A solder joint enhanced wire bonding apparatus

Abstract

The application discloses a kind of welding spot reinforced wire bonding equipment, including welding wire, glue dispensing, laser station, the welding wire machine further includes feeding mechanism;Wherein, the feeding mechanism includes solenoid, upper suction disc, lower suction disc and upper clamp arm and lower clamp arm, wherein, solenoid is respectively provided with upper suction disc and lower suction disc above and below, simultaneously, solenoid is provided with upper clamp arm and lower clamp arm on one side;Upper suction disc, lower suction disc respectively drive upper clamp arm and lower clamp arm to material clamping conveying, it is convenient for the accurate conveying of material;Upper clamp arm is provided with upper clamp jaw, corresponding lower clamp jaw is provided on lower clamp arm, and upper clamp jaw and lower clamp jaw jaw correspond, to form the structural features of clamping, it is convenient for material clamping.The present application realizes the full-automatic assembly line operation of feeding, welding wire, glue dispensing, laser, simultaneously simplifies equipment structure, reduces the equipment outline size, reduces the equipment material cost, and greatly improves production efficiency.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor welding equipment technology, and specifically relates to a solder joint enhancement wire bonding device for wire bonding. Background Technology

[0002] Wire bonding machines can be divided into gold wire ball wire bonding machines and aluminum wire wire bonding machines. The gold wire can be gold wire, copper wire, silver wire or alloy wire. They are mainly used for internal wire bonding of high-power devices, diodes (LEDs), laser tubes (lasers), small and medium power transistors, integrated circuits and some special semiconductor devices.

[0003] For example, patent application 202210426129.3 discloses a wire bonding mechanism for welded parts, including a base frame, a platform and a wire bonding device mounted on top of the base frame. The bottom surface of the platform is flush with the bottom surface of the wire bonding device, and the ends of the platform correspond to the inner surfaces of the wire bonding device. A tray is mounted on top of the platform, and a tube shell mounted on top of the tray corresponds to and matches the positioning device of the wire bonding device. This patent application utilizes the 2D vision positioning accuracy of a camera, but it requires image data for each different welded part, resulting in low recognition accuracy. Furthermore, it requires a tray to hold and position the welded parts, which is not conducive to automated production.

[0004] For example, patent application 202211043932.5 discloses an automatic resistor clamping and feeding device for an automatic LED wire bonding machine, including a drive box. A lower rack and an upper rack are slidably connected within the drive box, and a gear that meshes with both the lower and upper racks is also rotatably connected within the drive box. A lower clamping plate is fixedly connected to the lower rack, and an upper clamping plate is fixedly connected to the side wall of the upper rack. A V-shaped plate is fixedly connected to the lower end of the upper clamping plate, and a V-shaped groove is formed at the upper end of the lower clamping plate. The V-shaped plate is slidably disposed within the V-shaped groove, and a transverse sliding groove is formed on the inner wall of the V-shaped groove. This patent application uses a pushing mechanism to move a horizontal rod into a lifting groove when the V-shape and V-shaped groove engage. However, the specific V-shape and V-shaped groove structure limits its application and cannot be well applied to the welding production of most semiconductor devices.

[0005] In summary, existing automated equipment mainly uses conveyor belts or racks to transport materials, which makes it difficult to accurately measure the material transport position, requiring auxiliary devices for positioning, affecting processing efficiency and increasing processing costs. Summary of the Invention

[0006] Therefore, the primary objective of this invention is to provide a solder joint enhancement wire bonding device. This wire bonding machine feeds materials by clamping, which facilitates accurate material feeding and enables fully automated production line operation. It reduces manpower and material resources while meeting the reliability requirements of material welding processes.

[0007] Another objective of this invention is to provide a solder joint enhancement wire bonding apparatus that simplifies the equipment structure, reduces the equipment size, lowers the equipment material cost, and greatly improves production efficiency.

[0008] To achieve the above objectives, the technical solution of the present invention is as follows:

[0009] A solder joint enhancement wire bonding device includes a wire bonding station, an adhesive dispensing station, and a laser station, characterized in that the wire bonding machine further includes a feeding mechanism;

[0010] The feeding mechanism includes a solenoid, an upper suction cup, a lower suction cup, an upper clamping arm, and a lower clamping arm. The upper suction cup and the lower suction cup are respectively located above and below the solenoid, and the upper clamping arm and the lower clamping arm are located on one side of the solenoid. The upper suction cup and the lower suction cup drive the upper clamping arm and the lower clamping arm to clamp and convey the material, which facilitates the accurate conveying of the material.

[0011] The upper clamping arm is provided with an upper clamping claw, and the lower clamping arm is provided with a corresponding lower clamping claw. The upper and lower clamping claws correspond to each other to form a clamping structure, which facilitates the clamping of materials.

[0012] Furthermore, the upper or lower jaw has a protruding, downward-extending clamping surface.

[0013] Furthermore, the clamping surface has protrusions and a wavy contact surface to facilitate stable clamping of materials.

[0014] Once the material is clamped to a specific position, the solenoid is de-energized, and the upper and lower suction cups no longer have suction force, causing the upper and lower clamping arms to release, thereby loosening the clamping of the material.

[0015] The lower suction cup has a return spring to reset it when the solenoid is de-energized.

[0016] Furthermore, support platforms are installed in the wire bonding station, dispensing station, and laser station to support materials for processing.

[0017] Furthermore, the bearing platform includes a pressure plate, pressure plate arms, a support frame, and a cam bearing. The pressure plate is used to place the material to be processed. The pressure plate is supported on both sides by the pressure plate arms, which are in turn supported by the support frame. At the same time, a cam bearing is provided at the bottom of the support frame to adjust the position of the bearing platform.

[0018] Furthermore, the wire bonding station includes a base, a bonding head structure, and a transverse drive device and a longitudinal drive device; wherein:

[0019] The lateral drive device includes a lateral guide rail and a lateral motor located at the bottom of the head structure. The longitudinal drive device includes a longitudinal guide rail and a longitudinal motor located at the rear end of the head structure. The head structure is slidably connected to the longitudinal motor mover via the lateral guide rail, and the head structure is also slidably connected to the lateral motor mover via the longitudinal guide rail. Both the lateral motor and the longitudinal motor are mounted on the top surface of the base and are driven by the head structure.

[0020] Furthermore, the front ends of both sides of the base are provided with cooling fans to dissipate heat from the horizontal motor, and the rear end of the base is provided with a cooling fan to dissipate heat from the vertical motor.

[0021] Furthermore, the base has a T-shaped structure, and the top surface of the base wing is hollowed out. A horizontal motor is installed in the hollowed-out area. The top of the horizontal motor actuator has a shank structure, and the vertical motor is installed on the top surface of the base belly.

[0022] Furthermore, the head structure includes a movable base and a head body. The movable base has a head body at its front end, and the head body has a transducer and a wire clamp at its front end. The wire clamp is located above the transducer, and the transducer has a chopping blade at its front end. The movable base also has a voice coil motor for driving the head body to rotate in the vertical direction, thereby changing the height position of the chopping blade.

[0023] The voice coil motor includes a mover with an internal coil and a stator with internal magnets; the mover is connected to the rear end of the main body of the head, and there are two stators, which are located on both sides of the mover; the stator is provided with a gas pipe connector for cooling the mover.

[0024] Furthermore, the head structure also includes a spring plate assembly. The mover is connected to the rear end of the head body via the spring plate assembly. The spring plate assembly includes two spring plates, which are perpendicular to each other. There are two spring plate assemblies, located on opposite sides of the front end of the mover.

[0025] Furthermore, the bonding head structure also includes a mounting base, which is fixed to the top of the movable base and located above the wire clamp. The top of the mounting base is equipped with a vision component whose imaging focus is located at the product to be welded, and the front end of the mounting base is provided with a side light source for illuminating the product to be welded, located on one side above the cleaver.

[0026] Furthermore, the vision component is typically implemented using an industrial camera, and the mounting base is provided with an optical channel coaxial with the detection end of the industrial camera at the position corresponding to the detection end of the industrial camera.

[0027] The main functions of this equipment are wire bonding, dispensing, and laser processing. The entire operation process is as follows: the feeding mechanism delivers material to the first working area of ​​the wire bonding station. An optical mechanism identifies the material and performs the wire bonding process according to a pre-programmed sequence. After the wire bonding process is completed, the feeding mechanism delivers material to the second working area of ​​the dispensing station. An optical mechanism identifies the gold wire bonding joints at the second welding station, and a motion assembly moves the dispensing valve above the bonding joints to perform the dispensing process.

[0028] After the dispensing process is completed, the feeding mechanism delivers the material to the working area of ​​the galvanometer laser module. The galvanometer laser optical mechanism identifies the adhesive applied above the gold wire bonding station. The galvanometer laser emits a laser beam that irradiates the adhesive, heating and curing it.

[0029] Therefore, compared with the prior art, the beneficial effects of the present invention are:

[0030] This invention realizes a fully automated production line operation for feeding, wire bonding, dispensing, and laser processing. While meeting the reliability requirements of material welding processes, it reduces manpower and material resources. At the same time, this design simplifies the equipment structure, reduces the equipment size, lowers equipment material costs, and greatly improves production efficiency. Attached Figure Description

[0031] Figure 1 This is the front view of the implementation of this invention.

[0032] Figure 2 This is a top view of the implementation of this invention.

[0033] Figure 3 This is an exploded view of the feeding mechanism implemented in this invention.

[0034] Figure 4 This is a schematic diagram of the upper gripper structure implemented in this invention.

[0035] Figure 5 This is a schematic diagram of the support platform structure implemented in this invention.

[0036] Figure 6 This is a schematic diagram of the wire bonding structure provided by the present invention.

[0037] Figure 7 This is an assembly diagram of the head body and voice coil motor provided by the present invention.

[0038] Figure 8 This is an exploded view of the head body and voice coil motor provided by the present invention. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0040] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "lateral", "longitudinal", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0041] Figure 1 , Figure 2 As shown, the solder joint enhancement wire bonding equipment implemented by the present invention includes a wire bonding station 100, a dispensing station 200, and a laser station 300. A feeding mechanism 400 is also provided between each station. The feeding mechanism 400 is used to transport materials to realize wire bonding (ultrasonic thermocompression welding), dispensing and laser functions.

[0042] The wire bonding station 100, glue dispensing station 200, and laser station 300 are all horizontally set on the workbench to facilitate sequential assembly line operation. Each of the wire bonding station 100, glue dispensing station 200, and laser station 300 is equipped with a support platform 500 to support materials for processing.

[0043] The wire bonding station 100, the dispensing station 200, and the laser station 300 can all be implemented using existing technologies. Therefore, the specific structures of these stations will not be described in detail here. The description will focus solely on the core components of this invention: the feeding mechanism 400, the support platform 500, and the wire bonding structure.

[0044] Specifically, combining Figure 3 , Figure 4 As shown, the feeding mechanism 400 includes a solenoid 402, an upper suction cup 401, a lower suction cup 404, an upper clamping arm 405, and a lower clamping arm 406. The upper suction cup 401 and the lower suction cup 404 are respectively arranged above and below the solenoid 402. At the same time, the upper clamping arm 405 and the lower clamping arm 406 are arranged on one side of the solenoid 402. The upper suction cup 401 and the lower suction cup 404 drive the upper clamping arm 405 and the lower clamping arm 406 to clamp and convey the material, which facilitates the accurate conveying of the material.

[0045] The upper clamping arm 405 is provided with an upper clamping jaw 408, and the lower clamping arm 406 is provided with a corresponding lower clamping jaw 409. The upper clamping jaw 408 and the lower clamping jaw 409 are aligned to form a clamping structure, which facilitates the clamping of materials.

[0046] A solenoid sleeve 403 is provided on the outside of the solenoid 402 to protect and install the solenoid 402. At the same time, a mounting bracket 410 is provided on the outside of the solenoid sleeve 403, through which the upper clamping arm 405 and the lower clamping arm 406 are assembled.

[0047] Combination Figure 4 As shown, the upper jaw 408 has a protruding downward-extending clamping surface 412 at its front end. At the same time, the clamping surface 412 has a wavy contact surface 413 (which can also be achieved by protrusions) to facilitate stable clamping of materials.

[0048] In this way, after the feeding mechanism 400 clamps the material to a specific position, the solenoid 402 is de-energized, and the upper suction cup 401 and lower suction cup 404 no longer have suction force, causing the upper clamping arm 405 and lower clamping arm 406 to loosen, thereby relaxing the clamping of the material to facilitate wire bonding, glue dispensing and laser processing of the material.

[0049] The lower suction cup 404 has a return spring 411 on its side to reset when the solenoid 402 is de-energized.

[0050] Combination Figure 5 As shown, the support platform 500 includes a pressure plate 501, pressure plate arms 502, a support frame 503, and a cam bearing 504. The pressure plate 501 is used to place the material to be processed. The pressure plate 501 has pressure plate arms 502 on both sides, which support the pressure plate 501 from the sides. Furthermore, the bottom of the pressure plate arms 502 is provided with a support frame 503, which supports the pressure plate arms 502. At the same time, the bottom of the support frame 503 is provided with a cam bearing 504, which allows the position of the support platform 500 to be adjusted.

[0051] like Figure 6 As shown, the wire bonding structure implemented by the present invention includes a base 1, a bonding head structure 2, and further includes a transverse driving device 3 and a longitudinal driving device 4; wherein,

[0052] The transverse drive device 3 includes a transverse guide rail 31 and a transverse motor 32 located at the bottom of the head structure 2. The longitudinal drive device 4 includes a longitudinal guide rail 41 and a longitudinal motor 42 located at the rear end of the head structure 2. The head structure 2 is slidably connected to the mover of the longitudinal motor 42 via the transverse guide rail 31, and the head structure 2 is also slidably connected to the mover of the transverse motor 32 via the longitudinal guide rail 41. Both the transverse motor 32 and the longitudinal motor 42 are mounted on the top surface of the base 1 and are drivenly connected to the head structure 2.

[0053] In use, the transverse motor 32 can move laterally to drive the longitudinal guide rail 41 to move laterally, and the longitudinal guide rail 41 can move the head structure 2 laterally, so that the head structure 2 and the transverse guide rail 31 can be movably engaged. Alternatively, the longitudinal motor 42 can move longitudinally to drive the transverse guide rail 31 to move laterally, and the transverse guide rail 31 can move the head structure 2 longitudinally, so that the head structure 2 and the longitudinal guide rail 41 can be movably engaged.

[0054] Specifically, the base 1 has a T-shaped structure, and the top surface of the wing of the base 1 is hollowed out. A horizontal motor 32 is installed in the hollowed-out area. The top of the motor 32 has a head structure 2, and the vertical motor 42 is installed on the top surface of the belly of the base 1.

[0055] This configuration, where the transverse motor 32 drives the head structure 2 to move laterally while the longitudinal motor 42 does not move laterally, and vice versa, solves the technical problem in the prior art where two drive devices are independent of each other, causing the drive motor mover in one drive device to move laterally with the head structure body, which in turn requires a larger width for the drive motor stator to allow for the lateral movement of the drive motor mover, resulting in a larger overall device size.

[0056] In some embodiments, the horizontal motor 32 and the vertical motor 42 can also be linear motors. In this case, the stator of the horizontal motor 32 and the vertical motor 42 is equivalent to a track, and the mover of the horizontal motor 32 and the vertical motor 42 is equivalent to the motor body moving along the corresponding track. In this case, the track can be fixedly installed on the base 1. This is the prior art and will not be described in detail here.

[0057] To ensure the operating temperature of the horizontal motor 32 and the vertical motor 42, cooling fans 5 for cooling the horizontal motor 32 are provided at the front of both sides of the base 1, and cooling fans 5 for cooling the vertical motor 42 are provided at the rear of the base 1. As needed, ventilation structures are provided at the positions of the cooling fans 5 and the corresponding horizontal motor 32 and vertical motor 42 on the base 1. In use, the airflow generated by the cooling fans 5 is blown towards the horizontal motor 32 and the vertical motor 42 through the ventilation structures, thereby improving the heat dissipation efficiency of the horizontal motor 32 and the vertical motor 42.

[0058] The base 1 has a cover on the top surface of the longitudinal motor 42 and the hollowed-out position. The outer end face and top face of the cover are equipped with cooling fans 5.

[0059] The transverse motor 32 and the longitudinal motor 42 can be implemented using voice coil motors. However, the above-described implementation of the present invention eliminates the need for the longitudinal motor 42 to move laterally, thereby reducing the width of the longitudinal motor 42 stator and consequently reducing the width of the longitudinal drive device 4. This eliminates the need to consider the space required for the longitudinal motor 42 to move laterally, as is the need to consider the change in the magnetic field of the longitudinal motor 42 after the longitudinal motor 42 moves laterally.

[0060] Both the stator of the horizontal motor 32 and the vertical motor 42 are equipped with cooling fans 5 to dissipate heat from the moving parts of the horizontal motor 32 and the vertical motor 42.

[0061] To improve the accuracy of the movement of the head structure 2, the transverse motor 32 is equipped with longitudinal guide rails 41 on both sides of the head structure 2. That is, two longitudinal guide rails 41 are provided at intervals and parallel to each other. The head structure 2 ensures the accuracy of its longitudinal movement through the joint action of the two longitudinal guide rails 41.

[0062] Specifically, a sliding plate is installed on the top of the transverse motor 32. Both sides of the sliding plate are provided with longitudinal guide rails 41 that are longitudinally slidably connected to the head structure 2. This arrangement can better install and fix the longitudinal guide rails 41.

[0063] To further improve the accuracy of the movement of the head structure 2, the base 1 is equipped with a guide structure that is parallel to the transverse guide rail 31 at intervals, so that the head structure 2 slides laterally on the base 1 through the guide structure; as needed, to further improve the accuracy of the movement of the head structure 2, both the transverse guide rail 31 and the longitudinal guide rail 41 are cross roller guides.

[0064] Combination Figure 7-8 As shown, the head assembly structure 2 includes a movable base 21 and a head assembly body 22. The head assembly body 22 is located at the front end of the movable base 21. A transducer 23 and a wire clamp 24 are located at the front end of the head assembly body 22. The wire clamp 24 is located above the transducer 23. A chopping blade 25 is located at the front end of the transducer 23. The movable base 21 is also equipped with a voice coil motor 26. The voice coil motor 26 is used to drive the head assembly body 22 to rotate in the vertical direction, thereby driving the chopping blade 25 to rotate in the vertical direction, thus changing the height position of the chopping blade 25.

[0065] The voice coil motor 26 includes a mover 261 with a coil inside and a stator 262 with magnets inside. The mover 261 is connected to the rear end of the main body 22. There are two stators 262, which are located on both sides of the mover 261. The stator 262 is provided with a gas pipe connector 263 for cooling the mover 261. Specifically, the gas pipe connector 263 is connected to a gas source.

[0066] like Figure 7-8As shown, the head structure 2 also includes a spring plate assembly 27. The mover 261 is connected to the rear end of the head body 22 through the spring plate assembly 27. The spring plate assembly 27 includes two spring plates, and the two spring plates are perpendicular to each other. Specifically, one of the two spring plates is set vertically and the other is set horizontally. At this time, the rotation center axis of the head body 22 is collinear with the corresponding intersection line of the two spring plates.

[0067] There are two spring clip assemblies 27, which are located on both sides of the front end of the mover 261. Specifically, the intersecting lines in the two spring clip assemblies 27 are collinear.

[0068] To ensure the accuracy of the welding position of the welding wire structure, the bonding head structure 2 also includes a mounting base 28. The mounting base 28 is fixed to the top of the movable base 21 and is located above the wire clamp 24. A vision component 29 with the imaging focus located at the product to be welded is installed on the top of the mounting base 28. A side light source 210 for illuminating the product to be welded is provided at the front end of the mounting base 28, which is located on one side above the cutting blade 25.

[0069] In use, the product to be welded can be illuminated by the side light source 210 to ensure that the vision component 29 can capture a clearer real-time image of the product to be welded. Then, the position of the captured product is compared with the position of the cutting blade 25, so that the bonding head structure 2 can be adjusted by controlling the horizontal motor 32 or the vertical motor 42 to improve the quality of the welding wire.

[0070] The vision component 29 includes an industrial camera. The mounting base 28 is provided with an optical channel coaxial with the detection end of the industrial camera. The detection end of the industrial camera is set horizontally. The front end of the optical channel has a downward bend, and a 45-degree reflector is provided at the bend of the optical channel to ensure that the imaging focus of the industrial camera is on the product to be welded.

[0071] The main functions of this equipment are wire bonding, dispensing, and laser processing. The entire operation process is as follows: the feeding mechanism delivers material to the first working area of ​​the wire bonding station. An optical mechanism identifies the material and performs the wire bonding process according to a pre-programmed sequence. After the wire bonding process is completed, the feeding mechanism delivers material to the second working area of ​​the dispensing station. An optical mechanism identifies the gold wire bonding joints at the second welding station, and a motion assembly moves the dispensing valve above the bonding joints to perform the dispensing process.

[0072] After the dispensing process is completed, the feeding mechanism delivers the material to the working area of ​​the galvanometer laser module. The galvanometer laser optical mechanism identifies the adhesive applied above the gold wire bonding station. The galvanometer laser emits a laser beam that irradiates the adhesive, heating and curing it.

[0073] Among them, dispensing is performed using a dispensing machine. When the dispensing head moves along the X, Y, and Z axes, it is allowed to move above the fixed material and apply the adhesive to the material in small dots.

[0074] To ensure the quality of the bonding points, the pressure plate must ensure that the material is in the locked position and remains absolutely parallel to the X and Y axes.

[0075] Laser technology primarily involves heating and curing the colloid by irradiating it with a laser beam. First, a galvanometer laser optical mechanism identifies the material, specifically the colloid applied above the gold wire bonding station. Then, the galvanometer laser emits a laser beam that irradiates the colloid, heating and curing it.

[0076] Note: Conventional wire bonding processes are used. Common wire specifications range from 0.7 to 1.7 mil. The normal width of the fishtail is 2.5 to 4 times the wire diameter. The ball's specifications range from 2.5 to 4 times the wire diameter. Bonding marks must not be less than 2 / 3 of the bonding area, and there must be no incomplete solder joints or detachments.

[0077] Currently, in the semiconductor wire bonding machine field, the reliability pull force of two-way bonding of 1.7mil wire is generally around 8g. Current reinforcement processes often use adding balls first or later, and the reliability push force of two-way bonding can reach 80g, but it still cannot meet the needs of fields with higher reliability requirements.

[0078] This invention addresses the issue of insufficient push force for reliable two-way welding in the current market by employing a more reliable dispensing process. The adhesive is precisely applied to the surface of the two-way welding, bonding the adhesive to the pads. After the adhesive cures, the connection between the two-way welding is greatly improved, thus meeting the requirements for higher reliability.

[0079] Adding the dispensing process introduces another problem: the curing time is relatively long and the process is cumbersome. Currently, the common method is baking and sintering curing. Silver paste typically cures at 150℃ for 2 hours, which can be adjusted to 170℃ for 1 hour depending on the specific situation. Insulating adhesives generally cure at 150℃ for 1 hour. This necessitates adding a new baking stage to cure the adhesive, increasing both the time required and the manpower and resources needed.

[0080] This invention addresses the problems of long curing times and increased manpower and material resources required for colloid curing by achieving a fully automated, novel colloid curing process. Employing laser curing, a laser generator emits a laser beam to cure the colloid in approximately 300ms, thus solving both the long curing time issue and eliminating the need for additional manpower and material resources associated with baking curing.

[0081] In summary, this invention utilizes a feeding mechanism to achieve fully automated production line operations for wire bonding, dispensing, and laser processing. While ensuring the reliability of material welding processes, it reduces manpower and material resources. At the same time, this design simplifies the equipment structure, reduces the equipment's external dimensions, lowers equipment material costs, and significantly improves production efficiency.

[0082] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A solder joint enhanced wire bonding device, comprising a wire bonding station, a dispensing station, and a laser station, characterized in that... The wire bonding station also includes a feeding mechanism; The feeding mechanism includes a solenoid, an upper suction cup, a lower suction cup, an upper clamping arm, and a lower clamping arm. The upper suction cup and the lower suction cup are respectively located above and below the solenoid, and the upper clamping arm and the lower clamping arm are located on one side of the solenoid. The upper suction cup and the lower suction cup drive the upper clamping arm and the lower clamping arm to clamp and convey the material. The upper clamping arm is provided with an upper clamping jaw, and the lower clamping arm is provided with a corresponding lower clamping jaw. The upper and lower clamping jaws correspond to each other, which facilitates the clamping of materials.

2. The solder joint enhanced wire bonding device as described in claim 1, characterized in that... The upper or lower gripper has a protruding, downward-extending gripping surface.

3. The solder joint enhanced wire bonding apparatus as described in claim 2, characterized in that... The clamping surface has protrusions and a wavy contact surface to facilitate stable clamping of materials.

4. The solder joint enhanced wire bonding device as described in claim 1, characterized in that... The lower suction cup has a return spring to reset it when the solenoid is de-energized.

5. The solder joint enhanced wire bonding apparatus as described in claim 1, characterized in that... Each of the wire bonding station, dispensing station, and laser station is equipped with a support platform to support materials for processing.

6. The solder joint enhanced wire bonding apparatus as described in claim 5, characterized in that... The bearing platform includes a pressure plate, pressure plate arms, a support frame, and a cam bearing. The pressure plate is used to place the material to be processed. The pressure plate is supported on both sides by the pressure plate arms, which are in turn supported by the support frame. A cam bearing is provided at the bottom of the support frame to adjust the position of the bearing platform.

7. The solder joint enhanced wire bonding apparatus as described in claim 1, characterized in that... The wire bonding station includes a base, a bonding head structure, and a horizontal drive device and a vertical drive device; wherein: The lateral drive device includes a lateral guide rail and a lateral motor located at the bottom of the head structure. The longitudinal drive device includes a longitudinal guide rail and a longitudinal motor located at the rear end of the head structure. The head structure is slidably connected to the mover of the longitudinal motor via the lateral guide rail, and the head structure is slidably connected to the mover of the lateral motor via the longitudinal guide rail. Both the lateral motor and the longitudinal motor are mounted on the top surface of the base and are drivenly connected to the head structure.

8. The solder joint enhanced wire bonding apparatus as described in claim 7, characterized in that... The front ends of both sides of the base are provided with cooling fans to dissipate heat from the horizontal motor, and the rear end of the base is provided with a cooling fan to dissipate heat from the vertical motor. The base has a T-shaped structure, and the top surface of the base wing is hollowed out. A horizontal motor is installed in the hollowed-out part. The top of the horizontal motor actuator has a shank structure. The vertical motor is installed on the top surface of the base belly.

9. The solder joint enhanced wire bonding apparatus as described in claim 8, characterized in that... The head assembly structure includes a movable base and a head assembly body. The movable base has a head assembly body at its front end, and the head assembly body has a transducer and a wire clamp at its front end. The wire clamp is located above the transducer, and the transducer has a chopping blade at its front end. The movable base also has a voice coil motor for driving the head assembly body to rotate in the vertical direction, thereby changing the height position of the chopping blade. The voice coil motor includes a mover with an internal coil and a stator with internal magnets; the mover is connected to the rear end of the main body of the head, and there are two stators, which are located on both sides of the mover; the stator is provided with a gas pipe connector for cooling the mover.

10. The solder joint enhanced wire bonding apparatus as described in claim 9, characterized in that... The head structure also includes a spring plate assembly. The mover is connected to the rear end of the head body through the spring plate assembly. The spring plate assembly includes two spring plates, which are perpendicular to each other. There are two spring plate assemblies, which are located on both sides of the front end of the mover.

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