C-scan data merging

Abstract

Examples of the present subject matter provide techniques for collecting inspection data (e.g., c-scans) from a plurality of probes, such as ECA probes. Each probe can generate inspection data on a surface obtained from a different in-plane probe orientation, for example, thereby providing indications from disturbances or defects located in different in-plane directions relative to a probe sensitivity axis. The inspection data can then be combined while the indications in the different orientations can be preserved and then merged to generate a composite. Pattern recognition can then be performed to determine a type of the indications, such as a harmful defect or a benign anomaly, with the pattern recognition leveraging templates that define the defects or anomalies.

Description

[0001] Cross-reference to related applications

[0002] This application claims the benefit of priority to U.S. Provisional Patent Application No. 63 / 072,437, filed August 31, 2020, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] This invention generally relates to non-destructive surface inspection. Background Technology

[0004] Non-destructive testing (NDT) techniques can be used to inspect components, including but not limited to pressure vessels, aircraft wings, aircraft fuselages, railway rails, tram wheels, or other types of components. For some conductive materials, eddy current array (ECA) probes can be used for inspection. In an ECA probe, alternating current is injected into one or more coils within the probe, generating a magnetic field. When the ECA probe is placed on the object under test, opposing alternating currents (called eddy currents) are generated. Anomalies in the object under test may interfere with the path of the eddy currents, and this interference can then be detected and measured by the probe.

[0005] Technicians can use ECA probes to scan the object under test and receive indications of interference encountered by the probe. However, not all interference corresponds to harmful defects. Some interference may be caused by harmless anomalies. For example, scabs, which result from excessive material buildup on the surface during the rolling process and leave circular marks, often cause interference. However, scabs may not be considered unacceptable defects. Therefore, in response to receiving a defect indication, technicians may return and verify the cause of the notification by rescanning the area from different angles and then further considering whether the cause of the defect indication is indeed an unacceptable defect. This can lead to a prolonged inspection process and is sometimes prone to errors. Attached Figure Description

[0006] The accompanying drawings illustrate only exemplary implementations of this disclosure and should not be construed as limiting the scope of this disclosure.

[0007] Figure 1 An ECA probe is shown.

[0008] Figure 2 An example inspection system based on this topic is shown.

[0009] Figure 3 An example of an inspection layout based on this topic is shown.

[0010] Figure 4 This is a flowchart of the inspection process based on examples from this topic.

[0011] Figure 5 A graphical representation of the inspection process, based on an example of this topic, is shown.

[0012] Figure 6 A block diagram is shown illustrating an example of a machine on which any or more of the techniques (e.g., methods) discussed herein can be performed. Detailed Implementation

[0013] The inventors particularly recognize the need in the art for inspection systems that overcome the aforementioned challenges. Examples of this subject matter provide techniques for collecting inspection data (e.g., c-scan) from multiple probes, such as ECA probes. Each probe can generate inspection data on a surface obtained from different in-plane probe orientations, thus providing indications of interference or defects from directions located in different in-plane directions relative to the probe sensitivity axis. The inspection data can then be combined, retaining indications from different orientations, and then merged to generate a composite. Pattern recognition can then be performed to determine the type of indication, such as a harmful defect or a harmless anomaly, wherein the pattern recognition utilizes a template defining the defect or anomaly. Therefore, the systems and methods described herein provide rapid inspection techniques while reducing errors.

[0014] This document describes a method comprising: receiving a first set of eddy current inspection data, the first set of eddy current inspection data providing interference indication data obtained in a first orientation relative to a first sensitivity axis; receiving a second set of eddy current inspection data, the second set of eddy current inspection data providing interference indication information in a second orientation relative to a second sensitivity axis, the second orientation being different from the first orientation; combining the first set of inspection data and the second set of inspection data to generate a combined dataset that retains the interference indication data in the first and second orientations; and generating a composite of anomalies based on the combined dataset.

[0015] This document also describes an inspection system. The inspection system may include a first probe configured to obtain a first set of eddy current inspection data from an object, thereby providing indication information in a first orientation relative to a first sensitivity axis. The inspection system may also include a second probe configured to obtain a second set of eddy current inspection data from the object, thereby providing indication information in a second orientation relative to a second sensitivity axis. The inspection system may further include a processor configured to: combine the first set of eddy current inspection data and the second set of eddy current inspection data to generate a combined dataset retaining the indication information in the first and second orientations; and to merge the indication information in the combined dataset to generate a composite of anomalies.

[0016] This document also describes a machine-readable medium containing instructions that, when executed by a machine, cause the machine to perform operations including: receiving a first set of eddy current inspection data, the first set of eddy current inspection data providing interference indication data obtained in a first orientation relative to a first sensitivity axis; receiving a second set of eddy current inspection data, the second set of eddy current inspection data providing interference indication information in a second orientation relative to a second sensitivity axis, the second orientation being different from the first orientation; combining the first set of inspection data and the second set of inspection data to generate a combined dataset that retains the interference indication data in the first and second orientations; and generating a composite of anomalies based on the combined dataset.

[0017] Figure 1 An example of an ECA probe assembly 100 is shown, in a top view looking down at the surface of an object. The ECA probe assembly 100 may include a housing 102 and a plurality of sensors 104 disposed within the housing 102. The ECA probe assembly 100 may be placed on or near a target 110 (e.g., the object being measured). The sensors 104 may include one or more coils and may be arranged in one row or more rows within the housing 102. The sensors 104 may be arranged in a pattern to avoid mutual inductance between the individual sensors. Figure 1 In the example, sensor 104 can be arranged in two adjacent columns parallel to the array axis. The sensors in the first column can be offset or staggered, such that the center of the coil in the first column can be positioned in the space between the sensors in the second column to achieve optimized coverage and provide high resolution along the scan path along the scan axis. The scan axis is defined by the movement of sensor 104 along target 110 during inspection. Sensor 104 can also be arranged in more than two columns.

[0018] In another example, sensors 104 can be stacked on top of each other on corresponding printed circuit board (PCB) layers. In this example, the stacked sensors can be arranged in a row. The PCB layer can be flexible or rigid.

[0019] During inspection, the ECA probe assembly 100 can be moved along the scanning axis. As the ECA probe assembly 100 moves along the scanning axis, it can inspect a surface comprising a small region beneath the surface of the target 110. For example, it can inspect several millimeters below the surface, depending on the sensor's material properties, frequency, and size (e.g., approximately a few micrometers for carbon steel; approximately 5 mm for aluminum). Alternating current can be injected into the coil to create a magnetic field and generate opposing alternating current (eddy currents) on the surface of the target 110. Higher frequencies (e.g., 50 kHz to 500 kHz) can be used to provide higher resolution for detecting smaller anomalies; higher frequencies may result in relatively less penetration into the region directly beneath the surface. Anomalies in the part may interfere with the path of the eddy currents, which can then be measured by the ECA probe assembly 100.

[0020] In this example, data from probe assembly 100 can be multiplexed. The individual coils in coil 104 can be energized at different times so that two adjacent coils are not energized simultaneously. This minimizes the mutual inductance associated with magnetic coupling between the coils.

[0021] Figure 2 An example of an inspection system 200, including, for example, techniques that can be used to perform one or more of the techniques shown and described elsewhere herein, is generally illustrated. The inspection system 200 may include a test instrument 240, such as a handheld or portable component. The test instrument 240 may be electrically coupled to the probe assembly 100, for example, using a multi-conductor interconnect 230. The ECA probe assembly 100 may be as described above. Figure 1 The settings described.

[0022] Test instrument 240 may include digital and analog circuitry systems, such as front-end circuitry 222 including one or more transmit and receive signal chains. The transmit signal chain may include amplifier and filter circuitry systems to provide, for example, alternating current delivered via interconnect 230 to ECA probe assembly 100 for inspection.

[0023] Although Figure 2 A single ECA probe assembly 100 is shown, but other configurations can also be used, such as connecting multiple probe assemblies to a single test instrument 240 for tandem inspection, as shown below. Figures 3 to 5The inspection process is described. Furthermore, the inspection protocol can be executed, for example, in response to an overall test plan established from a main test instrument 240 or by another remote system, such as computing facility 208 or general-purpose computing devices like laptop computer 232, tablet computer, smartphone, desktop computer, etc. As an illustrative example, the test plan can be established according to published standards or regulations, and the test plan can be executed at initial manufacturing or cyclically for continuous monitoring.

[0024] Front-end circuitry 222 may be coupled to and controlled by one or more processor circuits, such as processor circuitry 202 included as part of test instrumentation 240. The processor circuitry may be coupled to memory circuitry to execute instructions, for example, causing test instrumentation 240 to perform one or more of the following related to inspection: coil excitation, signal acquisition, processing, or data storage, or to otherwise perform the techniques shown and described herein. Test instrumentation 240 may be communicatively coupled to other parts of system 200, for example, using a wired or wireless communication interface 220.

[0025] For example, the implementation of one or more techniques shown and described herein can be implemented on the onboard test instrument 240 or using other processing or storage facilities, such as computing facility 208 or general-purpose computing devices such as laptop computer 232, tablet computer, smartphone, desktop computer, etc. For example, processing tasks that would be very slow to execute on the onboard test instrument 240 or that exceed the capabilities of the test instrument 240 can be executed remotely (e.g., on a separate system) in response to a request from the test instrument 240. Similarly, the storage of inspection data or intermediate data such as a C-scan matrix can be implemented using a remote facility communicatively coupled to the test instrument 240. The test instrument may include a display 220 for presenting configuration information or results, for example, and an input device 222 for receiving operator commands, configuration information, or responses to queries. The input device 222 may include one or more of the following: keyboard, trackball, function keys or soft keys, mouse interface, touch screen, stylus, voice, gesture, etc.

[0026] Figure 3 An example of an inspection layout 300 based on this topic is shown. Figure 3This is a top view looking down at the surface of the object. The inspection setup 300 may include a first probe 302, a second probe 304, and a target 310 (e.g., the object being inspected). The first probe 302 and the second probe 304 may be provided as ECA probes as described above (e.g., ECA probe assembly 100). The first probe and the second probe 302 may be positioned on or near the surface of the target 310. The target 310 may, for example, be a track, pipe, or other component to be inspected. The probe sensitivity axis of the first probe 302 may be positioned in a first location. For example, it may be positioned at the normal position to the scan axis, for example, where the array axis is perpendicular to the scan axis.

[0027] The first probe 302 and the second probe 304 can be provided as orientation sensors; thus, they can detect anomalies in a predetermined orientation based on their respective sensitivity axes. The first probe 302 can be configured to detect properties or anomalies (e.g., interference in eddies) in two directions: longitudinal orientation (L. orientation) and lateral orientation (T. orientation) relative to the scan axis. That is, the longitudinal orientation can be parallel to the scan axis, and the lateral orientation can be perpendicular to the scan axis; therefore, the longitudinal and lateral orientations can be orthogonal to each other.

[0028] The second probe 304 can be located on or near the surface of the target 310. For example, the second probe 304 can be positioned adjacent to the first probe 302 relative to the scanning axis. The probe sensitivity axis of the second probe 304 can be arranged in a second position, which may differ from the first position of the first probe 302. For example, the probe sensitivity axis of the second probe 304 can be positioned at an angle (e.g., not perpendicular) relative to the scanning axis. For example, the probe sensitivity axis of the second probe 304 can be positioned at an angle of approximately 45° relative to the scanning axis. The second probe 302 can be configured to detect properties or anomalies (e.g., interference in eddies) in two orientations: a tilted longitudinal orientation and a tilted lateral orientation relative to the scanning axis.

[0029] As described above, the first probe 302 and the second probe 304 can be coupled to one or more test instruments to perform cascade testing. Furthermore, Figure 3 Two probes are shown for illustrative purposes, but more than two probes can be provided to perform cascaded inspections; the sensitivity axis of each probe can be positioned at different angles relative to the scan axis to detect properties or anomalies in different orientations.

[0030] Figure 4This is a flowchart of an inspection process 400 according to an example of this subject matter. The inspection process 400 can be performed using the aforementioned inspection components (e.g., inspection arrangement 300). At 402, two or more oriented ECA probes can be positioned on or near the surface of the object under test. The two or more ECA probes can be positioned at different sensitivity angles relative to the scanning axis. As discussed above, each ECA probe can detect abnormalities in two orientations (e.g., longitudinal and lateral orientations relative to the probe's sensitivity axis).

[0031] At position 404, the location of a sensor (e.g., a coil) within the ECA probe can be determined and encoded into the system. For example, if sensors are arranged in multiple columns, their positions relative to each other can be determined and encoded. This is because sensors in different columns may detect the same anomaly (e.g., a lateral anomaly) at different times. A sensor in a front column may detect the anomaly before a sensor in a rear column. The encoded sensor location information can be used to realign sensor data.

[0032] At position 406, inspection data, such as c-scan data, can be received from the ECA probe. The c-scan data from the probe can be normalized data based on reference data of the object under test. The reference data can be obtained from previous calibration procedures, manufacturing specifications, or other suitable sources. As mentioned above, the c-scan data for each ECA probe can include anomalies detected in two orientations (e.g., indications). The c-scan data can be provided as a two-dimensional surface map. The c-scan data can be captured as the target moves, for example, along a conveyor belt.

[0033] At 408, c-scan data from the ECA probes can be combined. If one or more sets of c-scan data include indications, these c-scan data can be combined in a manner that preserves the indications—including their orientation. For example, the sensitivity axes of the probes (e.g., two probes) can be determined based on the indications. Thus, the indication at a particular location can be classified as belonging to one of four axes (e.g., longitudinal, lateral, tilt longitudinal, tilt lateral) by: checking which probe displays the largest absolute value, which narrows the indication at the particular location to two axes (e.g., longitudinal or lateral, or tilt longitudinal or tilt lateral); and checking the sign of the value, which narrows the indication at the particular location to one axis. When using more than two probes, the spatial location of the sensors can be determined and encoded to compare the indications and determine the appropriate location. Combining the c-scan data can include accumulating the indications at each orientation detected by the ECA probes (e.g., position summation).

[0034] At 410, different indicators in the combined c-scan data can be merged to generate a pattern. For example, indicators can be merged to form continuous or semi-continuous (e.g., for discontinuous properties) lines. Merging can be performed based on proximity thresholds of different indicators. For example, if one indicator is within a proximity threshold of another indicator, interpolation or similar techniques can be used to merge the two indicators to form a pattern.

[0035] At position 412, pattern recognition can be performed on the generated pattern. Different patterns associated with different anomalies (e.g., bumps, weld defects) can be stored in memory. The generated pattern can be compared with the stored patterns to determine whether the generated pattern matches one of the stored patterns.

[0036] At point 414, a notification can be generated based on matching the generated pattern with a stored pattern. The notification may include an audible alarm. The notification may include displaying to a user (e.g., a technician) an alert about the detected pattern and the matched anomaly. For example, the generated pattern can be displayed to the technician, and the technician can be notified that the generated pattern matches the pattern of a matched anomaly (e.g., a bump). In another example, this step can be automated, and the notification can be internal to the system.

[0037] Figure 5 A graphical representation of an inspection process according to an example of this subject is shown. Image 502 shows an anomaly on the surface of the object being tested. As shown, the anomaly may be hook-shaped. Next, different sets of inspection data (e.g., c-scans) can be obtained. Image 504 shows an orthogonal c-scan obtained from an ECA probe whose sensitivity axis is positioned perpendicular to the scan axis. Image 504 shows indications of lateral and longitudinal orientations relative to the scan axis.

[0038] Figure 506 illustrates a tilted c-scan obtained from an ECA probe whose sensitivity axis is positioned at an angle relative to the scan axis. Figure 506 shows indications of two orientations: a tilted lateral orientation and a tilted longitudinal orientation relative to the scan axis. Furthermore, more than two scans can be obtained, each at a different angle relative to the scan axis. The c-scan can be obtained using a single probe or using the same probe that scans the surface sequentially at specified angles.

[0039] Image 508 shows the combined c-scan, which combines the indications from the individual c-scans in images 504 and 506. As shown, image 508 combines the indications from image 504 in both lateral and longitudinal orientations, and the indications from image 506 in both oblique lateral and oblique longitudinal orientations.

[0040] Figure 510 illustrates the merged composite based on the combined c-scans, which can be generated by merging different indicators from the combined c-scans. Different indicators can be merged into continuous or semi-continuous lines in a segmented manner or according to spline techniques or other analytical (e.g., parametric) models.

[0041] The merged composite can be stored and displayed to technicians. The merged composite can also be compared with stored patterns (e.g., pattern templates) corresponding to different anomaly types. If a match is found, the technician can be notified of the match and the corresponding anomaly of the matched pattern. For example, the merged composite in image 510 can match a stored pattern about a bump; therefore, the technician can be notified that a bump has been detected.

[0042] The techniques shown and described herein can be used as follows Figure 2 The inspection system 200 shown may be used as part or in whole, or otherwise employed as described below. Figure 6 The machine in question is 600 to perform the operation. Figure 6 A block diagram is shown illustrating an example of a machine 600 on which any one or more of the techniques (e.g., methods) discussed herein can be performed. In various examples, machine 600 may operate as a standalone device or may be connected (e.g., networked) to other machines. In a networked deployment, machine 600 may operate as a server machine, a client machine, or both in a server-client network environment. In the examples, machine 600 may act as a peer-to-peer (P2P) (or other distributed) network environment. Machine 600 may be a personal computer (PC), tablet device, set-top box (STB), personal digital assistant (PDA), mobile phone, web application, network router, switch, or bridge, or any machine capable of (sequentially or otherwise) executing instructions specifying actions to be taken by that machine. Furthermore, although only a single machine is shown, the term "machine" should also be considered to include any collection of machines that individually or collectively execute a set (or more) of instructions to perform any one or more methods discussed herein, such as cloud computing, Software as a Service (SaaS), and other computer cluster configurations.

[0043] As described herein, examples may include logic or multiple components or mechanisms, or may be operated by logic or multiple components or mechanisms. A circuit system is a collection of circuits implemented in a tangible entity including hardware (e.g., simple circuits, gates, logic, etc.). The relationships between circuit system components can be flexible over time and due to potential hardware variability. A circuit system includes components that can perform a specified operation individually or in combination during operation. In the examples, the hardware of the circuit system may be immutably designed to perform a specified operation (e.g., hardwired). In the examples, the hardware including the circuit system may include variable-connected physical components (e.g., execution units, transistors, simple circuits, etc.), which include computer-readable media that are physically modified (e.g., magnetically, electrically, or via changes in physical states or other physical characteristics, etc.) to encode instructions for a specified operation. When connecting physical components, the potential electrical characteristics of the hardware composition may, for example, change from insulating to conductive or vice versa. Instructions enable embedded hardware (e.g., execution units or loading mechanisms) to hardware-wise create components of the circuit system via variable connections to perform a portion of a specified operation during operation. Therefore, when the device is in operation, the computer-readable medium is communicatively coupled to other components of the circuit system. In this example, any physical component can be used in more than one component of more than one circuit system. For example, in operation, an execution unit can be used at one point in time in a first circuit of a first circuit system and can be reused at different points in time by a second circuit in the first circuit system or a third circuit in the second circuit system.

[0044] Machine (e.g., computer system) 600 may include a hardware processor 602 (e.g., a central processing unit (CPU), a graphics processing unit (GPU), a hardware processor core, or any combination thereof), main memory 604, and static memory 606, some or all of which may communicate with each other via interconnect (e.g., bus) 608. Machine 600 may also include a display unit 610, an alphanumeric input device 612 (e.g., a keyboard), and a user interface (UI) navigation device 614 (e.g., a mouse). In the example, display unit 610, input device 612, and UI navigation device 614 may be a touchscreen display. Machine 600 may additionally include a storage device (e.g., a drive unit) 608, a signal generation device 618 (e.g., a speaker), a network interface device 620, and one or more sensors 616, such as a global positioning system (GPS) sensor, a compass, an accelerometer, or other sensors. Machine 600 may include an output controller 628, for example, serial (e.g., Universal Serial Bus (USB), parallel, or other wired or wireless (e.g., infrared (IR), near field communication (NFC), etc.) connection, to communicate with or control one or more peripheral devices (e.g., printers, card readers, etc.).

[0045] Storage device 622 may include a machine-readable medium 608 on which one or more sets of data structures or instructions 624 (e.g., software) are stored, said set of data structures or instructions 624 embodying or being used by any one or more of the techniques or functions described herein. Instructions 624 may also reside wholly or at least partially within main memory 604, static memory 606, or hardware processor 602 during execution by machine 600. In this example, one or any combination of hardware processor 602, main memory 604, static memory 606, or storage device 626 may constitute a machine-readable medium.

[0046] Although machine-readable medium 622 is shown as a single medium, the term "machine-readable medium" can include a single medium or multiple media (e.g., a centralized or distributed database and / or associated caches and servers) configured to store one or more instructions 624.

[0047] The term "machine-readable medium" can include any medium capable of storing, encoding, or carrying instructions for use by machine 600 and to cause machine 600 to perform any one or more of the technologies of this disclosure, or capable of storing, encoding, or carrying data structures used by or associated with such instructions. Examples of non-limiting machine-readable media can include solid-state memory, as well as optical and magnetic media. Therefore, machine-readable media are not transiently propagating signals. Specific examples of high-capacity machine-readable media can include: non-volatile memory, such as semiconductor memory devices (e.g., electrically programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM)) and flash memory devices; magnetic or other phase-change or state-changing memory circuits; magnetic disks, such as internal hard disks and removable disks; magneto-optical disks; and CD-ROMs and DVD-ROMs.

[0048] Commands 624 can also be sent or received via the communication network 626 through the network interface device 620 using a transmission medium, utilizing any of several transport protocols (e.g., Frame Relay, Internet Protocol (IP), Transmission Control Protocol (TCP), User Datagram Protocol (UDP), Hypertext Transfer Protocol (HTTP), etc.). Example communication networks may include local area networks (LANs), wide area networks (WANs), packet data networks (e.g., the Internet), mobile phone networks (e.g., cellular networks), conventional telephone (POTS) networks, and wireless data networks (e.g., referred to as…). The Institute of Electrical and Electronics Engineers (IEEE) 802.22 family of standards, known as The IEEE 802.26 family of standards, the IEEE 802.25.4 family of standards, peer-to-peer (P2P) networks, etc. are examples. In the example, network interface device 620 may include one or more physical jacks (e.g., Ethernet, coaxial, or telephone jacks) or one or more antennas to connect to communication network 626. In the example, network interface device 620 may include multiple antennas to perform wireless communication using at least one of single-input multiple-output (SIMO), multiple-input multiple-output (MIMO), or multiple-input single-output (MISO) technologies. The term "transmission medium" should be considered to include any intangible medium capable of storing, encoding, or carrying instructions for execution by machine 600 and includes digital or analog communication signals or other intangible media to facilitate communication of such software.

[0049] Various annotations

[0050] Each of the above non-limiting aspects may exist independently, or may be combined in various permutations or combinations with one or more of the other aspects or other topics described herein.

[0051] The above detailed description includes reference to the accompanying drawings, which form part of the detailed description. The drawings illustrate, by way of illustration, specific implementations in which the invention can be practiced. These implementations are generally also referred to as “examples.” Such examples may include elements other than those shown or described. However, the inventors also contemplate examples provided herein that contain only those elements shown or described. Furthermore, the inventors also contemplate examples (or one or more aspects thereof) using any combination or arrangement of those elements shown or described with respect to specific examples (or one or more aspects thereof) shown or described herein or with respect to other examples (or one or more aspects thereof).

[0052] In the event of any inconsistency between the usage in this document and any document incorporated by reference, the usage in this document shall prevail.

[0053] In this document, as is common in patent literature, the terms "a" or "an" are used to include one or more, independent of any other instances or uses of "at least one" or "one or more". In this document, unless otherwise indicated, the term "or" is used to indicate a non-exclusive "or", such that "A or B" includes "A but not B", "B but not A", and "A and B". In this document, the terms "including" and "in which" are used as concise English equivalents to the corresponding terms "comprising" and "wherein". Furthermore, in the appended claims, the terms "including" and "comprising" are open-ended, meaning that a system, apparatus, article, combination, formulation, or process that includes elements other than those listed after such terms in the claim is still considered to fall within the scope of that claim. Moreover, in the appended claims, the terms "first", "second", and "third", etc., are used only as designations and are not intended to impose numerical requirements on their objects.

[0054] The methods described herein may be implemented, at least in part, by a machine or computer. Some examples may include computer-readable or machine-readable media encoded with instructions capable of operating to configure an electronic device to perform the methods described in the examples above. Implementations of such methods may include code, such as microcode, assembly language code, high-level language code, etc. Such code may include computer-readable instructions for performing various methods. The code may form part of a computer program product. Additionally, in the examples, the code may be tangibly stored on one or more volatile, non-transitory, or non-volatile tangible computer-readable media, for example, during execution or at other times. Examples of such tangible computer-readable media may include, but are not limited to, hard disks, removable disks, removable optical discs (e.g., compact discs and digital video discs), magnetic tape cartridges, memory cards or memory sticks, random access memory (RAM), read-only memory (ROM), etc.

[0055] The above description is intended to be illustrative and not restrictive. For example, the examples (or one or more aspects of the examples) described above can be used in combination with each other. For example, those skilled in the art can use other implementations after consulting the above description. An abstract is provided to enable the reader to quickly determine the nature of the technical disclosure. The abstract is submitted based on the understanding that it will not be used to interpret or limit the scope or meaning of the claims. In addition, in the detailed description above, various features may be combined to simplify the disclosure. This should not be construed as meaning that unclaimed features are necessary for any claim. Rather, the subject matter of the invention may lie in fewer than all features of a particular disclosure. Therefore, the appended claims are incorporated herein as examples or implementations, each claim existing independently as a separate implementation, and it is contemplated that such implementations can be combined with each other in various combinations or arrangements. The scope of the invention should be determined by reference to the appended claims and the full scope of their equivalents.

Claims

1. A method comprising: Receive a first set of eddy current test data, the first set of eddy current test data providing interference indication data obtained in a first orientation relative to a first sensitivity axis; Receive a second set of eddy current test data, which provides interference indication data in a second orientation relative to a second sensitivity axis, the second orientation being different from the first orientation; The first set of inspection data and the second set of inspection data are combined to generate a combined dataset that retains the interference indication data on the first orientation and the second orientation; Generate anomalous syntheses based on the combined dataset; The composite is compared with the stored pattern information; as well as A matching notification is generated based on a comparison of the synthesized compounds. The notification includes information about the type of anomaly that matches the composition.

2. The method according to claim 1, wherein, The first set of eddy current inspection data is obtained using a first directional probe, and the second set of eddy current inspection data is obtained using a second directional probe, wherein the first set of eddy current inspection data and the second set of eddy current inspection data include c-scan data.

3. The method according to claim 2, further comprising: The position information of the sensors in the first and second directional probes is encoded.

4. The method according to claim 1 or 2, wherein, The first set of eddy current inspection data also provides interference indication data obtained in a third orientation, and the second set of eddy current inspection data provides interference indication data obtained in a fourth orientation. Wherein, the first orientation and the third orientation are orthogonal to each other, and the second orientation and the fourth orientation are orthogonal to each other.

5. The method according to claim 1 or 2, wherein, The first set of eddy current test data and the second set of eddy current test data were obtained using an eddy current array ECA probe.

6. An inspection system, comprising: A first probe, configured to obtain a first set of eddy current inspection data from an object, thereby providing indication information in a first orientation relative to a first sensitivity axis; A second probe, configured to obtain a second set of eddy current inspection data from the object, thereby providing indication information in a second orientation relative to a second sensitivity axis; as well as A processor configured to: combine a first set of eddy current inspection data and a second set of eddy current inspection data to generate a combined dataset that retains indication information on the first orientation and the second orientation, and to merge the indication information in the combined dataset to generate an anomalous composite. The processor is further configured to: The composite is compared with the stored pattern information; and A matching notification is generated based on a comparison of the synthesized compounds. The notification includes information about the type of anomaly that matches the composition.

7. The inspection system according to claim 6, wherein, The first probe and the second probe include eddy current arrays.

8. The inspection system according to claim 6 or 7, wherein, The first probe and the second probe are directional probes.

9. The inspection system according to claim 6 or 7, wherein, The processor is also configured to encode the position information of the sensors in the first probe and the second probe.

10. The inspection system according to claim 6 or 7, wherein, The first set of eddy current inspection data also provides indication information in a third orientation, and the second set of eddy current inspection data provides indication information in a fourth orientation. Wherein, the first orientation and the third orientation are orthogonal to each other, and the second orientation and the fourth orientation are orthogonal to each other.

11. A machine-readable medium containing instructions that, when executed by a machine, cause the machine to perform operations, the operations including: Receive a first set of eddy current test data, the first set of eddy current test data providing interference indication data obtained in a first orientation relative to a first sensitivity axis; Receive a second set of eddy current test data, which provides interference indication data in a second orientation relative to a second sensitivity axis, the second orientation being different from the first orientation; The first set of inspection data and the second set of inspection data are combined to generate a combined dataset that retains the interference indication data on the first orientation and the second orientation; Generate anomalous syntheses based on the combined dataset; The composite is compared with the stored pattern information; as well as A matching notification is generated based on a comparison of the synthesized compounds. The notification includes information about the type of anomaly that matches the composition.

12. The machine-readable medium of claim 11, wherein, The first set of eddy current inspection data is obtained using a first directional probe, and the second set of eddy current inspection data is obtained using a second directional probe, wherein the first set of eddy current inspection data and the second set of eddy current inspection data include c-scan data.

13. The machine-readable medium of claim 12, further comprising: The position information of the sensors in the first and second directional probes is encoded.

14. The machine-readable medium according to claim 11 or 12, wherein, The first set of eddy current inspection data also provides interference indication data obtained in a third orientation, and the second set of eddy current inspection data provides interference indication data obtained in a fourth orientation. Wherein, the first orientation and the third orientation are orthogonal to each other, and the second orientation and the fourth orientation are orthogonal to each other.

15. The machine-readable medium according to claim 11 or 12, wherein, The first set of eddy current test data and the second set of eddy current test data were obtained using an eddy current array ECA probe.

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