Electronic device

Abstract

The present invention relates to an electronic device, comprising a substrate, a sensor, a wall structure, a pressurizing component, and a barrier structure. The substrate has a carrying surface. The sensor is disposed on the carrying surface. The wall structure is disposed on the carrying surface and surrounds the sensor. The pressurizing component is disposed on the wall structure. The pressurizing component, the wall structure, and the substrate collectively form a chamber, and the pressurizing component includes a mass and a diaphragm. The barrier structure is disposed between the pressurizing component and the wall structure and extends into the chamber. The barrier structure has at least one opening extending through the barrier structure.

Description

Technical Field

[0001] This invention relates to a device, and more particularly to an electronic device. Background Technology

[0002] Currently, due to the design requirements of electronic devices, sensors and pressurization components are often integrated together. Therefore, when the pressurization component vibrates, it may impact the sensor, causing damage. Thus, preventing the pressurization component from impacting the sensor during vibration is a significant challenge. Summary of the Invention

[0003] Therefore, it is necessary to provide an electronic device that can prevent the sensor from being damaged and the electronic device from malfunctioning due to excessive vibration of the pressurizing component when subjected to strong external impact.

[0004] An electronic device according to the present invention includes a substrate, a sensor, a partition structure, a pressurizing component, and a blocking structure. The substrate has a bearing surface. The sensor is disposed on the bearing surface. The partition structure is disposed on the bearing surface and surrounds the sensor. The pressurizing component is disposed on the partition structure. The pressurizing component, the partition structure, and the substrate together form a cavity, and the pressurizing component includes a mass block and a diaphragm. The blocking structure is disposed between the pressurizing component and the partition structure and extends into the cavity. The blocking structure has at least one opening penetrating through it.

[0005] In one embodiment, the blocking structure is disposed between the pressurizing component and the sensor, and forms at least one gap with each of the pressurizing component and the sensor.

[0006] In one embodiment, the shortest distance between the blocking structure and the pressurizing component is less than the shortest distance between the blocking structure and the sensor.

[0007] In one embodiment, both the mass block and the at least one opening are rectangular in shape.

[0008] In one embodiment, the length of the at least one opening is greater than the length of the mass block.

[0009] In one embodiment, the partition structure is made of a different material than the barrier structure, and the barrier structure is sandwiched between the partition structure and the pressurizing assembly.

[0010] In one embodiment, the partition structure is made of the same material as the barrier structure, and the partition structure and the barrier structure are integrally formed.

[0011] In one embodiment, the at least one opening is located on the mass block.

[0012] In one embodiment, the mass block, the at least one opening, and the sensor at least partially overlap.

[0013] In one embodiment, the width of the at least one opening is smaller than the width of the mass block.

[0014] In one embodiment, the blocking structure includes an anti-adhesion protrusion extending toward the diaphragm and a support portion connected to the anti-adhesion protrusion.

[0015] In one embodiment, the anti-adhesion protrusion is located on the diaphragm.

[0016] In one embodiment, the anti-adhesion protrusion surrounds the periphery of the support portion and is disposed along the periphery of the at least one opening.

[0017] In one embodiment, the at least one opening is a plurality of openings.

[0018] In one embodiment, the electronic device further includes a tuning layer disposed on the surface of the blocking structure near the sensor.

[0019] In one embodiment, the tuning layer corresponds to the at least one opening.

[0020] Based on the above, the electronic device of the present invention incorporates a blocking structure, which is placed between the pressurizing component and the partition structure and extends into the cavity containing the sensor. In this way, the blocking structure restricts the over-displacement of the pressurizing component. Since the blocking structure has at least one opening penetrating through it, the presence of the blocking structure does not affect the air conduction of the electronic device to the sensor. Therefore, in addition to adjusting the product performance through the inventive structure, the electronic device of the present invention can also avoid the situation where the pressurizing component vibrates excessively when subjected to external strong impact, causing the sensor to be damaged and the electronic device to malfunction. Attached Figure Description

[0021] Figure 1A This is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present invention.

[0022] Figure 1B yes Figure 1A A top-down view.

[0023] Figure 2 This is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention.

[0024] Figure 3 This is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention.

[0025] Figure 4 This is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention.

[0026] Figure 5 This is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention.

[0027] Figure 6 This is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention.

[0028] Figure 7 This is a cross-sectional schematic diagram of an electronic device according to yet another embodiment of the present invention.

[0029] Figure 8 This is a cross-sectional schematic diagram of an electronic device according to yet another embodiment of the present invention.

[0030] Figure label:

[0031] 10: Fixing ring

[0032] 100, 200, 300, 400, 500, 600, 700, 800: Electronic devices

[0033] 110, 160: substrate

[0034] 110t: Bearing surface

[0035] 110b: Surface

[0036] 112: Through hole

[0037] 120: Sensor

[0038] 122: Processing chips

[0039] 124: Sensing chip

[0040] 126: Wire bonding

[0041] 128: Insulation layer

[0042] 130: Partition wall structure

[0043] 140: Pressurization component

[0044] 142: Mass Block

[0045] 142L, 152L: Length

[0046] 142W, 152W, 250W, 352W: Width

[0047] 144: Diaphragm

[0048] 150, 250, 350, 450: Barrier Structure

[0049] 152, 252, 452, 504: Opening

[0050] 170, 190: Conductive parts

[0051] 180: Outer shell

[0052] 182: Vent

[0053] 250a, 350a: Anti-adhesion protrusions

[0054] 250b, 350b: Support section

[0055] 502, 602, 702, 802: Tuning layers

[0056] C: Chamber

[0057] L1, L2: Spacing Detailed Implementation

[0058] The directional terms used in this article (e.g., up, down, right, left, front, back, top, bottom) are used for reference only and are not intended to imply absolute orientation.

[0059] The invention is described more fully with reference to the drawings of this embodiment. However, the invention may be embodied in various different forms and should not be limited to the embodiments described herein. The thickness, dimensions, or size of layers or regions in the drawings are enlarged for clarity. The same or similar reference numerals denote the same or similar elements, which will not be described again in the following paragraphs.

[0060] Figure 1A This is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present invention. Figure 1B yes Figure 1A A top-down view.

[0061] Please refer to Figure 1A , Figure 1B The electronic device 100 of this embodiment includes at least a substrate 110, a sensor 120, a partition structure 130, a pressurizing assembly 140, and a blocking structure 150. Further, the substrate 110 has a bearing surface 110t, the sensor 120 and the partition structure 130 are disposed on the bearing surface 110t, and the partition structure 130 surrounds the sensor 120. In addition, the pressurizing assembly 140 is disposed on the partition structure 130, and the pressurizing assembly 140, the partition structure 130, and the substrate 110 together form a chamber C, so the sensor 120 can be located within the chamber C. Here, the pressurizing assembly 140 includes a mass 142 and a diaphragm 144.

[0062] In this embodiment, the electronic device 100 uses a barrier structure 150 to be placed between the pressurizing component 140 and the partition structure 130 and extends into the chamber C containing the sensor 120. In this way, the barrier structure 150 restricts the over-displacement of the pressurizing component 140. Since the barrier structure 150 has at least one opening 152 penetrating through it, the presence of the barrier structure 150 does not affect the transmission of air pressure from the electronic device 100 to the sensor 120. Therefore, the electronic device 100 in this embodiment can adjust the vibration performance of the sensor 120 and avoid the situation where the pressurizing component 140 vibrates excessively and hits the sensor 120 when subjected to strong external impact, which would damage the sensor 120 and cause the electronic device to malfunction. Furthermore, when the pressurizing component 140 vibrates due to an instantaneous external force (drop), the displacement amplitude is large, and the probability of it hitting the sensor 120 is also large. Therefore, when the electronic device 100 of this embodiment is subjected to a strong external impact, it can avoid the sensor 120 being damaged by the impact, which would prevent the entire electronic device 100 from failing to operate. However, the present invention is not limited to this.

[0063] In some embodiments, when the pressure assembly 140 vibrates, it may undergo displacement in the direction perpendicular to the substrate 110. Therefore, the blocking structure 150 may be disposed between the pressure assembly 140 and the sensor 120 (i.e., on the displacement path in the direction perpendicular to the substrate 110) to prevent the pressure assembly 140 from impacting the sensor 120 below it during vibration. Furthermore, the blocking structure 150 and the pressure assembly 140 and the sensor 120 may each form at least one gap (e.g., ...). Figure 1A The spacing L1 and L2 in the diagram are such that the blocking structure 150 can act as a buffer between the pressure assembly 140 and the sensor 120, thus effectively providing a blocking function. Here, the spacing L1 and L2 can be between 50 micrometers and 100 micrometers, but the present invention is not limited to this, and the spacing L1 and L2 can be adjusted according to actual design requirements.

[0064] In some embodiments, the spacing L1 is the shortest distance between the blocking structure 150 and the pressurizing component 140, and the spacing L2 is the shortest distance between the blocking structure 150 and the sensor 120. The shortest distance between the blocking structure 150 and the pressurizing component 140 is less than the shortest distance between the blocking structure 150 and the sensor 120, so as to avoid the impact caused by the pressurizing component 140 under asymmetrical displacement (oblique insertion), and further ensure that the blocking structure 150 can effectively perform the blocking function. However, the present invention is not limited thereto.

[0065] In this embodiment, as Figure 1BAs shown, both the mass block 142 and the opening 152 are rectangular in shape, but the invention is not limited to this. The shapes of the mass block 142 and the opening 152 can be determined according to the actual design requirements. For example, in embodiments not shown, the shapes of the mass block 142 and the opening 152 can also be circular. Furthermore, the mass block 142 and the opening 152 can be rectangles with different lengths and widths. The blocking structure 150 blocks through the short sides, while the long sides retain a larger area for engaging the pressure assembly to ensure process feasibility. For example, the length 152L of the opening 152 can be greater than the length 142L of the mass block 142, but the invention is not limited to this.

[0066] In this embodiment, the opening 152 is located opposite the mass block 142, and the mass block 142, the opening 152, and the sensor 120 at least partially overlap. For example, the orthographic projection of the mass block 142 on the substrate 110, the orthographic projection of the opening 152 on the substrate 110, and the orthographic projection of the sensor 120 on the substrate 110 can at least partially overlap. Furthermore, in this embodiment, the width 152W of the opening 152 can be smaller than the width 142W of the mass block 142, but the present invention is not limited to this. The size of the opening 152 of the blocking structure 150 can be designed to correspond to the air damping in the chamber C to meet the usage requirements of the electronic device 100.

[0067] In some embodiments, the materials of the partition structure 130 and the barrier structure 150 are homogeneous, in other words, the materials of the partition structure 130 and the barrier structure 150 are the same. Therefore, the partition structure 130 and the barrier structure 150 can be integrally formed (e.g., formed together by stamping). However, the invention is not limited to this. In other embodiments, the materials of the partition structure 130 and the barrier structure 150 are heterogeneous, in other words, the materials of the partition structure 130 and the barrier structure 150 are different. Therefore, the barrier structure 150 can be sandwiched between the partition structure 130 and the pressure assembly 140 by assembly. However, the invention is not limited to this.

[0068] In some embodiments, sensor 120 may include processing chip 122 and sensing chip 124. Further, sensing chip 124 may be a microphone element to sense pressure changes generated by the vibration of pressurization component 140, and processing chip 122 may be an application-specific integrated circuit (ASIC) to receive and process the signal measured by the microphone element, but the invention is not limited thereto.

[0069] In some embodiments, the sensing chip 124 covers the through-hole 112 of the substrate 110, and the processing chip 122 is disposed adjacent to the sensing chip 124. However, the present invention is not limited thereto, and the processing chip 122 and the sensing chip 124 can be configured according to the actual design requirements.

[0070] In some embodiments, the electronic device 100 further includes another substrate 160 disposed on the other side of the substrate 110 opposite to the sensor 120, the partition structure 130 and the pressurizing component 140, but the present invention is not limited thereto.

[0071] In some embodiments, substrate 110 and another substrate 160 are circuit boards. For example, substrate 110 and another substrate 160 are printed circuit boards (PCBs). The material of the partition structure 130 includes stainless steel, brass, printed circuit boards, or high-temperature resistant materials (which can be processed by reflow soldering). The material of the mass block 142 is metal (e.g., stainless steel or brass). The material of the diaphragm 144 is plastic (e.g., polytetrafluoroethylene (PTFE), polyethylene (PE), polyimide (PI), or polyether etherketone (PEEK). However, the invention is not limited to these, and any other suitable material can be used to replace the above-mentioned components.

[0072] In some embodiments, the electronic device 100 further includes a plurality of conductive portions 170 disposed between the substrate 110 and another substrate 160. In other words, the plurality of conductive portions 170 are disposed on the surface 110b of the substrate 110 opposite to the bearing surface 110t, but the invention is not limited thereto. Here, the conductive portions 170 may be metal solder balls or suitable conductive terminals for electrical connection between the substrate 110 and the other substrate 160.

[0073] In some embodiments, the electronic device 100 further includes bonding wires 126 and an insulating layer 128 disposed on the sensor 120, wherein the bonding wires 126 can connect the processing chip 122 and the sensing chip 124 to form an electrical connection between the processing chip 122 and the sensing chip 124, but the present invention is not limited thereto.

[0074] In some embodiments, the material of the bonding wire 126 is, for example, gold or other suitable conductive material, while the material of the insulating layer 128 is, for example, black glue or other suitable insulating material; the invention is not limited thereto.

[0075] In some embodiments, the electronic device 100 further includes a housing 180 disposed on another substrate 160 and other conductive portions 190, wherein the other conductive portions 190 are disposed around the housing 180 and the other substrate 160, and the other conductive portions 190 may be metal solder balls or suitable conductive terminals, so the housing 180 can form an electrical connection with the other substrate 160 through the other conductive portions 190, but the present invention is not limited thereto.

[0076] In some embodiments, the housing 180 further includes a vent 182, wherein the vent 182 may be one or more to release excess pressure within the electronic device 100, but the invention is not limited thereto.

[0077] In some embodiments, the electronic device 100 further includes a retaining ring 10 disposed between the diaphragm 144 and the blocking structure 150, wherein the retaining ring 10 is made of a rigid material, thereby enabling a more reliable connection between the pressure assembly 130 and the blocking structure 150, improving the reliability of the electronic device 100, but the present invention is not limited thereto.

[0078] It must be noted that the following embodiments use the component references and some contents of the above embodiments, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted. For the description of the omitted parts, please refer to the foregoing embodiments. The following embodiments will not repeat the description.

[0079] Figure 2 This is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention. Please refer to... Figure 2 Compared to the electronic device 100, the blocking structure 250 of the electronic device 200 in this embodiment includes an anti-adhesion protrusion 250a extending toward the diaphragm 144 and a support portion 250b connected to the anti-adhesion protrusion 250a. Since the anti-adhesion protrusion 250a can be a funnel-shaped structure with a small contact area with the pressure assembly 140, it can achieve the effect of anti-adhesion. In addition, the opening width 250W of the blocking structure 250 can be smaller than the width 142W of the mass block 142, so the anti-adhesion protrusion 250a can be positioned opposite the mass block 142, but the present invention is not limited thereto.

[0080] Furthermore, the anti-adhesion protrusion 250a surrounds the periphery of the support portion 250b and is disposed along the periphery of the opening 252 of the blocking structure 250. In other words, the anti-adhesion protrusion 250a can define the boundary of the opening 252, but the present invention is not limited thereto.

[0081] Figure 3 This is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention. Please refer to... Figure 3Compared to the electronic device 200, the blocking structure 350 of the electronic device 300 in this embodiment includes an anti-adhesion protrusion 350a extending toward the diaphragm 144 and a support portion 350b connected to the anti-adhesion protrusion 350a. The width 352W of the opening 352 of the blocking structure 350 is greater than the width 142w of the mass block 142. Therefore, the anti-adhesion protrusion 350a is located opposite the diaphragm 144 to further reduce the overall height of the electronic device 300 and thus reduce the size of the electronic device 300. However, the present invention is not limited to this.

[0082] Figure 4 This is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention. Please refer to... Figure 4 Compared to electronic device 100, the blocking structure 450 of electronic device 400 in this embodiment can have multiple openings 452. This multiple opening design allows for more flexible adjustment of the air damping within chamber C, resulting in a smoother response and improved sensitivity of electronic device 400. However, the invention is not limited to this. It should be noted that the number of openings can be determined according to actual design requirements, and the invention does not impose any limitations on this.

[0083] Figure 5 This is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention. Please refer to... Figure 5 Compared to electronic device 200, electronic device 500 in this embodiment may further include a tuning layer 502, wherein the tuning layer 502 is disposed on the surface of the barrier structure 250 near the sensor 120. In this way, the air damping in the chamber C can be adjusted more flexibly to further improve the frequency response of electronic device 500, but the present invention is not limited thereto. Here, the tuning layer 502 may be a high-temperature resistant ventilated membrane or other suitable materials, and the tuning layer 502 may be disposed on the barrier structure 250 by means of adhesion.

[0084] Furthermore, the tuning layer 502 may be provided corresponding to the opening 252 of the blocking structure 250. For example, the tuning layer 502 may extend from one side of the opening 252 to the other side of the opening 252, but the present invention is not limited thereto.

[0085] In some embodiments, the tuning layer 502 also has a plurality of openings 504, so the air pressure in the chamber C can be further adjusted by the combination of openings 252 and openings 504, so as to further adjust the frequency response of the electronic device 500, but the present invention is not limited thereto.

[0086] Figure 6 This is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention. Please refer to... Figure 6Compared to electronic device 100, electronic device 600 in this embodiment may further include a tuning layer 602, wherein the tuning layer 602 is disposed on the surface of the barrier structure 150 near the sensor 120. Here, the material and function of the tuning layer 602 may be similar to those of the tuning layer 502, and will not be described in detail here.

[0087] Figure 7 This is a cross-sectional schematic diagram of an electronic device according to yet another embodiment of the present invention. Please refer to... Figure 7 Compared to electronic device 300, electronic device 700 in this embodiment may further include a tuning layer 702, wherein the tuning layer 702 is disposed on the surface of the blocking structure 350 near the sensor 120. Furthermore, in this embodiment, the tuning layer 702, compared to... Figure 5 The tuning layer 502 has a relatively long extension, but the present invention is not limited thereto. Here, the materials and functions of the tuning layer 702 can be similar to those of the tuning layer 502, and will not be described in detail here.

[0088] Figure 8 This is a cross-sectional schematic diagram of an electronic device according to yet another embodiment of the present invention. Please refer to... Figure 8 Compared to electronic device 400, electronic device 800 in this embodiment may further include a tuning layer 802, wherein the tuning layer 802 is disposed on the surface of the barrier structure 450 near the sensor 120. Here, the material and function of the tuning layer 802 may be similar to those of the tuning layer 502, and will not be described in detail here.

[0089] In this embodiment, the tuning layer 802 can correspond to all openings 452. For example, the tuning layer 802 can correspond to the openings 452 in the central and outer areas of the blocking structure 450. However, the present invention is not limited to this. The setting position of the tuning layer 802 can be determined according to the actual design requirements. For example, the tuning layer 802 can correspond only to the opening 452 in the central area (not shown).

[0090] It should be noted that the present invention is not limited to the embodiments described above. The embodiments can be combined and adjusted according to actual design requirements. Any design with a corresponding blocking structure falls within the protection scope of the present invention.

[0091] In summary, the electronic device of the present invention incorporates a blocking structure, which is positioned between the pressurizing component and the partition structure and extends into the cavity containing the sensor. This blocking structure restricts the over-displacement of the pressurizing component. Furthermore, since the blocking structure has at least one opening penetrating it, its presence does not affect the transmission of air pressure from the electronic device to the sensor. Therefore, the electronic device of the present invention can improve the vibration performance of the sensor and prevent damage to the sensor caused by excessive vibration of the pressurizing component during strong external impacts, thus preventing the electronic device from malfunctioning. In addition, the design of the opening and the tuning layer allows for flexible adjustment of the air damping within the cavity, further enhancing the frequency response of the electronic device.

[0092] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. An electronic device, characterized in that, include: The substrate is a circuit board with a bearing surface; A sensor is disposed on the bearing surface; A partition wall structure is disposed on the bearing surface and surrounds the sensor; A pressurizing component is disposed on the partition wall structure, wherein the pressurizing component, the partition wall structure, and the substrate together form a cavity, and the pressurizing component includes a mass block and a diaphragm; as well as A barrier structure is disposed between the pressurizing assembly and the partition structure and extends into the cavity, wherein the barrier structure has at least one opening penetrating the barrier structure.

2. The electronic device according to claim 1, characterized in that, The blocking structure is disposed between the pressurizing component and the sensor, and forms at least one gap with each of the pressurizing component and the sensor.

3. The electronic device according to claim 2, characterized in that, The shortest distance between the blocking structure and the pressurizing component is less than the shortest distance between the blocking structure and the sensor.

4. The electronic device according to claim 1, characterized in that, Both the mass block and the at least one opening are rectangular in shape.

5. The electronic device according to claim 4, characterized in that, The length of at least one opening is greater than the length of the mass block.

6. The electronic device according to claim 1, characterized in that, The partition structure is made of a different material than the barrier structure, and the barrier structure is sandwiched between the partition structure and the pressurizing assembly.

7. The electronic device according to claim 1, characterized in that, The partition wall structure is made of the same material as the barrier structure, and the partition wall structure and the barrier structure are integrally formed.

8. The electronic device according to claim 1, characterized in that, The at least one opening is located on the mass block.

9. The electronic device according to claim 1, characterized in that, The mass block, the at least one opening, and the sensor at least partially overlap.

10. The electronic device according to claim 1, characterized in that, The width of the at least one opening is smaller than the width of the mass block.

11. The electronic device according to claim 1, characterized in that, The blocking structure includes an anti-adhesion protrusion extending toward the diaphragm and a support portion connected to the anti-adhesion protrusion.

12. The electronic device according to claim 11, characterized in that, The anti-adhesion protrusion is located on the diaphragm.

13. The electronic device according to claim 11, characterized in that, The anti-adhesion protrusion surrounds the periphery of the support portion and is disposed along the periphery of the at least one opening.

14. The electronic device according to claim 1, characterized in that, The at least one opening may be multiple openings.

15. The electronic device according to claim 1, characterized in that, It also includes a tuning layer disposed on the surface of the blocking structure near the sensor.

16. The electronic device according to claim 15, characterized in that, The tuning layer is configured corresponding to the at least one opening.

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