wiring layer 1. The distance from the wiring layer 1 to the antenna via 4 is reduced to 1-50 μm by mechanical grinding, and then encapsulated. This involves completing the fabrication of the wireless communication antenna packaging structure for the integrated circuit.

[0053] In summary, the wireless communication antenna for integrated circuits and its design method provided in this application solve the problem of a large proportion of silicon vias (SIVs) under the same transmission capability conditions in traditional SIV structures. By varying the curvature of the vias in a grid-like structure, multi-band wireless interconnection communication between vias of the same size is achieved, improving the utilization rate of vias of different sizes. The use of a double-layer insulating layer structure reduces signal crosstalk. Therefore, this invention effectively overcomes the various shortcomings of the prior art and has high industrial applicability.

[0054] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A wireless communication antenna for an integrated circuit, characterized in that, include: Intermediate layer; An insulating layer is disposed on two opposite sides of the intermediate layer; A wiring layer is disposed on the side of the insulating layer opposite to the intermediate layer; the stacking arrangement of the intermediate layer, insulating layer, and wiring layer is: wiring layer, insulating layer, intermediate layer, insulating layer, wiring layer; Two sets of antenna vias are arranged in parallel and penetrate the insulating layer and the interposer layer to connect the wiring layer; the antenna vias are filled with copper pillars with recessed sidewalls for use as antennas to receive or transmit signals; the copper pillars include four connection points, which are connected to the inner wall of the antenna vias, and the antenna vias are electrically connected to external circuits through the wiring layer; the contact surface between each connection point and the inner wall of the antenna via is an arc surface.

2. The wireless communication antenna of the integrated circuit according to claim 1, characterized in that, Also includes: A power supply structure is disposed on the wiring layer on one side of the intermediate layer and is electrically connected to one end of the antenna via through the power supply structure; A base disk is disposed on the wiring layer on the other side of the intermediate layer, and the base disk is sleeved on the other end of the antenna through hole; signal transmission or reception is achieved by connecting the feed structure and the base disk.

3. The wireless communication antenna of the integrated circuit according to claim 2, characterized in that, The feeding structure extends from the antenna through-hole to the side of the wiring layer to form an electrode, and the feeding structures corresponding to the two sets of antenna through-holes are on the same horizontal line.

4. The wireless communication antenna of the integrated circuit according to claim 3, characterized in that, Each group of antenna through holes has multiple blind holes on both sides of the feeding structure. The blind holes on both sides of the same feeding structure are arranged in a Y-shape along the extension direction of the feeding structure, and the antenna through holes are located at the head of the Y-shape, so that the blind holes at corresponding positions of the two groups of antenna through holes have an axisymmetric structure.

5. The wireless communication antenna of the integrated circuit according to claim 4, characterized in that, The blind via is filled with copper and grounded through the wiring layer to enhance the transmission signal between the two sets of antenna vias.

6. A design method for a wireless communication antenna for an integrated circuit, characterized in that, include: Provide an intermediary layer; An insulating layer is formed on both sides of the intermediate layer; Two sets of antenna through-holes are provided, which are arranged in parallel and penetrate the insulating layer and the intermediate layer. Copper pillars are set in the antenna through-holes as antennas for signal transmission or reception. Multiple recessed structures are made on the sidewall of the copper pillar to form four connection positions of the copper pillar. The copper pillar is connected to the inner wall of the antenna through-hole through the connection positions. The surface of the connection position used to connect with the inner wall of the antenna through-hole is an arc surface. A wiring layer is fabricated on the insulating layer, and the antenna vias are connected through the wiring layer so that one set of antenna vias serves as a signal transmitting end and the other set of antenna vias serves as a signal receiving end; the stacking method of the interposer layer, insulating layer, and wiring layer is: wiring layer, insulating layer, interposer layer, insulating layer, wiring layer.

7. The design method for a wireless communication antenna of an integrated circuit according to claim 6, characterized in that, The distance between the side of the wiring layer opposite to the intermediary layer and the antenna via is between 1 and 50 micrometers.

8. The design method for a wireless communication antenna of an integrated circuit according to claim 6, characterized in that, After setting two sets of antenna through-holes, the following is also included: A set of blind holes arranged in a Y-shape is made for each group of antenna through holes so that the Y-shaped blind holes of the two groups of antenna through holes are axially symmetrical, wherein the antenna through holes are located at the head of the Y-shape; The blind via is filled with copper and grounded through the wiring layer.

Images