A semiconductor process self-sealing switch door structure

Abstract

The present invention belongs to the field of semiconductor processing equipment, specifically a self-sealing switch door structure for semiconductor processes, comprising a fixed inner door frame, a movable outer door frame and an inner pressure plate, wherein the movable outer door frame is located on the outside of the fixed inner door frame and moves up and down under the drive of a driving member. The present invention is provided with a fixed inner door frame having a guide flange, a movable outer door frame having an inclined groove and an inner pressure plate having a guide shaft, and under the drive of the driving member, the inclined groove can press the corresponding guide shaft, so that the inner pressure plate moves inward along the inclined surface, and the rear side of the inner pressure plate covers the opening of the fixed inner door frame from the front side, thereby achieving self-sealing at the opening of the fixed inner door frame. The present invention can effectively achieve self-sealing at the opening of the fixed inner door frame, prevent the overflow of aerosols of harmful chemical liquids during semiconductor processing, ensure the safety of operators, and also ensure the accuracy of the wafer process.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor processing equipment, in particular to a semiconductor process self-sealing switch door structure. Background Art

[0002] Currently, the stripping, etching, and organic developing processes in semiconductor manufacturing all utilize hazardous chemicals, yet wafer access requires a door opening mechanism. Most semiconductor processing equipment doors consist of a metal plate with a wear-resistant edge frame, lacking a strict seal and unable to prevent the escape of harmful aerosols. Some etching and developing processes have stringent requirements for the aerosol flow field within the chamber, and a leaky door opening can severely impact the semiconductor process. Summary of the Invention

[0003] In view of the problem that the switch door of existing semiconductor processing equipment needs a better sealing effect, the purpose of the present invention is to provide a semiconductor process self-sealing switch door structure.

[0004] The object of the present invention is achieved through the following technical solutions:

[0005] A semiconductor process self-sealing switch door structure, comprising a fixed inner door frame, a movable outer door frame and an inner pressure plate;

[0006] The fixed inner door frame is mounted on the process chamber outside the process chamber opening, a guide flange is convexly provided on the front side surface of the fixed inner door frame below the process chamber opening, the top surface of the guide flange is an inclined surface, and the inclined surface gradually slopes downward from the side away from the process chamber to the side close to the process chamber, and a fixed inner door frame opening is opened on the inner side of the fixed inner door frame and is arranged corresponding to the process chamber opening;

[0007] The lower end of the movable outer door frame is open, and the movable outer door frame is located outside the fixed inner door frame and moves up and down under the drive of the driving member; the left and right side surfaces of the movable outer door frame are respectively provided with inclined grooves, and each of the inclined grooves is gradually inclined downward from the side close to the process chamber to the side away from the process chamber;

[0008] The inner pressure plate is arranged on the inner side of the movable outer door frame, and a plurality of guide shafts are provided on the inner pressure plate, and each guide shaft extends into an adjacent inclined groove;

[0009] When the movable outer door frame is lowered to close the door, the movable outer door frame and the inner pressure plate are lowered together first; after the lower end of the inner pressure plate abuts against the inclined surface, the movable outer door frame continues to lower a certain distance, and each of the inclined grooves presses the corresponding guide shaft, so that the inner pressure plate moves inward along the inclined surface, and the rear side of the inner pressure plate covers the opening of the fixed inner door frame from the front side;

[0010] The movable outer door frame rises to open the door, and at this time the inner pressure plate moves in the opposite direction and away from the opening of the fixed inner door frame.

[0011] The driving member is a cylinder.

[0012] The driving end of the driving member is connected to an adapter plate, and the adapter plate is connected to the top surface of the movable outer door frame.

[0013] The driving component is installed on the process chamber at the upper side of the process chamber opening.

[0014] A sealing ring A is provided between the rear side of the fixed inner door frame and the process cavity. The sealing ring A surrounds the outside of the process cavity opening. An embedding groove A for embedding the sealing ring A is provided on the rear side of the fixed inner door frame.

[0015] A sealing ring B is provided on the front side of the fixed inner door frame. The sealing ring B surrounds the outside of the opening of the fixed inner door frame. An embedding groove B for embedding the sealing ring B is opened on the front side of the fixed inner door frame.

[0016] An outer protective plate is installed on the front side of the movable outer door frame.

[0017] At least two parallel guide shafts are provided on the inner pressure plate, and the left and right ends of each guide shaft extend into a corresponding inclined groove respectively, and the length direction of each guide shaft is perpendicular to the moving direction of the movable outer door frame.

[0018] A plurality of guide shaft mounting seats are provided on the front side surface of the inner pressure plate at positions corresponding to each of the guide shafts, and each of the guide shafts passes through the corresponding guide shaft mounting seats.

[0019] Each guide shaft is provided with a plurality of buckles for supporting the guide shaft mounting seat or the movable outer door frame.

[0020] The advantages and positive effects of the present invention are:

[0021] The present invention can effectively achieve self-sealing at the opening of the fixed inner door frame through the coordinated arrangement of a fixed inner door frame with a guide flange, a movable outer door frame with an inclined groove, and an inner pressure plate with a guide shaft, thereby preventing the overflow of harmful chemical liquid mist during semiconductor processing, ensuring the safety of operators, and also ensuring the accuracy of the wafer process. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present invention;

[0023] Figure 2It is a schematic diagram of the overall split structure of the present invention;

[0024] Figure 3 for Figure 2 A magnified view of point A;

[0025] Figure 4 This is a schematic side view of the overall structure of the present invention when it is opened;

[0026] Figure 5 for Figure 4 Enlarged view of point B;

[0027] Figure 6 This is a schematic side view of the overall structure of the present invention when it is about to be closed;

[0028] Figure 7 This is a schematic side view of the overall structure of the present invention when it is closed;

[0029] Figure 8 This is a schematic diagram of the overall main structure of the present invention when it is opened;

[0030] Figure 9 It is a schematic diagram of the overall main structure of the present invention when it is closed.

[0031] In the figure: 1 is a fixed inner door frame, 101 is a guide flange, 102 is an inclined surface, 103 is an inlay groove B, 2 is a movable outer door frame, 201 is an inclined groove, 3 is an inner pressure plate, 4 is a driving member, 5 is a guide shaft, 6 is an adapter plate, 7 is a sealing ring A, 8 is a sealing ring B, 9 is an outer protective plate, 10 is a guide shaft mounting seat, and 11 is a buckle;

[0032] 001 is the process chamber, and 0011 is the process chamber opening. DETAILED DESCRIPTION

[0033] The following is combined with Figure 1-9 The present invention is described in further detail.

[0034] A semiconductor process self-sealing switch gate structure, such as Figure 1-9 As shown, this embodiment includes a fixed inner door frame 1, a movable outer door frame 2 and an inner pressure plate 3.

[0035] The fixed inner door frame 1 is installed on the process chamber 001 outside the process chamber opening 0011. A guide flange 101 is protruded on the front side surface of the fixed inner door frame 1 on the lower side of the process chamber opening 0011. The top surface of the guide flange 101 is an inclined surface 102. The inclined surface 102 gradually inclines downward from the side away from the process chamber 001 to the side close to the process chamber 001. A fixed inner door frame opening corresponding to the process chamber opening 0011 is opened on the inner side of the fixed inner door frame 1.

[0036] The lower end of the movable outer door frame 2 is open. It is located outside the fixed inner door frame 1 and moves up and down under the influence of the drive member 4. The left and right sides of the movable outer door frame 2 each have an inclined groove 201. Each inclined groove 201 slopes gradually downward from the side closest to the process chamber 001 to the side farther from the process chamber 001. In this embodiment, the angle between the inclined direction of the inclined groove 201 and the horizontal plane is 72.54°.

[0037] The inner pressure plate 3 is disposed on the inner side of the movable outer door frame 2 . A plurality of guide shafts 5 are provided on the inner pressure plate 3 . Each guide shaft 5 extends into an adjacent inclined groove 201 .

[0038] When the movable outer door frame 2 descends to close the door, the movable outer door frame 2 and the inner pressure plate 3 descend together first; after the lower end of the inner pressure plate 3 abuts against the inclined surface 102, the movable outer door frame 2 continues to descend a certain distance, and each inclined groove 201 presses the corresponding guide shaft 5, so that the inner pressure plate 3 moves inward along the inclined surface 102, and the rear side of the inner pressure plate 3 covers the opening of the fixed inner door frame from the front side, thereby realizing self-sealing at the opening of the fixed inner door frame.

[0039] The movable outer door frame 2 rises to open the door, and at this time the inner pressure plate 3 moves in the opposite direction and moves away from the opening of the fixed inner door frame.

[0040] Specifically, in this embodiment, the driver 4 utilizes a commercially available pneumatic cylinder, controlled by an external controller. The driver 4 is bolted to the process chamber 001 above the process chamber opening 0011. The driver end of the driver 4 is connected to an adapter plate 6, which is screwed to the top surface of the movable outer door frame 2. The pneumatic cylinder design simplifies the structure and eliminates the need for an electric drive, making it suitable for any process involving corrosive, hazardous, or flammable liquid chemicals.

[0041] Specifically, in this embodiment, a sealing ring A7 is provided between the rear side of the fixed inner door frame 1 and the process chamber 001. The sealing ring A7 surrounds the outside of the process chamber opening 0011. A recess A for the sealing ring A7 is defined on the rear side of the fixed inner door frame 1. The sealing ring A7 is squeezed and deformed to fill the recess A. The provision of the sealing ring A7 further ensures a seal between the rear side of the fixed inner door frame 1 and the process chamber 001.

[0042] Specifically, in this embodiment, a sealing ring B8 is provided on the front side of the fixed inner door frame 1, surrounding the outside of the fixed inner door frame opening. A recess B103 for receiving sealing ring B8 is defined in the front side of the fixed inner door frame 1. When the door is closed, the inner pressure plate 3 presses the sealing ring B8 inward, causing it to deform, further ensuring the seal between the rear side of the inner pressure plate 3 and the front side of the fixed inner door frame 1. In this embodiment, sealing rings A7 and B8 are made of wear-resistant fluororubber O-rings, significantly extending their service life.

[0043] Specifically, in this embodiment, an outer protective plate 9 is installed on the front side of the movable outer door frame 2 to protect the inner structure of the movable outer door frame 2.

[0044] Specifically, in this embodiment, two parallel guide shafts 5 are provided on the front side of the inner pressure plate 3. The left and right ends of each guide shaft 5 extend into a corresponding inclined groove 201, and the length direction of each guide shaft 5 is perpendicular to the moving direction of the movable outer door frame 2. A number of guide shaft mounting seats 10 are provided on the front side of the inner pressure plate 3 at positions corresponding to each guide shaft 5. Each guide shaft 5 passes through the corresponding guide shaft mounting seats 10. Each guide shaft 5 is provided with a number of buckles 11 for supporting the guide shaft mounting seats 10 or the movable outer door frame 2, which play a role in horizontally limiting the guide shaft 5 and are easy to disassemble and maintain. In this embodiment, the buckles 11 are all commercially available E-type buckles. The fixed inner door frame 1, the movable outer door frame 2 and the guide shaft 5 in this embodiment are all made of wear-resistant SUS316L stainless steel and are electrolytically planed.

[0045] Working principle:

[0046] By cooperating with a fixed inner door frame 1 provided with a guide flange 101, a movable outer door frame 2 provided with an inclined groove and an inner pressure plate 3 provided with a guide shaft 5, and under the drive of the driving member 4, the inclined groove 201 can press the corresponding guide shaft 5, so that the inner pressure plate 3 moves inward along the inclined surface 102, and the rear side of the inner pressure plate 3 covers the opening of the fixed inner door frame from the front side, thereby realizing self-sealing at the opening of the fixed inner door frame; by the setting of the sealing ring A 7, the sealing effect between the rear side of the fixed inner door frame 1 and the process chamber 001 can be further guaranteed; by the setting of the sealing ring B 8, the sealing effect between the rear side of the inner pressure plate 3 and the front side of the fixed inner door frame 1 can be further guaranteed.

Claims

1. A semiconductor process self-sealing switch door structure, characterized by: It comprises a fixed inner door frame (1), a movable outer door frame (2) and an inner pressure plate (3); The fixed inner door frame (1) is mounted on the process cavity outside the process cavity opening, a guide flange (101) is convexly provided on the front side of the fixed inner door frame (1) below the process cavity opening, the top surface of the guide flange (101) is an inclined surface (102), and the inclined surface (102) gradually slopes downward from the side away from the process cavity to the side close to the process cavity, and a fixed inner door frame opening corresponding to the process cavity opening is opened on the inner side of the fixed inner door frame (1); The lower end of the movable outer door frame (2) is open, and the movable outer door frame (2) is located outside the fixed inner door frame (1) and moves up and down under the drive of the driving member (4); the left and right side surfaces of the movable outer door frame (2) are respectively provided with inclined grooves (201), and each of the inclined grooves (201) is gradually inclined downward from the side close to the process chamber to the side away from the process chamber; The inner pressure plate (3) is arranged on the inner side of the movable outer door frame (2), and a plurality of guide shafts (5) are provided on the inner pressure plate (3), and each guide shaft (5) extends into an adjacent inclined groove (201); When the movable outer door frame (2) descends to close the door, the movable outer door frame (2) and the inner pressure plate (3) first descend together; after the lower end of the inner pressure plate (3) contacts the inclined surface (102), the movable outer door frame (2) continues to descend a certain distance, and each inclined groove (201) presses the corresponding guide shaft (5), so that the inner pressure plate (3) moves inward along the inclined surface (102), and the rear side of the inner pressure plate (3) covers the opening of the fixed inner door frame from the front side; The movable outer door frame (2) rises to open the door, and at this time the inner pressure plate (3) moves in the opposite direction and away from the opening of the fixed inner door frame; A sealing ring A (7) is provided between the rear side of the fixed inner door frame (1) and the process cavity, the sealing ring A (7) surrounds the outside of the process cavity opening, and an inlay groove A for inlaying the sealing ring A (7) is provided on the rear side of the fixed inner door frame (1); A sealing ring B (8) is provided on the front side of the fixed inner door frame (1), and the sealing ring B (8) surrounds the outer side of the opening of the fixed inner door frame; At least two parallel guide shafts (5) are provided on the inner pressure plate (3), and the left and right ends of each guide shaft (5) extend into a corresponding inclined groove (201), respectively. The length direction of each guide shaft (5) is perpendicular to the moving direction of the movable outer door frame (2); A plurality of guide shaft mounting seats (10) are provided on the front side surface of the inner pressure plate (3) at positions corresponding to each guide shaft (5), and each guide shaft (5) passes through the corresponding guide shaft mounting seat (10); Each guide shaft (5) is provided with a plurality of buckles (11) for abutting against the guide shaft mounting seat (10) or the movable outer door frame (2).

2. The semiconductor process self-sealing switch door structure according to claim 1, characterized in that: The driving member (4) is a cylinder.

3. The semiconductor process self-sealing switch door structure according to claim 1, characterized in that: The driving end of the driving member (4) is connected to an adapter plate (6), and the adapter plate (6) is connected to the top surface of the movable outer door frame (2).

4. The semiconductor process self-sealing switch gate structure according to claim 1, characterized in that: The driving member (4) is mounted on the process chamber at the upper side of the process chamber opening.

5. The semiconductor process self-sealing switch door structure according to claim 1, characterized in that: An embedding groove B (103) for embedding the sealing ring B (8) is provided on the front side of the fixed inner door frame (1).

6. The semiconductor process self-sealing switch door structure according to claim 1, characterized in that: An outer protective plate (9) is installed on the front side of the movable outer door frame (2).

Images