Surface treatment device

Abstract

The surface treatment device comprises: a treatment tank (100A, 100B) for storing a treatment liquid; an anode (142, 152) arranged in the treatment tank; a fixture (10) for holding a workpiece (W) in a downward manner and setting the workpiece as a cathode; a liquid ejection component (200) arranged between the anode and the workpiece; and a moving mechanism (270A, 270B) for moving the liquid ejection component relative to the workpiece. The liquid ejection component comprises at least one pair of plates (210, 220, 230), the at least one pair of plates being formed between the anode and the workpiece along an extension direction toward the workpiece and being separately arranged in a direction intersecting the extension direction, and guiding the treatment liquid flowing due to the movement of the liquid ejection component between the at least one pair of plates so that the treatment liquid is ejected toward the workpiece.

Description

Technical Field

[0001] The present invention relates to a surface treatment device for performing surface treatment such as plating on a workpiece. Background Art

[0002] In an apparatus for plating a workpiece such as a circuit board, as shown in Patent Document 1, a plating solution is sprayed toward the workpiece hanging in the plating solution from a plurality of nozzles arranged along the longitudinal direction of a nozzle tube disposed longitudinally in the plating solution.

[0003] In an apparatus for plating a workpiece such as a circuit board or a semiconductor wafer, a paddle for stirring a processing liquid is used instead of a nozzle tube, as shown in Patent Documents 2 and 3. The paddle in Patent Document 2 is a stirring rod, and the paddle in Patent Document 3 is a rectangular plate having a plurality of longitudinal holes formed therethrough, and these paddles reciprocate parallel to the main surface of the workpiece. Patent Documents 4 to 6 disclose a solution in which the nozzle in Patent Document 1 is provided on the paddle in Patent Document 2 or 3.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2012-046782 ( Figure 5 )

[0007] Patent Document 2: Japanese Patent Application Publication No. 2006-04172 ( Figure 1-5 )

[0008] Patent Document 3: Japanese Patent Application Publication No. 2014-185375 ( Figure 1 , 3 -4, 6)

[0009] Patent Document 4: Japanese Patent Application Publication No. 2004-16129 ( Figure 1-4 )

[0010] Patent Document 5: Japanese Patent Application Laid-Open No. 56-42976 ( Figure 1-3 )

[0011] Patent Document 6: Japanese Patent Application Laid-Open No. 10-88397 ( Figure 1-2 ) Summary of the invention

[0012] Problems to be solved by the invention

[0013] However, the nozzle tubes of Patent Document 1 are arranged at intervals in the width direction of the workpiece, and nozzles are arranged at intervals in the longitudinal direction on each nozzle tube, so it is difficult to uniformly spray the plating liquid onto the workpiece. On the other hand, the paddles of Patent Document 2 only stir the plating liquid. In Patent Documents 4 to 6, the treatment liquid pumped by the liquid jet pump is sprayed toward the workpiece from the moving paddle, but the uniformity of the treatment surface depends on the position of the nozzle and is not improved, which is the same as Patent Document 1. Moreover, in Patent Documents 4 to 6, in order to move the paddle, a liquid jet pump is required in addition to the drive source.

[0014] The object of the present invention is to provide a surface treatment device which does not require a liquid jet pump, can reduce the in-plane non-uniformity of the treatment liquid sprayed onto the workpiece, improve the in-plane uniformity of the surface treatment of the workpiece, and can improve productivity.

[0015] Means for solving problems

[0016] (1) One embodiment of the present invention relates to a surface treatment device, wherein:

[0017] The surface treatment device comprises:

[0018] a processing tank for receiving a processing liquid;

[0019] an anode, which is disposed in the treatment tank;

[0020] a jig for holding the workpiece immersed in the treatment liquid in a hanging manner and setting the workpiece as a cathode;

[0021] a liquid ejecting member disposed in the processing liquid between the anode and the workpiece; and

[0022] a moving mechanism that moves the liquid ejecting member relative to the workpiece,

[0023] The liquid ejection component includes at least one pair of plates, which are formed between the anode and the workpiece along an extension direction toward the workpiece and are separately arranged in a direction intersecting the extension direction, and the treatment liquid flowing through the movement of the liquid ejection component is guided between the at least one pair of plates and ejected toward the workpiece.

[0024] According to one embodiment of the present invention, by moving a liquid ejection component relative to a workpiece hanging down into the treatment liquid, the treatment liquid can be sprayed toward the workpiece without using a nozzle tube. That is, the treatment liquid flowing in the treatment tank due to the movement of the liquid ejection component is guided between at least one pair of plates and sprayed toward the workpiece. Thus, by the collision of the treatment liquid with the workpiece, fresh treatment liquid rich in surface treatment components located near the anode can be supplied to the workpiece, and productivity is improved. In addition, since the treatment liquid can be sprayed toward the workpiece between at least one pair of plates of the moving liquid ejection component, the uniformity of the treatment within the workpiece surface is improved compared to the case where the treatment liquid is sprayed from multiple nozzles of the nozzle tube.

[0025] (2) In one embodiment (1) of the present invention, there is provided a surface treatment device, wherein:

[0026] The moving mechanism moves the liquid ejecting member in a reciprocating direction parallel to the workpiece.

[0027] The liquid ejection component comprises:

[0028] A first guide body having two surfaces intersecting the reciprocating direction; and

[0029] The second guide and the third guide are respectively arranged with gaps between the two surfaces of the first guide,

[0030] The at least one pair of plates comprises:

[0031] a first pair of plates formed by the first guide body and the second guide body; and

[0032] a second pair of plates formed by the first guide body and the third guide body,

[0033] When the liquid ejection component moves in the forward movement direction in the reciprocating direction, the processing liquid blocked by the first guide body is guided along between the first pair of plates and ejected toward the workpiece.

[0034] When the liquid ejecting member moves in the return movement direction of the reciprocating direction, the processing liquid blocked by the first guide body is guided along between the second pair of plate materials and ejected toward the workpiece.

[0035] In this way, when the liquid ejecting component moves forward, for example, the processing liquid guided between the first pair of plates formed by the first and second guide bodies is ejected onto the workpiece, and when the liquid ejecting component moves back, for example, the processing liquid guided between the second pair of plates formed by the first and third guide bodies is ejected onto the workpiece.

[0036] (3) In one embodiment (2) of the present invention, the anode may include a first anode and a second anode disposed on both sides of the workpiece, the liquid ejecting member may include a first liquid ejecting member disposed between the first anode and the workpiece, and a second liquid ejecting member disposed between the second anode and the workpiece, and the moving mechanism may include a first moving mechanism for moving the first liquid ejecting member, and a second moving mechanism for moving the second liquid ejecting member. In this way, both sides of the workpiece can be processed.

[0037] (4) In one embodiment (3) of the present invention, it may be that there is also a first driving source for imparting driving force to the first moving mechanism and a second driving source for imparting driving force to the second moving mechanism, and the first liquid ejecting component and the second liquid ejecting component are driven asynchronously. When the first and second liquid ejecting components are facing each other with the workpiece in between, the processing liquid is ejected onto both sides of the workpiece in the same area. In the case where the workpiece has a through hole that passes through both sides, it is difficult for the processing liquid to pass through the through hole. In one reciprocating movement of the first and second liquid ejecting components, if the first and second liquid ejecting components are moved synchronously, the positions of the first and second liquid ejecting components facing each other relative to the workpiece are always the same, but by moving the first and second liquid ejecting components asynchronously, the positions of the first and second liquid ejecting components facing each other relative to the workpiece can be made different each time. As a result, the processing liquid can easily pass through the through hole.

[0038] (5) In one embodiment (3) or (4) of the present invention, the processing tank may be divided into a first tank and a second tank by lowering and installing the fixture holding the workpiece from above the processing tank. In this way, the first liquid ejection component can stir the processing liquid in the first tank, and the second liquid ejection component can stir the processing liquid in the second tank, and the adverse effect of the stirring in one tank on the other tank can be eliminated.

[0039] (6) In one embodiment (5) of the present invention, the processing tank can include buffer tanks on the outer sides of the two side wall portions located at the two ends along the reciprocating direction, respectively, and the buffer tanks are connected to the first tank and the second tank to accommodate the processing liquid. In this way, the processing liquid pushed to the two ends of the processing tank by the first liquid ejection component and the second liquid ejection component can escape into the buffer tank. In this way, the influence of the reflected waves of the processing liquid generated at the two ends of the processing tank can be reduced. In addition, the buffer tank can also ensure the circulation of the processing liquid between the first tank and the second tank.

[0040] (7) In one embodiment (5) of the present invention, the processing tank may include a first processing tank and a second processing tank connected in a direction parallel to the reciprocating direction and divided by a first buffer tank. The fixture may include: a first fixture that holds a first workpiece and divides the first processing tank into the first tank and the second tank; and a second fixture that holds a second workpiece and divides the second processing tank into the first tank and the second tank. The first buffer tank allows the processing liquid to flow between the first tank of the first processing tank, the first tank of the second processing tank, the second tank of the first processing tank, and the second tank of the second processing tank. The first processing tank may include a second buffer tank on the outside of a first side wall portion located at one end of the reciprocating direction, allowing the processing liquid to flow between the first tank and the second tank in the first processing tank. The second processing tank may include a third buffer tank on the outside of a second side wall portion located at the other end of the reciprocating direction, allowing the processing liquid to flow between the first tank and the second tank in the second processing tank. In this way, the first workpiece and the second workpiece can be processed simultaneously, and at this time, the same function and effect as one embodiment (6) of the present invention can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 It is a top view of the surface treatment device according to the first embodiment of the present invention.

[0042] Figure 2 It is a cross-sectional view of a surface treatment device.

[0043] Figure 3 It is a diagram for explaining the structure and operation of the liquid ejecting member.

[0044] Figure 4 This is the front view of the fixture.

[0045] Figure 5 is the rear view of the fixture.

[0046] exist Figure 6 middle, Figure 6 (A) to Figure 6 (C) are diagrams showing the relationship between the rectifier and the clamper.

[0047] Figure 7 It is a top view of a surface treatment device according to a second embodiment of the present invention. DETAILED DESCRIPTION

[0048] In the following disclosure, a plurality of different implementation methods or embodiments for implementing the different features of the proposed subject matter are provided. Of course, these are merely examples and are not intended to be limited thereto. In addition, in the present disclosure, reference numbers and / or text are sometimes repeated in each example. Such repetition is for the purpose of achieving simplicity and clarity, and it does not need to have a relationship between each implementation method and / or the described structure. Furthermore, when described as a first element being "connected" or "linked" to a second element, such a description includes an implementation method in which the first element and the second element are directly connected or linked to each other, and also includes an implementation method in which the first element and the second element have one or more other elements between them and are indirectly connected or linked to each other. In addition, when described as a first element "moving" relative to a second element, such a description includes an implementation method in which at least one of the first element and the second element moves relative to the other.

[0049] 1. First Implementation

[0050] Figure 1 1 is a schematic diagram of a surface treatment device, such as an electroplating device, according to the present embodiment. The electroplating device 1 includes a flat fixture 10 for holding a workpiece W, and a surface treatment tank 100A in which the fixture 10 is installed. F and the second main surface (eg, the back surface) W B At least one of them is used as the processed surface, and in this embodiment, both of them are used as the processed surfaces.

[0051] 1.1. Surface treatment tank

[0052] exist Figure 1 and Figure 2 In the surface treatment tank 100A for storing a treatment liquid such as a plating liquid 2, there are supporting parts 110 and 120 for supporting a fixture 10 in a detachable manner, and the fixture 10 holds the workpiece W in a vertical state. The lower supporting part 110 has a slit for inserting the lower end of the fixture 10. The upper supporting part 120 also has a slit for inserting the side edge of the fixture 10. The fixture 10 is lowered from the upper opening of the surface treatment tank 100A and is held in a vertical state by the supporting parts 110 and 120. The upper supporting part 120 has a terminal group (not shown) in contact with the terminal group 35A, 35B, 45A, and 45B of the fixture 10 described later. Thus, by lowering the fixture 10 from above and being supported by the upper supporting part 120, the terminal group 35A, 35B, 45A, and 45B of the fixture 10 can be connected to a rectifier (not shown) located outside the surface treatment tank 100A. Here, using the support parts 110, 120, the fixture 10 supported by the support parts 110, 120, and the workpiece W held by the fixture 10, as shown in FIG. Figure 1 and Figure 2As shown in FIG. 1 , the surface treatment tank 100A is divided into a first tank 101 and a second tank 102. Furthermore, the first tank 101 and the second tank 102 do not necessarily need to be sealed liquid-tightly. Figure 1 and Figure 2 As shown, the surface treatment tank 100A has openings 103 and 104 at its lower portion. The opening 103 is formed facing the first tank 101, and the opening 104 is formed facing the second tank 102. For the surface treatment tank 100A, the adjusted plating solution 2 is supplied from the upper opening, for example, and discharged from the openings 103 and 104. The discharged plating solution 2 is repeatedly supplied to the surface treatment tank 100A after being adjusted by filtering treatment, replenishment of each main component, etc. In addition, the plating solution 2 may be supplied from the openings 103 and 104, and, for example, the overflowed plating solution is discharged.

[0053] like Figure 1 and Figure 2 As shown, the surface treatment tank 100A has a front surface W and a rear surface W of the workpiece W. F and back W B The first anode box 140 and the second anode box 150 are opposite to each other. F The first anode 142 and the second anode box 150 are opposite to each other and are kept in contact with the back surface W of the workpiece W. B The second anode 152 is opposite. To perform electroplating, at least one rectifier is connected to the first anode 142 and the second anode 152, and the workpiece W is set as a cathode via the fixture 10.

[0054] like Figure 1 and Figure 2 As shown, the surface treatment tank 100A includes a liquid ejection member 200 (200A and 200B) between the workpiece W and the anodes 142 and 152. The liquid ejection member 200 (200A and 200B) is disposed in contact with the main surface W of the workpiece W. F , W B The liquid ejection member 200 (200A and 200B) will be described in detail later.

[0055] 1.2. Artifacts

[0056] The workpiece W is, for example, a rectangular circuit substrate, and copper plating is performed by the electroplating device 1. However, the type of plating is not limited. The circuit substrate W can be F and / or back W B With vias, or through-holes F and back W B In this case, the inner wall of the via and the through hole is also plated. F And back WB The respective plating areas can also be quite different.

[0057] 1.3. Fixture

[0058] Using the front view of the jig 10 Figure 4 and as a rear view of the fixture 10 Figure 5 , a fixture 10 for holding a workpiece W is described. The workpiece W can be loaded and unloaded with respect to the fixture 10 by, for example, an automatic device. The fixture 10 has a fixture body 12 formed of, for example, a flat plate, wherein the flat plate is made of an insulating material. The fixture body 12 has a rectangular hole 14 whose area is slightly larger than that of the rectangular workpiece W. The workpiece W is arranged in the hole 14. The fixture 10 has four sides around the rectangular hole 14. Figure 4 The electrodes 15A to 15D shown and Figure 5 The electrodes 15E to 15H are shown. The electrodes 15A to 15H are insulated from each other. A plurality of clamps 20 are held on each electrode 15A to 15H. The clamps 20 clamp the workpiece W from the front and back sides. Figure 4 and Figure 5 As shown, the clamp 20 may include: a clamp 21 that clamps the upper edge of the workpiece W; a clamp 22 that clamps the left edge of the workpiece W; a clamp 23 that clamps the lower edge of the workpiece W; and a clamp 24 that clamps the right edge of the workpiece W. Here, the clamp 21 includes a front side W of the workpiece W. F The contact clamping piece 31 ( Figure 4 ) and the back side W of the workpiece W B The contact clamping piece 41 ( Figure 5 ). In the present embodiment, the clamping piece 31 is electrically insulated from the clamping piece 41. Similarly, the clamp 22 includes electrically insulated clamping pieces 32 and 42, the clamp 23 includes electrically insulated clamping pieces 33 and 43, and the clamp 24 includes electrically insulated clamping pieces 34 and 44. In addition, the clamping piece 31 is electrically connected to the electrode 15A, the clamping piece 32 is electrically connected to the electrode 15B, the clamping piece 33 is electrically connected to the electrode 15C, the clamping piece 34 is electrically connected to the electrode 15D, the clamping piece 41 is electrically connected to the electrode 15E, the clamping piece 42 is electrically connected to the electrode 15H, the clamping piece 43 is electrically connected to the electrode 15G, and the clamping piece 44 is electrically connected to the electrode 15F. In this way, the clamping pieces 31 to 34 and 41 to 44 are insulated from each other, thereby allowing different currents to flow through the front and back surfaces of the workpiece W, and allowing different currents to flow through the four sides of each of the front and back surfaces.

[0059] like Figure 4 and Figure 5As shown, conductive patterns 31A, 32A1, 32A2, 33A, 31B, 33B, 34B1, and 34B2 are formed on the clamp body 12 made of insulating material and electrically connected to the clamp 20. In the left area of ​​the front side of the clamp body 12, as shown in FIG. Figure 4 As shown, the clamping piece 31L of the clamp 21L located in the left area among the multiple clamps 21 is connected to the conductive pattern 31A via the electrode 15A. The clamping piece 32U of the clamp 22U located in the upper area among the multiple clamps 22 is connected to the conductive pattern 32A1 via the electrode 15B. The clamping piece 32L of the clamp 22L located in the lower area among the multiple clamps 22 is connected to the conductive pattern 32A2 via the electrode 15B. The clamping piece 33L of the clamp 23L located in the left area among the multiple clamps 23 is connected to the conductive pattern 33A via the electrode 15C. These conductive patterns 31A, 32A1, 32A2, 33A are connected to the terminal group 35A, for example, via the wiring 36A, wherein the terminal group 35A is formed in, for example, a protrusion 16A protruding in the width direction at the upper part of the clamp body 12.

[0060] In the right area of ​​the front side of the clamp body 12, as shown in FIG. Figure 4 As shown, the clamping piece 31R of the clamp 21R located in the right area among the multiple clamps 21 is connected to the conductive pattern 31B via the electrode 15A. The clamping piece 34U of the clamp 24U located in the upper area among the multiple clamps 24 is connected to the conductive pattern 34B2 via the electrode 15D. The clamping piece 34L of the clamp 24L located in the lower area among the multiple clamps 24 is connected to the conductive pattern 34B1 via the electrode 15D. The clamping piece 33R of the clamp 23R located in the right area among the multiple clamps 23 is connected to the conductive pattern 33B via the electrode 15C. These conductive patterns 31B, 33B, 34B1, 34B2 are connected to the terminal group 35B via the wiring 36B, for example, wherein the terminal group 35B is formed at a protrusion 16B that protrudes in the width direction at the upper part of the clamp body 12. In this way, on the front side W of the rectangular workpiece W F The current can be controlled independently in a maximum of 4 parts: up, down, left, and right.

[0061] On the other hand, in the right area of ​​the back side of the clamp body 12, as shown in FIG. Figure 5As shown, the clamping piece 41R of the clamp 21R located in the right area (the left area when viewed from the front) among the multiple clamps 21 is connected to the conductive pattern 41A via the electrode 15E. The clamping piece 42U of the clamp 22U located in the upper area among the multiple clamps 22 is connected to the conductive pattern 42A1 via the electrode 15H. The clamping piece 42L of the clamp 22L located in the lower area among the multiple clamps 22 is connected to the conductive pattern 42A2 via the electrode 15H. The clamping piece 43R of the clamp 23R located in the right area (the left area when viewed from the front) among the multiple clamps 23 is connected to the conductive pattern 43A via the electrode 15G. These conductive patterns 41A, 42A1, 42A2, 43A are connected to the terminal group 45A, for example, via the wiring 37A, wherein the terminal group 45A is formed on the protruding portion 16A of the clamp body 12.

[0062] In the left area of ​​the back side of the clamp body 12, as shown in FIG. Figure 5 As shown, the clamping piece 41L of the clamp 21L located in the left area among the multiple clamps 21 is connected to the conductive pattern 41B via the electrode 15E. The clamping piece 44U of the clamp 24U located in the upper area among the multiple clamps 24 is connected to the conductive pattern 44B1 via the electrode 15F. The clamping piece 44L of the clamp 24L located in the lower area among the multiple clamps 24 is connected to the conductive pattern 44B2 via the electrode 15F. The clamping piece 43 of the clamp 23 located in the left area among the multiple clamps 23 is connected to the conductive pattern 43B via the electrode 15G. These conductive patterns 41B, 43B, 44B1, 44B2 are connected to the terminal group 45B formed on the protrusion 16B of the clamp body 12, for example, via the wiring 37B. In this way, even on the back side W of the rectangular workpiece W B , and current control can be performed independently in a maximum of 4 divisions, up, down, left, and right.

[0063] By applying an insulating coating to the conductive patterns 41A, 41B, 42A1, 42A2, 43A, 43B, 44B1, and 44B2 formed on the front and back surfaces of the jig 10, it is possible to prevent the plating from adhering. Figure 4 The electrodes 15A to 15D shown and Figure 5 The electrodes 15E to 15H shown are arranged near the periphery of the workpiece W and can function as dummy electrodes that eliminate the abnormality of the plating thickness caused by the electric field concentration generated at the periphery of the workpiece W, i.e., the so-called dog bone. In order to prevent the plating from adhering and to adjust the electrode exposure amount, the region between two adjacent clamps can be covered with insulators 17A to 17D that can be adjusted in position so that the electrode exposure portion can be variable. Figure 4 The electrodes 15A to 15D shown and Figure 5The electrodes 15E to 15H shown (see Japanese Patent Application No. 2019-15827 of the applicant of the present application).

[0064] In addition, the clamp can also cover the small gap formed around the workpiece W in the hole 14 of the fixture 10 to hold the workpiece W. In this way, the surface treatment tank 100A can be almost completely divided into the first groove 101 and the second groove 102 located on the front and back sides of the workpiece W by the fixture 10 and the workpiece W, and the supporting parts 110 and 120 of the surface treatment tank 100A.

[0065] 1.4. Rectifier

[0066] In this embodiment, in order to at least independently set the front surface W of the workpiece W F and back W B The current flowing, such as Figure 6 (A)~ Figure 6 As shown in (C), it is preferred to set a plurality of rectifiers. Figure 6 In (A), two rectifiers 300A and 300B are provided, and the rectifier 300A is in contact with the front surface W of the workpiece W. F The clamping pieces 31 to 34 in contact are electrically connected, and the rectifier 300B and the back surface W of the workpiece W are connected. B The contacting clamping pieces 41 to 44 are electrically connected. By independently controlling the two rectifiers 300A and 300B, the front surface W of the workpiece W can be independently set. F and back W B Thus, even if the front side W of the workpiece W F and back W B The respective plating areas on the electrodes are greatly different, and the current can also be adjusted according to the plating area or the plating position. In addition, in this case, the contacts at which the two rectifiers 300A and 300B are electrically connected to the first anode 142 and the second anode 152 are, for example, arranged at the center of each of the first anode 142 and the second anode 152.

[0067] In FIG. 6 (B), four rectifiers 310A to 310D are provided, and the rectifier 310A is connected to the front surface W of the workpiece W. F The clamping pieces 31, 32U, 34U that are in contact with the upper area of ​​the workpiece are electrically connected, and the rectifier 310B is connected to the front surface W of the workpiece W. F The clamping pieces 33, 32L, and 34L that are in contact with the lower area of ​​the workpiece are electrically connected, and the rectifier 310C is connected to the back side W of the workpiece W. B The clamping pieces 41, 42U, 44U that are in contact with the upper area of ​​the workpiece are electrically connected, and the rectifier 310D is connected to the back side W of the workpiece W. B The clamping pieces 43, 42L, and 44L that are in contact with the lower area of ​​the workpiece W are electrically connected. F and back WB In each of the two regions, the upper region and the lower region of the workpiece W (i.e., a total of four regions on the front and back sides) can be independently controlled. In this case, the contacts of the four rectifiers 310A to 310D electrically connected to the first anode 142 and the second anode 152 are arranged corresponding to the upper region of the first anode 142, the lower region of the first anode 142, the upper region of the second anode 152, and the lower region of the second anode 152, a total of four regions.

[0068] exist Figure 6 In (C), eight rectifiers 320A to 320H are provided, and the rectifier 320A is in contact with the front surface W of the workpiece W. F The clamping pieces 31L and 32U that are in contact with the upper left area of ​​the workpiece are electrically connected, and the rectifier 320B is connected to the front surface W of the workpiece W. F The clamping pieces 32L and 33L in contact with the lower left area of ​​the workpiece are electrically connected, and the rectifier 320C is connected to the front side W of the workpiece W. F The clamping pieces 31R and 34U that are in contact with the upper right area of ​​the workpiece are electrically connected, and the rectifier 320D is connected to the front surface W of the workpiece W. F The clamping pieces 33R and 34L in contact with the lower right area of ​​the workpiece are electrically connected, and the rectifier 320E is connected to the back side W of the workpiece W. B The clamping pieces 41L and 44U that are in contact with the upper left area of ​​the workpiece are electrically connected, and the rectifier 320F is connected to the back side W of the workpiece W. B The clamping pieces 43L and 44L in contact with the lower left area of ​​the workpiece are electrically connected, and the rectifier 320G is connected to the back side W of the workpiece W. B The clamping pieces 41R and 42U that are in contact with the upper right area of ​​the workpiece are electrically connected, and the rectifier 320H is connected to the back side W of the workpiece W. B The clamping pieces 42L and 43R that are in contact with the lower right area of ​​the workpiece W are electrically connected. F and back W B In each of the rectifiers 320A to 320H, the current flowing in the four regions of the upper left region, the lower left region, the upper right region, and the lower right region of the workpiece W (i.e., a total of 8 regions on the front and back sides) can be independently controlled. In addition, in this case, the contacts of the eight rectifiers 320A to 320H electrically connected to the first anode 142 and the second anode 152 are arranged corresponding to the upper left region, the lower left region, the upper right region, and the lower right region of the first anode 142, and the upper left region, the upper region, the lower region, the upper region, and the lower region of the second anode 152, respectively. However, the front and back sides may be divided into more than 8 regions in total.

[0069] 1.5. Liquid ejection components

[0070] The liquid ejection member 200 may include: F and the first liquid ejecting member 200A disposed on the back surface W of the workpiece W. B The first liquid ejecting member 200A is disposed between the front surface W of the workpiece W and the second anode 152. F The second liquid ejection member 200B moves in a reciprocating direction parallel to the back surface W of the workpiece W by a second reciprocating mechanism (second moving mechanism) 270B. B The first and second reciprocating mechanisms 270A and 270B can utilize various rotary motion-reciprocating linear motion conversion mechanisms such as a slider crank mechanism and an eccentric cam, and detailed descriptions thereof are omitted here.

[0071] In this embodiment, the front surface W of the workpiece W is F and back W B A liquid ejection component 200A and 200B are respectively provided. The liquid ejection components 200A and 200B preferably reciprocate with a movement stroke longer than the width of the workpiece W. In this way, the liquid ejection components 200A and 200B will not be folded back at a position overlapping with the ends in the width direction of the workpiece W. Therefore, the time when the liquid ejection component 200 becomes the shadow of the electric field between the cathode and the anode will not be different at the two ends of the workpiece W and at positions other than the two ends. It is also possible to apply the liquid ejection component 200 to the front side W of the workpiece W. F and back W B A plurality of liquid ejection components are provided on each surface of the workpiece W. In this way, the movement stroke of each liquid ejection component can be shortened. However, the time when the liquid ejection component 200 becomes the shadow of the electric field relative to the anode 142, 152 varies depending on the area (e.g., the two ends and the center) of the workpiece W, which is disadvantageous in this respect.

[0072] like Figure 3 As shown, the liquid ejection component 200 (200A and 200B) includes: a first guide body 210 having two surfaces intersecting with the reciprocating direction, for example, orthogonal to each other; and a second guide body 220 and a third guide body 230, which are respectively arranged on, for example, both sides of the first guide body 210 with gaps between the two surfaces of the first guide body 210. Each of the adjacent two guide bodies of the first to third guide bodies 210 to 230 is constituted by a pair of plates formed between the anode 142, 152 and the workpiece W along the extension direction toward the workpiece W and separately arranged in the direction intersecting with the extension direction. As shown Figure 2As shown, the guide body has a height extending over at least the vertical length of the workpiece W. A first passage 201 is formed between a first pair of plates formed by the first guide body 210 and the second guide body 220. A second passage 202 is formed between a second pair of plates formed by the first guide body 210 and the third guide body 230. The first guide body 210 is formed, for example, longer than the second guide body 220 and the third guide body 230, and both ends thereof protrude from the corresponding ends of the second guide body 220 and the third guide body 230. In addition, the end of the first guide body 210 facing the workpiece W is, for example, tapered. The end of the first guide body 210 on the side close to the anode box 140, 150 is fixed to a base end 240 extending, for example, parallel to the workpiece W. The second guide body 220 and the third guide body 230 may further include a fourth guide body 250 extending, for example, parallel to the base end 240. A third passage 203 is formed between the base end 240 and the fourth guide body 250 extending from the second guide body 220. The third passage 203 is connected to the first passage 201 and guides the processing liquid to the first passage 201. Similarly, a fourth passage 204 is formed between the base end 240 and the fourth guide 250 extending from the third guide 230. The fourth passage 204 is connected to the second passage 202 and guides the processing liquid to the second passage 202. The first guide 210 is connected to the second guide 220 and the third guide 230 by a spacer 260 of a flat plate at a certain distance. Figure 2 As shown, a plurality of the spacers 260 can be provided at intervals in the height direction.

[0073] The first liquid ejection member 200A has its base end portion 240 connected to a first reciprocating mechanism 270A to which a driving force is applied, for example, from a first driving source 280A. Thus, the first liquid ejection member 200A is moved in a reciprocating manner. Figure 2 Similarly, regarding the second liquid ejection component 200B, for example, its base end portion 240 is connected to a second reciprocating mechanism 270B, for example, which is driven by a second driving source 280B, so that the second liquid ejection component 200B moves in the reciprocating directions A and B. Figure 2 When the liquid ejection component 200 (200A and 200B) moves in the reciprocating directions A and B. Figure 2 The reciprocating directions A and B Figure 3When the liquid ejection member 200A moves in the forward movement direction A, the plating liquid blocked by the first guide body 210 is guided along the first passage 201 between the first pair of plates formed by the first guide body 210 and the second guide body 220, and is ejected toward the workpiece W. When the liquid ejection member 200A moves in the return movement direction B of the reciprocating directions A and B, the plating liquid blocked by the first guide body 210 is guided along the second passage 202 between the second pair of plates formed by the first guide body 210 and the third guide body 230, and is ejected toward the workpiece W. The second liquid ejection member 200B also ejects the plating liquid toward the workpiece W via the first passage 201 when moving in the forward movement direction A, and ejects the plating liquid toward the workpiece W via the second passage 202 when moving in the return movement direction B, similarly to the first liquid ejection member 200A. Furthermore, both the first passage 201 and the second passage 202 do not necessarily need to be provided. In any case of movement of the liquid ejection component 200 (200A and 200B) in the reciprocating directions A and B, the third passage 203 and the fourth passage 204 can also be formed by other guide bodies such as inclination or curvature to guide the processing liquid to a common passage between at least one pair of plates.

[0074] In this way, the processing liquid 2 collides with the workpiece W, so that the main surface W of the workpiece W can be F , W B The liquid ejection member 200 (200A and 200B) can be used to agitate the liquid near the anode boxes 140 and 150 to prevent the liquid from stagnating. In addition, the liquid ejection member 200 (200A and 200B) can be used to eject the liquid near the anode boxes 140 and 150. Figure 2 The processing liquid 2 is uniformly sprayed toward the workpiece W except for the spacer 260 in the longitudinal direction. Since the spacer 260 can be formed in a thin plate shape, the in-plane uniformity of the processing of the workpiece W is not impaired.

[0075] Here, the first driving source 280A and the second driving source 280B can be driven asynchronously. If the first and second liquid ejection components 200A and 200B are facing each other across the workpiece W, the treatment liquid 2 will be ejected toward both sides of the workpiece W in the same area. In the case where the workpiece W has a through hole that penetrates both sides, it is difficult for the treatment liquid 2 to pass through the through hole. In one reciprocating movement of the first and second liquid ejection components 200A and 200B, if the first and second liquid ejection components are moved synchronously, the positions facing the first and second liquid ejection components are always the same, but by moving the first and second liquid ejection components asynchronously, the positions facing the first and second liquid ejection components can be different each time. Thus, regardless of the position of the through hole formed in the workpiece W, plating can be reliably implemented in the through hole. In addition, the first driving source 280A and the second driving source 280B can also move the liquid ejection components 200A and 200B at different speeds, respectively. In this way, the pressure of the processing liquid 2 acting on the workpiece W is different between the front and back surfaces WF and WB. By utilizing this pressure difference, the processing liquid can easily pass through the through hole. In this case, the first driving source 280A and the second driving source 280B can be driven synchronously, or the first and second driving sources 280A and 280B can be set to the same driving source.

[0076] In addition, the fixture 10 holding the workpiece W is lowered from the top and installed, thereby, the surface treatment tank 100A is divided into the first tank 101 and the second tank 102. Here, if the first and second liquid ejection parts 200A and 200B are reciprocated, the liquid flow blocked and rebounded by the second and third guides 220 and 230 becomes a stirring flow that stirs the entire tank. At this time, the first liquid ejection part 200A can stir the treatment liquid in the first tank 101, and the second liquid ejection part 200B can stir the treatment liquid in the second tank 102, and the adverse effect of the stirring in one tank on the other can be eliminated.

[0077] In addition, the surface treatment tank 100A may have buffer tanks 107 and 108 on the outside of the two side wall portions 105 and 106, wherein the two side wall portions 105 and 106 are located at both ends in the reciprocating directions A and B. The opening 105A formed in the side wall portion 105 allows the first tank 101 to communicate with the buffer tank 107. The opening 105B formed in the side wall portion 105 allows the second tank 102 to communicate with the buffer tank 107. The opening 106A formed in the side wall portion 106 allows the first tank 101 to communicate with the buffer tank 108. The opening 106B formed in the side wall portion 106 allows the second tank 102 to communicate with the buffer tank 108. In this way, the treatment liquid pushed to the two ends of the treatment tank 100A by the liquid ejection part 200 (200A and 200B) can escape into the buffer tanks 107 and 108. In this way, the influence of the reflected waves of the processing liquid generated at both ends of the processing tank 100A can be reduced. In addition, the flow of the processing liquid between the first tank 101 and the second tank 102 can be ensured via the buffer tanks 107 and 108.

[0078] 2. Second Implementation

[0079] Figure 7 2 is a top view of a surface treatment device according to a second embodiment of the present invention. Figure 7 In the embodiment, the processing tank 100B may include a first processing tank 100B1 and a second processing tank 100B2, which are connected in a direction parallel to the reciprocating direction and divided by a first buffer tank 109. The fixture may include: a first fixture 10A, which holds the first workpiece W1 and divides the first processing tank 100B1 into a first tank 101 and a second tank 102; and a second fixture 10B, which holds the second workpiece W2 and divides the second processing tank 100B2 into a first tank 101 and a second tank 102. In this case, the first buffer tank 109 may include first to fourth openings 109A1, 109A2, 109B1, and 109B2 that connect the first tank 101 of the first processing tank 100B1, the first tank 101 of the second processing tank 100B2, the second tank 102 of the first processing tank 100B1, and the second tank 102 of the second processing tank 100B2. In addition, the first processing tank 100B1 may include a second buffer tank 107 on the outside of the first side wall portion 105 disposed at one end of the reciprocating direction, which allows the processing liquid to flow between the first tank 101 and the second tank 102 in the first processing tank 100B1. The second processing tank 100B2 may include a third buffer tank 108 on the outside of the second side wall portion 106 disposed at the other end of the reciprocating direction, which allows the processing liquid to flow between the first tank 101 and the second tank 102 in the second processing tank 100B2. In this way, the first workpiece W1 and the second workpiece W2 can be processed at the same time, which can play a role in Figure 1The same function and effect as the processing tank 100A. In addition, a central wall may be provided instead of the first buffer tank 109. In this case, the central wall may have: a first opening communicating with the first tank 101 of the first processing tank 100B1 and the first tank 101 of the second processing tank 100B2; and a second opening communicating with the second tank 102 of the first processing tank 100B1 and the second tank 102 of the second processing tank 100B2. However, in this case, the first tank 101 cannot be communicated with the second tank 102.

[0080] In addition, in the second embodiment, the first fixture 10A and the second fixture 10B may also be integrally formed. In addition, the two first liquid ejection components 200A may be driven by the same driving source, and the other two second liquid ejection components 200B may be driven by the same driving source. In addition, the surface treatment tank may be formed by connecting the first to Nth (N is an integer greater than 2) treatment tanks in a broad sense. When N≥3, (N-1) partition walls are arranged parallel to the side wall portions at both ends in the reciprocating direction.

[0081] Description of symbols

[0082] 1: Surface treatment device;

[0083] 2: Treatment fluid;

[0084] 10, 10A, 10B: fixture;

[0085] 12: fixture body;

[0086] 13A: lower part;

[0087] 13B: first side portion;

[0088] 13C: second side;

[0089] 14: rectangular hole;

[0090] 16A, 16B: protrusion;

[0091] 21, 41: first clamp;

[0092] 22, 42: second clamp;

[0093] 23, 43: third clamp;

[0094] 24, 44: fourth clamp;

[0095] 31A-34B2, 41A-44B2: conductive pattern;

[0096] 35A, 35B, 45A, 45B: terminal group;

[0097] 36A~37B: Wiring;

[0098] 100A, 100B: surface treatment tank;

[0099] 101: First slot;

[0100] 102: Second slot;

[0101] 103, 104: opening;

[0102] 105, 106: side wall portion;

[0103] 105A, 105B, 106A, 106B: opening;

[0104] 107, 108, 109: buffer tank;

[0105] 109A, 109B: first opening, second opening;

[0106] 110: lower supporting portion;

[0107] 120: upper supporting portion;

[0108] 142: first anode;

[0109] 152: second anode;

[0110] 200 (200A, 200B): liquid ejection component;

[0111] 201-204: First to fourth passages;

[0112] 210: first guide body;

[0113] 220: second guide body;

[0114] 230: third guide body;

[0115] 240: base end;

[0116] 250: fourth guide body;

[0117] 260: spacer;

[0118] 270A, 270B: moving mechanism;

[0119] 270A: first moving mechanism;

[0120] 270B: second moving mechanism;

[0121] W: workpiece;

[0122] W F : first main surface;

[0123] W B: The second main surface.

Claims

1. A surface treatment device, characterized in that: The surface treatment device comprises: a processing tank for receiving a processing liquid; an anode, which is disposed in the treatment tank; a jig for holding the workpiece immersed in the treatment liquid in a hanging manner and setting the workpiece as a cathode; a liquid ejection component disposed in the treatment liquid between the anode and the workpiece; as well as a moving mechanism that moves the liquid ejecting member relative to the workpiece, The liquid ejection component includes at least one pair of plates, the at least one pair of plates being formed between the anode and the workpiece along an extension direction toward the workpiece and being separately arranged in a direction intersecting the extension direction, and the treatment liquid flowing due to the movement of the liquid ejection component is guided between the at least one pair of plates and ejected toward the workpiece, The moving mechanism moves the liquid ejecting member in a reciprocating direction parallel to the workpiece. The liquid ejection component comprises: A first guide body having two surfaces intersecting the reciprocating direction; and The second guide and the third guide are respectively arranged with gaps between the two surfaces of the first guide, The at least one pair of plates comprises: a first pair of plates formed by the first guide body and the second guide body; and a second pair of plates formed by the first guide body and the third guide body, When the liquid ejection component moves in the forward movement direction in the reciprocating direction, the processing liquid blocked by the first guide body is guided along between the first pair of plates and ejected toward the workpiece. When the liquid ejecting member moves in the return movement direction of the reciprocating direction, the processing liquid blocked by the first guide body is guided along between the second pair of plate materials and ejected toward the workpiece.

2. The surface treatment device according to claim 1, characterized in that: The anode includes a first anode and a second anode disposed on both sides of the workpiece. The liquid ejection component includes: a first liquid ejection component, which is arranged between the first anode and the workpiece; and a second liquid ejection component, which is arranged between the second anode and the workpiece. The moving mechanism includes: a first moving mechanism that moves the first liquid ejecting member; and a second moving mechanism that moves the second liquid ejecting member.

3. The surface treatment device according to claim 2, characterized in that: The surface treatment device further includes a first driving source for applying driving force to the first moving mechanism and a second driving source for applying driving force to the second moving mechanism, and the first liquid ejecting member and the second liquid ejecting member are driven asynchronously.

4. The surface treatment device according to claim 2 or 3, characterized in that: The jig holding the workpiece is lowered from above the processing tank and installed, whereby the processing tank is divided into a first tank and a second tank.

5. The surface treatment device according to claim 4, characterized in that: The processing tank includes buffer tanks on the outer sides of two side walls, respectively, wherein the two side walls are located at both ends of the processing tank in the reciprocating direction, and the buffer tanks are connected to the first tank and the second tank to accommodate the processing liquid.

6. The surface treatment device according to claim 4, characterized in that: The processing tank includes a first processing tank and a second processing tank connected in a direction parallel to the reciprocating direction and divided by a first buffer tank, The fixture comprises: a first fixture that holds a first workpiece and divides the first processing tank into the first tank and the second tank; and a second fixture that holds a second workpiece and divides the second processing tank into the first tank and the second tank. The first buffer tank allows the treatment liquid to flow between the first tank of the first treatment tank, the first tank of the second treatment tank, the second tank of the first treatment tank, and the second tank of the second treatment tank. The first treatment tank includes a second buffer tank on the outer side of a first side wall portion located at one end of the reciprocating direction, which allows the treatment liquid to flow between the first tank and the second tank in the first treatment tank. The second treatment tank includes a third buffer tank on the outer side of a second side wall portion located at the other end in the reciprocating direction, for allowing the treatment liquid to flow between the first tank and the second tank in the second treatment tank.

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