Low profile modular tile active phased array antenna

Abstract

The application provides a low-profile modular tile active phased array antenna, which comprises a wave control power supply layer, a metal cavity layer, a power division network layer, a T / R link layer and an antenna array surface layer, the input end of the wave control power supply layer is connected with an external power supply and a control signal, and the output end of the wave control power supply layer is connected with the low-frequency input end of the T / R link layer; in the transmitting link, the input end of the power division network layer is connected with an external radio frequency excitation signal after passing through the wave control power supply layer of the bottom layer, the output end of the power division network layer is connected with the radio frequency input end of the T / R link layer, and the output end of the T / R link layer constitutes the input end of the top antenna array surface layer; in the receiving link, the transmission line of the radio frequency signal is the same as that of the transmitting link, the transmission direction is opposite to that of the transmitting link, and the output end of the radio frequency signal received by the antenna after passing through the power division network is transmitted to an external receiving device. Thus, the overall profile height is reduced, the overall weight and occupied space are reduced, and the miniaturization and light weight of the antenna are realized.

Description

Technical Field

[0001] This invention relates to the field of microwave radio frequency technology, and more specifically, to a low-profile modular tile-type active phased array antenna. Background Technology

[0002] In recent years, the increasing demand for communication and detection has driven the rapid development of communication equipment such as T / R modules and antennas towards "high integration, high frequency, and high performance." Thanks to the continuous improvement of semiconductor integration technology and printed circuit board manufacturing, tile-type T / R modules have been widely used. Compared with the brick-like structure where the multilayer board is perpendicular to the antenna aperture, the tile-type structure has the multilayer board and chip plane parallel to the antenna array, effectively improving space utilization.

[0003] Currently, tile-type active phased array antenna architectures are mainly divided into two types. One is a low-integration architecture similar to the traditional brick-type architecture, including antenna arrays, T / R modules, power supplies, power distribution, and beam control components. These components are manufactured and tested separately and interconnected through various high- and low-frequency connectors, finally assembled into an antenna system by manual assembly. The other is a highly integrated architecture, where various antenna system components are layered on multiple printed circuit boards, and multi-functional integrated chips are used to achieve control functions such as amplification, phase shifting, attenuation, and beam control. Inter-board interconnection is mainly achieved through pressing and soldering, and high-density antenna products are mainly produced through machine assembly. The former has a mature manufacturing process, but there are many components, especially connectors, resulting in a large amount of redundant space and failing to fully utilize the characteristics of the tile-type structure. The latter is small in size, light in weight, and high in density, but all components are located within the printed circuit board, making non-destructive disassembly difficult once production is complete, resulting in poor testability and maintainability. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the purpose of this invention is to provide a low-profile modular tile-type active phased array antenna.

[0005] In a first aspect, this application provides a low-profile modular tile-type active phased array antenna, comprising: a wave-controlled power supply layer, a metal cavity layer, a power divider network layer, a T / R link layer, and an antenna array layer. The input terminal of the wave-controlled power supply layer is connected to an external power supply and control signal, and the output terminal of the wave-controlled power supply layer is connected to the low-frequency input terminal of the T / R link layer.

[0006] In the transmit link, the input terminal of the power divider network layer passes through the bottom wave control power layer and is connected to the external radio frequency excitation signal. The output terminal of the power divider network layer is connected to the radio frequency input terminal of the T / R link layer. The output terminal of the T / R link layer constitutes the input terminal of the top antenna array layer. The radio frequency signal is amplified and phase-shifted in the T / R link layer and then output from the antenna.

[0007] In the receiving link, the transmission line of the radio frequency signal is the same as that of the transmitting link, but the transmission direction is opposite to that of the transmitting link. After the radio frequency signal received by the antenna enters the T / R link layer, it is output from the output end of the T / R link layer and enters the input end of the power divider network layer. After passing through the output end of the power divider network, it is transmitted to the external receiving device.

[0008] Optionally, the antenna array layer includes: an antenna radiating element, an antenna element partition wall, a fastening positioning hole, and a positioning pin;

[0009] The T / R link layer is formed by pressing multiple printed circuit boards and forms a power distribution network and a power supply network through electrical interconnection between striplines, gold wires and microstrip lines. The phase and amplitude of the radio frequency signal are controlled by the MMIC chip located on the bottom surface of the T / R link layer.

[0010] The power divider network layer includes: a power divider RF circuit board and a power divider network cover plate;

[0011] The metal cavity layer has through holes or grooves at the corresponding positions of components, connectors and positioning pins, and a metal cover plate is installed below the through hole position of the MMIC chip to form a closed cavity.

[0012] The wave-controlled power supply layer adopts an FPGA architecture, is placed below the metal cavity layer by fastening screws, and transmits electrical and control signals through low-frequency connectors.

[0013] Optionally, in the antenna array layer, the antenna unit partition separates each antenna radiating unit from each other, and the four sides of the antenna array layer are provided with semi-cylindrical positioning pins; wherein, the positioning pins and the antenna unit partition are integrated structural components.

[0014] Optionally, the number of antenna elements on the antenna subarray in the antenna array surface layer is N×N, where N is a natural number greater than or equal to 1.

[0015] Optionally, the overall structure, from top to bottom, consists of: an antenna partition wall structure, an RF mixing board, a metal cavity structure, a power divider network printed circuit board, and a wave control power supply printed circuit board.

[0016] Optionally, the antenna array unit and the T / R RF link are both located on the uppermost surface of the RF mixing plate. The antenna partition structure is welded to the surface of the RF mixing plate where the antenna array unit is located. The T / R RF link located on the lower layer of the RF mixing plate is vertically interconnected and fed to the antenna through striplines and blind holes.

[0017] Optionally, the components on the RF mixing board and the wave control power printed circuit board are mounted using SMT surface mount technology, and the RF mixing board is an aluminum substrate PCB.

[0018] Optionally, vertical RF interconnects between boards are achieved using glass insulators, while low-frequency interconnects are achieved using micro-rectangular printed circuit board low-frequency connectors.

[0019] Optionally, the upper antenna array layer, T / R link layer and the lower structure are positioned and fixed only by positioning pins, fastening screws and fastening adhesive, and no machining or welding is required during the installation and fastening process with the lower structure.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] This invention utilizes multilayer PCB hybrid board technology and microsystem-in-package (SIP) technology, primarily consisting of two structural components and three printed circuit boards (PCBs). From top to bottom, these are the antenna partition structure, RF PCB, metal cavity structure, power divider network PCB, and waveguide power supply PCB. At the design level, the antenna array and T / R RF link are located on the same PCB. The antenna partition structure is soldered onto the top of the RF board. The antenna elements are integrated onto the top layer of the RF PCB through etching and vertically interconnected with the T / R link. The RF output and antenna can be directly fed via striplines and blind vias, eliminating the need for coaxial adapters and cables, thus reducing subsequent manual assembly and fastening steps, significantly lowering assembly process risks. This invention uses a single multi-functional chip to achieve phase shifting, attenuation, power amplification, and signal transmission. Therefore, only one type of multi-functional MMIC chip is distributed on the RF board surface, allowing for one-time production via automated SMT and bonding lines. This greatly reduces production steps, lowers production costs, and shortens the production cycle. The metal cavity structure is welded to the bottom of the RF board and acts as a cold plate to dissipate heat. The holes on the structure and the multi-functional chip form a metal shield cavity, which improves the isolation between channels and reduces self-oscillation.

[0022] This invention discloses a low-profile modular tile-type active phased array antenna that abandons the independent "component" unit in traditional active phased array systems. Instead, it stacks the antenna, T / R components, power divider network, power supply, beam control, and other structures in a "layer" manner according to the coupling relationship of system functions. By utilizing a reasonable stripline topology, it achieves power distribution or coupling of radio frequency signals, reducing the number of components and saving surface space on the radio frequency board. Furthermore, it reduces the number of various high- and low-frequency connectors and cables through PCB interconnection, fully leveraging the characteristics of the tile-type structure. This significantly reduces the overall profile height, greatly reducing the overall weight and space occupied, thus achieving antenna miniaturization and lightweighting. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort. Other features, objects, and advantages of the present invention will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0024] Figure 1 A schematic diagram of a low-profile modular tile-type active phased array antenna provided for an embodiment of this application;

[0025] Figure 2 A three-dimensional schematic diagram of the overall structure of a low-profile modular tile-type active phased array antenna provided in this application embodiment;

[0026] Figure 3 A schematic diagram of the antenna array layer of a low-profile modular tile-type active phased array antenna provided in an embodiment of this application;

[0027] Figure 4 A cross-sectional schematic diagram of the T / R link layer of a low-profile modular tile-type active phased array antenna provided for embodiments of this application;

[0028] Figure 5 This is a cross-sectional schematic diagram of the metal cavity of a low-profile modular tile-type active phased array antenna provided in an embodiment of this application.

[0029] In the diagram: 1-Antenna Array Layer: 11-Antenna Radiation Element, 12-Antenna Element Partition Wall, 13-Firming Positioning Hole, 14-Positioning Pin; 2-T / R Link Layer: 21-RF Stripline, 22-Bonding Wire, 23-Multifunctional MMIC Chip, 24-Surface Microstrip Line, 25-RF Connector; 3-Power Divider Network Layer: 31-Power Divider RF Circuit Board, 32-Power Divider Network Cover Plate; 4-Metal Cavity Layer: 41-RF Chip Cavity, 42-Power Divider Network Cavity, 43-Positioning Pin Through Hole, 44-Connector Via Hole; 5-Wave-Controlled Power Supply Layer: 51-Low-Frequency Connector, 52-Wave-Controlled Power Supply Board. Detailed Implementation

[0030] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the invention in any way. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention. These all fall within the scope of protection of the present invention.

[0031] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as "connected to" another component, it can be directly connected to or indirectly connected to that other component. Furthermore, a connection can be for both fixing and circuit connection purposes.

[0032] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of the present invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0034] This application provides a low-profile modular tile-type active phased array antenna, whose structure, from top to bottom, consists of an antenna array layer, a T / R link layer, a power divider network layer, a metal cavity layer, and a wave-controlled power supply layer. The antenna array layer includes antenna radiating elements, antenna element partitions, and fastening positioning holes and positioning pins.

[0035] For example, in the antenna array surface layer, the antenna radiating elements are integrated on the top layer of the T / R link printed circuit board by etching. The mutual coupling between the array elements is reduced by adding antenna element partitions. Each subarray has semi-cylindrical positioning pins on its four sides, and the positioning pins and the unit partitions are integrated structural components. The T / R link layer is made of multiple layers of printed circuit boards. The power distribution network and the feed network are formed by electrical interconnection between striplines, bonding wires, surface microstrip lines and RF connectors. The phase and amplitude of the RF signal are controlled by an MMIC chip with phase shifting and power amplification functions, and the chip is located on the bottom surface of the T / R link layer. The power divider network layer consists of two parts: a power divider RF circuit board and a power divider network cover plate. The circuit board is located inside the power divider network cavity of the metal cavity layer, and electromagnetic shielding is achieved by adding a cover plate on it. The cover plate has through holes for the RF connector. The metal cavity layer has RF chip cavities at the corresponding positions of the RF chips and power divider network cavities at the power divider network positions. Through holes are provided at the corresponding positions of the positioning pins and through holes are provided at the corresponding positions of the connectors. The wave-controlled power layer adopts an FPGA architecture and is placed under the metal cavity layer by fastening screws. Low-frequency connectors are used to realize the transmission of electrical and control signals between the wave-controlled power layer printed circuit board and the T / R link layer.

[0036] Furthermore, in a low-profile modular tile-type active phased array antenna, the input terminal of the beam-controlled power supply layer is connected to an external power supply and control signal, and the output terminal of the beam-controlled power supply layer is connected to the low-frequency input terminal of the T / R link layer, enabling the power amplifier and other active devices within the T / R link layer to function and transmit data. In the transmit link, the input terminal of the power divider network layer passes through the bottom beam-controlled power supply layer and is connected to the external RF excitation signal. The output terminal of the power divider network layer is connected to the RF input terminal of the T / R link layer, and the output terminal of the T / R link layer is the input terminal of the top antenna array layer. The RF signal is amplified and phase-shifted in the T / R link layer before being output from the antenna. In the receive link, the RF signal transmission path is the same as in the transmit link, but the transmission direction is opposite. The RF signal received by the antenna is first input to the T / R link layer for amplification and phase shifting, and then output from the output terminal of the T / R link layer and enters the input terminal of the power divider network layer. After passing through the power divider network, it is output to the external receiving device.

[0037] This embodiment provides a low-profile modular tile-type active phased array antenna that is micro-assembled, low-cost, miniaturized, easy to disassemble and expand. While possessing the characteristics of a highly integrated architecture, it improves the system's testability, maintainability, and application scenarios.

[0038] Figure 1 A schematic block diagram of a low-profile modular tile-type active phased array antenna provided in this application embodiment is shown below. Figure 1As shown, the structure consists of five layers stacked from top to bottom: antenna array layer 1, T / R link layer 2, power divider network layer 3, metal cavity layer 4, and wave-controlled power supply layer 5.

[0039] Figure 2 This application provides a three-dimensional schematic diagram of the overall structure of a low-profile modular tile-type active phased array antenna, as shown in the embodiments of this application. Figure 2 As shown, each antenna subarray in antenna array layer 1 contains 16 antenna elements 11 in a 4×4 configuration. To reduce mutual coupling between the array elements, metal partitions 12 are installed between each antenna element. To prevent relative displacement of the various parts of the antenna subarray structure, fastening and positioning holes 13 are provided on the partition structure between the antenna elements. Semi-cylindrical positioning pins 14 are also provided on the sides of the antenna subarray, and the positioning pins 14 and the unit partitions 12 are integrated structural components.

[0040] In this embodiment, the number of antenna elements on the antenna subarray is 4×4, totaling 16, or it can be N×N (N is a natural number ≥1).

[0041] Figure 3 A schematic diagram of the antenna array layer of a low-profile modular tile-type active phased array antenna provided in this application embodiment is shown below. Figure 3 As shown, the T / R link layer 2 is fabricated from multiple layers of printed circuit boards, mainly comprising stripline 21, gold wire 22, multi-functional MMIC chip 23, microstrip line 24, and RF connector 25. Antenna radiating element 11 is etched on the top layer of the T / R link printed circuit board 2. In the transmit link, the external RF excitation signal is input through the coaxial RF connector 25 after passing through a power divider network. After being transferred and power divided by the surface microstrip line 24, it is input to the multi-functional chip 23 via the gold wire 22. After amplification and phase shifting by the multi-functional chip 23, it is input to the stripline 21 via the gold wire 22 and a metallized blind via, and finally output to the antenna radiating element 11 after transmission through the stripline 21. In the receiving link, after the external small signal is received by the antenna unit, it is transmitted to the lower surface of the printed circuit board via interlayer interconnects and stripline 21. It is then input to the multifunction chip 23 via gold wire 22, amplified, and transmitted again via gold wire 22 to the microstrip line 24. Finally, after power combining, it is output to the next stage power divider network via RF connector 25. The RF connector 25 and microstrip line 24 are connected by hard connection (soldering), while the multifunction chip 23 and microstrip line 24 are connected by soft connection (bonding).

[0042] Figure 4 A cross-sectional schematic diagram of the T / R link layer of a low-profile modular tile-type active phased array antenna provided in this application embodiment is shown below. Figure 4As shown, each multi-functional chip is located in an independent metallized cavity to prevent free-space transmission crosstalk between channels and reduce self-oscillation. Each chip can realize the transmit and receive amplitude and phase modulation functions of two antenna elements with a total of four links. The power divider network is located in the center of the metal cavity. One common port of the power divider network passes through the bottom beam control power layer and connects to external devices. The four antenna ports of the power divider network are connected to the RF connectors of the T / R link layer.

[0043] Figure 5 A cross-sectional schematic diagram of the metal cavity of a low-profile modular tile-type active phased array antenna provided in this application embodiment is shown below. Figure 5 As shown, the low-profile modular tile-type active phased array antenna mainly consists of two structural components and three printed circuit boards. From top to bottom, they are the antenna partition structure, the RF mixing board, the metal cavity structure, the power divider network printed circuit board, and the wave-controlled power supply printed circuit board. The antenna array layer 1 contains four identical antenna subarrays. Each antenna subarray corresponds to a T / R link multilayer board. Each T / R link multilayer board has one common port connected to the power divider network layer and 16 antenna ports connected to each antenna element. The power distribution and combining of the RF signal are jointly achieved by the power divider and the power divider RF circuit 32 on the board. The power divider RF circuit board 31 is located inside the power divider network cavity 42 of the metal cavity layer, and electromagnetic shielding is achieved by adding a cover plate 31 on it. The cover plate has through holes reserved for interconnection with the RF connector 25. The metal cavity layer 4 is located between the RF board and the low-frequency board, and also has independent RF chip cavities 41 and power divider network cavities 42, which can effectively shield electromagnetic crosstalk between high and low frequency signals. The metal cavity layer 4 uses positioning pin through-holes 43 and positioning pins 14 to achieve horizontal positioning and fixation, and is reinforced with fastening screws to improve the overall structural strength and tightness while providing heat dissipation. The FPGA architecture wave-controlled power layer 5 is located below the metal cavity layer 4. This layer is mainly responsible for the transmission and processing of power and control signals, and uses low-frequency connectors 51 to realize the board-to-board interconnection between the low-frequency board and the T / R link layer 2.

[0044] In this embodiment, the antenna array and the T / R RF link are located on the same PCB board. The antenna partition structure is soldered on the top of the RF board. The antenna unit is integrated on the top layer of the RF PCB board by etching and forms a vertical interconnect with the T / R link. The RF output and the antenna can be directly fed through striplines and blind holes, eliminating the need for coaxial adapters and cables. This saves on subsequent manual assembly and fastening steps, reduces assembly processes, and significantly reduces process risks.

[0045] In this embodiment, a single multi-functional chip is used to achieve phase shifting, attenuation, power amplification, and signal transmission. Therefore, only one type of multi-functional MMIC chip is distributed on the surface of the RF board, which can be manufactured in one step through an automated SMT and bonding production line, greatly reducing production steps, lowering production costs, and shortening the production cycle. The metal cavity structure is welded to the bottom of the RF board, serving as a cold plate for heat dissipation. The holes in the structure and the multi-functional chip form a metal shielded cavity, improving the isolation between channels and reducing self-oscillation.

[0046] In this embodiment, the independent component "component" in traditional active phased array systems is abandoned. Instead, the antenna, T / R components, power divider network, power supply, beam control, and other structures are stacked in layers according to the coupling relationship of system functions. A reasonable stripline topology is used to achieve power distribution or coupling of radio frequency signals, reducing the number of components and saving surface space on the radio frequency board. Furthermore, the number of various high- and low-frequency connectors and cables is reduced through PCB interconnection. The characteristics of the tile-type structure are fully utilized, significantly reducing the overall profile height, greatly reducing the overall weight and space occupied, and achieving antenna miniaturization and lightweighting.

[0047] The above is the core idea of ​​this invention. To make the above-mentioned objectives, features, and advantages of this invention more apparent and understandable, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0048] The various embodiments described in this specification are presented in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0049] The specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art can make various modifications or variations within the scope of the claims, which do not affect the essence of the present invention.

Claims

1. A low-profile modular tile-type active phased array antenna, characterized in that, include: The system comprises a beam control power layer, a metal cavity layer, a power divider network layer, a T / R link layer, and an antenna array layer. The antenna array and the T / R RF link are located on the same PCB board. The antenna partition structure is soldered above the RF board. The antenna elements are integrated into the top layer of the RF PCB board by etching and are vertically interconnected with the T / R link. The RF output is directly fed to the antenna through striplines and blind vias. The metal cavity layer has RF chip cavities at the corresponding positions of the RF chips and power divider network cavities at the power divider network positions. Through holes are provided at the corresponding positions of the positioning pins, and vias are provided at the corresponding positions of the connectors. The input terminal of the beam control power layer is connected to the external power supply and control signals, and the output terminal of the beam control power layer is connected to the low-frequency input terminal of the T / R link layer. The antenna array... The surface layer includes: antenna radiating elements, antenna element partitions, fastening positioning holes, and positioning pins; the T / R link layer is formed by pressing multiple printed circuit boards, and forms a power distribution network and a feed network through electrical interconnection between striplines, gold wires, and microstrip lines. The phase and amplitude of the radio frequency signal are controlled by the MMIC chip located on the bottom surface of the T / R link layer; the power divider network layer includes: a power divider RF circuit board and a power divider network cover plate, wherein the power divider RF circuit board is located in the power divider network cavity of the metal cavity layer, and electromagnetic shielding is achieved by installing a power divider network cover plate on it; the metal cavity layer has through holes or grooves at the corresponding positions of components, connectors, and positioning pins, wherein a metal cover plate is installed below the through hole position of the MMIC chip to form a closed cavity; In the transmit link, the input terminal of the power divider network layer passes through the bottom wave control power layer and is connected to the external radio frequency excitation signal. The output terminal of the power divider network layer is connected to the radio frequency input terminal of the T / R link layer. The output terminal of the T / R link layer constitutes the input terminal of the top antenna array layer. The radio frequency signal is amplified and phase-shifted in the T / R link layer and then output from the antenna. In the receiving link, the transmission line of the radio frequency signal is the same as that of the transmitting link, but the transmission direction is opposite to that of the transmitting link. After the radio frequency signal received by the antenna enters the T / R link layer, it is output from the output end of the T / R link layer and enters the input end of the power divider network layer. After passing through the output end of the power divider network, it is transmitted to the external receiving device.

2. The low-profile modular tile-type active phased array antenna according to claim 1, characterized in that, The wave-controlled power supply layer adopts an FPGA architecture, is placed below the metal cavity layer by fastening screws, and transmits electrical and control signals through low-frequency connectors.

3. The low-profile modular tile-type active phased array antenna according to claim 2, characterized in that, In the antenna array layer, the antenna unit partition separates each antenna radiating unit from the others, and the four sides of the antenna array layer are provided with semi-cylindrical positioning pins; wherein, the positioning pins and the antenna unit partition are integrated structural components.

4. The low-profile modular tile-type active phased array antenna according to claim 2, characterized in that, The number of antenna elements on the antenna subarray in the antenna array surface layer is N×N, where N is a natural number greater than or equal to 1.

5. The low-profile modular tile-type active phased array antenna according to claim 1, characterized in that, The overall structure, from top to bottom, consists of: antenna partition wall structure, RF mixing board, metal cavity structure, power divider network printed circuit board, and wave control power supply printed circuit board.

6. The low-profile modular tile-type active phased array antenna according to claim 5, characterized in that, The antenna unit and the T / R RF link are both located on the uppermost surface of the RF mixing plate. The antenna partition structure is welded to the antenna unit surface of the RF mixing plate. The T / R RF link located on the lower layer of the RF mixing plate is vertically interconnected and fed to the antenna through striplines and blind holes.

7. The low-profile modular tile-type active phased array antenna according to claim 5, characterized in that, The components on the RF mixing board and the wave control power printed circuit board are all mounted using SMT surface mount technology, and the RF mixing board is an aluminum substrate PCB.

8. The low-profile modular tile-type active phased array antenna according to claim 5, characterized in that, Vertical RF interconnection between boards is achieved using glass insulators, while low-frequency interconnection is achieved using micro-rectangular printed circuit board low-frequency connectors.

9. The low-profile modular tile-type active phased array antenna according to claim 1, characterized in that, The upper antenna array layer and T / R link layer are positioned and fixed to the lower structure only by positioning pins, fastening screws and fastening adhesive. No machining or welding is required during the installation and fastening process with the lower structure.

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