A chip heat sink testing system and method
By inputting power conditions to the heatsink and chip interface pins, and using detection and analysis modules to detect the contact and short-circuit status between the heatsink and chip interface pins, the problem of chip abnormalities caused by short circuits between the heatsink and chip pins is solved, and the accuracy and reliability of the detection are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- PUYA SEMICON SHANGHAI CO LTD
- Filing Date
- 2023-02-15
- Publication Date
- 2026-07-03
Smart Images
Figure CN116106723B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of chip testing, and more specifically to a chip heat sink testing system. Background Technology
[0002] During chip packaging testing, the short circuit test between the heatsink and chip pins was neglected; only the chip's functionality was tested. This meant that even if a short circuit occurred, the heatsink, remaining suspended, didn't affect the normal operation of these defective chips. Ultimately, these defective chips passed packaging testing and were delivered to customers. However, customers typically ground the heatsink, causing any chip pins shorted to the heatsink to also be grounded. If this grounded pin is not the chip's ground pin, the chip will malfunction. Conversely, if a customer doesn't ground the heatsink, a short circuit between the heatsink and the chip's ground pin will also cause malfunctions. Summary of the Invention
[0003] To address the technical problem that defective chips with short circuits between the heat sink and chip pins cannot be detected during packaging testing, this invention provides a chip heat sink testing system and method.
[0004] Specifically, the technical solution of the present invention is as follows:
[0005] In a first aspect, the present invention discloses a chip heat sink testing system, comprising:
[0006] A power module, connected to a heatsink detection module, is used to input power conditions to the heatsink detection module, the conditions including voltage and current.
[0007] The heat sink detection module is used to obtain the operating conditions of the test chip interface pins in the heat sink detection module and the operating conditions of the heat sink fixed on the test chip according to the operating conditions of the power supply; wherein, the test chip interface pins include: chip ground pins and other chip pins;
[0008] The analysis output module is connected to the heat sink detection module and is used to analyze the working conditions of the test chip interface pins and the heat sink, and output the heat sink test results. The heat sink test results include: the results of whether the channel for pre-detecting the working conditions of the heat sink is in normal contact with the heat sink, and the results of testing whether the heat sink is in an abnormal short-circuit state.
[0009] This implementation method obtains the working conditions of power input to the heat sink and chip interface pins through the power supply, and obtains the detection results of the pre-detection heat sink working condition, the contact status of the heat sink, and whether the heat sink is short-circuited to the chip interface pins based on the working conditions of the chip interface pins and the heat sink.
[0010] In some implementation methods of chip heatsink testing systems
[0011] The heat sink detection module further includes a test chip subunit, which is used to disconnect other pins of the chip from the power module when the channel provided by the test chip is in normal contact with the heat sink during the pre-detection of the heat sink's working condition.
[0012] The test chip subunit is also used to, when testing whether the heat sink is in an abnormal short-circuit state, receive a first current input from the power module at the ports of other pins of the chip, and receive a first voltage input from the power module at the heat sink; test the second voltage of each of the ports of other pins of the chip; and output the second voltage to the analysis output module.
[0013] This implementation method provides a test chip subunit that performs corresponding specific operations on the test chip under different tasks. When performing heat sink pre-detection, the test chip subunit leaves other pins of the chip floating; when judging the abnormal short circuit state of the heat sink, the test chip subunit provides feedback on the voltage of other pins of the test chip.
[0014] In some implementation methods of chip heatsink testing systems
[0015] The heat sink detection module further includes a heat sink testing subunit. The heat sink testing subunit is used to detect whether the heat sink is in normal contact with the heat sink when the heat sink receives a third current input from the power module and detects the voltage of the heat sink; and sends the voltage of the heat sink as a third voltage to the analysis output module.
[0016] This implementation method provides the specific operations performed on the heat sink by the heat sink subunit when performing a pre-detection of whether the heat sink is in normal contact with the heat sink operating condition channel.
[0017] In some implementation methods of chip heatsink testing systems
[0018] The analysis output module is further configured to calculate the theoretical resistance of the welding circuit connected to the heat sink according to Ohm's law R = U / I when the pre-detection circuit provides a channel for checking whether the heat sink is in normal contact with the heat sink. When the calculated value is the same as the theoretical value of the welding resistance, the module outputs the heat sink test result as indicating that the pre-detection circuit provides a channel for checking whether the heat sink is in normal contact with the heat sink, and that the chip ground pin, the ground pin of the test chip, and the heat sink are not in a connected state. Here, R is the calculated value of the welding resistance, U is the third voltage, and I is the third current.
[0019] This implementation method provides a specific identification method for whether the contact between heat sinks and the heat sink's operating conditions is normal during the pre-detection of whether the contact is normal. The analysis output module identifies whether the contact is normal based on the operating conditions of the heat sink.
[0020] In some implementation methods of chip heatsink testing systems
[0021] The analysis output module is also used to test whether the heat sink is in an abnormal short-circuit state.
[0022] Based on the first current and the integrated circuit inside the chip, the expected voltage of each other pin of the chip is obtained; when the expected voltage is different from the received second voltage, it is determined that the test chip pin corresponding to the other pin of the chip is in a connected state with the heat sink, the test result of the heat sink is output as the heat sink is in an abnormal short-circuit state, and a stop signal is sent to control the test chip to stop testing.
[0023] This embodiment provides a method for the analysis output module to identify whether the heat sink is short-circuited based on the chip pin voltage when testing whether the heat sink is in an abnormal short-circuit state.
[0024] In some implementation methods of chip heatsink testing systems
[0025] The analysis output module is also used to input test signals to other pins of the chip, and the other pins of the chip output corresponding actual output signals;
[0026] When the ground pin of the test chip is only connected to the heat sink, the ground pin of the test chip is pulled high by the first voltage. By analyzing the test signal, the ideal output signal obtained is different from the actual output signal, which can determine that the test chip is in an abnormal state. A stop signal is sent to control the test chip to stop testing.
[0027] This embodiment provides a method to intercept such defective chips by shorting all the chip's ground pins to the test chip, under the action of the first voltage of the heat sink, the voltage of the chip's ground pins is pulled up, causing the chip to malfunction.
[0028] Secondly, the present invention provides a method for testing chip heat sinks, including:
[0029] The operating condition of inputting power to the heat sink detection module, the operating condition includes: voltage and current;
[0030] The heat sink detection module obtains the operating conditions of the test chip interface pins and the heat sink based on the operating conditions of the power supply; wherein, the test chip interface pins include: chip ground pins and other chip pins;
[0031] Analyze the operating condition of the heat sink and pre-detect whether the channel is in normal contact with the heat sink;
[0032] When the pre-detection channel for the heat sink is in normal contact with the heat sink, the working condition of the test chip interface pin is analyzed to determine whether the heat sink is in an abnormal short-circuit state.
[0033] The output heat sink test results include: the results of pre-detecting whether the heat sink is in normal contact with the channel providing the heat sink, and the results of testing whether the heat sink is in an abnormal short-circuit state.
[0034] This implementation method measures the power input conditions from the power supply to the heatsink and chip interface pins. Based on the heatsink's operating condition, it ensures that the contact between the heatsink and the chip interface pins is normal. Then, by analyzing the chip interface pins' operating conditions, it detects whether the heatsink is short-circuited to the chip interface pins.
[0035] In some implementations of chip heat sink testing methods, the step of analyzing the operating condition of the heat sink and pre-detecting whether the channel providing the heat sink is in normal contact with the heat sink includes:
[0036] Disconnect the other pins of the chip from the power module;
[0037] The heat sink receives the third current input from the power module and detects the voltage of the heat sink; the voltage of the heat sink is used as the third voltage.
[0038] According to Ohm's law R=U / I, the calculated value of the theoretical resistance of the welding connected to the heat sink to be pre-tested is obtained;
[0039] When the calculated value and the theoretical value of the welding theoretical resistance are the same, the output of the heat sink test result indicates that the pre-detection heat sink working condition provides a channel that is in normal contact with the heat sink, and the chip ground pin, the ground pin of the test chip and the heat sink are not in a connected state; where R is the calculated value of the welding theoretical resistance, U is the third voltage and I is the third current.
[0040] This implementation method provides a specific method for determining whether the input channel for pre-detecting the working condition of the heat sink is in normal contact with the heat sink.
[0041] In some implementation methods of chip heatsink testing, the step of analyzing the operating conditions of the interface pins of the test chip and determining whether the heatsink is in an abnormal short-circuit state includes:
[0042] The other pins of the chip receive the first current input from the power module, and the other pins of the heat sink receive the first voltage input from the power module;
[0043] Test the second voltage of each of the other pins of the chip;
[0044] Based on the first current and the integrated circuit inside the chip, the expected voltage of each other pin of the chip is obtained;
[0045] When the expected voltage is different from the received second voltage, it is determined that the test chip pin corresponding to other pins of the chip is in a connected state with the heat sink, the test result of the heat sink is output as the heat sink is in an abnormal short-circuit state, and the stop signal is sent to control the test chip to stop testing.
[0046] This implementation method provides specific execution steps for obtaining the detection result of whether the heat sink is short-circuited to the chip interface pin by observing the operating conditions of the chip interface pin.
[0047] In some implementations of chip heatsink testing methods, after the other pins of the chip receive the first current input from the power module, and the other pins of the heatsink receive the first voltage input from the power module, the method further includes:
[0048] When a test signal is input to other pins of the chip, the other pins of the chip output the corresponding actual output signal.
[0049] When the ground pin of the test chip is only connected to the heat sink, the ground pin of the test chip is pulled high by the first voltage. By analyzing the test signal, the ideal output signal obtained is different from the actual output signal, which can be used to determine that the test chip is in an abnormal state.
[0050] A stop signal is sent to control the test chip to stop the test.
[0051] This embodiment provides a method to intercept such defective chips by shorting all the chip's ground pins to the test chip, under the action of the first voltage of the heat sink, the voltage of the chip's ground pins is pulled up, causing the chip to malfunction.
[0052] Compared with the prior art, the present invention has at least one of the following beneficial effects:
[0053] 1. This invention provides a heat sink testing system that measures the power input to the heat sink and chip interface pins by a power supply. Based on the working conditions of the chip interface pins and the heat sink, the system obtains the contact status of the heat sink's working condition and the detection results of whether the heat sink is short-circuited to the chip interface pins. This effectively avoids the risk that chip pins may touch the heat sink but cannot be detected during packaging testing and will end up with the customer.
[0054] 2. This invention provides a logic for determining whether the heat sink's operating condition supply channel is in normal contact with the heat sink, ensuring the accuracy of subsequent test results.
[0055] 3. The present invention provides detection logic for determining whether the test chip interface pins other than the chip ground pin and the chip ground pin are shorted to the heat sink. Attached Figure Description
[0056] The preferred embodiments will now be described in a clear and easy-to-understand manner, in conjunction with the accompanying drawings, to further explain the above-mentioned characteristics, technical features, advantages, and implementation methods of the present invention.
[0057] Figure 1 This is a system block diagram of one embodiment of a heat sink testing system of the present invention;
[0058] Figure 2 This is a description drawing of an embodiment of the heat sink testing system of the present invention;
[0059] Figure 3 This is a flowchart of an embodiment of a heat sink testing method of the present invention;
[0060] Figure 4 This is a flowchart of an embodiment of a heat sink testing method of the present invention;
[0061] Figure 5 This is a flowchart of an embodiment of a heat sink testing method of the present invention.
[0062] The following are the diagram labels: 10--Power supply module; 20--Heat sink detection module; 21--Test chip sub-unit; 22--Test heat sink sub-unit; 30--Analysis output module. Detailed Implementation
[0063] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the specific implementation methods of the present invention will be described below with reference to the accompanying drawings. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without any creative effort.
[0064] To keep the drawings concise, each figure only schematically shows the parts relevant to the invention, and these do not represent the actual structure of the product. Furthermore, to facilitate understanding, in some figures, only one of components with the same structure or function is schematically depicted, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one."
[0065] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.
[0066] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0067] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0068] In one embodiment, refer to the appendix to the specification. Figure 1 The present invention provides a chip heat sink testing system, comprising:
[0069] The power module 10 is connected to the heat sink detection module 20 and is used to input power to the heat sink detection module 20. The operating conditions include voltage and current.
[0070] According to the preset program, when the heat sink detection module performs different test contents, the power module 10 provides the corresponding current and voltage set by the preset program to the heat sink and the test chip interface pin in the heat sink detection module.
[0071] The heat sink detection module 20 is used to obtain the operating conditions of the test chip interface pins and the heat sink fixed on the test chip according to the operating conditions of the power supply, and send the operating conditions of the chip interface pins and the heat sink to the analysis output module 30; wherein, the test chip interface pins include: chip ground pins and other chip pins.
[0072] Heatsink detection module 20 (see attached instruction manual) Figure 2Based on the input power conditions, the corresponding output conditions are fed back to the analysis output module 30; for example, when performing a test to see if the heatsink is in an abnormal short-circuit state, the output conditions are fed back to the analysis output module 30. Figure 2 The current input at Ch1-7 enables the test chip to operate normally. Ch8 applies a voltage of 0V to the heatsink. When the pin I / O of channel Ch6 is shorted to the heatsink and then connected to the corresponding pin I / O of channel Ch6, the voltage of the pin I / O of channel Ch6 is also 0V due to the influence of the heatsink voltage. The information that the voltage of the pin I / O of channel Ch6 is 0V is sent to the analysis output module 30.
[0073] The analysis output module 30 is connected to the heat sink detection module 20. It is used to analyze and test the working conditions of the chip interface pins and the heat sink, and output the heat sink test results. The heat sink test results include: the results of whether the channel for pre-detecting the working conditions of the heat sink is in normal contact with the heat sink, and the results of testing whether the heat sink is in an abnormal short-circuit state.
[0074] For example, when testing whether the heatsink is in an abnormal short-circuit state, the voltage received at the pin I / O of channel Ch6 is 0V. Based on the current input to the chip and the internal integrated circuit of the chip, the expected voltage value of the test chip interface pin can be obtained when there is no short circuit between the chip pin and the heatsink. If the expected voltage value is not 0V, then there is a short circuit between the pin I / O of channel Ch6 and the heatsink.
[0075] This embodiment obtains the working conditions of power input to the heat sink and chip interface pins through the power supply, and obtains the detection results of the pre-detection heat sink working conditions, the contact status of the heat sink, and whether the heat sink is short-circuited to the chip interface pins based on the working conditions of the chip interface pins and the heat sink.
[0076] This embodiment provides a chip heat sink testing system based on the foregoing embodiments.
[0077] The heat sink detection module 20 also includes a test chip subunit 21, which is used to disconnect other pins of the chip from the power module when providing a channel to check whether the heat sink is in normal contact during the pre-detection of the heat sink.
[0078] The test chip subunit 21 is also used to test the second voltage of each of the other pins of the chip when the heat sink is in an abnormal short-circuit state, and to output the second voltage to the analysis output module.
[0079] This embodiment provides a test chip subunit 21, which performs corresponding specific operations on the test chip under different tasks. When performing heat sink pre-detection, the test chip subunit leaves other pins of the chip floating; when judging the abnormal short circuit state of the heat sink, the test chip subunit provides feedback on the voltage of other pins of the test chip.
[0080] This embodiment provides a chip heat sink testing system based on the foregoing embodiments.
[0081] The heat sink detection module 20 also includes a heat sink test subunit 22. The heat sink test subunit is used to provide a channel for testing whether the heat sink is in normal contact with the heat sink during the pre-detection of the heat sink's working condition. When the heat sink receives the third current input from the power module, it detects the voltage of the heat sink and sends the voltage of the heat sink as the third voltage to the analysis output module.
[0082] For example: when performing a pre-test to check whether the channel is in proper contact with the heatsink, Figure 2 In the circuit, Ch1-Ch7 are left floating. The power module sends a voltage of 10V to the second contact point on the heatsink through the Ch8 channel and detects the current of 2A at the first contact point on the heatsink. The current at the first contact point and the voltage at the second contact point are sent to the analysis output module. The first contact point is the contact point between the heatsink operating condition supply channel and the heatsink. The second contact point is the contact point between the first terminal of the welding theoretical resistor RsiteNo and the heatsink. The second terminal of the welding theoretical resistor RsiteNo is grounded.
[0083] This embodiment provides a chip heat sink testing system based on the foregoing embodiments.
[0084] The analysis output module is also used to measure the third voltage and third current by using a Kelvin circuit connection when providing a channel for pre-testing the heat sink to ensure proper contact between the channel and the heat sink. Based on Ohm's law R = U / I, the calculated value of the theoretical resistance of the weld connected to the pre-tested heat sink is obtained. When the calculated value and the theoretical value of the weld resistance are the same, the output heat sink test result indicates that the channel for pre-testing the heat sink is in normal contact with the heat sink, and the chip ground pin and the test chip ground pin are not connected to the heat sink. Here, R is the calculated value of the theoretical weld resistance, U is the third voltage, and I is the third current.
[0085] This embodiment provides a specific identification method for whether the contact between the heat sink and the heat sink condition provisioning channel is normal during the pre-detection of whether the contact is normal. For example, when performing the pre-detection of whether the contact between the heat sink condition provisioning channel and the heat sink is normal, if the current received at contact point 1 is 2A and the voltage at contact point 2 is 10V, the calculated value of the theoretical welding resistance RsiteNo is 5Ω. If the theoretical welding resistance RsiteNo is also 5Ω, then the pre-detection of the heat sink condition provisioning channel is in normal contact with the heat sink, and the chip ground pin, the test chip ground pin and the heat sink are not in a connected state.
[0086] This embodiment provides a chip heat sink testing system based on the foregoing embodiments.
[0087] The analysis output module is also used when testing whether the heatsink is in an abnormal short-circuit state.
[0088] Based on the first current and the internal integrated circuit of the chip, the expected voltage of other pins of each chip is obtained; when the expected voltage is different from the received second voltage, it is determined that the test chip pin corresponding to the other pins of the chip is in a connected state with the heat sink, the heat sink test result is output that the heat sink is in an abnormal short-circuit state, and a stop signal is sent to control the test chip to stop the test.
[0089] This embodiment provides a method for the analysis output module to identify whether the heat sink is short-circuited based on the specific voltage of the chip pins when testing whether the heat sink is in an abnormal short-circuit state.
[0090] This embodiment provides a chip heat sink testing system based on the foregoing embodiments.
[0091] The analysis output module is also used to input test signals to other pins of the chip, and the other pins of the chip output the corresponding actual output signals;
[0092] When the ground pin of the test chip is only connected to the heatsink, the ground pin is pulled high by the first voltage. If the ideal output signal obtained by analyzing the test signal differs from the actual output signal, it can be determined that the test chip is in an abnormal state. A stop signal is then sent to control the test chip to stop testing. For example, if the first voltage is set to 5V, the voltage value of the ground pin is also 5V because all the chip's ground pins are shorted to the heatsink. The test chip's function stops. According to the input test signal, the normal output of the test chip is a high level, but the actual output is low. The analysis module will then stop testing the abnormal chip based on this abnormality.
[0093] In one embodiment, refer to the appendix to the specification. Figure 3The present invention provides a method for testing chip heat sinks, comprising:
[0094] S110, the operating condition of inputting power to the heat sink detection module, including voltage and current;
[0095] S120, the heat sink detection module obtains the operating conditions of the test chip interface pins and the heat sink based on the power supply operating conditions; wherein, the test chip interface pins include: chip ground pin and other chip pins;
[0096] S130 analyzes the working condition of the heat sink and provides a channel to detect whether the heat sink is in normal contact with the heat sink.
[0097] S140: When the pre-detection heatsink's operating condition provides a channel that is in normal contact with the heatsink, analyze the operating condition of the test chip interface pins to determine whether the heatsink is in an abnormal short-circuit state.
[0098] S150 outputs heatsink test results, which include: the results of pre-detecting the heatsink's operating conditions, providing information on whether the heatsink is in normal contact with the channel, and the results of testing whether the heatsink is in an abnormal short-circuit state.
[0099] This embodiment measures the power input to the heatsink and chip interface pins by the power supply. Based on the condition of the heatsink, it ensures that the contact between the heatsink and the chip interface pins is normal. Then, by analyzing the condition of the chip interface pins, it detects whether the heatsink is short-circuited to the chip interface pins.
[0100] This embodiment provides a chip heatsink testing method based on the foregoing embodiments. Please refer to the attached manual for details. Figure 4 Step S130, which analyzes the operating condition of the heat sink and pre-detects whether the channel and the heat sink are in normal contact, includes:
[0101] S131, disconnect the other pins of the chip from the power module;
[0102] S132, the heat sink receives the third current input from the power module and detects the voltage of the heat sink; the voltage of the heat sink is used as the third voltage;
[0103] S133, according to Ohm's law R=U / I, the calculated value of the theoretical resistance of the welding connected to the pre-tested heat sink is obtained;
[0104] S134, when the calculated value and the theoretical value of the welding theoretical resistance are the same, the output heat sink test result is that the pre-detection heat sink working condition provides a channel for normal contact with the heat sink, and the chip ground pin, the test chip ground pin and the heat sink are not in a connected state; where R is the calculated value of the welding theoretical resistance, U is the third voltage and I is the third current.
[0105] This embodiment provides a specific method for determining whether the input channel for the pre-detection heatsink's operating condition is in normal contact with the heatsink. This ensures the accuracy of the subsequent determination of whether the test chip interface pin is shorted to the heatsink. When the calculated value of the theoretical resistance differs from the theoretical value, in addition to abnormal contact between the pre-detection heatsink's operating condition input channel and the heatsink, there is also the possibility that the chip's ground pin or the test chip's ground pin is connected to the heatsink. Further testing of the resistance between the chip's ground pin and the heatsink is required. If the measured resistance is infinite, then the chip's ground pin or the test chip's ground pin is not connected to the heatsink. The abnormal calculated value of the theoretical resistance is due to the pre-detection heatsink's operating condition input channel failing to make normal contact with the heatsink.
[0106] This embodiment provides a chip heatsink testing method based on the foregoing embodiments. Please refer to the attached manual for details. Figure 5 The step S140, which analyzes and tests the operating condition of the chip interface pins to determine whether the heatsink is in an abnormal short-circuit state, includes:
[0107] S141, the other pins of the chip receive the first current input from the power module, and the other pins of the heat sink receive the first voltage input from the power module;
[0108] S142, test the second voltage of each of the other pins of the chip;
[0109] S143, based on the first current and the internal integrated circuit of the chip, obtain the expected voltage of other pins of each chip;
[0110] S144: When the expected voltage is different from the received second voltage, it is determined that the test chip pin corresponding to other pins of the chip is in a connected state with the heat sink. The heat sink test result is output as the heat sink is in an abnormal short-circuit state, and a stop signal is sent to control the test chip to stop the test.
[0111] This embodiment provides a detection logic for determining whether test chip interface pins other than the chip ground pin are shorted to the heat sink. This is based on the fact that the voltage of other chip pins is affected by the first voltage on the heat sink because they are shorted to the heat sink, resulting in a voltage that does not match the expected voltage of the chip.
[0112] This embodiment provides a chip heatsink testing method based on the aforementioned embodiments. After step S141, where the ports of other pins of the chip receive the first current input from the power module and the other pins of the heatsink receive the first voltage input from the power module, the method further includes:
[0113] When a test signal is input to other pins of the chip, the corresponding actual output signal is output from those pins.
[0114] When the ground pin of the test chip is only connected to the heat sink, the ground pin of the test chip is pulled high by the first voltage. By analyzing the test signal, the ideal output signal obtained is different from the actual output signal, which can be used to determine that the test chip is in an abnormal state.
[0115] Send a stop signal to control the test chip to stop the test.
[0116] This embodiment provides a method to intercept such defective chips by shorting all the chip's ground pins to the test chip, under the action of the first voltage of the heat sink, the voltage of the chip's ground pins is pulled high, causing the chip to malfunction.
[0117] It should be noted that the above embodiments can be freely combined as needed. The above are merely preferred embodiments of the present invention. It should be pointed out that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.
Claims
1. A chip heatsink testing system, characterized in that, include: A power module, connected to a heatsink detection module, is used to input power conditions to the heatsink detection module, the conditions including voltage and current. The heat sink detection module is used to obtain the operating conditions of the test chip interface pins and the heat sink fixed on the test chip according to the operating conditions of the power supply, and send the operating conditions of the test chip interface pins and the heat sink to the analysis output module; wherein, the test chip interface pins include: chip ground pins and other chip pins; The analysis output module is connected to the heat sink detection module and is used to analyze the working condition of the test chip interface pins and the working condition of the heat sink, and output the heat sink test results. The heat sink test results include: the result of whether the channel for pre-detecting the working condition of the heat sink is in normal contact with the heat sink, and the result of testing whether the heat sink is in an abnormal short-circuit state. The heat sink detection module includes a test chip subunit and a test heat sink subunit; When the pre-detection channel of the heat sink is in normal contact with the heat sink, the test chip subunit disconnects the other pins of the chip from the power module; the heat sink receives the third current input from the power module, the test heat sink subunit detects the voltage of the heat sink, and sends the voltage of the heat sink as the third voltage to the analysis output module; When testing whether the heat sink is in an abnormal short circuit, the ports of other pins of the chip receive the first current input from the power module, and the heat sink receives the first voltage input from the power module; the test chip subunit tests the second voltage of each of the ports of other pins of the chip, and outputs the second voltage to the analysis output module.
2. The chip heat sink testing system according to claim 1, characterized in that, The analysis output module is further configured to calculate the theoretical resistance of the welding circuit connected to the heat sink according to Ohm's law R=U / I when the pre-detection circuit provides a channel for determining whether the heat sink is in normal contact with the heat sink. When the calculated value is the same as the theoretical value of the welding resistance, the module outputs the heat sink test result as indicating that the pre-detection circuit provides a channel for determining the heat sink is in normal contact with the heat sink, and that the chip grounding pin, the grounding pin of the test chip, and the heat sink are not in a connected state. Here, R is the calculated value of the welding resistance, U is the third voltage, and I is the third current.
3. A chip heatsink testing system according to claim 1 or 2, characterized in that, The analysis output module is also used to test whether the heat sink is in an abnormal short-circuit state. Based on the first current and the integrated circuit inside the chip, the expected voltage of each other pin of the chip is obtained; when the expected voltage is different from the received second voltage, it is determined that the test chip pin corresponding to the other pin of the chip is in a connected state with the heat sink, the test result of the heat sink is output as the heat sink is in an abnormal short-circuit state, and a stop signal is sent to control the test chip to stop testing.
4. A chip heatsink testing system according to claim 1 or 2, characterized in that, The analysis output module is also used to input test signals to other pins of the chip, and the other pins of the chip output corresponding actual output signals; When the ground pin of the test chip is only connected to the heat sink, the ground pin of the test chip is pulled high by the first voltage. By analyzing the test signal, the ideal output signal obtained is different from the actual output signal, which can determine that the test chip is in an abnormal state. A stop signal is sent to control the test chip to stop testing.
5. A method for testing chip heat sinks, characterized in that, include: The operating condition of inputting power to the heat sink detection module includes voltage and current; the heat sink detection module includes a test chip subunit and a test heat sink subunit. The heat sink detection module obtains the operating conditions of the test chip interface pins and the heat sink based on the operating conditions of the power supply; wherein, the test chip interface pins include: chip ground pins and other chip pins; The system analyzes the operating condition of the heat sink and pre-detects whether the operating condition provision channel of the heat sink is in normal contact with the heat sink. When the pre-detection is performed to check whether the operating condition provision channel of the heat sink is in normal contact with the heat sink, the test chip subunit disconnects the connection between other pins of the chip and the power module. The heat sink receives the third current input from the power module, and the test heat sink subunit detects the voltage of the heat sink and sends the voltage of the heat sink as the third voltage to the analysis output module. When the pre-detection channel for the heat sink is in normal contact with the heat sink, the operating condition of the test chip interface pins is analyzed to determine whether the heat sink is in an abnormal short-circuit state. When testing whether the heat sink is in an abnormal short-circuit state, the ports of other pins of the chip receive the first current input from the power module, and the heat sink receives the first voltage input from the power module. The test chip subunit tests the second voltage of each of the ports of other pins of the chip and outputs the second voltage to the analysis output module. The output heat sink test results include: the results of pre-detecting the working condition of the heat sink, providing the channel for normal contact with the heat sink, and the results of testing whether the heat sink is in an abnormal short-circuit state.
6. The chip heat sink testing method according to claim 5, characterized in that, The analysis of the heat sink's operating condition, and the pre-detection of the heat sink's operating condition providing a channel for ensuring normal contact with the heat sink, include: According to Ohm's law R=U / I, the calculated value of the theoretical resistance of the weld connected to the heat sink in the pre-detection is obtained; When the calculated value and the theoretical value of the welding theoretical resistance are the same, the output of the heat sink test result indicates that the pre-detection heat sink working condition provides a channel that is in normal contact with the heat sink, and the chip ground pin, the ground pin of the test chip and the heat sink are not in a connected state; where R is the calculated value of the welding theoretical resistance, U is the third voltage and I is the third current.
7. The chip heat sink testing method according to claim 6, characterized in that, The analysis of the operating conditions of the interface pins of the test chip to determine whether the heatsink is in an abnormal short-circuit state includes: Based on the first current and the integrated circuit inside the chip, the expected voltage of each other pin of the chip is obtained; When the expected voltage is different from the received second voltage, it is determined that the test chip pin corresponding to other pins of the chip is in a connected state with the heat sink. The test result of the heat sink is output as the heat sink is in an abnormal short-circuit state, and a stop signal is sent to control the test chip to stop testing.
8. The chip heat sink testing method according to claim 7, characterized in that, Also includes: When a test signal is input to other pins of the chip, the other pins of the chip output the corresponding actual output signal. When the ground pin of the test chip is only connected to the heat sink, the ground pin of the test chip is pulled high by the first voltage. By analyzing the test signal, the ideal output signal obtained is different from the actual output signal, which can be used to determine that the test chip is in an abnormal state. A stop signal is sent to control the test chip to stop the test.