A wave-transparent component and its preparation method

Abstract

The present invention relates to a wave-transmitting component and a method for preparing the same. The wave-transmitting component comprises an inner skin, an outer skin, and a filler layer located between the inner skin and the outer skin; the inner skin and the outer skin comprise: a first resin matrix comprising a first resin and a reinforcement comprising quartz fiber cloth; the filler layer comprises: a second resin matrix comprising a second resin and hollow fibers and hollow silica microspheres dispersed in the second resin matrix. The filler layer of the wave-transmitting component contains a specific resin, a specific hollow fiber material, and a specific hollow microsphere material. The addition of the specific hollow fiber material and the specific hollow microsphere material allows the filler layer to have good wave transmission and good dielectric constant adjustability, thereby achieving good broadband wave transmission performance. The component has great engineering application value.

Description

Technical Field

[0001] The present invention relates to the technical field of composite materials, and in particular to a wave-transmitting component and a preparation method thereof. Background Art

[0002] The continuous advancement of antenna technology places higher demands on the strength level of wave-transmitting components. High-transmittance wave-transmitting components generally adopt a single-layer structure. To achieve high transmittance and meet the requirements of structural weight reduction, single-layer wave-transmitting components are generally designed with half-wave or thin-wall structures. However, their structural strength is often reduced due to the thickness limit, and their dielectric constant cannot be designed and adjusted to meet the wave transmission requirements of the antenna in a specific frequency band. Summary of the Invention

[0003] In view of this, the present invention provides a high-strength dielectrically adjustable one-piece molded wave-transparent component and a preparation method thereof. The wave-transparent component can be used in the structure of a wide-band wave-transparent antenna cover or other wave-transparent components, can reduce the weight of the antenna cover, has excellent mechanical properties, realizes dielectric adjustability, and is process-friendly.

[0004] In order to achieve the above object, the present invention provides:

[0005] A wave-transmitting component comprises an inner skin, an outer skin and a filler layer located between the inner skin and the outer skin;

[0006] The inner skin and the outer skin include: a first resin matrix including a first resin and a reinforcement including a quartz fiber cloth;

[0007] The filler layer includes: a second resin matrix containing a second resin, and hollow fibers and hollow silica microspheres dispersed in the second resin matrix.

[0008] Preferably:

[0009] The hollow fiber is a fiber material with a length of 2mm-6mm, an inner diameter of 3μm-8μm, and an outer diameter of 10μm-16μm.

[0010] Preferably:

[0011] The hollow silicon dioxide microspheres are hollow microsphere materials with a particle size of 200 μm-500 μm.

[0012] Preferably:

[0013] The first resin and the second resin are cyanate resins and / or modified cyanate resins.

[0014] Preferably:

[0015] The fiber material in the quartz fiber cloth is A-type quartz fiber and / or B-type quartz fiber.

[0016] Preferably:

[0017] The thickness of the quartz fiber cloth is 0.1 mm to 0.28 mm.

[0018] Preferably:

[0019] The mass of the quartz fiber cloth is 100 wt % to 150 wt % of the mass of the first resin.

[0020] Preferably:

[0021] The mass of the hollow fiber is 11wt%-20wt% of the mass of the second resin;

[0022] The mass of the hollow silica microspheres is 80 wt % to 89 wt % of the mass of the second resin.

[0023] The present invention also provides a method for preparing a wave-transmitting component, which is prepared by an autoclave curing method and comprises the following steps:

[0024] The resin and quartz fiber cloth used for the outer skin are spread into the required mold and covered with a vacuum bag. The vacuum bag is evacuated and placed in an autoclave for pre-curing.

[0025] The process conditions of the pre-curing are:

[0026] Stage 1: Keep warm at 80℃-100℃ for 60min-90min, and the vacuum degree reaches above -0.09;

[0027] Stage 2: Keep at 150℃-180℃ for 30min-80min, and the vacuum degree reaches above -0.09;

[0028] The resin, hollow fibers and hollow silica microspheres used as fillers are spread on the pre-cured outer skin and covered with a vacuum bag. The vacuum bag is evacuated and placed in an autoclave for pre-curing.

[0029] The process conditions of the pre-curing are:

[0030] Stage 1: Keep warm at 80℃-100℃ for 60min-90min, and the vacuum degree reaches above -0.09;

[0031] Stage 2: Keep at 150℃-180℃ for 30min-80min, and the vacuum degree reaches above -0.09;

[0032] The resin and quartz fiber cloth used for the inner skin are spread on the pre-cured outer skin and filler and covered with a vacuum bag. The vacuum bag is evacuated and placed in an autoclave for curing.

[0033] The process conditions of the curing are:

[0034] Stage 1: Keep warm at 80℃-100℃ for 60min-90min, and the vacuum degree reaches above -0.09;

[0035] Stage 2: Keep at 130-170℃ for 15-30 minutes, then apply 0.5MPa-5MPa pressure, and keep the temperature and pressure for 60-120 minutes;

[0036] Stage 3: Keep at 200℃-230℃ for 100min-120min, and maintain pressure at 0.5MPa-5MPa.

[0037] Beneficial effects

[0038] The implementation of the technical solution of the present invention has the following beneficial effects:

[0039] The wave-transmitting component provided by the present invention integrates inner and outer skins with an intermediate filler layer, resulting in high structural strength and excellent mechanical properties. The filler layer is dispersed with a specific resin, hollow fiber material, and hollow microsphere material. The addition of these materials imparts excellent wave transmission and adjustable dielectric constant, enabling excellent broadband wave transmission performance. This component possesses significant engineering application value.

[0040] The wave-transmitting component provided by the present invention also has good processing performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 1 is a schematic structural diagram of the wave-transmitting component provided by the present invention, wherein 1 represents filler; 2 represents inner skin; and 3 represents outer skin. DETAILED DESCRIPTION

[0042] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0043] First aspect

[0044] In a first aspect, the present invention provides a high-strength dielectric adjustable integrally formed wave-transparent component, the wave-transparent component comprising an inner skin, an outer skin, and a filler layer located between the inner skin and the outer skin, such as Figure 1 As shown;

[0045] The inner skin and the outer skin include: a first resin matrix including a first resin and a reinforcement including a quartz fiber cloth;

[0046] The filler layer includes: a second resin matrix containing a second resin, and hollow fibers and hollow silica microspheres dispersed in the second resin matrix.

[0047] Quartz fiber cloth

[0048] The quartz fiber cloth provided by the present invention is an inorganic fiber material, specifically a quartz fiber cloth material with a thickness within the range of 0.1 mm, 0.14 mm or 0.28 mm.

[0049] Hollow Fiber

[0050] The hollow fibers in the filler provided by the present invention are short fiber materials, and the short fibers are reinforcing materials that provide strength support for the artificial medium material.

[0051] The inventors have discovered that one or more of the following properties of the short fiber material affect its use effect, and ultimately affect the use effect of the foam material:

[0052] (a) Fiber length

[0053] The hollow fibers in the wave-transmitting components provided herein are short fibers, specifically having a length within the range of 2 mm to 6 mm (inclusive). It should be noted that the short fibers can be of a single length, in which case the length can be any value within the aforementioned range, for example, 2 mm, 3 mm, 5 mm, or 6 mm.

[0054] The inventors have discovered that short fiber materials with this length characteristic offer advantages such as good dispersion, relatively uniform mixing with the resin and hollow silica microspheres, and excellent mechanical strength. More preferably, the fibers are short fibers with a length of 2mm-6mm. Fibers that are too long can cause uneven dispersion in the artificial medium, while fibers that are too short can exhibit poor mechanical properties and fail to function as a reinforcing material.

[0055] (b) Fiber diameter

[0056] The short fiber material used in the present invention is a short fiber material having an inner diameter within the range of 3μm-8μm (including the endpoint values) and an outer diameter within the range of 10μm-16μm (including the endpoint values). It should be noted that the short fiber material can be a fiber material with a single inner diameter and outer diameter, in which case it can be any value within the above range, for example, the inner diameter can be 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, and the outer diameter can be 10μm, 11μm, 12μm, 13μm, 14μm, 15μm, 16μm. In addition, the short fiber material can be a fiber material with a non-single diameter, in which case the length falls within the above range or the above sub-range.

[0057] The inventors have discovered that the short fiber material having such a diameter characteristic has the advantage of excellent dielectric properties.

[0058] (c) Fiber dosage

[0059] In some preferred embodiments, the mass of the fiber is 11wt%-20wt% of the resin mass, and can be any value within the above range (including the endpoint value), for example, it can be 11wt%, 13wt%, 15wt%, 18wt%, or 20wt%.

[0060] In some preferred embodiments, the fiber is an inorganic fiber, preferably an A-type quartz fiber and / or a B-type quartz fiber, more preferably an A-type quartz fiber.

[0061] Hollow microspheres

[0062] The hollow silicon dioxide microspheres in the artificial medium material provided by the present invention are hollow microsphere materials with a particle size of 200 μm-500 μm.

[0063] In some preferred embodiments, the mass of the hollow microspheres is 80wt%-89wt% of the resin mass, and can be any value within the above range (including the endpoint value), for example, it can be 80wt%, 82wt%, 85wt%, 87wt%, or 89wt%.

[0064] The addition of hollow microspheres with this particle size characteristic can significantly reduce the density of the artificial dielectric material and improve the broadband wave transmission performance of the artificial dielectric material.

[0065] It should be noted that the present invention does not place any particular limitation on the source of the hollow silica microspheres. The hollow silica microspheres in the present invention are commercially available silica hollow microsphere materials, or silica hollow microsphere materials prepared according to existing methods.

[0066] Resin

[0067] The resin materials of the first resin and the second resin in the artificial dielectric material provided by the present invention are cyanate resin and / or modified cyanate resin, preferably cyanate resin.

[0068] Cyanate ester resin has the advantages of good electrical properties, good process performance and stable performance.

[0069] It should be noted that the cyanate ester resin and the modified cyanate ester resin are both existing commercially available materials or materials prepared according to existing methods.

[0070] 〈Padding layer〉

[0071] The filler provided by the present invention comprises a specific hollow fiber material and a specific hollow silica microsphere material dispersed within a second resin matrix. It should be noted that while the hollow fibers (preferably type A hollow quartz fibers in the preferred embodiment) and the hollow silica microspheres are dispersed within the second resin matrix, it is also possible that a portion or all of the structure of the hollow fibers (preferably type A hollow quartz fibers in the preferred embodiment) and / or a portion or all of the structure of the hollow silica microspheres are also distributed on the surface of the specific resin.

[0072] By adding specific hollow fiber materials and specific silica hollow microsphere materials, the filler has good broadband wave transmission performance, low density, and controllable dielectric properties. It can be used as the core material of most wave-transmitting components and has great engineering application value.

[0073] The wave-transmitting component provided by the present invention also has good electrical properties.

[0074] Second aspect

[0075] In a second aspect, the present invention provides a method for preparing a high-strength dielectric adjustable one-piece molded wave-transparent component, comprising the following steps:

[0076] Step 1: pre-curing the outer skin material provided in the first aspect of the present invention;

[0077] Step 2: pre-curing the filler layer and the outer skin material obtained in step 1; and

[0078] Step 3: solidify the inner skin material and the material in step 2 together.

[0079] Step 1

[0080] The first step is the step of pre-curing the outer skin, the purpose of which is to pre-cure the inner skin so that it has a certain material strength that can be used to bear the weight and shape of the filler layer in the subsequent step.

[0081] The present invention provides a highly feasible pre-curing solution, employing an autoclave curing method to pre-cure the outer skin. The outer skin fabric is laid into a mold and covered with a vacuum bag. The bag is then evacuated and placed in an autoclave for pre-curing. It should be noted that the mold herein refers to a wave-transmitting component forming mold. The desired shape of the wave-transmitting component can be achieved using this mold. Existing product forming molds can be used, and this is not specifically limited in the present invention.

[0082] The process conditions for pre-curing are:

[0083] Stage 1: Keep warm at 80℃-100℃ for 60min-90min, and the vacuum degree reaches above -0.09;

[0084] Stage 2: Keep warm at 150℃-180℃ for 30min-80min, and the vacuum degree reaches above -0.09.

[0085] Step 2

[0086] Step 2 is the step of preparing the filler layer, laying the filler layer, and pre-curing the filler layer. The purpose is to make the filler layer have a certain material strength so that it can be used to bear the weight and shape of the inner skin in the subsequent steps.

[0087] The present invention provides a pre-curing solution with high process feasibility, which adopts an autoclave curing method to pre-cure the filler layer. The material used for the filler layer is laid on the outer skin in the mold according to the component shape requirements and covered with a vacuum bag. After the vacuum bag is evacuated, it is placed in an autoclave for pre-curing.

[0088] It should be noted that any mixing method is feasible as long as it can achieve the effect of uniformly mixing the raw materials used in the filler layer. The present invention recommends a mixing method of sequentially adding hollow silica microspheres and hollow fibers to the resin solution, which can improve the operation convenience.

[0089] The process conditions for pre-curing are:

[0090] Stage 1: Keep warm at 80℃-100℃ for 60min-90min, and the vacuum degree reaches above -0.09;

[0091] Stage 2: Keep warm at 150℃-180℃ for 30min-80min, and the vacuum degree reaches above -0.09.

[0092] Step 3

[0093] Step three involves laying out the inner skin, co-curing the inner skin with the materials from steps one and two. This co-curing process yields the desired wave-transmitting component. The inner skin fabric is applied to the pre-cured filler layer from step two and covered with a vacuum bag. The bag is then evacuated and placed in an autoclave for pre-curing.

[0094] The curing process conditions are:

[0095] Stage 1: Keep warm at 80℃-100℃ for 60min-90min, and the vacuum degree reaches above -0.09;

[0096] Stage 2: Keep at 130-170℃ for 15-30 minutes, then apply 0.5MPa-5MPa pressure, and keep the temperature and pressure for 60-120 minutes;

[0097] Stage 3: Keep at 200℃-230℃ for 100min-120min, and maintain pressure at 0.5MPa-5MPa.

[0098] Example 1

[0099] High-strength one-piece molded wave-transparent components:

[0100] Example 1 provides a high-strength, integrally molded wave-transparent component comprising inner and outer coverings and filler. The inner and outer coverings are made of a resin matrix and quartz fiber cloth. The resin is a cyanate ester resin, and the quartz fiber cloth is Type A with a thickness of 0.14 mm. The filler comprises a resin matrix, Type A chopped hollow quartz fibers, and hollow silica glass microspheres. The resin matrix is ​​a cyanate ester resin. The Type A chopped hollow quartz fibers dispersed in the artificial dielectric matrix have a fiber length of 6 mm, an inner diameter of 4 μm, and an outer diameter of 14 μm. The hollow silica glass microspheres dispersed in the resin matrix have a particle size of 300 μm.

[0101] The raw materials used include:

[0102] The resin is a cyanate resin;

[0103] The quartz fiber cloth is type A quartz fiber cloth with a thickness of 0.14 mm and a mass of 120 wt% of the resin mass;

[0104] A-type short-cut hollow quartz fiber, 2 mm in length, 4 μm in inner diameter, 14 μm in outer diameter, and a mass of 17.8 wt% of the resin mass;

[0105] Hollow glass microspheres, with a particle size of 300 μm and a mass of 80 wt% of the resin mass.

[0106] The preparation method is:

[0107] Outer skin pre-curing:

[0108] Stage 1: Keep at 90℃ for 70min, and the vacuum degree reaches above -0.09;

[0109] Stage 2: Keep at 160℃ for 60min, and the vacuum degree reaches above -0.09.

[0110] Pre-curing of filler layer:

[0111] Stage 1: Keep at 90℃ for 90min, and the vacuum degree reaches above -0.09;

[0112] Stage 2: Keep at 160℃ for 80min, and the vacuum degree reaches above -0.09.

[0113] Inner skin co-curing:

[0114] Stage 1: Keep at 100℃ for 90min, and the vacuum degree reaches above -0.09;

[0115] Stage 2: Keep at 170℃ for 20 minutes, then apply 1MPa pressure and keep the temperature and pressure for 120 minutes;

[0116] Stage 3: Keep at 230℃ for 120min and maintain pressure at 1MPa.

[0117] The electrical and mechanical properties of the wave-transmitting component materials are tested. The test items and methods are as follows:

[0118] ①Tensile strength at room temperature, test method: GB / T 1452-2005.

[0119] ②The wave transmission performance of the flat sample at room temperature in the Ka band, test method: amplitude directional method.

[0120] The test results are shown in Table 1.

[0121] Table 1 Performance test results of the human wave-transmitting component materials of Example 1

[0122] Test items Measured value Tensile strength (MPa) 9.5 Transmittance (Ka band) ≥85％

[0123] Example 2

[0124] High-strength one-piece molded wave-transparent components:

[0125] Example 1 provides a high-strength, integrally molded wave-transparent component comprising inner and outer skins and filler. The inner and outer skins are made of a resin matrix and quartz fiber cloth. The resin is a cyanate ester resin, and the quartz fiber cloth is Type A with a thickness of 0.14 mm. The filler comprises a resin matrix, Type A chopped hollow quartz fibers, and hollow silica glass microspheres. The resin matrix is ​​a cyanate ester resin. The Type A chopped hollow quartz fibers dispersed in the artificial dielectric matrix have a fiber length of 1 mm, an inner diameter of 10 μm, and an outer diameter of 25 μm. The hollow silica glass microspheres dispersed in the resin matrix have a particle size of 300 μm.

[0126] The raw materials used include:

[0127] The resin is a cyanate resin;

[0128] The quartz fiber cloth is type A quartz fiber cloth with a thickness of 0.14 mm and a mass of 120 wt% of the resin mass;

[0129] A-type short-cut hollow quartz fiber, with a length of 1 mm, an inner diameter of 10 μm, an outer diameter of 25 μm, and a mass of 17.8 wt% of the resin mass;

[0130] Hollow glass microspheres, with a particle size of 300 μm and a mass of 80 wt% of the resin mass.

[0131] The preparation method is:

[0132] Outer skin pre-curing:

[0133] Stage 1: Keep at 90℃ for 70min, and the vacuum degree reaches above -0.09;

[0134] Stage 2: Keep at 160℃ for 60min, and the vacuum degree reaches above -0.09.

[0135] Pre-curing of filler layer:

[0136] Stage 1: Keep at 90℃ for 90min, and the vacuum degree reaches above -0.09;

[0137] Stage 2: Keep at 160℃ for 80min, and the vacuum degree reaches above -0.09.

[0138] Inner skin co-curing:

[0139] Stage 1: Keep at 100℃ for 90min, and the vacuum degree reaches above -0.09;

[0140] Stage 2: Keep at 170℃ for 20 minutes, then apply 1MPa pressure and keep the temperature and pressure for 120 minutes;

[0141] Stage 3: Keep at 230℃ for 120min and maintain pressure at 1MPa.

[0142] The electrical and mechanical properties of the wave-transmitting component materials are tested. The test items and methods are as follows:

[0143] ①Tensile strength at room temperature, test method: GB / T 1452-2005.

[0144] ②The wave transmission performance of the flat sample at room temperature in the Ka band, test method: amplitude directional method.

[0145] The test results are shown in Table 1.

[0146] Table 1 Performance test results of the human wave-transmitting component materials of Example 1

[0147]

[0148]

[0149] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A wave-transmitting component, characterized in that: comprising an inner skin, an outer skin and a filler layer located between the inner skin and the outer skin; The inner skin and the outer skin include: a first resin matrix including a first resin and a reinforcement including a quartz fiber cloth; The filler layer comprises: a second resin matrix comprising a second resin, and hollow fibers and hollow silica microspheres dispersed in the second resin matrix; The hollow fiber is a fiber material with a length of 2mm-6mm, an inner diameter of 3μm-8μm, and an outer diameter of 10μm-16μm; The hollow silica microspheres are hollow microsphere materials with a particle size of 200 μm-500 μm; The first resin and the second resin are cyanate resins and / or modified cyanate resins; The mass of the hollow fiber is 11wt%-20wt% of the mass of the second resin; The mass of the hollow silica microspheres is 80 wt % to 89 wt % of the mass of the second resin.

2. The wave-transmitting component according to claim 1, wherein: The fiber material in the quartz fiber cloth is A-type quartz fiber and / or B-type quartz fiber.

3. The wave-transmitting component according to claim 2, characterized in that: The thickness of the quartz fiber cloth is 0.1 mm to 0.28 mm.

4. The wave-transmitting component according to claim 1, wherein: The mass of the quartz fiber cloth is 100 wt % to 150 wt % of the mass of the first resin.

5. A method for preparing the wave-transmitting component according to any one of claims 1 to 4, characterized in that: The steps include: (1) Pre-curing the outer skin material; (2) pre-curing the filler layer and the material obtained in step (1); (3) Curing the inner skin material and the material obtained in step (2) to obtain the wave-transmitting component.

6. The method for preparing a wave-transmitting component according to claim 5, characterized in that: In step (1), the pre-curing process conditions are: Stage 1: Keep warm at 80℃-100℃ for 60min-90min, and the vacuum degree reaches above -0.09; Stage 2: Keep at 150℃-180℃ for 30min-80min, and the vacuum degree reaches above -0.09; In step (2), the pre-curing process conditions are: Stage 1: Keep warm at 80℃-100℃ for 60min-90min, and the vacuum degree reaches above -0.09; Stage 2: Keep at 150℃-180℃ for 30min-80min, and the vacuum degree reaches above -0.09; In step (3), the curing process conditions are: Stage 1: Keep warm at 80℃-100℃ for 60min-90min, and the vacuum degree reaches above -0.09; Stage 2: Keep at 130-170℃ for 15-30 minutes, then apply 0.5MPa-5MPa pressure, and keep the temperature and pressure for 60-120 minutes; Stage 3: Keep at 200℃-230℃ for 100min-120min, and maintain pressure at 0.5MPa-5MPa.

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