Atomization device heating body temperature control method and device and atomization equipment

Abstract

The application relates to a heating body temperature control method and device of an atomization device, computer equipment, a storage medium, a computer program product and an atomization device. After the real-time resistance of a heating body of an atomization device is acquired, the corresponding relationship between resistance and temperature obtained based on the highest temperature area of the heating body is preset, the real-time temperature corresponding to the real-time resistance is obtained, and then the working power of the heating body is adjusted according to the size relationship between the real-time temperature and a standard temperature. The real-time temperature obtained according to the real-time resistance and the preset corresponding relationship between resistance and temperature is more accurate, and when the working power of the heating body is adjusted according to the size relationship between the real-time temperature and the standard temperature, the real-time temperature can also be close to the standard temperature, so that accurate control of the temperature of the heating body is realized.

Description

Technical Field

[0001] This application relates to the field of atomizing device technology, and in particular to a method, apparatus, computer equipment, storage medium, computer program product and atomizing device for controlling the temperature of the heating element of an atomizing device. Background Technology

[0002] The core component of an atomizing device is the heating element. The heating element heats the aerosol-generating matrix, thus producing aerosols. By controlling the temperature of the aerosol-generating matrix, it's possible to maintain it in a state where it can be atomized into smoke without combustion, while still providing a good inhalation experience. Therefore, controlling the temperature of the heating element is particularly crucial.

[0003] Traditional heating element temperature control methods employ Total Temperature Regulator (TCR) control, which involves placing a resistance wire on the heating element and calculating the temperature change by measuring the resistance change of the wire. TCR control first requires obtaining the resistance curve (TR) of the heating element. Currently, the TR curve is measured using the oil bath method, where the heating element is placed in a constant-temperature oil and heated uniformly. After the heating element temperature stabilizes, the resistance of the resistance wire at that temperature is measured. This process is repeated at multiple temperature points to obtain the TR curve. However, the TR curve obtained by the oil bath method is based on a uniform and steady-state heating condition. In actual heating, the heating element temperature is not uniform and is often transient. Furthermore, the heating element undergoes multiple heating stages, resulting in multiple resistance values ​​corresponding to the same temperature or multiple temperatures for the same resistance value. Therefore, the TR curve obtained by the oil bath method differs significantly from the TR curve obtained during actual heating in the atomizing device, leading to inaccurate temperature control of the heating element using the oil bath method. Summary of the Invention

[0004] Therefore, it is necessary to provide a heating element temperature control method, device, computer equipment, storage medium, computer program product, and atomizing device for the atomizing device that can improve the accuracy of temperature control of the heating element, in order to address the above-mentioned technical problems.

[0005] Firstly, this application provides a method for controlling the temperature of the heating element in an atomizing device. The method includes:

[0006] Obtain the real-time resistance of the heating element in the atomizing device;

[0007] Based on the preset correspondence between resistance and temperature, the real-time temperature corresponding to the real-time resistance is obtained; the correspondence between resistance and temperature is obtained based on the highest temperature region of the heating element.

[0008] The operating power of the heating element is adjusted according to the relationship between the real-time temperature and the standard temperature.

[0009] In one embodiment, the process of establishing the correspondence between resistance and temperature includes:

[0010] Determine the highest temperature range of the heating element;

[0011] The temperature and resistance of the highest temperature region are obtained when the heating element is heated in the atomizing device.

[0012] Based on the temperature and resistance of the highest temperature region, establish the correspondence between resistance and temperature.

[0013] In one embodiment, determining the highest temperature region of the heating element includes:

[0014] The heating element is heated before it is inserted into the atomizing device;

[0015] The surface temperature of the heating element is detected to obtain the highest temperature region.

[0016] In one embodiment, the heating phase of the heating element within the atomizing device includes a temperature-boosting phase, a cooling phase, and a temperature-stabilizing phase. Establishing the correspondence between resistance and temperature based on the temperature and resistance of the highest temperature region includes:

[0017] Based on the temperature and resistance of the highest temperature region during the temperature-pressing stage, establish the correspondence between resistance and temperature during the temperature-pressing stage.

[0018] Based on the temperature and resistance of the highest temperature region during the cooling phase, establish the correspondence between resistance and temperature during the cooling phase.

[0019] Based on the temperature and resistance of the highest temperature region in the steady-state phase, establish the correspondence between resistance and temperature in the steady-state phase.

[0020] In one embodiment, obtaining the real-time temperature corresponding to the real-time resistance based on a preset correspondence between resistance and temperature includes:

[0021] Determine the heating stage of the heating element;

[0022] Based on the relationship between resistance and temperature at the heating stage of the heating element, the real-time temperature corresponding to the real-time resistance is obtained.

[0023] In one embodiment, obtaining the real-time resistance of the heating element of the atomizing device includes:

[0024] Obtain the voltage and current of the heating element in the atomizing device;

[0025] The real-time resistance of the heating element is obtained based on the voltage and the current.

[0026] Secondly, this application also provides a temperature control device for the heating element of an atomizing device. The device includes:

[0027] The resistance acquisition module is used to acquire the real-time resistance of the heating element of the atomizing device;

[0028] The temperature acquisition module is used to obtain the real-time temperature corresponding to the real-time resistance according to a preset correspondence between resistance and temperature; the correspondence between resistance and temperature is obtained based on the highest temperature region of the heating element.

[0029] The power adjustment module is used to adjust the working power of the heating element according to the relationship between the real-time temperature and the standard temperature.

[0030] Thirdly, this application also provides a computer device. The computer device includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program to perform the following steps:

[0031] Obtain the real-time resistance of the heating element in the atomizing device;

[0032] Based on the preset correspondence between resistance and temperature, the real-time temperature corresponding to the real-time resistance is obtained; the correspondence between resistance and temperature is obtained based on the highest temperature region of the heating element.

[0033] The operating power of the heating element is adjusted according to the relationship between the real-time temperature and the standard temperature.

[0034] Fourthly, this application also provides a computer-readable storage medium. The computer-readable storage medium stores a computer program thereon, which, when executed by a processor, performs the following steps:

[0035] Obtain the real-time resistance of the heating element in the atomizing device;

[0036] Based on the preset correspondence between resistance and temperature, the real-time temperature corresponding to the real-time resistance is obtained; the correspondence between resistance and temperature is obtained based on the highest temperature region of the heating element.

[0037] The operating power of the heating element is adjusted according to the relationship between the real-time temperature and the standard temperature.

[0038] Fifthly, this application also provides a computer program product. The computer program product includes a computer program that, when executed by a processor, performs the following steps:

[0039] Obtain the real-time resistance of the heating element in the atomizing device;

[0040] Based on the preset correspondence between resistance and temperature, the real-time temperature corresponding to the real-time resistance is obtained; the correspondence between resistance and temperature is obtained based on the highest temperature region of the heating element.

[0041] The operating power of the heating element is adjusted according to the relationship between the real-time temperature and the standard temperature.

[0042] Sixthly, this application also provides an atomizing device, including an atomizing apparatus and a control device, wherein the control device is used to control the temperature of the heating element of the atomizing apparatus according to the method described above.

[0043] The aforementioned method, apparatus, computer equipment, storage medium, computer program product, and atomizing device for controlling the heating element temperature of an atomizing device obtains the real-time resistance of the heating element. Based on a preset correspondence between resistance and temperature derived from the heating element's highest temperature region, the real-time temperature corresponding to the real-time resistance is obtained. Then, the operating power of the heating element is adjusted according to the relationship between the real-time temperature and a standard temperature. The temperature change in the heating element's highest temperature region accurately reflects the temperature change during the heating process. The highest temperature region of the heating element characterizes the highest temperature point on the heating element's surface. Therefore, the correspondence between resistance and temperature derived from the heating element's highest temperature region is more consistent with reality. Consequently, the real-time temperature obtained based on the real-time resistance and the preset correspondence between resistance and temperature is more accurate. Adjusting the heating element's operating power based on the relationship between the real-time temperature and the standard temperature also allows the real-time temperature to approach the standard temperature, thus achieving accurate control of the heating element temperature. Attached Figure Description

[0044] Figure 1 This is a flowchart illustrating a method for controlling the temperature of the heating element in an atomizing device in one embodiment.

[0045] Figure 2 This is a schematic diagram illustrating the process of establishing the relationship between resistance and temperature in one embodiment;

[0046] Figure 3 This is a schematic diagram illustrating the process of establishing the relationship between resistance and temperature in another embodiment;

[0047] Figure 4 This is a flowchart illustrating the method for controlling the temperature of the heating element in an atomizing device in another embodiment;

[0048] Figure 5 This is a schematic diagram of the heating element's temperature rise curve in one embodiment;

[0049] Figure 6 This is a schematic diagram of the resistance change curve of the heating element during the heating process in one embodiment;

[0050] Figure 7 This is a schematic diagram of the TR curve in one embodiment;

[0051] Figure 8 This is a schematic diagram of the TR curve during the temperature surge stage in one embodiment;

[0052] Figure 9 This is a schematic diagram of the TR curve during the cooling stage in one embodiment;

[0053] Figure 10 This is a schematic diagram of the TR curve during the steady-state phase in one embodiment;

[0054] Figure 11 This is a flowchart illustrating the method for controlling the temperature of the heating element in another embodiment of the atomizing device;

[0055] Figure 12 This is a structural block diagram of the heating element temperature control device of an atomizing device in one embodiment;

[0056] Figure 13 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0057] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0058] The heating element temperature control method for an atomizing device provided in this application embodiment is used to control the temperature of the heating element in the atomizing device. This method can be executed by a control device, which can be located within the atomizing device to facilitate temperature control of the heating element. Alternatively, the heating element temperature control method for the atomizing device can also be executed by a terminal or server outside the atomizing device, whichever is deemed feasible by those skilled in the art.

[0059] In one embodiment, such as Figure 1 As shown, a method for controlling the temperature of the heating element in an atomizing device is provided. Taking the execution of this method by a control device as an example, it includes the following steps:

[0060] Step 102: Obtain the real-time resistance of the heating element of the atomizing device.

[0061] The heating element is used to heat the aerosol-generating matrix. The temperature of the heating element affects the quality and efficiency of aerosol generation after heating the aerosol-generating matrix. The aerosol-generating matrix is ​​a matrix capable of releasing volatile compounds that can form aerosols. The aerosol-generating matrix can be solid or liquid, or include both solid and liquid components.

[0062] The control device is connected to the heating control circuit, which can control the operating state of the heating control circuit, thereby controlling the temperature of the heating element. The heating element is used to heat the aerosol-generating matrix. Specifically, under the control of the control device, after the alternating current generated by the power supply is applied to the heating control circuit, the coil of the heating control circuit generates an alternating magnetic field. The heating element is placed in the alternating magnetic field and cuts the alternating magnetic field lines, thereby generating eddy currents inside. The eddy currents cause the atoms inside the heating element to move at high speed and randomly. The atoms collide and rub against each other, generating heat energy, thereby heating the aerosol-generating matrix.

[0063] The real-time resistance of a heating element is related to its temperature. Generally, the higher the resistance of the heating element, the higher the temperature; the lower the resistance, the lower the temperature. Real-time resistance refers to the resistance value of the heating element at the current detection moment.

[0064] Step 104: Based on the preset correspondence between resistance and temperature, obtain the real-time temperature corresponding to the real-time resistance.

[0065] The relationship between resistance and temperature is derived from the highest temperature region of the heating element. That is, the relationship is established based on the temperature and resistance changes within this highest temperature region. The highest temperature region of the heating element refers to the area on its surface with the highest temperature. There may be two or more such regions; only one is selected when establishing the relationship. Before implementing the heating element temperature control method in the atomizing device, the relationship between resistance and temperature is already obtained and stored, and can be directly retrieved later.

[0066] After obtaining the real-time resistance of the heating element, the resistance value of the real-time resistance is found in the preset resistance-temperature correspondence, and the temperature value corresponding to the real-time resistance value is obtained as the real-time temperature of the heating element.

[0067] Step 106: Adjust the working power of the heating element according to the relationship between the real-time temperature and the standard temperature.

[0068] The standard temperature is the target temperature of the heating element, i.e., the temperature the heating element needs to reach. The standard temperature corresponds to the operating mode of the atomizing device, which may have two or more operating modes. The control device can determine the operating mode of the atomizing device based on received user commands, and then match the standard temperature corresponding to the user-selected operating mode, achieving intelligent matching of the standard temperature. Alternatively, the standard temperature can be a stored constant value, which the control device can directly recall after the atomizing device is turned on.

[0069] After obtaining the real-time temperature and the standard temperature, the relationship between the real-time temperature and the standard temperature is compared, and the operating power of the heating element is adjusted accordingly. For example, if the real-time temperature is lower than the standard temperature, considering that the current real-time temperature of the heating element is relatively low, the operating power of the heating element is increased to further raise the temperature and reach the standard temperature as quickly as possible. If the real-time temperature is higher than the standard temperature, considering that the current real-time temperature of the heating element is relatively high, the operating power of the heating element is decreased to lower the temperature and reduce it to the standard temperature as quickly as possible.

[0070] Specifically, the operating power of the heating element can be adjusted by regulating the duty cycle of the control signal sent to the switching transistor of the heating element. A larger duty cycle results in a longer on-time of the transistor, leading to a higher operating power and further heating of the heating element. Conversely, a smaller duty cycle results in a shorter on-time of the transistor, lower operating power, slower heating, and even a decrease in temperature.

[0071] Furthermore, the control device can also adjust the operating power of the heating element based on the difference between the real-time temperature and the standard temperature. The difference can be a numerical value or a ratio, as long as it characterizes the degree of difference between the two values. After obtaining the difference between the real-time temperature and the standard temperature, if the difference is large, the operating power of the heating element is adjusted more significantly to bring the real-time temperature closer to the standard temperature as quickly as possible. If the difference is small, the operating power of the heating element is adjusted less significantly to avoid over-adjustment and improve control accuracy.

[0072] In this embodiment, the temperature change in the highest temperature region of the heating element can accurately reflect the temperature change during the heating process. The highest temperature region of the heating element can characterize the highest temperature point on the surface of the heating element. Therefore, the correspondence between resistance and temperature obtained based on the highest temperature region of the heating element is more consistent with reality. Consequently, the real-time temperature obtained based on the real-time resistance and the preset correspondence between resistance and temperature is more accurate. When adjusting the working power of the heating element according to the relationship between the real-time temperature and the standard temperature, the real-time temperature can be made close to the standard temperature, thereby achieving accurate control of the heating element temperature.

[0073] In one embodiment, such as Figure 2 As shown, the process of establishing the relationship between resistance and temperature includes steps 202 to 206.

[0074] Step 202: Determine the highest temperature range of the heating element.

[0075] The highest temperature region of a heating element refers to the area on its surface with the highest temperature. To determine this region, the heating element can be heated, and the temperature at various points on its surface can be measured. The area corresponding to the highest temperature is the highest temperature region of the heating element. There are various methods for measuring the temperature on the surface of the heating element. For example, an infrared thermal imager can be used to photograph the surface distribution of the heating element to obtain the highest temperature region, and the results can be sent to the control device. Using an infrared thermal imager offers high detection efficiency.

[0076] Step 204: Obtain the temperature and resistance of the highest temperature region when the heating element is heated in the atomizing device.

[0077] After the heating element is installed inside the atomizing device, the device is turned on, and the heating element begins heating. The temperature changes of the heating element inside the atomizing device are simulated during actual use, closely matching real-world conditions. During the heating process, the temperature and resistance of the highest temperature region are collected at various times, serving as the basis for establishing the correlation between resistance and temperature. Real-time data acquisition can be selected to obtain more comprehensive data.

[0078] There are multiple methods for detecting the temperature of the highest temperature zone. For example, a thermocouple can be placed in the highest temperature zone by adhesive bonding, which is simple to operate. Furthermore, the thermocouple can be placed in the highest temperature zone before the heating element is installed into the atomizing device, which is also convenient. The thermocouple can accurately detect the temperature of the highest temperature zone and send the data to the control device. Alternatively, a resistance detection device can be used to detect the resistance of the highest temperature zone and then send the data to the control device. Thus, the control device can obtain the temperature and resistance of the highest temperature zone when the heating element is heating within the atomizing device.

[0079] Step 206: Establish the correspondence between resistance and temperature based on the temperature and resistance of the highest temperature region.

[0080] After the control device obtains the temperature and resistance of the highest temperature region, since temperature and resistance are corresponding, a relationship between resistance and temperature can be established. For example, based on the obtained temperature and resistance of the highest temperature region, a TR curve can be obtained with temperature as the horizontal axis and resistance as the vertical axis, where T is temperature and R is resistance. The TR curve can then be used as the correspondence between resistance and temperature.

[0081] In this embodiment, after determining the highest temperature region of the heating element, the temperature and resistance of the highest temperature region are obtained when the heating element is heated in the atomizing device. Based on the temperature and resistance of the highest temperature region, a correspondence between resistance and temperature is established. The temperature change of the highest temperature region of the heating element can accurately reflect the temperature change during the heating process. The highest temperature region of the heating element can characterize the highest temperature point on the surface of the heating element. Therefore, the correspondence between resistance and temperature obtained based on the highest temperature region of the heating element is more consistent with reality.

[0082] In one embodiment, such as Figure 3 As shown, step 202 includes steps 302 and 304.

[0083] Step 302: Heat the heating element before it is installed into the atomizing device.

[0084] Before being installed in the nebulizer, the heating element can be referred to as a bare heating element. When heating the heating element, the heating temperature and time can be referenced to the operating temperature and time of the nebulizer to make the obtained test data more consistent with reality.

[0085] Step 304: Detect the surface temperature of the heating element to obtain the highest temperature region.

[0086] Next, the surface temperature of the heating element is detected, specifically the temperature of different areas on the surface of the heating element. The temperatures of these different areas are then compared to determine the area with the highest temperature. Specifically, an infrared thermal imager can be used to capture the surface distribution of the heating element during the heating process before it is placed into the atomizing device, in order to determine the area with the highest temperature. The detection results are then sent to the control device.

[0087] In this embodiment, the heating element is heated before being installed into the atomizing device to determine the highest temperature range, which facilitates temperature detection and monitoring of temperature changes.

[0088] In one embodiment, the heating phase of the heating element within the atomizing device includes a temperature boosting phase, a cooling phase, and a temperature stabilization phase, such as... Figure 3 As shown, step 206 includes steps 306 to 310.

[0089] Step 306: Based on the temperature and resistance of the highest temperature region during the temperature-pressing stage, establish the correspondence between resistance and temperature during the temperature-pressing stage.

[0090] The temperature rise phase refers to the period after the atomizing device starts working or after the heating element receives a heating command, during which the temperature of the heating element increases. Depending on the type of atomizing device and its operating mode, the rate of temperature change and the target temperature reached during the temperature rise phase vary. For example, the target temperature can be 250 degrees Celsius. Because the temperature rise phase is similar to a preheating process, the rate of temperature change during this phase is relatively fast to better meet user needs.

[0091] When the heating element is in the temperature surge stage, the temperature and resistance of the highest temperature region are collected. Based on the collected temperature and resistance data, the correspondence between resistance and temperature in the temperature surge stage can be established.

[0092] Step 308: Based on the temperature and resistance of the highest temperature region during the cooling stage, establish the correspondence between resistance and temperature during the cooling stage.

[0093] The cooling phase refers to the stage where the temperature of the heating element decreases after the aerosol generated by the atomizing device is consumed. Generally, the rate of temperature change during the cooling phase is less than that during the heating phase. The cooling phase usually follows the heating phase.

[0094] When the heating element is in the cooling phase, the temperature and resistance of the highest temperature region are collected. Based on the collected temperature and resistance data, the correspondence between resistance and temperature during the cooling phase can be established.

[0095] Step 310: Based on the temperature and resistance of the highest temperature region during the steady-state phase, establish the correspondence between resistance and temperature during the steady-state phase.

[0096] The stabilization phase refers to the stage in which the temperature of the heating element remains within a relatively stable temperature range. The stabilization phase usually occurs after the cooling phase.

[0097] When the heating element is in the steady-temperature phase, the temperature and resistance of the highest temperature region are collected. Based on the collected temperature and resistance data, the correspondence between resistance and temperature in the steady-temperature phase can be established.

[0098] In this embodiment, the heating stage of the heating element in the atomizing device is subdivided into a temperature boosting stage, a temperature cooling stage, and a temperature stabilization stage. Different resistance-temperature correspondences are established in different heating stages, thereby making the established resistance-temperature correspondences more accurate.

[0099] In one embodiment, such as Figure 4 As shown, step 104 includes steps 404 and 406.

[0100] Step 404: Determine the heating stage of the heating element.

[0101] The heating phase of the heating element includes a temperature-increasing phase, a cooling phase, and a temperature-stabilizing phase. A heating cycle can be defined as the process of forming one temperature-increasing phase, one cooling phase, and one temperature-stabilizing phase. The temperature-increasing phase refers to the stage where the temperature of the heating element rises after the atomizing device starts working or after the heating element receives a heating command. The cooling phase refers to the stage where the temperature of the heating element decreases after the aerosol generated by the atomizing device is consumed. The temperature-stabilizing phase refers to the stage where the temperature of the heating element is maintained within a relatively stable temperature range. After the temperature-stabilizing phase, the temperature of the heating element begins to decrease until it falls below the preset lower limit of the temperature range, or until the preset standby time is reached, at which point the heating element resumes heating and enters the temperature-increasing phase. In this embodiment, to save on control procedures, the temperature decrease process between the temperature-stabilizing phase and the temperature-increasing phase is not considered.

[0102] There isn't a single way to determine the heating stage of a heating element. For example, different heating stages correspond to different operating times, and the heating stage can be determined based on the current operating time of the heating element. Generally, within a heating cycle, starting from the beginning of heating, the element is in a temperature-rushing stage for the first 20 seconds, a cooling stage for 20-45 seconds, and then a temperature-stabilizing stage. Therefore, the current operating time of the heating element can be obtained to determine its heating stage. For example, if the heating element's operating time is 10 seconds, it can be considered to be in the temperature-rushing stage. If the heating element's operating time is 30 seconds, it can be considered to be in the cooling stage.

[0103] It is understood that in other embodiments, the heating stage of the heating element can also be determined in other ways. For example, the temperature of the heating element can be detected, and the heating stage can be determined based on the temperature change of the heating element. Specifically, when a large increase in the temperature of the heating element is detected, it can be considered that the heating element is currently in the temperature surge stage. When a large decrease in the temperature of the heating element is detected, it can be considered that the heating element is currently in the cooling stage. When the temperature of the heating element is detected to fluctuate within a certain range, it can be considered that the heating element is currently in the temperature stabilization stage.

[0104] Step 406: Based on the relationship between resistance and temperature of the heating element at the heating stage, obtain the real-time temperature corresponding to the real-time resistance.

[0105] Different heating stages correspond to different resistance-temperature relationships. Therefore, after obtaining the real-time resistance of the heating element and determining the heating stage it is in, the real-time temperature corresponding to the real-time resistance at the current heating stage can be obtained based on the resistance-temperature relationship corresponding to the heating stage.

[0106] In this embodiment, the heating stage of the heating element is first determined, and then the real-time temperature corresponding to the real-time resistance is obtained according to the correspondence between the resistance and temperature of the heating stage of the heating element. This allows for obtaining a real-time temperature that is unique to the real-time resistance, thus avoiding control disorder.

[0107] In one embodiment, such as Figure 4 As shown, step 102 includes steps 402 and 403.

[0108] Step 402: Obtain the voltage and current of the heating element of the atomizing device.

[0109] Specifically, an oscilloscope can be used to detect the voltage and current of the heating element in the atomizing device. The oscilloscope is connected to the atomizing device and a control device. The oscilloscope can detect the voltage and current of the atomizing device, record the actual voltage and current changes, and send the detected data to the control device. Thus, the control device can obtain the voltage and current of the heating element in the atomizing device. It is understood that in other embodiments, other devices or detection methods can be used to obtain the voltage and current of the heating element in the atomizing device, as long as those skilled in the art believe it is feasible.

[0110] Step 403: Obtain the real-time resistance of the heating element based on the voltage and current.

[0111] After obtaining the voltage and current of the heating element, the real-time resistance of the heating element can be obtained based on Ohm's law.

[0112] In this embodiment, the real-time resistance of the heating element is obtained based on the voltage and current of the heating element of the atomizing device, which is simple to operate and easy to calculate.

[0113] To better understand the above embodiments, a detailed explanation is provided below with reference to a specific embodiment. In one embodiment, the process of establishing the preset correspondence between resistance and temperature includes: first, determining the feedback temperature of the heating element. Using an infrared thermal imager, the surface temperature distribution of the bare heating element (the heating element before being placed in the atomizing device) is captured to find the highest temperature region of the heating element during the heating process. The highest temperature region is generally the highest temperature point. A thermocouple is attached to the highest temperature point of the heating element, and the thermocouple is used to test the temperature change at the highest temperature point after the heating element is placed in the atomizing device. Simultaneously, an oscilloscope is used to record the actual voltage and current changes of the atomizing device, obtaining the temperature change curve at the highest temperature point and the resistance change curve of the heating element during the actual heating process. This ensures that the TR curve used for feedback control during the heating process matches the actual TR curve.

[0114] During the heating process of the atomizing device, the temperature rise curve first increases, then decreases, and then stabilizes. The heating element may exhibit multiple temperature distributions corresponding to the same maximum temperature, resulting in multiple resistance values ​​for the same temperature, or multiple temperatures for the same resistance value. To avoid this situation, which could lead to erratic temperature control, the resistance curve (TR) can be made monotonic. Therefore, the temperature change curve and the resistance change curve are divided into three stages according to the heating process of the atomizing device: 1. Temperature surge stage; 2. Temperature drop stage; 3. Temperature stabilization stage. The temperature change curve over time and the resistance change curve over time are then fitted into three TR curves with T as the horizontal axis and R as the vertical axis for each of the three stages, obtaining TR curves for three different stages. This avoids a non-monotonic TR curve and the resulting control erraticities.

[0115] The heating element's temperature rise curve is as follows: Figure 5 During the heating phase, the temperature is first rapidly increased to above 250℃. After the aerosol is consumed, the temperature begins to cool down, entering the cooling phase. Then, a stabilization phase begins, maintaining the temperature within a relatively stable range. Please refer to the resistance change curve during the heating process. Figure 6 During heating, the resistance generally changes with temperature, but the coefficient of change varies at different stages due to differences in the surface temperature distribution of the heating element, resulting in multiple resistances corresponding to a single temperature. The temperature versus time curve and the resistance versus time curve are combined into a single TR curve with temperature T on the horizontal axis and resistance R on the vertical axis, as shown below. Figure 7 In the 220℃-270℃ range, the resistance curve shows significant overlap, with multiple resistance values ​​corresponding to a single temperature. Dividing the TR curve into three segments according to different heating stages makes the TR curve a monotonic function. The TR curve during the temperature surge stage is shown below. Figure 8 The TR curve during the cooling phase is as follows: Figure 9 The TR curve during the steady-temperature phase is as follows: Figure 10 The TR curve is divided into three segments according to the heating process, thereby achieving precise temperature control.

[0116] In summary, the core elements of establishing a preset correspondence between resistance and temperature include: using an infrared thermal imager to locate the highest temperature point of the heating element; using the temperature of the highest temperature point to represent the feedback temperature of the heating element; using thermocouples to monitor the temperature change at the highest temperature point of the heating element; and using an oscilloscope to monitor the real-time voltage and current of the heating element, calculating the real-time resistance, and obtaining a TR curve that matches the actual situation. The heating process of the atomizing device is divided into three stages, and the temperature-time curve and the resistance-time curve are fitted into three TR curves with T as the horizontal axis and R as the vertical axis for each of the three stages, obtaining TR curves for three different stages. Temperature feedback control is performed for the three stages using different TR curves.

[0117] As shown in Figure 11 , the process of the heating element temperature control method of the atomization device includes: by detecting the voltage and current of the heating element, calculating the resistance value R of the heating element in real time, obtaining the temperature T of the heating element by looking up the table with the calculated resistance value R, comparing the temperature T of the heating element obtained by looking up the table with the design temperature T0. If T < T0, the power duty cycle is increased to raise the temperature. If T > T0, the power duty cycle is decreased to lower the temperature. Thus, during the heating process of the heating element, the situation where one temperature corresponds to multiple resistance values or one resistance value corresponds to multiple temperatures, resulting in temperature control disorder of the heating element, can be reduced, and the situation of control disorder can be avoided.

[0118] It should be understood that although the steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless there is a clear description in this article, the execution of these steps has no strict order limit, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be executed alternately or in turn with at least a part of other steps or steps or stages in other steps.

[0119] Based on the same inventive concept, an embodiment of the present application further provides a heating element temperature control device for an atomization device for implementing the heating element temperature control method of the atomization device involved above. The solution provided by this device to solve the problem is similar to the solution described in the above method. Therefore, the specific limitations in one or more embodiments of the heating element temperature control device for the atomization device provided below can refer to the limitations on the heating element temperature control method of the atomization device in the above text, and will not be repeated here.

[0120] In one embodiment, as shown in Figure 12 , a heating element temperature control device for an atomization device is provided, including: a resistance acquisition module 1210, a temperature acquisition module 1212, and a power adjustment module 1214, where:

[0121] The resistance acquisition module 1210 is configured to acquire the real-time resistance of the heating element of the atomization device;

[0122] The temperature acquisition module 1212 is configured to obtain the real-time temperature corresponding to the real-time resistance according to the preset correspondence between resistance and temperature; the correspondence between resistance and temperature is obtained based on the highest temperature region of the heating element;

[0123] The power adjustment module 1214 is used to adjust the working power of the heating element according to the relationship between the real-time temperature and the standard temperature.

[0124] In one embodiment, the heating element temperature control device of the atomizing device further includes a model building module. The model building module is used to determine the highest temperature region of the heating element, obtain the temperature and resistance of the highest temperature region when the heating element is heated in the atomizing device, and establish the correspondence between resistance and temperature based on the temperature and resistance of the highest temperature region.

[0125] In one embodiment, the model building module is also used to heat the heating element before it is installed in the atomizing device, detect the surface temperature of the heating element, and obtain the highest temperature region.

[0126] In one embodiment, the heating phase of the heating element in the atomizing device includes a temperature boosting phase, a cooling phase, and a temperature stabilization phase. The model building module is also used to establish the correspondence between resistance and temperature in the temperature boosting phase based on the temperature and resistance of the highest temperature region in the temperature boosting phase; to establish the correspondence between resistance and temperature in the cooling phase based on the temperature and resistance of the highest temperature region in the cooling phase; and to establish the correspondence between resistance and temperature in the temperature stabilization phase based on the temperature and resistance of the highest temperature region in the temperature stabilization phase.

[0127] In one embodiment, the temperature acquisition module is further used to determine the heating stage of the heating element and obtain the real-time temperature corresponding to the real-time resistance based on the correspondence between the resistance and temperature of the heating stage of the heating element.

[0128] In one embodiment, the resistance acquisition module is also used to acquire the voltage and current of the heating element of the atomizing device, and to obtain the real-time resistance of the heating element based on the voltage and current.

[0129] Each module in the heating element temperature control device of the aforementioned atomizing device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of a computer device in software form, so that the processor can call and execute the operations corresponding to each module.

[0130] In one embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as follows: Figure 13As shown, the computer device includes a processor, memory, input / output interface, communication interface, display unit, and input device. The processor, memory, and input / output interface are connected via a system bus, and the communication interface, display unit, and input device are also connected to the system bus via the input / output interface. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The input / output interface is used for exchanging information between the processor and external devices. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, mobile cellular networks, NFC (Near Field Communication), or other technologies. When executed by the processor, the computer program implements a method for controlling the temperature of the heating element in an atomizing device. The display unit is used to form a visually visible image and can be a display screen, a projection device, or a virtual reality imaging device. The display screen can be an LCD screen or an e-ink screen. The input device of the computer device can be a touch layer covering the display screen, or buttons, trackballs, or touchpads set on the casing of the computer device, or external keyboards, touchpads, or mice, etc.

[0131] Those skilled in the art will understand that Figure 13 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0132] In one embodiment, a computer device is also provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps in the above method embodiments.

[0133] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon that, when executed by a processor, implements the steps in the above method embodiments.

[0134] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps in the above method embodiments.

[0135] In one embodiment, an atomizing device is provided, including an atomizing apparatus and a control device, wherein the control device is used to control the temperature of the heating element of the atomizing apparatus according to the method described above.

[0136] In one embodiment, the atomizing device further includes a thermocouple disposed on the heating element and connected to a control device. The thermocouple can be positioned in the highest temperature region of the heating element. Thermocouple temperature measurement is accurate, allowing the detection of the temperature in the highest temperature region and transmission of this information to the control device. Based on the temperature detected by the thermocouple, the control device can establish a correlation between resistance and temperature.

[0137] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0138] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0139] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method of controlling the temperature of a heating element of an atomization device, the method comprising: determining a temperature of the heating element; and adjusting the temperature of the heating element based on the determined temperature. The method comprises: obtaining a real-time resistance of a heating body of an atomization device; obtaining a real-time temperature corresponding to the real-time resistance according to a preset resistance-temperature correspondence relationship; the resistance-temperature correspondence relationship is obtained based on a highest temperature region of the heating body; and independent resistance-temperature correspondence relationships are respectively established for three different heating stages, so that the resistance-temperature correspondence relationship of each heating stage is monotonic; adjusting a working power of the heating body according to a size relationship between the real-time temperature and a standard temperature.

2. The method of claim 1, wherein, The establishment process of the resistance-temperature correspondence relationship comprises: determining a highest temperature region of the heating body; obtaining a temperature and a resistance of the highest temperature region when the heating body is heated in the atomization device; establishing a resistance-temperature correspondence relationship according to the temperature and the resistance of the highest temperature region.

3. The method of claim 2, wherein, The determination of the highest temperature region of the heating body comprises: heating the heating body before the heating body is loaded into the atomization device; detecting a surface temperature of the heating body to obtain the highest temperature region.

4. The method of claim 2, wherein, The heating stages of the heating body when the heating body is heated in the atomization device comprise a temperature-rising stage, a temperature-reducing stage and a temperature-maintaining stage; and the establishment of the resistance-temperature correspondence relationship according to the temperature and the resistance of the highest temperature region comprises: establishing a resistance-temperature correspondence relationship of the temperature-rising stage according to the temperature and the resistance of the highest temperature region of the temperature-rising stage; establishing a resistance-temperature correspondence relationship of the temperature-reducing stage according to the temperature and the resistance of the highest temperature region of the temperature-reducing stage; establishing a resistance-temperature correspondence relationship of the temperature-maintaining stage according to the temperature and the resistance of the highest temperature region of the temperature-maintaining stage.

5. The method of claim 4, wherein, The obtaining of the real-time temperature corresponding to the real-time resistance according to the preset resistance-temperature correspondence relationship comprises: determining a heating stage in which the heating body is located; obtaining the real-time temperature corresponding to the real-time resistance according to the resistance-temperature correspondence relationship of the heating stage in which the heating body is located.

6. The method of claim 1, wherein, The obtaining of the real-time resistance of the heating body of the atomization device comprises: obtaining a voltage and a current of the heating body of the atomization device; obtaining the real-time resistance of the heating body according to the voltage and the current.

7. A temperature control device for the heating element of an atomizing device, characterized in that, The device comprises: a resistance obtaining module configured to obtain a real-time resistance of a heating body of an atomization device; a temperature obtaining module configured to obtain a real-time temperature corresponding to the real-time resistance according to a preset resistance-temperature correspondence relationship; the resistance-temperature correspondence relationship is obtained based on a highest temperature region of the heating body; and independent resistance-temperature correspondence relationships are respectively established for three different heating stages, so that the resistance-temperature correspondence relationship of each heating stage is monotonic; a power adjusting module configured to adjust a working power of the heating body according to a size relationship between the real-time temperature and a standard temperature.

8. A computer device comprising a memory and a processor, the memory storing a computer program, characterized in that, The processor executes the computer program to implement the steps of the method in any one of claims 1 to 6.

9. A computer-readable storage medium having stored thereon a computer program, characterized in that, The computer program is executed by the processor to implement the steps of the method in any one of claims 1 to 6.

10. A computer program product comprising a computer program, characterized in that, The computer program is executed by the processor to implement the steps of the method in any one of claims 1 to 6.

11. An atomising device characterised in that, The aerosol-generating device comprises an atomizing device and a control device for controlling the temperature of a heating element of the atomizing device according to the method of any one of claims 1 to 6.

12. The atomizing device of claim 11, wherein, The aerosol-generating device further comprises a thermocouple disposed on the heating element and connected to the control device.

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