A packaged light source, a luminaire and a packaging method

Abstract

The application discloses a packaged light source, a lamp with the packaged light source and a packaging method, wherein the packaged light source comprises: a packaged blue light emitting diode chip, a packaged photoluminescence fluorescent powder and silica gel mixture layer and a pre-modification glue layer which are sequentially superimposed; the packaged blue light emitting diode chip and the packaged photoluminescence fluorescent powder and silica gel mixture layer have a color temperature difference between a color temperature of light generated by the packaged blue light emitting diode chip and the packaged photoluminescence fluorescent powder and silica gel mixture layer and a target color temperature; and the pre-modification glue layer is used for modifying to the target color temperature. When the packaged light source is produced by a packaged light source manufacturer, the color temperature formed by the packaged blue light emitting diode chip and the fluorescent glue layer is set to have a color temperature difference with the target color temperature, and the pre-modification glue layer is modified to be close to the target color temperature. When the packaged light source is filled with transparent glue by a lamp manufacturer, the color temperature of the emitted light will not be deviated or the deviation is very small, so that the color temperature of the light of the lamp terminal is closer to the required color temperature.

Description

Technical Field

[0001] This invention relates to the field of lighting technology, and in particular to a packaged light source, a lighting fixture, and a packaging method. Background Technology

[0002] An encapsulated light source is a structure formed by coating a blue light-emitting diode (LED) chip with a mixture of photoluminescent phosphor and silicone. After the blue LED chip emits light, the light passes through the photoluminescent phosphor and silicone mixture to obtain the desired white light color temperature. The encapsulated light source is then sent to lighting manufacturers to form the final lighting fixture. In certain product applications, especially outdoor waterproof lighting products...

[0003] Typically, lighting manufacturers apply a layer of transparent adhesive to the encapsulated light source for waterproofing and protection. However, this additional adhesive can cause a color temperature shift in the encapsulated light source, resulting in a deviation between the final light color temperature and the target color temperature. Lighting manufacturers usually need to customize non-standard encapsulated light sources to meet the actual color temperature requirements of the finished product, but this method is inflexible in production due to the need for custom-made light sources. Furthermore, this method only improves the color temperature difference to a certain extent and does not fundamentally solve the problem; the color temperature of the finished lighting fixture still exhibits significant fluctuations. Summary of the Invention

[0004] The main objective of this invention is to propose a packaged light source, luminaire, and packaging method, aiming to solve the technical problem of significant color temperature drift caused by re-filling the packaged light source with glue in the luminaire terminal in the prior art.

[0005] To achieve the above objectives, this invention proposes an encapsulated light source, comprising an encapsulated blue light-emitting diode chip, an encapsulated photoluminescent phosphor and silicone mixture layer, and a pre-correction adhesive layer stacked sequentially. The color temperature of the light emitted by the encapsulated light source is taken as the target color temperature. A color temperature difference exists between the color temperature of the light generated by the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer and the target color temperature. The pre-correction adhesive layer is used to compensate for this color temperature difference. The light generated by the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer can be corrected to the target color temperature after passing through the pre-correction adhesive layer.

[0006] Existing encapsulated light sources use blue LED chips encapsulated with a layer of photoluminescent phosphor and silicone. The light emitted from the blue LED chip interacts with the fluorescent material within the photoluminescent phosphor and silicone layer to form light with the required color temperature. While the encapsulation light source manufacturers test that the color temperature meets the requirements, the outer surface of the photoluminescent phosphor and silicone layer is air. The significant difference in refractive index between air and the photoluminescent phosphor and silicone layer causes internal reflection, leading to secondary and multiple excitations of the fluorescent material. This increases the proportion of fluorescent excitation in the spectrum. However, when lighting manufacturers encapsulate the light source with transparent... After the photoluminescent phosphor and silicone mixture layer is coated, a transparent adhesive is formed on the surface. Because the refractive indices of the photoluminescent phosphor and silicone mixture layer and the transparent adhesive are similar, the effect of internal reflection is weakened or disappears. The secondary and multiple excitation effects generated by the light reflected after passing through the photoluminescent phosphor and silicone mixture layer are basically destroyed. As a result, the blue light spectrum of the final emitted light increases due to the disappearance of the secondary and multiple excitation effects of internal reflection, while the fluorescence spectrum of the photoluminescent phosphor decreases due to the disappearance of secondary and multiple internal reflections. This causes the overall color coordinates of the light source spectrum to drift towards the blue light wavelength, resulting in a deviation between the color temperature and the desired color temperature, which is called color temperature drift.

[0007] In the production of the packaged light source of this invention, the color temperature of the packaged blue light-emitting diode chip and the layer of photoluminescent phosphor and silicone mixture is set to have a color temperature difference from the target color temperature. After a pre-correction adhesive layer is applied to the outside of the packaged blue light-emitting diode chip and the layer of photoluminescent phosphor and silicone mixture, the pre-correction adhesive layer is used to correct the color temperature shift caused by the reduction of internal reflection on the layer of photoluminescent phosphor and silicone mixture. This makes the light emitted by the packaged blue light-emitting diode chip, the layer of photoluminescent phosphor and silicone mixture, and the pre-correction adhesive layer close to the target color temperature. When the luminaire manufacturer applies transparent glue to the packaged light source, the color temperature of the emitted light will not shift or the shift will be very small, making the color temperature of the light at the luminaire terminal closer to the required color temperature.

[0008] Preferably, the color temperature of the light generated by the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer is lower than the target color temperature.

[0009] Typically, applying a transparent adhesive layer disrupts the internal reflection of the encapsulated light source, causing the blue light spectrum of the encapsulated light source to increase due to incomplete excitation, while the fluorescence spectrum decreases due to insufficient excitation. This results in the color coordinates of the encapsulated light source shifting towards the wavelength of the light from the encapsulated blue light-emitting diode chip, ultimately leading to a higher color temperature. Therefore, to ensure that the color temperature of the light produced by the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer is lower than the target color temperature, a pre-correction adhesive layer can raise the color temperature of the light produced by the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer to be closer to the target color temperature.

[0010] Preferably, the pre-corrected adhesive layer is a silicone layer. Silicone is a commonly used encapsulation adhesive with low cost.

[0011] In another aspect, the present invention also proposes a lamp fixture comprising the aforementioned encapsulated light source, wherein an outer adhesive layer is further encapsulated on the outside of the pre-corrected adhesive layer. By using the aforementioned encapsulated light source, after the outer adhesive layer is applied to the encapsulated light source, the color temperature shift of the light emitted by the lamp fixture is smaller and closer to the desired color temperature.

[0012] In another aspect, the present invention also proposes a packaging method, comprising the following steps:

[0013] S1: Measure the color parameters of the light produced by the test light source, and record it as the first color parameter;

[0014] S2: Measure the color parameters of the light produced by the combination of the test light source and the pre-corrected adhesive layer, and record it as the second color parameter;

[0015] S3: Analyze the difference between the first and second light color parameters, and denot it as the drift light color parameter difference;

[0016] S4: Obtain the color parameters of the light produced by the target light source, and record them as the target color parameters;

[0017] S5: Analyze the difference between the target light color parameter and the drift light color parameter, and record it as the third light color parameter. The third light color parameter is the light color parameter of the light generated by the third light source. The third light source is a combination of a packaged blue light emitting diode chip and a packaged photoluminescent phosphor and silicone mixture layer.

[0018] S6: Determine the luminescent material parameters of the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer based on the third light color parameter;

[0019] S7: The encapsulated photoluminescent phosphor and silicone mixture layer and the pre-corrected adhesive layer are sequentially encapsulated on the encapsulated blue light-emitting diode chip to form an encapsulated light source.

[0020] The encapsulation method of this invention first measures the first color parameters of the test light source and the second color parameters of the test light source combined with the pre-corrected adhesive layer. The difference between the first and second color parameters is analyzed to obtain the drift color parameter difference, thus determining the influence of the pre-corrected adhesive layer on the color temperature drift of the light source. Then, based on the target color parameters of the preset target light source and the drift color parameter difference generated by the pre-corrected adhesive layer, the required third color parameters of the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer are analyzed. The encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer are then determined. Finally, the encapsulated photoluminescent phosphor and silicone mixture layer and the pre-corrected adhesive layer are sequentially encapsulated onto the encapsulated blue light-emitting diode chip to obtain the encapsulated light source. This encapsulation method determines the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer based on the magnitude of the influence of the pre-corrected adhesive layer on the color temperature drift of the light source, ensuring that the color temperature generated by the encapsulated light source is close to the desired color temperature and can maintain the desired color temperature after encapsulation by the lighting manufacturer.

[0021] Preferably, in step S1, the first light color parameter is a first spectral radiant flux data packet D1, which contains radiant flux data d1, d2, ..., di of the light produced by the test light source;

[0022] In step S2, the second light color parameter is a second spectral radiant flux data packet E1, which contains radiant flux data e1, e2, ..., ei of the light generated by the combination of the test light source and the pre-corrected adhesive layer.

[0023] In step S3, the drift color parameter difference is a drift ratio data packet F1, which contains drift ratio data f1, f2, ..., fi, where f1 = e1 ÷ d1, f2 = e2 ÷ d2, ..., fi = ei ÷ di;

[0024] In step S4, the target light color parameter is a target spectral radiant flux data packet G1, which contains radiant flux data g1, g2, ..., gi of the light produced by the target light source;

[0025] In step S5, the third light color parameter is a third spectral radiant flux data packet H1, which contains radiant flux data h1, h2, ..., hi of the light generated by the third light source, where h1 = g1 ÷ f1, h2 = g2 ÷ f2, ..., hi = gi ÷ fi.

[0026] The radiant flux of light reflects its corresponding color temperature. By measuring the radiant flux of light produced by the test light source and the radiant flux of light produced by the combination of the test light source and the pre-correction adhesive layer, and comparing the two to obtain the drift ratio data, the influence of the pre-correction adhesive layer on the test light source can be quantified. Furthermore, by comparing the radiant flux data of the target light source with the drift ratio data, the radiant flux data of light produced by the third light source can be obtained. Through the calculation of radiant flux data, the energy characteristics of each ray can be more realistically reflected, and the obtained third color parameters are more accurate.

[0027] Preferably, step S6 includes:

[0028] S61: The target total radiation flux G2 and the third total radiation flux H2 are obtained by summing the target spectral radiation flux data packet G1 and the third spectral radiation flux data packet H1 respectively.

[0029] S62: Calculate the target iso-energy radiant flux data packet G3 of the light produced by the target light source. The target iso-energy radiant flux data packet G3 contains the iso-energy radiant flux data g31, g32, ..., g3i of the light produced by the target light source, where g31 = g1 ÷ G2, g32 = g2 ÷ G2, ..., g3i = gi ÷ G2;

[0030] S63: Calculate the third iso-energy radiant flux data packet H3 of the light produced by the third light source, wherein the third iso-energy radiant flux data packet H3 contains iso-energy radiant flux data h31, h32, ..., h3i of the light produced by the third light source, where h31 = h1 ÷ H2, h32 = h2 ÷ H2, ..., h3i = hi ÷ H2;

[0031] S64: Calculate the equal energy difference ratio data packet K, wherein the equal energy difference ratio data packet K contains the equal energy difference ratios k1, k2, ..., ki between the light emitted by the third light source and the light emitted by the target light source, where k1 = (h31 - g31) ÷ g31, k2 = (h32 - g32) ÷ g32, ..., ki = (h3i - g3i) ÷ g3i;

[0032] S65: The target light source includes a target blue light-emitting diode chip and a target photoluminescent phosphor and silicone mixture layer; obtain the luminescent material parameters of the target blue light-emitting diode chip and the target photoluminescent phosphor and silicone mixture layer.

[0033] S66: Based on the equal energy difference ratio data packet K, adjust the luminescent material parameters of the target blue light-emitting diode chip and the target photoluminescent phosphor and silicone mixture layer to obtain the luminescent material parameters of the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer.

[0034] After obtaining the third light color parameters of the third light source, namely the radiant flux data of the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer, it is necessary to convert the radiant flux data into the luminescent material parameters of the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer, so as to finally produce the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer.

[0035] This invention converts the radiant flux data of the light generated by the target light source and the third light source into iso-energy radiant flux data. By comparing the iso-energy data, the deviations between the target light source and the third light source at different wavelengths can be accurately analyzed. Specifically, the differences between the luminescent material parameters of the target blue LED chip and the target photoluminescent phosphor-silicone mixture layer and the luminescent material parameters of the encapsulated blue LED chip and the encapsulated photoluminescent phosphor-silicone mixture layer can be determined. This allows for adjustment of the luminescent material parameters of the target blue LED chip and the target photoluminescent phosphor-silicone mixture layer, resulting in a more accurate determination of the encapsulated blue LED chip and the encapsulated photoluminescent phosphor-silicone mixture layer. The comparison of iso-energy data provides more accurate data for fabricating the encapsulated blue LED chip and the encapsulated photoluminescent phosphor-silicone mixture layer, avoiding the problems of spectral deviations caused by different radiant energies or normalization of maximum values, which lead to inaccurate difference analysis. This results in the final encapsulated blue LED chip and the encapsulated photoluminescent phosphor-silicone mixture layer being closer to the third light source. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of the structure of the packaged light source of the present invention;

[0038] Figure 2 A schematic diagram of the light produced by a blue light-emitting diode chip and a layer of photoluminescent phosphor and silicone.

[0039] Figure 3 This is a schematic diagram of the light generated by the encapsulated light source of the present invention, namely, the encapsulated blue light-emitting diode chip, the encapsulated photoluminescent phosphor and silicone mixture layer and the pre-corrected adhesive layer;

[0040] Figure 4This is a schematic diagram of the structure of the lamp fixture of the present invention after an outer adhesive layer is applied to the encapsulated light source;

[0041] Figure 5 This is a graph showing the actual radiative flux distribution of the target light source and the third light source in the encapsulation method of the present invention.

[0042] Figure 6 This is a graph showing the equal-energy radiative flux distribution curves of the target light source and the third light source in the encapsulation method of the present invention.

[0043] Figure 7 This is a graph showing the distribution of the energy difference ratio between the third light source and the target light source in the encapsulation method of the present invention.

[0044] In the attached diagram: 1-Encapsulated blue light-emitting diode chip, 2-Encapsulated photoluminescent phosphor and silicone mixture layer, 3-Pre-corrected adhesive layer, 4-Outer adhesive layer.

[0045] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0046] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0047] It should be noted that if the embodiments of the present invention involve directional indicators, such as up, down, left, right, front, back, etc., the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0048] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0049] like Figure 1As shown, an encapsulated light source includes an encapsulated blue light-emitting diode chip 1, an encapsulated photoluminescent phosphor and silicone mixture layer 2, and a pre-correction adhesive layer 3 stacked sequentially. The color temperature of the light emitted by the encapsulated light source is taken as the target color temperature. There is a color temperature difference between the color temperature of the light generated by the encapsulated blue light-emitting diode chip 1 and the encapsulated photoluminescent phosphor and silicone mixture layer 2 and the target color temperature. The pre-correction adhesive layer 3 is used to compensate for the color temperature difference. The light generated by the encapsulated blue light-emitting diode chip 1 and the encapsulated photoluminescent phosphor and silicone mixture layer 2 can be corrected to the target color temperature after passing through the pre-correction adhesive layer 3.

[0050] Existing blue light-emitting diode chips, encapsulated with a layer of photoluminescent phosphor and silicone, such as Figure 2 As shown, the light emitted by the blue light-emitting diode chip interacts with the fluorescent material in the photoluminescent phosphor and silicone mixture layer to form light with the required color temperature. The packaging light source manufacturer tests the packaged light source to ensure that the color temperature meets the requirements. At this time, because the outside of the photoluminescent phosphor and silicone mixture layer is air, the refractive index of the air and the photoluminescent phosphor and silicone mixture layer is significantly different, resulting in internal reflection. This will cause the photoluminescent material to produce secondary and multiple excitation effects, enhancing the excitation ratio of the blue light spectrum emitted by the blue light chip, and relatively increasing the proportion of parameters in the fluorescent excitation part of the spectrum. However, the inventors discovered that when lighting manufacturers fill the light source with transparent adhesive, that is, after transparent adhesive is formed on the surface of the photoluminescent phosphor and silicone mixture layer, the internal reflection effect is weakened or disappeared because the refractive index of the photoluminescent phosphor and silicone mixture layer and the transparent adhesive are similar. The secondary and multiple excitation effects generated by the light reflected after passing through the photoluminescent phosphor and silicone mixture layer are basically destroyed. As a result, the blue light spectrum of the final emitted light increases due to the disappearance of the secondary and multiple excitation effects of internal reflection, while the fluorescence spectrum of the photoluminescent phosphor decreases due to the disappearance of secondary and multiple internal reflections. This causes the overall color coordinates of the light source spectrum to drift towards the blue light wavelength direction, resulting in a deviation between the final color temperature and the required color temperature, thus causing color temperature drift.

[0051] In the production of this invention's encapsulated light source, the color temperature of the encapsulated blue light-emitting diode chip 1 and the encapsulated photoluminescent phosphor and silicone mixture layer 2 is set to have a color temperature difference from the target color temperature. After a pre-correction adhesive layer 3 is applied to the outside of the encapsulated blue light-emitting diode chip 1 and the encapsulated photoluminescent phosphor and silicone mixture layer 2, the pre-correction adhesive layer 3 corrects the color temperature shift caused by reduced internal reflection on the encapsulated photoluminescent phosphor and silicone mixture layer 2, making the light generated by the encapsulated blue light-emitting diode chip 1, the encapsulated photoluminescent phosphor and silicone mixture layer 2, and the pre-correction adhesive layer 3 closer to the target color temperature. When the lighting manufacturer applies transparent adhesive to this encapsulated light source, such as... Figure 3As shown, the color temperature of the emitted light will not shift or will shift very little, making the color temperature of the light at the lamp terminal closer to the required color temperature.

[0052] Furthermore, the color temperature of the light generated by the encapsulated blue light-emitting diode chip 1 and the encapsulated photoluminescent phosphor and silicone mixture layer 2 is lower than the target color temperature.

[0053] Typically, applying a transparent adhesive layer disrupts the internal reflection of the encapsulated light source, causing the blue light spectrum of the encapsulated light source to increase due to incomplete excitation, while the fluorescence spectrum decreases due to insufficient excitation. This results in the color coordinates of the encapsulated light source shifting towards the wavelength of the light from the encapsulated blue light-emitting diode chip, ultimately leading to a higher color temperature. Therefore, to ensure that the color temperature of the light produced by the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer is lower than the target color temperature, a pre-correction adhesive layer can raise the color temperature of the light produced by the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer to be closer to the target color temperature.

[0054] Furthermore, the pre-correction adhesive layer 3 is a silicone layer. Silicone is a commonly used encapsulating adhesive with low cost. Other transparent potting compounds can also be used for the pre-correction adhesive layer.

[0055] A type of lamp, such as Figure 4 As shown, the luminaire includes the aforementioned encapsulated light source, and an outer adhesive layer 4 is further encapsulated on the outside of the pre-corrected adhesive layer 3. By using the aforementioned encapsulated light source, after the outer adhesive layer is applied to the encapsulated light source, the color temperature drift of the light emitted by the luminaire is smaller and closer to the desired color temperature.

[0056] In another aspect, the present invention provides a packaging method comprising the following steps:

[0057] S1: Measure the color parameters of the light produced by the test light source, and record it as the first color parameter;

[0058] S2: Measure the color parameters of the light produced by the combination of the test light source and the pre-corrected adhesive layer, and record it as the second color parameter;

[0059] S3: Analyze the difference between the first and second light color parameters, and denot it as the drift light color parameter difference;

[0060] S4: Obtain the color parameters of the light produced by the target light source, and record them as the target color parameters;

[0061] S5: Analyze the difference between the target light color parameter and the drift light color parameter, and record it as the third light color parameter. The third light color parameter is the light color parameter of the light generated by the third light source. The third light source is a combination of a packaged blue light emitting diode chip and a packaged photoluminescent phosphor and silicone mixture layer.

[0062] S6: Determine the luminescent material parameters of the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer based on the third light color parameter;

[0063] S7: The encapsulated photoluminescent phosphor and silicone mixture layer and the pre-corrected adhesive layer are sequentially encapsulated on the encapsulated blue light-emitting diode chip to form an encapsulated light source.

[0064] The encapsulation method of this invention first measures the first color parameters of the test light source and the second color parameters of the test light source combined with the pre-corrected adhesive layer. The difference between the first and second color parameters is analyzed to obtain the drift color parameter difference, thus determining the influence of the pre-corrected adhesive layer on the color temperature drift of the light source. Then, based on the target color parameters of the preset target light source and the drift color parameter difference generated by the pre-corrected adhesive layer, the required third color parameters of the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer are analyzed. The encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer are then determined. Finally, the encapsulated photoluminescent phosphor and silicone mixture layer and the pre-corrected adhesive layer are sequentially encapsulated onto the encapsulated blue light-emitting diode chip to obtain the encapsulated light source. This encapsulation method determines the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer based on the magnitude of the influence of the pre-corrected adhesive layer on the color temperature drift of the light source, ensuring that the color temperature generated by the encapsulated light source is close to the desired color temperature and can maintain the desired color temperature after encapsulation by the lighting manufacturer.

[0065] In some specific embodiments, in step S1, the first light color parameter is a first spectral radiant flux data packet D1, which contains radiant flux data d1, d2, ..., di of the light produced by the test light source.

[0066] In step S2, the second light color parameter is the second spectral radiant flux data packet E1, which contains radiant flux data e1, e2, ..., ei of the light generated by the combination of the test light source and the pre-corrected adhesive layer.

[0067] In step S3, the drift light color parameter difference is a drift ratio data packet F1, which contains drift ratio data f1, f2, ..., fi, where f1 = e1 ÷ d1, f2 = e2 ÷ d2, ..., fi = ei ÷ di.

[0068] In step S4, the target light color parameter is the target spectral radiant flux data packet G1, which contains the radiant flux data g1, g2, ..., gi of the light produced by the target light source.

[0069] In step S5, the third light color parameter is a third spectral radiant flux data packet H1, which contains radiant flux data h1, h2, ..., hi of the light generated by the third light source, where h1 = g1 ÷ f1, h2 = g2 ÷ f2, ..., hi = gi ÷ fi.

[0070] The radiant flux of light reflects its corresponding color temperature. By measuring the radiant flux of light produced by the test light source and the radiant flux of light produced by the combination of the test light source and the pre-correction adhesive layer, and comparing the two to obtain the drift ratio data, the influence of the pre-correction adhesive layer on the test light source can be quantified. Furthermore, by comparing the radiant flux data of the target light source with the drift ratio data, the radiant flux data of light produced by the third light source can be obtained. Through the calculation of radiant flux data, the energy characteristics of each ray can be more realistically reflected, and the obtained third color parameters are more accurate.

[0071] Specifically, the wavelength range of each light source is 380nm to 780nm.

[0072] The spectral radiant flux data of the test light source and the combination of the test light source and the pre-corrected adhesive layer are measured using a spectral analysis instrument. The spectral radiant flux data includes all wavelengths of visible light (380nm~780nm) in units of 1nm and the radiant flux corresponding to the wavelength. The first spectral radiant flux data package of the test light source is D1, in which each wavelength of the light from the test light source corresponds to one radiant flux data. In this embodiment, the first spectral radiant flux data package D1 contains 401 radiant flux data (d1, d2, ..., d401). The second spectral radiant flux data package of the test light source and the pre-corrected adhesive layer combination is E1, in which each wavelength of the light from the test light source and the pre-corrected adhesive layer combination corresponds to one radiant flux data. The second spectral radiant flux data package E1 also contains 401 radiant flux data (e1, e2, ..., e401). Existing instruments can be used for spectral analysis, as long as they can measure spectral energy. However, the same instrument should generally be used when measuring different light sources to avoid measurement errors and inaccurate evaluation results due to instrument limitations. Specifically, the HAAS-2000 high-precision rapid spectroradiometer from Hangzhou Yuanfang Optoelectronic Information Co., Ltd. can be used.

[0073] The target light color parameters are also obtained according to the required target light rays, resulting in a target spectral radiant flux data packet G1, which contains 401 radiant flux data (g1, g2, ..., g401).

[0074] Divide each data in the second spectral radiant flux data packet E1 by the data in the first spectral radiant flux data packet D1, i.e., f1 = e1 ÷ d1, f2 = e2 ÷ d2, ..., f401 = e401 ÷ d401, to obtain the 401 drift ratio data (f1, f2, ..., f401) contained in the drift ratio data packet F1.

[0075] Then, divide the data in the target spectral radiant flux data packet G1 by the data in the drift ratio data packet F1 one by one, i.e., h1=g1÷f1, h2=g2÷f2, ..., hi=g401÷f401, to obtain the 401 radiant flux data (h1, h2, ..., h401) contained in the third spectral radiant flux data packet H1.

[0076] After obtaining the third color parameter, i.e., the third spectral radiant flux data packet H1, it is necessary to fabricate an encapsulated blue light-emitting diode chip and an encapsulated photoluminescent phosphor and silicone mixture layer based on the third color parameter. Step S6 includes:

[0077] S61: The target total radiation flux G2 and the third total radiation flux H2 are obtained by summing the target spectral radiation flux data packet G1 and the third spectral radiation flux data packet H1 respectively.

[0078] S62: Calculate the target iso-energy radiant flux data packet G3 of the light produced by the target light source. The target iso-energy radiant flux data packet G3 contains the iso-energy radiant flux data g31, g32, ..., g3i of the light produced by the target light source, where g31 = g1 ÷ G2, g32 = g2 ÷ G2, ..., g3i = gi ÷ G2;

[0079] S63: Calculate the third iso-energy radiant flux data packet H3 of the light produced by the third light source, wherein the third iso-energy radiant flux data packet H3 contains iso-energy radiant flux data h31, h32, ..., h3i of the light produced by the third light source, where h31 = h1 ÷ H2, h32 = h2 ÷ H2, ..., h3i = hi ÷ H2;

[0080] S64: Calculate the equal energy difference ratio data packet K, wherein the equal energy difference ratio data packet K contains the equal energy difference ratios k1, k2, ..., ki between the light emitted by the third light source and the light emitted by the target light source, where k1 = (h31 - g31) ÷ g31, k2 = (h32 - g32) ÷ g32, ..., ki = (h3i - g3i) ÷ g3i.

[0081] S65: The target light source includes a target blue light-emitting diode chip and a target photoluminescent phosphor and silicone mixture layer; obtain the luminescent material parameters of the target blue light-emitting diode chip and the target photoluminescent phosphor and silicone mixture layer.

[0082] S66: Based on the equal energy difference ratio data packet K, adjust the luminescent material parameters of the target blue light-emitting diode chip and the target photoluminescent phosphor and silicone mixture layer to obtain the luminescent material parameters of the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer.

[0083] After obtaining the third light color parameters of the third light source, namely the radiant flux data of the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer, it is necessary to convert the radiant flux data into the luminescent material parameters of the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer, so as to finally produce the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer.

[0084] Currently, spectral comparison is commonly used to analyze the differences between two light sources. Existing methods for analyzing spectra typically fall into two categories: absolute spectral methods and relative spectral methods. Absolute spectral methods compare the absolute values ​​of the absolute energy of the measured light source's spectrum. Because they use absolute values, when the spectral distribution ratio is the same but the radiant energy differs, the spectral comparison can appear very different, even if the actual spectral distribution ratio is not that large, affecting the judgment result. Relative spectral methods forcibly normalize the spectrum, treating the highest spectral value as 1 for calculation. The difference observed in the comparison may not be the actual difference; the highest peaks may differ, but standardizing the highest peaks to 1 for comparison is equivalent to artificially distorting the spectral curve. Therefore, neither of these existing methods can accurately analyze the differences between spectra, and their accuracy in analyzing spectral differences is insufficient.

[0085] This invention converts the radiant flux data of the light generated by the target light source and the third light source into iso-energy radiant flux data. By comparing the iso-energy data, the deviations between the target light source and the third light source at different wavelengths can be accurately analyzed. Specifically, the differences between the luminescent material parameters of the target blue LED chip and the target photoluminescent phosphor-silicone mixture layer and the luminescent material parameters of the encapsulated blue LED chip and the encapsulated photoluminescent phosphor-silicone mixture layer can be determined. This allows for adjustment of the luminescent material parameters of the target blue LED chip and the target photoluminescent phosphor-silicone mixture layer, resulting in a more accurate determination of the encapsulated blue LED chip and the encapsulated photoluminescent phosphor-silicone mixture layer. The comparison of iso-energy data provides more accurate data for fabricating the encapsulated blue LED chip and the encapsulated photoluminescent phosphor-silicone mixture layer, avoiding the problems of spectral deviations caused by different radiant energies or normalization of maximum values, which lead to inaccurate difference analysis. This results in the final encapsulated blue LED chip and the encapsulated photoluminescent phosphor-silicone mixture layer being closer to the third light source.

[0086] Specifically, the 401 radiative flux data in G1 are divided by the total target radiative flux G2 to obtain the iso-energy radiative flux data g31, g32, ..., g3401 corresponding to each wavelength value. The iso-energy radiative flux data (g31, g32, ..., g3401) of all wavelength values ​​are combined to form the target iso-energy radiative flux data package G3, where G3 equals 1W (watts), that is, the sum of the iso-energy radiative flux data (g31, g32, ..., g3401) of all wavelength values ​​is 1W. Divide the 401 radiant flux data in E1 by the third total radiant flux H2 to obtain the iso-energy radiant flux data h31, h32, ..., h3401 corresponding to each wavelength value. Combine the iso-energy radiant flux data (h31, h32, ..., h3401) of all wavelength values ​​to form the third iso-energy radiant flux data packet H3, where H3 equals 1W (watts), that is, the sum of the iso-energy radiant flux data (h31, h32, ..., h3401) of all wavelength values ​​is 1W. Then calculate the iso-energy difference ratio data packets K (k1, k2, ..., k401), k1 = (h31 - g31) ÷ g31, k2 = (h32 - g32) ÷ g32, ..., k401 = (h3401 - g3401) ÷ g3401.

[0087] The sum of the iso-energy radiant flux data corresponding to the target light source and the third light source is 1W. By intercepting the wavelength range of the light sources and calculating the iso-energy radiant flux data package for each light source, the sum of the iso-energy radiant flux data corresponding to each light source is made to be 1W. By fixing the 1W radiant flux, it is convenient to compare the data of the target light source and the third light source. A radiant flux distribution coordinate system can be constructed, and the iso-energy radiant flux data corresponding to each light source can be displayed more intuitively through curves using graphical visualization, making it easier to compare, evaluate, and analyze the radiant energy distribution of the light sources.

[0088] The target light source, including the target blue light-emitting diode chip and the target photoluminescent phosphor and silicone mixture layer, has its luminescent material parameters. Those skilled in the art know its luminescent material parameters, such as the light intensity of the target blue light-emitting diode chip and the content of the target photoluminescent phosphor. According to the equal energy difference ratio data packet K, adjusting the light intensity of the blue light-emitting diode chip and the content of the photoluminescent phosphor can adjust the energy of the emitted light at different wavelengths, and finally obtain the luminescent material parameters of the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer.

[0089] The following comparison is made between existing packaged light sources and the packaged light source of the present invention, with the target light source being standard light with a color temperature of 6530K as an example.

[0090] Comparative example:

[0091] Using a standard light source that emits 6530K as the factory-packaged light source, and directly applying an outer adhesive layer to the packaged light source, the color temperature of the light emitted by the lamp is as shown in Table 1 below, based on the test data.

[0092] Table 1

[0093]

[0094]

[0095] As can be seen from the data in Table 1, when a standard 6530K light source is used directly as the encapsulated light source and glue is applied directly, the color temperature of the light emitted by the lamp deviates significantly from the target color temperature.

[0096] Example 1:

[0097] Using a standard light source of 6530K as the test light source, and the combination of the test light source and the pre-corrected adhesive layer as the combined light source, the first spectral radiant flux data packet D1 of the test light source and the second spectral radiant flux data packet E1 of the combined light source were measured by a spectrometer, and the drift ratio data packet F1 was calculated.

[0098] Then, acquire the target spectral radiant flux data packet G1 of the target light source (a standard light source at 6530K), and calculate the third spectral radiant flux data packet H1 of the third light source. A radiant flux distribution coordinate system can be constructed with wavelength as the X-axis and radiant flux as the Y-axis. The target radiant flux distribution curve is plotted on the coordinate system by corresponding the wavelength value of the target light source to the X-axis and the target spectral radiant flux data packet G1 to the Y-axis. Similarly, the third radiant flux distribution curve is plotted on the coordinate system by corresponding the wavelength value of the third light source to the X-axis and the third spectral radiant flux data packet H1 to the Y-axis. (Refer to...) Figure 5 .

[0099] The total radiant flux of the target light source between 380nm and 780nm is 1W, i.e., G2 = 1W. The total radiant flux of the third light source between 380nm and 780nm is 1.262611W, i.e., H2 = 1.262611W. Calculate the target's iso-energy radiant flux data packet G3 and the third iso-energy radiant flux data packet H3. A radiant flux distribution coordinate system can be constructed with wavelength as the X-axis and radiant flux as the Y-axis. Plot the target's iso-energy radiant flux distribution curve on the coordinate system by corresponding the wavelength of the target light source to the X-axis and the target's iso-energy radiant flux data packet G3 to the Y-axis. Similarly, plot the third iso-energy radiant flux distribution curve on the coordinate system by corresponding the wavelength of the third light source to the X-axis and the third iso-energy radiant flux data packet H3 to the Y-axis. Refer to... Figure 6 .from Figure 5 and Figure 6 The comparison shows that, since the target light source and the third light source have different actual energies, it is impossible to directly compare the differences in their spectra. However, by converting the target light source and the third light source to the same energy and then comparing them, the differences in their spectra can be accurately determined, providing more accurate data reference for the subsequent production of the third light source.

[0100] Then, using the target equal-energy radiant flux data packet G3 and the third equal-energy radiant flux data packet H3, the equal-energy difference ratio data packet K is calculated. In this embodiment, the equal-energy difference ratio is converted into a percentage. A radiant flux distribution coordinate system can be constructed with the wavelength value as the X-axis and the equal-energy difference ratio as the Y-axis. The wavelength value of the target light source is plotted on the equal-energy difference distribution coordinate system, corresponding to the X-axis, and the equal-energy difference ratio data packet K is plotted on the Y-axis. Referencing... Figure 7 .

[0101] The above measurement and calculation data are shown in Table 2 below.

[0102] Table 2

[0103]

[0104]

[0105]

[0106]

[0107]

[0108]

[0109]

[0110]

[0111] Adjustments were made based on the isoenergy difference ratio data packet K and the isoenergy difference ratio distribution curve, as well as the luminescent material parameters of the blue light-emitting diode chip and the photoluminescent phosphor and silicone mixture layer corresponding to the known 6530K standard light source. For example, at a wavelength of 450nm, the isoenergy difference ratio is -47.15%, which can reduce the energy at 450nm, specifically by reducing the proportion of blue light. At a wavelength of 640nm, the isoenergy difference ratio is 38.66%, which can increase the energy at 640nm, specifically by increasing the proportion of fluorescence. Finally, the ratio of the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer was obtained.

[0112] After the outer adhesive layer is applied to the encapsulated light source in this embodiment, the color temperature of the light emitted by the lamp is as shown in Table 2 below, based on the test data.

[0113] Table 2

[0114] serial number Luminous flux Φ (lm) x-axis y-axis Color temperature Tc(K) 1 1,181.70 0.3120 0.3354 6,496 2 1,183.50 0.3131 0.3340 6,446 3 1,171.80 0.3116 0.3345 6,523 4 1,170.00 0.3107 0.3319 6,587 5 1,172.70 0.3095 0.3311 6,659 6 1,166.40 0.3126 0.3315 6,489 7 1,170.90 0.3113 0.3342 6,543 8 1,155.60 0.3099 0.3306 6,642 9 1,177.20 0.3130 0.3339 6,452 10 1,185.30 0.3104 0.3319 6,606 11 1,183.50 0.3115 0.3364 6,513 12 1,205.10 0.3112 0.3339 6,545 13 1,188.90 0.3106 0.3313 6,604 14 1,197.00 0.3130 0.3369 6,432 15 1,189.80 0.3104 0.3339 6,587 16 1,160.10 0.3134 0.3320 6,446 17 1,168.20 0.3120 0.3358 6,493 18 1,186.20 0.3139 0.3349 6,398 19 1,189.80 0.3105 0.3333 6,592 20 1,186.20 0.3138 0.3336 6,415 21 1,166.40 0.3126 0.3360 6,459 22 1,185.30 0.3137 0.3366 6,398 23 1,186.20 0.3093 0.3316 6,672 24 1,188.90 0.3141 0.3357 6,385 25 1,182.60 0.3124 0.3331 6,489 MIN 1,155.60 0.3093 0.3306 6,385 MAX 1,205.10 0.3141 0.3369 6,672 AVG 1,179.97 0.3119 0.3338 6,515

[0115] As can be seen from the data in Table 2, after potting the encapsulated light source of this embodiment, the average color temperature of the light was 6515K after testing multiple sets of lamp samples. This is very close to the target color temperature and can greatly reduce color temperature drift compared to the lamps in the comparative example.

[0116] In some specific embodiments, the encapsulation method employs a radiation flux distribution curve construction system. The radiation flux distribution curve construction system includes a measurement module, a calculation module, a conversion module, and a display module connected in sequence. The measurement module measures the spectral radiation flux of light and sends it to the calculation module. The calculation module receives the spectral radiation flux of light and calculates the total radiation flux and iso-energy radiation flux data. The conversion module converts the iso-energy radiation flux data into a radiation flux distribution curve. The display module displays the radiation flux distribution curve.

[0117] The measurement module is connected to the calculation module, the calculation module is connected to the conversion module, and the conversion module is connected to the display module. Specifically, the measurement module refers to a spectral analyzer. It measures the spectrum of the light source and sends it to the calculation module. The calculation module calculates and generates iso-energy radiant flux data according to step three in the encapsulation method. The calculation module sends the iso-energy radiant flux data to the conversion module, which converts it into a radiant flux distribution curve. The display module (e.g., a screen) visualizes the radiant flux distribution curve. This construction system can execute the above construction method, thus possessing the beneficial effects of the aforementioned evaluation method, which will not be elaborated upon here. Furthermore, by designing this construction system, the evaluation of the light source spectrum can be made more convenient and efficient.

[0118] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method for packaging a light source, characterized in that, The encapsulated light source includes an encapsulated blue light-emitting diode chip (1), an encapsulated photoluminescent phosphor and silicone mixture layer (2), and a pre-correction adhesive layer (3) stacked sequentially. The color temperature of the light emitted by the encapsulated light source is the target color temperature. There is a color temperature difference between the color temperature of the light generated by the encapsulated blue light-emitting diode chip (1) and the encapsulated photoluminescent phosphor and silicone mixture layer (2) and the target color temperature. The pre-correction adhesive layer (3) is used to compensate for the color temperature difference. The light generated by the encapsulated blue light-emitting diode chip (1) and the encapsulated photoluminescent phosphor and silicone mixture layer (2) can be corrected to the target color temperature after passing through the pre-correction adhesive layer (3). The packaging method includes the following steps: S1: Measure the color parameters of the light produced by the test light source, and record it as the first color parameter; S2: Measure the color parameters of the light produced by the combination of the test light source and the pre-corrected adhesive layer, and record it as the second color parameter; S3: Analyze the difference between the first and second light color parameters, and denot it as the drift light color parameter difference; S4: Obtain the color parameters of the light produced by the target light source, and record them as the target color parameters; S5: Analyze the difference between the target light color parameter and the drift light color parameter, and record it as the third light color parameter. The third light color parameter is the light color parameter of the light generated by the third light source. The third light source is a combination of a packaged blue light emitting diode chip and a packaged photoluminescent phosphor and silicone mixture layer. S6: Determine the luminescent material parameters of the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer based on the third light color parameter; S7: Sequentially encapsulate the encapsulated photoluminescent phosphor and silicone mixture layer and the pre-corrected adhesive layer onto the encapsulated blue light-emitting diode chip to form an encapsulated light source; The pre-corrected adhesive layer (3) is a silicone layer; In step S1, the first light color parameter is a first spectral radiant flux data packet D1, which contains radiant flux data d1, d2, ..., di of the light produced by the test light source; In step S2, the second light color parameter is a second spectral radiant flux data packet E1, which contains radiant flux data e1, e2, ..., ei of the light generated by the combination of the test light source and the pre-corrected adhesive layer. In step S3, the drift color parameter difference is a drift ratio data packet F1, which contains drift ratio data f1, f2, ..., fi, where f1 = e1 ÷ d1, f2 = e2 ÷ d2, ..., fi = ei ÷ di; In step S4, the target light color parameter is a target spectral radiant flux data packet G1, which contains radiant flux data g1, g2, ..., gi of the light produced by the target light source; In step S5, the third light color parameter is a third spectral radiant flux data packet H1, which contains radiant flux data h1, h2, ..., hi of the light produced by the third light source, where h1 = g1 ÷ f1, h2 = g2 ÷ f2, ..., hi = gi ÷ fi; Step S6 includes: S61: The target total radiation flux G2 and the third total radiation flux H2 are obtained by summing the target spectral radiation flux data packet G1 and the third spectral radiation flux data packet H1 respectively. S62: Calculate the target iso-energy radiant flux data packet G3 of the light produced by the target light source. The target iso-energy radiant flux data packet G3 contains the iso-energy radiant flux data g31, g32, ..., g3i of the light produced by the target light source, where g31 = g1 ÷ G2, g32 = g2 ÷ G2, ..., g3i = gi ÷ G2; S63: Calculate the third iso-energy radiant flux data packet H3 of the light produced by the third light source, wherein the third iso-energy radiant flux data packet H3 contains iso-energy radiant flux data h31, h32, ..., h3i of the light produced by the third light source, where h31 = h1 ÷ H2, h32 = h2 ÷ H2, ..., h3i = hi ÷ H2; S64: Calculate the equal energy difference ratio data packet K, wherein the equal energy difference ratio data packet K contains the equal energy difference ratios k1, k2, ..., ki between the light emitted by the third light source and the light emitted by the target light source, where k1 = (h31 - g31) ÷ g31, k2 = (h32 - g32) ÷ g32, ..., ki = (h3i - g3i) ÷ g3i; S65: The target light source includes a target blue light-emitting diode chip and a target photoluminescent phosphor and silicone mixture layer; obtain the luminescent material parameters of the target blue light-emitting diode chip and the target photoluminescent phosphor and silicone mixture layer. S66: Based on the equal energy difference ratio data packet K, adjust the luminescent material parameters of the target blue light-emitting diode chip and the target photoluminescent phosphor and silicone mixture layer to obtain the luminescent material parameters of the encapsulated blue light-emitting diode chip and the encapsulated photoluminescent phosphor and silicone mixture layer.

2. The packaging method as described in claim 1, characterized in that, The color temperature of the light produced by the encapsulated blue light-emitting diode chip (1) and the encapsulated photoluminescent phosphor and silicone mixture layer (2) is lower than the target color temperature.

3. The packaging method as described in claim 1, characterized in that, The outer side of the pre-corrected adhesive layer (3) is also encapsulated with an outer adhesive layer (4).

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