Display panel and display device

Abstract

The application discloses a display panel and a display device, and belongs to the technical field of display. The display panel comprises a display area and a non-display area. The display panel comprises a substrate, a driving circuit layer, a light-emitting functional layer and a first electrode layer. The driving circuit layer comprises at least a first metal layer and a second metal layer. One side of the substrate comprises a plurality of first isolation structures located in the non-display area. At least one first isolation structure separates at least one of the light-emitting functional layer, the first electrode layer and other corresponding film layers extending to the non-display area. In a direction perpendicular to the plane where the display panel is located, at least one first isolation structure comprises a first part and a second part which are stacked. The first part is located in the first metal layer, and the second part is located in the second metal layer. The first metal layer and the second metal layer are separated by an insulating layer. The display device comprises the above-mentioned display panel. The application can effectively separate the path of the organic light-emitting material layer transmitting water vapor and oxygen to the display area, and ensure the display quality.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, more particularly, to a display panel and a display device. BACKGROUND

[0002] OLED (Organic Light-Emitting Diode) display devices are widely used in various fields due to their lightness, wide viewing angle, fast response, low temperature resistance, high luminous efficiency, and ability to produce flexible display screens.

[0003] A conventional OLED display screen usually includes a display panel and a thin film encapsulation structure located at the periphery of the display panel. The display panel includes an array substrate and an organic light-emitting material layer formed by evaporation on the array substrate. The thin film encapsulation structure is used to isolate water vapor and oxygen from the outside of the device to improve the service life of the display screen. During the manufacturing process of the display screen, the display screen needs to be cut to form a display screen with appropriate size. However, there is a phenomenon that the thin film encapsulation structure on the display screen cannot completely cover the evaporated organic light-emitting material layer, and water and oxygen can easily invade after cutting, resulting in encapsulation failure. Since the organic light-emitting material layer is very sensitive to water and oxygen, once the water vapor and oxygen form a transmission channel, it is easy to cause the display area to fail to emit light, affecting the display quality.

[0004] Therefore, it is a technical problem to be solved by those skilled in the art to provide a display panel and a display device that can effectively block the path of water vapor and oxygen transmission through the organic light-emitting material layer to the display area and ensure the display quality. SUMMARY

[0005] Therefore, the present application provides a display panel and a display device to solve the problem that the organic light-emitting material layer of the display area of the display screen is easily invaded by water and oxygen, causing the display area to fail to emit light and affecting the display quality.

[0006] The application discloses a display panel, comprising a display area and a non-display area arranged adjacent to the display area; the display panel comprises a substrate, a drive circuit layer, the drive circuit layer comprising at least a first metal layer and a second metal layer, the second metal layer being located on a side of the first metal layer away from the substrate, a light-emitting functional layer, the light-emitting functional layer being located on a side of the drive circuit layer away from the substrate, the light-emitting functional layer comprising a plurality of light-emitting portions, a first electrode layer, the first electrode layer being located on a side of the light-emitting functional layer away from the substrate, a side of the substrate comprising a plurality of first isolation structures, the first isolation structures being located in the non-display area, at least one first isolation structure separating at least one of the light-emitting functional layer, the first electrode layer and other corresponding film layers extending to the non-display area, in a direction perpendicular to a plane in which the display panel is located, the at least one first isolation structure comprising a first portion and a second portion stacked, the first portion being located in the first metal layer, the second portion being located in the second metal layer, the first metal layer and the second metal layer being separated by an insulating layer.

[0007] Based on the same inventive concept, the application further discloses a display device comprising the display panel.

[0008] Compared with the prior art, the display panel and the display device provided by the application at least achieve the following beneficial effects:

[0009] The display panel of the present application comprises a substrate for carrying other film layers thereof, one side of the substrate comprises a drive circuit layer, the drive circuit layer at least comprises a first metal layer and a second metal layer, the second metal layer is farther away from the substrate than the first metal layer, the drive circuit layer is used for manufacturing drive devices and drive circuits, etc., the side of the drive circuit layer away from the substrate is provided with a light-emitting functional layer and a first electrode layer, the first electrode layer can be a cathode with an integral surface structure. Within the non-display area range of the display panel, one side of the substrate comprises a plurality of first isolation structures, at least one first isolation structure separates at least one of the light-emitting functional layer, the first electrode layer and other corresponding film layers extending to the non-display area. And the present application provides at least one first isolation structure comprising a first part and a second part respectively located in the two metal layers, the first isolation structure of the at least two layers of metal stack not only can make the process technology of the first part located in the first metal layer not affected by the process technology of the metal trace of the first metal layer in the display area, but also can make the process technology of the metal trace of the display area in the second part and the second part located in the second metal layer not affected each other, and by increasing the height of the first isolation structure through the double-layer stacked first part and second part, and there can be part of the insulating layer between the first part and the second part, which can effectively separate when the evaporated organic light-emitting material climbs on the first isolation structure. Compared with the side-etched isolation column made of single-layer metal in the prior art, not only can the process technology of the first part and the second part be simplified and the process difficulty be reduced, but also the first isolation structure of the present application has better separation effect, which can effectively avoid the phenomenon of light-emitting failure of the light-emitting part of the display area affected by water and oxygen, and better ensure the display quality of the display panel.

[0010] Of course, it is not necessary for any product implementing the present application to achieve all the technical effects mentioned above at the same time.

[0011] Other features of the present application and its advantages will become apparent from the following detailed description of exemplary embodiments thereof, taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0012] The accompanying drawings incorporated in and forming a part of the specification, illustrate embodiments of the present application and, together with the description, serve to explain the principles of the application.

[0013] Figure 1 is a schematic diagram of a planar structure of a display panel provided by an embodiment of the present application;

[0014] Figure 2 is Figure 1 is a schematic diagram of another cross-sectional structure in the direction of A-A' in

[0015] Figure 3 is Figure 1 is another schematic diagram of a cross-sectional structure in the direction of A-A' in

[0016] Figure 4 is Figure 1 Another cross-sectional structure schematic view of the direction of A-A' in FIG. 4;

[0017] Figure 5 is Figure 1 Another cross-sectional structure schematic view of the direction of A-A' in FIG. 4;

[0018] Figure 6 is Figure 1 Another cross-sectional structure schematic view of the direction of A-A' in FIG. 4;

[0019] Figure 7 Another plane structure schematic view of the display panel provided by the embodiment of the present application;

[0020] Figure 8 is Figure 7 A cross-sectional structure schematic view of the direction of B-B' in FIG. 5;

[0021] Figure 9 is Figure 7 Another cross-sectional structure schematic view of the direction of B-B' in FIG. 5;

[0022] Figure 10 is Figure 7 A cross-sectional structure schematic view of the direction of C-C' in FIG. 6;

[0023] Figure 11 Another plane structure schematic view of the display panel provided by the embodiment of the present application;

[0024] Figure 12 is Figure 11 An enlarged schematic view of a part of the display area in FIG. 7;

[0025] Figure 13 is Figure 12 A cross-sectional structure schematic view of the direction of D-D' in FIG. 7;

[0026] Figure 14 Another plane structure schematic view of the display panel provided by the embodiment of the present application;

[0027] Figure 15 is Figure 14 A cross-sectional structure schematic view of the direction of E-E' in FIG. 8;

[0028] Figure 16 is Figure 1 Another cross-sectional structure schematic view of the direction of A-A' in FIG. 4;

[0029] Figure 17 is Figure 1 Another cross-sectional structure schematic view of the direction of A-A' in FIG. 4;

[0030] Figure 18 is Figure 1Another cross-sectional structure schematic view in the direction of A-A';

[0031] Figure 19 is Figure 7 Another cross-sectional structure schematic view in the direction of B-B';

[0032] Figure 20 is Figure 7 Another cross-sectional structure schematic view in the direction of B-B';

[0033] Figure 21 is Figure 7 Another cross-sectional structure schematic view in the direction of B-B';

[0034] Figure 22 is Figure 7 Another cross-sectional structure schematic view in the direction of B-B';

[0035] Figure 23 is Figure 7 Another cross-sectional structure schematic view in the direction of B-B';

[0036] Figure 24 is another plane structure schematic view of the display panel provided by the embodiment of the present application;

[0037] Figure 25 is Figure 14 Another cross-sectional structure schematic view in the direction of E-E';

[0038] Figure 26 is Figure 14 Another cross-sectional structure schematic view in the direction of E-E';

[0039] Figure 27 is Figure 14 Another cross-sectional structure schematic view in the direction of E-E';

[0040] Figure 28 is Figure 14 Another cross-sectional structure schematic view in the direction of E-E';

[0041] Figure 29 is a plane structure schematic view of the display device provided by the embodiment of the present application. DETAILED DESCRIPTION

[0042] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. If a matter is not described in detail, it should be noted that the relative arrangement of the components and steps illustrated in these embodiments, numerical expressions, and numerical values are not limiting to the scope of the present application unless otherwise specifically stated.

[0043] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way limiting to the scope of the application or its applications or uses.

[0044] Techniques, methods, and apparatus known to those of ordinary skill in the relevant art can not be discussed in detail herein. However, where appropriate, such techniques, methods, and apparatus should be considered as part of the present disclosure.

[0045] In all of the examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not limiting. Thus, other examples of the exemplary embodiments can have different values.

[0046] It should be noted that like reference numerals and letters refer to like items throughout the attached drawings, and once an item is defined in one drawing, it is not necessary to discuss it further in subsequent drawings.

[0047] Reference should be made to Figure 1 and Figure 2 , Figure 1 is a schematic diagram of a planar structure of a display panel provided by an embodiment of the present disclosure, Figure 2 is Figure 1 A-A' direction of FIG. 1, the display panel 000 provided by the embodiment includes a display area AA and a non-display area NA disposed adjacent to the display area AA; the display panel 000 includes:

[0048] a substrate 10;

[0049] a drive circuit layer 20, the drive circuit layer 20 including at least a first metal layer 201 and a second metal layer 202, the second metal layer 202 being located on a side of the first metal layer 201 away from the substrate 10;

[0050] a light-emitting functional layer 30, the light-emitting functional layer 30 being located on a side of the drive circuit layer 20 away from the substrate 10, the light-emitting functional layer 30 including a plurality of light-emitting portions 300;

[0051] a first electrode layer 40, the first electrode layer 40 being located on a side of the light-emitting functional layer 30 away from the substrate 10;

[0052] a side of the substrate 10 includes a plurality of first isolation structures 501, the first isolation structures 501 being located in the non-display area NA, at least one first isolation structure 501 isolating at least one of the light-emitting functional layer 30, the first electrode layer 40, and other corresponding film layers extending to the non-display area NA;

[0053] In a direction Z perpendicular to a plane in which the display panel 000 is located, the at least one first isolation structure 501 includes a first portion 501A and a second portion 501B stacked, the first portion 501A being located in the first metal layer 201, the second portion 502 being located in the second metal layer 202, the first metal layer 201 and the second metal layer 202 being spaced apart by an insulating layer 01.

[0054] Specifically, the display panel 000 provided in the embodiment can be an organic light-emitting diode display panel, and the display panel 000 includes a substrate 10 for carrying other film layers thereof. In the embodiment, the material of the substrate 10 is not limited, and can be any one of flexible or hard materials, such as polyimide, glass, ceramic material, etc. In actual implementation, the substrate 10 can be set according to actual requirements. One side of the substrate 10 includes a drive circuit layer 20, and the drive circuit layer 20 at least includes a first metal layer 201 and a second metal layer 202. The second metal layer 202 is farther away from the substrate 10 than the first metal layer 201. The first metal layer 201 and the second metal layer 202 are spaced apart by an insulating layer 01, that is, in the process, after the first metal layer 201 is manufactured, the insulating layer 01 needs to be manufactured, and then the second metal layer 202 is manufactured above the insulating layer 01, so that the first metal layer 201 and the second metal layer 202 are separated by the insulating layer 01. It can be understood that when some structures in the first metal layer 201 and some structures in the second metal layer 202 need to be electrically connected, the electric connection can be achieved by punching the insulating layer 01. The embodiment does not repeat the description here. The drive circuit layer 20 is used to manufacture a driving device and a driving circuit, etc. For example, the drive circuit layer 20 can be used to manufacture a signal wire for driving the display panel 000 to emit light, a thin film transistor of a pixel circuit, a capacitor structure, etc. The embodiment does not repeat the description here. In actual implementation, the structure of the organic light-emitting diode display panel in the related art can be referred to for understanding. It should be noted that the drive circuit layer 20 in the embodiment at least includes the first metal layer 201 and the second metal layer 202. In actual implementation, the number and structure of the metal layers in the drive circuit layer 20 include but are not limited to this, and other metal film layers can also be included. The embodiment is only illustrative. The drive circuit layer 20 away from the substrate 10 is provided with a light-emitting functional layer 30. The light-emitting functional layer 30 can be formed by an organic light-emitting material evaporated on the display panel 000. The light-emitting functional layer 30 includes a plurality of light-emitting parts 300 corresponding to sub-pixels. The pixel circuit manufactured by the drive circuit layer 20 can drive the light-emitting parts 300 of the light-emitting functional layer 30 to emit light. Light-emitting parts 300 of different colors correspond to sub-pixels of different colors, thereby realizing the display of the display panel 000. The side of the light-emitting functional layer 30 away from the substrate 10 includes a first electrode layer 40, which can be a cathode of an integral structure. Optionally, an anode layer 60 can be arranged between the light-emitting functional layer 30 and the drive circuit layer 20. The anode layer 60 can include a plurality of anodes 600 corresponding to the light-emitting parts 300.

[0055] When the display panel 000 of the embodiment is powered on and emits light, at least one thin film transistor T in the pixel circuit provided by the driving circuit layer 20 is electrically connected with the anode 600, and an image display signal can be transmitted to the source electrode of the thin film transistor T under the control of the gate electrode of the thin film transistor T in the driving circuit layer 20, and then transmitted to the drain electrode of the thin film transistor T from the source electrode of the thin film transistor T, and then transmitted to the anode 600 of the anode layer 60 from the drain electrode of the thin film transistor T, and the image display signal transmitted to the anode 600 drives the anode 600 to generate holes; at the same time, the signal applied to the first electrode layer 40 drives the first electrode layer 40 to generate electrons, and the holes generated by the anode 600 and the electrons generated by the first electrode layer 40 are injected into the light-emitting part 300 of the light-emitting functional layer 30, and the electrons and the holes can combine with each other to form excitons, and the light-emitting part 300 corresponding to the sub-pixel emits light by the energy generated when the excitons fall from the excited state to the ground state.

[0056] Optionally, the light-emitting functional layer 30 can further include one or more of a hole injection layer, a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer, and an electron injection layer, the hole injection layer and / or the hole transport layer can be arranged between the anode 600 and the light-emitting part 300, and the electron injection layer and / or the electron transport layer can be arranged between the first electrode layer 40 and the light-emitting part 300, which are not shown in the drawings of the embodiment and can be understood with reference to the structure of an organic light-emitting diode display panel in the related art. Further optionally, the light-emitting part 300 of the light-emitting functional layer 30 in the embodiment can be a red light-emitting part, a green light-emitting part, or a blue light-emitting part, and can also be a single white light-emitting part, which is not limited in the embodiment.

[0057] It should be noted that the light-emitting part 300 in the display panel 000 is taken as an example of a top-emitting light-emitting structure in the embodiment, and the display panel 000 in the embodiment can also be a bottom-emitting light-emitting structure in specific implementation, which is not described herein again.

[0058] It can be understood that the display panel 000 in the embodiment can also include other film layer structures, such as an encapsulation structure arranged on the side of the first electrode layer 40 away from the substrate 10, for example, a thin film encapsulation layer (not shown in the drawings), which can cover the light-emitting part 300 to prevent water and oxygen from eroding the light-emitting part 300, and the specific structure of the thin film encapsulation layer is not described herein again.

[0059] The display panel 000 of the embodiment includes a display area AA and a non-display area NA disposed adjacent to the display area AA, and a plurality of light emitting portions 300 of the light emitting functional layer 30 can be located in the display area AA. The non-display area NA can be a frame area of the display panel 000, or in other optional embodiments, the non-display area NA can also be a non-display area surrounded by the display area AA for placing functional devices such as cameras, and the present embodiment is only exemplarily illustrated by taking the non-display area NA as the frame area of the display panel 000. In the present embodiment, within the range of the non-display area NA of the display panel 000, one side of the substrate 10 includes a plurality of first isolation structures 501, and at least one first isolation structure 501 separates at least one of the light emitting functional layer 30, the first electrode layer 40, and other corresponding film layers extending to the non-display area NA. Optionally, at least one first isolation structure 501 can be disposed around the display area AA to form a closed structure. It should be noted that the present embodiment does not specifically limit the number of first isolation structures 501 in the non-display area NA, and can include a plurality of first isolation structures 501 arranged side by side to gradually block the invasion of water and oxygen into the display area AA. When the thin film encapsulation layer of the display panel 000 cannot completely cover the light emitting functional layer 30 of the evaporated organic light emitting material, the plurality of first isolation structures 501 disposed in the non-display area NA can separate at least one of the light emitting functional layer 30, the first electrode layer 40, or other corresponding film layers extending to the non-display area NA, block the invasion of water and oxygen after cutting the panel edge, and thus facilitate avoiding the problem of encapsulation failure. The plurality of first isolation structures 501 can block the transmission channel of water vapor and oxygen invading the display area AA, avoid the light emitting portion 300 of the display area AA from being affected by water and oxygen to cause light emitting failure, and facilitate ensuring the display quality.

[0060] In order to simplify the process in the prior art, a single-layer metal is generally used to make an isolation column structure, and a side etching process is used to form a morphology similar to the side wall recess of the isolation column to separate the organic light emitting material evaporated at the position of the isolation column structure, so as to avoid the invasion of water vapor and oxygen into the light emitting functional layer of the organic light emitting material structure in the display area. However, in the prior art, the metal layer for making the isolation column structure is used not only for making the signal lines of the driving circuit in the display panel, but also for separating the evaporated material through the side etching process. The two have different requirements for the process, that is, the side etching value formed by the side etching process is affected by the normal wiring process requirements of the signal lines of the metal layer in the display area, so that the side etching value of the isolation column cannot be adjusted too much, and thus if the side etching of the isolation column is insufficient, the isolation effect of the isolation column will be poor, and the channel for the invasion of water vapor and oxygen cannot be effectively separated.

[0061] To solve the above problems, the embodiment is provided in the direction Z perpendicular to the plane where the display panel 000 is located, at least one first isolation structure 501 includes a first part 501A and a second part 501B stacked, the first part 501A is located in the first metal layer 201, and the second part 502 is located in the second metal layer 202, that is, at least one first isolation structure 501 in the plurality of first isolation structures 501 provided in the non-display area NA of the embodiment includes the first part 501A and the second part 501B located in the two metal layers respectively, and the first isolation structure 501 of at least two layers of metal stacking, not only can make the process technology of the first part 501A located in the first metal layer 201 not affected by the process technology of the metal trace of the first metal layer 201 in the display area AA, but also can make the process technology of the second part 501B and the metal trace of the display area AA not affected each other, and by the double-layer stacked first part 501A and the second part 501B, the height of the first isolation structure 501 is increased, and the first part 501A and the second part 501B can also be separated by part of the insulating layer 01, which can effectively cut off when the evaporated organic light-emitting material climbs on the first isolation structure 501. Compared with the side-etched isolation column made of single-layer metal in the prior art, not only can the process technology of the first part 501A and the second part 501B be simplified, and the process difficulty be reduced, but also the first isolation structure 501 of the embodiment has better cutting effect, which can effectively avoid the phenomenon that the light-emitting part 300 of the display area AA is affected by water and oxygen to cause light-emitting failure, and better ensure the display quality of the display panel 000.

[0062] Optionally, the area of the second part 501B of the first isolation structure 501 in the embodiment can be smaller than the area of the first part 501A, that is, the orthographic projection of the second part 501B on the plane where the display panel 000 is located is located in the orthographic projection range of the first part 501A on the plane where the display panel 000 is located, so that the first part 501A, the second part 501B, and the part of the insulating layer 01 between the first part 501A and the second part 501B form a tapered structure of the first isolation structure 501, and the insulating layer 01 is etched at the position of the first isolation structure 501 to form a plurality of independent structures corresponding to the first part 501A and the second part 501B, as shown in Figure 1 and Figure 3 , Figure 3 is Figure 1Another cross-sectional structure schematic view of the direction from A to A', after the first part 501A of the first metal layer 201 and the structure of the display area AA located in the first metal layer 201 are made, the insulating layer 01 can be made, and the independent insulating part structure 01A corresponding to the independent first part 501A is formed through the processes of exposure, development and etching, and then the second part 501B of the second metal layer 202 and the structure of the display area AA located in the second metal layer 202 are made. The first isolation structure 501 stacked by the first part 501A, the independent insulating part structure 01A and the second part 501B is equivalent to raising the first isolation structure 501, and the side etching process is not needed, so that the tapered structure of the first isolation structure 501 can more effectively cut off the effect of the light-emitting functional layer 30 when the light-emitting functional layer 30 climbs on the first isolation structure 501 in the non-display area NA, and then the tapered structure of the first isolation structure 501 can block the water and oxygen from invading into the light-emitting functional layer 30 in the display area AA when the panel edge is cut, which is beneficial to further ensure the display quality.

[0063] It can be understood that the structure of the display panel 000 in the non-display area NA in the embodiment includes but is not limited to Figure 2 The first isolation structure 501 shown in the figure can also include other structures, and the embodiment only clearly shows the first isolation structure 501, and other structures are omitted. Figure 2 It should be noted that the structure of the display panel 000 in the figure of the embodiment is only an example, and in specific implementation, the structure of the display panel 000 includes but is not limited to this, and other structures capable of realizing the display function can also be included, and the embodiment will not be repeated here, and the structure of the organic light-emitting diode display panel in the related art can be referred to for understanding.

[0064] Optionally, the first part 501A of the first isolation structure 501 in the embodiment Figure 1 and Figure 2 is only taken as an example for description, that is, the first part 501A of the first isolation structure 501 is located in the first metal layer 201, the first metal layer 201 is a metal layer for making one pole of the capacitor in the driving circuit layer 20, and the second part 501B is located in the second metal layer 202, and the second metal layer 202 is a metal layer for making the source electrode and the drain electrode of the thin film transistor T in the driving circuit layer 20, in some other optional embodiments, the first metal layer 201 and the second metal layer 202 can also be metal layers in other driving circuit layers 20, such as Figure 4 shown in the figure, Figure 4 is Figure 1Another cross-sectional structure schematic view of the A-A' direction, the first part 501A of the first isolation structure 501 is located in the first metal layer 201, the first metal layer 201 is a metal layer in the driving circuit layer 20 for manufacturing the source electrode and the drain electrode of the thin film transistor T, the second part 501B is located in the second metal layer 202, the second metal layer 202 is another metal layer in the driving circuit layer 20 for manufacturing the source electrode and the drain electrode of the thin film transistor T, which will not be described in detail in this embodiment, and can be understood by referring to the film layer structure of the driving circuit layer of the organic light emitting diode display panel in the related art. The first isolation structure 501 can also include a structure of a larger number of metal layer stacks, which will not be described in detail in this embodiment.

[0065] In some optional embodiments, please refer to Figure 1 and Figure 5 , Figure 5 is Figure 1 Another cross-sectional structure schematic view of the A-A' direction, in this embodiment, the insulating layer 01 includes a plurality of hollow parts 01K, the orthogonal projection of the hollow part 01K on the plane of the display panel 000 is located within the orthogonal projection of the first part 501A on the plane of the display panel 000, and at least part of the second part 501B is filled in the hollow part 01K and directly contacts the first part 501A.

[0066] This embodiment explains that in the first isolation structure 501 provided by the display panel 000 in the non-display area NA, although the first part 501A located in the first metal layer 201 and the second part 501B located in the second metal layer 202 are separated by the insulating layer 01, the upper second part 501B can be electrically connected with the lower first part 501A, specifically, the insulating layer 01 between the first metal layer 201 and the second metal layer 202 is provided with a hollow part 01K at the position of the first isolation structure 501, the orthogonal projection of the hollow part 01K on the plane of the display panel 000 is located within the orthogonal projection of the first part 501A on the plane of the display panel 000, and at least part of the second part 501B is filled in the hollow part 01K of the insulating layer 01 to realize the direct contact and lap joint between the first part 501A and the second part 501B, the first part 501A located in the first metal layer 201 can be grounded during the use of the display panel 000, and the second part 501B located in the second metal layer 202 is electrically connected with the lower first part 501A, which is equivalent to that the second part 501B is also grounded, so that the static electricity in each film layer of the display panel 000 or the static electricity entering during cutting the edge of the panel can be promptly led away, thereby realizing the static electricity protection effect of the display panel 000 and being beneficial to ensuring the display quality.

[0067] It can be understood that the first part 501A of the first metal layer 201 can be connected to a ground signal by continuing to be overlapped with other metal layers in the driving circuit layer 20 closer to the substrate 10, such as Figure 6 Figure 6 Figure 1 is another cross-sectional structure diagram in the direction of A-A' in FIG. 11. When the first metal layer 201 is not the metal film layer in the driving circuit layer 20 closest to the substrate 10, a ground trace LJ can be arranged in the metal film layer closest to the substrate 10, and the first part 501A is supplied with a ground signal through the ground trace LJ to achieve the function of leading static electricity away. The ground trace LJ arranged in the metal film layer closest to the substrate 10 can also be used as a part of the first isolation structure 501 to further stack the first part 501A and the second part 501B to achieve a better isolation effect. The structure of the first part 501A for the ground signal is not specifically limited in the embodiment.

[0068] In some optional embodiments, please refer to Figure 7 and Figure 8 Figure 7 is another planar structure diagram of the display panel provided by the embodiment of the present application, Figure 8 Figure 7 is a cross-sectional structure diagram in the direction of B-B' in FIG. 12. In the embodiment, the display area AA includes a plurality of first data lines S1 extending along the first direction Y.

[0069] The non-display area NA includes a binding area BA, and the binding area BA is located on one side of the display area AA.

[0070] The binding area BA includes a plurality of conductive pads 70, and the conductive pads 70 are electrically connected with fan-out traces 80, and the fan-out traces 80 are located in the non-display area NA.

[0071] The first data line S1 is connected with the fan-out trace 80 through at least one first connection line L1, and the first connection line L1 is located in the display area AA.

[0072] The first connection line L1 is located in the second metal layer 202.

[0073] The embodiment explains that the non-display area NA of the display panel 000 further includes the binding area BA, and the binding area BA can be used to arrange a plurality of conductive pads 70. The conductive pads 70 can be used for subsequent binding electrical connection with a driving chip or a flexible circuit board to achieve the driving chip or the flexible circuit board providing a driving signal for display of the display panel 000. Specifically, the binding area BA includes a plurality of conductive pads 70, such as Figure 7 ​​​​As shown, along the first direction Y, the binding area BA is located at one side of the display area AA, and a fan-out area FA is included between the binding area BA and the display area AA, which can be used to set the fan-out wires 80 electrically connecting the signal wires of the display area AA and the conductive pads 70 of the binding area BA. In the display panel 000 of the embodiment, along the second direction X (the second direction X is perpendicular to the first direction Y), the display area AA includes a first display area AA1 and second display areas AA2 located at opposite sides of the first display area AA1, and the second display areas AA2 can be understood as the display areas close to the edges of the display panel 000 on the second direction X, and the first display area AA1 can be understood as the area of the display area AA closer to the center position on the second direction X. A plurality of first data lines S1 extending along the first direction Y in the display panel 000 are arranged in the second display areas AA2, and the first data lines S1 are connected to the fan-out wires 80 of the fan-out area FA through at least one first connecting line L1, and each fan-out wire 80 is further connected to at least part of the conductive pads 70 of the binding area BA, so as to realize signal transmission between the first data lines S1 and the conductive pads 70. In the embodiment, the first connecting line L1 is arranged in the display area AA, and the fan-out wire 80 is arranged in the fan-out area FA. Arranging the first connecting line L1 in the range of the display area AA can avoid occupying the space of the fan-out area FA, for example, Figure 7 As shown, the first connecting line L1 can gradually extend towards the first display area AA1 within the range of the display area AA, and then after being connected to the fan-out wire 80 of the fan-out area FA, the fan-out wire 80 can be as far away from the second display area AA2 on the second direction X as possible, which is beneficial to reducing the width of the fan-out area FA on the second direction X, and further reducing the lower frame of the display panel 000.

[0074] It can be understood that the design structure of the embodiment, in which the first connecting line L1 electrically connecting the first data line S1 of the display area AA and the conductive pad 70 of the binding area BA is arranged in the display area AA, can meet the requirement of high resolution of the display panel 000. Even if the number of the first data line S1 is larger, the first connecting line L1 does not need to occupy the space of the fan-out area FA, so the width of the fan-out area FA on the second direction X can still be further compressed, which can meet the requirement of high resolution while ensuring the display performance and realizing a narrower frame.

[0075] The first connection line L1 located in the display area AA is located in the second metal layer 202. The second metal layer 202 in which the first connection line L1 is located can be a metal layer in the drive circuit layer 20 except for the metal layer in which the gate, source / drain electrode and capacitor of the thin film transistor T are located, that is, the second metal layer 202 can be a metal film layer on the side away from the substrate 10 of the metal layer in which the source / drain electrode of the thin film transistor T is located. Alternatively, at this time, the first data line S1 can be located in the first metal layer 201, so as to avoid the influence of the setting of the first connection line L1 on the structure itself included in the thin film transistor T, the capacitor, the signal wire and the like included in the drive circuit layer 20 of the display panel 000. Alternatively, when the display panel 000 is an organic light-emitting diode display panel, the film layer in which the first connection line L1 is located can be additionally arranged between the film layer in which the anode 600 is located and the film layer in which the source / drain electrode of the thin film transistor T is located, or can also be arranged in other conductive film layers below the anode 600. The present embodiment does not limit this, and the specific implementation can be designed according to actual needs. At this time, since the second metal layer 201 is located between the film layer in which the anode 600 is located and the film layer in which the source / drain electrode of the thin film transistor T is located, it is relatively close to the light-emitting functional layer 30, and therefore the second part 501B of the first isolation structure 501 is located in the second metal layer 202, so as to make the top of the first isolation structure 501, that is, the second part 501B closer to the light-emitting functional layer 30, and more effectively cut off the organic light-emitting material when climbing on the first isolation structure 501 during evaporation, so as to avoid the light-emitting part 300 of the display area AA from being affected by water and oxygen and losing light-emitting function, and ensure the display quality of the display panel 000.

[0076] It can be understood that the present embodiment does not repeat the specific structure of the first connection line L1, and the structure of the fan-out line arranged in the display area in the related art can be referred to for understanding. It is only required that the film layer in which the second part 501B is located is the same layer as the first connection line L1.

[0077] Alternatively, as shown in Figure 7 and Figure 9 , Figure 9 is Figure 7 another cross-sectional structure diagram in the B-B' direction, the second part 501B of the first isolation structure 501 is made of the film layer in which the first connection line L1 of the display panel 000 itself is located. At this time, the second metal layer 202 does not need to be made into other conductive structures except for the first connection line L1, and therefore the second part 501B located in the second metal layer 202 can adopt a side etching process to form a structure in which the side part area of the second part 501B is recessed. The second part 501B and the first part 501A are further stacked to form the first isolation structure 501, which can further effectively block the climbing of the light-emitting functional layer 50, and further effectively prevent water and oxygen from invading the display area AA and affecting the display effect.

[0078] Optionally, in the embodiment, the second part 501B located at the second metal layer 202 adopts the side etching process to form the structure of the side surface part area of the second part 501B being recessed, the side etching process and the process of forming the first connection line L1 can be independent of each other, the first connection line L1 only needs to realize the electrical connection between the first data line S1 and the conductive pad 70, and the process can not be broken, and then the side etching value of the second part 501B formed by the side etching process can be as little as possible to be affected by the process requirement when the first connection line L1 is routed in the display area AA, that is, the side etching value of the second part 501B can be adjusted, so that the recess degree of the side surface part area of the second part 501B can be as sufficient as possible, the blocking effect of the first isolation structure 501 is improved, and the channel for the invasion of water vapor and oxygen is effectively blocked.

[0079] In some optional embodiments, please refer to Figure 7 and Figure 10 , Figure 10 is Figure 7 the cross-sectional structure diagram of C-C' direction (it can be understood that, in order to clearly show the structure of the embodiment, Figure 7 the second isolation structure is not shown in the embodiment), in the embodiment, the second metal layer 202 and the light emitting functional layer 30 include the anode layer 60, the anode layer 60 includes a plurality of anodes 600, and at least one anode 600 corresponds to one light emitting part 300;

[0080] The second metal layer 202 includes a plurality of second isolation structures 502, and the second isolation structure 502 is located in the display area AA.

[0081] The second isolation structure 502 is located between the adjacent two anodes 600, the second isolation structure 502 forms a plurality of openings 502K, at least part of the light emitting part 300 and the anode 600 are located in the opening 502K, the light emitting part 300 covers the anode 600, and the anode 600 and the second isolation structure 502 are insulated through the light emitting part 300.

[0082] The second metal layer 202 and the light-emitting functional layer 30 include the anode layer 60, the anode layer 60 includes a plurality of anodes 600, at least one anode 600 corresponds to one light-emitting part 300, in the process of the display panel 000, the anode 600 of the anode layer 60 can be made between the two adjacent second isolation structures 502 after the structure of the second metal layer 202 such as the second isolation structure 502 is made, and then the light-emitting functional layer 30 is evaporated by the evaporation process to form the mutually independent light-emitting part 300 between the two adjacent second isolation structures 502. The second isolation structure 502 between the two adjacent anodes 600 in the embodiment includes the opening 502K, the opening 502K can be formed by the side etching process consistent with the process of the second part 501B, the side etching process makes the side surface part of the second isolation structure 502 recessed to form the opening 502K, and then the anode 600 made subsequently is located between the two adjacent second isolation structures 502 to correspond to one sub-pixel. At least part of the light-emitting part 300 and the anode 600 are located in the opening 502K, the light-emitting part 300 covers the anode 600, and the light-emitting part 300 plays a role of insulating the anode 600 from the second isolation structure 502. The second isolation structure 502 of the embodiment includes the structure of the opening 502K, which can effectively cut off the different light-emitting parts 300 corresponding to different sub-pixels, so that the evaporated organic light-emitting material is cut off at the position of the second isolation structure 502, and the mutual crosstalk between the light-emitting parts 300 of different colors is avoided.

[0083] In the embodiment, the process of the display panel 000 can be that after the thin film transistor T structure of the driving circuit layer 20 is made, the second metal layer 202 is made, the second part 501B and the second isolation structure 502 are formed by the photoetching and side etching process, then the anode 600 of the anode layer 60 is made between the two adjacent second isolation structures 502, and the light-emitting functional layer 30 is evaporated by the evaporation process, the different light-emitting parts 300 of different colors in the display area AA are cut off by the second isolation structure 502, the light-emitting functional layer 30 of the non-display area NA is cut off by the first isolation structure 501, the mutual crosstalk between the light-emitting parts 300 of different colors in the display area AA is avoided, and the water and oxygen intrusion from the non-display area NA to the display area AA is also blocked, thereby improving the display quality of the display panel 000. In the embodiment, the structure of the pixel definition layer PDL can also be further replaced by the second isolation structure 502 Figure 2 In the embodiment, the structure of the pixel definition layer PDL can also be further replaced by the second isolation structure 502

[0084] In some optional embodiments, please refer to Figure 11 , Figure 12 , Figure 13 , Figure 11is another planar structure schematic view of the display panel provided by the embodiment of the present application, Figure 12 is Figure 11 is an enlarged schematic view of a partial area of the display area in the display panel 000, Figure 13 is Figure 12 is a cross-sectional structure schematic view in the direction of D-D' in the display panel 000, in the embodiment, the first connection line L1 is at least partially non-overlapping with the orthogonal projection of the light emitting part 300 on the plane of the display panel 000, and the partial segment of the first connection line L1 is multiplexed as the second isolation structure 502.

[0085] The embodiment explains that when the first connection line L1 located in the display area AA is made of the second metal layer 202, and after the first connection line L1 gradually extends in the display area AA to the direction close to the first display area AA1 and then is connected to the fan-out wire 80 of the fan-out area FA, the width of the fan-out area FA in the second direction X can be reduced, and then the lower frame of the display panel 000 can be reduced, the first connection line L1 located in the display area AA can be arranged to surround the light emitting part 300, that is, the orthogonal projection of the first connection line L1 on the plane of the display panel 000 is at least partially non-overlapping with the orthogonal projection of the light emitting part 300 on the plane of the display panel 000, the first connection line L1 which is non-overlapping with the light emitting part 300 can be arranged to surround the light emitting part 300, at this time, the position of the display panel 000 with the first connection line L1, the partial segment of the first connection line L1 can be multiplexed as the second isolation structure 502, and the second isolation structure 502 at the remaining position is still Figure 11 The structure shown in the figure is beneficial to reducing the structure of the second metal layer 202 in the display area AA, without making both the first connection line L1 and the second isolation structure 502 in the second metal layer 202, the area with the first connection line L1 is directly used as the second isolation structure 502, providing more space layout for the second metal layer 202, avoiding that the structure of the second metal layer 202 affects the light emitting quality of the light emitting part 300. And the partial segment of the first connection line L1 is multiplexed as the second isolation structure 502, which can also reduce the process technology of the second metal layer 202, and improve the process efficiency of the whole display panel 000.

[0086] It can be understood that the figure of the embodiment is only an example for illustrating the setting structure of the first connection line L1 outside the light emitting part 300 by taking the array arrangement of the light emitting part 300 as an example, in specific implementation, the arrangement of the light emitting part 300 can also be non-array arrangement, so as to improve the display effect by the non-array arrangement of the sub-pixel structure, which will not be described herein, and can be understood by referring to the arrangement mode of the sub-pixel in the related technology.

[0087] It can be understood that, in order to clearly illustrate the structure of the embodiment, Figure 12The first connection line L1 and the first data line S1 are not shown to be electrically connected, and in actual implementation, the first connection line L1 and the first data line S1 in different layers can be electrically connected through a via hole, that is, the first connection line L1 of the second isolation structure 502 and the corresponding first data line S1 can be electrically connected through at least one via hole, which is not described herein again.

[0088] Optionally, please continue to refer to Figures 11-13 In the embodiment, in the direction Z perpendicular to the plane where the display surface 000 is located, the second isolation structure 502 includes the first sub-line 502A, the second sub-line 502B, and the third sub-line 502C which are stacked, and the second sub-line 502B is located between the first sub-line 502A and the third sub-line 502C.

[0089] The width of the second sub-line 502B is smaller than the width of the first sub-line 502A, and the width of the second sub-line 502B is smaller than the width of the third sub-line 502C.

[0090] The embodiment explains that the second metal layer 202 located in the display area AA includes the second isolation structure 502, and when the first connection line L1 in the display area AA is made of the second metal layer 202 to reduce the lower frame of the display panel 000 through the first connection line L1 arranged in the display area AA, at least part of the segment of the first connection line L1 is reused as the second isolation structure 502 of the display area AA, at this time, the second isolation structure 502 (including the first connection line L1 reused as the second isolation structure 502) in the display area AA can be set as a structure with a partially recessed side surface, specifically, in the direction Z perpendicular to the plane where the display surface 000 is located, the second isolation structure 502 includes the first sub-line 502A, the second sub-line 502B, and the third sub-line 502C which are stacked, the second sub-line 502B is located between the first sub-line 502A and the third sub-line 502C, the width of the second sub-line 502B is smaller than the width of the first sub-line 502A, the width of the second sub-line 502B is smaller than the width of the third sub-line 502C, and the orthogonal projection of the second sub-line 502B on the plane where the display panel 000 is located is located within the orthogonal projection range of the first sub-line 502A on the plane where the display panel 000 is located, and the orthogonal projection of the second sub-line 502B on the plane where the display panel 000 is located is located within the orthogonal projection range of the third sub-line 502C on the plane where the display panel 000 is located, so as to form a structure with a partially recessed side surface of the second isolation structure 502, and through the structure with a partially recessed side surface of the second isolation structure 502, the organic light-emitting material corresponding to each sub-pixel (i.e., the light-emitting part 300) can be more effectively separated by the second isolation structure 502 with a side recessed shape, so as to avoid local color mixing and improve display quality.

[0091] Optionally, the second part 501B of the first isolation structure 501 in the embodiment is made of the second metal layer 202, so that the second part 501B of the first isolation structure 501 located in the non-display area NA can be made by the same process as the second isolation structure 502 in the display area AA (not shown in the figure), and the second part 501B is also formed as a structure with a side part area recessed by a side etching process, so that the second part 501B etched on the side and the first part 501A are further stacked to form the first isolation structure 501, which can further effectively block the climbing of the light-emitting functional layer 50, and further effectively prevent water and oxygen from invading the display area AA to affect the display effect.

[0092] In some optional embodiments, please continue to refer to Figure 7 and Figure 9 In the embodiment, in the direction Z perpendicular to the plane where the display panel 000 is located, the second part 501B includes a first sub-part 501B1, a second sub-part 501B2, and a third sub-part 501B3 stacked.

[0093] The orthographic projection of the first sub-part 501B1 on the plane where the display panel 000 is located covers the orthographic projection of the second sub-part 501B2 on the plane where the display panel 000 is located, and the orthographic projection of the third sub-part 501B3 on the plane where the display panel 000 is located covers the orthographic projection of the second sub-part 501B2 on the plane where the display panel 000 is located.

[0094] The area of the orthographic projection of the second sub-part 501B2 on the plane where the display panel 000 is located is smaller than the area of the orthographic projection of the first sub-part 501B1 on the plane where the display panel 000 is located, and the area of the orthographic projection of the second sub-part 501B2 on the plane where the display panel 000 is located is smaller than the area of the orthographic projection of the third sub-part 501B3 on the plane where the display panel 000 is located.

[0095] The embodiment explains that in the structure of the first isolation structure 501 located in the non-display area NA, the second part 501B located in the second metal layer 202 can be a structure stacked by multiple sub-parts, specifically, in the direction Z perpendicular to the plane where the display panel 000 is located, the second part 501B includes a first sub-part 501B1, a second sub-part 501B2, and a third sub-part 501B3 stacked, and the area of the second sub-part 501B2 located in the middle is smaller than the first sub-part 501B1 below and the third sub-part 501B3 above, so that the side of the second part 501B of the first isolation structure 501 is formed as a structure etched on the side through a relatively narrow second sub-part 501B2, and the second part 501B etched on the side and the first part 501A are further stacked to form the first isolation structure 501, which can further effectively block the climbing of the light-emitting functional layer 50, and further effectively prevent water and oxygen from invading the display area AA to affect the display effect.

[0096] Optionally, as shown in FIG. 2, the driving circuit layer 20 includes a plurality of metal layers; wherein, in the direction perpendicular to the plane where the display panel 000 is located, the distance from the second metal layer 202 to the light-emitting functional layer 30 is less than the distance from other metal layers of the driving circuit layer 20 to the light-emitting functional layer 30. Figure 7 Figure 9 Optionally, as shown in FIG. 2, the driving circuit layer 20 includes a plurality of metal layers; wherein, in the direction perpendicular to the plane where the display panel 000 is located, the distance from the second metal layer 202 to the light-emitting functional layer 30 is less than the distance from other metal layers of the driving circuit layer 20 to the light-emitting functional layer 30.

[0097] The embodiment explains that the second metal layer 202 used to make the second part 501B of the first isolation structure 501 can be the metal layer closest to the light-emitting functional layer 30 in the driving circuit layer 20, that is, although the driving circuit layer 20 includes a plurality of metal layers, in the direction perpendicular to the plane where the display panel 000 is located, the distance from the second metal layer 202 used to make the second part 501B to the light-emitting functional layer 30 is less than the distance from other metal layers of the driving circuit layer 20 to the light-emitting functional layer 30, and the second metal layer 202 is closer to the light-emitting functional layer 30 than other metal layers in the driving circuit layer 20, so that the second part 501B of the first isolation structure 501 is located at the second metal layer 202, and the second part 501B forms a side etching structure through the narrower second sub-part 501B2, so that when the top part of the first isolation structure 501, that is, the second part 501B, is closest to the light-emitting functional layer 30, the first isolation structure 501 can more effectively cut off the organic light-emitting material deposited on the first isolation structure 501 when the organic light-emitting material climbs up the first isolation structure 501, so as to avoid the light-emitting part 300 of the display area AA from being affected by water and oxygen and causing light-emitting failure, and ensure the display quality of the display panel 000.

[0098] Optionally, the second metal layer 202 in the embodiment can be made of a plurality of metal materials, that is, when the second metal layer 202 is made, the material used to make the second sub-part 501B2 can be different from the material used to make the first sub-part 501B1, and the material used to make the first sub-part 501B1 is the same as the material used to make the third sub-part 501B3. For example, the material used to make the second sub-part 501B2 includes aluminum metal material, the material used to make the first sub-part 501B1 and the third sub-part 501B3 includes titanium metal material, and the second metal layer 202 adopts a film layer structure stacked by titanium, aluminum and titanium three metal materials, which not only can reduce the impedance of the first connection line L1 made of the second metal layer 202 and be beneficial to signal transmission, but also can reduce the process difficulty of forming the first sub-part 501B1, the second sub-part 501B2 and the third sub-part 501B3, and make the second part 501B of the first isolation structure 501 and the structure of the second part 501B recessed in the side surface part region without using the side etching process. After the first sub-part 501B1 made of wider metal titanium material is made, the second sub-part 501B2 made of narrower metal aluminum material is made, and finally the third sub-part 501B3 made of wider metal titanium material is completed, which can effectively block the path of water and oxygen invading the display area AA and improve the process efficiency of the second part 501B.​

[0099] In some optional embodiments, please refer to Figure 14 and Figure 15 , Figure 14 is another schematic diagram of a planar structure of a display panel provided by the embodiments of the present application, Figure 15 is Figure 14 is a schematic diagram of a cross-sectional structure in the direction of E-E' in FIG. 5, in the present embodiment, the plurality of first isolation structures 501 include a first sub-isolation structure 5011 and a second sub-isolation structure 5012, and the first sub-isolation structure 5011 is located on the side of the second sub-isolation structure 5012 close to the display area AA in the direction from the display area AA to the non-display area NA.

[0100] The second sub-part 501B2 of the first sub-isolation structure 5011 has a smaller area in the orthogonal projection on the plane of the display panel 000 than the second sub-part 501B2 of the second sub-isolation structure 5012.

[0101] The present embodiment explains that a plurality of first isolation structures 501 can be arranged side by side in the non-display area NA to improve the effect of blocking water and oxygen from invading the display area AA, and the plurality of first isolation structures 501 in the present embodiment include at least a first sub-isolation structure 5011 and a second sub-isolation structure 5012, and the first sub-isolation structure 5011 is closer to the display area AA than the second sub-isolation structure 5012 in the direction from the display area AA to the non-display area NA, the second sub-part 501B2 of the first sub-isolation structure 5011 has a smaller area in the orthogonal projection on the plane of the display panel 000 than the second sub-part 501B2 of the second sub-isolation structure 5012, the side of the second part 501B close to the display area AA is deeper, that is, the area of the second sub-part 501B2 is smaller, and further optionally, the first sub-part 501B1 of the first sub-isolation structure 5011 can have the same area in the orthogonal projection on the plane of the display panel 000 as the first sub-part 501B1 of the second sub-isolation structure 5012, and the third sub-part 501B3 of the first sub-isolation structure 5011 can have the same area in the orthogonal projection on the plane of the display panel 000 as the third sub-part 501B3 of the second sub-isolation structure 5012, the deeper the recess degree of the side part area of the second part 501B, the better the blocking effect, and thus the display quality and production yield can be further improved.

[0102] In some optional embodiments, please refer to Figure 1 and Figure 16 , Figure 16 is Figure 1Another cross-sectional structure schematic view of the direction of A-A', in this embodiment, the driving circuit layer 20 further includes at least a third metal layer 203, the third metal layer 203 is located on the side of the second metal layer 202 away from the substrate 10; the driving circuit layer 20 includes a plurality of driving transistors DT and a capacitor C, the gate of the driving transistor DT DTG is located on the first metal layer 201, one pole of the capacitor C is located on the second metal layer 202, the source DTS and the drain DTD of the driving transistor DT are located on the third metal layer 203;

[0103] In the direction Z perpendicular to the plane where the display panel 000 is located, the first isolation structure 501 further includes a third part 501C located on the side of the second part 501B away from the first part 501A;

[0104] The third part 501C is located on the third metal layer 203;

[0105] The first part 501A covers the second part 501B in the orthographic projection of the plane where the display panel 000 is located, and the third part 501C covers the second part 501B in the orthographic projection of the plane where the display panel 000 is located;

[0106] The second part 501B covers the third part 501C in the orthographic projection of the plane where the display panel 000 is located.

[0107] The embodiment explains that the driving circuit layer 20 of the display panel 000 can include multiple metal layers. For example, when the driving circuit layer 20 is made of multiple metal layers to manufacture the driving transistor DT and the capacitor C of the pixel circuit, the gate electrode DTG of the driving transistor DT is located on the first metal layer 201, which can be understood as the gate metal layer M1, one pole of the capacitor C is located on the second metal layer 202, which can be understood as the capacitor metal layer Mc, the source electrode DTS and the drain electrode DTD of the driving transistor DT are located on the third metal layer 203, which can be understood as the source-drain metal layer M2, and the first isolation structure 501 arranged in the non-display area NA can further include a third part 501C. In the direction Z perpendicular to the plane on which the display panel 000 is located, the third part 501C of the first isolation structure 501 is located on the side away from the first part 501A of the first isolation structure 501 of the second part 501B of the first isolation structure 501. That is, the first isolation structure 501 is designed as a three-layer metal stack of the first metal layer 201, the second metal layer 202, and the third metal layer 203 (the gate metal layer M1, the capacitor metal layer Mc, and the source-drain metal layer M2). The first isolation structure 501 formed by the multi-layer metal stack, and then the side surface part area of the first isolation structure 501 can not use the side etching process, directly make the third part 501C of the upper layer and the first part 501A of the lower layer wide, and the second part 501B of the middle layer narrow, and then avoid the side etching process, without using the side etching method to etch a certain sub-layer in a single metal layer, which can reduce the process difficulty, save time and effort, directly utilize the width difference of different metal layers, and effectively block the evaporation material.

[0108] It can be understood that, since the organic light-emitting material is very thin, in nanoscale, when evaporating the display panel 000, if a single layer of metal, such as the second part 501B of the second metal layer 202, is formed by side etching to form a side part area recess, the side etching depth is only a few tenths of a micron, and the isolation effect is difficult to effectively guarantee, and if the side etching depth is too deep, the side surface of the second part 501B is easily sunken, affecting the process precision of the second part 501B. In the embodiment, the first metal layer 201, the second metal layer 202, and the third metal layer 203 (the gate metal layer M1, the capacitor metal layer Mc, and the source-drain metal layer M2) are stacked to form the first isolation structure 501 including the first part 501A, the second part 501B, and the third part 501C, and the overall thickness is in microns, and the thickness difference is relatively large, and the evaporation of the organic light-emitting material is more difficult to climb. For example, the third part 501C located in the third metal layer 203 is made wide, and the boundary of the second part 501B of the second metal layer 202 is several microns, that is, the second part 501B is narrower than the third part 501C by a few microns in the side etching process, and the isolation effect is necessarily better, and the water and oxygen invasion can be further blocked, and the display quality can be better improved while reducing the process difficulty.

[0109] Optionally, as shown in Figure 1 and Figure 16 In the embodiment, the first metal layer 201 and the second metal layer 202 can be provided with a first insulating layer 011, and the second metal layer 202 and the third metal layer 203 can be provided with a second insulating layer 012, so that the first part 501A and the second part 501B can be insulated by the structure of the first insulating layer 011, and the second part 501B and the third part 501C can be insulated by the structure of the second insulating layer 012, which is equivalent to raising the first isolation structure 501, and has a better isolation effect.

[0110] Optionally, as shown in Figure 1 and Figure 17 Figure 17 is Figure 1 ​Another cross-sectional structure schematic view of A-A' direction, the first insulating layer 011 can be arranged between the first metal layer 201 and the second metal layer 202, the second insulating layer 012 can be arranged between the second metal layer 202 and the third metal layer 203, but at the position of the first isolation structure 501, the third part 501C, the second part 501B and the first part 501A can be in contact and lapping conduction by opening the hollow part on the first insulating layer 011 and the second insulating layer 012, the first part 501A located in the first metal layer 201 can be grounded in the use process of the display panel 000, the second part 501B located in the second metal layer 202 is electrically connected with the first part 501A of the lower layer, which is equivalent to that the second part 501B is also grounded, the third part 501C located in the third metal layer 203 is electrically connected with the first part 501A of the lower layer, which is equivalent to that the third part 501C is also grounded, so that the static electricity in each film layer of the display panel 000 or the static electricity entering when cutting the panel edge can be timely led away, so that the static electricity protection effect of the display panel 000 can be realized, which is beneficial to ensure the display quality.

[0111] In some optional embodiments, please refer to Figure 1 and Figure 18 , Figure 18 is Figure 1 Another cross-sectional structure schematic view of A-A' direction, in the embodiment, in the direction Z perpendicular to the plane where the display panel 000 is located, the third part 501C includes the fourth sub-part 501C1, the fifth sub-part 501C2 and the sixth sub-part 501C3 which are stacked;

[0112] The orthographic projection of the fourth sub-part 501C1 on the plane where the display panel 000 is located covers the orthographic projection of the fifth sub-part 501C2 on the plane where the display panel 000 is located, and the orthographic projection of the sixth sub-part 501C3 on the plane where the display panel 000 is located covers the orthographic projection of the fifth sub-part 501C2 on the plane where the display panel 000 is located;

[0113] The area of the orthographic projection of the fifth sub-part 501C2 on the plane where the display panel 000 is located is smaller than the area of the orthographic projection of the fourth sub-part 501C1 on the plane where the display panel 000 is located, and the area of the orthographic projection of the fifth sub-part 501C2 on the plane where the display panel 000 is located is smaller than the area of the orthographic projection of the sixth sub-part 501C3 on the plane where the display panel 000 is located.

[0114] The first isolation structure 501 is a three-layer metal stack design of the first metal layer 201, the second metal layer 202, and the third metal layer 203 (the gate metal layer M1, the capacitor metal layer Mc, and the source-drain metal layer M2). When the first isolation structure 501 formed by the multi-layer metal stack is directly widened at the third part 501C of the upper layer and the first part 501A of the lower layer and narrowed at the second part 501B of the middle layer, the third part 501C of the third metal layer 203 can be further provided as a structure of a plurality of sub-parts stacked in the direction Z perpendicular to the plane where the display panel 000 is located. Specifically, the third part 501C includes the fourth sub-part 501C1, the fifth sub-part 501C2, and the sixth sub-part 501C3 stacked in the direction Z perpendicular to the plane where the display panel 000 is located. The fifth sub-part 501C2 in the middle has an area smaller than that of the fourth sub-part 501C1 of the lower layer and the sixth sub-part 501C3 of the upper layer. The side surface of the third part 501C of the first isolation structure 501 is formed as a side-etched structure through the narrower fifth sub-part 501C2. The side-etched third part 501C is further stacked with the second part 501A and the first part 501A to form the first isolation structure 501, which can effectively block the climbing of the light-emitting functional layer 50. The second part 501A and the first part 501A are not side-etched. Thus, the width difference of different metal layers can be directly utilized to reduce the process difficulty, save time and effort, and effectively prevent water and oxygen from invading the display area AA, thereby improving the display effect.

[0115] In some optional embodiments, please refer to Figure 7 and Figure 19 , Figure 19 is Figure 7 another cross-sectional structure diagram in the direction of B-B’ in FIG. 11. In this embodiment, the drive circuit layer 20 further includes the fourth metal layer 204 located on the side of the second metal layer 202 away from the substrate 10. The drive circuit layer 20 includes a plurality of drive transistors DT and capacitors C, and a plurality of data lines S. The source electrode DTS and the drain electrode DTD of the drive transistor DT are located on the first metal layer 201, and the data line S is located on the second metal layer 202.

[0116] In the direction Z perpendicular to the plane where the display panel 000 is located, the first isolation structure 501 further includes the fourth part 501D located on the side of the second part 501B away from the first part.

[0117] The fourth part 501D is located on the fourth metal layer 204. The orthographic projection of the first part 501A on the plane where the display panel 000 is located covers the orthographic projection of the second part 501B on the plane where the display panel 000 is located. The orthographic projection of the fourth part 501D on the plane where the display panel 000 is located covers the orthographic projection of the second part 501B on the plane where the display panel 000 is located.

[0118] The second part 501B has a smaller area in the orthographic projection on the plane of the display panel 000 than the first part 501A and the fourth part 501D.

[0119] The driving circuit layer 20 of the display panel 000 can include multiple metal layers. For example, when the driving circuit layer 20 is made of multiple metal layers to manufacture the driving transistor DT and the capacitor C of the pixel circuit, the gate electrode DTG of the driving transistor DT is located on the gate metal layer M1, one pole of the capacitor C is located on the capacitor metal layer Mc, the source electrode DTS and the drain electrode DTD of the driving transistor DT are located on the first metal layer 201, which can be understood as the source-drain metal layer M2, the data line S is located on the second metal layer 202, which can be understood as the signal line metal layer M3, and the data line S can include the first data line S1. The driving circuit layer 20 of the present embodiment can further include a fourth metal layer 204, which is located on the side of the second metal layer 202 away from the substrate 10. The fourth metal layer 204 can be understood as another metal layer provided below the anode layer 60 of the display panel 000. Optionally, the display area AA of the present embodiment is provided with a first connection line L1, which is connected to the first data line S1 of the second metal layer 202. The first connection line L1 extends gradually in the direction close to the first display area AA1 within the range of the display area AA, and then is connected to the fan-out wire 80 of the fan-out area FA, thereby reducing the width of the fan-out area FA in the second direction X, and further reducing the lower frame of the display panel 000. When the first connection line L1 is provided in the fourth metal layer 204 of the driving circuit layer 20, the fourth metal layer 204 can be understood as the connection line metal layer M4, which can avoid mutual interference between the first connection line L1 of the fourth metal layer 204 and the signal wires of other metal film layers, and affect the signal transmission.

[0120] The first isolation structure 501 set in the non-display area NA of the present embodiment can further include a fourth part 501D. In the direction Z perpendicular to the plane on which the display panel 000 lies, the fourth part 501D of the first isolation structure 501 is located on the side of the second part 501B of the first isolation structure 501 away from the first part 501A of the first isolation structure 501. That is, the first isolation structure 501 is designed as a three-layer metal stack of the first metal layer 201, the second metal layer 202, and the fourth metal layer 204 (the source-drain metal layer M2, the signal line metal layer M3, and the connection line metal layer M4). The first isolation structure 501 is formed by using a multi-layer metal stack. Thus, the side surface part of the first isolation structure 501 can not use the side etching process, and the fourth part 501D of the upper layer and the first part 501A of the lower layer can be directly widened, and the second part 501B of the middle layer can be narrowed. Thus, the side etching process can be avoided, and the process difficulty can be reduced by not using the side etching process to etch a certain sub-layer in a single metal layer. The width difference of different metal layers can be directly used to effectively block the evaporation material.

[0121] Optionally, as shown in Figure 7 and Figure 19 , the first metal layer 201 and the second metal layer 202 in the present embodiment can be provided with a third insulating layer 013, and the second metal layer 202 and the fourth metal layer 204 can be provided with a fourth insulating layer 014. The first part 501A and the second part 501B can be insulated by the structure of the part of the third insulating layer 013, and the second part 501B and the fourth part 501D can be insulated by the structure of the part of the fourth insulating layer 014, which is equivalent to raising the first isolation structure 501 and achieving a better isolation effect.

[0122] Optionally, as shown in Figure 7 and Figure 20 , Figure 20 is Figure 7 another cross-sectional structure diagram in the direction of B-B' in

[0123] The first metal layer 201 and the second metal layer 202 can be provided with the third insulating layer 013, and the second metal layer 202 and the fourth metal layer 204 can be provided with the fourth insulating layer 014, but at the position of the first isolation structure 501, the fourth part 501D, the second part 501B and the first part 501A can be in contact and lapped through the hollow part formed on the third insulating layer 013 and the fourth insulating layer 014. The first part 501A located in the first metal layer 201 can be lapped with the lower layer ground trace LJ in the use process of the display panel 000 to ground signal, the second part 501B located in the second metal layer 202 is electrically connected with the first part 501A of the lower layer, which is equivalent to that the second part 501B is also grounded, and the fourth part 501D located in the fourth metal layer 204 is electrically connected with the first part 501A of the lower layer, which is equivalent to that the fourth part 501D is also grounded. Therefore, the static electricity in each film layer of the display panel 000 or the static electricity entering when cutting the panel edge can be discharged in time, so that the static electricity protection effect of the display panel 000 can be realized, which is beneficial to ensure the display quality.

[0124] Optionally, as shown in Figure 7 and Figure 21 , Figure 21 is Figure 7 another cross-sectional structure diagram of B-B' direction, in the direction Z perpendicular to the plane where the display panel 000 is located, the fourth part 501D includes the seventh sub-part 501D1, the eighth sub-part 501D2 and the ninth sub-part 501D3 which are stacked;

[0125] The orthogonal projection of the seventh sub-part 501D1 on the plane where the display panel 000 is located covers the orthogonal projection of the eighth sub-part 501D2 on the plane where the display panel 000 is located, and the orthogonal projection of the ninth sub-part 501D3 on the plane where the display panel 000 is located covers the orthogonal projection of the eighth sub-part 501D2 on the plane where the display panel 000 is located;

[0126] The orthogonal projection area of the eighth sub-part 501D2 on the plane where the display panel 000 is located is less than the orthogonal projection area of the seventh sub-part 501D1 on the plane where the display panel 000 is located, and the orthogonal projection area of the eighth sub-part 501D2 on the plane where the display panel 000 is located is less than the orthogonal projection area of the ninth sub-part 501D3 on the plane where the display panel 000 is located.

[0127] The first isolation structure 501 in the non-display area NA is explained. The fourth part 501D of the fourth metal layer 204 can be a stacked structure of multiple sub-parts. Specifically, in the direction Z perpendicular to the plane of the display panel 000, the fourth part 501D includes a seventh sub-part 501D1, an eighth sub-part 501D2, and a ninth sub-part 501D3 stacked in sequence. The area of the eighth sub-part 501D2 in the middle is smaller than the seventh sub-part 501D1 below and the ninth sub-part 501D3 above. The side surface of the fourth part 501D of the first isolation structure 501 is formed by the narrower eighth sub-part 501D2, which is a side-etched structure. The side-etched fourth part 501D, the second part 501B, and the first part 501A are further stacked to form the first isolation structure 501, which can effectively block the climbing of the light-emitting functional layer 50 and further prevent water and oxygen from invading the display area AA and affecting the display effect.

[0128] Optionally, as shown in Figure 7 and Figure 21 , the fourth metal layer 204 in the embodiment can be made of various metal materials. That is, the material of the eighth sub-part 501D2 is different from that of the seventh sub-part 501D1 when the fourth metal layer 204 is made. The material of the eighth sub-part 501D2 is the same as that of the ninth sub-part 501D3. For example, the material of the eighth sub-part 501D2 includes aluminum metal material, and the materials of the seventh sub-part 501D1 and the ninth sub-part 501D3 include titanium metal material. The fourth metal layer 204 adopts a film layer structure stacked by titanium, aluminum, and titanium metal materials. This not only reduces the impedance of the first connecting line L1 made of the fourth metal layer 204, which is beneficial to signal transmission, but also reduces the process difficulty of forming the seventh sub-part 501D1, the eighth sub-part 501D2, and the ninth sub-part 501D3. When the fourth part 501D of the first isolation structure 501 is recessed in the side surface part area, a side-etching process is not required. After the seventh sub-part 501D1 made of wider titanium metal material is made, the eighth sub-part 501D2 made of narrower aluminum metal material is made, and then the ninth sub-part 501D3 made of wider titanium metal material is made. This can effectively block the path of water and oxygen invading the display area AA and improve the process efficiency of the second part 501B.

[0129] Optionally, as shown in Figure 7 and Figure 22 , Figure 22 is Figure 7Another cross-sectional view of the structure along the B-B' direction is shown in this embodiment. In the first isolation structure 501 located in the non-display area NA, the fourth part 501D of the fourth metal layer 204 can be a structure with multiple sub-parts stacked, the second part 501B of the second metal layer 202 can be a structure with multiple sub-parts stacked, and the first part 501A of the first metal layer 201 can be a structure with multiple sub-parts stacked. The first metal layer 201 is the source / drain metal layer M2, and the material of the source / drain metal layer M2 is itself a titanium-aluminum-titanium stacked metal layer. The second metal layer 202 is the signal line metal layer M3, and the signal line metal layer M3 can also be a titanium-aluminum-titanium stacked metal layer. Therefore, in this embodiment, the first part 501A, the second part 501B, and the fourth part 501D of the first isolation structure 501 can all be structures with recessed side areas. This not only blocks the organic light-emitting material from climbing up the first isolation structure 501 through the first part 501A, the second part 501B, and the fourth part 501D with different widths, but also further enhances the isolation effect through the side-etched first part 501A, the second part 501B, and the fourth part 501D, respectively. This not only more effectively blocks the path of water and oxygen intrusion into the display area AA, but also improves the process efficiency of the second part 501B.

[0130] Optional, such as Figure 7 and Figure 22 As shown, in the first isolation structure 501 of this embodiment, the projected area of ​​the eighth sub-part 501D2 of the fourth part 501D on the plane where the display panel is located is greater than the projected area of ​​the second sub-part 501B2 of the second part 501B on the plane where the display panel 000 is located.

[0131] The first isolation structure 501 can be a structure in which the fourth part 501D of the fourth metal layer 204 is stacked with multiple sub-parts, and the second part 501B of the second metal layer 202 is stacked with multiple sub-parts. Specifically, in the direction Z perpendicular to the plane in which the display panel 000 is located, the second part 501B includes a first sub-part 501B1, a second sub-part 501B2, and a third sub-part 501B3 stacked in sequence. The second sub-part 501B2 in the middle has an area smaller than that of the first sub-part 501B1 below and the third sub-part 501B3 above. The fourth part 501D of the fourth metal layer 204 can be stacked with multiple sub-parts. Specifically, in the direction Z perpendicular to the plane in which the display panel 000 is located, the fourth part 501D includes a seventh sub-part 501D1, an eighth sub-part 501D2, and a ninth sub-part 501D3 stacked in sequence. The eighth sub-part 501D2 in the middle has an area smaller than that of the seventh sub-part 501D1 below and the ninth sub-part 501D3 above. Since the fourth part 501D is wider than the second part 501B, the eighth sub-part 501D2 of the fourth part 501D can have a larger area in the orthogonal projection on the plane in which the display panel is located than the second sub-part 501B2 of the second part 501B. Thus, the side of the fourth part 501D of the first isolation structure 501 can form a side-etched structure through the narrower eighth sub-part 501D2. The side-etched fourth part 501D, the side-etched second part 501B, and the side-etched first part 501A are further stacked to form the first isolation structure 501, which can effectively block the climbing of the light-emitting functional layer 50 and prevent water and oxygen from entering the display area AA and affecting the display effect.

[0132] Optionally, as shown in Figure 7 and Figure 23 , Figure 23 is Figure 7Another cross-sectional structure diagram of the direction from B to B' is shown in the embodiment. When the side of the fourth part 501D of the first isolation structure 501 is formed into a side-etch structure by the narrower eighth sub-part 501D2, and the side of the second part 501B is formed into a side-etch structure by the narrower second sub-part 501B2, the side-etching depth of the fourth part 501D at the top of the first isolation structure 501 can be deeper, that is, the distance W1 between the boundary of the eighth sub-part 501D2 and the boundary of the seventh sub-part 501D1 is greater than the distance W2 between the boundary of the second sub-part 501B2 and the boundary of the first sub-part 501B1. The embodiment explains that the side-etching amount of the fourth part 501D, the side-etching amount of the second part 501B, and the side-etching amount of the first part 501A at different metal layers can be designed differently. For example, the side-etching amount of the first part 501A and the side-etching amount of the second part 501B can be moderately reduced, thereby reducing the resistance of the first part 501A at the first metal layer 201 and the second part 501B at the second metal layer 202, thereby reducing power consumption and reducing side-etching time and cost. The side-etching depth of the fourth part 501D at the top of the first isolation structure 501 can be deeper, that is, the distance W1 between the boundary of the eighth sub-part 501D2 and the boundary of the seventh sub-part 501D1 is greater than the distance W2 between the boundary of the second sub-part 501B2 and the boundary of the first sub-part 501B1, which can better ensure the blocking effect of the first isolation structure 501 on the organic light-emitting material and ensure the display quality.

[0133] In some optional embodiments, please refer to Figure 24 , Figure 24 Another planar structure diagram of the display panel is provided in the embodiment. In the embodiment, the display panel 000 includes a functional device area PA, and the display area AA is at least partially arranged around the functional device area PA.

[0134] The first isolation structure 501 is located in the functional device area PA. Optionally, the first isolation structure 501 located in the functional device area PA can be understood with reference to the structure in the above-mentioned embodiments, which will not be repeated here.

[0135] In order to improve the screen ratio, the display panel in the embodiment can be perforated on the display panel, and optical devices such as front cameras and optical sensors are arranged in the functional device area at the position corresponding to the screen perforation. However, in the prior art, for the display panel with a perforation in the display area, after each functional layer (drive circuit layer, light emitting functional layer, packaging layer, etc.) of the display panel is manufactured, the reserved area in the original display range of the display panel is cut to form a through hole. For example, when the light emitting functional layer of the display panel is evaporated, since the light emitting functional layer includes organic light emitting material, when the organic light emitting material is evaporated, the original display area of the display panel is generally fully evaporated, and then the reserved area in the original display range of the display panel is cut to form a through hole. Therefore, after the through hole is formed in the functional device area, the light emitting functional layer on the side wall of the through hole is exposed. The organic light emitting material of the light emitting functional layer is sensitive to water and oxygen, and the light emitting functional layer exposed on the side wall forms a path for water and oxygen to enter. When water and oxygen enter the sub-pixel area in the display area, the performance of the light emitting functional layer is invalid, and the display cannot be normally displayed, resulting in pixel display black spots and affecting the performance reliability of the display panel.

[0136] To solve the above problems, the display panel 000 in the embodiment is also provided with a first isolation structure 501 in the functional device area PA. Optionally, the first isolation structure 501 can be arranged outside the functional device area PA and surround the through hole PAK formed in the functional device area PA. The first isolation structure 501 in the functional device area PA can be understood with reference to the structure in the above embodiment, which will not be repeated here. The first isolation structure 501 in the above embodiment can separate the light emitting functional layer 30 or other film layers extending to the functional device area PA, so as to block the path for water and oxygen to enter the display area AA after the through hole is formed in the functional device area PA, thereby improving the performance reliability of the display panel 000.

[0137] It can be understood that the shape of the functional device area PA is not specifically limited in the embodiment, and the shape of the functional device area PA in the display panel 000 is only taken as a circular example for illustration. The position of the functional device area PA in the display panel 000 is not specifically limited in the embodiment, and can be selected according to actual needs during specific implementation.

[0138] In some optional embodiments, please continue to refer to Figure 1 and Figure 2 In the embodiment, in the direction of the display area AA pointing to the non-display area NA, the non-display area NA includes a first area NA1 adjacent to the display area AA, and the first isolation structure 501 is located in the first area NA1.

[0139] The first isolation structure 501 for isolating at least one of the light-emitting functional layer 30, the first electrode layer 40, and other corresponding film layers extending to the non-display area NA can be arranged in the first area NA1 closest to the display area AA. The first area NA1 can be understood as the area in the non-display area NA closest to the display area AA. Arranging the first isolation structure 501 in the first area NA1 can isolate at least one of the light-emitting functional layer 30, the first electrode layer 40, and other corresponding film layers extending to the non-display area NA at a position closest to the display area AA,

[0140] The isolation column arranged at a position close to the display area isolates at least one of the light-emitting functional layer 30, the first electrode layer 40, and other corresponding film layers extending to the non-display area NA, blocks the invasion of water and oxygen into the display area AA adjacent thereto, and the first isolation structure 501 arranged in the first area NA1 serves as the first line of defense closest to the display area AA outside the display area AA. This can effectively prevent the light-emitting part 300 of the display area AA from being affected by water and oxygen and appearing to be light-emitting failure, thereby ensuring the display quality.

[0141] In some optional embodiments, please refer to Figure 14 , Figures 25-26 , Figure 25 is another cross-sectional structure schematic view of the E-E' direction in Figure 14 , Figure 26 is another cross-sectional structure schematic view of the E-E' direction in Figure 14 . In this embodiment, the plurality of first isolation structures 501 at least includes a first sub-isolation structure 5011 and a second sub-isolation structure 5012 arranged in a direction pointing from the display area AA to the non-display area NA. The heights of the first sub-isolation structure 5011 and the second sub-isolation structure 5012 are different in the direction Z perpendicular to the plane where the display panel 000 is located.

[0142] This embodiment explains that the plurality of first isolation structures 501 in the non-display area NA can be arranged to have different heights through different numbers of metal layer stacking structures. Specifically, the plurality of first isolation structures 501 at least includes a first sub-isolation structure 5011 and a second sub-isolation structure 5012 arranged in a direction pointing from the display area AA to the non-display area NA. The heights of the first sub-isolation structure 5011 and the second sub-isolation structure 5012 are different in the direction Z perpendicular to the plane where the display panel 000 is located. Figure 25 The first sub-isolation structure 5011 can be a three-layer metal stacking structure (such as the first metal layer 201, the second metal layer 202, and the fourth metal layer 204) as shown in Figure 26As shown, the first sub-isolation structure 5011 can be a three-layer metal stack structure (such as the first metal layer 201, the second metal layer 202, and the fourth metal layer 204), and the second sub-isolation structure 5012 can be a two-layer metal stack structure (such as the second metal layer 202 and the fourth metal layer 204); or, the second sub-isolation structure 5012 can be a three-layer metal stack structure (such as the first metal layer 201, the second metal layer 202, and the fourth metal layer 204), and the first sub-isolation structure 5011 can be a two-layer metal stack structure (such as the first metal layer 201 and the second metal layer 202); or, the second sub-isolation structure 5012 can be a three-layer metal stack structure (such as the first metal layer 201, the second metal layer 202, and the fourth metal layer 204), and the first sub-isolation structure 5011 can be a two-layer metal stack structure (such as the second metal layer 202 and the fourth metal layer 204), which is not shown in the figure. In this embodiment, the plurality of first isolation structures 501 in the non-display area NA are made of metal layers with different stack numbers, so that the heights of the first isolation structures 501 at different positions are different, and the uneven climbing can be formed on the plurality of first isolation structures 501 with different heights in the process of evaporating the organic light-emitting material, which is beneficial to further improve the blocking effect of the evaporated material and water and oxygen.

[0143] Optionally, as shown in Figure 14 and Figure 25 In this embodiment, along the direction from the display area AA to the non-display area NA, the first sub-isolation structure 5011 is located on the side of the second sub-isolation structure 5012 close to the display area AA; and in the direction Z perpendicular to the plane of the display panel 000, the height H1 of the first sub-isolation structure 5011 is greater than the height H2 of the second sub-isolation structure 5012.

[0144] This embodiment explains that when the non-display area NA is provided with a plurality of parallel first isolation structures 501, the first sub-isolation structure 5011 is closer to the display area AA than the second sub-isolation structure 5012, and the first sub-isolation structure 5011 closer to the display area AA has a higher stack height, that is, the height of the first sub-isolation structure 5011 closest to the display area AA can be increased by increasing the number of stacked metal layers, and the blocking effect can be improved by the first sub-isolation structure 5011 with a higher height, so as to ensure the display quality of the display area AA.

[0145] Optionally, as shown in Figure 14 and Figure 27 As shown, Figure 27 is Figure 14 another cross-sectional structure diagram in the direction of E-E’ in FIG. 8, the first sub-isolation structure 5011 has a larger orthogonal projection area on the plane of the display panel 000 than the second sub-isolation structure 5012.

[0146] The embodiment explains that when the non-display area NA is provided with multiple first isolation structures 501 arranged side by side, the first sub-isolation structure 5011 is closer to the display area AA than the second sub-isolation structure 5012, and the first sub-isolation structure 5011 closer to the display area AA has a larger area in the orthogonal projection on the plane where the display panel 000 is located, which is embodied in that Figure 27 that is, the width W3 of the orthogonal projection of the first sub-isolation structure 5011 on the plane where the display panel 000 is located is wider than the width W4 of the orthogonal projection of the second sub-isolation structure 5012 on the plane where the display panel 000 is located. The width of the first sub-isolation structure 5011 closest to the display area AA can be increased to improve the blocking effect and ensure the display quality of the display area AA.

[0147] It can be understood that the first sub-isolation structure 5011 closer to the display area AA has a larger area in the orthogonal projection on the plane where the display panel 000 is located, which is embodied in that Figure 27 that is, the width W3 of the orthogonal projection of the first sub-isolation structure 5011 on the plane where the display panel 000 is located is wider, and the width W3 of the orthogonal projection of the first sub-isolation structure 5011 on the plane where the display panel 000 is located can be understood as the width of the orthogonal projection of the widest first part 501 in the first sub-isolation structure 5011 on the plane where the display panel 000 is located, thereby achieving the effect of increasing the width of the entire first sub-isolation structure 5011.

[0148] In some optional embodiments, please refer to Figure 14 and Figure 28 , Figure 28 is Figure 14Another cross-sectional structure schematic diagram of the middle E-E' direction, in the embodiment, the first isolation structure 501 of the display panel 000 located in the non-display area NA can adopt a structure of directly stacking a plurality of metal layers, for example, the first isolation structure 501 can include a first part 501A located in the first metal layer 201, a second part 502B located in the second metal layer 202, and a fourth part 501D located in the fourth metal layer 204, the first part 501A, the second part 502B, and the fourth part 501D can be directly contacted, in the process of manufacturing the first isolation structure 501, after the first part 501A of the first metal layer 201 is manufactured, the third insulating layer 013 can be manufactured, then the third insulating layer 013 above the first part 501A is etched by using the process of exposure, development and etching, then the second part 501B of the second metal layer 202 is manufactured, after the second part 501B of the second metal layer 202 is manufactured, the fourth insulating layer 014 can be manufactured, then the fourth insulating layer 014 above the second part 501B is etched by using the process of exposure, development and etching, and finally the fourth part 501D of the fourth metal layer 204 is manufactured, the fourth part 501D, the second part 501B, and the first part 501A can be directly contacted by using the exposure and development technology, without setting a hollow part in the insulating layer to realize the electrical connection, thereby being beneficial to simplifying the process steps, having higher design freedom, and further improving the process efficiency.

[0149] In some optional embodiments, please refer to Figure 29 , Figure 29 is a plane structure schematic diagram of a display device provided by the embodiment of the present application, the display device 111 provided by the embodiment of the present application includes the display panel 000 provided by the above-mentioned embodiments of the present application. Figure 29 The embodiment only takes a mobile phone as an example to describe the display device 111, and it can be understood that the display device 111 provided by the embodiment of the present application can be a computer, a television, a vehicle-mounted display device, or other display devices 111 having a display function, and the present application does not specifically limit this. The display device 111 provided by the embodiment of the present application has the beneficial effects of the display panel 000 provided by the embodiment of the present application, and specific descriptions can be referred to the specific descriptions of the display panel 000 in the above-mentioned embodiments, which will not be described here again.

[0150] It can be known from the above-mentioned embodiments that the display panel and the display device provided by the present application at least achieve the following beneficial effects:

[0151] The display panel of the present application comprises a substrate for carrying other film layers, one side of the substrate comprises a drive circuit layer, the drive circuit layer comprises at least a first metal layer and a second metal layer, the second metal layer is farther away from the substrate than the first metal layer, the drive circuit layer is used for manufacturing drive devices and drive circuits, etc., the side of the drive circuit layer away from the substrate is provided with a light-emitting functional layer and a first electrode layer, the first electrode layer can be a cathode with an integral structure. Within the range of the non-display area of the display panel, one side of the substrate comprises a plurality of first isolation structures, at least one first isolation structure separates at least one of the light-emitting functional layer, the first electrode layer and other corresponding film layers extending to the non-display area. And the present application provides at least one first isolation structure comprising a first part and a second part respectively located in the two metal layers, the first isolation structure of the at least two layers of metal stack, not only can make the process technology of the first part located in the first metal layer not affected by the process technology of the metal trace of the first metal layer in the display area, but also can make the process technology of the metal trace of the display area and the second part located in the second metal layer together not affected by each other, and by stacking the first part and the second part, the height of the first isolation structure is increased, and the first part and the second part can also be separated by part of the insulating layer, which can effectively separate when the evaporated organic light-emitting material climbs on the first isolation structure. Compared with the side-etched isolation column made of a single layer of metal in the prior art, not only can the process technology of the first part and the second part be simplified and the process difficulty be reduced, but also the first isolation structure of the present application has better separation effect, which can effectively avoid the phenomenon of light-emitting failure of the light-emitting part of the display area due to the influence of water and oxygen, and better ensure the display quality of the display panel.

[0152] Although some specific embodiments of the present application have been described in detail by examples, those skilled in the art should understand that the above examples are only for illustration, not for limiting the scope of the present application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A display panel, characterized by, The display panel comprises: a display area and a non-display area adjacent to the display area; the display panel comprises: a substrate; a driving circuit layer, the driving circuit layer comprising at least a first metal layer and a second metal layer, the second metal layer being located on a side of the first metal layer away from the substrate; a light-emitting functional layer, the light-emitting functional layer being located on a side of the driving circuit layer away from the substrate, the light-emitting functional layer comprising a plurality of light-emitting portions; a first electrode layer, the first electrode layer being located on a side of the light-emitting functional layer away from the substrate; a side of the substrate comprises a plurality of first isolation structures, the first isolation structures being located in the non-display area, at least one of the first isolation structures isolating at least one of the light-emitting functional layer, the first electrode layer and other corresponding film layers extending to the non-display area; in a direction perpendicular to a plane in which the display panel is located, at least one of the first isolation structures comprises a first portion and a second portion stacked, the first portion being located in the first metal layer, the second portion being located in the second metal layer, the first metal layer and the second metal layer being spaced apart by an insulating layer; the second metal layer comprises a plurality of second isolation structures, the second isolation structures being located in the display area; or the second metal layer and the light-emitting functional layer comprise an anode layer, the anode layer comprising a plurality of anodes, at least one of the anodes corresponding to one of the light-emitting portions; the second metal layer comprises a plurality of second isolation structures, the second isolation structures being located in the display area; the second isolation structures are located between two adjacent anodes, the second isolation structures forming a plurality of openings, at least part of the light-emitting portions and the anodes being located in the openings, the light-emitting portions covering the anodes, the anodes and the second isolation structures being insulated by the light-emitting portions.

2. The display panel of claim 1, wherein, The insulating layer comprises a plurality of hollow portions, a projection of the hollow portions on a plane in which the display panel is located being located within a projection of the first portion on the plane in which the display panel is located, at least part of the second portion being filled in the hollow portions and directly contacting the first portion.

3. The display panel of claim 1, wherein: the display area comprises a plurality of first data lines extending along a first direction; the non-display area comprises a bonding area, the bonding area being located on a side of the display area; the bonding area comprises a plurality of conductive pads, the conductive pads being electrically connected to fan-out wires, the fan-out wires being located in the non-display area; the first data lines are connected to the fan-out wires through at least one first connection line, the first connection line being located in the display area; the first connection line is located in the second metal layer.

4. The display panel of claim 3, wherein: a projection of the first connection line on a plane in which the display panel is located at least partially does not overlap with a projection of the light-emitting portions on the plane in which the display panel is located, part of the first connection line being multiplexed as the second isolation structure.

5. The display panel of claim 3, wherein, The second isolation structure comprises a first sub-line, a second sub-line and a third sub-line arranged in a stack in a direction perpendicular to a plane where the display panel is located, and the second sub-line is located between the first sub-line and the third sub-line; The width of the second sub-line is smaller than the width of the first sub-line, and the width of the second sub-line is smaller than the width of the third sub-line.

6. The display panel of claim 1, wherein, The second part comprises a first sub-part, a second sub-part and a third sub-part arranged in a stack in a direction perpendicular to a plane where the display panel is located, and the second sub-part is located between the first sub-part and the third sub-part; The orthographic projection of the first sub-part on the plane where the display panel is located covers the orthographic projection of the second sub-part on the plane where the display panel is located, and the orthographic projection of the third sub-part on the plane where the display panel is located covers the orthographic projection of the second sub-part on the plane where the display panel is located; The area of the orthographic projection of the second sub-part on the plane where the display panel is located is smaller than the area of the orthographic projection of the first sub-part on the plane where the display panel is located, and the area of the orthographic projection of the second sub-part on the plane where the display panel is located is smaller than the area of the orthographic projection of the third sub-part on the plane where the display panel is located.

7. The display panel of claim 6, wherein The driving circuit layer comprises a plurality of metal layers, and in a direction perpendicular to a plane where the display panel is located, the distance from the second metal layer to the light-emitting functional layer is smaller than the distance from other metal layers of the driving circuit layer to the light-emitting functional layer.

8. The display panel of claim 6, wherein, The manufacturing material of the second sub-part is different from the manufacturing material of the first sub-part, and the manufacturing material of the first sub-part is the same as the manufacturing material of the third sub-part.

9. The display panel of claim 8, wherein, The manufacturing material of the second sub-part comprises an aluminum metal material, and the manufacturing material of the first sub-part and the third sub-part comprises a titanium metal material.

10. The display panel of claim 6, wherein, The plurality of first isolation structures comprises a first sub-isolation structure and a second sub-isolation structure, and in a direction from the display area to the non-display area, the first sub-isolation structure is located on a side of the second sub-isolation structure close to the display area. The area of the orthographic projection of the second sub-part of the first sub-isolation structure on the plane where the display panel is located is smaller than the area of the orthographic projection of the second sub-part of the second sub-isolation structure on the plane where the display panel is located.

11. The display panel of claim 1, wherein, The driving circuit layer further comprises at least a third metal layer located on a side of the second metal layer away from the substrate, and the driving circuit layer comprises a plurality of driving transistors and a capacitor, the gate of the driving transistor is located on the first metal layer, one pole of the capacitor is located on the second metal layer, and the source and the drain of the driving transistor are located on the third metal layer. In a direction perpendicular to a plane where the display panel is located, the first isolation structure further comprises a third part located on a side of the second part away from the first part. The third part is located on the third metal layer. The orthographic projection of the first part on the plane where the display panel is located covers the orthographic projection of the second part on the plane where the display panel is located, and the orthographic projection of the third part on the plane where the display panel is located covers the orthographic projection of the second part on the plane where the display panel is located. The second part has a smaller area of the orthographic projection on the plane of the display panel than the first part and a smaller area of the orthographic projection on the plane of the display panel than the third part.

12. The display panel of claim 11, wherein, In a direction perpendicular to the plane of the display panel, the third part comprises a fourth sub-part, a fifth sub-part and a sixth sub-part arranged in a stack, and the fifth sub-part is located between the fourth sub-part and the sixth sub-part. The fourth sub-part covers the fifth sub-part in the orthographic projection on the plane of the display panel, and the sixth sub-part covers the fifth sub-part in the orthographic projection on the plane of the display panel. The fifth sub-part has a smaller area of the orthographic projection on the plane of the display panel than the fourth sub-part and a smaller area of the orthographic projection on the plane of the display panel than the sixth sub-part.

13. The display panel of claim 6, wherein, The driving circuit layer further comprises a fourth metal layer located on a side of the second metal layer away from the substrate, and the driving circuit layer comprises a plurality of driving transistors and capacitors and a plurality of data lines, wherein the source and drain of the driving transistors are located on the first metal layer, and the data lines are located on the second metal layer. In a direction perpendicular to the plane of the display panel, the first isolation structure further comprises a fourth part located on a side of the second part away from the first part. The fourth part is located on the fourth metal layer, the first part covers the second part in the orthographic projection on the plane of the display panel, and the fourth part covers the second part in the orthographic projection on the plane of the display panel. The second part has a smaller area of the orthographic projection on the plane of the display panel than the first part and a smaller area of the orthographic projection on the plane of the display panel than the fourth part.

14. The display panel of claim 13, wherein, In a direction perpendicular to the plane of the display panel, the fourth part comprises a seventh sub-part, an eighth sub-part and a ninth sub-part arranged in a stack, and the eighth sub-part is located between the seventh sub-part and the ninth sub-part. The seventh sub-part covers the eighth sub-part in the orthographic projection on the plane of the display panel, and the ninth sub-part covers the eighth sub-part in the orthographic projection on the plane of the display panel. The eighth sub-part has a smaller area of the orthographic projection on the plane of the display panel than the seventh sub-part and a smaller area of the orthographic projection on the plane of the display panel than the ninth sub-part.

15. The display panel of claim 14, wherein, The eighth sub-portion has a larger area of a projection on a plane where the display panel is located than the second sub-portion.

16. The display panel of claim 13, wherein, The first portion is in direct contact with the second portion, and the fourth portion is in direct contact with the second portion.

17. The display panel of claim 1, wherein, The display panel includes a functional device area, and the display area is at least partially arranged around the functional device area. The first isolation structure is located in the functional device area.

18. The display panel of claim 1, wherein, In a direction from the display area to the non-display area, the non-display area includes a first area adjacent to the display area, and the first isolation structure is located in the first area.

19. The display panel of claim 1, wherein, The first isolation structure includes at least a first sub-isolation structure and a second sub-isolation structure arranged in a direction from the display area to the non-display area, and the first sub-isolation structure and the second sub-isolation structure have different heights in a direction perpendicular to a plane where the display panel is located. 20.The display panel of claim 19, wherein, In the direction from the display area to the non-display area, the first sub-isolation structure is located on a side of the second sub-isolation structure close to the display area. The first sub-isolation structure has a larger height than the second sub-isolation structure in the direction perpendicular to the plane where the display panel is located. 21.The display panel of claim 19, wherein, The first sub-isolation structure has a larger area of a projection on the plane where the display panel is located than the second sub-isolation structure.

22. A display device comprising: The display panel of any one of claims 1-21.

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