Laser processing device

Abstract

The application discloses a laser processing device, comprising a laser source, a zoom assembly, a galvanometer assembly and a reflection assembly; the laser source is used for emitting laser; the zoom assembly comprises a plurality of lens groups, and is used for converging the laser emitted by the laser source; the galvanometer assembly is used for receiving the laser emitted by the zoom assembly, so that the laser is emitted at a preset angle; the reflection assembly is arranged between the galvanometer assembly and a workpiece, and comprises a plurality of mirrors, and is used for receiving the laser emitted by the galvanometer assembly and reflecting the laser to the workpiece, changing the direction of the laser to process the workpiece; the distance between the plurality of lens groups is adjustable, and is used for adjusting the main surface position of the zoom assembly, and then adjusting the focal point position of the laser reflected to the workpiece. The laser processing device can reduce the phenomenon of processing overlap and missed processing, and improve the processing quality.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and specifically to a laser processing device. Background Technology

[0002] In general production, lasers are used to perform welding, marking, cutting, and surface treatment on workpieces. When processing sidewalls with an angle of less than or equal to 90° between the sidewall and the bottom wall, the laser cannot achieve precision processing through galvanometer polarization, resulting in overlapping or missed processing on the sidewall. Summary of the Invention

[0003] In view of the above, it is necessary to propose a laser processing device to reduce processing overlap and missed processing when performing surface treatment on the sidewall of a workpiece where the angle between the upper sidewall and the bottom wall is less than or equal to 90°.

[0004] This application provides a laser processing apparatus for processing workpieces. The laser processing apparatus includes a laser source, a zoom component, a galvanometer component, and a reflection component. The laser source emits laser light. The zoom component includes multiple lens groups for focusing the laser light emitted by the laser source. The galvanometer component receives the laser light emitted by the zoom component, causing the laser light to exit at a preset angle. The reflection component is disposed between the galvanometer component and the workpiece. The reflection component includes multiple mirrors for receiving the laser light emitted by the galvanometer component and reflecting the laser light back to the workpiece, thereby changing the direction of the laser light to process the workpiece. The distance between the multiple lens groups is adjustable to adjust the position of the main surface of the zoom component, and thus adjust the focal point position reflected to the workpiece.

[0005] In use, the aforementioned laser processing device focuses the laser emitted from the laser source through a zoom assembly, causing the laser beam to be incident on the galvanometer assembly in the form of a focused beam. The galvanometer assembly receives the laser emitted through the zoom assembly and changes its direction, causing the laser to exit at a preset angle. The reflection assembly receives the laser emitted through the galvanometer assembly and reflects it onto the workpiece, changing the direction of the laser to process the workpiece, thereby realizing the laser processing operation on the workpiece. In this process, the size of the focused spot reflected onto the workpiece changes with the height difference of the upper sidewall of the workpiece. The distance between the multiple lens groups of the zoom assembly can also be adjusted to adjust the position of the main surface of the zoom assembly, thereby adjusting the position of the focused spot reflected onto the workpiece. This allows the laser to maintain a focused state as the height difference of the upper sidewall of the workpiece changes, avoiding insufficient uniformity of the surface treatment of the workpiece due to drastic changes in the size of the focused spot, thus affecting the processing quality.

[0006] In some embodiments, the plurality of the reflectors are arranged in a uniform ring.

[0007] In some embodiments, the reflective assembly further includes a plurality of driving elements, each of which corresponds to a plurality of reflectors, and each driving element is used to drive the corresponding reflector to rotate.

[0008] In some embodiments, the driving member drives the reflector to rotate so that the laser is reflected by the reflector at an angle ranging from 30° to 65°.

[0009] In some embodiments, the reflector is provided with at least one of a metal film and a dielectric film, wherein the metal film is made of silver and the dielectric film is made of calcium fluoride.

[0010] In some embodiments, along the emission direction of the laser, the zoom assembly includes: a beam expanding lens group for expanding the laser emitted by the laser source; a collimating and focusing lens group for collimating and initially focusing the expanded laser; and a focusing lens group for secondary focusing of the collimated and initially focused laser, so that the laser is emitted in the form of a converged ray; wherein the collimating and focusing lens group and the focusing lens group are movable relative to the beam expanding lens group to adjust the position of the main surface of the zoom assembly.

[0011] In some embodiments, along the emission direction of the laser, the collimating and focusing lens group includes: a first lens for collimating the expanded laser beam, the first lens being a convex lens; and a second lens for correcting the divergence angle of the collimated laser beam to achieve single-pass convergence, the second lens being a crescent-shaped lens.

[0012] In some embodiments, the beam-expanding lens group includes a third lens for expanding the laser beam emitted by the laser source, wherein the third lens is a crescent-shaped lens.

[0013] In some embodiments, the focusing lens group includes a fourth lens for secondary focusing of the laser beam after it has been aligned and focused once, wherein the fourth lens is a convex lens.

[0014] In some embodiments, the beam waist of the converging beam ranges from 42 μm to 49 μm.

[0015] The laser processing apparatus of this application, through the coordinated operation of the zoom assembly, galvanometer assembly, and reflector assembly, can achieve multi-angle and omnidirectional coverage of the workpiece's sidewall. The apparatus can process the workpiece's sidewall without requiring multiple movements of the workpiece, reducing laser splicing errors caused by the inaccuracy of the motion axis, thereby reducing processing overlap and missed areas. Because the workpiece does not need to move multiple times and the laser has a fast response characteristic, processing time can be effectively shortened, and manufacturing costs reduced. Furthermore, by adjusting the distance between multiple lens groups, the main surface position of the zoom assembly is adjustable, allowing the laser to maintain focus regardless of changes in the height difference of the sidewall. The size of the focused spot changes as required, improving the uniformity of the focused spot and avoiding insufficient surface treatment uniformity caused by drastic changes in the size of the focused spot, thus improving processing quality. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the laser processing apparatus provided in the embodiments of this application.

[0017] Figure 2 yes Figure 1 A schematic diagram of the laser processing device shown.

[0018] Figure 3 This is a schematic diagram of laser processing of a workpiece.

[0019] Figure 4 This is a schematic diagram of laser processing another type of workpiece.

[0020] Figure 5 This is a schematic diagram of another type of workpiece processed by laser.

[0021] Figure 6 This is a schematic diagram of the optical path of a laser processing device.

[0022] Explanation of main component symbols

[0023] Laser processing equipment 100

[0024] Laser source 10

[0025] Zoom component 20

[0026] Main position 22

[0027] Beam expander lens group 24

[0028] Third lens 242

[0029] Collimating and focusing lens group 26

[0030] First lens 262

[0031] Second lens 264

[0032] Focusing lens group 28

[0033] Fourth lens 282

[0034] Galvanometer assembly 30

[0035] Reflective component 40

[0036] Mirror 42

[0037] Drive component 44

[0038] Workpieces 200a, 200b, 200c

[0039] Inner wall 202, 204, 206

[0040] Bottom wall 203, 205, 207

[0041] Optical axis 300

[0042] Focal plane 400 Detailed Implementation

[0043] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0044] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, it should be noted that "multiple" means two or more, unless otherwise explicitly specified.

[0045] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0046] In related technologies, when surface treating the sidewall of a workpiece where the angle between the upper and lower sidewalls is less than or equal to 90°, a multi-axis motion mechanism is required to move the workpiece multiple times so that the laser can perform surface treatment on the sidewall. However, due to changes in the accuracy of the axes after each movement, errors in the workpiece's position occur, leading to splicing errors during the surface treatment of the sidewall. This results in overlapping or missed areas on the sidewall, affecting the processing quality. Furthermore, the need for multiple movements by the multi-axis motion mechanism increases processing time and manufacturing costs.

[0047] The following will describe some embodiments of this application in detail with reference to the accompanying drawings.

[0048] Please see Figure 1 This application provides a laser processing apparatus 100 in some embodiments. The laser processing apparatus 100 is used to process workpieces. The workpiece can be a three-dimensional structure, for example... Figure 3 The wide-mouthed workpiece 200a shown Figure 4 The cylindrical workpiece 200b shown, and Figure 5 The workpiece 200c shown is narrow-mouthed. Obviously, the workpiece can also be a cube, sphere, or other shape.

[0049] Please refer to the following: Figure 1 and Figure 2 The laser processing device 100 includes a laser source 10, a zoom component 20, a galvanometer component 30, and a reflection component 40.

[0050] Specifically, the laser source 10 is used to emit laser light. The zoom assembly 20 includes multiple lens groups and is used to focus the laser light emitted by the laser source 10, so that the laser light exits from the zoom assembly 20 in the form of a focused beam. The galvanometer assembly 30 is used to receive the laser light emitted from the zoom assembly 20, so that the laser light exits at a preset angle. The reflection assembly 40 is disposed between the galvanometer assembly 30 and the workpiece. The reflection assembly 40 includes multiple reflectors 42, which are used to receive the laser light emitted from the galvanometer assembly 30 and reflect the laser light back to the workpiece, thereby changing the direction of the laser light to process the workpiece. The distance between the multiple lens groups is adjustable, and by adjusting the distance between the multiple lens groups, the position 22 of the main surface of the zoom assembly 20 is adjusted (see [reference]). Figure 6 This allows for the adjustment of the focal position of the reflection onto the workpiece. Figure 1 In the process, the laser is finally reflected by the reflective component 40 onto the focal plane 400, which is perpendicular to the optical axis 300.

[0051] When the aforementioned laser processing apparatus 100 is in use, the laser source 10 emits a laser beam, which is incident on the zoom assembly 20. The zoom assembly 20 focuses the laser emitted by the laser source 10, causing the laser beam to be incident on the galvanometer assembly 30 in the form of a focused beam. The galvanometer assembly 30 receives the laser emitted from the zoom assembly 20 and changes the direction of the laser, causing the laser to exit at a preset angle and be incident on the corresponding reflector 42 of the reflector assembly 40. The reflector 42 receives the laser emitted from the galvanometer assembly 30 and reflects the laser onto the inner wall of the workpiece. At the same time, the laser is focused onto the inner wall of the workpiece in a focused manner. By changing the direction of the laser, the inner wall of the workpiece is processed, thereby realizing the laser processing operation on the inner wall of the workpiece. In this process, the laser is reflected onto the inner wall of the workpiece by the reflector 42 of the reflector assembly 40. Since the workpiece is... Figure 3 , Figure 4 or Figure 5 In the three-dimensional structure shown, the focused spot of the laser reflected onto the inner wall of the workpiece changes with the height difference of the inner wall. Specifically, the size of the focused spot changes, and the distance between the multiple lens groups of the zoom assembly 20 is adjusted accordingly to adjust the position 22 of the main surface of the zoom assembly 20, thereby adjusting the focal position reflected onto the workpiece. This allows the laser to maintain a focused state on the inner wall of the workpiece as the height difference of the inner wall changes. Specifically, the rate of change of the focused spot size meets the requirements, thereby improving the uniformity of the focused spot and avoiding insufficient uniformity of the surface treatment of the inner wall of the workpiece caused by drastic changes in the size of the focused spot. This reduces the phenomenon of processing overlap and missed processing, which is conducive to improving the processing quality.

[0052] Understandably, the laser source 10 serves as a laser output head, used to be driven to emit a laser beam. Preferably, the laser source 10 can be selected with different laser output powers in different application scenarios.

[0053] In some embodiments, multiple reflectors 42 are arranged uniformly in a circumferential direction and are tilted. In this embodiment, the number of reflectors 42 is four. Thus, by uniformly arranging multiple reflectors 42, the laser can be incident on the inner wall of the workpiece from all directions through reflection by the multiple reflectors 42 of the reflecting assembly 40, facilitating omnidirectional and full-coverage laser processing of the inner wall of the workpiece. By tilting the reflectors 42, the polarization effect of the reflectors 42 is reduced. Furthermore, by uniformly arranging multiple reflectors 42, the laser can perform laser processing on a workpiece within a 20mm range on the focal plane 400.

[0054] In other embodiments, the number of reflectors 42 can be more, such as six, eight, ten, etc. It is understood that the more reflectors 42 there are, the more precise the laser processing can be, but at the same time, controlling the movement of multiple reflectors 42 will also be relatively more complex. The appropriate number of reflectors 42 can be selected by comprehensively evaluating both the precision of the processing and the complexity of controlling the reflectors 42.

[0055] In some embodiments, each reflector 42 is provided with at least one of a metal film and a dielectric film. For example, the reflector 42 is provided with two metal films and two dielectric films, or it is provided with three dielectric films, or it is provided with three metal films. The metal film is made of silver, and the dielectric film is made of calcium fluoride. Thus, by providing at least one of a metal film and a dielectric film on the reflector 42, the reflectivity of the reflector 42 is improved, laser attenuation is reduced, and the laser power during processing is increased.

[0056] In some embodiments, the reflective assembly 40 further includes a plurality of driving members 44, each corresponding to a plurality of reflectors 42. Each driving member 44 drives the corresponding reflector 42 to rotate or deflect, so that the reflection angle of the laser reflected by the reflector 42 is in the range of 30°-65°. Thus, by setting the driving members 44 to drive the reflector 42 to rotate or polarize, the angle at which the reflector 42 reflects the laser is increased, allowing the laser to be incident on the inner wall of the workpiece at a set reflection angle. Furthermore, by limiting the reflection angle range of the laser reflected by the reflector 42 to 30°-65°, the reflectivity of the reflector 42 can be greater than or equal to 99%, thereby greatly improving the reflectivity of the reflector 42. In addition, the driving members 44 drive the reflector 42 to rotate or polarize and cooperate with the galvanometer assembly 30 to further expand the angle at which the laser can be incident on the inner wall of the workpiece, facilitating all-round, full-coverage laser processing of the workpiece. It should be noted that the galvanometer assembly 30 drives the X-axis galvanometer mirror and the Y-axis galvanometer mirror to deflect via a voice coil motor, thereby deflecting the direction of the laser. The relevant structure of the galvanometer assembly 30 will not be described in detail in this embodiment.

[0057] In one specific implementation, the drive element 44 can be a voice coil motor.

[0058] In other specific embodiments, the driving element 44 may also be a functional mechanism such as a motor or shape memory alloy that can drive the reflector 42 to rotate or deflect.

[0059] Please see Figure 3 The laser processing device 100 processes, for example, Figure 3 When the wide-mouth workpiece 200a is shown, its inner wall 202 and bottom wall 203 form an outwardly expanding structure (the angle between the inner wall 202 and the bottom wall 203 is an obtuse angle). The angle d between the inner wall 202 and the optical axis 300 is 10° or less than 10°. The laser is incident on the inner wall of the wide-mouth workpiece 200a through the zoom assembly 20, the galvanometer assembly 30, and the reflector 42. The reflector 42 is driven to rotate by the galvanometer assembly 30 and the driving component 44 to change the incident direction of the laser. With the cooperation of the zoom assembly 20, the laser can be incident on any position of the inner wall 202 and the laser can maintain a focused state at any position of the inner wall 202 of the workpiece 200a, thereby performing laser processing on the inner wall 202 of the workpiece 200a in an all-round, full-coverage and effective manner. A conventional laser with only a focusing system and a galvanometer system cannot process workpieces with an angle d ≤ 10° between the inner wall 202 and the optical axis 300. It should be noted that when the angle d between the inner wall 202 and the optical axis 300 is greater than 10°, the laser processing apparatus 100 of this embodiment can still perform laser processing on the workpiece 200a.

[0060] Please see Figure 4 The laser processing device 100 processes, for example, Figure 4 When the cylindrical workpiece 200b is shown, its inner wall 204 and bottom wall 205 form a cylindrical space (the angle between the inner wall 204 and the bottom wall 205 is approximately 90°). The inner wall 204 is parallel to the optical axis 300. The laser is incident on the inner wall 204 of the cylindrical workpiece 200b through the zoom assembly 20, the galvanometer assembly 30, and the reflector 42. The reflector 42 is driven to rotate by the galvanometer assembly 30 and the driving component 44 to change the incident direction of the laser. With the cooperation of the zoom assembly 20, the laser can be incident on any position of the inner wall 204 and the laser can be kept focused at any position of the inner wall 204 of the workpiece 200b. Thus, the inner wall 204 of the workpiece 200b can be laser-processed in an all-round, full-coverage and effective manner.

[0061] Please see Figure 5 The laser processing device 100 processes, for example, Figure 5 When the narrow-mouth workpiece 200c is shown, the cross-section between its inner wall 206 and bottom wall 207 is similar to a dovetail groove structure (the angle between the inner wall 206 and bottom wall 207 is an acute angle). The angle f between its inner wall 206 and the optical axis 300 is 30° or any angle greater than 0° and less than 90°. The laser is incident on the inner wall 206 of the narrow-mouth workpiece 200c through the zoom assembly 20, the galvanometer assembly 30, and the reflector 42. The reflector 42 is driven to rotate by the galvanometer assembly 30 and the driving component 44 to change the incident direction of the laser. With the cooperation of the zoom assembly 20, the laser can be incident on any position of the inner wall 206 and the laser can be kept focused at any position of the inner wall 206 of the workpiece 200c, so as to perform laser processing on the inner wall 206 of the workpiece 200c in an all-round, full-coverage and effective manner. Understandably, in some other embodiments, the inner wall 206 of the narrow-mouthed workpiece 200c may also be a concave curved surface in a direction away from the optical axis 300. The laser processing apparatus 100 of this application can still perform laser processing on the narrow-mouthed workpiece 200c with a concave curved surface of the inner wall 206.

[0062] Please see Figure 6 In some embodiments, along the laser emission direction, the zoom assembly 20 includes a beam expander lens group 24, a collimating and focusing lens group 26, and a focusing lens group 28.

[0063] Specifically, the beam-expanding lens group 24 is used to expand the laser beam emitted by the laser source 10. The collimating and focusing lens group 26 is used to collimate and initially focus the expanded laser beam. The focusing lens group 28 is used to perform secondary focusing on the collimated and initially focused laser beam, so that the laser beam is emitted in the form of a converged ray. The collimating and focusing lens group 26 and the focusing lens group 28 can move relative to the beam-expanding lens group 24 to adjust the principal plane position 22 of the zoom assembly 20. The principal plane position 22 is formed by the intersection of the extension lines of the incident and emitted laser beams; when the principal plane position 22 changes, the focal plane 400 also changes accordingly.

[0064] In related technologies, principal points and principal planes are specialized terms in ideal optical systems. They are defined as a pair of conjugate points in the conjugate space where the axial magnification remains unchanged after a ray passes through that point. A plane perpendicular to the principal axis formed by combining these conjugate points is called a principal plane. Rays propagate between two conjugate principal planes. The principal plane is a virtual plane used to conveniently describe an optical system formed by multiple lens groups. A significant advantage of introducing the concept of principal planes in optical systems is that, after replacing the actual optical system with an equivalent ideal optical system, the multiple refractions and reflections of the actual system can be replaced by a single deflection of the conjugate ray direction at the principal plane.

[0065] Thus, by moving the collimating and focusing lens group 26 and the focusing lens group 28, the principal surface position 22 of the zoom assembly 20 is adjusted to keep the laser incident on the inner wall of the workpiece in a focused state, without significantly changing the effective focal length of the laser. The laser can achieve the diffraction limit at different positions on the inner wall of the workpiece. By changing the principal surface position 22 of the zoom assembly 20, the working distance of the laser processing device 100 is increased, the range of effective focal length variation is reduced, thereby reducing the rate of change of the focused spot and improving the uniformity of the focused spot, thus enhancing the uniformity of laser processing. The movement range of the principal surface position 22 is less than 5 mm, and the laser processing device 100 can achieve a zoom distance greater than or equal to 120 mm.

[0066] Understandably, in this embodiment, the main surface position 22 of the zoom component 20 is located on the side of the galvanometer component 30 away from the zoom component 20, so that the laser can be focused on the workpiece after passing through the galvanometer component 30 and the reflection component 40.

[0067] In one specific embodiment, the collimating focusing lens group 26 and the focusing lens group 28 are moved by voice coil motors.

[0068] In some embodiments, along with the laser emission method, the collimating and focusing lens group 26 includes a first lens 262 and a second lens 264. The first lens 262 is used to collimate the expanded laser beam, and the first lens 262 is a convex lens; the second lens 264 is used to correct the divergence angle of the collimated laser to achieve single-pass convergence, and the second lens 264 is a crescent-shaped lens. Thus, by setting the collimating and focusing lens group 26 to include a first lens 262 (a convex lens) and a second lens 264 (a crescent-shaped lens), the effects of collimation and focusing are achieved.

[0069] The beam-expanding lens group 24 includes a third lens 242, which is used to expand the laser beam emitted by the laser source 10. The third lens 242 is a crescent-shaped lens. Thus, by including the crescent-shaped third lens 242 in the beam-expanding lens group 24, the beam-expanding lens group 24 achieves the beam-expanding effect. The third lens 242 can be made of fused silica material to meet the needs of high and low power applications ranging from 10W to 20000W. In a specific embodiment, the beam-expanding lens group 24 can be a fixed-magnification beam expander or a variable-magnification beam expander, with the magnification range preferably between 1.5x and 10x.

[0070] The focusing lens group 28 includes a fourth lens 282, which is used to further converge the laser light after the initial convergence. The fourth lens 282 is a convex lens. Thus, by including the fourth lens 282, which is a convex lens, the focusing lens group 28 achieves the effect of further converging the laser light, so that the laser light is emitted in a converged form.

[0071] In some embodiments, the beam waist of the converging beam emitted from the zoom assembly 20 can be in the range of 42μm-49μm. Thus, by limiting the range of the beam waist, the rate of change of the focused laser spot is less than 15%, avoiding insufficient uniformity of the surface treatment of the workpiece due to drastic changes in the size of the focused spot.

[0072] The laser processing apparatus 100 provided in this application embodiment, through the coordinated cooperation between the zoom assembly 20, the galvanometer assembly 30, and the reflector assembly 40, can achieve multi-angle and all-round coverage of the workpiece. The laser processing apparatus 100 can perform laser processing on the inner sidewall of the workpiece without the workpiece needing to move multiple times by a multi-axis motion mechanism. Compared with related technologies, this reduces the phenomenon of laser splicing errors caused by the accuracy of the motion axes, thereby reducing processing overlap and missed processing. Since the workpiece does not need to move multiple times by a multi-axis motion mechanism, and the laser has the characteristic of fast response, the processing time can be effectively shortened and the manufacturing cost reduced. In addition, by adjusting the distance between multiple lens groups, the main surface position 22 of the zoom assembly 20 is adjustable, and the focal plane 400 can be adjusted with the position of the main surface position 22, so that the laser can maintain a focused state as the height difference of the inner sidewall of the workpiece changes. The rate of change of the size of the focused spot meets the requirements, which is conducive to improving the uniformity of the focused spot and avoiding insufficient uniformity of the surface treatment of the workpiece caused by the rapid change of the size of the focused spot, thus improving the processing quality.

[0073] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be regarded as exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be embraced within this application.

[0074] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1.A laser processing device for processing a workpiece, the laser processing device comprising: a laser source for emitting a laser; a zoom assembly comprising a plurality of lens groups for converging the laser emitted by the laser source such that the laser exits the zoom assembly in the form of a convergent light beam; a galvanometer assembly for receiving the laser exiting the zoom assembly such that the laser exits at a preset angle; a reflection assembly disposed between the galvanometer assembly and the workpiece, the reflection assembly comprising a plurality of mirrors for receiving the laser exiting the galvanometer assembly and reflecting the laser to the workpiece, changing the direction of the laser to process the workpiece; wherein the distance between the plurality of lens groups is adjustable for adjusting the position of the main surface of the zoom assembly, and further adjusting the position of the focal point reflected to the workpiece, the range of the beam waist of the convergent light beam exiting the zoom assembly being 42 μm-49 μm, such that the variation rate of the focused spot of the laser is less than 15%. 2.The laser processing device of claim 1, wherein the plurality of mirrors are arranged in a ring shape uniformly. 3.The laser processing device of claim 2, wherein the reflection assembly further comprises a plurality of driving members, the plurality of driving members corresponding to the plurality of mirrors one by one, each of the driving members being configured to drive the corresponding mirror to rotate. 4.The laser processing device of claim 3, wherein the driving member drives the mirror to rotate such that the reflection angle of the laser reflected by the mirror ranges from 30° to 65°. 5.The laser processing device of claim 1, wherein the mirror is provided with at least one of a metal film and a dielectric film, the metal film being made of silver, and the dielectric film being made of calcium fluoride. 6.The laser processing device of claim 1, wherein, along the emission direction of the laser, the zoom assembly comprises: a beam expanding lens group for expanding the laser emitted by the laser source; a collimating and focusing lens group for collimating and converging the laser after expansion; and a focusing lens group for converging the laser after collimating and converging once, such that the laser exits in the form of convergent light rays; wherein the collimating and focusing lens group and the focusing lens group are movable relative to the beam expanding lens group to adjust the position of the main surface of the zoom assembly. 7.The laser processing device of claim 6, wherein, along the emission direction of the laser, the collimating and focusing lens group comprises: a first lens for collimating the laser after expansion, the first lens being a convex lens; and a second lens for correcting the divergence angle of the laser after collimating to achieve converging once, the second lens being a crescent lens. 8.The laser processing device of claim 6, wherein the beam expanding lens group comprises: a third lens for expanding the laser emitted by the laser source, the third lens being a crescent lens. 9.The laser processing device of claim 6, wherein the focusing lens group comprises: ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ A fourth lens for twice converging the laser light after collimation and once convergence, the fourth lens being a convex lens. A fourth lens for twice converging the laser light after collimation and once convergence, the fourth lens being a convex lens.

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