Display panel, preparation method thereof and display device

Abstract

A display panel (100) has a display area (AA) and a wiring area (BB) located at least one side of the display area (AA). The display panel (100) comprises a display substrate (1) and a protective film (2), the protective film (2) comprises a first protective part (21) and a second protective part (22), the first protective part (21) is arranged on the display side (1A) of the display substrate and covers the display area (AA); the second protective part (22) covers the wiring area (BB) and is bent from the display side (1A) of the display substrate (1) to the non-display side (1B) of the display substrate through the side (S) of the display substrate (1), wherein the second protective part (22) comprises a main film layer (23) and a wiring layer (24) arranged on the side of the main film layer (23) close to the display substrate (1), the wiring layer (24) comprises a plurality of wirings (241), at least one wiring (241) extends from the wiring area (BB) to the non-display side (1B) of the display substrate (1) through the side (S) of the display substrate (1).

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular, to a display panel, a manufacturing method thereof, and a display device. BACKGROUND

[0002] Mini LED(mini Light-Emitting Diode, mini light-emitting diode) technology / Micro LED(Micro Light-Emitting Diode, micro light-emitting diode) technology is known as the third generation display technology. In the process of preparing a Mini / Micro LED display panel, a large number of transferred LED chips are prone to bad points, which need to be repaired, bringing challenges to the preparation of large-size display panels (for example, display walls).

[0003] At present, the preparation of a large-size display panel can be realized by splicing small-size display panels into a large-size display panel.

[0004] DISCLOSURE

[0005] In one aspect, a display panel is provided. The display panel has a display area and a wiring area located at least one side of the display area. The display panel includes a display substrate and a protective film, the protective film including a first protective portion and a second protective portion, the first protective portion being disposed on a display side of the display substrate and covering the display area. The second protective portion covers the wiring area and is bent from the display side of the display substrate to a non-display side of the display substrate via a side surface of the display substrate. The second protective portion includes a main film layer and a wiring layer disposed on a side of the main film layer close to the display substrate, the wiring layer including a plurality of wirings, at least one wiring extending from the wiring area to the non-display side of the display substrate via the side surface of the display substrate.

[0006] In some embodiments, the first protective portion includes a first black adhesive layer, the main film layer includes a second black adhesive layer, and the first black adhesive layer and the second black adhesive layer are integrally formed. The wiring layer is located on a side of the second black adhesive layer close to the display substrate.

[0007] In some embodiments, the first protective portion further includes a first white adhesive layer disposed on a side of the first black adhesive layer close to the display substrate. The main film layer further includes a second white adhesive layer disposed between the second black adhesive layer and the wiring layer. The first white adhesive layer and the second white adhesive layer are integrally formed.

[0008] In some embodiments, the second protective portion further includes a carrier layer disposed between the main film layer and the wiring layer. The wiring layer is fixed on the carrier layer, and the carrier layer is bonded to the main film layer.

[0009] In some embodiments, the material of the trace layer comprises a photoconductive conductive material.

[0010] In some embodiments, the first protection portion and the main film layer are integrally formed.

[0011] In some embodiments, the display substrate comprises at least one first alignment mark, and the protection film further comprises at least one second alignment mark located on the display side of the display substrate. The at least one second alignment mark is configured to align with the at least one first alignment mark to determine the relative position of the protection film and the display substrate.

[0012] In some embodiments, the display substrate further comprises at least one third alignment mark, and the protection film further comprises at least one fourth alignment mark located on the non-display side of the display substrate. The at least one fourth alignment mark is configured to align with the at least one third alignment mark to determine the relative position of the protection film and the display substrate.

[0013] In some embodiments, the second alignment mark is of the same material and is disposed in the same layer as the plurality of traces. In the case that the protection film further comprises a fourth alignment mark, the fourth alignment mark is of the same material and is disposed in the same layer as the plurality of traces.

[0014] In some embodiments, the display substrate comprises a first pin and a second pin located in the trace area, the first pin is disposed on the display side of the display substrate, and the second pin is disposed on the non-display side of the display substrate. One end of the at least one trace is coupled to the first pin, and the other end is coupled to the second pin.

[0015] In some embodiments, the display panel has a first trace area and a second trace area located on opposite sides of the display area. The protection film comprises two second protection portions, and the two second protection portions are respectively located on opposite sides of the first protection portion.

[0016] In another aspect, a display device is provided. The display device comprises a display panel as described in any of the above embodiments.

[0017] In yet another aspect, a method for manufacturing a display panel is provided. The display panel has a display area and a trace area located on at least one side of the display area. The method comprises manufacturing a protection film. The protection film comprises a first protection portion and a second protection portion located on at least one side of the first protection portion. The second protection portion comprises a main film layer and a trace layer disposed on one side of the main film layer, and the trace layer comprises a plurality of traces.

[0018] Attaching the protection film on the display substrate, the first protection part is located on the display side of the display substrate and covers the display area, and the second protection part covers the trace area and is bent from the display side of the display substrate to the non-display side of the display substrate through the side of the display substrate. At least one trace of the trace layer extends from the trace area to the non-display side of the display substrate through the side of the display substrate.

[0019] In some embodiments, the method for manufacturing the protection film comprises: forming a carrier layer on a substrate; forming a conductive film on the carrier layer; patterning the conductive film to form a trace layer comprising a plurality of traces; peeling the carrier layer carrying the trace layer from the substrate; and attaching the carrier layer carrying the trace layer to a preset position on one side of an initial protection film to obtain the protection film. The initial protection film comprises a main film layer of the first protection part and the second protection part, and the preset position is a side of the main film layer configured to be close to the display substrate.

[0020] In some embodiments, the display substrate comprises at least one first alignment mark, and the protection film further comprises at least one second alignment mark. The method for attaching the protection film on the display substrate comprises: aligning the second alignment mark of the protection film with the first alignment mark of the display substrate to determine the relative position of the protection film and the display substrate, and then attaching the protection film on the display substrate.

[0021] In some embodiments, the protection film further comprises a protective layer covering the first protection part and the second protection part and located on a side of the main film layer away from the trace layer. The method further comprises: removing the protective layer after attaching the protection film on the display substrate. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings needed to be used in some embodiments of the present disclosure. Obviously, the drawings described in the following description are only the drawings of some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art according to these drawings. In addition, the drawings described in the following description can be regarded as schematic diagrams, and are not limited to the actual size, actual process, actual time sequence, etc. of the product involved in the embodiments of the present disclosure.

[0023] Figure 1 a plan view of a display side of a display panel according to some embodiments;

[0024] Figure 2 a cross-sectional view of the display panel in Figure 1

[0025] ​Figure 3 A cross-sectional view along section line AA' of another display panel according to some embodiments;

[0026] Figure 4 This is a cross-sectional view along section line AA' of another display panel according to some embodiments;

[0027] Figure 5 This is a plan view of the non-display side of a display panel according to some embodiments;

[0028] Figure 6 This is a plan view of the protective film of a display panel according to some embodiments;

[0029] Figure 7 This is a plan view of the display substrate of a display panel according to some embodiments;

[0030] Figure 8 This is a structural diagram of a display device according to some embodiments;

[0031] Figure 9 This is a flowchart of a method for manufacturing a display panel according to some embodiments;

[0032] Figure 10 for Figure 9 A flowchart of preparation method S1 in the process;

[0033] Figure 11 for Figure 9 A flowchart of preparation method S2 in the process;

[0034] Figure 12 A flowchart illustrating another method for manufacturing a display panel according to some embodiments;

[0035] Figures 13-20 The diagram shows the steps involved in manufacturing a display panel according to some embodiments;

[0036] Figures 21-22 This diagram illustrates the steps involved in fabricating a display panel in related technologies. Detailed Implementation

[0037] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0038] Unless the context clearly requires otherwise, throughout the description and the claims, the term "comprise," and variations thereof (e.g., "comprises" and "comprising"), will be construed both to cover the containing feature or features and additional feature or features not described. In describing some embodiments, the use of "coupled" or variations thereof can be used where, in some embodiments, an item is directly physically or electrically connected to another item or items. Such terminology can also be used to indicate that two or more elements are operatively coupled between the elements.

[0039] The terms "first", "second", and the like, are used only to describe the features and do not imply or suggest relative importance or a specific number of the indicated technical features. Thus, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0040] In describing some embodiments, the use of "coupled" or variations thereof can be used where, in some embodiments, an item is directly physically or electrically connected to another item or items. Such terminology can also be used to indicate that two or more elements are operatively coupled between the elements.

[0041] The use of "configured to" herein means open and inclusive language that does not exclude additional tasks or steps from being performed by the device.

[0042] In addition, the use of "based on" means open and inclusive, as the process, step, calculation, or other action based on one or more described conditions or values can in practice be based on additional conditions or values beyond those described.

[0043] As used herein, "about" includes the recited value and the average value within an acceptable range of deviation from the particular value, as determined by one of ordinary skill in the art considering the measurement in question and the error inherent in the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0044] Exemplary embodiments are described herein with reference to cross-sectional and / or plan view illustrations that are schematic illustrations of idealized embodiments. Variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, embodiments should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched region illustrated as a rectangle will, typically, have rounded or curved features. Thus, the regions illustrated in the figures are schematic and their shapes are not intended to illustrate the precise shape of a region of a device and are not intended to limit the scope of exemplary embodiments.

[0045] “same layer” refers to a layer structure formed by using the same film forming process to form a film layer for forming a specific pattern, and then using the same mask plate to form by a one-time patterning process. Depending on the specific pattern, the one-time patterning process can include multiple exposure, development or etching processes, and the specific patterns in the formed layer structure can be continuous or discontinuous, and the specific patterns can also be at different heights or have different thicknesses.

[0046] In the related art, as shown in Figure 21 In the process of preparing a Mini / Micro LED display panel, a protective film 2' needs to be attached to the surface of a display substrate 1', and then the part of the protective film 2' that exceeds the display substrate 1' is cut off by using a laser cutting process. However, in the process of laser cutting the protective film 2', the laser is easy to cut to the edge part of the display substrate 1', and damage the film layer structure of the display substrate 1' located at the edge part. And, referring to Figure 21 , the heat generated by laser cutting forms a conical heat affected zone, causing the part of the protective film 2' that should cover the display substrate 1' to be cut off, and further causing the problem of light leakage in the corresponding area (the area not covered by the protective film 2') of the display substrate 1'.

[0047] Therefore, as shown in Figure 22 , a safety distance P is left between the position of laser cutting the protective film 2' and the display substrate 1' in the planar direction of the display substrate 1', for example, the safety distance P is in the range of 68 μm-72 μm, for example, the safety distance P is 68 μm, 69 μm, 70 μm, 71 μm or 72 μm, which can avoid damage to the display substrate 1' by the laser cutting process and avoid the problem of light leakage in the edge area of the display substrate 1'. However, when multiple display panels are spliced into a large-size display panel, the part of the protective film 2' that exceeds the edge of the display substrate 1' will cause the non-display area between the display panels to be widened, affecting the display effect of the large-size display panel spliced.

[0048] To solve the above problems, some embodiments of the present disclosure provide a display panel, as shown inFigure 1 and Figure 2 As shown in FIG. 1A, the display panel 100 has a display area AA, and a trace area BB located at least one side of the display area AA. The display panel 100 includes a display substrate 1, and a plurality of light emitting devices 11 are disposed on the display substrate 1 within the display area AA. Each light emitting device 11 is configured to emit light of one color, for example, red light, green light, blue light, or white light.

[0049] As shown in FIG. 1A, the display panel 100 further includes a protective film 2 disposed on the display substrate 1. The protective film 2 includes a first protective portion 21 and a second protective portion 22. The first protective portion 21 is disposed on the display side 1A of the display substrate 1, and covers the display area AA. The first protective portion 21 can be used to protect the display area AA of the display side 1A of the display substrate 1. Figure 2

[0050] As shown in FIG. 1A, the second protective portion 22 covers the trace area BB, and is bent from the display side 1A of the display substrate 1, through the side S of the display substrate 1, to the non-display side 1B of the display substrate 1. Figure 2 As shown in FIG. 1A, the second protective portion 22 includes a main film layer 23, and a trace layer 24 disposed on the main film layer 23 close to the display substrate 1. The trace layer 24 is located in the trace area BB. The trace layer 24 includes a plurality of traces 241. At least one trace 241 extends from the trace area BB, through the side S of the display substrate 1, to the non-display side 1B of the display substrate 1. The main film layer 23 of the second protective portion 22 can be used to protect the trace layer 24, and the trace area BB of the display side 1A of the display substrate 1.

[0051] Figure 2 It should be noted that, as shown in FIG. 1A, the plane in which the surface of the display side 1A of the display substrate 1 is located is substantially parallel to the plane direction U in which the display substrate 1 is located. The plane in which the surface of the non-display side 1B of the display substrate 1 is located is substantially parallel to the plane direction U in which the display substrate 1 is located. The side S of the display substrate 1 connects the surface of the display side 1A and the surface of the non-display side 1B. The side S of the display substrate 1 can be a plane. The side S of the display substrate 1 can also be a non-plane, for example, the side S includes an arc surface, or the side S includes a plurality of planes, and the plurality of planes are not coplanar, or the side S includes an arc surface and a plane.

[0052] It should be noted that, as shown in FIG. 1A, the plane in which the surface of the display side 1A of the display substrate 1 is located is substantially parallel to the plane direction U in which the display substrate 1 is located. The plane in which the surface of the non-display side 1B of the display substrate 1 is located is substantially parallel to the plane direction U in which the display substrate 1 is located. The side S of the display substrate 1 connects the surface of the display side 1A and the surface of the non-display side 1B. The side S of the display substrate 1 can be a plane. The side S of the display substrate 1 can also be a non-plane, for example, the side S includes an arc surface, or the side S includes a plurality of planes, and the plurality of planes are not coplanar, or the side S includes an arc surface and a plane. Figure 2 Further, the trace layer 24 is disposed on the side of the main film layer 23 close to the display substrate 1. In the process of attaching the protective film 2 to the display substrate 1, the traces 241 of the trace layer 24 follow the second protective portion 22 to be bent from the display side 1A of the display substrate 1, through the side S of the display substrate 1, to the non-display side 1B of the display substrate 1.

[0053]

[0054] ​​​The thickness of the wiring layer 24 is thin, and does not affect the attachment of the protective film 2 on the display substrate 1. For example, the thickness of the wiring layer 24 ranges from 2 μm to 4 μm, for example, the thickness of the wiring layer 24 is 2 μm, 2.5 μm, 3 μm, 3.5 μm or 4 μm.

[0055] For example, all the wirings 241 included in the wiring layer 24 extend from the wiring area BB to the non-display side 1B of the display substrate 1 through the side surface S of the display substrate 1.

[0056] In the display panel 100 in the above embodiments of the present disclosure, the second protective part 22 of the protective film 2 is bent from the display side 1A of the display substrate 1 to the non-display side 1B of the display substrate 1 through the side surface S of the display substrate 1, that is, the part of the protective film 2 beyond the display substrate 1 is bent to the non-display side 1B of the display substrate 1 through the side surface S of the display substrate 1 along the plane direction U of the display substrate 1, which can avoid cutting the part of the protective film 2 beyond the display substrate 1 by using the laser cutting process, thereby avoiding cutting the edge part of the display substrate 1 and damaging the display substrate 1. Moreover, the second protective part 22 wraps the edge part of the display substrate 1 (the wiring area BB and the side surface S of the display substrate 1), which can improve the light leakage problem of the edge area of the display substrate 1.

[0057] Moreover, compared with Figure 22 In the display panel 100' in the above embodiments of the present disclosure, the position of the laser cutting of the protective film 2' and the display substrate 1' leave a safety distance P, and the part of the protective film 2' beyond the edge of the display substrate 1' will cause the splicing seam between the display panels to be wide (the width of the splicing seam is twice the safety distance P). Referring to Figure 2 In the display panel 100 in the above embodiments of the present disclosure, the part of the protective film 2 beyond the edge of the display substrate 1 is not present, and the plurality of display panels 100 are spliced together, and the width of the splicing seam between the adjacent two display panels 100 is twice the thickness of the part of the protective film 2 covering the side surface S along the direction U (the thickness of the part of the protective film 2 covering the side surface S along the direction U ranges from 40 μm to 60 μm, for example, the thickness is 40 μm, 45 μm, 50 μm, 55 μm or 60 μm). Since the thickness of the part of the protective film 2 covering the side surface S along the direction U is less than the safety distance P, the width of the splicing seam between the adjacent two display panels 100 is reduced, and the display quality of the large-size display panel spliced together can be improved.

[0058] In addition, the structure design of the protective film 2 used in the above embodiments of the present disclosure is that the prepared wiring layer 24 is arranged on the side of the main film layer 23 close to the display substrate 1. In this way, in the process of attaching the protective film 2 on the display substrate 1, the wirings 241 of the wiring layer 24 follow the second protective part 22 to bend from the display side 1A of the display substrate 1 to the non-display side 1B of the display substrate 1 through the side surface S of the display substrate 1, which can realize the preparation of the side edge wiring and simplify the preparation process.

[0059] In some embodiments, the material of the trace layer 24 comprises a photosensitive conductive material.

[0060] It should be noted that, in the process of preparing the trace layer 24, the above-mentioned carrier layer 25 can be formed on the carrier, and then a conductive film is formed on the side of the carrier layer 25 away from the carrier, the material of the conductive film comprising a photosensitive conductive material, so that the conductive film can be directly patterned by an exposure and development process to obtain the trace layer 24. It can be understood that the first protective part 21 can not comprise the carrier layer 25, i.e., only the second protective layer comprises the carrier layer 25.

[0061] Exemplarily, the material of the trace layer 24 comprises photosensitive silver, for example, the trace layer 24 can be a photosensitive silver dry film. Next, several structural designs of the protective film 2 will be introduced respectively through the following embodiments.

[0062] In some embodiments, as shown in Figure 3 The first protective part 21 comprises a first black gel layer 211, and the main body film layer 23 comprises a second black gel layer 231, the first black gel layer 211 and the second black gel layer 231 being integrally formed, which is beneficial to improve the integrity and mechanical strength of the protective film 2. The trace layer 24 is located on the side of the second black gel layer 231 close to the display substrate 1.

[0063] It can be understood that the protective film 2 comprises the black gel layer 20 (the first black gel layer 211 and the second black gel layer 231) and the trace layer 24, the black gel layer 20 covering the display area AA and the trace area BB, and the trace layer 24 being located on the side of the second black gel layer 231 of the black gel layer 20 close to the display substrate 1.

[0064] Exemplarily, the trace layer 24 can be directly bonded to the side of the second black gel layer 231 close to the display substrate 1.

[0065] By adopting the above-mentioned structural design of the protective film 2, the black gel layer 20 can realize the blackening of the surface of the display panel 100, and the black gel layer 20 can not only prevent light leakage in the edge area of the display panel 100, but also improve the brightness uniformity of the display picture of each area of the display panel 100, thereby improving the overall brightness uniformity of the display panel 100. In addition, the black gel layer 20 can also improve the problem of color crosstalk between different color lights (for example, red light, green light and blue light) emitted by each sub-pixel in the display panel 100.

[0066] It should be noted that, with reference to Figure 3If the surface of the side of the protective film 2 away from the display substrate 1 is flat, the thickness of the part of the protective film 2 located on the surface of the side of the light emitting device 11 away from the display substrate 1 and the part of the protective film 2 located between the two adjacent light emitting devices 11 is different; specifically, the thickness of the first black adhesive layer 211 in the direction perpendicular to the display substrate 1 between the two adjacent light emitting devices 11 is greater than the thickness of the first black adhesive layer 211 in the direction perpendicular to the display substrate 1 on the surface of the side of the light emitting device 11 away from the display substrate 1. Since there is a gap between the two adjacent light emitting devices 11, after the protective film 2 is attached to the surface of the display substrate 1, the surface of the side of the protective film 2 away from the display substrate 1 can also be uneven, that is, the part of the protective film 2 located on the surface of the side of the light emitting device 11 away from the display substrate 1 is farther away from the display substrate 1 than the part of the protective film 2 located between the two adjacent light emitting devices 11.

[0067] In some embodiments, as shown in Figure 2 The first protective part 21 further includes a first white adhesive layer 212, and the first white adhesive layer 212 is arranged on the side of the first black adhesive layer 211 close to the display substrate 1. The main film layer 23 further includes a second white adhesive layer 232, and the second white adhesive layer 232 is arranged between the second black adhesive layer 231 and the wiring layer 24. The first white adhesive layer 212 and the second white adhesive layer 232 are integrally formed, which is beneficial to improve the integrity and mechanical strength of the protective film 2.

[0068] It can be understood that the protective film 2 includes the black adhesive layer 20, the white adhesive layer 200 (the first white adhesive layer 212 and the second white adhesive layer 232) arranged on the side of the black adhesive layer 20 close to the display substrate 1, and the wiring layer 24 arranged on the side of the second white adhesive layer 232 of the white adhesive layer 200 close to the display substrate 1.

[0069] In addition, the white adhesive layer 200 has strong adhesion, and by adopting the structure design of the protective film 2, the connection strength of the wiring layer 24 and the white adhesive layer 200 and the connection strength of the black adhesive layer 20 and the white adhesive layer 200 can be improved, so that the connection strength of the wiring layer 24 and the black adhesive layer 20 is improved.

[0070] It should be noted that reference Figure 2Since there is a gap between two adjacent light emitting devices 11, after the protective film 2 is attached to the surface of the display substrate 1, the surface of the side of the protective film 2 away from the display substrate 1 can be uneven. Of course, in some cases, the surface of the side of the protective film 2 away from the display substrate 1 is flat, and then the thickness of the part of the protective film 2 on the surface of the side of the light emitting device 11 away from the display substrate 1 and the part between the two adjacent light emitting devices 11 is different; specifically, there can be a first white glue layer 212 between the two adjacent light emitting devices 11, and there can be a first white glue layer 212 and / or a first black glue layer 211 on the surface of the side of the light emitting device 11 away from the display substrate 1; or there can be a first white glue layer 212 and a first black glue layer 211 between the two adjacent light emitting devices 11, and there can be a first white glue layer 212 and / or a first black glue layer 211 on the surface of the side of the light emitting device 11 away from the display substrate 1.

[0071] In some embodiments, as shown in FIG. 2, the second protective part 22 further includes a carrier layer 25, which is arranged between the main film layer 23 and the wiring layer 24. The wiring layer 24 is fixed on the carrier layer 25, and the carrier layer 25 is bonded to the main film layer 23. Figure 4

[0072] It can be understood that the protective film 2 includes the black glue layer 20, the white glue layer 200 on the side of the black glue layer 20 close to the display substrate 1, the carrier layer 25 on the side of the white glue layer 200 close to the display substrate 1, and the wiring layer 24. The wiring layer 24 is fixed on the carrier layer 25, and the surface of the side of the carrier layer 25 away from the wiring layer 24 is bonded to the white glue layer 200.

[0073] By adopting the structure design of the protective film 2 as described above, the wiring layer 24 can be prepared in advance on the carrier layer 25, and the carrier layer 25 can facilitate the transfer of the wiring layer 24 as a carrier of the wiring layer 24. By bonding the carrier layer 25 to the main film layer 23 of the protective film 2, the wiring layer 24 is attached to the main film layer 23 of the protective film 2.

[0074] Exemplarily, the material of the carrier layer 25 can include polyimide.

[0075] In some embodiments, as shown in FIG. 2, the first protective part 21 and the main film layer 23 are integrally formed, which is beneficial to improve the integrity and mechanical strength of the protective film 2. Figures 2-4

[0076] Exemplarily, as shown in FIG. 2, the first protective part 21 and the main film layer 23 are integrally formed, which is beneficial to improve the integrity and mechanical strength of the protective film 2. Figure 2 Figure 4 ​​​As shown, the first protective part 21 includes a first black adhesive layer 211 and a first white adhesive layer 212, and the main film layer 23 includes a second black adhesive layer 231 and a second white adhesive layer 232, the first black adhesive layer 211 and the second black adhesive layer 231 are integrally formed, and the first white adhesive layer 212 and the second white adhesive layer 232 are integrally formed.

[0077] Exemplarily, as shown in FIG. 1A, Figure 3 As shown, the first protective part 21 includes a first black adhesive layer 211, and the main film layer 23 includes a second black adhesive layer 231, the first black adhesive layer 211 and the second black adhesive layer 231 are integrally formed.

[0078] In some embodiments, as shown in FIG. 1A, Figure 7 As shown, the display substrate 1 includes at least one first alignment mark 4.

[0079] It should be noted that the display substrate 1 includes a substrate, and a plurality of conductive patterns (thin film transistors and signal lines) disposed on the substrate. The first alignment mark 4 can be a single-layer structure, which is the same material as one of the conductive patterns and is disposed in the same layer. Alternatively, the first alignment mark 12 is a laminated structure, each layer of the laminated structure is the same material as one of the conductive patterns and is disposed in the same layer.

[0080] As shown in FIG. 1A, Figure 1 , Figure 2 and Figure 6 As shown, the protective film 2 further includes at least one second alignment mark 5, and the second alignment mark 5 is located on the display side 1A of the display substrate 1. The at least one second alignment mark 5 is configured to be aligned with the at least one first alignment mark 4 to determine the relative position of the protective film 2 and the display substrate 1.

[0081] It should be noted that the above-mentioned "alignment" includes various design manners. For example, the contour shape of the first alignment mark 4 is substantially the same as the contour shape of the second alignment mark 5, in which case, the "alignment" can mean that the contours of the first alignment mark 4 and the second alignment mark 5 are substantially coincident along the thickness direction V of the display substrate 1. For another example, the contour shape of the first alignment mark 4 is not limited, and the "alignment" can mean that the distance between the center of the first alignment mark 4 and the center of the second alignment mark 5 is less than or equal to a preset distance value along the planar direction U of the display substrate 1.

[0082] By adopting the structure design of the protective film 2 as described above, at least one second alignment mark 5 is arranged on the protective film 2, and in the process of attaching the protective film 2 to the display substrate 1, the relative position of the protective film 2 and the display substrate 1 can be determined by aligning the second alignment mark 5 on the protective film 2 with the first alignment mark 4 on the display substrate 1, so as to accurately control the position of the protective film 2 attached to the display substrate 1.

[0083] Exemplarily, as shown in Figure 7 , the display substrate 1 is in a quadrilateral shape, and has four corners, in this case, the display substrate 1 includes two first alignment marks 4, and a group of opposite corners of the display substrate 1 is provided with the first alignment mark 4. Figure 1 and Figure 2 , the protective film 2 includes two second alignment marks 5, and the second alignment mark 5 corresponds to the first alignment mark 4 one by one along the thickness direction V of the display substrate 1, and the corresponding second alignment mark 5 is aligned with the first alignment mark 4.

[0084] Exemplarily, the profile shape of the first alignment mark 4 can be a cross, a circle or a triangle, etc. The profile shape of the second alignment mark 5 can be a cross, a circle or a triangle, etc.

[0085] In some embodiments, as shown in Figure 7 , the display substrate 1 further includes at least one third alignment mark 6. The third alignment mark 6 can be provided in the same manner as the first alignment mark 4, i.e., the third alignment mark 6 can be a single-layer structure, which is the same as the material of one conductive pattern and is provided in the same layer. Alternatively, the third alignment mark 6 is a laminated structure, and each layer of the laminated structure is the same as the material of one conductive pattern and is provided in the same layer.

[0086] As shown in Figure 5 and Figure 6 , the protective film 2 further includes at least one fourth alignment mark 7, and the at least one fourth alignment mark 7 is located on the non-display side 1B of the display substrate 1. The at least one fourth alignment mark 7 is configured to align with the at least one third alignment mark 6 to determine the relative position of the protective film 2 and the display substrate 1.

[0087] By adopting the structure design of the protective film 2 described above, at least one fourth alignment mark 7 is provided on the protective film 2, in the process of attaching the protective film 2 to the display substrate 1, the protective film 2 is first attached to the display side 1A of the display substrate 1, and then the second protective part 22 of the protective film 2 is bent to the non-display side 1B of the display substrate 1 through the side S of the display substrate 1, and the relative position of the second protective part 22 of the protective film 2 and the display substrate 1 on the non-display side 1B is determined by aligning the fourth alignment mark 7 on the protective film 2 with the third alignment mark 6 on the display substrate 1, so as to accurately control the position of the second protective part 22 of the protective film 2 attached to the non-display side 1B of the display substrate 1.

[0088] Exemplarily, as shown in Figure 7 , the display substrate 1 is in a quadrilateral shape, and has four corners, in this case, the display substrate 1 includes two first alignment marks 4, and a group of opposite corners of the display substrate 1 is provided with the first alignment mark 4.As shown, the display substrate 1 is quadrilateral in shape and has four corners. In this case, the display substrate 1 includes two third alignment marks 6, and a set of third alignment marks 6 are provided at one diagonal of the display substrate 1. Correspondingly, as Figure 5 and Figure 6 As shown, the protective film 2 includes two fourth alignment marks 7. Along the thickness direction V of the display substrate 1, the fourth alignment marks 7 correspond one-to-one with the third alignment marks 6, and the corresponding fourth alignment marks 7 are aligned with the third alignment marks 6.

[0089] For example, the outline shape of the third alignment mark 6 can be a cross, a circle, or a triangle, etc. The outline shape of the fourth alignment mark 7 can be a cross, a circle, or a triangle, etc.

[0090] In some embodiments, such as Figure 6 As shown, the second alignment mark 5 is made of the same material as the multiple traces 241 and is set on the same layer, that is, the trace layer 24 also includes the second alignment mark 5.

[0091] It is understandable that during the fabrication of the wiring layer 24, a single patterning process can be used to fabricate multiple wirings 241 and the second alignment mark 5. Furthermore, the wirings 241 and the second alignment mark 5 are bonded to the main film layer 23 of the protective film 2 along with the carrier layer 25.

[0092] In some embodiments, such as Figure 6 As shown, the fourth alignment mark 7 is made of the same material as the multiple traces 241 and is set on the same layer, that is, the trace layer 24 also includes the fourth alignment mark 7.

[0093] It is understandable that during the fabrication of the wiring layer 24, a single patterning process can be used to fabricate multiple wirings 241 and the fourth alignment mark 7. Furthermore, the wirings 241 and the fourth alignment mark 7 are bonded to the main film layer 23 of the protective film 2 along with the carrier layer 25.

[0094] Furthermore, in some embodiments, such as Figure 2 and Figure 7 As shown, the display substrate 1 also includes a first pin 31 and a second pin 32 located in the trace area BB. The first pin 31 is disposed on the display side 1A of the display substrate 1, and the second pin 32 is disposed on the non-display side 1B of the display substrate 1. At least one trace 241 is coupled at one end to the first pin 31 and at the other end to the second pin 32.

[0095] It should be noted that the first pin 31 is configured to be coupled with the conductive pattern located at the display area AA, and the second pin 32 is configured to be coupled with the external circuit. One end of the wire 241 is coupled with the first pin 31, and the other end of the wire 241 is coupled with the second pin 32, so as to realize the coupling of the conductive pattern and the external circuit, and the wire 241 is used to transmit the signal provided by the external circuit to the driving circuit.

[0096] It can be seen that, in the process of attaching the protective film 2 to the display substrate 1, the structure design of the protective film 2 of the present disclosure also realizes the electrical contact of the wire 241 with the first pin 31 and the second pin 32, thereby simplifying the preparation process of the side edge line. Moreover, by controlling the position of the protective film 2 attached to the display substrate 1, the electrical contact of the wire 241 with the corresponding pin is ensured.

[0097] In some embodiments, as shown in Figure 1 and Figure 6 , the display panel 1 has a first wire area BB1 and a second wire area BB2 located at opposite sides of the display area AA. The protective film 2 includes a first protective part 21 and two second protective parts 22, wherein the first protective part 21 is arranged on the display side 1A of the display substrate 1 and covers the display area AA.

[0098] The two second protective parts 22 are respectively located at opposite sides of the first protective part 21, one of the second protective parts 22 covers the first wire area BB1 and is bent from the display side 1A of the display substrate 1 to the non-display side 1B of the display substrate 1 through the side surface S of the corresponding first wire area BB1 of the display substrate 1. The other second protective part 22 covers the second wire area BB2 and is bent from the display side 1A of the display substrate 1 to the non-display side 1B of the display substrate 1 through the side surface S of the corresponding second wire area BB2 of the display substrate 1.

[0099] Some embodiments of the present disclosure also provide a display device, as shown in Figure 8 , the display device 300 includes a plurality of display panels 100 according to any of the above embodiments, and the display device 300 is spliced by the plurality of display panels 100.

[0100] The display device 300 described above can be a mini LED display device or a Micro LED display device.

[0101] In the process of preparing the display panel 100 in the display device 300 according to the above embodiments of the present disclosure, the part of the protective film 2 that exceeds the display substrate 1 can be avoided to be cut off by using a laser cutting process, so as to avoid damaging the display substrate 1 by cutting the edge part of the display substrate 1. Moreover, the second protective part 22 wraps the edge part of the display substrate 1 (the wire area BB and the side surface S of the display substrate 1), which can improve the light leakage problem of the edge area of the display substrate 1.

[0102] In the display device 300, the width of the joint between two adjacent display panels 100 is reduced, and the display quality of the large-size display panel formed by the joint is improved.

[0103] In addition, the protective film 2 is designed to have the wiring layer 24 arranged on the side of the main film layer 23 close to the display substrate 1. In this way, in the process of attaching the protective film 2 to the display substrate 1, the wiring 241 of the wiring layer 24 is bent from the display side 1A of the display substrate 1 to the non-display side 1B of the display substrate 1 through the side S of the display substrate 1 together with the second protective part 22, so that the side edge wiring is prepared, and the problem of short circuit of the circuit in the display area caused by the penetration of the conductive material into the display area by the sputtering process is avoided.

[0104] Some embodiments of the present disclosure also provide a preparation method of a display panel, for example, the preparation method can be applied to the display panel 100 shown in Figure 1 The display panel 100 has a display area AA and a wiring area BB on at least one side of the display area AA.

[0105] As shown in Figure 9 , the preparation method of the display panel 100 includes the following S1-S2:

[0106] S1: preparing a protective film 2. Referring to Figure 18 and Figure 19 , the protective film 2 includes a first protective part 21 and a second protective part 22, and the second protective part 22 is located on at least one side of the first protective part 21. The second protective part 22 includes a main film layer 23 and a wiring layer 24 arranged on one side of the main film layer 23, and the wiring layer 24 includes a plurality of wirings 241.

[0107] Exemplarily, as shown in Figure 10 , S1: preparing a protective film 2 includes the following S11-S15:

[0108] S11: forming a carrier layer 25 on a substrate 10, as shown in Figure 13 .

[0109] S12: forming a conductive film 240 on the carrier layer 25, as shown in Figure 14 .

[0110] The carrier layer 25 serves as a carrier of the conductive film 240, which facilitates the patterning of the conductive film 240.

[0111] S13: patterning the conductive film 240 to form a wiring layer 24 including a plurality of wirings 241, as shown in Figure 15 and Figure 16 .

[0112] For example, the material of the conductive film 240 includes a photosensitive conductive material, such as Figure 15 As shown, the conductive film 240 is exposed by ultraviolet light using a mask process. As shown Figure 16 As shown, the exposed conductive film 240 is developed and heat-cured to obtain the trace layer 24 including a plurality of traces 241.

[0113] S14: As shown Figure 17 The carrier layer 25 carrying the trace layer 24 is peeled off from the substrate 10.

[0114] For example, the carrier layer 25 carrying the trace layer 24 is peeled off from the substrate 10 by laser lift-off technology (LLO) to facilitate the transfer and attachment of the trace layer 24.

[0115] S15: As shown Figure 18 and Figure 19 The carrier layer 25 carrying the trace layer 24 is attached to a predetermined position on one side of the initial protective film 8 to obtain the protective film 2.

[0116] In combination with Figure 18 and Figure 19 The initial protective film 8 includes a main film layer 23 of the first protective part 21 and the second protective part 22. In combination with Figure 19 and Figure 20 The "predetermined position" of the initial protective film 8 refers to that the main film layer 23 of the second protective part 22 is configured to be close to one side of the display substrate 1.

[0117] It should be noted that, referring to Figure 18 In the S13 step, the patterned conductive film 240 forms a plurality of traces 241, and the pattern and layout of the trace layer 24 on the carrier layer 25 are determined. Then, the carrier layer 25 carrying the trace layer 24 is attached to the initial protective film 8 to obtain the protective film 2.

[0118] S2: The protective film 2 is attached to the display substrate 1. Referring to Figure 20 The first protective part 21 of the protective film 2 is located on the display side 1A of the display substrate 1 and covers the display area AA. The second protective part 22 covers the trace area BB and is bent from the display side 1A of the display substrate 1 to the non-display side 1B of the display substrate 1 through the side S of the display substrate 1. At least one trace 241 of the trace layer 24 extends from the trace area BB to the non-display side 1B of the display substrate 1 through the side S of the display substrate 1.

[0119] Exemplarily, as shown Figure 7 The display substrate 1 includes at least one first alignment mark 4. As shown Figure 6As shown, the protective film 2 comprises at least one second alignment mark 5. In this case, as shown in FIG. 2B, the second alignment mark 5 is arranged on the side of the main film layer 23 of the protective film 2, away from the display substrate 1. Figure 11 As shown, S2: attaching the protective film 2 on the display substrate 1, comprising the following S21:

[0120] S21: aligning the second alignment mark 5 of the protective film 2 with the first alignment mark 4 of the display substrate 1, and determining the relative position of the protective film 2 and the display substrate 1, and then attaching the protective film 2 on the display substrate 1, so as to accurately control the position of the protective film 2 attached on the display substrate 1, and the position of the wire 241 attached on the display substrate 1.

[0121] It should be noted that in the S13 step, in the process of patterning the conductive film 240 to form the plurality of wires 241, the second alignment mark 5 can also be formed, that is, the wire layer 24 can also comprise the second alignment mark 5.

[0122] In the related art, in the process of preparing the side edge wire of the display substrate, a shielding film layer is first covered on the display area of the display substrate, and a laser cleaning process is used to clean the wire area of the display substrate, so as to improve the cleanliness of the surface of the display substrate, and facilitate the adhesion of the film layer on the display substrate to the surface of the display substrate. Then, a sputtering process and a laser etching process are used to form a plurality of wires in the wire area of the display substrate, and the shielding film layer is used to block the conductive material from penetrating into the display area during the film forming process. However, there is still a phenomenon that part of the conductive material penetrates into the display area along the gap between the shielding film layer and the display substrate, which may cause a short circuit problem of the circuit in the display area.

[0123] The above preparation method of the present disclosure, in the process of preparing the protective film 2, the wire layer 24 is arranged on one side of the main film layer 23 of the protective film 2. In this way, in the process of attaching the protective film 2 on the display substrate 1, the wire 241 of the wire layer 24 follows the second protective part 22 to bend from the display side 1A of the display substrate 1, through the side S of the display substrate 1, to the non-display side 1B of the display substrate 1, which simplifies the preparation process of the side edge wire and avoids the problem of short circuit of the circuit in the display area caused by the penetration of conductive material into the display area by using the sputtering process.

[0124] In the process of attaching the protective film 2 to the display substrate 1, the second protective portion 22 of the protective film 2 is bent from the display side 1A of the display substrate 1 to the non-display side 1B of the display substrate 1 via the side surface S of the display substrate 1, i.e., the portion of the protective film 2 beyond the display substrate 1 is bent to the non-display side 1B of the display substrate 1 via the side surface S of the display substrate 1 along the planar direction U of the display substrate 1, so that the portion of the protective film 2 beyond the display substrate 1 can be avoided to be cut off by using the laser cutting process, thereby avoiding damaging the display substrate 1 by cutting the edge portion of the display substrate 1. In addition, the second protective portion 22 wraps the edge portion of the display substrate 1 (the wiring area BB and the side surface S of the display substrate 1), which can improve the light leakage problem of the edge area of the display substrate 1.

[0125] In addition, compared with the prior art Figure 22 In the prior art, a safety distance P is left between the position of cutting the protective film 2' by laser and the display substrate 1', and the portion of the protective film 2' beyond the edge of the display substrate 1' will cause the splicing seam between the display panels to be wider (the width of the splicing seam is twice the safety distance P). Referring to Figure 2 , the protective film 2 does not exceed the edge of the display substrate 1, and the plurality of display panels 100 are spliced together, and the width of the splicing seam between the adjacent two display panels 100 is smaller (the width of the splicing seam is twice the thickness of the protective film 2, and the thickness of the protective film 2 is smaller than the safety distance P), which can improve the display picture quality of the large-size display panel spliced together.

[0126] In some embodiments, as shown in Figure 19 , the protective film 2 further comprises a protective layer 26, the protective layer 26 covers the first protective portion 21 and the second protective portion 22, and is located on the side of the main film layer 23 away from the wiring layer 24. In this case, as shown in Figure 12 , after S2: attaching the protective film to the display substrate, the preparation method further comprises the following S3:

[0127] S3: removing the protective layer 26. For example, the protective layer 26 can be a release film, which plays a role in protecting the protective film 2 during the preparation of the display panel 100.

[0128] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and any person skilled in the art can think of changes or replacements within the technical range disclosed by the present disclosure, which shall be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A display panel having a display area and a wiring area located on at least one side of the display area; The display panel includes: The display substrate includes a substrate; The protective film includes a first protective portion and a second protective portion; the first protective portion is disposed on the display side of the display substrate and covers the display area; the second protective portion covers the trace area and extends from the surface of the display side of the substrate, through the side of the substrate, to the surface of the non-display side of the substrate. The second protective part includes a main film layer and a wiring layer disposed on the side of the main film layer near the display substrate. The wiring layer includes multiple wirings, and at least one wiring extends from the wiring area on the display side surface of the substrate through the side surface of the substrate to the non-display side surface of the substrate. The wiring layer is in direct contact with the display substrate. The first protective layer includes a first black adhesive layer, and the main film layer includes a second black adhesive layer, wherein the first black adhesive layer and the second black adhesive layer are integrally formed; the first protective layer also includes a first white adhesive layer disposed on the side of the first black adhesive layer close to the display substrate; the main film layer also includes a second white adhesive layer disposed between the second black adhesive layer and the wiring layer; wherein the first white adhesive layer and the second white adhesive layer are integrally formed; The wiring layer is located on the side of the second black adhesive layer closest to the display substrate; The display substrate includes at least one first alignment mark; The protective film further includes at least one second alignment mark located on the display side of the display substrate; the at least one second alignment mark is configured to align with the at least one first alignment mark to determine the relative position of the protective film and the display substrate; the second alignment mark is made of the same material as the plurality of traces and is disposed in the same layer.

2. The display panel according to claim 1, wherein, The second protective layer further includes a carrier layer disposed between the main body membrane layer and the wiring layer; The wiring layer is fixed to the carrier layer, and the carrier layer is bonded to the main film layer.

3. The display panel according to claim 1, wherein, The material of the wiring layer includes a photosensitive conductive material.

4. The display panel according to claim 1, wherein, The first protective part and the main membrane layer are integrally formed.

5. The display panel according to claim 1, wherein, The display substrate further includes at least one third alignment mark; The protective film further includes at least one fourth alignment mark located on the non-display side of the display substrate; the at least one fourth alignment mark is configured to align with the at least one third alignment mark to determine the relative position of the protective film and the display substrate.

6. The display panel according to claim 5, The fourth alignment mark is made of the same material as the multiple traces and is located on the same layer.

7. The display panel according to claim 1, wherein, The display substrate includes a first pin and a second pin located in the wiring area. The first pin is disposed on the display side of the display substrate, and the second pin is disposed on the non-display side of the display substrate. One end of the at least one trace is coupled to the first pin, and the other end is coupled to the second pin.

8. The display panel according to claim 1, wherein, The display panel has a first wiring area and a second wiring area located on opposite sides of the display area; The protective film includes two second protective portions, which are located on opposite sides of the first protective portion.

9. A display device, comprising: The display panel as described in any one of claims 1 to 8.

10. A method for manufacturing a display panel, the display panel having a display area and a wiring area located on at least one side of the display area; The preparation method includes: Prepare a protective film; the protective film includes a first protective part and a second protective part, the second protective part being located on at least one side of the first protective part; the second protective part includes a main film layer and a wiring layer disposed on one side of the main film layer, the wiring layer including multiple wirings; A protective film is attached to a display substrate, the display substrate including a substrate, such that a first protective portion is located on the display side of the display substrate and covers the display area, and a second protective portion covers the wiring area and extends from the surface of the display side of the substrate, through the side of the substrate, to the surface of the non-display side of the substrate; at least one wiring layer extends from the wiring area on the surface of the display side of the substrate, through the side of the substrate, to the surface of the non-display side of the substrate, and the wiring layer is in direct contact with the display substrate; The first protective layer includes a first black adhesive layer, and the main film layer includes a second black adhesive layer, wherein the first black adhesive layer and the second black adhesive layer are integrally formed; the first protective layer also includes a first white adhesive layer disposed on the side of the first black adhesive layer close to the display substrate; the main film layer also includes a second white adhesive layer disposed between the second black adhesive layer and the wiring layer; wherein the first white adhesive layer and the second white adhesive layer are integrally formed; The wiring layer is located on the side of the second black adhesive layer closest to the display substrate; The display substrate includes at least one first alignment mark, and the protective film further includes at least one second alignment mark located on the display side of the display substrate; the at least one second alignment mark is configured to align with the at least one first alignment mark to determine the relative position of the protective film and the display substrate; the second alignment mark is made of the same material as the plurality of traces and is disposed in the same layer.

11. The preparation method according to claim 10, wherein, The preparation of the protective film includes: A carrier layer is formed on the substrate; A conductive thin film is formed on the carrier layer; The conductive film is patterned to form a trace layer including multiple traces; Peel the carrier layer containing the wiring layer from the substrate; The carrier layer carrying the wiring layer is attached to a preset position on one side of the initial protective film to obtain the protective film; the initial protective film includes a main film layer of the first protective part and the second protective part, and the preset position is that the main film layer is configured close to the side of the display substrate.

12. The preparation method according to claim 10, wherein, The process of attaching a protective film to the display substrate includes: Align the second alignment mark of the protective film with the first alignment mark of the display substrate to determine the relative position of the protective film and the display substrate, and then attach the protective film to the display substrate.

13. The preparation method according to any one of claims 10 to 12, wherein, The protective film further includes a protective layer that covers the first protective portion and the second protective portion, and is located on the side of the main film layer away from the wiring layer; The preparation method further includes: After attaching the protective film to the display substrate, the protective layer is removed.

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