A substrate thinning worktable, a substrate thinning device and a substrate thinning method

Abstract

The application discloses a substrate thinning workbench, a substrate thinning device and a substrate thinning method. The substrate thinning workbench comprises a rotary table, a suction cup arranged on the upper portion of the rotary table to carry a substrate to be processed, a flushing assembly arranged on the upper side of the suction cup to flush the surface of the suction cup, a brushing assembly comprising a swing arm and a brushing head, one end of the swing arm being rotatably connected to the outer side of the rotary table, and the other end of the swing arm being provided with the brushing head, the brushing head comprising a brushing base, a brush body and a driving motor, the driving motor being fixed to the brushing base, and the output shaft of the driving motor being connected to the brush body to brush the surface of the suction cup, the upper surface of the brushing base being provided with an annular groove, the annular groove being communicated with an external vacuum source, and the inside of the annular groove being provided with a fluid channel, the fluid channel being arranged through along the thickness direction of the brushing base, and the fluid channel being capable of adsorbing particulate matters on the surface of the suction cup.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of substrate thinning, and particularly relates to a substrate thinning workbench, a substrate thinning device and a substrate thinning method. BACKGROUND

[0002] In the field of semiconductors, before a substrate is divided, a thinning (grinding) device is used to grind the back surface of the substrate, so as to thin the substrate to a predetermined thickness. Grinding of the back surface of the substrate can reduce the volume of a chip package, reduce the height of a package, and the thickness of the chip after back surface thinning can even reach less than 5% of the initial thickness.

[0003] In a substrate thinning device, a chuck table is one of the key components, which usually vacuum-adsorbs a substrate to be processed. The stability of the chuck table directly relates to the reliability of the operation of the substrate thinning device.

[0004] In order to prevent particulate matter from accumulating on the surface of the chuck table and ensure the flatness of the chuck table, the surface of the chuck table needs to be cleaned regularly. As the chip manufacturing process moves forward, higher requirements are put forward for the cleanliness of the surface of the chuck table.

[0005] The existing cleaning method of the chuck table is to spray fluid towards the surface of the rotating chuck table, so as to throw out the particulate matter remaining on the surface of the chuck table under the action of centrifugal force. Due to incomplete cleaning of the back surface of the substrate, the surface of the chuck table is easily contaminated, which causes a large number of tiny particles to accumulate on the surface of the chuck table, affects the flatness of the surface of the chuck table, reduces the processing quality of substrate thinning, and even causes the substrate to break. SUMMARY

[0006] The embodiments of the present application provide a substrate thinning workbench, a substrate thinning device and a substrate thinning method, and aim to at least solve one of the technical problems existing in the prior art.

[0007] A first aspect of the embodiments of the present application provides a substrate thinning workbench, comprising:

[0008] a turntable;

[0009] a chuck table arranged on the upper part of the turntable to carry a substrate to be processed;

[0010] a flushing assembly arranged on the upper side of the chuck table to flush the surface of the chuck table;

[0011] a brushing assembly comprising a swing arm and a brushing head, one end of the swing arm being rotatably connected to the outer side of the turntable, and the other end of the swing arm being provided with the brushing head;

[0012] The brush head comprises a brush base, a brush body and a driving motor, the driving motor is fixed to the brush base, the output shaft of the driving motor is connected to the brush body to brush the surface of the suction disc; the upper surface of the brush base is provided with an annular groove, the annular groove is communicated with an external vacuum source; the inner part of the annular groove is provided with a fluid channel, the fluid channel is provided through along the thickness direction of the brush base, and the fluid channel can adsorb the particulate matters on the surface of the suction disc.

[0013] In some embodiments, the brush base is a columnar structure, a recess is arranged at the middle position of the lower part of the brush base, and the brush body is concentrically arranged in the recess.

[0014] In some embodiments, the shape and size of the recess are matched with the shape and size of the brush body.

[0015] In some embodiments, the number of the fluid channels is multiple, and the fluid channels are uniformly distributed with the center of the brush base as the reference.

[0016] In some embodiments, the fluid channel is arranged along the vertical direction, the upper port of the fluid channel is connected to the annular groove, and the lower port of the fluid channel is located on the lower surface of the brush base.

[0017] In some embodiments, the outer diameter of the brush base is less than or equal to the radius of the suction disc.

[0018] In some embodiments, the brush base is provided with a vertical channel extending downward from the upper surface, the end of the vertical channel is communicated with a radial channel, the end of the radial channel is provided with an inclined hole, and the inclined hole is arranged towards the inner side wall of the recess.

[0019] In some embodiments, the number of the radial channels is multiple, and the inclined hole is arranged towards the gap between the brush body and the recess.

[0020] In some embodiments, the vertical channel is communicated with an external water source through a pipeline, and the inclined hole can spray fluid towards the gap.

[0021] In some embodiments, the number of the fluid channels is multiple, and the distribution density of the fluid channels in the brush base is different.

[0022] In some embodiments, the bottom surface of the brush base comprises a first area and a second area, the first area corresponds to the edge notch of the substrate, and the distribution density of the fluid channels in the first area is greater than that in the second area.

[0023] The second aspect of the embodiment of the present application provides a substrate thinning device, which comprises:

[0024] The substrate thinning workbench described above, the chuck carries the substrate to be processed and drives the substrate to rotate around the axis of the chuck;

[0025] And a thinning mechanism for abutting the grinding wheel to the substrate to perform a thinning process on the substrate.

[0026] A third aspect of the embodiments of the present application provides a substrate thinning method using the substrate thinning device described above, comprising:

[0027] S1, placing the substrate on the chuck of the substrate thinning workbench, and grinding the substrate using the thinning mechanism;

[0028] S2, after the substrate is completed, the substrate is transferred to the next process;

[0029] S3, cleaning the surface of the chuck using the brushing assembly, the brushing head abutting the surface of the chuck, and the fluid channel in the cleaning base sucking the particles on the surface of the chuck.

[0030] In some embodiments, the inside of the chuck is provided with a chuck pipeline, which is in communication with an external gas source; during the cleaning of the chuck by the brushing assembly, the external gas source sprays gas downward from bottom to top through the chuck pipeline, so that the particles are separated from the chuck.

[0031] The beneficial effects of the present application include:

[0032] a. The brushing assembly includes a brush body and a fluid channel, the brush body brushes off the particles on the surface of the chuck, and the fluid channel timely transports the particles to the outside of the chuck through vacuum adsorption, ensuring the cleanliness of the surface of the chuck;

[0033] b. The inside of the cleaning base is configured with a vertical channel, a radial channel and an inclined hole, the fluid is sprayed through the vertical channel, the radial channel and the inclined hole towards the gap between the groove of the cleaning base and the brush body, so as to reduce or avoid the accumulation of particles in the gap, ensuring the use effect of the brushing assembly.

[0034] c. The fluid channels in the cleaning base are configured with different distribution densities, the distribution density of the fluid channels in the area corresponding to the edge notch of the substrate is greater than that in other areas, so as to clean the particles at the position corresponding to the edge notch of the substrate and ensure the flatness of the surface of the chuck. BRIEF DESCRIPTION OF DRAWINGS

[0035] The advantages of the present application will become more apparent and more easily understood from the following detailed description, which is only illustrative and not restrictive of the present application, and is presented in conjunction with the following drawings, in which:

[0036] Figure 1 is a schematic diagram of a substrate thinning device provided by an embodiment of the present application;

[0037] Figure 2 is a schematic view of a brushing assembly according to an embodiment of the present application;

[0038] Figure 3 is a schematic view of a brushing assembly according to an embodiment of the present application;

[0039] Figure 4 is a schematic view of a suction cup configured with a rinsing assembly and a brushing assembly;

[0040] Figure 5 is a schematic view of a brushing assembly according to an embodiment of the present application;

[0041] Figure 6 is a bottom view of a brushing assembly according to an embodiment of the present application;

[0042] Figure 7 is Figure 6 is a schematic view of a brushing assembly according to an embodiment of the present application;

[0043] Figure 8 is a flow chart of a substrate thinning method according to an embodiment of the present application. DETAILED DESCRIPTION

[0044] The technical solutions of the present application will be described in detail below with reference to specific embodiments and the accompanying drawings. The embodiments described herein are specific embodiments of the present application, which are used to illustrate the concept of the present application; these descriptions are all explanatory and exemplary, and should not be understood as limiting the embodiments of the present application and the protection scope of the present application. In addition to the embodiments described herein, those skilled in the art can also employ other technical solutions that are obvious based on the content disclosed in the claims and the specification of the present application, which include technical solutions that make any obvious substitutions and modifications to the embodiments described herein.

[0045] The drawings of the present specification are schematic drawings that assist in illustrating the concept of the present application, and schematically represent the shape of each part and their mutual relationship. It should be understood that, in order to clearly show the structure of each component of the embodiments of the present application, the drawings are not drawn according to the same scale, and the same reference numerals are used to represent the same parts in the drawings.

[0046] In the semiconductor industry, semiconductor chips are manufactured using substrates having electronic circuits such as ICs (Integrated Circuits) or LSIs (Large Scale Integrations) formed on the surface of the substrate. Before the substrate is divided into semiconductor chips, the back surface of the substrate is ground by a substrate thinning device, so that the substrate is ground to a predetermined thickness. The present application relates to a substrate thinning device to remove material from the surface of the substrate as required by the process.

[0047] Figure 1 Figure 1 is a schematic diagram of a substrate thinning device 100 according to an embodiment of the present application. The substrate thinning device 100 comprises a substrate thinning worktable 1 and a thinning mechanism 2, wherein the substrate thinning worktable 1 is arranged above a substrate thinning device base, and the thinning mechanism 2 is arranged above the substrate thinning worktable 1 and at an end of the substrate thinning device base.

[0048] Further, the substrate thinning worktable 1 comprises a turntable 10 arranged above the substrate thinning device base, which can rotate around its axis under the drive of a driving device; the upper part of the turntable 10 is configured with a chuck 20 for holding a substrate, and the lower part of the chuck 20 is provided with a driving part to drive the chuck and the substrate thereon to rotate.

[0049] Further, the thinning mechanism 2 is arranged above the chuck 20; the grinding wheel arranged at the bottom of the thinning mechanism 2 abuts against the surface of the substrate to grind the surface of the substrate, so as to remove the material.

[0050] The thinning mechanism 2 comprises a coarse grinding part 21 and a fine grinding part 22, the coarse grinding part 21 is provided with a coarse grinding wheel for coarse grinding of the substrate, and the fine grinding part 22 is provided with a fine grinding wheel for fine grinding of the substrate. The grinding process is to press the grinding wheel against the surface of the substrate and rotate to grind and remove a certain thickness of material layer.

[0051] The coarse grinding part 21 comprises a coarse grinding wheel in the shape of a cup-shaped structure, a coarse grinding spindle, a coarse grinding spindle seat and a coarse grinding feeding mechanism. The coarse grinding wheel is connected to the bottom of the coarse grinding spindle to drive the coarse grinding spindle to rotate, so as to realize the rotation grinding of the coarse grinding wheel on the surface of the substrate, and the coarse grinding spindle is connected to the coarse grinding feeding mechanism through the coarse grinding spindle seat to realize the up-and-down movement, and the coarse grinding wheel is controlled to approach or move away from the substrate by the coarse grinding feeding mechanism to realize the axial cutting type feeding grinding. The coarse grinding wheel can be a diamond grinding wheel, which has a relatively rough surface to realize fast grinding of the substrate and reduce the substrate thinning time.

[0052] The fine grinding part 22 comprises a fine grinding wheel in the shape of a cup-shaped structure, a fine grinding spindle, a fine grinding spindle seat and a fine grinding feeding mechanism. The fine grinding wheel is connected to the bottom of the fine grinding spindle to drive the fine grinding spindle to rotate, so as to realize the rotation grinding of the fine grinding wheel on the surface of the substrate, and the fine grinding spindle is connected to the fine grinding feeding mechanism through the fine grinding spindle seat to realize the up-and-down movement, and the fine grinding wheel is controlled to approach or move away from the substrate by the fine grinding feeding mechanism to realize the axial cutting type feeding grinding. The fine grinding wheel can be a diamond grinding wheel, which has a lower surface roughness than the coarse grinding wheel. Since the coarse grinding quickly removes the material on the surface of the substrate, it will cause serious surface defects and loss, and the fine grinding wheel with a delicate surface is used for low-speed grinding to reduce the thickness of the damaged layer on the surface of the substrate and improve the quality of the substrate surface.

[0053] Figure 1In the embodiment shown, the upper part of the rotary table 10 is uniformly provided with three suction cups 20, and specifically, the center lines of the three suction cups 20 and the center of the rotary table 10 form an angle of 120° with each other. The three suction cups 20 rotate among the rough grinding station, the fine grinding station and the loading and unloading station, wherein the two stations opposite to the thinning mechanism 2 are used for rough grinding and fine grinding respectively, and the remaining station is used for loading and unloading and cleaning the substrate.

[0054] Figure 1 In the embodiment shown, the substrate thinning workbench 1 further comprises:

[0055] The flushing assembly 30 is arranged on the upper side of the suction cup 20 to flush the surface of the suction cup 20; the flushing assembly 30 can remove the particles remaining on the surface of the suction cup 20 by flushing;

[0056] The brushing assembly 40 comprises Figure 2 The swing arm 41 and the brushing head 42 shown, the brushing head 42 is arranged at the end of the swing arm 41 to brush the particles on the surface of the suction cup 20.

[0057] Further, the flushing assembly 30 can be a spray pipe, which is connected to a double fluid such as a mixture of deionized water and nitrogen gas to spray the fluid with a certain pressure towards the surface of the suction cup 20 to enhance the impact ability of the fluid and ensure the cleaning effect of the suction cup 20. Figure 1 In the embodiment shown, one end of the swing arm 41 is rotatably connected to the outer side of the rotary table 10, and the swing arm 41 can rotate around the connection point to drive the brushing head 42 to move on the surface of the suction cup 20.

[0058] Figure 2 The brushing assembly 40 provided by the embodiment of the present application is shown in the figure, wherein the brushing head 42 comprises a brushing base 43, a brush body 44 and a driving motor 45; the driving motor 45 is arranged on the brushing base 43, and the output shaft of the driving motor 45 is connected to the brush body 44 to drive the brush body 44 to rotate. The lower surface of the brush body 44 abuts against the suction cup 20 to brush the particles remaining on the surface of the suction cup 20 through the mutual friction of the two.

[0059] Further, the brushing base 43 is a columnar structure arranged below the swing arm 41. The upper surface of the brushing base 43 is provided with an annular groove 43a concentrically arranged on the upper surface of the brushing base 43. The annular groove 43a is connected to an external vacuum source through a pipeline to suck the annular groove 43a and the channels or holes connected thereto.

[0060] Figure 2In the embodiment shown, the inner part of the annular groove 43a is provided with a fluid passage 43b, which is arranged through the thickness direction of the brushing base 43. When the external vacuum source is turned on, the fluid passage 43b in communication with the annular groove 43a can generate a suction force on the particles on the surface of the suction pad 20; the particles remaining on the surface of the suction pad 20 are removed from the substrate thinning workbench 1 through the fluid passage 43b, the annular groove 43a and the pipeline, thereby ensuring the cleanliness of the surface of the suction pad 20 and avoiding the particles on the surface of the suction pad from affecting the flatness of the surface of the suction pad.

[0061] Figure 2 In the embodiment shown, the brushing base 43 is a columnar structure, and a recess 43c is arranged at the middle position of the lower part of the brushing base 43, and the brush body 44 is concentrically arranged in the recess 43c. Further, the shape and size of the recess 43c are matched with the shape and size of the brush body 44, so as to avoid the interference between the outer peripheral wall of the brush body 44 and the inner side wall of the recess 43c.

[0062] Figure 2 In the embodiment shown, the brush body 44 is a columnar structure, which is made of a material with good water absorption, such as polyvinyl alcohol, and the bottom surface of the brush body 44 is provided with a plurality of micro protrusions for brushing the surface of the suction pad 20. Correspondingly, the recess 43c is a circular hole, and the inner diameter of the recess 43c is slightly larger than the outer diameter of the brush body 44, so as to ensure that the brush body 44 does not interfere with the inner side wall of the recess 43c during rotation. In some embodiments, the gap G between the brush body 44 and the inner side wall of the recess 43c is 2-3 mm. Figure 2

[0063] Figure 2 In the embodiment shown, the number of fluid passages 43b is multiple, which are uniformly distributed with the center of the brushing base as the reference. During the swinging of the swing arm 41 around the connecting point, the fluid passages 43b sweep different areas of the surface of the rotating suction pad 20 to adsorb the particles on the surface of the suction pad 20, thereby improving the cleaning ability of the surface of the suction pad 20.

[0064] Figure 3 FIG. 1 is a schematic view of a brushing assembly 40 provided by an embodiment of the present application, and the brushing base 43 is provided with 24 fluid passages 43b, which are uniformly distributed to ensure good adsorption effect. It can be understood that the number of fluid passages 43b can also be other numbers, such as 12, 36, 48 or other odd numbers, as long as they are roughly uniformly distributed on the brushing base 43.

[0065] Figure 2 In the embodiment shown, the fluid passage 43b is arranged in the vertical direction, and the upper port thereof is connected to the annular groove 43a, and the lower port thereof is located on the lower surface of the brushing base 43. That is, the lower port of the fluid passage 43b of the brush head 42 is arranged to face the surface of the suction pad 20, so as to facilitate the adsorption of the particles remaining on the surface of the suction pad 20. ​

[0066] Figure 4 is a schematic view of a chuck 20 according to an embodiment of the present application, which is provided with a rinsing assembly 30 and a brushing assembly 40. The rinsing assembly 30 can be in communication with a double fluid source, and the fluid is used to rinse the surface of the chuck 20 at a certain pressure; the annular groove 43a of the brushing assembly 40 is connected to an external vacuum source through a pipeline, so as to timely suck the particles on the surface of the chuck 20. The double fluid mentioned in the present application refers to the mixture of liquid and gas, such as the mixture of deionized water and nitrogen gas in a certain proportion. As an embodiment of the present application, the fluid sprayed by the rinsing assembly 30 has a certain temperature, such as 40-60°, so as to enhance the force of the rinsing fluid on the surface of the chuck. Figure 2 is shown) is connected to an external vacuum source through a pipeline, so as to timely suck the particles on the surface of the chuck 20. The double fluid mentioned in the present application refers to the mixture of liquid and gas, such as the mixture of deionized water and nitrogen gas in a certain proportion. As an embodiment of the present application, the fluid sprayed by the rinsing assembly 30 has a certain temperature, such as 40-60°, so as to enhance the force of the rinsing fluid on the surface of the chuck.

[0067] Further, the chuck 20 comprises a chuck base 20b and a ceramic chuck 20c, the inside of the chuck base 20b is provided with a chuck pipeline 20a facing the ceramic chuck, the inside of the chuck pipeline 20a can be connected to compressed gas, which is sprayed towards the ceramic chuck 20c, so as to blow up the particles on the surface of the chuck 20, and the fluid channel 43b on the brush head 42 can timely suck the blown-up particles, so as to enhance the cleaning effect of the brushing head 42. In the present application, the ceramic chuck 20c refers to a porous material, which is used to vacuum adsorb the substrate to be thinned.

[0068] In order to avoid the accumulation of particles in the fluid channel 43b, the brushing base 43 can be made of polytetrafluoroethylene, so as to ensure that the hole wall of the fluid channel 43b is relatively smooth. In some embodiments, the roughness of the inner surface of the fluid channel 43b is controlled to be below Ra0.2.

[0069] Figure 4 In the shown embodiment, the outer diameter of the brushing base 43 is smaller than the radius of the chuck 20, and the brush body 44 on the brushing head 42 covers the edge area of the chuck 20. This is because under the action of centrifugal force, the residual particles are mostly distributed in the edge of the ceramic chuck 20c. In addition, the outer edge of the substrate is usually provided with a notch, and the area corresponding to the notch will also accumulate some particles. Figure 4 In some embodiments, the outer diameter of the brushing base 43 is about 1 / 2 of the radius of the chuck 20, so as to concentrate on the cleaning treatment of the edge of the ceramic chuck 20c.

[0070] It can be understood that the outer diameter of the brushing base 43 can also be equal to the radius of the chuck 20, so that during the rotation of the chuck 20, the fluid channel 43b is always towards the surface of the ceramic chuck 20c.

[0071] Figure 2 In some embodiments, the brushing head 42 of the brushing assembly 40 is provided with a gap G, and the gap G will inevitably accumulate a large amount of particles during the long-term use of the brushing assembly 40, which will affect the cleaning effect of the chuck 20.

[0072] In order to solve the above problems, the cleaning effect of the chuck 20 is ensured, Figure 5 The provided brushing assembly 40 gives a solution, and Figure 2 Compared with the technical scheme shown, the brushing base 43 is configured with a vertical channel 43d extending downward from the upper surface, the end of the vertical channel 43d is connected with a radial channel 43e, and the end of the radial channel 43e is configured with an oblique hole 43f, which is arranged towards the inner side wall of the groove 43c to remove the particles adhering to the inner side wall of the groove 43c.

[0073] Figure 5 In the embodiment, the vertical channel 43d is connected with an external water source through a pipeline, and the oblique hole 43f can spray fluid such as compressed air and / or deionized water towards the gap G to remove the particles remaining in the gap G.

[0074] In the present application, the radial channel 43e refers to a channel arranged along the radial direction of the brushing base 43. The number of radial channels 43e is multiple, and correspondingly, the number of oblique holes 43f is equal to the number of radial channels 43e. The oblique hole 43f is arranged towards the gap G between the brush body 44 and the groove 43c to flush the particles adhering to the gap G with water flow and / or air flow.

[0075] Since the edge of the substrate is provided with a notch, after the substrate is placed on the surface of the chuck 20, the porous ceramic at the notch of the edge of the substrate is not blocked, so more particles are easily accumulated at the notch of the edge of the substrate, and the area needs to be cleaned to avoid the accumulation of particles on the surface of the chuck 20 to cause the flatness not to meet the process requirements.

[0076] To solve the above problems, the present application provides the following solutions: arranging fluid channels 43b with different distribution densities on the brushing base 43 of the brushing assembly 40. Specifically, more fluid channels 43b are arranged at positions corresponding to the notch of the edge of the substrate to clean the area where particles are more accumulated, and ensure the cleaning effect of the surface of the chuck.

[0077] Figure 6 is the bottom view of the brushing assembly 40 provided by an embodiment of the present application. In this embodiment, the bottom surface of the brushing base 43 includes a first area A1 and a second area A2. During the swinging of the swing arm 41 of the brushing assembly 40 around the fixed point, the first area A1 of the brushing base 43 can sweep the positions corresponding to the notch of the edge of the substrate. It should be noted that in the substrate thinning process, the orientation of the notch of the edge of the substrate is relatively fixed to facilitate transmission positioning. That is, the notch of the edge of the substrate is always located at the corresponding position on the surface of the chuck 20, so the position of the particles accumulated on the surface of the chuck 20 is relatively fixed.

[0078] Figure 6In the embodiment, the distribution density of the fluid channels 43b arranged in the first area A1 is greater than the distribution density of the fluid channels 43b arranged in the second area A2, so as to emphasize the cleaning of the position corresponding to the edge notch of the substrate.

[0079] Further, in the first area A1, the fluid channels 43b are arranged in multiple rows and are arranged along the radial direction of the brushing base 43, so as to enhance the suction capacity of the brushing assembly 40.

[0080] Further, in the first area A1, the inner diameter of the fluid channels 43b is smaller than the inner diameter of the fluid channels 43b in the second area A2, so as to ensure the cleaning effect of the emphasized position of the chuck 20.

[0081] Figure 7 is Figure 6 The brushing assembly 40 provided in the embodiment is arranged on the upper side of the chuck 20. The brushing assembly 40 rotates around the fixed point located on the outer side of the chuck 20, and the fluid channels 43b in the first area A1 can cover the position corresponding to the edge notch of the substrate, so as to ensure the cleaning effect of the chuck 20.

[0082] Figure 7 In the embodiment, in the first area A1, the fluid channels 43b are arranged in multiple rows along the bottom surface of the brushing base 43, the area of the first area A1 is 1 / 10-1 / 6 of the total area of the bottom of the brushing base 43, and the inner diameter of the fluid channels 43b in the first area A1 is smaller than 1 / 2 of the inner diameter of the fluid channels 43b in the second area A2, so as to effectively clean the emphasized area on the surface of the chuck 20.

[0083] Meanwhile, the present application also provides a substrate thinning device 100, a schematic diagram of which is shown in Figure 1 As shown, the substrate thinning device 100 comprises the substrate thinning workbench 1 and the thinning mechanism 2 described above, the chuck 20 of the substrate thinning workbench 1 carries the substrate to be processed and drives the substrate to rotate around the axis of the chuck 20, and the thinning mechanism 2 makes the grinding wheel abut against the substrate to perform the thinning processing on the substrate. In the embodiment, the upper side of the chuck 20 is configured with the brushing assembly 40, so as to effectively remove the particulate matter remaining on the surface of the chuck 20.

[0084] In addition, the present application also provides a substrate thinning method, which uses the substrate thinning device described above. Figure 8 is a flow chart of the substrate thinning method, which comprises:

[0085] S1, placing the substrate on the chuck 20 of the substrate thinning workbench 100 and grinding the substrate using the grinding wheel of the thinning mechanism 2;

[0086] S2, after the grinding of the substrate is completed, using the robot to transfer the substrate to the next process;

[0087] S3, the surface of the suction cup 20 is cleaned by the brushing assembly 40, the brushing head 42 abuts against the surface of the suction cup 20, the fluid passage 43b in the cleaning base 43 sucks the particles on the surface of the suction cup 20, so as to ensure the cleaning effect of the surface of the suction cup 20.

[0088] During the cleaning of the suction cup 20 by the brushing assembly 40, the flushing assembly 30 sprays fluid towards the suction cup 20, at the same time, the swing arm 41 of the brushing assembly 40 swings towards the suction cup 20, so that the brushing head 20 is located above the suction cup 20; the driving motor 45 rotates to drive the brush body 44 to rotate, so as to brush the surface of the suction cup 20.

[0089] During the cleaning of the suction cup 20, the external air source sprays gas from bottom to top through the suction cup pipeline 20a, so that the particles are separated from the suction cup 20, so as to simultaneously apply force from above and below, so that the particles are separated from the surface of the suction cup 20. That is, the particles are subjected to upward suction force through the fluid passage 43b, and at the same time, the particles are subjected to upward pushing force through the suction cup pipeline 20a in the suction cup 20, and through the combined action of the two, the particles are separated from the surface of the suction cup, and the cleaning ability of the brushing assembly 40 is enhanced.

[0090] The small particles attached to the surface of the ceramic suction cup are separated from the ceramic suction cup, the fluid passage 43b on the cleaning base 43 is in communication with the external vacuum source, and the particles suspended above the ceramic suction cup and on the upper part of the ceramic suction cup are timely sucked and removed, so as to ensure the cleanliness of the surface of the suction cup 20.

[0091] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0092] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A substrate thinning station, characterized by, The application relates to a substrate cleaning device, which comprises the following components: a rotary table; a suction disc arranged on the upper portion of the rotary table to carry a substrate to be processed; a flushing assembly arranged on the upper side of the suction disc to flush the surface of the suction disc; a brushing assembly comprising a swing arm and a brushing head, one end of the swing arm being rotatably connected to the outer side of the rotary table, and the other end being provided with the brushing head; the brushing head comprises a brushing base, a brush body and a driving motor, the driving motor being fixed to the brushing base, and the output shaft of the driving motor being connected to the brush body to brush the surface of the suction disc; the upper surface of the brushing base is provided with an annular groove, the annular groove being communicated with an external vacuum source; the inner portion of the annular groove is provided with a fluid channel, the fluid channel being arranged through the thickness direction of the brushing base, and the fluid channel being capable of adsorbing the particulate matters on the surface of the suction disc; the bottom surface of the brushing base comprises a first region and a second region, in the process of swinging of the swing arm around the fixed point, the first region of the brushing base sweeps the corresponding position at the edge notch of the substrate; the distribution density of the fluid channel in the first region is greater than that in the second region, so as to clean the corresponding position at the edge notch of the substrate; the area of the first region accounts for 1 / 10 to 1 / 6 of the bottom area of the brushing base, and the inner diameter of the fluid channel in the first region is less than 1 / 2 of the inner diameter of the fluid channel in the second region; the middle position of the lower portion of the brushing base is provided with a recess, and the brush body is concentrically arranged in the recess; the brushing base is provided with a vertical channel extending from top to bottom, and the end of the vertical channel is communicated with a radial channel; the end of the radial channel is provided with an inclined hole, which is arranged towards the inner side wall of the recess; the inclined hole is arranged towards the gap between the brush body and the recess to spray fluid towards the gap; the brushing base is a columnar structure, the shape and size of the recess are matched with those of the brush body; the fluid channel is arranged in the vertical direction, and the upper port of the fluid channel is connected to the annular groove, and the lower port of the fluid channel is located on the lower surface of the brushing base.

2. The substrate thinning station of claim 1, wherein, The outer diameter of the brushing base is less than or equal to the radius of the suction disc.

3. The substrate thinning station of claim 1, wherein, The number of the radial channels is multiple.

4. The substrate thinning station of claim 3, wherein, The vertical channel is communicated with an external water source through a pipeline.

5. A substrate thinning apparatus characterized by comprising: The application further relates to a substrate thinning device, which comprises the following components: the substrate thinning device of any one of claims 1 to 4, the suction disc carries the substrate to be processed and drives the substrate to rotate around the axis of the suction disc; and a thinning mechanism for abutting a grinding wheel to the substrate to perform a thinning process on the substrate.

6. A substrate thinning method characterized by, The application further relates to a method for using the substrate thinning device of claim 5, which comprises the following steps: S1, placing the substrate on the suction disc of the substrate thinning device, and grinding the substrate by using the thinning mechanism; S2, after the substrate is completed to be ground, transferring the substrate to the next process; S3, cleaning the surface of the suction disc by using the brushing assembly, abutting the brushing head to the surface of the suction disc, and sucking the particulate matters on the surface of the suction disc by the fluid channel in the cleaning base.

7. The substrate thinning method of claim 6, wherein The inner portion of the suction disc is provided with a suction disc pipeline, the suction disc pipeline is communicated with an external air source; in the process of cleaning the suction disc by the brushing assembly, the external air source sprays gas from bottom to top through the suction disc pipeline, so that the particulate matters are separated from the suction disc.

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