An optical receiving chip mounting position determination method and related product
By calculating the installation position of the light receiving chip and considering the rotation and position parameters of the optical components, the problem of light spot offset caused by prism rotation was solved, thus improving the object detection probability of the lidar.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BENEWAKE BEIJING TECH CO LTD
- Filing Date
- 2023-02-18
- Publication Date
- 2026-07-10
AI Technical Summary
The rotational motion of the prism reduces the detection probability of the light receiving chip in the lidar, especially under high rotation speed or long-distance detection conditions, the light spot deviates from the receiving range, affecting the object detection probability.
By acquiring the rotational speed, position parameters of the optical components, and the direction of the laser beam emitted from the laser, the installation position of the optical receiver chip is calculated to ensure that the optical receiver chip is installed in the direction of the emitted light from the rotated optical components. Taking into account the rotation angle and relative position of the optical components, the installation position of the optical receiver chip is adjusted.
This increases the detection probability of the light receiving chip, enabling the offset light spot to be received by the light receiving chip and enhancing the reliability of object detection.
Smart Images
Figure CN116149074B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of lidar technology, and in particular to a method for determining the installation location of an optical receiver chip. Background Technology
[0002] LiDAR products are characterized by fast, non-contact detection, enabling them to detect the road environment in real time. This helps autonomous driving systems such as cars and trains to plan their routes in advance, and they can also be placed on the roadside to achieve functions such as vehicle-road cooperation.
[0003] The basic principle of current lidar is as follows: the light emitted by the laser passes through a series of optical lenses and prisms and is emitted to the target object. The light reflected back from the target object passes through a series of optical lenses and prisms and returns to the light receiving chip to be detected.
[0004] Therefore, lidar not only requires accurate optical path design, but also requires the alignment of lenses, light receiving chips, and other components on the optical path during assembly.
[0005] In lidar production, optical path alignment (generally known as axis adjustment) usually needs to be performed with the prism stationary to align the light receiving chip with the light passing through the optical lens. However, in actual use, the prism rotates.
[0006] In practical use, the rotation of the prism causes a problem: after the light emitted by the laser travels for a certain period of time, it is reflected back onto the prism and then onto the light receiving chip. During the laser's flight time, the prism has deviated from the angle of the prism when the laser emitted the light, causing some of the light spot to shift outside the range that the light receiving chip can receive, reducing the probability of object detection. Moreover, as the rotation speed increases, the detection probability tends to decrease.
[0007] Therefore, how to avoid the negative impact of the prism's rotation speed on the detection probability of the optical receiver chip is a technical problem that needs to be solved. Summary of the Invention
[0008] The purpose of this application is to provide a method for determining the installation position of an optical receiver chip and related products, so as to solve the technical problem in the prior art of how to avoid the negative impact of the rotation speed of the prism on the detection probability of the optical receiver chip.
[0009] To achieve the above objectives, the embodiments of this application adopt the following technical solutions.
[0010] In a first aspect, embodiments of this application provide a method for determining the mounting position of an optical receiver chip, used for mounting an optical receiver chip in a lidar system, wherein the lidar system further includes a laser and rotating optical components. The method for determining the mounting position of the optical receiver chip includes:
[0011] The rotational speed, first position parameter, second position parameter and third position parameter of the optical component are obtained. The first position parameter represents the target detection distance, the second position parameter represents the relative distance between the light receiving chip and the optical component, and the third position parameter represents the direction of the laser beam emitted from the laser towards the optical component.
[0012] The mounting position of the optical receiving chip is determined based on the rotational speed of the optical component, the first position parameter, the second position parameter, and the third position parameter.
[0013] Optionally, the step of determining the mounting position of the optical receiver chip based on the rotational speed of the optical component, the first position parameter, the second position parameter, and the third position parameter includes:
[0014] Based on the first position parameter, calculate the time difference between the optical component receiving light emitted by the laser and the optical component receiving light reflected from the target object;
[0015] Based on the time difference and the rotational speed of the optical component, calculate the rotation angle of the reflecting surface of the optical component during the time difference;
[0016] The installation position of the optical receiver chip is determined based on the rotation angle and the second position parameter.
[0017] Optionally, before determining the mounting position of the optical receiver chip, the method for determining the mounting position of the optical receiver chip further includes: obtaining the initial position of the optical receiver chip; the second position parameter represents the relative distance between the initial position and the optical component;
[0018] The step of determining the installation position of the optical receiver chip based on the rotation angle and the second position parameter includes: determining an offset vector of the installation position relative to the initial position based on the rotation angle and the second position parameter, wherein the direction of the offset vector is perpendicular to the direction in which the optical receiver chip receives light; and determining the installation position of the optical receiver chip based on the offset vector.
[0019] Optionally, the length of the offset vector satisfies the following formula:
[0020] L=Dtan2θ
[0021] Where θ represents the rotation angle of the reflective surface of the optical element in the time difference, D represents the second position parameter, and L represents the length of the offset vector.
[0022] Optionally, after determining the mounting position of the optical receiver chip based on the offset vector, the method for determining the mounting position of the optical receiver chip further includes:
[0023] The light receiving chip is placed in the initial position, the laser is controlled to emit light to the target object, and the signal parameters of the light receiving chip are tested at the initial position.
[0024] Move the optical receiving chip from the initial position to the installation position, and continuously test the signal parameters of the optical receiving chip while moving it;
[0025] If the change in the signal parameters of the optical receiving chip during the movement is less than a preset fluctuation value, then the installation position is determined.
[0026] Optionally, the signal parameters of the optical receiver chip include electrical peak-to-peak value and / or pulse width.
[0027] Secondly, embodiments of this application provide a device for determining the mounting position of an optical receiver chip, used for mounting an optical receiver chip in a lidar system, wherein the lidar system further includes a laser and rotating optical components. The device for determining the offset of the optical receiver chip mounting position includes:
[0028] The input module is used to acquire the rotational speed, first position parameter, second position parameter and third position parameter of the optical component, wherein the first position parameter represents the target detection distance, the second position parameter represents the relative distance between the light receiving chip and the optical component, and the third position parameter represents the direction of the laser beam emitted from the laser toward the optical component;
[0029] The processing module is used to determine the installation position of the optical receiving chip based on the rotational speed of the optical component, the first position parameter, the second position parameter, and the third position parameter.
[0030] Thirdly, embodiments of this application provide a computer-readable storage medium storing a computer program or instructions, which, when executed by a computing device, implements the method for determining the installation location of the optical receiver chip in the first aspect.
[0031] Fourthly, embodiments of this application provide an electronic device, which includes a memory and a processor. The memory is electrically connected to the processor, and the memory stores an executable program. When the processor executes the executable program, it implements the method for determining the installation location of the optical receiver chip according to the first aspect.
[0032] Fifthly, embodiments of this application provide a lidar, wherein the mounting position of the optical receiver chip is determined according to the optical receiver chip mounting position determination method of the first aspect.
[0033] Compared with the prior art, this application has the following advantages:
[0034] By taking into account the rotational speed of the optical components, the target detection distance, and the direction of the laser beam emitted from the optical components, the mounting position of the optical receiver chip can be determined in the direction of the emitted light from the rotated optical components. Compared to not considering the change in the direction of the emitted light caused by the rotation of the optical components, the mounting position determined in this application can receive the emitted light from the optical components more accurately, so that the light spot that was originally offset outside the receiving range of the optical receiver chip falls into the receiving range of the optical receiver chip, thereby improving the detection probability of the object. Attached Figure Description
[0035] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0036] Figure 1 This is a schematic diagram of the optical path from the laser to the optical receiving chip in an existing lidar system.
[0037] Figure 2 This application provides a schematic diagram of the optical path from a laser to an optical receiving chip, as shown in the embodiments of this application.
[0038] Figure 3 This is a schematic diagram of a method for determining the installation position of an optical receiver chip provided in an embodiment of this application;
[0039] Figure 4 This is a schematic diagram of a device for determining the installation position of an optical receiver chip, provided in an embodiment of this application.
[0040] Explanation of reference numerals in the attached figures:
[0041] 1-Laser
[0042] 2-Optical Receiver Chip
[0043] 3-Optical components
[0044] 4-Target Object
[0045] 10-Input Module
[0046] 20-Processing Module Detailed Implementation
[0047] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only some embodiments of this application, not all embodiments. The components of the embodiments of this application described in the accompanying drawings can generally be arranged and designed in various different configurations.
[0048] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0049] In the description of this application, it should be noted that relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. The term "connection" should be interpreted broadly, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.
[0050] like Figure 1 In existing lidar systems, laser 1 emits light, which is reflected by optical component 3 and reaches target object 4. The reflected light from target object 4 then returns to optical component 3, and after being reflected again by optical component 3, it reaches light receiving chip 2.
[0051] To expand the detection range, the optical component 3 rotates to reflect the light emitted by the laser 1 onto different target objects 4.
[0052] The applicant discovered that if the detection range is increased, for example when developing lidar for use in subways, trains, and other vehicles, the light propagation path becomes longer. Due to the rotation of optical component 3, the final light deviates from the original position of the light receiving chip 2. Figure 2 The dashed line represents the position of the optical component 3 before rotation and the original position of the light receiving chip 2, while the solid line represents the position of the optical component 3 after rotation and the corresponding position of the light receiving chip 2.
[0053] In addition, the speed of the optical component 3 is also an important influencing factor. If the rotation speed is low, it can be ignored, but when the rotation speed increases, this effect of deviating from the original position of the optical receiving chip 2 will become more and more obvious.
[0054] When lidar uses high-speed optical components, or when developing lidar with a long range, the rotational motion of the optical components can cause the emitted light to deviate from its direction, negatively impacting the detection probability of the light receiving chip.
[0055] To overcome the above problems, embodiments of this application provide a method for determining the installation position of an optical receiver chip, used for installing an optical receiver chip in a lidar system, which also includes a laser and rotating optical components. Figure 3 The methods for determining the installation location of the optical receiver chip include:
[0056] S1. Obtain the rotation speed, first position parameter, second position parameter and third position parameter of the optical component. The first position parameter represents the target detection distance, the second position parameter represents the relative distance between the light receiving chip and the optical component, and the third position parameter represents the direction of the laser beam emitted from the laser towards the optical component.
[0057] S2. Determine the installation position of the optical receiving chip based on the rotational speed of the optical component, the first position parameter, the second position parameter, and the third position parameter.
[0058] By taking into account the rotational speed of the optical components, the target detection distance, and the direction of the laser beam emitted from the optical components, the mounting position of the optical receiver chip can be determined in the direction of the emitted light from the rotated optical components. Compared to not considering the change in the direction of the emitted light caused by the rotation of the optical components, the mounting position determined in this application can receive the emitted light from the optical components more accurately, so that the light spot that was originally offset outside the receiving range of the optical receiver chip falls into the receiving range of the optical receiver chip, thereby improving the detection probability of the object.
[0059] LiDAR systems for trains, subways, and other similar vehicles require long target detection ranges. Therefore, the embodiments of this application can be applied to LiDAR systems for trains, subways, and other similar vehicles, adapting to long target detection ranges. The target detection range can be several hundred meters or 100 to 1000 meters. The target detection range is the first position parameter in step S1.
[0060] In addition, in order to expand the scanning range, increase the scanning frequency and the timeliness of scanning, the rotation speed of the optical components in step S1 can reach tens of thousands of revolutions per minute.
[0061] The second and third position parameters in step S1 can be determined based on the structure of the lidar. Initial estimated values can be taken first, and then adaptive adjustments can be made.
[0062] For step S2, one implementation method is as follows:
[0063] S2-1. Calculate the time difference between the optical component receiving light emitted by the laser and the optical component receiving light reflected from the target object, based on the first position parameter;
[0064] S2-2. Calculate the rotation angle of the reflecting surface of the optical component in the time difference based on the time difference and the rotation speed of the optical component;
[0065] S2-3. Determine the installation position of the optical receiver chip based on the rotation angle and the second position parameter.
[0066] Specifically, for example, if the target detection distance is 300-600 meters, the first position parameter can be set to 500 meters. The time difference between the optical component receiving the light emitted by the laser and the optical component receiving the light reflected from the target object can be calculated as twice the time required for light to travel 500 meters, or twice the time required for light to travel 1000 meters. A medium coefficient can also be added based on the propagation medium, since the speed of light varies in different media such as vacuum, air, and water.
[0067] Once the time difference is calculated, the change in the rotation of the optical component can be calculated. The rotation angle of the reflective surface of the optical component during the time difference is the key factor affecting the direction of light deflection. Therefore, based on the rotation angle of the reflective surface of the optical component, it can be determined where the light receiving chip should be installed to successfully receive light.
[0068] This rotation angle is also related to the size and shape of the optical component; different types of optical components require specific analysis. An optical component can also be an optical system that includes lenses, in which case even more factors need to be considered to simulate this rotation angle.
[0069] refer to Figure 2 In the example, the mounting position of the light receiver chip 2 is translated relative to the position of the dashed line without considering rotation. It can be translated in one direction, that is, the vertical direction in the figure, which is perpendicular to the direction in which the light receiver chip 2 receives light.
[0070] Before step S2, a step can be set to obtain an initial position, which represents... Figure 2 Without considering the position of the dashed line during rotation, the second position parameter represents the relative distance between the initial position and the optical component.
[0071] Step S2-3 can be calculated using a vector: based on the rotation angle and the second position parameter, determine the offset vector of the installation position relative to the initial position, with the direction of the offset vector perpendicular to the direction in which the optical receiver chip receives light; determine the installation position of the optical receiver chip based on the offset vector.
[0072] Specifically, if the rotation angle of the reflecting surface of the optical component over the time difference is θ, then the rotation angle of the light rays from the optical component to the light receiving chip is 2θ, which can be expressed by the following geometric relationship:
[0073] L=Dtan2θ
[0074] Where D represents the second position parameter and L represents the length of the offset vector.
[0075] The installation process can involve placing the optical receiver chip in the initial position and then moving the optical receiver chip to the installation position along the offset vector.
[0076] To verify the effectiveness of this installation method and provide timely feedback during the installation process, you can set up tests during the installation process:
[0077] Place the light receiving chip in the initial position, control the laser to emit light to the target object, and test the signal parameters of the light receiving chip in the initial position;
[0078] Move the optical receiver chip from its initial position to its installation position, continuously testing the signal parameters of the optical receiver chip during the movement;
[0079] If the change in the signal parameters of the optical receiver chip during the movement is less than the preset fluctuation value, then the installation location is determined.
[0080] The signal parameters of the optical receiver chip include electrical peak-to-peak value and / or pulse width.
[0081] Based on the above embodiments, this application also provides a device for determining the mounting position of an optical receiver chip, used for mounting an optical receiver chip in a lidar, wherein the lidar also includes a laser and rotating optical components; as shown Figure 4 The device for determining the offset of the optical receiver chip mounting position includes:
[0082] The input module 10 is used to acquire the rotational speed of the optical component, a first position parameter, a second position parameter and a third position parameter. The first position parameter represents the target detection distance, the second position parameter represents the relative distance between the light receiving chip and the optical component, and the third position parameter represents the direction of the laser beam emitted from the laser towards the optical component.
[0083] The processing module 20 is used to determine the installation position of the optical receiving chip based on the rotation speed of the optical component, the first position parameter, the second position parameter, and the third position parameter.
[0084] Corresponding to the method for determining the installation location of the optical receiver chip, other modules or sub-modules can be set to perform other optional steps of the method, or these optional steps can be performed by the input module and the processing module.
[0085] For example, the processing module may include a first submodule, a second submodule, and a third submodule, which are used to execute steps S2-1, S2-2, and S2-3, respectively.
[0086] This application also provides a computer-readable storage medium storing a computer program or instructions, which, when executed by a computing device, implements the above-described method for determining the installation location of an optical receiver chip.
[0087] This application also provides an electronic device, including a memory and a processor. The memory and the processor are electrically connected. The memory stores an executable program. When the processor executes the executable program, it implements the above-described method for determining the installation position of the optical receiver chip.
[0088] This application embodiment also provides a lidar, wherein the installation position of the optical receiver chip is determined according to the above-described method for determining the installation position of the optical receiver chip.
[0089] In summary, this application proposes a method for determining the installation position of an optical receiver chip and related products, relating to the field of lidar technology. This method considers the rotational speed of the optical component, the target detection distance, and the direction of the laser beam emitted from the laser towards the optical component. It can determine the installation position of the optical receiver chip in the direction of the emitted light from the rotated optical component. Compared to methods that do not consider the change in the direction of the emitted light caused by the rotation of the optical component, the installation position determined in this application can more accurately receive the emitted light from the optical component, causing light spots that were originally outside the receiver's range to fall within the receiver's range, thus improving the probability of object detection.
[0090] The apparatus and system embodiments described above are merely illustrative. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement these embodiments without any creative effort.
[0091] The above are merely preferred embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A method for determining the installation location of an optical receiver chip, characterized in that, For mounting an optical receiver chip in a lidar, which also includes a laser and rotating optical components; The method for determining the installation location of the optical receiver chip includes: The rotational speed, first position parameter, second position parameter and third position parameter of the optical component are obtained. The first position parameter represents the target detection distance, the second position parameter represents the relative distance between the light receiving chip and the optical component, and the third position parameter represents the direction of the laser beam emitted from the laser towards the optical component. The mounting position of the optical receiving chip is determined based on the rotational speed of the optical component, the first position parameter, the second position parameter, and the third position parameter. The step of determining the mounting position of the optical receiver chip based on the rotational speed of the optical component, the first position parameter, the second position parameter, and the third position parameter includes: Based on the first position parameter, calculate the time difference between the optical component receiving light emitted by the laser and the optical component receiving light reflected from the target object; Based on the time difference and the rotational speed of the optical component, calculate the rotation angle of the reflecting surface of the optical component during the time difference; The installation position of the optical receiver chip is determined based on the rotation angle, the second position parameter, and the third position parameter. Before the step of determining the installation position of the optical receiver chip, the method for determining the installation position of the optical receiver chip further includes: obtaining the initial position of the optical receiver chip; the second position parameter represents the relative distance between the initial position and the optical component; The step of determining the installation position of the optical receiver chip based on the rotation angle, the second position parameter, and the third position parameter includes: determining an offset vector of the installation position relative to the initial position based on the rotation angle, the second position parameter, the third position parameter, and the initial position, wherein the direction of the offset vector is perpendicular to the direction in which the optical receiver chip receives light; and determining the installation position of the optical receiver chip based on the offset vector. After determining the mounting position of the optical receiver chip based on the offset vector, the method for determining the mounting position of the optical receiver chip further includes: The light receiving chip is placed in the initial position, the laser is controlled to emit light to the target object, and the signal parameters of the light receiving chip are tested at the initial position. Move the optical receiving chip from the initial position to the installation position, and continuously test the signal parameters of the optical receiving chip while moving it; If the change in the signal parameters of the optical receiving chip during the movement is less than a preset fluctuation value, then the installation position is determined.
2. The method for determining the installation location of the optical receiver chip as described in claim 1, characterized in that, The length of the offset vector satisfies the following formula: Where θ represents the rotation angle of the reflecting surface of the optical element in the time difference, D represents the second position parameter, and L represents the length of the offset vector.
3. The method for determining the installation location of the optical receiver chip as described in claim 1, characterized in that, The signal parameters of the optical receiver chip include electrical peak-to-peak value and / or pulse width.
4. A device for determining the mounting position of an optical receiver chip, characterized in that, For mounting an optical receiver chip in a lidar, which also includes a laser and rotating optical components; The optical receiver chip mounting position offset determination device includes: The input module is used to acquire the rotational speed, first position parameter, second position parameter and third position parameter of the optical component, wherein the first position parameter represents the target detection distance, the second position parameter represents the relative distance between the light receiving chip and the optical component, and the third position parameter represents the direction of the laser beam emitted from the laser toward the optical component; The processing module is used to determine the installation position of the optical receiving chip based on the rotational speed of the optical component, the first position parameter, the second position parameter, and the third position parameter. The step of determining the mounting position of the optical receiver chip based on the rotational speed of the optical component, the first position parameter, the second position parameter, and the third position parameter includes: Based on the first position parameter, calculate the time difference between the optical component receiving light emitted by the laser and the optical component receiving light reflected from the target object; Based on the time difference and the rotational speed of the optical component, calculate the rotation angle of the reflecting surface of the optical component during the time difference; The installation position of the optical receiver chip is determined based on the rotation angle, the second position parameter, and the third position parameter. Before determining the installation position of the optical receiver chip, the input module is further configured to: obtain the initial position of the optical receiver chip; the second position parameter represents the relative distance between the initial position and the optical component; The step of determining the installation position of the optical receiver chip based on the rotation angle, the second position parameter, and the third position parameter includes: determining an offset vector of the installation position relative to the initial position based on the rotation angle, the second position parameter, and the third position parameter, wherein the direction of the offset vector is perpendicular to the direction in which the optical receiver chip receives light; and determining the installation position of the optical receiver chip based on the offset vector. After determining the mounting position of the optical receiver chip based on the offset vector, the processing module is further configured to: The light receiving chip is placed in the initial position, the laser is controlled to emit light to the target object, and the signal parameters of the light receiving chip are tested at the initial position. Move the optical receiving chip from the initial position to the installation position, and continuously test the signal parameters of the optical receiving chip while moving it; If the change in the signal parameters of the optical receiving chip during the movement is less than a preset fluctuation value, then the installation position is determined.
5. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program or instructions that, when executed by a computing device, implement the method of any one of claims 1-3.
6. An electronic device, characterized in that, The electronic device includes a memory and a processor, the memory being electrically connected to the processor, the memory storing an executable program, and the processor executing the executable program to implement the method according to any one of claims 1-3.
7. A lidar, characterized in that, The mounting position of the optical receiver chip is determined by the method for determining the mounting position of the optical receiver chip according to any one of claims 1-3.