Electronic devices with plastic covers featuring a sealed central boss

Abstract

An electronic device includes a housing (10, 10') having a through-hole (10A) disposed in a central portion of the housing (10, 10'). A printed circuit board (14) is attached to the housing (10, 10'). The printed circuit board (14) includes one or more electronic components disposed thereon. A plastic housing cover (12) is attached to the housing (10, 10') and covers (12) the printed circuit board (14). The housing cover (12) includes a centrally positioned pillar member (16) integral with the housing (10, 10'). The pillar member (16) extends through the through-hole (10A) of the housing (10, 10') and engages with the housing (10, 10'). The engagement between the housing (10, 10') and the housing cover (12) prevents the housing cover (12) from deflecting outward.

Description

Technical Field

[0001] The present invention generally relates to a housing cover for an electronic control unit housing that prevents the cover from deflecting outward. Background Technology

[0002] Electronic control units (ECUs) are typically installed in the engine compartment of a vehicle. These ECUs control many vehicle functions, such as fuel injector drivers and engine operation, by controlling a series of actuators based on inputs from sensors. A typical ECU has a circuit board housed within a housing. A cover mounted to the housing covers the circuit board. When the vehicle and thus the ECU are exposed to high altitudes, internal pressure can build up inside the ECU. In a sealed ECU where the cover is sealed relative to the housing, this internal pressure can cause the cover to deflect outwards, reducing the effectiveness of the seal. Using vents in the ECU can balance the pressure inside the housing, but this solution is not feasible when a sealed ECU is required by the customer. Using a cast cover can limit cover deflection. However, cast covers are expensive and very heavy. Some existing implementations use screws and related hardware to secure the center portion of the cover to the housing, but such solutions are not cost-effective. Summary of the Invention

[0003] The exemplary embodiments are generally directed to a method for assembling electronic devices and the resulting electronic devices, which are relatively simple in design and inexpensive to manufacture.

[0004] According to an exemplary embodiment, an electronic device includes a housing having a through-hole disposed in a central portion of the housing. A printed circuit board is connected to the housing and includes one or more electrical or electronic components disposed thereon. A housing cover is connected to the housing and covers the printed circuit board. The housing cover includes a centrally positioned post member integral with the housing. The post member extends through the through-hole of the housing and engages with the housing. The engagement between the housing and the housing cover prevents the housing cover from deflecting outward.

[0005] The housing cover has a plastic composition. The distal portion of the pillar member is formed around a through-hole in the housing, thereby forming a joint. The distal portion extends over the housing defining the through-hole.

[0006] In one implementation, the housing cover further includes a protrusion extending from the housing cover and surrounding the column member along a longitudinal segment of the column member. The housing also includes a recess, and a distal portion of the protrusion is disposed within the recess. A sealant is disposed in the recess and contacts the distal portion of the protrusion. The sealant forms a seal between the housing and the housing cover.

[0007] In another implementation, the portion of the housing with a defined through-hole opens toward the housing cover. A sealant is applied between the outer surface of this portion of the housing and the outer surface of the column member.

[0008] Another embodiment relates to a method for assembling an electronic device. The method includes obtaining a housing having a through-hole disposed along its central portion, a printed circuit board at least partially filled with the electronic device, and a plastic housing cover having a pillar member extending from its inner surface. The method further includes securing the printed circuit board to the housing, placing the housing cover over the printed circuit board such that the pillar member extends through the through-hole of the housing, and securing the housing cover to the housing. Heat and pressure are applied to a distal portion of the pillar member such that the pillar member is formed on a portion of the housing defining the through-hole and engaging with the housing portion. This engagement prevents the housing cover from deflecting outwards.

[0009] The housing cover includes a protrusion surrounding the column member along a longitudinal section, and the method further includes placing a sealant along the housing such that the sealant contacts the protrusion during placement of the housing cover. The sealant forms a seal with the protrusion. Specifically, the housing includes a recess, and the operation of placing the sealant includes placing the sealant in the recess. In one implementation, a portion of the housing defining a through-hole opens toward the housing cover, and the operation of placing the sealant includes placing the sealant such that the sealant contacts the outer surface of the portion of the housing. Attached Figure Description

[0010] The various aspects of the present invention will now be described in detail with reference to the accompanying drawings and exemplary embodiments, in which:

[0011] Figure 1 This is a cross-sectional side view of an electronic device according to an exemplary embodiment;

[0012] Figure 2 yes Figure 1 An exploded perspective view of an electronic device;

[0013] Figure 3 yes Figure 1 A partial cross-sectional side view of the electronic device before the housing cover is joined to the housing;

[0014] Figure 4 yes Figure 1 A partial cross-sectional side view of an electronic device, wherein a housing cover is attached to the housing of the electronic device;

[0015] Figure 5 yes Figure 1 A simplified cross-sectional side view of the electronic device before the housing cover is joined to the housing;

[0016] Figure 6 yes Figure 1 A perspective view of the housing cover according to another exemplary embodiment;

[0017] Figure 7 It has before the housing cover is joined to the housing. Figure 6A three-dimensional cross-sectional view of the housing cover of an electronic device;

[0018] Figure 8 It has Figure 6 A partial cross-sectional side view of an electronic device with a housing cover attached to the housing of the electronic device;

[0019] Figure 9 yes Figure 1 A partial cross-sectional view of an electronic device according to another exemplary embodiment, wherein a housing cover is attached to the housing of the electronic device; and

[0020] Figure 10 yes Figure 1 A flowchart of the assembly process for electronic devices. Detailed Implementation

[0021] The following description of exemplary embodiments is merely illustrative in nature and is in no way intended to limit the invention, its application, or its uses. Throughout the drawings and detailed description, the same reference numerals are used to identify the same or similar elements. For clarity, elements are not shown to scale unless otherwise stated.

[0022] Generally, exemplary embodiments relate to an electronic device comprising a housing and a housing cover, wherein the housing cover is engaged with the housing in a screwless and / or screwless manner in a central region of the housing cover, thereby preventing the housing cover from deflecting outward under varying pressure and temperature conditions. For example, the electronic device may be an electronic control unit of a vehicle.

[0023] Figure 1 An electronic device 1 is shown, having a housing 10 and a housing cover 12, the housing cover 12 being attached to the housing 10 via screws or other attachment mechanisms. A printed circuit board (PCB) 14 is disposed inside the housing 10 and attached thereto. The PCB 14 may at least partially house electrical and / or electronic components 14A. Figure 3 The electrical and / or electronic components 14A are electrically connected to each other and together perform one or more predetermined functions during operation of the electronic device. The housing 10 includes one or more sockets 17 that provide electrical connection between the electrical and / or electronic components 14A and devices external to the electronic device 1. The housing cover 12 is made of a plastic composition.

[0024] refer to Figure 2 and Figure 3 The electronic device 1 further includes a thermal interface material 15 disposed between the PCB 14 and the housing 10. The thermal interface material 15 is composed of a thermally conductive composition to provide a thermally conductive path between the PCB 14 and the housing 10 for cooling the PCB 14 and, in particular, cooling the electronic component 14A.

[0025] Electronic device 1 can operate under varying atmospheric conditions, which may result in pressure being applied to housing cover 12 in a direction away from housing 10. To prevent housing cover 12 from deflecting outward, housing cover 12 is attached to housing 10 in a central region. Housing cover 12 includes a post member 16 extending from the central region of the cover and fixedly attached to housing 10. This fixed attachment in the central region of housing cover 12 advantageously serves to prevent the cover from deflecting outward in a direction away from housing 10.

[0026] According to an exemplary embodiment, the pillar member 16 is integrally formed with the plastic housing cover 12. In one implementation, the housing cover 12 and the pillar member 16 are formed as molded members. In another implementation, the pillar member 16 is adhered to or otherwise attached to the housing cover 12 for integral formation with the cover. The pillar member 16 extends from the inner surface of the housing cover 12. Figure 3 As shown, the column member 16 includes a shoulder 16A, on which the PCB 14 rests.

[0027] exist Figure 2 and Figure 3 Most notably, the housing 10 includes a through-hole 10A disposed in the central region of the housing. Specifically, the through-hole 10A is configured such that the pillar member 16 of the housing cover 12 extends through the through-hole 10A. Figure 3 Furthermore, the housing 10 includes shoulders 10C extending toward the PCB 14 and providing a contact surface against which the PCB 14 is disposed, thereby providing a more stable and rigid connection between the housing 10 and the housing cover 12 in the region surrounding the pillar member 16. Each shoulder 10C has an annular shape. Figure 2 and Figure 3 In the embodiment shown, the shoulder 10C surrounds the column member 16 along the longitudinal segment of the column member 16. It should be understood that the shoulder 10C may have a shape other than an annular shape, and more or fewer than two shoulders 10C may be used.

[0028] In an exemplary embodiment, the pillar member 16 is secured to the housing 10. Since the housing 10 is secured to the housing cover 12 via the pillar member 16, and the pillar member 16 is disposed along the central region of the housing cover 12, it prevents the housing cover from deflecting outward and / or bending.

[0029] In one implementation, the column member 16 is fixed to the housing 10 using hot air riveting and / or thermoforming. Specifically, with the column member 16 extending through the through-hole 10A, the column member 16 is subjected to hot air (i.e., non-contact heating), allowing the distal end of the column member 16 to be formed and / or plastically deformed into different shapes. This pile (column member 16) is formed, clamped, and cooled under pressure using tools with lower temperatures. Figure 2 and Figure 3The column member 16 is shown prior to hot air riveting and / or heat fusion. Figure 4 The column member 16 is shown after its forming and cooling. As shown, the distal portion of the column member 16 is formed above a portion of the defining through-hole 10A of the housing 10, thereby securing the column member 16 (and the cover 12) to the housing 10. It is understood that hot air riveting and thermoforming are well known, therefore, for convenience, a more detailed description of the process of reforming and / or plastic deformation of the distal end of the column member 16 will not be provided.

[0030] In another exemplary embodiment, the electronic device 1 includes a member providing an additional seal between the housing 10 and the housing cover 12. (See reference...) Figure 5-8 The housing cover 12 includes a protrusion 20 extending from the housing cover and surrounding the pillar member 16 along a longitudinal section of the pillar member 16. The protrusion 20 is shown as having a generally cylindrical shape; however, it should be understood that the protrusion 20 can have different shapes. Furthermore, the housing 10 includes a recess 10B defined along the inner surface of the housing. The size and dimensions of the recess 10B are designed to receive the distal portion of the protrusion 20, such as... Figure 7 and Figure 8 As shown, this forms a mortise and tenon structure. Sealant 22 is disposed in the recess 10B between the housing 10 and the protrusion 20 and contacts the housing 10 and the protrusion 20, thereby providing a seal between the housing 10 and the housing cover 12. Figure 8 Sealant 22 may be applied to the notch 10B prior to hot air riveting / thermal welding to reshape the column member 16 and attach it to the housing 10. In this exemplary embodiment, a single shoulder 10C is used to provide a rigid connection between the housing 10 and the housing cover 12 in the region of the column member 16.

[0031] Figure 9A third exemplary embodiment is shown. This embodiment includes a housing 10' formed of a sheet of metal. As shown, a portion of the housing 10' defining a through-hole 10A flares inward toward a housing cover 12. Furthermore, the housing cover 12 includes a protrusion 20' extending from the housing cover, which substantially surrounds the column member 16 along a longitudinal segment of the column member 16 and provides a contact surface 23 against which the PCB 14 is disposed. The protrusion 20' and the PCB 14 form a groove 21 surrounding the longitudinal segment of the column member 16. The distal end of the flared portion of the housing 10' is disposed within the protrusion 20', and particularly within the groove 21, thereby forming a mortise and tenon structure. In an exemplary embodiment, the flared end of the housing 10' may be disposed in the central portion of the groove 21, substantially equidistantly spaced between the column member 16 and the protrusion 20'. Before performing the aforementioned hot air riveting / thermal fusion welding on the column member 16, sealant 22 is placed in the groove 21 such that the sealant 22 surrounds the open end of the housing 10' and forms a seal between the open end and the housing cover 12. The sealant 22 can be added to the groove 21 before or after the open end of the housing 10' is inserted into the groove 21.

[0032] Reference Figure 10 A method for assembling electronic device 1 is described. It can be understood that the sequence of actions described below can be compared with... Figure 10 The different sequences shown are performed. Initially, at 1000, a housing 10, a PCB 14, a thermal interface material 15, and a housing cover 12 are provided. At 1002, the PCB 14 is secured to the housing 10, such as with one or more screws, adhesives, etc. At 1004, a sealant 22 is applied to the housing 10 and / or the pillar member 16. Then, at 1006, the housing cover 12 is secured to the housing 10. This securing can be performed using screws, adhesives, or other known mechanisms. Securing the housing cover 12 to the housing 10 allows the sealant 22 to come into contact, dry / cure, and form a seal between the cover and the housing. The pillar member 16, currently extending through the through-hole 10A of the housing 10, has a generally cylindrical shape. At 1008, hot air riveting and / or thermal fusion are performed, which reshapes the distal end of the pillar member 16 so that it is positioned above the portion of the housing 10 directly surrounding the through-hole 10A, thereby joining the central portion of the housing cover 12 to the housing 10.

[0033] The invention has been described herein in an illustrative manner, and it should be understood that the terminology used is intended to be descriptive rather than limiting. Clearly, many modifications and variations of the invention are possible based on the foregoing teachings. The invention can be practiced in addition to those specifically described within the scope of the appended claims.

Claims

1. An electronic device, comprising: A housing (10, 10'), the housing (10, 10') including a through hole (10A) provided in the central portion of the housing (10, 10'); A printed circuit board (14) connected to the housing (10, 10'), the printed circuit board (14) including one or more electrical or electronic components disposed thereon; and A housing cover (12) is attached to the housing (10, 10') and covers the printed circuit board (14). The housing cover (12) includes a centrally located pillar member (16) integral with the housing (10, 10'), the pillar member (16) extending through the through-hole (10A) of the housing (10, 10') and engaging with the housing (10, 10'). The engagement between the housing (10, 10') and the housing cover (12) prevents the housing cover (12) from deflecting outward. The housing cover (12) further includes protrusions (20, 20') extending from the housing cover (12) and surrounding the column member (16) along a longitudinal segment. The housing (10, 10') includes a recess (10B), and the distal portion of the protrusion (20, 20') is disposed in the recess (10B).

2. The electronic device according to claim 1, wherein, The housing cover (12) comprises a plastic composition.

3. The electronic device according to claim 2, wherein, The distal portion of the column member (16) is formed around the through hole (10A) of the housing (10, 10'), thereby forming the engagement.

4. The electronic device according to claim 3, wherein, The distal portion extends above the housing (10, 10') that defines the through hole (10A).

5. The electronic device according to claim 1, further comprising a sealant (22) disposed in the recess (10B) and contacting the distal portion of the protrusion (20, 20'), the sealant (22) forming a seal between the housing (10, 10') and the housing cover (12).

6. The electronic device according to claim 1, wherein, The portion of the housing (10, 10') that defines the through hole (10A) opens toward the housing cover (12).

7. The electronic device according to claim 6, further comprising a sealant (22) disposed between the outer surface of the portion and the outer surface of the column member (16).

8. A method for assembling electronic devices, comprising: A housing (10, 10') having a through hole (10A) provided along its central portion, a printed circuit board (14) at least partially housing electronic equipment, and a plastic housing cover (12) having a column member (16) extending from its inner surface are obtained. The printed circuit board (14) is fixed to the housing (10, 10'); The housing cover (12) is placed above the printed circuit board (14) such that the pillar member (16) extends through the through hole (10A) of the housing (10, 10'); Secure the housing cover (12) to the housing (10, 10'); and Heat and pressure are applied to the distal portion of the column member (16), such that the column member (16) is formed on the portion of the housing (10, 10') that defines the through hole (10A) and partially engages with the housing (10, 10'), the engagement preventing the housing cover (12) from deflecting outward. The housing cover (12) includes protrusions (20, 20') surrounding the column member (16) along a longitudinal section of the column member (16), and the method further includes placing a sealant (22) along the housing (10, 10') such that the sealant (22) contacts the protrusions (20, 20') during placement of the housing cover (12), and the sealant (22) forms a seal with the protrusions (20, 20'). The housing (10, 10') includes a notch (10B), and the operation of placing the sealant (22) includes placing the sealant (22) in the notch (10B).

9. The method according to claim 8, wherein, The portion of the housing (10, 10') that defines the through hole (10A) is opened toward the housing cover (12), and the operation of placing the sealant (22) includes placing the sealant (22) such that the sealant (22) contacts the outer surface of the portion of the housing (10, 10').

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