A sputtering silver system and a sputtering silver process

Abstract

The application relates to a silver spraying system and a silver spraying process. The silver spraying system comprises a high-speed spraying tank, a spraying power supply, a mother tank and an automatic silver ion supplementing system. The automatic silver ion supplementing system comprises a silver preparation tank, a silver preparation power supply and a control host. The control host is used for detecting the current of the spraying power supply through a signal line and controlling the silver preparation power supply to output a silver preparation current with the same size as the spraying power supply. When silver ions in the electroplating solution in the high-speed spraying tank are consumed and the silver ion concentration decreases, silver ions generated through the silver preparation tank are supplemented into the high-speed spraying tank, so that the silver ions are automatically supplemented, the concentration of the silver ions in the high-speed spraying tank is maintained, the silver plating effect of the workpiece to be plated is improved, and the convenience of supplementing silver ions in the electroplating solution is improved. The mother tank can play a buffering role to reduce the influence of the increased electroplating solution on the concentration of the electroplating solution remaining in the high-speed spraying tank, so as to ensure the spraying effect of the workpiece to be plated.

Description

Technical Field

[0001] This application relates to the technical field of high-speed silver spraying, and in particular to a silver spraying system and silver spraying process. Background Technology

[0002] With the rapid development of modern industry and technology, mechanical parts often require different metal plating layers on their surfaces depending on the application scenario, enabling the parts to better adapt to the application field. The plating metal is usually applied to the surface of the part to be plated through electroplating, and high-speed spray plating is one such electroplating process. High-speed spray plating typically involves the part to be plated acting as the cathode and a spray gun acting as the anode. A certain voltage is applied between the cathode and anode, while the electroplating solution is sprayed at high speed onto the part. Within the sprayed area, a circuit is formed between the cathode and anode through the electroplating solution, allowing current to flow through the sprayed area and generating electrodeposition, thus depositing the plating metal onto the surface of the part. High-speed spray plating is often combined with spot plating or selective plating devices, offering advantages of selectivity and localization.

[0003] During the silver spraying process, the concentration of silver ions in the electroplating solution needs to be monitored in real time to ensure there are sufficient silver ions to form a silver layer on the surface of the workpiece. The silver ions are typically provided by potassium silver cyanide in the electroplating solution. Currently, when the silver ion concentration is insufficient, potassium silver cyanide is often added manually to replenish the electroplating solution. However, potassium silver cyanide is supplied by specialized companies, requiring operators to purchase it before adding it, making the silver ion replenishment process rather inconvenient. Summary of the Invention

[0004] To improve the convenience of replenishing silver ions in electroplating solutions, this application provides a silver spraying system and a silver spraying process.

[0005] On one hand, the silver spraying system provided in this application adopts the following technical solution: A silver spraying system includes a high-speed spraying tank, a spraying power supply, a master tank, and an automatic silver ion replenishment system. The automatic silver ion replenishment system includes a silver-making tank, a silver-making power supply, and a control host. An ion exchange membrane is provided in the silver-making tank, dividing the silver-making tank into an anode section and a cathode section. A silver plate is provided in the anode section and connected to the positive electrode of the silver-making power supply. An inert metal is provided in the cathode section and connected to the negative electrode of the silver-making power supply. The ion exchange membrane is also used to prevent silver ions from moving from the anode section to the cathode section. The control host is used to detect the current of the spraying power supply through a signal line and control the silver-making power supply to output a silver-making current of the same magnitude as the spraying power supply. A first pumping pipe and a first return pipe are provided between the master tank and the anode section of the silver-making tank. A water pipe is provided, with a first pumping pipe connected to a first pumping component, which circulates the electroplating solution in the anode section of the mother tank and the silver-making tank. A circulation pipe is connected to the cathode section of the silver-making tank, and a third pumping component is connected to the circulation pipe, which circulates the chemical solution in the cathode section. The high-speed spray plating tank is equipped with a partition, dividing it into a receiving section and a receiving section. A second pumping pipe is provided between the mother tank and the receiving section of the high-speed spray plating tank, and a second pumping component is connected to the second pumping component. The second pumping component pumps the electroplating solution in the mother tank to the receiving section. The receiving section is used to recover the electroplating solution after electroplating. A second return water pipe is provided between the mother tank and the receiving section of the high-speed spray plating tank, through which the electroplating solution in the receiving section flows back to the mother tank. The mother tank is located below the high-speed spray plating tank and the silver-making tank.

[0006] By adopting the above technical solution, an ion exchange membrane is installed between the anode and cathode of the silver-forming tank. This membrane prevents silver ions from moving from the anode to the cathode, reducing the likelihood that silver ions generated at the anode will move to the cathode under the influence of current and be reduced to elemental silver. This allows the silver ions to remain at the anode of the silver-forming tank. When the silver ion concentration in the electroplating solution in the high-speed spray plating tank decreases due to the consumption of silver ions, silver ions generated in the silver-forming tank replenish the high-speed spray plating tank, thus achieving automatic silver ion replenishment. Simultaneously, silver ions are generated in the silver-forming tank while being consumed in the high-speed spray plating tank, replenishing the silver ions in the high-speed spray plating tank. This replenishes the silver ion concentration in the electroplating solution, maintains the silver ion concentration in the high-speed spray plating tank, improves the silver plating effect on the workpiece, and enhances the convenience of replenishing silver ions in the electroplating solution. The master tank acts as a buffer. The silver ions generated in the silver preparation tank are first transferred to the master tank and premixed in the master tank to make the distribution of silver ions in the master tank more uniform. Then the electroplating solution in the master tank is transported to the high-speed spray plating tank to reduce the impact of the increased electroplating solution on the concentration of the electroplating solution remaining in the high-speed spray plating tank, so as to ensure the spray plating effect of the parts to be plated.

[0007] The master tank is located below the high-speed spray plating tank and the silver preparation tank. The first, second, and third pumping components enable the electroplating solution to circulate between the master tank, the high-speed spray plating tank, and the silver preparation tank, while also generating a stirring effect, thereby improving the uniformity of silver ion distribution in the electroplating solution.

[0008] Preferably, the silver spraying system further includes a high-speed spot plating device. The high-speed spot plating device includes a mounting plate and a spot plating mold, a pressure belt assembly, and a sheet feeding assembly mounted on the mounting plate. The spot plating mold includes a spot plating roller, an anode nozzle plate, and a water tank. The spot plating roller is provided with spot plating holes. The anode nozzle plate is provided with multiple anode nozzles. The water tank is located inside the spot plating roller. The anode nozzle plate is located on the water tank. The anode nozzle plate is connected to the positive terminal of the spraying power supply. The bottom of the water tank is provided with a water inlet. The water inlet is connected to the receiving part through a fourth water pumping pipe. The fourth water pumping pipe is connected to a fourth water pumping component. The fourth water pumping component pumps the electroplating solution in the receiving part into the water tank and sprays it out from the anode nozzle.

[0009] By adopting the above technical solution, the high-speed spot plating device can achieve continuous electroplating with high efficiency.

[0010] Preferably, the water tank is further provided with a flow stabilizer plate, and the flow stabilizer plate is provided with a first water permeable hole, through which the electroplating solution overflows to the top of the flow stabilizer plate.

[0011] By adopting the above technical solution, the water flow becomes more stable after being blocked by the flow stabilizer plate, the water pressure difference at various points is reduced, and the water output of each anode nozzle tends to be consistent, thereby improving the uniformity of electroplating.

[0012] Preferably, the flow stabilizer plate has an arc-shaped structure and is concentric with the anode nozzle plate.

[0013] By adopting the above technical solution, the flow path length of the electroplating solution can be made more consistent, which also helps to reduce the water pressure difference at various points.

[0014] Preferably, the high-speed spot plating device further includes a flexible diaphragm and a top rod. The flexible diaphragm is disposed inside the water tank and is used to separate the water tank. The flexible diaphragm is provided with a second water permeable hole, through which the electroplating solution overflows to the top of the flexible diaphragm. The anode nozzle plate is provided with a sliding hole, and the top rod is slidably disposed in the sliding hole. The lower end of the top rod is fixedly disposed on the flexible diaphragm, and the upper end is used to pass through the spot plating hole and abut against the material sheet after the flexible diaphragm is expanded by the electroplating solution.

[0015] By adopting the above technical solution, the flexible diaphragm has the same flow stabilizing effect as the flow stabilizer plate, and it can expand and bulge under water pressure, driving the push rod to move to abut against the non-electroplated area of ​​the material sheet to achieve local sealing.

[0016] Preferably, a return spring is also fitted on the top rod to retract the top rod and disengage it from the plating roller when the electroplating solution does not expand the flexible diaphragm.

[0017] By adopting the above technical solution, the structure further ensures that the top rod retracts to a safe position when not spraying, without affecting the rotation of the spot plating roller.

[0018] Preferably, the top of the top rod is provided with insulating soft rubber.

[0019] By adopting the above technical solution, the insulating soft rubber is flexible, and after being pressed against the material sheet, it has good sealing performance and can also avoid short circuit caused by direct electrical conduction between the anode nozzle plate and the material sheet.

[0020] Preferably, the anode nozzle is arranged around the sliding hole.

[0021] By adopting the above technical solutions, the electroplating solution can enter the plating holes more accurately, avoiding uneven electroplating. In addition, it can also reduce the ineffective circulation of the electroplating solution, thus reducing energy waste.

[0022] Preferably, the flexible diaphragm is a water-permeable fabric.

[0023] By adopting the above technical solution, it is not necessary to drill holes in the flexible diaphragm, and it is not easily damaged.

[0024] On the one hand, another technical solution provided in this application is: a silver spraying process, which uses the silver spraying system described above for spraying.

[0025] In summary, this application includes at least one of the following beneficial technical effects:

[0026] 1. When the silver ions in the electroplating solution in the high-speed spray plating tank are consumed and the silver ion concentration decreases, the current signal at the time of consumption notifies the silver-making machine to produce the consumed silver ions and replenish the silver ions to the high-speed spray plating tank. This achieves automatic replenishment of silver ions, maintains the concentration of silver ions in the high-speed spray plating tank, improves the silver plating effect of the workpiece, and enhances the convenience of replenishing silver ions in the electroplating solution.

[0027] 2. The master tank acts as a buffer, making the distribution of silver ions in the master tank more uniform. Then, the electroplating solution in the master tank is transported to the high-speed spray plating tank to reduce the impact of the increased electroplating solution on the concentration of the electroplating solution remaining in the high-speed spray plating tank, so as to ensure the spray plating effect of the parts to be plated.

[0028] 3. The high-speed spot plating device can achieve continuous electroplating with high efficiency. The addition of a flow stabilizer plate makes the water flow more stable, reduces the water pressure difference at various points, and makes the water output of each anode nozzle more consistent, thereby improving the uniformity of electroplating. Attached Figure Description

[0029] Figure 1 A schematic diagram of the silver sputtering system described in Embodiment 1 of this application is illustrated.

[0030] Figure 2 A schematic diagram of the silver sputtering system described in Embodiment 2 of this application is shown;

[0031] Figure 3 A schematic diagram of the sheet material that can be processed in Embodiment 2 of this application is shown (the shaded area is the silver-plated area);

[0032] Figure 4 A front view of the high-speed spot plating apparatus in Embodiment 2 of this application is shown;

[0033] Figure 5 A perspective view of the high-speed spot plating apparatus in Embodiment 2 of this application is shown;

[0034] Figure 6 A perspective view of the dot plating mold described in Embodiment 2 of this application is illustrated;

[0035] Figure 7 An exploded view of the dot plating mold described in Embodiment 2 of this application is shown;

[0036] Figure 8 A cross-sectional schematic diagram of the dot plating mold described in Embodiment 2 of this application is illustrated;

[0037] Figure 9 A schematic diagram of the sheet material that can be processed in Embodiment 3 of this application is shown (the shaded area is the silver-plated area);

[0038] Figure 10 A cross-sectional schematic diagram of the dot plating mold described in Embodiment 3 of this application is illustrated;

[0039] Figure 11 It is illustrated Figure 10 Enlarged view of point A in the middle.

[0040] Explanation of reference numerals in the attached drawings: 1. High-speed spray plating tank; 11. Baffle plate; 12. Receiving section; 13. Receiving section; 2. Spray plating power supply; 3. Mother tank; 31. First pumping pipe; 32. First return water pipe; 33. First pumping component; 34. Second pumping pipe; 35. Second pumping component; 36. Second return water pipe; 4. Silver preparation tank; 41. Ion exchange membrane; 42. Anode section; 43. Cathode section; 44. Circulation pipe; 45. Third pumping component; 5. Silver preparation power supply; 6. Control host; 61. Signal line; 7. Silver plate; 8. Inert metal; 9. High-speed spot plating device; 91. Mounting plate; 92. 921. Spot plating mold; 921. Spot plating roller; 9211. Spot plating hole; 922. Anode nozzle plate; 9221. Anode nozzle; 9222. Sliding hole; 923. Water tank; 9231. Water inlet; 9232. Fourth water pumping pipe; 9233. Fourth water pumping component; 93. Material pressing belt assembly; 94. Material feeding assembly; 95. Flow stabilizer plate; 951. First water permeable hole; 96. Flexible diaphragm; 961. Second water permeable hole; 97. Push rod; 971. Insulating soft rubber; 98. Return spring; 100. Part to be plated; 101. Material sheet; 200. Electroplating solution; 300. Spray gun. Detailed Implementation

[0041] The following is in conjunction with the appendix Figure 1-11 This application will be described in further detail.

[0042] Example 1:

[0043] Reference Figure 1This application discloses a silver spraying system, including a high-speed spraying tank 1, a spraying power supply 2, a master tank 3, and an automatic silver ion replenishment system. The automatic silver ion replenishment system includes a silver-making tank 4, a silver-making power supply 5, and a control host 6. The silver-making tank 4 is equipped with an ion exchange membrane 41, which divides the silver-making tank 4 into an anode section 42 and a cathode section 43. The anode section 42 is equipped with a silver plate 7, which is connected to the positive electrode of the silver-making power supply 5. The cathode section 43 is equipped with an inert metal 8, which is connected to the negative electrode of the silver-making power supply 5. The ion exchange membrane 41 is also used to prevent silver ions from moving from the anode section 42 to the cathode section 43. The control host 6 is used to detect the current of the spraying power supply 2 through a signal line 61 and control the silver-making power supply 5 to output a silver-making current of the same magnitude as the spraying power supply 2. A first pumping pipe 31 and a first return pipe 32 are provided between the master tank 3 and the anode section 42 of the silver-making tank 4. The first pumping pipe 31 is connected to a first pumping component 33. The first pumping component 33 circulates the electroplating solution within the anode section 42 of the mother tank 3 and the silver-making tank 4. The cathode section 43 of the silver-making tank 4 is connected to a circulation pipe 44, which is connected to a third pumping component 45. The third pumping component 45 circulates the plating solution within the cathode section 43. The high-speed spray plating tank 1 is internally equipped with a partition 11, dividing it into a receiving section 12 and a receiving section 13. A partition is provided between the mother tank 3 and the receiving section 12 of the high-speed spray plating tank 1. A second water-pumping pipe 34 is provided, and the second water-pumping pipe 34 is connected to a second water-pumping component 35. The second water-pumping component 35 pumps the electroplating solution 200 in the mother tank 3 to the receiving part 12. The receiving part 13 is used to recover the electroplating solution after electroplating. A second water return pipe 36 is provided between the mother tank 3 and the receiving part 13 of the high-speed spray plating tank 1. The electroplating solution 200 in the receiving part 13 flows back to the mother tank 3 through the second water return pipe 36. The mother tank 3 is located below the high-speed spray plating tank 1 and the silver making tank 4.

[0044] The electroplating solution 200 includes silver ions and free potassium cyanide. The positive terminal of the spraying power supply 2 is connected to the spray gun 300, and the negative terminal is connected to the workpiece 100 to be plated. The receiving part 12 is used to hold the electroplating solution, and the suction port of the spray gun 300 extends into the receiving part 12. The receiving part 13 is used to receive the electroplating solution dripping from the workpiece 100. By spraying the electroplating solution onto the workpiece 100 through the spray gun 300, the spraying power supply 2, the spray gun 300, the workpiece 100 to be plated, and the electroplating solution form a complete electroplating path. Thus, when the electroplating solution is sprayed onto the workpiece 100, the silver ions in the electroplating solution can be reduced to form elemental silver on the surface of the workpiece 100, thereby forming a silver plating layer.

[0045] The first pumping unit 33, the second pumping unit 35, and the third pumping unit 45 all use water pumps. The control host 6 is a module with a program. The control host 6 includes a receiving end, an input end, and an output end. The output end of the control host 6 is connected to the silver plate 7 in the silver-making tank 4 and acts as the anode of the silver-making tank 4. The input end of the control host 6 is connected to the inert electrode of the silver-making tank 4. The receiving end of the control host 6 is connected to a signal line 61, which is connected to the current circuit of the high-speed spray plating tank 1 and generates a current signal through the signal line 61. After receiving the current signal, the receiving end of the control host 6 calculates the current required to produce silver ions equal to the amount of silver ions consumed by the spray plating tank through the program of the control host 6. The current is output from the output end of the control host 6, passes through the silver-making tank 4, and is then input into the input end of the control host 6, forming a complete current path. The control host 6 acts as the power source for the silver-making tank 4, with the silver plate 7 as the anode and the inert metal 8 as the cathode, together forming an electrolytic cell. The circulation pipe 44 and the third pumping unit 45 can stir the cathode part 43 through circulation, thereby improving the uniformity of the liquid in the cathode part 43 and enhancing the conductivity of the cathode part 43.

[0046] The silver spraying process of the above-mentioned silver spraying system is that the chemical solution in the cathode part 43 of the silver preparation tank 4 includes any one of NaOH, KOH, NaCN or KCN. The concentration of NaOH, KOH, NaCN or KCN in the cathode part 43 is 5-10 g / L. The concentration of the electroplating solution in the anode part 42 and the high-speed spraying tank 1 is 80-100 g / L of silver ions and 15-25 g / L of free potassium cyanide.

[0047] The basic performance of the products processed by the silver spraying process described in this application meets the requirements of actual production and processing, and therefore the products can be applied to actual production and processing processes.

[0048] The principle of this embodiment is as follows: An ion exchange membrane 41 is provided between the anode and cathode of the silver preparation tank 4. The ion exchange membrane 41 can prevent silver ions from moving from the anode 42 to the cathode 43. The ion exchange membrane 41 can reduce the possibility that the silver ions generated at the anode will move to the cathode of the silver preparation tank 4 under the action of current and be reduced to elemental silver, so that the silver ions can remain in the anode 42 of the silver preparation tank 4. When the silver ions in the electroplating solution in the high-speed spray plating tank 1 are consumed and the silver ion concentration decreases, the silver ions generated by the silver preparation tank 4 are replenished to the high-speed spray plating tank 1, thereby realizing the automatic replenishment of silver ions and forming a circulation system for the consumption and replenishment of silver ions in the electroplating solution. While the high-speed spray plating tank 1 consumes silver ions, silver ions are generated in the silver preparation tank 4 and replenished to the high-speed spray plating tank 1, thereby realizing the replenishment of silver ions in the electroplating solution, maintaining the concentration of silver ions in the high-speed spray plating tank 1, improving the silver plating effect of the workpiece 100, and improving the convenience of replenishing silver ions in the electroplating solution. The mother tank 3 acts as a buffer. The silver preparation tank 4 first transfers the generated silver ions to the mother tank 3 and premixes them in the mother tank 3 to make the distribution of silver ions in the mother tank 3 more uniform. Then, the electroplating solution 200 in the mother tank 3 is transported to the high-speed spray plating tank 1 to reduce the impact of the increased electroplating solution on the concentration of the electroplating solution remaining in the high-speed spray plating tank 1, so as to ensure the spray plating effect of the workpiece 100.

[0049] The mother tank 3 is located below the high-speed spray plating tank 1 and the silver preparation tank 4. The first water pump 33, the second water pump 35 and the third water pump 45 can make the electroplating solution circulate between the mother tank 3, the high-speed spray plating tank 1 and the silver preparation tank 4, and at the same time generate a stirring effect, thereby improving the uniformity of silver ion distribution in the electroplating solution.

[0050] Example 2:

[0051] In Example 1, a spray gun 300 is used to spray the electroplating solution onto the part 100 to be plated, which is a traditional spray plating method. Figures 2 to 8In this embodiment, a high-speed spot plating device 9 is used to selectively spot plating or selectively plate sheet-like parts such as lead frames. The high-speed spot plating device 9 includes a mounting plate 91 and a spot plating mold 92, a pressure belt assembly 93, and a sheet feeding assembly 94 mounted on the mounting plate 91. The spot plating mold 92 includes a spot plating roller 921, an anode nozzle plate 922, and a water tank 923. The sheet 101 is pressed onto the spot plating roller 921 by the pressure belt assembly 93. The spot plating roller 921 has spot plating holes 9211, the anode nozzle plate 922 has multiple anode nozzles 9221, and the water tank 923 is... Inside the spot plating roller 921, the anode nozzle plate 922 is mounted on the water tank 923. The anode nozzle plate 922 is connected to the positive terminal of the plating power supply 2. The bottom of the water tank 923 is provided with a water inlet hole 9231. The water inlet hole 9231 is connected to the receiving part 12 through a fourth water suction pipe 9232. The fourth water suction pipe 9232 is connected to a fourth water suction component 9233. The fourth water suction component 9233 draws the electroplating solution in the receiving part 12 into the water tank 923 and sprays it out from the anode nozzle 9221.

[0052] Reference Figure 3 and Figure 8 The plating holes 9211 on the plating roller 921 correspond one-to-one with the areas to be plating on the sheet 101. The areas to be plating are rectangular. The plating solution sprayed from the anode nozzle 9221 is sprayed from the plating holes 9211 onto the areas to be plating. The sheet 101 is connected to the negative terminal of the plating power supply 2, and the anode nozzle plate 922 is connected to the positive terminal of the plating power supply 2. An electroplating circuit is formed through the plating solution, allowing metallic silver to be deposited in the areas to be plating. The sheet feeding assembly 94 enables the sheet 101 to advance in a step-by-step or continuous manner, achieving continuous electroplating with high efficiency.

[0053] Because there are many anode nozzles 9221 on the anode nozzle plate 922, and they are distributed in an arc shape with different heights, the flow of the electroplating solution in the water tank 923 is also relatively turbulent. Therefore, the anode nozzles 9221 at different positions have different water pressures and different flow rates of the electroplating solution, which affects the uniformity of electroplating.

[0054] Reference Figure 7 and Figure 8 The water tank 923 is further equipped with a flow stabilizing plate 95, which has a first water permeation hole 951. The electroplating solution overflows from the first water permeation hole 951 to the top of the flow stabilizing plate 95. The electroplating solution enters from the water inlet hole 9231 at the bottom of the water tank 923. After being blocked by the flow stabilizing plate 95, the water flow becomes more stable, the water pressure difference at various points is reduced, and the water output of each anode nozzle 9221 tends to be consistent, thereby improving the uniformity of electroplating. In this embodiment, the flow stabilizing plate 95 has an arc-shaped structure and is concentric with the anode nozzle plate 922, which makes the flow path length of the electroplating solution tend to be consistent, and also helps to reduce the water pressure difference at various points.

[0055] Example 3:

[0056] like Figure 9 As shown, some sheet materials 101 require electroplating to form a complete ring, with non-electroplated areas inside and outside the ring. The high-speed spot plating device 9 described above cannot achieve this because it is impossible to set up a structure to cover the non-electroplated areas inside the ring. The only option is to first place a mask or film on the sheet material 101, then perform electroplating, and finally remove the mask or film. This process is complex, time-consuming, and costly.

[0057] Reference Figure 10 and Figure 11 This embodiment adds a flexible diaphragm 96 and a top rod 97 to the second embodiment. The flexible diaphragm 96 is disposed inside the water tank 923 and is used to separate the water tank 923. The flexible diaphragm 96 is provided with a second water permeable hole 961, through which the electroplating solution overflows to the top of the flexible diaphragm 96. The anode nozzle plate 922 is provided with a sliding hole 9222, and the top rod 97 is slidably disposed inside the sliding hole 9222. The lower end of the top rod 97 is fixedly disposed on the flexible diaphragm 96, and the upper end is used to pass through the plating hole 9211 and abut against the material sheet 101 after the flexible diaphragm 96 is expanded by the electroplating solution.

[0058] The flexible diaphragm 96 is preferably made of permeable fabric. Like the flow stabilizer 95, the flexible diaphragm 96 has a flow-stabilizing function. Furthermore, because the flexible diaphragm 96 is deformable, during spray plating, it expands upwards under the plating solution, causing the push rod 97 to slide upwards within the sliding hole 9222. The push rod 97 passes through the spot plating hole 9211 and abuts against the non-plating area of ​​the sheet 101, sealing the non-plating area and preventing the plating solution from contacting it, thus preventing silver plating. In this embodiment, the sheet 101 requires a step-by-step feeding method. After a section of sheet 101 is electroplated, spray plating stops, and the water pressure in the water tank 923 decreases. A liquid extraction operation can also be performed to remove a portion or a period of plating solution from the water tank 923. When the supporting force below the flexible diaphragm 96 is insufficient, it will move downwards, causing the push rod 97 to move downwards synchronously. The push rod 97 disengages from the spot plating hole 9211, at which point a step-by-step feeding can be performed, followed by another spray plating operation, repeating the cycle.

[0059] Reference Figure 11 The push rod 97 is also fitted with a return spring 98, which is used to retract the push rod 97 to disengage from the plating roller 921 when the electroplating solution does not expand the flexible diaphragm 96. Structurally, this further ensures that the push rod 97 retracts to a safe position when not plating, without affecting the rotation of the plating roller 921.

[0060] Reference Figure 11The top of the push rod 97 is provided with insulating soft rubber 971. The insulating soft rubber 971 is flexible, and after pressing against the material sheet 101, it has good sealing performance and can also prevent the anode nozzle plate 922 from directly conducting electricity with the material sheet 101, thus avoiding short circuit.

[0061] In this embodiment, the anode nozzle 9221 is preferably arranged around the sliding hole 9222. This is because the electroplating solution can enter the spot plating hole 9211 more accurately, avoiding uneven electroplating, and also reducing the ineffective circulation of the electroplating solution, thus avoiding energy waste.

[0062] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A silver-plating system, characterized in that, The system includes a high-speed spray plating tank (1), a spray plating power supply (2), a master tank (3), and an automatic silver ion replenishment system. The automatic silver ion replenishment system includes a silver preparation tank (4), a silver preparation power supply (5), and a control host (6). The silver preparation tank (4) is equipped with an ion exchange membrane (41) that divides the silver preparation tank (4) into an anode part (42) and a cathode part (43). The anode part (42) is equipped with a silver plate (7) that is connected to the positive electrode of the silver preparation power supply (5). The cathode part (43) is equipped with an inert metal (8) that is connected to the negative electrode of the silver preparation power supply (5). The ion exchange membrane (41) is also used to prevent silver ions from moving from the anode part (42) to the cathode part (43). The control host (6) is used to detect the current of the spray plating power supply (2) through a signal line (61) and control the silver preparation power supply (5) to output a silver preparation current of the same magnitude as that of the spray plating power supply (2). A first pumping pipe (31) and a first return pipe (32) are provided between the mother tank (3) and the anode part (42) of the silver making tank (4). The first pumping pipe (31) is connected to a first pumping component (33). The first pumping component (33) enables the electroplating solution (200) in the mother tank (3) and the anode part (42) of the silver making tank (4) to circulate. The cathode part (43) of the silver making tank (4) is connected to a circulation pipe (44). The circulation pipe (44) is connected to a third pumping component (45). The third pumping component (45) is used to enable the chemical solution in the cathode part (43) to circulate. The high-speed spray plating tank (1) is provided with a partition (11) to divide the high-speed spray plating tank (1) into a receiving part (12) and a receiving part (13). A second water pumping pipe (34) is provided between the mother tank (3) and the receiving part (12) of the high-speed spray plating tank (1). The second water pumping pipe (34) is connected to a second water pumping component (35). The second water pumping component (35) pumps the electroplating liquid (200) in the mother tank (3) to the receiving part (12). The receiving part (13) is used to recover the electroplating liquid after electroplating. A second return water pipe (36) is provided between the mother tank (3) and the receiving part (13) of the high-speed spray plating tank (1). The electroplating liquid in the receiving part (13) flows back to the mother tank (3) through the second return water pipe (36). The mother tank (3) is located below the high-speed spray plating tank (1) and the silver making tank (4). The silver spraying system also includes a high-speed spot plating device (9), which includes a mounting plate (91) and a spot plating mold (92), a pressure belt assembly (93), and a sheet feeding assembly (94) disposed on the mounting plate (91). The spot plating mold (92) includes a spot plating roller (921), an anode nozzle plate (922), and a water tank (923). The spot plating roller (921) is provided with spot plating holes (9211), and the anode nozzle plate (922) is provided with multiple anode nozzles (9221). The water tank (923) is disposed on the spot plating roller (9211). 1) Inside, the anode nozzle plate (922) is set on the water tank (923). The anode nozzle plate (922) is connected to the positive terminal of the spraying power supply (2). The bottom of the water tank (923) is provided with a water inlet hole (9231). The water inlet hole (9231) is connected to the receiving part (12) through the fourth water pumping pipe (9232). The fourth water pumping pipe (9232) is connected to a fourth water pumping component (9233). The fourth water pumping component (9233) pumps the electroplating liquid (200) in the receiving part (12) into the water tank (923) and sprays it out from the anode nozzle (9221). The water tank (923) is also provided with a flow stabilizer plate (95), and the flow stabilizer plate (95) is provided with a first water permeable hole (951). The electroplating liquid overflows from the first water permeable hole (951) to the top of the flow stabilizer plate (95). The high-speed spot plating device (9) further includes a flexible diaphragm (96) and a top rod (97). The flexible diaphragm (96) is disposed inside the water tank (923) and is used to separate the water tank (923). The flexible diaphragm (96) is provided with a second water permeable hole (961). The electroplating solution (200) overflows from the second water permeable hole (961) to the top of the flexible diaphragm (96). The anode nozzle plate (922) is provided with a sliding hole (9222). The top rod (97) is slidably disposed inside the sliding hole (9222). The lower end of the top rod (97) is fixedly disposed on the flexible diaphragm (96). The upper end of the top rod (97) is used to pass through the spot plating hole (9211) and abut against the material sheet (101) after the flexible diaphragm (96) is expanded by the electroplating solution. Among them, the spot plating holes (9211) on the spot plating roller (921) correspond one-to-one with the electroplating area on the material sheet (101); the flexible diaphragm (96) and the flow stabilizer plate (95) have a flow stabilizing effect, and the flexible diaphragm (96) can be deformed. During spray plating, the flexible diaphragm (96) is swollen by the electroplating liquid and bulges upward.

2. The silver-spraying system according to claim 1, characterized in that, The flow stabilizer plate (95) has an arc-shaped structure and is concentric with the anode nozzle plate (922).

3. The silver-plating system according to claim 1, characterized in that, A return spring (98) is also fitted on the top rod (97) to retract the top rod (97) and disengage it from the spot plating roller (921) when the electroplating solution does not swell the flexible diaphragm (96).

4. The silver-spraying system according to claim 1, characterized in that, The top of the top rod (97) is provided with insulating soft rubber (971).

5. The silver-spraying system according to claim 1, characterized in that, The anode nozzle (9221) is arranged around the sliding hole (9222) to allow the electroplating solution to enter the spot plating hole (9211) precisely.

6. The silver-spraying system according to claim 1, characterized in that, The flexible diaphragm (96) is a water-permeable fabric.

7. A silver-plating process, characterized in that, The silver spraying system according to any one of claims 1-6 is used for spraying.

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