Display module and display device

Abstract

The application discloses a display module and a display device, and belongs to the technical field of display. The display module comprises a flexible display panel and a buffer layer located on the side of the backlight surface of the flexible display panel. The display module comprises a bending area and a non-bending area. The buffer layer comprises a rheological material and a plurality of current conductor structures, and the rheological material and the current conductor structures are located at least in the bending area. The display device comprises the display module. The modulus of the buffer material can be controlled, the bending and impact performance is improved when the display module is bent, the pen drop performance and reliability on the surface of the bending area of the display module can be improved after the display module is flattened, and the overall thickness of the module can be reduced.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more specifically, to a display module and a display device. Background Technology

[0002] Traditional flat panel display technology has matured significantly, while flexible display panels, with their thinness, bendability, and impact resistance, are poised to become the mainstream in the display field. Among them, OLED (Organic Light Emitting Display) has become a research hotspot in the field of flexible displays in recent years due to its superior performance, including fast response speed, wide viewing angle, high brightness, low power consumption, self-emissive devices, and bend resistance.

[0003] In existing flexible display panels, a metal material is typically used as a support layer to improve the overall support of the screen. However, the complex stacked structure of the film layers in the flexible module makes it susceptible to mechanical damage after bending. Therefore, a buffer layer is usually placed above the support layer. The buffer layer can be made of foam to absorb energy and improve impact resistance during bending. However, due to the low elastic modulus and stiffness of the buffer material, when a user writes on the flexible display panel, the presence of the buffer material often makes the writing feel soft, which is not conducive to writing and results in insufficient reliability.

[0004] Therefore, providing a display module and display device that can control the modulus of the buffer material, improve bending and impact performance, and reduce the overall thickness of the module is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] In view of this, the present invention provides a display module and a display device to solve the problems of weak pen-writing performance and insufficient reliability of flexible display modules in the prior art.

[0006] The present invention discloses a display module, comprising: a flexible display panel and a buffer layer located on one side of the backlight surface of the flexible display panel; the display module includes a bending region and a non-bending region; the buffer layer includes a rheological material and a plurality of current conductor structures, wherein the rheological material and the current conductor structures are located at least in the bending region.

[0007] Based on the same inventive concept, the present invention also discloses a display device, which includes the above-mentioned display module.

[0008] Compared with the prior art, the display module and display device provided by the present invention achieve at least the following beneficial effects:

[0009] The display module provided by this invention may include bending and non-bending areas. The display module includes a flexible display panel. By setting the flexible display panel, the display module can be bent in the bending area, forming a bent state in which at least two non-bending areas of the display module are stacked. The display module also includes a buffer layer located on one side of the backlight surface of the flexible display panel. The buffer layer is used to absorb energy when the flexible display panel is bent to improve its impact resistance during bending. The elastic modulus of the buffer layer in this invention is controllable and variable. Specifically, the buffer layer includes a rheological material and multiple current conductor structures. The rheological material can be regarded as a liquid with a small elastic modulus in its normal state (i.e., without an applied electric or magnetic field), and can become a solid with a large elastic modulus when an electric or magnetic field is applied. The current conductor structures can be suspended within the rheological material. The primary function of the current conductor structure is to alter the state of the rheological material in the buffer layer. When an electric or magnetic field is applied through the current conductor structure, the rheological material changes from its normal liquid state to a solid state. The solid rheological material has a higher elastic modulus, facilitating the application of ink to the surface of the display module. When the electric or magnetic field is removed from the current conductor structure, the rheological material returns to its normal liquid state. The liquid rheological material has a lower elastic modulus, improving the bending performance of the display module and making it easier to bend. The rheological material and current conductor structure in the buffer layer can be located at least in the bending region, allowing for controllable and variable elastic modulus in at least the bending region of the display module. This improves bending and impact resistance during bending, and enhances the application performance and reliability of ink to the bending region surface of the display module after it is flattened.

[0010] Of course, any product implementing this invention need not necessarily achieve all of the technical effects described above at the same time.

[0011] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description

[0012] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the invention and, together with their description, serve to explain the principles of the invention.

[0013] Figure 1 This is a schematic diagram of the planar structure of the display module provided in an embodiment of the present invention;

[0014] Figure 2 yes Figure 1 A schematic diagram of a cross-sectional structure along the A-A' direction;

[0015] Figure 3 yes Figure 2 A schematic diagram of a planar structure of the intermediate buffer layer in the bending area;

[0016] Figure 4yes Figure 1 Another cross-sectional structural diagram along the A-A' direction;

[0017] Figure 5 yes Figure 2 A schematic diagram of a planar structure for a buffer layer;

[0018] Figure 6 This is a schematic diagram of another planar structure of the display module provided in an embodiment of the present invention;

[0019] Figure 7 yes Figure 6 A schematic diagram of a cross-sectional structure along the B-B' direction;

[0020] Figure 8 yes Figure 6 Another cross-sectional structural diagram along the B-B' direction;

[0021] Figure 9 yes Figure 6 Another cross-sectional structural diagram along the B-B' direction;

[0022] Figure 10 yes Figure 9 A schematic cross-sectional view of the current-carrying conductor structure along its extension direction.

[0023] Figure 11 This is a schematic diagram of another planar structure of the display module provided in an embodiment of the present invention;

[0024] Figure 12 yes Figure 11 A schematic diagram of a cross-sectional structure along the C-C' direction;

[0025] Figure 13 This is a schematic diagram of another planar structure of the display module provided in an embodiment of the present invention;

[0026] Figure 14 yes Figure 13 Schematic diagram of the planar structure of the intermediate buffer layer;

[0027] Figure 15 This is a schematic diagram of another planar structure of the display module provided in an embodiment of the present invention;

[0028] Figure 16 yes Figure 15 Schematic diagram of the planar structure of the intermediate buffer layer;

[0029] Figure 17 This is a schematic diagram of another planar structure of the display module provided in an embodiment of the present invention;

[0030] Figure 18 yes Figure 6 Another cross-sectional structural diagram along the B-B' direction;

[0031] Figure 19 This is a schematic diagram of the planar structure of the display device provided in an embodiment of the present invention. Detailed Implementation

[0032] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention.

[0033] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0034] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0035] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0036] Various modifications and variations can be made to this invention without departing from its spirit or scope, as will be apparent to those skilled in the art. Therefore, this invention is intended to cover modifications and variations falling within the scope of the corresponding claims (the claimed technical solutions) and their equivalents. It should be noted that the embodiments provided in this invention can be combined with each other without contradiction.

[0037] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0038] Please refer to the reference. Figures 1-3 , Figure 1 This is a schematic diagram of the planar structure of the display module provided in an embodiment of the present invention. Figure 2 yes Figure 1 A schematic diagram of a cross-sectional structure along the A-A' direction. Figure 3 yes Figure 2 A schematic diagram of a planar structure of the buffer layer in the bending area. The display module 000 provided in this embodiment includes: a flexible display panel 10 and a buffer layer 20 located on one side of the backlight surface 10B of the flexible display panel 10.

[0039] Display module 000 includes a bending area WA and a non-bending area NWA;

[0040] The buffer layer 20 includes a rheological material 201 and a plurality of current conductor structures 202, wherein the rheological material 201 and the current conductor structures 202 are located at least in the bending region WA.

[0041] Specifically, the display module 000 provided in this embodiment can be a flexible display module, that is, the display module 000 may include a bending area WA and a non-bending area NWA. Optionally, the display module 000 may include at least two non-bending areas NWA and at least one bending area WA. When the display module 000 is unfolded, the two non-bending areas NWA are located on opposite sides of a bending area WA. The display module 000 includes a flexible display panel 10. Through the setting of the flexible display panel 10, the display module 000 can be bent in the bending area WA, forming a bent state in which at least two non-bending areas NWA of the display module 000 are stacked. It is understood that in some other optional embodiments, the display module 000 may also include multiple bending areas WA and multiple non-bending areas NWA. This embodiment does not specifically limit the number of bending areas WA and non-bending areas NWA, and this embodiment does not limit the area of ​​the two non-bending areas NWA. The areas of the two non-bending areas NWA may be the same or different. This embodiment does not impose any limitation. The display module 000 of this embodiment also includes a buffer layer 20, which is located on one side of the backlight surface 10B of the flexible display panel 10. Optionally, the flexible display panel 10 includes a light-emitting surface 10A and a backlight surface 10B disposed opposite to each other. The light-emitting surface 10A of the flexible display panel 10 is used to display the image, and the backlight surface 10B of the flexible display panel 10 is used to set other structures of the display module 000. For example, setting the buffer layer 20 on the backlight surface 10B of the flexible display panel 10 can avoid the influence on optical performance. The buffer layer 20 is used to absorb energy when the flexible display panel 10 is bent to improve the impact resistance when bent. Alternatively, other structures, such as a support structure or a back film structure, can also be set on the backlight surface 10B of the flexible display panel 10. This embodiment will not be described in detail here. For details, please refer to the structure of the flexible display module in the related art for understanding.

[0042] In existing technologies, buffer layers are generally made of foam. Foam buffer layers have a fixed elastic modulus and a small elastic modulus, meaning that foam buffer layers have low stiffness. When a user puts a pen on a flexible display module that includes this buffer layer, the module surface is often too soft to easily put a pen on, resulting in insufficient reliability and a poor user experience.

[0043] To address the aforementioned issues, this embodiment features a controllable and variable elastic modulus for the buffer layer 20. Specifically, the buffer layer 20 includes a rheological material 201 and multiple current conductor structures 202. Optionally, the current conductor structures 202 can be made of conductive silicone, a relatively soft organic material that can be formed into wire or coil structures. (It is understood that in this embodiment...) Figure 3 (This example only illustrates the current conductor structure 202 as a linear conductive structure, enabling it to conduct electricity and generate an electric or magnetic field.) In this embodiment, the rheological material 201 can be considered a liquid with a low elastic modulus in its normal state (i.e., without an applied electric or magnetic field), and can become a solid with a high elastic modulus when an electric or magnetic field is applied. The current conductor structure 202 made of conductive silicone can be suspended within the rheological material 201. It is understood that the buffer layer 20 in this embodiment is mainly composed of the rheological material 201, and the current conductor structure 202 made of conductive silicone occupies only a small portion of the overall volume of the buffer layer 20. The main function of the current conductor structure 202 in this embodiment is to change the state of the rheological material 201 of the buffer layer 20. After applying an electric or magnetic field through the current conductor structure 202, the rheological material 201 changes from a normal liquid state to a solid state. The solid rheological material 201 has a larger elastic modulus, which makes it easier to write on the surface of the display module 000. After removing the electric or magnetic field from the current conductor structure 202, the rheological material 201 returns to its normal liquid state from a solid state. The liquid rheological material 201 has a smaller elastic modulus, which makes it easier to improve the bending performance of the display module 000 and make it easier to bend.

[0044] In this embodiment, the rheological material 201 and the current conductor structure 202 in the buffer layer 20 can be located at least in the bending region WA. By changing the elastic modulus of the rheological material 201 in the bending region WA through the current conductor structure 202, the elastic modulus of at least the bending region WA in the display module 000 can be controlled and varied. This improves the bending and impact performance when the display module 000 is bent, and improves the pen application performance and reliability on the surface of the bending region WA of the display module 000 after the display module 000 is flattened. Furthermore, since the buffer layer 20 made of the rheological material 201 and the current conductor structure 202 can be relatively thin, with the thickness controlled at around 15 μm, it is beneficial to reduce the overall thickness of the module and realize a thinner module design.

[0045] Optionally, in this embodiment Figure 3 The example given is a linear current conductor structure 202. The linear current conductor structure 202 can also be curved (e.g., ...). Figure 3 The structure can be either a linear shape (as shown in the diagram) or a zigzag shape (not shown in the diagram) to increase the area covered by the electric field formed by the current conductor structure 202 in the bending region WA after energization.

[0046] It should be noted that the figures in this embodiment only illustrate a part of the structure of the display module 000. The structure of the display module 000 includes, but is not limited to, this. It may also include other structures that can achieve display, support, or bending effects. In specific implementation, you can refer to the structure of flexible display modules in related technologies for understanding. This embodiment will not elaborate on it here.

[0047] In some alternative embodiments, please refer to the references. Figure 1 and Figure 4 , Figure 4 yes Figure 1 Another cross-sectional structural diagram along the A-A' direction. In this embodiment, the display module 000 also includes a back film layer 30 and a support layer 40. Along the direction Z perpendicular to the plane where the display module 000 is located, the back film layer 30 is located between the buffer layer 20 and the flexible display panel 10, and the support layer 40 is located on the side of the buffer layer 20 away from the flexible display panel 10.

[0048] This embodiment explains that the backlight surface 10B of the flexible display panel 10 of the display module 000 may further include a back film layer 30 and a support layer 40. In the direction Z perpendicular to the plane of the display module 000, the back film layer 30 is located between the buffer layer 20 and the flexible display panel 10, providing support for the flexible display panel 10. Optionally, the back film layer 30 may be made of PET plastic. In the direction Z perpendicular to the plane of the display module 000, the support layer 40 is located on the side of the buffer layer 20 away from the flexible display panel 10. The support layer 40 is generally made of metal, such as SUS stainless steel or TI alloy (titanium alloy). The support layer 40 improves the overall rigidity and flatness of the module. Since both the back film layer 30 and the support layer 40 in the module structure need to retain their respective support requirements, the buffer layer 20 included in the display module 000 is designed to include a rheological material 201 with a variable solid-liquid state. By only changing the material structure of the buffer layer 20 in the bending area WA, it is possible to ensure that the support effect of the display module 000 itself is not affected. At the same time, by only changing the structure of the buffer layer 20 in the bending area WA, the elastic modulus of at least the bending area WA in the display module 000 can be controlled and varied. This improves the bending and impact performance when the display module 000 is bent, and improves the pen application performance and reliability on the surface of the bending area WA of the display module 000 after the display module 000 is flattened.

[0049] It should be noted that the figures in this embodiment only illustrate the position and structure of some film layers of the display module 000 in the direction Z perpendicular to the plane where the display module 000 is located. In specific implementation, the specific planar structure of the back film layer 30 and the support layer 40 can be understood by referring to the structure of flexible display modules in related technologies. This embodiment does not limit it here.

[0050] In some alternative embodiments, please refer to the references. Figure 1 , Figure 2 and Figure 5 , Figure 5 yes Figure 2 A schematic diagram of a planar structure of the buffer layer. In this embodiment, the rheological material 201 is also located in the non-bending region NWA.

[0051] This embodiment explains that the buffer layer 20 of the display module 000 is designed to include a rheological material 201 in both the bending area WA and the non-bending area NWA. Optionally, the non-bending area NWA also includes a current conductor structure 202, which can also be suspended in the rheological material 201 of the non-bending area NWA. That is, the entire buffer layer 20 material of the display module 000 in both the bending area WA and the non-bending area NWA is a rheological material 201 with the current conductor structure 202 suspended, so that the rheological material is... The current conductor structure 201 and the current conductor structure 202 are located not only in the bending region WA, but also in the non-bending region NWA. The current conductor structure 202 together change the elastic modulus of the rheological material 201 in the bending region WA and the non-bending region NWA of the display module 000, so that the elastic modulus of the bending region WA and the non-bending region NWA in the display module 000 can be controlled and varied. When the display module 000 is bent, the overall bending and impact performance is improved. After the display module 000 is flattened, the overall pen application performance and reliability on the surface of the display module 000 can be improved.

[0052] In some alternative embodiments, please refer to the references. Figure 6 and Figure 7 , Figure 6 This is a schematic diagram of another planar structure of the display module provided in an embodiment of the present invention. Figure 7 yes Figure 6 A cross-sectional structural diagram along the B-B' direction (it can be understood that this is for the purpose of clearly illustrating the structure of this embodiment). Figure 6 (Transparency fill is applied in the middle). In this embodiment, the edge of the buffer layer 20 includes an encapsulation material 203, which surrounds the rheological material 201.

[0053] This embodiment explains that when the buffer layer 20 is made of rheological material 201, since the rheological material is liquid in its normal state (i.e., without an applied electric or magnetic field), during the manufacturing process of the display module 000, before fabricating the buffer layer 20 including the rheological material 201 and the current conductor structure 202 (for example, after fabricating the support layer 40), an encapsulation material 203 can be set around the edge of the display module 000. Optionally, the encapsulation material 203 can include any one of organic polymer materials such as silicone, UV-curable adhesive, and resin. The encapsulation material 203 is set around the edge of the display module 000, and ultimately, the buffer layer 20 including the rheological material 201 and the current conductor structure 202 is fabricated within the area surrounded by the encapsulation material 203, preventing the liquid rheological material 201 from overflowing the edge of the display module 000 and affecting the overall stability of the module.

[0054] It is understood that this embodiment is merely an example illustrating the types of materials that can be selected for the encapsulation material 203. In specific implementations, the materials used to manufacture the encapsulation material 203 include, but are not limited to, these materials. Other materials with curing and spill-proof effects can also be used, and this embodiment does not impose any limitations on them. It should be noted that this embodiment does not limit the width of the encapsulation material 203 disposed at the edge of the display module 000, as long as it does not affect the display effect and achieves the spill-proof effect.

[0055] In some alternative embodiments, please refer to the references. Figure 6 and Figure 8 , Figure 8 yes Figure 6 Another cross-sectional view of the structure along the B-B' direction is shown in this embodiment. The display module 000 also includes a shielding layer 50, which is located on the side of the buffer layer 20 facing the flexible display panel 10.

[0056] This embodiment explains that in the film layer structure of the display module 000, along the direction Z perpendicular to the plane where the display module 000 is located, a shielding layer 50 is also provided on the side of the buffer layer 20 facing the flexible display panel 10. The shielding layer 50 is used to shield the electric or magnetic field generated inside the rheological material 201 in the buffer layer 20 due to the current applied to the current conductor structure 202, preventing crosstalk to the thin-film transistor structure, touch circuits, and other components in the film layer structure of the flexible display panel 10. Optionally, the shielding layer 50 can be made of copper foil. Since copper foil can be made very thin and is relatively soft, the shielding layer 50 made of copper foil has little impact on the bending performance of the module, which is beneficial to ensuring the bending effect of the display module 000.

[0057] In some alternative embodiments, please refer to the references. Figure 6 and Figure 9 , Figure 9 yes Figure 6 Another cross-sectional view of the structure along the B-B' direction. In this embodiment, the resistance of the current conductor structure 202 in the bending region WA is less than the resistance of the current conductor structure 202 in the non-bending region NWA.

[0058] This embodiment explains that the buffer layer 20 of both the bending region WA and the non-bending region NWA of the display module 000 is made of a rheological material 201, and a linear or coil-shaped current conductor structure 202 is provided in the rheological material 201. This allows the current conductor structure 202 in the bending region WA to have a lower resistance than the current conductor structure 202 in the non-bending region NWA when an electric or magnetic field is applied. In other words, the lower resistance of the current conductor structure 202 in the bending region WA results in a smaller voltage drop across the current conductor structure 202 when the same current is applied, thus reducing the generated electric or magnetic field. The magnetic field strength is also smaller than that of the non-bending region NWA; the electric or magnetic field applied to the current conductor structure 202 of the bending region WA is small, and the elastic modulus of the rheological material 201 of the bending region WA after the current is applied is also smaller than that of the rheological material 201 of the non-bending region NWA. That is, although the buffer layer 20 of the bending region WA is also solid after the current is applied, its flexibility is still more flexible than that of the buffer layer 20 of the non-bending region NWA. Thus, by reducing the elastic modulus of the bending region WA, while ensuring the pen-dropping performance of the rheological material 201 of the bending region WA when it is solid under the current applied, the bending performance of the bending region WA can also be guaranteed.

[0059] Optional, such as Figure 6 , Figure 9 and Figure 10 As shown, Figure 10 yes Figure 9 A cross-sectional view of the current conductor structure along its extension direction is shown in this embodiment. The resistance of the current conductor structure 202 in the bending region WA is less than the resistance of the current conductor structure 202 in the non-bending region NWA. When the current conductor structure 202 is a linear or coil-like structure, the current conductor structure 202 in the bending region WA can be made thicker than the current conductor structure 202 in the non-bending region NWA. That is, the current conductor structure 202 in the bending region WA is thicker, and the current conductor structure 202 in the non-bending region NWA is thinner. Alternatively, the line width of the current conductor structure 202 in the bending region WA can be relatively thicker, gradually transitioning to a thinner line width after reaching the non-bending region NWA. This ensures that the resistance of the current conductor structure 202 in the bending region WA is less than the resistance of the current conductor structure 202 in the non-bending region NWA, while also allowing a natural transition in resistance between the bending region WA and the non-bending region NWA, avoiding abrupt changes in resistance.

[0060] It is understood that in this embodiment Figure 9 and Figure 10This embodiment only achieves the differential resistance design of the current conductor structure 202 in the bending region WA and the non-bending region NWA by changing the thickness of the current conductor structure 202. In specific implementation, the structure for achieving the differential resistance design includes, but is not limited to, this, and can also be achieved by other settings. This embodiment will not be described in detail here.

[0061] In some alternative embodiments, please refer to the references. Figure 11 and Figure 12 , Figure 11 This is a schematic diagram of another planar structure of the display module provided in an embodiment of the present invention. Figure 12 yes Figure 11 A cross-sectional structural diagram along the C-C' direction (it can be understood that this is for the purpose of clearly illustrating the structure of this embodiment). Figure 11 (Transparency filling is performed in the middle). In this embodiment, the rheological material 201 of the buffer layer 20 includes a magnetorheological material, and the current conductor structure 202 includes a magnetic induction coil.

[0062] This embodiment explains that the rheological material 201, whose elastic modulus can be changed by applying an electric or magnetic field, can be a magnetorheological material. In this case, the current conductor structure 202 suspended in the buffer layer 20 made of this magnetorheological material can include a magnetic induction coil structure, such as... Figure 11 and Figure 12 As shown, by passing current through the end of the magnetic induction coil, a magnetic field is generated within the buffer layer 20 of the magnetorheological material through the magnetic induction coil. That is, the buffer layer 20 of the magnetorheological material changes from its normal liquid state to a solid state. The current conductor structure 202 of the magnetic induction coil structure changes the elastic modulus of the buffer layer 20 of the magnetorheological material in the bending area WA and the non-bending area NWA of the display module 000. This makes the elastic modulus of both the bending area WA and the non-bending area NWA in the display module 000 controllable and variable. When the display module 000 is bent, the overall bending and impact performance is improved. After the display module 000 is flattened, the overall pen application performance and reliability on the surface of the display module 000 can be improved.

[0063] In some other alternative embodiments, such as Figure 6 and Figure 9 As shown, the rheological material 201 of the buffer layer 20 may include an electromorphic material. In this case, the current conductor structure 202 suspended in the electromorphic material within the buffer layer 20 can be a conductive trace extending along a first direction Y; wherein the first direction Y intersects with the direction X pointing from the bending region WA to the non-bending region NWA. It should be noted that in this embodiment… Figure 6Taking the example where the first direction Y is perpendicular to the direction X pointing from the bend region WA to the non-bend region NWA, it can be understood that in this embodiment, the current conductor structure 202 can be a curved or broken line conductive trace. In this case, the extension direction of the current conductor structure 202 can be understood as the extension direction of the overall structure. Figure 6 The first direction Y in the equation.

[0064] This embodiment explains that the rheological material 201, which can change its elastic modulus after being subjected to an electric or magnetic field, can be an electromorphic material. In this case, the current conductor structure 202 suspended in the buffer layer 20 made of this electromorphic material can include a structure with conductive traces extending along the first direction Y, such as... Figure 6 and Figure 9 As shown, after current is passed through the end of the current conductor structure 202 of the conductive trace structure, an electric field is generated within the buffer layer 20 of the current variant material through the conductive trace. That is, the buffer layer 20 of the current variant material changes from its normal liquid state to a solid state. The current conductor structure 202 of the conductive trace structure changes the elastic modulus of the buffer layer 20 of the current variant material in the bending area WA and the non-bending area NWA of the display module 000. This makes the elastic modulus of both the bending area WA and the non-bending area NWA in the display module 000 controllable and variable. When the display module 000 is bent, the overall bending and impact performance is improved. After the display module 000 is flattened, the overall pen application performance and reliability on the surface of the display module 000 can be improved.

[0065] Optionally, the rheological material 201 in the above embodiments includes an electrorheological material or a magnetorheological material. Its specific structure can be a suspension formed by uniformly dispersing micron-sized dielectric particles in an insulating liquid. Further, optionally, taking the rheological material 201 as a magnetorheological material, the dielectric particles can be iron powder, iron alloy powder, or other magnetic metal powders, and the insulating liquid can be mineral oil or silicone oil. Under the action of an applied electric or magnetic field, the dielectric particles are polarized, forming a chain-like ordered arrangement structure, resulting in drastic changes in mechanical properties, thereby changing the elastic modulus. This allows for a transition between liquid and solid states within an extremely short time (milliseconds).

[0066] In some alternative embodiments, please refer to the references. Figure 13 and Figure 14 , Figure 13 This is a schematic diagram of another planar structure of the display module provided in an embodiment of the present invention. Figure 14 yes Figure 13 A schematic diagram of the planar structure of the intermediate buffer layer (it should be understood that this is for the purpose of clearly illustrating the structure of this embodiment). Figure 13 and Figure 14(Transparency filling was performed in the middle). In this embodiment, the density of the magnetic induction coil (current conductor structure 202) in the bending region WA is less than that in the non-bending region NWA.

[0067] This embodiment explains that when a magnetic field is applied, the rheological material 201, which can change its elastic modulus, is a magnetorheological material. In this case, when the current conductor structure 202 suspended in the buffer layer 20 made of this magnetorheological material is a magnetic induction coil structure, the density of the magnetic induction coils (current conductor structure 202) in the bending region WA can be set to be less than the density of the magnetic induction coils (current conductor structure 202) in the non-bending region NWA. Figure 13 and Figure 14 As shown, after current is passed through the current conductor structure 202, the magnetic field strength of the bending region WA is less than that of the non-bending region WA, that is, the elastic modulus of the bending region WA is less than that of the non-bending region NWA. This realizes that the magnetorheological material from the non-bending region NWA to the bending region WA in the current-carrying state changes from hard to soft, thus ensuring the bending performance of the bending region WA.

[0068] In some alternative embodiments, please refer to the references. Figure 15 and Figure 16 , Figure 15 This is a schematic diagram of another planar structure of the display module provided in an embodiment of the present invention. Figure 16 yes Figure 15 A schematic diagram of the planar structure of the intermediate buffer layer (it should be understood that this is for the purpose of clearly illustrating the structure of this embodiment). Figure 15 and Figure 16 (Transparency fill is applied). In this embodiment, the interval D1 between two adjacent conductive traces (current conductor structure 202) in the bending region WA is greater than the interval D2 between two adjacent conductive traces (current conductor structure 202) in the non-bending region NWA.

[0069] This embodiment explains that when the rheological material 201, which can change its elastic modulus after an electric field is applied, is an electromorphic material, then when the current conductor structure 202 suspended in the buffer layer 20 made of this electromorphic material is a curved or zigzag conductive trace, the interval D1 between two adjacent conductive traces (current conductor structures 202) in the bending region WA can be set to be greater than the interval D2 between two adjacent conductive traces (current conductor structures 202) in the non-bending region NWA. Figure 15 and Figure 16As shown, after current is passed through the current conductor structure 202, the electric field strength in the bending region WA is less than that in the non-bending region WA, that is, the elastic modulus of the bending region WA is less than that of the non-bending region NWA. This realizes that the magnetorheological material from the non-bending region NWA to the bending region WA in the current-carrying state changes from hard to soft, thus ensuring the bending performance of the bending region WA.

[0070] Optional, please refer to Figure 17 , Figure 17 This is a schematic diagram of another planar structure of the display module provided in this embodiment of the invention (it should be understood that this diagram is for the purpose of clearly illustrating the structure of this embodiment). Figure 17 (Transparency filling was performed in the middle). In this embodiment, along the direction from the bending region WA to the non-bending region NWA, the interval between two adjacent conductive traces (current conductor structure 202) gradually decreases, so that the electric field intensity between the bending region WA and the non-bending region NWA transitions naturally after current is passed through the current conductor structure 202, avoiding abrupt changes in the electric field magnitude at the critical point between the bending region WA and the non-bending region NWA.

[0071] It is understood that in this embodiment, the current conductor structure 202 of the buffer layer 20 can gradually change from dense to sparse from the non-bending region NWA to the bending region WA, so that the elastic modulus of the rheological material 201 also changes from high to low. Further optionally, the density of the current conductor structure 202 from the non-bending region NWA to the bending region WA can change linearly or non-linearly, and this embodiment does not limit it.

[0072] In some alternative embodiments, please refer to the references. Figure 6 and Figure 18 , Figure 18 yes Figure 6 Another cross-sectional structural diagram along the B-B' direction. In this embodiment, along the direction Z perpendicular to the plane where the display module 000 is located, the buffer layer 20 includes a first sub-layer 20A, a second sub-layer 20B, and a third sub-layer 20C stacked together, with the second sub-layer 20B located between the first sub-layer 20A and the third sub-layer 20C.

[0073] The density of the current conductor structure 202 in the second sublayer 20B is less than that in the first sublayer 20A, and the density of the current conductor structure 202 in the second sublayer 20B is less than that in the third sublayer 20C (not shown in the figure).

[0074] This embodiment explains that the buffer layer 20 can adopt a structure of stacked multilayer electrorheological materials or magnetorheological materials. For example, along the direction Z perpendicular to the plane where the display module 000 is located, the buffer layer 20 includes a first sub-layer 20A, a second sub-layer 20B, and a third sub-layer 20C stacked together. The second sub-layer 20B is located between the first sub-layer 20A and the third sub-layer 20C. The density of the current conductor structure 202 in different sub-layers is different, so that the hardness of different sub-layers can be varied stepwise. Specifically, the density of the current conductor structure 202 in the second sub-layer 20B is less than that in the first sub-layer 20A, and the density of the current conductor structure 202 in the second sub-layer 20B is less than that in the third sub-layer 20C. This results in a denser current conductor structure 202 in the upper and lower sub-layers (first sub-layer 20A and third sub-layer 20C) and a sparser current conductor structure in the middle sub-layer (second sub-layer 20B). This makes the upper and lower surfaces of the buffer layer 20 have greater hardness after current is applied, which is beneficial to improving the overall impact resistance of the buffer layer 20.

[0075] It is understandable that when the buffer layer 20 in this embodiment adopts a multilayer electrorheological material or magnetorheological material stacked structure, the density of the current conductor structure 202 in multiple sub-layers can also be set to be the same. The hardness of different sub-layers can be adjusted by changing the electric field strength or magnetic field strength by adjusting the current passed into different sub-layers, thereby adjusting the elastic modulus of different sub-layers and achieving different hardness requirements. For example, during the bending process of the display module 000, the hardness of the middle sub-layer can be increased and the hardness of the upper and lower sub-layers can be decreased by adjusting the current passed into different sub-layers, so that the stiffness of the buffer layer 20 is reduced, which is conducive to bending. When the display module 000 is flattened or closed, the hardness of the upper and lower sub-layers can be increased and the hardness of the middle sub-layer can be decreased by adjusting the current passed into different sub-layers, thereby improving the impact resistance of the buffer layer 20.

[0076] It is understood that in this embodiment, the current can be passed through the current conductor structure 202 of the buffer layer 20 by connecting the battery lead wire to the main control board of the display module 000, adding control lines and switches (not shown in the figure) on the main control board, and when the switch is turned on, the current signal is connected to the current conductor structure 202 made of conductive silicone through the wire, so that the elastic modulus of the rheological material 201 in the buffer layer 20 changes.

[0077] In some alternative embodiments, please refer to Figure 19 , Figure 19 This is a schematic diagram of the planar structure of the display device provided in the embodiment of the present invention. The display device 111 provided in this embodiment includes the display module 000 provided in the above embodiment of the present invention. Figure 19This embodiment uses a mobile phone as an example to illustrate the display device 111. It is understood that the display device 111 provided in this embodiment can be any other display device 111 with display functions, such as a computer, television, or in-vehicle display device; this invention does not impose specific limitations on this. The display device 111 provided in this embodiment has the beneficial effects of the display module 000 provided in this embodiment. For details, please refer to the specific descriptions of the display module 000 in the above embodiments; these will not be repeated here.

[0078] As can be seen from the above embodiments, the display module and display device provided by the present invention achieve at least the following beneficial effects:

[0079] The display module provided by this invention may include bending and non-bending areas. The display module includes a flexible display panel. By setting the flexible display panel, the display module can be bent in the bending area, forming a bent state in which at least two non-bending areas of the display module are stacked. The display module also includes a buffer layer located on one side of the backlight surface of the flexible display panel. The buffer layer is used to absorb energy when the flexible display panel is bent to improve its impact resistance during bending. The elastic modulus of the buffer layer in this invention is controllable and variable. Specifically, the buffer layer includes a rheological material and multiple current conductor structures. The rheological material can be regarded as a liquid with a small elastic modulus in its normal state (i.e., without an applied electric or magnetic field), and can become a solid with a large elastic modulus when an electric or magnetic field is applied. The current conductor structures can be suspended within the rheological material. The primary function of the current conductor structure is to alter the state of the rheological material in the buffer layer. When an electric or magnetic field is applied through the current conductor structure, the rheological material changes from its normal liquid state to a solid state. The solid rheological material has a higher elastic modulus, facilitating the application of ink to the surface of the display module. When the electric or magnetic field is removed from the current conductor structure, the rheological material returns to its normal liquid state. The liquid rheological material has a lower elastic modulus, improving the bending performance of the display module and making it easier to bend. The rheological material and current conductor structure in the buffer layer can be located at least in the bending region, allowing for controllable and variable elastic modulus in at least the bending region of the display module. This improves bending and impact resistance during bending, and enhances the application performance and reliability of ink to the bending region surface of the display module after it is flattened.

[0080] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A display module, characterized in that, include: A flexible display panel and a buffer layer located on the backlight side of the flexible display panel; The display module includes a bent area and a non-bent area; The buffer layer includes a rheological material and a plurality of current conductor structures, wherein the rheological material and the current conductor structures are located at least in the bending region; Along a direction perpendicular to the plane where the display module is located, the buffer layer includes a first sub-layer, a second sub-layer, and a third sub-layer stacked together, with the second sub-layer located between the first sub-layer and the third sub-layer; The density of the current conductor structure in the second sub-layer is less than that in the first sub-layer, and the density of the current conductor structure in the second sub-layer is less than that in the third sub-layer.

2. The display module according to claim 1, characterized in that, The display module further includes a back film layer and a support layer. Along a direction perpendicular to the plane where the display module is located, the back film layer is located between the buffer layer and the flexible display panel, and the support layer is located on the side of the buffer layer away from the flexible display panel.

3. The display module according to claim 1, characterized in that, The rheological material is also located in the non-bending region.

4. The display module according to claim 3, characterized in that, The resistance of the current conductor structure in the bending region is less than the resistance of the current conductor structure in the non-bending region.

5. The display module according to claim 3, characterized in that, The rheological material includes a magnetorheological material, and the current conductor structure includes a magnetic induction coil.

6. The display module according to claim 5, characterized in that, The density of the magnetic induction coils in the bent region is less than that in the non-bent region.

7. The display module according to claim 3, characterized in that, The rheological material includes an electromorphic material; the current conductor structure includes conductive traces extending along a first direction; wherein the first direction intersects the direction from the bending region to the non-bending region.

8. The display module according to claim 7, characterized in that, The spacing between two adjacent conductive traces in the bending region is greater than the spacing between two adjacent conductive traces in the non-bending region.

9. The display module according to claim 7, characterized in that, Along the direction from the bending area to the non-bending area, the spacing between two adjacent conductive traces gradually decreases.

10. The display module according to claim 1, characterized in that, The edge of the buffer layer includes an encapsulating material that surrounds the rheological material.

11. The display module according to claim 1, characterized in that, The display module also includes a shielding layer located on the side of the buffer layer facing the flexible display panel.

12. A display device, characterized in that, Includes the display module as described in any one of claims 1-11.

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