A receiving assembly, an RFID tag and a method of manufacturing a receiving assembly

Abstract

The application discloses a receiving assembly, an RFID tag and a manufacturing method of the receiving assembly, and belongs to the technical field of radio frequency communication. The receiving assembly comprises a shielding piece, a gasket and a receiving element. The gasket and the shielding piece are formed into an integrated structure through compression molding. The receiving element comprises a body and a receiving end arranged on the body. The gasket is arranged between the receiving element and the shielding piece. The body is connected to the gasket, and the receiving end is arranged in the integrated structure. The receiving assembly, the RFID tag and the manufacturing method of the receiving assembly of the application avoid gluing between the gasket and the shielding piece by compression molding, reduce the assembly steps of the gasket and the shielding piece, simplify the assembly process, do not affect the assembly regardless of the size of the gasket, reduce the assembly difficulty, and thus reduce the cost.

Description

Technical Field

[0001] This invention relates to the field of radio frequency communication technology, and in particular to a receiving component, an RFID tag, and a method for manufacturing the receiving component. Background Technology

[0002] In the prior art, patent application number 201811136588.8, entitled "Attachment Device for Inductive Interconnection System," discloses a receiving assembly comprising a shield, a receiving element, and two spacers, wherein the receiving element includes a coil wound on ferrite. During assembly, the two spacers are first coated with adhesive and bonded to the receiving element. Then, adhesive is applied to the shield, and the spacers are bonded to the shield, thereby assembling the shield, receiving element, and spacers. However, the large number of these components results in numerous assembly steps and increases production costs. Summary of the Invention

[0003] The purpose of this invention is to provide a receiving component, an RFID tag, and a method for manufacturing the receiving component, which simplifies the assembly process and reduces production costs.

[0004] To achieve this objective, the present invention adopts the following technical solution:

[0005] In a first aspect, a receiving assembly is provided, including a shield, a pad, and a receiving element. The pad and the shield are formed into an integral structure by compression molding. The receiving element includes a body and a receiving end disposed on the body. The pad is disposed between the receiving element and the shield. The body is connected to the pad, and the receiving end passes through the integral structure.

[0006] In some possible implementations, the pad includes a substrate and a protrusion on the substrate, the shield has a first through hole, the protrusion has a second through hole, the protrusion passes through the first through hole, the receiving end passes through the second through hole, and the body is connected to the substrate.

[0007] In some possible implementations, the end of the protrusion facing away from the substrate is provided with a retaining edge, and the shielding member is sandwiched between the retaining edge and the substrate.

[0008] In some possible implementations, the shielding member has a receiving groove, the pad and the body are disposed in the receiving groove, and the receiving end passes through the bottom of the receiving groove.

[0009] In some possible implementations, the liner includes a vertical plate connected to the substrate, the substrate being disposed between the body and the bottom wall of the receiving groove, and the vertical plate being disposed between the body and the side wall of the receiving groove.

[0010] In some possible implementations, the upright plate has a notch facing the second through hole.

[0011] In some possible implementations, an adhesive layer is provided between the body and the liner.

[0012] Secondly, an RFID tag is provided, including the aforementioned receiving component.

[0013] Thirdly, a method for manufacturing a receiving component is provided, for manufacturing the aforementioned receiving component, comprising:

[0014] S100: Press the gasket and shielding components together to form a single structure;

[0015] S200: The body of the receiving element is connected to the pad, and the receiving end of the receiving element is inserted into the integral structure.

[0016] In some possible implementations, between step S100 and step S200, the following is also included:

[0017] S101: Apply adhesive to the side of the liner facing the body, and / or apply adhesive to the side of the body facing the liner.

[0018] The beneficial effects of this invention are:

[0019] This invention provides a receiving component, an RFID tag, and a method for manufacturing the receiving component. During assembly, only the main body needs to be connected to the pad, facilitating assembly. By pressing the pad and the shielding component into a single structure, the prior art avoids the need to separately apply adhesive to the two spacers and bond them to the shielding component, saving on the adhesive application process, simplifying the structure, and thus simplifying the assembly process. Furthermore, regardless of the size of the pad, it does not affect the assembly, reducing assembly difficulty and thereby lowering costs. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the shielding component and gasket provided in a specific embodiment of the present invention;

[0021] Figure 2 This is a schematic diagram of the shielding component provided in a specific embodiment of the present invention;

[0022] Figure 3 This is a schematic diagram of the gasket provided in a specific embodiment of the present invention;

[0023] Figure 4 This is a bottom view of the shielding component and padding provided in a specific embodiment of the present invention;

[0024] Figure 5 This is a flowchart illustrating a method for manufacturing a receiving component according to a specific embodiment of the present invention.

[0025] In the picture:

[0026] 1. Shielding component; 11. First through hole; 12. Receiving groove;

[0027] 2. Pad; 21. Substrate; 211. Opening; 22. Protrusion; 221. Second through hole; 23. Edge guard; 24. Vertical plate; 241. Notch. Detailed Implementation

[0028] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0030] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0031] This embodiment provides a receiving component, such as... Figure 1 As shown, it includes a shield 1, a pad 2 and a receiving element. The pad 2 and the shield 1 are molded into an integral structure by compression molding. The receiving element includes a body and a receiving end disposed on the body. The pad 2 is disposed between the receiving element and the shield 1. The body is connected to the pad 2 and the receiving end passes through the integral structure.

[0032] During assembly, the main body only needs to be connected to the pad 2, which facilitates assembly. By pressing the pad 2 and the shield 1 into a single structure, the existing technology of applying glue to the two spacers separately to the shield is avoided, saving the glue application process, simplifying the structure, and thus simplifying the assembly process. Moreover, the size of the pad 2 does not affect the assembly, reducing the assembly difficulty and thus reducing the cost.

[0033] The receiving element is ferrite, and specific details are as described in the prior art. Specifically, the shield 1 can be made of copper, and the pad 2 can be made of plastic. Further details will not be provided.

[0034] In one embodiment, the shield 1 and the pad 2 are manufactured using a low-pressure molding process.

[0035] In some embodiments, an adhesive layer is provided between the body and the pad 2 to achieve bonding between the body and the pad 2, making the connection convenient and reliable.

[0036] In traditional processes, the receiving end of the receiving element extends beyond the shield. After assembling the shield, receiving element, and spacer, the entire assembly needs to be reversed, and adhesive needs to be applied between the receiving end and the shield to prevent the shield from scratching the receiving end. This adhesive application step increases assembly time. In some embodiments, such as... Figures 1-3 As shown, the pad 2 includes a substrate 21 and protrusions 22 on the substrate 21. The shield 1 has a first through hole 11, and the protrusions 22 have a second through hole 221. The protrusions 22 pass through the first through hole 11, and the receiving end passes through the second through hole 221. The body is connected to the substrate 21. The protrusions 22 are spaced between the shield 1 and the receiving end, providing protection for the receiving end and preventing damage from the shield 1. This eliminates the need for a dispensing step, thus simplifying the assembly process. By integrally molding the shield 1 and the pad 2, compared to traditional structures and assembly methods, two dispensing stations and processes are reduced, simplifying the assembly steps and lowering costs. The substrate 21 is plate-shaped, and its cross-sectional area is set according to actual needs.

[0037] In some embodiments, such as Figure 2 and Figure 4 As shown, the end of the protrusion 22 facing away from the substrate 21 is provided with a retaining edge 23. The shield 1 is sandwiched between the retaining edge 23 and the substrate 21. The retaining edge 23 and the substrate 21 limit the distance between the shield 1 and the shield, improve the connection reliability between the shield 1 and the pad 2, and further realize the protection of the receiving end.

[0038] In some embodiments, such as Figure 2 As shown, the shielding component 1 has a receiving groove 12, the pad 2 and the main body are located in the receiving groove 12, and the receiving end is inserted through the bottom of the receiving groove 12, which increases the shielding effect on the main body.

[0039] In some embodiments, such as Figures 1-3 As shown, the pad 2 includes a vertical plate 24 connected to the substrate 21. The substrate 21 is disposed between the body and the bottom wall of the receiving groove 12, and the vertical plate 24 is disposed between the body and the side wall of the receiving groove 12, so that the bottom wall and the side wall of the receiving groove 12 are isolated from the body, thereby improving the isolation reliability and shielding effect.

[0040] In some embodiments, such as Figure 1 and Figure 3 As shown, the upright plate 24 has a notch 241 facing the second through hole 221 to prevent structural interference caused by the installation of the main body and the receiving end when the upright plate 24 is installed. The specific setting is based on the actual structural dimensions and layout of the receiving element and is not limited.

[0041] In some embodiments, such as Figure 1 and Figure 3 As shown, an opening 211 is provided on the substrate 21. The specific setting is determined according to actual needs and is not limited.

[0042] This embodiment also provides an RFID tag, including the above-described receiving component. In one embodiment, the receiving element includes a coil and a ferrite, with the coil wound around the ferrite.

[0043] This embodiment also provides a method for manufacturing a receiving component, used to manufacture the aforementioned receiving component, such as... Figure 5 As shown, it includes the following steps:

[0044] S100: Press the pad 2 and the shield 1 together to form an integral structure;

[0045] S200: The body of the receiving element is connected to the pad 2, and the receiving end of the receiving element is inserted into the integral structure.

[0046] Since the pad 2 and the shield 1 are an integral structure, when assembling the receiving element, the pad 2 and the shield 1, it is only necessary to connect the main body to the pad 2. Compared with the traditional structure and its assembly process, the structure and assembly steps are greatly simplified, making assembly easier.

[0047] In some embodiments, between step S100 and step S200, the following step is further included:

[0048] S101: Apply adhesive to the side of the pad 2 facing the body, and / or apply adhesive to the side of the body facing the pad 2.

[0049] An adhesive layer is formed by applying glue, and the body and the gasket 2 are bonded together through this adhesive layer. The process is simple and convenient. Specifically, hot melt adhesive can be applied.

[0050] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A receiving component, characterized in that, The device includes a shield (1), a pad (2), and a receiving element. The pad (2) and the shield (1) are formed into an integral structure by compression molding. The receiving element includes a body and a receiving end disposed on the body. The pad (2) is disposed between the receiving element and the shield (1). The body is connected to the pad (2). The receiving end passes through the integral structure. The pad (2) includes a substrate (21) and a protrusion (22) provided on the substrate (21). The shield (1) has a first through hole (11), the protrusion (22) has a second through hole (221), the protrusion (22) passes through the first through hole (11), the receiving end passes through the second through hole (221), and the body is connected to the substrate (21).

2. The receiving component according to claim 1, characterized in that, The protrusion (22) has a baffle (23) at one end away from the substrate (21), and the shield (1) is sandwiched between the baffle (23) and the substrate (21).

3. The receiving component according to claim 1 or 2, characterized in that, The shield (1) has a receiving groove (12), the pad (2) and the body are located in the receiving groove (12), and the receiving end is inserted through the bottom of the receiving groove (12).

4. The receiving component according to claim 3, characterized in that, The pad (2) includes a vertical plate (24) connected to the substrate (21), the substrate (21) being disposed between the body and the bottom wall of the receiving groove (12), and the vertical plate (24) being disposed between the body and the side wall of the receiving groove (12).

5. The receiving component according to claim 4, characterized in that, The upright plate (24) has a notch (241) facing the second through hole (221).

6. The receiving component according to claim 1 or 2, characterized in that, An adhesive layer is provided between the body and the liner (2).

7. An RFID tag, characterized in that, Includes the receiving component as described in any one of claims 1-6.

8. A method for manufacturing a receiving component, characterized in that, For manufacturing a receiving component as described in any one of claims 1-6, comprising: S100: Press the pad (2) and the shield (1) together to form an integral structure; S200: Connect the body of the receiving element to the pad (2) and pass the receiving end of the receiving element through the integral structure.

9. The method for manufacturing the receiving component according to claim 8, characterized in that, Between step S100 and step S200, the following is also included: S101: Apply adhesive to the side of the pad (2) facing the body, and / or apply adhesive to the side of the body facing the pad (2).

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